WO2020062886A1

WO2020062886A1 - Developing unit cleaning device and cleaning method using same

Info

Publication number: WO2020062886A1
Application number: PCT/CN2019/086740
Authority: WO
Inventors: 叶红
Original assignee: 武汉华星光电技术有限公司
Priority date: 2018-09-27
Filing date: 2019-05-14
Publication date: 2020-04-02
Also published as: CN109324484A; CN109324484B

Abstract

Provided is a developing unit cleaning device (110) applied in an exposure system, the developing unit cleaning device is respectively connected to the substrate coating unit (120) and the substrate developing unit (140), the developing unit cleaning device is used to transfer the photoresist solvent waste liquid generated by the substrate coating unit to the substrate developing unit, and to clean the developing tank (141) provided in the substrate developing unit. The developing unit cleaning device effectively solves the problem that the cured photoresist residue inside the developing unit is not cleaned, improves the cleanliness of the developing tank of the developing unit, so as to avoid product defects caused by the cleanliness of the developing tank of the developing unit, meanwhile, the developing unit cleaning device can use the photoresist solvent for a second time, improving the utilization rate of chemical consumables.

Description

Developing unit cleaning device and cleaning method using the same

Technical field

The present invention relates to the technical field of liquid crystal display panels, and in particular, to a developing unit cleaning device and a cleaning method using the device.

Background technique

In the exposure process of a TFT array substrate, a series of operations such as cleaning, coating, exposure, and development are generally performed through an exposure system. As shown in FIG. 1, the prior art exposure system includes a substrate cleaning unit 110, a substrate coating unit 120, a substrate exposure unit 130, and a substrate development unit 140. Specifically, first, in the substrate cleaning unit 110, the glass substrate is cleaned, which includes processes such as ultraviolet irradiation, water vapor cleaning, and air knife drying; second, the cleaned substrate is subjected to hot-plate baking and buffer cooling; In the substrate coating unit 120, a photoresist is coated on the substrate by a linear coater; and a vacuum dryer (Vacuum Chamber Dry), the photoresist solution is dried and cooled to form a solid, and then hot plate baking is performed to further dry; then, the dried substrate is turned and transferred to the exposure machine in the substrate exposure unit 130 A mask is used on a glass substrate to define a pattern on the photoresist to perform an exposure operation, and then the edges are exposed to remove the photoresist on the edge of the substrate; and the substrate is transferred to the substrate developing unit 140. In the substrate developing unit 140, a pattern is displayed by a developing process.

In the substrate developing unit 140, a developing subunit, a replacement water washing subunit, a straight water washing subunit, and an air knife drying subunit are respectively provided. Among them, the developing subunit is mainly used for developing a photoresist having a defined pattern to form a patterned photoresist. The replacement water washing sub-unit and the straight water washing sub-unit are mainly used to clean the photoresist developing solution remaining on the substrate. However, since the developing unit has been in the developing operation for a long time, the photoresist developing solution and the mixed solution will splash / evaporate in the chamber, and a solidified photoresist residue will be formed. When the substrate passes through the substrate developing unit 140, these photoresist residues may fall on the surface of the substrate, which may easily cause a pattern abnormality of the substrate. Therefore, the related staff will periodically clean and maintain the substrate developing unit 140 to reduce the influence of the photoresist residue. .

technical problem

As for the solidified photoresist residue, the developing tank cannot be cleaned by using only water or a developing solution, but a photoresist solvent (such as a rinse solution) is required for cleaning. However, the photoresist solvent is not provided at the position of the developing unit, so cleaning and maintenance of the developing unit will cause certain difficulties. Cleaning the unclean photoresist residue for a long time may easily cause abnormalities in the substrate to be processed and even the entire product.

In view of this, there is an urgent need to provide a developing unit cleaning device or a cleaning method.

Technical solutions

The purpose of the present invention is to provide a developing unit cleaning device, which effectively solves the problem that the solidified photoresist residue of the developing unit is not cleaned, improves the cleanliness in the developing tank of the developing unit, and thus avoids the development tank of the developing unit. The product's bad problem caused by the cleanliness of the product. At the same time, the device can use the photoresist solvent (such as rinse solution) for a second time, which improves the utilization rate of chemical consumables.

According to an aspect of the present invention, the present invention provides a developing unit cleaning device applied to an exposure system, the exposure system including a substrate cleaning unit, a substrate coating unit, a substrate exposure unit, and a substrate developing unit; The substrate cleaning unit is configured to clean a substrate, and transfer the cleaned substrate to the substrate coating unit; the substrate coating unit is coated by a photoresist provided in the substrate coating unit. The mechanism applies a photoresist to the substrate, and transfers the photoresist-coated substrate to the substrate exposure unit; the substrate exposure unit is used to define a pattern of the photoresist through a mask exposure process to perform an exposure operation, and After the exposure operation is performed, the substrate is transferred to the substrate developing unit; the substrate developing unit is used to develop a patterned photoresist through a development process to form a patterned photoresist; wherein the developing unit is clean A device is installed in the exposure system, and the developing unit cleaning device is connected to the substrate coating unit and the substrate development, respectively The developing unit cleaning device is configured to transfer the photoresist solvent waste liquid generated by the substrate coating unit to the substrate developing unit, and clean a developing tank provided in the substrate developing unit; The photoresist solvent waste liquid is a resin solution; the developing unit cleaning device includes a temporary storage tank and a pipeline, the pipeline includes a first pipeline and a second pipeline, and the first pipeline is connected Respectively connected to the output end of the substrate coating unit and the input end of the temporary storage tank, and the second pipeline connection is respectively connected to the output end of the temporary storage tank and the input end of the developing tank The temporary storage tank is used to store a photoresist solvent waste liquid generated by the substrate coating unit, and is provided to the developing tank.

According to another aspect of the present invention, the present invention provides a developing unit cleaning device applied to an exposure system, the exposure system includes a substrate cleaning unit, a substrate coating unit, a substrate exposure unit, and a substrate developing unit. The substrate cleaning unit is configured to clean a substrate and transfer the cleaned substrate to the substrate coating unit; the substrate coating unit passes a photoresist coating provided in the substrate coating unit The cloth mechanism applies a photoresist to the substrate, and transfers the photoresist-coated substrate to the substrate exposure unit; the substrate exposure unit is used to define a pattern of the photoresist through a mask exposure process to perform an exposure operation, After the exposure operation is performed, the substrate is transferred to the substrate developing unit; the substrate developing unit is used to develop a patterned photoresist through a development process to form a patterned photoresist; the developing unit is cleaned The device is installed in the exposure system, and the developing unit cleaning device is connected to the substrate coating unit and the substrate developing unit, respectively. ; The developing unit cleaning means for delivering the solvent waste photoresist coating unit substrate to the substrate generated by the developing unit, and the developing tank provided in the developing unit in the substrate cleaning.

In an embodiment of the present invention, the photoresist solvent waste liquid is a resin solution.

In an embodiment of the present invention, the developing unit cleaning device includes a temporary storage tank and a pipeline, the pipeline includes a first pipeline and a second pipeline, and the first pipeline is connected to An output end of the substrate coating unit and an input end of the temporary storage tank, and the second pipeline connection is respectively connected to the output end of the temporary storage tank and the input end of the developing tank; The temporary storage tank is used to store the photoresist solvent waste liquid generated by the substrate coating unit, and is provided to the developing tank.

In an embodiment of the present invention, a first switching valve is provided on the first pipeline, and the first switching valve is used to control a photoresist solvent from the substrate coating unit to the temporary storage tank. The flow of effluent.

In an embodiment of the present invention, a second on-off valve is provided on the temporary storage tank, and the second on-off valve is used to discharge the photoresist solvent waste liquid stored in the temporary storage tank to a External factory equipment.

In an embodiment of the present invention, a third on-off valve is provided on the second pipeline, and the third on-off valve is used to control the photoresist solvent waste liquid from the temporary storage tank to the developing tank. Of traffic.

In an embodiment of the present invention, the second pipeline is a detachable pipeline, and the second pipeline is also used to detachably connect the temporary storage tank body to other units of the exposure system.

According to yet another aspect of the present invention, the present invention further provides a developing unit cleaning method using the above-mentioned developing unit cleaning device. The developing unit cleaning device includes a temporary storage tank and a pipeline, and the pipeline includes a first tube. And a second pipeline, the method includes: (a) a substrate coating unit generating a photoresist solvent waste liquid after applying photoresist to the substrate; (b) passing the photoresist solvent waste liquid through the substrate The first pipeline is transmitted to the temporary storage tank and stored; (c) the photoresist solvent waste liquid stored in the temporary storage tank is provided to a developing tank through the second pipeline to clean the development groove.

In an embodiment of the present invention, a first on-off valve is provided on the first pipeline; the method in step (b) further includes: controlling from the substrate coating unit to the substrate coating unit via the first on-off valve. The flow rate of the photoresist solvent waste liquid in the temporary storage tank is described.

In an embodiment of the present invention, a third on-off valve is provided on the second pipeline; the method in step (c) further includes: controlling the third on-off valve from the temporary storage tank to all The flow rate of the photoresist solvent waste liquid in the developing tank is described.

Beneficial effect

An advantage of the present invention is that the developing unit cleaning device of the present invention adds a temporary storage tank containing a photoresist solvent between the substrate coating unit and the substrate developing unit, and coats the photoresist in the substrate coating unit. The photoresist solvent waste liquid used by the pre-cleaning roller of the cloth mechanism is reused for cleaning solidified photoresist residues remaining in the developing tank of the substrate developing unit. Therefore, the developing unit cleaning device can improve the cleanliness of the substrate developing unit, solve the problem of product failure caused by the residue of the photoresist, and use the photoresist solvent for a second time to improve the utilization rate of the chemical consumables. In addition, the secondary use of the photoresist solvent also saves the time for the related staff to originally clean the substrate developing unit, so as to improve the body productivity.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to explain the technical solutions in the embodiments of the present invention more clearly, the drawings used in the description of the embodiments are briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without paying creative labor.

FIG. 1 is a schematic structural diagram of a conventional exposure system.

FIG. 2 is a schematic diagram of a developing unit cleaning device in an embodiment of the present invention.

FIG. 3 is a schematic structural diagram of an exposure system in the embodiment of the present invention, and the developing unit cleaning device is installed in the exposure system.

FIG. 4 is a flowchart of steps of a developing unit cleaning method in an embodiment of the present invention.

Embodiments of the invention

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work fall into the protection scope of the present invention.

The terms "first", "second", "third", etc. (if present) in the description and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order Or in order. It should be understood that the objects so described are interchangeable under appropriate circumstances. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusion.

In this patent document, the drawings discussed below and the embodiments used to describe the principles of the present disclosure are for illustration purposes only and should not be construed as limiting the scope of the present disclosure. Those skilled in the art will understand that the principles of the present invention may be implemented in any suitably arranged system. Exemplary embodiments will be explained in detail, and examples of the embodiments are shown in the drawings. In addition, a terminal according to an exemplary embodiment will be described in detail with reference to the accompanying drawings. The same reference numbers in the drawings refer to the same elements.

The terms used in the description of the present invention are only used to describe specific embodiments and are not intended to show the concept of the present invention. Unless the context clearly indicates a different meaning, expressions used in the singular encompass the expression in the plural. In the description of the present invention, it should be understood that terms such as "including," "having," and "containing" are intended to indicate the possibility of a feature, number, step, action, or combination thereof disclosed in the present description, and are not intended Excludes the possibility that one or more other features, numbers, steps, actions, or a combination thereof may be present or may be added. The same reference numerals in the drawings refer to the same parts.

An embodiment of the present invention provides a developing unit cleaning device. Each will be described in detail below.

Refer to Figures 2 and 3. FIG. 2 is a schematic diagram of a developing unit cleaning device in an embodiment of the present invention. FIG. 3 is a schematic structural diagram of an exposure system in the embodiment of the present invention, and the developing unit cleaning device is installed in the exposure system.

The invention provides a developing unit cleaning device, which is applied to an exposure system. The exposure system includes a substrate cleaning unit 110, a substrate coating unit 120, a substrate exposure unit 130, and a substrate developing unit 140.

Specifically, the substrate cleaning unit 110 is configured to clean a substrate, and transfer the cleaned substrate to the substrate coating unit 120. The substrate cleaning unit 110 may include a first cleaning sub-unit, a second cleaning sub-unit, and a third cleaning sub-unit (not shown). The first cleaning sub-unit is used to irradiate the substrate with ultraviolet rays to clean the substrate. The second cleaning sub-unit performs secondary cleaning on the substrate by a water vapor method. The third cleaning sub-unit uses an air knife drying process to clean the substrate. After cleaning the substrate, the substrate can be baked with a hot plate and buffered and cooled.

The substrate coating unit 120 applies a photoresist to the substrate through a linear coater provided in the substrate coating unit 120, and transfers the photoresist-coated substrate to the substrate. Substrate exposure unit 130. In the substrate coating unit 120, a vacuum dryer (Vacuum Chamber) Dry), the photoresist solution is dried and cooled to form a solid, and then baked on a hot plate for further drying. Then, the dried substrate is turned and transferred to the substrate exposure unit 130.

The substrate exposure unit 130 is used to define a pattern of photoresist through a mask exposure process to perform an exposure operation, and after the exposure operation is performed, the substrate is transferred to the substrate development unit 140. The substrate exposure unit 130 uses a mask on a substrate to define a pattern of photoresist to perform an exposure operation. After that, the edge is exposed again to remove the photoresist on the edge of the substrate.

The substrate developing unit 140 is used to develop a patterned photoresist through a development process to form a patterned photoresist. The substrate developing unit 140 is provided with three developing tanks 141, and the substrate introduced by the substrate exposure unit 130 passes through the three developing tanks 141 in sequence, and passes through a plurality of developing nozzles provided above the three developing tanks 141. After the sprayed photoresist developing solution, the photoresist on the substrate reacts with the photoresist developing solution, so that a patterned photoresist can be formed.

In this embodiment, the developing unit cleaning device is installed in the exposure system, and the developing unit cleaning device is connected to the substrate coating unit 120 and the substrate developing unit 140, respectively. The developing unit cleaning device is configured to transfer the photoresist solvent waste liquid generated by the substrate coating unit 120 to the substrate developing unit 140, and clean the developing tank 141 provided in the substrate developing unit 140. .

Specifically, the developing unit cleaning device includes a temporary storage tank 210 and a pipeline. The pipeline includes a first pipeline 220 and a second pipeline 230. The first pipeline 220 is connected to the pipeline respectively. The output end of the substrate coating unit 120 and the input end of the temporary storage tank 210, and the second pipeline 230 is connected to the output end of the temporary storage tank 210 and the input end of the developing tank 141, respectively. The temporary storage tank 210 is used for storing the photoresist solvent waste liquid generated by the substrate coating unit 120 and is provided to the developing tank 141. In this embodiment, the pre-cleaning roller 122 of the photoresist coating mechanism of the substrate coating unit 120 generates a photoresist solvent waste liquid. The photoresist solvent waste liquid is a resin solution. Of course, in other embodiments, the photoresist solvent waste liquid may also be other solvents having the same function as the resin solution.

Since the substrate developing unit 140 in the prior art cannot provide a photoresist solvent, and only the substrate is cleaned by replacing water washing and straight water washing, it is not possible to effectively remove the photoresist remaining in the developing tank 141 to form a solidified photoresist. Residue. The developing unit cleaning device transmits the photoresist solvent waste liquid generated by the substrate coating unit 120 to the substrate developing unit 140, making full use of the photoresist used by the pre-cleaning roller 122 of the photoresist coating mechanism. Solvent waste liquid, the photoresist solvent waste liquid has a strong cleaning effect on the solidified photoresist residue in the developing tank 141, so as to realize the cleaning treatment of the developing tank 141. In this way, not only the cleanliness of the developing unit is improved, but the product defects caused by the cleanliness of the developing tank 141 are further avoided, and the photoresist solvent is used twice to improve the utilization rate of the chemical consumables. In addition, the secondary use of the photoresist solvent also saves the time for the related staff to originally clean the substrate developing unit 140, so as to improve the body productivity.

In addition, in the present embodiment, a first on-off valve 221 is provided on the first pipeline 220, and the first on-off valve 221 is used to control from the substrate coating unit 120 to the temporary storage tank 210 Photoresist solvent waste flow.

A second on-off valve 211 is provided on the temporary storage tank 210, and the second on-off valve 211 is used to discharge the photoresist solvent waste liquid stored in the temporary storage tank 210 to external factory equipment . That is, if the photoresist solvent waste liquid generated by the substrate coating unit 120 is large, the photoresist solvent waste liquid in the temporary storage tank 210 may be first discharged to an external factory equipment, Therefore, the temporary storage tank 210 has sufficient space to accommodate the photoresist solvent waste liquid.

In addition, in this embodiment, a third on-off valve 231 is provided on the second pipeline 230, and the third on-off valve 231 is used to control the distance from the temporary storage tank 210 to the developing tank 141. Photoresist solvent waste flow. In this way, the utilization rate of chemical consumables can also be effectively increased.

In this embodiment, the second pipeline 230 is a detachable pipeline. Normally, the second pipeline 230 is connected to the developing tank 141. Of course, according to the requirements of on-site practice, for example, other units of the exposure system need to use a photoresist solvent, the second pipeline 230 can be removed, and the temporary storage tank 210 can be detachably connected to Other units of the exposure system to provide the required photoresist solvent.

Refer to Figure 4. A flowchart of steps in a method for cleaning a developing unit according to an embodiment of the present invention. The present invention also provides a developing unit cleaning method. The developing unit cleaning device is adopted. The developing unit cleaning device includes a temporary storage tank 210 and a pipeline, and the pipeline includes a first pipeline 220 and a second pipeline. 230. The method includes:

Step S410: the substrate coating unit generates a photoresist solvent waste liquid after applying photoresist to the substrate.

The substrate coating unit 120 applies a photoresist to the substrate through a linear coater provided in the substrate coating unit 120, and transfers the photoresist-coated substrate to the substrate. Substrate exposure unit 130. In the substrate coating unit 120, a vacuum dryer (Vacuum Chamber) Dry), so that the photoresist solution is dried and cooled to form a solid, and then hot plate baking is performed to further dry; then, the dried substrate is turned and transferred to the substrate exposure unit 130. After the substrate coating unit 120 applies a photoresist to the substrate, a large amount of photoresist solvent waste liquid is generated.

Step S420: The photoresist solvent waste liquid is transferred to the temporary storage tank through the first pipeline and stored.

In this embodiment, a first on-off valve 221 is provided on the first pipeline 220. The method in step S420 further includes: controlling a flow rate of the photoresist solvent waste liquid from the substrate coating unit 120 to the temporary storage tank 210 through the first switching valve 221.

The temporary storage tank 210 first temporarily stores a large amount of photoresist solvent waste liquid generated by the substrate coating unit 120. When the developing tank 141 of the substrate developing unit 140 needs to be cleaned, the temporary storage tank body 210 supplies the temporarily stored photoresist solvent waste liquid to the developing tank 141 for cleaning.

Step S430: The photoresist solvent waste liquid stored in the temporary storage tank is provided to the developing tank through a second pipeline to clean the developing tank.

In this embodiment, a third on-off valve 231 is provided on the second pipeline 230. The method in step S430 further includes controlling a flow rate of the photoresist solvent waste liquid from the temporary storage tank body 210 to the developing tank 141 through a third switching valve 231. In this way, the utilization rate of chemical consumables can also be effectively increased.

The developing unit cleaning device according to the present invention and the method using the device add a temporary storage tank 210 containing a photoresist solvent between the substrate coating unit 120 and the substrate developing unit 140, and place the substrate coating unit 120 in the substrate coating unit 120. The used photoresist solvent waste liquid of the pre-cleaning roller 122 of the photoresist coating mechanism is reused for cleaning solidified photoresist residues remaining in the developing tank 141 of the substrate developing unit 140. Therefore, the developing unit cleaning device can improve the cleanliness of the substrate developing unit 140, solve the problem of product failure caused by the residue of the photoresist, and use the photoresist solvent for a second time to improve the utilization rate of the chemical consumables. In addition, the secondary use of the photoresist solvent also saves the time for the related staff to originally clean the substrate developing unit 140, so as to improve the body productivity.

The above is only a preferred embodiment of the present invention. It should be noted that, for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and retouches can be made. These improvements and retouches should also be viewed as It is the protection scope of the present invention.

Industrial applicability

The subject matter of this application can be manufactured and used in industry with industrial applicability.

Claims

A developing unit cleaning device is applied to an exposure system. The exposure system includes a substrate cleaning unit, a substrate coating unit, a substrate exposure unit, and a substrate developing unit. The substrate cleaning unit is used to perform a substrate Clean, and transfer the cleaned substrate to the substrate coating unit; the substrate coating unit applies a photoresist to the substrate through a photoresist coating mechanism provided in the substrate coating unit, and The photoresist-coated substrate is transferred to the substrate exposure unit; the substrate exposure unit is used to define a pattern of the photoresist through a mask exposure process to perform an exposure operation, and after the exposure operation is performed, the substrate is transferred to the substrate exposure unit. The substrate developing unit; the substrate developing unit is used to develop a patterned photoresist through a development process to form a patterned photoresist; wherein the developing unit cleaning device is installed in the exposure system, the The developing unit cleaning device is connected to the substrate coating unit and the substrate developing unit, respectively; the developing unit cleaning device is used for The photoresist solvent waste liquid generated by the substrate coating unit is transferred to the substrate development unit, and a developing tank provided in the substrate development unit is cleaned; the photoresist solvent waste liquid is a resin solution; the The developing unit cleaning device includes a temporary storage tank and a pipeline. The pipeline includes a first pipeline and a second pipeline. The first pipeline is connected to the output end of the substrate coating unit, respectively. And the input end of the temporary storage tank body, the second pipeline connection is respectively connected to the output end of the temporary storage tank body and the input end of the developing tank; the temporary storage tank body is used for storing the The photoresist solvent waste liquid generated by the substrate coating unit is supplied to the developing tank.
A developing unit cleaning device is applied to an exposure system. The exposure system includes a substrate cleaning unit, a substrate coating unit, a substrate exposure unit, and a substrate developing unit. The substrate cleaning unit is used to perform a substrate Clean, and transfer the cleaned substrate to the substrate coating unit; the substrate coating unit applies a photoresist to the substrate through a photoresist coating mechanism provided in the substrate coating unit, and The photoresist-coated substrate is transferred to the substrate exposure unit; the substrate exposure unit is used to define a pattern of the photoresist through a mask exposure process to perform an exposure operation, and after the exposure operation is performed, the substrate is transferred to the substrate exposure unit. The substrate developing unit; the substrate developing unit is used to develop a patterned photoresist through a development process to form a patterned photoresist; wherein the developing unit cleaning device is installed in the exposure system, the The developing unit cleaning device is connected to the substrate coating unit and the substrate developing unit, respectively; the developing unit cleaning device is used for Solvent waste photoresist coating unit of said substrate are then transmitted to the substrate of the developing unit, and the developing tank provided in the developing unit in the substrate cleaning.
The developing unit cleaning device according to claim 2, wherein the photoresist solvent waste liquid is a resin solution.
The developing unit cleaning device according to claim 2, wherein the developing unit cleaning device includes a temporary storage tank and a pipeline, the pipeline includes a first pipeline and a second pipeline, and the first The pipeline connection is respectively connected to the output end of the substrate coating unit and the input end of the temporary storage tank body, and the second pipeline connection is respectively connected to the output end of the temporary storage tank body and the developing tank. The input end; the temporary storage tank is used for storing the photoresist solvent waste liquid generated by the substrate coating unit, and is provided to the developing tank.
The developing unit cleaning device according to claim 4, wherein a first on-off valve is provided on the first pipeline, and the first on-off valve is used to control from the substrate coating unit to the temporary storage tank Flow of photoresist solvent waste.
The developing unit cleaning device according to claim 4, wherein a second on-off valve is provided on the temporary storage tank, and the second on-off valve is used to waste the photoresist solvent stored in the temporary storage tank. Liquid is discharged to external plant equipment.
The developing unit cleaning device according to claim 4, wherein a third on-off valve is provided on the second pipeline, and the third on-off valve is used to control the light from the temporary storage tank to the developing tank. Inhibit the flow of solvent waste.
The developing unit cleaning device according to claim 4, wherein the second pipe is a detachable pipe, and the second pipe is further used to detachably connect the temporary storage tank to the exposure system Other units.
A developing unit cleaning method adopts the developing unit cleaning device according to claim 2, wherein the developing unit cleaning device comprises a temporary storage tank body and a pipeline, and the pipeline includes a first pipeline and a second pipeline Circuit, wherein the method includes:

(A) a substrate coating unit generates a photoresist solvent waste liquid after the substrate is coated with photoresist;

(B) transferring the photoresist solvent waste liquid to the temporary storage tank through the first pipeline and storing it;

(C) supplying the photoresist solvent waste liquid stored in the temporary storage tank to a developing tank through the second pipeline to clean the developing tank.
The developing unit cleaning method according to claim 9, wherein a first on-off valve is provided on the first pipeline; the method further comprises in step (b):

A flow rate of the photoresist solvent waste liquid from the substrate coating unit to the temporary storage tank is controlled by the first switching valve.
The method for cleaning a developing unit according to claim 9, wherein a third on-off valve is provided on the second pipeline; the method further comprises in step (c):

A flow rate of the photoresist solvent waste liquid from the temporary storage tank body to the developing tank is controlled by the third switching valve.