WO2020008801A1 - 撮像素子及び固体撮像装置 - Google Patents

撮像素子及び固体撮像装置 Download PDF

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Publication number
WO2020008801A1
WO2020008801A1 PCT/JP2019/022702 JP2019022702W WO2020008801A1 WO 2020008801 A1 WO2020008801 A1 WO 2020008801A1 JP 2019022702 W JP2019022702 W JP 2019022702W WO 2020008801 A1 WO2020008801 A1 WO 2020008801A1
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Prior art keywords
electrode
imaging device
photoelectric conversion
separation
image sensor
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PCT/JP2019/022702
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English (en)
French (fr)
Japanese (ja)
Inventor
有希央 兼田
史彦 古閑
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ソニーセミコンダクタソリューションズ株式会社
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Priority to CN201980042585.4A priority Critical patent/CN112368836A/zh
Priority to US17/252,774 priority patent/US11563058B2/en
Priority to JP2020528743A priority patent/JP7391844B2/ja
Priority to DE112019003394.8T priority patent/DE112019003394T5/de
Publication of WO2020008801A1 publication Critical patent/WO2020008801A1/ja
Priority to US17/979,904 priority patent/US11793009B2/en
Priority to JP2023111849A priority patent/JP2023126323A/ja
Priority to US18/244,109 priority patent/US20230422534A1/en

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K39/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
    • H10K39/30—Devices controlled by radiation
    • H10K39/32—Organic image sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14665—Imagers using a photoconductor layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
    • H01L27/14612—Pixel-elements with integrated switching, control, storage or amplification elements involving a transistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14638—Structures specially adapted for transferring the charges across the imager perpendicular to the imaging plane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers
    • H01L27/14645—Colour imagers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/80—Camera processing pipelines; Components thereof
    • H04N23/84—Camera processing pipelines; Components thereof for processing colour signals
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/79—Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80—Constructional details
    • H10K30/81—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers
    • H01L27/14645—Colour imagers
    • H01L27/14647—Multicolour imagers having a stacked pixel-element structure, e.g. npn, npnpn or MQW elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K19/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00
    • H10K19/201—Integrated devices having a three-dimensional layout, e.g. 3D ICs
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the present disclosure relates to an imaging device and a solid-state imaging device including the imaging device.
  • An image sensor using an organic semiconductor material for the photoelectric conversion layer can photoelectrically convert a specific color (wavelength band). Because of these features, when used as an imaging device in a solid-state imaging device, subpixels are formed from a combination of an on-chip color filter (OCCF) and an imaging device, and the subpixels are two-dimensionally arranged. It is possible to obtain a structure in which sub-pixels are stacked (stacked image sensor), which is impossible with a conventional solid-state imaging device (see, for example, JP-A-2017-157816). Further, since demosaic processing is not required, there is an advantage that a false color does not occur.
  • OCCF on-chip color filter
  • an imaging device provided with a photoelectric conversion unit provided on or above a semiconductor substrate is referred to as a “first type imaging device” for convenience, and a photoelectric device constituting the first type imaging device is referred to as a “first type imaging device”.
  • the conversion unit is referred to as a “first type photoelectric conversion unit” for convenience, and the imaging device provided in the semiconductor substrate is referred to as a “second type imaging device” for convenience, forming a second type imaging device.
  • Such a photoelectric conversion unit may be referred to as a “second type photoelectric conversion unit” for convenience.
  • FIG. 57 shows an example of the structure of a stacked-type imaging device (stacked-type solid-state imaging device) disclosed in JP-A-2017-157816.
  • the third photoelectric conversion unit 43 which is the second type photoelectric conversion unit constituting the second imaging device 13 and the third imaging device 15 which is the second imaging device is provided in the semiconductor substrate 70.
  • the second photoelectric conversion unit 41 are stacked and formed.
  • a first photoelectric conversion unit 11 ' which is a first type of photoelectric conversion unit, is disposed above the semiconductor substrate 70 (specifically, above the second imaging element 13).
  • the first photoelectric conversion unit 11 ′ includes a first electrode 21, a photoelectric conversion layer 23 made of an organic material, and a second electrode 22, and constitutes the first imaging element 11 which is a first type imaging element. I do. Further, a charge storage electrode 24 is provided separately from the first electrode 21, and the photoelectric conversion layer 23 is located above the charge storage electrode 24 via an insulating layer 82.
  • the second photoelectric conversion unit 41 and the third photoelectric conversion unit 43 for example, blue light and red light are photoelectrically converted, respectively, due to a difference in absorption coefficient.
  • green light is photoelectrically converted.
  • the charges generated by the photoelectric conversion in the second photoelectric conversion unit 41 and the third photoelectric conversion unit 43 are temporarily stored in the second photoelectric conversion unit 41 and the third photoelectric conversion unit 43, respectively, and then each of the vertical transistors ( transferred by illustrating the gate portion 45) and the transfer transistor (illustrating the gate portion 46) to the second floating diffusion region (floating diffusion) FD 2 and the third floating diffusion layer FD 3, further external readout circuit (FIG. (Not shown).
  • These transistors and the floating diffusion layers FD 2 and FD 3 are also formed on the semiconductor substrate 70.
  • the charge generated by the photoelectric conversion in the first photoelectric conversion unit 11 ′ is attracted to the charge storage electrode 24 and stored in the photoelectric conversion layer 23 during charge storage.
  • charge accumulated in the photoelectric conversion layer 23 is stored first electrode 21, the contact hole 61, via the wiring layer 62, the first floating diffusion layer FD 1 formed on the semiconductor substrate 70 .
  • the first photoelectric conversion unit 11 ′ is also connected to a gate unit 52 of an amplification transistor that converts a charge amount into a voltage via a contact hole 61 and a wiring layer 62.
  • the first floating diffusion layer FD 1 constitutes a part of the reset transistor (illustrating the gate portion 51).
  • the reference numerals 63, 64, 65, 66, 71, 72, 76, 81, 83, 90, etc. will be described in the first embodiment.
  • an object of the present disclosure is to reliably suppress the movement of charges between adjacent image sensors during the operation of the image sensor, and furthermore, the charges accumulated in the photoelectric conversion layer are smoothly transferred to the first electrode.
  • An object of the present invention is to provide an imaging device having a configuration and a structure to be transferred and a solid-state imaging device including the imaging device.
  • the image sensor of the present disclosure for achieving the above object, A first electrode, A charge storage electrode spaced apart from the first electrode; A separation electrode that is disposed separately from the first electrode and the charge storage electrode and surrounds the charge storage electrode; A photoelectric conversion layer in contact with the first electrode and formed above the charge storage electrode via an insulating layer; and A second electrode formed on the photoelectric conversion layer,
  • the separation electrode includes a first separation electrode, and a second separation electrode that is spaced apart from the first separation electrode, The first separation electrode is located between the first electrode and the second separation electrode.
  • a solid-state imaging device for achieving the above object, It is composed of P ⁇ Q (where P ⁇ 2, Q ⁇ 1) image sensors along the first direction and Q along the second direction different from the first direction. It has a plurality of image sensor blocks, Each image sensor is A first electrode, A charge storage electrode spaced apart from the first electrode; A separation electrode that is disposed separately from the first electrode and the charge storage electrode and surrounds the charge storage electrode; A photoelectric conversion layer in contact with the first electrode and formed above the charge storage electrode via an insulating layer; and A second electrode formed on the photoelectric conversion layer, With The separation electrode includes a first separation electrode, a second separation electrode, and a third separation electrode, The first separation electrode is adjacent to and separated from the first electrode, between the image sensors arranged side by side at least along the second direction in the image sensor block, The second separation electrode is disposed between the image sensor and the image sensor in the image sensor block, The third separation electrode is arranged between the image sensor blocks.
  • the solid-state imaging device according to the second embodiment of the present disclosure for achieving the above object includes a stacked-type imaging device having at least one imaging device of the present disclosure.
  • FIG. 1 is a diagram schematically illustrating an arrangement state of a charge storage electrode, a first separation electrode, a second separation electrode, and a first electrode in the solid-state imaging device according to the first embodiment.
  • FIG. 2A and FIG. 2B are diagrams schematically illustrating the potential of each electrode in the image sensor according to the first embodiment.
  • FIG. 3A and FIG. 3B are diagrams schematically showing the potential of each electrode in the image sensor of the first embodiment.
  • FIG. 4A and FIG. 4B are diagrams schematically showing the potential of each electrode in the image sensor of the first embodiment.
  • 5A, 5B, and 5C are diagrams schematically illustrating the potentials of the respective electrodes in the imaging device according to the first embodiment.
  • FIGS. 6A and 6B are diagrams schematically showing the potential of each electrode in the image sensor according to the first embodiment.
  • FIGS. 7A and 7B are enlarged views of a part of each electrode for describing the positional relationship between the electrodes in the image sensor according to the first embodiment, and the positions of the electrodes in the image sensor without the first separation electrode. It is the figure which expanded a part of each electrode for explaining a relationship.
  • FIG. 8 is a schematic partial cross-sectional view of one of the imaging device and the stacked imaging device of the first embodiment.
  • FIG. 9 is an equivalent circuit diagram of the imaging device and the stacked imaging device of the first embodiment.
  • FIG. 10 is an equivalent circuit diagram of the imaging device and the stacked imaging device of the first embodiment.
  • FIG. 11 is a conceptual diagram of the solid-state imaging device according to the first embodiment.
  • FIG. 12 is an equivalent circuit diagram of a modified example (modified example 1 of the first embodiment) of the image sensor of the first embodiment and the stacked image sensor.
  • FIG. 13 is a schematic cross-sectional view of a modified example (a modified example 2 of the first embodiment) of the image sensor of the first embodiment (illustrating two image sensors arranged side by side).
  • FIG. 14 is a diagram schematically illustrating an arrangement state of a charge storage electrode, a first separation electrode, a second separation electrode, a third separation electrode, and a first electrode in the solid-state imaging device according to the second embodiment.
  • FIG. 12 is an equivalent circuit diagram of a modified example (modified example 1 of the first embodiment) of the image sensor of the first embodiment and the stacked image sensor.
  • FIG. 13 is a schematic cross-sectional view of a modified example (a modified example 2 of the first embodiment) of the image sensor of the first embodiment (illustrating two image sensors arranged side by
  • FIG. 15 is a diagram schematically illustrating an arrangement state of a charge storage electrode, a first separation electrode, a second separation electrode, a third separation electrode, and a first electrode in a modification of the solid-state imaging device according to the second embodiment.
  • 16A and 16B are schematic partial cross-sectional views of an image sensor (two image sensors arranged side by side) of a third embodiment and a modification example thereof.
  • 17A and 17B are schematic partial cross-sectional views of another modified example of the image sensor (two image sensors arranged side by side) of the third embodiment.
  • FIG. 18 is a schematic partial cross-sectional view of the imaging device and the stacked imaging device of the fourth embodiment.
  • FIG. 19 is a schematic partial cross-sectional view of the imaging device and the stacked imaging device of the fifth embodiment.
  • FIG. 20 is a schematic partial cross-sectional view of a modified example of the imaging device and the stacked imaging device of the fifth embodiment.
  • FIG. 21 is a schematic partial cross-sectional view of another modified example of the imaging device of the fifth embodiment.
  • FIG. 22 is a schematic partial cross-sectional view of still another modified example of the imaging device of the fifth embodiment.
  • FIG. 23 is a schematic partial cross-sectional view of the imaging device and the stacked imaging device of the sixth embodiment.
  • FIG. 24 is an equivalent circuit diagram of the imaging device and the stacked imaging device of the sixth embodiment.
  • FIG. 25 is an equivalent circuit diagram of the imaging device and the stacked imaging device of the sixth embodiment.
  • FIG. 26 is a schematic partial cross-sectional view of the imaging device and the stacked imaging device of the seventh embodiment.
  • FIG. 21 is a schematic partial cross-sectional view of another modified example of the imaging device of the fifth embodiment.
  • FIG. 22 is a schematic partial cross-sectional view of still another modified example of the imaging device of the
  • FIG. 27 is an equivalent circuit diagram of the imaging device and the stacked imaging device of the seventh embodiment.
  • FIG. 28 is an equivalent circuit diagram of the imaging device and the stacked imaging device of the seventh embodiment.
  • FIG. 29 is a schematic layout diagram of the first electrode and the charge storage electrode that constitute the imaging element of the seventh embodiment.
  • FIG. 30 is a schematic partial cross-sectional view of an imaging device and a stacked imaging device of Example 8.
  • FIG. 31 is a schematic partial cross-sectional view in which the portion where the charge storage electrode, the photoelectric conversion layer, and the second electrode are stacked in the imaging element of Example 8 is enlarged.
  • FIG. 32 is a schematic partial cross-sectional view in which the portion where the charge storage electrode, the photoelectric conversion layer, and the second electrode are stacked in the imaging element of Example 9 is enlarged.
  • FIG. 33 is a schematic partial cross-sectional view of the imaging device and the stacked imaging device of Example 10.
  • FIG. 34 is a schematic partial cross-sectional view of the imaging elements of Example 11 and Example 12 and the stacked imaging element.
  • 35A and 35B are schematic plan views of a charge storage electrode segment according to the twelfth embodiment.
  • 36A and 36B are schematic plan views of a charge storage electrode segment according to the twelfth embodiment.
  • FIG. 37 is a schematic partial cross-sectional view of the imaging devices of Example 13 and Example 12, and the stacked imaging device.
  • FIG. 38A and 38B are schematic plan views of a charge storage electrode segment according to the thirteenth embodiment.
  • FIG. 39 is a schematic partial cross-sectional view of another modified example of the imaging device and the stacked imaging device of the first embodiment.
  • FIG. 40 is a schematic partial cross-sectional view of still another modified example of the imaging device and the stacked imaging device of the first embodiment.
  • 41A, 41B, and 41C are enlarged schematic partial cross-sectional views of an image sensor according to the first embodiment, a first electrode portion of still another modified example of the stacked image sensor, and the like.
  • FIG. 42 is a schematic partial cross-sectional view of still another modified example of the imaging device and the stacked imaging device of the first embodiment.
  • FIG. 43 is a schematic partial cross-sectional view of still another modified example of the imaging device and the stacked imaging device of the first embodiment.
  • FIG. 44 is a schematic partial cross-sectional view of still another modified example of the imaging device of the first embodiment and the stacked imaging device.
  • FIG. 45 is a schematic partial cross-sectional view of another modified example of the imaging device and the stacked imaging device of the sixth embodiment.
  • FIG. 46 is a schematic partial cross-sectional view of still another modified example of the imaging device and the stacked imaging device of the first embodiment.
  • FIG. 47 is a schematic partial cross-sectional view of still another modified example of the imaging device and the stacked imaging device of the sixth embodiment.
  • FIG. 48 is a schematic partial cross-sectional view in which a portion where a charge storage electrode, a photoelectric conversion layer, and a second electrode are stacked in a modification of the imaging element of Example 8 is enlarged.
  • FIG. 49 is a schematic partial cross-sectional view in which a portion where a charge storage electrode, a photoelectric conversion layer, and a second electrode are stacked in a modification of the imaging device of Embodiment 9 is enlarged.
  • FIG. 50 is a diagram schematically illustrating an arrangement state of a charge storage electrode, a first separation electrode, a second separation electrode, and a first electrode in a modification of the solid-state imaging device according to the first embodiment.
  • FIG. 51A and 51B are diagrams schematically illustrating arrangement states of a charge storage electrode, a first separation electrode, a second separation electrode, and a first electrode in a modification of the solid-state imaging device according to the first embodiment.
  • FIG. 52 is a diagram schematically illustrating an arrangement state of a charge storage electrode, a first separation electrode, a second separation electrode, a third separation electrode, and a first electrode in a modification of the solid-state imaging device according to the second embodiment.
  • FIG. 53 schematically illustrates the arrangement of the charge storage electrode, the first separation electrode, the second separation electrode, the third separation electrode, the charge discharge electrode, and the first electrode in the solid-state imaging device according to the second embodiment including the charge discharge electrode.
  • FIG. 54 is a schematic plan view of a charge storage electrode, a first separation electrode, a second separation electrode, a third separation electrode, and a first electrode in a modification of the solid-state imaging device according to the second embodiment.
  • FIGS. 55A, 55B, and 55C are charts illustrating a read driving example in a modification of the solid-state imaging device according to the second embodiment illustrated in FIG.
  • FIG. 56 is a conceptual diagram of an example in which an electronic device (camera) is used as a solid-state imaging device including an imaging device and a stacked imaging device of the present disclosure.
  • FIG. 57 is a conceptual diagram of a conventional stacked image sensor (stacked solid-state imaging device).
  • FIG. 58 is a block diagram illustrating an example of a schematic configuration of a vehicle control system.
  • FIG. 59 is an explanatory diagram illustrating an example of the installation positions of the out-of-vehicle information detection unit and the imaging unit.
  • FIG. 60 is a diagram illustrating an example of a schematic configuration of the endoscopic surgery system.
  • FIG. 61 is a block diagram illustrating an example of a functional configuration of the camera head and the CCU.
  • Embodiment 6 (Modification of Embodiments 1 to 5, imaging element provided with transfer control electrode) 8.
  • Embodiment 7 (Modification of Embodiments 1 to 6, imaging device of the present disclosure including a plurality of charge storage electrode segments) 9.
  • Embodiment 8 (Modification of Embodiments 1 to 6, Image Sensors of First and Sixth Configurations) 10. Ninth embodiment (imaging elements of second and sixth configurations of the present disclosure) 11.
  • Example 10 (third configuration imaging device) 12.
  • Example 11 (imaging element of fourth configuration) 13.
  • Example 12 (imaging device of fifth configuration) 14.
  • Example 13 (imaging device of sixth configuration) 15.
  • Other configuration (imaging elements of second and sixth configurations of the present disclosure) 11.
  • Example 10 (third configuration imaging device) 12.
  • Example 11 (imaging element of fourth configuration) 13.
  • Example 12 (imaging device of fifth configuration) 14.
  • Example 13 (imaging device of sixth configuration) 15.
  • Other configuration (imaging elements of second and sixth configurations of the present disclosure) 11.
  • Example 10
  • Imaging device of the present disclosure solid-state imaging device according to first and second embodiments of the present disclosure, general description>
  • at least one lower imaging element is provided below the imaging element, and the wavelength of light received by the imaging element and the light received by the lower imaging element May be in a different form.
  • a configuration in which two lower imaging elements are stacked can be adopted.
  • the potential of the first separation electrode has a constant value V ES ⁇ . 1 and the potential of the second separation electrode can also be of a constant value V ES-2 , or alternatively, the potential of the first separation electrode varies from the constant value V ES-1 (specifically, Specifically , the potential changes to a value V ES-1 ′), and the potential of the second separation electrode can be a constant value V ES-2 .
  • the third separation electrode may be configured to be shared by adjacent imaging element blocks.
  • the first separation electrode is disposed adjacent to and separated from the first electrode between the image sensors arranged side by side along the second direction in the image sensor block
  • the second separation electrode is disposed between the image sensor and the image sensor arranged side by side along the first direction, and between the image sensor and the image sensor arranged side by side along the second direction.
  • a configuration in which the first separation electrode and the first separation electrode are separated from each other can be employed.
  • the second separation electrode and the third separation electrode may be connected to each other.
  • the first separation electrode is disposed adjacent to and separated from the first electrode between the image sensors arranged side by side along the second direction in the image sensor block, and further, Between the image sensor and the image sensor juxtaposed along the first direction, adjacent to the first electrode and spaced apart, The second separation electrode is arranged apart from the first separation electrode between the image sensors arranged side by side along the second direction, and further, arranged side by side along the first direction.
  • a configuration may be employed in which the first separation electrode and the first separation electrode are spaced apart from each other between the imaging elements. In this case, the second separation electrode and the third separation electrode may be connected to each other.
  • the potential of the first separation electrode is a constant value V ES-1
  • the second separation electrode and the The potential of the third separating electrode can also be in the form of a constant value V ES-2 , or alternatively, the potential of the first separating electrode varies from the constant value V ES-1 (specifically, V ES-1 ′), and the potentials of the second and third separation electrodes may have a constant value V ES-2 .
  • VES-1 the charge to be stored is an electron
  • VES-1 ⁇ VES-2 if the hole to be stored is an electron, VES-1 ⁇ VES-2 .
  • a mode that satisfies VES-2 VES-1 .
  • the first electrode is shared among the P ⁇ Q imaging elements forming the imaging element block. It can be taken as a form.
  • Each imaging element block has a control unit, and the control unit includes at least a floating diffusion layer and an amplification transistor, and the shared first electrode is connected to the control unit. can do.
  • the imaging element by sharing the first electrode among the P ⁇ Q imaging elements forming one imaging element block, the imaging element
  • the configuration and structure of a plurality of arranged pixel regions can be simplified and miniaturized.
  • One floating diffusion layer is provided for one image sensor block composed of P ⁇ Q image sensors.
  • the P ⁇ Q image sensors provided for one floating diffusion layer may be composed of a plurality of first type image sensors to be described later, or at least one first type image sensor. And one or more second-type image sensors to be described later.
  • the solid-state imaging device including the above-described preferable embodiments and configurations may include a stacked image sensor having at least one image sensor of the present disclosure. it can.
  • the solid-state imaging device having such a configuration, at least one layer of a lower imaging element block is provided below the plurality of imaging element blocks,
  • the lower image sensor block is composed of a plurality of (specifically, P P along the first direction and Q P ⁇ Q along the second direction) image sensors,
  • the wavelength of the light received by the image sensor constituting the image sensor block may be different from the wavelength of the light received by the image sensor constituting the lower image sensor block.
  • the lower imaging element block may be provided with two layers. Further, in the solid-state imaging device according to the first embodiment of the present disclosure including the above-described preferred embodiments, a plurality (specifically, P ⁇ Q) imaging elements constituting the lower imaging element block are shared. It can be configured to have a floating diffusion layer formed.
  • the first imaging element when the first electrode is shared by the four imaging elements forming the imaging element block, the first imaging element is stored in the four imaging elements under the control of various separation electrodes.
  • the readout method may be adopted in which the charges accumulated are separately read out four times, or the charges accumulated in the four imaging elements may be simultaneously read out one time.
  • the former may be referred to as a “first mode readout method” for convenience, and the latter may be referred to as a “second mode readout method” for convenience.
  • the readout method in the first mode it is possible to achieve higher definition of an image obtained by the solid-state imaging device.
  • signals obtained by four image sensors are added to increase the sensitivity.
  • Switching between the first mode readout method and the second mode readout method can be achieved by providing an appropriate switching unit in the solid-state imaging device.
  • P ⁇ Q imaging elements can share one floating diffusion layer by appropriately controlling the timing of the charge transfer period, and the imaging element block can be used.
  • the constituent P ⁇ Q image sensors are connected to one drive circuit. However, the control of the charge storage electrode is performed for each image sensor.
  • the imaging device of the present disclosure or the imaging device of the present disclosure (hereinafter, collectively referred to as “the solid-state imaging device” according to the first to second embodiments of the present disclosure including the above-described preferred embodiments)
  • the first separation electrode, the second separation electrode, and the third separation electrode are provided in a region opposed to a region of the photoelectric conversion layer via an insulating layer. It can be in the form.
  • These separation electrodes may be referred to as “lower first separation electrode”, “lower second separation electrode”, and “lower third separation electrode” for convenience, and these are collectively referred to as “lower separation electrode”. ].
  • first separation electrode, the second separation electrode, and the third separation electrode may be provided on the photoelectric conversion layer so as to be separated from the second electrode.
  • separation electrodes may be referred to as “upper first separation electrode”, “upper second separation electrode”, and “upper third separation electrode” for convenience, and these are collectively referred to as “upper separation electrode”. ].
  • the separation electrode is disposed separately from the first electrode and the charge storage electrode, surrounds the charge storage electrode, and the first separation electrode includes the first electrode and the second separation electrode.
  • the orthogonally projected image of the separation electrode is located apart from the orthogonally projected image of the first electrode and the charge storage electrode, and the charge storage electrode
  • the orthographic image surrounds the orthographic image
  • the orthographic image of the first separation electrode is located between the orthographic image of the first electrode and the orthographic image of the second separation electrode.
  • a part of the orthogonally projected image of the second separation electrode and a part of the orthogonally projected image of the charge storage electrode may overlap.
  • the orthogonally projected image of the first separation electrode is adjacent to the orthogonally projected image of the first electrode between the image sensors arranged side by side along at least the second direction in the image sensor block,
  • the second separation electrode is located between the imaging elements in the imaging element block, and the third separation electrode is located between the imaging elements in the imaging element block.
  • the imaging device or the like of the present disclosure including the above-described preferred embodiments and configurations further includes a semiconductor substrate, and the photoelectric conversion unit may be arranged above the semiconductor substrate.
  • the first electrode, the charge storage electrode, the second electrode, various kinds of separation electrodes and various kinds of electrodes are connected to a drive circuit described later.
  • the size of the charge storage electrode may be larger than the first electrode. Assuming that the area of the charge storage electrode is s 1 ′ and the area of the first electrode is s 1 , 4 ⁇ s 1 '/ s 1 Is preferably satisfied.
  • the second electrode located on the light incident side may be shared by a plurality of image sensors, except when an upper separation electrode is formed. That is, the second electrode can be a so-called solid electrode.
  • the photoelectric conversion layer can be shared by a plurality of imaging devices. That is, a mode in which one photoelectric conversion layer is formed in a plurality of imaging elements can be employed.
  • the first electrode extends in the opening provided in the insulating layer and is connected to the photoelectric conversion layer. It can be.
  • the photoelectric conversion layer can extend in the opening provided in the insulating layer and be connected to the first electrode.
  • the edge of the top surface of the first electrode is covered with an insulating layer, The first electrode is exposed at the bottom of the opening, When the surface of the insulating layer in contact with the top surface of the first electrode is the first surface, and the surface of the insulating layer in contact with the portion of the photoelectric conversion layer facing the charge storage electrode is the second surface, the side surface of the opening is the second surface.
  • the opening may have a slope extending from the first surface to the second surface, and the side surface of the opening having the slope extending from the first surface to the second surface may be located on the charge storage electrode side. It can be taken as a form. Note that another layer is formed between the photoelectric conversion layer and the first electrode (for example, a material layer suitable for charge storage is formed between the photoelectric conversion layer and the first electrode). Is included.
  • a control unit provided on the semiconductor substrate and having a drive circuit, The first electrode and the charge storage electrode are connected to a drive circuit, In the charge accumulation period, the driving circuit, the potential V 11 is applied to the first electrode, the potential V 31 is applied to the charge storage electrode, charges are accumulated in the photoelectric conversion layer, In the charge transfer period, the driving circuit, the potential V 12 is applied to the first electrode, the potential V 32 is applied to the charge storage electrode, the control unit charges accumulated in the photoelectric conversion layer through the first electrode Can be read out.
  • V 31 ⁇ V 11 and V 32 ⁇ V 12
  • V 31 ⁇ V 11 and V 32 > V 12 It is.
  • the image pickup device and the like of the present disclosure including the various preferable modes and configurations described above are disposed between the first electrode and the charge storage electrode and separated from the first electrode and the charge storage electrode.
  • a mode in which a transfer control electrode (charge transfer electrode) is disposed so as to face the photoelectric conversion layer via the insulating layer can be further provided.
  • the imaging device or the like of the present disclosure having such a form may be referred to as “the imaging device or the like of the present disclosure including a transfer control electrode” for convenience.
  • the charge accumulation period when the potential applied to the transfer control electrode was V 41, the potential of the first electrode and the second electrode In this case, it is preferable to satisfy V 41 ⁇ V 11 and V 41 ⁇ V 31 . Further, in the charge transfer period, when the potential applied to the transfer control electrode was V 42, the potential of the first electrode is higher than potential of the second electrode, satisfies V 32 ⁇ V 42 ⁇ V 12 Is preferred.
  • the charge discharging device connected to the photoelectric conversion layer and disposed separately from the first electrode and the charge storage electrode.
  • An embodiment further including an electrode can be adopted.
  • the imaging device and the like of the present disclosure in such a form are referred to as “the imaging device and the like of the present disclosure including a charge discharging electrode” for convenience.
  • the charge discharging electrode may be arranged so as to surround the first electrode and the charge storage electrode (that is, in a frame shape). .
  • the charge discharging electrode can be shared (shared) by a plurality of imaging devices.
  • the charge discharging electrode it is preferable that various separation electrodes are constituted by upper separation electrodes.
  • the photoelectric conversion layer extends in the second opening provided in the insulating layer, is connected to the charge discharging electrode, The edge of the top surface of the charge discharging electrode is covered with an insulating layer, A charge discharge electrode is exposed at the bottom of the second opening,
  • the side surface of the second opening is , A form having a slope that spreads from the third surface toward the second surface.
  • a control unit provided on the semiconductor substrate and having a drive circuit
  • the first electrode, the charge storage electrode, and the charge discharge electrode are connected to a drive circuit
  • the driving circuit In the charge accumulation period, the driving circuit, the potential V 11 is applied to the first electrode, the potential V 31 is applied to the charge storage electrode, the potential V 51 is applied to the charge discharging electrodes, electric charges accumulated in the photoelectric conversion layer
  • the driving circuit In the charge transfer period, the driving circuit applied the potential V 12 to the first electrode, applied the potential V 32 to the charge storage electrode, applied the potential V 52 to the charge discharging electrode, and accumulated the potential in the photoelectric conversion layer. Charges may be read out to the control unit via the first electrode.
  • the charge storage electrode may be configured to include a plurality of charge storage electrode segments.
  • the imaging device or the like of the present disclosure having such a configuration may be referred to as “the imaging device or the like of the present disclosure including a plurality of charge storage electrode segments” for convenience.
  • the number of charge storage electrode segments may be two or more.
  • the imaging device or the like of the present disclosure including a plurality of charge storage electrode segments, when applying a different potential to each of the N charge storage electrode segments,
  • the potential of the first electrode is higher than the potential of the second electrode, during the charge transfer period, the potential is applied to the charge storage electrode segment (first photoelectric conversion unit segment) located closest to the first electrode.
  • the potential is higher than the potential applied to the charge storage electrode segment (the Nth photoelectric conversion unit segment) located farthest from the first electrode
  • the potential of the first electrode is lower than the potential of the second electrode, the charge is applied to the charge storage electrode segment (first photoelectric conversion unit segment) located closest to the first electrode during the charge transfer period.
  • the potential may be lower than the potential applied to the charge storage electrode segment (the Nth photoelectric conversion unit segment) located farthest from the first electrode.
  • the semiconductor substrate is provided with at least a floating diffusion layer and an amplification transistor that constitute a control unit,
  • the first electrode may be connected to the floating diffusion layer and the gate of the amplification transistor.
  • the semiconductor substrate is further provided with a reset transistor and a selection transistor that constitute a control unit,
  • the floating diffusion layer is connected to one source / drain region of the reset transistor,
  • One source / drain region of the amplification transistor may be connected to one source / drain region of the selection transistor, and the other source / drain region of the selection transistor may be connected to a signal line.
  • the photoelectric conversion unit is composed of N (where N ⁇ 2) photoelectric conversion unit segments
  • the photoelectric conversion layer is composed of N photoelectric conversion layer segments
  • the insulating layer is composed of N insulating layer segments
  • the charge storage electrode includes N charge storage electrode segments.
  • the charge storage electrode includes N charge storage electrode segments that are spaced apart from each other.
  • the photoelectric conversion unit segment having a larger value of n is located farther from the first electrode.
  • the thickness of the insulating layer segment gradually changes from the first photoelectric conversion unit segment to the Nth photoelectric conversion unit segment.
  • the thickness of the photoelectric conversion layer segment gradually changes from the first photoelectric conversion unit segment to the Nth photoelectric conversion unit segment.
  • the material forming the insulating layer segment is different between the adjacent photoelectric conversion unit segments.
  • the material forming the charge storage electrode segment is different between the adjacent photoelectric conversion unit segments.
  • the area of the charge storage electrode segment gradually decreases from the first photoelectric conversion unit segment to the Nth photoelectric conversion unit segment. Note that the area may be continuously reduced or may be reduced stepwise.
  • the stacking direction of the charge storage electrode, the insulating layer, and the photoelectric conversion layer is set in the Z direction
  • the direction away from the electrode is defined as the X direction
  • the cross-sectional area of the laminated portion obtained by cutting the laminated portion in which the charge storage electrode, the insulating layer, and the photoelectric conversion layer are laminated on the YZ virtual plane is the distance from the first electrode. Varies depending on The change in the cross-sectional area may be a continuous change or a step-like change.
  • the N photoelectric conversion layer segments are provided continuously, and the N insulating layer segments are also provided continuously, and the N charge storage electrodes are provided. The segments are also provided continuously.
  • the N photoelectric conversion layer segments are provided continuously.
  • N insulating layer segments are provided continuously, while in the image pickup device of the third configuration, the N insulating layer segments are Is provided corresponding to each of.
  • the N charge storage electrode segments are provided corresponding to each of the photoelectric conversion unit segments. I have.
  • the same potential is applied to all of the charge storage electrode segments.
  • different potentials may be applied to each of the N charge storage electrode segments.
  • the thickness of the insulating layer segment is defined, or Further, the thickness of the photoelectric conversion layer segment is specified, or the material constituting the insulating layer segment is different, or the material constituting the charge storage electrode segment is different, or the charge storage electrode segment is different. Since the area is defined or the cross-sectional area of the laminated portion is defined, a kind of charge transfer gradient is formed, and the charge generated by photoelectric conversion can be more easily and reliably transferred to the first electrode. It becomes possible to transfer. As a result, it is possible to prevent the occurrence of an afterimage and the occurrence of a charge transfer residue.
  • a solid-state imaging device including a plurality of the imaging elements having the above-described first to sixth configurations can be used.
  • a solid-state imaging device including a plurality of stacked imaging devices having at least one imaging device having the above-described first to sixth configurations can be provided.
  • the photoelectric conversion unit segment having a larger value of n is located farther from the first electrode, but whether or not it is farther from the first electrode is determined in the X direction.
  • the direction away from the first electrode is defined as the X direction, but the “X direction” is defined as follows. That is, the pixel region in which a plurality of image sensors or stacked-type image sensors are arranged is composed of pixels arranged in a two-dimensional array, that is, regularly arranged in the X and Y directions.
  • the planar shape of the pixel When the planar shape of the pixel is rectangular, the direction in which the side closest to the first electrode extends is defined as the Y direction, and the direction orthogonal to the Y direction is defined as the X direction.
  • the planar shape of the pixel is an arbitrary shape, the overall direction including the line segment or curve closest to the first electrode is defined as the Y direction, and the direction orthogonal to the Y direction is defined as the X direction.
  • the potential of the first electrode is higher than the potential of the second electrode
  • the potential of the first electrode is lower than the potential of the second electrode.
  • the level of the potential may be reversed.
  • the thickness of the insulating layer segment gradually changes from the first photoelectric conversion unit segment to the Nth photoelectric conversion unit segment. May gradually become thicker or thinner, whereby a kind of charge transfer gradient is formed.
  • the thickness of the insulating layer segment When the charge to be stored is electrons, the thickness of the insulating layer segment may be gradually increased, and when the charge to be stored is holes, the thickness of the insulating layer segment may be gradually increased. What is necessary is just to employ
  • the thickness of the photoelectric conversion layer segment gradually changes from the first photoelectric conversion unit segment to the Nth photoelectric conversion unit segment.
  • the thickness of the layer segments may be progressively thicker or thinner, which forms a kind of charge transfer gradient.
  • the thickness of the photoelectric conversion layer segment When charges to be stored are electrons, the thickness of the photoelectric conversion layer segment may be gradually increased, and when charges to be stored are holes, the thickness of the photoelectric conversion layer segment may be increased. It is sufficient to adopt a configuration in which the thickness gradually increases.
  • the thickness of the photoelectric conversion layer segment gradually increases, when the state of V 31 ⁇ V 11 is satisfied during the charge storage period, and when the thickness of the photoelectric conversion layer segment gradually decreases, the charge storage When the state becomes V 31 ⁇ V 11 in the period, a stronger electric field is applied to the n-th photoelectric conversion unit segment than to the (n + 1) -th photoelectric conversion unit segment, and the n-th photoelectric conversion segment increases from the first photoelectric conversion segment. The flow of charges to the first electrode can be reliably prevented.
  • the material forming the insulating layer segment is different in the adjacent photoelectric conversion unit segments, which forms a kind of charge transfer gradient. It is preferable that the value of the relative dielectric constant of the material forming the insulating layer segment gradually decreases from the segment to the Nth photoelectric conversion segment.
  • the material forming the charge storage electrode segment is different between the adjacent photoelectric conversion unit segments, which forms a kind of charge transfer gradient. It is preferable that the work function value of the material forming the insulating layer segment gradually increases from the conversion section segment to the N-th photoelectric conversion section segment.
  • the area of the charge storage electrode segment gradually decreases from the first photoelectric conversion unit segment to the Nth photoelectric conversion unit segment. Since a kind of charge transfer gradient is formed, when the state of V 31 ⁇ V 11 is satisfied during the charge accumulation period, the n-th photoelectric conversion unit segment is more than the (n + 1) -th photoelectric conversion segment. Many charges can be stored. Then, in a state of V 32 ⁇ V 12 during the charge transfer period, the flow of charge from the first photoelectric conversion unit segment to the first electrode and the n-th to n-th photoelectric conversion unit segment The flow of electric charges to the photoelectric conversion unit segment can be reliably ensured.
  • the cross-sectional area of the stacked portion changes depending on the distance from the first electrode, thereby forming a kind of charge transfer gradient.
  • the thickness of the cross section of the stacked portion is constant and the width of the cross section of the stacked portion is reduced as the distance from the first electrode is increased, as described in the imaging device of the fifth configuration, In the charge accumulation period, when a state of V 31 ⁇ V 11 is satisfied, more charge can be accumulated in a region near the first electrode than in a region far from the first electrode.
  • the imaging device of the first configuration can be used. As described above, in the state of V 31 ⁇ V 11 during the charge storage period, a region closer to the first electrode can store more charges than a region farther from the first electrode, and a strong electric field is generated.
  • the flow of charges from a region near the first electrode to the first electrode can be reliably prevented. Then, in the state of V 32 ⁇ V 12 during the charge transfer period, it is possible to ensure the flow of charge from the region near the first electrode to the first electrode and the flow of charge from the region far from the region near the first electrode. Can be. Further, if a configuration in which the thickness of the photoelectric conversion layer segment is gradually increased is adopted, as described in the image pickup device of the second configuration, when the state of V 31 ⁇ V 11 is satisfied in the charge accumulation period, A stronger electric field is applied to the region closer to the first electrode than to the region farther from the region, and the flow of charges from the region closer to the first electrode to the first electrode can be reliably prevented. Then, in the state of V 32 ⁇ V 12 during the charge transfer period, it is possible to ensure the flow of charge from the region near the first electrode to the first electrode and the flow of charge from the region far from the region near the first electrode. Can be.
  • a light shielding layer is formed on the light incident side from the second electrode. It can be in the form.
  • light may be incident from the second electrode side, and light may not be incident on the first electrode (in some cases, the first electrode and the transfer control electrode).
  • a light-shielding layer may be formed on the light incident side of the second electrode and above the first electrode (in some cases, the first electrode and the transfer control electrode).
  • an on-chip micro lens is provided above the charge storage electrode and the second electrode, and light incident on the on-chip micro lens is focused on the charge storage electrode. It can be in a form.
  • the light shielding layer may be provided above the light incident side surface of the second electrode, or may be provided on the light incident side surface of the second electrode. In some cases, a light shielding layer may be formed on the second electrode.
  • a material forming the light-shielding layer include chromium (Cr), copper (Cu), aluminum (Al), tungsten (W), and a resin (for example, a polyimide resin) that does not transmit light.
  • a blue light provided with a photoelectric conversion layer (for convenience, referred to as a “first type blue photoelectric conversion layer”) that absorbs blue light (light of 425 nm to 495 nm) is used.
  • a photoelectric conversion layer (for convenience, referred to as a "first type of blue light imaging element") and a photoelectric conversion layer absorbing green light (light of 495 nm to 570 nm); ) Having a sensitivity to green light (for convenience, referred to as a “first-type image sensor for green light”), and a photoelectric conversion layer (for convenience, absorbing light of 620 nm to 750 nm).
  • first-type red photoelectric conversion layer (hereinafter referred to as “first-type red-light imaging element” for convenience).
  • a conventional image sensor having no charge storage electrode and having sensitivity to blue light is referred to as a “second type blue light image sensor” for convenience and has sensitivity to green light.
  • the image sensor is referred to as a “second type green light image sensor” for convenience, and the image sensor having sensitivity to red light is referred to as a “second type red light image sensor” for convenience.
  • the photoelectric conversion layer forming the blue light imaging device is referred to as a “second type blue photoelectric conversion layer” for convenience, and the photoelectric conversion layer forming the second type green light imaging device is referred to as “second type blue light conversion layer” for convenience.
  • the second type red photoelectric conversion layer is referred to as a “second type red photoelectric conversion layer” for convenience.
  • the stacked image sensor according to the present disclosure has at least one image sensor or the like (photoelectric conversion element) according to the present disclosure.
  • a first type of photoelectric conversion unit for blue light, a first type of photoelectric conversion unit for green light, and a first type of photoelectric conversion unit for red light are vertically stacked,
  • a blue light photoelectric conversion unit of the type and a first type green light photoelectric conversion unit are vertically stacked, Below these two layers of the first type photoelectric conversion units, a second type red light photoelectric conversion unit is disposed, A configuration and a structure in which the first type of blue light image sensor, the first type of green light image sensor, and the second type of red light image sensor are provided on a semiconductor substrate, respectively. Below the type green light photoelectric conversion unit, a second type blue light photoelectric conversion unit and a second type red light photoelectric conversion unit are arranged, A configuration and a structure [D] in which each of a control unit of the first type of green light image sensor, the second type of blue light image sensor, and the second type of red light image sensor is provided on a semiconductor substrate.
  • the type blue light photoelectric conversion unit a second type green light photoelectric conversion unit and a second type red light photoelectric conversion unit are arranged, A configuration and a structure in which the control units of the first type of blue light imaging device, the second type of green light imaging device, and the second type of red light imaging device are provided on a semiconductor substrate, respectively.
  • the arrangement order of the photoelectric conversion units in the vertical direction of these imaging elements is, in order from the light incident direction, the order of the blue light photoelectric conversion unit, the green light photoelectric conversion unit, and the red light photoelectric conversion unit, or the light incident direction. It is preferable that the order is from green light photoelectric conversion part, blue light photoelectric conversion part, and red light photoelectric conversion part.
  • a first type infrared photoelectric conversion unit may be provided.
  • the photoelectric conversion layer of the first type infrared photoelectric conversion unit is made of, for example, an organic material, and is the lowermost layer of the laminated structure of the first type imaging device, and is lower than the second type imaging device. It is also preferable to arrange them above.
  • a second type infrared photoelectric conversion unit may be provided below the first type photoelectric conversion unit.
  • the first electrode is formed on an interlayer insulating layer provided on a semiconductor substrate.
  • the imaging element formed on the semiconductor substrate can be of a back-illuminated type or a front-illuminated type.
  • the photoelectric conversion layer When the photoelectric conversion layer is composed of an organic material, the photoelectric conversion layer (1) It is composed of a p-type organic semiconductor. (2) It is composed of an n-type organic semiconductor. (3) It has a laminated structure of p-type organic semiconductor layer / n-type organic semiconductor layer. It has a laminated structure of a p-type organic semiconductor layer / a mixed layer of p-type organic semiconductor and n-type organic semiconductor (bulk heterostructure) / n-type organic semiconductor layer. It has a laminated structure of a p-type organic semiconductor layer / a mixed layer (bulk heterostructure) of a p-type organic semiconductor and an n-type organic semiconductor.
  • n-type organic semiconductor layer / a mixed layer (bulk heterostructure) of a p-type organic semiconductor and an n-type organic semiconductor.
  • fullerenes and fullerene derivatives eg, fullerenes (higher order fullerenes such as C60, C70, C74, etc., endohedral fullerenes, etc.) or fullerene derivatives (eg, fullerene fluorides, PCBM fullerene compounds, fullerene multimers, etc.)
  • fullerenes and fullerene derivatives eg, fullerene fluorides, PCBM fullerene compounds, fullerene multimers, etc.
  • a heterocyclic compound containing a nitrogen atom, an oxygen atom, and a sulfur atom for example, a pyridine derivative, a pyrazine derivative, a pyrimidine derivative, a triazine derivative, a quinoline derivative, a quinoxaline derivative, an isoquinoline derivative, an acridine Derivatives, phenazine derivatives, phenanthroline derivatives, tetrazole derivatives, pyrazole derivatives, imidazole derivatives, thiazole derivatives, oxazole derivatives, imidazole derivatives, benzimidazole derivatives, benzotriazole derivatives, benzoxazole derivatives, benzoxazole derivatives, carbazole derivatives, benzofuran derivatives, dibenzofuran derivatives , Subporphyrazine derivatives, polyphenylenevinylene derivatives, polybenzothiadiazole derivatives, polyfluorene
  • Examples of the group contained in the fullerene derivative include a halogen atom; a linear, branched, or cyclic alkyl group or a phenyl group; a group having a linear or condensed aromatic compound; a group having a halide; a partial fluoroalkyl group; Aryl group; arylsulfanyl group; alkylsulfanyl group; arylsulfonyl group; alkylsulfonyl group; arylsulfide group; alkylsulfide group; amino group; alkylamino group; arylamino group; A hydroxy group; an alkoxy group; an acylamino group; an acyloxy group; a carbonyl group; a carboxy group; a carboxamide group; a carboalkoxy group; an acyl group; a sulfonyl group; a cyano group; a nitro group; Fin group; phosphonic group
  • the thickness of the photoelectric conversion layer (sometimes referred to as “organic photoelectric conversion layer”) made of an organic material is not limited, but is, for example, 1 ⁇ 10 ⁇ 8 m to 5 ⁇ 10 ⁇ 7 m. , Preferably 2.5 ⁇ 10 ⁇ 8 m to 3 ⁇ 10 ⁇ 7 m, more preferably 2.5 ⁇ 10 ⁇ 8 m to 2 ⁇ 10 ⁇ 7 m, and still more preferably 1 ⁇ 10 ⁇ 7 m to 1. 8 ⁇ 10 ⁇ 7 m can be exemplified. Note that organic semiconductors are often classified as p-type and n-type.
  • the p-type means that holes can be easily transported
  • the n-type means that electrons can be easily transported
  • the inorganic semiconductor is inorganic. It is not limited to the interpretation that the semiconductor has holes or electrons as majority carriers of thermal excitation like a semiconductor.
  • examples of the material constituting the organic photoelectric conversion layer that performs green light photoelectric conversion include, for example, rhodamine-based dyes, melacyanine-based dyes, quinacridone derivatives, subphthalocyanine-based dyes (subphthalocyanine derivatives), and blue.
  • examples of a material constituting the organic photoelectric conversion layer that photoelectrically converts light include a coumaric acid dye, tris-8-hydroxyquinolialuminum (Alq3), a melanocyanine-based dye, and the like.
  • Examples of the material constituting the organic photoelectric conversion layer include a phthalocyanine dye and a subphthalocyanine dye (subphthalocyanine derivative).
  • crystalline silicon, amorphous silicon, microcrystalline silicon, crystalline selenium, amorphous selenium, and chalcopyrite-based compounds CIGS (CuInGaSe), CIS (CuInSe 2 ), CuInS 2 , CuAlS 2 , CuAlSe 2 , CuGaS 2 , CuGaSe 2 , AgAlS 2 , AgAlSe 2 , AgInS 2 , AgInSe 2 , or GaAs, InP, AlGaAs, InGaP, AlGaInP, and InGaAsP, which are III-V compounds.
  • Compound semiconductors such as CdSe, CdS, In 2 Se 3 , In 2 S 3 , Bi 2 Se 3 , Bi 2 S 3 , ZnSe, ZnS, PbSe, and PbS can be given.
  • quantum dots made of these materials can be used for the photoelectric conversion layer.
  • the photoelectric conversion layer can have a stacked structure of a lower semiconductor layer and an upper photoelectric conversion layer.
  • the efficiency of transferring charges accumulated in the photoelectric conversion layer to the first electrode can be increased.
  • electric charges generated in the photoelectric conversion layer can be temporarily held, and transfer timing and the like can be controlled. Further, generation of dark current can be suppressed.
  • the material constituting the upper photoelectric conversion layer may be appropriately selected from the various materials constituting the above photoelectric conversion layer.
  • a material forming the lower semiconductor layer a material having a large band gap energy (for example, a band gap energy of 3.0 eV or more) and having a higher mobility than the material forming the photoelectric conversion layer is used. It is preferable to use Specific examples include oxide semiconductor materials; transition metal dichalcogenides; silicon carbide; diamond; graphene; carbon nanotubes; and organic semiconductor materials such as condensed polycyclic hydrocarbon compounds and condensed heterocyclic compounds.
  • oxide semiconductor materials indium oxide, gallium oxide, zinc oxide, tin oxide, materials containing at least one of these oxides, materials obtained by adding a dopant to these materials
  • the, for example, IGZO, ITZO, IWZO, IWO , ZTO, ITO-SiO X materials, GZO, IGO, ZnSnO 3, AlZnO, GaZnO can be exemplified InZnO, also, CuI, InSbO 4, ZnMgO, CuInO 2, MgIn 2 O 4, Ageruko a material containing CdO etc. Although it is not intended to limit to these materials.
  • the electric charge to be accumulated is an electron as a material constituting the lower semiconductor layer
  • a material having an ionization potential higher than the ionization potential of the material constituting the photoelectric conversion layer can be used.
  • the charge is a hole
  • a material having an electron affinity lower than the electron affinity of the material forming the photoelectric conversion layer can be given.
  • the impurity concentration in the material forming the lower semiconductor layer is preferably 1 ⁇ 10 18 cm ⁇ 3 or less.
  • the lower semiconductor layer may have a single-layer structure or a multilayer structure. Further, the material forming the lower semiconductor layer located above the charge storage electrode may be different from the material forming the lower semiconductor layer located above the first electrode.
  • a single-chip color solid-state imaging device can be configured by the solid-state imaging devices according to the first and second embodiments of the present disclosure.
  • the solid-state imaging device including the stacked-type imaging device is different from the solid-state imaging device including the Bayer array imaging device (that is, using a color filter. Rather than performing blue, green, and red spectroscopy), one pixel is formed by stacking image sensors having sensitivity to light of multiple wavelengths in the same pixel in the light incident direction. It is possible to improve the sensitivity and the pixel density per unit volume.
  • the organic material since the organic material has a high absorption coefficient, the thickness of the organic photoelectric conversion layer can be made smaller than that of the conventional Si-based photoelectric conversion layer, and light leakage from an adjacent pixel and light incident angle can be reduced. Restrictions are relaxed.
  • a false color occurs because color signals are created by performing interpolation between pixels of three colors.
  • the second embodiment of the present disclosure including the stacked-type image sensor.
  • generation of false colors is suppressed. Since the organic photoelectric conversion layer itself also functions as a color filter, color separation is possible without providing a color filter.
  • the use of the color filter eases the demand for the blue, green, and red spectral characteristics. And has high mass productivity.
  • the imaging elements in the solid-state imaging device according to the first embodiment of the present disclosure in addition to a Bayer arrangement, an interline arrangement, a G stripe RB checkerboard arrangement, a G stripe RB complete checkerboard arrangement, a checkerboard complementary color arrangement, a stripe arrangement, an oblique stripe Examples include an array, a primary color difference array, a field color difference sequential array, a frame color difference sequential array, a MOS type array, an improved MOS type array, a frame interleave array, and a field interleave array.
  • one pixel (or sub-pixel) is constituted by one image sensor.
  • a pixel region in which a plurality of imaging devices or the like of the present disclosure or a plurality of stacked imaging devices in the present disclosure are arranged is composed of pixels regularly arranged in a two-dimensional array.
  • the pixel area is usually composed of an effective pixel area that actually receives light and amplifies signal charges generated by photoelectric conversion and reads it out to a drive circuit, and a black reference pixel for outputting optical black serving as a black level reference. And an area.
  • the black reference pixel area is usually arranged on the outer periphery of the effective pixel area.
  • the imaging device and the like of the present disclosure including the various preferable embodiments and configurations described above, light is irradiated, photoelectric conversion occurs in the photoelectric conversion layer, and carriers are separated from holes.
  • the electrode from which holes are extracted is defined as an anode
  • the electrode from which electrons are extracted is defined as a cathode.
  • the first electrode, the charge storage electrode, the various separation electrodes, the transfer control electrode, the charge discharge electrode, and the second electrode can be made of a transparent conductive material.
  • the first electrode, the charge storage electrode, the various separation electrodes, the transfer control electrode, and the charge discharge electrode may be collectively referred to as a “first electrode or the like”.
  • the second electrode is made of a transparent conductive material, and the first electrode and the charge storage electrode are made of a metal material.
  • the second electrode located on the light incident side is made of a transparent conductive material
  • the first electrode or the like is made of, for example, Al—Nd (an alloy of aluminum and neodymium) or A configuration may be made of ASC (an alloy of aluminum, samarium and copper).
  • an electrode made of a transparent conductive material may be referred to as a “transparent electrode”.
  • the band gap energy of the transparent conductive material is desirably 2.5 eV or more, preferably 3.1 eV or more.
  • the transparent conductive material constituting the transparent electrode include a conductive metal oxide.
  • indium oxide indium-tin oxide (ITO, Indium Tin Oxide, Sn-doped In 2 O 3) , Crystalline ITO and amorphous ITO), indium-zinc oxide (IZO) obtained by adding indium to zinc oxide as a dopant, and indium-gallium oxide (IGO) obtained by adding indium to gallium oxide as a dopant.
  • ITO indium-tin oxide
  • IGO indium-gallium oxide
  • Indium-gallium-zinc oxide obtained by adding indium and gallium as dopants to zinc oxide
  • indium-tin-zinc oxide obtained by adding indium and tin as dopants to zinc oxide
  • IFO F-doped in 2 O 3
  • tin oxide SnO 2
  • O SnO 2 and Sb-doped
  • FTO SnO 2 of F-doped
  • aluminum was added aluminum as a dopant to zinc oxide - zinc oxide (AZO), oxide Gallium-zinc oxide (GZO) in which gallium is added as a dopant to zinc
  • titanium oxide TiO 2
  • niobium-titanium oxide TNO
  • a transparent electrode having a base layer of gallium oxide, titanium oxide, niobium oxide, nickel oxide, or the like can be given.
  • the thickness of the transparent electrode may be 2 ⁇ 10 ⁇ 8 m to 2 ⁇ 10 ⁇ 7 m, preferably 3 ⁇ 10 ⁇ 8 m to 1 ⁇ 10 ⁇ 7 m.
  • the other electrodes are preferably made of a transparent conductive material from the viewpoint of simplifying the manufacturing process.
  • Alkali metals eg, Li, Na, K, etc.
  • alkaline earth metals eg, Mg, Ca, etc.
  • Alkali metals eg, Li, Na, K, etc.
  • alkaline earth metals eg, Mg, Ca, etc.
  • Alkali metals eg, Li, Na, K, etc.
  • alkaline earth metals eg, Mg, Ca, etc.
  • Alkali metals eg, Li, Na, K, etc.
  • alkaline earth metals eg, Mg, Ca, etc.
  • Alkali metals eg, Li, Na, K, etc.
  • alkaline earth metals eg, Mg, Ca, etc.
  • Alkali metals eg, Li, Na, K, etc.
  • alkaline earth metals eg, Mg, Ca, etc.
  • Alkali metals eg, Alkaline earth metals
  • Alkaline earth metals eg
  • platinum platinum (Pt), gold (Au), palladium (Pd), chromium (Cr), nickel (Ni), aluminum (Al), silver (Ag), tantalum (Ta) ), Tungsten (W), copper (Cu), titanium (Ti), indium (In), tin (Sn), iron (Fe), cobalt (Co), molybdenum (Mo), and the like, or a metal thereof.
  • Alloys containing elements conductive particles made of these metals, conductive particles of alloys containing these metals, polysilicon containing impurities, carbon-based materials, oxide semiconductors, carbon nanotubes, graphene, etc. Materials, or a layered structure of layers containing these elements.
  • an organic material such as poly (3,4-ethylenedioxythiophene) / polystyrenesulfonic acid [PEDOT / PSS] can be used.
  • these conductive materials may be mixed with a binder (polymer) to cure a paste or ink and then used as an electrode.
  • a dry method or a wet method can be used as a method for forming the first electrode and the like and the second electrode (anode and cathode).
  • Examples of the dry method include physical vapor deposition (PVD) and chemical vapor deposition (CVD).
  • a vacuum evaporation method using resistance heating or high frequency heating an EB (electron beam) evaporation method, various sputtering methods (magnetron sputtering method, RF-DC combined bias sputtering method, ECR Sputtering method, facing target sputtering method, high frequency sputtering method), ion plating method, laser ablation method, molecular beam epitaxy method, and laser transfer method.
  • the CVD method include a plasma CVD method, a thermal CVD method, an organic metal (MO) CVD method, and a photo CVD method.
  • electrolytic plating electroless plating, spin coating, ink jet, spray coating, stamping, micro contact printing, flexographic printing, offset printing, gravure printing, dipping, etc.
  • the patterning method include chemical etching such as shadow mask, laser transfer, and photolithography, and physical etching using ultraviolet light or laser.
  • a laser planarization method, a reflow method, a CMP (Chemical Mechanical Polishing) method, or the like can be used as a technique for planarizing the first electrode or the like or the second electrode.
  • Inorganic materials exemplified by metal oxide high-dielectric insulating materials such as silicon oxide-based materials; silicon nitride (SiN Y ); and aluminum oxide (Al 2 O 3 ) as materials for forming insulating layers, various interlayer insulating layers, and insulating films.
  • metal oxide high-dielectric insulating materials such as silicon oxide-based materials; silicon nitride (SiN Y ); and aluminum oxide (Al 2 O 3 ) as materials for forming insulating layers, various interlayer insulating layers, and insulating films.
  • PMMA Polymethyl methacrylate
  • PVP Polyvinyl phenol
  • PVA Polyvinyl alcohol
  • PC Polyethylene terephthalate
  • PTT Polystyrene
  • silicon oxide-based materials silicon oxide (SiO x ), BPSG, PSG, BSG, AsSG, PbSG, silicon oxynitride (SiON), SOG (spin-on-glass), low dielectric constant materials (for example, polyaryl ether, cycloalkyl Perfluorocarbon polymer and benzocyclobutene, cyclic fluororesin, polytetrafluoroethylene, fluorinated aryl ether, fluorinated polyimide, amorphous carbon, organic SOG) can be exemplified.
  • silicon oxide-based materials silicon oxide (SiO x ), BPSG, PSG, BSG, AsSG, PbSG, silicon oxynitride (SiON), SOG (spin-on-glass), low dielectric constant materials (for example, polyaryl ether, cycloalkyl Perfluorocarbon polymer and benzocyclobutene, cyclic fluororesin, polytetrafluoroethylene,
  • the configuration and structure of the floating diffusion layer, the amplification transistor, the reset transistor, and the selection transistor that constitute the control unit can be the same as those of the conventional floating diffusion layer, the amplification transistor, the reset transistor, and the selection transistor.
  • the drive circuit can also have a known configuration and structure.
  • the first electrode is connected to the floating diffusion layer and the gate portion of the amplification transistor, but a contact hole may be formed to connect the first electrode to the floating diffusion layer and the gate portion of the amplification transistor.
  • the material constituting the contact hole portion include polysilicon doped with impurities, high melting point metal such as tungsten, Ti, Pt, Pd, Cu, TiW, TiN, TiNW, WSi 2 , and MoSi 2, and metal silicide.
  • a laminated structure of layers made of a material (for example, Ti / TiN / W) can be exemplified.
  • a first carrier blocking layer may be provided between the organic photoelectric conversion layer and the first electrode, or a second carrier blocking layer may be provided between the organic photoelectric conversion layer and the second electrode. Further, a first charge injection layer may be provided between the first carrier blocking layer and the first electrode, or a second charge injection layer may be provided between the second carrier blocking layer and the second electrode.
  • an alkali metal such as lithium (Li), sodium (Na), and potassium (K) and a fluoride or oxide thereof, or an alkaline earth such as magnesium (Mg) or calcium (Ca) are used. Metals and their fluorides and oxides can be mentioned.
  • Examples of the method for forming various organic layers include a dry film formation method and a wet film formation method.
  • dry film forming methods include vacuum evaporation using resistance heating or high-frequency heating, electron beam heating, flash evaporation, plasma evaporation, EB evaporation, and various sputtering methods (two-pole sputtering, DC sputtering, DC magnetron sputtering).
  • Sea method MBE method
  • Examples of the CVD method include a plasma CVD method, a thermal CVD method, an MOCVD method, and a photo CVD method.
  • specific examples of the wet method include spin coating; dipping; casting; microcontact printing; drop casting; screen printing, ink jet printing, offset printing, gravure printing, and flexographic printing.
  • Various printing methods Stamp method; Spray method; Air doctor coater method, blade coater method, rod coater method, knife coater method, squeeze coater method, reverse roll coater method, transfer roll coater method, gravure coater method, kiss coater method, cast coater
  • Various coating methods such as a spray coating method, a spray coater method, a slit orifice coater method, and a calendar coater method can be exemplified.
  • non-polar or low-polarity organic solvents such as toluene, chloroform, hexane, and ethanol can be exemplified as the solvent.
  • the patterning method include chemical etching such as shadow mask, laser transfer, and photolithography, and physical etching using ultraviolet light or laser.
  • a flattening technique for various organic layers a laser flattening method, a reflow method, or the like can be used.
  • the imaging element or the solid-state imaging device may be provided with an on-chip micro lens or a light-shielding layer as necessary, or provided with a driving circuit or wiring for driving the imaging element. . If necessary, a shutter for controlling the incidence of light on the imaging device may be provided, or an optical cut filter may be provided according to the purpose of the solid-state imaging device.
  • a solid-state imaging device is stacked with a readout integrated circuit (ROIC)
  • a drive substrate on which a connection portion made of a readout integrated circuit and copper (Cu) is formed, and an image pickup device on which a connection portion is formed are formed.
  • the connection portions By stacking the connection portions so that the connection portions are in contact with each other and joining the connection portions, the layers can be laminated, and the connection portions can be joined using solder bumps or the like.
  • the electric charge in the first electrode is discharged out of the system while simultaneously accumulating the electric charge in the photoelectric conversion layer.
  • the charges accumulated in the photoelectric conversion layer are simultaneously transferred to the first electrode, and after the transfer is completed, the charges transferred to the first electrode in each image sensor are sequentially read out.
  • a method for driving a solid-state imaging device that repeats each step can be provided.
  • each imaging device has a structure in which light incident from the second electrode side does not enter the first electrode, and all the imaging devices simultaneously perform photoelectric conversion. Since the electric charge in the first electrode is discharged out of the system while accumulating the electric charge in the conversion layer, it is possible to surely reset the first electrode in all the imaging elements at the same time. Then, in all the image sensors, the charges accumulated in the photoelectric conversion layer are simultaneously transferred to the first electrode, and after the transfer is completed, the charges transferred to the first electrode in each image sensor are sequentially read. Therefore, a so-called global shutter function can be easily realized.
  • Example 1 relates to an imaging device according to the present disclosure and a solid-state imaging device according to the second aspect of the present disclosure.
  • FIG. 1 schematically illustrates the arrangement of the charge storage electrode, the first separation electrode, the second separation electrode, and the first electrode in the solid-state imaging device according to the first embodiment.
  • FIG. 8 is a schematic partial cross-sectional view of the image sensor of the first embodiment and the stacked image sensor, and FIGS. 9 and 10 are equivalent circuit diagrams of the image sensor and the stacked image sensor of the first embodiment. .
  • FIG. 8 is a schematic partial cross-sectional view along the dashed-dotted line AA shown in FIG.
  • various imaging element components located below an interlayer insulating layer may be collectively denoted by reference numeral 91 for convenience in order to simplify the drawing.
  • a driving circuit (however, the value V ES-1 is constant) is added to one image sensor, and a driving circuit (however, the value V ES-1 to the value V ES- Changed to 1 ').
  • the imaging device (photoelectric conversion device) 11 includes: First electrode 21, A charge storage electrode 24 spaced apart from the first electrode 21; A separation electrode 30 that is disposed separately from the first electrode 21 and the charge storage electrode 24 and surrounds the charge storage electrode 24; A photoelectric conversion layer 23 formed in contact with the first electrode 21 and above the charge storage electrode 24 via the insulating layer 82; A second electrode 22 formed on the photoelectric conversion layer 23, With The separation electrode 30 includes a first separation electrode 31A, and a second separation electrode 31B that is arranged separately from the first separation electrode 31A. The first separation electrode 31A is located between the first electrode 21 and the second separation electrode 31B.
  • the solid-state imaging device includes a stacked-type imaging device including at least one imaging device 11 according to the first embodiment. Specifically, at least one lower image sensor 13, 15 is provided below the image sensor 11 of the first embodiment, and the wavelength of light received by the image sensor 11 and the lower image sensor 13, 15 are different. Unlike the wavelength of the light to be received, in this case, two lower imaging elements 13 and 15 are stacked.
  • the second electrode 22 located on the light incident side is shared by the plurality of imaging elements 11 except for an imaging element according to a third embodiment described later. That is, the second electrode 22 is a so-called solid electrode.
  • the photoelectric conversion layer 23 is shared by the plurality of imaging elements 11. That is, one photoelectric conversion layer 23 is formed in the plurality of imaging elements 11.
  • the stacked-type image sensor according to the first embodiment includes at least one image sensor 11 according to the first embodiment or an image sensor according to a third embodiment described below (specifically, the image sensor 11 according to the first embodiment in the first embodiment).
  • the imaging device includes one imaging element 11 according to a third embodiment described later).
  • the first separation electrode 31 ⁇ / b> A and the second separation electrode 31 ⁇ / b> B are provided in a region facing the region of the photoelectric conversion layer 23 located between the adjacent imaging elements 11 via the insulating layer 82. That is, the first separation electrode 31A and the second separation electrode 31B are a lower first separation electrode and a lower second separation electrode. Although the first separation electrode 31A and the second separation electrode 31B are formed at the same level as the first electrode 21 or the charge storage electrode 24, they may be formed at different levels.
  • a control unit provided on the semiconductor substrate and having a drive circuit is further provided.
  • the first electrode 21, the second electrode 22, the charge storage electrode 24, the first separation electrode 31A, and the second separation electrode 31B are It is connected to the drive circuit.
  • the wiring connected to the second separation electrode 31B is appropriately shared by a plurality of image sensors, and the second separation electrode 31B is simultaneously controlled by the plurality of image sensors.
  • the second separation electrode 31B may be appropriately shared by a plurality of image sensors, and the second separation electrode 31B may be simultaneously controlled by the plurality of image sensors.
  • the first separation electrodes 31A are separately controlled in the image sensor.
  • the first electrode 21 and a positive potential, the second electrode 22 and a negative potential, electrons generated by photoelectric conversion in the photoelectric conversion layer 23 is read out to the first floating diffusion layer FD 1.
  • the first electrode 21 and a negative potential, the second electrode 22 to a positive potential, in the form of holes generated on the basis of the photoelectric conversion in the photoelectric conversion layer 23 is read out to the first floating diffusion layer FD 1 Can be obtained by reversing the level of the potential described below.
  • the potential of the first separation electrode 31A is a constant value V ES-1
  • the potential of the second separation electrode 31B is also It is a constant value VES-2
  • the potential of the first separation electrode 31A changes from a constant value V ES-1 to a value V ES-1 ′
  • the potential of the second separation electrode 31B has a constant value V ES-2 .
  • the potential of the first separation electrode 31A is a constant value V ES-1
  • the potential of the first separation electrode 31A is the value V ES-1.
  • V ES-1 V ES-1
  • V ES-2 V ES-1
  • the image sensor 11 of the first embodiment includes: A control unit provided on the semiconductor substrate 70 and having a drive circuit; The first electrode 21 and the charge storage electrode 24 are connected to a drive circuit, In the charge accumulation period, a potential V 11 is applied to the first electrode 21 from the drive circuit, a potential V 31 is applied to the charge accumulation electrode 24, and charges are accumulated in the photoelectric conversion layer 23. In the charge transfer period, the drive circuit applies the potential V 12 to the first electrode 21, applies the potential V 32 to the charge storage electrode 24, and transfers the charge stored in the photoelectric conversion layer 23 through the first electrode 21. And read out to the control unit. However, since the potential of the first electrode 21 was higher than the potential of the second electrode 22, V 31 ⁇ V 11 and V 32 ⁇ V 12 It is.
  • the reading method is a reading method in the first mode.
  • the potential is indicated by the height in the vertical direction, and the lower the height, the higher the potential.
  • the drive circuit applies the potential V 11 to the first electrode 21, applies the potential V 31 to the charge storage electrode 24, and applies the potential V ES ⁇ to the first separation electrode 31 A. 1 is applied, and the potential V ES-2 is applied to the second separation electrode 31B. Further, a potential V 21 is applied to the second electrode 22.
  • charges (electrons, schematically indicated by black dots) are accumulated in the photoelectric conversion layer 23.
  • FIG. 2A or FIG. 5A schematically shows the charge accumulation state immediately before the end of the charge accumulation period. The electrons generated by the photoelectric conversion are attracted to the charge storage electrode 24 and stop in a region of the photoelectric conversion layer 23 facing the charge storage electrode 24.
  • FIGS. 2B, 3A, 3B, 4A, 4B, 5B, 5B, 6A, and 6B schematically show charge accumulation states immediately before the end of the charge transfer period.
  • the electrons are stopped in the region of the photoelectric conversion layer 23 opposed to the charge storage electrode 24, first electrode 21, furthermore, are read into the first floating diffusion layer FD 1.
  • the charges stored in the photoelectric conversion layer 23 are read out to the control unit.
  • the potential of the first separation electrode 31A is lower than the potential of the first electrode 21 but higher than the potential of the charge storage electrode 24, the electrons generated inside the photoelectric conversion layer 23 are transferred to the first electrode 21.
  • the flow does not move toward the second separation electrode 31B. That is, it is possible to suppress the charge generated by the photoelectric conversion from flowing into the adjacent imaging element 11.
  • V FD > V 12 V ES-1 > V 32 > V ES-2 , V 31 > V 32 To be satisfied.
  • V FD > V 12 > V ES-1 '> V 32 ( V 31 )> V ES-2 To be satisfied.
  • V FD> V 12 ( V 11)> V ES-1 '> V 32> V ES-2, V 31> V 32 To be satisfied.
  • V FD> V 12 ( V 11)> V ES-1 '> V 32> V ES-2, V 31> V 32 To be satisfied.
  • a series of operations such as charge accumulation, reset operation, and charge transfer of the second image sensor 13 and the third image sensor 15 are the same as a conventional series of operations such as charge accumulation, reset operation, and charge transfer.
  • First floating reset noise of the diffusion layer FD 1 as in the prior art, can be removed correlated double sampling (CDS, Correlated Double Sampling) by treatment.
  • the separation electrode includes the first separation electrode, and the second separation electrode that is arranged separately from the first separation electrode. Since the separation electrode is located between the first electrode and the second separation electrode, the movement of the electric charge between the adjacent image pickup devices during the operation of the image pickup device is ensured under the control of the first separation electrode and the second separation electrode. In addition, the charge accumulated in the photoelectric conversion layer can be smoothly transferred to the first electrode, and the saturation charge amount can be improved without decreasing the saturation charge amount. It is possible to achieve both the reduction of the transfer residual and the suppression of the occurrence of blooming, and there is no deterioration in the quality of the captured video (image).
  • FIG. 7A is an enlarged view of a part of each electrode for describing a positional relationship between the electrodes in the image sensor of the first embodiment.
  • FIG. 7B is an enlarged view of a part of each electrode for describing a positional relationship between the electrodes in the image sensor without the first separation electrode 31A.
  • the relationship of V 12 > V 32 > V ES-2 is satisfied in the charge transfer period. Therefore, as a result of the simulation, the change in the potential in the region (shown as “region A” in FIGS. 7A and 7B) sandwiched between the first electrode 21 and the charge storage electrode 24 changes from the charge storage electrode 24 to the region A. , And then increase from the region A toward the first electrode 21.
  • the imaging device is arranged to be separated from the first electrode, and is arranged to face the photoelectric conversion layer via the insulating layer. Since the charge storage electrode is provided, the photoelectric conversion unit is irradiated with light, and when photoelectric conversion is performed in the photoelectric conversion unit, a kind of capacitor is formed by the photoelectric conversion layer, the insulating layer, and the charge storage electrode, Electric charges can be stored in the photoelectric conversion layer. Therefore, at the start of the exposure, the charge storage portion is completely depleted, and the charge can be erased.
  • the first separation electrode 31A and the second separation electrode are provided in a region opposed to the region 23 ′ of the photoelectric conversion layer 23 located between the adjacent image pickup devices 11 via the insulating layer 82. 31B are formed.
  • the first separation electrode 31A and the second separation electrode 31B may be collectively referred to as a "separation electrode 30".
  • the separation electrode 30 is formed below the portion 82 ′ of the insulating layer 82 in a region sandwiched between the charge storage electrodes 24 and the charge storage electrodes 24 constituting each of the adjacent imaging elements.
  • the separation electrode 30 is provided separately from the charge storage electrode 24, and is also provided separately from the first electrode 21. Alternatively, in other words, the separation electrode 30 is provided separately from the charge storage electrode 24, and the separation electrode 30 is arranged to face the region 23 ′ of the photoelectric conversion layer via the insulating layer 82. ing.
  • FIG. 8 is a schematic partial cross-sectional view of an imaging device having the basic structure of the present disclosure
  • FIGS. 23, 26, 30, 33, 34, 37, 39, 40, 42, 43, 44, 45, 46, and 47 show the present disclosure shown in FIG. 5 is a schematic partial cross-sectional view of various modified examples of the image sensor having the basic structure described above, and illustration of separation electrodes and the like is omitted.
  • a semiconductor substrate (more specifically, a silicon semiconductor layer) 70 is further provided, and the photoelectric conversion unit is arranged above the semiconductor substrate 70. Further, a control unit provided on the semiconductor substrate 70 and having a drive circuit to which the first electrode 21 and the second electrode 22, the charge storage electrode 24, and the separation electrode 30 are connected is further provided.
  • the light incident surface of the semiconductor substrate 70 is defined as an upper side
  • the opposite side of the semiconductor substrate 70 is defined as a lower side.
  • a wiring layer 62 including a plurality of wirings is provided below the semiconductor substrate 70.
  • the semiconductor substrate 70, the control unit at least the floating diffusion layer FD 1 and the amplifying transistor TR1 # 038 constituting is provided a first electrode 21 is connected to the gate of the floating diffusion layer FD 1 and the amplifying transistor TR1 # 038 ing.
  • the semiconductor substrate 70 is further provided with a reset transistor TR1 rst and a selection transistor TR1 sel constituting a control unit.
  • Floating diffusion layer FD 1 is connected to one source / drain region of the reset transistor TR1 rst, the other source / drain region of the amplifying transistor TR1 # 038 is provided for one source / drain region of the select transistor TR1 sel is connected, the other source / drain region of the select transistor TR1 sel is connected to a signal line VSL 1.
  • the amplifying transistor TR1 amp , the reset transistor TR1 rst and the selection transistor TR1 sel form a drive circuit.
  • the floating diffusion layer FD 1 and the like to one of the image pickup device 11 shows a state provided in the second embodiment to be described later, the floating diffusion layer with respect to the four image pickup element 11 FD 1 etc. are shared.
  • the image sensor and the multilayer image sensor of the first embodiment are a back-illuminated image sensor and a multilayer image sensor, and include a green light having a first type green photoelectric conversion layer that absorbs green light.
  • a first type of green image pickup device (hereinafter, referred to as a “first image pickup device”) having high sensitivity to blue light and a second type of blue photoelectric conversion layer that absorbs blue light;
  • a second type of conventional blue light image sensor hereinafter, referred to as a “second image sensor” having a second type and a second type of red light sensitive layer having a second type red photoelectric conversion layer that absorbs red light.
  • third image sensor It has a structure in which three image sensors 11, 13, and 15 of a conventional type of red light image sensor (hereinafter, referred to as "third image sensor") are stacked.
  • the red light image sensor (third image sensor) 15 and the blue light image sensor (second image sensor) 13 are provided in the semiconductor substrate 70, and the second image sensor 13 is the third image sensor. It is located on the light incident side of the image sensor 15.
  • the green light image sensor (first image sensor) 11 is provided above the blue light image sensor (second image sensor) 13.
  • One pixel is configured by the laminated structure of the first imaging device 11, the second imaging device 13, and the third imaging device 15. No color filter is provided.
  • the first electrode 21 and the charge storage electrode 24 are formed on the interlayer insulating layer 81 at a distance. Further, the separation electrode 30 is formed on the interlayer insulating layer 81 so as to be separated from the charge storage electrode 24.
  • the interlayer insulating layer 81, the charge storage electrode 24, and the separation electrode 30 are covered with an insulating layer 82.
  • the photoelectric conversion layer 23 is formed on the insulating layer 82, and the second electrode 22 is formed on the photoelectric conversion layer 23.
  • a protective layer 83 is formed on the entire surface including the second electrode 22, and an on-chip micro lens 90 is provided on the protective layer 83.
  • the first electrode 21, the charge storage electrode 24, the separation electrode 30, and the second electrode 22 are composed of, for example, a transparent electrode made of ITO (work function: about 4.4 eV).
  • the photoelectric conversion layer 23 is formed of a layer containing at least a well-known organic photoelectric conversion material having sensitivity to green light (for example, an organic material such as a rhodamine dye, a melanocyanine dye, and quinacridone). Further, the photoelectric conversion layer 23 may be configured to further include a material layer suitable for charge storage. That is, a material layer suitable for charge storage may be formed between the photoelectric conversion layer 23 and the first electrode 21 (for example, in the connection portion 67).
  • the interlayer insulating layer 81, the insulating layer 82, and the protective layer 83 are made of a known insulating material (for example, SiO 2 or SiN).
  • the photoelectric conversion layer 23 and the first electrode 21 are connected by a connection portion 67 provided in the insulating layer 82. In the connection part 67, the photoelectric conversion layer 23 extends. That is, the photoelectric conversion layer 23 extends in the opening 84 provided in the insulating layer 82 and is connected to the first electrode 21.
  • the charge storage electrode 24 is connected to a drive circuit. Specifically, the charge storage electrode 24 is connected to a vertical drive circuit 112 constituting a drive circuit via a connection hole 66, a pad portion 64, and a wiring VOA provided in the interlayer insulating layer 81. .
  • the separation electrode 30 is also connected to the drive circuit. Specifically, separate electrodes 30, connection holes 34 provided in the interlayer insulating layer 81, through the pad portion 33 and the wiring V OB, and is connected to the vertical drive circuit 112 included in the driver circuit. More specifically, the separation electrode 30 is formed in a region (a region 82 ′ of an insulating layer) that faces the region 23 ′ of the photoelectric conversion layer 23 via the insulating layer 82. In other words, the separation electrode 30 is formed below the portion 82 ′ of the insulating layer 82 in a region sandwiched between the charge storage electrodes 24 and the charge storage electrodes 24 constituting each of the adjacent imaging elements. . The separation electrode 30 is provided separately from the charge storage electrode 24. Alternatively, in other words, the separation electrode 30 is provided separately from the charge storage electrode 24, and the separation electrode 30 is arranged to face the region 23 ′ of the photoelectric conversion layer 23 via the insulating layer 82. Have been.
  • the size of the charge storage electrode 24 is larger than the first electrode 21.
  • three photoelectric conversion units segments 20 1, 20 2, 20 3) of the size as large Satoshi was a planar shape the same.
  • An element isolation region 71 is formed on the first surface (front surface) 70A side of the semiconductor substrate 70, and an oxide film 72 is formed on the first surface 70A of the semiconductor substrate 70. Further, on the first surface side of the semiconductor substrate 70, a reset transistor TR1 rst , an amplification transistor TR1 amp, and a selection transistor TR1 sel constituting a control unit of the first imaging element 11 are provided, and further, the first floating diffusion is provided. layer FD 1 is provided.
  • the reset transistor TR1rst includes a gate unit 51, a channel forming region 51A, and source / drain regions 51B and 51C.
  • the gate portion 51 of the reset transistor TR1 rst is connected to the reset line RST 1, one of the source / drain regions 51C of the reset transistor TR1 rst also serves as the first floating diffusion layer FD 1, the other of the source / drain
  • the region 51B is connected to the power supply VDD .
  • the first electrode 21 includes a connection hole 65 provided in the interlayer insulating layer 81, a pad portion 63, a contact hole portion 61 formed in the semiconductor substrate 70 and the interlayer insulating layer 76, and a wiring layer formed in the interlayer insulating layer 76. It is connected to one source / drain region 51C (first floating diffusion layer FD 1 ) of the reset transistor TR1 rst via 62.
  • the amplification transistor TR1 amp includes a gate section 52, a channel forming area 52A, and source / drain areas 52B and 52C.
  • the gate section 52 is connected to the first electrode 21 and one of the source / drain regions 51C (the first floating diffusion layer FD 1 ) of the reset transistor TR1rst via the wiring layer 62.
  • One source / drain region 52B is connected to the power supply VDD .
  • the selection transistor TR1sel includes a gate unit 53, a channel forming region 53A, and source / drain regions 53B and 53C.
  • the gate portion 53 is connected to the select line SEL 1. Further, one source / drain region 53B shares a region with the other source / drain region 52C constituting the amplifying transistor TR1 amp , and the other source / drain region 53C is a signal line (data output line). VSL 1 (117).
  • the second imaging element 13 includes an n-type semiconductor region 41 provided on the semiconductor substrate 70 as a photoelectric conversion layer.
  • Transfer transistor TR2 trs gate portion 45 made of vertical transistor extends to the n-type semiconductor region 41, and is connected to the transfer gate line TG 2. Further, a region 45C of the semiconductor substrate 70 in the vicinity of the transfer transistor TR2 trs gate portion 45 of the second floating diffusion layer FD 2 is provided. n-type charge accumulated in the semiconductor region 41 is read out to the second floating diffusion layer FD 2 through the transfer channel to be formed along the gate portion 45.
  • a reset transistor TR2 rst an amplification transistor TR2 amp and a selection transistor TR2 sel constituting a control unit of the second imaging device 13 are further provided on the first surface side of the semiconductor substrate 70. Have been.
  • the reset transistor TR2rst includes a gate portion, a channel forming region, and source / drain regions.
  • the gate of the reset transistor TR2 rst is connected to the reset line RST 2, one source / drain region of the reset transistor TR2 rst is connected to the power supply V DD, the other source / drain region, the second floating diffusion layer Also serves as FD 2 .
  • the amplification transistor TR2 amp includes a gate portion, a channel formation region, and a source / drain region.
  • the gate portion is connected to the other source / drain region (second floating diffusion layer FD 2 ) of the reset transistor TR2rst .
  • One source / drain region is connected to the power supply VDD .
  • the selection transistor TR2sel includes a gate portion, a channel formation region, and source / drain regions.
  • the gate portion is connected to the select line SEL 2.
  • the third imaging element 15 includes an n-type semiconductor region 43 provided on the semiconductor substrate 70 as a photoelectric conversion layer.
  • the gate portion 46 of the transfer transistor TR3 trs is connected to the transfer gate line TG 3. Further, a region 46C of the semiconductor substrate 70 in the vicinity of the transfer transistor TR3 trs of the gate portion 46, third floating diffusion layer FD 3 is provided. n-type charge accumulated in the semiconductor region 43 is read out to the third floating diffusion layer FD 3 via the transfer channel 46A which is formed along the gate portion 46.
  • a reset transistor TR3 rst an amplification transistor TR3 amp, and a selection transistor TR3 sel constituting a control unit of the third imaging element 15 are further provided on the first surface side of the semiconductor substrate 70. Have been.
  • the reset transistor TR3rst includes a gate unit, a channel forming region, and source / drain regions.
  • the gate of the reset transistor TR3 rst is connected to the reset line RST 3
  • one of the source / drain regions of the reset transistor TR3 rst is connected to the power supply V DD, the other source / drain region, the third floating diffusion layer Also serves as FD 3 .
  • the amplification transistor TR3 amp includes a gate portion, a channel formation region, and source / drain regions.
  • the gate section is connected to the other source / drain region (third floating diffusion layer FD 3 ) of the reset transistor TR3rst .
  • One source / drain region is connected to the power supply VDD .
  • the selection transistor TR3sel includes a gate portion, a channel formation region, and source / drain regions.
  • the gate portion is connected to the select line SEL 3. Further, one source / drain region, the other source / drain region constituting the amplifying transistor TR3 # 038, shares a region, the other source / drain region, the signal lines (data output lines) in VSL 3 It is connected.
  • the reset lines RST 1 , RST 2 , RST 3 , the selection lines SEL 1 , SEL 2 , SEL 3 , and the transfer gate lines TG 2 , TG 3 are connected to a vertical drive circuit 112 which constitutes a drive circuit, and a signal line (data output Lines) VSL 1 , VSL 2 , VSL 3 are connected to a column signal processing circuit 113 constituting a drive circuit.
  • a p + layer 44 is provided between the n-type semiconductor region 43 and the surface 70A of the semiconductor substrate 70 to suppress dark current generation.
  • a p + layer 42 is formed between the n-type semiconductor region 41 and the n-type semiconductor region 43, and a part of the side surface of the n-type semiconductor region 43 is surrounded by the p + layer 42. .
  • the p + layer 73 is formed on the side of the back surface 70B of the semiconductor substrate 70, and the HfO 2 film 74 and the insulating film are formed in a portion where the contact hole 61 inside the semiconductor substrate 70 from the p + layer 73 is to be formed.
  • a film 75 is formed.
  • wiring is formed over a plurality of layers, but is not shown.
  • the HfO 2 film 74 is a film having a negative fixed charge, and by providing such a film, generation of dark current can be suppressed.
  • an aluminum oxide (Al 2 O 3 ) film, a zirconium oxide (ZrO 2 ) film, a tantalum oxide (Ta 2 O 5 ) film, a titanium oxide (TiO 2 ) film, and a lanthanum oxide (La 2 O 3 ) film praseodymium oxide (Pr 2 O 3 ) film, cerium oxide (CeO 2 ) film, neodymium oxide (Nd 2 O 3 ) film, promethium oxide (Pm 2 O 3 ) film, samarium oxide (Sm 2 O 3) ) Film, europium oxide (Eu 2 O 3 ) film, gadolinium oxide ((Gd 2 O 3 ) film, terbium oxide (Tb 2 O 3 ) film, dysprosium oxide (Dy 2 O 3
  • FIG. 11 is a conceptual diagram of the solid-state imaging device according to the first embodiment.
  • the solid-state imaging device 100 according to the first embodiment includes an imaging region 111 in which the stacked imaging elements 101 are arranged in a two-dimensional array, a vertical driving circuit 112 as a driving circuit (peripheral circuit), a column signal processing circuit 113, It comprises a horizontal drive circuit 114, an output circuit 115, a drive control circuit 116 and the like.
  • These circuits can be constituted by known circuits, or by using other circuit configurations (for example, various circuits used in conventional CCD solid-state imaging devices and CMOS solid-state imaging devices). It goes without saying that it can be configured. Note that in FIG. 11, the display of the reference number “101” on the stacked-type image sensor 101 is only one line.
  • the drive control circuit 116 generates a clock signal and a control signal serving as a reference for the operation of the vertical drive circuit 112, the column signal processing circuit 113, and the horizontal drive circuit 114 based on the vertical synchronization signal, the horizontal synchronization signal, and the master clock. . Then, the generated clock signal and control signal are input to the vertical drive circuit 112, the column signal processing circuit 113, and the horizontal drive circuit 114.
  • the vertical drive circuit 112 is formed of, for example, a shift register, and sequentially scans the stacked imaging elements 101 in the imaging region 111 sequentially in the vertical direction in units of rows. Then, a pixel signal (image signal) based on a current (signal) generated according to the amount of received light in each of the stacked imaging elements 101 is transmitted to the column signal processing circuit 113 via the signal line (data output line) 117 and VSL.
  • a pixel signal image signal
  • a current (signal) generated according to the amount of received light in each of the stacked imaging elements 101 is transmitted to the column signal processing circuit 113 via the signal line (data output line) 117 and VSL.
  • the column signal processing circuit 113 is disposed, for example, for each column of the stacked-type image sensor 101, and converts an image signal output from one layer of the stacked-type image sensor 101 into a black reference pixel (not shown) for each image sensor. , Formed around the effective pixel area) to perform signal processing for noise removal and signal amplification.
  • a horizontal selection switch (not shown) is provided so as to be connected between the column signal processing circuit 113 and the horizontal signal line 118.
  • the horizontal drive circuit 114 is constituted by, for example, a shift register, sequentially selects each of the column signal processing circuits 113 by sequentially outputting horizontal scanning pulses, and outputs a signal from each of the column signal processing circuits 113 to the horizontal signal line 118. Output.
  • the output circuit 115 performs signal processing on signals sequentially supplied from each of the column signal processing circuits 113 via the horizontal signal line 118, and outputs the processed signals.
  • Imaging element according to embodiment 1 an equivalent circuit diagram of a modification of the multilayer-type imaging element (Modification 1 of Embodiment 1) As shown in FIG. 12, the other source / drain region 51B of the reset transistor TR1 rst, Instead of connecting to the power supply V DD , it may be grounded.
  • the imaging device and the stacked imaging device of the first embodiment can be manufactured by, for example, the following method. That is, first, an SOI substrate is prepared. Then, a first silicon layer is formed on the surface of the SOI substrate based on the epitaxial growth method, and the p + layer 73 and the n-type semiconductor region 41 are formed on the first silicon layer. Next, a second silicon layer is formed on the first silicon layer by an epitaxial growth method, and the element isolation region 71, the oxide film 72, the p + layer 42, the n-type semiconductor region 43, and the p + layer 44 is formed.
  • the second silicon layer various transistors and the like constituting the control unit of the image sensor are formed, and further, the wiring layer 62, the interlayer insulating layer 76, and various wirings are formed thereon.
  • a substrate (not shown) is attached. After that, the SOI substrate is removed to expose the first silicon layer.
  • the surface of the second silicon layer corresponds to the front surface 70A of the semiconductor substrate 70, and the surface of the first silicon layer corresponds to the back surface 70B of the semiconductor substrate 70.
  • the first silicon layer and the second silicon layer are collectively referred to as a semiconductor substrate 70.
  • an opening for forming a contact hole 61 is formed on the back surface 70B side of the semiconductor substrate 70, an HfO 2 film 74, an insulating film 75, and a contact hole 61 are formed.
  • the connection part 67 is opened, and the photoelectric conversion layer 23, the second electrode 22, the protective layer 83, and the on-chip micro lens 90 are formed.
  • the imaging device and the stacked imaging device of the first embodiment can be obtained.
  • FIG. 13 shows a schematic partial cross-sectional view of a modified example (a modified example 2 of the first embodiment) of the image sensor of the first embodiment (two image sensors arranged side by side).
  • the layer may have a laminated structure of the lower semiconductor layer 23DN and the upper photoelectric conversion layer 23UP .
  • the upper photoelectric conversion layer 23 UP and the lower semiconductor layer 23DN are shared by a plurality of imaging devices. That is, in a plurality of imaging elements, one upper photoelectric conversion layer 23 UP and one lower semiconductor layer 23 DN are formed.
  • the efficiency of transferring charges accumulated in the photoelectric conversion layer 23 to the first electrode 21 can be increased.
  • the material constituting the upper photoelectric conversion layer 23 UP may be appropriately selected from various materials constituting the photoelectric conversion layer 23.
  • a band gap energy value is large (for example, a band gap energy value of 3.0 eV or more) and a mobility higher than the material constituting the photoelectric conversion layer is required. It is preferable to use a material having such a material. Specifically, for example, an oxide semiconductor material such as IGZO can be used.
  • the impurity concentration in the material forming the lower semiconductor layer is preferably 1 ⁇ 10 18 cm ⁇ 3 or less. Note that the configuration and structure of Modification 2 of Embodiment 1 can be applied to other embodiments.
  • Example 2 relates to the solid-state imaging device according to the first embodiment of the present disclosure.
  • 14 and 15 schematically show the arrangement of the charge storage electrode, the first separation electrode, the second separation electrode, the second separation electrode, and the first electrode in the solid-state imaging device according to the second embodiment.
  • the schematic partial cross-sectional views of the image sensor and the stacked image sensor according to the second embodiment are substantially the same as those in FIG. 8. Is substantially the same as FIG. 9 and FIG.
  • a driving circuit (however, a change from the value VES-1 to the value VES-1 ') is added to one image sensor block.
  • Each imaging element 11 First electrode 21, A charge storage electrode 24 spaced apart from the first electrode 21; A separation electrode 30 that is disposed separately from the first electrode 21 and the charge storage electrode 24 and surrounds the charge storage electrode 24; A photoelectric conversion layer 23 formed in contact with the first electrode 21 and above the charge storage electrode 24 via the insulating layer 82; A second electrode 22 formed on the photoelectric conversion layer 23, With The separation electrode 30 includes a first separation electrode 31A, a second separation electrode 31B, and a third separation electrode 32, The first separation electrode 31 ⁇ / b> A is disposed adjacent to and separated from the first electrode 21 in the image sensor block, between the image sensors arranged at least along the second direction. , The second separation electrode 31B is arranged between the image sensors in the image sensor block, The third separation electrode 32 is arranged between the image sensor blocks.
  • the third separation electrode 32 is shared by adjacent imaging element blocks.
  • the first separation electrode 31A is adjacent to and separated from the first electrode 21 between the image sensors arranged side by side in the second direction in the image sensor block
  • the second separation electrode 31B is arranged between the image sensors arranged side by side along the first direction, and between the image sensors arranged side by side along the second direction.
  • the first separation electrode 31A In this case, the second separation electrode 31B and the third separation electrode 32 are connected.
  • the first separation electrode 31A is adjacent to and separated from the first electrode 21 between the image sensors arranged side by side in the second direction in the image sensor block, Further, between the image sensors arranged side by side along the first direction, the image sensor is disposed adjacent to and separated from the first electrode 21;
  • the second separation electrode 31B is arranged between the image sensors arranged side by side in the second direction, apart from the first separation electrode 31A, and further arranged side by side in the first direction.
  • the first separation electrode 31 ⁇ / b> A is arranged between the image pickup devices thus separated from each other. In this case, the second separation electrode 31B and the third separation electrode 32 are connected.
  • the second separation electrode 31B and the third separation electrode 32 are appropriately shared by a plurality of imaging devices, and the second separation electrode 31B and the third separation electrode 32 are simultaneously controlled by the plurality of imaging devices.
  • the first separation electrodes 31A are separately controlled in the image sensor.
  • the first separation electrode 31A in the imaging device block may be simultaneously controlled in a plurality of imaging devices.
  • the potential of the first separation electrode 31A is a constant value V ES-1
  • the second separation electrode 31B and the third separation electrode 31B. 32 also has a constant value V ES-2 , or alternatively, the potential of the first separation electrode 31A changes from a constant value V ES-1 (specifically, to a value V ES-1 ′). Change), and the potentials of the second separation electrode 31B and the third separation electrode 32 have a constant value V ES-2 . Then,
  • the first separation electrode 31 ⁇ / b> A, the second separation electrode 31 ⁇ / b> B, and the third separation electrode 32 are provided in a region facing the region of the photoelectric conversion layer 23 located between the adjacent imaging elements 11 via the insulating layer 82. . That is, the first separation electrode 31A, the second separation electrode 31B, and the third separation electrode 32 are a lower first separation electrode, a lower second separation electrode, and a lower third separation electrode.
  • the first separation electrode 31A, the second separation electrode 31B, and the third separation electrode 32 are formed at the same level as the first electrode 21 or the charge storage electrode 24, but may be formed at different levels.
  • the first electrodes 21 are shared by the P ⁇ Q imaging elements forming the imaging element block.
  • Each imaging element block has a control unit, and the control unit includes at least a floating diffusion layer and an amplification transistor, and the shared first electrode 21 is connected to the control unit.
  • the P ⁇ Q image sensors provided for one floating diffusion layer may be composed of a plurality of first type image sensors, or at least one first type image sensor and 1 or 2 It may be composed of the above-described second type image pickup device.
  • the solid-state imaging device includes a stacked imaging device having at least one imaging device 11 described in the first embodiment.
  • at least one layer (specifically, two layers) of lower image sensor blocks is provided below the plurality of image sensor blocks.
  • the lower image sensor block is composed of a plurality of (specifically, P P along the first direction and Q P ⁇ Q along the second direction) image sensors, The wavelength of the light received by the image sensor constituting the image sensor block is different from the wavelength of the light received by the image sensor constituting the lower image sensor block.
  • a plurality of (specifically, P ⁇ Q) image sensors constituting the lower image sensor block have a shared floating diffusion layer. Then, under the control of the third separation electrode 32, the movement of the charge accumulated in the photoelectric conversion layer 23 between the imaging elements between adjacent imaging element blocks is prohibited.
  • the operation of the solid-state imaging device according to the second embodiment can be substantially the same as the operation of the solid-state imaging device according to the first embodiment.
  • the first mode reading method in which the charges accumulated in the image pickup elements are separately read out four times in a convenient manner, three image pickup elements are set in the charge accumulation state, and when the remaining one image pickup element is read out, the charges are read out.
  • the potential of various electrodes in the image sensor to be read is set to V 12 > V ES-1 > V 32 > V ES-2 or V 12 > V ES-1 ′> V 32 > V ES-2, and the image sensor from which no charge is read the potential of various electrodes V 12> V 32> V ES -1> V ES-2 or V 12> V 32> and V ES-1 '> V ES -2 at.
  • the potential of the charge storage electrode 24 in the image pickup element from which such charges are not read is indicated by a chain line.
  • the movement of the charge accumulated in the imaging element from which the charge is not read to the first electrode 21 is prohibited.
  • one of the remaining three image sensors is operated in the same manner to read out the charge. Such an operation may be performed four times in total.
  • the potentials of the various electrodes in the image pickup devices in the four charge accumulation states are simultaneously set to V. 12> V ES-1> V 32> V ES-2 or V 12> V ES-1 ' > V 32> and V ES-2. Thereby, the electric charges accumulated in the four imaging elements can be moved to the first electrode 21 at the same timing.
  • the first separation electrode is adjacent to the first electrode in the imaging device block, between the imaging devices arranged side by side along at least the second direction, and
  • the second separation electrode is disposed between the image pickup devices in the image pickup device block
  • the third separation electrode is disposed between the image pickup device blocks. Therefore, under the control of the first separation electrode, the second separation electrode, and the third separation electrode, the movement of charges between adjacent imaging elements can be reliably suppressed during the operation of the imaging element. Can be smoothly transferred to the first electrode, the saturation charge amount is not reduced, the charge transfer residue is reduced, and blooming is suppressed. It is possible to stand.
  • the third embodiment is a modification of the first and second embodiments.
  • the first separation electrode 31A and the second separation electrode 31B, or alternatively, the first separation electrode 31A, the second separation electrode 31B, and the third separation electrode 32 are formed on the photoelectric conversion layer 23 by the second electrode. 22 may be provided apart from it. That is, the separation electrode is an upper separation electrode.
  • FIG. 16A is a schematic partial cross-sectional view of the image sensor of Example 3 (two image sensors arranged side by side).
  • the imaging device of the third embodiment instead of forming the second electrode 22 on the region 23 ′ of the photoelectric conversion layer 23 located between the adjacent imaging device, the upper first separation electrode and the upper Two separation electrodes (these are collectively referred to as “separation electrodes 35”) are formed.
  • the separation electrode 35 is provided separately from the second electrode 22.
  • the second electrode 22 is provided for each image sensor, and the separation electrode 35 surrounds at least a part of the second electrode 22 and is separated from the second electrode 22 to form one of the photoelectric conversion layers 23. It is provided on the part.
  • the separation electrode 35 is formed at the same level as the second electrode 22.
  • the separation electrode 35 may have, for example, the same planar shape as the separation electrode 30.
  • the orthogonally projected image of the separation electrode 30 is spaced apart from the orthogonally projected image of the first electrode 21 and the charge storage electrode 24, and surrounds the orthogonally projected image of the charge storage electrode 24.
  • the orthographic image of 31A is located between the orthographic image of the first electrode 21 and the orthographic image of the second separation electrode 31B. In some cases, part of the orthogonally projected image of the second separation electrode 31B and part of the orthogonally projected image of the charge storage electrode 24 may overlap.
  • the orthogonally projected image of the first separation electrode 31A is adjacent to the orthogonally projected image of the first electrode 21 at least between the image sensors arranged side by side along the second direction in the image sensor block.
  • the second separation electrode 31B is disposed between the image pickup devices in the image pickup device block, and the third separation electrode 32 is provided between the image pickup device block and the image pickup device block. It is located between.
  • the second electrode 22 and the separation electrode 35 can be obtained by forming a material layer forming the second electrode 22 and the separation electrode 35 on the photoelectric conversion layer 23 and then patterning the material layer.
  • Each of the second electrode 22 and the separation electrode 35 is separately connected to a wiring (not shown), and these wirings are connected to a drive circuit.
  • the wiring connected to the second electrode 22 is shared by a plurality of imaging devices.
  • the wiring connected to the separation electrode 35 is appropriately shared by a plurality of image sensors.
  • An insulating film (not shown) is formed on the photoelectric conversion layer 23 including the second electrode 22 and the separation electrode 35, and the insulating film above the second electrode 22 is connected to the second electrode 22.
  • a contact hole (not shown) is formed, and a wiring V OU (not shown) connected to the contact hole is provided on the insulating film.
  • the operation of the solid-state imaging device according to the third embodiment can be substantially the same as the operation of the solid-state imaging device according to the first embodiment, and thus a detailed description is omitted.
  • the potential applied to the separation electrode 35 is set lower than the potential applied to the second electrode 22.
  • the separation electrode is formed on the region of the photoelectric conversion layer located between the adjacent image sensors, instead of the second electrode. Therefore, the charge generated by the photoelectric conversion can be prevented from flowing into the adjacent image pickup device by the separation electrode, so that the quality of the captured video (image) does not occur.
  • FIG. 16B is a schematic partial cross-sectional view of a modified example (Modified Example 1) of the image sensor of Example 3 (two image sensors arranged side by side).
  • the second electrode 22 is provided for each image sensor, and the separation electrode 35 surrounds at least a part of the second electrode 22 and is provided separately from the second electrode 22.
  • a part of the charge storage electrode 24 exists below the separation electrode 35, and a separation electrode (lower separation electrode) 30 is provided below the separation electrode (upper separation electrode) 35.
  • the region of the second electrode 22 facing the separation electrode 35 is located on the first electrode side.
  • the charge storage electrode 24 is surrounded by the separation electrode 35.
  • FIG. 17A a schematic partial cross-sectional view of the image sensor of Example 3 (two image sensors arranged side by side), the second electrode 22 is divided into a plurality, and each divided second electrode is divided. A different potential may be individually applied to 22. Further, as shown in FIG. 17B, a separation electrode 35 may be provided between the divided second electrodes 22.
  • the fourth embodiment is a modification of the first to third embodiments.
  • the imaging device and the stacked imaging device of the fourth embodiment whose schematic partial cross-sectional view is shown in FIG. 18 are a front-illuminated imaging device and a stacked imaging device, and a first type of green photoelectric device that absorbs green light.
  • a first type of image sensor for green light (first image sensor) of Example 1 having sensitivity to green light having a conversion layer and a blue light having a second type of blue photoelectric conversion layer absorbing blue light.
  • a second type of conventional blue light image sensor having sensitivity, a second type of conventional red light sensitive to red light including a second type red photoelectric conversion layer that absorbs red light
  • It has a structure in which three image sensors of a light image sensor (third image sensor) are stacked.
  • the image sensor for red light (third image sensor) and the image sensor for blue light (second image sensor) are provided in the semiconductor substrate 70, and the second image sensor is higher than the third image sensor.
  • the image sensor for green light is provided above the image sensor for blue light (second image sensor).
  • various transistors constituting the control unit are provided as in the first embodiment. These transistors can have substantially the same configuration and structure as the transistors described in Embodiment 1. Further, the semiconductor substrate 70 is provided with a second image sensor and a third image sensor, and these image sensors are substantially the same as the second image sensor and the third image sensor described in the first embodiment. Configuration and structure.
  • interlayer insulating layers 77 and 78 are formed on the surface 70A of the semiconductor substrate 70.
  • interlayer insulating layer 78 On the interlayer insulating layer 78, a photoelectric conversion unit (first electrode 21, photoelectric A conversion layer 23 and a second electrode 22), a charge storage electrode 24, and the like are provided.
  • the configurations and structures of the imaging device of Example 4 and the stacked imaging device are the same as those of the imaging devices of Embodiments 1 to 3 and the stacked imaging device. Since the same can be applied, detailed description is omitted.
  • the fifth embodiment is a modification of the first to fourth embodiments.
  • the imaging device and the stacked imaging device of the fifth embodiment whose schematic partial cross-sectional view is shown in FIG. 19 are a back-illuminated imaging device and a stacked imaging device, and the first imaging of the first type of the first embodiment. It has a structure in which two image sensors of a device and a second type of second image sensor are stacked.
  • a modified example of the imaging device and the stacked imaging device of the fifth embodiment whose schematic partial cross-sectional view is shown in FIG. 20 is a surface-illuminated imaging device and a stacked imaging device, and is a first type of the embodiment. It has a structure in which two image sensors of one first image sensor and a second type of second image sensor are stacked.
  • the first image sensor absorbs light of the primary color
  • the second image sensor absorbs light of the complementary color.
  • the first image sensor absorbs white light
  • the second image sensor absorbs infrared light.
  • a modified example of the imaging device of the fifth embodiment, whose schematic partial cross-sectional view is shown in FIG. 21, is a back-illuminated imaging device, and includes the first imaging device of the first embodiment of the first type.
  • a modified example of the imaging device of the fifth embodiment whose schematic partial cross-sectional view is shown in FIG. 22 is a front-illuminated imaging device, which is configured by the first imaging device of the first embodiment of the first type.
  • the first image sensor is composed of three types of image sensors: an image sensor that absorbs red light, an image sensor that absorbs green light, and an image sensor that absorbs blue light.
  • the solid-state imaging device is configured by a plurality of these imaging elements.
  • a Bayer array can be cited.
  • a color filter for performing blue, green, and red spectroscopy is provided on the light incident side of each image sensor as necessary.
  • two image pickup devices are stacked (that is, two photoelectric conversion units are stacked, and a control unit of the two image pickup devices is provided on the semiconductor substrate).
  • a configuration in which three control units for three image pickup devices are provided on a semiconductor substrate is also possible.
  • the following table shows an example of a stacked structure of the first type image sensor and the second type image sensor.
  • Embodiment 6 is a modification of Embodiments 1 to 5, and relates to an imaging device of the present disclosure including a transfer control electrode (charge transfer electrode).
  • FIG. 23 shows a schematic partial cross-sectional view of a part of the imaging device and the stacked imaging device of the sixth embodiment
  • FIGS. 24 and 25 show equivalent circuit diagrams of the imaging device and the stacked imaging device of the sixth embodiment. .
  • the first electrode 21 and the charge storage electrode 24 are spaced apart from each other, and It further includes a transfer control electrode (charge transfer electrode) 25 disposed to face the photoelectric conversion layer 23 with the insulating layer 82 interposed therebetween.
  • the drive circuit applies the potential V 11 to the first electrode 21, applies the potential V 31 to the charge storage electrode 24, and applies the potential V 41 to the transfer control electrode 25.
  • Light incident on the photoelectric conversion layer 23 causes photoelectric conversion in the photoelectric conversion layer 23.
  • the holes generated by the photoelectric conversion are sent from the second electrode 22 to the drive circuit via the wiring VOU .
  • V 31 > V 41 (for example, V 31 > V 11 > V 41 or V 11 > V 31 > V 41 ).
  • the electrons generated by the photoelectric conversion are attracted to the charge storage electrode 24 and stop in the region of the photoelectric conversion layer 23 facing the charge storage electrode 24. That is, charges are accumulated in the photoelectric conversion layer 23. Since V 31 > V 41 , electrons generated inside the photoelectric conversion layer 23 can be reliably prevented from moving toward the first electrode 21. As the photoelectric conversion time elapses, the potential in the region of the photoelectric conversion layer 23 facing the charge storage electrode 24 becomes a more negative value.
  • the drive circuit After completion of the reset operation, charge reading is performed. That is, in the charge transfer period, the drive circuit applies the potential V 12 to the first electrode 21, applies the potential V 32 to the charge storage electrode 24, and applies the potential V 42 to the transfer control electrode 25.
  • V 32 ⁇ V 42 ⁇ V 12 it is assumed that V 32 ⁇ V 42 ⁇ V 12 .
  • electrons are stopped in the region of the photoelectric conversion layer 23 opposed to the charge storage electrode 24, first electrode 21, furthermore, are reliably read out to the first floating diffusion layer FD 1. That is, the charges stored in the photoelectric conversion layer 23 are read out to the control unit.
  • the other source / drain region 51B of the reset transistor TR1rst may be grounded instead of being connected to the power supply VDD .
  • Embodiment 7 is a modification of Embodiments 1 to 6, and relates to an imaging device of the present disclosure including a plurality of charge storage electrode segments.
  • FIG. 26 is a schematic partial cross-sectional view of a part of the image sensor of the seventh embodiment
  • FIGS. 27 and 28 are equivalent circuit diagrams of the image sensor of the seventh embodiment and the stacked-type image sensor.
  • FIG. 29 shows a schematic layout of the first electrode and the charge storage electrode that constitute the imaging element.
  • the charge storage electrode 24 includes a plurality of charge storage electrode segments 24A, 24B, and 24C.
  • the number of charge storage electrode segments may be two or more, and is set to “3” in the seventh embodiment.
  • different potentials are applied to each of the N charge storage electrode segments, but the potential of the first electrode 21 is higher than the potential of the second electrode 22. Is high, that is, for example, a positive potential is applied to the first electrode 21 and a negative potential is applied to the second electrode 22, so that the charge transfer period is closest to the first electrode 21.
  • the potential applied to the charge storage electrode segment (first photoelectric conversion unit segment) 24A is the charge storage electrode segment (Nth photoelectric conversion unit segment) 24C located farthest from the first electrode 21. Higher than the potential applied to. In this manner, by applying the potential gradient to the charge storage electrode 24, the electrons that have stopped in the region of the photoelectric conversion layer 23 facing the charge storage electrode 24 become the first electrode 21 and the first floating electrode. more reliably read out to the diffusion layer FD 1. That is, the charges stored in the photoelectric conversion layer 23 are read out to the control unit.
  • the other source / drain region 51B of the reset transistor TR1rst may be grounded instead of being connected to the power supply VDD .
  • Eighth embodiment is a modification of the first to seventh embodiments, and relates to an imaging device having a first configuration and a sixth configuration.
  • FIG. 30 is a schematic partial cross-sectional view of the imaging device and the stacked imaging device according to the eighth embodiment, and schematically illustrates an enlarged part where the charge storage electrode, the photoelectric conversion layer, and the second electrode are stacked.
  • FIG. 31 shows a cross-sectional view.
  • the photoelectric conversion unit includes N (where N ⁇ 2) photoelectric conversion unit segments (specifically, three photoelectric conversion unit segments 20 1 , 20 2 , and 20 3 ).
  • the photoelectric conversion layer 23 is composed of N photoelectric conversion layer segments (specifically, three photoelectric conversion layer segments 23 1 , 23 2 , and 23 3 ).
  • the insulating layer 82 is composed of N insulating layer segments (specifically, three insulating layer segments 82 1 , 82 2 , and 82 3 ).
  • the charge storage electrode 24 includes N charge storage electrode segments (specifically, in each embodiment, three charge storage electrode segments 24 1 and 24 2).
  • the charge storage electrode 24 includes N charge storage electrode segments (specifically, three Charge storage electrode segments 24 1 , 24 2 , 24 3 )
  • the image sensor of the eighth embodiment or the image sensors of the ninth and twelfth embodiments described below A photoelectric conversion unit formed by laminating a first electrode 21, a photoelectric conversion layer 23, and a second electrode 22;
  • the photoelectric conversion unit further includes a charge storage electrode 24 that is disposed apart from the first electrode 21 and that faces the photoelectric conversion layer 23 with the insulating layer 82 interposed therebetween.
  • the charge storage electrode 24, the insulating layer 82, and the photoelectric conversion layer 23 is the Z direction, and the direction away from the first electrode 21 is the X direction, the charge storage electrode 24, the insulating layer 82, and the photoelectric
  • the cross-sectional area of the laminated portion obtained by cutting the laminated portion on which the conversion layer 23 is laminated changes depending on the distance from the first electrode 21.
  • the thickness of the insulating layer segments progressively changes I have. Specifically, the thickness of the insulating layer segment gradually increases.
  • the width of the cross section of the laminated portion is constant, and the thickness of the cross section of the laminated portion, specifically, the thickness of the insulating layer segment is the first electrode 21. It becomes progressively thicker depending on the distance from.
  • the thickness of the insulating layer segment is increased stepwise. The thickness of the insulating layer segment 82 n in the n-th photoelectric conversion unit segment 20 n was constant.
  • the thickness of the insulating layer segment 82 n in the n-th photoelectric conversion unit segment 20 n is “1”
  • the thickness of ( +1) may be, for example, 2 to 10, but is not limited to such a value.
  • the thickness of the insulating layer segments 82 1 , 82 2 , and 82 3 is gradually increased by gradually reducing the thickness of the charge storage electrode segments 24 1 , 24 2 , and 24 3. I have.
  • the thicknesses of the photoelectric conversion layer segments 23 1 , 23 2 , and 23 3 are constant.
  • the drive circuit applies the potential V 11 to the first electrode 21 and applies the potential V 31 to the charge storage electrode 24.
  • Light incident on the photoelectric conversion layer 23 causes photoelectric conversion in the photoelectric conversion layer 23.
  • the holes generated by the photoelectric conversion are sent from the second electrode 22 to the drive circuit via the wiring VOU .
  • V 31 ⁇ V 11 since the potential of the first electrode 21 is higher than the potential of the second electrode 22, that is, for example, when a positive potential is applied to the first electrode 21 and a negative potential is applied to the second electrode 22, Therefore, V 31 ⁇ V 11 , preferably, V 31 > V 11 .
  • the electrons generated by the photoelectric conversion are attracted to the charge storage electrode 24 and stop in the region of the photoelectric conversion layer 23 facing the charge storage electrode 24. That is, charges are accumulated in the photoelectric conversion layer 23. Since V 31 > V 11 , electrons generated inside the photoelectric conversion layer 23 do not move toward the first electrode 21. As the photoelectric conversion time elapses, the potential in the region of the photoelectric conversion layer 23 facing the charge storage electrode 24 becomes a more negative value.
  • the thickness of the insulating layer segment gradually, because it uses a thicker structure, the charge accumulation period, if a state such as V 31 ⁇ V 11, the n-th The photoelectric conversion unit segment 20 n can store more electric charge than the (n + 1) -th photoelectric conversion unit segment 20 (n + 1) , and a strong electric field is applied to the first photoelectric conversion unit segment 20 n. the flow of charge from the conversion unit segments 20 1 to the first electrode 21 can be reliably prevented.
  • charge reading is performed. That is, during the charge transfer period, the drive circuit applies the potential V 12 to the first electrode 21 and applies the potential V 32 to the charge storage electrode 24. Here, it is assumed that V 12 > V 32 . Thus, electrons are stopped in the region of the photoelectric conversion layer 23 opposed to the charge storage electrode 24, first electrode 21, furthermore, it is read into the first floating diffusion layer FD 1. That is, the charges stored in the photoelectric conversion layer 23 are read out to the control unit.
  • the image sensor and the stacked image sensor according to the eighth embodiment can be manufactured in substantially the same manner as the image sensor according to the first embodiment, and thus detailed description is omitted.
  • the entire surface, depositing a conductive material layer for forming the charge storage electrodes 24 2, and patterning the conductive material layer, to form the photoelectric conversion unit segments 20 1, 20 2 and the first electrode 21 should by leaving the conductive material layer in the region, it is possible to obtain some and a charge storage electrode 24 2 of the first electrode 21.
  • the other source / drain region 51B of the reset transistor TR1rst may be grounded instead of being connected to the power supply VDD .
  • the image sensor of the ninth embodiment relates to the image sensors of the second and sixth configurations of the present disclosure.
  • FIG. 32 a schematic partial cross-sectional view in which the portion where the charge storage electrode, the photoelectric conversion layer, and the second electrode are stacked is enlarged is shown in FIG. over from the photoelectric conversion unit segments 20 1 to the N-th photoelectric conversion unit segments 20 N, the thickness of the photoelectric conversion layer segments, progressively changing.
  • the width of the cross section of the laminated portion is constant, and the thickness of the cross section of the laminated portion, specifically, the thickness of the photoelectric conversion layer segment is determined by the first electrode.
  • the thickness gradually increases depending on the distance from 21. More specifically, the thickness of the photoelectric conversion layer segment gradually increases.
  • the thickness of the photoelectric conversion layer segment is increased stepwise.
  • the thickness of the photoelectric conversion layer segment 23 n in the n-th photoelectric conversion unit segment 20 n was constant. Assuming that the thickness of the photoelectric conversion layer segment 23 n in the n-th photoelectric conversion unit segment 20 n is “1”, the photoelectric conversion layer segment 23 in the (n + 1) -th photoelectric conversion unit segment 20 (n + 1)
  • the thickness of (n + 1) can be exemplified by 2 to 10, but is not limited to such a value.
  • Example 9 by gradually reducing the thickness of the charge storage electrode segments 24 1, 24 2, 24 3, the photoelectric conversion layer segments 23 1, 23 2, 23 3 of a thickness gradually thicker ing.
  • the thickness of the insulating layer segments 82 1 , 82 2 , and 82 3 is constant.
  • V 32 ⁇ becomes a state such V 12, 1st charge flow from the photoelectric conversion unit segments 20 1 to the first electrode 21, the (n + 1) th photoelectric conversion unit segments 20 ( The flow of electric charges from ( n + 1) to the n-th photoelectric conversion unit segment 20 n can be reliably ensured.
  • the thickness of the photoelectric conversion layer segment gradually changes from the first photoelectric conversion unit segment to the Nth photoelectric conversion unit segment. Therefore, or alternatively, the cross-sectional area of the laminated portion when the laminated portion in which the charge storage electrode, the insulating layer, and the photoelectric conversion layer are laminated on the YZ virtual plane changes depending on the distance from the first electrode. Therefore, a kind of charge transfer gradient is formed, and the charges generated by the photoelectric conversion can be more easily and reliably transferred.
  • an insulating layer 82 is conformally formed on the entire surface.
  • the photoelectric conversion layer 23 is formed on the insulating layer 82, and the photoelectric conversion layer 23 is subjected to a planarization process.
  • Example 10 relates to an image sensor having a third configuration.
  • FIG. 33 is a schematic partial cross-sectional view of the imaging device and the stacked imaging device of the tenth embodiment.
  • the material forming the insulating layer segment is different between the adjacent photoelectric conversion unit segments.
  • the value of the dielectric constant of the material constituting the insulating layer segments gradually are reduced.
  • the same potential may be applied to all of the N charge storage electrode segments, or different potentials may be applied to each of the N charge storage electrode segments. .
  • the charge storage electrode segments 24 1 , 24 2 , and 24 3 that are spaced apart from each other are connected via the pad portions 64 1 , 64 2 , and 64 3 . What is necessary is just to connect to the vertical drive circuit 112 which comprises a drive circuit.
  • Example 11 relates to an imaging device having a fourth configuration.
  • FIG. 34 is a schematic partial cross-sectional view of the imaging device of Example 11 and the stacked imaging device.
  • the material forming the charge storage electrode segment differs between the adjacent photoelectric conversion unit segments.
  • the value of the work function of the material constituting the insulating layer segments gradually, is larger.
  • the same potential may be applied to all of the N charge storage electrode segments, or different potentials may be applied to each of the N charge storage electrode segments. .
  • the charge storage electrode segments 24 1 , 24 2 , 24 3 are connected to the vertical drive circuit 112 constituting the drive circuit via the pad portions 64 1 , 64 2 , 64 3 .
  • the image sensor of the twelfth embodiment relates to the image sensor of the fifth configuration.
  • 35A, 35B, 36A, and 36B show schematic plan views of the charge storage electrode segment in the twelfth embodiment.
  • a schematic partial cross-sectional view of the imaging device and the stacked imaging device of Example 12 is the same as that shown in FIG. 34 or FIG.
  • the imaging element according to embodiment 12 over from the first photoelectric conversion unit segments 20 1 to the N-th photoelectric conversion unit segments 20 N, the area of the electrode segments for charge storage, gradually, it is smaller .
  • the same potential may be applied to all of the N charge storage electrode segments, or different potentials may be applied to each of the N charge storage electrode segments. .
  • the charge storage electrode segments 24 1 , 24 2 , and 24 3 that are spaced apart from each other are connected via the pad portions 64 1 , 64 2 , and 64 3 . Then, it may be connected to the vertical drive circuit 112 constituting the drive circuit.
  • the charge storage electrode 24 is composed of a plurality of the charge storage electrode segments 24 1, 24 2, 24 3.
  • the number of charge storage electrode segments may be two or more, and is set to “3” in Example 12.
  • the potential of the first electrode 21 is higher than the potential of the second electrode 22, that is, for example, a positive potential is applied to the first electrode 21. is, since a negative potential is applied to the second electrode 22, the charge transfer period, the potential applied to the charge storage electrode segments 24 1 located closest to the first electrode 21, first electrode 21 higher than the potential applied to the charge storage electrode segments 24 3 located at the furthest in.
  • the electrons that have stopped in the region of the photoelectric conversion layer 23 facing the charge storage electrode 24 become the first electrode 21 and the first floating electrode. more reliably read out to the diffusion layer FD 1. That is, the charges stored in the photoelectric conversion layer 23 are read out to the control unit.
  • the potential of the charge storage electrode segments 24 3, charge storage electrode segments 24 second potential with possible to gradually change the potential of the charge storage electrode segments 24 1 (i.e., stepped or by changing the slope shape)
  • moving electrons was stopped in the region of the charge storage electrode segments 24 3 opposite to the photoelectric conversion layer 23
  • the electrons are stopped in the region of the charge storage electrode segments 24 2 opposed to the photoelectric conversion layer 23
  • the other source / drain region 51B of the reset transistor TR3rst may be grounded instead of being connected to the power supply VDD .
  • Example 13 relates to the imaging device having the sixth configuration.
  • FIG. 37 shows a schematic partial cross-sectional view of the imaging device of Example 13 and the stacked imaging device.
  • 38A and 38B are schematic plan views of the charge storage electrode segment in the thirteenth embodiment.
  • the imaging device according to the thirteenth embodiment includes a photoelectric conversion unit in which a first electrode 21, a photoelectric conversion layer 23, and a second electrode 22 are stacked, and the photoelectric conversion unit is further separated from the first electrode 21.
  • the charge storage electrode 24 is disposed and disposed so as to face the photoelectric conversion layer 23 with the insulating layer 82 interposed therebetween.
  • the charge storage electrode 24 and the insulating layer 82, and the photoelectric conversion layer 23 are the Z direction, and the direction away from the first electrode 21 is the X direction, the charge storage electrode 24 and the insulating layer
  • the cross-sectional area of the layered portion obtained by cutting the layered portion where the and the photoelectric conversion layer 23 are stacked changes depending on the distance from the first electrode 21.
  • the thickness of the cross section of the stacked portion is constant, and the width of the cross section of the stacked portion becomes narrower as the distance from the first electrode 21 increases.
  • the width may be continuously reduced (see FIG. 38A) or may be reduced in a stepwise manner (see FIG. 38B).
  • the cross-sectional area of the stacked portion when the stacked portion where the charge storage electrode 24, the insulating layer 82, and the photoelectric conversion layer 23 are stacked is cut on the YZ virtual plane. , Changes depending on the distance from the first electrode, a kind of charge transfer gradient is formed, and the charge generated by photoelectric conversion can be more easily and reliably transferred.
  • the present disclosure has been described based on the preferred embodiments, the present disclosure is not limited to these embodiments.
  • the structures and configurations, manufacturing conditions, manufacturing methods, and materials used of the imaging device, the stacked imaging device, and the solid-state imaging device described in the embodiments are examples, and can be appropriately changed.
  • the imaging devices of the embodiments can be combined as appropriate.
  • the imaging device of the eighth embodiment, the imaging device of the ninth embodiment, the imaging device of the tenth embodiment, the imaging device of the eleventh embodiment, and the imaging device of the twelfth embodiment can be arbitrarily combined.
  • the image sensor of the ninth embodiment, the image sensor of the tenth embodiment, the image sensor of the eleventh embodiment, and the image sensor of the thirteenth embodiment can be arbitrarily combined.
  • one image sensor block is composed of 2 ⁇ 2 image sensors, but the number of one image sensor block is not limited to this.
  • the first direction may be a row direction or a column direction in an image sensor array of the solid-state imaging device.
  • the region 46C of the semiconductor substrate 70 near the gate portion 46 of TR3 trs can be shared by a plurality of image sensors.
  • the first electrode 21 extends inside the opening 84A provided in the insulating layer 82, and A configuration connected to the conversion layer 23 is also possible.
  • FIG. 40 illustrates, for example, a modified example of the imaging device and the stacked imaging device described in the first embodiment
  • FIG. 41A illustrates an enlarged schematic partial cross-sectional view of the first electrode portion and the like.
  • the edge of the top surface of the first electrode 21 is covered with the insulating layer 82, the first electrode 21 is exposed at the bottom surface of the opening 84B, and the insulating layer 82 is in contact with the top surface of the first electrode 21.
  • the side surface of the opening 84B is the first surface It has an inclination that spreads from 82p toward the second surface 82q. In this manner, by making the side surface of the opening 84B inclined, the movement of charges from the photoelectric conversion layer 23 to the first electrode 21 becomes smoother.
  • the side surface of the opening 84B is rotationally symmetric about the axis of the opening 84B. However, as shown in FIG. 41B, the side faces from the first surface 82p toward the second surface 82q.
  • the opening 84 ⁇ / b> C may be provided so that the side surface of the opening 84 ⁇ / b> C having a widening inclination is located on the charge storage electrode 24 side. This makes it difficult for the charges to move from the portion of the photoelectric conversion layer 23 opposite to the charge storage electrode 24 across the opening 84C.
  • the side surface of the opening 84B has an inclination that spreads from the first surface 82p toward the second surface 82q, and the edge of the side surface of the opening 84B in the second surface 82q is, as shown in FIG. 41A, It may be located outside the edge of the first electrode 21, or may be located inside the edge of the first electrode 21, as shown in FIG. 41C.
  • the openings 84B and 84C are formed by reflowing an etching mask made of a resist material formed when the openings are formed in the insulating layer based on the etching method, so that the opening side surfaces of the etching mask are inclined.
  • the insulating layer 82 can be formed by etching the insulating layer 82 using an etching mask.
  • FIG. 42 for example, as shown in a modified example of the imaging device and the stacked imaging device described in the first embodiment, light enters from the second electrode 22 side, and the light incident side from the second electrode 22. May have a configuration in which a light shielding layer 92 is formed. Note that various wirings provided on the light incident side of the photoelectric conversion layer can also function as a light shielding layer.
  • the light shielding layer 92 is formed above the second electrode 22, that is, on the light incident side of the second electrode 22 and above the first electrode 21.
  • the light-shielding layer 92 may be provided on the light incident side surface of the second electrode 22.
  • a light-shielding layer 92 may be formed on the second electrode 22, as shown in FIG.
  • a structure in which light is incident from the second electrode 22 side and light is not incident on the first electrode 21 may be employed.
  • a light shielding layer 92 is formed on the light incident side of the second electrode 22 and above the first electrode 21.
  • an on-chip micro lens 90 is provided above the charge storage electrode 24 and the second electrode 22, and light incident on the on-chip micro lens 90 is: It is also possible to adopt a structure in which light is focused on the charge storage electrode 24 and does not reach the first electrode 21.
  • the transfer control electrode 25 when the transfer control electrode 25 is provided, light can be prevented from being incident on the first electrode 21 and the transfer control electrode 25. Specifically, As shown in FIG.
  • a structure in which a light shielding layer 92 is formed above the first electrode 21 and the transfer control electrode 25 may be employed.
  • the light incident on the on-chip micro lens 90 may be configured not to reach the first electrode 21 or the first electrode 21 and the transfer control electrode 25.
  • the portion of the photoelectric conversion layer 23 located above the first electrode 21 does not contribute to photoelectric conversion. All pixels can be reset more reliably at the same time, and the global shutter function can be more easily realized.
  • the electric charge in the first electrode 21 is discharged out of the system while simultaneously accumulating the electric charge in the photoelectric conversion layer 23, and thereafter, In all the imaging devices, the charges accumulated in the photoelectric conversion layer 23 are simultaneously transferred to the first electrode 21, and after the transfer is completed, the charges transferred to the first electrode 21 in each imaging device are sequentially read out. Repeat each step.
  • each imaging device has a structure in which light incident from the second electrode side does not enter the first electrode, and all the imaging devices simultaneously perform photoelectric conversion. Since the electric charge in the first electrode is discharged out of the system while accumulating the electric charge in the conversion layer, it is possible to surely reset the first electrode in all the imaging elements at the same time. Then, in all the image sensors, the charges accumulated in the photoelectric conversion layer are simultaneously transferred to the first electrode, and after the transfer is completed, the charges transferred to the first electrode in each image sensor are sequentially read. Therefore, a so-called global shutter function can be easily realized.
  • a plurality of transfer control electrodes may be provided from the position closest to the first electrode 21 toward the charge storage electrode 24.
  • FIG. 47 shows an example in which two transfer control electrodes 25A and 25B are provided.
  • An on-chip micro lens 90 is provided above the charge storage electrode 24 and the second electrode 22. Light incident on the on-chip micro lens 90 is focused on the charge storage electrode 24. , The first electrode 21 and the transfer control electrodes 25A, 25B may not be reached.
  • Example 8 shown in FIGS. 30 and 31 the thickness of the charge storage electrode segments 24 1 , 24 2 , and 24 3 is gradually reduced, so that the insulating layer segments 82 1 , 82 2 , and 82 3 are formed. Is gradually increased in thickness.
  • FIG. 48 a schematic partial cross-sectional view in which a portion where the charge storage electrode, the photoelectric conversion layer, and the second electrode are stacked in the modification of the eighth embodiment is enlarged. 1, 24 2, and 24 3 of the constant thickness, the insulating layer segments 82 1, 82 2, 82 3 of the thickness may be gradually thicker. Note that the thickness of the photoelectric conversion layer segments 23 1 , 23 2 , and 23 3 is constant.
  • Example 9 shown in FIG. 32 the charge storage electrode segments 24 1, 24 2, by gradually thinning of 24 3 thickness, the photoelectric conversion layer segments 23 1, 23 2, 23 3 Is gradually increased in thickness.
  • FIG. 49 a schematic partial cross-sectional view in which a portion where the charge storage electrode, the photoelectric conversion layer, and the second electrode are stacked in the modification of the ninth embodiment is enlarged.
  • the thickness of the photoelectric conversion layer segments 23 1 , 23 2 , and 23 3 is kept constant by keeping the thicknesses of 1 , 2 2 , and 2 3 constant, and gradually reducing the thicknesses of the insulating layer segments 82 1 , 82 2 , and 82 3. May be gradually increased.
  • the second separation electrode 31B is appropriately shared by a plurality of imaging devices, and the second separation electrode 31B is simultaneously controlled by the plurality of imaging devices. Is also good.
  • FIG. 50 schematically illustrates the arrangement of the charge storage electrode, the first separation electrode, the second separation electrode, and the first electrode in such a modification of the solid-state imaging device according to the first embodiment.
  • FIGS. 51A and 51B schematically show the arrangement of the charge storage electrode, the first separation electrode, the second separation electrode, and the first electrode in a further modified example of the imaging device described in the first embodiment.
  • the planar shape of the charge storage electrode 24 is a rectangle having four corners, and the corner facing the first electrode 21 is notched.
  • a portion of the first separation electrode 31A facing the first electrode 21 extends to a cutout portion of the charge storage electrode 24.
  • the first separation electrode 31A is located between the notch of the first electrode 21 and the charge storage electrode 24.
  • FIG. 52 schematically illustrates the arrangement of the charge storage electrode, the first separation electrode, the second separation electrode, the third separation electrode, and the first electrode in a further modified example of the imaging device described in the second embodiment.
  • the planar shape of the charge storage electrode 24 is a rectangle having four corners, and the corner facing the first electrode 21 is notched.
  • the first separation electrode 31A is located between the first electrode 21 and the cutout portion of the charge storage electrode 24. Further, the first separation electrodes 31A constituting each image sensor are connected. With such a structure, the potential between the charge storage electrode 24 and the first electrode 21 can be controlled with higher accuracy. Note that these modifications can be applied to other embodiments.
  • FIG. 53 shows still another modification of the solid-state imaging device described in the second embodiment.
  • one common first electrode 21 is provided corresponding to the four charge storage electrodes 24, and the insulation in a region surrounded by the four charge storage electrodes 24 is provided.
  • the separation electrode 30 (the first separation electrode 31A, the second separation electrode 31B, and the third separation electrode 32) is formed below the layer 82, and is further surrounded by the four charge storage electrodes 24.
  • the charge discharging electrode 26 is formed below the portion of the insulating layer 82 in the region.
  • the charge discharging electrode 26 and the photoelectric conversion layer 23 are connected via an opening provided in the insulating layer 82.
  • the photoelectric conversion layer 23 extends in the opening provided in the insulating layer 82, and the extending portion of the photoelectric conversion layer 23 is 26.
  • Such a charge discharging electrode 26 can be applied to other embodiments.
  • FIG. 54 is a schematic plan view of a first electrode and a charge storage electrode in still another modification of the solid-state imaging device according to the second embodiment.
  • an imaging element block is configured by two imaging elements.
  • One on-chip micro lens 90 is provided above the image sensor block.
  • a first separation electrode 31A and a second separation electrode 31B are provided between two image pickup devices constituting the image pickup device block, and a third separation electrode 32 is provided between the image pickup device blocks. ing.
  • charge storage electrodes 24 11 of the image sensor block, 24 21, 24 31, the photoelectric conversion layer corresponding to 24 41 of the drawings has a high sensitivity to incident light from upper right.
  • charge storage electrodes 24 12 of the image pickup element block, 24 22, 24 32, the photoelectric conversion layer corresponding to 24 42 of the drawings has a high sensitivity to incident light from the upper left.
  • FIG. 55A shows a read driving example in the image sensor block of the second embodiment shown in FIG. 54.
  • Step-A Auto zero signal input to comparator
  • Step-B Reset operation of one shared floating diffusion layer
  • Step-C Transfer of charge to the P phase readout and the first electrode 21 2 in the imaging element corresponding to the charge storage electrode 24 21
  • Step -D Transfer of charge to the D phase readout and the first electrode 21 2 in the imaging element corresponding to the charge storage electrode 24 21
  • Step -E Reset operation of one shared floating diffusion layer
  • Step-F Auto zero signal input to comparator
  • Step-G Transfer of charge to the P phase readout and the first electrode 21 2 in the imaging element corresponding to the charge storage electrode 24 22
  • Step -H The flow of transfer of charge to the D phase readout and the first electrode 21 2 in the imaging element corresponding to the charge storage electrode 24 22, two image pickup elements corresponding to the charge storage electrode 24 21 and the charge storage electrode 24 22 Read the signal from.
  • the difference between the D-phase readout in step -H] and P phase readout at step -G] is a signal from the image pickup elements corresponding to the charge storage electrode 24 22.
  • [Step-E] may be omitted (see FIG. 55B).
  • the operation of [Step-F] may be omitted.
  • [Step-G] can be further omitted (see FIG. 55C).
  • the difference between the D-phase readout in step -D] is a signal from the image sensor corresponding to the charge storage electrode 24 21, and the D-phase readout in step -H] and D-phase readout at step -D] difference, a signal from the image sensor corresponding to the charge storage electrode 24 22.
  • the operation of the image sensor block including the two image sensors illustrated in FIG. 54 is not limited to the above operation, and the image sensor block including the four image sensors described in the second embodiment is described. The same operation can be performed.
  • each semiconductor region may be constituted by a semiconductor region of the opposite conductivity type, and the conductivity type of the photoelectric conversion layer formed on the semiconductor substrate may be p-type.
  • the present invention is not limited to application to a solid-state imaging device, but can also be applied to a CCD solid-state imaging device.
  • the signal charges are transferred in a vertical direction by a vertical transfer register of a CCD type structure, transferred in a horizontal direction by a horizontal transfer register, and amplified to output a pixel signal (image signal).
  • the present invention is not limited to a column-type solid-state imaging device in which pixels are formed in a two-dimensional matrix and a column signal processing circuit is arranged for each pixel column. Further, in some cases, the selection transistor can be omitted.
  • the imaging device of the present disclosure and the stacked imaging device are not limited to application to a solid-state imaging device that detects the distribution of the amount of incident visible light and captures an image as an image, and includes infrared, X-ray, or particles.
  • the present invention is also applicable to a solid-state imaging device that captures the distribution of the incident amount as an image.
  • the present invention can be applied to all solid-state imaging devices (physical quantity distribution detecting devices) such as a fingerprint detection sensor that detects a distribution of other physical quantities such as pressure and capacitance to capture an image.
  • the present invention is not limited to a solid-state imaging device that sequentially scans each unit pixel of the imaging region in a row unit and reads out a pixel signal from each unit pixel.
  • the present invention is also applicable to an XY address type solid-state imaging device that selects an arbitrary pixel in pixel units and reads out pixel signals from the selected pixel in pixel units.
  • the solid-state imaging device may be formed as a single chip, or may be formed as a module having an imaging function in which an imaging region and a driving circuit or an optical system are packaged together.
  • the present invention is not limited to application to a solid-state imaging device, but is also applicable to an imaging device.
  • the imaging device refers to a camera system such as a digital still camera or a video camera, or an electronic device having an imaging function such as a mobile phone.
  • the imaging device may be a module mounted on an electronic device, that is, a camera module.
  • FIG. 56 is a conceptual diagram illustrating an example in which the solid-state imaging device 201 including the imaging device according to the present disclosure and the stacked imaging device is used in an electronic apparatus (camera) 200.
  • the electronic device 200 includes a solid-state imaging device 201, an optical lens 210, a shutter device 211, a drive circuit 212, and a signal processing circuit 213.
  • the optical lens 210 forms image light (incident light) from a subject on the imaging surface of the solid-state imaging device 201.
  • signal charges are accumulated in the solid-state imaging device 201 for a certain period.
  • the shutter device 211 controls a light irradiation period and a light blocking period to the solid-state imaging device 201.
  • the drive circuit 212 supplies a drive signal for controlling a transfer operation and the like of the solid-state imaging device 201 and a shutter operation of the shutter device 211.
  • the signal transfer of the solid-state imaging device 201 is performed by a drive signal (timing signal) supplied from the drive circuit 212.
  • the signal processing circuit 213 performs various kinds of signal processing.
  • the video signal on which the signal processing has been performed is stored in a storage medium such as a memory or output to a monitor.
  • the electronic device 200 to which the solid-state imaging device 201 can be applied is not limited to a camera, but can be applied to an imaging device such as a camera module for mobile devices such as a digital still camera and a mobile phone.
  • the technology according to the present disclosure can be applied to various products.
  • the technology according to the present disclosure is realized as a device mounted on any type of moving object such as an automobile, an electric vehicle, a hybrid electric vehicle, a motorcycle, a bicycle, a personal mobility, an airplane, a drone, a ship, and a robot. You may.
  • FIG. 58 is a block diagram illustrating a schematic configuration example of a vehicle control system that is an example of a moving object control system to which the technology according to the present disclosure can be applied.
  • Vehicle control system 12000 includes a plurality of electronic control units connected via communication network 12001.
  • the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an outside information detection unit 12030, an inside information detection unit 12040, and an integrated control unit 12050.
  • a microcomputer 12051, an audio / video output unit 12052, and a vehicle-mounted network I / F (interface) 12053 are illustrated.
  • the drive system control unit 12010 controls the operation of the device related to the drive system of the vehicle according to various programs.
  • the drive system control unit 12010 includes a drive force generation device for generating a drive force of the vehicle such as an internal combustion engine or a drive motor, a drive force transmission mechanism for transmitting the drive force to wheels, and a steering angle of the vehicle. It functions as a control device such as a steering mechanism for adjusting and a braking device for generating a braking force of the vehicle.
  • the body control unit 12020 controls the operation of various devices mounted on the vehicle body according to various programs.
  • the body control unit 12020 functions as a keyless entry system, a smart key system, a power window device, or a control device for various lamps such as a head lamp, a back lamp, a brake lamp, a blinker, a fog lamp, and the like.
  • a radio wave or various switch signals transmitted from a portable device that substitutes for a key may be input to the body control unit 12020.
  • the body control unit 12020 receives the input of these radio waves or signals, and controls a door lock device, a power window device, a lamp, and the like of the vehicle.
  • Out-of-vehicle information detection unit 12030 detects information external to the vehicle on which vehicle control system 12000 is mounted.
  • an imaging unit 12031 is connected to the outside-of-vehicle information detection unit 12030.
  • the out-of-vehicle information detection unit 12030 causes the image capturing unit 12031 to capture an image outside the vehicle, and receives the captured image.
  • the outside-of-vehicle information detection unit 12030 may perform an object detection process or a distance detection process of a person, a vehicle, an obstacle, a sign, a character on a road surface, or the like based on the received image.
  • the imaging unit 12031 is an optical sensor that receives light and outputs an electric signal according to the amount of received light.
  • the imaging unit 12031 can output the electric signal as an image or can output the electric signal as distance measurement information.
  • the light received by the imaging unit 12031 may be visible light or non-visible light such as infrared light.
  • the in-vehicle information detection unit 12040 detects information in the vehicle.
  • the in-vehicle information detection unit 12040 is connected to, for example, a driver status detection unit 12041 that detects the status of the driver.
  • the driver state detection unit 12041 includes, for example, a camera that captures an image of the driver, and the in-vehicle information detection unit 12040 determines the degree of fatigue or concentration of the driver based on the detection information input from the driver state detection unit 12041. The calculation may be performed, or it may be determined whether the driver has fallen asleep.
  • the microcomputer 12051 calculates a control target value of the driving force generation device, the steering mechanism, or the braking device based on the information on the inside and outside of the vehicle acquired by the outside information detection unit 12030 or the inside information detection unit 12040, and the drive system control unit.
  • a control command can be output to 12010.
  • the microcomputer 12051 implements the functions of ADAS (Advanced Driver Assistance System) including vehicle collision avoidance or impact mitigation, following running based on the following distance, vehicle speed maintaining running, vehicle collision warning, vehicle lane departure warning, and the like.
  • ADAS Advanced Driver Assistance System
  • the cooperative control for the purpose can be performed.
  • the microcomputer 12051 controls the driving force generation device, the steering mechanism, the braking device, and the like based on information on the surroundings of the vehicle acquired by the outside-of-vehicle information detection unit 12030 or the inside-of-vehicle information detection unit 12040, so that the driver It is possible to perform cooperative control for automatic driving or the like in which the vehicle travels autonomously without relying on the operation.
  • the microcomputer 12051 can output a control command to the body system control unit 12020 based on information on the outside of the vehicle acquired by the outside information detection unit 12030.
  • the microcomputer 12051 controls the headlamp in accordance with the position of the preceding vehicle or the oncoming vehicle detected by the outside-of-vehicle information detection unit 12030, and performs cooperative control for the purpose of anti-glare such as switching a high beam to a low beam. It can be carried out.
  • the audio image output unit 12052 transmits at least one of an audio signal and an image signal to an output device capable of visually or audibly notifying a passenger of the vehicle or the outside of the vehicle of information.
  • an audio speaker 12061, a display unit 12062, and an instrument panel 12063 are illustrated as output devices.
  • the display unit 12062 may include, for example, at least one of an on-board display and a head-up display.
  • FIG. 59 is a diagram illustrating an example of an installation position of the imaging unit 12031.
  • the vehicle 12100 includes imaging units 12101, 12102, 12103, 12104, and 12105 as the imaging unit 12031.
  • the imaging units 12101, 12102, 12103, 12104, and 12105 are provided, for example, at positions such as a front nose, a side mirror, a rear bumper, a back door, and an upper portion of a windshield in the vehicle interior of the vehicle 12100.
  • An imaging unit 12101 provided in the front nose and an imaging unit 12105 provided above a windshield in the vehicle cabin mainly acquire an image in front of the vehicle 12100.
  • the imaging units 12102 and 12103 provided in the side mirror mainly acquire images of the side of the vehicle 12100.
  • the imaging unit 12104 provided in the rear bumper or the back door mainly acquires an image behind the vehicle 12100.
  • the forward images acquired by the imaging units 12101 and 12105 are mainly used for detecting a preceding vehicle, a pedestrian, an obstacle, a traffic light, a traffic sign, a lane, and the like.
  • FIG. 59 shows an example of the photographing range of the imaging units 12101 to 12104.
  • the imaging range 12111 indicates the imaging range of the imaging unit 12101 provided on the front nose
  • the imaging ranges 12112 and 12113 indicate the imaging ranges of the imaging units 12102 and 12103 provided on the side mirrors, respectively
  • the imaging range 12114 indicates 14 shows an imaging range of an imaging unit 12104 provided in a rear bumper or a back door.
  • a bird's-eye view image of the vehicle 12100 viewed from above can be obtained.
  • At least one of the imaging units 12101 to 12104 may have a function of acquiring distance information.
  • at least one of the imaging units 12101 to 12104 may be a stereo camera including a plurality of imaging elements or an imaging element having pixels for detecting a phase difference.
  • the microcomputer 12051 calculates the distance to each three-dimensional object in the imaging ranges 12111 to 12114 and the temporal change of this distance (relative speed with respect to the vehicle 12100). , It is possible to extract, as a preceding vehicle, a three-dimensional object that travels at a predetermined speed (for example, 0 km / h or more) in a direction substantially the same as the vehicle 12100, which is the closest three-dimensional object on the traveling path of the vehicle 12100. it can.
  • a predetermined speed for example, 0 km / h or more
  • microcomputer 12051 can set an inter-vehicle distance to be secured before the preceding vehicle, and perform automatic brake control (including follow-up stop control), automatic acceleration control (including follow-up start control), and the like. As described above, it is possible to perform cooperative control for automatic driving or the like in which the vehicle travels autonomously without depending on the operation of the driver.
  • the microcomputer 12051 converts the three-dimensional object data relating to the three-dimensional object into other three-dimensional objects such as a two-wheeled vehicle, a normal vehicle, a large vehicle, a pedestrian, and a utility pole based on the distance information obtained from the imaging units 12101 to 12104. It can be classified and extracted and used for automatic avoidance of obstacles. For example, the microcomputer 12051 distinguishes obstacles around the vehicle 12100 into obstacles that are visible to the driver of the vehicle 12100 and obstacles that are difficult to see.
  • the microcomputer 12051 determines a collision risk indicating a risk of collision with each obstacle, and when the collision risk is equal to or higher than the set value and there is a possibility of collision, the microcomputer 12051 transmits the signal via the audio speaker 12061 or the display unit 12062.
  • driving assistance for collision avoidance can be performed.
  • At least one of the imaging units 12101 to 12104 may be an infrared camera that detects infrared light.
  • the microcomputer 12051 can recognize a pedestrian by determining whether or not a pedestrian exists in the captured images of the imaging units 12101 to 12104. The recognition of such a pedestrian is performed by, for example, extracting a feature point in an image captured by the imaging unit 12101 to 12104 as an infrared camera, and performing a pattern matching process on a series of feature points indicating the outline of the object to determine whether the object is a pedestrian.
  • the audio image output unit 12052 outputs a rectangular contour for emphasis to the recognized pedestrian.
  • the display unit 12062 is controlled so that is superimposed. Further, the sound image output unit 12052 may control the display unit 12062 so as to display an icon or the like indicating a pedestrian at a desired position.
  • the technology according to the present disclosure may be applied to an endoscopic surgery system.
  • FIG. 60 is a diagram illustrating an example of a schematic configuration of an endoscopic surgery system to which the technology (the present technology) according to the present disclosure may be applied.
  • FIG. 60 shows a state in which an operator (doctor) 11131 is performing an operation on a patient 11132 on a patient bed 11133 using the endoscopic surgery system 11000.
  • the endoscopic surgery system 11000 includes an endoscope 11100, other surgical tools 11110 such as an insufflation tube 11111 and an energy treatment tool 11112, and a support arm device 11120 that supports the endoscope 11100.
  • a cart 11200 on which various devices for endoscopic surgery are mounted.
  • the endoscope 11100 includes a lens barrel 11101 having a region of a predetermined length from the distal end inserted into the body cavity of the patient 11132, and a camera head 11102 connected to the proximal end of the lens barrel 11101.
  • the endoscope 11100 which is configured as a so-called rigid endoscope having a hard barrel 11101 is illustrated.
  • the endoscope 11100 may be configured as a so-called flexible endoscope having a soft barrel. Good.
  • An opening in which the objective lens is fitted is provided at the tip of the lens barrel 11101.
  • a light source device 11203 is connected to the endoscope 11100, and light generated by the light source device 11203 is guided to a distal end of the lens barrel by a light guide extending inside the lens barrel 11101, and an objective is provided. The light is radiated toward the observation target in the body cavity of the patient 11132 via the lens.
  • the endoscope 11100 may be a direct view, a perspective view, or a side view.
  • An optical system and an image sensor are provided inside the camera head 11102, and the reflected light (observation light) from the observation target is focused on the image sensor by the optical system.
  • the observation light is photoelectrically converted by the imaging element, and an electric signal corresponding to the observation light, that is, an image signal corresponding to the observation image is generated.
  • the image signal is transmitted to a camera control unit (CCU: ⁇ Camera ⁇ Control ⁇ Unit) 11201 as RAW data.
  • the $ CCU 11201 is configured by a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), and the like, and controls the operations of the endoscope 11100 and the display device 11202 overall. Further, the CCU 11201 receives an image signal from the camera head 11102, and performs various image processing on the image signal for displaying an image based on the image signal, such as a development process (demosaicing process).
  • a development process demosaicing process
  • the display device 11202 displays an image based on an image signal on which image processing has been performed by the CCU 11201 under the control of the CCU 11201.
  • the light source device 11203 includes a light source such as an LED (Light Emitting Diode), for example, and supplies the endoscope 11100 with irradiation light when imaging an operation part or the like.
  • a light source such as an LED (Light Emitting Diode), for example, and supplies the endoscope 11100 with irradiation light when imaging an operation part or the like.
  • the input device 11204 is an input interface to the endoscopic surgery system 11000.
  • the user can input various information and input instructions to the endoscopic surgery system 11000 via the input device 11204.
  • the user inputs an instruction or the like to change imaging conditions (type of irradiation light, magnification, focal length, and the like) by the endoscope 11100.
  • the treatment instrument control device 11205 controls the driving of the energy treatment instrument 11112 for cauterizing, incising a tissue, sealing a blood vessel, and the like.
  • the insufflation device 11206 is used to inflate the body cavity of the patient 11132 for the purpose of securing the visual field by the endoscope 11100 and securing the working space of the operator.
  • the recorder 11207 is a device that can record various types of information related to surgery.
  • the printer 11208 is a device that can print various types of information on surgery in various formats such as text, images, and graphs.
  • the light source device 11203 that supplies the endoscope 11100 with irradiation light at the time of imaging the operation site can be configured by a white light source configured by, for example, an LED, a laser light source, or a combination thereof.
  • a white light source configured by a combination of the RGB laser light sources
  • the output intensity and output timing of each color (each wavelength) can be controlled with high accuracy. It can be carried out.
  • laser light from each of the RGB laser light sources is irradiated to the observation target in a time-division manner, and the driving of the image pickup device of the camera head 11102 is controlled in synchronization with the irradiation timing, so that each of the RGB laser light sources is controlled. It is also possible to capture the image obtained in a time-division manner. According to this method, a color image can be obtained without providing a color filter in the image sensor.
  • the driving of the light source device 11203 may be controlled so as to change the intensity of the output light every predetermined time.
  • the driving of the image pickup device of the camera head 11102 in synchronization with the timing of the change of the light intensity, an image is acquired in a time-division manner, and the image is synthesized, so that a high dynamic image without a so-called blackout or whiteout is obtained.
  • An image of the range can be generated.
  • the light source device 11203 may be configured to be able to supply light in a predetermined wavelength band corresponding to special light observation.
  • special light observation for example, by utilizing the wavelength dependence of light absorption in body tissue, by irradiating light in a narrower band compared to irradiation light (ie, white light) during normal observation, the surface of the mucous membrane is exposed.
  • a narrow band light observation (Narrow / Band / Imaging) for photographing a predetermined tissue such as a blood vessel with high contrast is performed.
  • a fluorescence observation for obtaining an image by fluorescence generated by irradiating the excitation light may be performed.
  • a body tissue is irradiated with excitation light to observe fluorescence from the body tissue (autofluorescence observation), or a reagent such as indocyanine green (ICG) is locally injected into the body tissue and the body tissue is subjected to the fluorescence observation.
  • ICG indocyanine green
  • Irradiation with excitation light corresponding to the fluorescence wavelength of the reagent can be performed to obtain a fluorescence image.
  • the light source device 11203 can be configured to be able to supply narrowband light and / or excitation light corresponding to such special light observation.
  • FIG. 61 is a block diagram showing an example of a functional configuration of the camera head 11102 and the CCU 11201 shown in FIG.
  • the camera head 11102 includes a lens unit 11401, an imaging unit 11402, a driving unit 11403, a communication unit 11404, and a camera head control unit 11405.
  • the CCU 11201 includes a communication unit 11411, an image processing unit 11412, and a control unit 11413.
  • the camera head 11102 and the CCU 11201 are communicably connected to each other by a transmission cable 11400.
  • the lens unit 11401 is an optical system provided at a connection with the lens barrel 11101. Observation light taken in from the tip of the lens barrel 11101 is guided to the camera head 11102, and enters the lens unit 11401.
  • the lens unit 11401 is configured by combining a plurality of lenses including a zoom lens and a focus lens.
  • the imaging unit 11402 includes an imaging element.
  • the number of imaging elements constituting the imaging unit 11402 may be one (so-called single-panel type) or plural (so-called multi-panel type).
  • image signals corresponding to RGB may be generated by the imaging elements, and a color image may be obtained by combining the image signals.
  • the imaging unit 11402 may be configured to include a pair of imaging devices for acquiring right-eye and left-eye image signals corresponding to 3D (Dimensional) display. By performing the 3D display, the operator 11131 can more accurately grasp the depth of the living tissue in the operative part.
  • a plurality of lens units 11401 may be provided for each imaging device.
  • the imaging unit 11402 does not necessarily need to be provided in the camera head 11102.
  • the imaging unit 11402 may be provided inside the lens barrel 11101 immediately after the objective lens.
  • the driving unit 11403 is configured by an actuator, and moves the zoom lens and the focus lens of the lens unit 11401 by a predetermined distance along the optical axis under the control of the camera head control unit 11405.
  • the magnification and the focus of the image captured by the imaging unit 11402 can be appropriately adjusted.
  • the communication unit 11404 is configured by a communication device for transmitting and receiving various information to and from the CCU 11201.
  • the communication unit 11404 transmits the image signal obtained from the imaging unit 11402 as RAW data to the CCU 11201 via the transmission cable 11400.
  • the communication unit 11404 receives a control signal for controlling the driving of the camera head 11102 from the CCU 11201 and supplies the control signal to the camera head control unit 11405.
  • the control signal includes, for example, information indicating the frame rate of the captured image, information indicating the exposure value at the time of imaging, and / or information indicating the magnification and focus of the captured image. Contains information about the condition.
  • imaging conditions such as the frame rate, the exposure value, the magnification, and the focus may be appropriately designated by the user, or may be automatically set by the control unit 11413 of the CCU 11201 based on the acquired image signal. Good.
  • a so-called AE (Auto Exposure) function, an AF (Auto Focus) function, and an AWB (Auto White Balance) function are mounted on the endoscope 11100.
  • the camera head controller 11405 controls driving of the camera head 11102 based on a control signal from the CCU 11201 received via the communication unit 11404.
  • the communication unit 11411 is configured by a communication device for transmitting and receiving various information to and from the camera head 11102.
  • the communication unit 11411 receives an image signal transmitted from the camera head 11102 via the transmission cable 11400.
  • the communication unit 11411 transmits a control signal for controlling driving of the camera head 11102 to the camera head 11102.
  • the image signal and the control signal can be transmitted by electric communication, optical communication, or the like.
  • the image processing unit 11412 performs various types of image processing on an image signal that is RAW data transmitted from the camera head 11102.
  • the control unit 11413 performs various kinds of control relating to imaging of the operation section and the like by the endoscope 11100 and display of a captured image obtained by imaging the operation section and the like. For example, the control unit 11413 generates a control signal for controlling driving of the camera head 11102.
  • control unit 11413 causes the display device 11202 to display a captured image showing the operative part or the like based on the image signal on which the image processing is performed by the image processing unit 11412.
  • the control unit 11413 may recognize various objects in the captured image using various image recognition techniques. For example, the control unit 11413 detects a surgical tool such as forceps, a specific living body site, a bleeding, a mist at the time of using the energy treatment tool 11112, and the like by detecting the shape and color of the edge of the object included in the captured image. Can be recognized.
  • the control unit 11413 may use the recognition result to superimpose and display various types of surgery support information on the image of the operative site. By superimposing the operation support information and presenting it to the operator 11131, the burden on the operator 11131 can be reduced, and the operator 11131 can surely proceed with the operation.
  • the transmission cable 11400 connecting the camera head 11102 and the CCU 11201 is an electric signal cable corresponding to electric signal communication, an optical fiber corresponding to optical communication, or a composite cable thereof.
  • the communication is performed by wire using the transmission cable 11400, but the communication between the camera head 11102 and the CCU 11201 may be performed wirelessly.
  • the technology according to the present disclosure may be applied to, for example, a microscopic surgery system and the like.
  • Imaging element A first electrode, A charge storage electrode spaced apart from the first electrode; A separation electrode that is disposed separately from the first electrode and the charge storage electrode and surrounds the charge storage electrode; A photoelectric conversion layer in contact with the first electrode and formed above the charge storage electrode via an insulating layer; and A second electrode formed on the photoelectric conversion layer,
  • the separation electrode includes a first separation electrode, and a second separation electrode that is spaced apart from the first separation electrode, The first separation electrode is an imaging device located between the first electrode and the second separation electrode.
  • Each image sensor is A first electrode, A charge storage electrode spaced apart from the first electrode; A separation electrode that is disposed separately from the first electrode and the charge storage electrode and surrounds the charge storage electrode; A photoelectric conversion layer in contact with the first electrode and formed above the charge storage electrode via an insulating layer; and A second electrode formed on the photoelectric conversion layer,
  • the separation electrode includes a first separation electrode, a second separation electrode, and a third separation electrode, The first separation electrode is adjacent to and separated from the first electrode, between the image sensors arranged side by side at least along the second direction in the image sensor block, The second separation electrode is disposed between the image sensor and the image sensor in the image sensor block, A solid-state imaging device in which the third separation electrode is disposed between the image sensor blocks.
  • the first separation electrode is arranged between the image sensors arranged side by side along the second direction in the image sensor block, adjacent to and separated from the first electrode.
  • the second separation electrode is disposed between the image sensor and the image sensor arranged side by side along the first direction, and between the image sensor and the image sensor arranged side by side along the second direction.
  • the solid-state imaging device according to [A06] or [A07] which is spaced apart from the first separation electrode.
  • the first separation electrode is disposed adjacent to and separated from the first electrode between the image sensors arranged side by side in the second direction in the image sensor block. Further, between the imaging element arranged side by side along the first direction, adjacent to the first electrode, and is arranged spaced apart, The second separation electrode is arranged apart from the first separation electrode between the image sensors arranged side by side along the second direction, and further, arranged side by side along the first direction.
  • the solid-state imaging device according to [A06] or [A07], which is arranged between the imaging element and the imaging element so as to be separated from the first separation electrode. [A11] The solid-state imaging device according to [A10], wherein the second separation electrode is connected to the third separation electrode.
  • [A16] The solid-state imaging device according to any one of [A06] to [A15], in which the first electrodes are shared among the P ⁇ Q imaging elements forming the imaging element block.
  • [A18] further comprising a semiconductor substrate, The solid-state imaging device according to any one of [A01] to [A17], wherein the photoelectric conversion unit is disposed above the semiconductor substrate.
  • [A19] Transfer control disposed between the first electrode and the charge storage electrode at a distance from the first electrode and the charge storage electrode, and disposed to face the photoelectric conversion layer via an insulating layer.
  • [A20] The solid-state imaging device according to any one of [A01] to [A19], wherein the charge storage electrode includes a plurality of charge storage electrode segments.
  • [A21] The solid-state imaging device according to any one of [A01] to [A20], wherein the size of the charge storage electrode is larger than that of the first electrode.
  • the edge of the top surface of the first electrode is covered with an insulating layer, The first electrode is exposed at the bottom of the opening, When the surface of the insulating layer in contact with the top surface of the first electrode is the first surface, and the surface of the insulating layer in contact with the portion of the photoelectric conversion layer facing the charge storage electrode is the second surface, the side surface of the opening is the second surface.
  • a side surface of the opening having an inclination extending from the first surface to the second surface is located on the charge storage electrode side.
  • Control of potential of first electrode and charge storage electrode >> A control unit provided on the semiconductor substrate and having a drive circuit, The first electrode and the charge storage electrode are connected to a drive circuit, In the charge accumulation period, the driving circuit, the potential V 11 is applied to the first electrode, the potential V 12 is applied to the charge storage electrode, charges are accumulated in the photoelectric conversion layer, During the charge transfer period, the driving circuit applies the potential V 21 to the first electrode, applies the potential V 22 to the charge storage electrode, and transfers the charge stored in the photoelectric conversion layer to the control unit via the first electrode.
  • the solid-state imaging device according to any one of [A01] to [A25], which is read out at a time.
  • the solid-state imaging device according to [A27], which is lower than a potential applied to the charge storage electrode segment.
  • the semiconductor substrate is provided with at least a floating diffusion layer and an amplifying transistor constituting a control unit, The solid-state imaging device according to any one of [A01] to [A28], wherein the first electrode is connected to the floating diffusion layer and a gate of the amplification transistor.
  • the semiconductor substrate is further provided with a reset transistor and a selection transistor that constitute a control unit.
  • the floating diffusion layer is connected to one source / drain region of the reset transistor,
  • Imaging device [A31] The solid-state imaging device according to any one of [A01] to [A30], in which light is incident from the second electrode side, and a light shielding layer is formed on the light incident side from the second electrode.
  • An on-chip micro lens is provided above the charge storage electrode and the second electrode, The solid-state imaging device according to [A32], wherein light incident on the on-chip micro lens is focused on the charge storage electrode.
  • ⁇ Imaging element: First configuration >> The photoelectric conversion unit is composed of N (where N ⁇ 2) photoelectric conversion unit segments, The photoelectric conversion layer is composed of N photoelectric conversion layer segments, The insulating layer is composed of N insulating layer segments, The charge storage electrode is composed of N charge storage electrode segments, The n-th (where n 1, 2, 3,...
  • N) photoelectric conversion unit segment includes an n-th charge storage electrode segment, an n-th insulating layer segment, and an n-th photoelectric conversion layer. Segment.
  • the photoelectric conversion unit segment having a larger value of n is located farther from the first electrode,
  • the photoelectric conversion unit is composed of N (where N ⁇ 2) photoelectric conversion unit segments,
  • the photoelectric conversion layer is composed of N photoelectric conversion layer segments,
  • the insulating layer is composed of N insulating layer segments,
  • the charge storage electrode is composed of N charge storage electrode segments,
  • the photoelectric conversion unit segment having a larger value of n is located farther from the first electrode, The thickness according to any one of [A01] to [A34], wherein the thickness of the photoelectric conversion layer segment gradually changes from the first photoelectric conversion unit segment to the Nth photoelectric conversion unit segment.
  • Solid-state imaging device. [B03] ⁇ Imaging element: third configuration >> The photoelectric conversion unit is composed of N (where N ⁇ 2) photoelectric conversion unit segments, The photoelectric conversion layer is composed of N photoelectric conversion layer segments, The insulating layer is composed of N insulating layer segments, The charge storage electrode is composed of N charge storage electrode segments, The n-th (where n 1, 2, 3,...
  • N) photoelectric conversion unit segment includes an n-th charge storage electrode segment, an n-th insulating layer segment, and an n-th photoelectric conversion layer. Segment.
  • the photoelectric conversion unit segment having a larger value of n is located farther from the first electrode,
  • the solid-state imaging device according to any one of [A01] to [A34], in which a material forming an insulating layer segment is different between adjacent photoelectric conversion unit segments.
  • the photoelectric conversion unit is composed of N (where N ⁇ 2) photoelectric conversion unit segments,
  • the photoelectric conversion layer is composed of N photoelectric conversion layer segments,
  • the insulating layer is composed of N insulating layer segments,
  • the charge storage electrode is composed of N charge storage electrode segments that are spaced apart from each other,
  • the photoelectric conversion unit segment having a larger value of n is located farther from the first electrode,
  • the solid-state imaging device according to any one of [A01] to [A34], in which the material forming the charge storage electrode segment is different between adjacent photoelectric conversion unit segments.
  • the photoelectric conversion unit is composed of N (where N ⁇ 2) photoelectric conversion unit segments,
  • the photoelectric conversion layer is composed of N photoelectric conversion layer segments,
  • the insulating layer is composed of N insulating layer segments,
  • the charge storage electrode is composed of N charge storage electrode segments that are spaced apart from each other,
  • N) photoelectric conversion unit segment includes an n-th charge storage electrode segment, an n-th insulating layer segment, and an n-th photoelectric conversion layer. Segment.
  • the photoelectric conversion unit segment having a larger value of n is located farther from the first electrode, The one according to any one of [A01] to [A34], wherein the area of the charge storage electrode segment gradually decreases from the first photoelectric conversion unit segment to the Nth photoelectric conversion segment.
  • [B06] Imaging element: sixth configuration >> When the lamination direction of the charge storage electrode, the insulating layer, and the photoelectric conversion layer is the Z direction, and the direction away from the first electrode is the X direction, the charge storage electrode, the insulating layer, and the photoelectric conversion layer are laminated on the YZ virtual plane.
  • [C01] ⁇ Laminated image sensor >> A stacked solid-state imaging device having at least one imaging device according to any one of [A01] to [B06].
  • Solid-state imaging device including a stacked imaging device including at least one imaging device according to any one of [A01] to [B06].
  • [D02] At least one lower image sensor is provided below the image sensor.
  • [D03] The solid-state imaging device according to [D02], wherein two lower imaging elements are stacked.
  • [D05] The solid-state imaging device according to any one of [D01] to [D04], wherein the plurality of imaging elements configuring the lower imaging element block include a shared floating diffusion layer.
  • insulating layer 82 ', ..Area between adjacent imaging elements, 82p... First surface of insulating layer, 82q... Second surface of insulating layer, 83... Protective layer, 84, 84A, 84B, 84C. Opening, 90 ... On-chip micro lens, 91 ...

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