WO2020077800A1 - 柔性 oled 显示装置及制备方法 - Google Patents

柔性 oled 显示装置及制备方法 Download PDF

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Publication number
WO2020077800A1
WO2020077800A1 PCT/CN2018/122240 CN2018122240W WO2020077800A1 WO 2020077800 A1 WO2020077800 A1 WO 2020077800A1 CN 2018122240 W CN2018122240 W CN 2018122240W WO 2020077800 A1 WO2020077800 A1 WO 2020077800A1
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Prior art keywords
flexible substrate
flexible
display device
oled display
substrate
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PCT/CN2018/122240
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English (en)
French (fr)
Inventor
陈继峯
贾永臻
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to US16/316,353 priority Critical patent/US10833135B2/en
Publication of WO2020077800A1 publication Critical patent/WO2020077800A1/zh
Anticipated expiration legal-status Critical
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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the present application relates to the field of display technology, in particular to a flexible OLED display device and a preparation method.
  • the advantages of using a flexible OLED display device are not only the opportunity to make a bendable display or a curved display, but also the wiring and components of the non-display area can be hidden behind the display area by bending the substrate, thereby reducing the border area Area, increase screen ratio.
  • the more successful example of the application of the flexible substrate on the display is the application of the ultra-narrow lower bezel.
  • the flexible substrate can be bent to bend the trace and the bonding area and hide it under the display area.
  • the extension length of the area is shorter than that of the original flexible circuit board, so the lower border is reduced.
  • the shrinkage of the lower frame mentioned above depends on the radius of curvature of the flexible substrate bending.
  • the metal trace may be broken, resulting in signal interruption.
  • the prior art flexible OLED display device is coated with UV curing glue on the substrate to be bent, and then bent after curing, so that the position of the neutral plane can be adjusted to be close to The location of the metal traces further reduces the bending cross-sectional stress of the metal traces.
  • colloids due to the low modulus of elasticity of UV-curable adhesives, it is necessary to use colloids to adjust the position of the neutral plane to close to the metal traces. The thickness of the colloids must often exceed 200 ⁇ m.
  • the bending stiffness will increase significantly (which is proportional to the cube), that is, the thicker the thickness, the harder it will be to bend.
  • the thinning of the flexible substrate not only helps to reduce the stress of the metal traces, but its reaction force Rf under the bending state is also smaller as the substrate is thinned.
  • the thickness of the flexible substrate is too thin, the flatness of the substrate surface is reduced, which further affects the precision and electrical characteristics of the display area of the flexible OLED display device when manufacturing light-emitting and control elements.
  • the more feasible way is to only reduce the thickness of the flexible substrate in the bending area of the lower frame and retain the original thickness of the flexible substrate in the display area.
  • the existing flexible substrate coating technology is difficult to achieve continuous films of different thicknesses, and the surface will not appear. Height difference.
  • the method of processing and thinning the back surface of the flexible substrate using a laser is not only complicated and time-consuming, but also unsuitable for mass production, but also leads to the problem of a large amount of organic dust contaminating the production line.
  • the present application provides a flexible OLED display device and a preparation method thereof, which can effectively improve the bendability of the flexible OLED display device in the bending area without affecting the characteristics of the display element of the display area to solve the existing flexible OLED display
  • the device and preparation method because it is difficult to achieve continuous films of different thicknesses in the coating technology of flexible substrates, the surface will not have a height difference, which further affects the bendable performance of the flexible OLED display device in the bending area, which in turn affects the display technology problem.
  • the present application provides a flexible OLED display device, including: a first flexible substrate, an inorganic thin film layer, a second flexible substrate, a TFT layer, and an OLED light-emitting layer; wherein the flexible OLED display device includes a display area, and a A non-display area at one end of the area; the first flexible substrate and the inorganic thin film layer are located in the display area, and the second flexible substrate and the TFT layer extend from the display area to the non-display area.
  • the material of the inorganic thin film layer is silicon oxynitride.
  • the material of the first flexible substrate is polyimide
  • the material of the second flexible substrate is the same as the material of the first substrate.
  • the thickness of the first flexible substrate is greater than the thickness of the inorganic thin film layer, and the thickness of the second flexible substrate is the same as the thickness of the first flexible substrate.
  • the present application also provides a method for preparing a flexible OLED display device, the method comprising:
  • the S20 further includes:
  • the S60 further includes:
  • the material of the inorganic thin film layer is silicon oxynitride.
  • the material of the first flexible substrate is polyimide
  • the material of the second flexible substrate is the same as the material of the first substrate.
  • the thickness of the first flexible substrate is greater than the thickness of the inorganic thin film layer, the thickness of the second flexible substrate and the thickness of the first flexible substrate the same.
  • the flexible OLED display device and the preparation method provided by the present application can reduce the thickness of the flexible substrate in the bending area, while maintaining the original thickness of the non-bending area, thereby improving flexibility
  • the bendability of the OLED display device in the bending area further prevents the metal traces in the bending area from breaking, and further increases the screen ratio of the flexible OLED display device.
  • FIG. 1 is a schematic structural diagram of a flexible OLED display device of the present application.
  • FIG. 2 is a flowchart of a method for manufacturing a flexible OLED display device of the present application.
  • 2A-2G are schematic diagrams of the method for manufacturing the flexible OLED display device in FIG. 2.
  • FIG. 3 is a plan 2D top view of solution 1 of the flexible OLED display device of the present application.
  • FIG. 5 is a plan 3D side view of the second solution of the flexible OLED display device of the present application.
  • the present application is directed to the existing flexible OLED display device and its preparation method. Since it is difficult to achieve continuous films of different thicknesses in the coating technology of flexible substrates, the surface will not have a height difference, which further affects the flexible OLED display device in the bending area The bendable performance, which in turn affects the technical problems of display, can be solved by this embodiment.
  • the present application provides a flexible OLED display device 10, including: a first flexible substrate 101, an inorganic thin film layer 102, a second flexible substrate 103, a TFT layer 104, and an OLED light emitting layer 105; wherein, the flexible The OLED display device 10 includes a display area and a non-display area located at one end of the display area; the first flexible substrate 101 and the inorganic thin film layer 102 are located in the display area, the second flexible substrate 103 and the The TFT layer 104 extends from the display area to the non-display area.
  • the material of the first flexible substrate 101 is polyimide
  • the material of the second flexible substrate 103 is the same as the material of the first substrate 101.
  • the material of the inorganic thin film layer 102 is silicon oxynitride.
  • the thickness of the first flexible substrate 101 is greater than the thickness of the inorganic thin film layer 102, and the thickness of the second flexible substrate 103 is the same as the thickness of the first flexible substrate 101.
  • the present application also provides a flow of a method for manufacturing a flexible OLED display device.
  • the method includes:
  • a glass substrate 201 is provided, and a first flexible substrate 202 is coated on the surface of the glass substrate 201, and the first flexible substrate 202 has a bending region and a non-bending region.
  • the S10 further includes:
  • a cleaned glass substrate 201 is provided, a layer of flexible base material is coated on the surface of the glass substrate 201, and the first flexible substrate 202 is formed after baking, and the flexible base material is polyimide.
  • the first flexible substrate 202 has a bending area and a non-bending area, as shown in FIG. 2A.
  • a release layer 203 is formed on the first flexible substrate 202 located in the bending region.
  • the S20 further includes:
  • a baffle mask is used to cover the surface of the first flexible substrate 202 to expose a portion of the first flexible substrate 202 located in the bending area, and a local release agent is added to the Part of the first flexible substrate 202 is sprayed to form a release layer 203, and the release layer 203 is located in the bending region and defines a local release region, as shown in FIG. 2B.
  • an inorganic thin film layer 204 is formed on the surface of the first flexible substrate 202, and the inorganic thin film layer 204 completely covers the release layer 203.
  • the S30 further includes:
  • An inorganic thin film layer 204 is deposited on the surface of the first flexible substrate 202 using a chemical vapor film, and the inorganic thin film layer 204 completely covers the release layer 203.
  • the material of the inorganic thin film layer 204 is silicon oxynitride.
  • the thickness of the inorganic thin film layer 204 is smaller than the thickness of the first flexible substrate 202.
  • the inorganic thin film layer 204 can improve the water resistance of the first flexible substrate 202. Performance and flatness are shown in Figure 2C.
  • the S40 further includes:
  • a layer of flexible substrate material is coated on the surface of the inorganic thin film layer 204 to form a second flexible substrate 205.
  • the material of the second flexible substrate 205 is polyimide, and the thickness of the second flexible substrate 205 is the same as the thickness of the first flexible substrate 202, as shown in FIG. 2D.
  • a TFT layer 206 and an OLED light emitting layer 207 are sequentially deposited on the surface of the second flexible substrate 205.
  • the S50 further includes:
  • a yellow light process is performed on the surface of the second flexible substrate 205 to form a TFT layer 206, and then an OLED light emitting layer 207 is deposited on a portion of the TFT layer 206 located in the non-bending area, as shown in FIG. 2E.
  • the glass substrate 201 is removed, and the first flexible substrate 202 is turned over to peel off part of the first flexible substrate 202, the release layer 203 and part of the inorganic thin film layer 204 located in the bending region .
  • the S60 further includes:
  • the semi-finished flexible OLED display device is first removed from the glass substrate 201; and then turned over on the surface of the first flexible substrate 202 Perform laser half-cutting and use laser energy to control the cutting depth; finally, the part of the first flexible substrate 202 located in the bending area is torn off, since the first flexible substrate 202 has been previously coated with a mask spray
  • the release layer 203 is defined, and a locally releasable region is defined. Therefore, a portion of the first flexible substrate 202 in the bending region can be torn off with a very light release force ( ⁇ 5g / cm). Since only the second flexible substrate 205 remains in the bending area, the stress of the metal traces in the bending area can be greatly reduced, as shown in FIG. 2F.
  • the S70 further includes:
  • FIG. 3 is a plan 2D top view of solution 1 of the flexible OLED display device of the present application.
  • the portion of the metal trace bending region is the single-layer flexible substrate region 30, and the other regions are the double-layer flexible substrate region 40.
  • the portion of the metal wiring bending area being the single-layer flexible substrate area 30
  • the portion of the left and right edge regions of the display area is also the single-layer flexible substrate area 30, and the other areas are the double-layer flexible substrate area 40.
  • FIG. 5 is a plan 3D side view of the second solution of the flexible OLED display device of the present application.
  • the bending of the left and right edge regions of the display area is mainly applied to narrow-frame displays with curved edges, which will effectively reduce the risk of damage to the components caused by the bending of the edges.
  • the flexible OLED display device and the preparation method provided by the present application can reduce the thickness of the flexible substrate in the bending area, while maintaining the original thickness of the non-bending area, thereby improving flexibility
  • the bendability of the OLED display device in the bending area further prevents the metal traces in the bending area from breaking, and further increases the screen ratio of the flexible OLED display device.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
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Abstract

一种柔性OLED显示装置及其制备方法，包括：第一柔性基板、无机薄膜层、第二柔性基板、TFT层以及OLED发光层；其中，所述柔性OLED显示装置包括显示区域，以及非显示区域；所述第一柔性基板以及所述无机薄膜层位于所述显示区域，所述第二柔性基板以及所述TFT层从所述显示区域延伸到所述非显示区域。

Description

柔性OLED显示装置及制备方法 技术领域
本申请涉及显示技术领域，尤其涉及一种柔性OLED显示装置及制备方法。
 背景技术
目前，使用柔性OLED显示装置的优点除了有机会制作出可弯折显示器或曲面显示器, 还可藉由基板的弯折，将非显示区的走线与元件隐藏于显示区背后，进而减少边框区域面积，提升屏占比。其中，柔性基板应用在显示器上较成功的例子是超窄下边框的应用，利用柔性基板可弯折的特性，将走线与接合区弯折后藏于显示区下方，如此一来，弯折区延伸长度较原先的软性电路板来得短，下边框因此得以缩小。然而，上述的下边框缩小程度取决于柔性基板弯折的曲率半径，半径越小则下边框得以缩的越小，反之，则下边框变大；当曲率半径越小时，弯折截面应力越大，弯折截面应力越大就有可能造成金属走线断裂, 导致讯号中断。为了解决上述弯折截面应力过大的问题, 现有技术的柔性OLED显示装置是在待弯折的基板上方涂布紫外固化胶, 固化后再进行弯折, 使得中性面位置得以调整到接近金属走线的位置, 进而降低了金属走线的弯折截面应力。但是由于紫外固化胶的弹性模量偏低, 所以要利用胶体来调整中性面位置到接近金属走线, 胶体的厚度往往必须超过200μm以上。而根据弯曲刚度与断面材料、几何的关系可知，厚度增大, 弯曲刚度会大幅增长(三次方为正比) , 也就是说, 厚度堆叠得越厚, 就越难弯。
所以，柔性基板减薄不但有助于降低金属走线应力, 其在维持弯折状态下的反作用力Rf, 也随着基板的减薄而更小。然而, 柔性基板厚度太薄会降低基板表面平坦度, 进而影响柔性OLED显示装置的显示区域在制作发光及控制元件时的精密度和电气特性。较可行的方式是只减薄下边框弯折区的柔性基板厚度, 保留显示区域的柔性基板的原有厚度, 然而, 现有的柔性基板涂布技术难以达成不同厚度连续膜, 表面不会出现高低差。另外, 使用激光对柔性基板背面进行加工减薄的方式除了程序复杂费时, 不适用量产, 还会衍生大量有机粉尘污染生产线的问题。
综上所述，现有的柔性OLED显示装置及制备方法，在柔性基板涂布技术时，难以达成不同厚度连续膜, 表面不会出现高低差，进一步影响了柔性OLED显示装置在弯折区域的可弯折性能。
 技术问题
现有的柔性OLED显示装置及制备方法，在柔性基板涂布技术时，难以达成不同厚度连续膜, 表面不会出现高低差，进一步影响了柔性OLED显示装置在弯折区域的可弯折性能。
 技术解决方案
本申请提供一种柔性OLED显示装置及制备方法，能够在不影响显示区域显示元件特性的前提下，有效提升柔性OLED显示装置在弯折区域的可弯折性，以解决现有的柔性OLED显示装置及制备方法，由于在柔性基板涂布技术时，难以达成不同厚度连续膜, 表面不会出现高低差，进一步影响了柔性OLED显示装置在弯折区域的可弯折性能，进而影响显示的技术问题。
为解决上述问题，本申请提供的技术方案如下：
本申请提供一种柔性OLED显示装置，包括：第一柔性基板、无机薄膜层、第二柔性基板、TFT层以及OLED发光层；其中，所述柔性OLED显示装置包括显示区域，以及位于所述显示区域一端的非显示区域；所述第一柔性基板以及所述无机薄膜层位于所述显示区域，所述第二柔性基板以及所述TFT层从所述显示区域延伸到所述非显示区域。在本申请实施例所提供的柔性显示装置中，所述无机薄膜层的材质为氮氧化硅。
在本申请实施例所提供的柔性显示装置中，所述第一柔性基板的材质为聚酰亚胺，所述第二柔性基板的材质与所述第一基板的材质相同。
在本申请实施例所提供的柔性显示装置中，所述第一柔性基板的厚度大于所述无机薄膜层的厚度，所述第二柔性基板的厚度与所述第一柔性基板的厚度相同。
本申请还提供一种柔性OLED显示装置的制备方法，所述方法包括：
S10，提供一玻璃基板，在所述玻璃基板表面涂布第一柔性基板，所述第一柔性基板具有弯折区域以及非弯折区域；
S20，在位于所述弯折区域的部分所述第一柔性基板上形成离形层；
S30，在所述第一柔性基板表面形成一无机薄膜层，所述无机薄膜层完全覆盖所述离形层；
S40，在所述无机薄膜层表面涂布第二柔性基板；
S50，在所述第二柔性基板表面依次沉积形成TFT层以及OLED发光层；
S60，去除所述玻璃基板，并翻转所述第一柔性基板，剥离位于所述弯折区域的部分所述第一柔性基板、所述离形层以及部分所述无机薄膜层；
S70，将位于所述弯折区域的部分所述第二柔性基板以及部分所述TFT层弯折，并绑定柔性电路板以及驱动电路，形成柔性OLED显示装置。
在本申请实施例所提供的柔性显示装置的制备方法中，所述S20还包括：
S201，使用挡板遮罩对位于所述非弯折区域的部分所述第一柔性基板进行遮挡；
S202，加入一道局部离形剂对未被所述挡板遮罩遮挡的剩余部分所述第一柔性基板进行喷涂，形成离形层。
在本申请实施例所提供的柔性显示装置的制备方法中，所述S60还包括：
S601，去除所述基板，并翻转所述第一柔性基板；
S602，对位于所述弯折区域的部分所述第一柔性基板进行激光半切；
S603，剥离位于所述弯折区域的部分所述第一柔性基板、所述离形层以及部分所述无机薄膜层。
在本申请实施例所提供的柔性显示装置的制备方法中，所述无机薄膜层的材质为氮氧化硅。
在本申请实施例所提供的柔性显示装置的制备方法中，所述第一柔性基板的材质为聚酰亚胺，所述第二柔性基板的材质与所述第一基板的材质相同。
在本申请实施例所提供的柔性显示装置的制备方法中，所述第一柔性基板的厚度大于所述无机薄膜层的厚度，所述第二柔性基板的厚度与所述第一柔性基板的厚度相同。
 有益效果
本申请的有益效果为：本申请所提供的柔性OLED显示装置及制备方法，将弯折区域的柔性基板的厚度得以减薄，而非弯折区域得以维持原有的厚度不变，提升了柔性OLED显示装置在弯折区域的可弯折性，进一步防止弯折区域的金属走线断裂，更进一步提升了柔性OLED显示装置的屏占比。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请柔性OLED显示装置结构示意图。
图2为本申请柔性OLED显示装置的制备方法流程图。
图2A-2G为图2中柔性OLED显示装置的制造方法示意图。
图3为本申请柔性OLED显示装置方案一的平面2D俯视图。
图4为本申请柔性OLED显示装置方案二的平面2D俯视图。
图5为本申请柔性OLED显示装置方案二的平面3D侧视图。
 本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本申请可用以实施的特定实施例。本申请所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本申请，而非用以限制本申请。在图中，结构相似的单元是用以相同标号表示。
本申请针对现有的柔性OLED显示装置及制备方法，，由于在柔性基板涂布技术时，难以达成不同厚度连续膜, 表面不会出现高低差，进一步影响了柔性OLED显示装置在弯折区域的可弯折性能，进而影响显示的技术问题，本实施例能够解决该缺陷。
如图1所示，本申请提供一种柔性OLED显示装置10，包括：第一柔性基板101、无机薄膜层102、第二柔性基板103、TFT层104以及OLED发光层105；其中，所述柔性OLED显示装置10包括显示区域，以及位于所述显示区域一端的非显示区域；所述第一柔性基板101以及所述无机薄膜层102位于所述显示区域，所述第二柔性基板103以及所述TFT层104从所述显示区域延伸到所述非显示区域。
具体的，所述第一柔性基板101的材质为聚酰亚胺，所述第二柔性基板103的材质与所述第一基板101的材质相同。
具体的，所述无机薄膜层102的材质为氮氧化硅。
具体的，所述第一柔性基板101的厚度大于所述无机薄膜层102的厚度，所述第二柔性基板103的厚度与所述第一柔性基板101的厚度相同。
如图2所示，本申请还提供一种柔性OLED显示装置的制造方法流程，所述方法包括：
S10，提供一玻璃基板201，在所述玻璃基板201表面涂布第一柔性基板202，所述第一柔性基板202具有弯折区域以及非弯折区域。
具体的，所述S10还包括：
首先，提供一清洗干净的玻璃基板201，在所述玻璃基板201表面涂布一层柔性基底材料，烤干后形成第一柔性基板202，所述柔性基底材料为聚酰亚胺。所述第一柔性基板202具有弯折区域以及非弯折区域，如图2A所示。
S20，在位于所述弯折区域的部分所述第一柔性基板202上形成离形层203。
具体的，所述S20还包括：
使用一挡板遮罩覆盖于所述第一柔性基板202的表面，暴露出位于所述弯折区域的部分所述第一柔性基板202，加入一道局部离形剂对位于所述弯折区域的部分所述第一柔性基板202上进行喷涂，形成离形层203，所述离形层203位于所述弯折区域内，并定义了局部可离形区，如图2B所示。
S30，在所述第一柔性基板202表面形成一无机薄膜层204，所述无机薄膜层204完全覆盖所述离形层203。
具体的，所述S30还包括：
在所述第一柔性基板202的表面使用化学气相薄膜沉积出一层无机薄膜层204，所述无机薄膜层204完全覆盖所述离形层203。所述无机薄膜层204的材质为氮氧化硅，所述无机薄膜层204的厚度小于所述第一柔性基板202的厚度，所述无机薄膜层204可以提升所述第一柔性基板202的阻水性能和平坦性，如图2C所示。
S40，在所述无机薄膜层204表面涂布第二柔性基板205。
具体的，所述S40还包括：
在所述无机薄膜层204表面涂布一层柔性衬底材料，形成第二柔性基板205。所述第二柔性基板205的材质为聚酰亚胺，所述第二柔性基板205的厚度与所述第一柔性基板202的厚度相同，如图2D所示。
S50，在所述第二柔性基板205表面依次沉积形成TFT层206以及OLED发光层207。
具体的，所述S50还包括：
首先在所述第二柔性基板205表面进行黄光制程，形成TFT层206，之后在所述TFT层206位于非弯折区域的部分沉积形成OLED发光层207，如图2E所示。
S60，去除所述玻璃基板201，并翻转所述第一柔性基板202，剥离位于所述弯折区域的部分所述第一柔性基板202、所述离形层203以及部分所述无机薄膜层204。
具体的，所述S60还包括：
所述OLED发光层207沉积于所述TFT层206表面之后，首先将半成品的所述柔性OLED显示装置从所述玻璃基板201上取下；然后翻面在所述第一柔性基板202的表面上进行激光半切，利用激光能量来控制切割深度；最后，将位于弯折区域的部分所述第一柔性基板202撕除，由于先前在涂完所述第一柔性基板202后已使用遮罩喷涂形成了所述离形层203，并定义了局部可离形区。因此，可以用很轻的离形力(<5g/cm)将弯折区的部分所述第一柔性基板202撕除。由于弯折区只剩下所述第二柔性基板205，因此可使弯折区的金属走线应力大幅度下降，如图2F所示。
S70，将位于所述弯折区域的部分所述第二柔性基板205以及部分所述TFT层206弯折，并绑定柔性电路板208以及驱动电路，形成柔性OLED显示装置。
具体的，所述S70还包括：
将位于所述弯折区域的部分所述第二柔性基板205以及部分所述TFT层206弯折，并使用异方性导电胶膜绑定柔性电路板208以及驱动电路，形成柔性OLED显示装置，如图2G所示。
图3为本申请柔性OLED显示装置方案一的平面2D俯视图。其中，金属走线弯折区的部分为单层柔性基板区域30，而其他区域为双层柔性基板区域40。
图4为本申请柔性OLED显示装置方案二的平面2D俯视图。其中，除了金属走线弯折区的部分为单层柔性基板区域30之外，显示区域左右两侧边缘区的部分也为单层柔性基板区域30，而其他区域为双层柔性基板区域40。
图5为本申请柔性OLED显示装置方案二的平面3D侧视图。其中，所述显示区域左右两侧边缘区弯折主要应用在具有弧形边缘的窄边框显示器，这将有效降低边缘弯折所带来的元件受损风险。
本申请的有益效果为：本申请所提供的柔性OLED显示装置及制备方法，将弯折区域的柔性基板的厚度得以减薄，而非弯折区域得以维持原有的厚度不变，提升了柔性OLED显示装置在弯折区域的可弯折性，进一步防止弯折区域的金属走线断裂，更进一步提升了柔性OLED显示装置的屏占比。
综上所述，虽然本申请已以优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (10)

  1. 一种柔性OLED显示装置，其中，包括：
    第一柔性基板；
    无机薄膜层，位于所述第一柔性基板的表面；
    第二柔性基板，位于所述无机薄膜层的表面；
    TFT层和OLED发光层，位于所述第二柔性基板的表面；
    其中，所述柔性OLED显示装置包括显示区域，以及位于所述显示区域一端的非显示区域；所述第一柔性基板以及所述无机薄膜层位于所述显示区域，所述第二柔性基板以及所述TFT层从所述显示区域延伸到所述非显示区域。
  2. 根据权利要求1所述的柔性OLED显示装置，其中，所述无机薄膜层的材质为氮氧化硅。
  3. 根据权利要求1所述的柔性OLED显示装置，其中，所述第一柔性基板的材质为聚酰亚胺，所述第二柔性基板的材质与所述第一基板的材质相同。
  4. 根据权利要求1所述的柔性OLED显示装置，其中，所述第一柔性基板的厚度大于所述无机薄膜层的厚度，所述第二柔性基板的厚度与所述第一柔性基板的厚度相同。
  5. 一种柔性OLED显示装置的制备方法，其中，所述方法包括：
    S10，提供一玻璃基板，在所述玻璃基板表面涂布第一柔性基板，所述第一柔性基板具有弯折区域以及非弯折区域；
    S20，在位于所述弯折区域的部分所述第一柔性基板上形成离形层；
    S30，在所述第一柔性基板表面形成一无机薄膜层，所述无机薄膜层完全覆盖所述离形层；
    S40，在所述无机薄膜层表面涂布第二柔性基板；
    S50，在所述第二柔性基板表面依次沉积形成TFT层以及OLED发光层；
    S60，去除所述玻璃基板，并翻转所述第一柔性基板，剥离位于所述弯折区域的部分所述第一柔性基板、所述离形层以及部分所述无机薄膜层；
    S70，将位于所述弯折区域的部分所述第二柔性基板以及部分所述TFT层弯折，并绑定柔性电路板以及驱动电路，形成柔性OLED显示装置。
  6. 根据权利要求5所述的柔性OLED显示装置的制备方法，其中，所述S20还包括：
    S201，使用挡板遮罩对位于所述非弯折区域的部分所述第一柔性基板进行遮挡；
    S202，加入一道局部离形剂对未被所述挡板遮罩遮挡的剩余部分所述第一柔性基板进行喷涂，形成离形层。
  7. 根据权利要求5所述的柔性OLED显示装置的制备方法，其中，所述S60还包括：
    S601，去除所述基板，并翻转所述第一柔性基板；
    S602，对位于所述弯折区域的部分所述第一柔性基板进行激光半切；
    S603，剥离位于所述弯折区域的部分所述第一柔性基板、所述离形层以及部分所述无机薄膜层。
  8. 根据权利要求5所述的柔性OLED显示装置的制备方法，其中，所述无机薄膜层的材质为氮氧化硅。
  9. 根据权利要求5所述的柔性OLED显示装置的制备方法，其中，所述第一柔性基板的材质为聚酰亚胺，所述第二柔性基板的材质与所述第一基板的材质相同。
  10. 根据权利要求5所述的柔性OLED显示装置的制备方法，其中，所述第一柔性基板的厚度大于所述无机薄膜层的厚度，所述第二柔性基板的厚度与所述第一柔性基板的厚度相同。
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