WO2019134582A1 - 一种烘烤方法、装置及烘烤炉 - Google Patents

一种烘烤方法、装置及烘烤炉 Download PDF

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Publication number
WO2019134582A1
WO2019134582A1 PCT/CN2018/124607 CN2018124607W WO2019134582A1 WO 2019134582 A1 WO2019134582 A1 WO 2019134582A1 CN 2018124607 W CN2018124607 W CN 2018124607W WO 2019134582 A1 WO2019134582 A1 WO 2019134582A1
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WO
WIPO (PCT)
Prior art keywords
thimbles
preset
substrate
baking
rises
Prior art date
Application number
PCT/CN2018/124607
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English (en)
French (fr)
Inventor
郭晓斌
Original Assignee
惠科股份有限公司
重庆惠科金渝光电科技有限公司
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Application filed by 惠科股份有限公司, 重庆惠科金渝光电科技有限公司 filed Critical 惠科股份有限公司
Priority to US16/958,857 priority Critical patent/US11400485B2/en
Publication of WO2019134582A1 publication Critical patent/WO2019134582A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0254—After-treatment
    • B05D3/0272—After-treatment with ovens
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/14—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133302—Rigid substrates, e.g. inorganic substrates
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1337—Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
    • G02F1/133711—Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers by organic films, e.g. polymeric films
    • G02F1/133723—Polyimide, polyamide-imide

Definitions

  • the present application belongs to the technical field of material fabrication, and in particular, to a baking method, a device and a baking device.
  • a film on a glass substrate for example, a polyimide film (Polyimide Film, PI film) is prepared on a glass substrate, and the PI film is a guiding film or an alignment film, which can make the liquid crystal display panel
  • the liquid crystal molecules are arranged in a pretilt angle.
  • the PI film is obtained by pre-baking the glass substrate coated with the PI liquid after applying the PI liquid on the glass substrate, and the pre-baking can be realized by alternately raising the contact glass substrate with the heating thimble.
  • this heating method causes the shrinkage rate of the PI liquid to be inconsistent due to uneven heating, which causes various trace phenomena such as uneven brightness of the liquid crystal display panel.
  • the embodiment of the present application provides a baking method, a device, and a baking device to solve the phenomenon of uneven brightness and the like of the liquid crystal display panel caused by uneven heating in the related baking manner.
  • An aspect of an embodiment of the present application provides a baking method, including:
  • Controlling the first set of thimbles to move to the first predetermined direction by a first predetermined distance, so that the substrate moves toward the first predetermined direction Describe a first preset distance, where the first preset distance is related to the number of times the first set of thimbles rises;
  • the first set of thimbles are controlled to return to the initial position when the first set of thimbles is lowered to a second predetermined position.
  • the predetermined instruction specifically refers to an instruction to start baking
  • the start timing specifically refers to starting timing after acquiring an instruction to start baking
  • the distance that the first set of thimbles rise from the initial position to the first preset position may be equal to the first set of thimbles fall from the first preset position to The distance that the second preset position is lowered.
  • the method further includes:
  • the first preset distance is related to the number of times the first set of thimbles are raised:
  • the L i represents the first preset distance
  • the i represents the number of times the first set of thimbles rises.
  • the initial value is 0, and the second preset distance is related to the number of times the first set of thimbles are raised:
  • the R i represents the second preset distance
  • the i represents the number of times the first set of thimbles rises.
  • the preset time is 1/2 of the baking time.
  • the baking time is artificially set.
  • a baking apparatus including:
  • the first obtaining unit is configured to acquire a predetermined instruction, start timing, and control the following unit cycle work:
  • a first rise control unit configured to control the first set of thimbles to support the substrate from the initial position, and record the number of times the first set of thimbles rises
  • a first movement control unit configured to: when the first set of ejector pins rise to the first preset position, control the first set of thimbles to move the first preset distance to the first preset direction, to And moving the substrate to the first preset direction by the first preset distance, where the first preset distance is related to the number of times the first set of thimbles rises;
  • a first drop control unit configured to control the first set of thimbles to descend such that the second set of thimbles support the substrate
  • a first return control unit configured to control the first set of ejector pins to return to the initial position when the first set of ejector pins is lowered to the second preset position.
  • the baking device further comprises:
  • a second acquiring unit configured to acquire a timing time after the first set of ejector pins returns to the initial position, and when the timing time is equal to or greater than the preset time, the timing time and the first The number of times a set of thimbles is raised is reset to the initial value, the timing is restarted and the following unit cycle is controlled:
  • a second rising control unit configured to control the first set of thimbles to support the substrate from the initial position, and record the number of times the first set of thimbles rises
  • the second movement control unit is further configured to: when the first set of thimbles rises to the first preset position, control the first set of thimbles to move the second preset distance to the second preset direction, Transmitting, by the substrate, the second preset distance to the second preset direction, where the second preset direction is opposite to the first preset direction, and the second preset distance is The number of times the first set of thimbles are raised is related;
  • a second drop control unit configured to control the first set of thimbles to descend such that the second set of thimbles support the substrate
  • a second return control unit configured to control the first set of thimbles to return to the initial position when the first set of thimbles is lowered to the second preset position
  • the discharge control unit is configured to acquire a timing time, and when the timing time is equal to or greater than the preset time, the substrate is discharged.
  • the first preset distance is related to the number of times the first set of thimbles rises:
  • the L i represents the first preset distance
  • the i represents the number of times the first set of thimbles rises.
  • the initial value is 0, and the second preset distance is related to the number of times the first set of ejector rises is:
  • the R i represents the second preset distance
  • the i represents the number of times the first set of thimbles rises.
  • the preset time is 1/2 of the baking time.
  • a baking apparatus including a storage unit, a processing unit, and a computer program stored in the storage unit and operable on the processing unit, wherein the processing The steps of the baking method as described below are implemented when the unit executes the computer program:
  • Controlling the first set of thimbles to move to the first predetermined direction by a first predetermined distance, so that the substrate moves toward the first predetermined direction Describe a first preset distance, where the first preset distance is related to the number of times the first set of thimbles rises;
  • the first set of thimbles are controlled to return to the initial position when the first set of thimbles is lowered to a second predetermined position.
  • the predetermined instruction specifically refers to an instruction to start baking
  • the start timing specifically refers to starting timing after acquiring an instruction to start baking
  • the distance that the first set of thimbles rise from the initial position to the first preset position may be equal to the first set of thimbles fall from the first preset position to The distance that the second preset position is lowered.
  • the method further includes the steps of:
  • the first preset distance is related to the number of times the first set of thimbles are raised:
  • the L i represents the first preset distance
  • the i represents the number of times the first set of thimbles rises.
  • the initial value is 0, and the second preset distance is related to the number of times the first set of thimbles are raised:
  • the R i represents the second preset distance
  • the i represents the number of times the first set of thimbles rises.
  • the preset time is 1/2 of the baking time.
  • Another aspect of an embodiment of the present application provides a computer readable storage medium storing a computer program, wherein the computer program is executed by one or more processors to implement an embodiment of the present application Provide the steps of the method described below:
  • Controlling the first set of thimbles to move to the first predetermined direction by a first predetermined distance, so that the substrate moves toward the first predetermined direction Describe a first preset distance, where the first preset distance is related to the number of times the first set of thimbles rises;
  • the first set of thimbles are controlled to return to the initial position when the first set of thimbles is lowered to a second predetermined position.
  • the timing is started and the following steps are performed: controlling the first set of thimbles to rise from the initial position to support the substrate, and recording the number of times the first set of thimbles rise; in the first set of thimbles Raising to the first preset position, controlling the first set of thimbles to move the first preset distance to the first preset direction, so that the substrate moves the first preset distance to the first preset direction, The first preset distance is related to the number of times the first set of thimbles are raised; controlling the first set of thimbles to descend such that the second set of thimbles supports the substrate; and the first set of thimbles descending to the second preset Positioning, controlling the first set of thimbles to return to the initial position; preventing repeated contact or long-term contact of the same thimble with the same position of the substrate, so that the heating time of each position of the substrate is consistent, effectively overcoming
  • FIG. 1 is a schematic flow chart showing the implementation of a baking method provided by an embodiment of the present application
  • FIG. 2 is a schematic view showing the position of a first set of thimbles in a baking process provided by an embodiment of the present application
  • FIG. 3 is a schematic diagram showing an implementation flow of a baking method provided by an embodiment of the present application.
  • FIG. 4 is a schematic view of a baking apparatus provided by an embodiment of the present application.
  • Figure 5 is a schematic view of a baking apparatus provided by an embodiment of the present application.
  • FIG. 6 is a schematic diagram of a baking apparatus provided by an embodiment of the present application.
  • the term “if” can be interpreted as “when” or “on” or “in response to determining” or “in response to detecting” depending on the context. .
  • the phrase “if determined” or “if detected [condition or event described]” may be interpreted in context to mean “once determined” or “in response to determining” or “once detected [condition or event described] ] or “in response to detecting [conditions or events described]”.
  • PI Polyimide Film
  • the PI film has outstanding high temperature resistance, radiation resistance, chemical resistance and electrical insulation properties. It can be used in air for a long time at 250-280 ° C, and the chemical properties of PI are stable. It can prevent combustion without adding flame retardant. Therefore, the PI film is particularly suitable for use as a flexible printed circuit board substrate and various high temperature resistant electrical and electrical insulating materials.
  • PI liquid prebaking is a key step in the preparation process of the liquid crystal display panel. After the PI liquid is evenly applied on the glass substrate, the PI coated glass substrate is prebaked until the PI film is formed.
  • the PI film is a guiding film or an alignment film which enables liquid crystal molecules in the liquid crystal display panel to be aligned at a pretilt angle.
  • the shrinkage rate of the PI liquid changes according to the change of the heating temperature. Therefore, whether the PI liquid is heated uniformly will directly affect whether the shrinkage rate of the PI liquid film is consistent, thereby affecting the liquid crystal display. Whether the panel brightness is uniform and whether mura (screen spot) will appear.
  • the embodiment of the present application is directed to the problem that the shrinkage rate of the PI liquid is affected by temperature, and a baking method, a device and a baking oven are proposed to solve the problem of temperature non-uniformity in the baking process.
  • the embodiment of the present application can solve the problem of uneven heating in the process of PI liquid film formation, and can also solve the problem of uneven baking temperature occurring in other baking processes, such as the baking process of the photoresist, which is not limited. It can only solve the problem of uneven heating in the PI liquid film formation process.
  • FIG. 1 is a schematic diagram showing an implementation process of a baking method provided by an embodiment of the present application.
  • the method shown in the present disclosure may include the following steps:
  • step S101 a predetermined instruction is acquired, timing is started, and the following steps are cyclically executed.
  • the predetermined instruction specifically refers to an instruction to start baking
  • the start timing specifically refers to starting timing after acquiring an instruction to start baking
  • performing the following steps in the loop refers to sequentially performing steps After S102 to step S105, execution from step S102 continues.
  • Step S102 controlling the first set of thimbles to rise from the initial position to support the substrate, and recording the number of times the first set of thimbles are raised.
  • the initial position may refer to a position where the first set of thimbles are not in contact with the substrate, and the substrate is supported by the second set of thimbles. It is also possible to set a first set of thimbles to return to the initial position by a button on the baking oven before the baking process.
  • the initial value of the number of times the first set of thimbles is raised may be set to 0, the first set of thimbles is raised once, and the number of times is increased by 1.
  • the first set of thimbles may be set to execute once. After the initial position is raised, translated, lowered, and returned to the initial position, the number of times of the first set of thimble cycles is automatically increased by one; of course, the number of times of translation can be set to increase by one; or, the number of times of decrease is increased by one.
  • Step S103 controlling the first set of thimbles to move to the first preset direction by the first preset distance, so that the first set of thimbles is raised to the first preset position, so that the substrate is toward the first preset
  • the direction moves the first preset distance, and the first preset distance is related to the number of times the first set of thimbles rises.
  • the first preset position refers to the first set of thimbles rising to a position capable of supporting the substrate, and when the first set of thimbles is located at the first preset position, the substrate No longer in contact with the second set of thimbles.
  • the PI liquid 21 is evenly coated on the glass substrate 22, the hot plate 23 is located below the glass substrate 22, and the second set of thimbles 24 and the first set of thimbles 25 are mounted on the hot plate 23.
  • the first set of thimbles 25 can be moved up and down and left and right.
  • FIG. 2A shows the first set of thimbles 25 rising to a first predetermined position P1, at which time the glass substrate 22 is supported by the first set of thimbles 25, and the glass substrate 22 leaves the second Group thimble 24.
  • FIG. 2B shows that the first set of thimbles 25 are moved by a first predetermined distance L in a first predetermined direction to move the glass substrate 22 by a first predetermined distance L in a first predetermined direction.
  • the first preset distance is related to the number of times the first set of thimbles rises:
  • the Li represents a first preset distance
  • the i represents the number of times the first set of thimbles are raised.
  • the first set of thimbles are controlled to move by x mm in a first predetermined direction; when the number of times the first set of thimbles is raised is 2, 3, 4, ...
  • n-1, n the first set of thimbles are controlled to move 2x mm in the first predetermined direction.
  • n refers to any natural number greater than one.
  • the unit that can also set the first preset distance is another distance measurement unit; and other corresponding relationship between the first preset distance and the number of times the first set of ejector rises can be set, for example, the first movement x
  • the second move 2x, the third move x, you can also set the distance of each move is equal, no limit here.
  • Step S104 controlling the first set of thimbles to descend so that the second set of thimbles support the substrate.
  • the first set of thimbles is a movable thimble set
  • the second set of thimbles may be an unmovable thimble set
  • the first set of thimbles and the second set of thimbles each have a heating function
  • Only one set of the set of thimbles and the second set of thimbles has a heating function.
  • Step S105 controlling the first set of ejector pins to return to the initial position when the first set of thimbles is lowered to the second preset position.
  • FIG. 2-C shows that the first set of thimbles 25 are lowered to a second predetermined position P2 such that the second set of thimbles 24 support the glass substrate 22.
  • the second preset position means that the first set of thimbles are lowered to be able to no longer contact the substrate, and the substrate is supported by the second set of thimbles.
  • the distance that the first set of thimbles rise from the initial position to the first preset position may be equal to the first set of thimbles fall from the first preset position to the first The distance dropped by the two preset positions.
  • Figure 2-D shows the first set of thimbles 25 returning to the initial position P0.
  • the second set of thimbles can be a set of thimbles that can be moved up and down.
  • the second set of thimbles may be controlled to rise when the first set of thimbles are lowered to support the second set of thimbles to support the substrate.
  • the second set of thimbles may be controlled to descend so that the first set of thimbles support the substrate; and the first set of thimbles is controlled to move from the initial position to the first predetermined direction by a first predetermined distance, so that Moving the substrate to the first predetermined direction by a first predetermined distance; controlling the second set of thimbles to support the substrate; and controlling the first set of ejector pins to return to the initial position.
  • the method further includes:
  • Step S301 acquiring a timing time, when the timing time is equal to or greater than a preset time, resetting the timing time and the number of times the first group of thimbles are raised to an initial value, restarting timing, and performing the following steps cyclically.
  • the preset time may be 1/2 of the baking time.
  • the baking time refers to the total time taken from the start of the timer to the end of the baking.
  • the baking time can be artificially set.
  • the resetting the timing time and the number of times the first set of thimbles are raised is reset to an initial value, and the initial value may be zero.
  • the loop performs the following steps, which means that after step S302 to S306 are sequentially performed, the process proceeds from step S302; if the time is less than the preset time, the process proceeds from step S102.
  • the number of times the first set of thimbles is raised may also be acquired. If the number of times is equal to the preset number of times, the number of times the first set of thimbles is raised is reset to an initial value, and the following steps are cyclically performed.
  • the preset number of times may be set to the number of times the first set of thimbles need to be raised in 1/2 baking time.
  • Step S302 controlling the first set of thimbles to support the substrate from the initial position, and recording the number of times the first set of thimbles are raised.
  • step S102 This step is the same as the step S102.
  • steps S102 For details, refer to the description of step S102, and details are not described herein again.
  • Step S303 controlling the first set of thimbles to move to a second preset direction by a second preset distance when the first set of thimbles rises to the first preset position, so that the substrate is toward the second
  • the preset direction moves the second preset distance
  • the second preset direction is opposite to the first preset direction
  • the second preset distance is related to the number of times the first set of thimbles rises .
  • the initial value is 0, and the second preset distance is related to the number of times the first set of thimbles rises:
  • R i represents a second preset distance
  • the i represents the number of times the first set of thimbles are raised.
  • the first set of thimbles are controlled to move by x mm in a first predetermined direction; when the number of times the first set of thimbles is raised is 2, 3, 4, ...
  • n-1, n the first set of thimbles are controlled to move 2x mm in the first predetermined direction.
  • n refers to any natural number greater than one.
  • the unit that can also set the first preset distance is another distance measurement unit; and other corresponding relationship between the first preset distance and the number of times the first set of ejector rises can be set, for example, if the first pre- Let the direction move x for the first time, move 2x for the second time, move x for the third time, move 2x for the first time along the second preset direction, move x for the second time, and move 2x for the third time, thus preventing the same
  • the thimble and the substrate are repeatedly contacted or contacted for a long time; the distances for moving each time along the second preset direction are equal, and the specific moving distance is not limited herein, but it is required to ensure that the first predetermined direction is along the first predetermined direction.
  • the distance of the last movement is different from the distance of the first movement in the second predetermined direction.
  • the direction that the second preset direction is opposite to the first preset direction may be that the first preset direction is horizontal to the left, and the second preset direction is horizontal to the right; or the first The preset direction is horizontal to the right, and the second preset direction is horizontal to the left; or the first preset direction is horizontal forward, the second preset direction is horizontal backward, or the first preset direction is horizontal After that, the second preset direction is horizontal forward.
  • the level may refer to being parallel to the substrate.
  • Step S304 controlling the first set of thimbles to descend such that the second set of thimbles support the substrate.
  • Step S305 controlling the first set of thimbles to return to the initial position when the first set of thimbles is lowered to the second preset position.
  • Step S306 acquiring a timing time, when the timing time is equal to or greater than the preset time, discharging the substrate.
  • step S302 when the first set of thimbles are controlled to return to the initial position, a timing time is acquired, and if the timing time is equal to or greater than the preset time, the substrate is excluded, the timing ends, and the baking ends; If the timing time is less than the preset time, step S302 is continued.
  • Steps S102 to S105 and the steps S302 to S305 are actually the processes in which the substrate is moved in the opposite direction.
  • Steps S102 to S105 are cyclically executed in the process of moving to the first preset direction, and after each step S105 is performed, step S301 (actually loop execution steps S102, S103, S104, S105, S301) is further performed to Determining whether the first preset direction is moved for a preset time, if the step S102 to the step S105 are not performed until the preset time, if the preset time is moved to the first preset direction, the time is re-timed and moved in the opposite direction.
  • step S302 to step S305 need to be performed, and after each step S305 is performed, step S306 (actually loop execution steps S302, S303, S304, S305, S306) is further performed to determine to the second preset. Whether the direction is moved for a preset time, if the preset time is not reached, the process proceeds to step S302 to step S305, and if the preset time is moved to the second preset direction, the substrate is excluded.
  • the time during which a certain contact point of the liquid crystal display panel is in contact with a certain thimble is actually: the total baking time divided by the total number of movements.
  • the baking method described in the embodiment of the present application acquires a predetermined instruction, starts timing, and cyclically executes the steps of: controlling the first set of thimbles to rise from the initial position to support the substrate, and recording the number of times the first set of thimbles rises; Controlling the first set of thimbles to move to the first predetermined direction by a first predetermined distance, so that the substrate moves toward the first predetermined direction Determining a first preset distance, the first preset distance being related to the number of times the first set of thimbles are raised; controlling the first set of thimbles to descend such that the second set of thimbles supports the substrate; The thimble is lowered to a second predetermined position to control the first set of thimbles to return to the initial position.
  • the technical solution makes the same thimble and the substrate only contact once, preventing repeated contact or long-term contact of the same thimble and the same position of the substrate, so that the heating time of each position of the substrate is consistent, effectively overcoming the uneven heating during the baking process. problem.
  • the baking device comprises:
  • the first obtaining unit 41 is configured to acquire a predetermined instruction, start timing, and control the following unit cycle work:
  • the first rise control unit 42 is configured to control the first set of thimbles to support the substrate from the initial position, and record the number of times the first set of thimbles are raised.
  • the first movement control unit 43 is configured to control the first set of thimbles to move the first preset distance to the first preset direction when the first set of thimbles rises to the first preset position, And moving the substrate to the first preset direction by the first preset distance, where the first preset distance is related to the number of times the first set of thimbles rises.
  • the first preset distance is related to the number of times the first set of thimbles rises:
  • the L i represents the first preset distance
  • the i represents the number of times the first set of thimbles rises.
  • a first drop control unit 44 is configured to control the first set of thimbles to descend such that the second set of thimbles support the substrate.
  • the first return control unit 45 is configured to control the first set of ejector pins to return to the initial position when the first set of ejector pins is lowered to the second preset position.
  • the baking apparatus further includes:
  • the second obtaining unit 51 is further configured to acquire a timing time after the first set of ejector pins returns to the initial position, and when the timing time is equal to or greater than the preset time, the timing time and the The number of times the first set of ejector rises is reset to the initial value, the timing is restarted and the following unit cycle is controlled:
  • the second rising control unit 52 is configured to control the first set of thimbles to support the substrate from the initial position, and record the number of times the first set of thimbles are raised.
  • the second movement control unit 53 is further configured to control the first set of thimbles to move the second preset distance to the second preset direction when the first set of thimbles rises to the first preset position
  • the second preset distance is moved in the second predetermined direction, the second preset direction is opposite to the first preset direction, and the second preset distance is Associated with the number of times the first set of thimbles are raised.
  • the initial value is 0, and the second preset distance is related to the number of times the first set of thimbles rises:
  • the R i represents the second preset distance
  • the i represents the number of times the first set of thimbles rises.
  • a second drop control unit 54 is configured to control the first set of thimbles to descend such that the second set of thimbles support the substrate.
  • the second return control unit 55 is further configured to control the first set of ejector pins to return to the initial position when the first set of ejector pins is lowered to the second preset position.
  • the discharge control unit 56 is configured to acquire a timing time, and when the timing time is equal to or greater than the preset time, the substrate is discharged.
  • the preset time is 1/2 of the baking time.
  • each functional unit in the embodiment may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit, and the integrated unit may be implemented in the form of hardware. It can also be implemented in the form of a software functional unit.
  • the specific names of the respective functional units are only for the purpose of facilitating mutual differentiation, and are not intended to limit the scope of protection of the present application.
  • FIG. 6 is a schematic diagram of a baking apparatus provided by an embodiment of the present application.
  • the baking apparatus 6 of this embodiment includes a processing unit 60, a storage unit 61, and a computer program 62 stored in the storage unit 61 and operable on the processing unit 60, such as baking. Method of procedure.
  • the processing unit 60 when executing the computer program 62, implements the steps in the various baking method embodiments described above, such as steps S101 through S105 shown in FIG.
  • the processing unit 60 executes the computer program 62
  • the functions of the units in the above-described respective device embodiments, such as the functions of the units 41 to 45 shown in FIG. 4 are implemented.
  • the computer program 62 can be partitioned into one or more units that are stored in the storage unit 61 and executed by the processing unit 60 to complete the application.
  • the one or more units may be a series of computer program instruction segments capable of performing a particular function for describing the execution of the computer program 62 in the baking device 6.
  • the computer program 62 may be divided into a first acquisition unit, a first rise control unit, a first movement control unit, a first fall control unit, a first return control unit (a unit in a virtual device), each unit specific The function is as follows:
  • the first obtaining unit is configured to acquire a predetermined instruction, start timing, and control the following unit cycle work:
  • a first rising control unit configured to control the first set of thimbles to support the substrate from the initial position, and record the number of times the first set of thimbles are raised.
  • a first movement control unit configured to: when the first set of ejector pins rise to the first preset position, control the first set of thimbles to move the first preset distance to the first preset direction, to And moving the substrate to the first preset direction by the first preset distance, where the first preset distance is related to the number of times the first set of thimbles rises.
  • the first preset distance is related to the number of times the first set of thimbles rises:
  • the L i represents the first preset distance
  • the i represents the number of times the first set of thimbles rises.
  • a first drop control unit configured to control the first set of thimbles to descend such that the second set of thimbles support the substrate.
  • a first return control unit configured to control the first set of ejector pins to return to the initial position when the first set of ejector pins is lowered to the second preset position.
  • the baking device further comprises:
  • a second acquiring unit configured to acquire a timing time after the first set of ejector pins returns to the initial position, and when the timing time is equal to or greater than the preset time, the timing time and the The number of times the first set of thimbles is raised is reset to the initial value, the timing is restarted and the following unit cycle is controlled:
  • a second rising control unit configured to control the first set of thimbles to support the substrate from the initial position, and record the number of times the first set of thimbles are raised.
  • the second movement control unit is further configured to: when the first set of thimbles rises to the first preset position, control the first set of thimbles to move the second preset distance to the second preset direction, Transmitting, by the substrate, the second preset distance to the second preset direction, where the second preset direction is opposite to the first preset direction, and the second preset distance is The number of times the first set of thimbles are raised is related.
  • the initial value is 0, and the second preset distance is related to the number of times the first set of thimbles rises:
  • the R i represents the second preset distance
  • the i represents the number of times the first set of thimbles rises.
  • a second drop control unit configured to control the first set of thimbles to descend such that the second set of thimbles support the substrate.
  • the second return control unit is further configured to control the first set of ejector pins to return to the initial position when the first set of ejector pins is lowered to the second preset position.
  • the discharge control unit is configured to acquire a timing time, and when the timing time is equal to or greater than the preset time, the substrate is discharged.
  • the preset time is 1/2 of the baking time.
  • the baking device 6 can be a computing device such as a desktop computer, a notebook, a palmtop computer, and a cloud server.
  • the baking device may include, but is not limited to, the processing unit 60 and the storage unit 61. It will be understood by those skilled in the art that FIG. 6 is merely an example of the baking device 6, and does not constitute a limitation to the baking device 6, and may include more or less components than those illustrated, or some components may be combined, or different.
  • the components, such as the baking device may also include input and output devices, network access devices, buses, and the like.
  • the processing unit 60 may be a central processing unit (CPU), or may be another general-purpose processor, a digital signal processor (DSP), an application specific integrated circuit (ASIC), Field-Programmable Gate Array (FPGA) or other programmable logic device, discrete gate or transistor logic device, discrete hardware components, etc.
  • the general purpose processor may be a microprocessor or the processor or any conventional processor or the like.
  • the storage unit 61 may be an internal storage unit of the baking device 6, such as a hard disk or a memory of the baking device 6.
  • the storage unit 61 may also be an external storage unit of the baking device 6, such as a plug-in hard disk provided on the baking device 6, a smart memory card (SMC), and a secure digital (Secure Digital) , SD) card, flash card (Flash Card), etc.
  • the storage unit 61 may also include both an internal storage unit of the baking device 6 and an external storage device.
  • the storage unit 61 is for storing the computer program and other programs and data required for the baking oven.
  • the storage unit 61 can also be used to temporarily store data that has been output or is about to be output.
  • the disclosed device/terminal device and method may be implemented in other manners.
  • the device/terminal device embodiments described above are merely illustrative.
  • the division of the modules or units is only a logical function division.
  • there may be another division manner for example, multiple units.
  • components may be combined or integrated into another system, or some features may be omitted or not performed.
  • the mutual coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection through some interface, device or unit, and may be in electrical, mechanical or other form.
  • the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, may be located in one place, or may be distributed to multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of the embodiment.
  • each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.
  • the above integrated unit can be implemented in the form of hardware or in the form of a software functional unit.
  • the integrated modules/units if implemented in the form of software functional units and sold or used as separate products, may be stored in a computer readable storage medium. Based on such understanding, the present application implements all or part of the processes in the foregoing embodiments, and may also be completed by a computer program to instruct related hardware.
  • the computer program may be stored in a computer readable storage medium. The steps of the various method embodiments described above may be implemented when the program is executed by the processor.
  • the computer program comprises computer program code, which may be in the form of source code, object code form, executable file or some intermediate form.
  • the computer readable medium may include any entity or device capable of carrying the computer program code, a recording medium, a USB flash drive, a removable hard disk, a magnetic disk, an optical disk, a computer memory, a read-only memory (ROM). , random access memory (RAM, Random Access Memory), electrical carrier signals, telecommunications signals, and software distribution media. It should be noted that the content contained in the computer readable medium may be appropriately increased or decreased according to the requirements of legislation and patent practice in a jurisdiction, for example, in some jurisdictions, according to legislation and patent practice, computer readable media It does not include electrical carrier signals and telecommunication signals.

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Abstract

一种烘烤方法、装置及烘烤装置，包括：获取到预定指令，开始计时并循环执行下述步骤（S101）：控制第一组顶针（25）从初始位置（P0）上升支撑基板（22），并记录第一组顶针（25）上升的次数（S102）；在第一组顶针（25）上升到第一预设位置（P1），控制第一组顶针（25）向第一预设方向移动第一预设距离（L），以使得基板（22）向第一预设方向移动第一预设距离（L），第一预设距离（L）与第一组顶针（25）上升的次数相关（S103）；控制第一组顶针（25）下降使得第二组顶针（24）支撑基板（22）（S104）；在第一组顶针（25）下降到第二预设位置（P2），控制第一组顶针（25）回到初始位置（P0）（S105）。

Description

一种烘烤方法、装置及烘烤炉 技术领域
本申请属于材料制作技术领域，尤其涉及一种烘烤方法、装置及烘烤装置。
背景技术
液晶显示面板制备工艺中，需要在玻璃基板上成膜，例如，在玻璃基板上制备聚酰亚胺薄膜(PolyimideFilm，PI膜)，PI膜是一种导向膜或定向膜，能够使得液晶显示面板中液晶分子按照预倾角排列。
PI膜是将PI液涂抹在玻璃基板上之后对涂抹了PI液的玻璃基板进行预烘烤的方式获得的，预烘烤可以采用加热顶针交替上升接触玻璃基板的方式实现。但是这种加热方式由于加热不均匀导致PI液受热成膜时缩膜率不一致，这就会造成液晶显示面板亮度不均匀等各种痕迹现象。
发明内容
有鉴于此，本申请实施例提供了一种烘烤方法、装置及烘烤装置，以解决相关的烘烤方式加热不均匀导致的液晶显示面板亮度不均匀等痕迹现象。
本申请实施例的一个方面提供了一种烘烤方法，其中，包括：
获取到预定指令，开始计时并循环执行下述步骤：
控制第一组顶针从初始位置上升支撑基板，并记录所述第一组顶针上升的次数；
在所述第一组顶针上升到第一预设位置，控制所述第一组顶针向第一预设方向移动第一预设距离，以使得所述基板向所述第一预设方向移动所述第一预设距离，所述第一预设距离与所述第一组顶针上升的次数相关；
控制所述第一组顶针下降使得第二组顶针支撑所述基板；
在所述第一组顶针下降到第二预设位置，控制所述第一组顶针回到所述初始位置。
在其中的一个实施例中，所述预定指令具体是指开始烘烤的指令，所述开始计时具体是指从获取到所述开始烘烤的指令后开始计时。
在其中的一个实施例中，所述第一组顶针从所述初始位置上升至所述第一预设位置所上升的距离可以等于所述第一组顶针从所述第一预设位置下降至所述第二预设位置所下降的距离。
在其中的一个实施例中，在所述第一组顶针回到所述初始位置后，所述方法还包括：
获取计时时间，当所述计时时间等于或者大于预设时间时，将所述计时时间和所述第一组顶针上升的次数重置为初始值，重新开始计时并循环执行下述步骤：
控制所述第一组顶针从所述初始位置上升支撑所述基板，并记录所述第一组顶针上升的次数；
在所述第一组顶针上升到所述第一预设位置，控制所述第一组顶针向第二预设方向移动第二预设距离，以使得所述基板向所述第二预设方向移动所述第二预设距离，所述第二预设方向与所述第一预设方向为相反的方向，所述第二预设距离与所述第一组顶针上升的次数相关；
控制所述第一组顶针下降使得所述第二组顶针支撑所述基板；
在所述第一组顶针下降到所述第二预设位置，控制所述第一组顶针回到所述初始位置；
获取计时时间，当所述计时时间等于或者大于所述预设时间时，排出所述基板。
在其中的一个实施例中，所述第一预设距离与所述第一组顶针上升的次数相关为：
L i＝x，(i＝1)
L i＝2x，(i＝2,3,4,…)
其中，所述L i表示所述第一预设距离，所述i表示所述第一组顶针上升的次数。
在其中的一个实施例中，所述初始值为0，所述第二预设距离与所述第一组顶针上升的次数相关为：
R i＝x，(i＝1)
R i＝2x，(i＝2,3,4,…)
其中，所述R i表示所述第二预设距离，所述i表示所述第一组顶针上升的次数。
在其中的一个实施例中，所述预设时间为烘烤时间的1/2。
在其中的一个实施例中，所述烘烤时间为人为设定的。
本申请实施例的另一个方面提供了一种烘烤装置，其中，包括：
第一获取单元，用于获取到预定指令，开始计时并控制下述单元循环工作：
第一上升控制单元，用于控制所述第一组顶针从所述初始位置上升支撑所述基板，并记录所述第一组顶针上升的次数；
第一移动控制单元，用于在所述第一组顶针上升到所述第一预设位置，控制所述第一组顶针向所述第一预设方向移动所述第一预设距离，以使得所述基板向所述第一预设方向移动所述第一预设距离，所述第一预设距离与所述第一组顶针上升的次数相关；
第一下降控制单元，用于控制所述第一组顶针下降使得所述第二组顶针支撑所述基板；
第一返回控制单元，用于在所述第一组顶针下降到所述第二预设位置，控制所述第一组顶针回到所述初始位置。
在其中的一个实施例中，所述烘烤装置还包括：
第二获取单元，用于在所述第一组顶针回到所述初始位置后，获取计时时间，当所述计时时间等于或者大于所述预设时间时，将所述计时时间和所述第一组顶针上升的次数重置为初始值，重新开始计时并控制下述单元循环工作：
第二上升控制单元，用于控制所述第一组顶针从所述初始位置上升支撑所述基板，并记录所述第一组顶针上升的次数；
第二移动控制单元，还用于在所述第一组顶针上升到所述第一预设位置，控制所述第一组顶针向所述第二预设方向移动所述第二预设距离，以使得所述基板向所述第二预设方向移动所述第二预设距离，所述第二预设方向与所述第一预设方向为相反的方向，所述第二预设距离与所述第一组顶针上升的次数相关；
第二下降控制单元，用于控制所述第一组顶针下降使得所述第二组顶针支撑所述基板；
第二返回控制单元，还用于在所述第一组顶针下降到所述第二预设位置，控制所述第一组顶针回到所述初始位置；
排出控制单元，用于获取计时时间，当所述计时时间等于或者大于所述预设时间时，排出所述基板。
在其中的一个实施例中，所述第一预设距离与所述第一组顶针上升的次数相关具体为：
L i＝x，(i＝1)
L i＝2x，(i＝2,3,4,…)
其中，所述L i表示所述第一预设距离，所述i表示所述第一组顶针上升的次数。
在其中的一个实施例中，所述初始值为0，所述第二预设距离与所述第一组顶针上升的次数相关具体为：
R i＝x，(i＝1)
R i＝2x，(i＝2,3,4,…)
其中，所述R i表示所述第二预设距离，所述i表示所述第一组顶针上升的次数。
在其中的一个实施例中，所述预设时间为烘烤时间的1/2。本申请实施例的另一个方面提供了一种烘烤装置，其中，包括存储单元、处理单元以及存储在所述存储单元中并可在所述处理单元上运行的计算机程序，其中，所述处理单元执行所述计算机程序时实现如下所述烘烤方法的步骤：
获取到预定指令，开始计时并循环执行下述步骤：
控制第一组顶针从初始位置上升支撑基板，并记录所述第一组顶针上升的次数；
在所述第一组顶针上升到第一预设位置，控制所述第一组顶针向第一预设方向移动第一预设距离，以使得所述基板向所述第一预设方向移动所述第一预设距离，所述第一预设距离与所述第一组顶针上升的次数相关；
控制所述第一组顶针下降使得第二组顶针支撑所述基板；
在所述第一组顶针下降到第二预设位置，控制所述第一组顶针回到所述初始位置。
在其中的一个实施例中，所述预定指令具体是指开始烘烤的指令，所述开始计时具体是指从获取到所述开始烘烤的指令后开始计时。
在其中的一个实施例中，所述第一组顶针从所述初始位置上升至所述第一预设位置所上升的距离可以等于所述第一组顶针从所述第一预设位置下降至所述第二预设位置所下降的距离。
在其中的一个实施例中，在所述第一组顶针回到所述初始位置后，还包括步骤：
获取计时时间，当所述计时时间等于或者大于预设时间时，将所述计时时间和所述第一组顶针上升的次数重置为初始值，重新开始计时并循环执行下述步骤：
控制所述第一组顶针从所述初始位置上升支撑所述基板，并记录所述第一组顶针上升的次数；
在所述第一组顶针上升到所述第一预设位置，控制所述第一组顶针向第二预设方向移动第二预设距离，以使得所述基板向所述第二预设方向移动所述第二预设距离，所述第二预设方向与所述第一预设方向为相反的方向，所述第二预设距离与所述第一组顶针上升的次数相关；
控制所述第一组顶针下降使得所述第二组顶针支撑所述基板；
在所述第一组顶针下降到所述第二预设位置，控制所述第一组顶针回到所述初始位置；
获取计时时间，当所述计时时间等于或者大于所述预设时间时，排出所述基板。
在其中的一个实施例中，所述第一预设距离与所述第一组顶针上升的次数相关为：
L i＝x，(i＝1)
L i＝2x，(i＝2,3,4,…)
其中，所述L i表示所述第一预设距离，所述i表示所述第一组顶针上升的次数。
在其中的一个实施例中，所述初始值为0，所述第二预设距离与所述第一组顶针上升的次数相关为：
R i＝x，(i＝1)
R i＝2x，(i＝2,3,4,…)
其中，所述R i表示所述第二预设距离，所述i表示所述第一组顶针上升的次数。
在其中的一个实施例中，所述预设时间为烘烤时间的1/2。
本申请实施例的另一个方面提供了一种计算机可读存储介质，所述计算机 可读存储介质存储有计算机程序，其中，所述计算机程序被一个或多个处理器执行时实现本申请实施例提供的如下所述方法的步骤：
获取到预定指令，开始计时并循环执行下述步骤：
控制第一组顶针从初始位置上升支撑基板，并记录所述第一组顶针上升的次数；
在所述第一组顶针上升到第一预设位置，控制所述第一组顶针向第一预设方向移动第一预设距离，以使得所述基板向所述第一预设方向移动所述第一预设距离，所述第一预设距离与所述第一组顶针上升的次数相关；
控制所述第一组顶针下降使得第二组顶针支撑所述基板；
在所述第一组顶针下降到第二预设位置，控制所述第一组顶针回到所述初始位置。
本申请实施例通过获取到预定指令，开始计时并循环执行下述步骤：控制第一组顶针从初始位置上升支撑基板，并记录所述第一组顶针上升的次数；在所述第一组顶针上升到第一预设位置，控制所述第一组顶针向第一预设方向移动第一预设距离，以使得所述基板向所述第一预设方向移动所述第一预设距离，所述第一预设距离与所述第一组顶针上升的次数相关；控制所述第一组顶针下降使得第二组顶针支撑所述基板；在所述第一组顶针下降到第二预设位置，控制所述第一组顶针回到所述初始位置；防止了同一顶针与基板同一位置反复接触或长时间接触，使基板的各个位置的加热时间一致，有效克服了烘烤过程中受热不均的问题。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例或相关技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例提供的烘烤方法的实现流程示意图；
图2是本申请实施例提供的烘烤过程中第一组顶针的位置示意图；
图3是本申请实施例提供的烘烤方法的实现流程示意图；
图4是本申请实施例提供的烘烤装置的示意图；
图5是本申请实施例提供的烘烤装置的示意图；
图6是本申请实施例提供的烘烤装置的示意图。
具体实施方式
以下描述中，为了说明而不是为了限定，提出了诸如特定系统结构、技术之类的具体细节，以便透彻理解本申请实施例。然而，本领域的技术人员应当清楚，在没有这些具体细节的其它实施例中也可以实现本申请。在其它情况中，省略对众所周知的系统、装置、电路以及方法的详细说明，以免不必要的细节妨碍本申请的描述。
应当理解，当在本说明书和所附权利要求书中使用时，术语“包括”指示所描述特征、整体、步骤、操作、元素和/或组件的存在，但并不排除一个或多个其它特征、整体、步骤、操作、元素、组件和/或其集合的存在或添加。
还应当理解，在此本申请说明书中所使用的术语仅仅是出于描述特定实施例的目的而并不意在限制本申请。如在本申请说明书和所附权利要求书中所使用的那样，除非上下文清楚地指明其它情况，否则单数形式的“一”、“一个”及“该”意在包括复数形式。
还应当进一步理解，在本申请说明书和所附权利要求书中使用的术语“和/或”是指相关联列出的项中的一个或多个的任何组合以及所有可能组合，并且包括这些组合。
如在本说明书和所附权利要求书中所使用的那样，术语“如果”可以依据上下文被解释为“当...时”或“一旦”或“响应于确定”或“响应于检测到”。类似地，短语“如果确定”或“如果检测到[所描述条件或事件]”可以依据上下文被解释为意指“一旦确定”或“响应于确定”或“一旦检测到[所描述条件或事件]”或“响应于检测到[所描述条件或事件]”。
为了说明本申请所述的技术方案，下面通过具体实施例来进行说明。
在描述具体实施例之前，先介绍PI(PolyimideFilm，PI)膜。PI膜有突出的耐高温、耐辐射、耐化学腐蚀和电绝缘性能，可在250～280℃空气中长期使用，且PI化学性质稳定，不需要加入阻燃剂就可以阻止燃烧。所以，PI膜特别适宜用作柔性印制电路板基材和各种耐高温电机电器绝缘材料。
常见的，如应用于液晶显示面板制备。PI液预烘烤是液晶显示面板制备工艺中的一个关键步骤，将PI液均匀涂抹在玻璃基板上之后，对涂抹了PI的玻璃基板进行预烘烤，直至形成PI膜。PI膜是一种导向膜或定向膜，能够使液晶显示面板中的液晶分子按照预倾角排列。但是，PI液在成膜过程中，其缩膜率会根据受热温度的变化而变化，所以PI液受热是否均匀，将直接影响到PI液成膜时缩膜率是否一致，进而影响到液晶显示面板亮度是否均匀、是否会出现mura(屏幕斑点)。
本申请实施例正是针对PI液成膜时缩膜率受温度影响的问题，提出了一种烘烤方法、装置及烘烤炉，以解决烘烤过程中温度不均匀的问题。
当然，本申请实施例除了能够解决PI液成膜过程中受热不均匀的问题，还能够解决其它烘烤工艺中出现的烘烤温度不均匀的问题，例如光刻胶的烘烤工艺，并非限定于只能解决PI液成膜过程中受热不均匀的问题。
图1示出了本申请实施例提供的烘烤方法的实现流程示意图，如图所示方法可以包括以下步骤：
步骤S101，获取到预定指令，开始计时并循环执行下述步骤。
其中，所述预定指令具体是指开始烘烤的指令，所述开始计时具体是指从获取到所述开始烘烤的指令的后，开始计时；所述循环执行下述步骤是指顺序执行步骤S102至步骤S105之后，继续从步骤S102执行。
步骤S102，控制所述第一组顶针从初始位置上升支撑基板，并记录所述第 一组顶针上升的次数。
其中，所述初始位置可以是指所述第一组顶针不与所述基板接触时所处的某一位置，此时所述基板由所述第二组顶针支撑。还可以设定在进行烘烤程序之前，通过烘烤炉上的某个按键触发第一组顶针回到初始位置。
在具体应用中，所述第一组顶针上升的次数的初始值可以设置为0，所述第一组顶针上升一次，次数加1，在实际应用中还可以设置第一组顶针循环执行一次从初始位置经过上升、平移、下降、再回到初始位置，就自动将第一组顶针循环的次数加1；当然还可以设置平移一次次数加1；或者，下降一次次数加1。
步骤S103，在所述第一组顶针上升到第一预设位置，控制所述第一组顶针向第一预设方向移动第一预设距离，以使得所述基板向所述第一预设方向移动所述第一预设距离，所述第一预设距离与所述第一组顶针上升的次数相关。
其中，所述第一预设位置是指所述第一组顶针上升至能够支撑所述基板的的某一位置，当所述第一组顶针位于所述第一预设位置时，所述基板不再与所述第二组顶针接触。
参见图2，一个实施例中，PI液21被均匀涂抹在玻璃基板22上，热板23位于玻璃基板22的下方，热板23上安装有第二组顶针24和第一组顶针25，所述第一组顶针25可上下、左右移动。
图2-A示出了所述第一组顶针25上升到第一预设位置P1，此时所述玻璃基板22由所述第一组顶针25支撑，所述玻璃基板22离开所述第二组顶针24。
图2-B示出了所述第一组顶针25向第一预设方向移动第一预设距离L，以使所述玻璃基板22向第一预设方向移动第一预设距离L。
在具体应用中，所述第一预设距离与所述第一组顶针上升的次数相关为：
L i＝x，(i＝1)
L i＝2x，(i＝2,3,4,…)
其中，所述L i表示第一预设距离，所述i表示所述第一组顶针上升的次数。
例如，当所述第一组顶针上升的次数为1时，控制第一组顶针向第一预设方向移动x毫米；当所述第一组顶针上升的次数为2、3、4、……、n-1、n时，控制第一组顶针向第一预设方向移动2x毫米。其中，n指大于1的任一自然数。当然，在实际应用于还可以设置第一预设距离的单位为其它距离计量单位；还可以设置第一预设距离与第一组顶针上升的次数的其它对应关系，例如，第一次移动x，第二次移动2x，第三次移动x，还可以设置每次移动的距离都相等，在此不做限制。
步骤S104，控制所述第一组顶针下降使得第二组顶针支撑基板。
在具体应用中，所述第一组顶针是可以移动的顶针组，所述第二组顶针可以是不能移动的顶针组；第一组顶针和第二组顶针均具有加热功能；还可以设置第一组顶针和第二组顶针只有一组具有加热功能。
步骤S105，在所述第一组顶针下降到第二预设位置，控制所述第一组顶针回到初始位置。
参见图2，一个实施例中，图2-C示出了所述第一组顶针25下降到第二预设位置P2，使得所述第二组顶针24支撑所述玻璃基板22。
其中，所述第二预设位置是指所述第一组顶针下降至能够不再与所述基板接触，此时所述基板由所述第二组顶针支撑。
在具体应用中，所述第一组顶针从所述初始位置上升至所述第一预设位置所上升的距离可以等于所述第一组顶针从所述第一预设位置下降至所述第二预设位置所下降的距离。
参见图2，一个实施例中，图2-D示出了所述第一组顶针25回到初始位置P0。
在具体应用中，所述第二组顶针可以是能够上下移动的顶针组。可以在控制所述第一组顶针下降时，控制所述第二组顶针上升，以使第二组顶针支撑所述基板。
在具体应用中，还可以控制第二组顶针下降，以使第一组顶针支撑所述基板；控制所述第一组顶针从初始位置向第一预设方向移动第一预设距离，以使所述基板向第一预设方向移动第一预设距离；控制所述第二组顶针上升支撑所述基板；控制所述第一组顶针返回到初始位置。
在一个实施例中，参见图3，在所述第一组顶针回到所述初始位置后，所述方法还包括：
步骤S301，获取计时时间，当所述计时时间等于或者大于预设时间时，将所述计时时间和所述第一组顶针上升的次数重置为初始值，重新开始计时并循环执行下述步骤。
在具体应用中，所述预设时间可以是烘烤时间的1/2。所述烘烤时间是指从开始计时到烘烤结束所用的总时间。所述烘烤时间可以是人为设定的。
在具体应用中，所述将所述计时时间和所述第一组顶针上升的次数重置为初始值，所述初始值可以是0。
在具体应用中，在获取计时时间后，如果所述计时时间等于或者大于预设时间，将所述计时时间和所述第一组顶针上升的次数重置为初始值，开始计时并循环执行下述步骤，所述循环执行下述步骤是指顺序执行步骤S302至S306之后，继续从步骤S302执行；如果所述计时时间小于预设时间，则继续从步骤S102执行。
在具体实施例中，我们是设置基板向第一预设方向移动1/2烘烤时间，然后再向第二预设方向移动1/2烘烤时间。所以如果计时时间小于预设时间说明第一组顶针向第一预设方向还未移动1/2烘烤时间，那么则需要继续从步骤S102执行，如果计时时间等于或者大于预设时间，说明所述第一组顶针向第一预设方向已经移动1/2烘烤时间，就需要向相反的方向继续移动，这是就需要将所述计时时间和所述第一组顶针上升的次数重置为初始值，重新将当前位置作为向第二预设方向移动的起点，然后开始计时并从步骤S302执行。
在具体应用中，也可以获取所述第一组顶针上升的次数，如果所述次数等于预设次数，将所述第一组顶针上升的次数重置为初始值，并循环执行下述步 骤。所述预设次数可以设置为1/2烘烤时间内所述第一组顶针需要上升的次数。
步骤S302，控制所述第一组顶针从所述初始位置上升支撑所述基板，并记录所述第一组顶针上升的次数。
该步骤与步骤S102一致，具体可参照步骤S102的描述，在此不再赘述。
步骤S303，在所述第一组顶针上升到所述第一预设位置，控制所述第一组顶针向第二预设方向移动第二预设距离，以使得所述基板向所述第二预设方向移动所述第二预设距离，所述第二预设方向与所述第一预设方向为相反的方向，所述第二预设距离与所述第一组顶针上升的次数相关。
在具体应用中，所述初始值为0，所述第二预设距离与第一组顶针上升的次数相关为：
R i＝x，(i＝1)
R i＝2x，(i＝2,3,4,…)
其中，所述R i表示第二预设距离，所述i表示所述第一组顶针上升的次数。
例如，当所述第一组顶针上升的次数为1时，控制第一组顶针向第一预设方向移动x毫米；当所述第一组顶针上升的次数为2、3、4、……、n-1、n时，控制第一组顶针向第一预设方向移动2x毫米。其中，n指大于1的任一自然数。当然，在实际应用于还可以设置第一预设距离的单位为其它距离计量单位；还可以设置第一预设距离与第一组顶针上升的次数的其它对应关系，例如，如果沿第一预设方向第一次移动x，第二次移动2x，第三次移动x，则沿第二预设方向第一次移动2x，第二次移动x，第三次移动2x，以此可以防止同一顶针与基板同一位置反复接触或长时间接触；还可以设置沿第二预设方向每次移动的距离都相等，具体移动距离在此不做限制，但需要保证的是，沿第一预设方向最后一次移动的距离与沿第二预设方向第一次移动的距离不同，。
在具体应用中，所述第二预设方向与所述第一预设方向为相反的方向可以指，第一预设方向为水平向左，第二预设方向为水平向右；或第一预设方向为水平向右，第二预设方向为水平向左；也可以指第一预设方向为水平向前，第二预设方向为水平向后，或第一预设方向为水平向后，第二预设方向为水平向前。所述水平可以指与所述基板平行。
步骤S304，控制所述第一组顶针下降使得所述第二组顶针支撑所述基板。
步骤S305，在所述第一组顶针下降到所述第二预设位置，控制所述第一组顶针回到所述初始位置。
步骤S306，获取计时时间，当所述计时时间等于或者大于所述预设时间时，排出所述基板。
在具体应用中，在控制所述第一组顶针回到所述初始位置，获取计时时间，如果所述计时时间等于或者大于所述预设时间，排除所述基板，计时结束，烘烤结束；如果所述计时时间小于所述预设时间，继续执行步骤S302。
由上述内容可以看出，步骤S102至步骤S105，与步骤S302至步骤S305实际是基板向相反方向移动的过程。在向第一预设方向移动的过程中循环执行步骤S102至S105，并且每次执行完步骤S105之后，还需要执行步骤S301(实 际是循环执行步骤S102、S103、S104、S105、S301)，以确定向第一预设方向是否移动够预设时间，若未到预设时间继续执行步骤S102至步骤S105，若向第一预设方向移动够预设时间，则重新计时并向相反的方向移动，这时就需要执行步骤S302至步骤S305，并且，每次执行完步骤S305之后，还需要执行步骤S306(实际是循环执行步骤S302、S303、S304、S305、S306)以确定向第二预设方向是否移动够预设时间，若未到预设时间则继续执行步骤S302至步骤S305，若向第二预设方向移动够预设时间，则排除基板。
另外，我们还可以设置每一次移动第一预设距离或者第二预设距离时，第二组顶针和第一组顶针接触基板的时间相同。这样，液晶显示面板中某一个接触点与某一个顶针接触的时间实际为：整个烘烤的时间除以总共移动的次数。
本申请实施例中所述的烘烤方法在获取到预定指令，开始计时并循环执行下述步骤：控制第一组顶针从初始位置上升支撑基板，并记录所述第一组顶针上升的次数；在所述第一组顶针上升到第一预设位置，控制所述第一组顶针向第一预设方向移动第一预设距离，以使得所述基板向所述第一预设方向移动所述第一预设距离，所述第一预设距离与所述第一组顶针上升的次数相关；控制所述第一组顶针下降使得第二组顶针支撑所述基板；在所述第一组顶针下降到第二预设位置，控制所述第一组顶针回到所述初始位置。该技术方案使得同一顶针与基板同一位置只接触一次，防止了同一顶针与基板同一位置反复接触或长时间接触，使基板的各个位置的加热时间一致，有效克服了烘烤过程中受热不均的问题。
应理解，上述实施例中各步骤的序号的大小并不意味着执行顺序的先后，各过程的执行顺序应以其功能和内在逻辑确定，而不应对本申请实施例的实施过程构成任何限定。
图4是本申请实施例提供的烘烤装置的示意框图，为了便于说明，仅示出了与本申请实施例相关的部分。所述烘烤装置包括：
第一获取单元41，用于获取到预定指令，开始计时并控制下述单元循环工作：
第一上升控制单元42，用于控制所述第一组顶针从所述初始位置上升支撑所述基板，并记录所述第一组顶针上升的次数。
第一移动控制单元43，用于在所述第一组顶针上升到所述第一预设位置，控制所述第一组顶针向所述第一预设方向移动所述第一预设距离，以使得所述基板向所述第一预设方向移动所述第一预设距离，所述第一预设距离与所述第一组顶针上升的次数相关。
在具体应用中，所述第一预设距离与所述第一组顶针上升的次数相关为：
L i＝x，(i＝1)
L i＝2x，(i＝2,3,4,…)
其中，所述L i表示所述第一预设距离，所述i表示所述第一组顶针上升的次数。
第一下降控制单元44，用于控制所述第一组顶针下降使得所述第二组顶针 支撑所述基板。
第一返回控制单元45，用于在所述第一组顶针下降到所述第二预设位置，控制所述第一组顶针回到所述初始位置。
在一个实施例中，参见图5，所述烘烤装置还包括：
第二获取单元51，还用于在所述第一组顶针回到所述初始位置后，获取计时时间，当所述计时时间等于或者大于所述预设时间时，将所述计时时间和所述第一组顶针上升的次数重置为初始值，重新开始计时并控制下述单元循环工作：
第二上升控制单元52，用于控制所述第一组顶针从所述初始位置上升支撑所述基板，并记录所述第一组顶针上升的次数。
第二移动控制单元53，还用于在所述第一组顶针上升到所述第一预设位置，控制所述第一组顶针向所述第二预设方向移动所述第二预设距离，以使得所述基板向所述第二预设方向移动所述第二预设距离，所述第二预设方向与所述第一预设方向为相反的方向，所述第二预设距离与所述第一组顶针上升的次数相关。
在具体应用中，所述初始值为0，所述第二预设距离与第一组顶针上升的次数相关为：
R i＝x，(i＝1)
R i＝2x，(i＝2,3,4,…)
其中，所述R i表示所述第二预设距离，所述i表示所述第一组顶针上升的次数。
第二下降控制单元54，用于控制所述第一组顶针下降使得所述第二组顶针支撑所述基板。
第二返回控制单元55，还用于在所述第一组顶针下降到所述第二预设位置，控制所述第一组顶针回到所述初始位置。
排出控制单元56，用于获取计时时间，当所述计时时间等于或者大于所述预设时间时，排出所述基板。
在具体应用中，所述预设时间为烘烤时间的1/2。
所属领域的技术人员可以清楚地了解到，为了描述的方便和简洁，仅以上述各功能单元的划分进行举例说明，实际应用中，可以根据需要而将上述功能分配由不同的功能单元完成，即将所述装置的内部结构划分成不同的功能单元，以完成以上描述的全部或者部分功能。实施例中的各功能单元可以集成在一个处理单元中，也可以是各个单元单独物理存在，也可以两个或两个以上单元集成在一个单元中，上述集成的单元既可以采用硬件的形式实现，也可以采用软件功能单元的形式实现。另外，各功能单元的具体名称也只是为了便于相互区分，并不用于限制本申请的保护范围。上述系统中单元的具体工作过程，可以参考前述方法实施例中的对应过程，在此不再赘述。
图6是本申请实施例提供的烘烤装置的示意图。如图6所示，该实施例的烘烤装置6包括：处理单元60、存储单元61以及存储在所述存储单元61中并 可在所述处理单元60上运行的计算机程序62，例如烘烤方法的程序。所述处理单元60执行所述计算机程序62时实现上述各个烘烤方法实施例中的步骤，例如图1所示的步骤S101至S105。或者，所述处理单元60执行所述计算机程序62时实现上述各装置实施例中各单元的功能，例如图4所示单元41至45的功能。
例如，所述计算机程序62可以被分割成一个或多个单元，所述一个或者多个单元被存储在所述存储单元61中，并由所述处理单元60执行，以完成本申请。所述一个或多个单元可以是能够完成特定功能的一系列计算机程序指令段，该指令段用于描述所述计算机程序62在所述烘烤装置6中的执行过程。例如，所述计算机程序62可以被分割成第一获取单元、第一上升控制单元、第一移动控制单元、第一下降控制单元、第一返回控制单元(虚拟装置中的单元)，各单元具体功能如下：
第一获取单元，用于获取到预定指令，开始计时并控制下述单元循环工作：
第一上升控制单元，用于控制所述第一组顶针从所述初始位置上升支撑所述基板，并记录所述第一组顶针上升的次数。
第一移动控制单元，用于在所述第一组顶针上升到所述第一预设位置，控制所述第一组顶针向所述第一预设方向移动所述第一预设距离，以使得所述基板向所述第一预设方向移动所述第一预设距离，所述第一预设距离与所述第一组顶针上升的次数相关。
在具体应用中，所述第一预设距离与所述第一组顶针上升的次数相关为：
L i＝x，(i＝1)
L i＝2x，(i＝2,3,4,…)
其中，所述L i表示所述第一预设距离，所述i表示所述第一组顶针上升的次数。
第一下降控制单元，用于控制所述第一组顶针下降使得所述第二组顶针支撑所述基板。
第一返回控制单元，用于在所述第一组顶针下降到所述第二预设位置，控制所述第一组顶针回到所述初始位置。
在一个实施例中，所述烘烤装置还包括：
第二获取单元，还用于在所述第一组顶针回到所述初始位置后，获取计时时间，当所述计时时间等于或者大于所述预设时间时，将所述计时时间和所述第一组顶针上升的次数重置为初始值，重新开始计时并控制下述单元循环工作：
第二上升控制单元，用于控制所述第一组顶针从所述初始位置上升支撑所述基板，并记录所述第一组顶针上升的次数。
第二移动控制单元，还用于在所述第一组顶针上升到所述第一预设位置，控制所述第一组顶针向所述第二预设方向移动所述第二预设距离，以使得所述基板向所述第二预设方向移动所述第二预设距离，所述第二预设方向与所述第一预设方向为相反的方向，所述第二预设距离与所述第一组顶针上升的次数相关。
在具体应用中，所述初始值为0，所述第二预设距离与第一组顶针上升的次数相关为：
R i＝x，(i＝1)
R i＝2x，(i＝2,3,4,…)
其中，所述R i表示所述第二预设距离，所述i表示所述第一组顶针上升的次数。
第二下降控制单元，用于控制所述第一组顶针下降使得所述第二组顶针支撑所述基板。
第二返回控制单元，还用于在所述第一组顶针下降到所述第二预设位置，控制所述第一组顶针回到所述初始位置。
排出控制单元，用于获取计时时间，当所述计时时间等于或者大于所述预设时间时，排出所述基板。
在具体应用中，所述预设时间为烘烤时间的1/2。
所述烘烤装置6可以是桌上型计算机、笔记本、掌上电脑及云端服务器等计算设备。所述烘烤装置可包括，但不仅限于，处理单元60、存储单元61。本领域技术人员可以理解，图6仅仅是烘烤装置6的示例，并不构成对烘烤装置6的限定，可以包括比图示更多或更少的部件，或者组合某些部件，或者不同的部件，例如所述烘烤装置还可以包括输入输出设备、网络接入设备、总线等。
所称处理单元60可以是中央处理单元(Central Processing Unit，CPU)，还可以是其他通用处理器、数字信号处理器(Digital Signal Processor，DSP)、专用集成电路(Application Specific Integrated Circuit，ASIC)、现成可编程门阵列(Field-Programmable Gate Array，FPGA)或者其他可编程逻辑器件、分立门或者晶体管逻辑器件、分立硬件组件等。通用处理器可以是微处理器或者该处理器也可以是任何常规的处理器等。
所述存储单元61可以是所述烘烤装置6的内部存储单元，例如烘烤装置6的硬盘或内存。所述存储单元61也可以是所述烘烤装置6的外部存储单元，例如所述烘烤装置6上配备的插接式硬盘，智能存储卡(Smart Media Card,SMC)，安全数字(Secure Digital,SD)卡，闪存卡(Flash Card)等。进一步地，所述存储单元61还可以既包括所述烘烤装置6的内部存储单元也包括外部存储设备。所述存储单元61用于存储所述计算机程序以及所述烘烤炉所需的其他程序和数据。所述存储单元61还可以用于暂时地存储已经输出或者将要输出的数据。在上述实施例中，对各个实施例的描述都各有侧重，某个实施例中没有详述或记载的部分，可以参见其它实施例的相关描述。
本领域普通技术人员可以意识到，结合本文中所公开的实施例描述的各示例的单元及算法步骤，能够以电子硬件、或者计算机软件和电子硬件的结合来实现。这些功能究竟以硬件还是软件方式来执行，取决于技术方案的特定应用和设计约束条件。专业技术人员可以对每个特定的应用来使用不同方法来实现所描述的功能，但是这种实现不应认为超出本申请的范围。
在本申请所提供的实施例中，应该理解到，所揭露的装置/终端设备和方法， 可以通过其它的方式实现。例如，以上所描述的装置/终端设备实施例仅仅是示意性的，例如，所述模块或单元的划分，仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，例如多个单元或组件可以结合或者可以集成到另一个系统，或一些特征可以忽略，或不执行。另一点，所显示或讨论的相互之间的耦合或直接耦合或通讯连接可以是通过一些接口，装置或单元的间接耦合或通讯连接，可以是电性，机械或其它的形式。
所述作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元显示的部件可以是或者也可以不是物理单元，即可以位于一个地方，或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本实施例方案的目的。
另外，在本申请各个实施例中的各功能单元可以集成在一个处理单元中，也可以是各个单元单独物理存在，也可以两个或两个以上单元集成在一个单元中。上述集成的单元既可以采用硬件的形式实现，也可以采用软件功能单元的形式实现。
所述集成的模块/单元如果以软件功能单元的形式实现并作为独立的产品销售或使用时，可以存储在一个计算机可读取存储介质中。基于这样的理解，本申请实现上述实施例方法中的全部或部分流程，也可以通过计算机程序来指令相关的硬件来完成，所述的计算机程序可存储于一计算机可读存储介质中，该计算机程序在被处理器执行时，可实现上述各个方法实施例的步骤。其中，所述计算机程序包括计算机程序代码，所述计算机程序代码可以为源代码形式、对象代码形式、可执行文件或某些中间形式等。所述计算机可读介质可以包括：能够携带所述计算机程序代码的任何实体或装置、记录介质、U盘、移动硬盘、磁碟、光盘、计算机存储器、只读存储器(ROM，Read-Only Memory)、随机存取存储器(RAM，Random Access Memory)、电载波信号、电信信号以及软件分发介质等。需要说明的是，所述计算机可读介质包含的内容可以根据司法管辖区内立法和专利实践的要求进行适当的增减，例如在某些司法管辖区，根据立法和专利实践，计算机可读介质不包括是电载波信号和电信信号。
以上所述实施例仅用以说明本申请的技术方案，而非对其限制；尽管参照前述实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的精神和范围，均应包含在本申请的保护范围之内。

Claims (20)

  1. 一种烘烤方法，包括以下步骤：
    获取到预定指令，开始计时并循环执行下述步骤：
    控制第一组顶针从初始位置上升支撑基板，并记录所述第一组顶针上升的次数；
    在所述第一组顶针上升到第一预设位置，控制所述第一组顶针向第一预设方向移动第一预设距离，以使得所述基板向所述第一预设方向移动所述第一预设距离，所述第一预设距离与所述第一组顶针上升的次数相关；
    控制所述第一组顶针下降使得第二组顶针支撑所述基板；
    在所述第一组顶针下降到第二预设位置，控制所述第一组顶针回到所述初始位置。
  2. 如权利要求1所述的烘烤方法，其中，所述预定指令具体是指开始烘烤的指令，所述开始计时具体是指从获取到所述开始烘烤的指令后开始计时。
  3. 如权利要求1所述的烘烤方法，其中，所述第一组顶针从所述初始位置上升至所述第一预设位置所上升的距离可以等于所述第一组顶针从所述第一预设位置下降至所述第二预设位置所下降的距离。
  4. 如权利要求1所述的烘烤方法，其中，在所述第一组顶针回到所述初始位置后，所述方法还包括：
    获取计时时间，当所述计时时间等于或者大于预设时间时，将所述计时时间和所述第一组顶针上升的次数重置为初始值，重新开始计时并循环执行下述步骤：
    控制所述第一组顶针从所述初始位置上升支撑所述基板，并记录所述第一组顶针上升的次数；
    在所述第一组顶针上升到所述第一预设位置，控制所述第一组顶针向第二预设方向移动第二预设距离，以使得所述基板向所述第二预设方向移动所述第二预设距离，所述第二预设方向与所述第一预设方向为相反的方向，所述第二预设距离与所述第一组顶针上升的次数相关；
    控制所述第一组顶针下降使得所述第二组顶针支撑所述基板；
    在所述第一组顶针下降到所述第二预设位置，控制所述第一组顶针回到所述初始位置；
    获取计时时间，当所述计时时间等于或者大于所述预设时间时，排出所述基板。
  5. 如权利要求1所述的烘烤方法，其中，所述第一预设距离与所述第一组顶针上升的次数相关为：
    L i＝x，(i＝1)
    L i＝2x，(i＝2,3,4,…)
    其中，所述L i表示所述第一预设距离，所述i表示所述第一组顶针上升的次数。
  6. 如权利要求4所述的烘烤方法，其中，所述初始值为0，所述第二预设距离与所述第一组顶针上升的次数相关为：
    R i＝x，(i＝1)
    R i＝2x，(i＝2,3,4,…)
    其中，所述R i表示所述第二预设距离，所述i表示所述第一组顶针上升的次数。
  7. 如权利要求4所述的烘烤方法，其中，所述预设时间为烘烤时间的1/2。
  8. 如权利要求7所述的烘烤方法，其中，所述烘烤时间为人为设定的。
  9. 一种烘烤装置，包括：
    第一获取单元，用于获取到预定指令，开始计时并控制下述单元循环工作：
    第一上升控制单元，用于控制所述第一组顶针从所述初始位置上升支撑所述基板，并记录所述第一组顶针上升的次数；
    第一移动控制单元，用于在所述第一组顶针上升到所述第一预设位置，控制所述第一组顶针向所述第一预设方向移动所述第一预设距离，以使得所述基板向所述第一预设方向移动所述第一预设距离，所述第一预设距离与所述第一组顶针上升的次数相关；
    第一下降控制单元，用于控制所述第一组顶针下降使得所述第二组顶针支撑所述基板；
    第一返回控制单元，用于在所述第一组顶针下降到所述第二预设位置，控制所述第一组顶针回到所述初始位置；
    第二获取单元，用于在所述第一组顶针回到所述初始位置后，获取计时时间，当所述计时时间等于或者大于所述预设时间时，将所述计时时间和所述第一组顶针上升的次数重置为初始值，重新开始计时并控制下述单元循环工作：
    第二上升控制单元，用于控制所述第一组顶针从所述初始位置上升支撑所述基板，并记录所述第一组顶针上升的次数；
    第二移动控制单元，还用于在所述第一组顶针上升到所述第一预设位置，控制所述第一组顶针向所述第二预设方向移动所述第二预设距离，以使得所述基板向所述第二预设方向移动所述第二预设距离，所述第二预设方向与所述第一预设方向为相反的方向，所述第二预设距离与所述第一组顶针上升的次数相关；
    第二下降控制单元，用于控制所述第一组顶针下降使得所述第二组顶针支撑所述基板；
    第二返回控制单元，还用于在所述第一组顶针下降到所述第二预设位置，控制所述第一组顶针回到所述初始位置；
    排出控制单元，用于获取计时时间，当所述计时时间等于或者大于所述预设时间时，排出所述基板；
    其中，所述第一预设距离与所述第一组顶针上升的次数相关具体为：
    L i＝x，(i＝1)
    L i＝2x，(i＝2,3,4,…)
    其中，所述L i表示所述第一预设距离，所述i表示所述第一组顶针上升的次数；
    所述初始值为0，所述第二预设距离与所述第一组顶针上升的次数相关具体为：
    R i＝x，(i＝1)
    R i＝2x，(i＝2,3,4,…)
    其中，所述R i表示所述第二预设距离，所述i表示所述第一组顶针上升的次数；
    所述预设时间为烘烤时间的1/2。
  10. 一种烘烤装置，包括存储单元、处理单元以及存储在所述存储单元中并可在所述处理单元上运行的计算机程序，其中，所述计算机程序包括：
    第一获取单元，用于获取到预定指令，开始计时并控制下述单元循环工作：
    第一上升控制单元，用于控制所述第一组顶针从所述初始位置上升支撑所述基板，并记录所述第一组顶针上升的次数；
    第一移动控制单元，用于在所述第一组顶针上升到所述第一预设位置，控制所述第一组顶针向所述第一预设方向移动所述第一预设距离，以使得所述基板向所述第一预设方向移动所述第一预设距离，所述第一预设距离与所述第一组顶针上升的次数相关；
    第一下降控制单元，用于控制所述第一组顶针下降使得所述第二组顶针支撑所述基板；以及
    第一返回控制单元，用于在所述第一组顶针下降到所述第二预设位置，控制所述第一组顶针回到所述初始位置。
  11. 如权利要求10所述的烘烤装置，其中，所述第一预设距离与所述第一组顶针上升的次数相关具体为：
    L i＝x，(i＝1)
    L i＝2x，(i＝2,3,4,…)
    其中，所述L i表示所述第一预设距离，所述i表示所述第一组顶针上升的次数。
  12. 如权利要求10所述的烘烤装置，其中，所述烘烤装置还包括：
    第二获取单元，用于在所述第一组顶针回到所述初始位置后，获取计时时间，当所述计时时间等于或者大于所述预设时间时，将所述计时时间和所述第一组顶针上升的次数重置为初始值，重新开始计时并控制下述单元循环工作：
    第二上升控制单元，用于控制所述第一组顶针从所述初始位置上升支撑所述基板，并记录所述第一组顶针上升的次数；
    第二移动控制单元，还用于在所述第一组顶针上升到所述第一预设位置，控制所述第一组顶针向所述第二预设方向移动所述第二预设距离，以使得所述基板向所述第二预设方向移动所述第二预设距离，所述第二预设方向与所述第一预设方向为相反的方向，所述第二预设距离与所述第一组顶针上升的次数相 关；
    第二下降控制单元，用于控制所述第一组顶针下降使得所述第二组顶针支撑所述基板；
    第二返回控制单元，还用于在所述第一组顶针下降到所述第二预设位置，控制所述第一组顶针回到所述初始位置；
    排出控制单元，用于获取计时时间，当所述计时时间等于或者大于所述预设时间时，排出所述基板。
  13. 如权利要求12所述的烘烤装置，其中，所述初始值为0，所述第二预设距离与所述第一组顶针上升的次数相关具体为：
    R i＝x，(i＝1)
    R i＝2x，(i＝2,3,4,…)
    其中，所述R i表示所述第二预设距离，所述i表示所述第一组顶针上升的次数。
  14. 如权利要求12所述的烘烤装置，其中，所述预设时间为烘烤时间的1/2。
  15. 如权利要求10所述的烘烤装置，其中，所述烘烤装置为计算机或云端服务器。
  16. 如权利要求10所述的烘烤装置，其中，所述处理单元为通用处理器、数字信号处理器、专用集成电路、可编程逻辑器件、分立门、晶体管逻辑器件或分立硬件组件。
  17. 如权利要求10所述的烘烤装置，其中，所述烘烤装置还包括：输入输出设备、网络接入设备和总线。
  18. 如权利要求10所述的烘烤装置，其中，所述存储单元为所述烘烤装置的内部存储单元。
  19. 如权利要求10所述的烘烤装置，其中，所述存储单元为所述烘烤装置的外部存储单元。
  20. 如权利要求19所述的烘烤装置，其中，所述外部存储单元为插接式硬盘、智能存储卡、安全数字卡或闪存卡。
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