WO2020080474A1 - プリプレグ、繊維強化複合樹脂成形体、管状成形体の製造方法、エポキシ樹脂組成物、および管状成形体 - Google Patents

プリプレグ、繊維強化複合樹脂成形体、管状成形体の製造方法、エポキシ樹脂組成物、および管状成形体 Download PDF

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Publication number
WO2020080474A1
WO2020080474A1 PCT/JP2019/040933 JP2019040933W WO2020080474A1 WO 2020080474 A1 WO2020080474 A1 WO 2020080474A1 JP 2019040933 W JP2019040933 W JP 2019040933W WO 2020080474 A1 WO2020080474 A1 WO 2020080474A1
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Prior art keywords
component
epoxy resin
resin composition
prepreg
mass
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Ceased
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PCT/JP2019/040933
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English (en)
French (fr)
Japanese (ja)
Inventor
奈緒 河村
拓也 寺西
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Mitsubishi Chemical Corp
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Mitsubishi Chemical Corp
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Application filed by Mitsubishi Chemical Corp filed Critical Mitsubishi Chemical Corp
Priority to JP2020553296A priority Critical patent/JP7524764B2/ja
Priority to CN201980067551.0A priority patent/CN112839977B/zh
Priority to CN202311115988.1A priority patent/CN117164914A/zh
Priority to KR1020217009972A priority patent/KR20210077674A/ko
Publication of WO2020080474A1 publication Critical patent/WO2020080474A1/ja
Priority to US17/227,645 priority patent/US20210230385A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/243Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using carbon fibres
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/28Shaping operations therefor
    • B29C70/40Shaping or impregnating by compression not applied
    • B29C70/42Shaping or impregnating by compression not applied for producing articles of definite length, i.e. discrete articles
    • B29C70/44Shaping or impregnating by compression not applied for producing articles of definite length, i.e. discrete articles using isostatic pressure, e.g. pressure difference-moulding, vacuum bag-moulding, autoclave-moulding or expanding rubber-moulding
    • B29C70/446Moulding structures having an axis of symmetry or at least one channel, e.g. tubular structures, frames
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/003Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised by the matrix material, e.g. material composition or physical properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/28Shaping operations therefor
    • B29C70/40Shaping or impregnating by compression not applied
    • B29C70/42Shaping or impregnating by compression not applied for producing articles of definite length, i.e. discrete articles
    • B29C70/46Shaping or impregnating by compression not applied for producing articles of definite length, i.e. discrete articles using matched moulds, e.g. for deforming sheet moulding compounds [SMC] or prepregs
    • B29C70/465Shaping or impregnating by compression not applied for producing articles of definite length, i.e. discrete articles using matched moulds, e.g. for deforming sheet moulding compounds [SMC] or prepregs and impregnating by melting a solid material, e.g. sheets, powders of fibres
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/24Di-epoxy compounds carbocyclic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014Nitrogen containing compounds
    • C08G59/4021Ureas; Thioureas; Guanidines; Dicyandiamides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/0405Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
    • C08J5/042Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with carbon fibres
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/0008Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025Crosslinking or vulcanising agents; including accelerators
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/21Urea; Derivatives thereof, e.g. biuret
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2063/00Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2307/00Use of elements other than metals as reinforcement
    • B29K2307/04Carbon
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2023/00Tubular articles
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2463/00Characterised by the use of epoxy resins; Derivatives of epoxy resins

Definitions

  • the present invention relates to a prepreg, a fiber-reinforced composite resin molded body, a method for manufacturing a tubular molded body, an epoxy resin composition, and a tubular molded body.
  • the present application claims priority based on Japanese Patent Application No. 2018-195636 filed in Japan on October 17, 2018, the contents of which are incorporated herein by reference.
  • a fiber-reinforced composite resin molded body which is one of the fiber-reinforced composite materials, is widely used for sports / leisure applications, industrial applications such as automobiles and aircraft, because of its light weight, high strength, and high rigidity.
  • the fiber-reinforced composite resin tubular body is widely used for sports / leisure applications such as fishing rods, golf club shafts, ski poles, and bicycle frames.
  • a method of manufacturing a fiber-reinforced composite resin molded body there is a method of using an intermediate material obtained by impregnating a reinforcing material composed of long fibers such as reinforcing fibers with a matrix resin, that is, a prepreg. According to this method, there is an advantage that the content of the reinforcing fiber in the fiber-reinforced composite resin molded body can be easily controlled and the content can be designed to be high.
  • Specific methods for obtaining the fiber-reinforced composite resin molded product from the prepreg include, for example, a molding method using an autoclave, press molding, internal pressure molding, oven molding and the like.
  • a molding method using an autoclave usually, when two or more prepregs are laminated and heat-cured after shaping into a desired shape, it takes about 2 to 6 hours at a temperature of about 160 ° C. or higher until curing. I need time. That is, high-temperature and long-time treatments are required to manufacture the fiber-reinforced composite resin molded body.
  • molding In order to improve the molding cycle, it is required that molding can be performed at a relatively low temperature of about 100 to 140 ° C. in a short time of several minutes to several tens of minutes.
  • the fiber-reinforced composite resin molded product is required to have heat resistance. Specifically, it is desired that the glass transition temperature of the prepreg after curing, that is, the fiber-reinforced composite resin molded body is higher than the temperature of the mold during molding.
  • an epoxy resin composition excellent in mechanical properties, heat resistance and handleability is widely used.
  • epoxy resin compositions used for sports / leisure applications, industrial applications, etc. are required to have both breaking strain and heat resistance.
  • it is effective to reduce the crosslinking density of the epoxy resin composition, for example.
  • the crosslink density of the epoxy resin composition is lowered, the glass transition temperature of the cured product is lowered, and the heat resistance is likely to be lowered.
  • the glass transition temperature of the cured product of the epoxy resin composition decreases, the glass transition temperature of the fiber-reinforced composite resin molded product also decreases.
  • Patent Document 1 discloses a prepreg that uses dicyandiamide as a latent curing agent having excellent breaking strain and an epoxy resin composition using polyvinyl formal as a thermoplastic resin elastomer as a matrix resin. Has been done.
  • the prepreg in which the reinforcing resin is impregnated with the epoxy resin composition described in Patent Document 1 requires a curing time of 2 hours at 130 ° C. and does not meet the above requirements.
  • the present invention the curing is completed in a short time even at low temperature, bending elastic modulus, bending strength, a prepreg that can obtain a fiber-reinforced composite resin molded article having excellent mechanical properties and heat resistance such as breaking strain, bending elastic modulus, It is an object of the present invention to provide a fiber-reinforced composite resin molded article having excellent mechanical properties such as bending strength and breaking strain and heat resistance.
  • the present invention has the following aspects.
  • a prepreg containing an epoxy resin composition and a reinforcing fiber contains the following components (A), (B), (C) and (D): When the content of the component (A) is 40 to 70 mass% and the content of the component (B) is 15 to 40 mass% with respect to the total mass of all epoxy resins contained in the epoxy resin composition. There is a prepreg.
  • n represents an integer of 1 to 30.
  • [4] The prepreg according to any one of [1] to [3], wherein the reinforcing fibers are carbon fibers.
  • the component (D) is an amine type curing agent.
  • the component (C) is phenyldimethylurea.
  • the content of the component (C) is 1 to 10 parts by mass based on the total mass (100 parts by mass) of all epoxy resins contained in the epoxy resin composition, [1] to [6] Prepreg according to any one of.
  • the content of the component (D) is 2 to 15 parts by mass with respect to the total mass (100 parts by mass) of all epoxy resins contained in the epoxy resin composition, [1] to [7] Prepreg according to any one of.
  • a fiber-reinforced composite resin molded body which is a cured product of a laminated body in which two or more prepregs according to any one of [1] to [8] are laminated.
  • a method for manufacturing a tubular molded body A step of disposing a tubular prepreg containing a resin composition and reinforcing fibers in a mold, Heating the tubular prepreg at 130 ° C.
  • the said resin composition is a manufacturing method of a tubular molded object containing the following component (A), component (B), and component (D).
  • the tubular molded body has an annular curved portion, The method for producing a tubular molded body according to [10], including a step of bending the tubular prepreg into an annular shape.
  • An epoxy resin composition containing an epoxy resin and a curing agent, having a glass transition point of 140 ° C.
  • the curing completion time in the following measuring method is 12 minutes or less
  • Measurement method According to JIS K 6300, a change in torque value (N ⁇ m) at a die temperature of 140 ° C. is measured, and a torque-time curve is obtained. After the tangent slope of the obtained torque-time curve reaches the maximum value, the time when the slope becomes 1/30 of the maximum value is the curing completion time.
  • the epoxy resin composition according to [12] wherein the epoxy resin has a ring structure.
  • n represents an integer of 1 to 30.
  • the epoxy resin composition according to any one of [12] to [14], wherein the epoxy resin contains a urea compound.
  • Curing of the prepreg of the present invention is completed in a short time even at a low temperature, and a fiber-reinforced composite resin molded article having excellent mechanical properties such as flexural modulus, flexural strength and breaking strain and heat resistance can be obtained.
  • the fiber-reinforced composite resin molded product of the present invention is excellent in mechanical properties such as bending elastic modulus, bending strength, and breaking strain, and heat resistance.
  • the prepreg of the present invention contains an epoxy resin composition and a reinforcing fiber.
  • the epoxy resin composition contains the following components (A), (B), (C), and (D). Moreover, the epoxy resin composition may contain components (optional components) other than the component (A), the component (B), the component (C), and the component (D).
  • the component (A) is an oxazolidone type epoxy resin.
  • the oxazolidone type epoxy resin is an epoxy resin having an oxazolidone ring structure.
  • the epoxy resin composition contains the component (A)
  • the workability of the prepreg at room temperature becomes good.
  • a cured product of an epoxy resin composition (hereinafter, also referred to as "resin cured product”) has improved heat resistance, breaking strain, and adhesiveness with reinforcing fibers, and is excellent in heat resistance and breaking strain.
  • the body is obtained.
  • "normal temperature” means 30 degreeC.
  • the oxazolidone ring structure is produced by the addition reaction of an isocyanate group and an epoxy group.
  • the method for producing the oxazolidone type epoxy resin is not particularly limited, and for example, it can be obtained in an approximately theoretical amount by reacting an isocyanate compound and an epoxy resin in the presence of a catalyst used for forming an oxazolidone ring.
  • the isocyanate compound and the epoxy resin are preferably reacted in an equivalent ratio (isocyanate compound: epoxy resin) in the range of 1: 2 to 1:10.
  • an equivalent ratio of the isocyanate compound and the epoxy resin is in the above range, the heat resistance and water resistance of the cured resin tend to be better.
  • the isocyanate compound as a raw material of the component (A) is not particularly limited, but an isocyanate compound having a plurality of isocyanate groups is preferable in order to incorporate the oxazolidone ring structure into the skeleton of the epoxy resin.
  • diisocyanate having a rigid structure is preferable for the cured resin to have high heat resistance.
  • Specific examples of the isocyanate compound include methane diisocyanate, butane-1,1-diisocyanate, ethane-1,2-diisocyanate, butane-1,2-diisocyanate, transvinylene diisocyanate, propane-1,3-diisocyanate, butane-1.
  • a bifunctional isocyanate compound or a trifunctional isocyanate compound is preferable, a bifunctional isocyanate compound is more preferable, and isophorone, benzene, toluene, diphenylmethane, from the viewpoint that the heat resistance of the cured resin tends to be further improved.
  • a bifunctional isocyanate compound having a skeleton selected from naphthalene, norbornene polymethylene polyphenylene polyphenyl, and hexamethylene is more preferable.
  • epoxy resins can be used as the epoxy resin as the raw material of the component (A), but in order to efficiently incorporate the oxazolidone ring structure into the skeleton of the epoxy resin, the epoxy resin has epoxy groups at both ends of the molecule.
  • Epoxy resins are preferred. Specific examples of the epoxy resin include bisphenol A type, bisphenol F type, bisphenol AD type, bisphenol S type, tetramethylbisphenol A type, tetramethylbisphenol F type, tetramethylbisphenol AD type, tetramethylbisphenol S type, and tetrabromo.
  • Epoxy resins derived from dihydric phenols such as bisphenol A type and biphenyl type; 1,1,1-tris (4-hydroxyphenyl) methane, 1,1,1- (4-hydroxyphenyl) ethane, 4,4- Epoxy resins derived from tris (glycidyloxyphenyl) alkanes such as [1- [4- [1- (4-hydroxyphenyl) -1-methylethyl] phenyl] ethylidene] bisphenol; phenol novolac type, cresol novolac type , Bispheno Epoxy resins derived from novolak A novolak type and the like, but not limited thereto. These epoxy resins may be used alone or in combination of two or more.
  • a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, and a biphenyl type epoxy resin are preferable from the viewpoint of suppressing an excessive increase in the viscosity of the component (A).
  • a bifunctional isocyanate having a toluene skeleton such as tolylene diisocyanate (eg, 1-methylbenzene-2,4-diisocyanate, 1-methylbenzene-2,5-diisocyanate, 1-methylbenzene-2,6) -Diisocyanate, 1-methylbenzene-3,5-diisocyanate) 1 molecule and 2 molecules of bisphenol A diglycidyl ether as an epoxy resin are mixed and reacted to obtain an addition reaction product, which has good workability at room temperature of prepreg. It is particularly preferable for improving the heat resistance of the cured resin.
  • tolylene diisocyanate eg, 1-methylbenzene-2,4-diisocyanate, 1-methylbenzene-2,5-diisocyanate, 1-methylbenzene-2,6) -Diisocyanate, 1-methylbenzene-3,5-diisocyanate
  • component (A) examples include AER4152, AER4151, LSA3301, LSA2102 (all are trade names, manufactured by Asahi Kasei E-Materials Co., Ltd.); ACR1348 (trade name, manufactured by ADEKA Co., Ltd.); DER (registered trademark).
  • the same applies hereinafter) 852 and 858 both are trade names, manufactured by Dow Chemical Japan Co., Ltd.); TSR-400 (trade names, manufactured by DIC Co., Ltd.); YD-952 (trade names, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.) Etc. Both are preferably used in the present invention, but AER4152 and TSR-400 are particularly preferable.
  • the component (A) one type may be used alone, or two or more types may be used in combination.
  • the content of the component (A) with respect to the total mass (100 mass%) of all epoxy resins contained in the epoxy resin composition is 40 mass% or more, preferably 41 mass% or more, and more preferably 42 mass% or more. Further, the content of the component (A) with respect to the total mass (100 mass%) of all epoxy resins contained in the epoxy resin composition is 70 mass% or less, preferably 65 mass% or less, and more preferably 60 mass% or less. , 55 mass% or less is particularly preferable. The content of the component (A) with respect to the total mass (100 mass%) of all epoxy resins contained in the epoxy resin composition is, for example, preferably 40 to 70 mass%, more preferably 40 to 65 mass%, and 41 to 60.
  • Mass% is more preferable, and 42 to 55 mass% is even more preferable.
  • the content of the component (A) with respect to the total mass (100% by mass) of all epoxy resins contained in the epoxy resin composition is at least the above lower limit, the heat resistance of the resin cured product, the adhesiveness to carbon fibers, the mechanical properties A physical property tends to be improved, and a fiber-reinforced composite resin molded product having both heat resistance and mechanical properties can be obtained.
  • the component (B) is a novolac type epoxy resin.
  • the component (B) is a novolac type epoxy resin.
  • the quick-curing property of the epoxy resin composition is improved, and a prepreg in which curing is completed in a short time even at a low temperature can be obtained.
  • the component (B) examples include phenol novolac type epoxy resin and cresol novolac type epoxy resin.
  • the component (B) preferably has a structural unit derived from the structure represented by the following formula (1), and more preferably has a structural unit derived from the structure represented by the following formula (2) from the viewpoint of heat resistance. .
  • R represents a hydrogen atom, an alkyl group, an alkoxy group, or an aryl group, and n represents an integer of 1 to 30.
  • Examples of the alkyl group for R in the formula (1) include a methyl group, an ethyl group, an n-propyl group and an isopropyl group, and a methyl group is preferable.
  • Examples of the alkoxy group for R in the formula (1) include a methoxy group and an ethoxy group, and a methoxy group is preferable.
  • Examples of the aryl group for R in the formula (1) include a phenyl group and a naphthyl group, and a phenyl group is preferable.
  • n an integer of 1 to 30.
  • phenol novolac type epoxy resins examples include jER (registered trademark; the same applies hereinafter) 152 and 154 (both are trade names, manufactured by Mitsubishi Chemical Corporation); Epicron (registered trademark. The same applies below) N -740, N-775 (both are trade names, manufactured by DIC Corporation) and the like.
  • cresol novolac type epoxy resins examples include Epiclon N-660 and N-665 (both are trade names, manufactured by DIC Corporation); EOCN-1020 and EOCN-102S (both are trade names, Nippon Kayaku). YDCN-700, YDCN-701 (both are trade names, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.) and the like.
  • component (B) one type may be used alone, or two or more types may be used in combination.
  • the content of the component (B) with respect to the total mass (100 mass%) of all epoxy resins contained in the epoxy resin composition is 15 mass% or more, and preferably 20 mass% or more. Further, the content of the component (B) with respect to the total mass (100 mass%) of all epoxy resins contained in the epoxy resin composition is 40 mass% or less, preferably 35 mass% or less, and more preferably 30 mass% or less. . The content of the component (B) with respect to the total mass (100 mass%) of all the epoxy resins contained in the epoxy resin composition is, for example, preferably 15 to 40 mass%, more preferably 15 to 35 mass%, and 20 to 35 mass%. Mass% is more preferable, and 20 to 30% is even more preferable.
  • the content of the component (B) with respect to the total mass (100 mass%) of all epoxy resins contained in the epoxy resin composition is at least the above lower limit value, the heat resistance of the cured resin tends to be improved, and the heat resistance An excellent fiber-reinforced composite resin molded article can be obtained.
  • the quick-curing property of the epoxy resin composition is improved, and a prepreg in which curing is completed in a short time even at a low temperature can be obtained.
  • the content of the component (B) with respect to the total mass (100 mass%) of all epoxy resins contained in the epoxy resin composition is at most the above upper limit value, the mechanical properties of the cured resin will tend to be improved, and the mechanical properties will be improved.
  • An excellent fiber-reinforced composite resin molded article can be obtained.
  • a resin cured product having a high breaking strain and no void tends to be obtained.
  • the mass ratio of the content of component (A) to the content of component (B) in the epoxy resin composition is 1. 2 or more is preferable and 1.6 or more is more preferable.
  • the mass ratio of the content of component (A) to the content of component (B) in the epoxy resin composition is 5 0.0 or less is preferable, and 4.0 or less is more preferable.
  • the component (C) is a urea compound.
  • the rapid curing property of the epoxy resin composition is improved, and a prepreg in which curing is completed in a short time even at a low temperature can be obtained.
  • Urea compounds include 3-phenyl-1,1-dimethylurea, 3- (3,4-dichlorophenyl) -1,1-dimethylurea (DCMU), 3- (3-chloro-4-methylphenyl) -1. 1,1-dimethylurea, 2,4-bis (3,3-dimethylureido) toluene and the like.
  • the urea compound is preferably phenyldimethylurea (PDMU).
  • TBDMU 2,4-bis (3,3-dimethylureido) toluene
  • PDMU phenyldimethylurea
  • MDMU 4,4′-methylenebis (phenyldimethylurea)
  • 3- (3,4-dichlorophenyl) -1,1-dimethylurea includes DCMU99 (manufactured by Hodogaya Chemical Co., Ltd.) and the like. Is mentioned.
  • the content of the component (C) is preferably 1 to 10 parts by mass, more preferably 2 to 8 parts by mass, based on the total mass (100 parts by mass) of all epoxy resins contained in the epoxy resin composition.
  • the content of the component (C) with respect to the total mass (100 parts by mass) of all epoxy resins contained in the epoxy resin composition is at least the above lower limit value, the curing promoting function can be sufficiently obtained.
  • the content of the component (C) with respect to the total mass (100 parts by mass) of all epoxy resins contained in the epoxy resin composition is at most the above upper limit value, the storage stability of the epoxy resin composition will be enhanced.
  • the component (D) is a curing agent.
  • an amine type curing agent is preferable.
  • the amine-type curing agent is a particle-like heat-activated latent curing agent, and when combined with other components, curing at a relatively low temperature becomes possible. Further, since the amine type curing agent has excellent dispersibility, the rate of curing reaction is accelerated.
  • amine type curing agents examples include aromatic amines such as diaminodiphenylmethane and diaminodiphenylsulfone, aliphatic amines, imidazole derivatives, dicyandiamide, tetramethylguanidine, thiourea-added amines, and isomers and modified products thereof. Can be mentioned.
  • aromatic amines such as diaminodiphenylmethane and diaminodiphenylsulfone
  • aliphatic amines such as diaminodiphenylmethane and diaminodiphenylsulfone
  • imidazole derivatives imidazole derivatives
  • dicyandiamide tetramethylguanidine
  • thiourea-added amines thiourea-added amines
  • isomers and modified products thereof Can be mentioned.
  • dicyandiamide is particularly preferable from the viewpoint of excellent storability of the prepreg
  • Examples of commercially available component (D) include DICYANEX (registered trademark; the same applies hereinafter) 1400F (trade name, manufactured by Evonik Japan Co., Ltd.); jER Cure (registered trademark) DICY7 and DICY15 (trade names, Mitsubishi Chemical Co., Ltd.) and the like.
  • the content of the component (D) with respect to the total mass (100 parts by mass) of all epoxy resins contained in the epoxy resin composition is preferably 2 to 15 parts by mass, more preferably 5 to 9 parts by mass.
  • the content of the component (D) with respect to the total mass (100 parts by mass) of all epoxy resins contained in the epoxy resin composition is at least the above lower limit value, the curing reaction will proceed sufficiently.
  • the content of the component (D) with respect to the total mass (100 parts by mass) of all epoxy resins contained in the epoxy resin composition is not more than the above upper limit value, the storage stability of the epoxy resin composition is increased and the resin cured product is obtained. Can maintain good physical properties.
  • the mass ratio of the content of the component (C) to the content of the component (D) in the epoxy resin composition is 0. 2 or more is preferable and 0.4 or more is more preferable.
  • the mass ratio of the content of component (C) to the content of component (D) in the epoxy resin composition is 1 0.0 or less is preferable, and 0.8 or less is more preferable.
  • the optional component examples include epoxy resins other than the components (A) and (B) (hereinafter, also referred to as “other epoxy resin”), thermoplastic resins, additives, and the like.
  • epoxy resins examples include bifunctional epoxy resins such as bisphenol A type epoxy resins, bisphenol F type epoxy resins, and epoxy resins modified with these; naphthalene type epoxy resins, glycidyl amine type epoxy resins, and these epoxy resins. Examples include, but are not limited to, trifunctional or higher functional epoxy resins such as modified epoxy resins. These other epoxy resins may be used alone or in combination of two or more.
  • Examples of commercially available bifunctional epoxy resins include those shown below.
  • Examples of commercially available bisphenol A type epoxy resins include jER 825, 826, 827, 828, 834 and 1001 (all are trade names, manufactured by Mitsubishi Chemical Corporation); Epicron 850 (trade name, manufactured by DIC Corporation).
  • Epototo registered trademark; the same applies hereinafter
  • YD-128 trade name, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.
  • DER 331, 332 both are trade names, manufactured by Dow Chemical Japan Co., Ltd.
  • Bakerite registered trademark
  • the same applies hereinafter) EPR154, EPR162, EPR172, EPR173, EPR174 all are trade names, manufactured by Bakerite AG).
  • Examples of commercially available bisphenol F type epoxy resins include jER 806, 807, and 1750 (all trade names, manufactured by Mitsubishi Chemical Corporation); Epicron 830 (trade name, manufactured by DIC Corporation); Epototo YD-170. , YD-175 (all trade names, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.); Bakerite EPR169 (trade name, manufactured by Bakerite AG); GY281, GY282, GY285 (all trade names, manufactured by Huntsman Advanced Materials) Can be mentioned.
  • Examples of commercially available trifunctional or higher functional epoxy resins include those shown below.
  • Examples of commercially available naphthalene type epoxy resins include HP-4032 and HP-4700 (both trade names, manufactured by DIC Corporation); NC-7300 (trade name, manufactured by Nippon Kayaku Co., Ltd.).
  • Examples of commercially available glycidyl amine type epoxy resins include jER630 (trade name, manufactured by Mitsubishi Chemical Corporation), Araldite (registered trademark) MY0500, MY0510, MY0600 (all are trade names, manufactured by Huntsman Advanced Materials). Etc.
  • thermoplastic resin for example, polyamide, polyester, polycarbonate, polyether sulfone, polyphenylene ether, polyphenylene sulfide, polyether ether ketone, polyether ketone, polyetherimide, polyimide, polytetrafluoroethylene, polyether, polyolefin, liquid crystal Polymer, polyarylate, polysulfone, polyacrylonitrile styrene, polystyrene, polyacrylonitrile, polymethylmethacrylate, acrylonitrile-butadiene-styrene copolymer (ABS resin), acrylonitrile-ethylene-propylene-diene-styrene copolymer (AES resin) , Acrylonitrile-styrene-alkyl (meth) acrylate copolymer (ASA resin), polyvinyl chloride, polyvinyl chloride Ruhorumaru, phenoxy resins, block polymers, and the like, without limitation.
  • thermoplastic resins phenoxy resin, polyether sulfone, polyether imide, polyvinyl formal, and block polymer are preferable from the viewpoint of excellent resin flow controllability.
  • a phenoxy resin, polyether sulfone or polyether imide is used, the heat resistance and flame retardancy of the cured resin product are further enhanced.
  • polyvinyl formal is used, the tack of the obtained prepreg can be easily controlled within an appropriate range without impairing the heat resistance of the cured resin.
  • the adhesiveness between the reinforcing fiber and the cured resin is further improved.
  • Use of the block polymer improves the toughness and impact resistance of the cured resin.
  • Examples of commercially available phenoxy resin include YP-50, YP-50S, YP70, ZX-1356-2, FX-316 (all are trade names, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.). Not limited.
  • Examples of commercially available products of polyvinyl formal include, for example, vinylec (registered trademark) K (average molecular weight: 59,000), L (average molecular weight: 66,000), H (average molecular weight: 73,000), E (average molecular weight). : 126,000) (all are trade names, manufactured by JNC Corporation) and the like, but are not limited to these.
  • polyether sulfone or polyether imide is preferably used as the thermoplastic resin.
  • examples of commercially available products of polyether sulfone include Sumika Excel (registered trademark) 3600P (average molecular weight: 16,400), 5003P (average molecular weight: 30,000), 5200P (average molecular weight: 35,000), 7600P ( Average molecular weight: 45,300) (all trade names, manufactured by Sumitomo Chemical Co., Ltd.) and the like.
  • ULTEM registered trademark 1000 (average molecular weight: 32,000), 1010 (average molecular weight: 32,000), 1040 (average molecular weight: 20,000) (both are commercial products , Manufactured by SABIC Innovative Plastics Japan LLC, etc., but are not limited thereto.
  • block polymers include, for example, Nanostrength (registered trademark) M52, M52N, M22, M22N, 123, 250, 012, E20, E40 (all trade names, manufactured by ARKEMA), TPAE-8, TPAE-.
  • Examples include, but are not limited to, 10, TPAE-12, TPAE-23, TPAE-31, TPAE-38, TPAE-63, TPAE-100, PA-260 (all are trade names, manufactured by T & K TOKA Corporation). Not done.
  • additives examples include epoxy resin curing accelerators, inorganic fillers, internal release agents, organic pigments, and inorganic pigments.
  • the epoxy resin composition is obtained, for example, by mixing the above-mentioned components.
  • Examples of the method for mixing the respective components include a method using a mixer such as a three-roll mill, a planetary mixer, a kneader, a homogenizer, and a homodisper.
  • the epoxy resin composition can be used for producing a prepreg by impregnating an aggregate of reinforcing fibers, for example, as described later.
  • a film of the epoxy resin composition can be obtained by applying the epoxy resin composition to release paper or the like and curing it.
  • the epoxy resin composition thus obtained is completely cured even at a low temperature in a short time. Specifically, the complete curing time of the epoxy resin composition tends to be within 12 minutes. Further, the viscosity of the epoxy resin composition at 30 ° C. easily becomes 100 to 1,000,000 Pa ⁇ s, and the tackiness of the prepreg surface and the workability are excellent.
  • a cured product of the epoxy resin composition (resin cured product) has excellent mechanical properties such as flexural modulus, flexural strength, and breaking strain, and heat resistance. For example, the flexural modulus of the cured product of the epoxy resin composition obtained by curing at 140 ° C.
  • the glass transition temperature which is an index of the heat resistance of the cured product of the epoxy resin composition obtained under the same conditions, tends to be 140 ° C. or higher.
  • low temperature means a temperature of 100 to 140 ° C.
  • short time means 10 to 30 minutes.
  • the reinforcing fibers are present as a reinforcing fiber base material (aggregate of reinforcing fibers) in the prepreg and are preferably in a sheet form.
  • the reinforcing fibers may be the reinforcing fibers arranged in a single direction or may be arranged in random directions. Examples of the form of the reinforcing fiber include a woven fabric of the reinforced fiber, a nonwoven fabric of the reinforced fiber, and a sheet in which long fibers of the reinforced fiber are aligned in one direction.
  • the reinforcing fiber is preferably a sheet composed of a bundle of reinforcing fibers in which long fibers are aligned in a single direction from the viewpoint that a fiber-reinforced composite material having a high specific strength and a high specific elastic modulus can be formed. From the viewpoint of easy handling, a woven fabric of reinforcing fibers is preferable.
  • the material of the reinforcing fiber examples include glass fiber, carbon fiber (including graphite fiber), aramid fiber, boron fiber and the like. From the viewpoint of mechanical properties and weight reduction of the fiber-reinforced composite resin molded body, carbon fiber is preferable as the reinforcing fiber. That is, the reinforcing fiber is preferably a reinforcing fiber substrate containing carbon fiber.
  • the fiber diameter of the carbon fiber is preferably 3 to 12 ⁇ m. If the fiber diameter of the carbon fiber is equal to or more than the above lower limit, a process for processing the carbon fiber, for example, a process such as a comb or a roll, the carbon fibers laterally move and the carbon fibers rub against each other, or When rubbing against the roll surface or the like, the carbon fibers are less likely to be cut or fluff accumulated. Therefore, the fiber-reinforced composite material having stable strength can be preferably manufactured. If the fiber diameter of the carbon fiber is not more than the above upper limit value, the carbon fiber can be produced by a usual method. The number of carbon fibers in the carbon fiber bundle is preferably 1,000 to 70,000.
  • the strand tensile strength of the carbon fiber is preferably 1.5 to 9 GPa, and the strand tensile elastic modulus of the carbon fiber is preferably 150 to 260 GPa.
  • the strand tensile strength and the strand tensile elastic modulus of carbon fibers are values measured according to JIS R 7601: 1986.
  • the prepreg is obtained, for example, by impregnating an aggregate of reinforcing fibers with the above-mentioned epoxy resin composition.
  • the prepreg thus obtained is obtained by impregnating an aggregate of reinforcing fibers with an epoxy resin composition.
  • a method of impregnating the epoxy resin composition into the reinforcing fiber aggregate for example, a wet method of dissolving the epoxy resin composition in a solvent such as methyl ethyl ketone or methanol to reduce the viscosity and then impregnating into the reinforcing fiber aggregate;
  • a hot melt method dry method in which an epoxy resin composition is reduced in viscosity by heating and then impregnated into an aggregate of reinforcing fibers.
  • the wet method is a method in which an aggregate of reinforcing fibers is immersed in a solution of an epoxy resin composition, then pulled up, and the solvent is evaporated using an oven or the like.
  • the hot melt method includes a method of directly impregnating an aggregate of reinforcing fibers with an epoxy resin composition whose viscosity is reduced by heating, and a method of once coating the epoxy resin composition on the surface of a base material such as release paper to form a film.
  • the coating layer obtained by coating the surface of a base material such as release paper may be used in the hot melt method as it is in an uncured state, or may be used in the hot melt method after curing the coating layer.
  • the hot melt method is preferable because there is substantially no solvent remaining in the prepreg.
  • the content of the epoxy resin composition in the prepreg (hereinafter, also referred to as “resin content”) with respect to the total mass (100% by mass) of the prepreg is preferably 15 to 50% by mass, more preferably 20 to 45% by mass, 25-40 mass% is more preferable.
  • the resin content is at least the above lower limit, the adhesiveness between the reinforcing fiber and the epoxy resin composition can be sufficiently secured.
  • the resin content is less than or equal to the above upper limit value, the mechanical properties of the fiber-reinforced composite resin molded body are further enhanced.
  • the prepreg of the present invention described above includes the epoxy resin composition and the reinforcing fiber described above.
  • the epoxy resin composition contained in the prepreg of the present invention can prevent a decrease in glass transition temperature and a decrease in curing rate. Therefore, the prepreg of the present invention can be cured at a low temperature in a short time, and a fiber-reinforced composite resin molded article having excellent mechanical properties such as bending elastic modulus, bending strength, and breaking strain and heat resistance can be obtained. Further, if the prepreg of the present invention is used, the processing time can be shortened in the molding of the fiber-reinforced composite resin molded product, so that the fiber-reinforced composite resin molded product can be manufactured at low cost. Moreover, since the epoxy resin composition contained in the prepreg of the present invention has a controlled viscosity at 30 ° C., it has excellent workability and adjustment of tack on the surface of the prepreg.
  • the fiber-reinforced composite resin molded product of the present invention is a cured product of a laminate in which two or more of the above-mentioned prepregs of the present invention are laminated. That is, the fiber-reinforced composite resin molded product of the present invention contains a cured product of the epoxy resin composition contained in the prepreg and a reinforcing fiber.
  • the fiber-reinforced composite resin molded body is obtained by, for example, laminating two or more prepregs of the present invention and then molding the resulting epoxy resin composition by heating while applying pressure to the laminated body. .
  • the molding method of the fiber-reinforced composite resin molding of the present invention includes a press molding method, an autoclave molding method, a bagging molding method, a wrapping tape method, an internal pressure molding method, a sheet wrap molding method, and epoxy for a filament or preform of a reinforcing fiber.
  • examples include RTM (Resin Transfer Molding), which is impregnated with a resin composition to obtain a molded product, VaRTM (Vacuum assisted Resin Transfer Molding: vacuum resin impregnation manufacturing method), filament winding, RFI (Resin Film Infusion), and the like. It is not limited to these molding methods.
  • the wrapping tape method is a method of forming a tubular fiber-reinforced composite resin molded body (fiber-reinforced composite resin tubular body) by winding a prepreg around a core metal such as a mandrel, and manufacturing rod-shaped bodies such as golf shafts and fishing rods. It is preferably used when More specifically, a prepreg is wound on a mandrel, a wrapping tape made of a thermoplastic film is wound on the outside of the prepreg for fixing and applying pressure to the prepreg, and the epoxy resin composition in the prepreg is heat-cured in an oven. After that, the core metal is removed to obtain a fiber-reinforced composite resin tubular body.
  • the internal pressure molding method is to set a preform in which a prepreg is wound around an internal pressure imparting body such as a tube made of a thermoplastic resin in a mold, and then introduce a high pressure gas into the internal pressure imparting body to apply pressure and at the same time to apply the metal.
  • This is a method in which the mold is heated and molded.
  • the heating temperature is not particularly limited, but a higher temperature is preferable because the molding time can be shortened. Specifically, it is preferably 120 ° C or higher, more preferably 140 ° C or higher.
  • the present method is preferably used when molding a complicated shape object such as a golf shaft, a bat, a racket such as tennis or badminton.
  • the fiber-reinforced composite resin molded body of the present invention since it is a cured product of a laminated body in which two or more prepregs of the present invention are laminated, a machine such as bending elastic modulus, bending strength, breaking strain, etc. Excellent physical properties and heat resistance.
  • the fiber-reinforced composite resin molded product of the present invention is suitably used for sports applications, general industrial applications and aerospace applications. More specifically, in sports applications, it is suitably used for golf shafts, fishing rods, rackets for tennis and badminton, sticks such as hockey, and ski poles. Furthermore, in general industrial applications, it can be used as structural materials for moving bodies such as automobiles, ships, and railway vehicles, drive shafts, leaf springs, windmill blades, pressure vessels, flywheels, papermaking rollers, roofing materials, cables, and repair and reinforcement materials. It is preferably used.
  • Epoxy resin composition The epoxy resin composition of the present invention, which is different from the epoxy resin composition used for the prepreg of the present invention described above, will be described below.
  • the epoxy resin composition of the present invention contains an epoxy resin and a curing agent.
  • Examples of the epoxy resin contained in the epoxy resin composition of the present invention include the above-mentioned component (A), component (B), and the other epoxy resins listed as optional components.
  • the epoxy resin contained in the epoxy resin composition of the present invention preferably contains the above-mentioned component (A) or component (B), and more preferably contains the above-mentioned component (A) and component (B). Specific components and contents of the component (A) and the component (B) in the epoxy resin composition of the present invention, preferable modes and the like are as described above.
  • the epoxy resin contained in the epoxy resin composition of the present invention preferably has a ring structure and has a structural unit derived from a naphthalene structure, a dicyclopentadiene structure, or a structure represented by the following formula (2). Is preferable from the viewpoint of heat resistance.
  • n an integer of 1 to 30.
  • the above-mentioned component (D) can be mentioned. Specific components, content, preferred embodiments, etc. of the component (D) in the epoxy resin composition of the present invention are as described above.
  • the epoxy resin composition of the present invention is A urea compound may be included.
  • the urea compound include the above-mentioned component (C). Specific components, content, preferred embodiments, etc. of the component (C) in the epoxy resin composition of the present invention are as described above.
  • the glass transition temperature which is an index of heat resistance of the cured product of the epoxy resin composition is usually 120 ° C or higher, preferably 130 ° C or higher, more preferably 135 ° C or higher, and 140 ° C or higher. Is more preferable. From the viewpoint of toughness, it is preferably 250 ° C or lower, more preferably 200 ° C or lower, and further preferably 180 ° C or lower.
  • the curing completion time in the following measuring method is 12 minutes or less, preferably 11 minutes or less, and 8 minutes or less. More preferable.
  • Measurement method According to JIS K 6300, a change in torque value (N ⁇ m) at a die temperature of 140 ° C. is measured, and a torque-time curve is obtained. After the tangent slope of the obtained torque-time curve reaches the maximum value, the time when the slope becomes 1/30 of the maximum value is the curing completion time.
  • the epoxy resin composition of the present invention has a flexural strength of a cured resin plate obtained by heating the epoxy resin composition at 130 ° C. to 150 ° C., which is 174 MPa or more, preferably 175 MPa or more, more preferably 180 MPa or more. From the viewpoint, it is preferably 250 MPa or less, the flexural modulus is 3.6 GPa or more, preferably 3.7 GPa or more, more preferably 3.8 GPa or more, and from the viewpoint of cost, 5.0 MPa or less is preferable, and the breaking strain is 9 or less. % Or more, preferably 9.5% or more, more preferably 10% or more, and 20% or less from the viewpoint of cost.
  • the epoxy resin composition of the present invention can be cured in a short time even at a low temperature, and a resin molded article having excellent mechanical properties such as bending elastic modulus, bending strength, breaking strain and heat resistance can be obtained. Therefore, it is useful as a matrix resin used for a prepreg.
  • the method for producing a tubular molded body of the present invention includes the following steps. (1) placing a tubular prepreg containing a resin composition and reinforcing fibers in a mold, (2) A step of heating the tubular prepreg at 130 ° C. or higher, (3) A step of pressing the tubular prepreg against a mold to form the medium by expanding the medium from inside the tubular prepreg.
  • the tubular prepreg can be obtained, for example, by winding an prepreg containing a resin composition and reinforcing fibers around an internal pressure applying body such as a tube made of a thermoplastic resin.
  • the obtained tubular prepreg is set in a mold and heated to 130 ° C. or higher, preferably 140 ° C. or higher to be molded.
  • the molding can be performed by introducing high-pressure gas into the internal pressure applying body to expand the internal pressure applying body and pressing the gas from the inside of the tubular prepreg against the mold.
  • the resin composition contained in the tubular prepreg used in the method for producing a tubular molded body of the present invention contains the above-mentioned component (A), component (B), and component (D). Specific components and contents of the component (A), the component (B), and the component (D) in the method for producing a tubular molded body of the present invention, preferable embodiments, and the like are as described above.
  • the rapid curing property of the resin composition is improved, and a tubular prepreg in which curing is completed in a short time even at a low temperature is obtained, and in addition, since it is possible to suppress a decrease in breaking strain of the resin cured product, the tubular molded article of the present invention can be obtained.
  • the resin composition contained in the tubular prepreg used in the manufacturing method may contain a urea compound.
  • the urea compound include the above-mentioned component (C). Specific components, content, preferred embodiments and the like of the component (C) in the method for producing a tubular molded body of the present invention are as described above.
  • the resin composition containing the tubular prepreg used in the method for producing a tubular molded article of the present invention may be the epoxy resin composition of the present invention described above, and is the epoxy resin composition contained in the prepreg of the present invention described above. It may be.
  • the method may further include the step of bending the tubular prepreg into an annular shape.
  • the tubular molded body having an annular curved portion refers to something like a racket for tennis or badminton.
  • the tubular molded article of the present invention has a curved portion, preferably an annular curved portion, and contains a cured product of the resin composition and carbon fibers.
  • the resin composition contained in the tubular molded body of the present invention contains the above-mentioned component (A), component (B), and component (D). Specific components and contents of the component (A), the component (B), and the component (D) in the method for producing a tubular molded body of the present invention, preferable embodiments, and the like are as described above.
  • the resin composition contained in the tubular molded body of the present invention is the same as the resin composition contained in the tubular prepreg used in the method for producing the tubular molded body of the present invention, in terms of specific components, content, and preferred embodiments. May be
  • N-775 Phenol novolac type epoxy resin (manufactured by DIC Corporation, trade name: Epicron N-775).
  • N-740 Phenol novolac type epoxy resin (manufactured by DIC Corporation, trade name: Epicron N-740).
  • Omicure 94 3-phenyl-1,1-dimethylurea (manufactured by PIT II Japan, Inc., trade name: Omicure 94).
  • Component (D)) 1400F Dicyandiamide (Evonik Japan KK, trade name: DICYANEX1400F).
  • -JER828 + DDS Bisphenol A type epoxy resin (manufactured by Mitsubishi Chemical Corporation, trade name: jER828, number average molecular weight 370) 100 parts by mass, 4,4'-diaminodiphenyl sulfone (4,4'-DDS, Wakayama Seika Kogyo Co., Ltd.) Epoxy resin (epoxy) obtained by mixing 9 parts by mass of trade name: SEICACURE (registered trademark) -S) manufactured by Co., Ltd., and heating the resulting mixture to 170 ° C. and reacting (preliminary reaction) for 1 hour. Equivalent weight 266 g / eq, viscosity at 90 ° C. 1.3 Pa ⁇ s).
  • An epoxy resin composition was prepared as follows according to the formulations shown in Tables 1 to 3. First, the components other than the component (C) and the component (D) were weighed in a glass flask and heated and mixed at 100 ° C. to obtain a uniform epoxy resin main agent. After cooling the obtained epoxy resin main component to 60 ° C. or lower, the component (C) and the component (D) are weighed and added, and uniformly mixed by heating and mixing at 60 ° C. to obtain an epoxy resin composition.
  • an epoxy resin composition was prepared as follows. First, the components other than the component (C) and the component (D) were weighed in a glass flask and heated and mixed at 100 ° C. to obtain a uniform epoxy resin main agent. After cooling the obtained epoxy resin main component to 60 ° C. or lower, the component (C) and the component (D) are weighed and added, and uniformly mixed by heating and mixing at 60 ° C. to obtain an epoxy resin composition. It was Then, the obtained epoxy resin composition is cast by sandwiching it between glass plates together with a Teflon spacer having a thickness of 2 mm, holding at 70 ° C. for 10 minutes, and then heat-curing at 140 ° C. for 40 minutes to obtain a cured resin having a thickness of 2 mm. A plate (cured product of the epoxy resin composition) was obtained. The following measurements and evaluations were performed on the obtained cured resin plate. The results are shown in Table 3.
  • the cured resin plate in each example was processed into a length of 60 mm and a width of 8 mm to obtain a test piece.
  • the obtained test piece was subjected to a three-point bending test under the following measurement conditions to measure the bending strength, bending elastic modulus, and breaking strain of the cured resin plate.
  • Measurement environment temperature 23 °C, humidity 50% RH
  • the cured resin plate in each example was processed into a test piece by processing it into a length of 55 mm and a width of 12.5 mm.
  • the storage modulus (G ′) of the obtained test piece was measured under the following measurement conditions, log G ′ was plotted against temperature, and the approximate straight line in the flat region of log G ′ and G ′ were transferred. The temperature at the intersection of the area with the approximate straight line was recorded as the glass transition temperature (G'-Tg).
  • the epoxy resin compositions obtained in Examples 1 to 4 all had a curing completion time within 12 minutes.
  • all of the cured resin plates, which are cured products of these epoxy resin compositions had a bending strength of 174 MPa or more, a bending elastic modulus of 3.6 GPa or more, and a breaking strain of 9% or more, and were excellent in mechanical properties.
  • the glass transition temperature of the cured resin plate was 140 ° C. or higher, and the heat resistance was excellent. Therefore, with the prepregs containing the epoxy resin compositions obtained in Examples 1 to 4, curing is completed in a short time even at a low temperature, and mechanical properties such as bending elastic modulus, bending strength, and breaking strain and heat resistance are excellent. It was shown that a fiber-reinforced composite resin molded product can be obtained.
  • the epoxy resin composition of Comparative Example 1 containing no component (A) had a low breaking strain of the cured product (cured resin plate) and was inferior in mechanical properties.
  • the epoxy resin composition of Comparative Example 2 containing no component (B) had a long curing completion time. Further, the cured product of the epoxy resin composition had a low glass transition temperature and was inferior in heat resistance.
  • the epoxy resin compositions of Comparative Examples 3 and 4 in which the content of the component (A) was less than 40% by mass had a low glass transition temperature of the cured product and were poor in heat resistance.
  • the content of the component (A) is small, it is presumed that the adhesiveness to the reinforcing fiber is deteriorated and the physical properties of the fiber-reinforced composite resin molded product are deteriorated.
  • the epoxy resin compositions of Comparative Examples 5 and 6 in which the content of the component (B) was less than 15% by mass had a low glass transition temperature of the cured product and were poor in heat resistance.
  • the epoxy resin composition of Comparative Example 9 containing no component (C) had low flexural strength, flexural modulus and breaking strain, and was inferior in mechanical properties.
  • the prepreg of the present invention it is possible to obtain a fiber-reinforced composite resin molded product which is hardened in a short time even at a low temperature and has excellent mechanical properties such as flexural modulus, flexural strength and breaking strain and heat resistance. Therefore, according to the present invention, high productivity, high efficiency, molded articles excellent in mechanical properties, for example, molded articles for sports and leisure such as shafts for golf clubs to molded articles for industrial applications such as aircraft are provided widely. can do.

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  • Chemical & Material Sciences (AREA)
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  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Composite Materials (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
PCT/JP2019/040933 2018-10-17 2019-10-17 プリプレグ、繊維強化複合樹脂成形体、管状成形体の製造方法、エポキシ樹脂組成物、および管状成形体 Ceased WO2020080474A1 (ja)

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JP2020553296A JP7524764B2 (ja) 2018-10-17 2019-10-17 プリプレグ、繊維強化複合樹脂成形体、管状成形体の製造方法、エポキシ樹脂組成物、および管状成形体
CN201980067551.0A CN112839977B (zh) 2018-10-17 2019-10-17 预浸料、纤维增强复合树脂成型体、管状成型体的制造方法、环氧树脂组合物及管状成型体
CN202311115988.1A CN117164914A (zh) 2018-10-17 2019-10-17 预浸料及纤维增强复合树脂成型体
KR1020217009972A KR20210077674A (ko) 2018-10-17 2019-10-17 프리프레그, 섬유 강화 복합 수지 성형체, 관상 성형체의 제조 방법, 에폭시 수지 조성물 및 관상 성형체
US17/227,645 US20210230385A1 (en) 2018-10-17 2021-04-12 Prepreg, Fiber-Reinforced Composite Resin Molded Article, Method for Producing Tubular Molded Article, Epoxy Resin Composition, and Tubular Molded Article

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KR20240038221A (ko) * 2022-09-15 2024-03-25 삼성전자주식회사 가전기기용 복합 파이프 및 이를 포함하는 청소기

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TW202428684A (zh) 2024-07-16
JP7524764B2 (ja) 2024-07-30
TWI848992B (zh) 2024-07-21
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JPWO2020080474A1 (ja) 2021-09-24
KR20210077674A (ko) 2021-06-25

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