CN109324484B - Developing unit cleaning device and cleaning method using the same - Google Patents
Developing unit cleaning device and cleaning method using the same Download PDFInfo
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- CN109324484B CN109324484B CN201811128282.8A CN201811128282A CN109324484B CN 109324484 B CN109324484 B CN 109324484B CN 201811128282 A CN201811128282 A CN 201811128282A CN 109324484 B CN109324484 B CN 109324484B
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/08—Cleaning containers, e.g. tanks
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
Abstract
The invention discloses a developing unit cleaning device which is applied to an exposure system. The developing unit cleaning device effectively solves the problem that the cured photoresist residues in the developing unit are not clean, improves the cleanliness of the developing tank of the developing unit, thereby avoiding the problem of poor products caused by the cleanliness of the developing tank of the developing unit, and meanwhile, the device can secondarily utilize a photoresist solvent, thereby improving the utilization rate of chemical consumables.
Description
Technical Field
The invention relates to the technical field of liquid crystal display panels, in particular to a developing unit cleaning device and a cleaning method adopting the same.
Background
In the exposure process of the TFT array substrate, a series of operations such as cleaning, coating, exposure, and development are generally performed by an exposure system. The prior art exposure system includes: a substrate cleaning unit 110, a substrate coating unit 120, a substrate exposing unit 130, and a substrate developing unit 140. Specifically, first, in the substrate cleaning unit 110, the glass substrate is cleaned, which includes the processes of ultraviolet irradiation, water vapor cleaning, air knife drying, and the like; secondly, baking the cleaned substrate by a hot plate and performing buffer cooling; next, in the substrate coating unit 120, a photoresist is coated on the substrate by a photoresist coating mechanism (linear coater); drying and cooling the photoresist solution to form a solid state by the drying action of a Vacuum Chamber Dry (Vacuum Chamber Dry), and then baking on a hot plate for further drying; then, the dried substrate is turned and transferred to an exposure machine, a pattern is defined on the photoresist on the glass substrate by using a mask in the substrate exposure unit 130 to perform an exposure operation, and then the edge is exposed to remove the photoresist on the edge of the substrate; the substrate is then transferred to the substrate developing unit 140. In the substrate developing unit 140, a pattern is displayed through a developing process.
In the substrate developing unit 140, a developing sub-unit, a replacement water washing sub-unit, a direct water washing sub-unit, and an air knife drying sub-unit are provided, respectively. The developing subunit is mainly used for developing the photoresist with the defined pattern to form the patterned photoresist. The displacement washing subunit and the direct washing subunit are mainly used for cleaning the photoresist developing solution remained on the substrate. However, since the developing unit is in the developing operation for a long time, the photoresist developer and the mixed solution are splashed/evaporated in the developing tank (Chamber), and a cured photoresist residue is formed. When the substrate passes through the substrate developing unit 140, the photoresist scum may fall on the surface of the substrate, which may cause pattern abnormality of the substrate. Therefore, the related personnel can perform cleaning and maintenance on the substrate developing unit 140 at regular intervals to reduce the influence of the photoresist scum.
The cured resist residue cannot be cleaned by using water or a developer alone, and needs to be cleaned by using a resist solvent (e.g., a rinse solution). However, since the photoresist solvent is not supplied at the position of the developing unit, the cleaning and maintenance of the developing unit are difficult, and the photoresist scum which is not cleaned for a long time is liable to cause an abnormality in the substrate to be processed and even the entire product.
In view of the foregoing, it is desirable to provide a developing unit cleaning apparatus or a cleaning method.
Disclosure of Invention
The invention aims to provide a developing unit cleaning device, which effectively solves the problem that cured photoresist residues of a developing unit cannot be cleaned cleanly, improves the cleanliness in a developing tank of the developing unit so as to avoid the problem of poor products caused by the cleanliness of the developing tank of the developing unit, and can utilize a photoresist solvent (such as a rinse liquid) for the second time so as to improve the utilization rate of chemical consumables.
The invention provides a developing unit cleaning device, which is applied to an exposure system, wherein the exposure system comprises a substrate cleaning unit, a substrate coating unit, a substrate exposure unit and a substrate developing unit; the substrate cleaning unit is used for cleaning a substrate and conveying the cleaned substrate to the substrate coating unit; the substrate coating unit coats a substrate with photoresist through a photoresist coating mechanism arranged in the substrate coating unit and transmits the substrate coated with the photoresist to the substrate exposure unit; the substrate exposure unit is used for defining a pattern on the photoresist through a mask exposure process so as to execute an exposure operation, and after the exposure operation is executed, the substrate is conveyed to the substrate development unit; the substrate developing unit is used for developing the photoresist with the defined pattern through a developing process to form a patterned photoresist; the developing unit cleaning device is installed in the exposure system, and the developing unit cleaning device is connected to the substrate coating unit and the substrate developing unit, respectively; the developing unit cleaning device is used for conveying the photoresist solvent waste liquid generated by the substrate coating unit to the substrate developing unit and cleaning a developing tank arranged in the substrate developing unit.
In an embodiment of the invention, the photoresist solvent waste liquid is a resin solution.
In an embodiment of the present invention, the developing unit cleaning apparatus includes a temporary storage tank and a pipeline, the pipeline includes a first pipeline and a second pipeline, the first pipeline is connected to the output end of the substrate coating unit and the input end of the temporary storage tank, respectively, and the second pipeline is connected to the output end of the temporary storage tank and the input end of the developing tank, respectively; the temporary storage tank body is used for storing the photoresist solvent waste liquid generated by the substrate coating unit and providing the photoresist solvent waste liquid to the developing tank.
In an embodiment of the invention, a first switch valve is disposed on the first pipeline, and the first switch valve is used for controlling a flow rate of the photoresist solvent waste liquid from the substrate coating unit to the temporary storage tank.
In an embodiment of the invention, a second on-off valve is disposed on the temporary storage tank body, and the second on-off valve is used for discharging the waste photoresist solvent liquid stored in the temporary storage tank body to an external service device.
In an embodiment of the invention, a third on-off valve is disposed on the second pipeline, and the third on-off valve is used for controlling the flow of the photoresist solvent waste liquid from the temporary storage tank body to the developing tank.
In an embodiment of the invention, the second pipeline is a detachable pipeline, and the second pipeline is further used for detachably connecting the temporary storage tank to other units of the exposure system.
In addition, the invention also provides a cleaning method of the developing unit, which adopts the cleaning device of the developing unit, the cleaning device of the developing unit comprises a temporary storage groove body and a pipeline, the pipeline comprises a first pipeline and a second pipeline, and the method comprises the following steps: (a) the substrate coating unit is used for coating a substrate with a photoresist to generate photoresist solvent waste liquid; (b) conveying the photoresist solvent waste liquid to a temporary storage tank body through a first pipeline and storing; (c) and supplying the waste photoresist solvent liquid stored in the temporary storage tank body to a developing tank through a second pipeline so as to clean the developing tank.
In an embodiment of the present invention, a first on-off valve is disposed on the first pipeline; the method further comprises in step (b): and controlling the flow of the photoresist solvent waste liquid from the substrate coating unit to the temporary storage tank body through a first switch valve.
In an embodiment of the present invention, a third on/off valve is disposed on the second pipeline; the method further comprises in step (c): and controlling the flow of the photoresist solvent waste liquid from the temporary storage tank body to the developing tank through a third switch valve.
The developing unit cleaning device has the advantages that a temporary storage groove body for accommodating the photoresist solvent is additionally arranged between the substrate coating unit and the substrate developing unit, and the photoresist solvent waste liquid used by the pre-cleaning roller of the photoresist coating mechanism in the substrate coating unit is secondarily utilized for cleaning the solidified photoresist residues remained in the developing groove of the substrate developing unit. Therefore, the cleaning device for the developing unit can improve the cleanliness of the substrate developing unit, solve the problem of poor products caused by photoresist residues, and secondarily utilize a photoresist solvent to improve the utilization rate of chemical consumables. In addition, the secondary utilization of the photoresist solvent also saves the time of related workers for cleaning the substrate developing unit originally so as to improve the utilization rate of the machine body.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic diagram of an exposure system of the prior art.
FIG. 2 is a schematic view of a developer unit cleaning apparatus in an embodiment of the invention.
Fig. 3 is a schematic view of the configuration of an exposure system in which the developing unit cleaning apparatus is installed in the embodiment of the present invention.
FIG. 4 is a flowchart illustrating steps in a method for cleaning a developer unit in accordance with one embodiment of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terms "first," "second," "third," and the like in the description and in the claims, as well as in the drawings, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the objects so described are interchangeable under appropriate circumstances. Furthermore, the terms "comprising" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions.
In this patent document, the drawings discussed below and the embodiments used to describe the principles of the present disclosure are by way of illustration only and should not be construed in any way to limit the scope of the present disclosure. Those skilled in the art will understand that the principles of the present invention may be implemented in any suitably arranged system. Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. Further, a terminal according to an exemplary embodiment will be described in detail with reference to the accompanying drawings. Like reference symbols in the various drawings indicate like elements.
The terms used in the description of the present invention are only used to describe specific embodiments, and are not intended to show the concept of the present invention. Unless the context clearly dictates otherwise, expressions used in the singular form encompass expressions in the plural form. In the present specification, it is to be understood that terms such as "comprising," "having," and "containing" are intended to specify the presence of stated features, integers, steps, acts, or combinations thereof, as taught in the present specification, and are not intended to preclude the presence or addition of one or more other features, integers, steps, acts, or combinations thereof. Like reference symbols in the various drawings indicate like elements.
The embodiment of the invention provides a developing unit cleaning device. The details will be described below separately.
Refer to fig. 2 and 3. FIG. 2 is a schematic view of a developer unit cleaning apparatus in an embodiment of the invention. Fig. 3 is a schematic view of the configuration of an exposure system in which the developing unit cleaning apparatus is installed in the embodiment of the present invention.
The invention provides a developing unit cleaning device which is applied to an exposure system. The exposure system includes a substrate cleaning unit 110, a substrate coating unit 120, a substrate exposure unit 130, and a substrate developing unit 140.
Specifically, the substrate cleaning unit 110 is used to clean a substrate and transfer the cleaned substrate to the substrate coating unit 120. The substrate cleaning unit 110 may include a first cleaning sub-unit, a second cleaning sub-unit, and a third cleaning sub-unit (not shown). The first cleaning subunit is used for irradiating ultraviolet rays to the substrate so as to clean the substrate. The second cleaning subunit carries out secondary cleaning on the substrate in a water vapor mode. The third cleaning subunit cleans the substrate by using an air knife drying process. After cleaning the substrate, the substrate may be hot plate baked and buffer cooled.
The substrate coating unit 120 coats a substrate with a photoresist by a photoresist coating mechanism (linear coater) provided in the substrate coating unit 120, and transfers the substrate coated with the photoresist to the substrate exposing unit 130. In the substrate coating unit 120, the photoresist solution may be further dried and cooled to be a solid state by a drying action of a Vacuum Chamber Dry (Vacuum Chamber Dry), and then baked on a hot plate to be further dried. Then, the dried substrate is turned and transferred to the substrate exposing unit 130.
The substrate exposing unit 130 is used to define a pattern on the photoresist through a mask exposure process to perform an exposure operation, and after performing the exposure operation, transfers the substrate to the substrate developing unit 140. The substrate exposing unit 130 defines a pattern on the photoresist using a mask to perform an exposing operation. Then, the edge is exposed to remove the photoresist on the edge of the substrate.
The substrate developing unit 140 is used for developing the photoresist with the defined pattern through a developing process to form a patterned photoresist. The substrate developing unit 140 is provided with three developing tanks 141, and the substrate introduced by the substrate exposing unit 130 passes through the three developing tanks 141 in sequence, and after passing through the photoresist developing solution sprayed from the plurality of developing nozzles disposed above the three developing tanks 141, the photoresist on the substrate reacts with the photoresist developing solution, so that a patterned photoresist may be formed.
In the present embodiment, the developing unit cleaning device is installed in the exposure system, and the developing unit cleaning device is connected to the substrate coating unit 120 and the substrate developing unit 140, respectively. The developing unit cleaning device is used for conveying the photoresist solvent waste liquid generated by the substrate coating unit 120 to the substrate developing unit 140 and cleaning the developing tank 141 arranged in the substrate developing unit 140.
Specifically, the developing unit cleaning device includes a temporary storage tank 210 and pipelines, the pipelines include a first pipeline 220 and a second pipeline 230, the first pipeline 220 is connected to the output end of the substrate coating unit 120 and the input end of the temporary storage tank 210, respectively, and the second pipeline 230 is connected to the output end of the temporary storage tank 210 and the input end of the developing tank 141, respectively; the temporary storage tank 210 is used to store the photoresist solvent waste solution generated by the substrate coating unit 120 and provide the photoresist solvent waste solution to the developing tank 141. In the present embodiment, the pre-cleaning roller 122 of the photoresist coating mechanism of the substrate coating unit 120 generates a photoresist solvent waste. The photoresist solvent waste solution is a resin solution. Of course, in other embodiments, the photoresist solvent waste solution may be other solvents that perform the same function as the resin solution.
Since the substrate developing unit 140 in the prior art cannot provide the photoresist solvent, the substrate is cleaned by the replacement water washing and the direct water washing, and thus the cured photoresist scum formed in the developing tank 141 cannot be effectively removed. The developing unit cleaning device transmits the photoresist solvent waste liquid generated by the substrate coating unit 120 to the substrate developing unit 140, and fully utilizes the photoresist solvent waste liquid used by the pre-cleaning roller 122 of the photoresist coating mechanism, and the photoresist solvent waste liquid has a strong cleaning effect on cured photoresist residues in the developing tank 141, so that the cleaning treatment of the developing tank 141 is realized. Therefore, the cleanliness of the developing unit is improved, the problem of poor products caused by the cleanliness of the developing tank 141 is further avoided, and the photoresist solvent is secondarily utilized to improve the utilization rate of chemical consumables. In addition, the secondary utilization of the photoresist solvent also saves the time of the related workers for cleaning the substrate developing unit 140 originally, so as to improve the utilization rate of the machine body.
In addition, in the embodiment, a first switch valve 221 is disposed on the first pipeline 220, and the first switch valve 221 is used for controlling the flow of the photoresist waste solution from the substrate coating unit 120 to the temporary storage tank 210.
A second switch valve 211 is disposed on the temporary storage tank 210, and the second switch valve 211 is used for discharging the photoresist solvent waste liquid stored in the temporary storage tank 210 to an external service device. That is, if the substrate coating unit 120 generates a large amount of photoresist solvent waste liquid, a part of the photoresist solvent waste liquid in the temporary storage tank 210 may be discharged to an external plant, so that the temporary storage tank 210 has a sufficient space to contain the photoresist solvent waste liquid.
In addition, in this embodiment, a third on-off valve 231 is disposed on the second pipeline 230, and the third on-off valve 231 is used for controlling the flow of the photoresist waste solution from the temporary storage tank 210 to the developing tank 141. This also effectively increases the usage rate of the chemical consumable.
In this embodiment, the second pipeline 230 is a detachable pipeline. Generally, the second pipe 230 is connected to the developing tank 141. Of course, the second pipeline 230 may be detached and the temporary storage tank 210 may be detachably connected to other units of the exposure system to provide the required photoresist solvent according to the needs of field operations, for example, other units of the exposure system need to use the photoresist solvent.
Refer to fig. 4. A flowchart of the steps of a method for cleaning a developer unit in accordance with one embodiment of the present invention. The invention also provides a cleaning method of the developing unit, which adopts the cleaning device of the developing unit, wherein the cleaning device of the developing unit comprises a temporary storage tank body 210 and pipelines, and the pipelines comprise a first pipeline 220 and a second pipeline 230. The method comprises the following steps:
step S410: the substrate coating unit generates a photoresist solvent waste liquid after coating a photoresist on a substrate.
The substrate coating unit 120 coats a substrate with a photoresist by a photoresist coating mechanism (linear coater) provided in the substrate coating unit 120, and transfers the substrate coated with the photoresist to the substrate exposing unit 130. In the substrate coating unit 120, the photoresist solution may be further dried and cooled to form a solid state by a drying action of a Vacuum Chamber Dry (Vacuum Chamber Dry), and then baked on a hot plate to be further dried; then, the dried substrate is turned and transferred to the substrate exposing unit 130. After the substrate coating unit 120 coats the substrate with the photoresist, a large amount of photoresist solvent waste liquid is generated.
Step S420: and conveying the photoresist solvent waste liquid to a temporary storage tank body through a first pipeline and storing.
In this embodiment, a first on-off valve 221 is disposed on the first pipeline 220. The method further comprises in step S420: the flow rate of the photoresist solvent waste liquid from the substrate coating unit 120 to the temporary storage tank 210 is controlled by a first switching valve 221.
The temporary storage tank 210 temporarily stores a large amount of photoresist solvent waste generated by the substrate coating unit 120. When the developing tank 141 of the substrate developing unit 140 needs to be cleaned, the temporary storage tank 210 supplies the temporarily stored photoresist solvent waste solution to the developing tank 141 for cleaning.
Step S430: and supplying the waste photoresist solvent liquid stored in the temporary storage tank body to a developing tank through a second pipeline so as to clean the developing tank.
In this embodiment, a third on/off valve 231 is disposed on the second pipeline 230. The method further comprises in step S430: the flow rate of the resist solvent waste liquid from the temporary storage tank body 210 to the developing tank 141 is controlled by the third on/off valve 231. This also effectively increases the usage rate of the chemical consumable.
The cleaning device for the developing unit and the method adopting the same are used for cleaning the residual solidified photoresist residue in the developing tank 141 of the substrate developing unit 140 by additionally arranging a temporary storage tank body 210 containing photoresist solvent between the substrate coating unit 120 and the substrate developing unit 140 and secondarily utilizing the photoresist solvent waste liquid used by the pre-cleaning roller 122 of the photoresist coating mechanism in the substrate coating unit 120. Therefore, the cleaning device for the developing unit can improve the cleanliness of the substrate developing unit 140, solve the problem of poor products caused by photoresist residues, and secondarily utilize a photoresist solvent to improve the utilization rate of chemical consumables. In addition, the secondary utilization of the photoresist solvent also saves the time of the related workers for cleaning the substrate developing unit 140 originally, so as to improve the utilization rate of the machine body.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A developing unit cleaning device is applied to an exposure system, and the exposure system comprises a substrate cleaning unit, a substrate coating unit, a substrate exposure unit and a substrate developing unit; the substrate cleaning unit is used for cleaning a substrate and conveying the cleaned substrate to the substrate coating unit; the substrate coating unit coats a substrate with photoresist through a photoresist coating mechanism arranged in the substrate coating unit and transmits the substrate coated with the photoresist to the substrate exposure unit; the substrate exposure unit is used for defining a pattern on the photoresist through a mask exposure process so as to execute an exposure operation, and after the exposure operation is executed, the substrate is conveyed to the substrate development unit; the substrate developing unit is used for developing the photoresist with the defined pattern through a developing process to form a patterned photoresist; wherein the developing unit cleaning device is installed in the exposure system, the developing unit cleaning device being connected to the substrate coating unit and the substrate developing unit, respectively; the developing unit cleaning device is used for conveying the photoresist solvent waste liquid generated by the substrate coating unit to the substrate developing unit and cleaning a developing tank arranged in the substrate developing unit.
2. The developer unit cleaning apparatus according to claim 1, wherein the photoresist solvent waste liquid is a resin solution.
3. The developer unit cleaning apparatus according to claim 1, comprising a temporary storage tank and a pipeline, wherein the pipeline comprises a first pipeline and a second pipeline, the first pipeline is connected to an output end of the substrate coating unit and an input end of the temporary storage tank, respectively, and the second pipeline is connected to an output end of the temporary storage tank and an input end of the developer tank, respectively; the temporary storage tank body is used for storing the photoresist solvent waste liquid generated by the substrate coating unit and providing the photoresist solvent waste liquid to the developing tank.
4. The developing unit cleaning device as claimed in claim 3, wherein a first on-off valve is provided on the first pipeline for controlling the flow of the resist solvent waste liquid from the substrate coating unit to the temporary storage tank.
5. The developing unit cleaning device according to claim 3, wherein a second on-off valve is provided on the temporary storage tank body, the second on-off valve being used to discharge the resist solvent waste liquid stored in the temporary storage tank body to an external plant.
6. The developing unit cleaning device according to claim 3, wherein a third on/off valve is provided on the second pipeline, the third on/off valve being configured to control a flow rate of the resist solvent waste liquid from the temporary storage tank body to the developing tank.
7. The developer unit cleaning apparatus according to claim 3, wherein the second conduit is a detachable conduit, the second conduit further being configured to detachably connect the temporary storage tank to other units of the exposure system.
8. A developing unit cleaning method using the developing unit cleaning apparatus according to claim 1, the developing unit cleaning apparatus including a temporary storage tank body and pipes including a first pipe and a second pipe, the method comprising:
(a) the substrate coating unit is used for coating a substrate with a photoresist to generate photoresist solvent waste liquid;
(b) conveying the photoresist solvent waste liquid to a temporary storage tank body through a first pipeline and storing;
(c) and supplying the waste photoresist solvent liquid stored in the temporary storage tank body to a developing tank through a second pipeline so as to clean the developing tank.
9. The developer unit cleaning method according to claim 8, wherein a first on-off valve is provided on the first pipe; the method further comprises in step (b):
and controlling the flow of the photoresist solvent waste liquid from the substrate coating unit to the temporary storage tank body through a first switch valve.
10. The developer unit cleaning method according to claim 8, wherein a third on/off valve is provided on the second pipe; the method further comprises in step (c):
and controlling the flow of the photoresist solvent waste liquid from the temporary storage tank body to the developing tank through a third switch valve.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
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| CN201811128282.8A CN109324484B (en) | 2018-09-27 | 2018-09-27 | Developing unit cleaning device and cleaning method using the same |
| PCT/CN2019/086740 WO2020062886A1 (en) | 2018-09-27 | 2019-05-14 | Developing unit cleaning device and cleaning method using same |
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| CN201811128282.8A CN109324484B (en) | 2018-09-27 | 2018-09-27 | Developing unit cleaning device and cleaning method using the same |
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| CN204406032U (en) * | 2014-12-19 | 2015-06-17 | 卢兆晓 | A kind of cleaning fluid recycling device for developing machine |
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| CN109324484A (en) | 2019-02-12 |
| WO2020062886A1 (en) | 2020-04-02 |
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