WO2019167402A1 - ポンプ装置および基板処理装置 - Google Patents

ポンプ装置および基板処理装置 Download PDF

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Publication number
WO2019167402A1
WO2019167402A1 PCT/JP2018/047350 JP2018047350W WO2019167402A1 WO 2019167402 A1 WO2019167402 A1 WO 2019167402A1 JP 2018047350 W JP2018047350 W JP 2018047350W WO 2019167402 A1 WO2019167402 A1 WO 2019167402A1
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WO
WIPO (PCT)
Prior art keywords
liquid
chemical solution
folded
width
ring
Prior art date
Application number
PCT/JP2018/047350
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
淳樹 西村
小椋　浩之
徹 門間
将司 桐田
栄寿 佐川
省吾 吉田
Original Assignee
株式会社Ｓｃｒｅｅｎホールディングス
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Ｓｃｒｅｅｎホールディングス filed Critical 株式会社Ｓｃｒｅｅｎホールディングス
Publication of WO2019167402A1 publication Critical patent/WO2019167402A1/ja

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B43/00—Machines, pumps, or pumping installations having flexible working members
    • F04B43/02—Machines, pumps, or pumping installations having flexible working members having plate-like flexible members, e.g. diaphragms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching

Definitions

  • the present invention relates to a substrate for an FPD (Flat Panel Display) such as a semiconductor substrate, a liquid crystal display device or an organic EL (electroluminescence) display device, a glass substrate for a photomask, a substrate for an optical disk, a substrate for a magnetic disk, a ceramic substrate, and a solar cell.
  • the present invention relates to a pump device for sending a chemical solution supplied to a substrate such as a substrate for use, and a substrate processing apparatus including the pump device.
  • the pump device is a storage portion that stores a chemical solution, a movable member that reciprocates in the storage portion, and a rolling diaphragm that partitions a storage space in which the chemical solution is stored in the storage portion.
  • the rolling diaphragm having a folded cylindrical portion having an overlapping portion formed by being folded at a position in the suction movement direction of the movable member, and the liquid pushing portion at a preset end position in the pushing movement direction
  • the volume of the accommodating space when the stub is present is 49 cc or less, and the width of the gap between the overlapping portions of the folded cylindrical portion is It is characterized in that the liquid pressing portion is 1/20 or more than 1/6 the width of the.
  • the rolling diaphragm includes a liquid pushing portion, a ring-shaped peripheral portion, and a folded cylindrical portion that connects the liquid pushing portion and the ring-shaped peripheral portion.
  • the folded cylindrical portion has an overlapping portion formed by folding.
  • the width of the gap between the overlapping tubular portions is 1/20 or more and 1/6 or less of the width of the liquid pressing portion. If it is in the range, a chemical
  • the chemical liquid can flow relatively smoothly from the inlet to the outlet. That is, the liquid replacement property of the folded tubular portion is improved. Therefore, the chemical solution is solidified, and the solidified product can be prevented from being mixed in the chemical solution, and the cleanliness of the chemical solution can be maintained.
  • the rolling diaphragm includes a liquid pushing portion, a ring-shaped peripheral portion, and a folded cylindrical portion that connects the liquid pushing portion and the ring-shaped peripheral portion.
  • the folded cylindrical portion has an overlapping portion formed by folding.
  • the width of the gap of the overlapping portion of the folded cylindrical portion is 1/30 or more and 1/5 or less of the width of the liquid pressing portion. If it is in the range, a chemical
  • the chemical liquid can flow relatively smoothly from the inlet to the outlet. That is, the liquid replacement property of the folded tubular portion is improved. Therefore, the chemical solution is solidified, and the solidified product can be prevented from being mixed in the chemical solution, and the cleanliness of the chemical solution can be maintained.
  • the width of the gap of the overlapping portion of the folded tubular portion is the liquid pushing portion.
  • the width of the gap between the liquid pushing portion and the inner wall of the housing portion facing the liquid pushing portion is preferably larger.
  • the rolling diaphragm having a folded cylindrical portion having an overlapping portion formed by being folded at a position in the suction movement direction of The volume of the accommodating space when the liquid pushing portion is present at a preset end position in the case is 49 cc or less, and the width of the gap between the overlapping portions of the folded cylindrical portion is the liquid pushing portion
  • the width is 1/20 or more and 1/6 or less.
  • a substrate processing apparatus includes a holding unit that holds a substrate, a nozzle that discharges a chemical to the substrate held by the holding unit, and a pump device that sends the chemical to the nozzle
  • the pump device includes: a storage portion that stores a chemical solution; a movable member that reciprocates in the storage portion; and a rolling diaphragm that partitions a storage space that stores the chemical solution in the storage portion, the tip of the movable member
  • a liquid pushing part attached to the inner part, a ring-like peripheral part attached to the inner peripheral wall of the housing part, and the liquid pushing part and the ring-shaped peripheral part are connected to each other, and the movable member is connected to the ring-shaped peripheral part.
  • the rolling diaphragm having a folded cylindrical portion having an overlapping portion formed by being folded at a position in the suction movement direction of
  • the volume of the storage space when the liquid pushing portion is present at a preset end position in the case is 0.46 cc or more and 1.5 cc or less
  • the width of the gap of the overlapping portion of the folded cylindrical portion Is 1/30 or more and 1/5 or less of the width
  • the rolling diaphragm of the pump device includes the liquid pushing portion, the ring-shaped peripheral portion, and the folded cylindrical portion that connects the liquid pushing portion and the ring-shaped peripheral portion.
  • the folded cylindrical portion has an overlapping portion formed by folding.
  • the volume of the storage space is 0.46 cc or more and 1.5 cc or less
  • the width of the gap of the overlapping portion of the folded cylindrical portion is 1/30 or more and 1/5 or less of the width of the liquid pressing portion. If it is in the range, a chemical
  • the chemical liquid can flow relatively smoothly from the inlet to the outlet. That is, the liquid replacement property of the folded tubular portion is improved. Therefore, the chemical solution is solidified, and the solidified product can be prevented from being mixed in the chemical solution, and the cleanliness of the chemical solution can be maintained.
  • FIG. 1 is a schematic configuration diagram of a substrate processing apparatus according to an embodiment.
  • 2 and 3 are longitudinal sectional views showing the pump device of the embodiment.
  • FIG. 2 is a diagram when the liquid pushing portion of the rolling diaphragm exists at a preset end position in the pushing movement direction.
  • FIG. 3 is a view when the liquid pushing portion of the rolling diaphragm exists at a position in the suction movement direction.
  • the substrate processing apparatus 1 includes a nozzle 2 and a holding rotation unit 3.
  • the nozzle 2 discharges the chemical liquid onto the substrate W held by the holding rotation unit 3.
  • the chemical solution is, for example, a resist solution, a coating solution for forming an antireflection film, a solvent such as thinner, a rinse solution such as pure water (DIW), a developer, or an etching solution.
  • the holding rotation unit 3 holds the substrate W and rotates the held substrate W.
  • the holding rotation unit 3 includes a spin chuck 4 and a rotation driving unit 5.
  • the spin chuck 4 is configured to be rotatable around the rotation axis AX.
  • the rotation drive unit 5 drives the spin chuck 4 to rotate about the rotation axis AX.
  • the rotation drive unit 5 is composed of an electric motor or the like.
  • the holding rotation unit 3 corresponds to the holding unit of the present invention.
  • the substrate processing apparatus 1 includes a chemical solution supply source 7, chemical solution pipes 8A and 8B, a pump device 9, and on / off valves (ON / OFF valves) V1 and V2.
  • the chemical solution supply source 7 is constituted by, for example, a tank or a bottle that stores the chemical solution.
  • One end of the chemical liquid pipes 8 ⁇ / b> A and 8 ⁇ / b> B is connected to the chemical liquid supply source 7, and the other end is connected to the nozzle 2.
  • a pump device 9 is provided in the chemical solution pipes 8A and 8B between the chemical solution supply source 7 and the nozzle 2.
  • the pump device 9 is a mechanism for feeding a chemical solution. Details of the pump device 9 will be described later.
  • An on-off valve V1 is provided in the chemical liquid pipe 8A between the chemical liquid supply source 7 and the pump device 9.
  • An on-off valve V2 is provided in the chemical liquid pipe 8B between the pump device 9 and the nozzle 2.
  • Each of the on-off valves V1 and V2 supplies a chemical solution and stops the supply.
  • the chemical liquid pipes 8A and 8B may be provided with, for example, at least one of a foreign matter removal filter and a suck back valve for preventing dripping.
  • the pump device 9 includes a chamber 21, a movable member (also referred to as a piston) 23, a rolling diaphragm 25, an electric motor 27, and a conversion mechanism 29.
  • the rolling diaphragm 25 defines a storage space 35 for storing the chemical solution in the chamber 21. That is, the accommodation space 35 is a space surrounded by the inner walls 31 ⁇ / b> A and 31 ⁇ / b> B (including rounded corner portions) of the chamber body 31 and the rolling diaphragm 25.
  • the rolling diaphragm 25 is deformed by the movement of the movable member 23. When the rolling diaphragm 25 is deformed, the volume of the accommodation space 35 changes.
  • the rolling diaphragm 25 includes a liquid pushing portion 41, a peripheral edge portion 43, and a folded cylindrical portion 45.
  • the rolling diaphragm 25 is made of a fluororesin such as PTFE (polytetrafluoroethylene).
  • the liquid pushing portion 41 is attached to the distal end portion of the movable member 23. Therefore, the liquid pushing part 41 is moved integrally with the movable member 23.
  • the peripheral part 43 is ring-shaped.
  • the peripheral portion 43 is attached to an inner peripheral wall (inner wall) 31B such as a cylindrical inner surface of the chamber 21. Specifically, as shown in FIG. 2, the peripheral portion 43 is attached by being sandwiched between the chamber body 31 and the guide portion 33.
  • the width WD1 of the gap 47A of the overlapping portion 47 of the folded tubular portion 45 has the following relationship with the width WD2 of the liquid pushing portion 41. That is, the width WD1 (or the diameter of the roll portion 45A) of the gap 47A of the overlapping portion 47 of the folded tubular portion 45 is 1/20 or more and 1/6 or less of the width of the liquid pressing portion 41. In this case, the volume of the accommodating space 35 when the liquid pushing portion 41 exists at a preset end position in the pushing movement direction is greater than 0 cc and not more than 49 cc (see FIGS. 6 to 8).
  • the width WD1 of the gap 47A of the overlapping portion 47 of the folded tubular portion 45 may be 1/30 or more and 1/5 or less of the width of the liquid pressing portion.
  • the volume of the storage space is 0.46 cc or more and 1.5 cc or less (see FIG. 7). Details of the relationship between the width WD1 of the gap 47A of the overlapping portion 47 and the width WD2 of the liquid pressing portion 41 will be described later.
  • the electric motor 27 is composed of a pulse motor or a servo motor having an encoder.
  • the conversion mechanism 29 converts the rotation obtained from the electric motor 27 into a linear movement in the left-right direction (X direction).
  • the conversion mechanism 29 includes, for example, a screw shaft, a female screw, and a guide part.
  • FIG. 1 A transport mechanism (not shown) transports the substrate W onto the spin chuck 4 of the holding rotation unit 3.
  • the spin chuck 4 holds the substrate W by adsorbing the back surface of the substrate W.
  • the rotation drive unit 5 rotates the substrate W held by the spin chuck 4.
  • the nozzle 2 is moved above the substrate W by a moving mechanism (not shown).
  • the two on-off valves V1 and V2 are closed (OFF state).
  • the on-off valve V1 is closed (OFF state) and the on-off valve V2 is opened (ON state).
  • the movable member 23 and the liquid pushing portion 41 are moved in the pushing movement direction (left direction in FIG. 2) by the electric motor 27 and the conversion mechanism 29.
  • the volume of the accommodation space 35 in the chamber 21 is reduced. Therefore, the chemical solution is sent from the storage space 35 to the nozzle 2 through the outlet port 39, the chemical solution pipe 8B, and the on-off valve V2.
  • the chemical solution sent to the nozzle 2 is discharged from the nozzle 2 onto the substrate W.
  • the two on-off valves V1 and V2 and the pump device 9 As described above, by operating the two on-off valves V1 and V2 and the pump device 9, a predetermined amount of the chemical solution is discharged from the nozzle 2 onto the substrate W. After the chemical solution is discharged, the two on-off valves V1 and V2 are closed (OFF state).
  • the nozzle 2 After discharging the chemical solution, the nozzle 2 is retracted from the substrate W to the outside of the substrate W.
  • the holding rotation unit 3 stops the rotation of the substrate W held, and then releases the holding of the substrate W.
  • a transport mechanism (not shown) moves the substrate W on the holding rotation unit 3 to another device, a mounting unit, a carrier, or the like.
  • FIG. 4B is a fluid analysis model having a ratio of 1:20.
  • FIG. 5A is a fluid analysis model having a ratio of 1:10.
  • FIG. 5B is a fluid analysis model having a ratio of 1: 5.
  • the same dimensions are used for the dimensions other than the widths WD1 and WD2.
  • the liquid Since the volume of the double size is large, the liquid is less likely to flow compared to the standard size. That is, the speed (mm / second) at each position tends to be slow. In the case of the ratio 1:30, the liquid flows more easily in the regions RY2 and RY3 than in the region RY1 shown in FIG. Therefore, as in the case of the standard size, the determination is “ ⁇ (bad)”.
  • the rolling diaphragm 25 includes the liquid pushing portion 41, the ring-shaped peripheral portion 43, and the folded tubular portion 45 that connects the liquid pushing portion 41 and the ring-shaped peripheral portion 43. ing.
  • the folded cylindrical portion 45 has an overlapping portion 47 formed by folding.
  • the width WD1 of the gap 47A of the overlapping portion 47 of the folded cylindrical portion 45 is 1/20 or more and 1/6 or less of the width WD2 of the liquid pressing portion 41.
  • the chemical solution can easily flow into the folded cylindrical portion 45.
  • the chemical solution can flow relatively smoothly from the inlet 37 to the outlet 39. That is, the liquid replacement property of the folded tubular portion is improved. Therefore, the chemical solution is solidified, and the solidified product can be prevented from being mixed in the chemical solution, and the cleanliness of the chemical solution can be maintained.
  • the width WD1 of the gap 47A of the overlapping portion 47 is as follows.
  • the width WD3 of the gap between the liquid pushing portion 41 and the inner wall (opposing inner wall) 31A of the chamber body 31 facing the liquid pushing portion 41 is larger.
  • the ratio of the width WD1, the width WD2, and the width WD3 is 1:20: about 0.88. That is, at the ratio 1:20, the width WD1 is larger than the width WD3.
  • the chemical solution pipe 8 ⁇ / b> A is connected to the inlet 37 ⁇ / b> A of the upstream pump device 61.
  • One end of the chemical liquid pipe 8C is connected to the outlet 39A of the upstream pump device 61, and the other end of the chemical liquid pipe 8C is connected to the inlet 63A of the foreign matter removing filter 63.
  • One end of the chemical liquid pipe 8D is connected to the outlet 63B of the foreign substance removal filter 63, and the other end of the chemical liquid pipe 8D is connected to the inlet 37B of the downstream pump device 62.
  • medical solution from which the foreign material was removed by the foreign material removal filter 63 is sent out to the exit 63B of the foreign material removal filter 63.
  • a discharge pipe 67 that discharges bubbles, chemicals, and the like is connected to the vent 63 ⁇ / b> C of the foreign matter removal filter 63.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Reciprocating Pumps (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Coating Apparatus (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
PCT/JP2018/047350 2018-02-27 2018-12-21 ポンプ装置および基板処理装置 WO2019167402A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-033981 2018-02-27
JP2018033981A JP6970629B2 (ja) 2018-02-27 2018-02-27 ポンプ装置および基板処理装置

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WO2019167402A1 true WO2019167402A1 (ja) 2019-09-06

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WO (1) WO2019167402A1 (zh)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006207533A (ja) * 2005-01-31 2006-08-10 Tacmina Corp ダイヤフラム及び往復動ポンプ
JP2007285340A (ja) * 2006-04-13 2007-11-01 Toray Eng Co Ltd ピストンとそのピストンの製造方法及びそのピストンを備えたポンプ
US20120073432A1 (en) * 2010-12-07 2012-03-29 General Compression, Inc. Compressor and/or expander device with rolling piston seal
CN206860384U (zh) * 2017-06-02 2018-01-09 德帕姆(杭州)泵业科技有限公司 柱塞式计量泵无泄漏液力端结构

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI253359B (en) * 2003-03-14 2006-04-21 Dainippon Screen Mfg Substrate processing device and liquid feeding device
JP2016061169A (ja) * 2014-09-16 2016-04-25 日本ピラー工業株式会社 ダイアフラムポンプシステム
JP6719323B2 (ja) * 2016-08-03 2020-07-08 日本ピラー工業株式会社 往復動ポンプ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006207533A (ja) * 2005-01-31 2006-08-10 Tacmina Corp ダイヤフラム及び往復動ポンプ
JP2007285340A (ja) * 2006-04-13 2007-11-01 Toray Eng Co Ltd ピストンとそのピストンの製造方法及びそのピストンを備えたポンプ
US20120073432A1 (en) * 2010-12-07 2012-03-29 General Compression, Inc. Compressor and/or expander device with rolling piston seal
CN206860384U (zh) * 2017-06-02 2018-01-09 德帕姆(杭州)泵业科技有限公司 柱塞式计量泵无泄漏液力端结构

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TW201937063A (zh) 2019-09-16
TWI743433B (zh) 2021-10-21
JP2019148236A (ja) 2019-09-05
JP6970629B2 (ja) 2021-11-24

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