WO2020156040A1 - 彩膜基板、显示装置以及彩膜基板制备方法 - Google Patents

彩膜基板、显示装置以及彩膜基板制备方法 Download PDF

Info

Publication number
WO2020156040A1
WO2020156040A1 PCT/CN2020/070432 CN2020070432W WO2020156040A1 WO 2020156040 A1 WO2020156040 A1 WO 2020156040A1 CN 2020070432 W CN2020070432 W CN 2020070432W WO 2020156040 A1 WO2020156040 A1 WO 2020156040A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
substrate
display area
color resist
color filter
Prior art date
Application number
PCT/CN2020/070432
Other languages
English (en)
French (fr)
Inventor
于宪书
郭磊
Original Assignee
京东方科技集团股份有限公司
合肥京东方显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 合肥京东方显示技术有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/962,824 priority Critical patent/US11474402B2/en
Publication of WO2020156040A1 publication Critical patent/WO2020156040A1/zh
Priority to US17/930,757 priority patent/US11829040B2/en

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136222—Colour filters incorporated in the active matrix substrate
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133512—Light shielding layers, e.g. black matrix
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133388—Constructional arrangements; Manufacturing methods with constructional differences between the display region and the peripheral region
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133514—Colour filters
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136209—Light shielding layers, e.g. black matrix, incorporated in the active matrix substrate, e.g. structurally associated with the switching element

Definitions

  • the present disclosure relates to the field of display technology, in particular to a color filter substrate, a display device, and a method for preparing a color filter substrate.
  • the present disclosure discloses a color filter substrate including a display area and a non-display area.
  • the color filter substrate in the non-display area includes: a base; and a photoresist layer disposed on the base;
  • a flat layer disposed on the side of the photoresist layer away from the substrate;
  • a support layer provided on the side of the flat layer away from the substrate
  • the total thickness of the photoresist layer, the flat layer and the support layer is greater than or equal to a first thickness threshold.
  • the photoresist layer includes a light shielding layer and a color resist layer laminated on the substrate, and the light shielding layer is disposed close to the substrate.
  • the color resist layer includes a red color resist layer, a green color resist layer, and a blue color resist layer.
  • the thickness of the color resist layer is greater than or equal to 1.5 ⁇ m and less than or equal to 2.5 ⁇ m.
  • the thickness of the light shielding layer is greater than or equal to 0.8 ⁇ m and less than or equal to 1.6 ⁇ m.
  • the thickness of the flat layer is greater than or equal to 0.5 ⁇ m and less than or equal to 1.5 ⁇ m.
  • the thickness of the support layer is greater than or equal to 1 ⁇ m and less than or equal to 2.5 ⁇ m.
  • the color filter substrate of the display area includes: the substrate, a color resist layer provided on the substrate, a flat layer provided on the side of the color resist layer away from the substrate, and The support layer on the side of the flat layer away from the base, wherein the first thickness threshold is equal to the total thickness of the color resist layer, the flat layer and the support layer of the color filter substrate in the display area minus 1.1 um.
  • the present disclosure also discloses a display panel.
  • the display device includes an array substrate and a color filter substrate as described above, which are arranged in alignment, and are filled between the array substrate and the color filter substrate.
  • the liquid crystal layer is provided.
  • the distance between the flat layer of the color filter substrate in the non-display area and the surface on the side facing away from the base and the array substrate is greater than or equal to the thickness of the support layer and less than or equal to the second thickness Threshold, the second thickness threshold is less than or equal to 2.5 ⁇ m.
  • the distance between the support layer of the color filter substrate in the non-display area and the array substrate on the side facing away from the base is less than or equal to a third thickness threshold, and the third thickness threshold is less than 0.2 ⁇ m .
  • a method for preparing a color filter substrate wherein the color filter substrate includes a non-display area and a display area, and the method includes: forming a light-shielding layer on the base for the non-display area, and A color resist layer is prepared in the display area, a flat layer is coated on the color resist layer, and a support layer is made on the flat layer.
  • preparing a color resist layer for the non-display area on the light shielding layer includes preparing one or more of a red color resist layer, a blue color resist layer, and a green color resist layer on the light shield layer for the non-display area.
  • preparing a color resist layer for the non-display area on the light-shielding layer includes after the color resist layer is made on the light-shielding layer for the display area, moving the mask of the color resist layer to the non-display area to target the light-shielding layer The color resist layer is prepared in the non-display area.
  • the thickness of the light shielding layer, the color resist layer, the flat layer and the support layer in the non-display area is greater than or equal to a first thickness threshold.
  • the color filter substrate of the display area includes: the substrate, a color resist layer provided on the substrate, a flat layer provided on the side of the color resist layer away from the substrate, and The support layer on the side of the flat layer away from the base, wherein the first thickness threshold is equal to the total thickness of the color resist layer, the flat layer and the support layer of the color filter substrate in the display area minus 1.1 um.
  • FIG. 1 shows a schematic cross-sectional structure diagram of a color filter substrate provided by related technologies
  • FIG. 2a shows a schematic cross-sectional structure diagram of a color filter substrate provided by an embodiment of the present application
  • FIG. 2b shows a schematic cross-sectional structure diagram of another color filter substrate provided by an embodiment of the present application.
  • FIG. 3 shows a schematic cross-sectional structure diagram of a light-shielding layer in a method for preparing a color filter substrate provided by an embodiment of the present application
  • FIG. 4 shows a schematic diagram of a cross-sectional structure of a blue color resist layer in a method for preparing a color filter substrate provided by an embodiment of the present application
  • FIG. 5 shows a schematic diagram of a cross-sectional structure of a green color resist layer in a method for preparing a color filter substrate provided by an embodiment of the present application
  • FIG. 6 shows a schematic diagram of a cross-sectional structure of a red color resist layer in a method for preparing a color filter substrate provided by an embodiment of the present application
  • FIG. 7 shows a schematic cross-sectional structure diagram of a flat layer produced in a method for preparing a color filter substrate according to an embodiment of the present application
  • FIG. 8 shows a schematic diagram of a cross-sectional structure of a support layer in a method for preparing a color filter substrate provided by an embodiment of the present application
  • FIG. 9 shows a schematic cross-sectional structure diagram of a display device provided by an embodiment of the present application.
  • the present application provides a color filter substrate and a display device, wherein the color filter substrate includes a display area and a non-display area, and the color filter substrate in the non-display area includes: a substrate; and a photoresist layer disposed on the substrate; A flat layer disposed on the side of the photoresist layer away from the substrate; a support layer disposed on the side of the flat layer away from the substrate; wherein the photoresist layer, the flat layer, and the support layer The total thickness of is greater than or equal to the first thickness threshold.
  • the thickness of the color filter substrate in the non-display area By increasing the thickness of the color filter substrate in the non-display area, the peripheral cell thickness of the display panel formed by the combination of the color filter substrate and the array substrate is reduced, the peripheral liquid crystal filling amount is reduced, and the compression zone and non-compression zone of the display panel are reduced.
  • the thickness of the color filter substrate in the non-display area can be increased to reduce the gap between the support layer and the array substrate, improve the peripheral support force, enhance the resistance to deformation of the display panel, and improve the periphery Poor light leakage in the dark state.
  • the peripheral area of the traditional color film substrate (the BM (Black Matrix) size area in Figure 1) is laminated on the substrate 20 with a black matrix material layer 11, a protective OC (overcoat) layer 12, and a supporting spacer.
  • the color filter substrate in the display area includes: a base 20; and a color resist layer 2111 (for example, including arranged RGB color resist layers) disposed on the base 20. Among them, a black matrix 2112 is provided on the substrate 20.
  • the color filter substrate in the display area further includes: a flat layer 2113 disposed on the color resist layer 2111 on the side facing away from the base, and a support layer 2114 disposed on the flat layer 2113 on the side facing away from the base.
  • the existing color filter substrate has a thinner peripheral film thickness, which makes the BM Size area around the formed screen have a larger vacant volume, resulting in more surrounding liquid crystal filling.
  • the PS layer 13 and the array of the color filter substrate in the BM Size area There is a gap of d1 of about 1.1um between the substrate 19 (for example, the substrate 40 and the thin film transistor layer 30), which results in insufficient peripheral support.
  • the force on the periphery of the screen is uneven, the deformation of the glass substrate is large and the liquid crystal molecules are arranged disorderly , Resulting in poor peripheral light leakage.
  • the color filter substrate includes a display area (AA area) and a non-display area (BM Size area).
  • AA area display area
  • BM Size area non-display area
  • the configuration of the display area is similar to that of Fig. 1 and will not be repeated here.
  • the color filter substrate in the display area includes: a base 20; and a color resist layer 2111 (for example, including arranged RGB color resist layers) disposed on the base 20. Among them, a black matrix 2112 is provided on the substrate 20.
  • the color filter substrate of the display area further includes: a flat layer 2113 disposed on the color resist layer 2111 on the side away from the base, and a support layer 2114 disposed on the flat layer 2113 on the side away from the base.
  • the color filter substrate in the non-display area includes: a substrate 20; and a photoresist layer 21 disposed on the substrate 20; a flat layer 22 disposed on the side of the photoresist layer 21 away from the substrate 20; and a flat layer 22 disposed on the side away from the substrate 20
  • the supporting layer 23 wherein the total thickness of the photoresist layer 21, the flat layer 22 and the supporting layer 23 is greater than or equal to the first thickness threshold.
  • the first thickness threshold is equal to the total thickness of the black matrix 2112, the flat layer 2113 and the support layer 2114 in the display area.
  • the first thickness threshold is equal to the total thickness of the color resist layer 2111, the flat layer 2113 and the support layer 2114 of the color filter substrate of the display area minus 1.1 um.
  • the support layer in the non-display area and the support layer in the display area are formed in the same layer in the same preparation process, and the thickness of each spacer PS can be set according to actual needs.
  • the base 20 may be glass or a flexible substrate.
  • the photoresist layer 21 may only include a light-shielding layer (such as a black photoresist layer), and may also include a color resist layer (such as a color photoresist layer) disposed on the side of the light-shielding layer away from the substrate 20.
  • a light-shielding layer such as a black photoresist layer
  • a color resist layer such as a color photoresist layer
  • the planarization layer 22 plays a role of planarization and protection, and its material may be a resin material.
  • the thickness of the flat layer may be greater than or equal to 0.5 ⁇ m and less than or equal to 1.5 ⁇ m.
  • the support layer 23 may include a plurality of PS dots (PS dots), or may include a PS wall (PS wall), which functions to uniformize the box thickness in the display panel, and the material may be a resin material.
  • the thickness of the support layer may be greater than or equal to 1 ⁇ m and less than or equal to 2.5 ⁇ m.
  • the light-shielding layer can be increased by (That is, the thickness of the light-shielding layer in the BM Size area is greater than that in the AA area); in another implementation, referring to Figure 2a, the thickness of the flat layer can be increased (that is, the thickness of the flat layer in the BM Size area is larger than that in the AA area Large) implementation; in another implementation, referring to Figure 2b, it can be implemented by adding a color resist layer on the light shielding layer.
  • the value of the first thickness threshold can be set for the purpose of reducing the liquid crystal filling amount around the display panel and increasing the peripheral support force.
  • the specific value can be determined according to actual conditions, which is not limited in this embodiment.
  • the color filter substrate provided by this embodiment increases the thickness of the color filter substrate in the non-display area, so that the peripheral cell thickness of the display panel formed by the combination of the color filter substrate and the array substrate is reduced, thereby reducing the surrounding liquid crystal filling volume and reducing
  • the difference in cell thickness between the compression area and the non-compression area of the display panel can improve light leakage; and the increase in the thickness of the color filter substrate in the non-display area can reduce the gap between the support layer and the array substrate and improve the peripheral support force. Enhance the anti-deformation ability of the display panel and improve the peripheral dark state light leakage.
  • the photoresist layer 21 may include a light shielding layer 211 and a color resist layer 212 stacked on the substrate 20, and the light shielding layer 211 is disposed close to the substrate 20.
  • the color resist layer 212 may include a red color resist layer R, a green color resist layer G, and a blue color resist layer B.
  • the number of the red color resist layer R, the green color resist layer G, and the blue color resist layer B contained in the color resist layer can be set according to actual needs.
  • the material and thickness of the light-shielding layer 211 can be the same as the black matrix 25 in the AA area, so the light-shielding layer 211 can be formed in the same process as the black matrix 25 in the AA area, which reduces the process complexity.
  • the thickness of the light shielding layer 211 may be greater than or equal to 0.8 ⁇ m and less than or equal to 1.6 ⁇ m, for example, the thickness of the light shielding layer 211 is 1 ⁇ m.
  • the material and thickness of the color resist layer 212 can be the same as those of the color resist layer 26 in the AA region. Similarly, the color resist layer 212 can be formed in the same process as the color resist layer 26 in the AA region to reduce process complexity. The thickness of the color resist layer 212 may be greater than or equal to 1.5 ⁇ m and less than or equal to 2.5 ⁇ m, for example, the thickness of the color resist layer 212 is 2 ⁇ m.
  • the color filter substrate provided in this embodiment can be prepared by the following steps:
  • FIG. 3 shows a schematic diagram of a cross-sectional structure of the finished light-shielding layer
  • Figure 4 shows the completed blue color resist layer. Schematic diagram of the cross-sectional structure; in Figure 4, two columns of blue color resist layer B are made in the BM Size area. In practical applications, the number of columns of blue color resist layer B can be set according to the actual situation. For example, 5 rows of blue color resist layer B can be made ;
  • FIG. 5 shows the completed green color resist layer Schematic diagram of the cross-sectional structure; in Figure 5, two green color resist layers G are made in the BM Size area.
  • the number of green color resist layers G can be set according to the actual situation. For example, five green color resist layers G can be made ;
  • red color resist layer on the light-shielding layer For example, you can first make a red color resist layer R in the AA area, and then move the Mask to the BM Size area to epitaxially make the red color resist layer R.
  • Figure 6 shows the finished red color resist layer. Schematic diagram of the cross-sectional structure; in Figure 6, two rows of red color resist layers R are made in the BM Size area. In practical applications, the number of rows of red color resist layers R can be set according to the actual situation. For example, 5 rows of red color resist layers R can be made ;
  • FIG. 7 shows a schematic cross-sectional structure diagram of the completed flat layer
  • FIG. 8 shows a schematic cross-sectional structure diagram of the color filter substrate after the support layer is fabricated.
  • the color resistance layers of the BM Size area and the AA area in the above preparation method are made step by step by moving the mask.
  • a large-size mask can be used to make the color resistance of the BM Size area and the AA area at the same time.
  • the color filter substrate provided in this embodiment extends the RGB color resist layer in the AA area to the BM Size area.
  • the film layer in the BM Size area includes the light shielding layer 211 + the color resist layer 212 + the flat layer 22 + the support layer 23, thereby increasing
  • the thickness of the CF substrate in the BM Size area is such that the total thickness of the photoresist layer 21, the flat layer 22, and the support layer 23 on the color filter substrate in the non-display area is greater than or equal to the first thickness threshold.
  • the color resist layer 212 is extended to the BM Size area to increase the thickness of the color filter substrate in the peripheral non-display area (BM Size area).
  • the mask can be shared with the color resist layer in the AA area.
  • the mask cost is saved, and the color resist layer 212 in the BM Size area can be formed in the same process as the color resist layer in the AA area, thereby simplifying the process and reducing process complexity.
  • This embodiment improves the problem of peripheral light leakage from the following two aspects: on the one hand, the fundamental cause of light leakage is the disorder of the liquid crystal molecules in the light leakage area, and the disorder of the liquid crystal molecules leads to uneven brightness in the deformed and non-deformed regions of the screen under dark conditions.
  • the peripheral box thickness of the display panel formed by the color filter substrate and the array substrate is reduced, thereby reducing the periphery
  • the liquid crystal filling volume reduces the cell thickness difference between the compression zone and the non-compression zone caused by the deformation of the display panel, thereby improving light leakage;
  • the thickness of the color film substrate in the peripheral non-display area (BM Size area) is reduced, and the support layer can even be brought into contact with the array substrate, so that the display panel deforms less under external pressure and further improves light leakage.
  • the display device includes an array substrate 90 that is arranged in alignment and the color filter substrate according to any of the above embodiments, and the array substrate and the color filter are filled The liquid crystal layer between the substrates.
  • the display device in this embodiment may be any product or component with a display function, such as a display panel, electronic paper, mobile phone, tablet computer, television, notebook computer, digital photo frame, navigator, etc.
  • the array substrate 90 may include a substrate (such as a glass substrate), a plurality of thin film transistors formed on the substrate, and the like.
  • the method for preparing the corresponding display device may include the following steps:
  • Figure 4 shows the completed blue color resist layer. Schematic diagram of the cross-sectional structure; in Figure 4, two columns of blue color resist layer B are made in the BM Size area. In practical applications, the number of columns of blue color resist layer B can be set according to the actual situation. For example, 5 rows of blue color resist layer B can be made ;
  • FIG. 5 shows the completed green color resist layer Schematic diagram of the cross-sectional structure; in Figure 5, two green color resist layers G are made in the BM Size area.
  • the number of green color resist layers G can be set according to the actual situation. For example, five green color resist layers G can be made ;
  • red color resist layer on the light-shielding layer For example, you can first make a red color resist layer R in the AA area, and then move the Mask to the BM Size area to epitaxially make the red color resist layer R.
  • Figure 6 shows the finished red color resist layer. Schematic diagram of the cross-sectional structure; in Figure 6, two rows of red color resist layers R are made in the BM Size area. In practical applications, the number of rows of red color resist layers R can be set according to the actual situation. For example, 5 rows of red color resist layers R can be made ;
  • FIG. 7 shows a schematic cross-sectional structure diagram of the completed flat layer
  • FIG. 8 shows a schematic cross-sectional structure diagram of the color filter substrate after the support layer is manufactured
  • FIG. 9 shows a schematic cross-sectional structure diagram of the display device after the cell alignment is completed.
  • the peripheral cell thickness of the display device is reduced, thereby reducing the peripheral liquid crystal filling amount, and reducing the gap between the compression zone and the non-compression zone of the display device.
  • the thickness of the color filter substrate in the non-display area can be increased to reduce the gap between the support layer and the array substrate, improve the peripheral support force, enhance the resistance to deformation of the display device, and improve the peripheral dark state Poor light leakage.
  • the distance d2 between the surface of the flat layer of the color filter substrate in the non-display area away from the base and the array substrate is greater than or equal to the thickness of the support layer and less than or equal to the second thickness threshold.
  • the second thickness threshold may be less than or It is equal to 2.5 ⁇ m, such as 2.0 ⁇ m, etc., and the specific value of the second thickness threshold can be set according to actual conditions.
  • the distance d3 between the surface of the color filter substrate in the non-display area facing away from the base and the array substrate is less than or equal to the third thickness threshold.
  • the third thickness threshold may be less than 0.2 ⁇ m, for example, 0.1 ⁇ m.
  • the specific value of the thickness threshold can be set according to actual conditions.
  • the embodiments of the present application provide a color filter substrate and a display device, wherein the color filter substrate includes a display area and a non-display area, and the color filter substrate in the non-display area includes: a substrate; and a photoresist layer provided on the substrate; The flat layer on the side of the photoresist layer away from the substrate; the support layer disposed on the side of the flat layer away from the substrate; wherein the total thickness of the photoresist layer, the flat layer and the support layer is greater than or equal to the first thickness threshold.
  • the peripheral cell thickness of the display panel formed by the combination of the color filter substrate and the array substrate is reduced, thereby reducing the surrounding liquid crystal filling volume, and reducing the compression area and uncompressed area of the display panel.
  • the difference in cell thickness between the regions can improve light leakage; and the increase in the thickness of the color filter substrate in the non-display area can reduce the gap between the support layer and the array substrate, improve the peripheral support force, and enhance the resistance to deformation of the display panel, and improve The peripheral dark state light leakage is poor.

Abstract

彩膜基板、显示装置以及彩膜基板制备方法。彩膜基板包括显示区域(AA)和非显示区域(BM Size)，非显示区域(BM Size)的彩膜基板包括：基底(20)；以及设置在基底(20)上的光阻层(21)；设置在光阻层(21)背离基底(20)一侧的平坦层(22)；设置在平坦层(22)背离基底(20)一侧的支撑层(23)；其中，光阻层(21)、平坦层(22)以及支撑层(23)的总厚度大于或等于第一厚度阈值。

Description

彩膜基板、显示装置以及彩膜基板制备方法
交叉引用
本申请要求申请日为2019年2月2日、发明名称为“一种彩膜基板及显示装置”的中国发明专利申请第201920188064.7号的优先权，该中国发明专利申请的全部内容为了所有目的被全部结合于此。
技术领域
本公开涉及显示技术领域，特别是涉及彩膜基板、显示装置以及彩膜基板制备方法。
背景技术
随着大尺寸显示屏技术的发展，人们消费水平的不断提高，大尺寸TV(television，电视)产品受到越来越多消费者的喜爱。
然而，大尺寸屏幕组合成TV产品后周边很容易发生受力不均的情况。屏幕受力不均便会产生形变，导致暗态条件下周边产生漏光。漏光不良在客户端高发，严重影响用户使用体验，因此需要实施有效的方案解决周边漏光问题。
发明内容
根据一些实施例，本公开公开了一种彩膜基板，包括显示区域和非显示区域，所述非显示区域的彩膜基板包括：基底；以及设置在所述基底上的光阻层；
设置在所述光阻层背离所述基底一侧的平坦层；
设置在所述平坦层背离所述基底一侧的支撑层；
其中，所述光阻层、所述平坦层以及所述支撑层的总厚度大于或等于第一厚度阈值。
可选地，所述光阻层包括层叠设置在所述基底上的遮光层和色阻层，所述遮光层靠近所述基底设置。
可选地，所述色阻层包括红色色阻层、绿色色阻层和蓝色色阻层。
可选地，所述色阻层的厚度大于或等于1.5μm，且小于或等于2.5μm。
可选地，所述遮光层的厚度大于或等于0.8μm，且小于或等于1.6μm。
可选地，所述平坦层的厚度大于或等于0.5μm，且小于或等于1.5μm。
可选地，所述支撑层的厚度大于或等于1μm，且小于或等于2.5μm。
可选地，所述显示区域的彩膜基板包括：所述基底，设置在所述基底上的色阻层，设置在所述色阻层背离所述基底一侧的平坦层，设置在所述平坦层背离所述基底一侧的支撑层，其中第一厚度阈值等于所述显示区域的彩膜基板的所述色阻层、所述平坦层以及所述支撑层的总厚度减去1.1um。
根据一些实施例，本公开还公开了一种显示面板，所述显示装置包括对合设置的阵列基板和如上所述的彩膜基板，以及填充在所述阵列基板和所述彩膜基板之间的液晶层。
可选地，所述非显示区域的彩膜基板的平坦层背离所述基底一侧的表面与所述阵列基板之间的距离大于或等于所述支撑层的厚度，且小于或等于第二厚度阈值，所述第二厚度阈值小于或等于2.5μm。
可选地，所述非显示区域的彩膜基板的支撑层背离所述基底一侧的表面与所述阵列基板之间的距离小于或等于第三厚度阈值，所述第三厚度阈值小于0.2μm。
根据一些实施例，提供一种制备彩膜基板的方法，其中所述彩膜基板包括非显示区和显示区，该方法包括：在基底上针对非显示区域制作遮光层，在遮光层上针对非显示区域制备色阻层，在色阻层上涂布平坦层，以及在平坦层上制作支撑层。
可选地，在遮光层上针对非显示区域制备色阻层包括在遮光层上针对非显示区域制备红色色阻层、蓝色色阻层和绿色色阻层中的一者或多者。
可选地，在遮光层上针对非显示区域制备色阻层包括在遮光层上针对显示区制作完色阻层之后，将该色阻层的掩模移动到非显示区域来在遮光层上针对非显示区域制备色阻层。
可选地，所述非显示区域的所述遮光层、所述色阻层、所述平坦层和所述支撑层的厚度大于等于第一厚度阈值。
可选地，所述显示区域的彩膜基板包括：所述基底，设置在所述基底上的色阻层， 设置在所述色阻层背离所述基底一侧的平坦层，设置在所述平坦层背离所述基底一侧的支撑层，其中第一厚度阈值等于所述显示区域的彩膜基板的所述色阻层、所述平坦层以及所述支撑层的总厚度减去1.1um。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对本公开实施例的描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1示出了相关技术提供的一种彩膜基板的剖面结构示意图；
图2a示出了本申请实施例提供的一种彩膜基板的剖面结构示意图；
图2b示出了本申请实施例提供的另一种彩膜基板的剖面结构示意图；
图3示出了本申请实施例提供的一种彩膜基板制备方法中完成遮光层制作的剖面结构示意图；
图4示出了本申请实施例提供的一种彩膜基板制备方法中完成蓝色色阻层制作的剖面结构示意图；
图5示出了本申请实施例提供的一种彩膜基板制备方法中完成绿色色阻层制作的剖面结构示意图；
图6示出了本申请实施例提供的一种彩膜基板制备方法中完成红色色阻层制作的剖面结构示意图；
图7示出了本申请实施例提供的一种彩膜基板制备方法中完成平坦层制作的剖面结构示意图；
图8示出了本申请实施例提供的一种彩膜基板制备方法中完成支撑层制作的剖面结构示意图；
图9示出了本申请实施例提供的一种显示装置的剖面结构示意图。
具体实施方式
为使本公开的上述目的、特征和优点能够更加明显易懂，下面结合附图和具体实施方式对本公开作进一步详细的说明。
本申请提供了一种彩膜基板及显示装置，其中彩膜基板包括显示区域和非显示区域，所述非显示区域的彩膜基板包括：基底；以及设置在所述基底上的光阻层；设置在所述光阻层背离所述基底一侧的平坦层；设置在所述平坦层背离所述基底一侧的支撑层；其中，所述光阻层、所述平坦层以及所述支撑层的总厚度大于或等于第一厚度阈值。通过增加非显示区域彩膜基板的厚度，使得该彩膜基板与阵列基板对合形成的显示面板的周边盒厚减小，减少周边液晶填充量，减小显示面板受压区与非受压区之间的盒厚差异，从而改善漏光；并且，非显示区域彩膜基板的厚度增大可以缩小支撑层与阵列基板之间的间隙，提升周边支撑力，增强显示面板的抗形变能力，改善周边暗态漏光不良。
传统彩膜基板的周边区域(如图1中的BM(Black Matrix)size区域)是在基底20上层叠设置黑色矩阵材料层11、起保护作用的OC(overcoat)层12以及起支撑作用的隔垫物PS(spacer)层13。
如图1所示，显示区域的彩膜基板包括：基底20；以及设置在基底20上的色阻层2111(例如包括排列的RGB色阻层)。其中，基底20上设有黑色矩阵2112。显示区域的彩膜基板还包括：设置在色阻层2111上背离所述基底一侧的平坦层2113以及设置在所述平坦层2113背离所述基底一侧的支撑层2114。
发明人发现现有的彩膜基板周边膜厚较薄，使形成的屏幕周边BM Size区空余体积较大，导致周边液晶填充量较多；同时，BM Size区彩膜基板的PS层13与阵列基板19(例如包括基底40和薄膜晶体管层30)之间存在d1约为1.1um的空隙，导致周边支撑力不足，当屏幕周边受力不均时，玻璃基板形变量较大，液晶分子排列紊乱，导致周边漏光不良发生。
为了解决这一问题，本申请一实施例提供了一种彩膜基板，参照图2a所示，该彩膜基板包括显示区域(AA区)和非显示区域(BM Size区)。显示区域的配置与图1相似，在此不再赘述。
显示区域的彩膜基板包括：基底20；以及设置在基底20上的色阻层2111(例如包括排列的RGB色阻层)。其中，基底20上设有黑色矩阵2112。显示区域的彩膜基板还包括：设置在色阻层2111上背离所述基底一侧的平坦层2113以及设置在所述平坦层2113 背离所述基底一侧的支撑层2114。
非显示区域的彩膜基板包括：基底20；以及设置在基底20上的光阻层21；设置在光阻层21背离基底20一侧的平坦层22；设置在平坦层22背离基底20一侧的支撑层23；其中，光阻层21、平坦层22以及支撑层23的总厚度大于或等于第一厚度阈值。
在一些实施例中，第一厚度阈值等于所述显示区域的黑色矩阵2112、所述平坦层2113和所述支撑层2114的总厚度。
在一些实施例中，第一厚度阈值等于所述显示区域的彩膜基板的所述色阻层2111、所述平坦层2113以及所述支撑层2114的总厚度减去1.1um。
在一些实施例中，非显示区域的支撑层和显示区域的支撑层是在同一制备工序中同层形成的，其中各个隔垫物PS的厚度可以根据实际需而设置。
其中，基底20可以是玻璃或柔性衬底等。
光阻层21可以只包括遮光层(如黑色光阻层)，还可以包括设置在遮光层背离基底20一侧的色阻层(如彩色光阻层)等。
平坦层22起到平坦化和保护的作用，其材料可以为树脂材料。平坦层的厚度可以大于或等于0.5μm，且小于或等于1.5μm。
支撑层23可以包括多个PS dot(PS点)，也可以包括PS wall(PS壁)，在显示面板中起到均一化盒厚的作用，材料可以是树脂材料。支撑层的厚度可以大于或等于1μm，且小于或等于2.5μm。
为了使光阻层21、平坦层22以及支撑层23的总厚度大于或等于第一厚度阈值，一种实现方式中，参照图2a，当光阻层为遮光层时，可以通过增大遮光层的厚度(即BM Size区的遮光层厚度比AA区大)来实现；另一种实现方式中，参照图2a，可以通过增大平坦层的厚度(即BM Size区的平坦层厚度比AA区大)实现；又一种实现方式中，参照图2b，可以通过在遮光层上增设色阻层实现。在实际应用中，这几种实现方式还可以任意组合。其中，第一厚度阈值的数值设置可以以减少显示面板周边液晶填充量和提升周边支撑力为目的，具体数值可以根据实际情况确定，本实施例对此不作限定。
本实施例提供的彩膜基板，通过增加非显示区域彩膜基板的厚度，使得该彩膜基板与阵列基板对合形成的显示面板的周边盒厚减小，进而减少周边液晶填充量，减小显示面板受压区与非受压区之间的盒厚差异，从而改善漏光；并且，非显示区域彩膜基板的 厚度增大可以缩小支撑层与阵列基板之间的间隙，提升周边支撑力，增强显示面板的抗形变能力，改善周边暗态漏光不良。
为了降低工艺复杂度，降低成本，参照图2b，光阻层21可以包括层叠设置在基底20上的遮光层211和色阻层212，遮光层211靠近基底20设置。
其中，色阻层212可以包括红色色阻层R、绿色色阻层G和蓝色色阻层B。色阻层中所包含的红色色阻层R、绿色色阻层G和蓝色色阻层B的数量可以根据实际需要进行设置。
本实施例中，遮光层211的材料和厚度可以与AA区的黑色矩阵25相同，这样遮光层211可以与AA区的黑色矩阵25同工艺形成，降低工艺复杂度。遮光层211的厚度可以大于或等于0.8μm，且小于或等于1.6μm，例如遮光层211的厚度为1μm。
色阻层212的材料和厚度均可以与AA区的色阻层26相同，同样色阻层212可以与AA区的色阻层26同工艺形成，降低工艺复杂度。色阻层212的厚度可以大于或等于1.5μm，且小于或等于2.5μm，例如色阻层212的厚度为2μm。本实施例提供的彩膜基板可以采用如下步骤制备：
在基底上制作遮光层，参照图3示出了完成遮光层制作的剖面结构示意图；
在遮光层上制备蓝色色阻层；例如可以先在AA区制作蓝色色阻层B，然后移动Mask至BM Size区域外延制作蓝色色阻层B，图4示出了完成蓝色色阻层制作的剖面结构示意图；图4中在BM Size区域制作了2列蓝色色阻层B，在实际应用中蓝色色阻层B的列数可以根据实际情况设定，如可以制作5列蓝色色阻层B；
在遮光层上制备绿色色阻层；例如可以先在AA区制作绿色色阻层G，然后移动Mask至BM Size区域外延制作绿色色阻层G，图5示出了完成绿色色阻层制作的剖面结构示意图；图5中在BM Size区域制作了2列绿色色阻层G，在实际应用中绿色色阻层G的列数可以根据实际情况设定，如可以制作5列绿色色阻层G；
在遮光层上制备红色色阻层；例如可以先在AA区制作红色色阻层R，然后移动Mask至BM Size区域外延制作红色色阻层R，图6示出了完成红色色阻层制作的剖面结构示意图；图6中在BM Size区域制作了2列红色色阻层R，在实际应用中红色色阻层R的列数可以根据实际情况设定，如可以制作5列红色色阻层R；
在色阻层上涂布平坦层；图7示出了完成平坦层制作的剖面结构示意图；
在平坦层上制作支撑层，得到彩膜基板，图8示出了完成支撑层制作的彩膜基板的剖面结构示意图。
需要说明的是，上述制备方法中BM Size区和AA区的色阻层是通过移动mask分步制作的，在实际应用中，可以采用一个大尺寸mask同时制作BM Size区和AA区的色阻层。
本实施例提供的彩膜基板，通过将AA区的RGB色阻层向BM Size区域外延，BM Size区域的膜层包括遮光层211+色阻层212+平坦层22+支撑层23，从而增加BM Size区域CF基板的厚度，使非显示区域彩膜基板上的光阻层21、平坦层22以及支撑层23的总厚度大于或等于第一厚度阈值。
本实施例通过将色阻层212向BM Size区域外延，来增加周边非显示区域(BM Size区域)的彩膜基板的厚度，在制作过程中可以与AA区的色阻层共用Mask，从而可以节约mask成本，同时BM Size区的色阻层212可以与AA区的色阻层同工艺形成，从而简化工艺，降低工艺复杂度。通过在彩膜基板的周边增加色阻层，提高显示面板周边的支撑力同时减少周边液晶量，增强Panel抗形变能力，改善周边暗态漏光不良。
本实施例从以下两个方面改善周边漏光的问题：一方面，漏光的根本原因是漏光区域的液晶分子排序紊乱，液晶分子排序紊乱导致暗态条件下屏幕形变区与非形变区亮暗不均，产生漏光不良；本实施例通过增加周边非显示区域(BM Size区域)的彩膜基板的厚度，使得该彩膜基板与阵列基板对合形成的显示面板的周边盒厚减小，进而减少周边液晶填充量，减小由于显示面板形变导致的受压区与非受压区盒厚差异，从而改善漏光；另一方面，通过增加周边非显示区域(BM Size区域)的彩膜基板的厚度，缩小显示面板中支撑层与阵列基板之间的空隙，甚至可以使支撑层与阵列基板接触，使得显示面板在外界压力下变形量小，进一步改善漏光。
本申请另一实施例还提供了一种显示装置，参照图9，该显示装置包括对合设置的阵列基板90和上述任一实施例所述的彩膜基板，以及填充在阵列基板和彩膜基板之间的液晶层。
需要说明的是，本实施例中的显示装置可以为：显示面板、电子纸、手机、平板电脑、电视机、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
阵列基板90可以包括衬底(如玻璃基板)以及形成在衬底上的多个薄膜晶体管等。
当彩膜基板中的光阻层包括层叠设置在基底上的遮光层和色阻层时，相应的显示装置的制备方法可以包括如下步骤：
在基底上制作遮光层；参照图3示出了完成遮光层制作的剖面结构示意图；
在遮光层上制备蓝色色阻层；例如可以先在AA区制作蓝色色阻层B，然后移动Mask至BM Size区域外延制作蓝色色阻层B，图4示出了完成蓝色色阻层制作的剖面结构示意图；图4中在BM Size区域制作了2列蓝色色阻层B，在实际应用中蓝色色阻层B的列数可以根据实际情况设定，如可以制作5列蓝色色阻层B；
在遮光层上制备绿色色阻层；例如可以先在AA区制作绿色色阻层G，然后移动Mask至BM Size区域外延制作绿色色阻层G，图5示出了完成绿色色阻层制作的剖面结构示意图；图5中在BM Size区域制作了2列绿色色阻层G，在实际应用中绿色色阻层G的列数可以根据实际情况设定，如可以制作5列绿色色阻层G；
在遮光层上制备红色色阻层；例如可以先在AA区制作红色色阻层R，然后移动Mask至BM Size区域外延制作红色色阻层R，图6示出了完成红色色阻层制作的剖面结构示意图；图6中在BM Size区域制作了2列红色色阻层R，在实际应用中红色色阻层R的列数可以根据实际情况设定，如可以制作5列红色色阻层R；
在色阻层上涂布平坦层；图7示出了完成平坦层制作的剖面结构示意图；
在平坦层上制作支撑层，得到彩膜基板，图8示出了完成支撑层制作的彩膜基板的剖面结构示意图；
涂布封框胶，滴注液晶，与阵列基板对盒，得到显示装置(显示面板)，图9示出了完成对盒后的显示装置的剖面结构示意图。
本实施例提供的显示装置，通过增加非显示区域彩膜基板的厚度，使得显示装置的周边盒厚减小，进而减少周边液晶填充量，减小显示装置受压区与非受压区之间的盒厚差异，从而改善漏光；并且，非显示区域彩膜基板的厚度增大可以缩小支撑层与阵列基板之间的间隙，提升周边支撑力，增强显示装置的抗形变能力，改善周边暗态漏光不良。
其中，非显示区域的彩膜基板的平坦层背离基底一侧的表面与阵列基板之间的距离d2大于或等于支撑层的厚度，且小于或等于第二厚度阈值，第二厚度阈值可以小于或等于2.5μm，例如可以为2.0μm等，第二厚度阈值的具体数值可以根据实际情况设定。
非显示区域的彩膜基板的支撑层背离基底一侧的表面与阵列基板之间的距离d3小于或等于第三厚度阈值，第三厚度阈值可以小于0.2μm，例如可以为0.1μm等，第三厚度阈值的具体数值可以根据实际情况设定。
本申请实施例提供了一种彩膜基板及显示装置，其中彩膜基板包括显示区域和非显示区域，非显示区域的彩膜基板包括：基底；以及设置在基底上的光阻层；设置在光阻层背离基底一侧的平坦层；设置在平坦层背离基底一侧的支撑层；其中，光阻层、平坦层以及支撑层的总厚度大于或等于第一厚度阈值。通过增加非显示区域彩膜基板的厚度，使得该彩膜基板与阵列基板对合形成的显示面板的周边盒厚减小，进而减少周边液晶填充量，减小显示面板受压区与非受压区之间的盒厚差异，从而改善漏光；并且，非显示区域彩膜基板的厚度增大可以缩小支撑层与阵列基板之间的间隙，提升周边支撑力，增强显示面板的抗形变能力，改善周边暗态漏光不良。
本说明书中的各个实施例均采用递进的方式描述，每个实施例重点说明的都是与其他实施例的不同之处，各个实施例之间相同相似的部分互相参见即可。
最后，还需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、商品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、商品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括所述要素的过程、方法、商品或者设备中还存在另外的相同要素。
以上对本公开所提供的一种彩膜基板及显示装置进行了详细介绍，本文中应用了具体个例对本公开的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本公开的方法及其核心思想；同时，对于本领域的一般技术人员，依据本公开的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本公开的限制。

Claims (18)

  1. 一种彩膜基板，其中包括显示区域和非显示区域，所述非显示区域的彩膜基板包括：基底；以及设置在所述基底上的光阻层；
    设置在所述光阻层背离所述基底一侧的平坦层；
    设置在所述平坦层背离所述基底一侧的支撑层；
    其中，所述光阻层、所述平坦层以及所述支撑层的总厚度大于或等于第一厚度阈值。
  2. 根据权利要求1所述的彩膜基板，其中，所述光阻层包括层叠设置在所述基底上的遮光层和色阻层，所述遮光层靠近所述基底设置。
  3. 根据权利要求2所述的彩膜基板，其中，所述色阻层包括红色色阻层、绿色色阻层和蓝色色阻层。
  4. 根据权利要求2所述的彩膜基板，其中，所述色阻层的厚度大于或等于1.5μm，且小于或等于2.5μm。
  5. 根据权利要求2所述的彩膜基板，其中，所述遮光层的厚度大于或等于0.8μm，且小于或等于1.6μm。
  6. 根据权利要求1至5任一项所述的彩膜基板，其中，所述平坦层的厚度大于或等于0.5μm，且小于或等于1.5μm。
  7. 根据权利要求1至6任一项所述的彩膜基板，其中，所述支撑层的厚度大于或等于1μm，且小于或等于2.5μm。
  8. 根据权利要求1至7任一项所述的彩膜基板，其中，所述显示区域的彩膜基板包括：
    所述基底，
    设置在所述基底上的色阻层，
    设置在所述色阻层背离所述基底一侧的平坦层，
    设置在所述平坦层背离所述基底一侧的支撑层。
    其中第一厚度阈值等于所述显示区域的彩膜基板的所述色阻层、所述平坦层以及所述支撑层的总厚度减去1.1um。
  9. 根据权利要求1至7任一项所述的彩膜基板，其中，所述显示区域的彩膜基板包括：
    所述基底，
    设置在所述基底上的黑色矩阵和设置在所述基底和所述黑色矩阵上的色阻层，
    设置在所述色阻层背离所述基底一侧的平坦层，
    设置在所述平坦层背离所述基底一侧的支撑层，
    其中第一厚度阈值等于所述显示区域的彩膜基板的所述黑色矩阵、所述平坦层以及所述支撑层的总厚度。
  10. 一种显示面板，其中，所述显示装置包括对合设置的阵列基板和权利要求1至9任一项所述的彩膜基板，以及填充在所述阵列基板和所述彩膜基板之间的液晶层。
  11. 根据权利要求10所述的显示面板，其中，所述非显示区域的彩膜基板的平坦层背离所述基底一侧的表面与所述阵列基板之间的距离大于或等于所述支撑层的厚度，且小于或等于第二厚度阈值，所述第二厚度阈值小于或等于2.5μm。
  12. 根据权利要求10所述的显示面板，其中，所述非显示区域的彩膜基板的支撑层背离所述基底一侧的表面与所述阵列基板之间的距离小于或等于第三厚度阈值，所述第三厚度阈值小于0.2μm。
  13. 一种制备彩膜基板的方法，其中所述彩膜基板包括非显示区和显示区，该方法包括：
    在基底上针对非显示区域制作遮光层，
    在遮光层上针对非显示区域制备色阻层，
    在色阻层上涂布平坦层，以及
    在平坦层上制作支撑层。
  14. 如权利要求13所述的方法，其中，在遮光层上针对非显示区域制备色阻层包括在遮光层上针对非显示区域制备红色色阻层、蓝色色阻层和绿色色阻层中的一者或多者。
  15. 如权利要求14所述的方法，其中，在遮光层上针对非显示区域制备色阻层包括在遮光层上针对显示区制作完色阻层之后，将该色阻层的掩模移动到非显示区域来在遮光层上针对非显示区域制备色阻层。
  16. 如权利要求13-15中任一项所述的方法，其中，所述非显示区域的所述遮光层、所述色阻层、所述平坦层和所述支撑层的厚度大于等于第一厚度阈值。
  17. 如权利要求16所述的方法，其中，所述显示区域的彩膜基板包括：
    所述基底，
    设置在所述基底上的色阻层，
    设置在所述色阻层背离所述基底一侧的平坦层，
    设置在所述平坦层背离所述基底一侧的支撑层，
    其中第一厚度阈值等于所述显示区域的彩膜基板的所述色阻层、所述平坦层以及所述支撑层的总厚度减去1.1um。
  18. 如权利要求17所述的方法，其中，所述显示区域的彩膜基板包括：
    所述基底，
    设置在所述基底上的黑色矩阵和设置在所述基底和所述黑色矩阵上的色阻层，
    设置在所述色阻层背离所述基底一侧的平坦层，
    设置在所述平坦层背离所述基底一侧的支撑层，
    其中第一厚度阈值等于所述显示区域的彩膜基板的所述黑色矩阵、所述平坦层以及所述支撑层的总厚度。
PCT/CN2020/070432 2019-02-02 2020-01-06 彩膜基板、显示装置以及彩膜基板制备方法 WO2020156040A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US16/962,824 US11474402B2 (en) 2019-02-02 2020-01-06 Color film substrate comprising a display region and a non-display region, display device and color film substrate fabricating method
US17/930,757 US11829040B2 (en) 2019-02-02 2022-09-09 Color film substrate comprising a support layer disposed on a side of a planarization layer away from a base in a non-display region and display device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201920188064.7U CN209590464U (zh) 2019-02-02 2019-02-02 一种彩膜基板及显示装置
CN201920188064.7 2019-02-02

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US16/962,824 A-371-Of-International US11474402B2 (en) 2019-02-02 2020-01-06 Color film substrate comprising a display region and a non-display region, display device and color film substrate fabricating method
US17/930,757 Continuation US11829040B2 (en) 2019-02-02 2022-09-09 Color film substrate comprising a support layer disposed on a side of a planarization layer away from a base in a non-display region and display device

Publications (1)

Publication Number Publication Date
WO2020156040A1 true WO2020156040A1 (zh) 2020-08-06

Family

ID=68354255

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/070432 WO2020156040A1 (zh) 2019-02-02 2020-01-06 彩膜基板、显示装置以及彩膜基板制备方法

Country Status (3)

Country Link
US (2) US11474402B2 (zh)
CN (1) CN209590464U (zh)
WO (1) WO2020156040A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN209590464U (zh) 2019-02-02 2019-11-05 合肥京东方显示技术有限公司 一种彩膜基板及显示装置
CN111025734A (zh) * 2019-12-16 2020-04-17 友达光电（昆山）有限公司 显示装置
CN111983847A (zh) * 2020-08-20 2020-11-24 武汉华星光电技术有限公司 彩色滤光片基板及其制作方法与液晶显示面板
CN112987374B (zh) * 2021-03-03 2023-01-20 捷开通讯(深圳)有限公司 显示面板及终端设备
CN113253520B (zh) * 2021-04-30 2023-01-24 滁州惠科光电科技有限公司 一种显示面板及显示设备

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008158138A (ja) * 2006-12-22 2008-07-10 Dainippon Printing Co Ltd カラーフィルタ基板および液晶表示装置
CN103149729A (zh) * 2013-03-01 2013-06-12 京东方科技集团股份有限公司 一种彩膜基板及其制作方法、显示装置
CN104777666A (zh) * 2015-04-30 2015-07-15 武汉华星光电技术有限公司 一种彩膜基板及液晶显示器
CN106526955A (zh) * 2017-01-04 2017-03-22 京东方科技集团股份有限公司 一种显示面板及显示装置
CN109557709A (zh) * 2018-11-29 2019-04-02 南京中电熊猫平板显示科技有限公司 一种彩膜基板及其制造方法
CN209590464U (zh) * 2019-02-02 2019-11-05 合肥京东方显示技术有限公司 一种彩膜基板及显示装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI337679B (en) * 2003-02-04 2011-02-21 Sipix Imaging Inc Novel compositions and assembly process for liquid crystal display
KR101620526B1 (ko) * 2010-01-22 2016-05-13 삼성디스플레이 주식회사 액정 표시 장치의 제조 방법과 이에 의한 액정 표시 장치
TWI557488B (zh) * 2015-01-12 2016-11-11 群創光電股份有限公司 顯示裝置
TWI548915B (zh) * 2015-04-10 2016-09-11 群創光電股份有限公司 顯示面板
CN106256955A (zh) 2015-06-19 2016-12-28 上海东升新材料有限公司 一种浆内施胶剂乳液及其制备方法和应用
CN105353554A (zh) * 2015-12-04 2016-02-24 深圳市华星光电技术有限公司 彩膜基板的制作方法及液晶显示装置
JP2018054733A (ja) * 2016-09-27 2018-04-05 株式会社ジャパンディスプレイ 液晶表示装置及びカラーフィルタ基板
JP6370967B1 (ja) * 2017-06-28 2018-08-08 デクセリアルズ株式会社 画像表示装置の製造方法、光硬化性樹脂組成物及び光透過性硬化樹脂層

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008158138A (ja) * 2006-12-22 2008-07-10 Dainippon Printing Co Ltd カラーフィルタ基板および液晶表示装置
CN103149729A (zh) * 2013-03-01 2013-06-12 京东方科技集团股份有限公司 一种彩膜基板及其制作方法、显示装置
CN104777666A (zh) * 2015-04-30 2015-07-15 武汉华星光电技术有限公司 一种彩膜基板及液晶显示器
CN106526955A (zh) * 2017-01-04 2017-03-22 京东方科技集团股份有限公司 一种显示面板及显示装置
CN109557709A (zh) * 2018-11-29 2019-04-02 南京中电熊猫平板显示科技有限公司 一种彩膜基板及其制造方法
CN209590464U (zh) * 2019-02-02 2019-11-05 合肥京东方显示技术有限公司 一种彩膜基板及显示装置

Also Published As

Publication number Publication date
CN209590464U (zh) 2019-11-05
US20210373397A1 (en) 2021-12-02
US11829040B2 (en) 2023-11-28
US11474402B2 (en) 2022-10-18
US20230013193A1 (en) 2023-01-19

Similar Documents

Publication Publication Date Title
WO2020156040A1 (zh) 彩膜基板、显示装置以及彩膜基板制备方法
US10274776B2 (en) Color film substrate, display device, and manufacturing method of the color film substrate
WO2018188318A1 (zh) 彩膜基板及其制作方法、以及相关装置
WO2019184769A1 (zh) 液晶显示面板、其制作方法及显示装置
WO2017008369A1 (zh) Coa型液晶显示面板及其制作方法
US9188813B2 (en) Liquid crystal display panel and manufacturing method thereof
US20150029428A1 (en) Color filter substrate, manufacturing process thereof and liquid crystal display panel
WO2016086539A1 (zh) 液晶面板及其制作方法
US20160005790A1 (en) Display substrate and method of manufacturing the same, and display device
US11243441B2 (en) Display panel, display apparatus, method of fabricating display panel, and operating method of operating display panel
CN106842687B (zh) 彩膜基板及其制作方法
WO2014131257A1 (zh) 彩膜基板及其制作方法、显示装置
US20060215105A1 (en) Liquid crystal display device with photo spacers
WO2018145482A1 (zh) 显示面板及其制作方法、显示装置、基板
US20190219853A1 (en) Coa substrate, manufacturing method therefor, display panel, and display device
WO2021017250A1 (zh) 显示面板及其制作方法
US9335587B2 (en) Liquid crystal cell and method for manufacturing the same
WO2019085224A1 (zh) 阵列基板及显示面板
US10317738B2 (en) Array substrate and a display panel
US7593089B2 (en) Method for fabricating liquid crystal panel
CN109814298B (zh) 液晶显示面板及其制造方法、液晶显示装置
US20190049803A1 (en) Active switch array substrate, manufacturing method therefor same, and display device using same
CN107065315B (zh) 一种显示面板及显示装置
US20130057812A1 (en) Liquid crystal display and method for manufacturing the same
WO2021017298A1 (zh) 显示面板及其制备方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20748809

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20748809

Country of ref document: EP

Kind code of ref document: A1

122 Ep: pct application non-entry in european phase

Ref document number: 20748809

Country of ref document: EP

Kind code of ref document: A1

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 26/01/2022)

122 Ep: pct application non-entry in european phase

Ref document number: 20748809

Country of ref document: EP

Kind code of ref document: A1