WO2023103012A1 - 拼接屏及其制备方法和显示装置 - Google Patents

拼接屏及其制备方法和显示装置 Download PDF

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Publication number
WO2023103012A1
WO2023103012A1 PCT/CN2021/138843 CN2021138843W WO2023103012A1 WO 2023103012 A1 WO2023103012 A1 WO 2023103012A1 CN 2021138843 W CN2021138843 W CN 2021138843W WO 2023103012 A1 WO2023103012 A1 WO 2023103012A1
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WIPO (PCT)
Prior art keywords
led
splicing
packaged
display
distance
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Application number
PCT/CN2021/138843
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English (en)
French (fr)
Inventor
柯中乔
Original Assignee
Tcl华星光电技术有限公司
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Publication of WO2023103012A1 publication Critical patent/WO2023103012A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages

Definitions

  • the present application belongs to the field of display technology, and in particular relates to a splicing screen, a preparation method thereof, and a display device.
  • Micro-light-emitting diodes are becoming more and more popular because of their advantages such as fast response, high color gamut, and low energy consumption.
  • the packaged LED chips (Micro-Led In Package, MIP) is applied in Micro-LED or Mini-LED direct display display, however, the display quality of the splicing in the existing splicing screen is not good.
  • the display quality of the splicing part in the existing splicing screen is not good.
  • Embodiments of the present application provide a splicing screen, a manufacturing method thereof, and a display device, so as to solve the problem of poor display quality at splicing locations in existing splicing screens.
  • the embodiment of the present application provides a splicing screen, including a plurality of mutually spliced display modules, each of which includes a display area and a splicing area located on at least one side of the display area, and each The display module includes:
  • a plurality of packaged LED units are arranged in the display area of the display module, each of the packaged LED units includes at least three first LED chips;
  • a plurality of second LED chips are arranged in the splicing area of the display module
  • the embodiment of the present application further provides a display device, including:
  • the splicing screen is connected with the main body, and the splicing screen includes a plurality of display modules spliced with each other, each of the display modules includes a display area and a splicing area located at least one side of the display area, and each The above display modules include:
  • a plurality of packaged LED units are arranged in the display area of the display module, each of the packaged LED units includes at least three first LED chips;
  • a plurality of second LED chips are arranged in the splicing area of the display module
  • the embodiment of the present application also provides a method for preparing a splicing screen, including:
  • the distance between the LED chips in the splicing area of two adjacent display modules can be controlled. Due to the impact of the packaging, the size is set to the required size, so that the display screen after the display modules are spliced is uniform, thereby improving the display quality of the splicing screen.
  • the assembly speed of the display module can be improved.
  • FIG. 1 is a schematic diagram of a first structure of a display device provided by an embodiment of the present application.
  • FIG. 2 is a schematic diagram of a second structure of a display device provided by an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of a display module in the display device shown in FIG. 2 .
  • FIG. 4 is a schematic flowchart of a method for preparing a splicing screen provided in an embodiment of the present application.
  • embodiments of the present application provide a splicing screen, a manufacturing method thereof, and a display device, which will be described below with reference to the accompanying drawings.
  • FIG. 1 is a first structural schematic diagram of a display device provided by an embodiment of the present application.
  • the embodiment of the present application provides a display device 1.
  • the display device 1 may include a splicing screen 10 and a main body 20.
  • the splicing screen 10 is connected to the main body 20.
  • the main body 20 is used to carry the splicing screen 10 and related electrical components of the splicing screen 10.
  • different sizes of display devices 1 are usually used for different occasions, so as to better integrate the display device 1 with the usage occasions, improve aesthetics and viewing comfort for users.
  • a large-sized display device 1 a large-sized display device 1 can be formed by splicing multiple display screens together.
  • the display device 1 may include a spliced screen 10 that has been spliced.
  • the display quality of the splicing part in the existing splicing screen is not good, which makes the user's experience poor.
  • the embodiment of the present application processes the splicing of the splicing screen 10 to improve the display quality at the splicing place.
  • FIG. 2 is a second structural schematic diagram of a display device provided by an embodiment of the present application
  • FIG. 3 is a structure of a display module in the display device shown in FIG. 2 schematic diagram.
  • the splicing screen 10 of the embodiment of the present application includes a plurality of display modules 11 that are spliced with each other.
  • Each display module 11 may include a display area 110 and a splicing area 120 .
  • the splicing area 120 is disposed on at least one side of the display area 110 . That is, the splicing area 120 of one display module 11 is adjacent to another display module 11 .
  • Each display module 11 also includes a plurality of packaged LED units 112 and a plurality of second LED chips 122 .
  • a plurality of packaged LED units 112 are disposed in the display area 110 of the display module 11 , and each packaged LED unit 112 includes at least three first LED chips 1121 .
  • a plurality of second LED chips 122 are disposed in the bonding area 120 .
  • In the splicing direction X there is a first distance between each second LED chip 122 and the first LED chip 1121 of the packaged LED unit 112 adjacent to it, one first LED chip 1121 in one packaged LED unit 112 and its
  • There is a second distance between the first LED chips 1121 in adjacent packaged LED units 112 there is a second distance between the first LED chips 1121 in adjacent packaged LED units 112 , and the second distance is greater than the first distance.
  • the distance between each second LED chip 122 and the first LED chip 1121 of its adjacent packaged LED unit 112 is smaller than the distance between the two first LED chips 1121 oppositely arranged in two adjacent packaged LED units 112 .
  • the splicing direction X is the direction in which the two display modules 11 face splicing or face away from separation.
  • the second LED chip 122 may be a Mini-LED or a Micro-LED, that is, a micro light emitting diode.
  • Micro-LED or Mini-LED technology refers to the technology of micro-sized light-emitting diode (Light Emitting Diode, LED) arrays integrated with high density on the substrate, and the size of each Micro-LED or Mini-LED is only 1 to 10 Micron or so, high-resolution Micro-LED or Mini-LED display panels can be formed through this technology.
  • Micro-LED or Mini-LED has the advantages of high luminous efficiency, low energy consumption and high resolution.
  • the Micro-LED or Mini-LED is usually displayed in the way of direct display, that is to say, one second LED chip 122 can display red light, green light or blue light, and three second LED chips displaying different colors 122 can be used as a pixel unit, and a plurality of pixel units arranged in a certain regular arrangement can display a picture.
  • the direct display is relative to the backlight display, which is a form of lighting in the electronics industry and is often used in LCD (Liquid Crystal Display, liquid crystal display) displays.
  • LCD Liquid Crystal Display, liquid crystal display
  • the mainstream LCD backlight technologies on the market include LED (Light Emitting Diode) and CCFL (Cold Cathode Fluorescent Lamp).
  • the light source may be an incandescent bulb, an electro-optic panel (ELP), a light-emitting diode (LED), a cold-cathode tube (CCFL), and the like.
  • Electro-optic panels provide uniform light across the surface, while other backlights use diffusers to provide uniform light from uneven light sources.
  • the backlight can be any color, and monochrome liquid crystals usually have backlights such as yellow, green, blue, and white.
  • the color display uses white white light because it covers the most colored light.
  • each display module 11 has at least one splicing area 120 along the splicing direction X.
  • the plurality of second LED chips 122 in each splicing area 120 can be arranged in a row of K columns, and the row direction of the plurality of second LED chips 122 is perpendicular to the splicing direction X.
  • the three second LED chips 122 can be used as a pixel group, and the display of the three second LED chips 122 is equivalent to the display of one packaged LED unit 112 . Therefore, the K columns of the second LED chips 122 may be equivalent to three times the number of columns of the packaged LED units 112 .
  • each display module 11 may include two splicing areas 120 , and the two splicing areas 120 are oppositely disposed on two sides of the display area 110 .
  • the splicing direction X there is a third distance between the second LED chips 122 in a splicing area 120 and the second LED chips 122 in the splicing area 120 of the adjacent display module 11, and the third distance is equal to the second distance. .
  • the distance between the second LED chip 122 in a splicing area 120 and the second LED chip 122 in the splicing area 120 of the adjacent display module 11 is equal to the distance between a first LED in a packaged LED unit 112
  • the distance between the chip 1121 and the first LED chip 1121 in the packaged LED unit 112 adjacent to it is equal.
  • the second LED chips 122 in the splicing area 120 arranged in this way can make the display images of the two spliced display modules 11 uniform, and improve user experience.
  • the first LED chip 1121 can be the same as the second LED chip 122, that is, the first LED chip 1121 can also be a Mini-LED or a Micro-LED.
  • the first LED chip 1121 reference may be made to the description of the second LED chip 122, which will not be repeated here.
  • the difference between the first LED chip 1121 and the second LED chip 122 is that the first LED chip 1121 is usually packaged and used to improve the assembly efficiency of the display module 11 .
  • the first LED chip 1121 is usually packaged and used to improve the assembly efficiency of the display module 11 .
  • at least three first LED chips 1121 can be packaged together to form a packaged LED unit 112 , and the packaged LED unit 112 can also be called a MIP chip (Micro-Led In Package).
  • At least three first LED chips 1121 are packaged together to form a unit, that is, the packaged LED unit 112 , and then a plurality of packaged LED units 112 are packaged and placed in the display area 110 .
  • the method of arranging a plurality of packaged LED units 112 in the display area 110 in the embodiment of the present application can improve the assembly efficiency of the display module 11 .
  • each packaged LED unit 112 may include a package frame 1123 and three first LED chips 1121 .
  • the three first LED chips 1121 can respectively emit red light, green light and blue light, so that the three first LED chips 1121 emitting light of different colors can form a light emitting unit or a pixel unit.
  • the number of first LED chips 1121 packaged in each packaged LED unit 112 can also be other numbers, which is not limited here.
  • each packaged LED unit 112 includes three first LED chips 1121 as an example. Be explained.
  • three first LED chips 1121 may be arranged in one row and three columns in the packaging frame 1123 , and the row direction of the three first LED chips 1121 is perpendicular to the splicing direction X. That is to say, the three first LED chips 1121 are arranged in a straight line in the packaging frame 1123 , and there is a predetermined distance between each first LED chip 1121 .
  • the three first LED chips 1121 can be arranged in a straight line from the middle position of one side of the package frame 1123 to the middle position of the other side of the package frame 1123 opposite to the aforementioned side.
  • the three first LED chips 1121 can also be arranged in other ways, for example, the three first LED chips 1121 can be arranged in a triangle.
  • the three first LED chips 1121 can also be arranged obliquely in the packaging frame 1123, that is, the straight line formed by the three first LED chips 1121 and the edge of the packaging frame 1123 present a certain oblique angle, so as to satisfy different requirements. Luminous needs.
  • the multiple packaged LED units 112 may be arranged in an array of M rows and N columns, and the row direction of the multiple packaged LED units 112 is perpendicular to the splicing direction X. At least three first LED chips 1121 in two adjacent rows of packaged LED units 112 are arranged in parallel. It can be understood that at least three first LED chips 1121 in two adjacent rows of packaged LED units 112 are arranged in parallel, and the first LED chips 1121 in two adjacent columns of packaged LED units 112 are arranged in a straight line. Since the size of the packaging frame 1123 is greater than the size of the three first LED chips 1121 arranged together, the distance between the first LED chips 1121 in two adjacent rows of packaged LED units 112 is greater than that of two adjacent rows of packaged LED units. 112 is the distance between two adjacent first LED chips 1121 .
  • the second LED chips 122 at the splicing place can be set as The required size can further make the display picture at the splicing place and the display picture of the display area 110 uniform, thereby improving the display quality of the splicing screen 10 and improving user experience.
  • the packaged LED unit 112 in the display area 110 of the display module 11 compared with arranging a single LED chip in the display area, the packaged LED unit 112 of the embodiment of the present application can improve the assembly efficiency of the display module 11 .
  • the splicing screen 10 of the embodiment of the present application can not only improve the display quality of the splicing part, but also improve the assembly efficiency of the splicing screen 10 , and has high compatibility.
  • the splicing screen 10 of the embodiment of the present application two adjacent display modules 11 are detachably connected. That is, when using the display device 1 , it can be used by splicing a plurality of display modules 11 together to form the splicing screen 10 . When the display device 1 is not in use or when the display device 1 is transported, the splicing screen 10 can be disassembled for the convenience of storage or transportation.
  • the splicing screen 10 can be installed on the main body 20 , that is, the main body 20 is used to connect multiple display modules 11 .
  • the main body 20 can be connected to the display module 11 from a side away from the display area 110 .
  • the main body 20 can be a large connecting plate, and each display module 11 is arranged at a corresponding position of the main body 20 .
  • the main body 20 may be provided with installation grooves corresponding to the number of the display modules 11 , and the display modules 11 are installed in the installation grooves to complete the splicing of the display modules 11 .
  • the two display modules 11 are respectively connected to the connecting plate by eg screws, so that the two display modules 11 are spliced together.
  • the splicing area 120 of two adjacent display modules 11 can also be bonded by adhesive tape.
  • the display module 11 may be pre-fixed with tape first, and then the display modules 11 are connected together through the main body 20 .
  • FIG. 4 is a schematic flowchart of a method for preparing a splicing screen provided in an embodiment of the present application.
  • the embodiment of the present application also provides a method for preparing a spliced screen.
  • the structure of the splicing screen can refer to FIG. 1 to FIG. 3 and the above description, and will not be repeated here.
  • the preparation method of the splicing screen includes:
  • each packaged LED unit 112 may include a package frame 1123 and three first LED chips 1121 .
  • the three first LED chips 1121 can respectively emit red light, green light and blue light, so that the three first LED chips 1121 emitting light of different colors can form a light emitting unit or a pixel unit.
  • the number of first LED chips 1121 packaged in each packaged LED unit 112 can also be other numbers, which is not limited here.
  • each packaged LED unit 112 includes three first LED chips 1121 as an example. Be explained.
  • the three first LED chips 1121 can be arranged in one row and three columns in the packaging frame 1123 , and the row direction of the three first LED chips 1121 is perpendicular to the splicing direction X. That is to say, the three first LED chips 1121 are arranged in a straight line in the packaging frame 1123 , and there is a predetermined distance between each first LED chip 1121 .
  • the three first LED chips 1121 can be arranged in a straight line from the middle position of one side of the package frame 1123 to the middle position of the other side of the package frame 1123 opposite to the aforementioned side.
  • a plurality of packaged LED units 112 packaged with the first LED chips 1121 are punched onto a substrate, and the plurality of packaged LED units 112 can be arranged in an array of M rows and N columns, and the row direction of the packaged LED units 112 can be aligned with the splicing direction X vertical. At least three first LED chips 1121 in two adjacent rows of packaged LED units 112 are arranged in parallel. It can be understood that at least three first LED chips 1121 in two adjacent rows of packaged LED units 112 are arranged in parallel, and the first LED chips 1121 in two adjacent columns of packaged LED units 112 are arranged in a straight line.
  • the distance between the first LED chips 1121 in two adjacent rows of packaged LED units 112 is greater than that of two adjacent rows of packaged LED units.
  • 112 is the distance between two adjacent first LED chips 1121 .
  • the area formed by the multiple packaged LED units 112 arranged in this way can be used as the display area 110 of the display module 11 .
  • a plurality of second LED chips 122 are disposed on at least one side of the plurality of packaged LED units 112 on the substrate, and the area where the plurality of second LED chips 122 are located can be used as the splicing area 120 of the display module 11 .
  • a position close to one side or multiple sides of the display area 110 can be used as the splicing area 120 of the display module 11, and a plurality of second LED chips 122 can be arranged in the splicing area 120, for example, a plurality of second LED chips 122 can be They are arranged in a straight line in the splicing area 120 .
  • the image display at the splicing part of the splicing screen 10 is consistent or even with the image display in the display area 110, which solves the problem of poor display quality of the existing splicing screens.
  • the area between the display area 110 and the COF can be used as the splicing area 120, because this part has reserved an area for bonding, therefore, the spacing between the pixel units in this part of the area Larger, in the embodiment of the present application, setting a single second LED chip 122 in this part of the area can reduce the spacing between pixel units at the splicing site, thereby improving the display quality of the splicing screen 10 .
  • the arrangement positions of the plurality of second LED chips 122 and the corresponding splicing area 120 and the display area 110 may also have other forms, which will not be exemplified here.
  • multiple display modules 11 can be spliced to form spliced screen 10 .
  • a plurality of display modules 11 can be arranged on a large-sized main body 20 , and each display module 11 is correspondingly arranged on the main body 20 , so as to form the splicing screen 10 by splicing.
  • splicing multiple display modules 11 there may be other methods for splicing multiple display modules 11 , which will not be repeated here.
  • the splicing screen 10 includes a plurality of mutually spliced display modules 11, and each display module 11 may include a display area 110 and a splicing area 120, and the splicing area 120 is disposed on at least one side of the display area 110 . That is, the splicing area 120 of one display module 11 is adjacent to another display module 11 .
  • Each display module 11 also includes a plurality of packaged LED units 112 and a plurality of second LED chips 122 .
  • a plurality of packaged LED units 112 are disposed in the display area 110 of the display module 11 , and each packaged LED unit 112 includes at least three first LED chips 1121 .
  • a plurality of second LED chips 122 are disposed in the bonding area 120 .
  • There is a second distance between the first LED chips 1121 in adjacent packaged LED units 112 and the second distance is greater than the first distance. That is to say, the distance between each second LED chip 122 and the first LED chip 1121 of its adjacent packaged LED unit 112 is smaller than the distance between the two first LED chips 1121 oppositely arranged in two adjacent packaged LED units 112 . distance between.
  • the splicing direction X is the direction in which the two display modules 11 face splicing or face away from separation.
  • first and second are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features.
  • features defined as “first” and “second” may explicitly or implicitly include one or more features.

Abstract

一种拼接屏（10）及其制备方法和显示装置（1），拼接屏（10）包括多个显示模组（11），显示模组（11）包括：多个封装LED单元（112），包括至少三个第一LED芯片（1121）；多个第二LED芯片（122）；每一第二LED芯片（122）和与其相邻的第一LED芯片之（1121）间的第一距离小于封装LED单元（112）中的一个第一LED芯片（1121）和与其相邻的封装LED单元（112）中的第一LED芯片（1121）之间的第二距离。可以提升拼接屏（10）的显示质量。

Description

拼接屏及其制备方法和显示装置 技术领域
本申请属于显示技术领域，尤其涉及一种拼接屏及其制备方法和显示装置。
 背景技术
微发光二极管（Mini-LED或者Micro-LED）因其具有反应快、高色域、低能耗等优势而越来越受欢迎。
其中，为了加速Micro-LED或者Mini-LED的量产时程，封装的LED芯片（Micro-Led In Package，MIP）被应用于Micro-LED或者Mini-LED直显显示屏中，然而，现有的拼接屏中拼接处的显示质量不佳。
 技术问题
现有的拼接屏中拼接处的显示质量不佳。
 技术解决方案
本申请实施例提供一种拼接屏及其制备方法和显示装置，以解决现有的拼接屏中拼接处的显示质量不佳的问题。
第一方面，本申请实施例提供一种拼接屏，包括多个相互拼接的显示模组，每一所述显示模组包括显示区以及位于所述显示区至少一侧边的拼接区，每一所述显示模组包括：
多个封装LED单元，设置于所述显示模组的显示区内，每一所述封装LED单元包括至少三个第一LED芯片；
多个第二LED芯片，设置于所述显示模组的拼接区内；
其中，在拼接方向上，每一所述第二LED芯片和与其相邻的所述封装LED单元的所述第一LED芯片之间具有第一距离，一个所述封装LED单元中的一个第一LED芯片和与其相邻的所述封装LED单元中的第一LED芯片之间具有第二距离，所述第二距离大于所述第一距离。
第二方面，本申请实施例还提供一种显示装置，包括：
主体；以及
拼接屏，与所述主体连接，所述拼接屏包括多个相互拼接的显示模组，每一所述显示模组包括显示区以及位于所述显示区至少一侧边的拼接区，每一所述显示模组包括：
多个封装LED单元，设置于所述显示模组的显示区内，每一所述封装LED单元包括至少三个第一LED芯片；
多个第二LED芯片，设置于所述显示模组的拼接区内；
其中，在拼接方向上，每一所述第二LED芯片和与其相邻的所述封装LED单元的所述第一LED芯片之间具有第一距离，一个所述封装LED单元中的一个第一LED芯片和与其相邻的所述封装LED单元中的第一LED芯片之间具有第二距离，所述第二距离大于所述第一距离。
第三方面，本申请实施例还提供一种拼接屏的制备方法，包括：
将至少三个第一LED芯片封装，以得到封装LED单元；
打件多个所述封装LED单元至一基板上；
在多个所述封装LED单元的至少一侧边设置多个第二LED芯片至所述基板，以得到显示模组；
将多个所述显示模组进行拼接，以使在拼接方向上，每一所述第二LED芯片和与其相邻的所述封装LED单元的所述第一LED芯片之间具有第一距离，一个所述封装LED单元中的一个第一LED芯片和与其相邻的所述封装LED单元中的第一LED芯片之间具有第二距离，所述第二距离大于所述第一距离。
 有益效果
本申请实施例的拼接屏及其制备方法和显示装置中，通过在显示模组的拼接区设置单个的LED芯片，可以使得两个相邻显示模组拼接区的LED芯片之间的距离不受封装的影响而设置为需要的尺寸，使得显示模组拼接后的显示画面均匀，进而提升拼接屏的显示质量。此外，通过在显示模组的显示区设置封装LED单元，相比于在显示区设置单个的LED芯片，可以提高显示模组的装配速度。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单的介绍。显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对本领域技术人员来说，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
为了更完整地理解本申请及其有益效果，下面将结合附图来进行说明。其中，在下面的描述中相同的附图标号表示相同部分。
图1为本申请实施例提供的显示装置的第一种结构示意图。
图2为本申请实施例提供的显示装置的第二种结构示意图。
图3为图2所示的显示装置中显示模组的结构示意图。
图4为本申请实施例提供的拼接屏的制备方法的流程示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
为了解决现有的拼接屏中拼接处的显示质量不佳的问题，本申请实施例提供一种拼接屏及其制备方法和显示装置，以下将结合附图进行说明。
示例性的，请参阅图1，图1为本申请实施例提供的显示装置的第一种结构示意图。本申请实施例提供一种显示装置1，显示装置1可以包括拼接屏10和主体20，拼接屏10与主体20连接，主体20用于承载拼接屏10以及拼接屏10相关的电器件等。需要说明的是，对于不同场合通常使用不同尺寸的显示装置1，以使得显示装置1与使用场合的融合效果更好，提升美观度以及用户观看的舒适度。对于大尺寸的显示装置1来说，可以通过将多个显示屏拼接在一起而形成大尺寸的显示装置1。
显示装置1可以包括拼接完成的拼接屏10。现有的拼接屏中拼接处的显示质量不佳，使得用户的体验感差。为了解决上述问题，本申请实施例对拼接屏10的拼接进行了处理，以改善拼接处的显示质量。
示例性的，请结合图1并参阅图2和图3，图2为本申请实施例提供的显示装置的第二种结构示意图，图3为图2所示的显示装置中显示模组的结构示意图。本申请实施例的拼接屏10包括多个相互拼接的显示模组11，每一显示模组11可以包括显示区110和拼接区120，拼接区120设置于显示区110的至少一侧边。也即一个显示模组11的拼接区120与另一显示模组11邻接。每一显示模组11还包括多个封装LED单元112和多个第二LED芯片122。多个封装LED单元112设置于显示模组11的显示区110内，每一封装LED单元112包括至少三个第一LED芯片1121。多个第二LED芯片122设置于拼接区120内。在拼接方向X上，每一第二LED芯片122和与其相邻的封装LED单元112的第一LED芯片1121之间具有第一距离，一个封装LED单元112中的一个第一LED芯片1121和与其相邻的封装LED单元112中的第一LED芯片1121之间具有第二距离，第二距离大于第一距离。也即每一第二LED芯片122和与其相邻的封装LED单元112的第一LED芯片1121之间的距离小于相邻两个封装LED单元112中的相对设置的两个第一LED芯片1121之间的距离。其中，拼接方向X也即两个显示模组11朝向拼接或者背向分离的方向。通过在显示模组11的拼接区120设置单个的LED芯片，可以使得两个相邻显示模组11拼接区120的LED芯片之间的距离不受封装的影响而设置为需要的尺寸，使得显示模组11拼接后的显示画面均匀，进而提升拼接屏10的显示质量。此外，通过在显示模组11的显示区110设置封装LED单元112，相比于在显示区设置单个的LED芯片，可以提高显示模组11的装配速度。
其中，需要说明的是，第二LED芯片122可以为Mini-LED或者Micro-LED，也即是微发光二极管。Micro-LED或者Mini-LED技术是指在衬底上以高密度集成的微小尺寸发光二极管(Light Emitting Diode，LED)阵列的技术，每个Micro-LED或者Mini-LED的尺寸仅在1至10微米左右，通过该技术可以形成高分辨率的Micro-LED或者Mini-LED显示面板，Micro-LED或者Mini-LED具有发光效率高、能耗低和解析度高等优点。
其中，Micro-LED或者Mini-LED通常采用直接显示的方式进行显示，也即是说，一个第二LED芯片122可以显示出红光、绿光或者蓝光，三个显示不同颜色的第二LED芯片122可以作为一个像素单元，多个呈现一定排布规律排布的像素单元可以显示画面。需要说明的是，直接显示是相对于背光显示而言的，背光是在电子工业中一种照明的形式，常被用于LCD（Liquid Crystal Display，液晶显示器）显示上。液晶不同于等离子的最大区别就是液晶必须依靠被动光源，而等离子电视属于主动发光显示设备。市场上主流的液晶背光技术包括LED(发光二极管)和CCFL(冷阴极荧光灯)两类。其光源可能是白炽灯泡、电光面板(ELP)、发光二极管(LED)、冷阴极管(CCFL)等。电光面板提供整个表面均匀的光，而其他的背光模组则使用散光器从不均匀的光源中来提供均匀的光线。背光可以是任何一种颜色，单色液晶通常有黄、绿、蓝、白等背光。而彩色显示采用白色白光，因其涵盖最多色光。
其中，每一显示模组11沿拼接方向X至少有一个拼接区120。每一拼接区120的多个第二LED芯片122可以呈一行K列设置，多个第二LED芯片122的行方向与拼接方向X垂直。其中，三个第二LED芯片122可以作为一个像素组，三个第二LED芯片122的显示相当于一个封装LED单元112的显示。因此，第二LED芯片122的K列可以相当于封装LED单元112的列数量的三倍。
其中，示例性的，每一显示模组11可以包括两个拼接区120，两个拼接区120相对设置于显示区110的两侧边。在拼接方向X上，一个拼接区120的第二LED芯片122和与其相邻的显示模组11的拼接区120的第二LED芯片122之间具有第三距离，第三距离和第二距离相等。也即是说，一个拼接区120的第二LED芯片122和与其相邻的显示模组11的拼接区120的第二LED芯片122之间的距离和一个封装LED单元112中的一个第一LED芯片1121和与其相邻的封装LED单元112中的第一LED芯片1121之间的距离相等。可以理解的是，这样设置的拼接区120的第二LED芯片122可以使得两个拼接的显示模组11的显示画面均匀，提升用户使用体验。
需要说明的是，第一LED芯片1121可以与第二LED芯片122相同，也即第一LED芯片1121也可以为Mini-LED或者Micro-LED。对于第一LED芯片1121可以参照第二LED芯片122的说明，这里不再赘述。
第一LED芯片1121与第二LED芯片122的区别在于，第一LED芯片1121通常封装起来进行使用，以提高显示模组11的装配效率。需要说明的是，可以将至少三个第一LED芯片1121封装在一起以形成封装LED单元112，封装LED单元112也可以称为MIP芯片（Micro-Led In Package）。将至少三个第一LED芯片1121先封装在一起形成一个单元，也即封装LED单元112，然后再将多个封装LED单元112进行打件设置到显示区110。相比于在显示区110设置多个单个的第一LED芯片1121，本申请实施例在显示区110设置多个封装LED单元112的方式可以提高显示模组11的装配效率。
示例性的，每一封装LED单元112可以包括封装框1123和三个第一LED芯片1121。三个第一LED芯片1121可以分别发出红光、绿光和蓝光，从而三个发出不同颜色的光的第一LED芯片1121可以组成一个发光单元或者说像素单元。当然，每一封装LED单元112中封装的第一LED芯片1121的数量还可以为其他数量，这里不作限制，本申请实施例以每一封装LED单元112中包括三个第一LED芯片1121为例进行说明。
其中，示例性的，三个第一LED芯片1121可以呈一行三列排列于封装框1123内，三个第一LED芯片1121的行方向与拼接方向X垂直。也即是说，三个第一LED芯片1121在封装框1123中呈一字型排列，且每一第一LED芯片1121之间有预设间隔。三个第一LED芯片1121可以自封装框1123的其中一边的中间位置、至与上述边相对的封装框1123的另外一边的中间位置呈一字型排列。当然，三个第一LED芯片1121也可以有其他设置方式，比如，三个第一LED芯片1121可以呈三角形设置。再比如，三个第一LED芯片1121也可以呈斜线排布在封装框1123内，也即三个第一LED芯片1121形成的直线与封装框1123的边线呈现一定倾斜角度，从而满足不同的发光需求。
示例性的，多个封装LED单元112可以呈M行N列阵列排布，多个封装LED单元112的行方向与拼接方向X垂直。相邻两行封装LED单元112中的至少三个第一LED芯片1121平行设置。可以理解的是，相邻两行封装LED单元112中的至少三个第一LED芯片1121平行设置，相邻两列封装LED单元112中的第一LED芯片1121呈一字型排布。由于封装框1123的尺寸大于三个第一LED芯片1121排布在一起的尺寸，因此，相邻两行封装LED单元112中的第一LED芯片1121之间的距离大于相邻两列封装LED单元112中的相邻两个第一LED芯片1121之间的距离。
本申请实施例的拼接屏10中，通过在显示模组11的拼接区120设置多个单个的第二LED芯片122，可以使得拼接处的第二LED芯片122不受封装尺寸的影响而设置成为需要的尺寸，进而可以使得拼接处的显示画面与显示区110的显示画面均匀统一，从而提升拼接屏10的显示质量，提升用户使用体验。此外，通过在显示模组11的显示区110设置封装LED单元112，相比于在显示区设置单个的LED芯片，本申请实施例的封装LED单元112可以提高显示模组11的装配效率。综合来看，本申请实施例的拼接屏10既可以实现拼接处的显示质量提升，又能提高拼接屏10的装配效率，兼容性高。
需要说明的是，本申请实施例的拼接屏10中，相邻两个显示模组11之间可拆卸连接。也即，在使用显示装置1时，可以通过将多个显示模组11拼接在一起形成拼接屏10来使用。在不使用显示装置1时或者运输显示装置1时，为了便于保存或者便于运输，可以将拼接屏10拆分开。
示例性的，拼接屏10可以安装于主体20上，也即主体20用于连接多个显示模组11。比如，主体20可以自背离显示区110的一侧连接显示模组11。主体20可以为一个尺寸较大的连接板，每一显示模组11设置于主体20的相应位置。比如，主体20可以设置有与显示模组11数量对应的安装槽，显示模组11安装于安装槽内也即完成了显示模组11的拼接。两个显示模组11分别通过如螺钉与连接板连接，从而将两个显示模组11拼接在一起。相邻两个显示模组11的拼接区120也可以采用胶带粘接。比如，在装配时，可以先使用胶带将显示模组11预固定，然后再通过主体20将显示模组11连接在一起。当然，关于显示模组11的拼接还可以有其他方式，这里不再举例。
示例性的，请结合图1至图3并参阅图4，图4为本申请实施例提供的拼接屏的制备方法的流程示意图。本申请实施例还提供一种拼接屏的制备方法。拼接屏的结构可以参照图1至图3以及上述说明，这里不再赘述。拼接屏的制备方法包括：
101、将至少三个第一LED芯片封装，以得到封装LED单元。
示例性的，每一封装LED单元112可以包括封装框1123和三个第一LED芯片1121。三个第一LED芯片1121可以分别发出红光、绿光和蓝光，从而三个发出不同颜色的光的第一LED芯片1121可以组成一个发光单元或者说像素单元。当然，每一封装LED单元112中封装的第一LED芯片1121的数量还可以为其他数量，这里不作限制，本申请实施例以每一封装LED单元112中包括三个第一LED芯片1121为例进行说明。
示例性的，三个第一LED芯片1121可以呈一行三列排列于封装框1123内，三个第一LED芯片1121的行方向与拼接方向X垂直。也即是说，三个第一LED芯片1121在封装框1123中呈一字型排列，且每一第一LED芯片1121之间有预设间隔。三个第一LED芯片1121可以自封装框1123的其中一边的中间位置、至与上述边相对的封装框1123的另外一边的中间位置呈一字型排列。
102、打件多个封装LED单元至一基板上。
将多个封装有第一LED芯片1121的封装LED单元112打件至一基板上，多个封装LED单元112可以呈M行N列阵列排布，封装LED单元112的行方向可以与拼接方向X垂直。相邻两行封装LED单元112中的至少三个第一LED芯片1121平行设置。可以理解的是，相邻两行封装LED单元112中的至少三个第一LED芯片1121平行设置，相邻两列封装LED单元112中的第一LED芯片1121呈一字型排布。由于封装框1123的尺寸大于三个第一LED芯片1121排布在一起的尺寸，因此，相邻两行封装LED单元112中的第一LED芯片1121之间的距离大于相邻两列封装LED单元112中的相邻两个第一LED芯片1121之间的距离。这样设置的多个封装LED单元112所构成的区域可以作为显示模组11的显示区110。
103、在多个封装LED单元的至少一侧边设置多个第二LED芯片至基板，以得到显示模组。
在多个封装LED单元112的至少一侧边设置多个第二LED芯片122到基板上，多个第二LED芯片122所在的区域可以作为显示模组11的拼接区120。在靠近显示区110的一侧边或者多侧边的位置可以作为显示模组11的拼接区120，拼接区120内可以设置多个第二LED芯片122，比如，多个第二LED芯片122可以在拼接区120呈一字型排列。并且，拼接区120可以只设置一列或者一行多个第二LED芯片122，从而使得两个显示模组11的拼接区120的多个第二LED芯片122可以根据需要设置之间的距离，不受封装框1123的影响。进而使得拼接屏10的拼接处的画面显示与显示区110的画面显示一致或者均匀，解决了现有的拼接屏显示质量不佳的问题。
其中，需要说明的是，对于显示区110与覆晶薄膜之间的区域可以作为拼接区120，因为这部分预留了用于绑定的区域，因此，这部分区域的像素单元之间的间距较大，本申请实施例在这部分区域设置单个的第二LED芯片122可以减小拼接处的像素单元之间的间距，进而提升拼接屏10的显示质量。当然，多个第二LED芯片122的设置位置及对应的拼接区120与显示区110还可以有其他形式，这里不再举例。
104、将多个显示模组进行拼接，以使在拼接方向上，每一第二LED芯片和与其相邻的封装LED单元的第一LED芯片之间具有第一距离，一个封装LED单元中的一个第一LED芯片和与其相邻的封装LED单元中的第一LED芯片之间具有第二距离，第二距离大于第一距离。
示例性的，多个显示模组11可以进行拼接以形成拼接屏10。比如，多个显示模组11可以均设置于一个尺寸较大的主体20上，每一显示模组11对应设置在主体20上，从而拼接形成拼接屏10。当然，多个显示模组11的拼接方式还可以有其他方式，这里不再赘述。
本申请实施例的拼接屏10及其制备方法和显示装置1中，拼接屏10包括多个相互拼接的显示模组11，每一显示模组11可以包括显示区110和拼接区120，拼接区120设置于显示区110的至少一侧边。也即一个显示模组11的拼接区120与另一显示模组11邻接。每一显示模组11还包括多个封装LED单元112和多个第二LED芯片122。多个封装LED单元112设置于显示模组11的显示区110内，每一封装LED单元112包括至少三个第一LED芯片1121。多个第二LED芯片122设置于拼接区120内。在拼接方向X上，每一第二LED芯片122和与其相邻的封装LED单元112的第一LED芯片1121之间具有第一距离，一个封装LED单元112中的一个第一LED芯片1121和与其相邻的封装LED单元112中的第一LED芯片1121之间具有第二距离，第二距离大于第一距离。也即每一第二LED芯片122和与其相邻的封装LED单元112的第一LED芯片1121之间的距离小于相邻两个封装LED单元112中的相对设置的两个第一LED芯片1121之间的距离。其中，拼接方向X也即两个显示模组11朝向拼接或者背向分离的方向。通过在显示模组11的拼接区120设置单个的LED芯片，可以使得两个相邻显示模组11拼接区120的LED芯片之间的距离不受封装的影响而设置为需要的尺寸，使得显示模组11拼接后的显示画面均匀，进而提升拼接屏10的显示质量。此外，通过在显示模组11的显示区110设置封装LED单元112，相比于在显示区设置单个的LED芯片，可以提高显示模组11的装配速度。
在上述实施例中，对各个实施例的描述都各有侧重，某个实施例中没有详述的部分，可以参见其他实施例的相关描述。
在本申请的描述中，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个特征。
以上对本申请实施例所提供的拼接屏及其制备方法和显示装置进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种拼接屏，其中，包括多个相互拼接的显示模组，每一所述显示模组包括显示区以及位于所述显示区至少一侧边的拼接区，每一所述显示模组包括：
    多个封装LED单元，设置于所述显示模组的显示区内，每一所述封装LED单元包括至少三个第一LED芯片；
    多个第二LED芯片，设置于所述显示模组的拼接区内；
    其中，在拼接方向上，每一所述第二LED芯片和与其相邻的所述封装LED单元的所述第一LED芯片之间具有第一距离，一个所述封装LED单元中的一个第一LED芯片和与其相邻的所述封装LED单元中的第一LED芯片之间具有第二距离，所述第二距离大于所述第一距离。
  2. 根据权利要求1所述的拼接屏，其中，每一所述封装LED单元包括封装框和三个所述第一LED芯片，三个所述第一LED芯片呈一行三列排列于所述封装框内，三个所述第一LED芯片的行方向与所述拼接方向垂直。
  3. 根据权利要求2所述的拼接屏，其中，所述多个封装LED单元呈M行N列阵列排布，所述多个封装LED单元的行方向与所述拼接方向垂直，相邻两行所述封装LED单元中的至少三个所述第一LED芯片平行设置。
  4. 根据权利要求1所述的拼接屏，其中，所述拼接区内的多个所述第二LED芯片呈一行K列阵列排布，多个所述第二LED芯片的行方向与所述拼接方向垂直。
  5. 根据权利要求4所述的拼接屏，其中，每一所述显示模组包括两个所述拼接区，两个所述拼接区相对设置于所述显示区的两侧边。
  6. 根据权利要求1所述的拼接屏，其中，在所述拼接方向上，一个所述拼接区内的所述第二LED芯片和与其相邻的所述显示模组的所述拼接区内的所述第二LED芯片之间具有第三距离，所述第三距离与所述第二距离相等。
  7. 一种显示装置，其中，包括：
    主体；以及
    拼接屏，与所述主体连接，所述拼接屏包括多个相互拼接的显示模组，每一所述显示模组包括显示区以及位于所述显示区至少一侧边的拼接区，每一所述显示模组包括：
    多个封装LED单元，设置于所述显示模组的显示区内，每一所述封装LED单元包括至少三个第一LED芯片；
    多个第二LED芯片，设置于所述显示模组的拼接区内；
    其中，在拼接方向上，每一所述第二LED芯片和与其相邻的所述封装LED单元的所述第一LED芯片之间具有第一距离，一个所述封装LED单元中的一个第一LED芯片和与其相邻的所述封装LED单元中的第一LED芯片之间具有第二距离，所述第二距离大于所述第一距离。
  8. 根据权利要求7所述的显示装置，其中，每一所述封装LED单元包括封装框和三个所述第一LED芯片，三个所述第一LED芯片呈一行三列排列于所述封装框内，三个所述第一LED芯片的行方向与所述拼接方向垂直。
  9. 根据权利要求8所述的显示装置，其中，所述多个封装LED单元呈M行N列阵列排布，所述多个封装LED单元的行方向与所述拼接方向垂直，相邻两行所述封装LED单元中的至少三个所述第一LED芯片平行设置。
  10. 根据权利要求7所述的显示装置，其中，所述拼接区内的多个所述第二LED芯片呈一行K列阵列排布，多个所述第二LED芯片的行方向与所述拼接方向垂直。
  11. 根据权利要求10所述的显示装置，其中，每一所述显示模组包括两个所述拼接区，两个所述拼接区相对设置于所述显示区的两侧边。
  12. 根据权利要求7所述的显示装置，其中，在所述拼接方向上，一个所述拼接区内的所述第二LED芯片和与其相邻的所述显示模组的所述拼接区内的所述第二LED芯片之间具有第三距离，所述第三距离与所述第二距离相等。
  13. 一种拼接屏的制备方法，其中，包括：
    将至少三个第一LED芯片封装，以得到封装LED单元；
    打件多个所述封装LED单元至一基板上；
    在多个所述封装LED单元的至少一侧边设置多个第二LED芯片至所述基板，以得到显示模组；
    将多个所述显示模组进行拼接，以使在拼接方向上，每一所述第二LED芯片和与其相邻的所述封装LED单元的所述第一LED芯片之间具有第一距离，一个所述封装LED单元中的一个第一LED芯片和与其相邻的所述封装LED单元中的第一LED芯片之间具有第二距离，所述第二距离大于所述第一距离。
  14. 根据权利要求13所述的制备方法，其中，所述将至少三个第一LED芯片封装，以得到封装LED单元包括：
    将三个所述第一LED芯片呈一行三列的方式排列于封装框内，以形成所述封装LED单元，三个所述第一LED芯片的行方向与所述拼接方向垂直。
  15. 根据权利要求14所述的制备方法，其中，所述打件多个所述封装LED单元至一基板上包括：
    将多个所述封装LED单元呈M行N列阵列排布，所述多个封装LED单元的行方向与所述拼接方向垂直，相邻两行所述封装LED单元中的至少三个所述第一LED芯片平行设置。
  16. 根据权利要求13所述的制备方法，其中，所述在多个所述封装LED单元的至少一侧边设置多个第二LED芯片至所述基板，以得到显示模组包括：
    将多个所述第二LED芯片呈一行K列阵列排布，多个所述第二LED芯片的行方向与所述拼接方向垂直。
  17. 根据权利要求16所述的制备方法，其中，所述在多个所述封装LED单元的至少一侧边设置多个第二LED芯片至所述基板，以得到显示模组还包括：
    在多个所述封装LED单元的相对两侧边分别设置多个第二LED芯片。
  18. 根据权利要求13所述的制备方法，其中，所述将多个所述显示模组进行拼接之后，还包括：
    拼接完成的显示模组，在所述拼接方向上，一个所述拼接区内的所述第二LED芯片和与其相邻的所述显示模组的所述拼接区内的所述第二LED芯片之间具有第三距离，所述第三距离与所述第二距离相等。
  19. 根据权利要求13所述的制备方法，其中，所述在多个所述封装LED单元的至少一侧边设置多个第二LED芯片至所述基板，以得到显示模组之后，还包括：
    将不同数量的所述显示模组进行拼接，以得到不同尺寸的拼接屏。
  20. 根据权利要求13所述的制备方法，其中，所述显示模组包括覆晶薄膜，所述在多个所述封装LED单元的至少一侧边设置多个第二LED芯片至所述基板，以得到显示模组还包括：
    将多个所述第二LED芯片设置于多个所述封装LED单元与覆晶薄膜之间。
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