WO2020056873A1 - 显示模组及其制作方法 - Google Patents

显示模组及其制作方法 Download PDF

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Publication number
WO2020056873A1
WO2020056873A1 PCT/CN2018/113620 CN2018113620W WO2020056873A1 WO 2020056873 A1 WO2020056873 A1 WO 2020056873A1 CN 2018113620 W CN2018113620 W CN 2018113620W WO 2020056873 A1 WO2020056873 A1 WO 2020056873A1
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WO
WIPO (PCT)
Prior art keywords
region
back plate
layer
display module
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/113620
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English (en)
French (fr)
Inventor
王海峰
陶强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Publication date
Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to US16/331,154 priority Critical patent/US11011729B2/en
Publication of WO2020056873A1 publication Critical patent/WO2020056873A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8794—Arrangements for heating and cooling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present application relates to the field of display, and in particular to a display module and a manufacturing method thereof.
  • OLED display is not only thin and light, low power consumption, strong endurance, but also can be bent, with a higher screen ratio.
  • the curved area technology of the display panel in the OLED display as a key technology of the display has become a hotspot in the display industry.
  • the bending of the display panel bending area is usually performed after the mark is pre-aligned.
  • This technology can achieve the effect of bending the display panel, but it is affected by the display panel material.
  • the influence of hardness cannot effectively ensure the bending position and the bending angle of the bending area of the display panel. Therefore, a display module and a manufacturing method thereof are urgently needed to solve the above problems.
  • the bending accuracy of the bending area of the display panel in the display module is not high, and the alignment is not accurate.
  • a display module which includes:
  • a display panel includes a first region, a second region, and a curved region connecting the first region and the second region, the first region is provided with a pixel array, the second region includes a terminal region, and the curved region
  • the bending radius of the zone is greater than 0.4 mm and less than 0.6 mm;
  • a back plate layer which is disposed on a surface of one side of the display panel and includes a first back plate and a second back plate, and the second back plate is located on the surface of the second region;
  • a support layer is provided between the first back plate and the second back plate, the support layer fixes the first back plate and the second back plate, and the support layer includes a foam material film layer , Graphite film layer and copper film layer;
  • a fixing layer provided between the second back plate and the support layer, the fixing layer including a body and at least one protrusion provided on the body;
  • the second back plate and the second region are provided with vias matching the shape of the protrusions, and the protrusions and the vias nest the second region by a nesting effect. Bent to a predetermined position on the second back plate.
  • the second region includes a substrate and a functional device disposed on the substrate;
  • the via hole is disposed in a region other than the functional device.
  • the fixing layer includes two protrusions, and the protrusions are distributed at two ends of the surface of the body.
  • the body of the fixing layer is disposed on a surface of the second back plate and does not protrude from a boundary of the second back plate.
  • the protrusion is a columnar protrusion, and a height of the columnar protrusion is not greater than a depth of the via hole.
  • a display module including:
  • the display panel includes a first region, a second region, and a curved region connecting the first region and the second region, the first region is provided with a pixel array, and the second region is a terminal region;
  • a back plate layer which is disposed on a surface of one side of the display panel and includes a first back plate and a second back plate, and the second back plate is located on the surface of the second region;
  • a support layer is provided between the first back plate and the second back plate, and the support layer fixes the first back plate and the second back plate;
  • a fixing layer provided between the second back plate and the support layer, the fixing layer including a body and at least one protrusion provided on the body;
  • the second back plate and the second region are provided with vias matching the shape of the protrusions, and the protrusions and the vias nest the second region by a nesting effect. Bent to a predetermined position on the second back plate.
  • the second region includes a substrate and a functional device disposed on the substrate;
  • the via hole is disposed in a region other than the functional device.
  • the fixing layer includes two protrusions, and the protrusions are distributed at two ends of the surface of the body.
  • the body of the fixing layer is disposed on a surface of the second back plate and does not protrude from a boundary of the second back plate.
  • the protrusion is a columnar protrusion, and a height of the columnar protrusion is not greater than a depth of the via hole.
  • the terminal region includes an outer pin bonding region.
  • the method further includes:
  • a touch layer disposed on a side of the display panel facing away from the first backplane, the touch layer including a touch electrode layer and a touch flexible circuit board;
  • An optical adhesive layer disposed between the touch electrode layers in the first region
  • a polarizing layer disposed on the touch electrode layer
  • a first flexible circuit board disposed on a surface of the second region facing away from the second backplane;
  • a second flexible circuit board bonded to the first flexible circuit board.
  • a first driving circuit is attached to the first flexible circuit board.
  • a second driving circuit is attached to the second flexible circuit board.
  • a method for manufacturing a display module including:
  • Step S10 A display panel is provided.
  • the display panel includes a first region, a second region, and a curved region between the first region and the second region.
  • the first region is provided with a pixel array.
  • Step S20 Laminating a first back plate on the surface of the first region, and setting a second back plate on the surface of the second region to form a back plate layer including the first back plate and the second back plate;
  • Step S30 A support layer and a fixing layer are sequentially disposed on a side of the first back plate facing away from the display panel, and the fixing layer includes a main body and at least one protrusion provided on the main body;
  • Step S40 Form at least one via hole matching the shape of the protrusion at a target position of the second back plate and the second area, and bend the curved area to connect the via hole with the Raised body nesting.
  • the via hole penetrates the second back plate and the second region.
  • vias are formed in the second backplane and the second region by means of laser cutting.
  • the second region includes a terminal region.
  • the display module further includes:
  • a touch layer disposed on a side of the display panel facing away from the first backplane, the touch layer including a touch electrode layer and a touch flexible circuit board;
  • An optical adhesive layer disposed between the touch electrode layers in the first region
  • a polarizing layer disposed on the touch electrode layer
  • a first flexible circuit board disposed on a surface of the second region facing away from the second backplane;
  • a second flexible circuit board bonded to the first flexible circuit board.
  • a first driving circuit is attached to the first flexible circuit board.
  • An advantage of the present application is to provide a display module and a manufacturing method thereof.
  • a fixed layer including at least one convex body in a display panel via holes are provided in the display panel and the back plate layer, the convex body Nesting with via holes, so that the bending angle of the display panel is fixed, and accurate bending of the display panel is achieved.
  • FIG. 1 is a schematic structural diagram of a display module according to a first embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of a display module provided in an unbent state according to a first embodiment of the present application
  • FIG. 3 is a schematic plan view of a display module in an unbent state according to a first embodiment of the present application
  • FIG. 4 is a schematic structural diagram of a fixed layer provided by a second embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of a display module according to a third embodiment of the present application.
  • FIG. 6 is a schematic flowchart of a method for manufacturing a display module according to a fourth embodiment of the present application.
  • FIG. 7 is a process diagram of a method for manufacturing a display module according to a fourth embodiment of the present application.
  • the present application provides a display module and a manufacturing method thereof.
  • the bending accuracy of the bending region of the display panel in the display module is not high, and the problem of inaccurate alignment is solved.
  • This embodiment can improve the defect.
  • a display module including:
  • the display panel 11 includes a first region 111, a second region 112, and a curved region 113 connecting the first region 111 and the second region 112.
  • the first region 111 is provided with a pixel array
  • the second region 112 is bent to the back of the first region 111 through the bending region 113, and the second region includes a terminal region.
  • the first region 111 includes a display region for realizing a display function of the display panel 11, and a main material of the curved region 113 is made of an easily bendable organic material.
  • Metal traces that connect the first region 111 to the driving circuit are arranged side by side.
  • the curved region 113 is in a curved state, so as to realize a narrow frame design of the display device.
  • the structure of the curved region 112 is not limited to the organic material and metal traces, and other related structures may also be provided.
  • the terminal region includes an outer pin bonding region.
  • a metal trace for connecting the display panel 111 to the driving circuit is disposed in the outer pin bonding area.
  • the back plate layer 12 is disposed on a surface of one side of the display panel 11 and includes a first back plate 121 and a second back plate 122.
  • the second back plate 122 is located on a surface of the second region 112.
  • the support layer 13 is disposed between the first back plate 121 and the second back plate 122.
  • the supporting layer 13 fixes the first back plate 121 and the second back plate 122.
  • the supporting layer 13 includes a foam material film layer, a graphite film layer, and a copper film layer, so as to support and dissipate heat from the display panel 11.
  • a fixing layer 14 is disposed between the second back plate 122 and the support layer 13 to fix the position of the second back plate 122.
  • the fixing layer 14 includes a main body 141 and a main body 141 disposed on the main body. At least one protrusion 142 on 141.
  • the protrusion 142 may be a columnar protrusion to facilitate 15 rows of nesting with the vias of the second back plate 122 and the second region 12, thereby ensuring the bending accuracy of the display panel.
  • the protrusion 142 can be a cylindrical protrusion or a rhombic protrusion. The specific shape can be designed according to actual needs, and is not limited here.
  • the second back plate 122 and the second region 112 are provided with via holes 15 matching the shape of the protrusion 142.
  • the protruding body 142 and the via hole 15 bend the second region 112 to a predetermined position on the second back plate 122 through a nesting effect.
  • the protrusions 142 in the fixing layer 14 may coincide with the positions of the vias 15 in the second back plate 122 and the second region 112, thereby embedding the protrusions 142 and the vias 15 set.
  • the second region 112 of the display panel and the fixed layer 14 can be accurately aligned, the precise bending of the bending region 113 can be completed, and the bending angle of the bending region 113 can be controlled to further improve the bending accuracy of the display panel 11.
  • a bending radius of the bending region 113 is 0.4 mm to 0.6 mm.
  • the second region 112 includes a substrate and a functional device disposed on the substrate.
  • the substrate is a polyimide substrate;
  • the via hole 15 is disposed in a region other than the functional device.
  • the substrate includes a region covered by a functional device and a region not covered by a functional device.
  • the via is located in an area of the substrate that is not covered by a functional device to avoid affecting the structure of the functional device.
  • the functional device includes an external pin device.
  • the fixing layer 14 includes two protrusions 142, and the protrusions 142 are distributed at both ends of the surface of the body 141, thereby enhancing the vias 15 and Nesting effect of the convex body 142.
  • the body 141 of the fixing layer 14 is disposed on a surface of the second back plate 122 and does not protrude from a boundary of the second back plate 122. It can also be understood that the area of the body 141 is smaller than the area of the second back plate 122, thereby preventing the fixed layer 14 from interfering with and affecting other structures of the display module.
  • the height of the columnar protrusion is not greater than the depth of the via hole, thereby preventing the protrusion 42 from affecting other structures of the display module.
  • the display module further includes:
  • a touch layer 17 disposed on a side of the display panel 11 facing away from the first back plate 121.
  • the touch layer includes a touch electrode layer 171 and a touch flexible circuit board 172.
  • the optical adhesive layer 16 is disposed between the first region 111 and the touch electrode layer 171.
  • the optical adhesive layer 16 is used to adhere the first region 111 and the touch electrode layer 171.
  • the polarizing layer 18 is disposed on the touch electrode layer 171.
  • the display module further includes a cover plate attached to the polarizing layer 18.
  • a first flexible circuit board 211 is disposed on a surface of the second region 112 facing away from the second backplane 122.
  • a first driving circuit 191 is attached to the first flexible circuit board 211.
  • anisotropic conductive adhesive is used between the first flexible circuit board 211 and the second region 112, and between the first flexible circuit board 211 and the second flexible circuit board 212. .
  • the present application further provides a method for manufacturing a display module, including:
  • Step S10 A display panel is provided.
  • the display panel includes a first region, a second region, and a curved region between the first region and the second region.
  • the first region is provided with a pixel array.
  • Step S20 Laminating a first back plate on the surface of the first region, and setting a second back plate on the surface of the second region to form a back plate layer including the first back plate and the second back plate.
  • Step S30 A support layer and a fixing layer are sequentially disposed on a side of the first back plate facing away from the display panel, and the fixing layer includes a main body and at least one protrusion provided on the main body.
  • Step S40 At least one via hole matching the shape of the protrusion is formed at a target position of the second back plate and the second region. Bending the bending area to nest the via with the protrusion.
  • the bonding accuracy between the film layers is usually plus or minus 100 microns.
  • the cutting accuracy in the cutting process is plus or minus 50 microns.
  • mark alignment can be performed on the second backplane to achieve accurate bending of the display panel.
  • the height of the via hole is 100 ⁇ m to 120 ⁇ m larger than the height of the protrusion, so as to avoid interference between the two.
  • the vias penetrate the second backplane and the second region.
  • vias are formed in the second backplane and the second region by means of laser cutting.
  • FIG. 7 is a process diagram of a display module manufacturing method in the present application.
  • the first cutting process is performed.
  • a whole display module is cut into several display panels, and related devices are bound on the display panel.
  • Lamination of the backplane layer is performed on the display panel, and then the unnecessary portion of the display panel is cut (at the same time, the second region and the via in the second backplane are formed in the cutting process).
  • Laminate the support layer and the fixed layer in order.
  • the display panel is bent to nest the convex body and the via hole in the present application.
  • An advantage of the present application is to provide a display module and a manufacturing method thereof.
  • a fixed layer including at least one convex body in a display panel via holes are provided in the display panel and the back plate layer, and the convex body is formed. Nesting with via holes, so that the bending angle of the display panel is fixed, and accurate bending of the display panel is achieved.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

本申请提供了一种显示模组及其制作方法。所述显示模组包括：显示面板、第一背板、第二背板、支撑层、固定层。所述固定层包括本体以及凸起体。所述显示面板包括第一区、第二区以及弯曲区。其中，所述第二背板与所述第二区内设置有过孔。所述凸起体与所述过孔通过嵌套作用将所述第二区弯曲至所述第二背板上的预定位置。

Description

显示模组及其制作方法 技术领域
本申请涉及显示领域，具体涉及一种显示模组及其制作方法。
 背景技术
随着科技的发展，手机、数码、电脑等显示设备成为人们日常生活中必不可少的一部分，在使用的过程中，大众对屏幕的要求越来越高，轻薄化和高屏占比的显示设备逐渐成为人们追逐的热点。OLED显示屏不仅体积轻薄、功耗低、续航能力强，而且可以进行弯曲，具有更高的屏占比。
当前，OLED显示屏中显示面板的弯曲区技术作为显示屏的关键技术，已成为显示行业内研究的一个热点。在已有的面板弯曲设计中，多采用标记预对位后再进行弯折的方式进行显示面板弯曲区的弯折，这种技术虽然可以实现显示面板弯折的效果，但是受显示面板材料的硬度的影响，不能有效的保证显示面板弯曲区的弯折位置以及弯折角大小。因此，目前亟需一种显示模组及其制作方法以解决上述问题。
 技术问题
显示模组中显示面板的弯曲区的弯折精度不高，对位不准的问题。
 技术解决方案
根据本发明的一个方面，提供了一种显示模组，其包括：
显示面板，包括第一区、第二区以及连接所述第一区和所述第二区的弯曲区，所述第一区设置有像素阵列，所述第二区包括端子区域，所述弯曲区的弯曲半径大于0.4毫米并小于0.6毫米；
背板层，设置于所述显示面板一侧的表面，包括第一背板和第二背板，所述第二背板位于所述第二区表面；
支撑层，设置于所述第一背板与所述第二背板之间，所述支撑层将所述第一背板与所述第二背板固定，所述支撑层包括泡沫材料膜层、石墨膜层以及铜膜层；
固定层，设置于所述第二背板与所述支撑层之间，所述固定层包括本体以及设置在所述本体上的至少一个凸起体；
其中，所述第二背板与所述第二区内设置有与所述凸起体形状相匹配的过孔，所述凸起体与所述过孔通过嵌套作用将所述第二区弯曲至所述第二背板上的预定位置。
根据本申请一实施例，所述第二区包括衬底以及设置在所述衬底上的功能器件；
所述过孔设置于所述功能器件以外的区域。
根据本申请一实施例，所述固定层包括两个凸起体，所述凸起体分布于所述本体表面的两端。
根据本申请一实施例，所述固定层的本体设置于所述第二背板的表面，且不凸出于所述第二背板的边界。
根据本申请一实施例，所述凸起体为柱状凸起体，所述柱状凸起体的高度不大于所述过孔的深度。
根据本申请的一个另方面，提供了一种显示模组，包括：
显示面板，包括第一区、第二区以及连接所述第一区和所述第二区的弯曲区，所述第一区设置有像素阵列，所述第二区为端子区域；
背板层，设置于所述显示面板一侧的表面，包括第一背板和第二背板，所述第二背板位于所述第二区表面；
支撑层，设置于所述第一背板与所述第二背板之间，所述支撑层将所述第一背板与所述第二背板固定；
固定层，设置于所述第二背板与所述支撑层之间，所述固定层包括本体以及设置在所述本体上的至少一个凸起体；
其中，所述第二背板与所述第二区内设置有与所述凸起体形状相匹配的过孔，所述凸起体与所述过孔通过嵌套作用将所述第二区弯曲至所述第二背板上的预定位置。
根据本申请一实施例，所述第二区包括衬底以及设置在所述衬底上的功能器件；
所述过孔设置于所述功能器件以外的区域。
根据本申请一实施例，所述固定层包括两个凸起体，所述凸起体分布于所述本体表面的两端。
根据本申请一实施例，所述固定层的本体设置于所述第二背板的表面，且不凸出于所述第二背板的边界。
根据本申请一实施例，所述凸起体为柱状凸起体，所述柱状凸起体的高度不大于所述过孔的深度。
根据本申请一实施例，所述端子区域包括外引脚贴合区域。
根据本申请一实施例，还包括：
设置于所述显示面板背离所述第一背板一侧上的触控层，所述触控层包括触控电极层和触控柔性线路板；
设置于所述第一区域所述触控电极层之间的光学胶层；
设置于所述触控电极层上的偏光层；
设置于所述偏光层上的盖板；
设置于所述第二区背离所述第二背板一侧的表面的第一柔性线路板；以及
与所述第一柔性线路板贴合的第二柔性线路板。
根据本申请一实施例，所述第一柔性线路板上贴合有第一驱动电路。
根据本申请一实施例，所述第二柔性线路板上贴合有第二驱动电路。
根据本申请的又一方面，还提供了一种显示模组的制作方法，包括：
步骤S10、提供一显示面板，所述显示面板包括第一区、第二区以及所述第一区和所述第二区之间的弯曲区，所述第一区设置有像素阵列；
步骤S20、在所述第一区表面贴合第一背板，在所述第二区表面设置第二背板以形成包括所述第一背板和所述第二背板的背板层；
步骤S30、在所述第一背板背离所述显示面板的一侧依次设置支撑层和固定层，所述固定层包括本体以及设置在所述本体上的至少一个凸起体；
步骤S40、在所述第二背板和所述第二区的目标位置形成至少一个与所述凸起体形状相匹配的过孔，弯曲所述弯曲区，以将所述过孔与所述凸起体嵌套。
根据本申请一实施例，所述过孔贯穿所述第二背板和所述第二区。
根据本申请一实施例，采用激光切割的方式在所述第二背板和所述第二区中形成过孔。
根据本申请一实施例，所述第二区包括端子区域。
根据本申请一实施例，所述显示模组还包括：
设置于所述显示面板背离所述第一背板一侧上的触控层，所述触控层包括触控电极层和触控柔性线路板；
设置于所述第一区域所述触控电极层之间的光学胶层；
设置于所述触控电极层上的偏光层；
设置于所述偏光层上的盖板；
设置于所述第二区背离所述第二背板一侧的表面的第一柔性线路板；以及
与所述第一柔性线路板贴合的第二柔性线路板。
根据本申请一实施例，所述第一柔性线路板上贴合有第一驱动电路。
 有益效果
本申请的优点是，提供了一种显示模组及其制作方法，通过在显示面板中设置包括至少一个凸起体的固定层，在显示面板和背板层内设置过孔，将凸起体和过孔进行嵌套，进而使显示面板的弯折角度固定，实现显示面板的精准弯折。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请第一实施例提供的显示模组的结构示意图；
图2为本申请第一实施例提供的显示模组未弯曲状态下的结构示意图；
图3为本申请第一实施例提供的显示模组未弯曲状态下的俯视结构示意图；
图4为本申请第二实施例提供的固定层的结构示意图；
图5为本申请第三实施例提供的显示模组的结构示意图；
图6为本申请第四实施例提供的显示模组的制作方法的流程示意图；
图7为本申请第四实施例提供的显示模组的制作方法的工艺图。
 本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。在图中，结构相似的单元是用以相同标号表示。
本申请提供了一种显示模组及其制作方法，显示模组中显示面板的弯曲区的弯折精度不高，对位不准的问题，本实施例能够改善该缺陷。
下面接合附图和具体实施例对本申请做进一步的说明：
根据本申请的第一实施例，请参阅如图1、图2和图3所示。提供了一种显示模组，包括：
显示面板11，包括第一区111、第二区112以及连接所述第一区111和所述第二区112的弯曲区113，所述第一区111设置有像素阵列，所述第二区112通过所述弯曲区113弯曲至所述第一区111的背部，所述第二区包括端子区域。
在一种实施例中，所述第一区111包括用以实现显示面板11显示功能的显示区域，所述弯曲区113的主体材料采用易弯曲的有机材料制备。并排布上将第一区111与驱动电路进行信号连接的金属走线。在显示面板11中，所述弯曲区113呈现弯曲状态，以实现显示装置的窄边框设计。当然，所述弯曲区112的结构并不仅限于所述有机材料以及金属走线，还可以设置有其它相关结构。
在一种实施例中，所述端子区域包括外引脚贴合区域。所述外引脚贴合区域内设置有用于实现显示面板111与驱动电路连接的金属走线。
背板层12，设置于所述显示面板11一侧的表面，包括第一背板121和第二背板122。所述第二背板122位于所述第二区112表面。
支撑层13，设置于所述第一背板121与所述第二背板122之间。所述支撑层13将所述第一背板121与所述第二背板122固定。
在一种实施例中，所述支撑层13包括泡沫材料膜层、石墨膜层以及铜膜层，以起到对显示面板11的支撑和散热功能。
固定层14，设置于所述第二背板122与所述支撑层13之间，用以将所述第二背板122的位置固定，所述固定层14包括本体141以及设置在所述本体141上的至少一个凸起体142。
在一种实施例中，所述凸起体142可以为柱状凸起体，以方便与第二背板122和第二区12的过孔进15行嵌套，进而保证显示面板的弯折精度。可以理解的是，所述凸起体142既可以为圆柱状凸起体，也可以为菱柱状凸起体。具体形状可根据实际需求设计，进行这里不做限定。
在一种实施例中，所述第二背板122与所述第二区112内设置有与所述凸起体142形状相匹配的过孔15。所述凸起体142与所述过孔15通过嵌套作用将所述第二区112弯曲至所述第二背板122上的预定位置。
在进行显示面板的弯折时，固定层14中的凸起体142可以与第二背板122和第二区112中的过孔15的位置重合，从而将凸起体142和过孔15嵌套。可实现显示面板的第二区112与固定层14进行精准对位，完成弯曲区113的精准弯折，控制弯曲区113的弯曲角大小，进而提高显示面板11的弯折精度。
在一种实施例中，在显示面板11的弯折状态下，所述弯曲区113的弯曲半径为0.4毫米至0.6毫米。
在一种实施例中，所述第二区112包括衬底以及设置在所述衬底上的功能器件。通常的，所述衬底为聚酰亚胺衬底；
所述过孔15设置于所述功能器件以外的区域。在一种实施例中，所述衬底包括被功能器件覆盖的区域以及未被功能器件覆盖的区域。所述过孔位于所述衬底未被功能器件覆盖的区域，以避免对所述功能器件的结构产生影响，所述功能器件包括外引脚器件。
在一种实施例中，请参阅图4所示，所述固定层14包括两个凸起体142，所述凸起体142分布于所述本体141表面的两端，进而增强过孔15与凸起体142的嵌套效果。
在一种实施例中，所述固定层14的本体141设置于所述第二背板122的表面，且不凸出于所述第二背板122的边界。也可以理解为本体141的面积小于第二背板122的面积，进而防止固定层14对显示模组的其它结构产生干扰和影响。
在一种实施例中，所述柱状凸起体的高度不大于所述过孔的深度，进而防止凸起体42影响显示模组的其它结构。
请参阅图5所示，所述显示模组还包括：
设置于所述显示面板11背离所述第一背板121一侧上的触控层17，所述触控层包括触控电极层171和触控柔性线路板172。
设置于所述第一区111与所述触控电极层171之间的光学胶层16。所述光学胶层16用以黏合所述第一区111与所述触控电极层171。
设置于所述触控电极层171上的偏光层18，在一种实施例中，显示模组还包括贴合在偏光层18上的盖板。
设置于所述第二区112背离所述第二背板122一侧的表面的第一柔性线路板211，所述第一柔性线路板211上贴合有第一驱动电路191。
与所述第一柔性线路板211粘合的第二柔性线路板212，所述第二柔性线路板212上贴合有第二驱动电路192。
在一种实施例中，所述第一柔性线路板211和所述第二区112之间、所述第一柔性线路板211和第二柔性线路板212之间均采用异方性导电胶黏合。
请参阅图6所述，本申请还提供了一种显示模组的制作方法，包括：
步骤S10、提供一显示面板，所述显示面板包括第一区、第二区以及所述第一区和所述第二区之间的弯曲区，所述第一区设置有像素阵列。
步骤S20、在所述第一区表面贴合第一背板，在所述第二区表面设置第二背板以形成包括所述第一背板和所述第二背板的背板层。
步骤S30、在所述第一背板背离所述显示面板的一侧依次设置支撑层和固定层，所述固定层包括本体以及设置在所述本体上的至少一个凸起体。
步骤S40、在所述第二背板和所述第二区的目标位置形成至少一个与所述凸起体形状相匹配的过孔。弯曲所述弯曲区，以将所述过孔与所述凸起体嵌套。
在一种实施例中，在2D贴合中，膜层之间的贴合精度通常为正负100微米。切割工艺中的切割精度为正负50微米。在本申请中可通过在第二背板上进行标记对位，进而实现显示面板的精准弯折。
在一种实施例中，所述过孔的高度要比所述凸起体的高度大100微米至120微米，以避免两者之间相互干涉。
在一种实施例中，所述过孔贯穿所述第二背板和所述第二区。
在一种实施例中，采用激光切割的方式在所述第二背板和所述第二区中形成过孔。
请参阅图7所示为本申请中显示模组制作方法的工艺图。通过在对显示模块进行电路调试，在确保显示模块电路正常后，进行第一次切割工艺。以将一整块显示模块切割成若干个显示面板，在显示面板上进行相关器件的绑定。随后，采用紫外线工艺固定。并在显示面板上进行背板层的贴合，再进行显示面板多余部分的切割（同时在切割工艺中形成第二区和第二背板中的过孔）。依次贴合支撑层和固定层。最后进行显示面板的弯折，以将本申请中凸起体与过孔嵌套。
本申请的优点是，提供了一种显示模组及其制作方法，通过在显示面板中设置包括至少一个凸起体的固定层，在显示面板和背板层内设置过孔，将凸起体和过孔进行嵌套，进而使显示面板的弯折角度固定，实现显示面板的精准弯折。
综上所述，虽然本申请已以优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (20)

  1. 一种显示模组，其包括：
    显示面板，包括第一区、第二区以及连接所述第一区和所述第二区的弯曲区，所述第一区设置有像素阵列，所述第二区包括端子区域，所述弯曲区的弯曲半径大于0.4毫米并小于0.6毫米；
    背板层，设置于所述显示面板一侧的表面，包括第一背板和第二背板，所述第二背板位于所述第二区表面；
    支撑层，设置于所述第一背板与所述第二背板之间，所述支撑层将所述第一背板与所述第二背板固定，所述支撑层包括泡沫材料膜层、石墨膜层以及铜膜层；
    固定层，设置于所述第二背板与所述支撑层之间，所述固定层包括本体以及设置在所述本体上的至少一个凸起体；
    其中，所述第二背板与所述第二区内设置有与所述凸起体形状相匹配的过孔，所述凸起体与所述过孔通过嵌套作用将所述第二区弯曲至所述第二背板上的预定位置。
  2. 根据权利要求1所述的显示模组，其中，所述第二区包括衬底以及设置在所述衬底上的功能器件；
    所述过孔设置于所述功能器件以外的区域。
  3. 根据权利要求1所述的显示模组，其中，所述固定层包括两个凸起体，所述凸起体分布于所述本体表面的两端。
  4. 根据权利要求1所述的显示模组，其中，所述固定层的本体设置于所述第二背板的表面，且不凸出于所述第二背板的边界。
  5. 根据权利要求1所述的显示模组，其中，所述凸起体为柱状凸起体，所述柱状凸起体的高度不大于所述过孔的深度。
  6. 一种显示模组，其包括：
    显示面板，包括第一区、第二区以及连接所述第一区和所述第二区的弯曲区，所述第一区设置有像素阵列，所述第二区包括端子区域；
    背板层，设置于所述显示面板一侧的表面，包括第一背板和第二背板，所述第二背板位于所述第二区表面；
    支撑层，设置于所述第一背板与所述第二背板之间，所述支撑层将所述第一背板与所述第二背板固定；
    固定层，设置于所述第二背板与所述支撑层之间，所述固定层包括本体以及设置在所述本体上的至少一个凸起体；
    其中，所述第二背板与所述第二区内设置有与所述凸起体形状相匹配的过孔，所述凸起体与所述过孔通过嵌套作用将所述第二区弯曲至所述第二背板上的预定位置。
  7. 根据权利要求6所述的显示模组，其中，所述第二区包括衬底以及设置在所述衬底上的功能器件；
    所述过孔设置于所述功能器件以外的区域。
  8. 根据权利要求6所述的显示模组，其中，所述固定层包括两个凸起体，所述凸起体分布于所述本体表面的两端。
  9. 根据权利要求6所述的显示模组，其中，所述固定层的本体设置于所述第二背板的表面，且不凸出于所述第二背板的边界。
  10. 根据权利要求6所述的显示模组，其中，所述凸起体为柱状凸起体，所述柱状凸起体的高度不大于所述过孔的深度。
  11. 根据权利要求6所述的显示模组，其中，所述端子区域包括外引脚贴合区域。
  12. 根据权利要求6所述的显示模组，其中，还包括：
    设置于所述显示面板背离所述第一背板一侧上的触控层，所述触控层包括触控电极层和触控柔性线路板；
    设置于所述第一区域所述触控电极层之间的光学胶层；
    设置于所述触控电极层上的偏光层；
    设置于所述偏光层上的盖板；
    设置于所述第二区背离所述第二背板一侧的表面的第一柔性线路板；以及
    与所述第一柔性线路板贴合的第二柔性线路板。
  13. 根据权利要求6所述的显示模组，其中，所述第一柔性线路板上贴合有第一驱动电路。
  14. 根据权利要求6所述的显示模组，其中，所述第二柔性线路板上贴合有第二驱动电路。
  15. 一种显示模组的制作方法，其包括：
    步骤S10、提供一显示面板，所述显示面板包括第一区、第二区以及所述第一区和所述第二区之间的弯曲区，所述第一区设置有像素阵列；
    步骤S20、在所述第一区表面贴合第一背板，在所述第二区表面设置第二背板以形成包括所述第一背板和所述第二背板的背板层；
    步骤S30、在所述第一背板背离所述显示面板的一侧依次设置支撑层和固定层，所述固定层包括本体以及设置在所述本体上的至少一个凸起体；
    步骤S40、在所述第二背板和所述第二区的目标位置形成至少一个与所述凸起体形状相匹配的过孔，弯曲所述弯曲区，以将所述过孔与所述凸起体嵌套。
  16. 根据权利要求15所述的显示模组的制作方法，其中，所述过孔贯穿所述第二背板和所述第二区。
  17. 根据权利要求15所述的显示模组的制作方法，其中，采用激光切割的方式在所述第二背板和所述第二区中形成过孔。
  18. 根据权利要求15所述的显示模组的制作方法，其中，所述第二区包括端子区域。
  19. 根据权利要求15所述的显示模组的制作方法，其中，所述显示模组包括：
    设置于所述显示面板背离所述第一背板一侧上的触控层，所述触控层包括触控电极层和触控柔性线路板；
    设置于所述第一区域所述触控电极层之间的光学胶层；
    设置于所述触控电极层上的偏光层；
    设置于所述偏光层上的盖板；
    设置于所述第二区背离所述第二背板一侧的表面的第一柔性线路板；以及
    与所述第一柔性线路板贴合的第二柔性线路板。
  20. 根据权利要求15所述的显示模组的制作方法，其中，所述第一柔性线路板上贴合有第一驱动电路。
PCT/CN2018/113620 2018-09-20 2018-11-02 显示模组及其制作方法 Ceased WO2020056873A1 (zh)

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Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109616492B (zh) * 2018-10-26 2020-11-06 武汉华星光电半导体显示技术有限公司 柔性显示面板、柔性显示装置和柔性显示面板的制备方法
CN109671753B (zh) * 2018-12-14 2021-06-01 武汉华星光电半导体显示技术有限公司 显示装置及其制造方法
CN109817684B (zh) * 2019-02-01 2020-12-04 武汉华星光电半导体显示技术有限公司 柔性oled模组堆叠结构及其制备方法
CN115485755B (zh) * 2019-03-05 2025-03-21 京东方科技集团股份有限公司 一种柔性屏
KR102771506B1 (ko) * 2019-04-12 2025-02-21 삼성디스플레이 주식회사 표시 장치
CN109979327B (zh) * 2019-04-22 2021-04-02 武汉华星光电半导体显示技术有限公司 一种柔性显示器
CN109903681B (zh) * 2019-04-25 2021-09-21 京东方科技集团股份有限公司 支撑结构及其制造方法、显示装置及其装配方法
CN110570756A (zh) * 2019-08-08 2019-12-13 武汉华星光电半导体显示技术有限公司 显示面板、显示模组及显示装置
CN110718159A (zh) * 2019-09-25 2020-01-21 武汉华星光电半导体显示技术有限公司 Oled显示屏及oled显示装置
CN111028682B (zh) * 2019-11-21 2021-03-23 武汉华星光电半导体显示技术有限公司 柔性显示装置
CN110828530A (zh) * 2019-11-28 2020-02-21 武汉华星光电半导体显示技术有限公司 一种显示面板及其制备方法、显示装置
CN111402736B (zh) * 2020-03-26 2022-03-08 武汉华星光电半导体显示技术有限公司 显示装置
CN112037662B (zh) * 2020-09-24 2022-08-16 京东方科技集团股份有限公司 一种折叠显示器支撑件及显示装置
CN112289185B (zh) * 2020-10-26 2021-11-23 武汉华星光电半导体显示技术有限公司 显示模组
CN112533367B (zh) * 2020-12-03 2022-03-25 昆山国显光电有限公司 柔性电路板、显示屏及电子设备
CN112908162B (zh) * 2021-01-20 2022-09-06 昆山国显光电有限公司 可卷绕的显示模组、显示装置
CN113066361A (zh) 2021-03-01 2021-07-02 武汉华星光电半导体显示技术有限公司 柔性显示装置及其制备方法
CN114122081B (zh) * 2021-11-05 2023-07-25 武汉华星光电半导体显示技术有限公司 一种显示装置
CN114038892B (zh) * 2021-11-24 2023-07-04 武汉华星光电半导体显示技术有限公司 显示面板和显示装置
CN114627762B (zh) * 2022-03-09 2024-04-09 武汉华星光电半导体显示技术有限公司 显示模组及其贴合方法、移动终端
CN114783296A (zh) * 2022-05-07 2022-07-22 武汉华星光电半导体显示技术有限公司 一种显示装置及显示终端

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040183958A1 (en) * 2003-03-18 2004-09-23 Kabushiki Kaisha Toshiba Display device
US20130279088A1 (en) * 2012-04-20 2013-10-24 John Raff Electronic Devices With Flexible Displays Having Fastened Bent Edges
CN106711183A (zh) * 2017-02-16 2017-05-24 京东方科技集团股份有限公司 柔性oled显示面板和显示装置
CN107180850A (zh) * 2016-03-11 2017-09-19 三星显示有限公司 柔性显示设备
CN107195642A (zh) * 2017-07-05 2017-09-22 京东方科技集团股份有限公司 柔性显示面板及其制备方法、显示装置
CN107799550A (zh) * 2016-08-30 2018-03-13 乐金显示有限公司 柔性显示器

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9349969B2 (en) * 2013-02-01 2016-05-24 Lg Display Co., Ltd. Electronic devices with flexible display and method for manufacturing the same
KR102331813B1 (ko) * 2015-06-17 2021-11-26 삼성디스플레이 주식회사 표시 장치
KR102394723B1 (ko) * 2015-09-30 2022-05-09 엘지디스플레이 주식회사 터치 스크린 패널 및 이를 포함하는 표시 장치
CN106898264B (zh) * 2017-03-06 2019-10-22 武汉华星光电技术有限公司 一种可折叠面板及其制作方法
CN106997251B (zh) * 2017-03-20 2020-05-01 武汉华星光电技术有限公司 含Home键的移动终端及其显示面板
CN206946143U (zh) * 2017-08-04 2018-01-30 信利半导体有限公司 一种新型液晶显示装置
CN207624701U (zh) * 2018-01-04 2018-07-17 京东方科技集团股份有限公司 一种显示面板及显示装置
CN207800055U (zh) * 2018-02-27 2018-08-31 京东方科技集团股份有限公司 一种显示面板及显示装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040183958A1 (en) * 2003-03-18 2004-09-23 Kabushiki Kaisha Toshiba Display device
US20130279088A1 (en) * 2012-04-20 2013-10-24 John Raff Electronic Devices With Flexible Displays Having Fastened Bent Edges
CN107180850A (zh) * 2016-03-11 2017-09-19 三星显示有限公司 柔性显示设备
CN107799550A (zh) * 2016-08-30 2018-03-13 乐金显示有限公司 柔性显示器
CN106711183A (zh) * 2017-02-16 2017-05-24 京东方科技集团股份有限公司 柔性oled显示面板和显示装置
CN107195642A (zh) * 2017-07-05 2017-09-22 京东方科技集团股份有限公司 柔性显示面板及其制备方法、显示装置

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