WO2020048981A3 - Verfahren zur regelung der deckentemperatur eines cvd-reaktors - Google Patents
Verfahren zur regelung der deckentemperatur eines cvd-reaktors Download PDFInfo
- Publication number
- WO2020048981A3 WO2020048981A3 PCT/EP2019/073464 EP2019073464W WO2020048981A3 WO 2020048981 A3 WO2020048981 A3 WO 2020048981A3 EP 2019073464 W EP2019073464 W EP 2019073464W WO 2020048981 A3 WO2020048981 A3 WO 2020048981A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- process chamber
- cvd reactor
- chamber ceiling
- ceiling
- controlling
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4411—Cooling of the reaction chamber walls
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
- C23C16/463—Cooling of the substrate
- C23C16/466—Cooling of the substrate using thermal contact gas
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201980066051.5A CN112969815B (zh) | 2018-09-07 | 2019-09-03 | 用于调节cvd反应器的顶部温度的方法 |
KR1020217010036A KR20210049168A (ko) | 2018-09-07 | 2019-09-03 | Cvd 반응기를 설정 또는 작동시키기 위한 방법 |
JP2021512635A JP7439056B2 (ja) | 2018-09-07 | 2019-09-03 | Cvdリアクタの設定又は稼動方法 |
US17/250,809 US11713505B2 (en) | 2018-09-07 | 2019-09-03 | Device and method for controlling the ceiling temperature of a CVD reactor |
EP19765977.4A EP3847293A2 (de) | 2018-09-07 | 2019-09-03 | Verfahren zur regelung der deckentemperatur eines cvd-reaktors |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102018121854.0A DE102018121854A1 (de) | 2018-09-07 | 2018-09-07 | Verfahren zum Einrichten oder zum Betrieb eines CVD-Reaktors |
DE102018121854.0 | 2018-09-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2020048981A2 WO2020048981A2 (de) | 2020-03-12 |
WO2020048981A3 true WO2020048981A3 (de) | 2020-05-14 |
Family
ID=67909369
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2019/073464 WO2020048981A2 (de) | 2018-09-07 | 2019-09-03 | Verfahren zum einrichten oder zum betrieb eines cvd-reaktors |
Country Status (8)
Country | Link |
---|---|
US (1) | US11713505B2 (de) |
EP (1) | EP3847293A2 (de) |
JP (1) | JP7439056B2 (de) |
KR (1) | KR20210049168A (de) |
CN (1) | CN112969815B (de) |
DE (1) | DE102018121854A1 (de) |
TW (1) | TW202031925A (de) |
WO (1) | WO2020048981A2 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102018121854A1 (de) * | 2018-09-07 | 2020-03-12 | Aixtron Se | Verfahren zum Einrichten oder zum Betrieb eines CVD-Reaktors |
US11842907B2 (en) | 2020-07-08 | 2023-12-12 | Applied Materials, Inc. | Spot heating by moving a beam with horizontal rotary motion |
CN115838917A (zh) * | 2021-11-24 | 2023-03-24 | 无锡先为科技有限公司 | 成膜装置 |
Citations (5)
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DE10064942A1 (de) * | 2000-12-23 | 2002-07-04 | Aixtron Ag | Verfahren zum Abscheiden insbesondere kristalliner Schichten |
JP2008195995A (ja) * | 2007-02-09 | 2008-08-28 | Matsushita Electric Ind Co Ltd | 気相成長装置 |
DE102010000554A1 (de) * | 2009-03-16 | 2010-09-30 | Aixtron Ag | MOCVD-Reaktor mit einer örtlich verschieden an ein Wärmeableitorgan angekoppelten Deckenplatte |
JP2013251442A (ja) * | 2012-06-01 | 2013-12-12 | Sharp Corp | 気相成長装置および窒化物半導体発光素子の製造方法 |
US20150090693A1 (en) * | 2013-10-02 | 2015-04-02 | Nuflare Technology, Inc. | Film formation apparatus and film formation method |
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US6095083A (en) * | 1991-06-27 | 2000-08-01 | Applied Materiels, Inc. | Vacuum processing chamber having multi-mode access |
ATE312955T1 (de) * | 1996-05-21 | 2005-12-15 | Applied Materials Inc | Verfahren und vorrichtung zum regeln der temperatur einer reaktorwand |
US6079874A (en) * | 1998-02-05 | 2000-06-27 | Applied Materials, Inc. | Temperature probes for measuring substrate temperature |
US6188044B1 (en) * | 1998-04-27 | 2001-02-13 | Cvc Products, Inc. | High-performance energy transfer system and method for thermal processing applications |
US6492625B1 (en) * | 2000-09-27 | 2002-12-10 | Emcore Corporation | Apparatus and method for controlling temperature uniformity of substrates |
DE10056029A1 (de) * | 2000-11-11 | 2002-05-16 | Aixtron Ag | Verfahren und Vorrichtung zur Temperatursteuerung der Oberflächentemperaturen von Substraten in einem CVD-Reaktor |
UA81614C2 (ru) * | 2001-11-07 | 2008-01-25 | Карнеги Инститьюшн Ов Вашингтон | Устройство для изготовления алмазов, узел удержания образца (варианты) и способ изготовления алмазов (варианты) |
DE10247921A1 (de) * | 2002-10-10 | 2004-04-22 | Aixtron Ag | Hydrid VPE Reaktor |
DE102006018514A1 (de) * | 2006-04-21 | 2007-10-25 | Aixtron Ag | Vorrichtung und Verfahren zur Steuerung der Oberflächentemperatur eines Substrates in einer Prozesskammer |
DE102007009145A1 (de) | 2007-02-24 | 2008-08-28 | Aixtron Ag | Vorrichtung zum Abscheiden kristalliner Schichten wahlweise mittels MOCVD oder HVPE |
KR101451772B1 (ko) * | 2009-11-02 | 2014-10-16 | 엘아이지에이디피 주식회사 | 화학기상증착장치 및 화학기상증착장치의 온도제어방법 |
US9034142B2 (en) * | 2009-12-18 | 2015-05-19 | Novellus Systems, Inc. | Temperature controlled showerhead for high temperature operations |
DE102010027168A1 (de) * | 2010-07-14 | 2012-01-19 | Leybold Optics Gmbh | Verfahren und Vorrichtung zur Plasmabehandlung flacher Substrate |
DE102011053498A1 (de) * | 2011-09-12 | 2013-03-14 | Aixtron Se | Verfahren und Vorrichtung zur Ermittlung der Verformung eines Substrates |
DE102012101717A1 (de) * | 2012-03-01 | 2013-09-05 | Aixtron Se | Verfahren und Vorrichtung zur Regelung der Oberflächentemperatur eines Suszeptors einer Substratbeschichtungseinrichtung |
KR102535623B1 (ko) * | 2013-11-12 | 2023-05-26 | 어플라이드 머티어리얼스, 인코포레이티드 | 고온계 배경 제거 |
DE102013114412A1 (de) * | 2013-12-18 | 2015-06-18 | Aixtron Se | Vorrichtung und Verfahren zur Regelung der Temperatur in einer Prozesskammer eines CVD-Reaktors unter Verwendung zweier Temperatursensoreinrichtungen |
DE102014106871A1 (de) | 2014-05-15 | 2015-11-19 | Aixtron Se | Verfahren und Vorrichtung zum Abscheiden dünner Schichten auf einem Substrat und einer höhenverstellbaren Prozesskammer |
US20160282886A1 (en) * | 2015-03-27 | 2016-09-29 | Applied Materials, Inc. | Upper dome temperature closed loop control |
JP2017190506A (ja) | 2016-04-14 | 2017-10-19 | 株式会社ニューフレアテクノロジー | 気相成長装置および気相成長方法 |
DE102017105333A1 (de) * | 2017-03-14 | 2018-09-20 | Aixtron Se | Verfahren und Vorrichtung zur thermischen Behandlung eines Substrates |
DE102018121854A1 (de) * | 2018-09-07 | 2020-03-12 | Aixtron Se | Verfahren zum Einrichten oder zum Betrieb eines CVD-Reaktors |
DE102019104433A1 (de) * | 2019-02-21 | 2020-08-27 | Aixtron Se | CVD-Reaktor mit Mitteln zur lokalen Beeinflussung der Suszeptortemperatur |
-
2018
- 2018-09-07 DE DE102018121854.0A patent/DE102018121854A1/de active Pending
-
2019
- 2019-09-03 CN CN201980066051.5A patent/CN112969815B/zh active Active
- 2019-09-03 EP EP19765977.4A patent/EP3847293A2/de active Pending
- 2019-09-03 WO PCT/EP2019/073464 patent/WO2020048981A2/de unknown
- 2019-09-03 KR KR1020217010036A patent/KR20210049168A/ko active Search and Examination
- 2019-09-03 US US17/250,809 patent/US11713505B2/en active Active
- 2019-09-03 JP JP2021512635A patent/JP7439056B2/ja active Active
- 2019-09-06 TW TW108132280A patent/TW202031925A/zh unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10064942A1 (de) * | 2000-12-23 | 2002-07-04 | Aixtron Ag | Verfahren zum Abscheiden insbesondere kristalliner Schichten |
JP2008195995A (ja) * | 2007-02-09 | 2008-08-28 | Matsushita Electric Ind Co Ltd | 気相成長装置 |
DE102010000554A1 (de) * | 2009-03-16 | 2010-09-30 | Aixtron Ag | MOCVD-Reaktor mit einer örtlich verschieden an ein Wärmeableitorgan angekoppelten Deckenplatte |
JP2013251442A (ja) * | 2012-06-01 | 2013-12-12 | Sharp Corp | 気相成長装置および窒化物半導体発光素子の製造方法 |
US20150090693A1 (en) * | 2013-10-02 | 2015-04-02 | Nuflare Technology, Inc. | Film formation apparatus and film formation method |
Also Published As
Publication number | Publication date |
---|---|
KR20210049168A (ko) | 2021-05-04 |
WO2020048981A2 (de) | 2020-03-12 |
US20210310120A1 (en) | 2021-10-07 |
EP3847293A2 (de) | 2021-07-14 |
CN112969815B (zh) | 2024-04-30 |
DE102018121854A1 (de) | 2020-03-12 |
CN112969815A (zh) | 2021-06-15 |
TW202031925A (zh) | 2020-09-01 |
JP2021536530A (ja) | 2021-12-27 |
JP7439056B2 (ja) | 2024-02-27 |
US11713505B2 (en) | 2023-08-01 |
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