WO2020008656A1 - Dispositif de source de lumière et projecteur - Google Patents

Dispositif de source de lumière et projecteur Download PDF

Info

Publication number
WO2020008656A1
WO2020008656A1 PCT/JP2018/031544 JP2018031544W WO2020008656A1 WO 2020008656 A1 WO2020008656 A1 WO 2020008656A1 JP 2018031544 W JP2018031544 W JP 2018031544W WO 2020008656 A1 WO2020008656 A1 WO 2020008656A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
optical system
light source
source device
semiconductor laser
Prior art date
Application number
PCT/JP2018/031544
Other languages
English (en)
Japanese (ja)
Inventor
裕貴 山田
三浦　雄一
Original Assignee
ウシオ電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ウシオ電機株式会社 filed Critical ウシオ電機株式会社
Publication of WO2020008656A1 publication Critical patent/WO2020008656A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0239—Combinations of electrical or optical elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/14—Details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/14—Details
    • G03B21/20—Lamp housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30

Definitions

  • the present invention relates to a light source device, and more particularly, to a light source device using light emitted from a semiconductor laser chip.
  • the invention also relates to a projector provided with such a light source device.
  • Semiconductor laser chips are being used as light sources for projectors.
  • a light source device that uses a semiconductor laser chip as a light source and further increases the light output has been expected from the market.
  • a method of condensing light emitted from a plurality of semiconductor laser chips can be considered.
  • semiconductor laser chips have a certain width, and there is a limit in arranging them in close proximity. That is, merely arranging a plurality of semiconductor laser chips increases the size of the light source device.
  • a semiconductor laser chip group is arranged in a first region, another semiconductor laser chip group is arranged in a second region different from the first region,
  • a technique for combining light emitted from a group of semiconductor laser chips by using a light combining means including a slit mirror According to such a method, it is possible to increase the light intensity while reducing the arrangement area as compared with a case where a plurality of semiconductor laser chips are simply arranged in the same place.
  • a method for increasing the light intensity on the light source side a method using a semiconductor laser chip provided with a plurality of regions for emitting laser light (light emitting region: hereinafter sometimes referred to as “emitter”) is considered.
  • a semiconductor laser chip may be referred to as a “multi-emitter type”.
  • the present inventors have studied to increase the light intensity by using a multi-emitter type semiconductor laser chip as a light source, and have found that the following problems exist.
  • FIG. 1A is a perspective view schematically showing a structure of a semiconductor laser chip having one emitter. Such a semiconductor laser chip may be referred to as a “single-emitter type”.
  • FIG. 1A also schematically illustrates a light beam of light (laser light) emitted from the emitter.
  • a bundle of rays emitted from a single emitter and formed in a bundle is referred to as a “ray bundle”, and a ray emitted from the center of the emitter in parallel with the optical axis is referred to as a “principal ray”. Name.
  • a direction (Y direction shown in FIG. 1A) in which the divergence angle of the light beam 101L is large is defined as a direction of two directions (X direction and Y direction) orthogonal to the optical axis (Z direction shown in FIG. 1A).
  • the direction in which the divergence angle of the light beam 101L is small (the X direction shown in FIG. 1A) is referred to as a “Fast axis direction” and is referred to as a “Slow axis direction”.
  • the divergence angle refers to an angle twice as large as the angle formed by the light beam that travels at a light intensity of 1 / e 2 of the principal light with the maximum light intensity and the principal light.
  • FIG. 1B schematically illustrates the light beam 101L when viewed from the X direction and when viewed from the Y direction. As shown in FIG. 1B, larger divergence angle theta y light bundle 101L is for Fast axis, divergence angle theta x light bundle 101L is smaller for Slow axis direction.
  • the divergence angle of the light beam may be exaggerated in some cases for convenience of explanation.
  • each light flux 101L is converted into parallel light. After being converted, the light is generally collected by a lens. More specifically, a collimating lens (also referred to as a “collimation lens”) is arranged downstream of the semiconductor laser chip 100 to reduce the divergence angle of each light beam 101L.
  • a collimating lens also referred to as a “collimation lens”
  • FIG. 2A is a drawing schematically showing a light beam traveling in the YZ plane direction when the collimator lens 102 is arranged at the subsequent stage of the semiconductor laser chip 100.
  • FIG. 2A only light rays emitted from the upper end and the lower end of the emitter are drawn.
  • the light beam 101L after passing through the collimating lens 102, the light beam 101L becomes a substantially parallel light beam in the Fast axis direction (Y direction) (hereinafter, referred to as “substantially parallel light beam”).
  • substantially parallel light beam or “substantially parallel light beam” refers to a light beam having a divergence angle of less than 4 °.
  • the substantially parallel light beam may be illustrated as a completely parallel light beam.
  • FIG. 2B is a diagram schematically showing a light beam traveling in the XZ plane direction when the collimating lens 102 is disposed at the subsequent stage of the semiconductor laser chip 100.
  • the light beam 101L becomes a substantially parallel light beam also in the Slow axis direction (X direction).
  • FIG. 3A is a perspective view schematically showing a structure of a semiconductor laser chip having a plurality of emitters, unlike FIG. 1A.
  • FIG. 3A shows a case where the semiconductor laser chip 110 includes two emitters (111, 112).
  • FIG. 3B is a schematic diagram of the light flux (111L, 112L) emitted from each emitter (111, 112) divided into a case viewed from the X direction and a case viewed from the Y direction, following FIG. 1B. This is shown in FIG. Since the emitters (111, 112) are formed at the same coordinate position in the Y direction, the light beams (111L, 112L) completely overlap when viewed from the X direction. On the other hand, since the respective emitters (111, 112) are formed at different coordinate positions in the X direction, the light beams (111L, 112L) are displayed with their respective positions shifted when viewed from the Y direction.
  • each light beam (111L, 112L) passes through the collimating lens 102, and then becomes a substantially parallel light beam as in FIG. 2A.
  • FIG. 4 is a drawing schematically showing a light beam traveling in the XZ plane direction when the collimating lens 102 is arranged at the subsequent stage of the semiconductor laser chip 110. Since the semiconductor laser chip 110 includes a plurality of emitters (111, 112) separated in the X direction, the X coordinate at the center position of the collimating lens 102 and the X coordinate at the center position of each emitter (111, 112) Is inevitably shifted.
  • the light beam 111L emitted from the emitter 111 and the light beam 112L emitted from the emitter 112 become substantially parallel light beams after passing through the collimating lens 102, but the main light beam 111Lm of the light beam 111L,
  • the principal ray 112Lm of the ray bundle 112L is non-parallel. That is, the light beam 111L and the light beam 112L have different traveling directions in the X direction.
  • the angle of the traveling direction of the light beam 111L and the light beam 112L in the X direction is determined by the relative value of the distance between the emitters (111, 112) to the focal length of the collimating lens 102.
  • the above problem can also occur in the single-emitter type semiconductor laser chip 100. That is, the above-described problem is caused when the width of the emitter 101 is widened to increase the output of the semiconductor laser chip 100, or when a plurality of single-emitter type semiconductor laser chips 100 are arranged and emitted from the plurality of semiconductor laser chips 100. The same can occur when the collimated lens beam is incident on one collimating lens 102.
  • the light source device A plurality of light emitting regions provided on the same or different semiconductor laser chips, Including a plurality of flat surfaces having different inclination angles, at least a part of each of a plurality of first light beams emitted from a plurality of light emitting regions adjacent to each other is incident on the different flat surfaces, and a plurality of the first light beams are emitted.
  • a first refractive optical system that converts each principal ray of the light beam into a plurality of second light beams that travel while moving away from each other, and A plurality of the second light fluxes emitted from the first refractive optical system are incident, and the traveling directions of the respective principal rays of the plurality of the second light fluxes are converted substantially parallel to the optical axis.
  • a second refractive optical system that converts each of the plurality of second light beams into a substantially parallel light beam and emits the converted light beams.
  • the light source device includes a first refraction optical system including a plurality of flat surfaces having different inclination angles at a stage subsequent to the laser light source. At least some of the plurality of first light beams emitted from the laser light source are incident on different flat surfaces of the first refractive optical system. In accordance with the inclination angle formed on the flat surface, the plurality of first light beams are refracted, and their traveling directions change.
  • the inclination angle of each flat surface is set such that the respective principal rays of the plurality of first light beams travel while moving away from each other. As a result, the respective second light beams after passing through the first refractive optical system travel while moving away from each other.
  • the principal rays of the second light flux after passing through the first refracting optical system converge within a certain range on an extension line directed in the opposite direction (the laser light source side) to the traveling direction of the light.
  • the principal rays of the second light flux that have passed through the first refraction optical system are substantially light emitted from one light emission area.
  • the light source device at the subsequent stage of the first refractive optical system, while converting the traveling direction of the principal ray of each of the plurality of second light beams substantially parallel to the optical axis, each of the plurality of second light beams, A second refractive optical system that converts the light into a substantially parallel light beam and emits the light;
  • the respective second light beams that have passed through the second refracting optical system have substantially the same traveling direction.
  • the light source device converts the first light flux emitted from the plurality of light emission areas into the second light flux substantially emitted from one area by the first refraction optics, and converts them into the second light flux.
  • the refracting optical system emits each ray bundle and each ray as substantially parallel light (substantially parallel light).
  • the light beams do not cross each other, or only extremely fine light beams cross.
  • light having a high irradiance can be obtained by condensing these light beams at a later stage.
  • the light source device since the spread of the light beam is suppressed by disposing the second refraction optical system after the first refraction optical system, it is necessary to dispose a large collimating lens having a long focal length. Therefore, expansion of the device scale is suppressed.
  • the light source device may be provided with a plurality of multi-emitter type semiconductor laser chips having a plurality of light emitting regions (so-called “emitters”) on the same semiconductor laser chip, or on the same semiconductor laser chip.
  • a plurality of single-emitter type semiconductor laser chips having a single light emitting region (emitter) may be provided.
  • the window may be configured by the first refractive optical system.
  • the laser light source and the first refractive optical system can be configured as a single light source device by casing.
  • this light source device and the second refraction optical system having a focal length according to the application outside substantially parallel light can be obtained.
  • a casing material having a window part that shows transparency to light is provided in a part thereof,
  • the window may be configured by the second refractive optical system.
  • the laser light source, the first refraction optical system, and the second refraction optical system can be formed into a single light source device by casing. Substantially parallel light can be obtained only with this light source device.
  • the casing material may contain a plurality of the semiconductor laser chips.
  • the first refractive optical system may have a plurality of the flat surfaces on the light incident surface side.
  • the plurality of first light beams emitted from the light emitting region travel while spreading around the principal light.
  • Each principal ray travels while maintaining parallelism, but the light beam travels while spreading, and eventually a part of the light beam reaches the optical axis.
  • the light beam further propagates while spreading, so that a part of the light beam crosses the optical axis and a part of each light beam advances while overlapping. Then, the overlap of the light beams increases as the light beams progress.
  • the first refraction optical system is arranged before the position where a part of the first light beam reaches the optical axis.
  • the first refracting optical system is arranged at a stage before the position where a part of the first light beam reaches the optical axis, so that the plurality of first light beams emitted from the light emitting area are respectively It is completely incident on a different flat surface of the first refractive optical system.
  • all the light beams included in each first light beam can be made substantially parallel by the second refraction optical system and guided to the subsequent stage.
  • the first refracting optical system may be arranged at a stage subsequent to a position where a part of the first light beam reaches the optical axis.
  • the adjacent first light beams are incident on the flat surface of the second refractive optical system in a state where the first light beams partially overlap each other.
  • the first light flux emitted from the light emitting area has the highest light intensity at the position of the principal ray, and the light distribution is such that the light intensity decreases rapidly as the distance from the principal ray increases, such as a Gaussian distribution. Distribution.
  • each first ray bundle exhibits a distribution such as a Gaussian distribution, and rays near the principal ray included in each first ray bundle are the same as the principal ray by the second refractive optical system. Since these light beams travel in the direction, these light beams are focused on a target position by a later-stage focusing optical system. That is, also in this mode, the intensity of the unusable light beam is extremely low, and does not significantly affect the light use efficiency when viewed as a whole device.
  • the light exit surface of the first refractive optical system and the light entrance slope of the second refractive optical system may be shared.
  • a single optical system can convert a light beam emitted from a laser light source having a plurality of light emission regions into substantially parallel light, and further convert each light beam into substantially parallel light. Since the light can be converted into substantially parallel light by one optical system, expansion of the device scale is suppressed. Further, the members for disposing the first refracting optical system and the second refracting optical system become one, and the expansion of the apparatus scale is further suppressed.
  • the projector according to the present invention includes: An image is projected using light emitted from the light source device.
  • a light source device that uses a plurality of semiconductor laser chips to increase the light output while suppressing an increase in the device scale is realized.
  • FIG. 1A schematically illustrates a light beam emitted from the semiconductor laser chip of FIG. 1A separately when viewed from an X direction and when viewed from a Y direction.
  • FIG. 3 is a drawing schematically showing a light beam traveling in the YZ plane direction when a collimator lens is arranged at a stage subsequent to a semiconductor laser chip.
  • FIG. 3 is a drawing schematically showing a light beam traveling in the XZ plane direction when a collimator lens is arranged at a subsequent stage of a semiconductor laser chip.
  • FIG. 1A schematically illustrates a light beam emitted from the semiconductor laser chip of FIG. 1A separately when viewed from an X direction and when viewed from a Y direction.
  • FIG. 3 is a drawing schematically showing a light beam traveling in the YZ plane direction when a collimator lens is arranged at a stage subsequent to a semiconductor laser chip
  • FIG. 3A schematically illustrates a light beam emitted from the semiconductor laser chip of FIG. 3A separately when viewed from the X direction and when viewed from the Y direction.
  • FIG. 3B is a drawing schematically showing a light beam traveling in the XZ plane direction when a collimator lens is arranged at the subsequent stage of the semiconductor laser chip of FIG. 3A. It is a figure showing typically composition of one embodiment of a light source device.
  • FIG. 3B is a drawing schematically showing a light beam traveling in the XZ plane direction when the first refractive optical system is arranged at a stage subsequent to the semiconductor laser chip of FIG. 3A.
  • FIG. 6B is a partially enlarged view of FIG. 6A.
  • FIG. 1 is a drawing schematically showing a configuration example in which a first refractive optical system and a second refractive optical system are integrated into a combined refractive optical system. It is drawing which shows typically the structure of one embodiment of the light source device which was casing. It is drawing which shows another example of a structure of the light source device in which the casing was carried out typically. It is drawing which shows another example of a structure of the light source device in which the casing was carried out typically. It is drawing which shows another example of a structure of the light source device in which the casing was carried out typically. It is drawing which shows another example of a structure of the light source device in which the casing was carried out typically. It is drawing which shows another example of a structure of the light source device in which the casing was carried out typically. It is drawing of XY plane view of FIG. 12A.
  • FIG. 3 is a perspective view of a light source device in which a plurality of semiconductor laser chips are casing with the same casing material.
  • 1 is a drawing schematically showing a configuration of an embodiment of a light source device in which a plurality of semiconductor laser chips are individually partitioned by a single casing material and casing.
  • FIG. 3 is a perspective view of a light source device in which a plurality of semiconductor laser chips are casing with the same casing material.
  • FIG. 1 is a drawing schematically showing a configuration of an embodiment of a light source device in which a plurality of semiconductor laser chips are casing in the same space of one casing material. It is a figure which shows typically another example of the structure of the light source device in which the some semiconductor laser chip was casing in the same space of one casing material. It is a figure which shows typically another example of the structure of the light source device in which the some semiconductor laser chip was casing in the same space of one casing material.
  • 3 is a diagram schematically illustrating a configuration example of a projector including a light source device.
  • FIG. 5 is a drawing schematically showing a configuration of an embodiment of the light source device.
  • the light source device 1 includes a semiconductor laser chip 5, a first refractive optical system 2, and a second refractive optical system 3.
  • FIG. 5 shows, as an example, a case where the semiconductor laser chip 5 is a multi-emitter type laser light source having two light emitting regions (10, 20).
  • the optical axis is defined as the Z direction
  • the direction in which the light emitting regions (10, 20) are separated is defined as the X direction
  • the direction orthogonal to the X direction and the Z direction is defined as the Y direction.
  • the first refracting optical system 2 is an optical system that refracts the first light beam (11, 21) emitted from the light emitting area (10, 20) of the semiconductor laser chip 5 at a predetermined angle.
  • the first refractive optical system 2 is a prism having flat surfaces (2a, 2b) having different inclination angles on the incident surface side of the first light flux (11, 21). The description of the tilt angle will be described later with reference to FIG. 6B.
  • the second refracting optical system 3 receives the second light flux (12, 22) emitted from the first refracting optical system 2 and changes the traveling direction of each principal ray (12Lm, 22Lm) of the second light flux.
  • An optical system that converts light beams substantially parallel to the optical axis and converts each of the plurality of second light fluxes (12, 22) into substantially parallel light fluxes.
  • the second refractive optical system 3 is a collimating lens.
  • FIG. 6A is a drawing schematically showing a light beam traveling in the XZ plane direction when the first refracting optical system 2 is arranged at a stage subsequent to the semiconductor laser chip 5.
  • the first light fluxes (11, 21) emitted from the light emission areas (10, 20) of the semiconductor laser chip 5 are refracted by the first refraction optical system 2, and the principal rays (12Lm, 22Lm) are separated from each other. Proceed to. Thereafter, the second light flux (12, 22) emitted from the first refraction optical system 2 travels while diverging based on each principal ray (12Lm, 22Lm).
  • FIG. 6B is a partially enlarged view of FIG. 6A.
  • the first refracting flat plane of the optical system 2 (2a, 2b) tilt angle ( ⁇ a, ⁇ b) is set for. More specifically, each flat surface (2a, 2b) has the same convergence as though the first light beam (11, 21) is emitted from the spaced light emitting regions (10, 20).
  • the inclination angles ( ⁇ a , ⁇ b ) are set so as to have a function of optically simulating the light emitted from the region 6.
  • the inclination angles ( ⁇ a , ⁇ b ) of the flat surfaces (2a, 2b) refer to angles with respect to the optical axis 60 of the first light flux (11, 21), and this angle includes It is assumed that positive and negative values are added according to the direction of rotation for distinction.
  • the case where the rotation direction is counterclockwise is defined as positive
  • the case where the rotation direction is clockwise is defined as negative. That is, according to the example of FIG. 6B, the flat surface 2a of the first refractive optical system 2 is inclined in the counterclockwise direction with respect to the optical axis 60, the inclination angle theta a is a positive value.
  • the flat surface 2b of the first refractive optical system 2 is inclined in the clockwise direction with respect to the optical axis 60, the inclination angle theta b is a negative value. That is, the inclination angle theta a flat surface 2a, and the inclination angle theta b of the flat surface 2b, a different value.
  • the inclination angles ( ⁇ a , ⁇ b ) of the flat surfaces (2a, 2b) are set so that the converging region 6 is located in the middle of the light emitting regions (10, 20) of the semiconductor laser chip 5. Is set, but does not have to be located in the middle of the light emitting area (10, 20) of the semiconductor laser chip 5. Further, it does not have to be on the optical axis 60.
  • each principal ray (12Lm, 22Lm) of the light beam refracted by the flat surface (incident surface) (2a, 2b) and the exit surface 2c of the first refracting optical system 2 is moved in the traveling direction.
  • imaginary lines (11a, 21a) extending in the opposite direction are drawn, the imaginary lines converge on the convergence area 6. That is, the light beams (11, 21) that have passed through the first refracting optical system 2 become light beams emitted from the virtual convergence region 6, that is, substantially from the single emitter.
  • the light beam 101 ⁇ / b> L emitted from the emitter (light emission region) 101 of the single-emitter type semiconductor laser chip 100 is converted by the collimator lens 102 into substantially parallel light.
  • the light beam (11, 21) emitted from the semiconductor laser chip 5 shown in FIG. 5 is converted by the first refractive optical system 2 into a light beam substantially emitted from a single emitter.
  • FIG. 7 is a drawing schematically showing another configuration example of the light source device 1.
  • the light source device 1 may include a combined refractive optical system 4 in which the first refractive optical system 2 and the second refractive optical system 3 are integrated.
  • Reference numeral 7 shown in FIG. 7 indicates a boundary surface between the first refractive optical system 2 and the second refractive optical system 3.
  • the first light beam (11, 2) refracted on the incident surface (the flat surfaces (2a, 2b) in FIG. 6B) of the first refractive optical system 2 disposed before the combined refractive optical system 4. 21) travels through the first refractive optical system 2 so as to diverge based on the principal ray (11m, 21m).
  • the light beams (11, 21) reaching the boundary surface 7 enter the second refractive optical system 3 as they are, and travel through the second refractive optical system 3. Then, the light is refracted on the exit surface of the second refraction optical system 3 (coupling refraction optical system 4), and is emitted as substantially parallel light.
  • the combined refractive optical system 4 may be configured by combining the first refractive optical system 2 and the second refractive optical system 3 having the same refractive index, or may be configured by combining the first refractive optical system 2 having different refractive indexes.
  • the second refractive optical system 3 may be combined with the second refractive optical system 3.
  • the coupling and refracting optical system 4 may be configured as one member instead of combining two members.
  • an optical member having a convex curved surface on the exit surface side and a flat surface with a different inclination angle on the incident surface side may be used.
  • the light source device 1 may be realized by casing the semiconductor laser chip 5 with a predetermined material.
  • FIG. 8 is a drawing schematically showing a configuration of one embodiment of the light source device 1 that is casing.
  • the casing material 30 provided in the light source device 1 casings the semiconductor laser chip 5, and the first refractive optical system 2 and the second refractive optical system 3 are arranged outside the casing material 30. Have been.
  • Part of the casing member 30 is provided with a window portion 30a that shows light transmission.
  • the casing material 30 has a portion other than the window 30a made of a metal having a thermal expansion coefficient similar to that of glass such as Kovar, and the window 30a is made of an optical glass such as BK-7.
  • the window portion 30a is arranged at a position facing the light emitting area (10a, 20a) of the semiconductor laser chip 5, and the light is emitted from each light emitting area (10a, 20a).
  • the first light beams (11, 21) pass through the window 30a and enter the first refractive optical system 2 arranged outside the casing member 30.
  • the light source device 1 shown in FIG. 8 is located between the light emitting area (10a, 20a) of the semiconductor laser chip 5 and the first refractive optical system 2 as compared with the light source device 1 described with reference to FIG. Since only the window 30a of the casing member 30 which does not optically affect the progress of the first light beam (11, 21) is arranged, from the viewpoint of avoiding overlap, each of the windows after the window 30a is provided. A description of the progress of the light beam will be omitted.
  • FIG. 9 is a drawing schematically showing another configuration example of the light source device 1 that is casing.
  • the casing material 30 included in the light source device 1 casings the semiconductor laser chip 5 and the first refractive optical system 2, and the second refractive optical system 3 is disposed outside the casing material 30. ing.
  • Part of the casing member 30 is provided with a window portion 30a that shows light transmission.
  • the semiconductor laser chip 5 the first refractive optical system 2 arranged downstream of the semiconductor laser chip 5, and the second refractive optical system arranged downstream of the first refractive optical system 2 Since the light source device 1 is provided with the system 3, the light source device 1 described with reference to FIG. 5 is the same as the light source device 1.
  • the light source device 1 shown in FIG. 9 has a configuration in which the first refractive optical system 2 is disposed inside the casing member 30, it is necessary to provide a space in which the first refractive optical system 2 can be disposed in the casing member 30. However, the influence is small, and it is not necessary to dispose the first refraction optical system 2 outside the casing member 30, so that the overall size of the light source device 1 can be reduced.
  • the first refractive optical system 2 can be arranged closer to the semiconductor laser chip 5 than the light source device 1 shown in FIG. For this reason, when the semiconductor laser chip 5 is of a multi-emitter type, the first refracting optical system 2 must be turned off before the first light beams (11, 21) emitted from the respective light emitting regions (10, 20) are greatly expanded.
  • the light can be incident on a predetermined incident surface (flat surfaces 2a and 2b). As a result, the size of the incident surface (flat surface 2a, 2b) of the first refractive optical system 2 can be reduced, which contributes to downsizing of the entire light source device 1.
  • FIG. 10 is a drawing schematically showing another example of the configuration of the light source device 1 in a casing. More specifically, the first refracting optical system 2 is configured to have the function of the window 30a of the casing member 30 in FIG.
  • the semiconductor laser chip 5 the first refractive optical system 2 arranged downstream of the semiconductor laser chip 5, and the second refractive optical system arranged downstream of the first refractive optical system 2 Since the light source device 1 is provided with the system 3, the light source device 1 described with reference to FIG. 5 is the same as the light source device 1.
  • FIG. 11 is a drawing schematically showing another example of the configuration of the light source device 1 in a casing. More specifically, the second refracting optical system 3 has the function of the window 30a of the casing member 30 in FIG. 8, and the first refracting optical system 2 is disposed inside the casing member. .
  • the semiconductor laser chip 5 the first refractive optical system 2 arranged downstream of the semiconductor laser chip 5, and the second refractive optical system arranged downstream of the first refractive optical system 2 Since the light source device 1 is provided with the system 3, the light source device 1 described with reference to FIG. 5 is the same as the light source device 1.
  • the light source device 1 shown in FIG. 11 also has the configuration in which the first refractive optical system 2 is disposed inside the casing member 30 similarly to the configuration in FIG. 9, so that the first refractive optical system 2 can be disposed in the casing member 30. It is necessary to provide space. However, the influence is small, and the first refractive optical system 2 can be arranged near the semiconductor laser chip 5, and the first refractive optical system 2 and the second refractive optical system 3 need to be arranged outside the casing material 30. By eliminating the point, the apparatus scale of the entire light source device 1 can be reduced.
  • FIG. 12A is a drawing schematically showing another example of the configuration of the light source device 1 in a casing. More specifically, the combined refracting optical system 4 in which the first refracting optical system 2 and the second refracting optical system 3 are integrated has the function of the window 30a of the casing member 30 in FIG. There is no need to provide a space between the first refracting optical system 2 and the second refracting optical system 3, and the size of the device can be further reduced as compared with the light source device 1 shown in FIG.
  • the window of the casing member 30 is configured by the second refractive optical system 3, and the first refractive optical system 2 and the second refractive optical system 3 are joined to form the combined refractive optical system 4.
  • FIG. 12B shows the shapes of the first refractive optical system 2 and the second refractive optical system 3 in XY plane view in FIG. 12A. However, since the first refractive optical system 2 has the same shape as the second refractive optical system 3 in the XY plane view, the first refractive optical system 2 is hidden behind the second refractive optical system 3 in FIG.
  • FIG. 12C shows the window of the casing member 30 in the XY plane view in FIG. 12C.
  • a part of the portion corresponding to the second refractive optical system 3 may be arranged so as to be in contact with the outer wall surface of the casing material 30. Further, the first refracting optical system 2 and the second refracting optical system 3 do not have to be circular or square in XY plan view.
  • the coupled refraction optics obtained by integrating the semiconductor laser chip 5 and the first refraction optical system 2 and the second refraction optical system 3 disposed at the subsequent stage of the semiconductor laser chip 5 Since the light source device 1 is provided with the system 4, it is the same as the light source device 1 described with reference to FIG.
  • the light source device 1 may include a plurality of semiconductor laser chips 5.
  • each semiconductor laser chip 5 may be casing with the same casing material.
  • FIG. 13A is a schematic perspective view of the light source device 1 in which a plurality of semiconductor laser chips 5 are casing with the same casing material 31 (hereinafter, may be referred to as “multi-casing material 31”).
  • the light source device of the present invention is also constituted by the multi-casing member 31, and can be used as a light source for a projector or the like.
  • FIG. 13A schematically shows an example.
  • the semiconductor laser chip 5 is arranged in an arrangement area that is individually partitioned in the multi-casing material 31.
  • illustration of the refractive optical system (2, 3) is omitted for convenience of explanation.
  • the window of the multi-casing member 31 may be constituted by the first refractive optical system 2 and the second refractive optical system 3. 12A to 12D, the first refracting optical system 2 and the second refracting optical system 3 may be constituted by a combined refracting optical system 4 which is shared.
  • the plurality of semiconductor laser chips 5 and the refractive optical system (2, 3) are constituted by one casing material, the number of optical systems arranged outside can be reduced, and a voltage is applied to each semiconductor laser chip 5.
  • the electrodes for applying the voltage can be shared, which contributes to a reduction in the size of the device. There is no particular limitation on the number of semiconductor laser chips 5 accommodated in the same multi-casing material 31 and the arrangement method of each semiconductor laser chip 5.
  • FIG. 13B is a drawing showing the multi-casing material 31 shown in FIG. 13A together with the refractive optical system (2, 3) arranged at the subsequent stage.
  • a plurality of semiconductor laser chips are individually divided by one casing material and are casing.
  • the light source device 1 shown in FIG. 13B is configured by arranging a plurality of semiconductor laser chips 5 in a multi-casing material 31 and arranging a first refractive optical system 2 and a second refractive optical system 3 outside the multi-casing material 31. Have been.
  • FIG. 14A is another perspective view of a light source device in which a plurality of semiconductor laser chips 5 are casing with the same casing material.
  • the semiconductor laser chips 5 are arranged in the multi-casing member 32 without being separated.
  • FIG. 14A omits illustration of the refractive optical system (2, 3) for the sake of explanation, similarly to FIG. 13A.
  • FIG. 14B is a drawing showing the multi-casing material 32 shown in FIG. 14A together with the refractive optical system (2, 3) arranged at the subsequent stage.
  • the light source device 1 shown in FIG. 14B has a plurality of semiconductor laser chips 5 arranged in a multi-casing material 32, and a first refracting optical system 2 and a second refracting optical system outside the multi-casing material 32 separated by a window 32 a.
  • the system 3 is arranged.
  • FIG. 14C is a drawing schematically showing another configuration example of the light source device in which a plurality of semiconductor laser chips are casing in the same space of one casing material. As shown in FIG. 14C, a plurality of first refractive optical systems 2 may be combined to form the optical member 33.
  • FIG. 14D is a drawing schematically showing another configuration example of a light source device in which a plurality of semiconductor laser chips are casing in the same space of one casing material. As shown in FIG. 14D, even if the plurality of first refractive optical systems 2 are combined to form one optical member 33, and the optical member 33 further configures the window 32 b of the multi-casing material 32. I do not care.
  • the exit surface side of the optical member 33 in FIG. 14D and the entrance surface side of the second refraction optical system may be in contact or shared to constitute one optical member.
  • FIG. 15 is a drawing schematically showing a configuration example of a projector including the light source device 1 described above.
  • the projector 9 includes an illumination optical system 70 including the light source device 1, and a spectral / projection optical system 80 that splits light guided from the illumination optical system 70 and then projects the split light on a screen 90.
  • the light source device 1 is a red light source. That is, the illumination optical system 70 includes the light source device 1 as a red light source, a blue light source 71, a fluorescent light source 72 that receives blue light emitted from the blue light source 71 to generate fluorescence, and a diffuse reflection optical system 73. , A dichroic mirror (74, 75), an integrator optical system 50, a combining optical system 76, and a quarter-wave plate 77.
  • the red light R having a high light density emitted from the light source device 1 is reflected by the dichroic mirror 74 and then guided to the integrator optical system 50. Further, the blue light B emitted from the blue light source 71 is separated into light reflected by the dichroic mirror 75 and light transmitted therethrough according to the polarization.
  • the dichroic mirror 75 may include a polarization separation element that can control the traveling direction of light depending on the polarization direction.
  • the blue light of a certain polarization direction reflected by the dichroic mirror 75 is guided to the fluorescent light source 72 and used as excitation light of the phosphor contained in the fluorescent light source 72, and the obtained fluorescent light is used as the dichroic mirror (75, 74). And is guided to the integrator optical system 50.
  • the blue light of another polarization direction that has passed through the dichroic mirror 75 passes through the quarter-wave plate 77 and then enters the diffuse reflection optical system 73.
  • the light passes through the ⁇ wavelength plate 77 and is guided to the dichroic mirror 75. This light is reflected by the dichroic mirror 75, passes through the dichroic mirror 74, and is guided to the integrator optical system 50.
  • the light of each color is combined with the white light by the combining optical system 76 after the illuminance distribution is made uniform.
  • the combining optical system 76 may include a polarization conversion element that makes the polarization direction uniform.
  • the white light that has passed through the combining optical system 76 is guided to the spectral / projection optical system 80.
  • the light of each color that has been color-separated by each dichroic mirror (81a, 81b, 81c) included in the spectral / projection optical system 80 is appropriately adjusted via mirrors (81d, 81e), and then adjusted for each color.
  • the light is incident on the modulators (82R, 82G, 82B).
  • the modulators (82R, 82G, 82B) modulate each color light in accordance with the image information and output to the color combining optical system 83.
  • the color synthesizing optical system 83 synthesizes light corresponding to the image information and makes the light enter the projection optical system 84.
  • the projection optical system 84 projects light according to the image information on the screen 90.
  • the light source device 1 of the present embodiment is used as a light source that generates red light, but may be a light source that generates blue light.
  • a light source device 1 that generates blue light and a fluorescent light source that emits blue light emitted from the light source device 1 as excitation light to generate fluorescence are provided. May be combined to generate white light.
  • the projector 9 may be configured to generate light of each color of R, G, and B by the light source device 1 of the present embodiment, and to combine them by the combining optical system 76. That is, the light source device 1 may include the semiconductor laser chip 5 that generates blue light, the semiconductor laser chip 5 that generates red light, and the semiconductor laser chip 5 that generates green light. In this case, the light of each color emitted from each light source device 1 may be propagated through a light guide member such as an optical fiber and may be incident on the modulation device (82R, 82G, 82B) of each color.
  • a light guide member such as an optical fiber
  • the projector 9 shown in FIG. 15 is illustrated assuming that the modulators (82R, 82G, and 82B) are configured by transmissive liquid crystal elements. However, the projector 9 shown in FIG. : Digital Micromirror Device (registered trademark) may be used.
  • the spectral / projection optical system 80 is appropriately set according to the configuration of the modulation device.
  • the semiconductor laser chip 5 described above with reference to FIG. 5 and the like has a multi-emitter type configuration having two light emitting regions (10, 20).
  • the number of light emitting regions provided in the semiconductor laser chip 5 is not limited to two, and may be three or more.
  • the number of flat surfaces (2a, 2b, ....) having different inclination angles provided in the first refraction optical system 2 is set according to the number of light emission areas.
  • each semiconductor laser chip 5 has a single-emitter type configuration having a single light emitting region, and the emitted light from the plurality of semiconductor laser chips 5 A configuration in which the light enters the one-refractive optical system 2 may be used. Further, in a mode in which light emitted from the plurality of semiconductor laser chips 5 is incident on the first refractive optical system 2, each semiconductor laser chip 5 may have a multi-emitter type structure.
  • the first refractive optical system 2 only needs to be provided corresponding to each semiconductor laser chip 5, and even if the first refractive optical system 2 itself is provided individually, it is integrally formed in an array. No problem.
  • the light source device 1 according to the present invention can be applied to other than a projector as long as it is an application that collects a plurality of light beams and irradiates a predetermined irradiation target.
  • the light source device 1 can be used as a light source for an exposure apparatus.
  • ⁇ 4 >>>
  • the optical arrangement mode provided in the light source device 1 described above is merely an example, and the present invention is not limited to the illustrated configurations.
  • a reflection optical system for changing the traveling direction of light may be appropriately interposed between one optical system and another optical system.
  • Optical member 40 Rear optical system 50: Integrator optical system 60: Optical axis 70: Illumination optical system 71: Blue light source 72: Fluorescent light source 73: Diffuse reflection optics System 74, 75: Da Echroic mirror 76: Synthetic optical system 77: Wave plate 80: Spectral / projection optical system 81a, 81, 81c: Dichroic mirror 81d, 81e: Mirror 82B, 82G,

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Projection Apparatus (AREA)
  • Semiconductor Lasers (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Microscoopes, Condenser (AREA)
  • Lenses (AREA)

Abstract

L'invention concerne un dispositif de source de lumière qui utilise une pluralité de puces laser à semi-conducteur pour augmenter l'émission de lumière tout en réduisant au minimum l'augmentation de l'encombrement du dispositif. Le dispositif de source de lumière comprend : une pluralité de zones d'émission de lumière disposées sur une même puce laser à semi-conducteur ou sur des puces laser à semi-conducteur différentes ; un premier système optique de réfraction qui comprend une pluralité de surfaces plates inclinées à différents angles de telle sorte qu'au moins une partie de chacun d'une pluralité de premiers faisceaux émis à partir d'une pluralité de zones d'émission de lumière adjacentes tombe de façon incidente sur différentes surfaces plates, et les rayons principaux de chacun de la pluralité de premiers faisceaux sont convertis et émis sous la forme d'une pluralité de seconds faisceaux qui se déplacent de façon à se séparer mutuellement les uns des autres ; et un second système optique de réfraction qui reçoit la pluralité de seconds faisceaux émis par le premier système optique de réfraction et qui convertit la direction de déplacement des rayons principaux de chacun de la pluralité de seconds faisceaux en une direction sensiblement parallèle à l'axe optique tout en convertissant chacun de la pluralité de seconds faisceaux en des faisceaux sensiblement parallèles et en émettant le résultat.
PCT/JP2018/031544 2018-07-04 2018-08-27 Dispositif de source de lumière et projecteur WO2020008656A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018127850A JP6536724B1 (ja) 2018-07-04 2018-07-04 光源装置、プロジェクタ
JP2018-127850 2018-07-04

Publications (1)

Publication Number Publication Date
WO2020008656A1 true WO2020008656A1 (fr) 2020-01-09

Family

ID=66318557

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/031544 WO2020008656A1 (fr) 2018-07-04 2018-08-27 Dispositif de source de lumière et projecteur

Country Status (4)

Country Link
JP (1) JP6536724B1 (fr)
CN (1) CN208834083U (fr)
TW (1) TWI780211B (fr)
WO (1) WO2020008656A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021102254A1 (de) 2021-02-01 2022-08-04 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronische anordnung

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112567294B (zh) 2018-08-16 2023-02-17 索尼公司 光源装置和投影型显示装置
JP7314778B2 (ja) * 2019-11-25 2023-07-26 セイコーエプソン株式会社 光源装置およびプロジェクター
CN111985455A (zh) * 2020-09-08 2020-11-24 国网江西省电力有限公司电力科学研究院 一种光伏组件可见光故障模型的训练和识别方法及装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009103529A (ja) * 2007-10-22 2009-05-14 Denso Corp レーザビーム照射装置
JP2010140745A (ja) * 2008-12-11 2010-06-24 Canon Inc 照明装置、及び投射型画像表示装置
JP2015015305A (ja) * 2013-07-03 2015-01-22 浜松ホトニクス株式会社 レーザ装置
WO2017029874A1 (fr) * 2015-08-18 2017-02-23 アルプス電気株式会社 Dispositif émetteur de lumière
US20170252859A1 (en) * 2014-11-19 2017-09-07 Trumpf Laser- Und Systemtechnik Gmbh System for asymmetric optical beam shaping
US20180062342A1 (en) * 2016-08-30 2018-03-01 Corning Incorporated Laser cutting of materials with intensity mapping optical system

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003066369A (ja) * 2001-08-28 2003-03-05 Canon Inc 画像表示装置、画像表示装置の制御方法、画像処理システム
US7693206B2 (en) * 2003-05-09 2010-04-06 Hamamatsu Photonics K.K. Semiconductor laser device including laser array or stack first collimator, path rotator, and an optical element
TWM296531U (en) * 2006-01-02 2006-08-21 Sean & Stephen Corp Green laser module
JP6515514B2 (ja) * 2014-12-11 2019-05-22 セイコーエプソン株式会社 光源装置、照明装置およびプロジェクター
JP2017215570A (ja) * 2016-05-26 2017-12-07 セイコーエプソン株式会社 光源装置およびプロジェクター

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009103529A (ja) * 2007-10-22 2009-05-14 Denso Corp レーザビーム照射装置
JP2010140745A (ja) * 2008-12-11 2010-06-24 Canon Inc 照明装置、及び投射型画像表示装置
JP2015015305A (ja) * 2013-07-03 2015-01-22 浜松ホトニクス株式会社 レーザ装置
US20170252859A1 (en) * 2014-11-19 2017-09-07 Trumpf Laser- Und Systemtechnik Gmbh System for asymmetric optical beam shaping
WO2017029874A1 (fr) * 2015-08-18 2017-02-23 アルプス電気株式会社 Dispositif émetteur de lumière
US20180062342A1 (en) * 2016-08-30 2018-03-01 Corning Incorporated Laser cutting of materials with intensity mapping optical system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021102254A1 (de) 2021-02-01 2022-08-04 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronische anordnung

Also Published As

Publication number Publication date
CN208834083U (zh) 2019-05-07
JP2020009843A (ja) 2020-01-16
JP6536724B1 (ja) 2019-07-03
TWI780211B (zh) 2022-10-11
TW202006459A (zh) 2020-02-01

Similar Documents

Publication Publication Date Title
JP5673247B2 (ja) 光源装置及びプロジェクター
CN109557752B (zh) 光源系统及投影装置
US20170343891A1 (en) Light source apparatus and projector
WO2020008656A1 (fr) Dispositif de source de lumière et projecteur
TWI574098B (zh) 雷射投影光源
WO2014196020A1 (fr) Système optique d'éclairage et projecteur
JP2006309231A (ja) 照明ユニット及び方法、それを採用した画像投射装置及び方法
JP2003248270A (ja) 照射システム及びこれを備えたプロジェクションディスプレイ装置
JP6421930B2 (ja) 照明装置及び投写型映像表示装置
JP4420087B2 (ja) 照明装置及びプロジェクタ
US20100321596A1 (en) Projection optical system and projection display unit using the same
JP6611019B2 (ja) 光源装置、プロジェクタ
JP6881423B2 (ja) 光源装置およびプロジェクター
JPWO2005036255A1 (ja) 照明装置及びこれを備えたプロジェクタ
JP2019078947A (ja) 光源装置およびプロジェクター
WO2019230008A1 (fr) Dispositif de source de lumière et projecteur
JP2017053876A (ja) 投写型画像表示装置
CN210199482U (zh) 透镜模块及投影装置
US20070258050A1 (en) Laser projector
JPWO2005019928A1 (ja) 照明装置及びこれを備えたプロジェクタ
US20220357561A1 (en) Fly-eye lens group, light source device, and projection apparatus
TWI614563B (zh) 雷射投影機的光源系統
JP2021086135A (ja) 光源光学系、光源装置及び画像表示装置
US11143945B2 (en) Lens module and projection device
JP4872272B2 (ja) 照明装置及びプロジェクタ

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18925501

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18925501

Country of ref document: EP

Kind code of ref document: A1