WO2020020181A9 - 附着物回收方法及装置、真空成膜系统 - Google Patents

附着物回收方法及装置、真空成膜系统 Download PDF

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Publication number
WO2020020181A9
WO2020020181A9 PCT/CN2019/097356 CN2019097356W WO2020020181A9 WO 2020020181 A9 WO2020020181 A9 WO 2020020181A9 CN 2019097356 W CN2019097356 W CN 2019097356W WO 2020020181 A9 WO2020020181 A9 WO 2020020181A9
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WIPO (PCT)
Prior art keywords
recovery
attachment
cavity
preset
cleaned
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PCT/CN2019/097356
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English (en)
French (fr)
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WO2020020181A1 (zh
Inventor
鲁玉泉
Original Assignee
北京铂阳顶荣光伏科技有限公司
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Publication of WO2020020181A1 publication Critical patent/WO2020020181A1/zh
Publication of WO2020020181A9 publication Critical patent/WO2020020181A9/zh

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0623—Sulfides, selenides or tellurides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks

Definitions

  • the present disclosure relates to the technical field of equipment waste recovery, in particular to a method and device for recovering attachments, and a vacuum film forming system.
  • the deposit of the film forming material is thickly adhered to a place other than the substrate on which the thin film is formed, for example, in a vacuum container other than the substrate. Since these vacuum film forming apparatuses are used repeatedly, there will be more deposits on the vacuum film forming apparatus, and some metals will corrode the vacuum film forming apparatus, thereby destroying the vacuum film forming apparatus.
  • manual methods are often used to recover the attachments. However, when the attachments are manually recovered, the vacuum film forming device will be damaged and recycled. The pollution of the attachments is higher.
  • the embodiments of the present disclosure provide a method and device for recovering attachments, and a vacuum film forming system, which can solve the problem that the vacuum film forming device is damaged when the attachments are manually recovered in the related art, and the pollution of the recovered attachments is relatively high.
  • the problem. The technical solution is as follows:
  • an attachment recovery device including: a recovery cavity and a connecting member, the recovery cavity is provided with an opening;
  • the opening of the recovery cavity is communicated with the opening of the device to be cleaned through the communicating member, and the recovery cavity and the device to be cleaned form a closed space.
  • the connecting member includes a first flange interface, a second flange interface, and a connecting portion.
  • the first flange interface and the second flange interface have different diameters, and the first method
  • the flange interface is connected to the opening of the recovery cavity, the second flange interface is used to connect with the opening of the device to be cleaned, and the first flange interface and the second flange interface are connected through the connection
  • the connecting portion is provided with a central through hole.
  • the attachment recovery device further includes a diversion portion, and the diversion portion includes a connecting end and a diversion strip,
  • the connecting end is arranged around the central through hole
  • the guide bar extends into the recovery cavity.
  • the number of the guide portions is greater than or equal to two.
  • a plurality of the guide portions are symmetrically arranged around the central through hole of the connecting portion.
  • the inside of the recovery cavity has a tapered structure, and the area of the opening of the tapered structure is larger than the area of the bottom surface.
  • a vacuum device interface is provided on the cavity wall of the recovery cavity, and the vacuum device interface is used to connect a vacuum device.
  • the recovery cavity further includes a cooling part for cooling the recovery cavity.
  • the recovery cavity further includes a heating part for heating the attachments in the device to be cleaned.
  • the heating part includes a heating wire, which is arranged at the opening of the recovery cavity.
  • it further includes a display module for displaying the preset temperature and the preset duration of heating the attachments in the device to be cleaned and cooling the recovery cavity.
  • it further includes a communication module for transmitting the preset temperature and the preset duration to the target mobile terminal.
  • it further includes a processing module, which is electrically connected to the heating part and the cooling part, respectively.
  • the processing module receives a recycling instruction, it instructs the heating part and the cooling part to perform the pre-processing. Set the temperature and the preset duration.
  • it further includes a recycling button, which can be pressed to generate the recycling instruction.
  • it further includes a light sensor for detecting the light intensity in the recycling cavity, and when the light intensity is less than a preset value, sending the recycling instruction to the processing module.
  • a vacuum film forming system including a vacuum film forming device and the attached matter recovery device according to the first aspect
  • the opening of the recovery cavity of the attachment recovery device communicates with the opening of the holding cavity of the vacuum film forming device through a connecting member.
  • a method for recovering attachments including:
  • the recovery cavity is cooled to solidify the recovered attachments.
  • the preset heating temperature and preset heating duration are used when heating the attachments in the device to be cleaned, the preset heating temperature is 250-320 degrees Celsius, and the preset heating duration is 6. ⁇ 8 hours.
  • a preset cooling temperature and a preset cooling duration are used for cooling the recovery cavity, the preset cooling temperature is less than or equal to 20 degrees Celsius, and the preset cooling duration is greater than or equal to 5 hours.
  • the opening of the recovery cavity is communicated with the opening of the device to be cleaned through a connecting piece.
  • the recovery cavity and the device to be cleaned form a closed space.
  • the attachment recovery device is used to heat the attachments in the device to be cleaned and can convert the attachments into The liquid flows into the recovery cavity. Compared with the manual method in the related art, the liquid can protect the device to be cleaned and reduce the pollution of the recovered attachments.
  • Figure 1 is a schematic structural diagram of a melting device in the related art
  • FIG. 2 is a schematic structural diagram of an attachment recovery device provided by an embodiment of the present disclosure
  • FIG. 3 is a schematic structural diagram of another attachment recovery device provided by an embodiment of the present disclosure.
  • FIG. 4 is a schematic diagram of the structure of the connecting member and the guide portion provided by the embodiment of the present disclosure
  • FIG. 5 is a schematic structural diagram of a recovery cavity provided by an embodiment of the present disclosure.
  • FIG. 6 is a schematic structural diagram of a vacuum film forming system provided by an embodiment of the present disclosure.
  • FIG. 7 is a flowchart of a method for recycling attachments provided by an embodiment of the present disclosure.
  • the deposit of the film forming material is thickly adhered to a place other than the substrate on which the thin film is formed, for example, in a vacuum container other than the substrate. Since these vacuum film forming apparatuses are used repeatedly, there will be more deposits on the vacuum film forming apparatus, and some metals will corrode the vacuum film forming apparatus, thereby destroying the vacuum film forming apparatus.
  • a vacuum evaporation method can be used to heat the film-forming material to a molten state, and the vapor generated by the film-forming material in the molten state is transferred to the surface of the substrate through the vacuum chamber to condense into a thin film.
  • a vacuum evaporation method is required to form a thin film, such as forming a copper indium gallium selenide compound semiconductor thin film to serve as the absorption layer of the solar cell.
  • This process usually requires melting equipment.
  • FIG. 1 it mainly includes a containing cavity 11, a crucible 12 and a heating part 13.
  • the crucible 12 and the heating part 13 are arranged in the containing cavity 11.
  • the crucible 12 contains the film-forming material 14, and the heating part 13 heats the crucible 12 to melt the film-forming material 14 in the crucible 12 to a molten state and generate steam.
  • the steam is ejected from the opening of the containing cavity 11 and reaches The surface of the substrate is attached to the surface of the substrate (not shown in Figure 1).
  • the heating part 13 will thickly adhere to the deposits of the film-forming material. As the melting equipment is repeatedly used, the deposits on the heating part 13 will increase, and the selenium element in the film-forming material will cause the melting equipment Corrosion, which will destroy the melting equipment.
  • the attachment recovery device provided by the embodiment of the present disclosure is used to heat the attachments in the cleaning device, so that the attachments are converted into liquid and flow into the recovery cavity, which can protect the vacuum film forming device and reduce the recovery.
  • the attachment recovery device 20 includes: a recovery cavity 21 and a connecting member 22.
  • the recovery cavity 21 is provided with an opening 213; and the recovery cavity 21
  • the opening 213 is communicated with the opening 301 of the device 30 to be cleaned through the connecting member 22, and the recovery cavity 21 and the device 30 to be cleaned form a closed space.
  • the attachment recovery device 20 is used to heat the attachments 31 in the device 30 to be cleaned, so that the attachments 31 are converted into liquid and flow into the recovery cavity 21.
  • the opening of the recovery cavity is communicated with the opening of the device to be cleaned through the connecting member, and the recovery cavity and the device to be cleaned form a closed space.
  • the attachment recovery device is used for Heating the attachments in the device to be cleaned can convert the attachments into liquid and flow into the recovery cavity. Compared with the manual method in the related art, it can protect the device to be cleaned and reduce the recovery of attachments. Pollution degree.
  • FIG. 3 is a schematic structural diagram of another attachment recovery device provided by an embodiment of the present disclosure on the basis of FIG. 2.
  • the attachment recovery device includes a recovery cavity 21, a connecting member 22 and a flow guide 23.
  • the recovery cavity 21 is provided with an opening; the opening of the recovery cavity 21 communicates with the opening of the device to be cleaned 30 through the connecting member 22, and the recovery cavity 21 and the device to be cleaned 30 form a closed space.
  • the attachment recovery device is used to heat the attachments 31 in the cleaning device 30 so that the attachments 31 are converted into liquid and flow into the recovery cavity 21.
  • the attachment recovery device provided by the embodiment of the present disclosure can heat the attachment 31 in the device 30 to be cleaned through the heating part of the device 30 to be cleaned. Utilizing the existing heating part of the device to be cleaned 30 can simplify the structure of the attachment recovery device and reduce the manufacturing cost of the attachment recovery device.
  • the attachment recovery device provided by the embodiment of the present disclosure may include a heating part, and the heating part may be provided in the recovery cavity 21, and the attachment recovery device passes the heating part to the cleaning device 30 The attached matter 31 in the heat is heated.
  • the heating part may include a heating wire, and the heating wire may be disposed at the opening of the recovery cavity 21.
  • the connecting member can be formed by transition flanges, including a first flange interface 221, a second flange interface 222, and the first flange interface 221 and the second flange interface 222.
  • the diameter of the connecting portion 223 between the first flange interface 221 and the second flange interface 222 are different.
  • the first flange interface 221 is connected to the opening of the recovery cavity, and the second flange interface 222 is used to connect to the device to be cleaned. The opening is connected.
  • the first flange interface 221 and the second flange interface 222 are connected by a connecting portion 223 provided with a central through hole 224.
  • first flange interface and the opening of the recovery cavity can be connected by caliper screws
  • second flange interface and the opening of the device to be cleaned can be connected by caliper screws
  • the flow guide portion 23 includes a connecting end 231 and a flow guide bar 232, the connecting end 231 is arranged around the central through hole; the flow guide bar 232 extends into the recovery cavity.
  • the diversion part is used to divert the liquid generated by the attachment recovery device heating the attachment to the recovery cavity to improve the recovery efficiency of the attachment.
  • the number of the guide portions 23 is greater than or equal to two.
  • the attachment recovery devices shown in Figs. 3 and 4 are both described with two guides as an example.
  • a plurality of guide portions 23 are arranged symmetrically around the center of the central through hole 224 of the connecting portion 223 and extend into the recovery cavity. In this way, the recovery efficiency of attachments can be further improved .
  • a vacuum device interface 211 is provided on the cavity wall of the recovery cavity 21, and the vacuum device interface 211 is used to connect the vacuum device 40.
  • the vacuum device 40 is used for vacuuming the enclosed space formed by the recovery cavity 21 and the device 30 to be cleaned.
  • the vacuum equipment can keep the enclosed space formed by the recovery cavity and the device to be cleaned in a vacuum state, further reducing the pollution of the recovered attachments, and at the same time can avoid damage to the components in the device to be cleaned.
  • the vacuum equipment includes a vacuum pump, and the vacuum pump is connected to the vacuum equipment interface through a corrugated pipe.
  • the distance d between the center of the vacuum device interface 211 and the bottom of the recovery cavity 21 is greater than or equal to 60 mm.
  • the distance between the center of the vacuum device interface and the bottom of the recovery cavity is relatively large, which can prevent the vacuum device interface from being blocked by recovered attachments.
  • the recovery cavity 21 further includes a cooling part 212 for cooling the recovery cavity 21.
  • the attachment recovery device heats the attachments in the cleaning device so that the attachments are converted into liquid and flow into the recovery cavity.
  • the cooling part then cools the recovery cavity to solidify the recovered attachments. Store the recovered attachments to facilitate next use.
  • the cooling part may adopt water cooling to cool the recovery cavity.
  • the inside of the recovery cavity 21 has a tapered structure, and the area of the opening of the tapered structure is larger than the area of the bottom surface.
  • the inside of the recovery cavity is a tapered structure, which is convenient to quickly take out the solidified attachments.
  • a vacuum device interface 211 is provided on the cavity wall of the recovery cavity 21 in FIG. 5.
  • the opening of the recovery cavity 21 of the attachment recovery device may be passed through the connecting member 22 and the device 30 to be cleaned.
  • the opening is connected, the recovery cavity 21 and the device to be cleaned 30 form a closed space; then the closed space formed by the recovery cavity 21 and the device to be cleaned 30 is evacuated; then the attachment 31 in the device to be cleaned 30 is heated to attach
  • the attached matter 31 is converted into a liquid and flows into the recovery cavity 21; after that, the recovery cavity 21 is cooled to solidify the recovered attached matter.
  • the preset heating temperature and the preset heating time can be used for heating, and the recovery cavity can be cooled by using the preset cooling temperature and the preset cooling time.
  • the preset heating temperature may be 250-320 degrees Celsius, and the preset heating time may be 6-8 hours.
  • the preset heating temperature is 300 degrees Celsius, and the preset heating time is 6 hours.
  • the preset cooling temperature may be less than or equal to 20 degrees Celsius, and the preset cooling period may be greater than or equal to 5 hours.
  • the preset cooling temperature is 20 degrees Celsius, and the preset cooling time is 5 hours.
  • the attachment recovery device may further include a display module for displaying the preset heating temperature used when the attachment recovery device heats the attachment in the device to be cleaned And the preset heating time, as well as the preset cooling temperature and preset cooling time used when the cooling part cools the recovery cavity, the user can intuitively get the preset temperature (including the preset heating temperature and the preset cooling temperature) through the display module And preset duration (including preset heating duration and preset cooling duration).
  • the display module may be a light-emitting diode (Light-Emitting Diode, LED) display panel.
  • the display module can also be used to display the time used for heating the attachments in the device to be cleaned and the time used for cooling the recovery cavity, so that the user can understand the recovery progress in time. For example, at the current moment, the attachment recovery device is heating the attachments in the device to be cleaned. If it has been heated for 2 hours, the display module can also display the 2 hours.
  • the attachment recovery device may further include a communication module for transmitting data of the preset heating temperature, preset heating duration, preset cooling temperature, and preset cooling duration To the target mobile terminal, so that the target mobile terminal displays the preset temperature and preset duration.
  • the communication module can also be used to transmit data of the used time for heating or cooling to the target mobile terminal, so that the target mobile terminal displays the used time, so that the user holding the target mobile terminal can understand the processing progress in time.
  • the attachment recovery device may include a processing module which is electrically connected to the heating part and the cooling part.
  • the processing module instructs the heating part to use The preset heating temperature and preset heating duration heat the attachments in the cleaning device, so that the attachments are converted into liquid and flow into the recovery cavity; after that, the processing module instructs the cooling unit to use the preset cooling temperature and preset cooling duration to recover The cavity cools to solidify the recovered attachments.
  • the processing module is a processor.
  • the attachment recovery device can be provided with a recovery button, when the user presses the recovery button, a recovery instruction is generated, and the processing module receives the recovery instruction triggered by the user. In this way, through the user's one-key operation, the attachment recovery device can sequentially complete the heating process and the cooling process.
  • a light sensor can be installed in the recovery cavity.
  • the light sensor is used to detect the light intensity in the recovery cavity, and when the light intensity is less than a preset value, send a recovery instruction to the processing module.
  • the processing module receives the recovery instruction
  • a preset time period (the preset time period is the time corresponding to vacuuming the enclosed space formed by the recovery cavity and the device to be cleaned) instructs the heating section to use the preset heating temperature and the preset heating time for treatment
  • the attachment in the cleaning device is heated, and then the cooling part is instructed to cool the recovery cavity by using the preset cooling temperature and the preset cooling time. In this way, the attachment recovery device can automatically complete heating and cooling after the recovery cavity and the device to be cleaned form a closed space.
  • the opening of the recovery cavity is communicated with the opening of the device to be cleaned through the connecting member, and the recovery cavity and the device to be cleaned form a closed space.
  • the attachment recovery device is used for Heating the attachments in the device to be cleaned can convert the attachments into liquid and flow into the recovery cavity. Compared with the manual method in the related art, it can protect the device to be cleaned and reduce the recovery of attachments. Pollution degree.
  • the embodiments of the present disclosure also provide a vacuum film forming system, which includes a vacuum film forming device and the attachment recovery device provided in the above-mentioned embodiments.
  • the attachment recovery device may be the one shown in FIG. 2 or FIG. 3 Attachment recovery device.
  • the opening of the recovery cavity of the attachment recovery device is communicated with the opening of the containing cavity of the vacuum film forming device through a connecting piece.
  • the vacuum film forming device may be a melting device for preparing solar cells.
  • the melting device is shown in FIG. 1 and mainly includes a holding cavity 11, a crucible 12, and a heating part 13.
  • the vacuum film forming system may As shown in FIG. 6, the opening of the recovery cavity 21 of the attachment recovery device communicates with the opening of the containing cavity 11 of the melting device through the connecting member 22, and the recovery cavity 21 and the containing cavity 11 form a closed space.
  • the attachment recovery device can recover the attachments attached to the heating part 13, so the heating part can be reused, avoiding the influence of the use function of the heating part, protecting the melting equipment, and reducing the recovery The degree of contamination of the attached objects, the attached objects can be reused.
  • the vacuum film forming system provided by the embodiments of the present disclosure may be set in an equipment cabinet, which includes a cabinet body and a front door movably arranged at the front end of the cabinet body.
  • the opening and closing modes of the front door are In push-pull mode, the front stop door is provided with a lock structure, and the front stop door is connected to the cabinet through the lock structure.
  • the equipment cabinet protects the vacuum film forming system.
  • the inner wall of the equipment cabinet may be made of galvanized steel sheet.
  • the side wall of the equipment cabinet may be provided with a through hole for the power cord to pass through, and the vacuum film forming system is electrically connected with the power source outside the equipment cabinet through the power cord.
  • the side wall of the equipment cabinet may also be provided with through holes for the passage of vacuum pipes (such as corrugated pipes), and the vacuum equipment interface of the recovery cavity of the attachment recovery device is connected to the vacuum equipment outside the equipment cabinet through the corrugated pipes.
  • vacuum pipes such as corrugated pipes
  • the lower end of the cabinet body of the equipment cabinet can also be provided with at least one layer of support plates along the height direction of the cabinet body, the surface of each support plate is perpendicular to the height direction of the cabinet body, and the power supply and vacuum equipment can be arranged on the support plate.
  • FIG. 7 is a flowchart of a method for recycling attachments provided by an embodiment of the present disclosure. The method can be used in the attachment recovery device shown in FIG. 2 or FIG. 3, and the method for recycling attachments includes:
  • Step 701 Connect the opening of the recovery cavity of the attachment recovery device with the opening of the device to be cleaned through the connecting member, and the recovery cavity and the device to be cleaned form a closed space.
  • Step 702 Vacuum the enclosed space formed by the recovery cavity and the device to be cleaned.
  • a vacuum device interface 211 is provided on the cavity wall of the recovery cavity 21, and the vacuum device interface 211 is used to connect the vacuum device 40.
  • the enclosed space formed by the recovery cavity 21 and the device 30 to be cleaned can be evacuated by the vacuum device 40.
  • the enclosed space formed by the recovery cavity 21 and the device to be cleaned 30 can always be in a vacuum state, further reducing the pollution degree of the recovered attachments, and at the same time avoiding damage to the components in the device to be cleaned.
  • Step 703 Heat the attachments in the device to be cleaned to convert the attachments into liquid and flow into the recovery cavity.
  • the attachments in the device to be cleaned can be heated by the heating part of the device to be cleaned.
  • the preset heating temperature and the preset heating duration can be used for heating.
  • the preset heating temperature may be 250-320 degrees Celsius, and the preset heating time may be 6-8 hours.
  • the attachments in the cleaning device can be heated at 300 degrees Celsius for 6 hours to convert the attachments into liquid and flow into the recovery cavity.
  • Step 704 Cool the recovery cavity to solidify the recovered attachments.
  • the recovery cavity can be cooled by the cooling part included in the recovery cavity.
  • the preset cooling temperature and the preset cooling duration can be used for cooling.
  • the preset cooling temperature may be less than or equal to 20 degrees Celsius, and the preset cooling period may be greater than or equal to 5 hours.
  • the recovery cavity can be continuously cooled at 20 degrees Celsius for 5 hours to solidify the recovered attachments, which is convenient for storage of the recovered attachments and convenient for next use.
  • the attachment recovery method provided by the embodiments of the present disclosure first connects the opening of the recovery cavity of the attachment recovery device to the opening of the device to be cleaned through the connecting piece, and the recovery cavity and the device to be cleaned form a closed space. Then vacuumize the enclosed space formed by the recovery cavity and the device to be cleaned, and then heat the attachments in the cleaning device to convert the attachments into liquid and flow into the recovery cavity. After that, the recovery cavity is cooled to make the recovery Compared with the artificial method in the related art, the solidification of the attachments can protect the device to be cleaned and reduce the pollution degree of the recovered attachments.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance.
  • plurality refers to two or more, unless specifically defined otherwise.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Cleaning In General (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)

Abstract

一种附着物回收装置（20），包括：回收腔体（21）和连通件（22），回收腔体（21）设置有开口（213）；回收腔体（21）的开口（213）通过连通件（22）与待清理装置（30）的开口（301）连通，回收腔体（21）和待清理装置（30）形成密闭空间。还包括一种附着物回收方法。

Description

[根据细则91更正 06.12.2019]　附着物回收方法及装置、真空成膜系统
交叉引用
本公开要求于2018年7月23日提交的申请号为201810813909.7的中国专利申请的优先权，该中国专利申请的全部内容通过引用全部并入本文。
技术领域
本公开涉及设备余料回收技术领域，特别涉及一种附着物回收方法及装置、真空成膜系统。
背景技术
近年来，有大量产品或设备需要镀膜技术来实现，其包括太阳能电池、液晶板的平板显示板、半导体装置和存储器等。上述产品和设备可通过使用溅射法、真空蒸镀法、离子喷镀法等真空成膜法的真空成膜装置制备，成膜材料中使用稀有金属的情况也很多。采用稀有金属，特别是铟或钽等稀有金属作为成膜材料使用存在其资源枯竭的问题。为了缓解上述问题，正在寻找能够控制在现有的生产阶段和使用阶段的废弃量的、回收并循环上述稀有金属的处理技术的确定和具体的对策。
通常，采用上述真空成膜法，在形成薄膜的基板之外的地方，例如基板之外的真空容器内会厚厚地附着着成膜材料的附着物。由于这些真空成膜装置被反复使用，因此，附着在真空成膜装置上的附着物会变多，并且由于一些金属会对真空成膜装置产生腐蚀作用，从而会破坏真空成膜装置。相关技术中，为了保护真空成膜装置，并回收真空成膜装置上的附着物，常常是采用人工方式回收附着物，然而采用人工方式回收附着物时会使真空成膜装置产生破损，而且回收的附着物的污染度较高。
公开内容
本公开实施例提供了一种附着物回收方法及装置、真空成膜系统，可以解决相关技术中采用人工方式回收附着物时使真空成膜装置产生破损，而且回收的附着物的污染度较高的问题。所述技术方案如下：
根据本公开实施例的第一方面，提供一种附着物回收装置，包括：回收腔体和连通件， 所述回收腔体设置有开口；
所述回收腔体的开口通过所述连通件与待清理装置的开口连通，所述回收腔体和所述待清理装置形成密闭空间。
在一实施例中，所述连通件包括第一法兰接口、第二法兰接口以及连接部，所述第一法兰接口和所述第二法兰接口的直径不同，所述第一法兰接口与所述回收腔体的开口连接，所述第二法兰接口用于与所述待清理装置的开口连接，所述第一法兰接口和所述第二法兰接口通过所述连接部连接，所述连接部设置有中中心通孔。
在一实施例中，所述附着物回收装置还包括导流部，所述导流部包括连接端和导流条，
所述连接端围绕所述中心通孔设置；
所述导流条向所述回收腔体内延伸。
在一实施例中，所述导流部的数量大于或等于2。
在一实施例中，多个所述导流部围绕所述连接部的所述中心通孔对称设置。
在一实施例中，所述回收腔体的内部为锥形结构，所述锥形结构的开口的面积大于底面的面积。
在一实施例中，所述回收腔体的腔体壁上设置有真空设备接口，所述真空设备接口用于连接真空设备。
在一实施例中，所述回收腔体还包括冷却部，用于冷却所述回收腔体。
在一实施例中，所述回收腔体还包括加热部，用于加热所述待清理装置中的附着物。
在一实施例中，所述加热部包括加热丝，设置在所述回收腔体的开口处。
在一实施例中，还包括显示模块，用于显示对所述待清理装置中的附着物进行加热以及对所述回收腔体冷却时的预设温度和预设时长。
在一实施例中，还包括通讯模块，用于将所述预设温度和所述预设时长传输至目标移动终端。
在一实施例中，还包括处理模块，其分别与所述加热部和所述冷却部电连接，所述处理模块接收到回收指令时，指示所述加热部和所述冷却部执行所述预设温度以及所述预设时长。
在一实施例中，还包括一回收按键，按下后能够产生所述回收指令。
在一实施例中，还包括一光照传感器，用于检测所述回收腔体内的光照强度，并在光照强度小于预设值时，向所述处理模块发送所述回收指令。
根据本公开实施例的第二方面，提供一种真空成膜系统，包括真空成膜装置和根据第 一方面所述的附着物回收装置，
所述附着物回收装置的回收腔体的开口通过连通件与所述真空成膜装置的盛放腔体的开口连通。
根据本公开实施例的第三方面，提供一种附着物回收方法，所述方法包括：
将附着物回收装置的回收腔体的开口通过连通件与待清理装置的开口连通，所述回收腔体和所述待清理装置形成密闭空间；
对所述回收腔体和所述待清理装置形成的密闭空间进行抽真空；
对所述待清理装置中的附着物进行加热，使所述附着物转换为液体并流入所述回收腔体内；
对所述回收腔体冷却，使回收的所述附着物凝固。
在一实施例中，对所述待清理装置中的附着物进行加热时采用预设加热温度和预设加热时长，所述预设加热温度为250～320摄氏度，所述预设加热时长为6～8小时。
在一实施例中，对所述回收腔体冷却采用预设冷无温度和预设冷却时长，所述预设冷却温度小于或等于20摄氏度，所述预设冷却时长大于或等于5小时。
本公开实施例提供的技术方案至少包括以下有益效果：
回收腔体的开口通过连通件与待清理装置的开口连通，回收腔体和待清理装置形成密闭空间，该附着物回收装置用于对待清理装置中的附着物进行加热，能够使附着物转换为液体并流入回收腔体内，相较于相关技术中的人工方式，可以起到保护待清理装置的作用，且降低了回收的附着物的污染度。
附图说明
为了更清楚地说明本公开的实施例，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是相关技术中一种熔融设备的结构示意图；
图2是本公开实施例提供的一种附着物回收装置的结构示意图；
图3是本公开实施例提供的另一种附着物回收装置的结构示意图；
图4是本公开实施例提供的连通件和导流部的结构示意图；
图5是本公开实施例提供的一种回收腔体的结构示意图；
图6是本公开实施例提供的一种真空成膜系统的结构示意图；
图7是本公开实施例提供的一种附着物回收方法的流程图。
具体实施方式
为了使本公开的目的、技术方案和优点更加清楚，下面将结合附图对本公开作进一步地详细描述，显然，所描述的实施例仅仅是本公开一部份实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本公开保护的范围。
通常，采用真空成膜法，在形成薄膜的基板之外的地方，例如基板之外的真空容器内会厚厚地附着着成膜材料的附着物。由于这些真空成膜装置被反复使用，因此，附着在真空成膜装置上的附着物会变多，并且由于一些金属会对真空成膜装置产生腐蚀作用，从而会破坏真空成膜装置。例如，采用真空蒸镀法可以将成膜材料加热至熔融状态，成膜材料在熔融状态下产生的蒸气经真空室转移到基板表面凝结成薄膜。示例的，在太阳能电池的制备过程中，需要采用真空蒸镀法形成薄膜，比如形成铜铟镓硒化合物半导体薄膜，以作为太阳能电池的吸收层，该过程通常要用到熔融设备，该熔融设备如图1所示，主要包括盛放腔体11、坩埚12和加热部13，坩埚12和加热部13设置在盛放腔体11内。其中，坩埚12盛放成膜材料14，加热部13对坩埚12进行加热，使坩埚12中的成膜材料14融化至熔融状态并产生蒸气，蒸汽从盛放腔体11的开口喷出，到达基板表面，并附着在基板(图1中未画出)表面。而加热部13会厚厚地附着着成膜材料的附着物，由于熔融设备被反复使用，附着在加热部13上的附着物会变多，并且由于成膜材料中的硒元素会对熔融设备产生腐蚀作用，从而会破坏熔融设备。
相关技术中，为了保护真空成膜装置，并回收真空成膜装置上的附着物，常常是采用人工方式回收附着物，然而采用人工方式回收附着物时会使真空成膜装置产生破损，而且回收的附着物的污染度较高。
而本公开实施例提供的附着物回收装置用于对待清理装置中的附着物进行加热，使得附着物转换为液体并流入回收腔体内，可以起到保护真空成膜装置的作用，且降低了回收的附着物的污染度。
图2是本公开实施例提供的一种附着物回收装置20的结构示意图，该附着物回收装置20包括：回收腔体21和连通件22，回收腔体21设置有开口213；回收腔体21的开口213通过连通件22与待清理装置30的开口301连通，回收腔体21和待清理装置30形成密闭空间。
该附着物回收装置20用于对待清理装置30中的附着物31进行加热，使得附着物31转换为液体并流入回收腔体21内。
综上所述，本公开实施例提供的附着物回收装置，回收腔体的开口通过连通件与待清理装置的开口连通，回收腔体和待清理装置形成密闭空间，该附着物回收装置用于对待清理装置中的附着物进行加热，能够使附着物转换为液体并流入回收腔体内，相较于相关技术中的人工方式，可以起到保护待清理装置的作用，且降低了回收的附着物的污染度。
图3是本公开实施例在图2的基础上提供的另一种附着物回收装置的结构示意图，该附着物回收装置包括：回收腔体21，连通件22和导流部23。
其中，回收腔体21设置有开口；回收腔体21的开口通过连通件22与待清理装置30的开口连通，回收腔体21和待清理装置30形成密闭空间。
该附着物回收装置用于对待清理装置30中的附着物31进行加热，使得附着物31转换为液体并流入回收腔体21内。
示例的，当待清理装置30设置有加热部时，本公开实施例提供的附着物回收装置可以通过待清理装置30的加热部对待清理装置30中的附着物31进行加热，这样一来，充分利用了待清理装置30已有的加热部，可以简化附着物回收装置的结构，降低附着物回收装置的制造成本。当待清理装置30未设置加热部时，本公开实施例提供的附着物回收装置可以包括加热部，该加热部可以设置在回收腔体21内，附着物回收装置通过该加热部对待清理装置30中的附着物31进行加热。示例的，该加热部可以包括加热丝，加热丝可以设置在回收腔体21的开口处。
在一实施例中，如图4所示，连通件可以过渡法兰组建，包括第一法兰接口221、第二法兰接口222以及设置在第一法兰接口221与第二法兰接口222之间的连接部223，第一法兰接口221和第二法兰接口222的直径不同，第一法兰接口221与回收腔体的开口连接，第二法兰接口222用于与待清理装置的开口连接。第一法兰接口221和第二法兰接口222通过连接部223连接，该连接部223设置有中心通孔224。
其中，第一法兰接口与回收腔体的开口可以通过卡钳螺钉连接，第二法兰接口与待清理装置的开口可以通过卡钳螺钉连接。
如图4所示，导流部23包括连接端231和导流条232，连接端231围绕所述中心通孔设置；导流条232向回收腔体内延伸。导流部用于将附着物回收装置对附着物进行加热所产生的液体导流至回收腔体中，以提高附着物回收效率。
在一实施例中，导流部23的数量大于或等于2。图3和图4示出的附着物回收装置均 以2个导流部为例进行说明。
在一实施例中，如图4所示，多个导流部23围绕连接部223的中心通孔224的中心对称设置，并向回收腔体内延伸，这样一来，可以进一步提高附着物回收效率。
在一实施例中，如图3所示，回收腔体21的腔体壁上设置有真空设备接口211，该真空设备接口211用于连接真空设备40。真空设备40用于对回收腔体21和待清理装置30形成的密闭空间进行抽真空。真空设备可以使回收腔体和待清理装置形成的密闭空间始终处于真空状态，进一步降低回收的附着物的污染度，同时可以避免待清理装置内的各部件产生破损。示例的，真空设备包括真空泵，真空泵通过波纹管道与真空设备接口连接。
在一实施例中，如图3所示，真空设备接口211的中心与回收腔体21的底部之间的距离d大于或等于60毫米。真空设备接口的中心与回收腔体的底部之间的距离较大，可以避免真空设备接口被回收的附着物堵住。
在一实施例中，如图3所示，回收腔体21还包括冷却部212，用于冷却回收腔体21。在本公开实施例中，附着物回收装置对待清理装置中的附着物进行加热，使得附着物转换为液体并流入回收腔体内，冷却部再对回收腔体冷却，使回收的附着物凝固，便于对回收的附着物进行存储，方便下次使用。示例的，冷却部可以采用水冷的方式冷却回收腔体。
在一实施例中，如图5所示，回收腔体21的内部为锥形结构，该锥形结构的开口的面积大于底面的面积。回收腔体的内部为锥形结构，便于快速取出凝固后的附着物。图5中回收腔体21的腔体壁上设置有真空设备接口211。
参见图3，在使用本公开实施例提供的附着物回收装置回收待清理装置中的附着物时，可以先将附着物回收装置的回收腔体21的开口通过连通件22与待清理装置30的开口连通，回收腔体21和待清理装置30形成密闭空间；再对回收腔体21和待清理装置30形成的密闭空间进行抽真空；然后对待清理装置30中的附着物31进行加热，使附着物31转换为液体并流入回收腔体21内；之后，对回收腔体21冷却，使回收的附着物凝固。其中，对待清理装置中的附着物进行加热时可以采用预设加热温度和预设加热时长进行加热，对回收腔体冷却时可以采用预设冷却温度和预设冷却时长进行冷却。
在一实施例中，预设加热温度可以为250～320摄氏度，预设加热时长可以为6～8小时。比如预设加热温度为300摄氏度，预设加热时长为6小时。
在一实施例中，预设冷却温度可以小于或等于20摄氏度，预设冷却时长可以大于或等于5小时。比如预设冷却温度为20摄氏度，预设冷却时长为5小时。
在一实施例中，本公开实施例提供的附着物回收装置还可以包括显示模块，该显示模 块用于显示该附着物回收装置对待清理装置中的附着物进行加热时所采用的预设加热温度和预设加热时长，以及冷却部冷却回收腔体时所采用的预设冷却温度和预设冷却时长，用户通过该显示模块可以直观得到预设温度(包括预设加热温度和预设冷却温度)和预设时长(包括预设加热时长和预设冷却时长)的数据。示例的，该显示模块可以为发光二极管(Light-Emitting Diode，LED)显示面板。
在一实施例中，显示模块还可以用于显示对待清理装置中的附着物进行加热已使用的时长，以及对回收腔体冷却已使用的时长，便于用户及时了解回收进度。比如，当前时刻，附着物回收装置正在对待清理装置中的附着物进行加热，假设已加热2小时，那么显示模块还可以对这2小时进行显示。
在一实施例中，本公开实施例提供的附着物回收装置还可以包括通讯模块，该通讯模块用于将预设加热温度、预设加热时长、预设冷却温度以及预设冷却时长的数据传输至目标移动终端，使得目标移动终端对预设温度和预设时长进行显示。该通讯模块还可以用于将加热或冷却已使用的时长的数据传输至目标移动终端，使得目标移动终端对已使用的时长进行显示，便于持有该目标移动终端的用户及时了解处理进度。
在一实施例中，本公开实施例提供的附着物回收装置可以包括处理模块，该处理模块分别与加热部和冷却部电连接，当该处理模块接收到回收指令时，处理模块指示加热部采用预设加热温度和预设加热时长对待清理装置中的附着物进行加热，使附着物转换为液体并流入回收腔体内；之后，处理模块指示冷却部采用预设冷却温度和预设冷却时长对回收腔体冷却，使回收的附着物凝固。示例的，处理模块为处理器。
其中，处理模块接收回收指令可以有多种方式，下面以以下两种方式为例进行说明。
第一种方式，附着物回收装置可以设置一回收按键，当用户按下该回收按键时，产生回收指令，处理模块接收由用户触发的回收指令。在该种方式中，通过用户的一键操作，附着物回收装置可以依次完成加热处理和冷却处理。
第二种方式，回收腔体内可以设置一光照传感器，该光照传感器用于检测回收腔体内的光照强度，并在光照强度小于预设值时，向处理模块发送回收指令，当回收腔体内的光照强度小于预设值时，表明回收腔体和待清理装置已形成密闭空间。处理模块接收到回收指令后经过预设时长(该预设时长为对回收腔体和待清理装置形成的密闭空间进行抽真空对应的时长)指示加热部采用预设加热温度和预设加热时长对待清理装置中的附着物进行加热，然后指示冷却部采用预设冷却温度和预设冷却时长对回收腔体冷却。在该种方式中，附着物回收装置可以在回收腔体和待清理装置形成密闭空间后自动完成加热处理和冷却。
综上所述，本公开实施例提供的附着物回收装置，回收腔体的开口通过连通件与待清理装置的开口连通，回收腔体和待清理装置形成密闭空间，该附着物回收装置用于对待清理装置中的附着物进行加热，能够使附着物转换为液体并流入回收腔体内，相较于相关技术中的人工方式，可以起到保护待清理装置的作用，且降低了回收的附着物的污染度。
本公开实施例还提供一种真空成膜系统，该真空成膜系统包括真空成膜装置和上述实施例所提供的附着物回收装置，该附着物回收装置可以为图2或图3所示的附着物回收装置。
附着物回收装置的回收腔体的开口通过连通件与真空成膜装置的盛放腔体的开口连通。
示例的，真空成膜装置可以为用于制备太阳能电池的熔融设备，该熔融设备如图1所示，主要包括盛放腔体11、坩埚12和加热部13，相应的，真空成膜系统可以如图6所示，附着物回收装置的回收腔体21的开口通过连通件22与熔融设备的盛放腔体11的开口连通，回收腔体21和盛放腔体11形成密闭空间。附着物回收装置能够对附着在加热部13上的附着物进行回收，所以加热部可以被重复使用，避免了加热部的使用功能受到影响，起到了保护熔融设备的作用，且降低了回收的附着物的污染度，附着物能够被再次利用。
在一实施例中，本公开实施例提供的真空成膜系统可以设置在设备柜中，设备柜包括柜体和活动设置在柜体前端的前挡门，该前挡门的打开和闭合方式为推拉方式，该前挡门上设置有锁扣结构，前挡门通过锁扣结构与柜体相连接。设备柜对真空成膜系统起到保护作用。
在一实施例中，为了降低设备柜的成本，设备柜的内壁可以采用镀锌钢板制成。
设备柜的侧壁可以设置有用于电源线穿过的通孔，真空成膜系统通过电源线与设备柜外部的电源电连接。
设备柜的侧壁还可以设置有用于真空管道(比如波纹管道)穿过的通孔，附着物回收装置的回收腔体的真空设备接口通过波纹管道与设备柜外部的真空设备连接。
设备柜的柜体的下端还可以沿柜体的高度方向设置至少一层支撑板，每层支撑板的板面与柜体的高度方向垂直，电源和真空设备可以设置在支撑板上。
图7是本公开实施例提供的一种附着物回收方法的流程图，该方法可以用于图2或图3所示的附着物回收装置，该附着物回收方法包括：
步骤701、将附着物回收装置的回收腔体的开口通过连通件与待清理装置的开口连通，回收腔体和待清理装置形成密闭空间。
步骤702、对回收腔体和待清理装置形成的密闭空间进行抽真空。
如图3所示，回收腔体21的腔体壁上设置有真空设备接口211，该真空设备接口211用于连接真空设备40。
在本步骤中，可以通过真空设备40对回收腔体21和待清理装置30形成的密闭空间进行抽真空。通过执行步骤702，可以使回收腔体21和待清理装置30形成的密闭空间始终处于真空状态，进一步降低回收的附着物的污染度，同时可以避免待清理装置内的各部件产生破损。
步骤703、对待清理装置中的附着物进行加热，使附着物转换为液体并流入回收腔体内。
当待清理装置设置有加热部时，可以通过待清理装置的加热部对待清理装置中的附着物进行加热。对待清理装置中的附着物进行加热时可以采用预设加热温度和预设加热时长进行加热。
在一实施例中，预设加热温度可以为250～320摄氏度，预设加热时长可以为6～8小时。比如可以采用300摄氏度对待清理装置中的附着物持续加热6小时，使附着物转换为液体并流入回收腔体内。
步骤704、对回收腔体冷却，使回收的附着物凝固。
参见图3，可以通过回收腔体包括的冷却部对回收腔体冷却。对回收腔体冷却时可以采用预设冷却温度和预设冷却时长进行冷却。
在一实施例中，预设冷却温度可以小于或等于20摄氏度，预设冷却时长可以大于或等于5小时。比如可以采用20摄氏度对回收腔体持续冷却5小时，使回收的附着物凝固，便于对回收的附着物进行存储，方便下次使用。
综上所述，本公开实施例提供的附着物回收方法，先将附着物回收装置的回收腔体的开口通过连通件与待清理装置的开口连通，回收腔体和待清理装置形成密闭空间，再对回收腔体和待清理装置形成的密闭空间进行抽真空，然后对待清理装置中的附着物进行加热，使附着物转换为液体并流入回收腔体内，之后，对回收腔体冷却，使回收的附着物凝固，相较于相关技术中的人工方式，可以起到保护待清理装置的作用，且降低了回收的附着物的污染度。
需要说明的是，本公开实施例提供的附着物回收方法的步骤的先后顺序可以进行适当调整，附着物回收方法的步骤也可以根据情况进行相应增减。任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，可轻易想到变化的方法，都应涵盖在本公开的保护范围 之内，因此不再赘述。
所属领域的技术人员可以清楚地了解到，为描述的方便和简洁，上述描述的各步骤的具体工作过程，可以参考前述装置实施例中装置和部件的具体工作过程，在此不再赘述。
在本公开中，术语“第一”和“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性。术语“多个”指两个或两个以上，除非另有明确的限定。
本领域技术人员在考虑说明书及实践这里公开的公开后，将容易想到本公开的其它实施方案。本申请旨在涵盖本公开的任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本公开的一般性原理并包括本公开未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本公开的真正范围和精神由权利要求指出。
应当理解的是，本公开并不局限于上面已经描述并在附图中示出的精确结构，并且可以在不脱离其范围进行各种修改和改变。本公开的范围仅由所附的权利要求来限制。

Claims (19)

  1. 一种附着物回收装置，包括：回收腔体和连通件，所述回收腔体设置有开口；
    所述回收腔体的开口通过所述连通件与待清理装置的开口连通，所述回收腔体和所述待清理装置形成密闭空间。
  2. 根据权利要求1所述的附着物回收装置，其中，所述连通件包括第一法兰接口、第二法兰接口以及连接部，所述第一法兰接口与所述回收腔体的开口连接，所述第二法兰接口用于与所述待清理装置的开口连接，所述第一法兰接口和所述第二法兰接口通过所述连接部连接，所述连接部设置有中心通孔。
  3. 根据权利要求2所述的附着物回收装置，其中，所述附着物回收装置还包括导流部，所述导流部包括连接端和导流条，
    所述连接端围绕所述中心通孔设置；
    所述导流条向所述回收腔体内延伸。
  4. 根据权利要求3所述的附着物回收装置，其中，所述导流部的数量大于或等于2。
  5. 根据权利要求4所述的附着物回收装置，其中，多个所述导流部围绕所述连接部的所述中心通孔对称设置。
  6. 根据权利要求1所述的附着物回收装置，其中，所述回收腔体的内部为锥形结构，所述锥形结构的开口的面积大于底面的面积。
  7. 根据权利要求1所述的附着物回收装置，其中，所述回收腔体的腔体壁上设置有真空设备接口，所述真空设备接口用于连接真空设备。
  8. 根据权利要求1所述的附着物回收装置，其中，所述回收腔体还包括冷却部，用于冷却所述回收腔体。
  9. 根据权利要求8所述的附着物回收装置，其中，所述回收腔体还包括加热部，用于加热所述待清理装置中的附着物。
  10. 根据权利要求9所述的附着物回收装置，其中，所述加热部包括加热丝，设置在所述回收腔体的开口处。
  11. 根据权利要求10所述的附着物回收装置，还包括显示模块，用于显示对所述待清理装置中的附着物进行加热以及对所述回收腔体冷却时的预设温度和预设时长。
  12. 根据权利要求11所述的附着物回收装置，还包括通讯模块，用于将所述预设温度和所述预设时长传输至目标移动终端。
  13. 根据权利要求12所述的附着物回收装置，还包括处理模块，其分别与所述加热部和所述冷却部电连接，所述处理模块接收到回收指令时，指示所述加热部和所述冷却部执行所述预设温度以及所述预设时长。
  14. 根据权利要求13所述的附着物回收装置，还包括一回收按键，按下后能够产生所述回收指令。
  15. 根据权利要求13所述的附着物回收装置，还包括一光照传感器，用于检测所述回收腔体内的光照强度，并在光照强度小于预设值时，向所述处理模块发送所述回收指令。
  16. 一种真空成膜系统，包括真空成膜装置和根据权利要求1至15中任一所述的附着物回收装置，
    所述附着物回收装置的回收腔体的开口通过连通件与所述真空成膜装置的盛放腔体的开口连通。
  17. 一种附着物回收方法，所述方法包括：
    将附着物回收装置的回收腔体的开口通过连通件与待清理装置的开口连通，所述回收腔体和所述待清理装置形成密闭空间；
    对所述回收腔体和所述待清理装置形成的密闭空间进行抽真空；
    对所述待清理装置中的附着物进行加热，使所述附着物转换为液体并流入所述回收腔体内；
    对所述回收腔体冷却，使回收的所述附着物凝固。
  18. 根据权利要求17所述的附着物回收方法，其中，对所述待清理装置中的附着物进行加热时采用预设加热温度和预设加热时长，所述预设加热温度为250～320摄氏度，所述预设加热时长为6～8小时。
  19. 根据权利要求17所述的附着物回收方法，其中，对所述回收腔体冷却采用预设冷却温度和预设冷却时长，所述预设冷却温度小于或等于20摄氏度，所述预设冷却时长大于或等于5小时。
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