WO2020020334A1 - Adhésif conducteur, composition de matière première, élément électronique et procédé de préparation et application - Google Patents

Adhésif conducteur, composition de matière première, élément électronique et procédé de préparation et application Download PDF

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Publication number
WO2020020334A1
WO2020020334A1 PCT/CN2019/097874 CN2019097874W WO2020020334A1 WO 2020020334 A1 WO2020020334 A1 WO 2020020334A1 CN 2019097874 W CN2019097874 W CN 2019097874W WO 2020020334 A1 WO2020020334 A1 WO 2020020334A1
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WO
WIPO (PCT)
Prior art keywords
polymer
eaa
ethylene
resin
copolymer
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PCT/CN2019/097874
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English (en)
Chinese (zh)
Inventor
邓华
傅强
孙承啸
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杭州蓉阳电子科技有限公司
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Priority to JP2020567001A priority Critical patent/JP7196200B2/ja
Publication of WO2020020334A1 publication Critical patent/WO2020020334A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04—Homopolymers or copolymers of ethene
    • C09J123/08—Copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04—Homopolymers or copolymers of ethene
    • C09J123/08—Copolymers of ethene
    • C09J123/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
    • C09J123/0815—Copolymers of ethene with aliphatic 1-olefins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04—Homopolymers or copolymers of ethene
    • C09J123/08—Copolymers of ethene
    • C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C09J123/0869—Acids or derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/10—Homopolymers or copolymers of propene
    • C09J123/14—Copolymers of propene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C09J183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/085—Copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Abstract

L'invention concerne un adhésif conducteur, une composition de matière première, un élément électronique et un procédé de préparation et une application. La composition de matière première comprend les constituants suivants : une résine élastomère polymère, des particules conductrices et une poudre d'un adhésif fusible. Le rapport en masse entre la résine élastomère polymère et la poudre d'un adhésif fusible est de (4-17):(3-35) ; la résine élastomère polymère est une résine élastomère polymère dont la réticulation est amorcée par des peroxydes ; et un point de ramollissement de l'adhésif fusible, dans la poudre d'un adhésif fusible, est supérieur à 90 °C.
PCT/CN2019/097874 2018-07-27 2019-07-26 Adhésif conducteur, composition de matière première, élément électronique et procédé de préparation et application WO2020020334A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2020567001A JP7196200B2 (ja) 2018-07-27 2019-07-26 導電性接着剤、原料組成物、電子部品、製造方法及び使用

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201810847272 2018-07-27
CN201810847272.3 2018-07-27

Publications (1)

Publication Number Publication Date
WO2020020334A1 true WO2020020334A1 (fr) 2020-01-30

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PCT/CN2019/097874 WO2020020334A1 (fr) 2018-07-27 2019-07-26 Adhésif conducteur, composition de matière première, élément électronique et procédé de préparation et application

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JP (1) JP7196200B2 (fr)
CN (1) CN110776847B (fr)
WO (1) WO2020020334A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114410245A (zh) * 2021-12-30 2022-04-29 金发科技股份有限公司 一种聚乙烯热熔胶组合物及其制备方法
CN114464345A (zh) * 2022-02-24 2022-05-10 江苏集萃纳米应用技术研究所有限公司 导电银浆、制备方法及复合结构
WO2022215528A1 (fr) * 2021-04-05 2022-10-13 ユニチカ株式会社 Composition de résine et matériau élastomère comprenant ladite composition de résine

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113444487A (zh) * 2020-09-14 2021-09-28 浙江大学山东工业技术研究院 Led照明芯片散热用双组分加成型导热硅胶
CN112680168A (zh) * 2020-12-28 2021-04-20 苏州德佑新材料科技股份有限公司 导电性胶水的预混方法以及导电胶带及其制备方法
CN113355048A (zh) * 2021-06-04 2021-09-07 李峰 一种粘性强可剥落的热熔胶及其制备方法
CN113621299A (zh) * 2021-09-08 2021-11-09 青岛九维华盾科技研究院有限公司 一种轻质宽频电磁屏蔽涂料及其制备方法
CN114133726B (zh) * 2021-12-09 2023-06-20 万华化学集团股份有限公司 一种导电聚氨酯弹性体组合物及其制备方法和应用

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05279644A (ja) * 1992-03-31 1993-10-26 Sekisui Finechem Co Ltd 異方導電性接着シート
CN103540280A (zh) * 2013-09-27 2014-01-29 沈阳建筑大学 一种导热、导电热熔胶及其制备方法
CN103965818A (zh) * 2013-01-31 2014-08-06 日东电工株式会社 粘合剂组合物及粘合片
CN106633919A (zh) * 2015-10-28 2017-05-10 深圳德邦界面材料有限公司 一种fmvq/tpu导电复合材料

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101412822B1 (ko) * 2012-09-06 2014-06-27 삼성전기주식회사 외부전극용 전도성 페이스트, 이를 이용한 적층 세라믹 전자부품 및 이의 제조방법
WO2015068611A1 (fr) * 2013-11-07 2015-05-14 東洋インキＳｃホールディングス株式会社 Adhésif électroconducteur, feuille adhésive électroconductrice, dispositif de câblage et procédé de fabrication d'un dispositif de câblage

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05279644A (ja) * 1992-03-31 1993-10-26 Sekisui Finechem Co Ltd 異方導電性接着シート
CN103965818A (zh) * 2013-01-31 2014-08-06 日东电工株式会社 粘合剂组合物及粘合片
CN103540280A (zh) * 2013-09-27 2014-01-29 沈阳建筑大学 一种导热、导电热熔胶及其制备方法
CN106633919A (zh) * 2015-10-28 2017-05-10 深圳德邦界面材料有限公司 一种fmvq/tpu导电复合材料

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022215528A1 (fr) * 2021-04-05 2022-10-13 ユニチカ株式会社 Composition de résine et matériau élastomère comprenant ladite composition de résine
CN114410245A (zh) * 2021-12-30 2022-04-29 金发科技股份有限公司 一种聚乙烯热熔胶组合物及其制备方法
CN114464345A (zh) * 2022-02-24 2022-05-10 江苏集萃纳米应用技术研究所有限公司 导电银浆、制备方法及复合结构

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CN110776847A (zh) 2020-02-11
CN110776847B (zh) 2021-11-12
JP2021524881A (ja) 2021-09-16
JP7196200B2 (ja) 2022-12-26

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