WO2020037741A1 - Tft阵列基板及其制作方法 - Google Patents

Tft阵列基板及其制作方法 Download PDF

Info

Publication number
WO2020037741A1
WO2020037741A1 PCT/CN2018/105545 CN2018105545W WO2020037741A1 WO 2020037741 A1 WO2020037741 A1 WO 2020037741A1 CN 2018105545 W CN2018105545 W CN 2018105545W WO 2020037741 A1 WO2020037741 A1 WO 2020037741A1
Authority
WO
WIPO (PCT)
Prior art keywords
tft array
passivation layer
pixel
photoresist
blue sub
Prior art date
Application number
PCT/CN2018/105545
Other languages
English (en)
French (fr)
Inventor
李培宏
宋江江
Original Assignee
武汉华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US16/342,544 priority Critical patent/US20200057329A1/en
Publication of WO2020037741A1 publication Critical patent/WO2020037741A1/zh

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509Filters, e.g. light shielding masks
    • G02F1/133514Colour filters
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/1368Active matrix addressed cells in which the switching element is a three-electrode device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259Multistep manufacturing methods
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259Multistep manufacturing methods
    • H01L27/1288Multistep manufacturing methods employing particular masking sequences or specially adapted masks, e.g. half-tone mask
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136222Colour filters incorporated in the active matrix substrate
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136286Wiring, e.g. gate line, drain line
    • G02F1/136295Materials; Compositions; Manufacture processes

Abstract

一种TFT阵列基板及其制作方法,TFT阵列基板包括TFT阵列层(11)、彩色滤光层(12)和钝化层(13),彩色滤光层(12)包括蓝色子像素(123),钝化层(13)包括钝化层本体(131)和凸设在钝化层本体(131)上的凸部(132),通过在彩色滤光层(12)的蓝色子像素(123)的两侧区域形成钝化层(13)的凸部(132),增加了蓝色子像素(123)两侧区域的光阻,使得钝化层(13)厚度均匀化,进而减少色度差异。

Description

TFT阵列基板及其制作方法 技术领域
本申请涉及一种显示技术领域,特别涉及一种TFT阵列基板及其制作方法。
背景技术
液晶显示装置(Liquid  Crystal  Display,LCD)具有机身薄、省电、无辐射等众多优点,得到了广泛的应用。比如液晶电视、移动电话、PDA、计算机屏幕和笔记本电脑屏幕等。
通常薄膜晶体管液晶显示器包括彩色滤光片和薄膜晶体管阵列基板(TFT基板)以及液晶层。其中,彩色滤光片提供红/绿/蓝色彩,目前采用光刻胶进行制作。
因为光刻胶的流平性问题,导致实际制作出的子像素的图形呈凹形(bowl shape),凹陷的幅度超过0.5微米,导致子像素中心位置和边缘位置色度差异过大,大于0.004,规格为±0.002,导致产品色彩不佳,其中以蓝色子像素最为明显。
技术问题
本申请实施例提供一种TFT阵列基板及其制作方法;以解决现有的TFT阵列基板的蓝色子像素呈凹形,导致蓝色子像素中心位置和边缘位置色度差异过大,从而影响产品色彩的技术问题。
技术解决方案
本申请实施例提供一种TFT阵列基板,其包括:
TFT阵列层;
彩色滤光层,设置在所述TFT阵列层上,包括多个色阻单元,所述多个色阻单元分别填充红色光刻胶、绿色光刻胶和蓝色光刻胶,且对应形成红色子像素、绿色子像素和蓝色子像素,蓝色子像素两侧区域的厚度大于蓝色子像素中间区域的厚度;
钝化层,设置在所述彩色滤光层上,包括覆盖所述彩色滤光层的钝化层本体和凸设在所述钝化层本体上的凸部;以及
像素电极层,设置在所述钝化层上;
其中所述凸部对应设置在所述蓝色子像素两侧区域的上方,所述凸部的厚度为0.3微米~0.5微米,所述凸部的宽度为所述蓝色子像素宽度的1/5~1/4。
在本申请的TFT阵列基板中,所述凸部的截面形状为矩形。
在本申请的TFT阵列基板中,所述钝化层的材料为可溶性聚四氟乙烯。
本申请实施例提供另一种TFT阵列基板,其包括:
TFT阵列层;
彩色滤光层,设置在所述TFT阵列层上,包括多个色阻单元,所述多个色阻单元分别填充红色光刻胶、绿色光刻胶和蓝色光刻胶,且对应形成红色子像素、绿色子像素和蓝色子像素,蓝色子像素两侧区域的厚度大于蓝色子像素中间区域的厚度;
钝化层,设置在所述彩色滤光层上,包括覆盖所述彩色滤光层的钝化层本体和凸设在所述钝化层本体上的凸部;以及
像素电极层,设置在所述钝化层上;
其中所述凸部对应设置在所述蓝色子像素两侧区域的上方。
在本申请的另一TFT阵列基板中,所述凸部的厚度为0.3微米~0.5微米。
在本申请的另一TFT阵列基板中,所述凸部的宽度为蓝色子像素宽度的1/5~1/4。
在本申请的另一TFT阵列基板中,所述凸部的截面形状为矩形。
在本申请的另一TFT阵列基板中,所述钝化层的材料为可溶性聚四氟乙烯。
本申请还涉及一种TFT阵列基板的制作方法,其包括:
S1:提供一衬底基板,在所述衬底基板上形成TFT阵列层;
S2:在所述TFT阵列层上形成多个色阻单元,得到彩色滤光层,所述多个色阻单元分别填充红色光刻胶、绿色光刻胶和蓝色光刻胶,对应形成红色子像素、绿色子像素和蓝色子像素,蓝色子像素两侧区域的厚度大于蓝色子像素中间区域的厚度;
S3:在所述彩色滤光层上涂布光刻胶;
S4:通过半色调掩模板对所述光刻胶进行图案化处理,得到钝化层,以使所述钝化层对应于所述蓝色子像素两侧区域的位置形成一凸部,
所述钝化层包括覆盖所述彩色滤光层的钝化层本体和设置在所述钝化层本体上的所述凸部;
S5:在所述钝化层上形成像素电极层。
在本申请的TFT阵列基板的制作方法中,所述半色调掩模板包括第一透光部和第二透光部,所述第一透光部的透光率大于所述第二透光部的透光率,所述光刻胶为负性光刻胶,所述步骤S4包括以下步骤:
S41:将所述第一透光部设置在所述光刻胶对应于所述蓝色子像素的两侧区域的上方,将所述第二透光部设置在所述光刻胶对应于除所述蓝色子像素两侧区域外的其他区域的上方;
S42:透过所述半色调掩模板对所述光刻胶进行曝光和显影处理,得到钝化层,所述钝化层包括覆盖所述彩色滤光层的钝化层本体和对应于所述蓝色子像素两侧区域的凸部。
在本申请的TFT阵列基板的制作方法中,所述凸部的厚度为0.3微米~0.5微米。
在本申请的TFT阵列基板的制作方法中,所述凸部的宽度为蓝色子像素宽度的1/5~1/4。
在本申请的TFT阵列基板的制作方法中,所述凸部的截面形状为矩形。
在本申请的TFT阵列基板的制作方法中,所述钝化层的材料为可溶性聚四氟乙烯。
在本申请的TFT阵列基板的制作方法中,所述TFT阵列层通过光刻工艺形成。
有益效果
相较于现有技术的TFT阵列基板,本申请的TFT阵列基板及其制作方法通过在彩色滤光层的蓝色子像素的两侧区域形成钝化层的凸部,增加了蓝色子像素两侧区域的光阻,使得钝化层厚度均匀化,进而减少色度差异;另外,凸部可将蓝色光刻胶散射的光聚合,减少光透过率的损失;解决了现有的TFT阵列基板的蓝色子像素呈凹形,导致蓝色子像素中心位置和边缘位置色度差异过大,从而影响产品色彩的技术问题。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案,下面对实施例中所需要使用的附图作简单的介绍。下面描述中的附图仅为本申请的部分实施例,对于本领域普通技术人员而言,在不付出创造性劳动的前提下,还可以根据这些附图获取其他的附图。
图1为本申请的TFT阵列基板的实施例的结构示意图;
图2为本申请的TFT阵列基板的制作方法的实施例的流程图;
图3为本申请的TFT阵列基板的制作方法的实施例的步骤S1的示意图;
图4为本申请的TFT阵列基板的制作方法的实施例的步骤S2的示意图;
图5为本申请的TFT阵列基板的制作方法的实施例的步骤S3的示意图;
图6为本申请的TFT阵列基板的制作方法的实施例的步骤S4的示意图;
图7为本申请的TFT阵列基板的制作方法的实施例中钝化层对应的掩膜板的结构示意图;
图8为本申请的TFT阵列基板的制作方法的实施例的步骤S5的示意图。
本发明的实施方式
请参照附图中的图式,其中相同的组件符号代表相同的组件。以下的说明是基于所例示的本申请具体实施例,其不应被视为限制本申请未在此详述的其它具体实施例。
请参照图1,图1为本申请的TFT阵列基板的实施例的结构示意图。
本申请的实施例的TFT阵列基板包括TFT阵列层11、彩色滤光层12、钝化层13和像素电极层14。
具体的,彩色滤光层12设置在TFT阵列层11上,其包括多个色阻单元。多个色阻单元分别填充红色光刻胶、绿色光刻胶和蓝色光刻胶,且对应形成红色子像素121、绿色子像素122和蓝色子像素123。蓝色子像素123两侧区域12a的厚度大于蓝色子像素123中间区域的厚度。钝化层13设置在彩色滤光层12上。钝化层13包括覆盖彩色滤光层12的钝化层本体131和凸设在钝化层本体131上的凸部132。像素电极层14设置在钝化层13上。
其中,凸部132对应设置在蓝色子像素123两侧区域12a的上方。
本申请的TFT阵列基板通过在彩色滤光层12的蓝色子像素123的两侧区域12a形成钝化层13的凸部132,增加了蓝色子像素123两侧区域12a的光阻,使得钝化层13整体的厚度均匀化,进而减少色度差异;另外,凸部132可将蓝色光刻胶散射的光聚合,减少光透过率的损失。
另外,彩色滤光层12中对于填充红色光刻胶、绿色光刻胶和蓝色光刻胶的顺序不做限定。
在本申请的TFT阵列基板的实施例中,凸部132的厚度为0.3微米~0.5微米。凸部132的主要作用在于增加蓝色子像素123两侧区域12a的光阻并将蓝色子像素123散射的光聚合,以减少光透过率的损失。当凸部132的厚度小于0.3微米时,凸部132所增加的光阻不足,仍然会出现蓝色子像素的两侧区域和中间区域存在色度差异;当凸部132的厚度大于0.5微米时,凸部132对蓝色子像素123增加的色阻过大,同样导致蓝色子像素的两侧区域和中间区域存在色度差异;因此当凸部132的厚度为0.3微米~0.5微米时,凸部132增加蓝色子像素123两侧区域12a的光阻正好可以弥补蓝色子像素123的两侧区域12a和中间区域的色度差异,从而达到色度均匀化的目的。
而在实际制作中,蓝色子像素的两侧区域的厚度可能会不同,因此,最优的方案是相对的凸部132的厚度也应该相对不同,但是由于现在工艺的限制,凸部132的厚度采用一致处理方案,即取相对于蓝色子像素的两侧区域的两个凸部中,满足两侧区域中最高厚度所对应的凸部,作为整体凸部厚度的厚度值。
凸部132的截面形状为矩形。
另外,凸部132的宽度为蓝色子像素123宽度的1/5~1/4。由于蓝色子像素的两侧区域12a存在色度差异较大部分的宽度为蓝色子像素123宽度的1/5~1/4,其他区域可以忽略不计。因此针对该范围进行增加蓝色子像素两侧区域的色阻,故将凸部132的宽度设定为蓝色子像素123宽度的1/5~1/4。
在本申请的TFT阵列基板的实施例中,钝化层13的材料为可溶性聚四氟乙烯。
请参照图2-图8,本申请还涉及一种TFT阵列基板的制作方法,所述制作方法的步骤包括:
S1:提供一衬底基板,在所述衬底基板上形成TFT阵列层;
S2:在所述TFT阵列层上形成多个色阻单元,得到彩色滤光层,
所述多个色阻单元分别填充红色光刻胶、绿色光刻胶和蓝色光刻胶,对应形成红色子像素、绿色子像素和蓝色子像素,蓝色子像素两侧区域的厚度大于蓝色子像素中间区域的厚度;
S3:在所述彩色滤光层上涂布光刻胶;
S4:通过半色调掩模板对所述光刻胶进行图案化处理,得到钝化层,以使所述钝化层对应于所述蓝色子像素两侧区域的位置形成一凸部,
所述钝化层包括覆盖所述彩色滤光层的钝化层本体和设置在所述钝化层本体上的所述凸部;
S5:在所述钝化层上形成像素电极层。
在步骤S1中,请参照图3,通过成膜、黄光、蚀刻等一系列制程一次在衬底基板(图未示出)上形成TFT阵列层11。
在步骤S2中,请参照图4,在TFT阵列层11上依次形成多个色阻单元,得到彩色滤光层12,多个色阻单元分别填充红色光刻胶、绿色光刻胶和蓝色光刻胶,对应形成红色子像素121、绿色子像素122和蓝色子像素123,蓝色子像素123两侧区域12a的厚度大于蓝色子像素123中间区域的厚度。
具体的,通过光刻制程,在TFT阵列层11上形成彩色滤光层12。彩色滤光层12中对于填充红色光刻胶、绿色光刻胶和蓝色光刻胶的顺序不做限定。
在步骤S3中,请参照图5,在彩色滤光层12上涂布光刻胶,用于形成钝化层13,其中光刻胶为负性光刻胶或正性光刻胶均可,在本申请中的实施例中以负性光刻胶为例进行说明。
在步骤S4中,请参照图6,通过半色调掩模板对光刻胶图案化处理,得到具有不同厚度部分的钝化层13。其中钝化层13对应于蓝色子像素123两侧区域12a的位置形成一凸部132,以增加蓝色子像素123两侧区域12a的色阻;钝化层13的其他区域的高度小于对应蓝色子像素123两侧区域的高度,以使钝化层13对应于整个蓝色子像素123的厚度均匀化,从而达到均化色度的效果。
因此,钝化层13包括覆盖彩色滤光层12的钝化层本体131和设置在钝化层本体131上的凸部132,其中钝化层本体131和凸部132之间存在高度差,即凸部132的高度高于钝化层本体131的高度。
其中,凸部132的厚度为0.3微米~0.5微米。凸部132的宽度为蓝色子像素123宽度的1/5~1/4。凸部132的截面形状为矩形。
具体的,请一并参照图7,半色调掩模板20包括第一透光部21和第二透光部22。第一透光部21的透光率大于第二透光部22的透光率。在本实施例中,第一透光部21为全透光,第二透光部22的透光率大于0。步骤S4包括以下步骤:
步骤S41:将第一透光部21设置在光刻胶对应于蓝色子像素123的两侧区域12a的上方,将第二透光部22设置在光刻胶对应于除蓝色子像素123两侧区域12a外的其他区域的上方;
步骤S42:透过半色调掩模板20对光刻胶进行曝光和显影处理,得到钝化层13。钝化层13包括覆盖彩色滤光层12的钝化层本体131和对应于蓝色子像素123两侧区域12a的凸部132。
通过半色调掩模板20对光刻胶进行图案化处理,得到对应于蓝色子像素123两侧区域12a的钝化层132的凸部132。一方面增加了蓝色子像素123两侧区域12a的光阻,使得钝化层13厚度均匀化,进而减少色度差异;另一方面,凸部132可将蓝色光刻胶(蓝色子像素)散射的光聚合,减少光透过率的损失,提高了产品的色彩表现。
在步骤S5中,请参照图8,在钝化层13上形成像素电极层14。
至此,TFT阵列基板已制作完毕。
本申请还提供一种具有上述实施例的TFT阵列基板的COA型液晶显示面板。所述COA液晶显示面板包括上基板、TFT阵列基板和设置在上基板和TFT阵列基板之间的液晶层。
其中COA(Color  filter  On  Array)技术是一种将彩色滤光片基板的色阻层制备于TFT阵列基板上的技术,即将彩色滤光层与TFT阵列层设置在同侧。
相较于现有技术的TFT阵列基板,本申请的TFT阵列基板及其制作方法通过在彩色滤光层的蓝色子像素的两侧区域形成钝化层的凸部,增加了蓝色子像素两侧区域的光阻,使得钝化层厚度均匀化,进而减少色度差异;另外,凸部可将蓝色光刻胶散射的光聚合,减少光透过率的损失,且提高了产品的色彩表现质量;解决了现有的TFT阵列基板的蓝色子像素呈凹形,导致蓝色子像素中心位置和边缘位置色度差异过大,从而影响产品色彩的技术问题。
虽然本申请已以实施例揭露如上,实施例前的序号,如“第一”、“第二”等仅为描述方便而使用,对本申请各实施例的顺序不造成限制。并且,上述实施例并非用以限制本申请,本领域的普通技术人员,在不脱离本申请的精神和范围内,均可作各种更动与润饰,因此本申请的保护范围以权利要求界定的范围为准。

Claims (15)

  1. 一种TFT阵列基板,其包括:
    TFT阵列层;
    彩色滤光层,设置在所述TFT阵列层上,包括多个色阻单元,所述多个色阻单元分别填充红色光刻胶、绿色光刻胶和蓝色光刻胶,且对应形成红色子像素、绿色子像素和蓝色子像素,蓝色子像素两侧区域的厚度大于蓝色子像素中间区域的厚度;
    钝化层,设置在所述彩色滤光层上,包括覆盖所述彩色滤光层的钝化层本体和凸设在所述钝化层本体上的凸部;以及
    像素电极层,设置在所述钝化层上;
    其中所述凸部对应设置在所述蓝色子像素两侧区域的上方,所述凸部的厚度为0.3微米~0.5微米,所述凸部的宽度为所述蓝色子像素宽度的1/5~1/4。
  2. 根据权利要求1所述的TFT阵列基板,其中,所述凸部的截面形状为矩形。
  3. 根据权利要求1所述的TFT阵列基板,其中,所述钝化层的材料为可溶性聚四氟乙烯。
  4. 一种TFT阵列基板,其包括:
    TFT阵列层;
    彩色滤光层,设置在所述TFT阵列层上,包括多个色阻单元,所述多个色阻单元分别填充红色光刻胶、绿色光刻胶和蓝色光刻胶,且对应形成红色子像素、绿色子像素和蓝色子像素,蓝色子像素两侧区域的厚度大于蓝色子像素中间区域的厚度;
    钝化层,设置在所述彩色滤光层上,包括覆盖所述彩色滤光层的钝化层本体和凸设在所述钝化层本体上的凸部;以及
    像素电极层,设置在所述钝化层上;
    其中所述凸部对应设置在所述蓝色子像素两侧区域的上方。
  5. 根据权利要求4所述的TFT阵列基板,其中,所述凸部的厚度为0.3微米~0.5微米。
  6. 根据权利要求4所述的TFT阵列基板,其中,所述凸部的宽度为蓝色子像素宽度的1/5~1/4。
  7. 根据权利要求4所述的TFT阵列基板,其中,所述凸部的截面形状为矩形。
  8. 根据权利要求4所述的TFT阵列基板,其中,所述钝化层的材料为可溶性聚四氟乙烯。
  9. 一种TFT阵列基板的制作方法,其包括:
    S1:提供一衬底基板,在所述衬底基板上形成TFT阵列层;
    S2:在所述TFT阵列层上形成多个色阻单元,得到彩色滤光层;所述多个色阻单元分别填充红色光刻胶、绿色光刻胶和蓝色光刻胶,对应形成红色子像素、绿色子像素和蓝色子像素,蓝色子像素两侧区域的厚度大于蓝色子像素中间区域的厚度;
    S3:在所述彩色滤光层上涂布光刻胶;
    S4:通过半色调掩模板对所述光刻胶进行图案化处理,得到钝化层,以使所述钝化层对应于所述蓝色子像素两侧区域的位置形成一凸部;所述钝化层包括覆盖所述彩色滤光层的钝化层本体和设置在所述钝化层本体上的所述凸部;
    S5:在所述钝化层上形成像素电极层。
  10. 根据权利要求9所述的TFT阵列基板的制作方法,其中,所述半色调掩模板包括第一透光部和第二透光部,所述第一透光部的透光率大于所述第二透光部的透光率,所述光刻胶为负性光刻胶,所述步骤S4包括以下步骤:
    S41:将所述第一透光部设置在所述光刻胶对应于所述蓝色子像素的两侧区域的上方,将所述第二透光部设置在所述光刻胶对应于除所述蓝色子像素两侧区域外的其他区域的上方;
    S42:透过所述半色调掩模板对所述光刻胶进行曝光和显影处理,得到钝化层,所述钝化层包括覆盖所述彩色滤光层的钝化层本体和对应于所述蓝色子像素两侧区域的凸部。
  11. 根据权利要求9所述的TFT阵列基板的制作方法,其中,所述凸部的厚度为0.3微米~0.5微米。
  12. 根据权利要求9所述的TFT阵列基板的制作方法,其中,所述凸部的宽度为蓝色子像素宽度的1/5~1/4。
  13. 根据权利要求9所述的TFT阵列基板的制作方法,其中,所述凸部的截面形状为矩形。
  14. 根据权利要求9所述的TFT阵列基板的制作方法,其中,所述钝化层的材料为可溶性聚四氟乙烯。
  15. 根据权利要求9所述的TFT阵列基板的制作方法,其中,所述TFT阵列层通过光刻工艺形成。
PCT/CN2018/105545 2018-08-20 2018-09-13 Tft阵列基板及其制作方法 WO2020037741A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/342,544 US20200057329A1 (en) 2018-08-20 2018-09-13 Thin film transistor array substrate and manufacturing method of same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201810948985.9 2018-08-20
CN201810948985.9A CN109143700B (zh) 2018-08-20 2018-08-20 Tft阵列基板及其制作方法

Publications (1)

Publication Number Publication Date
WO2020037741A1 true WO2020037741A1 (zh) 2020-02-27

Family

ID=64790522

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/105545 WO2020037741A1 (zh) 2018-08-20 2018-09-13 Tft阵列基板及其制作方法

Country Status (2)

Country Link
CN (1) CN109143700B (zh)
WO (1) WO2020037741A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111769144B (zh) * 2020-06-24 2022-07-12 武汉华星光电半导体显示技术有限公司 波浪形起伏走线的制作方法、掩膜板及显示装置
CN114355685B (zh) * 2021-12-30 2023-01-10 绵阳惠科光电科技有限公司 阵列基板、阵列基板的制备方法和显示面板

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10186378A (ja) * 1996-12-26 1998-07-14 Sanyo Electric Co Ltd 液晶表示装置
CN202141873U (zh) * 2011-07-22 2012-02-08 京东方科技集团股份有限公司 彩色滤光片及液晶面板
CN104166280A (zh) * 2014-07-24 2014-11-26 京东方科技集团股份有限公司 一种阵列基板及其制备方法、显示装置
CN106324880A (zh) * 2016-10-12 2017-01-11 深圳市华星光电技术有限公司 液晶基板的制作方法
US20180004036A1 (en) * 2016-06-30 2018-01-04 Samsung Display Co., Ltd. Display device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107290894B (zh) * 2017-07-28 2020-03-17 深圳市华星光电技术有限公司 Coa型液晶显示面板及其制作方法
CN108646490B (zh) * 2018-06-11 2021-01-26 Tcl华星光电技术有限公司 Coa型阵列基板及其制作方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10186378A (ja) * 1996-12-26 1998-07-14 Sanyo Electric Co Ltd 液晶表示装置
CN202141873U (zh) * 2011-07-22 2012-02-08 京东方科技集团股份有限公司 彩色滤光片及液晶面板
CN104166280A (zh) * 2014-07-24 2014-11-26 京东方科技集团股份有限公司 一种阵列基板及其制备方法、显示装置
US20180004036A1 (en) * 2016-06-30 2018-01-04 Samsung Display Co., Ltd. Display device
CN106324880A (zh) * 2016-10-12 2017-01-11 深圳市华星光电技术有限公司 液晶基板的制作方法

Also Published As

Publication number Publication date
CN109143700A (zh) 2019-01-04
CN109143700B (zh) 2020-12-04

Similar Documents

Publication Publication Date Title
WO2017008369A1 (zh) Coa型液晶显示面板及其制作方法
CN107272232B (zh) 一种液晶显示面板的制造方法
WO2016086539A1 (zh) 液晶面板及其制作方法
US8724058B2 (en) Color filter substrate with black matrix on undercut groove and fabricating method thereof
WO2018120463A1 (zh) 彩色滤光层基板的制造方法及其应用的液晶面板的制造方法
US20170363922A1 (en) Liquid crystal display panel, the manufacturing method thereof and a display apparatus
US10197845B2 (en) Manufacturing method of color filter substrate and manufacturing method of liquid crystal panel
WO2020156040A1 (zh) 彩膜基板、显示装置以及彩膜基板制备方法
WO2018214198A1 (zh) 具有一体式黑色矩阵与光阻间隔物的液晶面板的制作方法及光罩
WO2017152469A1 (zh) 彩膜基板的制作方法及制得的彩膜基板
WO2019128959A1 (zh) 液晶显示面板及其制作方法
WO2019075900A1 (zh) 液晶显示面板及其制作方法
WO2019085224A1 (zh) 阵列基板及显示面板
US20220342248A1 (en) Display substrate and manufacturing method therefor, and display device
WO2020228168A1 (zh) 阵列基板及其制作方法
WO2018176603A1 (zh) 光罩及其主动开关阵列基板的制造方法
US11262632B2 (en) Active switch array substrate, manufacturing method thereof and liquid crystal display panel applying the same
JP2007233059A (ja) 液晶表示装置及びその製造方法
WO2020037741A1 (zh) Tft阵列基板及其制作方法
WO2017031779A1 (zh) 阵列基板的制作方法及阵列基板
WO2018201545A1 (zh) 光罩及其应用于主动开关阵列基板的制造方法
CN108646490B (zh) Coa型阵列基板及其制作方法
WO2021134833A1 (zh) 一种阵列基板制备方法、阵列基板及液晶显示面板
CN106200100A (zh) 显示面板及其制造方法、显示装置
US20200089032A1 (en) Color filter, and manufacturing method thereof and display panel

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18930632

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18930632

Country of ref document: EP

Kind code of ref document: A1