WO2020042313A1 - 电路板组件、显示面板及显示装置 - Google Patents

电路板组件、显示面板及显示装置 Download PDF

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Publication number
WO2020042313A1
WO2020042313A1 PCT/CN2018/111827 CN2018111827W WO2020042313A1 WO 2020042313 A1 WO2020042313 A1 WO 2020042313A1 CN 2018111827 W CN2018111827 W CN 2018111827W WO 2020042313 A1 WO2020042313 A1 WO 2020042313A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
board assembly
mounting
chip
area
Prior art date
Application number
PCT/CN2018/111827
Other languages
English (en)
French (fr)
Inventor
熊志
Original Assignee
惠科股份有限公司
重庆惠科金渝光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 惠科股份有限公司, 重庆惠科金渝光电科技有限公司 filed Critical 惠科股份有限公司
Priority to US16/313,461 priority Critical patent/US20210161014A1/en
Publication of WO2020042313A1 publication Critical patent/WO2020042313A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00—Aspects of the constitution of display devices
    • G09G2300/04—Structural and physical details of display devices
    • G09G2300/0421—Structural details of the set of electrodes
    • G09G2300/0426—Layout of electrodes and connections
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2310/00—Command of the display device
    • G09G2310/08—Details of timing specific for flat panels, other than clock recovery
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2320/00—Control of display operating conditions
    • G09G2320/06—Adjustment of display parameters
    • G09G2320/0673—Adjustment of display parameters for control of gamma adjustment, e.g. selecting another gamma curve
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2330/00—Aspects of power supply; Aspects of display protection and defect management
    • G09G2330/02—Details of power systems and of start or stop of display operation
    • G09G2330/021—Power management, e.g. power saving
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10212—Programmable component

Definitions

  • the present application relates to the field of display manufacturing, and in particular, to a circuit board assembly, a display panel, and a display device.
  • the display panel generally connects a circuit board, a data driving chip and a display screen by a bonding technology to form a display panel.
  • a function chip is set on the circuit board, and the function chip and the bonding area are set on the same side of the circuit board. Due to the limited length of the circuit board, in order to effectively install the function chip, the width of the circuit board will be increased. , Affecting the overall thinning effect of the display panel.
  • the main purpose of this application is to propose a circuit board assembly, which aims to solve the technical problem of how to improve the overall thinning effect of the display panel.
  • the circuit board assembly proposed in this application includes:
  • the circuit board body includes a first side and a second side, the first side facing away from the second side, the first side having a bonding area, the second side having a mounting area, and the mounting area having Mounting position for function chip installation.
  • the projection of the mounting area on the first side coincides with the bonding area at least partially.
  • the overlapping width of the projection of the mounting area on the first side and the bonding area is 0 mm to 2 mm.
  • the number of the bonding regions is plural, and the plurality of bonding regions are spaced apart along a long side of the circuit board body.
  • the number of the mounting positions is multiple, and the plurality of mounting positions are arranged at intervals along the length direction of the mounting area.
  • the circuit board assembly further includes a function chip installed in the mounting position.
  • the functional chip is soldered to the mounting position.
  • the function chip includes at least one of a timing control chip, a power chip, and a programmable gamma chip.
  • the present application also proposes a display panel including a circuit board assembly.
  • the circuit board assembly includes a circuit board body including a first side surface and a second side surface. The first side surface faces away from the second side surface. The first side has a bonding area, the second side has a mounting area, and the mounting area has a mounting position for mounting a function chip.
  • the present application also proposes a display device including a display panel including a circuit board assembly.
  • the circuit board assembly includes a circuit board body including a first side and a second side. To the second side, the first side has a bonding area, the second side has a mounting area, and the mounting area has a mounting position for mounting a function chip.
  • the bonding area and the mounting area of the functional chip are respectively disposed on the first side of the circuit board body and the second side facing away from the first side, so that the bonding area and the mounting area do not interfere with each other, so that The bonding area and the mounting area do not have to give up each other, that is, at least the separation distance between the bonding area and the mounting area is reduced, thereby reducing the overall width of the circuit board body, improving the overall thinning effect of the display panel, and reducing the circuit. Production cost of the board body.
  • FIG. 1 is a schematic structural diagram of an embodiment of a circuit board assembly of the present application
  • FIG. 2 is a schematic structural diagram of another embodiment of a circuit board assembly of the present application.
  • FIG. 3 is a schematic structural diagram of an embodiment of a display panel of the present application.
  • the directional indication is only used to explain in a specific posture (as shown in the drawings (Shown) the relative positional relationship, movement, etc. of the various components, if the specific posture changes, the directional indicator will change accordingly.
  • the present application proposes a circuit board assembly.
  • the circuit board assembly includes:
  • the circuit board body 10 includes a first side surface 11 and a second side surface 12.
  • the first side surface 11 faces away from the second side surface 12.
  • the first side surface 11 has a bonding area 111 and the second side surface 12 has a mounting area 121.
  • the mounting area 121 has a mounting position for mounting the function chip 13.
  • the bonding area 111 is generally close to the side of the circuit board body 10, and a bonding mark is provided in the bonding area 111 for bonding connection between the driving chip 21 of the display panel and the circuit board.
  • the driver chip 21 can be set to the bonding mark.
  • the mounting area 121 is used for mounting the functional chip 13.
  • the mounting area 121 is provided with a mounting position. When processing the display panel, the functional chip 13 may be soldered to the mounting position.
  • the first side surface 11 and the second side surface 12 are two side surfaces of the circuit board, and the first side surface 11 faces away from the second side surface 12. It should be noted that the first side surface 11 and the second side surface 12 are not opposite to the display panel.
  • the surface correspondence only needs to satisfy that the bonding region 111 and the mounting region 121 are disposed on different sides of the circuit board body 10.
  • the circuit board body 10 generally has a long shape, and a long side thereof is opposite to one side of the display screen 20; the bonding area 111 and the mounting area 121 both occupy a certain width of the circuit board body 10, so the bonding area 111 Setting the mounting area 121 on a different side of the circuit board body 10 is beneficial to reducing the overall width of the circuit board body 10.
  • the bonding area 111 and the mounting area 121 of the functional chip 13 are respectively disposed on the first side surface 11 of the circuit board body 10 and the second side surface 12 facing away from the first side surface 11, so that the bonding area 111 and the The mounting area 121 does not interfere with each other, so that the bonding area 111 and the mounting area 121 do not have to give up each other, that is, at least the separation distance between the bonding area 111 and the mounting area 121 is reduced, thereby reducing the overall width of the circuit board body 10 This improves the overall thinness and lightening effect of the display panel, reduces the production and processing costs of the circuit board body 10, and improves the utilization of both sides of the circuit board body 10.
  • the projection of the mounting area 121 on the first side surface 11 and the bonding area 111 at least partially overlap.
  • the projection of the mounting area 121 on the first side 11 and the bonding area 111 at least partially overlap with each other, thereby reducing the occupied area of the mounting area 121 to the second side 12 of the circuit board body 10, thereby further reducing the circuit board.
  • the width of the body 10 and the overall utilization of the circuit board body 10 are improved.
  • the overlapping width of the projection of the mounting area 121 on the first side surface 11 and the bonding area 111 is 0 mm to 2 mm.
  • the reduced width of the circuit board body 10 is at least the width of the overlapping portion, and the width of the mounting area 121 is generally larger than that of the bonding area.
  • the fixed area 111 therefore, if the projection of the mounting area 121 on the first side 11 and the bonding area 111 all overlap, the width that the circuit board body 10 can reduce is at least the total width of the bonding area 111.
  • the width of the bonding region 111 is generally 2 mm. Therefore, if the projection of the mounting region 121 on the first side 11 and the bonding region 111 all overlap, the overall width of the circuit board body 10 can be reduced by 2 mm.
  • each bonding region 111 is provided with a bonding mark, and the driving chip 21 of the display panel is correspondingly multiple, so as to correspond to each bonding region 111, and the bonding of the display screen 20 and the circuit board is increased. Fixed area to improve the stability of the bonding connection. It can be understood that the distance between any two adjacent bonding regions 111 is not enough to mount the functional chip 13.
  • the number of the mounting positions is plural, and the plurality of mounting positions are arranged at intervals along the length direction of the mounting area 121.
  • the mounting area 121 extends along the length direction of the circuit board body 10, and a plurality of mounting positions are spaced apart along the length direction of the mounting area 121 to reduce the area occupied by the mounting position in the width direction of the circuit board body 10.
  • Multiple mounting positions are used to install multiple functional chips 13.
  • the mounting positions may preferably be provided with mounting marks. When installing the functional chips 13, the functional chips 13 need only be soldered to the positions provided with the mounting marks. However, this simplifies the processing process of the circuit board assembly and improves the production efficiency.
  • the circuit board assembly further includes a function chip 13 installed in the mounting position.
  • the function chip 13 is used to provide control, power supply or programming functions for the display panel to improve the function integration effect of the circuit board component.
  • the functional chip 13 is soldered to the mounting position by a reflow soldering process.
  • the reflow soldering process is to first attach the functional chip 13 provided with solder to the circuit board body 10, and then heat the air or nitrogen to a sufficiently high temperature and then blow it to the circuit board body to which the functional chip 13 is attached. 10. After the solder on the functional chip 13 is melted, it is bonded to the circuit board body 10, so that the functional chip 13 is firmly soldered to the circuit board body 10.
  • the temperature of the reflow soldering process is easy to control during the process, it can also effectively avoid oxidation reactions, and is convenient for centralized soldering, which is beneficial to reducing processing costs.
  • the welding of the functional chip 13 on the second side 12 does not affect the first side 11, that is, even if the projection of the mounting area 121 on the first side 11 coincides with the bonding area 111, the functional chip 13
  • the soldering of 13 does not affect the bonding region 111 on the back side, that is, the driving chip 21 of the display panel can still be effectively bonded to the circuit board body 10 in the bonding region 111.
  • the function chip 13 includes at least one of a timing control chip, a power chip, and a programmable gamma chip.
  • the timing control chip is used to apply temporal control to the signal flow of the display panel, so that the working process of each functional module of the display panel can be performed in time orderly.
  • the power chip is used to provide stable voltage for the work of each functional module of the display panel, so that each functional module can work effectively.
  • the programmable gamma chip is used to provide the data driving chip 21 of the display panel with a gamma voltage required for its operation, so that the data driving chip 21 can work effectively.
  • timing control chip, power chip, and programmable gamma chip can be installed on the mounting area 121 preferentially to improve the function integration effect of the circuit board component; the timing control chip, power chip, and programmable gamma chip There are no restrictions on the sequence and spacing, as long as it is installed in the installation position.
  • the present application also proposes a display panel including a circuit board assembly.
  • a display panel including a circuit board assembly.
  • the display panel further includes a display screen 20 and a data driving chip 21.
  • One side of the data driving chip 21 is electrically connected to the display screen 20, and the other side is connected to the bonding region 111 of the circuit board assembly.
  • the present application also proposes a display device including a display panel.
  • a display panel For a specific structure of the display panel, refer to the foregoing embodiments. Since the display device adopts all the technical solutions of all the above embodiments, it has at least the technologies of the above embodiments. All technical effects brought by the solution are not repeated here one by one.

Abstract

一种电路板组件、显示面板及显示装置，该电路板组件包括：电路板本体（10），包括第一侧面（11）及第二侧面（12），第一侧面（11）背向第二侧面（12），第一侧面（11）具有邦定区域（111），第二侧面（12）具有安装区域（121），安装区域(121)具有用以供功能芯片（13）安装的安装位。

Description

电路板组件、显示面板及显示装置
技术领域
本申请涉及显示器制造领域，特别涉及一种电路板组件、显示面板及显示装置。
背景技术
随着科技的发展，人们对显示面板的设计要求也越来越高。显示面板一般通过邦定技术将电路板、数据驱动芯片及显示屏相连接以构成显示面板。现有的显示面板中会在电路板上设置功能芯片，并将功能芯片与邦定区域设置于电路板的同一侧面，由于电路板长度有限，为了有效安装功能芯片，会使电路板的宽度增加，影响了显示面板整体的轻薄化效果。
发明内容
本申请的主要目的是提出一种电路板组件，旨在解决如何提高显示面板整体轻薄化效果的技术问题。
为实现上述目的，本申请提出的电路板组件，包括：
电路板本体，包括第一侧面及第二侧面，所述第一侧面背向所述第二侧面，所述第一侧面具有邦定区域，所述第二侧面具有安装区域，所述安装区域具有用以供功能芯片安装的安装位。
可选地，所述安装区域在所述第一侧面的投影与所述邦定区域至少部分重合。
可选地，所述安装区域在所述第一侧面的投影与所述邦定区域的重合宽度为0mm~2mm。
可选地，所述邦定区域的数量为多个，多个所述邦定区域沿所述电路板本体的一长侧边间隔设置。
可选地，所述安装位的数量为多个，多个所述安装位沿所述安装区域的长度方向间隔设置。
可选地，所述电路板组件还包括安装于所述安装位的功能芯片。
可选地，所述功能芯片焊接于所述安装位。
可选地，所述功能芯片至少包括时序控制芯片、电源芯片及可编程伽玛芯片中的一个。
本申请还提出一种显示面板，包括一种电路板组件，该电路板组件包括：电路板本体，包括第一侧面及第二侧面，所述第一侧面背向所述第二侧面，所述第一侧面具有邦定区域，所述第二侧面具有安装区域，所述安装区域具有用以供功能芯片安装的安装位。
本申请还提出一种显示装置，包括一种显示面板，该显示面板包括一种电路板组件，该电路板组件包括：电路板本体，包括第一侧面及第二侧面，所述第一侧面背向所述第二侧面，所述第一侧面具有邦定区域，所述第二侧面具有安装区域，所述安装区域具有用以供功能芯片安装的安装位。
本申请电路板组件通过将邦定区域与功能芯片的安装区域分别设置在电路板本体第一侧面及背向第一侧面的第二侧面，使得邦定区域与安装区域不会互相干涉，从而使邦定区域与安装区域不必互相让位，即至少减少了邦定区域与安装区域的间隔距离，由此减少了电路板本体的整体宽度，提高了显示面板整体的轻薄化效果，同时降低了电路板本体的生产加工成本。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图示出的结构获得其他的附图。
图1为本申请电路板组件一实施例的结构示意图；
图2为本申请电路板组件另一实施例的结构示意图；
图3为本申请显示面板一实施例的结构示意图。
附图标号说明：
标号 名称 标号 名称 标号 名称
10 电路板本体 11 第一侧面 12 第二侧面
111 邦定区域 121 安装区域 13 功能芯片
20 显示屏 21 驱动芯片
本申请目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
需要说明，若本申请实施例中有涉及方向性指示（诸如上、下、左、右、前、后……），则该方向性指示仅用于解释在某一特定姿态（如附图所示）下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
另外，若本申请实施例中有涉及“第一”、“第二”等的描述，则该“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外，全文中出现的“和/或”的含义为，包括三个并列的方案，以“A和/或B为例”，包括A方案，或B方案，或A和B同时满足的方案。另外，各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本申请要求的保护范围之内。
本申请提出一种电路板组件。
在本申请实施例中，如图1和图2所示，该电路板组件包括：
电路板本体10，包括第一侧面11及第二侧面12，第一侧面11背向第二侧面12，所述第一侧面11具有邦定区域111，所述第二侧面12具有安装区域121，所述安装区域121具有用以供功能芯片13安装的安装位。
在本实施例中，邦定区域111一般紧邻电路板本体10的侧边，邦定区域111内设有邦定标记，用以供显示面板的驱动芯片21与电路板邦定连接，在邦定时，将驱动芯片21邦定于邦定标记即可。安装区域121用以供功能芯片13安装，安装区域121设有安装位，在加工显示面板时，将功能芯片13焊接于安装位即可。第一侧面11及第二侧面12为电路板两个侧面，且第一侧面11背向第二侧面12，需要说明的是，第一侧面11及第二侧面12并不与显示面板的正反面对应，只需满足邦定区域111与安装区域121设置在电路板本体10的不同侧面即可。电路板本体10一般呈长条状，其一长侧边与显示屏20的一侧边相对；邦定区域111及安装区域121均会占据电路板本体10一定的宽度，因此将邦定区域111与安装区域121设置于电路板本体10的不同侧面有利于减少电路板本体10的整体宽度。
本申请电路板组件通过将邦定区域111与功能芯片13的安装区域121分别设置在电路板本体10的第一侧面11及背向第一侧面11的第二侧面12，使得邦定区域111与安装区域121不会互相干涉，从而使邦定区域111与安装区域121不必互相让位，即至少减少了邦定区域111与安装区域121的间隔距离，由此减少了电路板本体10的整体宽度，提高了显示面板整体的轻薄化效果，同时降低了电路板本体10的生产加工成本，并提高对电路板本体10两个侧面的利用率。
进一步地，如图1和图2所示，所述安装区域121在所述第一侧面11的投影与所述邦定区域111至少部分重合。在本实施例中，安装区域121在第一侧面11的投影与邦定区域111至少部分重合，减少了安装区域121对电路板本体10的第二侧面12的占用面积，从而能进一步减少电路板本体10的宽度，以及提高对电路板本体10的整体利用率。
进一步地，如图1和图2所示，所述安装区域121在所述第一侧面11的投影与所述邦定区域111的重合宽度为0mm~2mm。在本实施例中，若安装区域121在第一侧面11的投影与邦定区域111部分重合，则电路板本体10能减少的宽度至少为重合部分的宽度，而安装区域121的宽度一般大于邦定区域111，因此，若安装区域121在第一侧面11的投影与邦定区域111全部重合，则电路板本体10能减少的宽度至少为邦定区域111的总宽度。在实际应用中，邦定区域111的宽度一般为2mm，因此，若安装区域121在第一侧面11的投影与邦定区域111全部重合，则电路板本体10的整体宽度能减少2mm。
进一步地，如图1和图2所示，所述邦定区的数量为多个，多个所述邦定区沿所述电路板本体10的一长侧边间隔设置。在本实施例中，每个邦定区域111均设有邦定标记，显示面板的驱动芯片21也相应地为多个，以分别对应各个邦定区域111，增加显示屏20与电路板的邦定面积，提高邦定连接的稳定性。可以理解的是，任意两相邻的邦定区域111之间的间距不足以安装功能芯片13。
进一步地，如图1和图2所示，所述安装位的数量为多个，多个所述安装位沿所述安装区域121的长度方向间隔设置。在本实施例中，安装区域121沿电路板本体10的长度方向延伸，多个安装位沿安装区域121的长度方向间隔设置，以减少安装位对电路板本体10宽度方向的面积占用。多个安装位用以供多个功能芯片13安装，在实际应用中，安装位可优选设置有安装标记，在安装功能芯片13时，只需将功能芯片13焊接于设有安装标记的位置即可，由此，简化了电路板组件的加工过程，提高了生产效率。
进一步地，如图1和图2所示，所述电路板组件还包括安装于所述安装位的功能芯片13。在本实施例中，功能芯片13用以为显示面板提供控制、供电或编程功能，以提高电路板组件的功能集成效果。
进一步地，所述功能芯片13通过回流焊的工艺焊接于所述安装位。在本实施例中，回流焊工艺是先将设有焊料的功能芯片13贴在电路板本体10上，再将空气或氮气加热到足够高的温度后吹向贴有功能芯片13的电路板本体10，功能芯片13上的焊料融化后与电路板本体10粘结，从而使功能芯片13稳固地焊接于电路板本体10上。回流焊工艺在进行过程中温度容易控制，还能有效避免氧化反应，且方便集中焊接，有利于降低加工成本。可以理解的是，功能芯片13在第二侧面12上的焊接并不会影响第一侧面11，也就是说，即使安装区域121在第一侧面11上的投影与邦定区域111重合，功能芯片13的焊接也不会对背面的邦定区域111造成影响，即显示面板的驱动芯片21仍能在邦定区域111与电路板本体10有效邦定连接。
进一步地，所述功能芯片13至少包括时序控制芯片、电源芯片及可编程伽玛芯片中的一个。在本实施例中，时序控制芯片用以对显示面板的信号流施加时间上的控制，使得显示面板各功能模块的工作过程能够按时间顺序有序进行。电源芯片用以为显示面板各功能模块的工作提供稳定电压，从而使各功能模块能够有效工作。可编程伽马芯片用以为显示面板的数据驱动芯片21提供其工作所需的伽马电压，以使数据驱动芯片21能有效工作。可以理解的是，时序控制芯片、电源芯片及可编程伽玛芯片中可优先均安装在安装区域121上，以提高电路板组件的功能集成效果；时序控制芯片、电源芯片及可编程伽玛芯片的顺序及间距在此不做限制，只需满足安装于安装位即可。
本申请还提出一种显示面板，该显示面板包括电路板组件，该电路板组件的具体结构参照上述实施例，由于本显示面板采用了上述所有实施例的全部技术方案，因此至少具有上述实施例的技术方案所带来的所有技术效果，在此不再一一赘述。其中，显示面板还包括显示屏20和数据驱动芯片21，数据驱动芯片21一侧与显示屏20电连接，另一侧与电路板组件的邦定区域111邦定连接。
本申请还提出一种显示装置，该显示装置包括显示面板，该显示面板的具体结构参照上述实施例，由于本显示装置采用了上述所有实施例的全部技术方案，因此至少具有上述实施例的技术方案所带来的所有技术效果，在此不再一一赘述。
以上所述仅为本申请的优选实施例，并非因此限制本申请的专利范围，凡是在本申请的发明构思下，利用本申请说明书及附图内容所作的等效结构变换，或直接/间接运用在其他相关的技术领域均包括在本申请的专利保护范围内。

Claims (20)

  1. 一种电路板组件，其中，所述电路板组件包括：
    电路板本体，包括第一侧面及第二侧面，所述第一侧面背向所述第二侧面，所述第一侧面具有邦定区域，所述第二侧面具有安装区域，所述安装区域具有用以供功能芯片安装的安装位。
  2. 如权利要求1所述的电路板组件，其中，所述安装区域在所述第一侧面的投影与所述邦定区域至少部分重合。
  3. 如权利要求2所述的电路板组件，其中，所述安装区域在所述第一侧面的投影与所述邦定区域的重合宽度为0mm~2mm。
  4. 如权利要求1所述的电路板组件，其中，所述邦定区域的数量为多个，多个所述邦定区域沿所述电路板本体的一长侧边间隔设置。
  5. 如权利要求1所述的电路板组件，其中，所述安装位的数量为多个，多个所述安装位沿所述安装区域的长度方向间隔设置。
  6. 如权利要求1所述的电路板组件，其中，所述电路板组件还包括安装于所述安装位的功能芯片。
  7. 如权利要求6所述的电路板组件，其中，所述功能芯片焊接于所述安装位。
  8. 如权利要求6所述的电路板组件，其中，所述功能芯片至少包括时序控制芯片、电源芯片及可编程伽玛芯片中的一个。
  9. 如权利要求1所述的电路板组件，其中，所述邦定区域内具有邦定标记，用以供所述显示面板的驱动芯片与所述电路板邦定连接。
  10. 如权利要求1所述的电路板组件，其中，所述电路板本体呈长条状设置，且所述电路板本体的长侧边与所述显示屏的一侧边相对。
  11. 如权利要求2所述的电路板组件，其中，所述安装区域在所述第一侧面的投影与所述邦定区域全部重合。
  12. 如权利要求4所述的电路板组件，其中，任意两相邻的所述邦定区域之间的间距小于所述功能芯片的尺寸。
  13. 如权利要求5所述的电路板组件，其中，所述安装区域沿所述电路板本体的长度方向延伸。
  14. 如权利要求5所述的电路板组件，其中，所述安装位设置有安装标记，用以供所述功能芯片安装。
  15. 如权利要求7所述的电路板组件，其中，所述功能芯片通过回流焊的工艺焊接于所述安装位。
  16. 如权利要求8所述的电路板组件，其中，所述功能芯片包括时序控制芯片、电源芯片及可编程伽玛芯片中。
  17. 如权利要求2所述的电路板组件，其特征在于，所述电路板组件还包括安装于所述安装位的功能芯片。
  18. 如权利要求3所述的电路板组件，其特征在于，所述电路板组件还包括安装于所述安装位的功能芯片。
  19. 一种显示面板，其中，包括一种电路板组件，该电路板组件包括：电路板本体，包括第一侧面及第二侧面，所述第一侧面背向所述第二侧面，所述第一侧面具有邦定区域，所述第二侧面具有安装区域，所述安装区域具有用以供功能芯片安装的安装位。
  20. 一种显示装置，其中，包括一种显示面板，该显示面板包括一种电路板组件，该电路板组件包括：电路板本体，包括第一侧面及第二侧面，所述第一侧面背向所述第二侧面，所述第一侧面具有邦定区域，所述第二侧面具有安装区域，所述安装区域具有用以供功能芯片安装的安装位。
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