WO2019205534A1 - 一种硅基太阳能电池板 - Google Patents

一种硅基太阳能电池板 Download PDF

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Publication number
WO2019205534A1
WO2019205534A1 PCT/CN2018/111693 CN2018111693W WO2019205534A1 WO 2019205534 A1 WO2019205534 A1 WO 2019205534A1 CN 2018111693 W CN2018111693 W CN 2018111693W WO 2019205534 A1 WO2019205534 A1 WO 2019205534A1
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Prior art keywords
layer
metal plate
thickness
silicon
thermally conductive
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PCT/CN2018/111693
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English (en)
French (fr)
Inventor
黄敏艳
Original Assignee
Huang Minyan
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Priority to US16/314,129 priority Critical patent/US20210226075A1/en
Publication of WO2019205534A1 publication Critical patent/WO2019205534A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H01L31/049—Protective back sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/052—Cooling means directly associated or integrated with the PV cell, e.g. integrated Peltier elements for active cooling or heat sinks directly associated with the PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the present application relates to the field of solar cell technology, and in particular to a silicon-based solar panel.
  • Existing silicon-based solar modules typically include a glass cover, a first EVA adhesive layer, a solar cell sheet layer, a second EVA adhesive layer, and a solar cell backsheet.
  • the existing solar cell backsheet has a TPT backsheet and a TPE backsheet.
  • the TPT backsheet is coated with a layer of 300 micron thick PET layer, and a PVF layer is adhered on both sides of the PET layer.
  • the TPT backsheet has excellent weather resistance; the TPE backsheet is coated with a layer of 300 micron thick PET layer, and the PVF layer is bonded on the lower surface of the PET layer and adhered on the upper surface of the PET layer.
  • the PE layer or the EVA layer is also provided, and the TPE back sheet also has excellent weather resistance.
  • the existing solar cell backplane has poor seismic performance, sealing performance and thermal conductivity, which causes the corresponding silicon-based solar component to be easily damaged, and the output power is likely to be degraded during long-term use.
  • the purpose of the present application is to overcome the deficiencies of the prior art described above and to provide a silicon-based solar panel.
  • the silicon-based solar panel includes:
  • a solar cell backsheet comprising a first metal plate, a first polyester film layer bonded to an upper surface of the first metal plate, the upper surface of the first polyester film layer being bonded a polyimide film having an upper surface provided with a first polyolefin bonding layer, a plurality of first columnar grooves arranged in an array, the first columnar grooves penetrating through the a first polyolefin bonding layer, the polyimide film, and the first polyester film layer and exposing an upper surface of the first metal plate, wherein each of the first columnar grooves is embedded with a heat conduction An elastic column, an upper end portion of the thermally conductive elastic column is exposed to the first polyolefin bonding layer, a bottom surface of the thermally conductive elastic column is in contact with the first metal plate, and a lower surface of the first metal plate is disposed a plurality of columnar protrusions arranged in an array;
  • a second metal plate wherein the upper surface of the second metal plate is provided with a plurality of second columnar grooves distributed in an array, the second columnar grooves are in one-to-one correspondence with the columnar protrusions, and each of the columnar protrusions The portion is embedded in the corresponding second cylindrical groove, the lower surface of the second metal plate is bonded with a second polyester film layer, and the lower surface of the second polyester film layer is bonded a polypropylene layer having a lower surface bonded with a fluorine-containing resin layer, a plurality of grooves arranged in an array, the grooves extending through the fluorine-containing resin layer, the polypropylene layer, and the second polymerization An ester film layer and exposing a lower surface of the second metal plate, each of the grooves being embedded with a metal block, a top surface of the metal block being in contact with a lower surface of the second metal plate, the metal a lower end portion of the block is exposed to the fluorine-containing resin layer;
  • thermally conductive encapsulant layer covering the solar cell backsheet, wherein the upper end portion of the thermally conductive elastic pillar exposed to the first polyolefin bonding layer is embedded in the first a thermally conductive encapsulant layer;
  • a plurality of silicon-based solar cells are disposed on the second encapsulant layer
  • a third encapsulant layer covering the silicon-based solar cell sheet
  • a tempered glass plate the tempered glass plate being disposed on the third encapsulant layer.
  • the first metal plate and the second metal plate are made of one of aluminum, copper, stainless steel and aluminum-magnesium alloy, and the first polyester film layer has a thickness of 2-4 mm.
  • the polyimide film has a thickness of from 1 to 1.5 mm, and the first polyolefin bonding layer has a thickness of from 100 to 150 ⁇ m.
  • the thermally conductive elastic column comprises a metal copper core, a side surface of the metal copper core is provided with a silicone rubber layer, and a surface of the silicone rubber layer is provided with a second polyolefin bonding layer, the metal copper core
  • the diameter is 5-10 mm
  • the silicone rubber layer has a thickness of 5-10 mm
  • the second polyolefin bonding layer has a thickness of 50-100 ⁇ m.
  • the columnar protrusions have a diameter of 2-5 mm, the adjacent columnar protrusions have a pitch of 4-8 mm, the columnar protrusions have a height of 0.4-0.8 mm, and the rubber buffer layer has a thickness of 300-700 microns, the columnar protrusions exposed to the portion of the rubber buffer layer have a height of 50-100 microns.
  • the second polyester film layer has a thickness of 1-3 mm
  • the polypropylene layer has a thickness of 0.5-1 mm
  • the fluororesin layer has a thickness of 100-200 ⁇ m
  • the metal block The material is aluminum or copper, and the length of the metal block exposed to the lower end portion of the fluorine-containing resin layer is 1-2 mm.
  • the first thermally conductive encapsulant layer comprises a polyolefin resin and a thermally conductive nanoparticle, the thermally conductive nanoparticle being one of alumina, aluminum nitride, boron nitride, silicon nitride, magnesium oxide,
  • the thermally conductive nanoparticles have a particle diameter of 100-200 nm, and the second encapsulant layer and the third encapsulant layer are made of polyolefin.
  • the first thermal conductive encapsulant layer has a thickness of 400-500 micrometers
  • the second encapsulant layer has a thickness of 50-100 micrometers
  • the third encapsulant layer has a thickness of 200-300 micrometers.
  • the upper end portion of the elastic column embedded in the first thermally conductive sealant layer has a length of 200 to 400 ⁇ m.
  • the fluorine-containing resin layer is made of polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinylidene fluoride, polyvinyl fluoride, ethylene-chlorotrifluoroethylene copolymer or ethylene-tetrafluoroethylene copolymer.
  • a first columnar groove is formed in the multilayer resin layer on the surface of the first metal plate, and a thermally conductive elastic column is embedded in each of the first columnar grooves to form
  • the plurality of thermally conductive elastic columns respectively form a plurality of heat dissipating passages, and the heat generated by the solar cell sheet can be quickly transmitted to the first metal plate, and a plurality of arrays are disposed on the lower surface of the first metal plate.
  • the solar cell back sheet has excellent seismic performance
  • a second polyester film layer, a polypropylene layer, and a fluorine-containing resin layer are disposed on the lower surface of the second metal plate, and a groove is formed to embed the metal block, so that the whole While the solar cell backsheet has excellent heat conduction formation, the presence of the first and second metal plates can effectively prevent moisture from intruding into the silicon-based solar panel.
  • the thermally conductive elastic column comprises a metal copper core, a silicone rubber layer and a second polyolefin bonding layer, so that the thermal conductive elastic column has excellent thermal conductivity while also having excellent cushioning and shock absorbing performance,
  • the design of the shock absorbing structure makes the solar cell chip not damage and break even if the single crystal silicon battery assembly collides.
  • the upper end of the thermal conductive elastic column is embedded in the first thermal conductive encapsulant layer, and the area of the thermal conductive elastic column and the first thermal conductive encapsulation layer is increased, thereby further improving the stability and thermal conductivity of the single crystal silicon battery assembly.
  • the surface of the package backsheet has a polyolefin bonding layer, and an ultra-thin second encapsulant layer is disposed between the first thermally conductive encapsulant layer and the silicon-based solar cell sheet layer, so that the entire panel is more easily bonded into one body.
  • the silicon-based solar panel of the present application has a thick overall thickness by optimizing the specific structure of the silicon-based solar panel of the present application and the specific size of each layer, and has excellent heat dissipation performance and seismic performance.
  • the water vapor barrier performance ensures that the photoelectric conversion efficiency of the silicon-based solar cell is not attenuated, ensuring stable output power and suitable for long-term use.
  • FIG. 1 is a schematic structural view of a silicon-based solar panel of the present application.
  • FIG. 2 is a top plan view of a solar cell backsheet of the present application.
  • Figure 3 is a bottom plan view of the first metal plate of the present application.
  • FIG. 4 is a bottom plan view of a solar cell backsheet of the present application.
  • FIG. 5 is a schematic structural view of a bottom surface of a thermally conductive elastic column of the present application.
  • the present application provides a silicon-based solar panel including: a solar cell backplane 1, the solar cell backplane 1 including a first metal panel 11,
  • the upper surface of the first metal plate 11 is bonded with a first polyester film layer 12, and the upper surface of the first polyester film layer 12 is bonded with a polyimide film 13, and the polyimide film 13
  • the upper surface is provided with a first polyolefin bonding layer 14, a plurality of first columnar grooves 15 arranged in an array, the first columnar grooves 15 penetrating the first polyolefin bonding layer 14, a polyimide film 13 and the first polyester film layer 12 and exposing the upper surface of the first metal plate 11, and each of the first column-shaped grooves 15 is embedded with a thermally conductive elastic column 2,
  • the upper end portion of the thermally conductive elastic column 2 is exposed to the first polyolefin bonding layer 14, the bottom surface of the thermally conductive elastic column 2 is in contact with the first metal plate 11, and the lower surface of the first metal plate
  • the upper surface of the second metal plate 3 is provided with a plurality of second columnar grooves 31 distributed in an array, and the second columnar grooves 31 are in one-to-one correspondence with the columnar protrusions 16
  • the portion of each of the columnar protrusions 16 is embedded in the corresponding second columnar groove 31, and the lower surface of the second metal plate 3 is bonded with a second polyester film layer 32
  • the lower surface of the second polyester film layer 32 is bonded with a polypropylene layer 33, and the lower surface of the polypropylene layer 33 is bonded with a fluorine-containing resin layer 34, and a plurality of grooves 35 arranged in an array, the grooves a groove 35 penetrating the fluorine-containing resin layer 34, the polypropylene layer 33, and the second polyester film layer 32 and exposing the lower surface of the second metal plate 3, and each of the grooves 35 is embedded with a metal block 4
  • the top surface of the metal block 4 is in contact with the lower surface of the second metal
  • a first thermally conductive encapsulant layer 5 covering the solar cell backsheet 1 , the bare thermal adhesive column 2 being exposed to the first polyolefin bonding layer 14
  • the upper end portion is embedded in the first heat conductive encapsulant layer 5;
  • the second encapsulant layer 6 covers the first heat conductive encapsulant layer 5; and the plurality of silicon based solar cells 7 are disposed.
  • the third encapsulant layer 8 covers the silicon-based solar cell sheet 7; a tempered glass panel 9, the tempered glass panel 9 is disposed in the Above the third encapsulant layer 8.
  • the first metal plate 11 and the second metal plate 3 are made of one of aluminum, copper, stainless steel and aluminum-magnesium alloy, and the first polyester film layer 12 has a thickness of 2-4.
  • the polyimide film 13 has a thickness of 1 to 1.5 mm, and the first polyolefin bonding layer 14 has a thickness of 100 to 150 ⁇ m.
  • the thermally conductive elastic column 2 comprises a metal copper core 21, the side surface of which is provided with a silicone rubber layer 22, and the surface of the silicone rubber layer 22 is provided with a second polyolefin bonding layer 23,
  • the metal copper core 21 has a diameter of 5-10 mm
  • the silicone rubber layer 22 has a thickness of 5-10 mm
  • the second polyolefin bonding layer 23 has a thickness of 50-100 ⁇ m.
  • the columnar protrusions 16 have a diameter of 2-5 mm, the adjacent columnar protrusions 16 have a pitch of 4-8 mm, and the columnar protrusions 16 have a height of 0.4-0.8 mm, the rubber buffer layer.
  • the thickness of 17 is 300-700 ⁇ m, and the height of the portion of the columnar protrusion 16 exposed to the rubber buffer layer 17 is 50-100 ⁇ m.
  • the second polyester film layer 32 has a thickness of 1-3 mm
  • the polypropylene layer 33 has a thickness of 0.5-1 mm
  • the fluorine-containing resin layer 34 has a thickness of 100-200 ⁇ m.
  • the material of the metal block 4 is aluminum or copper, and the length of the metal block 4 exposed to the lower end portion of the fluorine-containing resin layer 34 is 1-2 mm.
  • the first thermally conductive encapsulant layer 5 comprises a polyolefin resin and a thermally conductive nanoparticle
  • the thermally conductive nanoparticle is one of alumina, aluminum nitride, boron nitride, silicon nitride, and magnesium oxide.
  • the thermally conductive nanoparticles have a particle diameter of 100-200 nm
  • the second encapsulant layer 6 and the third encapsulant layer 8 are made of polyolefin.
  • the first thermally conductive encapsulant layer 5 has a thickness of 400-500 microns
  • the second encapsulant layer 6 has a thickness of 50-100 microns
  • the third encapsulant layer 8 has a thickness of 200-300 microns.
  • the length of the upper end portion of the thermally conductive elastic column 2 embedded in the first thermally conductive sealant layer 5 is 200-400 microns.
  • the fluorine-containing resin layer 34 is made of polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinylidene fluoride, polyvinyl fluoride, ethylene-chlorotrifluoroethylene copolymer or ethylene-tetrafluoroethylene copolymer.
  • the present application provides a silicon-based solar panel including: a solar cell backplane 1, the solar cell backplane 1 including a first metal panel 11,
  • the upper surface of the first metal plate 11 is bonded with a first polyester film layer 12, and the upper surface of the first polyester film layer 12 is bonded with a polyimide film 13, and the polyimide film 13
  • the upper surface is provided with a first polyolefin bonding layer 14, a plurality of first columnar grooves 15 arranged in an array, the first columnar grooves 15 penetrating the first polyolefin bonding layer 14, a polyimide film 13 and the first polyester film layer 12 and exposing the upper surface of the first metal plate 11, and each of the first column-shaped grooves 15 is embedded with a thermally conductive elastic column 2,
  • the upper end portion of the thermally conductive elastic column 2 is exposed to the first polyolefin bonding layer 14, the bottom surface of the thermally conductive elastic column 2 is in contact with the first metal plate 11, and the lower surface of the first metal plate
  • the upper surface of the second metal plate 3 is provided with a plurality of second columnar grooves 31 distributed in an array, and the second columnar grooves 31 are in one-to-one correspondence with the columnar protrusions 16
  • the portion of each of the columnar protrusions 16 is embedded in the corresponding second columnar groove 31, and the lower surface of the second metal plate 3 is bonded with a second polyester film layer 32
  • the lower surface of the second polyester film layer 32 is bonded with a polypropylene layer 33, and the lower surface of the polypropylene layer 33 is bonded with a fluorine-containing resin layer 34, and a plurality of grooves 35 arranged in an array, the grooves a groove 35 penetrating the fluorine-containing resin layer 34, the polypropylene layer 33, and the second polyester film layer 32 and exposing the lower surface of the second metal plate 3, and each of the grooves 35 is embedded with a metal block 4
  • the top surface of the metal block 4 is in contact with the lower surface of the second metal
  • a first thermally conductive encapsulant layer 5 covering the solar cell backsheet 1 , the bare thermal adhesive column 2 being exposed to the first polyolefin bonding layer 14
  • the upper end portion is embedded in the first heat conductive encapsulant layer 5;
  • the second encapsulant layer 6 covers the first heat conductive encapsulant layer 5; and the plurality of silicon based solar cells 7 are disposed.
  • the third encapsulant layer 8 covers the silicon-based solar cell sheet 7; a tempered glass panel 9, the tempered glass panel 9 is disposed in the Above the third encapsulant layer 8.
  • the material of the first metal plate 11 and the second metal plate 3 is aluminum, the thickness of the first polyester film layer 12 is 3 mm, and the thickness of the polyimide film 13 is 1.2 mm.
  • the first polyolefin bonding layer 14 has a thickness of 120 microns.
  • the thermally conductive elastic column 2 includes a metal copper core 21, and a side surface of the metal copper core 21 is provided with a silicone rubber layer 22, and a surface of the silicone rubber layer 22 is provided with a second polyolefin bonding layer 23, the metal
  • the copper core 21 has a diameter of 7 mm
  • the silicone rubber layer 22 has a thickness of 7 mm
  • the second polyolefin adhesive layer 23 has a thickness of 80 ⁇ m.
  • the columnar protrusions 16 have a diameter of 4 mm, the adjacent columnar protrusions 16 have a pitch of 6 mm, the columnar protrusions 16 have a height of 0.6 mm, and the rubber buffer layer 17 has a thickness of 500 ⁇ m.
  • the height of the portion of the columnar protrusion 16 exposed to the rubber buffer layer 17 is 100 ⁇ m.
  • the second polyester film layer 32 has a thickness of 2 mm
  • the polypropylene layer 33 has a thickness of 0.8 mm
  • the fluorine-containing resin layer 34 has a thickness of 150 ⁇ m
  • the metal block 4 is made of aluminum.
  • the length of the metal block 4 exposed to the lower end portion of the fluorine-containing resin layer 34 was 1.5 mm.
  • the first thermally conductive encapsulant layer 5 comprises a polyolefin resin and thermally conductive nanoparticles, the thermally conductive nanoparticles are alumina, the thermally conductive nanoparticles have a particle size of 150 nm, the second encapsulant layer 6 and the The material of the third encapsulant layer 8 is polyolefin.
  • the thickness of the first thermal conductive encapsulant layer 5 is 450 micrometers
  • the thickness of the second encapsulating adhesive layer 6 is 90 micrometers
  • the thickness of the third encapsulating adhesive layer 8 is 220 micrometers
  • the thermal conductive elastic column 2 is embedded in the
  • the upper end portion of the first thermally conductive encapsulant layer 5 has a length of 350 ⁇ m.
  • the material of the fluorine-containing resin layer 34 is polytetrafluoroethylene.
  • This embodiment provides another silicon-based solar panel, which is different from the first embodiment in that the first metal plate 11 and the second metal plate 3 are made of copper, and the first polyester
  • the film layer 12 has a thickness of 4 mm
  • the polyimide film 13 has a thickness of 1 mm
  • the first polyolefin bonding layer 14 has a thickness of 150 ⁇ m.
  • the metal copper core 21 has a diameter of 10 mm
  • the silicone rubber layer 22 has a thickness of 10 mm
  • the second polyolefin bonding layer 23 has a thickness of 100 ⁇ m.
  • the columnar protrusions 16 have a diameter of 5 mm, the adjacent columnar protrusions 16 have a pitch of 8 mm, the columnar protrusions 16 have a height of 0.7 mm, and the rubber buffer layer 17 has a thickness of 630 ⁇ m.
  • the height of the portion of the columnar protrusion 16 exposed to the rubber buffer layer 17 is 70 ⁇ m.
  • the thickness of the second polyester film layer 32 is 1 mm
  • the thickness of the polypropylene layer 33 is 1 mm
  • the thickness of the fluorine-containing resin layer 34 is 200 ⁇ m
  • the material of the metal block 4 is copper.
  • the length of the metal block 4 exposed to the lower end portion of the fluorine-containing resin layer 34 is 2 mm.
  • the thermally conductive nanoparticle in the first thermally conductive encapsulant layer 5 is magnesium oxide, the thermally conductive nanoparticle has a particle diameter of 200 nm, and the first thermally conductive encapsulant layer 5 has a thickness of 500 micrometers, and the second encapsulant layer
  • the thickness of 6 is 100 micrometers
  • the thickness of the third encapsulant layer 8 is 200 micrometers
  • the length of the upper end portion of the thermally conductive elastic pillar 2 embedded in the first thermal conductive encapsulant layer 5 is 400 micrometers.
  • the material of the fluorine-containing resin layer 34 is polyvinylidene fluoride.
  • This embodiment provides another silicon-based solar panel, which is different from the first embodiment in that the first metal plate 11 and the second metal plate 3 are made of aluminum-magnesium alloy, the first The polyester film layer 12 has a thickness of 2 mm, the polyimide film 13 has a thickness of 1.5 mm, and the first polyolefin bonding layer 14 has a thickness of 100 ⁇ m.
  • the metal copper core 21 has a diameter of 5 mm, the silicone rubber layer 22 has a thickness of 5 mm, and the second polyolefin adhesive layer 23 has a thickness of 50 ⁇ m.
  • the columnar protrusions 16 have a diameter of 2 mm, the adjacent columnar protrusions 16 have a pitch of 4 mm, the columnar protrusions 16 have a height of 0.4 mm, and the rubber buffer layer 17 has a thickness of 350 ⁇ m.
  • the height of the portion of the columnar protrusion 16 exposed to the rubber buffer layer 17 is 50 ⁇ m.
  • the second polyester film layer 32 has a thickness of 3 mm
  • the polypropylene layer 33 has a thickness of 0.5 mm
  • the fluorine-containing resin layer 34 has a thickness of 100 ⁇ m
  • the metal block 4 is made of copper.
  • the length of the metal block 4 exposed to the lower end portion of the fluorine-containing resin layer 34 is 1 mm.
  • the thermally conductive nanoparticle in the first thermally conductive encapsulant layer 5 is silicon nitride
  • the thermally conductive nanoparticle has a particle diameter of 100 nm
  • the first thermally conductive encapsulant layer 5 has a thickness of 400 micrometers.
  • the thickness of the layer 6 is 50 micrometers
  • the thickness of the third encapsulant layer 8 is 300 micrometers
  • the length of the upper end portion of the thermally conductive elastic pillar 2 embedded in the first thermal conductive encapsulant layer 5 is 250 micrometers.
  • the material of the fluorine-containing resin layer 34 is an ethylene-tetrafluoroethylene copolymer.

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Abstract

本申请提供一种硅基太阳能电池板，所述硅基太阳能电池板包括太阳能电池背板、第一导热封装胶层、第二封装胶层、多个硅基太阳能电池片、第三封装胶层以及钢化玻璃板，在第一金属板上表面的多层树脂层中形成第一柱状凹槽，每个所述第一柱状凹槽中均嵌入一个导热弹性柱，且在第一金属板的下表面设置有多个呈阵列排布的柱状凸起，所述柱状凸起的一部分嵌入到第二金属板的第二柱状凹槽中，第一金属板与第二金属板之间设置有橡胶缓冲层，在第二金属板的下表面形成有沟槽以嵌入金属块。本发明的电池板具有优异的散热性能、抗震性能以及水汽阻隔性能。

Description

一种硅基太阳能电池板 技术领域
本申请涉及太阳能电池技术领域，特别是涉及一种硅基太阳能电池板。
背景技术
随着科技的发展和进步，对能源的需求也急剧增加，其中常用的能源来自化石能源石油、煤炭和天然气。由于石化能源总储藏量有限，且为不可再生能源，因而全球面临着严峻的能源形势，使得人们对风能、地热、太阳能等新兴可再生能源的探索日益迫切。其中，太阳能作为一种取之不尽，用之不竭的绿色可再生能源逐渐受到人们的广泛关注，太阳能电池相关技术也日益蓬勃发展。在现有的各类太阳能电池中，硅基太阳能电池由于效率高、制造工艺成熟而得到广泛的应用。现有的硅基太阳能组件通常包括玻璃盖板、第一EVA胶层、太阳能电池片层、第二EVA胶层以及太阳能电池背板。现有的太阳能电池背板有TPT背板和TPE背板，所述TPT背板是由一层300微米厚的PET层双面涂布胶黏剂后，在PET层的两面分别粘贴PVF层，该TPT背板具有优异的耐候性能；TPE背板是由一层300微米厚的PET层双面涂布黏结剂后，在PET层的下表面粘结PVF层，且在PET层的上表面粘结PE层或EVA层，该TPE背板同样具有优异的耐候性能。然而现有的太阳能电池背板抗震性能、密封性能以及导热性能均较差，导致相应的硅基太阳能组件容易被撞坏，且在长期使用过程中容易导致输出功率下降。
发明内容
本申请的目的是克服上述现有技术的不足，提供一种硅基太阳能电池板。
为实现上述目的，本申请提出的一种硅基太阳能电池板，所述硅基太阳能电池板包括：
太阳能电池背板，所述太阳能电池背板包括第一金属板，在所述第一金属板的上表面粘结有第一聚酯薄膜层，所述第一聚酯薄膜层的上表面粘结有聚酰亚胺薄膜，所述聚酰亚胺薄膜的上表面设置有第一聚烯烃粘结层，多个呈阵列排布的第一柱状凹槽，所述第一柱状凹槽贯穿所述第一聚烯烃粘结层、所述聚酰亚胺薄膜以及所述第一聚酯薄膜层并暴露所述第一金属板的上表面，每个所述第一柱状凹槽中均嵌入一个导热弹性柱，所述导热弹性柱的上端部裸露于所述第一聚烯烃粘结层，所述导热弹性柱的底面与所述第一金属板接触，所述第一金属板的下表面设置有多个呈阵列排布的柱状凸起；
橡胶缓冲层，所述橡胶缓冲层覆盖所述第一金属板的下表面，每个所述柱状凸起的一部分裸露于所述橡胶缓冲层；
第二金属板，所述第二金属板的上表面设置多个呈阵列分布的第二柱状凹槽，所述第二柱状凹槽与所述柱状凸起一一对应，每个所述柱状凸起的所述一部分嵌入到相应的所述第二柱状凹槽中，所述第二金属板的下表面粘结有第二聚酯薄膜层，所述第二聚酯薄膜层的下表面粘结有聚丙烯层，所述聚丙烯层的下表面粘结有含氟树脂层，多个呈阵列排布的沟槽，所述沟槽贯穿所述含氟树脂层、聚丙烯层以及第二聚酯薄膜层并暴露所述第二金属板的下表面，每个所述沟槽中均嵌入一个金属块，所述金属块的顶表面与所述第二金属板的下表面接触，所述金属块的下端部裸露于所述含氟树脂层；
第一导热封装胶层，所述第一导热封装胶层覆盖所述太阳能电池背板，所述导热弹性柱中裸露于所述第一聚烯烃粘结层的所述上端部嵌入到所述第一导热封装胶层中；
第二封装胶层，所述第二封装胶层覆盖所述第一导热封装胶层；
多个硅基太阳能电池片设置于所述第二封装胶层上；
第三封装胶层，所述第三封装胶层覆盖所述硅基太阳能电池片；
钢化玻璃板，所述钢化玻璃板设置于所述第三封装胶层之上。
作为优选，所述第一金属板和所述第二金属板的材质为铝、铜、不锈钢以及铝镁合金中的一种，所述第一聚酯薄膜层的厚度为2-4毫米，所述聚酰亚胺薄膜的厚度为1-1.5毫米，所述第一聚烯烃粘结层的厚度为100-150微米。
作为优选，所述导热弹性柱包括金属铜芯，所述金属铜芯的侧表面设置有硅橡胶层，所述硅橡胶层的表面设置有第二聚烯烃粘结层，所述金属铜芯的直径为5-10毫米，所述硅橡胶层的厚度为5-10毫米，所述第二聚烯烃粘结层的厚度为50-100微米。
作为优选，所述柱状凸起的直径为2-5毫米，相邻柱状凸起的间距为4-8毫米，所述柱状凸起的高度为0.4-0.8毫米，所述橡胶缓冲层的厚度为300-700微米，所述柱状凸起裸露于所述橡胶缓冲层的所述一部分的高度为50-100微米。
作为优选，所述第二聚酯薄膜层的厚度为1-3毫米，所述聚丙烯层的厚度为0.5-1毫米，所述含氟树脂层厚度为100-200微米，所述金属块的材质为铝或铜，所述金属块裸露于所述含氟树脂层的所述下端部的长度为1-2毫米。
作为优选，所述第一导热封装胶层包括聚烯烃树脂以及导热纳米颗粒，所述导热纳米颗粒为氧化铝、氮化铝、氮化硼、氮化硅、氧化镁中的一种，所述导热纳米颗粒的粒径为100-200纳米，所述第二封装胶层和所述第三封装胶层的材质为聚烯烃。
作为优选，第一导热封装胶层的厚度为400-500微米，所述第二封装胶层的厚度为50-100微米，所述第三封装胶层的厚度为200-300微米，所述导热弹性柱嵌入到所述第一导热封装胶层中的所述上端部的长度为200-400微米。
作为优选，所述含氟树脂层的材质为聚四氟乙烯、聚三氟氯乙烯、聚 偏氟乙烯、聚氟乙烯、乙烯-三氟氯乙烯共聚物或乙烯-四氟乙烯共聚物。
与现有技术相比，本申请的有益效果在于:
本申请的硅基太阳能电池板中，在第一金属板上表面的多层树脂层中形成第一柱状凹槽，每个所述第一柱状凹槽中均嵌入一个导热弹性柱，使得在形成较厚的背板中，多个导热弹性柱分别形成多条散热通路，可以将太阳能电池片产生的热量快速传导至第一金属板，且在第一金属板的下表面设置有多个呈阵列排布的柱状凸起，所述柱状凸起的一部分嵌入到第二金属板的第二柱状凹槽中，第一金属板与第二金属板之间设置有橡胶缓冲层，方便传热的同时，且使得该太阳能电池背板具有优异的抗震性能，在第二金属板的下表面设置第二聚酯薄膜层、聚丙烯层以及含氟树脂层，并形成沟槽以嵌入金属块，使得整个太阳能电池背板具有优异导热形成的同时，第一、第二金属板的存在可以有效防止水汽侵入硅基太阳能电池板。通过优化导热弹性柱的结构，所述导热弹性柱包括金属铜芯、硅橡胶层以及第二聚烯烃粘结层，使得导热弹性柱具有优异的导热性能同时还具有优异的缓冲减震性能，双重减震结构的设计使得单晶硅电池组件即使发生碰撞，太阳能电池片也不会损坏破碎。导热弹性柱的上端嵌入到第一导热封装胶层，增加导热弹性柱和第一导热封装层的面积，进一步提高单晶硅电池组件的稳固性和导热性能。封装背板的表面具有聚烯烃粘结层，且在第一导热封装胶层与硅基太阳能电池片层之间具有一超薄的第二封装胶层，使得整个电池板更易粘结为一体。与现有的电池板相比，通过优化本申请的硅基太阳能电池板的具体结构以及各层的具体尺寸，使得本申请的硅基太阳能电池板整体较厚，具有优异的散热性能、抗震性能以及水汽阻隔性能，确保硅基太阳能电池片的光电转换效率不衰减，确保其输出功率稳定，适于长期使用。
附图说明
图1为本申请的硅基太阳能电池板的结构示意图。
图2为本申请的太阳能电池背板的俯视图。
图3为本申请的第一金属板的仰视图。
图4为本申请的太阳能电池背板的仰视图。
图5为本申请的导热弹性柱的底面的结构示意图。
具体实施方式
如图1-5所示，本申请提出一种硅基太阳能电池板，所述硅基太阳能电池板包括：太阳能电池背板1，所述太阳能电池背板1包括第一金属板11，在所述第一金属板11的上表面粘结有第一聚酯薄膜层12，所述第一聚酯薄膜层12的上表面粘结有聚酰亚胺薄膜13，所述聚酰亚胺薄膜13的上表面设置有第一聚烯烃粘结层14，多个呈阵列排布的第一柱状凹槽15，所述第一柱状凹槽15贯穿所述第一聚烯烃粘结层14、所述聚酰亚胺薄膜13以及所述第一聚酯薄膜层12并暴露所述第一金属板11的上表面，每个所述第一柱状凹槽15中均嵌入一个导热弹性柱2，所述导热弹性柱2的上端部裸露于所述第一聚烯烃粘结层14，所述导热弹性柱2的底面与所述第一金属板11接触，所述第一金属板11的下表面设置有多个呈阵列排布的柱状凸起16；橡胶缓冲层17，所述橡胶缓冲层17覆盖所述第一金属板11的下表面，每个所述柱状凸起16的一部分裸露于所述橡胶缓冲层17。
还包括第二金属板3，所述第二金属板3的上表面设置多个呈阵列分布的第二柱状凹槽31，所述第二柱状凹槽31与所述柱状凸起16一一对应，每个所述柱状凸起16的所述一部分嵌入到相应的所述第二柱状凹槽31中，所述第二金属板3的下表面粘结有第二聚酯薄膜层32，所述第二聚酯薄膜层32的下表面粘结有聚丙烯层33，所述聚丙烯层33的下表面粘结有含氟树脂层34，多个呈阵列排布的沟槽35，所述沟槽35贯穿所述含氟树脂层34、聚丙烯层33以及第二聚酯薄膜层32并暴露所述第二金属板3的下表面，每个所述沟槽35中均嵌入一个金属块4，所述金属块4的顶表面与所述第二金属板3的下表面接触，所述金属块4的下端部裸露于所述含氟树 脂层34。
此外，第一导热封装胶层5，所述第一导热封装胶层5覆盖所述太阳能电池背板1，所述导热弹性柱2中裸露于所述第一聚烯烃粘结层14的所述上端部嵌入到所述第一导热封装胶层5中；第二封装胶层6，所述第二封装胶层6覆盖所述第一导热封装胶层5；多个硅基太阳能电池片7设置于所述第二封装胶层6上；第三封装胶层8，所述第三封装胶层8覆盖所述硅基太阳能电池片7；钢化玻璃板9，所述钢化玻璃板9设置于所述第三封装胶层8之上。
优选的，所述第一金属板11和所述第二金属板3的材质为铝、铜、不锈钢以及铝镁合金中的一种，所述第一聚酯薄膜层12的厚度为2-4毫米，所述聚酰亚胺薄膜13的厚度为1-1.5毫米，所述第一聚烯烃粘结层14的厚度为100-150微米。
优选的，所述导热弹性柱2包括金属铜芯21，所述金属铜芯21的侧表面设置有硅橡胶层22，所述硅橡胶层22的表面设置有第二聚烯烃粘结层23，所述金属铜芯21的直径为5-10毫米，所述硅橡胶层22的厚度为5-10毫米，所述第二聚烯烃粘结层23的厚度为50-100微米。
优选的，所述柱状凸起16的直径为2-5毫米，相邻柱状凸起16的间距为4-8毫米，所述柱状凸起16的高度为0.4-0.8毫米，所述橡胶缓冲层17的厚度为300-700微米，所述柱状凸起16裸露于所述橡胶缓冲层17的所述一部分的高度为50-100微米。
优选的，所述第二聚酯薄膜层32的厚度为1-3毫米，所述聚丙烯层33的厚度为0.5-1毫米，所述含氟树脂层34厚度为100-200微米，所述金属块4的材质为铝或铜，所述金属块4裸露于所述含氟树脂层34的所述下端部的长度为1-2毫米。
优选的，所述第一导热封装胶层5包括聚烯烃树脂以及导热纳米颗粒，所述导热纳米颗粒为氧化铝、氮化铝、氮化硼、氮化硅、氧化镁中的一种， 所述导热纳米颗粒的粒径为100-200纳米，所述第二封装胶层6和所述第三封装胶层8的材质为聚烯烃。
优选的，第一导热封装胶层5的厚度为400-500微米，所述第二封装胶层6的厚度为50-100微米，所述第三封装胶层8的厚度为200-300微米，所述导热弹性柱2嵌入到所述第一导热封装胶层5中的所述上端部的长度为200-400微米。
优选的，所述含氟树脂层34的材质为聚四氟乙烯、聚三氟氯乙烯、聚偏氟乙烯、聚氟乙烯、乙烯-三氟氯乙烯共聚物或乙烯-四氟乙烯共聚物。
实施例1
如图1-5所示，本申请提出一种硅基太阳能电池板，所述硅基太阳能电池板包括：太阳能电池背板1，所述太阳能电池背板1包括第一金属板11，在所述第一金属板11的上表面粘结有第一聚酯薄膜层12，所述第一聚酯薄膜层12的上表面粘结有聚酰亚胺薄膜13，所述聚酰亚胺薄膜13的上表面设置有第一聚烯烃粘结层14，多个呈阵列排布的第一柱状凹槽15，所述第一柱状凹槽15贯穿所述第一聚烯烃粘结层14、所述聚酰亚胺薄膜13以及所述第一聚酯薄膜层12并暴露所述第一金属板11的上表面，每个所述第一柱状凹槽15中均嵌入一个导热弹性柱2，所述导热弹性柱2的上端部裸露于所述第一聚烯烃粘结层14，所述导热弹性柱2的底面与所述第一金属板11接触，所述第一金属板11的下表面设置有多个呈阵列排布的柱状凸起16；橡胶缓冲层17，所述橡胶缓冲层17覆盖所述第一金属板11的下表面，每个所述柱状凸起16的一部分裸露于所述橡胶缓冲层17。
还包括第二金属板3，所述第二金属板3的上表面设置多个呈阵列分布的第二柱状凹槽31，所述第二柱状凹槽31与所述柱状凸起16一一对应，每个所述柱状凸起16的所述一部分嵌入到相应的所述第二柱状凹槽31中，所述第二金属板3的下表面粘结有第二聚酯薄膜层32，所述第二聚酯薄膜层32的下表面粘结有聚丙烯层33，所述聚丙烯层33的下表面粘结有含氟 树脂层34，多个呈阵列排布的沟槽35，所述沟槽35贯穿所述含氟树脂层34、聚丙烯层33以及第二聚酯薄膜层32并暴露所述第二金属板3的下表面，每个所述沟槽35中均嵌入一个金属块4，所述金属块4的顶表面与所述第二金属板3的下表面接触，所述金属块4的下端部裸露于所述含氟树脂层34。
此外，第一导热封装胶层5，所述第一导热封装胶层5覆盖所述太阳能电池背板1，所述导热弹性柱2中裸露于所述第一聚烯烃粘结层14的所述上端部嵌入到所述第一导热封装胶层5中；第二封装胶层6，所述第二封装胶层6覆盖所述第一导热封装胶层5；多个硅基太阳能电池片7设置于所述第二封装胶层6上；第三封装胶层8，所述第三封装胶层8覆盖所述硅基太阳能电池片7；钢化玻璃板9，所述钢化玻璃板9设置于所述第三封装胶层8之上。
其中，所述第一金属板11和所述第二金属板3的材质为铝，所述第一聚酯薄膜层12的厚度为3毫米，所述聚酰亚胺薄膜13的厚度为1.2毫米，所述第一聚烯烃粘结层14的厚度为120微米。所述导热弹性柱2包括金属铜芯21，所述金属铜芯21的侧表面设置有硅橡胶层22，所述硅橡胶层22的表面设置有第二聚烯烃粘结层23，所述金属铜芯21的直径为7毫米，所述硅橡胶层22的厚度为7毫米，所述第二聚烯烃粘结层23的厚度为80微米。所述柱状凸起16的直径为4毫米，相邻柱状凸起16的间距为6毫米，所述柱状凸起16的高度为0.6毫米，所述橡胶缓冲层17的厚度为500微米，所述柱状凸起16裸露于所述橡胶缓冲层17的所述一部分的高度为100微米。
所述第二聚酯薄膜层32的厚度为2毫米，所述聚丙烯层33的厚度为0.8毫米，所述含氟树脂层34厚度为150微米，所述金属块4的材质为铝，所述金属块4裸露于所述含氟树脂层34的所述下端部的长度为1.5毫米。所述第一导热封装胶层5包括聚烯烃树脂以及导热纳米颗粒，所述导热纳 米颗粒为氧化铝，所述导热纳米颗粒的粒径为150纳米，所述第二封装胶层6和所述第三封装胶层8的材质为聚烯烃。第一导热封装胶层5的厚度为450微米，所述第二封装胶层6的厚度为90微米，所述第三封装胶层8的厚度为220微米，所述导热弹性柱2嵌入到所述第一导热封装胶层5中的所述上端部的长度为350微米。所述含氟树脂层34的材质为聚四氟乙烯。
实施例2
本实施例提供另一种硅基太阳能电池板，与实施例1相比，区别仅在于，所述第一金属板11和所述第二金属板3的材质为铜，所述第一聚酯薄膜层12的厚度为4毫米，所述聚酰亚胺薄膜13的厚度为1毫米，所述第一聚烯烃粘结层14的厚度为150微米。所述金属铜芯21的直径为10毫米，所述硅橡胶层22的厚度为10毫米，所述第二聚烯烃粘结层23的厚度为100微米。所述柱状凸起16的直径为5毫米，相邻柱状凸起16的间距为8毫米，所述柱状凸起16的高度为0.7毫米，所述橡胶缓冲层17的厚度为630微米，所述柱状凸起16裸露于所述橡胶缓冲层17的所述一部分的高度为70微米。
所述第二聚酯薄膜层32的厚度为1毫米，所述聚丙烯层33的厚度为1毫米，所述含氟树脂层34厚度为200微米，所述金属块4的材质为铜，所述金属块4裸露于所述含氟树脂层34的所述下端部的长度为2毫米。所述第一导热封装胶层5中的导热纳米颗粒为氧化镁，所述导热纳米颗粒的粒径为200纳米，第一导热封装胶层5的厚度为500微米，所述第二封装胶层6的厚度为100微米，所述第三封装胶层8的厚度为200微米，所述导热弹性柱2嵌入到所述第一导热封装胶层5中的所述上端部的长度为400微米。所述含氟树脂层34的材质为聚偏氟乙烯。
实施例3
本实施例提供另一种硅基太阳能电池板，与实施例1相比，区别仅在于，所述第一金属板11和所述第二金属板3的材质为铝镁合金，所述第一 聚酯薄膜层12的厚度为2毫米，所述聚酰亚胺薄膜13的厚度为1.5毫米，所述第一聚烯烃粘结层14的厚度为100微米。所述金属铜芯21的直径为5毫米，所述硅橡胶层22的厚度为5毫米，所述第二聚烯烃粘结层23的厚度为50微米。所述柱状凸起16的直径为2毫米，相邻柱状凸起16的间距为4毫米，所述柱状凸起16的高度为0.4毫米，所述橡胶缓冲层17的厚度为350微米，所述柱状凸起16裸露于所述橡胶缓冲层17的所述一部分的高度为50微米。
所述第二聚酯薄膜层32的厚度为3毫米，所述聚丙烯层33的厚度为0.5毫米，所述含氟树脂层34厚度为100微米，所述金属块4的材质为铜，所述金属块4裸露于所述含氟树脂层34的所述下端部的长度为1毫米。所述第一导热封装胶层5中的导热纳米颗粒为氮化硅，所述导热纳米颗粒的粒径为100纳米，第一导热封装胶层5的厚度为400微米，所述第二封装胶层6的厚度为50微米，所述第三封装胶层8的厚度为300微米，所述导热弹性柱2嵌入到所述第一导热封装胶层5中的所述上端部的长度为250微米。所述含氟树脂层34的材质为乙烯-四氟乙烯共聚物。
以上所述是本申请的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本申请原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也视为本申请的保护范围。

Claims (8)

  1. 一种硅基太阳能电池板，其特征在于：所述硅基太阳能电池板包括：
    太阳能电池背板，所述太阳能电池背板包括第一金属板，在所述第一金属板的上表面粘结有第一聚酯薄膜层，所述第一聚酯薄膜层的上表面粘结有聚酰亚胺薄膜，所述聚酰亚胺薄膜的上表面设置有第一聚烯烃粘结层，多个呈阵列排布的第一柱状凹槽，所述第一柱状凹槽贯穿所述第一聚烯烃粘结层、所述聚酰亚胺薄膜以及所述第一聚酯薄膜层并暴露所述第一金属板的上表面，每个所述第一柱状凹槽中均嵌入一个导热弹性柱，所述导热弹性柱的上端部裸露于所述第一聚烯烃粘结层，所述导热弹性柱的底面与所述第一金属板接触，所述第一金属板的下表面设置有多个呈阵列排布的柱状凸起；
    橡胶缓冲层，所述橡胶缓冲层覆盖所述第一金属板的下表面，每个所述柱状凸起的一部分裸露于所述橡胶缓冲层；
    第二金属板，所述第二金属板的上表面设置多个呈阵列分布的第二柱状凹槽，所述第二柱状凹槽与所述柱状凸起一一对应，每个所述柱状凸起的所述一部分嵌入到相应的所述第二柱状凹槽中，所述第二金属板的下表面粘结有第二聚酯薄膜层，所述第二聚酯薄膜层的下表面粘结有聚丙烯层，所述聚丙烯层的下表面粘结有含氟树脂层，多个呈阵列排布的沟槽，所述沟槽贯穿所述含氟树脂层、聚丙烯层以及第二聚酯薄膜层并暴露所述第二金属板的下表面，每个所述沟槽中均嵌入一个金属块，所述金属块的顶表面与所述第二金属板的下表面接触，所述金属块的下端部裸露于所述含氟树脂层；
    第一导热封装胶层，所述第一导热封装胶层覆盖所述太阳能电池背板，所述导热弹性柱中裸露于所述第一聚烯烃粘结层的所述上端部嵌入到所述第一导热封装胶层中；
    第二封装胶层，所述第二封装胶层覆盖所述第一导热封装胶层；
    多个硅基太阳能电池片设置于所述第二封装胶层上；
    第三封装胶层，所述第三封装胶层覆盖所述硅基太阳能电池片；
    钢化玻璃板，所述钢化玻璃板设置于所述第三封装胶层之上。
  2. 根据权利要求1所述的硅基太阳能电池板，其特征在于：所述第一金属板和所述第二金属板的材质为铝、铜、不锈钢以及铝镁合金中的一种，所述第一聚酯薄膜层的厚度为2-4毫米，所述聚酰亚胺薄膜的厚度为1-1.5毫米，所述第一聚烯烃粘结层的厚度为100-150微米。
  3. 根据权利要求2所述的硅基太阳能电池板，其特征在于：所述导热弹性柱包括金属铜芯，所述金属铜芯的侧表面设置有硅橡胶层，所述硅橡胶层的表面设置有第二聚烯烃粘结层，所述金属铜芯的直径为5-10毫米，所述硅橡胶层的厚度为5-10毫米，所述第二聚烯烃粘结层的厚度为50-100微米。
  4. 根据权利要求2所述的硅基太阳能电池板，其特征在于：所述柱状凸起的直径为2-5毫米，相邻柱状凸起的间距为4-8毫米，所述柱状凸起的高度为0.4-0.8毫米，所述橡胶缓冲层的厚度为300-700微米，所述柱状凸起裸露于所述橡胶缓冲层的所述一部分的高度为50-100微米。
  5. 根据权利要求1所述的硅基太阳能电池板，其特征在于：所述第二聚酯薄膜层的厚度为1-3毫米，所述聚丙烯层的厚度为0.5-1毫米，所述含氟树脂层厚度为100-200微米，所述金属块的材质为铝或铜，所述金属块裸露于所述含氟树脂层的所述下端部的长度为1-2毫米。
  6. 根据权利要求1所述的硅基太阳能电池板，其特征在于：所述第一导热封装胶层包括聚烯烃树脂以及导热纳米颗粒，所述导热纳米颗粒为氧化铝、氮化铝、氮化硼、氮化硅、氧化镁中的一种，所述导热纳米颗粒的粒径为100-200纳米，所述第二封装胶层和所述第三封装胶层的材质为聚烯烃。
  7. 根据权利要求6所述的硅基太阳能电池板，其特征在于：第一导热封装胶层的厚度为400-500微米，所述第二封装胶层的厚度为50-100微米，所述第三封装胶层的厚度为200-300微米，所述导热弹性柱嵌入到所述第一导 热封装胶层中的所述上端部的长度为200-400微米。
  8. 根据权利要求1所述的硅基太阳能电池板，其特征在于：所述含氟树脂层的材质为聚四氟乙烯、聚三氟氯乙烯、聚偏氟乙烯、聚氟乙烯、乙烯-三氟氯乙烯共聚物或乙烯-四氟乙烯共聚物。
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