CN109410762A - 背光模组及具有该背光模组的显示装置 - Google Patents
背光模组及具有该背光模组的显示装置 Download PDFInfo
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Abstract
本发明公开了一种背光模组及具有该背光模组的显示装置,背光模组包括面光源,具有一发光面;荧光膜,覆于所述面光源的发光面;支撑层,设于所述荧光膜上,所述支撑层为透明胶膜层;扩散片,覆于所述支撑层上。本发明的背光模组及具有该背光模组的显示装置,在保证较高的光效的前提下,减少背光模组中扩散片的层数,增加了光线的透过率,从而实现了较好的混光效果和高效的出光效果实现均匀混光和减薄背光模组的目的。
Description
技术领域
本发明涉及显示器领域,具体为一种背光模组及具有该背光模组的显示装置。
背景技术
Mini-LED又名“次毫米发光二极管”,意指晶粒尺寸约在100微米的LED。Mini-LED由于其高亮、柔性、低功耗、轻薄以及可以制作窄边框样品等诸多优势受到诸多厂商的广泛关注。
Mini-LED在组装背光模组时,需要满足混光均匀以及尽可能高的光效特性。混光均匀性即要求Mini-LED在使用单张扩散片时,具有一定的混光距离;或采用多张扩散片相互叠加的方式进行混光。如图1所示,现有的背光模组9在使用单张扩散片90时,利用垫高柱91和空气层92来作为支撑层93以增加混光距离。但是,混光距离的存在给Mini-LED背光源的实际量产带来较大的挑战,会造成良率偏低,不利于其成本降低。详细来讲,如图2所示,图2为采用图1混光方式的背光模组的剖视图,从图2中可以看出,背光模组9中无法加入图1所示的垫高柱91的结构,导致面光源94和扩散片90间存在一镂空间隙,但是扩散片90由于重力或振荡等因素导致膜片松动或者脱落,造成镂空间隙改变,导致miniLED的混光不均。因此,对于采用单张扩散片90并预留一定混光距离的混光方式,在组装背光模组9过程中,由于框胶8的限制无法实现大规模量产,信赖性也存在较大的风险,而采用多张扩散膜片的混光方式会降低Mini-LED的光效。如何在保证光效和混光效果的前提下实现Mini-LED背光模组的可行性,成为Mini-LED应用过程中需要重点解决的问题。
发明内容
为了解决上述技术问题,本发明提供了一种背光模组及具有该背光模组的显示装置,通过透明胶膜层来增加混光距离,以代替垫高柱和空气层,从而使扩散片在背光模组中具有支撑,在保证较高的光效的前提下,减少背光模组中扩散片的层数,实现均匀混光和减薄背光模组的目的。
解决上述问题的技术方案是:提供一种背光模组,包括一面光源,具有一发光面;一荧光膜,覆于所述面光源的发光面;一支撑层,设于所述荧光膜上,所述支撑层为透明胶膜层;一扩散片,覆于所述支撑层上。
在本发明一实施例中,所述透明胶膜层的厚度为d,
d=d1(n2 2-n1 2sin2α)0.5/(n0 2-n1 2sin2α)0.5;
其中d1为所述支撑层为空气层时所需的厚度,n0为所述空气层的折射率,n1为所述荧光膜的折射率,n2为所述透明胶膜层的折射率,α为光线从所述荧光膜进入所述支撑层的入射角。
在本发明一实施例中,所述荧光膜的折射率为1.1-1.4。
在本发明一实施例中,所述面光源包括基板,其中一表面具有多个金属走线;以及若干芯片,设于所述基板上且对应的连接于所述金属走线。
在本发明一实施例中,所述面光源还包括反射层,所述反射层覆于所述基板的具有金属走线的所述其中一表面上。
在本发明一实施例中,所述反射层所用的反光材料为酚醛树脂、环氧树脂、聚酰亚胺树脂、聚酯树脂、白油中的一种。
在本发明一实施例中,所述芯片为蓝光芯片;所述芯片的尺寸为100μm-500μm。
在本发明一实施例中,所述扩散片的层数为一层。
在本发明一实施例中,所述的背光模组还包括棱镜片,设于所述扩散片上。
本发明还提供了一种显示装置,具有所述的背光模组以及封装胶框,所述封装胶框包覆于所述背光模组的边侧。
本发明的有益效果是:本发明的背光模组及具有该背光模组的显示装置,通过透明胶膜层来增加混光距离,以代替垫高柱和空气层,从而使扩散片在背光模组中具有支撑,在保证较高的光效的前提下,减少背光模组中扩散片的层数,增加了光线的透过率,从而实现了较好的混光效果和高效的出光效果实现均匀混光和减薄背光模组的目的。
附图说明
下面结合附图和实施例对本发明作进一步解释。
图1是现有技术中的背光模组的剖视图。
图2图1中封装后的背光模组的剖视图。
图3是本发明实施例的背光模组的剖视图。
图4是本发明实施例的面光源的剖视图。
图5是本发明实施例基板的金属走线和焊盘的一种分布结构图。
图6是现有技术中光线在空气层内发生折射的光路图。
图7是本发明实施例的光线在透明胶膜层内发生折射的光路图。
图8是本发明实施例的显示装置的结构示意图,主要体现封装后的背光模组结构。
附图标记为:
1显示装置,
10背光模组; 20封装胶框;
110面光源; 120荧光膜;
130支撑层; 140扩散片;
150棱镜片; 111基板;
112芯片; 113反射层;
114发光面;
1111金属走线; 1112焊盘;
9现有的背光模组; 8胶框;
90扩散片; 91垫高柱;
92空气层; 93支撑层。
具体实施方式
以下实施例的说明是参考附加的图式,用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语,例如「上」、「下」、「前」、「后」、「左」、「右」、「顶」、「底」等,仅是参考附加图式的方向。因此,使用的方向用语是用以说明及理解本发明,而非用以限制本发明。
如图3所示,在一实施例中,本发明背光模组10包括面光源110、荧光膜120、支撑层130、扩散片140以及棱镜片150。
如图4所示,所述面光源110具有一发光面114。本实施例中,所述面光源110包括基板111、若干芯片112以及反射层113。所述基板111的其中一表面具有多个金属走线1111及多个焊盘1112,如图5所示,图5为所述基板111的金属走线1111和焊盘1112的一种分布结构。
请同时参照图4、图5,所述芯片112设于所述基板111上且所述芯片112对应的焊接于所述金属走线1111上的焊盘1112。所述反射层113覆于所述基板111的具有金属走线1111的所述其中一表面。
在固晶作业时,先在所述基板111的所述其中一表面涂覆一层反光材料,形成反射层113,所述反射层113覆盖所述基板111上的所述金属走线1111,从而提高折射率和反光率,在封胶后能有效的提高灯珠亮度。所述反光材料可采用酚醛树脂、环氧树脂、聚酰亚胺树脂、聚酯树脂、白油等,本实施例中的反射层113所用材料采用白油。然后在所述基板111上采用回流焊工艺进行固晶作业。
本实施例中,所述芯片112阵列排布于所述基板111上,所述芯片112的尺寸为100μm-500μm,每平方厘米的面积中,设置20-50颗所述芯片112。若采用六寸屏,那么所对应的基板111上的所述芯片112的数量在100-5000颗。由于需要考虑生产成本等方面的问题,因此,在制备时所述面光源110,尽可能利用小尺寸的芯片112,而所述芯片112数量也需要控制在较少的范围内,每平方厘米的面积中,优选30颗所述芯片112,所述芯片112的尺寸优选为200μm。
如图3所示,所述荧光膜120覆于所述面光源110的发光面114;即布置完所述芯片112后,在所述芯片112的上压覆一荧光膜120,通过所述荧光膜120实现颜色转换。本实施例中,所述芯片112选用为蓝光芯片112,所述荧光膜120为颜色转换装置,将所述蓝光芯片112发出的光部分转换成绿光和红光。
所述支撑层130设于所述荧光膜120上,本实施例中,所述支撑层130为透明胶膜层132(见图3)。如可选用有机硅胶、丙烯酸型树脂及不饱和聚酯、聚氨酯、环氧树脂中的一种作为透明胶膜层132的材料。所述透明胶膜层132可以通过热压或胶粘的方式贴合于所述荧光膜120的表面。
由于混光效率与所述透明胶膜层132的折射率、厚度等相关,因此同时参见图6和图7所示,图6为现有技术中光线在空气层92内发生折射的光路图,图6中是采用如图1所示垫高柱91和空气层92来作为支撑层93以增加混光距离的。图7为本发明的光线在所述透明胶膜层132内发生折射的光路图,图7中是利用所述透明胶膜层132作为支撑层130来增加混光距离的。
本实施例中的所述透明胶膜层的厚度若设为d,则
d=d1(n2 2-n1 2sin2α)0.5/(n0 2-n1 2sin2α)0.5,
其中d1为所述支撑层130为空气层92时所需的厚度,n0为所述空气层92的折射率,n1为所述荧光膜120的折射率,n2为透明胶膜层132的折射率,α为光线从所述荧光膜120进入所述支撑层130的入射角。
由此可见,所述透明胶膜层132的厚度与所述荧光膜120的折射率有关,其中采用折射率较低的透明介质材料,有助于减薄所述透明胶膜层132厚度。因此,本实施例中,所述荧光膜120的折射率为1.1-1.4,如折射率可以选择1.12,1.13,1.15;1.21,1.33等等。
如图3所示,所述扩散片140覆于所述支撑层130上。一般情况下,所述扩散片140可以采用单层结构也可以采用多层结构,本实施例采用的是单层结构。所述棱镜片150设于所述扩散片140上。单层的所述扩散片140增加了模组透过率,从而实现了较好的混光效果和高效的出光效果。
如图8所示,在其一实施例中,本发明还提供了一种显示装置1,本发明所述的显示装置1可以是Mini-LED显示装置,下面就以Mini-LED显示装置为例,对其结构进行进一步说明。
所述Mini-LED显示装置具有所述背光模组10以及封装胶框20,所述封装胶框20包覆于所述背光模组10的边侧。由于所述背光模组10中的扩散片140落于所述透明胶膜层132的上方,所述透明胶膜层132形成支撑,增强了所述背光模组10的机械信赖性,同时,所述透明胶膜层132的存在也实现了Mini-LED显示装置1的混光距离,而且,本实施例中,所述扩散片140为一层,增加了光线的透过率,从而实现了较好的混光效果和高效的出光效果。
本发明的主要设计要点在于背光模组10结构,对于显示面板、框架等其他结构不再一一赘述。
以上仅为本发明的较佳实施例而已,并不用以限制本发明,凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本发明的保护范围之内。
Claims (10)
1.一种背光模组,其特征在于,包括
面光源,具有一发光面;
荧光膜,覆于所述面光源的发光面;
支撑层,设于所述荧光膜上,所述支撑层为透明胶膜层;以及
扩散片,覆于所述支撑层上。
2.根据权利要求1所述的背光模组,其特征在于,所述透明胶膜层的厚度设为d,d=d1(n2 2-n1 2sin2α)0.5/(n0 2-n1 2sin2α)0.5;其中d1为所述支撑层为空气层时所需的厚度,n0为所述空气层的折射率,n1为所述荧光膜的折射率,n2为所述透明胶膜层的折射率,α为光线从所述荧光膜进入所述支撑层的入射角。
3.根据权利要求2所述的背光模组,其特征在于,所述荧光膜的折射率为1.1-1.4。
4.根据权利要求1所述的背光模组,其特征在于,所述面光源包括
基板,在其中一表面具有多个金属走线;以及
若干芯片,设于所述基板上且对应的连接于所述金属走线。
5.根据权利要求4所述的背光模组,其特征在于,所述面光源还包括反射层,所述反射层覆于所述基板的具有金属走线的所述其中一表面上。
6.根据权利要求5所述的背光模组,其特征在于,所述反射层所用的反光材料为酚醛树脂、环氧树脂、聚酰亚胺树脂、聚酯树脂、白油中的一种。
7.根据权利要求4所述的背光模组,其特征在于,所述芯片为蓝光芯片;所述芯片的尺寸为100μm-500μm。
8.根据权利要求1所述的背光模组,其特征在于,所述扩散片的层数为一层。
9.根据权利要求1所述的背光模组,其特征在于,还包括棱镜片,设于所述扩散片上。
10.一种显示装置,其特征在于,具有如权利要求1-9中任意一项所述的背光模组以及封装胶框,所述封装胶框包覆于所述背光模组的边侧。
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