WO2020048981A3 - Verfahren zur regelung der deckentemperatur eines cvd-reaktors - Google Patents

Verfahren zur regelung der deckentemperatur eines cvd-reaktors Download PDF

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Publication number
WO2020048981A3
WO2020048981A3 PCT/EP2019/073464 EP2019073464W WO2020048981A3 WO 2020048981 A3 WO2020048981 A3 WO 2020048981A3 EP 2019073464 W EP2019073464 W EP 2019073464W WO 2020048981 A3 WO2020048981 A3 WO 2020048981A3
Authority
WO
WIPO (PCT)
Prior art keywords
process chamber
cvd reactor
chamber ceiling
ceiling
controlling
Prior art date
Application number
PCT/EP2019/073464
Other languages
English (en)
French (fr)
Other versions
WO2020048981A2 (de
Inventor
Peter Sebald Lauffer
Original Assignee
Aixtron Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aixtron Se filed Critical Aixtron Se
Priority to CN201980066051.5A priority Critical patent/CN112969815B/zh
Priority to KR1020217010036A priority patent/KR20210049168A/ko
Priority to JP2021512635A priority patent/JP7439056B2/ja
Priority to US17/250,809 priority patent/US11713505B2/en
Priority to EP19765977.4A priority patent/EP3847293A2/de
Publication of WO2020048981A2 publication Critical patent/WO2020048981A2/de
Publication of WO2020048981A3 publication Critical patent/WO2020048981A3/de

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4411Cooling of the reaction chamber walls
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/46Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/46Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
    • C23C16/463Cooling of the substrate
    • C23C16/466Cooling of the substrate using thermal contact gas
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52Controlling or regulating the coating process

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

Die Erfindung betrifft ein Verfahren zum Einrichten oder zum Betrieb eines CVD-Reaktors sowie einen CVD-Reaktor zur Durchführung des Verfahrens, bei dem ein oder mehrere Schichten auf ein oder mehrere Substrate abgeschieden werden können. Ein Suszeptor (2) wird mittels einer Heizeinrichtung (3) beheizt. Wärme wird vom Suszeptor (2) durch eine Prozesskammer (4) hin zu einer Prozesskammerdecke (1), durch die Prozesskammerdecke (1) hindurch und von der Prozesskammerdecke (1) durch einen Spaltabstandsraum (5) zu einem Wärmeableitkörper (6) transportiert. Die Temperatur der Prozesskammerdecke (1) wird zumindest an zwei unterschiedlichen azimutalen Winkelpositionen um ein Zentrum (Z) der Prozesskammer (4) gemessen. Die Messstellen beziehungsweise Zonen (8, 8', 8'', 8''') haben denselben radialen Abstand (R) zum Zentrum (Z) der Prozesskammer (4). Aus diesen zumindest zwei Temperaturmesswerten wird ein Mittelwert oder ein Differenzwert gemessen.
PCT/EP2019/073464 2018-09-07 2019-09-03 Verfahren zum einrichten oder zum betrieb eines cvd-reaktors WO2020048981A2 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN201980066051.5A CN112969815B (zh) 2018-09-07 2019-09-03 用于调节cvd反应器的顶部温度的方法
KR1020217010036A KR20210049168A (ko) 2018-09-07 2019-09-03 Cvd 반응기를 설정 또는 작동시키기 위한 방법
JP2021512635A JP7439056B2 (ja) 2018-09-07 2019-09-03 Cvdリアクタの設定又は稼動方法
US17/250,809 US11713505B2 (en) 2018-09-07 2019-09-03 Device and method for controlling the ceiling temperature of a CVD reactor
EP19765977.4A EP3847293A2 (de) 2018-09-07 2019-09-03 Verfahren zur regelung der deckentemperatur eines cvd-reaktors

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018121854.0A DE102018121854A1 (de) 2018-09-07 2018-09-07 Verfahren zum Einrichten oder zum Betrieb eines CVD-Reaktors
DE102018121854.0 2018-09-07

Publications (2)

Publication Number Publication Date
WO2020048981A2 WO2020048981A2 (de) 2020-03-12
WO2020048981A3 true WO2020048981A3 (de) 2020-05-14

Family

ID=67909369

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2019/073464 WO2020048981A2 (de) 2018-09-07 2019-09-03 Verfahren zum einrichten oder zum betrieb eines cvd-reaktors

Country Status (8)

Country Link
US (1) US11713505B2 (de)
EP (1) EP3847293A2 (de)
JP (1) JP7439056B2 (de)
KR (1) KR20210049168A (de)
CN (1) CN112969815B (de)
DE (1) DE102018121854A1 (de)
TW (1) TW202031925A (de)
WO (1) WO2020048981A2 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102018121854A1 (de) * 2018-09-07 2020-03-12 Aixtron Se Verfahren zum Einrichten oder zum Betrieb eines CVD-Reaktors
US11842907B2 (en) 2020-07-08 2023-12-12 Applied Materials, Inc. Spot heating by moving a beam with horizontal rotary motion
CN115838917A (zh) * 2021-11-24 2023-03-24 无锡先为科技有限公司 成膜装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10064942A1 (de) * 2000-12-23 2002-07-04 Aixtron Ag Verfahren zum Abscheiden insbesondere kristalliner Schichten
JP2008195995A (ja) * 2007-02-09 2008-08-28 Matsushita Electric Ind Co Ltd 気相成長装置
DE102010000554A1 (de) * 2009-03-16 2010-09-30 Aixtron Ag MOCVD-Reaktor mit einer örtlich verschieden an ein Wärmeableitorgan angekoppelten Deckenplatte
JP2013251442A (ja) * 2012-06-01 2013-12-12 Sharp Corp 気相成長装置および窒化物半導体発光素子の製造方法
US20150090693A1 (en) * 2013-10-02 2015-04-02 Nuflare Technology, Inc. Film formation apparatus and film formation method

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6095083A (en) * 1991-06-27 2000-08-01 Applied Materiels, Inc. Vacuum processing chamber having multi-mode access
ATE312955T1 (de) * 1996-05-21 2005-12-15 Applied Materials Inc Verfahren und vorrichtung zum regeln der temperatur einer reaktorwand
US6079874A (en) * 1998-02-05 2000-06-27 Applied Materials, Inc. Temperature probes for measuring substrate temperature
US6188044B1 (en) * 1998-04-27 2001-02-13 Cvc Products, Inc. High-performance energy transfer system and method for thermal processing applications
US6492625B1 (en) * 2000-09-27 2002-12-10 Emcore Corporation Apparatus and method for controlling temperature uniformity of substrates
DE10056029A1 (de) * 2000-11-11 2002-05-16 Aixtron Ag Verfahren und Vorrichtung zur Temperatursteuerung der Oberflächentemperaturen von Substraten in einem CVD-Reaktor
UA81614C2 (ru) * 2001-11-07 2008-01-25 Карнеги Инститьюшн Ов Вашингтон Устройство для изготовления алмазов, узел удержания образца (варианты) и способ изготовления алмазов (варианты)
DE10247921A1 (de) * 2002-10-10 2004-04-22 Aixtron Ag Hydrid VPE Reaktor
DE102006018514A1 (de) * 2006-04-21 2007-10-25 Aixtron Ag Vorrichtung und Verfahren zur Steuerung der Oberflächentemperatur eines Substrates in einer Prozesskammer
DE102007009145A1 (de) 2007-02-24 2008-08-28 Aixtron Ag Vorrichtung zum Abscheiden kristalliner Schichten wahlweise mittels MOCVD oder HVPE
KR101451772B1 (ko) * 2009-11-02 2014-10-16 엘아이지에이디피 주식회사 화학기상증착장치 및 화학기상증착장치의 온도제어방법
US9034142B2 (en) * 2009-12-18 2015-05-19 Novellus Systems, Inc. Temperature controlled showerhead for high temperature operations
DE102010027168A1 (de) * 2010-07-14 2012-01-19 Leybold Optics Gmbh Verfahren und Vorrichtung zur Plasmabehandlung flacher Substrate
DE102011053498A1 (de) * 2011-09-12 2013-03-14 Aixtron Se Verfahren und Vorrichtung zur Ermittlung der Verformung eines Substrates
DE102012101717A1 (de) * 2012-03-01 2013-09-05 Aixtron Se Verfahren und Vorrichtung zur Regelung der Oberflächentemperatur eines Suszeptors einer Substratbeschichtungseinrichtung
KR102535623B1 (ko) * 2013-11-12 2023-05-26 어플라이드 머티어리얼스, 인코포레이티드 고온계 배경 제거
DE102013114412A1 (de) * 2013-12-18 2015-06-18 Aixtron Se Vorrichtung und Verfahren zur Regelung der Temperatur in einer Prozesskammer eines CVD-Reaktors unter Verwendung zweier Temperatursensoreinrichtungen
DE102014106871A1 (de) 2014-05-15 2015-11-19 Aixtron Se Verfahren und Vorrichtung zum Abscheiden dünner Schichten auf einem Substrat und einer höhenverstellbaren Prozesskammer
US20160282886A1 (en) * 2015-03-27 2016-09-29 Applied Materials, Inc. Upper dome temperature closed loop control
JP2017190506A (ja) 2016-04-14 2017-10-19 株式会社ニューフレアテクノロジー 気相成長装置および気相成長方法
DE102017105333A1 (de) * 2017-03-14 2018-09-20 Aixtron Se Verfahren und Vorrichtung zur thermischen Behandlung eines Substrates
DE102018121854A1 (de) * 2018-09-07 2020-03-12 Aixtron Se Verfahren zum Einrichten oder zum Betrieb eines CVD-Reaktors
DE102019104433A1 (de) * 2019-02-21 2020-08-27 Aixtron Se CVD-Reaktor mit Mitteln zur lokalen Beeinflussung der Suszeptortemperatur

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10064942A1 (de) * 2000-12-23 2002-07-04 Aixtron Ag Verfahren zum Abscheiden insbesondere kristalliner Schichten
JP2008195995A (ja) * 2007-02-09 2008-08-28 Matsushita Electric Ind Co Ltd 気相成長装置
DE102010000554A1 (de) * 2009-03-16 2010-09-30 Aixtron Ag MOCVD-Reaktor mit einer örtlich verschieden an ein Wärmeableitorgan angekoppelten Deckenplatte
JP2013251442A (ja) * 2012-06-01 2013-12-12 Sharp Corp 気相成長装置および窒化物半導体発光素子の製造方法
US20150090693A1 (en) * 2013-10-02 2015-04-02 Nuflare Technology, Inc. Film formation apparatus and film formation method

Also Published As

Publication number Publication date
KR20210049168A (ko) 2021-05-04
WO2020048981A2 (de) 2020-03-12
US20210310120A1 (en) 2021-10-07
EP3847293A2 (de) 2021-07-14
CN112969815B (zh) 2024-04-30
DE102018121854A1 (de) 2020-03-12
CN112969815A (zh) 2021-06-15
TW202031925A (zh) 2020-09-01
JP2021536530A (ja) 2021-12-27
JP7439056B2 (ja) 2024-02-27
US11713505B2 (en) 2023-08-01

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