WO2020062492A1 - 电路板结构及显示面板 - Google Patents

电路板结构及显示面板 Download PDF

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Publication number
WO2020062492A1
WO2020062492A1 PCT/CN2018/115866 CN2018115866W WO2020062492A1 WO 2020062492 A1 WO2020062492 A1 WO 2020062492A1 CN 2018115866 W CN2018115866 W CN 2018115866W WO 2020062492 A1 WO2020062492 A1 WO 2020062492A1
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WO
WIPO (PCT)
Prior art keywords
bending section
circuit board
flexible conductive
board structure
conductive substrate
Prior art date
Application number
PCT/CN2018/115866
Other languages
English (en)
French (fr)
Inventor
李汶欣
Original Assignee
惠科股份有限公司
重庆惠科金渝光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 惠科股份有限公司, 重庆惠科金渝光电科技有限公司 filed Critical 惠科股份有限公司
Priority to US16/254,629 priority Critical patent/US10925156B2/en
Publication of WO2020062492A1 publication Critical patent/WO2020062492A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits

Definitions

  • the present application relates to the field of display, and in particular to a circuit board structure and a display panel.
  • Thin film transistor liquid crystal display (Thin Flim Transisor Liquid Crystal Display TFT-LCD) is one of the main varieties of flat panel displays, and has become an important display platform in modern IT and video products.
  • the main driving principle of TFT-LCD is as follows: the system motherboard passes the R / G / B compression signal, control signal and voltage through the wire and the printed circuit board (Printed The controller on the Circuit Board is electrically connected, and the data passes through the timing controller on the PCB.
  • TCON integrated circuit
  • IC integrated circuit
  • S-COF source-chip on film S-COF
  • gate circuit Gate-Chip on Film G-COF
  • panel display area Display Area
  • the LCD panel is formed by stacking multiple layers of components, and from top to bottom are an upper polarizing film, a color filter, a liquid crystal layer, a TFT glass substrate, and a lower polarizing plate.
  • the TFT glass substrate is plated with a layer of transparent conductive metal (Indium Tin Oxide ITO), ITO forms electrode wires on the glass substrate, printed circuits on the PCB form a bonding area on one side of the PCB board, and the electrode wires on the glass substrate are electrically connected to the bonding area on the PCB board, and the LCD panel is then Get electricity.
  • ITO Indium Tin Oxide ITO
  • a power supply IC and a driver IC are generally installed on the PCB of the TFT-LCD.
  • the power IC is set to distribute power and the driver IC is set to drive S-COF and G-COF switches to change the state of the liquid crystal in the liquid crystal layer, so that The LCD display can display images of various colors.
  • the driver IC or power IC is integrated with other necessary electrical components on a PCB, but this will cause the length or width of the PCB to become very long, which will make the entire machine with an LCD panel. A large amount of plane space needs to be reserved for PCB installation, so it is not conducive to the design of the whole machine.
  • the main purpose of this application is to propose a circuit board structure, which aims to solve the technical problem of large plane space occupied by existing circuit boards.
  • the circuit board structure proposed in the present application is provided as a display panel and includes: a mounting substrate, at least two of which are provided for mounting electrical components; and a flexible conductive substrate, which is provided on two adjacent mounting substrates. In between, the two mounting substrates are electrically connected, and a convex portion is formed on a side of the flexible conductive substrate toward a board surface where the flexible conductive substrate is located.
  • the present application also proposes a circuit board structure including:
  • At least two mounting substrates provided for mounting electrical components
  • a flexible conductive substrate is provided between two adjacent mounting substrates to electrically connect the two mounting substrates, and the flexible conductive substrate forms a convex portion on a side of the board surface where the flexible conductive substrate is located, and the convex portion It includes a first bending section and a second bending section. One end of the first bending section and the second bending section is electrically connected to a mounting substrate, and the other end is connected to each other.
  • the present application also proposes a display panel including an array substrate.
  • the array substrate includes:
  • At least two mounting substrates provided for mounting electrical components
  • a flexible conductive substrate is provided between two adjacent mounting substrates to electrically connect the two mounting substrates, and the flexible conductive substrate forms a convex portion on a side of the board surface where the flexible conductive substrate is located.
  • the technical solution of the present application adopts a method of arranging a flexible conductive substrate between adjacent mounting substrates, so that when a circuit board is installed in the whole machine, the deformability of the flexible conductive substrate can be used to make the flexible conductive substrate move toward one of its board surfaces. A raised portion is formed on the side, so that the distance between two adjacent mounting substrates can be shortened. Since the electrical components are mounted on the mounting substrate, the function of the circuit board remains unchanged.
  • the circuit board structure provided in the present application uses a flexible conductive substrate to replace the routing area of the original circuit board.
  • the volume occupied by the space reduces the area occupied by the circuit board in the plane space, so that the whole machine that cooperates with the panel does not need to reserve a large amount of plane space, which is convenient for the design of the whole machine.
  • FIG. 1 is a schematic structural diagram of an embodiment of a circuit board structure of the present application
  • FIG. 2 is a schematic structural diagram of an embodiment of a circuit board structure of the present application.
  • FIG. 3 is a schematic structural diagram of an embodiment of a circuit board structure of the present application.
  • FIG. 4 is a schematic structural diagram of an embodiment of a circuit board structure of the present application.
  • FIG. 5 is a schematic structural diagram of an embodiment of a circuit board structure of the present application.
  • FIG. 6 is a top view of the embodiment shown in FIG. 1;
  • FIG. 7 is a top view of an embodiment of a circuit board structure of the present application.
  • the directivity indication is only set to be interpreted in a specific posture (as shown in the accompanying drawings). (Shown) the relative positional relationship, movement, etc. of the various components, if the specific posture changes, the directional indicator will change accordingly.
  • the present application proposes a circuit board structure.
  • the circuit board structure includes a mounting substrate 1 and a flexible conductive substrate 2; at least two mounting substrates 1 are provided for installing electrical components; and the flexible conductive substrate 2 is provided at the phase Between the two adjacent mounting substrates 1, the two mounting substrates 1 are electrically connected, and the flexible conductive substrate 2 forms a protrusion on one side of the board surface.
  • the technical solution of the present application adopts a method of arranging the flexible conductive substrate 2 between the adjacent mounting substrates 1, so that when the circuit board is installed in the whole machine, the deformable ability of the flexible conductive substrate 2 can be used to make the flexible conductive substrate 2 face itself.
  • a convex portion 21 is formed on one side of the board surface. In this way, the distance between two adjacent mounting substrates 1 can be shortened. Since the electrical components are mounted on the mounting substrate 1, the function of the circuit board remains unchanged.
  • the circuit board structure provided in this application uses a flexible conductive substrate 2 instead of the routing area of the original circuit board.
  • the volume occupied by the three-dimensional space reduces the area occupied by the circuit board in the plane space, so that the entire machine that cooperates with the panel does not need to reserve a large amount of plane space, which is convenient for the design of the whole machine.
  • each flexible conductive substrate 2 is formed with a convex portion 21 on a side of the flexible conductive substrate 2, and each convex portion 21 faces the mounting substrate 1. The same side forms a bump.
  • the protrusions 21 formed by the plurality of flexible mounting substrates 1 protrude toward the same side of the mounting substrate 1. Since the present application shortens the number of adjacent mounting substrates 1 by the vertical deformation of the flexible mounting substrates 1 Distance, thereby reducing the plane space occupied by the circuit board. Therefore, when a plurality of protrusions 21 form protrusions on the same side of the mounting substrate 1, when designing the whole machine that cooperates with the display panel, only A certain amount of space is reserved on one side of the mounting substrate 1 to accommodate the raised portion of the flexible conductive substrate 2, which is beneficial to make the whole machine thin. Compared with an exemplary circuit board, this application provides The circuit board occupies a smaller area, which is conducive to narrowing the whole machine. The combination of the two can ultimately make the whole machine narrow and thin, which is in line with the mainstream aesthetics of the current market and is conducive to product promotion and sales.
  • the plane on which the mounting substrate 1 is located is parallel to the horizontal plane, and the above vertical direction is perpendicular to the plane on which the mounting substrate 1 is located, and is not limited to the direction perpendicular to the horizontal plane. The plane on which it changes will change accordingly.
  • the plurality of protrusions 21 may not protrude toward the same side of the mounting substrate 1 due to different product positioning and different internal structures of the product.
  • the thickness of the final machine will be thicker, but more space will help the heat dissipation of the mounting substrate 1 and reduce the temperature on the performance of the electrical components on the mounting substrate 1. To ensure the stability of product operation, it can be set to products with higher requirements on product performance.
  • the protrusion 21 includes a first bending section 211 and a second bending section 212.
  • One ends of the first bending section 211 and the second bending section 212 are electrically connected to a mounting substrate 1, respectively. The other ends are connected to each other.
  • the convex portion 21 is formed by bending the flexible guide substrate, the convex portion 21 is provided to include the first bending section 211 and the second bending section 212, which can facilitate the shaping of the shape of the convex section 21.
  • the space inside the whole machine becomes very precious, so the internal structure of the whole machine will also be very compact. Therefore, when the circuit board is placed in the whole machine, since the protrusion 21 is formed by the flexible conductive substrate 2, the protrusion 21 is easily deformed by the pressure of other structures in the machine, which may cause the protrusion 21 The physical properties are affected.
  • the conductive ability of the flexible conductive substrate 2 may be affected, causing product failure and shortening the service life of the product.
  • the electrical components on the mounting substrate 1 generate heat due to operation, and the circuit board needs to be used to dissipate heat. If the protrusion 21 is pressed against the mounting substrate 1, not only the heat dissipation ability of the circuit board will be affected, but also the electrical components
  • the performance of the product decreases, which results in a decrease in product performance and affects the user experience. It also increases the elastic force at the connection between the flexible conductive substrate 2 and the mounting substrate 1, which may reduce the sensitivity of the connection between the flexible conductive substrate 2 and the mounting substrate 1. As a result, the voltage signal cannot be transmitted well, and the product is damaged, which will also affect the user experience.
  • the convex portion 21 is set as the first bending section 211 and the second bending section 212, and by adjusting the angle at which the first bending section 211 and the second bending section 212 are inclined relative to the mounting substrate 1, and setting The respective lengths of the first bending section 211 and the second bending section 212 allow the protrusion 21 to well avoid other structures in the whole machine, thereby avoiding the above problems and reducing the product
  • the failure rate improves the user experience and product reputation, and is conducive to product sales.
  • first bending section 211 and the second bending section 212 are equal in length, and the inclination angles of the first bending section 211 and the second bending section 212 are equal.
  • first bending section 211 is the same length as the second bending section 212 .
  • the first bending section 211 and the second bending section 212 provided with the same length may be It is convenient for the designer to calculate the space occupied by the convex portion 21, which is convenient for the design of the whole machine.
  • Another reason is that during production processing, not only the equipment for manufacturing the convex portion 21 is simpler, but also the convex portion 21 is easier. Molding is beneficial to control the manufacturing cost of the circuit board.
  • first bending section 211 and the second bending section 212 can be approximately regarded as two sides of an isosceles triangle. The calculation of height and volume is also simpler, without the need for complicated calculations.
  • first bending section 211 and the second bending section 212 are arranged obliquely and are connected at a side far from the mounting substrate 1, the first bending section 211 and the second bending section 212 and the flexible conductive substrate 2 are located there.
  • a triangular prism is formed on the surface of the plate. Compared with other shapes, the triangular prism structure has higher stability.
  • the structure of the triangular prism can ensure that the convex portion 21 has a certain pressure resistance ability, which will not easily deform and cause product damage, which improves the overall assembly process. Fault tolerance.
  • the stable triangular prism structure makes the probability of deformation of the convex portion 21 affected by external forces lower, which can ensure that the shape of the convex portion 21 remains unchanged for a long time, which reduces the product's Rework rate improves product stability.
  • the lengths of the first bending section 211 and the second bending section 212 may not be the same, and should be set to different products.
  • the first bending section 211 and the second bending section The inclination angle of the folded section 212 may also be different, so as to be suitable for different machine structures.
  • the lengths of the first bending section 211 and the second bending section 212 of the different protrusions 21 may also be different, and the first bending section 211 and the second bending section 212 may be different.
  • the angle of inclination also changes accordingly, in order to better fit the internal structure of the whole machine and reduce the volume of the whole machine.
  • the structure of the convex portion 21 formed by each flexible circuit board is the same.
  • the inclination angle of the first bending section 211 is 45 ° -70 °, that is, the inclination angle of the second bending section 212 is 45 ° -70 °.
  • the shortening of the distance between the adjacent mounting substrates 1 is related to the height of the convex portion 21, that is, the larger the inclination angle of the first bending section 211, the shorter the distance between the two mounting substrates 1, when the first bending When the inclination of the segment 211 is 90 °, two adjacent mounting substrates 1 are in close contact.
  • the circuit board occupies the smallest area in the whole machine, but because the mounting substrate 1 needs to have good heat dissipation performance to assist in mounting the substrate
  • the electrical components on 1 dissipate heat, so sufficient space needs to be reserved between the two mounting substrates 1 to ensure the heat dissipation ability of the mounting substrate 1.
  • the inclination angle of the first bending section 211 increases, the distance between the first bending section 211 and the second bending section 212 will gradually decrease until it is fully fitted. Since the electrode is etched on the flexible conductive substrate 2 When the flexible conductive substrate 2 is bent, the electrode wires on the flexible conductive substrate 2 will also be bent accordingly. As the inclination of the first bending section 211 increases, the electrode wires on the flexible conductive substrate 2 may be excessively bent. Fold, which affects the conductive properties of the electrode wire. Therefore, the inclination angle of the first bending section 211 should not be set too large.
  • the inclination angle of the first bending section 211 should not be set too small.
  • the inclination angle of the first bending section 211 is set to 60 °, which can effectively shorten the distance between the two mounting substrates 1 and reduce the space occupied by the circuit board. It will take up too much vertical space, which is conducive to the thin design of the whole machine.
  • the inclination angle of the first bending section 211 may also be set to 45 °, 50 °, 55 °, 65 °, 70 °, or the like.
  • a crease is formed at a connection between the first bending section 211 and the second bending section 212.
  • the protruding portion 21 is formed by bending the flexible conductive substrate 2, the protruding portion 21 is a portion where the flexible conductive substrate 2 is deformed. An elastic restoring force is applied to both sides of the protruding portion 21, and the protruding portion 21 generates The elastic restoring force is set as the connection between the flexible conductive substrate 2 and the mounting substrate 1. Since the flexible conductive substrate 2 and the mounting substrate 1 are fixed by an anisotropic conductive adhesive, over time, The elastic restoring force of the convex portion 21 may cause a deviation between the flexible conductive substrate 2 and the mounting substrate 1, so that the voltage signal cannot be transmitted well through the flexible conductive substrate 2, resulting in product failure.
  • the crease formed between the first bending section 211 and the second bending section 212 can effectively weaken the elastic restoring force of the convex portion 21, thereby reducing the drag on the connection between the flexible conductive substrate 2 and the mounting substrate 1, and improving The stability of the connection between the flexible conductive substrate 2 and the mounting substrate 1 is improved.
  • no crease may be formed between the first bending section 211 and the second bending section 212.
  • Limits can be provided on both sides of the convex portion 21 to reduce the influence of the elastic restoring force of the convex portion 21 on the connection between the flexible conductive substrate 2 and the mounting substrate 1. Specifically, by setting corresponding limiting structures on the whole machine, such as limiting columns, limiting plates, etc., the first bending section 211 and the second bending section 212 abut against different limiting structures, respectively.
  • the elastic restoring force of the convex portion 21 is weakened; the convex portion 21 can also be inserted into a corresponding groove provided on the whole machine during assembly, and the groove can be formed by other structures on the whole machine, or It is formed on the casing of the whole machine, and the first bending section 211 and the second bending section 212 are restricted by the groove wall of the groove, thereby limiting the elastic restoring force of the convex portion 21;
  • the method of adding a fastener between 2 and the mounting substrate 1 improves the stability of the connection between the flexible conductive substrate 2 and the mounting substrate 1.
  • the fastener may be a screw, a spring nail, or the like.
  • the flexible conductive substrate 2 further includes a horizontal section 213, and two sides of the horizontal section 213 are respectively bent with the first bending section 211 and the second bending section.
  • the segments 212 are connected and arranged parallel to the mounting substrate 1.
  • the horizontal section 213 is disposed on a side of the first bending section 211 and the second bending section 212 away from the mounting substrate 1, and the first bending section 211 and the second bending section 212 are inclined. Therefore, the first bending section 211, the second bending section 212, the horizontal section 213, and the board surface of the flexible conductive substrate 2 itself can be approximately regarded as a ladder platform.
  • the height of the convex portion 21 relative to the mounting substrate 1 can be reduced by setting the horizontal section 213. The space occupied by the raised portion 21 is reduced, which is beneficial to make the whole machine thin.
  • creases are formed between the first bending section 211 and the horizontal section 213 and between the second bending section 212 and the horizontal section 213.
  • the existence of the crease can weaken the elastic restoring force of the convex portion 21 to improve the stability of the connection between the flexible conductive substrate 2 and the mounting substrate 1.
  • the overall structure of the convex portion 21 is smoother, thereby reducing the elastic restoring force of the convex portion 21, and also improving the stability of the connection between the flexible conductive substrate 2 and the mounting substrate 1.
  • the horizontal section 213 may not be parallel to the mounting substrate 1, and the horizontal section 213 may be disposed in an arc shape, so that the horizontal section 213 and the first bending section 211 And the transition between the second bending sections 212 is smoother to reduce the influence on the electrode lines on the flexible conductive substrate 2.
  • the horizontal section 213 may also be arranged in a V-shape, and the horizontal section 213 is convex toward the side where the mounting substrate 1 is located.
  • the horizontal section 213 is V-shaped, which has the advantages of reducing the height of the protrusion 21 and reducing the plane space occupied by the horizontal section 213. , The scope of application is wider.
  • the horizontal section 213 may also be set in a wavy shape.
  • the plane space occupied by the horizontal section 213 can be effectively reduced to suit the setting.
  • the horizontal section 213 is continuously bent, it is suitable to be set in a relatively large product.
  • the convex portion 21 is disposed in an arc shape as shown in the figure.
  • the advantage of the convex portion 21 in a convex arc shape is that, firstly, since the flexible conductive substrate 2 has fewer bent portions, the influence on the electrode lines on the flexible conductive substrate 2 is relatively small, and the conductive performance of the flexible conductive substrate 2 is more stable.
  • the convex portion 21 has the ability to deform accordingly.
  • the curved surface of the convex portion 21 does not have sharp edges.
  • the damage to the convex portion 21 can be reduced, and the arc structure is easy to transmit force.
  • the convex portion 21 can be further deformed, and The stability of the raised portion 21 is improved.
  • the convex portions 21 provided in a convex arc shape can be used to form the convex portions 21 of the flexible conductive substrate 2 by bringing the adjacent mounting substrates 1 close to each other, without the need for the flexible conductive substrate. (2) Other operations are applied. Therefore, the convex portion 21 provided in a convex arc shape is easy to be formed and is convenient for large-scale production.
  • the flexible conductive substrate 2 is disposed on the opposite side or adjacent side of the bonding region 11 of the mounting substrate 1.
  • the flexible conductive substrate 2 is disposed adjacent to the bonding region 11 of the mounting substrate 1.
  • the flexible conductive substrate 2 is disposed on the bonding substrate 11. The opposite side of the fixed area 11.
  • the position where the flexible conductive substrate 2 is set can be adaptively changed to minimize the plane space occupied by the conductive substrate.
  • the flexible conductive substrate 2 is made of a flexible circuit board.
  • flexible printed circuit board FPC for short
  • FPC flexible printed circuit board with high reliability and excellent reliability, based on polyimide or polyester film. It has high wiring density, light weight, thin thickness, and bending. Good sexual characteristics.
  • the present application also proposes a display panel including a circuit board structure.
  • a display panel including a circuit board structure.
  • the circuit board structure For a specific structure of the circuit board structure, refer to the above embodiments. Since the display panel adopts all the technical solutions of all the above embodiments, it has at least the above embodiments All the effects brought by the technical solution are not repeated here.
  • PCB boards Printed Circuit Board Printed circuit boards
  • C-board is mainly responsible for receiving input signals from the system and outputting data signals and control signals.
  • X-board is mainly responsible for transmitting data signals output from C-board With control signals.
  • C-board and X-board can be set on two PCB boards respectively, or they can be integrated on one PCB board. With the current process, when C-board and X-board are integrated on a PCB, the PCB will become very long.
  • the display panel provided in the present application through the above-mentioned circuit board structure, enables the PCB to be narrowed or shortened when the C-board and X-board are integrated on a PCB board, reducing the space occupied by the PCB board, which is convenient The design of the whole machine.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

一种电路板结构及显示面板，其中电路板结构包括安装基板（1）及柔性导电基板（2），该柔性导电基板（2）连接于相邻两安装基板（1）之间，以连接两安装基板（1）。

Description

电路板结构及显示面板
相关申请
本申请要求2018年09月30日申请的，申请号为201821622255.1，名称为“一种电路板结构及显示面板”的中国专利申请优先权，在此将其全文引入作为参考。
技术领域
本申请涉及显示领域，特别涉及一种电路板结构及显示面板。
背景技术
薄膜晶体管液晶显示器（Thin Flim Transisor Liquid Crystal Display TFT-LCD）是当前平板显示的主要品种之一，已经成为了现代IT、视讯产品中重要的显示平台。TFT-LCD主要的驱动原理如下：系统主板将R/G/B压缩信号、控制信号及电压通过线材与印制电路板（Printed Circuit Board PCB板）上的控制器电性连接，数据经过PCB板上的时序控制器（Timing Controller TCON）集成电路（Integrated Circuit IC）处理后，经PCB板，通过源极电路（Source-Chip on Film S-COF）和栅极电路（Gate-Chip on Film G-COF）与面板显示区域（Display Area）电性连接，从而使LCD获得所需的电源及信号，以显示图像信息。
LCD面板由多层构件堆叠而成，自上而下依次为上偏光膜、彩色滤光片、液晶层、TFT玻璃基板及下偏光板。其中TFT玻璃基板上镀有一层透明导电金属（Indium Tin Oxide ITO），ITO在玻璃基板上形成电极导线，PCB上印刷电路在PCB板的一侧边形成邦定区，玻璃基板上的电极导线与PCB板上的邦定区电性连接后，LCD面板便可得电。
TFT-LCD中的PCB板一般会安装有电源IC以及驱动IC，其中电源IC设置为分配供电，驱动IC设置为驱动S-COF和G-COF开关，以改变液晶层中液晶的状态，从而使LCD显示屏能够显示各种色彩的图像。一般而言，示例性技术中都是将驱动IC或电源IC与其他必须电器元件集成在一块PCB上，但是这样会导致PCB的的长度或宽度变得很长，从而使得搭配LCD面板的整机需要预留出大量的平面空间，以供PCB安装，因此不利于整机的设计。
申请内容
本申请的主要目的是提出一种电路板结构，旨在解决现有的电路板占用的平面空间大的技术问题。
为实现上述目的，本申请提出的电路板结构，设置为显示面板，包括：安装基板，至少设有两块，设置为安装电器元件；以及柔性导电基板，设于相邻两所述安装基板之间，以电性连接两所述安装基板，且所述柔性导电基板向自身所在板面的一侧形成凸起部。
本申请还提出一种电路板结构，其包括：
安装基板，至少设有两块，设置为安装电器元件；以及
柔性导电基板，设于相邻两所述安装基板之间，以电性连接两所述安装基板，且所述柔性导电基板向自身所在板面的一侧形成凸起部，所述凸起部包括第一弯折段及第二弯折段，所述第一弯折段与所述第二弯折段的一端分别与一所述安装基板电性连接，另一端相互连接。
本申请还提出一种显示面板，其包括阵列基板，所述阵列基板包括：
安装基板，至少设有两块，设置为安装电器元件；以及
柔性导电基板，设于相邻两所述安装基板之间，以电性连接两所述安装基板，且所述柔性导电基板向自身所在板面的一侧形成凸起部。
本申请技术方案通过采用在相邻安装基板之间设置柔性导电基板的方式，使得在整机内安装电路板时，可以利用柔性导电基板的形变能力，使柔性导电基板向自身所在板面的一侧形成凸起部，这样，可使相邻两安装基板之间的距离缩短，由于电器元件安装于安装基板上，因此电路板的功能保持不变。与现有的电路板结构相比，本申请所提供的电路板结构，使用柔性导电基板替代了原电路板上的走线区域，在保证电路板功能的前提下，通过增加柔性电路板在立体空间上占用的体积，减小了电路板在平面空间上占用的面积，使得与面板配合的整机无需预留大量的平面空间，便于整机的设计。
附图说明
为了更清楚地说明本申请实施例或示例性技术中的技术方案，下面将对实施例或示例性技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图示出的结构获得其他的附图。
图1为本申请电路板结构一实施例的结构示意图；
图2为本申请电路板结构一实施例的结构示意图；
图3为本申请电路板结构一实施例的结构示意图；
图4为本申请电路板结构一实施例的结构示意图；
图5为本申请电路板结构一实施例的结构示意图；
图6为图1所示实施例的俯视图；
图7为为本申请电路板结构一实施例的俯视图。
附图标号说明：
标号 名称 标号 名称
1 安装基板 11 邦定区
2 柔性导电基板 21 凸起部
211 第一弯折段 212 第二弯折段
213 水平段
本申请目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
需要说明，若本申请实施例中有涉及方向性指示（诸如上、下、左、右、前、后……），则该方向性指示仅设置为解释在某一特定姿态（如附图所示）下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
另外，若本申请实施例中有涉及“第一”、“第二”等的描述，则该“第一”、“第二”等的描述仅设置为描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外，全文中出现的“和/或”的含义为，包括三个并列的方案，以“A和/或B”为例，包括A方案，或B方案，或A和B同时满足的方案。另外，各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本申请要求的保护范围之内。
本申请提出一种电路板结构。
在本申请实施例中，如图1所示，该电路板结构包括安装基板1及柔性导电基板2；其中安装基板1至少设置有两块，设置为安装电器元件；柔性导电基板2设于相邻两安装基板1之间，以电性连接两安装基板1，且该柔性导电基板2向自身板面的一侧形成凸起。
本申请技术方案通过采用在相邻安装基板1之间设置柔性导电基板2的方式，使得在整机内安装电路板时，可以利用柔性导电基板2的形变能力，使柔性导电基板2向自身所在板面的一侧形成凸起部21，这样，可使相邻两安装基板1之间的距离缩短，由于电器元件安装于安装基板1上，因此电路板的功能保持不变。与现有的电路板结构相比，本申请所提供的电路板结构，使用柔性导电基板2替代了原电路板上的走线区域，在保证电路板功能的前提下，通过增加柔性电路板在立体空间上占用的体积，减小了电路板在平面空间上占用的面积，使得与面板配合的整机无需预留大量的平面空间，便于整机的设计。
进一步地，在本实施例中，柔性导电基板2设置有多块，每一柔性导电基板2均向自身板面的一侧形成有凸起部21，且每一凸起部21向安装基板1的同一侧形成凸起。
由多个柔性安装基板1所形成的凸起部21，向安装基板1的同一侧凸起，由于本申请是通过柔性安装基板1的在竖直方向的形变，来缩短相邻安装基板1之间的距离，进而减小电路板占用的平面空间的，因此当多个凸起部21均向安装基板1的同一侧形成凸起时，在设计与显示面板配合的整机时，只需在安装基板1的一侧预留出一定的空间，以容置柔性导电基板2凸起的部分即可，这样有利于将整机做薄，加之相较于示例性的电路板，本申请所提供的电路板占用的面积更小，有利于将整机做窄，两相结合，最终可令整机既窄且薄，符合当下市场的主流审美，有利于产品的宣传与销售。
需要说明的是，在本实施例中，安装基板1所在平面平行于水平面，而上述竖直方向是垂直于安装基板1所在的平面的，并不仅限于垂直于水平面的方向，即当安装基板1所在的平面发生改变，竖直方向也相应发生改变。
需要说明的是，在其他实施例中，多个凸起部21也可不朝安装基板1的同一侧凸起，由于产品定位的不同，以及产品内部结构的不同，虽然相较于凸起部21向安装基板1同侧凸起的产品而言，最终制造销售的整机的厚度会更厚，但更多的空间有助于安装基板1的散热，降低温度对安装基板1上的电器元件性能的影响，从而保证产品运行的稳定性，可设置为对产品性能要求较高的产品。
进一步地，该凸起部21包括第一弯折段211及第二弯折段212，该第一弯折段211与第二弯折段212的一端分别与一安装基板1电性连接，于另一端相互连接。
由于凸起部21是通过弯折柔性导向基板形成的，将凸起部21设置为包括第一弯折段211与第二弯折段212，可便于塑造凸起部21的形状。在实际生产的过程中，为将整机做的更小更薄，整机内部的空间就显得十分珍贵，因此整机内部的结构也会十分紧凑。因此，在将电路板置于整机中时，由于凸起部21是柔性导电基板2形成的，凸起部21容易受到整机内其他结构的压迫而变形，这样可能导致凸起部21的物理性质受到影响，随着使用时间的增加，可能影响柔性导电基板2的导电能力，造成产品的故障，缩短产品的使用寿命。由于在工作过程中，安装基板1上的电器元件会因为运行而产生热量，需要电路板辅助散热，如果凸起部21被压向安装基板1，不仅会影响电路板的散热能力，导致电器元件的性能降低，造成产品性能下降，影响用户体验，而且还会增加柔性导电基板2与安装基板1连接处受到的弹性力，可能会降低柔性导电基板2与安装基板1之间连接的灵敏性，导致电压信号无法很好的传递，造成产品的损坏，同样会影响用户体验。
故而将凸起部21设置为第一弯折段211与第二弯折段212，可通过调整第一弯折段211与第二弯折段212相较于安装基板1倾斜的角度，及设置第一弯折段211与第二弯折段212各自的长度，使得在整机中时，凸起部21能够很好的避开整机中其他结构，从而避免发生上述问题，降低了产品的故障率，提高了用户体验与产品口碑，有利于产品的销售。
进一步地，该第一弯折段211与第二弯折段212等长，且第一弯折段211与第二弯折段212的倾角相等。
将第一弯折段211设置为与第二弯折段212等长，其中一个原因在于，在设计整机的尺寸时，等长设置的第一弯折段211与第二弯折段212可便于设计人员计算凸起部21占用的空间，方便于整机的设计；另一个原因在于在生产加工时，不仅设置为制造凸起部21的设备更为简单，且凸起部21也更容易成型，有利于控制电路板的制造成本。而第一弯折段211与第二弯折段212的倾角相等，可将第一弯折段211与第二弯折段212近似看成等腰三角形的两边，这样在对凸起部21的高度及体积的计算上也就更为简单，而无需复杂的计算。
而且由于第一弯折段211与第二弯折段212倾斜设置，且于远离安装基板1的一侧相连接，因此第一弯折段211与第二弯折段212以及柔性导电基板2所在的板面形成了一个三棱柱，相较于其他形状，三棱柱结构的稳定性更高，在整机组装的过程中，若是凸起部21受到外力的干扰，如工作人员误操作导致手或整机的其他结构挤压到凸起部21时，三棱柱的结构能够保证凸起部21具有一定的抗压能力，不会轻易发生形变，而导致产品损坏，提高了整机组装过程中的容错率。
在整机的运输及使用的过程中，稳定的三棱柱结构，使得凸起部21受到外力影响而发生形变的概率更低，能够长时间保证凸起部21的形状不变，降低了产品的返修率，提高了产品的稳定性。
可以理解，在其他实施例中，第一弯折段211与第二弯折段212的长度也可不相等，以应设置为不同的产品中，相应的，第一弯折段211与第二弯折段212的倾角也可不同，以适设置为不同的整机结构。且由于整机内部结构较为复杂，不同凸起部21的第一弯折段211与第二弯折段212的长度也可以各不相同，相应第一弯折段211与第二弯折段212的倾角也随之改变，以更加贴合于整机的内部结构，缩小整机的体积。在本实施例中，每一柔性电路板所形成的凸起部21的结构相同。
进一步地，该第一弯折段211的倾角范围为45°-70°，即第二弯折段212的倾角也为45°-70°。
由于相邻安装基板1之间距离的缩短与凸起部21的高度相关，即第一弯折段211的倾角越大，两安装基板1之间的距离也就越短，当第一弯折段211的倾角为90°时，相邻两安装基板1紧贴，虽然这样一来，电路板在整机内占用的面积最小，但是由于安装基板1需要具有良好的散热性能，以辅助安装基板1上的电器元件散热，因此两安装基板1之间需要预留出足够的空间，以保证安装基板1的散热能力。且随着第一弯折段211倾角的增大，第一弯折段211与第二弯折段212之间的距离也会逐渐缩短，直至完全贴合，由于柔性导电基板2上蚀刻有电极线，当柔性导电基板2发生弯折时，柔性导电基板2上电极线也会相应弯折，随着第一弯折段211倾角的增大，可能使柔性导电基板2上的电极线过度弯折，而影响电极线的导电性能。所以，第一弯折段211的倾角不宜设置过大。
其次，当第一弯折段211的倾角设置过小时，相邻两安装基板1之间的距离缩短有限，无法有效减小电路板在整机内占用的平面空间，减弱了本申请所提供的电路板效果。所以，第一弯折段211的倾角不宜设置的过小。
因此，将第一弯折段211的倾角范围设置为45°-70°，是综合考量的结果，能够在减小电路板占用的平面空间的同时，保证安装基板1的散热能力与柔性导电基板2的导电能力。
具体地，在本实施例中，第一弯折段211的倾角设置为60°，这样既能有效缩短两安装基板1之间的距离，减小电路板的占用空间，且凸起部21不会占用过多的竖直空间，有利于整机的薄化设计。在其他实施例中，第一弯折段211的倾角也可设置为45°、50°、55°、65°、70°等。
进一步地，该第一弯折段211与第二弯折段212连接处形成有折痕。
由于凸起部21为柔性导电基板2弯折形成，因此凸起部21是柔性导电基板2发生形变的部分，会向凸起部21的两侧施加弹性回复力，而凸起部21产生的弹性回复力是作设置为柔性导电基板2与安装基板1的连接处的，由于柔性导电基板2与安装基板1之间是通过一种异方性导电胶粘接固定，随着时间的增加，凸起部21的弹性回复力可能导致柔性导电基板2与安装基板1之间发生偏移，使得电压信号无法很好的通过柔性导电基板2进行传递，导致产品故障。而第一弯折段211与第二弯折段212之间形成的折痕能够有效地减弱凸起部21的弹性回复力，进而减弱柔性导电基板2与安装基板1连接处受到的牵扯，提高了柔性导电基板2与安装基板1之间连接的稳定性。
需要说明的是，在其他实施例中，第一弯折段211与第二弯折段212之间也可不形成有折痕，为提高柔性导电基板2与安装基板1之间连接的稳定性，可通过在凸起部21的两侧设置限位，以减弱凸起部21的弹性回复力对柔性导电基板2与安装基板1的连接处的影响。具体地，可通过在整机上设置相应的限位结构，如限位柱，限位板等，使得第一弯折段211与第二弯折段212分别与不同的限位结构抵接，进而减弱凸起部21的弹性回复力；也可在组装时，将凸起部21插设于整机上相应设置的凹槽中，该凹槽可由整机上的其他结构形成，或是在整机的壳体上开设而成，通过凹槽的槽壁限制第一弯折段211以及第二弯折段212，进而限制凸起部21的弹性回复力；亦或是通过在柔性导电基板2与安装基板1之间增加紧固件的方式，提高柔性导电基板2与安装基板1之间连接的稳定性，该紧固件可为螺钉、弹簧钉等。
进一步地，如图2所示，在本申请的某一实施例中，柔性导电基板2还包括一水平段213，该水平段213的两侧分别与第一弯折段211及第二弯折段212连接，并平行于安装基板1设置。
水平段213设置于第一弯折段211及第二弯折段212远离安装基板1的一侧，且第一弯折段211及第二弯折段212倾斜设置，因此，第一弯折段211、第二弯折段212、水平段213及柔性导电基板2自身所在板面可近似看成一个梯台。为保证安装基板1的散热能力，相邻两安装基板1间的间距虽然缩短，但仍存有一定距离，通过水平段213的设置，可降低凸起部21相对于安装基板1的高度，进而减小了凸起部21的占用空间，有利于将整机做薄。
进一步地，第一弯折段211与水平段213之间、及第二弯折段212与水平段213之间形成有折痕。折痕的存在可减弱凸起部21的弹性回复力，以提高柔性导电基板2与安装基板1间连接的稳定性。且由于水平段213的设置，使得凸起部21的整体结构更为平缓，从而减弱凸起部21的弹性回复力，也能够提高柔性导电基板2与安装基板1之间连接的稳定性。
需要说明的是，在本申请的另一实施例中，水平段213也可不平行于安装基板1，且水平段213也可呈圆弧形设置，以使水平段213与第一弯折段211以及第二弯折段212之间过渡更为平滑，以减少对柔性导电基板2上的电极线的影响。
如图3所示，在本申请的某一实施例中，水平段213也可呈V字型设置，且水平段213向安装基板1所在的一侧凸起。将水平段213设置为V字型，相较于平行于安装基板1设置的水平段213，其优点在于，既能够减小凸起部21的高度，且水平段213占用的平面空间也更小，适用范围更广。
如图4所示，在本申请的某一实施例中，水平段213也可设置为波浪形，通过水平段213的连续弯折，可有效减小水平段213占用的平面空间，以适设置为不同的产品的需求，由于水平段213连续弯折，因此适设置为较为大型的产品中。
进一步地，如图5所示，本申请的某一实施例中，凸起部21呈图弧形设置。
凸起部21呈凸弧形设置的好处在于，首先由于柔性导电基板2弯折的部分较少，这样对于柔性导电基板2上电极线的影响相对较小，柔性导电基板2的导电性能更为稳定。
其次，由于柔性导电基板2能够发生形变的特性，凸起部21相应具有形变的能力，当凸起部21受到整机其他结构的抵压时，凸起部21弧形的表面不具有尖锐的部分，可减少凸起部21受到的伤害，且圆弧的结构易于力的传递，当凸起部21的某一侧或某一区域受到挤压后，凸起部21能够进一步发生形变，而提高凸起部21的稳定性。
再则，从加工难易度考虑，凸弧形设置的凸起部21，只需将相邻安装基板1相互靠近，即可使柔性导电基板2形成凸起部21，而无需对柔性导电基板2施加其他操作，因此，凸弧形设置的凸起部21，易于加工成型，便于大规模的生产制作。
结合图6与图7所示，柔性导电基板2设于安装基板1的邦定区11的相对侧或相邻侧。
在图1所示的实施例中，柔性导电基板2设置于安装基板1的邦定区11的相邻侧，在图6所示的实施例中，柔性导电基板2设置于安装基板1的邦定区11的相对侧。在实际生产的过程中，由于产品型号的不同，可以适应性改变柔性导电基板2设置的位置，以最大程度的减小导电基板占用的平面空间。
进一步地，该柔性导电基板2由柔性电路板制成。
柔性电路板（Flexible Printed Circuit 简称FPC）是以聚酰亚胺或聚酯薄膜为基材制成的一种具有高度可靠性，绝佳的可挠性印刷电路板，具有配线密度高、重量轻、厚度薄、弯折性好的特点。
本申请还提出一种显示面板，该显示面板包括电路板结构，该电路板结构的具体结构参照上述实施例，由于本显示面板采用了上述所有实施例的全部技术方案，因此至少具有上述实施例的技术方案所带来的所有效果，在此不再一一赘述。
具体地，在显示面板领域，PCB板（Printed Circuit Board 印制电路板）一般分为C-board与X-board，其中C-board主要负责接收系统端的输入信号，并输出数据信号与控制信号，X-board主要负责传输从C-board输出的数据信号与控制信号。针对不同的产品，C-board与X-board可以分别设置在两块PCB板上，也可集成于一块PCB板上。以目前的工艺，当C-board与X-board集成于一块PCB板上时，PCB板会变得很长。本申请所提供的显示面板，通过上述电路板结构，使得在将C-board与X-board集成于一块PCB板上时，PCB能够变窄或变短，减小了PCB板占用的空间，便于整机的设计。
以上所述仅为本申请的可选实施例，并非因此限制本申请的专利范围，凡是在本申请的发明构思下，利用本申请说明书及附图内容所作的等效结构变换，或直接/间接运用在其他相关的技术领域均包括在本申请的专利保护范围内。

Claims (20)

  1. 一种电路板结构，其中，所述电路板结构包括：
    安装基板，至少设有两块，设置为安装电器元件；以及
    柔性导电基板，设于相邻两所述安装基板之间，以电性连接两所述安装基板，且所述柔性导电基板向自身所在板面的一侧形成凸起部。
  2. 如权利要求1所述的电路板结构，其中，所述电路板结构包括多块所述柔性导电基板，每一所述柔性导电基板均形成有所述凸起部，且每一所述凸起部向所述安装基板的同一侧形成凸起。
  3. 如权利要求1所述的电路板结构，其中，所述电路板结构包括多块所述柔性导电基板，每一所述柔性导电基板均形成有所述凸起部，多个所述凸起部的朝向不同。
  4. 如权利要求1所述的电路板结构，其中，所述凸起部包括第一弯折段及第二弯折段，所述第一弯折段与所述第二弯折段的一端分别与一所述安装基板电性连接，另一端相互连接。
  5. 如权利要求4所述的电路板结构，其中，所述第一弯折段与所述第二弯折段等长，且所述第一弯折段与所述第二弯折段的倾角相等。
  6. 如权利要求5所述的电路板结构，其中，所述第一弯折段的倾角范围为45°-70°。
  7. 如权利要求6所述的电路板结构，其中，所述第一弯折段的倾角设置为60°。
  8. 如权利要求4所述的电路板结构，其中，所述第一弯折段与所述第二弯折段连接处形成有折痕。
  9. 如权利要求4所述的电路板结构，其中，所述柔性导电基板还包括一水平段，所述水平段的两侧分别与所述第一弯折段及所述第二弯折段连接，并平行于所述安装基板设置。
  10. 如权利要求9所述的电路板结构，其中，所述水平段与所述第一弯折段及所述第二弯折段之间形成有折痕。
  11. 如权利要求1所述的电路板结构，其中，所述凸起部呈凸弧形设置。
  12. 如权利要求1所述的电路板结构，其中，所述柔性导电基板由柔性电路板制成。
  13. 如权利要求1所述的电路板结构，其中，所述柔性导电基板设于所述安装基板的邦定区的相对侧或相邻侧。
  14. 一种电路板结构，其中，所述电路板结构包括：
    安装基板，至少设有两块，设置为安装电器元件；以及
    柔性导电基板，设于相邻两所述安装基板之间，以电性连接两所述安装基板，且所述柔性导电基板向自身所在板面的一侧形成凸起部，所述凸起部包括第一弯折段及第二弯折段，所述第一弯折段与所述第二弯折段的一端分别与一所述安装基板电性连接，另一端相互连接。
  15. 一种显示面板，其中，所述显示面板包括阵列基板，所述阵列基板包括：
    安装基板，至少设有两块，设置为安装电器元件；以及
    柔性导电基板，设于相邻两所述安装基板之间，以电性连接两所述安装基板，且所述柔性导电基板向自身所在板面的一侧形成凸起部。
  16. 如权利要求15所述的显示面板，其中，所述凸起部包括第一弯折段及第二弯折段，所述第一弯折段与所述第二弯折段的一端分别与一所述安装基板电性连接，另一端相互连接。
  17. 如权利要求16所述的显示面板，其中，所述第一弯折段与所述第二弯折段等长，且所述第一弯折段与所述第二弯折段的倾角相等。
  18. 如权利要求17所述的显示面板，其中，所述第一弯折段的倾角范围为45°-70°。
  19. 如权利要求16所述的显示面板，其中，所述第一弯折段与所述第二弯折段连接处形成有折痕。
  20. 如权利要求15所述的显示面板，其中，所述柔性导电基板设于所述安装基板的邦定区的相对侧或相邻侧。
PCT/CN2018/115866 2018-09-30 2018-11-16 电路板结构及显示面板 WO2020062492A1 (zh)

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CN1856213A (zh) * 2005-04-19 2006-11-01 日东电工株式会社 用于导管的柔性印刷电路板、使用其的导管及导管的制造方法
CN101442878A (zh) * 2007-11-21 2009-05-27 富士胶片株式会社 挠性配线板、制造该配线板的方法以及成像装置
JP2010040720A (ja) * 2008-08-04 2010-02-18 Sharp Corp フレキシブルプリント配線板、電子機器モジュールおよび電子情報機器
CN101836519A (zh) * 2008-03-26 2010-09-15 揖斐电株式会社 刚挠性电路板及其制造方法
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CN1856213A (zh) * 2005-04-19 2006-11-01 日东电工株式会社 用于导管的柔性印刷电路板、使用其的导管及导管的制造方法
CN101442878A (zh) * 2007-11-21 2009-05-27 富士胶片株式会社 挠性配线板、制造该配线板的方法以及成像装置
CN101836519A (zh) * 2008-03-26 2010-09-15 揖斐电株式会社 刚挠性电路板及其制造方法
JP2010040720A (ja) * 2008-08-04 2010-02-18 Sharp Corp フレキシブルプリント配線板、電子機器モジュールおよび電子情報機器
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