WO2020063645A1 - 电路板结构及电子设备 - Google Patents
电路板结构及电子设备 Download PDFInfo
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- WO2020063645A1 WO2020063645A1 PCT/CN2019/107755 CN2019107755W WO2020063645A1 WO 2020063645 A1 WO2020063645 A1 WO 2020063645A1 CN 2019107755 W CN2019107755 W CN 2019107755W WO 2020063645 A1 WO2020063645 A1 WO 2020063645A1
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- circuit board
- component
- pin
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
Definitions
- the present disclosure relates to the field of circuit design, and in particular, to a circuit board structure and electronic equipment.
- a “sandwich” stacking method is used to increase the bearing area of components, that is, as shown in FIG. 1, two bearing circuit boards for bearing components are stacked on each other, and two bearing circuits are stacked on each other. Another connection circuit board is welded between the boards.
- the carrier circuit board is usually arranged around the components between the two carrier circuit boards.
- the two carrier circuit boards are supported and electrically connected by the connection circuit boards.
- the connection through the connection circuit board will increase the length of the connection line between the two bearing circuit boards, resulting in a decrease in the electrical conductivity between the two bearing circuit boards, especially when there are many connection lines between the two bearing circuit boards. .
- Embodiments of the present disclosure provide a circuit board structure and an electronic device, so as to solve the related art that the length of a connection line between two bearing circuit boards is increased due to the connection of the circuit boards, resulting in electrical conduction between the two bearing circuit boards. Degraded performance.
- an embodiment of the present disclosure provides a circuit board structure including a first circuit board and a second circuit board:
- At least one first component is disposed between the first circuit board and the second circuit board;
- Each of the first components is provided with a first pin and a second pin;
- the first circuit board is provided with a first pad corresponding to the first pin
- the second circuit board is provided with a second pad corresponding to the second pin
- an embodiment of the present disclosure further provides an electronic device including the circuit board structure described above.
- the circuit board structure includes a first circuit board and a second circuit board. At least one first component is disposed between the first circuit board and the second circuit board. Each first component is provided with a first component. Pin and second pin; the first circuit board is provided with a first pad corresponding to the first pin, the second circuit board is provided with a second pad corresponding to the second pin, and the first pin is soldered to The first pad and the second pin are soldered to the second pad, and the first component electrically connects the first circuit board and the second circuit board.
- the first component electrically connects the first circuit board and the second circuit board.
- FIG. 1 is one of the structural schematic diagrams of a circuit board structure provided by an embodiment of the present disclosure
- FIG. 2 is a second structural schematic diagram of a circuit board structure provided by an embodiment of the present disclosure.
- FIG. 3 is a third structural schematic diagram of a circuit board structure provided by an embodiment of the present disclosure.
- FIG. 4 is a fourth structural schematic diagram of a circuit board structure provided by an embodiment of the present disclosure.
- FIG. 5 is a fifth structural schematic diagram of a circuit board structure provided by an embodiment of the present disclosure.
- FIG. 6 is a sixth schematic structural diagram of a circuit board structure provided by an embodiment of the present disclosure.
- FIG. 1 is a schematic structural diagram of a circuit board structure according to an embodiment of the present disclosure.
- the circuit board structure includes a first circuit board 10 and a second circuit board 20, where:
- At least one first component 30 is disposed between the first circuit board 10 and the second circuit board 20;
- Each first component 30 is provided with a first pin 31 and a second pin 32;
- the first circuit board 10 is provided with a first pad 11 corresponding to the first pin 31, the second circuit board 20 is provided with a second pad 21 corresponding to the second pin 32, and the first pin 31 is soldered to the first A pad 11 and a second pin 32 are soldered to the second pad 21, and the first component 30 electrically connects the first circuit board 10 and the second circuit board 20.
- the first component 30 is a component carried between the first circuit board 10 and the second circuit board 20
- the first component 30 may be close to the bearing area of the first circuit board 10 and the second circuit board 20. It is set at the center position, and the bearing area is used to carry components. Therefore, the first circuit board 10 and the second circuit board 20 are electrically connected through the first component 30 to shorten the first circuit board 10 and the second circuit board. The length of the line on 20 increases the electrical conduction performance between the first circuit board 10 and the second circuit board 20.
- first circuit board 10 and second circuit board 20 may be any circuit board capable of carrying components 30, which may be a single-layer circuit board, a double-layer circuit board, or a circuit with three or more layers
- first circuit board 10 and the second circuit board 20 may be single-layer circuit boards; or one of the first circuit board 10 and the second circuit board 20 is a single-layer circuit board and the other circuit board It is a double-layer circuit board, etc., and is not limited herein.
- the length of the components between the first circuit board 10 and the second circuit board 20 may be longer in the direction from the first circuit board 10 to the second circuit board 20, which may cause the overall structure of the circuit board. Thicker.
- one side of any one of the first circuit board 10 and the second circuit board 20 may be provided with an opening so that a higher component on the other circuit board passes through the side through the opening.
- components on one circuit board can partially extend into or penetrate another circuit board, thereby reducing the overall thickness of the circuit board structure.
- the opening may be an opening in a recessed area or a hollowed out area on a circuit board, and may be set according to a height of a component opposite to the opening.
- a first opening 101 having a recessed area may be opened on the first circuit board 10, and the second circuit board 20
- the component A opposite to the first opening 101 may partially extend into the first opening 101, that is, the component A does not penetrate the first circuit board 10, and the component B on the first circuit board 10 is much higher than the component
- a second opening 201 with a hollowed-out area may be opened on the second circuit board 20, and the component B on the first circuit board 10 opposite to the second opening 201 may pass through the second opening 201 ⁇ ⁇ ⁇ 20 ⁇ Two circuit boards 20.
- the at least one first component 30 may be a part or all of the components disposed between the first circuit board 10 and the second circuit board 20, for example, the first circuit board 10 and the first circuit board 10
- all components between the first circuit board 10 and the second circuit board 20 may be used as the first components 30 described above.
- the components in the related technology are usually provided with functional pins for realizing their normal work, and the functional pins of the components are usually soldered only to the first circuit board 10 or the second circuit board 20, and the elements are realized by the function pins.
- the device is electrically connected to the circuit board where it is located to achieve the normal operation of the component.
- the first pin 31 or the second pin 32 on the first component 30 may be a function pin of the first component 30, and when the first component 30 connects the first circuit board 10 and the second circuit When the board 20 is electrically connected, the first pin 31 or the second pin 32 can still achieve the normal operation of the first component 30; or, the first pin 31 and the second pin 32 may be different from the first pin 31 Added pins for the functional pins of the component 30.
- the first circuit board 10 and the second circuit board 20 can pass through the first The components 30 are electrically connected, so the first pin 31 and the second pin 32 need to be electrically connected.
- each of the first components 30 may be provided with only a first pin 31 and a second pin 32, so as to implement a line between the first circuit board 10 and the second circuit board 20.
- each of the above-mentioned first components 30 may also be provided with a plurality of first pins 31 and a plurality of second pins 32, through a plurality of second pins 31 and a plurality of second pins 32. A plurality of lines between the first circuit board 10 and the second circuit board 20 are conducted.
- first pin 31 and the second pin 32 are electrically connected, and a line may be engraved on the surface of the first component 30, and the electrical properties of the first pin 31 and the second pin 32 may be achieved by the engraved line.
- a line may be engraved on the surface of the first component 30, and the electrical properties of the first pin 31 and the second pin 32 may be achieved by the engraved line.
- it can also be conducted in other ways, which is not limited here.
- the first circuit board 10 and the second circuit board 20 may be supported and electrically connected only by the at least one first component 30.
- the at least one first component 30 may connect All lines that need to be electrically connected between the first circuit board 10 and the second circuit board 20 are conducted, and at least one first component 30 can provide sufficient support force for the first circuit board 10 and the second circuit board 20, starting from To the stent effect.
- the first circuit board 10 and the second circuit board 20 are provided with a carrying area (not shown), the carrying area is used for soldering components, and at least one first component 30
- the circuit board structure further includes a third circuit board 40, the third circuit board 40 is sandwiched between the first circuit board 10 and the second circuit board 20, and the third circuit board 40 is disposed around the bearing area; A circuit board 10 and a second circuit board 20 are also electrically connected through a third circuit board 40.
- the third circuit board 40 is sandwiched between the first circuit board 10 and the second circuit board 20, and can support the first circuit board 10 and the second circuit board 20 to improve the firmness of the circuit board structure;
- the first circuit board 10 and the second circuit board 20 are also electrically connected through the third circuit board 40, so that the wiring mode of the connection line between the first circuit board 10 and the second circuit board 20 can be flexibly set, and the first circuit board 10 can be further shortened.
- the length of the connection line between one circuit board 10 and the second circuit board 20 is sandwiched between the first circuit board 10 and the second circuit board 20, and can support the first circuit board 10 and the second circuit board 20 to improve the firmness of the circuit board structure;
- the first circuit board 10 and the second circuit board 20 are also electrically connected through the third circuit board 40, so that the wiring mode of the connection line between the first circuit board 10 and the second circuit board 20 can be flexibly set, and the first circuit board 10 can be further shortened.
- the third circuit board 40 may be any circuit board capable of supporting the first circuit board 10 and the second circuit board 20 and electrically connecting the first circuit board 10 and the second circuit board 20. It may be a single circuit board. Layer circuit board or multilayer circuit board; and the third circuit board 40 may be an integrated circuit board, or may be composed of multiple circuit boards, which is not limited herein.
- the third circuit board 40 is disposed around the carrying area, at least one first component 30 is disposed in the carrying area, and the first circuit board 10 and the second circuit board 20 can pass through the third circuit board 40 and each first circuit board, respectively.
- One component 30 is electrically connected. Therefore, selecting a proper connection method can effectively shorten the length of the connection line between the first circuit board 10 and the second circuit board 20.
- the first circuit board 10 is provided with a first circuit
- the second circuit board 20 is provided with a second circuit
- the first circuit and the second circuit are electrically connected through at least one first component 30.
- the sum of the distance between a circuit and the second circuit and the at least one first component 30 is less than the sum of the distance between the first circuit and the second circuit and the third circuit board 40, because the first circuit and the second circuit
- the sum of the distances from the first component 30 is closer, and the first circuit and the second circuit are electrically connected through the first component 30, so that the connection between the first circuit board 10 and the second circuit board 20 can be further shortened The length of the line.
- the first circuit board 10 and the second circuit board 20 can be supported by at least one first component 30 and the third circuit board 40 at the same time, that is, at least the first component 30 and the third circuit board 40 are soldered to the first circuit board 10 and the second circuit board 20.
- the height of the first component 30 is equal to the height of the third circuit board 40, so that it is easy to realize that at least one of the first component 30 and the third
- the circuit board 40 is soldered between the first circuit board 10 and the second circuit board 20, and at the same time, the soldering stability of the circuit board structure is improved.
- the at least one first component 30 is disposed in the bearing area, and the at least one first component 30 may be disposed in any position in the bearing area.
- the at least one first component 30 is a first component 30, and the first component 30 is disposed at a central position of the carrying area; the at least one first component 30 includes a plurality of first components 30, and more The first components 30 are evenly distributed in the bearing area, so that the supporting capacity of the at least one first component 30 to the first circuit board 10 and the second circuit board 20 can be increased, and the first circuit board 10 and the second circuit can be further shortened The length of the connection lines between the circuit boards 20.
- the circuit board structure may include only one first component 30, or may include a plurality of first components 30.
- the circuit board structure includes a plurality of first components 30, in order to improve each first component 30, The supporting and balancing performance of the component 30 on the first circuit board 10 and the second circuit board.
- the circuit board structure includes a plurality of first components 30.
- the first circuit board 10 faces the second circuit board 20. In the direction, a height difference between the plurality of first components 30 is less than or equal to a preset height difference.
- the first component 30 may also be a component formed by stacking at least two components, and the at least two components may be electrically connected.
- the component 30 is formed by stacking the component C and the component D, the component C and the component D are welded together, the component C is welded on the first circuit board 10, and the component D is welded on the second circuit board.
- a third pin 33 is provided on the first component 30, and a third pad 12 and a third pin corresponding to the third pin 33 are provided on the first circuit board 10. 33 is soldered on the third pad 12;
- the circuit board structure further includes a second component 50.
- the second component 50 is disposed on a side of the first circuit board 10 away from the second circuit board 20.
- the second component 50 is provided with a fourth pin 51 and the first circuit board 10.
- a fourth pad 13 corresponding to the fourth pin 51 is provided thereon, the fourth pin 51 is soldered to the fourth pad 13, and the fourth pin 51 is electrically connected to the third pin 33 through the first circuit board 10 and the third pin 33. connection.
- the fourth pin 51 on the second component 50 is electrically connected to the third pin 33 on the first component 30 through the first circuit board 10, so that the first component 30 and the second component 50 can be realized.
- Electrical connection when the first component 30 and the second component 50 are stackable components, the first component 30 and the second component 50 are disposed on the first circuit board 10 compared to the stacking method. Both sides can effectively reduce the height of the circuit board structure, especially when the height of the first component 30 and the second component 50 is high.
- the third pin 33 may be a pin different from the first pin 31 on the first component 30, so that the first component 30 can not only be electrically connected to the second component 50 on the first circuit board 10. It can also be electrically connected to other circuits or components on the first circuit board 10; or, optionally, the third pin 33 is the first pin 31, so that the first component 30 is only connected to the second element.
- the device 50 is electrically connected.
- the fourth pin 51 is electrically connected to the third pin 33 through the first circuit board 10, and then the first circuit board 10 is provided with a connection line connecting the fourth pin 51 and the third pin 33.
- the third pads 12 and the fourth pads 13 are oppositely disposed on both sides of the first circuit board 10, and the first circuit board 10 is provided with an extension from the third pad 12 to the fourth pad 13.
- the third pad 12 and the fourth pad 13 are electrically connected through the connection line, so that the connection line between the third pin 33 and the fourth pin 51 is the shortest, which further improves the electrical conductivity of the circuit board structure. .
- a component electrically connected to the first component 30 may also be provided on the second circuit board 10, and details are not described herein.
- the above-mentioned circuit board structure may include other components in addition to the above-mentioned components.
- the circuit board structure may further include a shield 60, and the shield 60 is provided with the first circuit board.
- the shield 60 is provided with the first circuit board. 10 A side away from the second circuit board 20, the shielding member 60 and the first circuit board 10 form a receiving space 70, and the components on the side of the first circuit board 10 away from the second circuit board 20 are accommodated in the above-mentioned accommodation
- the shield 60 can shield the components located in the receiving space 70 from the outside; similarly, the side of the second circuit board 20 away from the first circuit board 10 can also be provided with the shield 60, which is not performed here. To repeat.
- the circuit board structure includes a first circuit board and a second circuit board. At least one first component is disposed between the first circuit board and the second circuit board. Each first component is provided with a first component. Pin and second pin; the first circuit board is provided with a first pad corresponding to the first pin, the second circuit board is provided with a second pad corresponding to the second pin, and the first pin is soldered to The first pad and the second pin are soldered to the second pad, and the first component electrically connects the first circuit board and the second circuit board.
- the first component electrically connects the first circuit board and the second circuit board.
- the first component is a component of a packaging structure.
- the pin can be a pin leading from the package body, or a soldering point on the surface of the package body for soldering to a circuit board patch.
- an embodiment of the present disclosure further provides an electronic device including the above circuit board structure.
- the electronic device may be a mobile terminal, such as: a mobile phone, a tablet computer, a laptop computer, a personal digital assistant (PDA), and a mobile Internet device (such as Mobile Internet Device (MID) or Wearable Device (Wearable Device), etc., can also be other electronic devices, such as digital cameras, e-books, navigators, etc.
- a mobile terminal such as: a mobile phone, a tablet computer, a laptop computer, a personal digital assistant (PDA), and a mobile Internet device (such as Mobile Internet Device (MID) or Wearable Device (Wearable Device), etc.
- MID Mobile Internet Device
- Wearable Device Wearable Device
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Abstract
一种电路板结构及电子设备，电路板结构包括第一电路板（10）和第二电路板（20），第一电路板（10）与第二电路板（20）之间设置有至少一个第一元器件（30）；每一第一元器件（30）设置有第一管脚（31）和第二管脚（32）；第一电路板（10）设有与第一管脚（31）对应的第一焊盘（11），第二电路板（20）设有与第二管脚（32）对应的第二焊盘（12），第一管脚（31）焊接于第一焊盘（11），第二管脚（32）焊接于第二焊盘（12），且第一元器件（30）将第一电路板（10）与第二电路板（20）电连接。上述电路板结构，通过第一元器件（30）将第一电路板（10）和第二电路板（20）上的线路电连接，可以缩短第一电路板（10）和第二电路板（20）上线路的长度，从而提升第一电路板（10）和第二电路板（20）之间的电导通性能。
Description
相关申请的交叉引用
本申请主张在2018年9月29日在中国提交的中国专利申请No.201811150119.1的优先权，其全部内容通过引用包含于此。
本公开涉及电路设计领域，尤其涉及一种电路板结构及电子设备。
随着电子技术的飞速发展，智能手机和平板电脑等电子设备越来越普及，并已成为人们日常生活中不可或缺的工具。为了满足人们对于电子设备的需求，电子设备通过元器件性能的改进以及新增元器件来实现越来越多的功能。
由于电子设备中元器件的不断增加，元器件需要占用印刷电路板(Printed Circuit Board，PCB)上越来越多的承载面积。相关技术中，有采用“三明治”的堆叠方式来实现增加元器件的承载面积，即如图1所示，将两块用于承载元器件的承载电路板相互叠设，并在两块承载电路板之间焊接另一连接电路板，该承载电路板通常围绕两块承载电路板之间的元器件设置，通过连接电路板支撑和电连接两块承载电路板。但是，由于通过连接电路板连接会增加两块承载电路板之间的连接线路的长度，导致两块承载电路板之间的电导通性能降低，尤其两块承载电路板之间的连接线路较多时。
可见，相关技术中存在因连接电路板引起两块承载电路板之间的连接线路的长度增加，导致两块承载电路板之间的电导通性能降低的问题。
发明内容
本公开实施例提供一种电路板结构及电子设备，以解决相关技术中存在因连接电路板引起两块承载电路板之间的连接线路的长度增加，导致两块承载电路板之间的电导通性能降低的问题。
为解决上述技术问题，本公开是这样实现的：
第一方面，本公开实施例提供一种电路板结构，包括第一电路板和第二电路板：
所述第一电路板与所述第二电路板之间设置有至少一个第一元器件；
每一所述第一元器件设置有第一管脚和第二管脚；
所述第一电路板设有与所述第一管脚对应的第一焊盘，所述第二电路板设有与所述第二管脚对应的第二焊盘，所述第一管脚焊接于所述第一焊盘，所述第二管脚焊接于所述第二焊盘，且所述第一元器件将所述第一电路板与所述第二电路板电连接。
第二方面，本公开实施例还提供一种电子设备，包括上述电路板结构。
本公开实施例中，电路板结构包括第一电路板和第二电路板，第一电路板与第二电路板之间设置有至少一个第一元器件；每一第一元器件设置有第一管脚和第二管脚；第一电路板设有与第一管脚对应的第一焊盘，第二电路板设有与第二管脚对应的第二焊盘，第一管脚焊接于第一焊盘，第二管脚焊接于第二焊盘，且第一元器件将第一电路板与第二电路板电连接。这样，通过第一元器件将第一电路板和第二电路板上的线路电连接，可以缩短第一电路板和第二电路板上线路的长度，从而提升第一电路板和第二电路板之间的电导通性能。
为了更清楚地说明本公开实施例的技术方案，下面将对本公开实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本公开实施例提供的电路板结构的结构示意图之一；
图2是本公开实施例提供的电路板结构的结构示意图之二；
图3是本公开实施例提供的电路板结构的结构示意图之三；
图4是本公开实施例提供的电路板结构的结构示意图之四；
图5是本公开实施例提供的电路板结构的结构示意图之五；
图6是本公开实施例提供的电路板结构的结构示意图之六。
下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
参见图1，图1是本公开实施例提供的一种电路板结构的结构示意图，如图1所示，电路板结构包括第一电路板10和第二电路板20，其中：
第一电路板10与第二电路板20之间设置有至少一个第一元器件30；
每一第一元器件30设置有第一管脚31和第二管脚32；
第一电路板10设有与第一管脚31对应的第一焊盘11，第二电路板20设有与第二管脚32对应的第二焊盘21，第一管脚31焊接于第一焊盘11，第二管脚32焊接于第二焊盘21，且第一元器件30将第一电路板10与第二电路板20电连接。
这里，由于第一元器件30为第一电路板10和第二电路板20之间承载的元器件，第一元器件30可以靠近第一电路板10和第二电路板20上的承载区域的中心位置设置，该承载区域用于承载元器件，因而通过第一元器件30将第一电路板10和第二电路板20上的线路电连接，可以缩短第一电路板10和第二电路板20上线路的长度，从而提升第一电路板10和第二电路板20之间的电导通性能。
应当说明的是，上述第一电路板10和第二电路板20可以是任何能够承载元器件30的电路板，其可以是单层电路板、双层电路板或者三层或三层以上的电路板，例如：上述第一电路板10和第二电路板20均可以为单层电路板；或者第一电路板10和第二电路板20中一块电路板为单层电路板且另一块电路板为双层电路板，等等，在此并不进行限定。
另外，由于在由第一电路板10至第二电路板20的方向上，第一电路板10和第二电路板20之间的元器件的长度可能较长，从而可能引起电路板结构的总体厚度较厚。
本公开实施例中，第一电路板10和第二电路板20中任一电路板的一侧 面可以开设有开口，以使另一电路板上较高的元器件由该开口穿过上述侧面，从而使得一电路板上的元器件可以部分伸入或者贯穿另一电路板，实现电路板结构总体厚度的降低。
其中，上述开口可以是电路板上的凹陷区域或者镂空区域的开口，其可以根据与该开口相对的元器件的高度进行设定。例如：如图2所示，在第二电路板20上的元器件A稍高的情况下，可以在第一电路板10上开设有凹陷区域的第一开口101，且第二电路板20上与该第一开口101相对的元器件A可以部分伸入第一开口101内，即元器件A未贯穿第一电路板10；而在第一电路板10上的元器件B远高于元器件A的高度时，可以在第二电路板20上开设有镂空区域的第二开口201，且第一电路板10上与该第二开口201相对的元器件B可以通过该第二开口201贯穿第二电路板20。
本公开实施例中，上述至少一个第一元器件30可以是设置于第一电路板10和第二电路板20之间的元器件中的部分或者全部，例如：在第一电路板10和第二电路板20之间的元器件数量较少，且各元器件的高度一致时，可以将第一电路板10和第二电路板20之间的所有元器件作为上述第一元器件30。
相关技术中的元器件中通常设置有用于实现其正常工的功能管脚，且元器件的功能管脚通常仅焊接于第一电路板10或者第二电路板20上，通过功能管脚实现元器件与其所在电路板的电连接，以实现该元器件的正常工作。
其中，上述第一元器件30上的第一管脚31或者第二管脚32可以是第一元器件30的功能管脚，且当第一元器件30将第一电路板10和第二电路板20电连接时，第一管脚31或者第二管脚32仍然可以实现第一元器件30的正常工作；或者，上述第一管脚31和第二管脚32也可以是区别于第一元器件30的功能管脚的新增的管脚。
另外，在第一管脚31焊接于第一焊盘11上，以及第二管脚32焊接于第二焊盘21上的情况下，第一电路板10和第二电路板20可以通过第一元器件30电连接，因而第一管脚31和第二管脚32之间需要设置为电性导通。
需要说明的是，上述每一第一元器件30上可以是仅设置有一个第一管脚31和一个第二管脚32，从而实现第一电路板10和第二电路板20之间一条线 路的导通；当然，上述每一第一元器件30上也可以设置有多个第一管脚31和多个第二管脚32，通过多个第二管脚31和多个第二管脚32，实现第一电路板10和第二电路板20之间多条线路的导通。
另外，第一管脚31和第二管脚32电性导通，可以是在第一元器件30的表面刻印线路，通过刻印的线路实现第一管脚31和第二管脚32的电性导通，当然也可以通过其他方式，在此并不作限定。
本公开实施例中，上述第一电路板10和第二电路板20之间可以是仅通过上述至少一个第一元器件30支撑并实现电连接，此时上述至少一个第一元器件30可以将第一电路板10和第二电路板20之间需要电连接的所有线路导通，且至少一个第一元器件30可以为第一电路板10和第二电路板20提供足够的支撑力，起到支架作用。
或者，可选地，如图3所示，第一电路板10和第二电路板20上设置有承载区域(图未示)，承载区域用于焊接元器件，且至少一个第一元器件30位于承载区域内；电路板结构还包括第三电路板40，第三电路板40夹设于第一电路板10和第二电路板20之间，且第三电路板40围绕承载区域设置；第一电路板10和第二电路板20还通过第三电路板40电连接。
这里，第三电路板40夹设于第一电路板10和第二电路板20之间，可以对第一电路板10和第二电路板20进行支撑，提升电路板结构的牢固性；而且，第一电路板10和第二电路板20还通过第三电路板40电连接，从而可以灵活设置第一电路板10和第二电路板20之间连接线路的走线方式，进而可以进一步缩短第一电路板10和第二电路板20之间的连接线路的长度。
其中，上述第三电路板40可以是任何能够对第一电路板10和第二电路板20进行支撑，且将第一电路板10和第二电路板20电连接的电路板，其可以是单层电路板或者多层电路板；且第三电路板40可以是一块整体电路板，或者是由多块电路板组成，在此并不进行限定。
另外，由于第三电路板40围绕承载区域设置，至少一个第一元器件30设置于承载区域内，且第一电路板10和第二电路板20可以分别通过第三电路板40和每一第一元器件30电连接，因此，选择合适的连接方式可以有效缩短第一电路板10和第二电路板20之间的连接线路的长度。
可选地，第一电路板10上设置有第一电路，第二电路板20上设置有第二电路，且第一电路和第二电路通过至少一个第一元器件30电连接，其中，第一电路和第二电路与至少一个第一元器件30之间的距离之和，小于第一电路和第二电路与第三电路板40之间的距离之和，由于第一电路和第二电路与第一元器件30之间的距离之和更近，第一电路和第二电路通过第一元器件30电连接，从而可以进一步缩短第一电路板10和第二电路板20之间的连接线路的长度。
由于第一电路板10和第二电路板20可以同时通过至少一个第一元器件30和第三电路板40支撑，即至少第一元器件30和第三电路板40均焊接于第一电路板10和第二电路板20之间。可选的，在第一电路板10朝向第二电路板20的方向上，第一元器件30的高度等于第三电路板40的高度，从而易于实现将至少一个第一元器件30和第三电路板40焊接于第一电路板10和第二电路板20之间，同时提升电路板结构的焊接稳定性。
当然，在第一电路板10朝向第二电路板20的方向上，第一元器件30与第三电路板40之间也可以具有一定的高度差，在焊接时可以通过焊锡等焊接剂弥补上述高度差。
需要说明的是，上述至少一个第一元器件30设置于承载区域内，可以是至少一个第一元器件30设置于承载区域内的任意位置。可选的，至少一个第一元器件30为一个第一元器件30，一个第一元器件30设置于承载区域的中央位置；至少一个第一元器件30包括多个第一元器件30，多个第一元器件30均匀分布于承载区域，从而可以增加至少一个第一元器件30对第一电路板10和第二电路板20的支撑能力，并且可以进一步缩短第一电路板10和第二电路板20之间的连接线路的长度。
如上，电路板结构可以是仅包括一个第一元器件30，也可以是包括多个第一元器件30，而在电路板结构包括多个第一元器件30的情况下，为提升各第一元器件30对第一电路板10和第二电路板之间的支撑平衡性能，可选的，电路板结构包括多个第一元器件30，在第一电路板10朝向第二电路板20的方向上，多个第一元器件30之间的高度差小于或者等于预设高度差。
本公开实施例中，上述第一元器件30还可以是有至少两个元器件堆叠形 成的元器件，且该至少两个元器件之间可以电连接，例如：如图4所示，第一元器件30由元器件C和元器件D叠设形成，元器件C和元器件D焊接在一起，且元器件C焊接于第一电路板10上，元器件D焊接于第二电路板上。
可选地，如图5所示，第一元器件30上设有第三管脚33，第一电路板10上设有与第三管脚33对应的第三焊盘12，第三管脚33焊接于第三焊盘12上；
电路板结构还包括第二元器件50，第二元器件50设置于第一电路板10远离第二电路板20的侧面，第二元器件50设有第四管脚51，第一电路板10上设有与第四管脚51对应的第四焊盘13，第四管脚51焊接于第四焊盘13上，且第四管脚51通过第一电路板10与第三管脚33电连接。
这里，第二元器件50上的第四管脚51通过第一电路板10与第一元器件30上的第三管脚33电连接，从而可以实现第一元器件30和第二元器件50的电连接，当第一元器件30和第二元器件50为可堆叠的元器件时，相比于堆叠的方式，将第一元器件30和第二元器件50设置于第一电路板10的两侧面，可以有效降低电路板结构的高度，尤其是第一元器件30和第二元器件50堆叠时的高度较高的情况下。
其中，上述第三管脚33可以是第一元器件30上区别于第一管脚31的管脚，从而使第一元器件30不仅可以与第一电路板10上的第二元器件50电连接，还可以与第一电路板10上的其他电路或者元器件电连接；或者，可选的，第三管脚33为第一管脚31，从而实现第一元器件30仅与第二元器件50电连接。
另外，上述第四管脚51通过第一电路板10与第三管脚33电连接，则第一电路板10上设置有连接第四管脚51和第三管脚33的连接线路。可选的，第三焊盘12与第四焊盘13正对设置于第一电路板10的两侧面，且第一电路板10上设有由第三焊盘12向第四焊盘13延伸的连接线路，第三焊盘12和第四焊盘13通过连接线路电连接，从而时第三管脚33与第四管脚51之间的连接线路最短，进一步提升电路板结构的电导通性能。
当然，上述第二电路板10上也可以设置一与第一元器件30电连接的元器件，在此并不进行赘述。
需要说明的是，上述电路板结构除包括上述各部件之外，还可以包括其他部件，例如：如图6所示，电路板结构还可以包括屏蔽件60，屏蔽件60设置与第一电路板10远离第二电路板20的一侧面，屏蔽件60与第一电路板10围成收容空间70，且第一电路板10远离第二电路板20的一侧面上的元器件均收容于上述收容空间70内，屏蔽件60可以将位于收容空间70内的元器件与外界屏蔽；同理，第二电路板20远离第一电路板10的一侧面也可以设置屏蔽件60，在此并不进行赘述。
本公开实施例中，电路板结构包括第一电路板和第二电路板，第一电路板与第二电路板之间设置有至少一个第一元器件；每一第一元器件设置有第一管脚和第二管脚；第一电路板设有与第一管脚对应的第一焊盘，第二电路板设有与第二管脚对应的第二焊盘，第一管脚焊接于第一焊盘，第二管脚焊接于第二焊盘，且第一元器件将第一电路板与第二电路板电连接。这样，通过第一元器件将第一电路板和第二电路板上的线路电连接，可以缩短第一电路板和第二电路板上线路的长度，从而提升第一电路板和第二电路板之间的电导通性能。
可选地，本公开实施中，第一元器件为封装结构的元器件。管脚可以是从封装主体引出的引脚，也可以是在封装主体表面的焊接点，用于与电路板贴片焊接。
基于上述电路板结构，本公开实施例还提供一种电子设备，包括上述电路板结构。
由于电子设备本体的结构是相关技术，电路板结构在上述实施例中已进行详细说明，因此，本实施例中对于具体的电子设备的结构不再赘述。
本公开实施例中，上述电子设备可以是移动终端，例如：手机、平板电脑(Tablet Personal Computer)、膝上型电脑(Laptop Computer)、个人数字助理(personal digital assistant，PDA)、移动上网装置(Mobile Internet Device，MID)或可穿戴式设备(Wearable Device)等，还可以是其它电子设备，如数码相机、电子书、导航仪等。
上面结合附图对本公开的实施例进行了描述，但是本公开并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的， 本领域的普通技术人员在本公开的启示下，在不脱离本公开宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本公开的保护之内。
Claims (10)
- 一种电路板结构，包括第一电路板和第二电路板，其中：所述第一电路板与所述第二电路板之间设置有至少一个第一元器件；每一所述第一元器件设置有第一管脚和第二管脚；所述第一电路板设有与所述第一管脚对应的第一焊盘，所述第二电路板设有与所述第二管脚对应的第二焊盘，所述第一管脚焊接于所述第一焊盘，所述第二管脚焊接于所述第二焊盘，且所述第一元器件将所述第一电路板与所述第二电路板电连接。
- 根据权利要求1所述的电路板结构，其中：所述第一元器件上设有第三管脚，所述第一电路板上设有与所述第三管脚对应的第三焊盘，所述第三管脚焊接于所述第三焊盘上；所述电路板结构还包括第二元器件，所述第二元器件设置于所述第一电路板远离所述第二电路板的侧面，所述第二元器件设有第四管脚，所述第一电路板上设有与所述第四管脚对应的第四焊盘，所述第四管脚焊接于所述第四焊盘上，且所述第四管脚通过所述第一电路板与所述第三管脚电连接。
- 根据权利要求2所述的电路板结构，其中：所述第三管脚为所述第一管脚。
- 根据权利要求2或者3所述的电路板结构，其中：所述第三焊盘与所述第四焊盘正对设置于所述第一电路板的两侧面，且所述第一电路板上设有由所述第三焊盘向所述第四焊盘延伸的连接线路，所述第三焊盘和所述第四焊盘通过所述连接线路电连接。
- 根据权利要求1所述的电路板结构，其中：所述第一电路板和所述第二电路板上设置有承载区域，所述承载区域用于焊接元器件，且所述至少一个第一元器件位于所述承载区域内；所述电路板结构还包括第三电路板，所述第三电路板夹设于所述第一电路板和所述第二电路板之间，且所述第三电路板围绕所述承载区域设置；所述第一电路板和所述第二电路板还通过所述第三电路板电连接。
- 根据权利要求5所述的电路板结构，其中：所述第一电路板上设置有第一电路，所述第二电路板上设置有第二电路，且所述第一电路和所述第二电路通过所述至少一个第一元器件电连接，其中，所述第一电路和所述第二电路与所述至少一个第一元器件之间的距离之和，小于所述第一电路和所述第二电路与所述第三电路板之间的距离之和。
- 根据权利要求5或者6所述的电路板结构，其中：在所述第一电路板朝向所述第二电路板的方向上，所述第一元器件的高度等于所述第三电路板的高度。
- 根据权利要求5或者6所述的电路板结构，其中：所述至少一个第一元器件为一个第一元器件，所述一个第一元器件设置于所述承载区域的中央位置；所述至少一个第一元器件包括多个第一元器件，所述多个第一元器件均匀分布于所述承载区域。
- 根据权利要求1所述的电路板结构，其中：所述电路板结构包括多个所述第一元器件，在所述第一电路板朝向所述第二电路板的方向上，多个所述第一元器件之间的高度差小于或者等于预设高度差。
- 一种电子设备，其中，所述电子设备包括如权利要求1至9中任一项所述的电路板结构。
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-
2019
- 2019-09-25 WO PCT/CN2019/107755 patent/WO2020063645A1/zh not_active Ceased
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040089943A1 (en) * | 2002-11-07 | 2004-05-13 | Masato Kirigaya | Electronic control device and method for manufacturing the same |
| US20050275317A1 (en) * | 2004-06-09 | 2005-12-15 | Nihon Dempa Kogyo Co., Ltd. | Structure with a plurality of substrates, its manufacturing method and crystal oscillator with the structure |
| CN204046940U (zh) * | 2014-08-26 | 2014-12-24 | 安捷利电子科技（苏州）有限公司 | 新型埋入式元器件的封装结构及电路板 |
| CN204316868U (zh) * | 2014-09-30 | 2015-05-06 | 上海移远通信技术有限公司 | 电路板的结合结构 |
| CN105516407A (zh) * | 2015-12-21 | 2016-04-20 | 惠州Tcl移动通信有限公司 | 移动终端及其电路板组件 |
| CN109041418A (zh) * | 2018-09-29 | 2018-12-18 | 维沃移动通信有限公司 | 一种电路板结构及电子设备 |
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| Publication number | Publication date |
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| CN109041418A (zh) | 2018-12-18 |
| CN109041418B (zh) | 2020-08-11 |
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