WO2020015093A1 - 基板加工方法 - Google Patents

基板加工方法 Download PDF

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Publication number
WO2020015093A1
WO2020015093A1 PCT/CN2018/105057 CN2018105057W WO2020015093A1 WO 2020015093 A1 WO2020015093 A1 WO 2020015093A1 CN 2018105057 W CN2018105057 W CN 2018105057W WO 2020015093 A1 WO2020015093 A1 WO 2020015093A1
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WIPO (PCT)
Prior art keywords
site
substrate
inspection
list
station
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PCT/CN2018/105057
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English (en)
French (fr)
Inventor
潘柏松
Original Assignee
惠科股份有限公司
重庆惠科金渝光电科技有限公司
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Application filed by 惠科股份有限公司, 重庆惠科金渝光电科技有限公司 filed Critical 惠科股份有限公司
Publication of WO2020015093A1 publication Critical patent/WO2020015093A1/zh
Priority to US17/036,964 priority Critical patent/US12074176B2/en

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    • H01L27/1262—
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q50/00—Information and communication technology [ICT] specially adapted for implementation of business processes of specific business sectors, e.g. utilities or tourism
    • G06Q50/04—Manufacturing
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
    • C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
    • C03C17/3639—Multilayers containing at least two functional metal layers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q10/00—Administration; Management
    • G06Q10/06—Resources, workflows, human or project management; Enterprise or organisation planning; Enterprise or organisation modelling
    • G06Q10/063—Operations research, analysis or management
    • G06Q10/0639—Performance analysis of employees; Performance analysis of enterprise or organisation operations
    • G06Q10/06395—Quality analysis or management
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q30/00—Commerce
    • G06Q30/018—Certifying business or products
    • G06Q30/0185—Product, service or business identity fraud
    • G—PHYSICS
    • G07—CHECKING-DEVICES
    • G07C—TIME OR ATTENDANCE REGISTERS; REGISTERING OR INDICATING THE WORKING OF MACHINES; GENERATING RANDOM NUMBERS; VOTING OR LOTTERY APPARATUS; ARRANGEMENTS, SYSTEMS OR APPARATUS FOR CHECKING NOT PROVIDED FOR ELSEWHERE
    • G07C3/00—Registering or indicating the condition or the working of machines or other apparatus, other than vehicles
    • G07C3/005—Registering or indicating the condition or the working of machines or other apparatus, other than vehicles during manufacturing process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/30—Computing systems specially adapted for manufacturing

Definitions

  • the present application relates to the technical field of panel manufacturing, and in particular, to a substrate processing method.
  • the equipment in the panel factory is divided into a process machine and a measurement machine, where the process machine is a machine through which the glass substrate must pass (Run), and the measurement machine is a machine through which the glass substrate does not necessarily pass.
  • the process equipment used involves three main process flows: thin film process ⁇ yellow light process ⁇ etching process, five cycles must be performed, and the order must not be wrong.
  • MES Manufacturing Execution System
  • a process flag is used for control.
  • the specific method is to use 15 bits (corresponding to 3 processes x 5 cycles) as the process flag.
  • the initial value is 000000000000000.
  • the main process will set the corresponding bit (1), for example, after the first thin film process, the flag becomes 100000000000000.
  • the embodiment of the present application provides a substrate processing method to optimize process flag control logic and implement effective management and control of the substrate processing process.
  • a substrate processing method includes loading an operation list of a substrate, wherein the operation list includes an operation site bar, an inspection site bar, and an operation flag record enabling bar, the operation site bar includes a plurality of operation sites, and the inspection
  • the site bar includes an inspection site; a substrate is loaded into a production line; when the substrate flows to an operation site on the production line, the operation site column in the operation list queries the operation site and judges the operation site If the operation site has an inspection site in the inspection site column; if the operation site has an inspection site in the inspection site column, confirm whether the current operation mark of the substrate matches the inspection site; if the substrate The current operation mark of is consistent with the inspection site, and the substrate is processed at the operation site; wherein, the inspection site is an operation site that the substrate needs to undergo before the operation site; wherein the multiple Operation stations include a process station and a measurement station, and each of the operation sites in the operation list includes an operation target
  • the record enable bar is set to the enabled state.
  • Each of the measurement sites has no check site in the
  • a substrate processing method includes loading an operation list of a substrate, wherein the operation list includes an operation site bar, an inspection site bar, and an operation flag record enabling bar, the operation site bar includes a plurality of operation sites, and the inspection
  • the site bar includes an inspection site; a substrate is loaded into a production line; when the substrate flows to an operation site on the production line, the operation site column in the operation list queries the operation site and judges the operation site If the operation site has an inspection site in the inspection site column; if the operation site has an inspection site in the inspection site column, confirm whether the current operation mark of the substrate matches the inspection site; and if The current operation mark of the substrate is consistent with the inspection station, and the substrate is processed at the operation station.
  • the inspection site is an operation site that the substrate needs to undergo before the operation site.
  • the plurality of operation stations include a process station and a measurement station; and the operation flag record enable column of each process station in the operation list is set to an enabled state. ; For each of the measurement sites, no inspection site is set in the inspection site column in the operation list, and the setting of the operation flag record enable field is in a non-enabled state.
  • the operation list is a main process flow operation list, and each of the process stations except the first process station in the main process flow operation list is in the operation list.
  • the check site bar has a check site set up.
  • the operation list is a rework process operation list, and each of the process sites has at least one inspection site set in the inspection site column in the operation list.
  • the substrate processing method further includes: if the operation station is set to an enabled state in the operation flag record enable column, processing of the substrate is completed at the operation station. Then, the operation mark of the substrate is recorded as the operation site to update the current operation mark.
  • the method before the substrate processing method loads the operation list of the substrate, the method further includes: obtaining an operation list setting interface according to a process flow of the substrate to be performed; and setting the operation list setting interface. And selectively setting the operation status of each operation site of the operation site bar at the inspection site of the inspection site bar and the operation flag record enabling status of the operation bar to obtain the operation list; wherein the operation site bar Each operation site is a process site or a measurement site, and the operation flag record enable column of each process site in the operation list is set to an enabled state, and each of the measurement sites is in the The inspection site bar in the operation list is not set with an inspection site, and the setting of the operation flag record enable bar is in a non-enabled state.
  • At least one of the process sites has at least one inspection site in the inspection site column in the operation list.
  • the substrate includes a glass substrate.
  • the processing is performed by a thin film process, a yellow light process, or an etching process.
  • a substrate processing method includes: loading an operation list of a substrate; loading a substrate into a production line; when the substrate flows to an operation site on the production line, querying the operation site in the operation list, and Determine whether the operation site has an inspection site; if the operation site has an inspection site, confirm whether the current operation mark of the substrate matches the inspection site; if the current operation mark of the substrate matches the inspection site If so, the substrate is processed at the operation station; if the current operation mark of the substrate does not match the inspection station, the operation station does not process the substrate.
  • the substrate is provided with an S / N number; the confirming whether the current operation mark of the substrate is consistent with the inspection site includes: using a scanner configured at the operation site to obtain all The S / N number of the substrate; querying the operation mark corresponding to the S / N number in the system database according to the S / N number; comparing the operation mark with the inspection site.
  • the operation site is a process site, and an operation flag record enable column of the process site in the operation list is set to an enabled state.
  • the substrate processing method further includes: after the operation site finishes processing the substrate, recording an operation mark of the substrate as the operation site to update the current operation mark .
  • the operation list is a main process flow operation list
  • an operation site column of the main process flow operation list includes a plurality of operation sites, and the plurality of operation sites include a process station and a measurement Station; each of the process stations except the first process station in the main process flow operation list is provided with an inspection station.
  • the operation list is a rework process operation list.
  • the operation site column of the rework process operation list includes a plurality of operation sites, and the plurality of operation sites include a process station and a measurement. Stations; at least one of the process stations in the rework process operation list is provided with a plurality of inspection stations.
  • the substrate includes a glass substrate; and the processing is performed by a thin film process, a yellow light process, or an etching process.
  • FIG. 1A is a schematic diagram of an initial state of an operation list interface according to an embodiment of the present application.
  • FIG. 1B is a schematic diagram of a target state of the operation list interface shown in FIG. 1A.
  • FIG. 1C is a schematic diagram of another operation list according to an embodiment of the present application.
  • FIG. 2 is a flowchart of steps of a substrate processing method according to an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of a production line according to an embodiment of the present application.
  • a substrate processing method provided in the embodiment of the present application adopts a new process flag control logic.
  • the system screen and logic involved in the process flag control logic of this embodiment are shown in FIG. 1A and FIG. 1B.
  • the operator can obtain the information shown in FIG. 1A according to the process flow of the substrate, such as the process type and process ID. Operation list setting interface. After that, the operator can select an operation site in the operation site bar on the operation list setting interface shown in FIG. 1A, and enter the inspection site to be confirmed when entering the operation site in the inspection site bar, for example, the inspection of the operation site A1200 in the inspection site bar.
  • the station is set to A1100, the operation site A1300 is set to A1200 in the inspection site bar, the operation site A1400 is set to A1300 in the inspection site bar, the operation site A1800 is set to A1400 in the inspection site bar, etc .; here
  • the operation stations A1100, A1200, A1300, A1400, and A1800 are process stations, that is, the operation stations that must be experienced to complete the entire process flow substrate. Therefore, in order to avoid the problem of incorrect station jumps due to the use of the MES system's station jump function
  • each other process station is provided with an inspection station to achieve effective management and control of specific operation stations. For measurement sites such as A1300, no inspection site is set.
  • the operator can also select an operation site in the operation site bar on the operation list setting interface shown in FIG. 1A, and click the [operation flag record enable status setting / reset] button, then the operation flag record enable bar can be Set the enable state (Y) or non-enable state (clear); each process station here such as A1100, A1200, A1300, A1400, and A1800 is set to the enable state (Y) in the operation flag record enable column, and The measurement station, such as A1300, is set to disabled (cleared) in the operation flag record enable column.
  • click the [Submit] button to get the target operation list interface as shown in FIG. 1B for loading and use during subsequent substrate processing.
  • FIG. 1B shows the main process flow operation list, but the type of process flow involved in the embodiment of the present application is not limited to the main process flow (MAIN), but also other process flows such as rework process flow (Rework), for example, a specific rework process operation list is shown in FIG. 1C.
  • A7161 and A1405 are process sites, and A1115 is a measurement site; some of these process sites, such as A7161, can have multiple inspection sites, but the measurement site still does not have inspection sites and
  • the operation flag record enable column is set to a non-enabled state.
  • the substrate processing method in this embodiment includes, for example, the following steps S201, S203, S205, S207, and S209, specifically:
  • S205 When the substrate flows to an operation site on the production line, query the operation site in the operation site column in the operation list, and determine whether the operation site has an inspection site set in the inspection site column;
  • the operation list loaded in step S201 is, for example, the main process flow (MAIN) operation list shown in FIG. 1B loaded by the MES system.
  • the operation list includes an operation serial number column, an operation site column, an inspection site column, and an operation flag record.
  • Energy bar of course, to increase the friendliness and expandability of the interface, you can also include other fields. More specifically, in FIG.
  • the operation serial number column includes operation serial numbers such as 0100, 0200, 0300, 0400, 0500, 0600, etc., which indicates that the entire process flow is designed to have 6 operation stations;
  • the operation station column includes A1100, A1200, A1300, A1390, A1400, A1800 and other 6 operation site identification numbers, of which A1100, A1200, A1300, A1400, and A1800 are process sites, for example, selected from thin film process sites, yellow light process sites, or etching process sites, etc., complete the entire
  • the operation site that the process substrate must go through, and A1390 is the measurement site, it is the operation site that the substrate does not necessarily go through;
  • the inspection site column includes inspection sites such as A1100, A1200, A1300, and A1400.
  • the inspection site is A1100. Before the operation site A1200 performs processing, you must first confirm whether the substrate has undergone the process performed by the inspection site A1100.
  • the operation flag record enable column contains the enabled state Y and the disabled state (cleared). It can be known from FIG. 1B that the process station is set to enable state Y in the operation mark record enable column, and the measurement station is enabled in operation mark record Set in the disable state (empty).
  • step S203 the substrate is loaded into a production line, as shown in FIG. 3, for example, the entire production line is configured with a plurality of operation stations, such as A1100, A1200, ..., A1800, along the substrate traveling direction (or flow direction). Each operation site is used to process the substrate.
  • the substrate initially loaded on the production line is a glass substrate.
  • the glass substrate goes through each operation site in turn on the production line, the glass Various film layers are formed on the substrate, such as a first metal layer including a gate, a scan line, and a common electrode wiring, a gate insulating layer, a semiconductor layer, an ohmic contact layer, and a second metal layer including a source drain and a data line.
  • a passivation layer with a contact hole, a transparent pixel electrode layer, and the like are formed.
  • These film layers are stacked in the listed order, and finally a TFT (Thin Film Transistor, thin film transistor) array substrate can be obtained.
  • TFT Thin Film Transistor, thin film transistor
  • step S205 when the substrate flows into an operation site on the production line, such as operation site A1200 after operation site A1100 shown in FIG. 3, the operation site column in the operation list loaded in step S201 by the MES system Query the operation site A1200, and determine whether the operation site A1200 found has a check site in the check site bar.
  • step S207 the operation site A1200 is taken as an example, and an inspection site A1100 is set in the inspection site column; then the system will continue to confirm whether the current operation mark of the substrate matches the inspection site A1100.
  • the method for obtaining the current operation mark of the substrate is: the scanner configured at the operation site A1200 obtains the S / N number set on the substrate, and then queries the operation mark corresponding to the S / N number in the system database according to the S / N number .
  • the operation mark here is typically represented by an operation site (for example, an operation site identification number).
  • step S207 confirms that the current operation mark of the substrate is consistent with the inspection site A1100, indicating that the checkpoint confirmation is successful, then step S209 is performed; otherwise, if it does not match, it indicates that the checkpoint confirmation has failed, and a return message indicates the failure reason, and the operation site A1200 will not perform subsequent processing operations on the substrate, or the operation site A1200 will not allow substrates to enter.
  • step S209 if the current operation mark of the substrate is consistent with the inspection site A1100, it indicates that the substrate has already passed through the operation site A1100, that is, the checkpoint confirmation is successful, so the processing equipment of the operation site A1200 processes the substrate Taking a glass substrate for a display panel as an example, the processing here is, for example, performing a thin film process, a yellow light process, or an etching process.
  • the substrate processing method of this embodiment may further include the step of: if an operation station is set to an enabled state in an operation mark record enable column, after the operation station finishes processing the substrate, recording the substrate
  • the operation flag of is the operation site to update the current operation flag of the substrate.
  • the setting in the operation flag recording enable column is set to the enabled state (Y).
  • the MES system records the substrate (indicated by its S / N number).
  • the operation mark is the operation station A1100 for subsequent checkpoint confirmation and use.
  • the substrate processing method of this embodiment may further include steps before step S210: obtaining an operation list setting interface (for example, as shown in FIG. 1A) according to the process flow of the substrate to be performed; and setting the interface in the operation list.
  • Each operation site of the operation site bar is selectively set in the inspection site of the inspection site bar and the operation flag records the enable status of the enable bar to obtain the operation list (for example, as shown in FIG. 1B). The specific details of this step can be described with reference to the related descriptions of FIG. 1A and FIG. 1B, and are not repeated here.
  • the disclosed system, device, and / or method may be implemented in other ways.
  • the device embodiments described above are merely schematic.
  • the division of the unit is only a logical function division.
  • multiple units or components may be combined or Can be integrated into another system, or some features can be ignored or not implemented.
  • the displayed or discussed mutual coupling or direct coupling or communication connection may be indirect coupling or communication connection through some interfaces, devices or units, which may be electrical, mechanical or other forms.
  • the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, may be located in one place, or may be distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the objective of the solution of this embodiment.

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Abstract

一种基板加工方法，包括：加载基板的操作列表（S201），其中所述操作列表包含操作站点栏、检查站点栏和操作标志记录使能栏，所述操作站点栏包含多个操作站点，且所述检查站点栏包含检查站点；将基板载入生产线（S203）；当所述基板流入所述生产线上的一操作站点时，在所述操作列表中的所述操作站点栏查询所述操作站点、并判断所述操作站点在所述检查站点栏是否有设置检查站点（S205）；若所述操作站点在所述检查站点栏有设置检查站点，确认所述基板的当前操作标志与所述检查站点是否相符（S207）；以及若所述基板的当前操作标志与所述检查站点相符，在所述操作站点对所述基板进行加工（S209）。该方法有效防止操作人员跳错站，从而可以实现对基板加工流程的有效管控。

Description

基板加工方法 技术领域
本申请涉及面板制造技术领域，尤其涉及一种基板加工方法。
背景技术
在面板厂的设备分为工艺机台和量测机台，其中工艺机台是玻璃基板一定要经过(Run)的机台，而量测机台是玻璃基板不一定要经过的机台。以薄膜晶体管(TFT)制造工艺而言，所采用的工艺机台涉及三个主工艺流程：薄膜工艺→黄光工艺→蚀刻工艺，要做五个循环，而且顺序不能错。而在制造执行系统(Manufacturing Execution System，MES)上是用过程标志(Process Flag)做控制，具体做法是用15bit(对应3个工艺×5个循环)当成过程标志，初始值为000000000000000，经过一个主工艺就会将相应位(bit)置1，例如经过第一道薄膜工艺过程标志变为100000000000000。如果有返工(Rework)操作，就会将过程标志中的相应位置0。由此可见，目前做法如果工艺的循环次数增加，过程标志的Bit数就要增加，又搭配Rework，过程标志的开/关(on/off)控制逻辑编写就变得非常困难，而且是由于采用硬编码(Hard Code)方式，未来工艺新增修改，程序源代码要重新修改一次，非常不方便。
发明内容
本申请的实施例提供一种基板加工方法，以优化过程标志控制逻辑， 实现对基板加工流程进行有效管控。
一种基板加工方法，包括：加载基板的操作列表，其中所述操作列表包含操作站点栏、检查站点栏和操作标志记录使能栏，所述操作站点栏包含多个操作站点，且所述检查站点栏包含检查站点；将基板载入生产线；当所述基板流至所述生产线上的一操作站点时，在所述操作列表中的所述操作站点栏查询所述操作站点、并判断所述操作站点在所述检查站点栏是否有设置检查站点；若所述操作站点在所述检查站点栏有设置检查站点，确认所述基板的当前操作标志与所述检查站点是否相符；若所述基板的当前操作标志与所述检查站点相符，在所述操作站点对所述基板进行加工；其中，所述检查站点为在所述操作站点之前所述基板需要经历的操作站点；其中，所述多个操作站点包括工艺站点和量测站点，每一个所述工艺站点在所述操作列表中的所述操作标志记录使能栏的设置为使能状态，每一个所述量测站点在所述操作列表中的所述检查站点栏未设置检查站点、且在所述操作标志记录使能栏的设置为非使能状态。
一种基板加工方法，包括：加载基板的操作列表，其中所述操作列表包含操作站点栏、检查站点栏和操作标志记录使能栏，所述操作站点栏包含多个操作站点，且所述检查站点栏包含检查站点；将基板载入生产线；当所述基板流至所述生产线上的一操作站点时，在所述操作列表中的所述操作站点栏查询所述操作站点、并判断所述操作站点在所述检查站点栏是否有设置检查站点；若所述操作站点在所述检查站点栏有设置检查站点，确认所述基板的当前操作标志与所述检查站点是否相符；以及若所述基板 的当前操作标志与所述检查站点相符，在所述操作站点对所述基板进行加工。
在本申请的一个实施例中，所述检查站点为在所述操作站点之前所述基板需要经历的操作站点。
在本申请的一个实施例中，所述多个操作站点包括工艺站点和量测站点；每一个所述工艺站点在所述操作列表中的所述操作标志记录使能栏的设置为使能状态；每一个所述量测站点在所述操作列表中的所述检查站点栏未设置检查站点、且在所述操作标志记录使能栏的设置为非使能状态。
在本申请的一个实施例中，所述操作列表为主工艺流程操作列表，除所述主工艺流程操作列表中的第一个工艺站点之外的每一个所述工艺站点在所述操作列表中的所述检查站点栏有设置一个检查站点。
在本申请的一个实施例中，所述操作列表为返工工艺流程操作列表，每一个所述工艺站点在所述操作列表中的所述检查站点栏有设置至少一个检查站点。
在本申请的一个实施例中，所述基板加工方法还包括：若所述操作站点在所述操作标志记录使能栏中的设置为使能状态，在所述操作站点对所述基板加工完毕后，记录所述基板的操作标志为所述操作站点以更新所述当前操作标志。
在本申请的一个实施例中，所述基板加工方法在所述加载基板的操作列表之前，还包括：根据所述基板欲进行的工艺流程获取操作列表设置界面；以及在所述操作列表设置界面中选择性设置所述操作站点栏的各个操 作站点在所述检查站点栏的检查站点和所述操作标志记录使能栏的使能状态，以得到所述操作列表；其中，所述操作站点栏的各个操作站点为工艺站点或量测站点，每一个所述工艺站点在所述操作列表中的所述操作标志记录使能栏的设置为使能状态，每一个所述量测站点在所述操作列表中的所述检查站点栏未设置检查站点、且在所述操作标志记录使能栏的设置为非使能状态。
在本申请的一个实施例中，至少一个所述工艺站点在所述操作列表中的所述检查站点栏有设置至少一个检查站点。
在本申请的一个实施例中，所述基板包括玻璃基板。
在本申请的一个实施例中，所述加工为进行薄膜工艺、黄光工艺或蚀刻工艺。
一种基板加工方法，包括：加载基板的操作列表；将基板载入生产线；当所述基板流至所述生产线上的一操作站点时，在所述操作列表中的查询所述操作站点、并判断所述操作站点是否有设置检查站点；若所述操作站点有设置检查站点，确认所述基板的当前操作标志与所述检查站点是否相符；若所述基板的当前操作标志与所述检查站点相符，在所述操作站点对所述基板进行加工；若所述基板的当前操作标志与所述检查站点不相符，所述操作站点不对所述基板进行加工。
在本申请的一个实施例中，所述基板上设置有S/N号；所述确认所述基板的当前操作标志与所述检查站点是否相符包括：利用所述操作站点配置的扫描仪获取所述基板的S/N号；根据S/N号查询系统数据库中与所述 S/N号相对应的操作标志；比较所述操作标志与所述检测站点。
在本申请的一个实施例中，所述操作站点为工艺站点，所述工艺站点在所述操作列表中的操作标志记录使能栏的设置为使能状态。
在本申请的一个实施例中，所述基板加工方法还包括：在所述操作站点对所述基板加工完毕后，记录所述基板的操作标志为所述操作站点、以更新所述当前操作标志。
在本申请的一个实施例中，所述操作列表为主工艺流程操作列表，所述主工艺流程操作列表的操作站点栏包含多个操作站点，且所述多个操作站点包含工艺站点和量测站点；所述主工艺流程操作列表中除第一个工艺站点之外的每一个所述工艺站点设置有一个检查站点。
在本申请的一个实施例中，所述操作列表为返工工艺流程操作列表，所述返工工艺流程操作列表的操作站点栏包含多个操作站点，且所述多个操作站点包含工艺站点和量测站点；在所述返工工艺流程操作列表中至少一个所述工艺站点设置有多个检查站点。
在本申请的一个实施例中，所述基板包括玻璃基板；所述加工为进行薄膜工艺、黄光工艺或蚀刻工艺。
本申请实施例通过优化过程标志控制逻辑，在操作人员使用跳站功能时，经由管控特定操作站点例如工艺站点，其可以有效防止操作人员跳错站，从而可以实现对基板加工流程的有效管控。
附图说明
为了更清楚地说明本申请实施例的技术方案，下面将对实施例描述 中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1A为本申请实施例的一种操作列表界面初始状态示意图。
图1B为图1A所示操作列表界面的目标状态示意图。
图1C为本申请实施例的另一种操作列表示意图。
图2为本申请实施例的一种基板加工方法的步骤流程图。
图3为本申请实施例的一种生产线结构示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请实施例提供的一种基板加工方法，其采用一种新的过程标志(Process Flag)控制逻辑。具体地，本实施例的过程标志控制逻辑涉及的系统画面及逻辑如图1A及图1B所示，操作人员可以根据基板欲进行的工艺流程例如流程类型、流程ID等信息获取图1A所示的操作列表设置界面。之后，操作人员可以在图1A所示操作列表设置界面选中操作站点栏的某个操作站点，在检查站点栏输入进入该操作站点时需要确认的检查站点，例如操作站点A1200在检查站点栏的检查站点设为A1100，操作站点 A1300在检查站点栏的检查站点设为A1200，操作站点A1400在检查站点栏的检查站点设为A1300，操作站点A1800在检查站点栏的检查站点设为A1400等；此处的操作站点A1100、A1200、A1300、A1400及A1800为工艺站点，也就是完成整个工艺流程基板必须要经历的操作站点，因此为了避免操作人员因使用MES系统的跳站功能而出现跳错站的问题，除整个工艺流程中的第一个工艺站点A1100之外，其他各个工艺站点均设置有检查站点，以实现对特定操作站点的有效管控。而对于量测站点例如A1300，则不设置检查站点。
此外，操作人员还可以在图1A所示操作列表设置界面选中操作站点栏的某个操作站点，并点击【操作标志记录使能状态设置/重置】按钮，则可以在操作标志记录使能栏设置使能状态(Y)或非使能状态(清空)；此处的各个工艺站点例如A1100、A1200、A1300、A1400及A1800在操作标志记录使能栏均设为使能状态(Y)，而量测站点例如A1300在操作标志记录使能栏设为非使能状态(清空)。待各个操作站点的检查站点栏及操作标志记录使能栏均设定好，点击【提交】按钮，即可以得到如图1B所示的目标操作列表界面，以供后续基板加工过程中加载使用。
此处值得一提的是，图1B所示为主工艺流程操作列表，但本申请实施例涉及的工艺流程类型并不限于主工艺流程(MAIN)，也可以是其他工艺流程例如返工工艺流程(Rework)，具体的返工工艺流程操作列表例如图1C所示。在图1C所示的返工工艺流程操作列表中，A7161和A1405为工艺站点，A1115为量测站点；其中某些工艺站点例如A7161可以设置多个检 查站点，而量测站点仍然不设置检查站点且其操作标志记录使能栏设为非使能状态。
参见图2及图3，本实施例的基板加工方法例如包括如下步骤S201、S203、S205、S207和S209，具体地：
S201：加载基板的操作列表；
S203：将基板载入生产线；
S205：当所述基板流至所述生产线上的一操作站点时，在所述操作列表中的操作站点栏查询所述操作站点、并判断所述操作站点在检查站点栏是否有设置检查站点；
S207：若所述操作站点在所述检查站点栏有设置检查站点，确认所述基板的当前操作标志与所述检查站点是否相符；
S209：若所述基板的当前操作标志与所述检查站点相符，在所述操作站点对所述基板进行加工。
详细来说，步骤S201加载的操作列表例如是由MES系统加载的图1B所示主工艺流程(MAIN)操作列表，该操作列表包括操作序号栏、操作站点栏、检查站点栏和操作标志记录使能栏，当然为增加界面的友好性和可扩展性，还可以包含其他栏位。更具体地，在图1B中，操作序号栏包含0100、0200、0300、0400、0500、0600等操作序号，其表示整个工艺流程被设计成有6个操作站点；操作站点栏包含A1100、A1200、A1300、A1390、A1400、A1800等6个操作站点的识别号，其中A1100、A1200、A1300、A1400和A1800为工艺站点，例如选自薄膜工艺站点、黄光工艺站点或蚀刻工艺站 点等，是完成整个工艺流程基板必须要经历的操作站点，而A1390为量测站点，为基板不一定要经历的操作站点；检查站点栏包含A1100、A1200、A1300和A1400等检查站点，以操作站点A1200为例，设置的检查站点为A1100，则在操作站点A1200进行加工之前首先要确认基板是否已经经历过检查站点A1100所执行的工艺；操作标志记录使能栏包含使能状态Y和非使能状态(清空)，从图1B中可以得知，工艺站点在操作标志记录使能栏设为使能状态Y，量测站点在操作标志记录使能栏设为非使能状态(清空)。
步骤S203将基板载入生产线，例如图3所示，整个生产线例如沿基板行进方向(或称流向)配置有多个操作站点，例如A1100、A1200、…、A1800。各个操作站点用于对基板进行加工，以显示面板例如液晶显示面用玻璃基板的加工为例，最初载入生产线上的基板为玻璃基板，随着玻璃基板在生产线上依次经历各个操作站点，玻璃基板上会形成各个膜层，例如包含栅极、扫描线和公共电极配线的第一金属层，栅极绝缘层，半导体层，欧姆接触层，包含源漏极和数据线的第二金属层，形成有接触孔的钝化层、透明像素电极层等，这些膜层按照所列顺序层叠设置，最终可以得到TFT(Thin Film Transistor，薄膜晶体管)阵列基板。
承上述，在步骤S205中，当所述基板流入生产线上的某一个操作站点，例如图3所示操作站点A1100之后的操作站点A1200时，MES系统在步骤S201加载的操作列表中的操作站点栏查询操作站点A1200、并判断查询到的操作站点A1200在检查站点栏是否有设置检查站点。
在步骤S207中，继续以操作站点A1200为例，其在检查站点栏有设 置检查站点A1100；则系统会继续确认所述基板的当前操作标志与所述检查站点A1100是否相符。其中，基板的当前操作标志获取方式为：由操作站点A1200配置的扫描仪获取基板上设置的S/N号，再根据S/N号查询系统数据库中与该S/N号相对应的操作标志。此处的操作标志典型的以操作站点(例如操作站点识别号)表示。如果步骤S207确认所述基板的当前操作标志与所述检查站点A1100相符，表示卡关确认成功，则执行步骤S209；否则若不相符，则表示卡关确认失败，返回消息表明失败原因，操作站点A1200后续不会对基板进行加工操作，或者说操作站点A1200不允许基板进入。
在步骤S209中，若所述基板的当前操作标志与所述检查站点A1100相符，其表示基板已经经历过操作站点A1100，也即卡关确认成功，因此由操作站点A1200的工艺设备对基板进行加工，以显示面板用玻璃基板为例，此处的加工例如是进行薄膜工艺、黄光工艺或蚀刻工艺。
另外，本实施例的基板加工方法还可以进一步包括步骤：若操作站点在操作标志记录使能栏中的设置为使能状态，在所述操作站点对所述基板加工完毕后，记录所述基板的操作标志为所述操作站点，以更新所述基板的当前操作标志。以操作站点A1100为例，其操作标志记录使能栏中的设置为使能状态(Y)，当基板在操作站点A1100加工完毕后，由MES系统记录基板(以其S/N号表示)的操作标志为操作站点A1100，以便后续进行卡关确认使用。
进一步地，本实施例的基板加工方法，在步骤S210之前还可以包括 步骤：根据所述基板欲进行的工艺流程获取操作列表设置界面(例如图1A所示)；以及在所述操作列表设置界面中选择性设置所述操作站点栏的各个操作站点在所述检查站点栏的检查站点和所述操作标志记录使能栏的使能状态，以得到所述操作列表(例如图1B所示)。该步骤的具体细节可参考图1A及图1B的相关说明书描述，在此不再赘述。
在本申请所提供的几个实施例中，应该理解到，所揭露的系统，装置和/或方法，可以通过其它的方式实现。例如，以上所描述的装置实施例仅仅是示意性的，例如，所述单元的划分，仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，例如多路单元或组件可以结合或者可以集成到另一个系统，或一些特征可以忽略，或不执行。另一点，所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口，装置或单元的间接耦合或通信连接，可以是电性，机械或其它的形式。
所述作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元显示的部件可以是或者也可以不是物理单元，即可以位于一个地方，或者也可以分布到多路网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本实施例方案的目的。
以上实施例仅用以说明本申请的技术方案，而非对其限制；尽管参照前述实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技 术方案的本质脱离本申请各实施例技术方案的精神和范围。

Claims (20)

  1. 一种基板加工方法，包括：
    加载基板的操作列表，其中所述操作列表包含操作站点栏、检查站点栏和操作标志记录使能栏，所述操作站点栏包含多个操作站点，且所述检查站点栏包含检查站点；
    将基板载入生产线；
    当所述基板流至所述生产线上的一操作站点时，在所述操作列表中的所述操作站点栏查询所述操作站点、并判断所述操作站点在所述检查站点栏是否有设置检查站点；
    若所述操作站点在所述检查站点栏有设置检查站点，确认所述基板的当前操作标志与所述检查站点是否相符；
    若所述基板的当前操作标志与所述检查站点相符，在所述操作站点对所述基板进行加工；
    其中，所述检查站点为在所述操作站点之前所述基板需要经历的操作站点；
    其中，所述多个操作站点包括工艺站点和量测站点，每一个所述工艺站点在所述操作列表中的所述操作标志记录使能栏的设置为使能状态，每一个所述量测站点在所述操作列表中的所述检查站点栏未设置检查站点、且在所述操作标志记录使能栏的设置为非使能状态。
  2. 一种基板加工方法，包括：
    加载基板的操作列表，其中所述操作列表包含操作站点栏、检查站点 栏和操作标志记录使能栏，所述操作站点栏包含多个操作站点，且所述检查站点栏包含检查站点；
    将基板载入生产线；
    当所述基板流至所述生产线上的一操作站点时，在所述操作列表中的所述操作站点栏查询所述操作站点、并判断所述操作站点在所述检查站点栏是否有设置检查站点；
    若所述操作站点在所述检查站点栏有设置检查站点，确认所述基板的当前操作标志与所述检查站点是否相符；
    若所述基板的当前操作标志与所述检查站点相符，在所述操作站点对所述基板进行加工。
  3. 根据权利要求2所述的基板加工方法，其中，所述检查站点为在所述操作站点之前所述基板需要经历的操作站点。
  4. 根据权利要求2所述的基板加工方法，其中，所述多个操作站点包括工艺站点和量测站点；每一个所述工艺站点在所述操作列表中的所述操作标志记录使能栏的设置为使能状态；每一个所述量测站点在所述操作列表中的所述检查站点栏未设置检查站点、且在所述操作标志记录使能栏的设置为非使能状态。
  5. 根据权利要求4所述的基板加工方法，其中，所述操作列表为主工艺流程操作列表，除所述主工艺流程操作列表中的第一个工艺站点之外的每一个所述工艺站点在所述操作列表中的所述检查站点栏有设置一个检查站点。
  6. 根据权利要求4所述的基板加工方法，其中，所述操作列表为返工工艺流程操作列表，每一个所述工艺站点在所述操作列表中的所述检查站点栏有设置至少一个检查站点。
  7. 根据权利要求2所述的基板加工方法，还包括：
    若所述操作站点在所述操作标志记录使能栏中的设置为使能状态，在所述操作站点对所述基板加工完毕后，记录所述基板的操作标志为所述操作站点以更新所述当前操作标志。
  8. 根据权利要求2所述的基板加工方法，在所述加载基板的操作列表之前，还包括：
    根据所述基板欲进行的工艺流程获取操作列表设置界面；
    在所述操作列表设置界面中选择性设置所述操作站点栏的各个操作站点在所述检查站点栏的检查站点和所述操作标志记录使能栏的使能状态，以得到所述操作列表；
    其中，所述操作站点栏的各个操作站点分别为工艺站点或量测站点，每一个所述工艺站点在所述操作列表中的所述操作标志记录使能栏的设置为使能状态，每一个所述量测站点在所述操作列表中的所述检查站点栏未设置检查站点、且在所述操作标志记录使能栏的设置为非使能状态。
  9. 根据权利要求8所述的基板加工方法，其中，至少一个所述工艺站点在所述操作列表中的所述检查站点栏有设置至少一个检查站点。
  10. 根据权利要求2所述的基板加工方法，其中，所述基板包括玻璃基板。
  11. 根据权利要求2所述的基板加工方法，其中，所述加工为进行薄膜工艺。
  12. 根据权利要求2所述的基板加工方法，其中，所述加工为进行黄光工艺。
  13. 根据权利要求2所述的基板加工方法，其中，所述加工为进行蚀刻工艺。
  14. 一种基板加工方法，包括：
    加载基板的操作列表；
    将基板载入生产线；
    当所述基板流至所述生产线上的一操作站点时，在所述操作列表中的查询所述操作站点、并判断所述操作站点是否有设置检查站点；
    若所述操作站点有设置检查站点，确认所述基板的当前操作标志与所述检查站点是否相符；
    若所述基板的当前操作标志与所述检查站点相符，在所述操作站点对所述基板进行加工；
    若所述基板的当前操作标志与所述检查站点不相符，所述操作站点不对所述基板进行加工。
  15. 根据权利要求14所述的基板加工方法，其中，所述基板上设置有S/N号；所述确认所述基板的当前操作标志与所述检查站点是否相符包括：
    利用所述操作站点配置的扫描仪获取所述基板的所述S/N号；
    根据所述S/N号查询系统数据库中与所述S/N号相对应的操作标志；
    比较所述操作标志与所述检测站点。
  16. 根据权利要求14所述的基板加工方法，其中，所述操作站点为工艺站点，所述工艺站点在所述操作列表中的操作标志记录使能栏的设置为使能状态。
  17. 根据权利要求16所述的基板加工方法，还包括：
    在所述操作站点对所述基板加工完毕后，记录所述基板的操作标志为所述操作站点、以更新所述当前操作标志。
  18. 根据权利要求14所述的基板加工方法，其中，所述操作列表为主工艺流程操作列表，所述主工艺流程操作列表的操作站点栏包含多个操作站点，且所述多个操作站点包含工艺站点和量测站点；所述主工艺流程操作列表中除第一个工艺站点之外的每一个所述工艺站点设置有一个检查站点。
  19. 根据权利要求14所述的基板加工方法，其中，所述操作列表为返工工艺流程操作列表，所述返工工艺流程操作列表的操作站点栏包含多个操作站点，且所述多个操作站点包含工艺站点和量测站点；在所述返工工艺流程操作列表中至少一个所述工艺站点设置有多个检查站点。
  20. 根据权利要求14所述的基板加工方法，其中，所述基板包括玻璃基板；所述加工为进行薄膜工艺、黄光工艺或蚀刻工艺。
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