WO2019196736A1 - 泡棉及其制备方法、电子装置 - Google Patents

泡棉及其制备方法、电子装置 Download PDF

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Publication number
WO2019196736A1
WO2019196736A1 PCT/CN2019/081479 CN2019081479W WO2019196736A1 WO 2019196736 A1 WO2019196736 A1 WO 2019196736A1 CN 2019081479 W CN2019081479 W CN 2019081479W WO 2019196736 A1 WO2019196736 A1 WO 2019196736A1
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Prior art keywords
foam
layer
bonding
hole
bonding layer
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PCT/CN2019/081479
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English (en)
French (fr)
Inventor
王涛
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京东方科技集团股份有限公司
京东方光科技有限公司
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Publication of WO2019196736A1 publication Critical patent/WO2019196736A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements

Definitions

  • the present disclosure relates to a method of preparing foam, foam, and an electronic device.
  • the display device is a common electronic device. As the preparation method of the display device is gradually matured and the production cost is gradually reduced, the quality requirements of the display device are also increasing. However, since most of the display devices have a structure in which a fragile material is formed, it is necessary to provide a cushioning material in the display device that prevents the structure from being broken by the fragile material. At present, most of the components in the display device are combined by frame bonding, and foam is often used when assembling the display device by the frame bonding method. The foam is typically a full circle of hollow frame structure to fill the gap between the display screen and the terminal housing with foam to provide cushioning and dust protection for the various components of the display device.
  • At least one embodiment of the present disclosure provides a foam comprising: a foam layer including opposing first and second surfaces, and a through hole extending from the first surface to the second surface a first bonding layer disposed on the first surface; a second bonding layer disposed on the second surface; wherein the through hole is provided with an adhesive material, the first bonding The layer and the second bonding layer are joined by the bonding material.
  • the bonding material is bonded and fixed to the inner wall of the through hole.
  • the number of the through holes is plural, and the plurality of through holes are arranged at intervals.
  • a plurality of the through holes are equally spaced.
  • a distance between two adjacent through holes is less than or equal to a thickness of the first bonding layer; or, less than or equal to the second viscosity The thickness of the layer.
  • the first bonding layer has a thickness of about 0.02 mm to 0.3 mm; and the second bonding layer has a thickness of about 0.02 mm to 0.3 mm;
  • the thickness of the foam layer is from about 0.05 mm to about 3 mm.
  • the cross-sectional shape of the through hole includes at least one of a circle, a regular polygon, and an irregular polygon on a plane parallel to the first surface.
  • the through hole has a pore diameter ranging from about 1 mm to 5 mm.
  • the materials of the first adhesive layer, the second adhesive layer, and the bonding material are the same.
  • the materials of the first adhesive layer, the second adhesive layer and the bonding material are all glued, and the bonding material fills the same.
  • the through hole is described.
  • the through holes are further provided with bonding particles, and the bonding particles are mixed in the bonding material.
  • the binder particles are nano ceramic particles.
  • the foam further includes a release film disposed on a surface of the first adhesive layer facing away from the foam layer, And/or the release film is disposed on a surface of the second bonding layer that faces away from the foam layer.
  • At least one embodiment of the present disclosure also provides an electronic device comprising the foam of any of the above.
  • At least one embodiment of the present disclosure also provides a method of preparing a foam, the method comprising: forming a foam layer, wherein the foam layer includes opposing first and second surfaces; and the foam layer Forming a through hole, wherein the through hole extends from the first surface to the second surface; forming a first bonding layer on the first surface; forming a bonding material in the through hole; Forming a second bonding layer on the second surface; wherein the first bonding layer and the second bonding layer are connected by the bonding material.
  • the bonding material is bonded to the inner wall of the through hole in the process of forming the through hole.
  • the through hole is further filled with bonding particles, and the bonding particles are mixed in the bonding material.
  • the binder particles are nano ceramic particles.
  • the preparation method provided by at least one embodiment of the present disclosure further includes: forming a release film on a surface of the first adhesive layer facing away from the foam layer, and/or in the second adhesive layer A release film is formed on the surface facing away from the foam layer.
  • 1 is a schematic cross-sectional view of an electronic device
  • FIG. 2 is a schematic cross-sectional structural view of a foam according to an embodiment of the present disclosure
  • FIG. 3 is a schematic cross-sectional structural view of still another foam according to an embodiment of the present disclosure.
  • FIG. 4 is a flow chart of a method for preparing a foam according to an embodiment of the present disclosure.
  • the foam comprises a foam layer, a bonding layer and a release film which are laminated, and when the foam is used, the release film needs to be peeled off from the adhesive layer, and the foam after peeling off the release film is attached to the foam.
  • the foam may be severely stretched or the release film may not be peeled off at all, and the foam layer may be parallel to the bond during the process of peeling off the release film. Layering in the direction of the thickness of the layer, thereby reducing the performance of the electronic device.
  • FIG. 1 is a cross-sectional structural diagram of an electronic device.
  • a The foam 13 is buffered to prevent dust or moisture from entering the visible area of the display module 11.
  • the buffer foam 13 is covered with a release film (not shown in FIG. 1) before being mounted in the electronic device 100.
  • the release film needs to be removed from the buffer foam 13, and the release film 13 is removed from the touch screen 10 and the display module 11 after the release film is removed.
  • the cushioning foam 13 In the process of tearing off the release film, at the beginning of the tearing off, the cushioning foam 13 is subjected to a large moment of pulling force, which causes the cushioning foam 13 to be entangled with tearing, thereby causing the cushioning foam 13 to be prevented from being lost.
  • the role of dust or moisture The role of dust or moisture.
  • a through hole can be provided between the two adhesive layers of the buffer foam 13, and the adhesive material is filled in the through hole, and the two adhesive layers are joined by the adhesive material in the through hole.
  • the bonding material has a viscosity, so that a relatively stable structure can be formed between the two bonding layers and the bonding material, and the stable structure can protect the buffer foam 13 when the buffer foam 13 is parallel to the sticky
  • the foam layer included in the buffer foam 13 can be firmly formed between the two bonding layers without delamination based on the arrangement of the bonding material.
  • FIG. 2 is a schematic cross-sectional view of a foam according to an embodiment of the present disclosure.
  • the foam 20 includes a foam layer 21 including opposing first and second surfaces 211, 212, and a through hole 213 extending from the first surface 211 to the second surface 212.
  • the foam 20 further includes a first bonding layer 22 and a second bonding layer 23, the first bonding layer 22 is disposed on the first surface 211 of the foam layer 21; the second bonding layer 23 is disposed on the foam On the second surface 212 of the layer 21, the through hole 213 is filled with a bonding material 24, and the first bonding layer 22 and the second bonding layer 23 are joined by a bonding material 24.
  • the first bonding layer 22 and the second bonding layer 23 are joined by the bonding material 24 in the through hole 213, and the bonding material 24 has adhesiveness, such that the first bonding layer 22, the second bonding layer 23 and the bonding layer A stable structure is formed between the junction materials 24, and the stable structure protects the foam layer 21 when the foam 20 is subjected to a thickness direction parallel to the first bonding layer 22 and the second bonding layer 23.
  • the foam layer 21 can be firmly formed between the first bonding layer 22 and the second bonding layer 23 without delamination.
  • the material of the foam layer 21 may be chemically crosslinked polyethylene foamed cotton, polyvinyl acetate foam, and high density polyurethane foam.
  • the through hole 213 penetrates through the foam layer 21, and the two holes of the through hole 213 are respectively located on the first surface 211 of the foam layer 21 that is in contact with the first adhesive layer 22 and the second contact layer 23 On the second surface 212.
  • the shape of the opening of the through hole 213 may be various, for example, a regular pattern or an irregular pattern.
  • the regular pattern may be various, for example, a circle, a square, a rectangle, a diamond, a triangle, etc.; the irregular pattern may also be various, for example, a closed hole formed by a zigzag edge or the like.
  • the shape of the aperture of the through hole 213 is also not limited, and those skilled in the art can flexibly select according to actual needs.
  • the manner in which the plurality of through holes 213 are distributed is also not particularly limited, and those skilled in the art can flexibly select according to actual needs, for example, including but not limited to uniform distribution.
  • the number of the through holes 213 and the distance between the adjacent two through holes 213 can be set as needed.
  • the number of the through holes 213 is plural, and the plurality of through holes 213 are arranged at intervals.
  • the plurality of through holes 213 may be arranged at equal intervals or may be arranged at unequal intervals.
  • the first bonding layer 22, the second bonding layer 23, and the bonding material 24 are formed to form the foam layer 21
  • the protection effect is better.
  • the distance between the adjacent two through holes 213 may be less than or equal to the thickness of the first bonding layer 22, or may be less than or equal to the second bonding layer 23. thickness of.
  • the distance between adjacent two through holes 213 is half of the thickness of the first bonding layer 22; or, is half the thickness of the second bonding layer 23.
  • the thickness of the first bonding layer 22 is about 0.02 mm to 0.3 mm, for example, the thickness of the first bonding layer 22 is about 0.02 mm, 0.05 mm, 0.08 mm, 0.1 mm, 0.2 mm, or 0.3 mm.
  • the thickness of the second bonding layer 22 is about 0.02 mm to 0.3 mm, and for example, the thickness of the second bonding layer 23 is about 0.03 mm, 0.04 mm, 0.07 mm, 0.15 mm, 0.25 mm, or 0.3 mm.
  • the thicknesses of the first bonding layer 22 and the second bonding layer 23 are the same or different.
  • the thickness of the foam layer is from about 0.05 mm to about 3 mm.
  • the bonding material 24 is filled in the through hole 213, and in order to improve the protective effect of the first bonding layer 22, the second bonding layer 23, and the bonding material 24 on the foam layer 21, the bonding material 24 and the through hole
  • the inner wall of 213 is bonded and fixed.
  • the bonding material 24 has adhesive properties, and when the foam 20 receives a tensile force parallel to the thickness direction of the first bonding layer 22 and/or the second bonding layer 23, the foam layer 21 and the bonding material 24 The adhesion between them serves to prevent delamination of the foam layer 21.
  • first adhesive layer 22 and the second adhesive layer 23 may be a viscous layer structure made of a different material or a viscous layer structure made of the same material.
  • the materials of the first bonding layer 22 and the second bonding layer 23 are both glue.
  • the bonding material 24 is filled in the through hole 213, and the bonding material 24 fills the through hole 213.
  • the materials of the first bonding layer 22, the second bonding layer 23, and the bonding material 24 may be the same, which may reduce the kind of material used.
  • the materials of the first bonding layer 22, the second bonding layer 23, and the bonding material 24 are all glue. There may be many types of the bonding material 24, and the embodiment of the present disclosure is not limited to glue, and may be other suitable materials.
  • the bonding material 24 fills the through hole 213.
  • the glue may be at least one of an acrylate glue, a composite structural glue, a polymer glue, a seal adhesive, a hot melt adhesive, a water-based adhesive, a pressure sensitive adhesive, a solvent-based adhesive, an inorganic adhesive, and an optical adhesive.
  • FIG. 3 is a schematic cross-sectional structural view of still another foam according to an embodiment of the present disclosure.
  • the through hole 213 is also filled with bonding particles 25 which are mixed in the bonding material 24.
  • the bonding particles 25 are uniformly mixed in the bonding material 24.
  • the bonding particles 25 are nano ceramic particles. Nano ceramic particles can be used to increase the cohesion of the glue.
  • the binder particles can also be made of other materials, which can be selected according to the actual conditions.
  • the cohesive force of the bonding material 24 can be further improved, and the protective effect on the foam layer 21 can be improved.
  • the binder particles 25 are nanoparticles.
  • the foam 20 may further include a release film 26 disposed on a surface of the first adhesive layer 22 facing away from the foam layer 21, and/or the release film 26 is disposed on the second paste.
  • the layer of the layer 23 faces away from the surface of the foam layer 21.
  • the release film 26 may protect the first bonding layer 22 and/or the second bonding layer 23 on the foam 20 prior to the use of the foam 20 such that the first bonding layer 22 and/or the first bonding layer 22
  • the second bonding layer 23 remains viscous.
  • the release film 26 is disposed only on the surface of the first adhesive layer 22 facing away from the foam layer 21.
  • the release film 26 needs to be peeled off from the foam 20, and the foam 20 after the release film 26 is peeled off is placed between the components to which the electronic device needs to be attached.
  • the instantaneous pulling force of the foam layer 21 is large, so that the foam layer 21 may be teared together, so that the foam 20 loses its function of preventing dust or moisture.
  • the adhesion between the release film 26 and the first adhesive layer 22 and/or the second adhesive layer 23 is small, and by applying a tensile force to the release film 26, the release film 26 can be made from the first adhesive.
  • the layer 22 and/or the second bonding layer 23 are peeled off.
  • the material type and structural size of the release film 26 can be set according to actual needs.
  • An embodiment of the present disclosure also provides an electronic device including any of the above-mentioned foams.
  • the electronic device is a display device or a touch device, etc.
  • the foam provided by the embodiment of the present disclosure may be disposed between the display screen and the terminal housing, because the foam layer in the foam is less likely to be delaminated. Therefore, the foam can play a better buffering and supporting role, so that the display device has better performance. This can increase product yield.
  • the electronic device has the features and advantages of the foam described above, and will not be further described herein.
  • the type of the display device is not particularly limited, and may be any display function device or device in the art, such as, but not limited to, a mobile phone, a tablet computer, a navigator, a computer display, a game machine. , televisions, monitors, wearable devices, and other devices or devices such as living appliances or household appliances with display functions.
  • the electronic device may include the necessary structures and components of a conventional electronic device in addition to the foam in any of the above embodiments, for example, the electronic device is a display device, and the display device
  • the structure and components of a conventional display device such as a display panel, a film, a plastic frame, a light guide plate, a reflective sheet, and a back sheet are included.
  • the foam is disposed at the peripheral edge of the display panel, and the display panel and the plastic frame are bonded together by the first adhesive layer and the second adhesive layer of the foam, and the film is disposed on the plastic frame away from the display panel.
  • a light guide plate, a reflection sheet, a back sheet, and the like are sequentially disposed on the side of the film material away from the display panel.
  • FIG. 4 is a flow chart of a method for preparing a foam according to an embodiment of the present disclosure. As shown in FIG. 4, the preparation method includes the following steps.
  • a conventional punching tool can be used to punch holes to form the through holes.
  • the first bonding layer can be formed by applying glue and then curing the glue.
  • a bonding material may be formed in the through hole by pouring glue, which is solidified during the flow in the through hole.
  • the bonding material is formed throughout the through hole.
  • the second bonding layer can be formed by applying glue and then curing the glue.
  • composition of the first adhesive layer, the second adhesive layer, and the bonding material can be referred to the related description in the above, and will not be described herein.
  • the thickness of the first bonding layer, the second bonding layer, and the cross-sectional shape and size of the through hole can be referred to the related description in the above, and details are not described herein again.
  • the bonding material is formed in the through hole, the bonding material is bonded and fixed to the inner wall of the through hole.
  • the through hole is also filled with bonding particles which are mixed in the bonding material.
  • the binder particles are nano ceramic particles. Nano ceramic particles can be used to increase the cohesion of the glue.
  • the preparation method may further include forming a release film on a surface of the first adhesive layer facing away from the foam layer, and/or forming a release film on a surface of the second adhesive layer facing away from the foam layer.
  • the release film can ensure that the first bonding layer and/or the second bonding layer on the foam is protected before the foam is used, so that the first bonding layer and/or the second bonding layer remain viscosity.
  • a method for preparing a foam, an electronic device, and a foam provided by an embodiment of the present disclosure has at least one of the following beneficial effects:
  • the foam layer is provided with a through hole filled with a bonding material, and the first bonding layer and the second bonding layer pass through the through hole
  • the bonding materials are joined, the bonding material has a viscosity, and a relatively stable structure is formed between the first bonding layer, the second bonding layer and the bonding material, and the structure protects the foam layer.
  • the foam when the foam is subjected to a force parallel to the thickness direction of the first adhesive layer and the second adhesive layer, the foam is based on the setting of the bonding material
  • the layer can be firmly formed without delamination between the first adhesive layer and the second adhesive layer, that is, the foam layer in the foam does not delaminate during the process of peeling off the release film.
  • the electronic device is, for example, a display device, and the foam is disposed between the display screen and the terminal housing, because the foam layer in the foam is less likely to be delaminated. Therefore, the foam can play a better buffering and supporting role, so that the display device has better performance, thereby improving product yield.

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Abstract

一种泡棉及其制备方法以及电子装置。该泡棉包括泡棉层(21)，该泡棉层(21)包括相对的第一表面(211)和第二表面(212)，以及从所述第一表面(211)延伸至所述第二表面(212)的贯通孔(213)；第一粘结层(22)，设置在所述第一表面(211)上；第二粘结层(23)，设置在所述第二表面(212)上；其中，所述贯通孔(213)内设置有粘结材料(24)，所述第一粘结层(22)和所述第二粘结层(23)通过所述粘结材料(24)连接。当泡棉(20)受到平行于第一粘结层(22)和/或第二粘结层(23)厚度方向的作用力时，泡棉层(21)能够牢固地形成在第一粘结层(22)和第二粘结层(23)之间且不发生分层。

Description

泡棉及其制备方法、电子装置
本申请要求于2018年4月8日递交的中国专利申请第201820487157.5号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
技术领域
本公开涉及一种泡棉、泡棉的制备方法和电子装置。
背景技术
显示装置是常见的电子装置，随着显示装置的制备方法逐渐成熟以及生产成本的逐渐降低，消费者对显示装置的品质要求也越来越高。然而，由于大部分显示装置中都具有易碎材料形成的结构，因此，需要在显示装置中设置防止易碎材料形成的结构破碎的缓冲材料。目前，显示装置中的部件大多采用框贴实现结合，采用框贴方式组装显示装置时常使用泡棉。泡棉通常为一个整圈的中空框架结构，以在显示屏和终端壳体之间的空隙中填充泡棉，以对显示装置中的各部件起到缓冲和防尘的作用。
发明内容
本公开至少一实施例提供一种泡棉，该泡棉包括：泡棉层，其包括相对的第一表面和第二表面，以及从所述第一表面延伸至所述第二表面的贯通孔；第一粘结层，设置在所述第一表面上；第二粘结层，设置在所述第二表面上；其中，所述贯通孔内设置有粘结材料，所述第一粘结层和所述第二粘结层通过所述粘结材料连接。
例如，在本公开至少一实施例提供的泡棉中，所述粘结材料与所述贯通孔的内壁粘接固定。
例如，在本公开至少一实施例提供的泡棉中，所述贯通孔的数目为多个，多个所述贯通孔间隔排布。
例如，在本公开至少一实施例提供的泡棉中，多个所述贯通孔等间隔排布。
例如，在本公开至少一实施例提供的泡棉中，相邻两个所述贯通孔之间的距离小于或者等于所述第一粘结层的厚度；或者，小于或者等于所述第二粘结层的厚度。
例如，在本公开至少一实施例提供的泡棉中，所述第一粘结层的厚度为约0.02mm-0.3mm；所述第二粘结层的厚度为约0.02mm-0.3mm；所述泡棉层的厚度为约0.05mm-3mm。
例如，在本公开至少一实施例提供的泡棉中，在平行于所述第一表面的平面上，所述贯通孔的截面形状包括圆形、规则多边形和不规则多边形中的至少一种。
例如，在本公开至少一实施例提供的泡棉中，所述贯通孔的孔径的范围为约1mm-5mm。
例如，在本公开至少一实施例提供的泡棉中，所述所述第一粘结层、所述第二粘结层和所述粘结材料的材料相同。
例如，在本公开至少一实施例提供的泡棉中，所述第一粘结层、所述第二粘结层和所述粘结材料的材料均为胶水，所述粘结材料填满所述贯通孔。
例如，在本公开至少一实施例提供的泡棉中，所述贯通孔内还设置有粘结颗粒，所述粘结颗粒混合于所述粘结材料中。
例如，在本公开至少一实施例提供的泡棉中，所述粘结颗粒为纳米陶瓷颗粒。
例如，在本公开至少一实施例提供的泡棉中，所述泡棉还包括离型膜，所述离型膜设置在所述第一粘结层的背离所述泡棉层的表面上，和/或所述离型膜设置在所述第二粘结层的背离所述泡棉层的表面上。
本公开至少一实施例还提供一种电子装置，其包括上述任一项所述的泡棉。
本公开至少一实施例还提供一种泡棉的制备方法，该制备方法包括：形成泡棉层，其中，所述泡棉层包括相对的第一表面和第二表面；在所述泡棉层中形成贯通孔，其中，所述贯通孔从所述第一表面延伸至所述第二表面；在所述第一表面上形成第一粘结层；在所述贯通孔内形成粘结材料；在所述第二表面上形成第二粘结层；其中，所述第一粘结层和所述第二粘结层通过所述粘结材料连接。
例如，在本公开至少一实施例提供的制备方法中，所述粘结材料形成在所述贯通孔中的过程中，与所述贯通孔的内壁粘接固定。
例如，在本公开至少一实施例提供的制备方法中，所述贯通孔内还填充有粘结颗粒，所述粘结颗粒混合于所述粘结材料中。
例如，在本公开至少一实施例提供的制备方法中，所述粘结颗粒为纳米陶瓷颗粒。
例如，本公开至少一实施例提供的制备方法，还包括：在所述第一粘结层的背离所述泡棉层的表面上形成离型膜，和/或在所述第二粘结层的背离所述泡棉层的表面上形成离型膜。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本公开的一些实施例，而非对本公开的限制。
图1为一种电子装置的截面结构示意图；
图2为本公开一实施例提供的一种泡棉的截面结构示意图；
图3为本公开一实施例提供的再一种泡棉的截面结构示意图；以及
图4为本公开一实施例提供的一种泡棉的制备方法的流程图。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于所描述的本公开的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本公开保护的范围。
除非另外定义，本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定 于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
在制作电子装置时需要使用一些泡棉作为缓冲材料，但由于泡棉本身的特性，泡棉具有贴附和撕除时易拉伸变形、不可二次利用等缺点。目前，泡棉包括层叠设置的泡棉层、粘结层以及离型膜，使用泡棉时需要先将离型膜从粘结层上剥离，再将剥离离型膜后的泡棉贴附到电子装置的相关部件上。在将离型膜从粘结层上剥离时，会导致泡棉被严重拉伸变形或者根本无法将离型膜剥离，且在剥离离型膜的过程中泡棉层会因受到平行于粘结层厚度方向的作用力而分层，从而降低了电子装置的性能。
例如，图1为一种电子装置的截面结构示意图，如图1所示，在触控屏10与电子装置100的其他部件，例如，在触控屏10与显示模块11之间，通常设置有一缓冲泡棉13，用以防止灰尘或水汽进入显示模块11的可视区内。缓冲泡棉13在安装到电子装置100中之前覆盖有离型膜(图1中未示出)。当使用缓冲泡棉13时，需要将离型膜从缓冲泡棉13上撕下，再将离型膜撕除后缓冲泡棉13设置于触控屏10与显示模块11之间。然而，在缓冲泡棉13的胶层与离型膜之间存在粘附力。在撕除离型膜的过程中，在撕除的开始阶段，缓冲泡棉13受到的瞬间拉力很大，这样导致缓冲泡棉13可能会被连带着撕裂，从而使得缓冲泡棉13失去防止灰尘或水汽的作用。
本公开的发明人发现，可以在缓冲泡棉13的两个粘结层之间设置贯通孔，在贯通孔内填充粘结材料，两个粘结层通过贯通孔内的粘结材料相接，且粘结材料具有粘性，这样两个粘结层和粘结材料之间可以形成相对稳定的结构，该稳定的结构对缓冲泡棉13可以起到保护作用，当缓冲泡棉13受到平行于粘结层的厚度方向的作用力时，基于粘结材料的设置，缓冲泡棉13包括的泡棉层能够牢固地形成在两个粘接层之间且不发生分层。
本公开一实施例提供一种泡棉。例如，图2为本公开一实施例提供的一种泡棉的截面结构示意图。如图2所示，该泡棉20包括泡棉层21，该泡棉层21包括相对的第一表面211和第二表面212，以及从第一表面211延伸至第二表面212的贯通孔213；该泡棉20还包括第一粘结层22和第二粘结层23，第一粘结层22设置在泡棉层21的第一表面211上；第二粘 结层23设置在泡棉层21的第二表面212上，该贯通孔213内填充有粘结材料24，该第一粘结层22和第二粘结层23通过粘结材料24连接。第一粘结层22和第二粘结层23通过贯通孔213内的粘结材料24相接，且粘结材料24具有粘性，这样第一粘结层22、第二粘结层23和粘结材料24之间均形成了稳定的结构，该稳定的结构对泡棉层21起到保护作用，当泡棉20受到平行于第一粘结层22和第二粘结层23厚度方向的作用力时，基于粘结材料24的设置，泡棉层21能够牢固地形成在第一粘结层22和第二粘结层23之间且不发生分层。
例如，该泡棉层21的材料可以是化学交联聚乙烯发泡泡棉、醋酸聚乙烯泡棉以及高密度聚氨酯泡棉等。
例如，贯通孔213贯通泡棉层21，贯通孔213的两个孔口分别位于泡棉层21的与第一粘结层22接触的第一表面211和与第二粘结层23接触的第二表面212上。贯通孔213的孔口的形状可以有多种，例如，规则图形或者不规则图形。例如，规则图形可以有多种，例如，圆形、正方形、长方形、菱形、三角形等；该不规则图形也可以有多种，例如，锯齿状的边缘形成的闭合孔等。例如，根据本公开的实施例，贯通孔213的孔口形状也没有限制要求，本领域技术人员可以根据实际需求进行灵活选择。
根据本公开的实施例，多个贯通孔213的分布方式也没有特别限制，本领域技术人员可以根据实际需要进行灵活选择，例如，包括但不限于均匀分布。
例如，基于贯通孔213的上述功能，可以根据实际需要设置贯通孔213的数目以及相邻两个贯通孔213之间的距离。例如，贯通孔213的数目为多个，多个贯通孔213间隔排布。该多个贯通孔213可以等间隔排布，也可以不等间距排布。
例如，当贯通孔213的数目较多且贯通孔213内均填充有粘结材料24时，第一粘结层22、第二粘结层23和粘结材料24形成的结构对泡棉层21的保护效果更好。
例如，当多个贯通孔213等间隔排布时，相邻的两个贯通孔213之间的距离可以小于或者等于第一粘结层22的厚度，或者，小于或者等于第二粘结层23的厚度。
例如，相邻两个贯通孔213之间的距离为第一粘结层22的厚度的一 半；或者，为第二粘结层23的厚度的一半。
例如，第一粘结层22的厚度为约0.02mm-0.3mm，例如，第一粘结层22的厚度为约0.02mm，0.05mm，0.08mm，0.1mm，0.2mm或者0.3mm。
例如，第二粘结层22的厚度为约0.02mm-0.3mm，例如，第二粘结层23的厚度为约0.03mm，0.04mm，0.07mm，0.15mm，0.25mm或者0.3mm。
例如，第一粘结层22和第二粘结层23的厚度相同或者不同。
例如，泡棉层的厚度为约0.05mm-3mm。
例如，粘结材料24填充在贯通孔213中，为了提高第一粘结层22、第二粘结层23和粘结材料24对泡棉层21的保护效果，该粘结材料24与贯通孔213的内壁粘接固定。例如，该粘结材料24具有粘结性能，当泡棉20接收到平行于第一粘结层22和/或第二粘结层23厚度方向的拉力时，泡棉层21与粘结材料24之间的粘结力起到防止泡棉层21发生分层的效果。
例如，第一粘结层22和第二粘结层23可以是由不同种材料制成的具有粘性的层结构，也可以是由相同材料制成的具有粘性的层结构。例如，第一粘结层22和第二粘结层23的材料均为胶水。
例如，粘结材料24填充在贯通孔213内，粘结材料24填满该贯通孔213。
例如，第一粘结层22、第二粘结层23和粘结材料24的材料可以相同，这样可以减少所用到的材料的种类。
例如，第一粘结层22、第二粘结层23和粘结材料24的材料均为胶水。该粘结材料24的种类可以有多种，本公开的实施例中不限于胶水，还可以是其他适合的材料。
例如，该粘结材料24填满贯通孔213。
例如，上述胶水可以为丙烯酸酯胶、复合型结构胶、高分子胶、密封胶粘剂、热熔胶、水基胶粘剂、压敏胶、溶剂型胶、无机胶粘剂和光学胶中的至少之一。
例如，图3为本公开一实施例提供的再一种泡棉的截面结构示意图。如图3所示，该贯通孔213内还填充有粘结颗粒25，该粘结颗粒25混合 于粘结材料24中。例如，该粘结颗粒25均匀混合于粘结材料24中。
例如，该粘结颗粒25为纳米陶瓷颗粒。纳米陶瓷颗粒可以用以提高胶水的内聚力。该粘结颗粒还可以由其他材料，其可以根据实际进行选择。
例如，在该粘结材料24中加入粘结颗粒25后，可以进一步提高粘结材料24的内聚力，提高对泡棉层21的保护效果。
例如，该粘结颗粒25为纳米颗粒。
例如，该泡棉20还可以包括离型膜26，该离型膜26设置在第一粘结层22的背离泡棉层21的表面上，和/或该离型膜26设置在第二粘结层23的背离泡棉层21的表面上。在使用泡棉20之前，该离型膜26可以对泡棉20上的第一粘结层22和/或第二粘结层23起到保护作用，使得第一粘结层22和/或第二粘结层23保持粘性。在图3所示的结构中，该离型膜26仅设置在第一粘结层22的背离泡棉层21的表面上。
例如，当使用泡棉20时，需要将离型膜26从泡棉20上撕下，再将撕除离型膜26后的泡棉20设置于电子装置需要贴合的元件之间。然而，第一粘结层22与离型膜26之间，和/或第二粘结层23与离型膜26之间存在粘附力，在撕除离型膜26的过程中，在撕下的开始阶段，泡棉层21受到的瞬间拉力很大，导致泡棉层21可能会被连带着撕裂，从而使得泡棉20失去防止灰尘或水汽的作用。
例如，该离型膜26与第一粘结层22和/或第二粘结层23之间的粘性较小，通过对离型膜26施加拉力，可以实现将离型膜26从第一粘结层22和/或第二粘结层23上剥离。该离型膜26的材料种类和结构尺寸可以根据实际需要进行设置。
本公开一实施例还提供一种电子装置，包括上述任一泡棉。例如，该电子装置为显示装置或者触控装置等，可以将本公开的实施例提供的泡棉设置在显示屏幕和终端壳体之间，由于该泡棉中的泡棉层不易发生分层，因此该泡棉可以起到较好的缓冲作用和支撑作用，使得显示装置具有较好的性能。从而可以提高产品良率。本领域技术人员可以理解，该电子装置具有前面所述泡棉的所忧特征和优点，在此不再一一赘述。
例如，该电子装置为显示装置时，该显示装置的种类没有特别限制，可以为本领域任何具有显示功能装置或设备，例如，包括但不限于手机、平板电脑、导航仪、计算机显示器、游戏机、电视机、显示器、可穿戴设 备及其他具有显示功能的生活电器或家用电器等设备或装置等。
当然，本领域技术人员可以理解，该电子装置除了上述任一实施例中的泡棉，还可以包括常规电子装置所具有的必要的结构和部件，例如，该电子装置为显示装置，该显示装置包括：显示面板、膜材、胶框、导光板、反射片以及背板等常规显示装置所具有的结构和部件。例如，泡棉设置于显示面板的四周边缘处，通过泡棉的第一粘结层和第二粘结层将显示面板和胶框粘结在一起，膜材设置于胶框远离显示面板的一侧，再在膜材的远离显示面板的一侧依次设置导光板、反射片和背板等。
本公开一实施例还提供一种泡棉的制备方法，例如，图4为本公开一实施例提供的一种泡棉的制备方法的流程图。如图4所示，该制备方法包括以下步骤。
S01：形成泡棉层，该泡棉层包括相对的第一表面和第二表面。
S02：在泡棉层中形成贯通孔，其中，该贯通孔从泡棉层的第一表面延伸至泡棉层的第二表面。
例如，可以采用常用的打孔工具进行打孔以形成该贯通孔。
S03：在泡棉层的第一表面上形成第一粘结层。
例如，可以通过涂覆胶水、然后该胶水固化以形成第一粘结层。
S04：在贯通孔内形成粘结材料。
例如，可以通过灌注胶水的形式在贯通孔中形成粘结材料，该胶水在贯通孔中流动的过程中固化。
例如，该粘结材料形成在整个贯通孔内。
S05：在泡棉层的第二表面上形成第二粘结层，该第一粘结层和第二粘结层通过粘结材料连接。
例如，可以通过涂覆胶水、然后该胶水固化以形成第二粘结层。
例如，该第一粘结层、第二粘结层和粘结材料的成分可以参见上述中的相关描述，在此不再赘述。
例如，该第一粘结层、第二粘结层的厚度，以及该贯通孔的截面形状和尺寸可以参见上述中的相关描述，在此不再赘述。
例如，该粘结材料形成在贯通孔中的过程中，该粘结材料与贯通孔的内壁粘接固定。
例如，该贯通孔内还填充有粘结颗粒，该粘结颗粒混合于所述粘结材 料中。
例如，该粘结颗粒为纳米陶瓷颗粒。纳米陶瓷颗粒可以用以提高胶水的内聚力。
例如，该制备方法还可以包括在第一粘结层的背离泡棉层的表面上形成离型膜，和/或在第二粘结层的背离泡棉层的表面上形成离型膜。该离型膜可以保证在使用泡棉之前，对泡棉上的第一粘结层和/或第二粘结层起到保护作用，使得第一粘结层和/或第二粘结层保持粘性。
本公开的实施例提供的一种泡棉、电子装置以及泡棉的制备方法具有以下至少一项有益效果：
(1)在本公开至少一实施例提供的泡棉中，泡棉层中设置有贯通孔，该贯通孔内填充有粘结材料，第一粘结层和第二粘结层通过贯通孔内的粘结材料相连接，粘结材料具有粘性，第一粘结层、第二粘结层和粘结材料之间形成了相对稳定的结构，该结构对泡棉层起到了保护作用。
(2)在本公开至少一实施例提供的泡棉中，当泡棉受到平行于第一粘结层和第二粘结层厚度方向的作用力时，基于粘结材料的设置，该泡棉层能够牢固形成在第一粘结层和第二粘结层之间不发生分层，即在剥离离型膜的过程中该泡棉中的泡棉层不会发生分层。
(3)在本公开至少一实施例提供的电子装置中，该电子装置例如为显示装置，泡棉设置在显示屏幕和终端壳体之间，由于该泡棉中的泡棉层不易发生分层，因此该泡棉可以起到较好的缓冲作用和支撑作用，使得显示装置具有较好的性能，从而可以提高产品良率。
还有以下几点需要说明：
(1)本公开实施例附图只涉及到与本公开实施例涉及到的结构，其他结构可参考通常设计。
(2)为了清晰起见，在用于描述本公开的实施例的附图中，层或区域的厚度被放大或缩小，即这些附图并非按照实际的比例绘制。可以理解，当诸如层、膜、区域或基板之类的元件被称作位于另一元件“上”或“下”时，该元件可以“直接”位于另一元件“上”或“下”或者可以存在中间元件。
(3)在不冲突的情况下，本公开的实施例及实施例中的特征可以相互组合以得到新的实施例。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局 限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以权利要求的保护范围为准。

Claims (19)

  1. 一种泡棉，包括：
    泡棉层，包括相对的第一表面和第二表面，以及从所述第一表面延伸至所述第二表面的贯通孔；
    第一粘结层，设置在所述第一表面上；
    第二粘结层，设置在所述第二表面上；
    其中，所述贯通孔内设置有粘结材料，所述第一粘结层和所述第二粘结层通过所述粘结材料连接。
  2. 根据权利要求1所述的泡棉，其中，所述粘结材料与所述贯通孔的内壁粘接固定。
  3. 根据权利要求1或2所述的泡棉，其中，所述贯通孔的数目为多个，多个所述贯通孔间隔排布。
  4. 根据权利要求3所述的泡棉，其中，多个所述贯通孔等间隔排布。
  5. 根据权利要求4所述的泡棉，其中，相邻两个所述贯通孔之间的距离小于或者等于所述第一粘结层的厚度；或者，小于或者等于所述第二粘结层的厚度。
  6. 根据权利要求1-5中任一项所述的泡棉，其中，所述第一粘结层的厚度为约0.02mm-0.3mm；所述第二粘结层的厚度为约0.02mm-0.3mm；所述泡棉层的厚度为约0.05mm-3mm。
  7. 根据权利要求1-6中任一项所述的泡棉，其中，在平行于所述第一表面的平面上，所述贯通孔的截面形状包括圆形、规则多边形和不规则多边形中的至少一种。
  8. 根据权利要求7所述的泡棉，其中，所述贯通孔的孔径的范围为约1mm-5mm。
  9. 根据权利要求1-8中任一项所述的泡棉，其中，所述第一粘结层、所述第二粘结层和所述粘结材料的材料相同。
  10. 根据权利要求1-9中任一项所述的泡棉，其中，所述第一粘结层、所述第二粘结层和所述粘结材料的材料均为胶水，所述粘结材料填满所述贯通孔。
  11. 根据权利要求1-10中任一项所述的泡棉，其中，所述贯通孔内还 设置有粘结颗粒，所述粘结颗粒混合于所述粘结材料中。
  12. 根据权利要求11所述的泡棉，其中，所述粘结颗粒为纳米陶瓷颗粒。
  13. 根据权利要求1-12中任一项所述的泡棉，其中，所述泡棉还包括离型膜，所述离型膜设置在所述第一粘结层的背离所述泡棉层的表面上，和/或所述离型膜设置在所述第二粘结层的背离所述泡棉层的表面上。
  14. 一种电子装置，其中，包括权利要求1-13中任一项所述的泡棉。
  15. 一种泡棉的制备方法，包括：
    形成泡棉层，其中，所述泡棉层包括相对的第一表面和第二表面；
    在所述泡棉层中形成贯通孔，其中，所述贯通孔从所述第一表面延伸至所述第二表面；
    在所述第一表面上形成第一粘结层；
    在所述贯通孔内形成粘结材料；
    在所述第二表面上形成第二粘结层；
    其中，所述第一粘结层和所述第二粘结层通过所述粘结材料连接。
  16. 根据权利要求15所述的制备方法，其中，所述粘结材料形成在所述贯通孔中的过程中，所述粘结材料与所述贯通孔的内壁粘接固定。
  17. 根据权利要求15或16所述的制备方法，其中，所述贯通孔内还填充有粘结颗粒，所述粘结颗粒混合于所述粘结材料中。
  18. 根据权利要求17所述的制备方法，其中，所述粘结颗粒为纳米陶瓷颗粒。
  19. 根据权利要求15-18中任一项所述的制备方法，还包括：在所述第一粘结层的背离所述泡棉层的表面上形成离型膜，和/或在所述第二粘结层的背离所述泡棉层的表面上形成离型膜。
PCT/CN2019/081479 2018-04-08 2019-04-04 泡棉及其制备方法、电子装置 WO2019196736A1 (zh)

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Publication number Priority date Publication date Assignee Title
CN208166909U (zh) * 2018-04-08 2018-11-30 京东方科技集团股份有限公司 一种泡棉及显示装置
CN113322017A (zh) * 2021-06-09 2021-08-31 苏州高泰电子技术股份有限公司 芯片场所用液态金属防泄漏的结构泡棉
CN114774012A (zh) * 2022-03-31 2022-07-22 苏州华星光电技术有限公司 一种胶带以及显示装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006183025A (ja) * 2004-12-01 2006-07-13 Sekisui Chem Co Ltd 架橋ポリオレフィン系樹脂発泡シート及び粘着テープ
CN103629286A (zh) * 2012-08-27 2014-03-12 深圳富泰宏精密工业有限公司 泡棉组件及其制造方法及应用该泡棉组件的电子装置
CN203559003U (zh) * 2013-09-25 2014-04-23 衡山县佳诚新材料有限公司 防水泡棉胶带
CN104085161A (zh) * 2014-07-08 2014-10-08 苏州佳值电子工业有限公司 遮光减震泡棉
CN203937270U (zh) * 2014-07-08 2014-11-12 苏州佳值电子工业有限公司 遮光减震泡棉
CN105542674A (zh) * 2016-01-28 2016-05-04 宁波吉象塑胶制品有限公司 一种泡棉双面胶带
CN208166909U (zh) * 2018-04-08 2018-11-30 京东方科技集团股份有限公司 一种泡棉及显示装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006183025A (ja) * 2004-12-01 2006-07-13 Sekisui Chem Co Ltd 架橋ポリオレフィン系樹脂発泡シート及び粘着テープ
CN103629286A (zh) * 2012-08-27 2014-03-12 深圳富泰宏精密工业有限公司 泡棉组件及其制造方法及应用该泡棉组件的电子装置
CN203559003U (zh) * 2013-09-25 2014-04-23 衡山县佳诚新材料有限公司 防水泡棉胶带
CN104085161A (zh) * 2014-07-08 2014-10-08 苏州佳值电子工业有限公司 遮光减震泡棉
CN203937270U (zh) * 2014-07-08 2014-11-12 苏州佳值电子工业有限公司 遮光减震泡棉
CN105542674A (zh) * 2016-01-28 2016-05-04 宁波吉象塑胶制品有限公司 一种泡棉双面胶带
CN208166909U (zh) * 2018-04-08 2018-11-30 京东方科技集团股份有限公司 一种泡棉及显示装置

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