WO2020031470A1 - Dispositif de coupe de substrat de verre et procédé de coupe de substrat de verre - Google Patents

Dispositif de coupe de substrat de verre et procédé de coupe de substrat de verre Download PDF

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Publication number
WO2020031470A1
WO2020031470A1 PCT/JP2019/021393 JP2019021393W WO2020031470A1 WO 2020031470 A1 WO2020031470 A1 WO 2020031470A1 JP 2019021393 W JP2019021393 W JP 2019021393W WO 2020031470 A1 WO2020031470 A1 WO 2020031470A1
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WO
WIPO (PCT)
Prior art keywords
glass substrate
roller
blade
cutting
protective film
Prior art date
Application number
PCT/JP2019/021393
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English (en)
Japanese (ja)
Inventor
春樹 岡田
山田　聡
征人 石川
一也 岩本
Original Assignee
株式会社ジャパンディスプレイ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ジャパンディスプレイ filed Critical 株式会社ジャパンディスプレイ
Priority to CN201980044045.XA priority Critical patent/CN112368245B/zh
Publication of WO2020031470A1 publication Critical patent/WO2020031470A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Definitions

  • the present invention relates to a glass substrate cutting device and a glass substrate cutting method for cutting a glass substrate such as a display device.
  • Flat display devices including liquid crystal display devices and organic EL display devices (OLEDs: Organic Electroluminescence Display) are widely used as image display devices for various computers, portable terminal devices, and the like.
  • OLEDs Organic Electroluminescence Display
  • TFT Thin Film Transistor
  • the thin film is usually formed on a glass substrate in a display device manufacturing process.
  • a display device manufacturing process thin films for a plurality of products are simultaneously formed on one large glass substrate, and then the large glass substrate is cut. This is because more efficient manufacturing is possible than a method of forming a series of thin films on a glass substrate of one product size.
  • the large-sized glass substrate may be cut into a plurality of smaller glass substrates depending on the production line.
  • Patent Document 1 discloses a method of cutting a glass substrate at the same time as thinning by inserting a scribe line in a glass substrate and etching the glass substrate.
  • the present invention has been made in view of the above problems, and an object of the present invention is to provide a glass substrate cutting apparatus and a glass substrate cutting method capable of cutting a glass substrate having a protective film formed on one surface. .
  • One embodiment of the present invention includes a first roller facing one surface of a glass substrate on which a protective film is formed, and a first roller facing the one surface of the glass substrate and cutting the protective film.
  • the first roller moves while facing the second roller or the second blade, and the second roller moves while facing the first blade.
  • FIG. 3 is a diagram showing a positional relationship among a first head, a second head, and a mother glass substrate having a protective film formed on one surface in a glass substrate cutting apparatus according to an embodiment of the present invention. It is a figure showing the 1st state in the glass substrate cutting device concerning one embodiment of the present invention.
  • FIG. 3 is a diagram illustrating an arrangement relationship between a first blade, a second roller, and a mother glass substrate in a first state of the present invention. It is a figure showing the 2nd state in the glass substrate cutting device concerning one embodiment of the present invention.
  • FIG. 3 is a diagram showing a positional relationship among a first head, a second head, and a mother glass substrate having a protective film formed on one surface in a glass substrate cutting apparatus according to an embodiment of the present invention. It is a figure showing the 1st state in the glass substrate cutting device concerning one embodiment of the present invention.
  • FIG. 3 is a diagram illustrating an arrangement relationship between a first blade, a second roller, and
  • FIG. 6 is a diagram illustrating an arrangement relationship between a second blade, a first roller, and a mother glass substrate in a second state of the present invention. It is a figure showing the 3rd state in the glass substrate cutting device concerning one embodiment of the present invention.
  • FIG. 8 is a diagram illustrating an arrangement relationship between a first roller, a second roller, and a mother glass substrate in a third state of the present invention. It is a flowchart which shows the glass substrate cutting process in the glass substrate cutting apparatus which concerns on one Embodiment of this invention. 4 is a flowchart illustrating a process of a protective film cutting process in the glass substrate cutting apparatus according to one embodiment of the present invention.
  • ⁇ above '' and ⁇ below '' are only when located directly above or directly below a certain component
  • FIG. 1 is a schematic view of a glass substrate cutting apparatus 1 according to one embodiment of the present invention.
  • the glass substrate cutting apparatus 1 is an apparatus that performs processing for cutting a mother glass substrate 100 that is a large glass substrate. In FIG. 1, illustration of the mother glass substrate 100 is omitted.
  • the glass substrate cutting apparatus 1 has a first head 10, a first rail 15, a second head 20, a second rail 25, and a third rail pair 30.
  • the first head 10 is connected to the first rail 15. Then, the first head 10 moves in the X direction shown in FIG. 1 according to the trajectory of the first rail 15.
  • the second head 20 is connected to the second rail 25. Then, the second head 20 moves in the X direction shown in FIG. 1 according to the trajectory of the second rail 25.
  • Both ends of the first rail 15 and both ends of the second rail 25 are connected to the third pair of rails 30, respectively. Then, the first rail 15 and the second rail 25 move in the Y direction shown in FIG. 1 according to the track of the third rail pair 30. That is, the movement of the first head 10 and the second head 20 in the Y direction is performed according to the trajectory of the third pair of rails 30.
  • the glass substrate cutting apparatus 1 further includes an actuator (not shown) for driving at least one of the first head 10 and the second head 20.
  • This actuator controls the position or pressure of blades and rollers attached to the first head 10 and the second head 20, respectively, in processing in first to third states described later.
  • FIG. 2 is a diagram showing a positional relationship between a first head 10, a second head 20, and a mother glass substrate 100 having a protective film 110 formed on one surface in a glass substrate cutting apparatus 1 according to an embodiment of the present invention. It is.
  • a protective film 110 is formed on one surface of the mother glass substrate 100.
  • the protective film 110 may be provided directly on one surface of the mother glass substrate 100.
  • a thin film having a TFT (Thin Film Transistor) substrate, a display element, or the like may be provided between the mother glass substrate 100 and the protective film 110.
  • the protective film 110 has a role of protecting a thin film laminated on a glass substrate such as a TFT substrate.
  • the other surface of the mother glass substrate 100 is a glass surface.
  • the first head 10 is on the side of the protective film 110 formed on one surface of the mother glass substrate 100.
  • the second head 20 is on the opposite side to the above-described protective film 110 side. That is, the second head 20 exists on the side opposite to the side on which the first head 10 exists.
  • a first blade 11 and a first roller 12 are attached to the first head 10, and a second blade 21 and a second roller 22 are attached to the second head 20.
  • the first blade 11 is a blade for cutting the protective film 110 and is attached to one end of the first head 10.
  • the first blade 11 is preferably in the form of a rotary blade (rotary cutter). Specifically, a hub blade or a washer-type blade having an annular outer shape may be used.
  • the hub blade includes a base formed in a disk shape, and a cutting blade fixed to an outer peripheral portion of the base.
  • the cutting blade has a sharp pointed shape, and has a V-shaped cross section as shown in FIGS.
  • the angle of the cutting edge of the first blade 11 ( ⁇ 1 shown in FIG. 4) is preferably set in a range of 15 degrees to 45 degrees, and the angle set to an angle of about 30 degrees is preferable. It is more preferred to use.
  • the cutting blade of the first blade 11 is not particularly limited as long as it is a blade made of a material used for cutting a normal optical film or the like.
  • a material used for cutting a normal optical film or the like for example, iron, iron alloys, steel, metal such as stainless steel, titanium nitride, titanium carbide, tungsten carbide, ceramics and the like, and those having been subjected to a surface treatment such as diamond-like carbon and the like.
  • the second blade 21 is a blade for scribing the mother glass substrate 100, and is attached to one end of the second head 20.
  • the second blade 21 is preferably in the form of a rotary blade (rotary cutter).
  • a hub blade or a washer-type blade having an annular outer shape may be used.
  • the hub blade includes a base formed in a disk shape, and a cutting blade fixed to an outer peripheral portion of the base.
  • the cutting blade has a shape that is sharp at an obtuse angle, and has a V-shaped cross section as shown in FIG.
  • the angle ( ⁇ 2 shown in FIG. 6) of the cutting edge of the second blade 21 is preferably set in the range of 105 ° to 135 °, and the angle set near 120 ° is preferable. It is more preferred to use.
  • the cutting edge of the second blade 21 is not particularly limited as long as it is a blade made of a material used for normal glass cutting or scribing.
  • a cemented carbide, a sintered diamond (PCD: Poly Crystalline Diamond), etc. are mentioned.
  • the first roller 12 supports the mother glass substrate 100 from the side opposite to the second blade 21 during processing by the second blade 21 used as a pair in a first state described later.
  • the second roller 22 supports the mother glass substrate 100 from the side opposite to the first blade 11 during processing by the first blade 11 used as a pair in a second state described later. Further, the first roller 12 and the second roller 22 perform a dividing process of the mother glass substrate 100 in a third state described later.
  • the first roller 12 and the second roller 22 are made of a rigid body.
  • the first roller 12 and the second roller 22 in the present embodiment are made of metal.
  • FIGS. 5 and 6 for the processing steps in the second state
  • FIGS. 7 and 8 for the processing steps in the third processing.
  • FIG. 3 is a diagram showing a first state in the glass substrate cutting apparatus 1 according to one embodiment of the present invention.
  • FIG. 4 is a diagram illustrating an arrangement relationship between the first blade 11, the second roller 22, and the mother glass substrate 100 in the first state of the present invention.
  • the first state is a state in which the first blade 11 and the second roller 22 face each other.
  • a protection film cutting process is performed.
  • This protective film cutting process is a process in which the first blade 11 cuts the protective film 110 formed on one surface of the mother glass substrate 100 along a predetermined cutting line.
  • the first blade 11 and the second roller 22 are set to the use mode.
  • the pedestal of the first blade 11 and the pedestal of the second roller 22 are respectively protruded from the position in the normal state to the position in the use mode.
  • the first roller 12 does not contact the surface of the protective film 110, and the second blade 21 does not contact the surface of the mother glass substrate 100.
  • the first blade 11 and the second roller 22 are moved in one set direction. Specifically, in the case of FIG. 3, the first blade 11 and the second roller 22 move from right to left. During this cutting process, the first blade 11 cuts the protective film 110. Further, the second roller 22 simultaneously moves so as to be directly below the first blade 11, and supports the mother glass substrate 100 as necessary.
  • the protection film cutting process in the first state is completed once after confirming that the protection film 110 has been completely cut by performing once or a set multiple times.
  • the confirmation at this time may be based on analysis of an image captured by a camera by an image recognition device or the like, or may be visually checked by an operator.
  • the first blade 11 is attached to the tip of a horizontal shaft 60 extending from the rotation shaft 50, as shown in FIG.
  • the horizontal axis 60 is provided in parallel with a predetermined cutting line in order to align the cutting line of the protective film 110 with the caster effect.
  • the actuator controls the first blade 11 in the Z-axis direction shown in FIGS.
  • the control in the Z-axis direction in the first state is control of the pressure when cutting the protective film 110 by moving the first blade 11.
  • the actuator controls the pressure applied to the protective film 110 from the cutting edge of the first blade 11 in the Z-axis direction shown in FIGS.
  • the actuator also controls the second roller 22 in the Z-axis direction as shown in FIGS. 1 and 4 as necessary to appropriately support the mother glass substrate 100.
  • FIG. 5 is a diagram showing a second state in the glass substrate cutting apparatus 1 according to one embodiment of the present invention.
  • FIG. 6 is a diagram showing an arrangement relationship between the second blade 21 and the first roller 12 and the mother glass substrate 100 in the second state of the present invention.
  • the second state is a state in which the second blade 21 and the first roller 12 face each other.
  • a glass substrate scribing process is performed.
  • This glass substrate scribing process is a process in which the second blade 21 scribes the other surface of the mother glass substrate 100 on which the protective film 110 is not formed.
  • the second blade 21 and the first roller 12 are set to the use mode.
  • the pedestal of the second blade 21 and the pedestal of the first roller 12 are respectively protruded from the normal position to the use mode position.
  • the first blade 11 does not contact the surface of the protective film 110
  • the second roller 22 does not contact the surface of the mother glass substrate 100.
  • the scribing is performed by moving the second blade 21 and the first roller 12 in one direction to be set. Specifically, in the case of FIG. 5, the second blade 21 and the first roller 12 move from right to left. The second blade 21 scribes the mother glass substrate 100 during the scribe processing. The scribe line overlaps with the cutting line of the protective film 110 when viewed in the Z-axis direction, as shown by the dashed line in FIG. In addition, the first roller 12 moves so as to be directly above the second blade 21 and supports the mother glass substrate 100 as necessary. Thereby, the scribe process by the second blade 21 is performed more reliably.
  • the glass substrate scribing process in the second state is completed after confirming that the thickness of the glass at the scribed portion is smaller than a predetermined thickness by performing the set multiple times.
  • the confirmation at this time may be based on analysis of an image captured by a camera by an image recognition device or the like, or may be visually checked by an operator.
  • the second blade 21 is also attached to the tip of a horizontal shaft 60 extending from the rotation shaft 50, similarly to the first blade 11.
  • the horizontal axis 60 is provided in parallel with a predetermined scribe line in order to align the scribe line of the mother glass substrate 100 with the caster effect.
  • the actuator controls the second blade 21 in the Z-axis direction shown in FIGS.
  • the control in the Z-axis direction in the second state is control of the pressure when the mother glass substrate 100 is scribed by the movement of the second blade 21.
  • the actuator controls the pressure applied to the mother glass substrate 100 from the cutting edge of the second blade 21 in the Z-axis direction shown in FIGS.
  • the actuator also controls the first roller 12 in the Z-axis direction as shown in FIGS. 1 and 6 as needed in order to appropriately support the mother glass substrate 100.
  • FIG. 7 is a diagram showing a third state in the glass substrate cutting apparatus 1 according to one embodiment of the present invention.
  • FIG. 8 is a diagram showing an arrangement relationship between the first roller 12 and the second roller 22 and the mother glass substrate 100 in the third state of the present invention.
  • the third state is a state in which the first roller 12 and the second roller 22 face each other.
  • a glass substrate cutting process is performed.
  • the glass substrate cutting process is a process of cutting (cutting) the mother glass substrate 100 by applying pressure by the first roller 12 to a portion of the mother glass substrate 100 that has been thinned by the glass substrate scribing process.
  • the first roller 12 and the second roller 22 are set to the use mode.
  • the pedestal of the first roller 12 and the pedestal of the second roller 22 are respectively protruded from the position in the normal state to the position in the use mode.
  • the first blade 11 does not contact the surface of the protective film 110
  • the second blade 21 does not contact the surface of the mother glass substrate 100.
  • the first roller 12 and the second roller 22 are moved in one direction to be set. Specifically, in the case of FIG. 7, the first roller 12 and the second roller 22 move from right to left.
  • the first roller 12 applies a set predetermined pressure to the surface of the protective film 110.
  • the mother glass substrate 100 is bent near the scribed portion due to the pressure applied from the first roller 12.
  • the second roller 22 comes into contact with the other surface of the mother glass substrate 100 so as to support the bent mother glass substrate 100.
  • the glass surface receives a reaction against the pressure applied from the contacting second roller 22.
  • the mother glass substrate 100 is divided at a portion of the mother glass substrate 100 that has been thinned by the scribe.
  • the second roller 22 is not in contact with the surface of the mother glass substrate 100 as shown in FIG.
  • the second roller 22 may be in contact with the other surface of the mother glass substrate 100 from the stage before the first roller 12 applies pressure to the protective film 110.
  • the second roller 22 sinks in the Z-axis direction by the amount of flexure applied to the mother glass substrate 100. Thereafter, the second roller 22 may support the mother glass substrate 100 so that the mother glass substrate 100 does not drop at the time of division.
  • the glass substrate cutting process in the third state is performed once or a plurality of times set, and is completed after confirming that the mother glass substrate 100 is completely cut.
  • the glass substrate cutting process is performed only once, it is checked whether or not the mother glass substrate 100 where the pressure has already been applied is completely cut along with the movement of the first roller 12 and the second roller 22. Then, the first roller 12 and the second roller 22 may be moved to the next location.
  • the confirmation at this time may be based on analysis of an image captured by a camera by an image recognition device or the like, or may be visually checked by an operator.
  • the actuator controls the first roller 12 in the Z-axis direction shown in FIGS. More specifically, the control is performed so that the height in the Z-axis direction at the time of positioning the first roller 12 before the division does not change during the movement of the mother glass substrate 100 for the division.
  • the actuator also controls the second roller 22 in the Z-axis direction as shown in FIGS. 1 and 8 as needed to appropriately support the mother glass substrate 100.
  • the mother glass substrate 100 having the protective film 110 formed on one surface is cut through a protective film cutting process, a glass substrate scribing process, and a glass substrate cutting process.
  • FIG. 9 is a flowchart showing a glass substrate cutting step in the glass substrate cutting apparatus 1 according to one embodiment of the present invention.
  • the mother glass substrate 100 having the protective film 110 formed on one surface, which is cut in the glass substrate cutting step is set between the first head 10 and the second head 20 (S0).
  • the mother glass substrate 100 is turned into two glass substrates by the glass substrate cutting step, and is supported by another device (not shown) so as not to fall after cutting.
  • An apparatus for supporting these two glass substrates is, for example, a clip-shaped metal fitting or a suction cup.
  • a protection film cutting process is performed (S1). After the protection film cutting process, a glass substrate scribing process is performed (S2). After the glass substrate scribing process, a glass substrate cutting process is performed (S3). The two glass substrates cut by the glass substrate cutting process are each carried to an apparatus used in the next step.
  • FIG. 10 is a flowchart showing steps of a protective film cutting process in the glass substrate cutting apparatus 1 according to one embodiment of the present invention.
  • alignment is performed so that the set cutting start position of the protective film 110 and the position of the cutting edge of the first blade 11 match (S12).
  • This alignment may be automatically performed by an actuator included in the glass substrate cutting device 1, or may be manually set by an operator.
  • Positioning is performed on the blade edge of one blade 11.
  • the second roller 22 is aligned so that the first blade 11 corresponds to the set position (S13).
  • the coordinates determined in S12 may be acquired, and the actuator of the glass substrate cutting apparatus 1 may automatically determine the position of the second roller 22 based on the coordinates.
  • the position of the second roller 22 may be manually set by an operator.
  • the protection film 110 is cut (S15).
  • the use mode set for the first blade 11 and the second roller 22 ends (S16).
  • the first blade 11 and the second roller 22 that were in the use mode position return to the normal position.
  • the protection film cutting process is performed.
  • FIG. 11 is a flowchart showing a glass substrate scribing process in the display device manufacturing apparatus according to one embodiment of the present invention.
  • alignment is performed so that the set scribing start position of the mother glass substrate 100 and the position of the cutting edge of the second blade 21 match (S22).
  • This positioning may be automatically performed by an actuator of the glass substrate cutting apparatus 1 based on information such as coordinates indicating the position of a cutting line of the protective film 110, or manually set by an operator. It may be.
  • the first roller 12 is aligned so that the second blade 21 corresponds to the set position (S23).
  • the coordinates indicating the position of the cutting edge of the second blade 21 determined in S22 described above are acquired, and the actuator of the glass substrate cutting apparatus 1 automatically moves the first roller based on the coordinates. Twelve positions may be determined. Alternatively, the position of the first roller 12 may be manually set by an operator.
  • the mother glass substrate 100 is scribed (S25).
  • the use mode set for the second blade 21 and the first roller 12 ends (S26).
  • the second blade 21 and the first roller 12 that have been in the use mode position return to their normal positions.
  • the glass substrate scribing process is performed.
  • FIG. 12 is a flowchart showing a glass substrate cutting process in the display device manufacturing apparatus according to one embodiment of the present invention.
  • the first roller 12 and the second roller 22 are set to a use mode (S31).
  • the pedestal of the first roller 12 and the pedestal of the second roller 22 are respectively protruded from the normal position to the use mode position.
  • the pressing position of the mother glass substrate 100 set by the first roller 12 is set in advance (S32).
  • This alignment may be automatically performed by an actuator included in the glass substrate cutting device 1, or may be manually set by an operator.
  • the first roller 12 is aligned based on information such as coordinates indicating a position of a cutting line of the protective film 110 and coordinates indicating a scribe line of the mother glass substrate 100. .
  • the second roller 22 is aligned with the set position (S33).
  • the actuator of the glass substrate cutting apparatus 1 acquires the coordinates indicating the position of the first roller 12 determined in S32 described above, and determines the position of the second roller 22 based on the coordinates. You may. Alternatively, the position of the second roller 22 may be manually set by an operator.
  • the mother glass substrate 100 is cut (S35).
  • the use mode set for the first roller 12 or the second roller 22 ends (S36).
  • the first roller 12 or the second roller 22 at the position of the use mode returns to the normal position.
  • the glass substrate cutting process is performed.
  • the glass substrate cutting apparatus described above, and the glass substrate cutting method using the glass substrate cutting apparatus, even for a large glass substrate having a protective film formed on one surface, cutting the glass substrate without using a plurality of apparatuses Becomes possible.
  • the configuration in which the protective film is cut is shown, but a film other than the protective film may be formed on the glass substrate.
  • the first blade may have a cutting blade capable of cutting the film provided on the glass substrate.

Abstract

L'invention concerne un dispositif de coupe de substrat de verre et un procédé de coupe de substrat de verre qui peuvent couper un substrat de verre présentant un film protecteur formé sur une surface. Ce dispositif de coupe de substrat de verre est caractérisé en ce qu'il est pourvu de : un premier rouleau orienté vers la surface du substrat en verre sur lequel est formé le film protecteur ; une première lame orientée vers la surface du substrat en verre et destinée à couper le film protecteur ; un deuxième rouleau orienté vers l'autre surface du substrat en verre sur lequel le film protecteur n'est pas formé ; et une deuxième lame orientée vers l'autre surface du substrat en verre et servant à tracer le substrat en verre, le premier rouleau se déplaçant tout en étant en regard du deuxième rouleau ou la deuxième lame et le deuxième rouleau se déplaçant tout en étant en regard de la première lame.
PCT/JP2019/021393 2018-08-10 2019-05-29 Dispositif de coupe de substrat de verre et procédé de coupe de substrat de verre WO2020031470A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201980044045.XA CN112368245B (zh) 2018-08-10 2019-05-29 玻璃基板截断装置以及玻璃基板截断方法

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Application Number Priority Date Filing Date Title
JP2018151286A JP7171305B2 (ja) 2018-08-10 2018-08-10 ガラス基板切断方法
JP2018-151286 2018-08-10

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WO2020031470A1 true WO2020031470A1 (fr) 2020-02-13

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Citations (3)

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Publication number Priority date Publication date Assignee Title
WO2003040049A1 (fr) * 2001-11-08 2003-05-15 Sharp Kabushiki Kaisha Procede et dispositif destines a diviser un substrat de verre, panneau a cristaux liquides et dispositif de fabrication de panneau a cristaux liquides
WO2006129563A1 (fr) * 2005-05-30 2006-12-07 Mitsuboshi Diamond Industrial Co., Ltd. Dispositif et procédé de découpe de substrat en matériau fragile
JP2016108167A (ja) * 2014-12-03 2016-06-20 三星ダイヤモンド工業株式会社 スクライビングツールおよびスクライブ装置

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Publication number Priority date Publication date Assignee Title
JP2002316829A (ja) * 2001-04-17 2002-10-31 Seiko Epson Corp ガラス基板の切断方法、電気光学装置の製造方法、電気光学装置、電子機器、およびスクライブ溝形成装置
JP2003313036A (ja) * 2002-04-17 2003-11-06 Sharp Corp ガラス分断方法とその装置
TW200408061A (en) * 2002-07-02 2004-05-16 Mitsuboshi Diamond Ind Co Ltd Substrate slicing system for sealed substrates and the substrate slicing method
JP6471491B2 (ja) * 2014-12-24 2019-02-20 三星ダイヤモンド工業株式会社 スクライブ方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003040049A1 (fr) * 2001-11-08 2003-05-15 Sharp Kabushiki Kaisha Procede et dispositif destines a diviser un substrat de verre, panneau a cristaux liquides et dispositif de fabrication de panneau a cristaux liquides
WO2006129563A1 (fr) * 2005-05-30 2006-12-07 Mitsuboshi Diamond Industrial Co., Ltd. Dispositif et procédé de découpe de substrat en matériau fragile
EP1886782A1 (fr) * 2005-05-30 2008-02-13 Mitsuboshi Diamond Industrial Co., Ltd. Dispositif et procédé de découpe de substrat en matériau fragile
JP2016108167A (ja) * 2014-12-03 2016-06-20 三星ダイヤモンド工業株式会社 スクライビングツールおよびスクライブ装置

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JP7171305B2 (ja) 2022-11-15
CN112368245B (zh) 2022-11-29
JP2020026368A (ja) 2020-02-20

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