WO2019195632A1 - Appareil de chauffage d'un matériau fondu - Google Patents

Appareil de chauffage d'un matériau fondu Download PDF

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Publication number
WO2019195632A1
WO2019195632A1 PCT/US2019/025908 US2019025908W WO2019195632A1 WO 2019195632 A1 WO2019195632 A1 WO 2019195632A1 US 2019025908 W US2019025908 W US 2019025908W WO 2019195632 A1 WO2019195632 A1 WO 2019195632A1
Authority
WO
WIPO (PCT)
Prior art keywords
side wall
electrode
molten material
opening
vessel
Prior art date
Application number
PCT/US2019/025908
Other languages
English (en)
Inventor
Gilbert De Angelis
Megan Aurora Delamielleure
Pierre LARONZE
Eugene LEHMAN, Jr.
Guido Peters
Original Assignee
Corning Incorporated
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Incorporated filed Critical Corning Incorporated
Publication of WO2019195632A1 publication Critical patent/WO2019195632A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B5/00—Melting in furnaces; Furnaces so far as specially adapted for glass manufacture
    • C03B5/16—Special features of the melting process; Auxiliary means specially adapted for glass-melting furnaces
    • C03B5/167—Means for preventing damage to equipment, e.g. by molten glass, hot gases, batches
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B5/00—Melting in furnaces; Furnaces so far as specially adapted for glass manufacture
    • C03B5/02—Melting in furnaces; Furnaces so far as specially adapted for glass manufacture in electric furnaces, e.g. by dielectric heating
    • C03B5/027—Melting in furnaces; Furnaces so far as specially adapted for glass manufacture in electric furnaces, e.g. by dielectric heating by passing an electric current between electrodes immersed in the glass bath, i.e. by direct resistance heating
    • C03B5/03—Tank furnaces
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B5/00—Melting in furnaces; Furnaces so far as specially adapted for glass manufacture
    • C03B5/16—Special features of the melting process; Auxiliary means specially adapted for glass-melting furnaces
    • C03B5/42—Details of construction of furnace walls, e.g. to prevent corrosion; Use of materials for furnace walls
    • C03B5/43—Use of materials for furnace walls, e.g. fire-bricks
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B5/00—Melting in furnaces; Furnaces so far as specially adapted for glass manufacture
    • C03B5/16—Special features of the melting process; Auxiliary means specially adapted for glass-melting furnaces
    • C03B5/42—Details of construction of furnace walls, e.g. to prevent corrosion; Use of materials for furnace walls
    • C03B5/44—Cooling arrangements for furnace walls
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B17/00—Forming molten glass by flowing-out, pushing-out, extruding or drawing downwardly or laterally from forming slits or by overflowing over lips
    • C03B17/06—Forming glass sheets
    • C03B17/064—Forming glass sheets by the overflow downdraw fusion process; Isopipes therefor

Definitions

  • the present disclosure relates generally to apparatus for heating molten material and, more particularly, to apparatus for heating molten material with electrodes.
  • an apparatus for heating molten material can comprise a vessel comprising a base wall and a side wall extending from the base wall. An inner surface of the base wall and an inner surface of the side wall can define a containment area of the vessel.
  • the apparatus can further include a first electrode comprising a portion positioned within a first through opening of the side wall.
  • the apparatus can also include a second electrode comprising a portion positioned within a second through opening of the side wall.
  • a wall material can define a portion of the inner surface of the base wall and can comprise a resistivity at 60 Hz within a range from about 200 Ohms ⁇ cm to 625 Ohms ⁇ cm within a temperature range from 1500 °C to 1600 °C.
  • an apparatus for heating molten material can comprise a vessel comprising a base wall and a side wall extending from the base wall. An inner surface of the base wall and an inner surface of the side wall can define a containment area of the vessel. The apparatus can further include molten material positioned within the containment area. The apparatus can also include a first electrode comprising a portion positioned within a first through opening of the side wall. An outer end of the first electrode can contact the molten material. The apparatus can still also include a second electrode comprising a portion positioned within a second through opening of the side wall. An outer end of the second electrode can also contact the molten material. A wall material can define a portion of the inner surface of the base wall. A 1600 °C resistivity ratio between the wall material and the molten material is within a range from about 1.0 to about 3.0.
  • the wall material can comprise a resistivity at 60 Hz within a range from about 200 Ohms ⁇ cm to 625 Ohms ⁇ cm within a temperature range from 1500 °C to 1600 °C.
  • the wall material can define an inner surface of an unbroken path connecting the first through opening with the second through opening.
  • the side wall can comprise a side wall portion elevationally defined between an elevation of the base wall and an elevation of a lower periphery of the first through opening.
  • the apparatus can further comprise a cooling device contacting an outer surface of the side wall portion.
  • the cooling device can comprise a plate.
  • the apparatus can further comprise a rod positioned to force the plate in a direction towards the outer surface of the side wall portion.
  • the apparatus can further comprise a pad positioned between the rod and the plate to increase an electrical resistance between the rod and the plate.
  • an apparatus for heating molten material can comprise a vessel comprising a base wall and a side wall extending from the base wall. An inner surface of the base wall and an inner surface of the side wall can define a containment area of the vessel.
  • the apparatus can further comprise a first electrode comprising a portion positioned within a first through opening of the side wall.
  • the apparatus can still further comprise a second electrode comprising a portion positioned within a second through opening of the side wall.
  • the side wall can comprise a side wall portion elevationally defined between an elevation of the base wall and an elevation of a lower periphery of the first through opening.
  • the apparatus can further comprise a cooling device contacting an outer surface of the side wall portion.
  • the cooling device can comprise a plate.
  • the apparatus can further comprise a rod positioned to force the plate in a direction towards the outer surface of the side wall portion.
  • the apparatus can further comprise a pad positioned between the rod and the plate to increase an electrical resistance between the rod and the plate.
  • the wall material defines an inner surface of an unbroken path connecting the first through opening with the second through opening.
  • methods of heating molten material with embodiments of the apparatus above can comprise heating molten material within the containment area by passing electricity through the molten material from the first electrode to the second electrode.
  • the method can further comprise cooling the side wall portion with targeted enhanced cooling of the side wall portion of the side wall with the cooling device.
  • the cooling of the side wall portion can be targeted vertically below a lower periphery of the first through opening with the cooling device.
  • the side wall portion can be cooled by circulating fluid with the cooling device.
  • a cooling plate of the cooling device can be forced in a direction toward the side wall portion.
  • FIG. 1 schematically illustrates an exemplary embodiment of a glass manufacturing apparatus in accordance with embodiments of the disclosure
  • FIG. 2 shows a perspective cross-sectional view of the glass manufacturing apparatus along line 2-2 of FIG. 1 in accordance with embodiments of the disclosure
  • FIG. 3 shows a schematic view of a portion of the glass manufacturing apparatus along line 3-3 of FIG. 1 in accordance with embodiments of the disclosure
  • FIG. 4 shows a schematic cross-sectional view of the glass manufacturing apparatus along line 4-4 of FIG. 3 in accordance with embodiments of the disclosure
  • FIG. 5 shows an enlarged portion of the cross-sectional view of the glass manufacturing apparatus taken at view 5A of FIG. 4, wherein the enlarged portion of the cross-sectional view of the glass manufacturing apparatus taken at view 5B of FIG. 4 can comprise a mirror image of FIG. 5;
  • FIG. 6 shows a partial cross-sectional view of the glass manufacturing apparatus taken along line 6-6 of FIG. 5;
  • FIG. 7 shows a partial cross-sectional view of the glass manufacturing apparatus taken along line 7-7 of FIG. 5.
  • a glass manufacturing apparatus can optionally include a glass forming apparatus that forms a glass article (e.g., a glass ribbon and/or a glass sheet) from a quantity of molten material.
  • the glass manufacturing apparatus can optionally comprise a glass forming apparatus such as a slot draw apparatus, float bath apparatus, down-draw apparatus, up-draw apparatus, press-rolling apparatus, or other glass forming apparatus that forms a glass article.
  • the glass article can be employed in a variety of articles having desired optical characteristics (e.g., ophthalmic articles, display articles).
  • the apparatus can be employed to produce display articles (e.g., display glass sheets) that may be used in a wide variety of display applications including, but not limited to, liquid crystal displays (LCDs), electrophoretic displays (EPD), organic light emitting diode displays (OLEDs), plasma display panels (PDPs), and other electronic displays.
  • display articles e.g., display glass sheets
  • LCDs liquid crystal displays
  • EPD electrophoretic displays
  • OLEDs organic light emitting diode displays
  • PDPs plasma display panels
  • an exemplary glass manufacturing apparatus 100 can include a glass forming apparatus 101 including a forming vessel 140 designed to produce a glass ribbon 103 from a quantity of molten material 121.
  • the glass ribbon 103 can include a central portion 152 disposed between opposite, relatively thick edge beads formed along a first outer edge 153 and a second outer edge 155 of the glass ribbon 103.
  • a glass sheet 104 can be separated from the glass ribbon 103 along a separation path 151 by a glass separator 149 (e.g., scribe, score wheel, diamond tip, laser, etc.).
  • the relatively thick edge beads formed along the first outer edge 153 and the second outer edge 155 can be removed to provide the central portion 152 as a high-quality glass sheet 104 having a uniform thickness.
  • the resulting high-quality glass sheet 104 can then be one of processed and employed in a variety of applications.
  • the glass manufacturing apparatus 100 can include a melting vessel 105 oriented to receive batch material 107 from a storage bin 109.
  • the batch material 107 can be introduced by a batch delivery device 111 powered by a motor 113.
  • an optional controller 115 can be operated to activate the motor 113 to introduce a desired amount of batch material 107 into the melting vessel 105, as indicated by arrow 117.
  • the melting vessel 105 can heat the batch material 107 to provide molten material 121.
  • a glass melt probe 119 can be employed to measure a level of molten material 121 within a standpipe 123 and communicate the measured information to the controller 115 by way of a communication line 125.
  • the glass manufacturing apparatus 100 can include a first conditioning station including a fining vessel 127 located downstream from the melting vessel 105 and coupled to the melting vessel 105 by way of a first connecting conduit 129.
  • molten material 121 can be gravity fed from the melting vessel 105 to the fining vessel 127 by way of the first connecting conduit 129.
  • gravity can drive the molten material 121 to pass through an interior pathway of the first connecting conduit 129 from the melting vessel 105 to the fining vessel 127.
  • bubbles can be removed from the molten material 121 within the fining vessel 127 by various techniques.
  • the glass manufacturing apparatus 100 can further include a second conditioning station including a mixing chamber 131 that can be located downstream from the fining vessel 127.
  • the mixing chamber 131 can be employed to provide a homogenous composition of molten material 121, thereby reducing or eliminating inhomogeneity that may otherwise exist within the molten material 121 exiting the fining vessel 127.
  • the fining vessel 127 can be coupled to the mixing chamber 131 by way of a second connecting conduit 135.
  • molten material 121 can be gravity fed from the fining vessel 127 to the mixing chamber 131 by way of the second connecting conduit 135.
  • gravity can drive the molten material 121 to pass through an interior pathway of the second connecting conduit 135 from the fining vessel 127 to the mixing chamber 131.
  • the glass manufacturing apparatus 100 can include a third conditioning station including a delivery vessel 133 that can be located downstream from the mixing chamber 131.
  • the delivery vessel 133 can condition the molten material 121 to be fed into an inlet conduit 141.
  • the delivery vessel 133 can function as an accumulator and/or flow controller to adjust and provide a consistent flow of molten material 121 to the inlet conduit 141.
  • the mixing chamber 131 can be coupled to the delivery vessel 133 by way of a third connecting conduit 137.
  • molten material 121 can be gravity fed from the mixing chamber 131 to the delivery vessel 133 by way of the third connecting conduit 137.
  • gravity can drive the molten material 121 to pass through an interior pathway of the third connecting conduit 137 from the mixing chamber 131 to the delivery vessel 133.
  • a delivery pipe 139 e.g., downcomer
  • a delivery pipe 139 can be positioned to deliver molten material 121 to the inlet conduit 141 of the forming vessel 140.
  • forming vessels can be provided in accordance with features of the disclosure including a forming vessel with a wedge for fusion drawing the glass ribbon, a forming vessel with a slot to slot draw the glass ribbon, or a forming vessel provided with press rolls to press roll the glass ribbon from the forming vessel.
  • the forming vessel 140 shown and disclosed below can be provided to fusion draw molten material 121 off a root 145 of a forming wedge 209 to produce the glass ribbon 103.
  • the molten material 121 can be delivered from the inlet conduit 141 to the forming vessel 140.
  • the molten material 121 can then be formed into the glass ribbon 103 based on the structure of the forming vessel 140.
  • the molten material 121 can be drawn off the bottom edge (e.g., root 145) of the forming vessel 140 along a draw path extending in a draw direction 157 of the glass manufacturing apparatus 100.
  • edge directors 163a, 163b can direct the molten material 121 off the forming vessel 140 and define a width“WR” of the glass ribbon 103.
  • the width“WR” of the glass ribbon 103 can extend between the first outer edge 153 of the glass ribbon 103 and the second outer edge 155 of the glass ribbon 103.
  • FIG. 2 shows a cross-sectional perspective view of the glass manufacturing apparatus 100 along line 2-2 of FIG. 1.
  • the forming vessel 140 can include a trough 201 oriented to receive the molten material 121 from the inlet conduit 141.
  • a trough 201 oriented to receive the molten material 121 from the inlet conduit 141.
  • cross-hatching of the molten material 121 is removed from FIG. 2 for clarity.
  • the forming vessel 140 can further include the forming wedge 209 including a pair of downwardly inclined converging surface portions 207a, 207b extending between opposed ends 210a, 210b (See FIG. 1) of the forming wedge 209.
  • the pair of downwardly inclined converging surface portions 207a, 207b of the forming wedge 209 can converge along the draw direction 157 to intersect along a bottom edge of the forming wedge 209 to define the root 145 of the forming vessel 140.
  • a draw plane 213 of the glass manufacturing apparatus 100 can extend through the root 145 along the draw direction 157.
  • the glass ribbon 103 can be drawn in the draw direction 157 along the draw plane 213.
  • the draw plane 213 can bisect the root 145 although, in some embodiments, the draw plane 213 can extend at other orientations relative to the root 145.
  • the molten material 121 can flow in a direction 159 into the trough 201 of the forming vessel 140.
  • the molten material 121 can then overflow from the trough 201 by simultaneously flowing over corresponding weirs 203a, 203b and downward over the outer surfaces 205a, 205b of the corresponding weirs 203a, 203b.
  • Respective streams of molten material 121 can then flow along the downwardly inclined converging surface portions 207a, 207b of the forming wedge 209 to be drawn off the root 145 of the forming vessel 140, where the flows converge and fuse into the glass ribbon 103.
  • the glass ribbon 103 can then be fusion drawn off the root 145 in the draw plane 213 along the draw direction 157.
  • the glass separator 149 (see FIG. 1) can then subsequently separate the glass sheet 104 from the glass ribbon 103 along the separation path 151.
  • the separation path 151 can extend along the width“WR” of the glass ribbon 103 between the first outer edge 153 and the second outer edge 155. Additionally, in some embodiments, the separation path 151 can extend substantially perpendicular to the draw direction 157 of the glass ribbon 103.
  • the draw direction 157 can be a fusion draw direction of the glass ribbon 103 being fusion drawn from the forming vessel 140.
  • the glass ribbon 103 can be drawn from the root 145 with a first major surface 215a of the glass ribbon 103 and a second major surface 215b of the glass ribbon 103 facing opposite directions and defining a thickness“T” (e.g., average thickness) of the glass ribbon 103.
  • T thickness“T” (e.g., average thickness) of the glass ribbon 103.
  • the thickness “T’ of the glass ribbon 103 can be less than or equal to about 2 millimeters (mm), less than or equal to about 1 millimeter, less than or equal to about 0.5 millimeters, less than or equal to about 500 micrometers (pm), for example, less than or equal to about 300 pm, less than or equal to about 200 pm, or less than or equal to about 100 pm, although other thicknesses may be provided in further embodiments.
  • the thickness“ ⁇ ” of the glass ribbon 103 can be from about 50 mih to about 750 mih, from about 100 mih to about 700 mih, from about 200 mih to about 600 mih, from about 300 mih to about 500 mih, from about 50 mih to about 500 mih, from about 50 mih to about 700 mih, from about 50 mih to about 600 mih, from about 50 mih to about 500 mm, from about 50 mih to about 400 mih, from about 50 mih to about 300 mih, from about 50 mm to about 200 mih, from about 50 mih to about 100 mih, including all ranges and subranges of thicknesses therebetween.
  • the glass ribbon 103 can include a variety of compositions including, but not limited to, soda-lime glass, borosilicate glass, alumino-borosilicate glass, alkali-containing glass or alkali-free glass.
  • FIGS. 3-7 show an embodiment of a heating apparatus 300 for heating molten material 121.
  • the heating apparatus 300 can include a vessel including a containment area for containing molten material.
  • the heating apparatus 300 may be applied to various vessels in the glass manufacturing apparatus 100.
  • the heating apparatus 300 can be employed to vessels that can process material in a wide range of ways including but not limited to fining, conditioning, containing, stirring, chemically reacting, bubbling a gas therein, cooling, heating, forming, holding and flowing.
  • the heating apparatus 300 can include a vessel that comprises, but is not limited to, the melting vessel 105, first connecting conduit 129, fining vessel 127, the standpipe 123, the second connecting conduit 135, the mixing chamber 131, the third connecting conduit 137, the delivery vessel 133, the delivery pipe 139, the inlet conduit 141 and the forming vessel 140.
  • the heating apparatus 300 comprises the melting vessel 105 including a base wall 313 and a side wall 310 extending from the base wall 313.
  • the base wall 313 connects to the bottom of the side wall 310 to form a containment area 315.
  • the base wall 313 and side wall 310 can be formed from bricks of refractory material that can contain molten material at high temperatures.
  • the side wall 310 can include a rectangular (e.g., square) shape as viewed from the top shown in FIG. 3 although other shapes may be provided. Indeed, as shown in FIG. 3, the side wall 310 can include four side wall segments arranged in a rectangular (e.g., square) shape.
  • the side wall can comprise a single side wall segment that has a curvilinear shape (e.g., elliptical, oblong, circular).
  • a curvilinear shape e.g., elliptical, oblong, circular.
  • four side wall segments are illustrated, three or more than four side wall segments may be provided in further embodiments.
  • FIG. 3 shows a plan view of a portion of the glass manufacturing apparatus 100 including the melting vessel 105 along line 3-3 of FIG. 1, with a top portion (e.g., lid, roof, ceiling) of the melting vessel 105 removed for clarity.
  • the melting vessel 105 can include a fixed or removable top portion without departing from the scope of the disclosure.
  • the top portion of the melting vessel 105 can be open to, for example, the environment outside of the melting vessel 105, and a free surface of the molten material 121 can face the open top portion.
  • an inner surface 311 of the side wall 310 and an inner surface 312 of the base wall 313 can define a containment area 315 of the vessel.
  • the containment area 315 can include a wide range of three- dimensional shapes such as, but not limited to, a sphere, a rectangular box, a cylinder, a cone, or other three-dimensional shape oriented to provide the containment area 315.
  • Exemplary embodiments of an exemplary heating apparatus 300 discussed above have been described with respect to heating molten material 121 contained within the containment area 315 of the melting vessel 105 with the understanding that, unless otherwise noted, one or more features of the heating apparatus 300 can be employed, alone or in combination, in some embodiments, to heat material contained within a containment area of other vessels of the glass manufacturing apparatus 100.
  • the containment area 315 can contain material (e.g., batch material 107, molten material 121); however, unless otherwise noted, it is to be understood that the melting vessel 105 can be empty (e.g., provided without material) in some embodiments, without departing from the scope of the disclosure.
  • the side wall 310 of the melting vessel 105 can include (e.g., be manufactured from) metallic and/or non-metallic materials including but not limited to one or more of a thermal insulating refractory material (e.g., ceramic, silicon carbide, zirconia, zircon, chromium oxide).
  • a portion of the inner surface 311, 312 of the melting vessel 105 can be defined by a wall material 501 of the side wall 310 and the base wall 313 to provide the containment area 315 with a corrosion resistant barrier for the material 107, 121 contained within the containment area 315.
  • the side wall 310 and base wall 313 of the melting vessel 105 can include material selected to resist structural degradation and deformation (e.g., warp, sag, creep, fatigue, corrosion, breakage, cracking, thermal shock, structural shock, etc.) caused by exposure to one or more of an elevated temperature (e.g., temperatures at or below 2l00°C), a corrosive chemical (e.g., boron, phosphorus, sodium oxide), and an external force.
  • an elevated temperature e.g., temperatures at or below 2l00°C
  • a corrosive chemical e.g., boron, phosphorus, sodium oxide
  • the side wall 310 and/or base wall 313 can be manufactured as a solid monolithic structure; however, in some embodiments, a plurality of separate structures (e.g., bricks) can be combined (e.g., stacked, placed) to provide a portion of the side wall 310 and/or a portion of the base wall 313.
  • a containment vessel can be provided with inner surface 311, 312 defining a portion of a containment area 315 oriented to contain material 107, 121 within the containment area 315.
  • the heating apparatus 300 for heating molten material can include a first electrode 301 and a second electrode 302 operable to heat (e.g., melt) the batch material 107 to provide molten material 121 and/or to heat molten material 121 contained within the containment area 315.
  • the first electrode 301 and the second electrode 302 can be identical to one another.
  • discussion throughout the disclosure features of the first electrode 301 can be identical to features of the second electrode 302.
  • structures associated and/or operable with the first electrode 301 can be identical to structures associated and/or operable with the second electrode 302.
  • first electrode 301 and structures associated and/or operable with the first electrode 301 can equally apply to the features of the second electrode 302 and structures associated and/or operable with the second electrode 302.
  • features of the second electrode 302 and/or structures associated and/or operable with the second electrode 302 may not be identical to corresponding features of the first electrode 301 and/or corresponding structures associated with the first electrode 301.
  • the first electrode 301 can include a portion positioned within a first through opening 401 of the side wall 310. As shown, a front face 303 of an outer end of the first electrode 301 can contact molten material 121 contained within the containment area 315. As further illustrated, the second electrode 302 can include a portion positioned within a second through opening 402 of the side wall 310. A front face 304 of an outer end of the second electrode 302 can also contact molten material 121 contained within the containment area 315.
  • a heating electrical circuit including a first electrical lead 307 electrically connected to the first electrode 301 and a second electrical lead 308 electrically connected to the second electrode 302.
  • the material e.g., batch material 107, molten material 121
  • the material can include material properties that cause the material to behave as an electrical resistor which converts an electric current 325 passing through the material 107, 121 into heat energy based on the principle of Joule heating.
  • electric current 325 can pass from the front face 303 of the first electrode 301, through the material 107, 121 contained in the containment area 315, to the front face 304 of the second electrode 302.
  • electric current 325 can pass from the front face 304 of the second electrode 302, through the material 107, 121 contained in the containment area 315, to the front face 303 of the first electrode 301.
  • one or more features of the heating apparatus 300 can operate to increase a temperature of the material 107, 121 and/or maintain a temperature of the material 107, 121 contained within the containment area 315.
  • a temperature of a rear face 305 of the first electrode 301 can be less than a temperature of the front face 303 of the first electrode 301.
  • a temperature of a rear face 306 of the second electrode 302 can be less than a temperature of the front face 304 of the second electrode 302.
  • a cooling device e.g., cooling plate
  • Each through opening 401, 402 can extend entirely through the side wall 310 to allow each electrode 301, 302 to be inserted through the wall and translated in corresponding inward directions 351, 352. As shown, each opening 401, 402 can extend through opposite side wall segments of four side wall segments of the side wall 310. In embodiments with a single sidewall or other shaped sidewall, the each opening 401, 402 can optionally be provided on opposite portions of the side wall. As shown, in some embodiments, the first through opening 401 and the second through opening 402 can be aligned along a common axis.
  • the front face 303 of the first electrode 301 can face the front face 304 of the second electrode 302 with the front faces 303, 304 contacting the material 107, 121 contained within the containment area 315 of the melting vessel 105. Accordingly, in some embodiments, electric current 325 can pass from the front face 303 of the first electrode 301 positioned in the first opening 401 through the material 107, 121 contained in the containment area 315, to the front face 304 of the second electrode 302 positioned in the second opening 402.
  • electric current 325 can pass from the front face 304 of the second electrode 302 positioned in the second opening 402, through the material 107, 121 contained in the containment area 315, to the front face 303 of the first electrode 301 positioned in the first opening 401.
  • one of the front face 303 of the first electrode 301 and the front face 304 of the second electrode 302 can wear, for example, over a duration of time based on operation of the heating apparatus 300 and contact with the material 107, 121.
  • the first electrode 301 can be adjusted relative to the first opening 401 to translate the front face 303 along an adjustment path in the inward direction 351, thereby compensating for the structural degradation of the front face 303 caused by wear while operating the glass manufacturing apparatus 100.
  • the second electrode 302 can be adjusted relative to the second opening 404 to translate the front face 304 along an adjustment path in the inward direction 352, thereby compensating for the structural degradation of the front face 304 caused by wear while operating the glass manufacturing apparatus 100.
  • the inner surface 311, 312 of the side wall 310 and base wall 313 as well as the front face 303 of the first electrode 301 and the front face 304 of the second electrode 302 can define the containment area 315 of the melting vessel 105.
  • the first electrode 301 and/or the second electrode 302 can include (e.g., be manufactured from) metallic and/or non-metallic materials including but not limited to one or more of tin oxide, carbon, zirconia, molybdenum, platinum, and platinum alloys.
  • the front face 303 of the outer end of the first electrode 301 and the front face 304 of the outer end of the second electrode 302 can contact the material 107, 121 contained within the containment area 315 of the melting vessel 105.
  • the first electrode 301 and/or the second electrode 302 can include material selected to resist structural degradation and deformation (e.g., warp, sag, creep, fatigue, corrosion, breakage, cracking, thermal shock, structural shock, etc.) caused by exposure to one or more of an elevated temperature (e.g., temperatures at or below 2l00°C), a corrosive chemical (e.g., boron, phosphorus, sodium oxide), and an external force.
  • structural degradation and deformation e.g., warp, sag, creep, fatigue, corrosion, breakage, cracking, thermal shock, structural shock, etc.
  • an elevated temperature e.g., temperatures at or below 2l00°C
  • a corrosive chemical e.g., boron, phosphorus, sodium oxide
  • the first electrode 301 and/or the second electrode 302 can be manufactured as a single monolithic structure; however, in some embodiments, a plurality of separate structures (e.g., bricks) can be combined (e.g., stacked) to provide a portion of the first electrode 301 and/or the second electrode 302. Building the electrode from a plurality of separate structures (e.g., bricks) can help simplify and reduce costs of fabrication of the electrode.
  • a plurality of separate structures e.g., bricks
  • one or more further heating devices can be provided to, for example, initially melt the batch material 107 to provide the molten material 121 contained within the containment area 315, and then the heating apparatus 300 can be employed to further melt the batch material 107 and/or further heat the molten material 121.
  • one or more additional heating devices including but not limited to gas heaters, electric heaters, and resistance heaters can be provided to provide additional heat to the material 107, 121 contained within the containment area 315 of the melting vessel 105 without departing from the scope of the disclosure.
  • the heating apparatus 300 can, therefore, be employed to, for example, heat the material 107, 121 contained within the containment area 315 of the melting vessel 105.
  • the molten material 121 can flow through the containment area 315 to the first connecting conduit 129 (e.g., across the electric current 325) while being heated by the heating apparatus 300.
  • the molten material 121 can then be provided to the glass forming apparatus 101 for further processing to, for example, form the glass ribbon 103 (See FIG. 1).
  • the heating apparatus 300 can be used to heat a wide range of molten material 121 including a wide range of resistivities.
  • example samples of molten material (Ml, M2, M3) can include resistivities at 1500 °C and 1600 °C with an alternating current of 60 Hertz (Hz) as set forth in Table 1 below (Ohms ⁇ centimeter).
  • the molten material can comprise a resistivity at 60 Hz within a range from about 127 (W ⁇ ah) to about 432 (W ⁇ ah) within a temperature range from 1500 °C and 1600 °C.
  • example molten material Ml can include a resistivity at 60 Hz within a range from about 127 (W ⁇ ah) to about 330 (W ⁇ oih) within a temperature range from 1500 °C and 1600 °C.
  • molten material M2 can include a resistivity at 60 Hz within a range from about 178 (W ⁇ oih) to about 406 (W ⁇ oih) within a temperature range from 1500 °C and 1600 °C.
  • molten material M3 can include a resistivity at 60 Hz within a range from about 191 (W ⁇ oih) to about 432 (W ⁇ oih) within a temperature range from 1500 °C and 1600 °C.
  • the example resistivities of the molten material 121 discussed above can be provided, in some embodiments, for molten material configured to be formed into a glass article such as the glass ribbon 103 illustrated in FIG. 1.
  • the wall material can comprise a zirconia fused cast material.
  • the wall material can comprise XiLEC 9 zirconia fused cast material available from Saint-Gobain SEFPRO with a typical chemical composition of 88.4% Zr0 2 , 9.0 % Si0 2 , 1% Ta 2 0 5 / Nb 2 0 5 , 0.7% B 2 0 3 , 0.5% Al 2 0 3 and others less than 0.3% (Ti0 2 +Fe 2 0 3 +Na 2 0+Y 2 0 3 ).
  • the XiLEC 9 zirconia fused cast material can include 89.5% monoclinic zirconia and a 10.5% vitreous phase.
  • the wall material can comprise XiLEC 5 zirconia fused cast material available from Saint-Gobain SEFPRO with a typical chemical composition of 92.6% Zr0 2 , 5.0 % Si0 2 , 1.1% Ta 2 0 5 / Nb 2 0 5 , 0.5% B 2 0 3 , 0.5% Al 2 0 3 and others less than 0.3% (Ti0 2 +Fe 2 0 3 +Na 2 0+Y 2 0 3 ).
  • the XiLEC 5 zirconia fused cast material can include 93.5% monoclinic zirconia and a 6.5% vitreous phase.
  • Resistivities of XiLEC 5 (see X5 in Table 2 below) and XiLEC 9 (see X9 in Table 2 below) are known to include resistivities at 1500 °C and 1600 °C with an alternating current of 60 Hertz (Hz) as set forth in Table 2 below (Ohms ⁇ centimeter).
  • the wall material 501 can comprise a resistivity, at an alternating current of 60 Hz, within a range from about 200 (W ⁇ ah) to about 625 (Q » cm) within a temperature range from 1500 °C and 1600 °C.
  • the resistivity at 60 Hz can be within a range from about 200 (W ⁇ ah) to about 350 (W ⁇ ah) within a temperature range from 1500 °C and 1600 °C.
  • the resistivity at 60 Hz can be within a range from about 375 (W ⁇ ah) to about 625 (Q » cm) within a temperature range from 1500 °C and 1600 °C.
  • Table 3 lists the resistivity ratio of the resistivities XiLEC 5 (X5) and XiLEC 9 (X9) listed in Table 2 relative to the samples of molten material (Ml, M2, M3) listed in Table 1 above.
  • the wall material 501 can be selected such that a 1600 °C resistivity ratio between the resistivity of the wall material 501 at an alternating current of 60 Hz and a temperature of 1600 °C and the molten material 121 being heated by the electrodes at an alternating current of 60 Hz and a temperature of 1600 °C can be greater than or equal to 1.0. Indeed, as shown in the 1600 °C column of Table 3 above, the 1600 °C resistivity ratio between the wall material and the molten material can be within a range of from about 1.0 to about 3.0.
  • the 1600 °C resistivity ratio between the XiLEC 5 wall material and the molten material can be within a range of from about 1.0 to about 1.6.
  • performance can be improved when using XiLEC 9 as the wall material.
  • the 1600 °C resistivity ratio between the XiLEC 9 wall material and the molten material can be within a range of from about 2.0 to about 3.0. Comparing the 1500 °C resistivity ratio and the 1600 °C resistivity ratio in Table 3 above, the resistivity ratio increases as the temperature increases, thereby suggesting that the resistivity of the samples of glass falls relatively faster than the wall material fabricated from XiLEC 9 and XiLEC 5 material as the temperature increases.
  • XiLEC 9 and XiLEC 5 material can provide even larger resistivity ratios between the wall material and the molten material to provide even further resistance to shorting of the electrical current at elevated operating temperatures.
  • the wall material 501 can define an inner surface of an unbroken path connecting the first through opening 401 with the second through opening 402.
  • the relatively high resistivity of the wall material 501 can further help prevent electrical shorting between the electrodes 301, 302 by providing the wall material 501 with relatively higher resistivity than the molten material along the shortest path between the electrodes.
  • the side wall 310 comprises a first side wall portion 403a elevationally defined between an elevation of the base wall 313 and an elevation of a lower periphery of the first through opening 401.
  • a height“HI” of the first side wall portion 403a can be defined as a difference between the elevation of the lower periphery of the first through opening 401 and the elevation of the base wall 313.
  • the height“HI” of the first side wall portion 403a can be the distance between the lowermost portion of the first opening 401 at the inner surface 311 of the side wall 310 and the elevation of the inner surface 312 of the base wall 313 at a location below the first opening 401.
  • the side wall 310 can further comprise a second side wall portion 403b elevationally defined between an elevation of the base wall 313 and an elevation of a lower periphery of the second through opening 402.
  • the second side wall portion 403b can also include a corresponding height also defined as the distance between the lowermost portion of the second opening 402 and the inner surface 311 of the side wall 310 and the elevation of the inner surface 312 of the base wall 313 at a location below the second opening 402.
  • the height“HI” of the first side wall portion 403a and/or the second side wall portion 403b can be greater than 2 inches (about 5 cm) such as greater than 6 inches (about 15 cm) to increase the shortest distance between the electrodes 301, 302, thereby decreasing the likelihood of electrical current shorting of the electrodes 301, 302 through the inner surfaces 311, 312 of the side wall 310 and base wall 313.
  • increasing the height“HI” of the first side wall portion 403a and/or the second side wall portion 403b can be provided while also providing the wall material 501 defining portions of the inner surfaces 311, 312 (e.g., as discussed above) to further increase the resistivity of the side wall and base wall to still further decrease the likelihood of shorting of the electrodes 301, 302 through the inner surfaces 311, 312 of the side wall 310 and base wall 313 between the electrodes.
  • the lower pair of corners 701a, 701b of the opening 401, 402 can rise to particularly relatively high temperatures.
  • the first side wall portion 403a of the side wall 310 located beneath the width“W” of the first opening 401 can experience overheating.
  • Thermal conditions can provide further overheating at the lower corners 701a, 701b of the openings.
  • overheating can result in undesired wearing of the side wall 310 that can result in failure of the vessel over time and/or other performance inefficiencies of the vessel.
  • overheating can reduce the resistivity of the wall material 501; thereby undesirably increasing the chance of shorting between the electrodes 301, 302.
  • the first side wall portion 403a of the side wall 310 can be provided with a first cooling device 405a and the second side wall portion 403b of the side wall 310 can be provided with a second cooling device 405b.
  • the cooling devices 405a, 405b can provide targeted enhanced cooling of the side wall 310 and/or base wall 313 to reduce the otherwise relatively high temperatures associated with the side wall portions 403a, 403b of the side wall 310 located beneath the width“W” of the openings and/or lower corners 701a, 701b of the openings 401,
  • targeted enhanced cooling means that cooling is enhanced at a predetermined target area relative to cooling that may or may not take place at other areas.
  • a cooling device may physically contact the target area (e.g., the entire target area) to promote targeted enhanced cooling at the target area.
  • Targeted enhanced cooling can be desired to avoid overcooling other areas of the vessel that do not otherwise experience overheating in use. As such, by employing targeted enhanced cooling, energy consumption can be reduced and undesired temperature differentials in the walls of the vessel can be avoided.
  • the targeted enhanced cooling can be take place at an elevation of the side wall 310 and/or base wall 313 that is less than or equal to the elevation“E” at 25% of the height“H2” of the electrode 301, 302.
  • the elevation“E” can correspond to a distance“D” from the lower surface 314 of the base wall 313 equal to the thickness “T” of the base wall 313 added to the height“HI” of the wall portion and 25% of the height“H2” of the electrode.
  • the targeted enhanced cooling can take place on the side wall 310 and/or the base wall 313 surrounding the openings 401, 402.
  • the area of the targeted enhanced cooling can include an area at or below the lower periphery of the openings 401, 402 and lateral portions extending to the lateral sides of the openings 401, 402 up to the distance “D”.
  • Targeted enhanced cooling above the lowermost portion of the openings 401, 402, such as up to 25% of the height“H2” of the electrode as discussed above can help accommodate overheated portions above the lowermost portions of the openings 401, 402 resulting from the relatively high temperatures associated with the lower comers 701a, 401b of the openings 401, 402 and below the openings 401, 402 discussed above.
  • the targeted enhanced cooling can take place at an elevation of the side wall 310 and/or base wall 313 at or below the lower periphery of the openings 401, 402.
  • targeted enhanced cooling can occur at a distance from the lower surface 314 of the base wall 313 equal to the thickness“T” of the base wall 313 added to the height“HI” of the side wall portion.
  • the targeted enhanced cooling can take place at an elevation of the side wall 310 and/or base wall 313 at or below the lower periphery of the openings 401, 402 and within the lateral width“W” of the openings 401, 402.
  • the targeted enhanced cooling can be limited to the side wall portion 403a, 403b within the height“HI” of the side wall portion and within the lateral width“W” of the opening 401, 402 below the opening 401, 402.
  • such targeted enhanced cooling locations can accommodate relatively high temperatures associated with the lower corners 701a, 701b and below the openings 401, 402 discussed above.
  • the first cooling device 405a can contact an outer surface 503 of the first side wall portion 403a.
  • the cooling device can comprise the illustrated plate 505 to provide increased heat transfer from the first side wall portion 403a.
  • a rod 507 may be positioned to force the plate 505 in a direction 509 towards the outer surface 503 of the first side wall portion 403a to enhance heat transfer from the first side wall portion 403a to the plate 505.
  • each side of the plate 505 can optionally include a bracket 601.
  • a thrust plate 603 can be coupled to the end of the rod 507 to help distribute the force over a larger area, thereby reducing the pressure being applied across the surface of the bracket 601.
  • a pad 605 positioned between the rod 507 and the plate 505 to increase an electrical resistance between the rod 507 and the plate 505.
  • the illustrated pad 605 can comprise an electrical insulating material that may be sandwiched between the thrust plate 603 and the bracket 601. As such, shorting of electrical current from the electrodes 301, 302, through the rod to ground can be avoided.
  • the plate 505 can comprise a solid plate designed to provide a heat sink for the first side wall portion 403a.
  • the plate 505 can comprise an internal fluid passage 511 to enhance heat transfer provided by the plate 505.
  • the internal fluid passage 511 can optionally define a serpentine path 607 (see FIG. 6).
  • the plate 505 can include a fluid inlet port 609 and a fluid outlet port 611.
  • An inlet conduit 613 can be coupled to the fluid inlet port 609 wherein an inlet cooling fluid stream 615 can be introduced into the internal fluid passage 511 of the plate 505.
  • the fluid stream may then travel along the serpentine path 607 to provide convection heat transfer prior to exiting the fluid outlet port 611 to be carried away by an outlet conduit 617 as an outlet heated fluid stream 619.
  • a conformable conductive pad 513 may be placed between the plate 505 and the outer surface 503 of the first side wall portion 403a.
  • the conformable pad can enhance thermal communication between the plate 505 and the first side wall portion 403a.
  • the conductive pad 513 can be formed from a wide range of materials such as a metal mesh pad that can be compressed to conform to the engaged surfaces of the plate 505 and the outer surface 503 of the first side wall portion 403a.
  • the plate 505 contacts a portion or the entire area of targeted enhanced cooling discussed above.
  • the plate 505 can be pressed against the outer surface 503 of the first sidewall portion 403a and may also be pressed against the corresponding outer surface of the base wall 313 at a portion or the entire area of the targeted enhanced cooling discussed above.
  • the plate 505 does not contact the electrode associated with the opening to help prevent shorting of the electrode.
  • the batch material 107 can be introduced by the batch delivery device 111 into the containment area 315 of the melting vessel 105.
  • the melting vessel 105 can heat the batch material 107 to provide molten material 121 within the containment area 315.
  • the melting vessel 105 may be operable to raise or lower the temperature of a molten material contained within the containment area 315.
  • the method of heating the molten material 121 within the containment area 315 can include passing the electric current 325 through the molten material 121 from the first electrode 301 to the second electrode 302.
  • the method can include cooling the side wall portion 403a, 403b with targeted enhanced cooling of the side wall portion 403a, 403b with the cooling device 405a, 405b.
  • the cooling of the side wall portion 403a, 403b with the cooling device 405a, 405b can be targeted vertically below a lower periphery of the respective through opening 401, 402. Providing targeted enhanced cooling can reduce otherwise excessive temperatures below the electrodes 301, 302 to preserve the integrity of the vessel.
  • the targeted enhanced cooling can help prevent overheating of the wall material 501 defining the inner surface 311 of the side wall portion 403a, 403b to help prevent shorting of electrical current between the electrodes 301, 302.
  • heating efficiency provided by the electric current 325 passing through the molten material 121 between the electrodes 301, 302 can be increased and damage to the wall material 501 can be avoided.
  • the side wall portion 403a, 403b can be cooled by circulating fluid with the cooling device 405a, 405b.
  • the fluid can comprise liquid (e.g., water) or gas (e.g., air) that may be circulated through the internal fluid passage 511 from the fluid inlet port 609 to the fluid outlet port 611.
  • liquid e.g., water
  • gas e.g., air
  • convective heat transfer may help transfer heat from the side wall portion 403a, 403b to the fluid circulating through the internal fluid passage 511.
  • the absorbed heat can be removed from the side wall portion 403a, 403b and carried away with the fluid exiting the fluid outlet port 611.
  • the fluid may circulate within a closed system where a heat exchanger may remove absorbed heat from the fluid as the fluid travels from the fluid outlet port 611 back to the fluid inlet port 609.
  • the method can include forcing the cooling device 405a, 405b in the direction 509 toward the side wall portion 403a, 403b.
  • a drive nut 515 may be rotatably mounted to a bracket 517 secured to a base support 519.
  • the rod 507 can include external threads that are threadedly received within a threaded through bore of the drive nut 515.
  • a motor (not shown) can rotate the drive nut 515 to force the rod 507 in the direction 509.
  • the force applied by the rod 507 can partially collapse the conformable conductive pad 513 to allow the pad to mold to the surface topography of the facing surfaces of the plate 505 and the side wall portion 603a, 603b.
  • the force applied by the rod 507 can ensure thermal contact between the plate 505 and the side wall portion 603a, 603b while also allowing the conductive pad 513 to conform and further enhance the thermal coupling efficiency of the plate 505 and side wall portion 603a, 603b.
  • Embodiments described herein can be implemented as one or more computer program products, i.e., one or more modules of computer program instructions encoded on a tangible program carrier for execution by, or to control the operation of, data processing apparatus.
  • the tangible program carrier can be a computer readable medium.
  • the computer readable medium can be a machine-readable storage device, a machine-readable storage substrate, a memory device, or a combination of one or more of them.
  • processor or“controller” can encompass all apparatus, devices, and machines for processing data, including by way of example a programmable processor, a computer, or multiple processors or computers.
  • the processor can include, in addition to hardware, code that creates an execution environment for the computer program in question, e.g., code that constitutes processor firmware, a protocol stack, a database management system, an operating system, or a combination of one or more of them.
  • a computer program (also known as a program, software, software application, script, or code) can be written in any form of programming language, including compiled or interpreted languages, or declarative or procedural languages, and it can be deployed in any form, including as a standalone program or as a module, component, subroutine, or other unit suitable for use in a computing environment.
  • a computer program does not necessarily correspond to a file in a file system.
  • a program can be stored in a portion of a file that holds other programs or data (e.g., one or more scripts stored in a markup language document), in a single file dedicated to the program in question, or in multiple coordinated files (e.g., files that store one or more modules, sub programs, or portions of code).
  • a computer program can be deployed to be executed on one computer or on multiple computers that are located at one site or distributed across multiple sites and interconnected by a communication network.
  • the processes described herein can be performed by one or more programmable processors executing one or more computer programs to perform functions by operating on input data and generating output.
  • the processes and logic flows can also be performed by, and apparatus can also be implemented as, special purpose logic circuitry, e.g., an FPGA (field programmable gate array) or an ASIC (application specific integrated circuit) to name a few.
  • FPGA field programmable gate array
  • ASIC application specific integrated circuit
  • processors suitable for the execution of a computer program include, by way of example, both general and special purpose microprocessors, and any one or more processors of any kind of digital computer.
  • a processor will receive instructions and data from a read only memory or a random-access memory or both.
  • the essential elements of a computer are a processor for performing instructions and one or more data memory devices for storing instructions and data.
  • a computer will also include, or be operatively coupled to receive data from or transfer data to, or both, one or more mass storage devices for storing data, e.g., magnetic, magneto optical disks, or optical disks.
  • mass storage devices for storing data, e.g., magnetic, magneto optical disks, or optical disks.
  • a computer need not have such devices.
  • a computer can be embedded in another device, e.g., a mobile telephone, a personal digital assistant (PDA), to name just a few.
  • PDA personal digital assistant
  • Computer readable media suitable for storing computer program instructions and data include all forms data memory including nonvolatile memory, media and memory devices, including by way of example semiconductor memory devices, e.g., EPROM, EEPROM, and flash memory devices; magnetic disks, e.g., internal hard disks or removable disks; magneto optical disks; and CD ROM and DVD-ROM disks.
  • semiconductor memory devices e.g., EPROM, EEPROM, and flash memory devices
  • magnetic disks e.g., internal hard disks or removable disks
  • magneto optical disks e.g., CD ROM and DVD-ROM disks.
  • the processor and the memory can be supplemented by, or incorporated in, special purpose logic circuitry.
  • a computer having a display device, e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor, and the like for displaying information to the user and a keyboard and a pointing device, e.g., a mouse or a trackball, or a touch screen by which the user can provide input to the computer.
  • a display device e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor
  • a keyboard and a pointing device e.g., a mouse or a trackball, or a touch screen by which the user can provide input to the computer.
  • Other kinds of devices can be used to provide for interaction with a user as well; for example, input from the user can be received in any form, including acoustic, speech, or tactile input.
  • Embodiments described herein can be implemented in a computing system that includes a back end component, e.g., as a data server, or that includes a middleware component, e.g., an application server, or that includes a front end component, e.g., a client computer having a graphical user interface or a Web browser through which a user can interact with implementations of the subject matter described herein, or any combination of one or more such back end, middleware, or front end components.
  • the components of the system can be interconnected by any form or medium of digital data communication, e.g., a communication network. Examples of communication networks include a local area network (“LAN”) and a wide area network (“WAN”), e.g., the Internet.
  • LAN local area network
  • WAN wide area network
  • the computing system can include clients and servers.
  • a client and server are generally remote from each other and typically interact through a communication network.
  • the relationship of client and server arises by virtue of computer programs running on the respective computers and having a client-server relationship to each other.
  • Ranges can be expressed herein as from“about” one particular value, and/or to “about” another particular value. When such a range is expressed, embodiments include from the one particular value and/or to the other particular value. Similarly, when values are expressed as approximations, by use of the antecedent“about,” it will be understood that the particular value forms another embodiment. It will be further understood that the endpoints of each of the ranges are significant both in relation to the other endpoint, and independently of the other endpoint. [0091] The terms“substantial,”“substantially,” and variations thereof as used herein are intended to note that a described feature is equal or approximately equal to a value or description.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Glass Melting And Manufacturing (AREA)

Abstract

La présente invention concerne un appareil pouvant comprendre un récipient comprenant une zone de confinement délimitée par une surface interne d'une paroi de base et une surface interne d'une paroi latérale. Une partie d'une première et d'une seconde électrode peut être positionnée à l'intérieur d'une première et d'une seconde ouverture traversante respective de la paroi latérale. Selon certains modes de réalisation, un matériau de paroi définissant une partie de la surface interne de la paroi de base peut comprendre une résistivité à 60 Hz comprise dans une plage allant d'environ 200 Ohms⋅cm à 625 Ohms⋅cm dans une plage de température allant de 1 500 °C à 1 600 °C. Selon certains modes de réalisation, un rapport de résistivité à 1 600 °C entre le matériau de paroi et un matériau fondu peut se situer dans une plage d'environ 1,0 à environ 3,0. Selon certains modes de réalisation, un dispositif de refroidissement peut entrer en contact avec une surface externe d'une partie de la paroi latérale.
PCT/US2019/025908 2018-04-06 2019-04-04 Appareil de chauffage d'un matériau fondu WO2019195632A1 (fr)

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Cited By (1)

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CN113582510A (zh) * 2021-08-04 2021-11-02 清远南玻节能新材料有限公司 冷却系统及熔窑

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US20020000101A1 (en) * 1997-08-25 2002-01-03 Chenoweth Vaughn Charles Glass melting apparatus and method
US20060144089A1 (en) * 2002-12-03 2006-07-06 Rainer Eichholz Method and apparatus for heating melts
US8869564B2 (en) * 2006-01-24 2014-10-28 Schott Ag Method for temperature manipulation of a melt
US9206068B2 (en) * 2005-11-04 2015-12-08 Ocv Intellectual Capital, Llc Method of manufacturing S-glass fibers in a direct melt operation and products formed therefrom
US9302927B2 (en) * 2014-03-20 2016-04-05 China Building Materials Academy Vacuum melting furnace for infrared glass and melting system and method thereof

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020000101A1 (en) * 1997-08-25 2002-01-03 Chenoweth Vaughn Charles Glass melting apparatus and method
US20060144089A1 (en) * 2002-12-03 2006-07-06 Rainer Eichholz Method and apparatus for heating melts
US9206068B2 (en) * 2005-11-04 2015-12-08 Ocv Intellectual Capital, Llc Method of manufacturing S-glass fibers in a direct melt operation and products formed therefrom
US8869564B2 (en) * 2006-01-24 2014-10-28 Schott Ag Method for temperature manipulation of a melt
US9302927B2 (en) * 2014-03-20 2016-04-05 China Building Materials Academy Vacuum melting furnace for infrared glass and melting system and method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113582510A (zh) * 2021-08-04 2021-11-02 清远南玻节能新材料有限公司 冷却系统及熔窑

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