WO2019148853A1 - 柔性显示面板、其制作方法及显示装置 - Google Patents

柔性显示面板、其制作方法及显示装置 Download PDF

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Publication number
WO2019148853A1
WO2019148853A1 PCT/CN2018/105501 CN2018105501W WO2019148853A1 WO 2019148853 A1 WO2019148853 A1 WO 2019148853A1 CN 2018105501 W CN2018105501 W CN 2018105501W WO 2019148853 A1 WO2019148853 A1 WO 2019148853A1
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Prior art keywords
region
layer
organic light
emitting functional
top electrode
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PCT/CN2018/105501
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English (en)
French (fr)
Inventor
孙阔
皇甫鲁江
赵梦
唐国强
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京东方科技集团股份有限公司
成都京东方光电科技有限公司
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Priority to US16/480,023 priority Critical patent/US11316137B2/en
Publication of WO2019148853A1 publication Critical patent/WO2019148853A1/zh
Priority to US17/706,687 priority patent/US11751467B2/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259—Multistep manufacturing methods
    • H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H04M1/0268—Details of the structure or mounting of specific components for a display module assembly including a flexible display panel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80—Constructional details
    • H10K30/88—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the present disclosure relates to the field of display technologies, and in particular, to a flexible display panel, a method of fabricating the same, and a display device.
  • the comprehensive screen has a large screen ratio and an ultra-narrow bezel, which can greatly improve the visual effect of the viewer compared with the ordinary display screen, and thus has received extensive attention.
  • a display device such as a mobile phone using a full screen
  • a front camera, an earpiece, a fingerprint recognition device, or a physical button are usually disposed in a display area.
  • a flexible display panel is generally formed by using an organic light-emitting display panel.
  • the through hole refers to a through hole extending through the thickness direction of the flexible display screen to place the front camera, the earpiece, and the fingerprint in the through hole. Identify device or physical buttons, etc.
  • Open Mask vapor deposition mask
  • the embodiments of the present disclosure provide a flexible display panel, a manufacturing method thereof, and a display device, and the specific scheme is as follows:
  • an embodiment of the present disclosure provides a method for fabricating a flexible display panel, including:
  • a region where the flexible substrate substrate is located at the through hole region is removed.
  • a cross section of the protruding structure gradually increases along a direction in which the flexible substrate substrate is pointed away from the flexible substrate.
  • the forming the convex structure at the through-hole region on the flexible substrate comprises:
  • the negative photoresist layer is patterned to form the raised structure.
  • the removing the convex structure and the organic light-emitting functional film layer and the top electrode layer cover a region of the convex structure to form the
  • the pattern of the organic light-emitting functional film layer and the top electrode layer specifically includes:
  • the package film includes a plurality of layers of inorganic thin films and at least one organic film disposed alternately;
  • Forming the organic film in the package film specifically comprising:
  • the organic thin film is formed in a region other than the via region by inkjet printing.
  • the forming the organic thin film in a region outside the through-hole region by using an inkjet printing method specifically includes:
  • a pattern of the organic thin film conforming to the pattern of the organic light-emitting functional film layer and the top electrode layer is formed by an inkjet printing method.
  • the removing the region of the flexible substrate that is located at the through-hole region includes:
  • the region of the flexible substrate substrate at the through hole region is removed by a laser method.
  • the method before the forming the convex structure at the through-hole region on the flexible substrate substrate, the method further includes:
  • a pixel circuit structure layer is formed on the flexible substrate, the pixel circuit structure layer having a hollow region at the via region.
  • an embodiment of the present disclosure further provides a flexible display panel formed by the above manufacturing method, including:
  • the flexible display panel provided by the embodiment of the present disclosure further includes: a pixel circuit structure layer between the flexible substrate and the organic light-emitting functional film layer;
  • the pixel circuit structure layer has a pattern only in a region other than the via region.
  • an embodiment of the present disclosure further provides a display device, including the above flexible display panel provided by the embodiment of the present disclosure.
  • FIG. 1 is a schematic flow chart of a method for fabricating a flexible display panel according to an embodiment of the present disclosure
  • FIG. 2 is a schematic diagram of a complete process of a method for fabricating a flexible display panel according to an embodiment of the present disclosure
  • FIG. 3 is a schematic structural diagram of a method for fabricating a flexible display panel according to an embodiment of the present disclosure after completion of each step;
  • FIG. 4 is a schematic structural diagram of a flexible display panel according to an embodiment of the present disclosure.
  • FIG. 5 is a schematic top plan view of a flexible display panel according to an embodiment of the present disclosure.
  • FIG. 6 is a schematic structural diagram of a display device according to an embodiment of the present disclosure.
  • a method for manufacturing a flexible display panel according to an embodiment of the present disclosure includes the following steps:
  • the via area is located in the display area of the flexible substrate
  • a convex structure at a via hole region is formed on the flexible substrate, so as to remove the organic light-emitting functional film layer and the top electrode layer while removing the convex structure.
  • the region covering the convex structure is used instead of arranging the occluded via-hole region member in the vapor deposition mask to achieve the purpose of no organic light-emitting functional film layer and top electrode layer pattern in the via region.
  • the step of removing the encapsulation film pattern at the via region may be added to expose the flexible substrate substrate of the via region, and the fabrication is performed in the flexible display panel after removing the flexible substrate substrate at the via region The effect of the through hole.
  • step S101 before the protruding structure at the through-hole region is formed on the flexible substrate substrate in step S101, the following steps may be further included:
  • a pixel circuit structure layer is formed on the flexible substrate, and the pixel circuit structure layer has a hollow region at the via region.
  • the pixel circuit structure layer formed on the flexible substrate substrate is used to control the organic light-emitting function film layer to emit light.
  • the pixel circuit structure layer is generally composed of an inorganic film layer such as a metal layer, a semiconductor layer or an insulating layer. By patterning these inorganic film layers, a control circuit for controlling pixel light emission can be formed, and the specific circuit structure has various implementation modes. I will not go into details here.
  • the pixel circuit structure layer in order to avoid the process interference of the insulating layer in the pixel circuit structure layer on the subsequent removal of the flexible substrate in the via region, the pixel circuit structure layer generally has no pattern at the via region, and specifically can be formed in the pixel circuit structure layer. The patterning process of each film layer is achieved by removing the film layer pattern at the via hole region.
  • the organic light-emitting functional film layer produced in step S102 may generally include a hole injection layer, an electron blocking layer, an organic light-emitting layer, a hole blocking layer, and an electron injection layer.
  • the film layers are all organic materials. It is usually made of a fine metal mask (FMM).
  • the top electrode layer is mostly disposed on the entire surface and is fabricated using an open mask.
  • the top electrode layer may specifically correspond to a cathode in the upright type organic light emitting display panel, that is, an anode, an organic light emitting functional film layer and a cathode are sequentially stacked on the flexible substrate; the top electrode layer may also be specifically inverted.
  • the anode in the organic light-emitting display panel, that is, the cathode, the organic light-emitting functional film layer, and the anode are sequentially stacked on the flexible substrate, which is not limited herein.
  • the protruding structure formed on the flexible substrate substrate at the through hole region in step S101 generally has a cross section directed away from the flexible lining along the flexible substrate substrate.
  • the direction of the base substrate gradually increases.
  • the formed convex structure has an inverted trapezoidal structure with a small bottom end and a large upper end, which is favorable for the organic light-emitting functional film layer and the top electrode layer disposed on the entire surface when the organic light-emitting functional film layer and the top electrode layer are formed in the subsequent step S102.
  • the region is broken at the edge of the convex structure, that is, the region where the organic light-emitting functional film layer and the top electrode layer cover the convex structure is disconnected from the other regions.
  • the shape of the convex structure formed in the above manufacturing method provided by the embodiment of the present disclosure is not limited to the inverted trapezoidal structure, and the convex structure may also be a positive trapezoidal structure with a large bottom end and a small upper end, or a rectangular cross section.
  • the area where the organic light-emitting functional film layer and the top electrode layer cover the convex structure and other regions can be realized by increasing the difference between the thickness of the convex structure and the thickness of the organic light-emitting functional film layer and the top electrode layer Is disconnected.
  • the step S101 forms a convex structure at the through-hole region on the flexible substrate, which may be implemented in the following manner:
  • a negative photoresist layer is formed on the flexible substrate
  • the negative photoresist layer is patterned to form a raised structure.
  • a mask having a set pattern may be used to block a region other than the via region, so that the negative photoresist layer outside the via region is dissolved.
  • the negative photoresist layer at the via region is preserved. Due to the characteristics of the negative photoresist, the bump structure formed by the negative photoresist may have an inverted trapezoidal structure.
  • step S103 removes the convex structure and the organic light-emitting functional film layer and the top electrode layer cover the region of the convex structure to form the organic light-emitting functional film layer and the top electrode layer.
  • the pattern can be implemented in the following ways:
  • the protrusion structure is peeled off by the stripping liquid, and the area where the organic light-emitting functional film layer and the top electrode layer cover the convex structure are removed, and the pattern of the organic light-emitting functional film layer and the top electrode layer is formed.
  • the flexible substrate substrate is entirely immersed in the stripping liquid to peel off the protrusion structure, and during the stripping process, the exposed negative photoresist layer is peeled off, and the organic light-emitting functional film layer and the top electrode layer cover the protrusion.
  • the regions of the structure are also peeled off together, eventually forming a pattern of the organic light-emitting functional film layer and the top electrode layer which are hollowed out in the via region.
  • the package film formed in step S104 generally includes a plurality of layers of inorganic thin films and at least one organic film alternately disposed.
  • the encapsulating film is alternately laminated by an inorganic film and an organic film for protecting the organic light-emitting functional film layer from external moisture, oxygen, and the like.
  • the inorganic film mainly functions to prevent the entry of water oxygen, and the organic film makes the package film have a certain flexibility.
  • the inorganic film is located at the innermost layer and the outermost layer of the package film, that is, when the package film is formed, an inorganic film is first formed, and finally an inorganic film is formed.
  • a layer may be first formed.
  • the organic film, and finally the organic film is not limited herein.
  • the inorganic thin film in the formed packaging film may be disposed on the entire surface to seal the organic light-emitting functional film layer and the top electrode layer to the first inorganic film and the flexible layer. Between the substrate substrates.
  • forming the organic thin film in the package film may be specifically implemented in the following manner:
  • An organic film is formed in a region other than the via region by inkjet printing.
  • the organic film is formed in a region other than the through-hole region by using an inkjet printing method, and may specifically include:
  • a pattern of an organic film conforming to the pattern of the organic light-emitting functional film layer and the top electrode layer is formed by an inkjet printing method.
  • the pattern of the organic thin film is consistent with the pattern of the organic light-emitting functional film layer and the top electrode layer, so that after the step S105 is removed from the region where the package film is located at the through-hole region, the organic film is not exposed in the through-hole region, that is, the film is ensured.
  • the organic film is sealed at the edge of the via region by the upper inorganic film to achieve a good sealing of the package film at the via region.
  • the step S106 is performed to remove the area of the flexible substrate substrate at the through-hole area, which may specifically include:
  • the area of the flexible substrate substrate at the via area is removed by a laser method.
  • the pixel circuit structure layer 600 is generally unpatterned at the via area A, i.e., has a hollowed out area at the via area A.
  • a negative photoresist can be used to form the raised structure 200 having an inverted trapezoidal structure.
  • S203 sequentially forming an organic light-emitting functional film layer 300 and a top electrode layer 400 on the flexible substrate substrate 100, as shown in FIG. 3c; specifically, using a fine metal mask (FMM) to form the organic light-emitting functional film layer 300 in the display region, and then A top electrode layer 400 disposed over the entire surface is formed on the organic light-emitting functional film layer 300 by using an open mask. Further, the region in which the organic light-emitting functional film layer 300 and the top electrode layer 400 cover the convex structure 200 is in an off state from the other regions.
  • FMM fine metal mask
  • the first inorganic thin film 510 and the second inorganic thin film 530 are removed from the region of the via hole region A, as shown in FIG. 3h; specifically, the first inorganic thin film at the via region A may be removed by etching.
  • the embodiment of the present disclosure further provides a flexible display panel formed by the above manufacturing method. Since the principle of solving the problem of the flexible display panel is similar to the foregoing manufacturing method, the implementation of the flexible display panel can be referred to. The implementation of the production method, the repetition will not be repeated.
  • a flexible display panel provided by an embodiment of the present disclosure, as shown in FIG. 4, includes:
  • the organic light-emitting functional film layer 300 and the top electrode layer 400 are sequentially disposed on the flexible substrate substrate 100, and the orthographic projections of the organic light-emitting functional film layer 300 and the top electrode layer 400 on the flexible substrate substrate 100 are not the same as the via-hole region A.
  • Overlapping ie, the organic light-emitting functional film layer 300 and the top electrode layer 400 have a hollowed-out region at the via area A;
  • the encapsulation film 500 covering the organic light-emitting functional film layer 300 and the top electrode layer 400 has a pattern only in a region other than the via hole region A.
  • the package film 500 may specifically include a plurality of layers of inorganic thin films 510 and 530 and at least one organic film 520.
  • the encapsulating film 500 includes a first inorganic film 510, an organic film 520, and a second inorganic film 530 which are laminated, and in practical applications, an inorganic film and an organic film may be provided as needed. The number of layers.
  • the pixel circuit structure layer 600 between the flexible substrate substrate 100 and the organic light-emitting function film layer 300 may further be included.
  • the pixel circuit structure layer 600 is configured to control the organic light-emitting function film layer 300 to emit light;
  • the pixel circuit structure layer 600 has a pattern only in a region other than the via hole region A, that is, the pixel circuit structure layer 600 has a cutout region at the via hole region A.
  • the through-hole area A may be circular, or may be set as other graphics according to physical components required for the display device. Not limited. Also, the via area A can be located in the display area to enable full screen display.
  • an embodiment of the present disclosure further provides a display device, including the above flexible display panel provided by an embodiment of the present disclosure.
  • the display device can be any product or component having a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like.
  • a display function such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like.
  • a component B such as a front camera, an earpiece, a fingerprint recognition device, or a physical button may be placed in the through hole of the flexible display panel.
  • the flexible display panel, the manufacturing method thereof and the display device provided by the embodiments of the present disclosure form a convex structure at the through-hole region on the flexible substrate to remove the organic light-emitting functional layer while removing the convex structure.
  • the top electrode layer covers the area of the convex structure instead of arranging the occluded through-hole area component in the evaporation mask to achieve the purpose of no organic light-emitting functional layer and top electrode layer pattern in the through-hole area.
  • the step of removing the encapsulation film pattern at the via region may be added to expose the flexible substrate substrate of the via region, and the fabrication is performed in the flexible display panel after removing the flexible substrate substrate at the via region The effect of the through hole.

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Abstract

一种柔性显示面板、其制作方法及显示装置，在柔性衬底基板（100）上形成位于通孔区域（A）处的凸起结构（200），以便在去除凸起结构（200）的同时，去除有机发光功能膜层（300）和顶电极层（400）覆盖凸起结构（200）的区域，以替代在蒸镀掩模板中设置悬空的遮挡通孔区域（A）部件，达到在通孔区域（A）无有机发光功能膜层（300）和顶电极层（400）图案的目的。之后形成覆盖有机发光功能膜层（300）和顶电极层（400）的图案的封装薄膜（500），对通孔区域（A）处的有机发光功能膜层（300）起到封装作用，保证通孔区域（A）处柔性显示面板的密封性，以防止显示器件失效。在形成封装薄膜（500）后，可以增加去除通孔区域（A）处的封装薄膜（500）图案的步骤，以露出通孔区域（A）的柔性衬底基板（100），在去除通孔区域（A）处的柔性衬底基板（100）后实现在柔性显示面板中制作通孔的效果。

Description

柔性显示面板、其制作方法及显示装置
本申请要求在2018年02月02日提交中国专利局、申请号为201810106226.8、发明名称为“一种柔性显示面板、其制作方法及显示装置”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本公开涉及显示技术领域，尤其涉及一种柔性显示面板、其制作方法及显示装置。
背景技术
随着显示技术的发展，全面屏以其具有较大的屏占比、超窄的边框，与普通的显示屏相比，可以大大提高观看者的视觉效果，从而受到了广泛的关注。目前，在采用全面屏的诸如手机的显示装置中，为了实现自拍、可视通话以及指纹识别的功能，通常都会在显示区域内设置前置摄像头、听筒、指纹识别器件或实体按键等。
而目前为了满足柔性显示屏的柔韧性，一般采用有机发光显示面板制作柔性显示屏。为了在柔性显示屏实现全面屏就需要在柔性显示屏的显示区域内设置通孔，通孔是指贯穿柔性显示屏的厚度方向的过孔，以在通孔内放置前置摄像头、听筒、指纹识别器件或实体按键等。但是，在柔性显示屏制作时，无法在制作有机发光显示面板中有机发光功能膜层的蒸镀掩模板(Open Mask)内设置悬空的遮挡通孔区域的部件。
因此，如何在柔性显示屏的显示区域内设置通孔，是本领域亟需解决的技术问题。
发明内容
有鉴于此，本公开实施例提供了一种柔性显示面板、其制作方法及显示装置，具体方案如下：
因此，本公开实施例提供了一种柔性显示面板的制作方法，包括：
在柔性衬底基板上形成位于通孔区域处的凸起结构，其中，所述通孔区域位于所述柔性衬底基板的显示区域内；
在形成有所述凸起结构的柔性衬底基板上依次形成有机发光功能膜层和顶电极层；
去除所述凸起结构以及所述有机发光功能膜层和所述顶电极层覆盖所述凸起结构的区域，形成所述有机发光功能膜层和所述顶电极层的图案；
在所述柔性衬底基板上形成覆盖所述有机发光功能膜层和所述顶电极层的图案的封装薄膜；
去除所述封装薄膜位于所述通孔区域处的区域；
去除所述柔性衬底基板位于所述通孔区域处的区域。
可选地，在本公开实施例提供的上述制作方法中，所述凸起结构的横截面沿所述柔性衬底基板指向远离所述柔性衬底基板的方向逐渐增加。
可选地，在本公开实施例提供的上述制作方法中，所述在柔性衬底基板上形成位于通孔区域处的凸起结构，具体包括：
在所述柔性衬底基板上形成负性光刻胶层；
对所述负性光刻胶层进行构图，形成所述凸起结构。
可选地，在本公开实施例提供的上述制作方法中，所述去除所述凸起结构以及所述有机发光功能膜层和所述顶电极层覆盖所述凸起结构的区域，形成所述有机发光功能膜层和所述顶电极层的图案，具体包括：
采用剥离液剥离所述凸起结构，同时去除所述有机发光功能膜层和所述顶电极层覆盖所述凸起结构的区域，形成所述有机发光功能膜层和所述顶电极层的图案。
可选地，在本公开实施例提供的上述制作方法中，所述封装薄膜包括交替设置的多层无机薄膜和至少一层有机薄膜；
形成所述封装薄膜中的有机薄膜，具体包括：
采用喷墨打印方式，在所述通孔区域之外的区域形成所述有机薄膜。
可选地，在本公开实施例提供的上述制作方法中，所述采用喷墨打印方式，在所述通孔区域之外的区域形成所述有机薄膜，具体包括：
采用喷墨打印方式，形成与所述有机发光功能膜层和所述顶电极层的图案一致的所述有机薄膜的图案。
可选地，在本公开实施例提供的上述制作方法中，所述去除所述柔性衬底基板位于所述通孔区域处的区域，具体包括：
采用激光方式，去除所述柔性衬底基板位于所述通孔区域处的区域。
可选地，在本公开实施例提供的上述制作方法中，所述在柔性衬底基板上形成位于通孔区域处的凸起结构之前，还包括：
在所述柔性衬底基板上形成像素电路结构层，所述像素电路结构层在所述通孔区域处具有镂空区域。
另一方面，本公开实施例还提供了一种采用上述制作方法形成的柔性显示面板，包括：
具有通孔区域的柔性衬底基板；
依次位于所述柔性衬底基板上的有机发光功能膜层和顶电极层，且所述有机发光功能膜层和所述顶电极层在所述柔性衬底基板上的正投影均与所述通孔区域不重叠；以及，
覆盖所述有机发光功能膜层的封装薄膜，所述封装薄膜仅在所述通孔区域以外的区域具有图案。
可选地，在本公开实施例提供的上述柔性显示面板中，还包括：位于所述柔性衬底基板与所述有机发光功能膜层之间的像素电路结构层；
所述像素电路结构层仅在所述通孔区域以外的区域具有图案。
另一方面，本公开实施例还提供了一种显示装置，包括：本公开实施例提供的上述柔性显示面板。
附图说明
图1为本公开实施例提供的柔性显示面板的制作方法的流程示意图；
图2为本公开实施例提供的柔性显示面板的制作方法的完整流程示意图；
图3a至图3i分别为本公开实施例提供的柔性显示面板的制作方法在各步骤完成后的结构示意图；
图4为本公开实施例提供的柔性显示面板的结构示意图；
图5为本公开实施例提供的柔性显示面板的俯视示意图；
图6为本公开实施例提供的显示装置的结构示意图。
具体实施方式
为了使本公开的目的、技术方案和优点更加清楚，下面将结合附图对本公开作进一步地详细描述，显然，所描述的实施例仅是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本公开保护的范围。
附图中各部件的形状和大小不反映真实比例，目的只是示意说明本公开内容。
本公开实施例提供的一种柔性显示面板的制作方法，如图1所示，包括以下步骤：
S101、在柔性衬底基板上形成位于通孔区域处的凸起结构；
其中，通孔区域位于柔性衬底基板的显示区域内；
S102、在形成有凸起结构的柔性衬底基板上依次形成有机发光功能膜层和顶电极层；
S103、去除凸起结构以及有机发光功能膜层和顶电极层覆盖凸起结构的区域，形成有机发光功能膜层和顶电极层的图案；
S104、在柔性衬底基板上形成覆盖有机发光功能膜层和顶电极层的图案的封装薄膜；
S105、去除封装薄膜位于通孔区域处的区域；
S106、去除柔性衬底基板位于通孔区域处的区域。
具体地，本公开实施例提供的上述制作方法中，在柔性衬底基板上形成 位于通孔区域处的凸起结构，以便在去除凸起结构的同时，去除有机发光功能膜层和顶电极层覆盖凸起结构的区域，以替代在蒸镀掩模板中设置悬空的遮挡通孔区域部件，达到在通孔区域无有机发光功能膜层和顶电极层图案的目的。之后形成覆盖有机发光功能膜层和顶电极层的图案的封装薄膜，对通孔区域处的有机发光功能膜层起到封装作用，保证通孔区域处柔性显示面板的密封性，以防止显示器件失效。在形成封装薄膜后，可以增加去除通孔区域处的封装薄膜图案的步骤，以露出通孔区域的柔性衬底基板，在去除通孔区域处的柔性衬底基板后实现在柔性显示面板中制作通孔的效果。
可选地，在本公开实施例提供的上述制作方法中，在步骤S101在柔性衬底基板上形成位于通孔区域处的凸起结构之前，还可以包括以下步骤：
在柔性衬底基板上形成像素电路结构层，像素电路结构层在通孔区域处具有镂空区域。
具体地，在柔性衬底基板上形成的像素电路结构层用于控制有机发光功能膜层发光。其中，像素电路结构层一般由金属层、半导体层、绝缘层等无机膜层构成，通过对这些无机膜层进行构图，可以形成控制像素发光的控制电路，其具体电路结构有多种实现方式，在此不赘述。并且，为了避免像素电路结构层中的绝缘层对后续去除通孔区域处的柔性衬底基板的工艺干扰，像素电路结构层一般在通孔区域处无图案，具体可以通过在制作像素电路结构层中各膜层的构图工艺时去除通孔区域处的膜层图案的方式实现。
可选地，在本公开实施例提供的上述制作方法中，在步骤S102制作的有机发光功能膜层一般可以包括空穴注入层、电子阻挡层、有机发光层、空穴阻挡层、电子注入层等膜层，这些膜层均为有机材料。一般采用精细金属掩模板(FMM)制作。顶电极层多为整面设置，且采用开放式掩模板(Open Mask)制作。具体地，顶电极层可以具体对应为正置型有机发光显示面板中的阴极，即在柔性衬底基板上依次层叠设置阳极、有机发光功能膜层和阴极；顶电极层也可以具体对应为倒置型有机发光显示面板中的阳极，即在柔性衬底基板上依次层叠设置阴极、有机发光功能膜层和阳极，在此不做限定。
可选地，在本公开实施例提供的上述制作方法中，在步骤S101在柔性衬底基板上形成的位于通孔区域处的凸起结构，一般其横截面沿柔性衬底基板指向远离柔性衬底基板的方向逐渐增加。
具体地，形成的凸起结构呈底端小且上端大的倒梯形结构，有利于后续步骤S102形成有机发光功能膜层和顶电极层时，整面设置的有机发光功能膜层和顶电极层在凸起结构的边缘处断开，即有机发光功能膜层和顶电极层覆盖凸起结构的区域与其它区域为断开状态。
具体地，在本公开实施例提供的上述制作方法中形成的凸起结构形状不限于上述倒梯形结构，凸起结构也可以呈底端大且上端小的正梯形结构，或者横截面一致的矩形结构，此时，可以通过增大凸起结构的厚度与有机发光功能膜层和顶电极层的厚度之差的方式，实现有机发光功能膜层和顶电极层覆盖凸起结构的区域与其它区域为断开状态。
可选地，在本公开实施例提供的上述制作方法中，步骤S101在柔性衬底基板上形成位于通孔区域处的凸起结构，具体可以采用下述方式实现：
首先，在柔性衬底基板上形成负性光刻胶层；
之后，对负性光刻胶层进行构图，形成凸起结构。
具体地，对负性光刻胶层进行构图时，可以采用具有设定图案的掩膜板遮挡通孔区域之外的区域，使通孔区域以外区域的负性光刻胶层均被溶解掉，保留通孔区域处的负性光刻胶层，由于负性光刻胶的特性，采用负性光刻胶形成的凸起结构可以具有倒梯形结构。
可选地，在本公开实施例提供的上述制作方法中，步骤S103去除凸起结构以及有机发光功能膜层和顶电极层覆盖凸起结构的区域，形成有机发光功能膜层和顶电极层的图案，具体可以采用下述方式实现：
采用剥离液剥离凸起结构，同时去除有机发光功能膜层和顶电极层覆盖凸起结构的区域，形成有机发光功能膜层和顶电极层的图案。
具体地，将柔性衬底基板整个浸泡在剥离液中剥离凸起结构，在剥离过程中，已曝光的负性光刻胶层会成片剥落，有机发光功能膜层和顶电极层覆 盖凸起结构的区域也会被一同剥离，最终形成在通孔区域镂空的有机发光功能膜层和顶电极层的图案。
可选地，在本公开实施例提供的上述制作方法中，步骤S104中形成的封装薄膜一般包括交替设置的多层无机薄膜和至少一层有机薄膜。具体地，封装薄膜由无机薄膜和有机薄膜交替层叠设置，用于保护有机发光功能膜层不受外部湿气和氧气等影响。其中，无机薄膜主要起到阻止水氧进入的功能，有机薄膜使封装薄膜具有一定的柔韧性。一般无机薄膜位于封装薄膜的最内层和最外层，即在制作封装薄膜时，首先制作一层无机薄膜，且最后制作一层无机薄膜，当然，在具体实施时，也可以首先制作一层有机薄膜，以及最后制作一层有机薄膜，在此不做限定。
可选地，在本公开实施例提供的上述制作方法中，形成的封装薄膜中的无机薄膜可以为整面设置，以便将有机发光功能膜层和顶电极层密封于第一层无机薄膜和柔性衬底基板之间。
可选地，在本公开实施例提供的上述制作方法中，形成封装薄膜中的有机薄膜，具体可以采用以下方式实现：
采用喷墨打印方式，在通孔区域之外的区域形成有机薄膜。
具体地，通过对喷墨打印图形的设置，可以避免在通孔区域喷涂形成有机薄膜的图案。
可选地，在本公开实施例提供的上述制作方法中，采用喷墨打印方式，在通孔区域之外的区域形成有机薄膜，可以具体包括：
采用喷墨打印方式，形成与有机发光功能膜层和顶电极层的图案一致的有机薄膜的图案。
具体地，有机薄膜的图案与有机发光功能膜层和顶电极层的图案一致，可以使后续步骤S105去除封装薄膜位于通孔区域处的区域后，不会在通孔区域露出有机薄膜，即保证有机薄膜在通孔区域的边缘被上层的无机薄膜密封，使通孔区域处的封装薄膜达到良好的密封性。
可选地，在本公开实施例提供的上述制作方法中，上述步骤S106去除柔 性衬底基板位于通孔区域处的区域，可以具体包括：
采用激光方式，去除柔性衬底基板位于通孔区域处的区域。
下面以一个具体的实施例，对本公开实施例提供的上述制作方法的具体流程进行详细说明。
本公开实施例提供的上述制作方法的完整流程，如图2所示，具体包括以下步骤：
S201、在柔性衬底基板100上形成像素电路结构层600，如图3a所示；并且，为了避免像素电路结构层600中的绝缘层对后续去除通孔区域处的柔性衬底基板100的工艺干扰，像素电路结构层600一般在通孔区域A处无图案，即在通孔区域A处具有镂空区域。
S202、在柔性衬底基板100上形成位于通孔区域A处的凸起结构200，如图3b所示；具体可以采用负性光刻胶形成具有倒梯形结构的凸起结构200。
S203、在柔性衬底基板100上依次形成有机发光功能膜层300和顶电极层400，如图3c所示；具体采用精细金属掩模板(FMM)在显示区域制作有机发光功能膜层300，之后，采用开放式掩模板(Open Mask)在有机发光功能膜层300上制作出整面设置的顶电极层400。并且，有机发光功能膜层300和顶电极层400覆盖凸起结构200的区域与其它区域为断开状态。
S204、采用剥离液剥离凸起结构200，同时去除有机发光功能膜层300和顶电极层400覆盖凸起结构200的区域，形成有机发光功能膜层300和顶电极层400的图案，如图3d所示。
S205、在柔性衬底基板100上形成覆盖有机发光功能膜层300和顶电极层400的第一层无机薄膜510，如图3e所示；其中，第一层无机薄膜510为整面设置，将有机发光功能膜层300和顶电极层400密封于第一层无机薄膜510和柔性衬底基板100之间。
S206、在第一层无机薄膜510上的通孔区域之外的区域形成有机薄膜520，如图3f所示；其中，可以采用喷墨打印方式形成有机薄膜520，也可以采用其他方式形成，在此不做限定。
S207、在有机薄膜520上形成第二层无机薄膜530，如图3g所示；其中，第二层无机薄膜530为整面设置，可以对通孔区域A边缘处的有机薄膜520进行密封。
S208、去除第一层无机薄膜510和第二层无机薄膜530位于通孔区域A处的区域，如图3h所示；具体可以采用刻蚀的方式去除通孔区域A处的第一层无机薄膜510和第二层无机薄膜530的图案。
S209、去除柔性衬底基板100位于通孔区域A处的区域，如图3i所示；至此，在柔性衬底基板100上形成了贯穿厚度方向的通孔。
基于同一发明构思，本公开实施例还提供了一种采用上述制作方法形成的柔性显示面板，由于该柔性显示面板解决问题的原理与前述一种制作方法相似，因此该柔性显示面板的实施可以参见制作方法的实施，重复之处不再赘述。
具体地，本公开实施例提供的一种柔性显示面板，如图4所示，包括：
具有通孔区域A的柔性衬底基板100；
依次位于柔性衬底基板100上的有机发光功能膜层300和顶电极层400，且有机发光功能膜层300和顶电极层400在柔性衬底基板100上的正投影均与通孔区域A不重叠(即有机发光功能膜层300和顶电极层400在通孔区域A处均具有镂空区域)；以及，
覆盖有机发光功能膜层300和顶电极层400的封装薄膜500，封装薄膜500仅在通孔区域A以外的区域具有图案。
具体地，在本公开实施例提供的上述柔性显示面板中，如图4所示，封装薄膜500具体可以包括交替设置的多层无机薄膜510和530，以及至少一层有机薄膜520。图4中是以封装薄膜500包括层叠设置的第一层无机薄膜510、有机薄膜520和第二层无机薄膜530为例进行说明的，在实际应用时，可以根据需要设置无机薄膜和有机薄膜的层数。
可选地，在本公开实施例提供的上述柔性显示面板中，如图4所示，还可以包括：位于柔性衬底基板100与有机发光功能膜层300之间的像素电路 结构层600，该像素电路结构层600用于控制有机发光功能膜层300发光；
像素电路结构层600仅在通孔区域A以外的区域具有图案，即像素电路结构层600在通孔区域A处具有镂空区域。
可选地，在本公开实施例提供的上述柔性显示面板中，如图5所示，通孔区域A可以为圆形，也可以根据显示装置所需设置的实体部件设置为其他图形，在此不做限定。并且，通孔区域A可以位于显示区域，以便实现全屏显示。
基于同一发明构思，本公开实施例还提供了一种显示装置，包括本公开实施例提供的上述柔性显示面板。该显示装置可以为：手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。该显示装置的实施可以参见上述柔性显示面板的实施例，重复之处不再赘述。
具体地，在本公开实施例提供的上述显示装置中，如图6所示，在柔性显示面板的通孔内可以放置前置摄像头、听筒、指纹识别器件或实体按键等部件B。
本公开实施例提供的上述柔性显示面板、其制作方法及显示装置，在柔性衬底基板上形成位于通孔区域处的凸起结构，以便在去除凸起结构的同时，去除有机发光功能膜层和顶电极层覆盖凸起结构的区域，以替代在蒸镀掩模板中设置悬空的遮挡通孔区域部件，达到在通孔区域无有机发光功能膜层和顶电极层图案的目的。之后形成覆盖有机发光功能膜层和顶电极层的图案的封装薄膜，对通孔区域处的有机发光功能膜层起到封装作用，保证通孔区域处柔性显示面板的密封性，以防止显示器件失效。在形成封装薄膜后，可以增加去除通孔区域处的封装薄膜图案的步骤，以露出通孔区域的柔性衬底基板，在去除通孔区域处的柔性衬底基板后实现在柔性显示面板中制作通孔的效果。
显然，本领域的技术人员可以对本公开进行各种改动和变型而不脱离本公开的精神和范围。这样，倘若本公开的这些修改和变型属于本公开权利要 求及其等同技术的范围之内，则本公开也意图包含这些改动和变型在内。

Claims (11)

  1. 一种柔性显示面板的制作方法，其中，包括：
    在柔性衬底基板上形成位于通孔区域处的凸起结构，其中，所述通孔区域位于所述柔性衬底基板的显示区域内；
    在形成有所述凸起结构的柔性衬底基板上依次形成有机发光功能膜层和顶电极层；
    去除所述凸起结构以及所述有机发光功能膜层和所述顶电极层覆盖所述凸起结构的区域，形成所述有机发光功能膜层和所述顶电极层的图案；
    在所述柔性衬底基板上形成覆盖所述有机发光功能膜层和所述顶电极层的图案的封装薄膜；
    去除所述封装薄膜位于所述通孔区域处的区域；
    去除所述柔性衬底基板位于所述通孔区域处的区域。
  2. 如权利要求1所述的制作方法，其中，所述凸起结构的横截面沿所述柔性衬底基板指向远离所述柔性衬底基板的方向逐渐增加。
  3. 如权利要求1所述的制作方法，其中，所述在柔性衬底基板上形成位于通孔区域处的凸起结构，具体包括：
    在所述柔性衬底基板上形成负性光刻胶层；
    对所述负性光刻胶层进行构图，形成所述凸起结构。
  4. 如权利要求1所述的制作方法，其中，所述去除所述凸起结构以及所述有机发光功能膜层和所述顶电极层覆盖所述凸起结构的区域，形成所述有机发光功能膜层和所述顶电极层的图案，具体包括：
    采用剥离液剥离所述凸起结构，同时去除所述有机发光功能膜层和所述顶电极层覆盖所述凸起结构的区域，形成所述有机发光功能膜层和所述顶电极层的图案。
  5. 如权利要求1所述的制作方法，其中，所述封装薄膜包括交替设置的多层无机薄膜和至少一层有机薄膜；
    形成所述封装薄膜中的有机薄膜，具体包括：
    采用喷墨打印方式，在所述通孔区域之外的区域形成所述有机薄膜。
  6. 如权利要求5所述的制作方法，其中，所述采用喷墨打印方式，在所述通孔区域之外的区域形成所述有机薄膜，具体包括：
    采用喷墨打印方式，形成与所述有机发光功能膜层和所述顶电极层的图案一致的所述有机薄膜的图案。
  7. 如权利要求1所述的制作方法，其中，所述去除所述柔性衬底基板位于所述通孔区域处的区域，具体包括：
    采用激光方式，去除所述柔性衬底基板位于所述通孔区域处的区域。
  8. 如权利要求1-7任一项所述的制作方法，其中，所述在柔性衬底基板上形成位于通孔区域处的凸起结构之前，还包括：
    在所述柔性衬底基板上形成像素电路结构层，所述像素电路结构层在所述通孔区域处具有镂空区域。
  9. 一种采用如权利要求1-8任一项所述的制作方法形成的柔性显示面板，其中，包括：
    具有通孔区域的柔性衬底基板；
    依次位于所述柔性衬底基板上的有机发光功能膜层和顶电极层，且所述有机发光功能膜层和所述顶电极层在所述柔性衬底基板上的正投影均与所述通孔区域不重叠；以及，
    覆盖所述有机发光功能膜层和所述顶电极层的封装薄膜，所述封装薄膜仅在所述通孔区域以外的区域具有图案。
  10. 如权利要求9所述的柔性显示面板，其中，还包括：位于所述柔性衬底基板与所述有机发光功能膜层之间的像素电路结构层；
    所述像素电路结构层仅在所述通孔区域以外的区域具有图案。
  11. 一种显示装置，其中，包括：如权利要求9或10所述的柔性显示面板。
PCT/CN2018/105501 2018-02-02 2018-09-13 柔性显示面板、其制作方法及显示装置 WO2019148853A1 (zh)

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Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108321176B (zh) 2018-02-02 2020-07-03 京东方科技集团股份有限公司 一种柔性显示面板、其制作方法及显示装置
KR102481292B1 (ko) * 2018-04-13 2022-12-26 삼성전자주식회사 플렉시블 디스플레이를 포함하는 전자 장치
CN109148525B (zh) * 2018-08-13 2021-02-02 武汉华星光电半导体显示技术有限公司 有机发光二极管显示面板及其制作方法
CN109244039B (zh) * 2018-09-05 2021-01-26 京东方科技集团股份有限公司 显示面板及其制造方法
CN109301085B (zh) * 2018-09-30 2020-11-27 京东方科技集团股份有限公司 一种显示基板及其制作方法、显示装置
CN109461839B (zh) * 2018-10-19 2020-12-15 京东方科技集团股份有限公司 Oled显示基板及其制作方法、显示装置
CN109216349B (zh) * 2018-10-31 2020-08-25 厦门天马微电子有限公司 显示面板和显示装置
CN109742110B (zh) * 2019-01-04 2022-07-08 京东方科技集团股份有限公司 有机发光显示器及制造方法
CN111416054A (zh) * 2019-01-08 2020-07-14 陕西坤同半导体科技有限公司 有机发光二极管显示屏的制作方法及其制作的显示屏
CN109904346B (zh) * 2019-02-28 2021-03-26 云谷（固安）科技有限公司 显示装置、显示面板及其制作方法
CN109830519B (zh) * 2019-02-28 2020-12-29 云谷（固安）科技有限公司 显示面板的制作方法
CN109994657B (zh) * 2019-03-08 2021-09-28 云谷（固安）科技有限公司 Oled显示面板制作方法及由该方法制备的显示面板
CN110048028B (zh) * 2019-03-25 2020-09-08 武汉华星光电半导体显示技术有限公司 显示面板及其制备方法
CN110034249B (zh) * 2019-04-25 2020-04-28 武汉华星光电半导体显示技术有限公司 柔性显示面板的制作方法及用于制作柔性显示面板的载体基板
CN110244483A (zh) * 2019-06-17 2019-09-17 武汉华星光电技术有限公司 阵列基板及液晶显示面板
CN110534666B (zh) * 2019-08-29 2021-12-14 合肥维信诺科技有限公司 柔性显示基板、柔性显示面板及其制备方法、显示装置
CN113126792A (zh) 2019-12-31 2021-07-16 瀚宇彩晶股份有限公司 柔性面板的制造方法
CN111261643B (zh) * 2020-02-10 2022-12-06 武汉华星光电半导体显示技术有限公司 柔性显示面板及制备方法
CN113985663B (zh) * 2021-11-15 2023-11-28 武汉华星光电技术有限公司 显示面板、显示装置以及车载监控装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105655504A (zh) * 2016-04-11 2016-06-08 京东方科技集团股份有限公司 一种有机电致发光器件及其制备方法和显示面板
CN106601775A (zh) * 2016-12-19 2017-04-26 武汉华星光电技术有限公司 Oled显示装置及其制作方法
CN107331694A (zh) * 2017-09-04 2017-11-07 京东方科技集团股份有限公司 一种oled显示面板及其制备方法、oled显示装置
CN107452894A (zh) * 2017-07-31 2017-12-08 京东方科技集团股份有限公司 一种有机电致发光显示面板、其制作方法及显示装置
CN108321176A (zh) * 2018-02-02 2018-07-24 京东方科技集团股份有限公司 一种柔性显示面板、其制作方法及显示装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104750284B (zh) * 2013-12-27 2019-02-19 昆山工研院新型平板显示技术中心有限公司 一种触控显示装置及其制备方法
KR102175991B1 (ko) * 2014-12-26 2020-11-09 삼성디스플레이 주식회사 디스플레이 장치 및 그 제조방법
CN104851903B (zh) * 2015-04-22 2018-11-02 京东方科技集团股份有限公司 一种柔性oled显示器及其制备方法
CN105845712B (zh) * 2016-05-19 2019-03-12 上海天马有机发光显示技术有限公司 一种显示面板及其制作方法
KR20180076429A (ko) * 2016-12-27 2018-07-06 삼성디스플레이 주식회사 디스플레이 장치 및 그 제조방법
KR102443229B1 (ko) * 2018-01-23 2022-09-15 삼성전자주식회사 센서를 장착하기 위한 개구를 포함하는 디스플레이

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105655504A (zh) * 2016-04-11 2016-06-08 京东方科技集团股份有限公司 一种有机电致发光器件及其制备方法和显示面板
CN106601775A (zh) * 2016-12-19 2017-04-26 武汉华星光电技术有限公司 Oled显示装置及其制作方法
CN107452894A (zh) * 2017-07-31 2017-12-08 京东方科技集团股份有限公司 一种有机电致发光显示面板、其制作方法及显示装置
CN107331694A (zh) * 2017-09-04 2017-11-07 京东方科技集团股份有限公司 一种oled显示面板及其制备方法、oled显示装置
CN108321176A (zh) * 2018-02-02 2018-07-24 京东方科技集团股份有限公司 一种柔性显示面板、其制作方法及显示装置

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