WO2019134192A1 - Oled面板及其制作方法 - Google Patents

Oled面板及其制作方法 Download PDF

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Publication number
WO2019134192A1
WO2019134192A1 PCT/CN2018/073465 CN2018073465W WO2019134192A1 WO 2019134192 A1 WO2019134192 A1 WO 2019134192A1 CN 2018073465 W CN2018073465 W CN 2018073465W WO 2019134192 A1 WO2019134192 A1 WO 2019134192A1
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layer
substrate
glass
oled panel
cover plate
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PCT/CN2018/073465
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English (en)
French (fr)
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杨中国
李金川
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深圳市华星光电半导体显示技术有限公司
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Priority to US15/914,157 priority Critical patent/US20190207152A1/en
Publication of WO2019134192A1 publication Critical patent/WO2019134192A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants

Definitions

  • the present invention relates to the field of semiconductor packaging technologies, and in particular, to an OLED panel and a method of fabricating the same.
  • OLED is an Organic Light-Emitting Diode, which has the characteristics of self-illumination, high brightness, wide viewing angle, high contrast, flexibility, low energy consumption, etc., and has received extensive attention as a new generation display mode. It has gradually replaced traditional LCD monitors and is widely used in mobile phone screens, computer monitors, and full-color TVs. Unlike traditional LCD displays, OLED display technology eliminates the need for backlights and uses very thin organic coatings and glass substrates that illuminate when current is passed through. However, since organic materials are easily reacted with water and oxygen, as an organic material-based display device, an OLED display has a very high requirement for packaging. In order to realize the commercialization of OLED display panels, the related packaging technology has become a research hotspot.
  • the liquid encapsulating glue is usually filled in the gap between the edges of the upper and lower substrates, and then cured by ultraviolet light, thereby achieving adhesion to the two-layer substrate and suppressing the infiltration of moisture and oxygen.
  • this type of bonding is not ideal. Under high temperature conditions or after prolonged use, the encapsulant is prone to aging or shedding, resulting in package failure and affecting internal optical components.
  • the present invention provides an OLED panel and a manufacturing method thereof, which can ensure a good packaging effect of the OLED panel, and can ensure reliable packaging even under high temperature conditions or after long time use.
  • An OLED panel includes a substrate, a cover plate, an organic light-emitting layer disposed between the substrate and the cover plate, and a glass layer simultaneously encapsulated at the end of the substrate and the cover, the width of the substrate More than the width of the cover plate, the glass layer is formed on the surface of the substrate facing the cover plate, and wraps the end of the cover plate, and the organic light-emitting layer is encapsulated on the substrate, the cover The space enclosed by the plate and the glass layer.
  • the glass layer at least partially covers a surface of the cover plate facing away from the substrate.
  • the glass layer is formed on the surface of the substrate layer by layer by means of 3D printing.
  • the edge of the cover plate facing away from the surface of the substrate is thinner than the intermediate thickness to form a stepped recess, and the glass layer is filled in the recess.
  • the surface of the glass layer is flush with the substrate.
  • the bottom surface of the recess is open with a first recess, and the glass layer is further filled in the first recess.
  • the OLED panel further includes an inner encapsulation layer formed by sintering a glass paste between the substrate and the cover, the inner encapsulation layer encapsulating the organic light-emitting layer among them.
  • the inner wall of the inner encapsulation layer is bonded to the glass layer.
  • Another object of the present invention is to provide a method for fabricating an OLED panel, including:
  • the cover plate is vacuum-bonded to the substrate, the glass paste is surrounded by the organic light-emitting layer, and the glass paste is laser-sintered;
  • a glass molten material is formed on the surface of the substrate, and the glass molten material is filled in the groove.
  • the glass molten material is printed layer by layer on the surface of the substrate from the bottom of the substrate using a 3D printer until the glass molten material fills the groove.
  • the invention utilizes the advantages of 3D printing technology in speed and precision to print the glass packaging material on the periphery of the glass plastic packaging structure. Since the glass is melted and printed layer by layer, the density is better than that of the glass glue, and the glass glue is avoided. The internal pores formed by the sintering of organic matter and the intrusion of water vapor caused by cracks achieve a more reliable encapsulation effect.
  • FIG. 1 is a schematic structural view of an OLED panel according to Embodiment 1 of the present invention.
  • FIG. 2 is a partial structural schematic view of an OLED panel according to Embodiment 1 of the present invention.
  • FIG. 3 is a flow chart of a method for fabricating an OLED panel according to Embodiment 1 of the present invention.
  • FIG. 4 is a schematic diagram of a manufacturing process of an OLED panel according to Embodiment 1 of the present invention.
  • FIG. 5 is a schematic structural diagram of an OLED panel according to Embodiment 2 of the present invention.
  • FIG. 6 is a partial schematic structural view of an OLED panel according to Embodiment 2 of the present invention.
  • an OLED panel includes a substrate 10 , a cover plate 20 , an organic light emitting layer 30 disposed between the substrate 10 and the cover plate 20 , and a glass layer 40 simultaneously encapsulated at the ends of the substrate 10 and the cover plate 20 .
  • the width of the substrate 10 is greater than the width of the cover plate 20, and the glass layer 40 is formed on the surface of the substrate 10 facing the cover plate 20, and wraps the end of the cover plate 20, and the organic light-emitting layer 30 is encapsulated on the substrate 10, the cover plate 20, and the glass.
  • the substrate 10 is a TFT (Thin Film Transistor) substrate
  • the cover 20 is a glass cover.
  • the glass layer 40 is formed on the surface of the substrate 10 layer by layer by means of 3D printing until the glass layer 40 at least partially covers the surface of the cover 20 facing away from the substrate 10.
  • the thickness of the edge of the cover 20 away from the surface of the substrate 10 is thinner than the intermediate thickness to form a stepped recess 200, and the glass layer 40 is filled in the recess 200 to ensure the printed glass layer 40 and the cover. 20 has a larger bonding area and has a better bonding strength.
  • After the glass layer 40 is printed its upper surface is flush with the substrate 10 to minimize the influence on the appearance and display effect.
  • an inner encapsulation layer 50 composed of sintered glass paste (Frit glue) is further encapsulated, and the inner encapsulation layer 50 encapsulates the organic light-emitting layer 30 therein, and the inner wall of the inner encapsulation layer 50 and the glass Layer 40 fits.
  • the present invention further provides a method for fabricating an OLED panel, which mainly includes:
  • a ring groove 20a is formed in an edge region of the lower surface of the cover plate 20, and a cutting line is reserved in the groove 20a by cutting;
  • the organic light-emitting layer 30 is formed on the upper surface of the substrate 10;
  • the cover plate 20 and the substrate 10 are vacuum-bonded, so that the glass glue surrounds the organic light-emitting layer 30, and the upper and lower surfaces of the glass glue are respectively adhered to the inner surface of the cover plate 20 and the substrate 10, and then the glass glue is sintered.
  • the sintering method can adopt non-contact laser sintering, which can achieve more precise local sintering treatment;
  • the cutting process may use the cutting line in step S02 as a cutting boundary to cut off the excess glass substrate outside the cutting line;
  • a glass molten material is formed on the periphery of the glass paste on the substrate 10, and the glass molten material is filled in the groove 20a.
  • the surface of the substrate 10 is printed layer by layer from bottom to top until the glass molten material fills the groove 20a and is flush with the substrate 10.
  • the recess 20a occupies about half of the thickness of the cover 20, and the width of the glass molten material printed into the recess 20a and printed on the substrate 10 is equal, which can better adapt to the 3D printing operation and improve the printed glass and The adhesion of the substrate 10 and the cover 20 improves the packaging effect.
  • the bottom surface of the recessed portion 200 of the upper surface of the cover plate 20 of the present embodiment further has a first groove 201 formed thereon, and the surface of the substrate 10 facing the cover plate 20 is also A second groove 100 is opened, and the glass layer 40 is simultaneously filled in the first groove 201 and the second groove 100.
  • a molten glass material is also formed in the first groove 201, which can further improve the bonding strength between the glass layer 40 and the substrate 10.
  • the second groove 100 has a height difference from the inner encapsulation layer 50 formed by sintering the glass paste, so that the outer portion The glass layer 40 can be better encapsulated on the periphery of the inner encapsulation layer 50, and at the same time, the bonding effect of the molten glass layer after the 3D printing and the substrate 10 can be further improved.
  • the present invention contemplates that the organic matter in the glass paste of the inner layer package structure cannot be completely volatilized in the oven, so that after the laser sintering, there are many pores and cracks inside the glass glue, and the pores and cracks act as water vapor.
  • the intrusion channel makes the package effect worse. Therefore, the present invention further produces a circle of glass layer 40 in which glass glue is further encapsulated in the periphery of the glass paste by a 3D printing technique, which has an unparalleled advantage in printing speed and precision, and can realize a near perfect glass 3D. Print effect.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种OLED面板，包括基板（10）、盖板（20）、设于基板与盖板之间的有机发光层（30）以及同时封装于基板与盖板端部的玻璃层（40），基板的宽度大于盖板的宽度，玻璃层形成于基板朝向盖板的表面，并包裹盖板的端部，将有机发光层封装于基板、盖板、玻璃层围成的空间内。一种OLED面板的制作方法。利用3D打印技术在速度和精度上的优势在玻璃胶封装结构的外围打印出玻璃封装材料，由于是将玻璃熔融后逐层打印，因此其致密程度比玻璃胶更好，避免玻璃胶由于内部的有机物烧结而形成的气孔和裂纹导致的水汽进入，实现更可靠的封装效果。

Description

OLED面板及其制作方法 技术领域
本发明涉及半导体封装技术领域，尤其涉及一种OLED面板及其制作方法。
背景技术
OLED即有机发光二极管(Organic Light-Emitting Diode)，具备自发光、高亮度、宽视角、高对比度、可挠曲、低能耗等特性，因此受到广泛的关注，并作为新一代的显示方式，已开始逐渐取代传统液晶显示器，被广泛应用在手机屏幕、电脑显示器、全彩电视等。OLED显示技术与传统的LCD显示方式不同，无需背光灯，采用非常薄的有机材料涂层和玻璃基板，当有电流通过时，这些有机材料就会发光。但是由于有机材料易与水氧反应，作为基于有机材料的显示设备，OLED显示屏对封装的要求非常高。为了实现OLED显示面板商业化，与之相关的封装技术成为了研究热点。
现有技术中，常用液态的封装胶填充在上下两基板的边缘之间的间隙内，然后利用紫外光照固化，从而实现对两层基板的粘贴，并抑制水汽和氧的渗入。然而，此种粘贴方式并不理想，在高温条件下，或长时间使用后，封装胶容易出现老化或脱落现象，导致封装失效，影响内部的光学元器件。
发明内容
鉴于现有技术存在的不足，本发明提供了一种OLED面板及其制作方法，可以保证OLED面板具有良好的封装效果，即使在高温条件或长时间使用后，仍能保证可靠的封装。
为了实现上述的目的，本发明采用了如下的技术方案：
一种OLED面板，包括基板、盖板、设于所述基板与所述盖板之间的有机发光层以及同时封装于所述基板与所述盖板端部的玻璃层，所述基板的宽度大于所述盖板的宽度，所述玻璃层形成于所述基板朝向所述盖板的表面，并包裹所述盖板的端部，将所述有机发光层封装于所述基板、所述盖板、所述玻璃层围成的空间内。
作为其中一种实施方式，所述玻璃层至少部分覆盖于所述盖板上背离所述基板的表面。
作为其中一种实施方式，所述玻璃层通过3D打印的方式逐层形成于所述基板表面。
作为其中一种实施方式，所述盖板背离所述基板的表面的边缘厚度比中间厚度薄而形成台阶状的凹陷部，所述玻璃层填充于所述凹陷部内。
作为其中一种实施方式，所述玻璃层表面与所述基板平齐。
作为其中一种实施方式，所述凹陷部底面开设有第一凹槽，所述玻璃层还填充于所述第一凹槽内。
作为其中一种实施方式，所述的OLED面板还包括封装于所述基板与所述盖板之间的烧结的玻璃胶构成的内部封装层，所述内部封装层将所述有机发光层封装于其中。
作为其中一种实施方式，所述内部封装层内壁与所述玻璃层贴合。
本发明的另一目的在于提供一种OLED面板的制作方法，包括：
提供基板和盖板；
在所述盖板的下表面制作出一圈凹槽；
在所述盖板的上表面涂布一圈玻璃胶，并用烤炉烧掉玻璃胶内的有机物；
在所述基板上表面制作出有机发光层；
将所述盖板与所述基板真空贴合，使所述玻璃胶将所述有机发光层包围于其中，并对所述玻璃胶进行激光烧结；
在所述凹槽内切割所述盖板；
在所述基板表面制作玻璃熔融材料，并使所述玻璃熔融材料填充所述凹槽。
作为其中一种实施方式，所述玻璃熔融材料采用3D打印机在所述基板表面自下而上逐层打印，直至所述玻璃熔融材料填满所述凹槽。
本发明利用3D打印技术在速度和精度上的优势在玻璃胶封装结构的外围打印出玻璃封装材料，由于是将玻璃熔融后逐层打印，因此其致密程度比玻璃胶更好，避免玻璃胶由于内部的有机物烧结而形成的气孔和裂纹导致的水汽进 入，实现更可靠的封装效果。
附图说明
图1为本发明实施例1的OLED面板的结构示意图；
图2为本发明实施例1的OLED面板的部分结构示意图；
图3为本发明实施例1的OLED面板的制作方法流程图；
图4为本发明实施例1的OLED面板的制作过程示意图；
图5为本发明实施例2的OLED面板的结构示意图；
图6为本发明实施例2的OLED面板的部分结构示意图。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
实施例1
参阅图1，本发明实施例的OLED面板包括基板10、盖板20、设于基板10与盖板20之间的有机发光层30以及同时封装于基板10与盖板20端部的玻璃层40，基板10的宽度大于盖板20的宽度，玻璃层40形成于基板10朝向盖板20的表面，并包裹盖板20的端部，将有机发光层30封装于基板10、盖板20、玻璃层40围成的空间内。这里，基板10为TFT(Thin Film Transistor，薄膜晶体管)基板，盖板20为玻璃盖板。
这里，玻璃层40通过3D打印的方式逐层形成于基板10表面，直至玻璃层40至少部分覆盖于盖板20上背离基板10的表面。如图2，盖板20背离基板10的表面的边缘厚度比中间厚度薄而形成台阶状的凹陷部200，玻璃层40填充于该凹陷部200内，可以保证打印出的玻璃层40与盖板20具有更大的结合面积，具有更好的结合强度，玻璃层40打印完毕后，其上表面与基板10平齐，以最大限度地减小对于外观和显示效果的影响。
在基板10与盖板20之间，还封装有烧结后的玻璃胶(Frit胶)构成的内部封装层50，内部封装层50将有机发光层30封装于其中，内部封装层50的内壁与玻璃层40贴合。
如图3和图4所示，本发明还提供了一种OLED面板的制作方法，其主要包括：
S01、提供基板10和盖板20；
S02、在盖板20的下表面的边缘区域制作出一圈凹槽20a，并在凹槽20a内通过切割预留出切割线；
S03、在盖板20的上表面的边缘区域涂布一圈玻璃胶，并送入烤炉烧掉玻璃胶内的有机物；
S04、在基板10上表面制作出有机发光层30；
S05、将盖板20与基板10真空贴合，使玻璃胶将有机发光层30包围于其中，玻璃胶的上下表面分别粘附在盖板20与基板10内表面，然后对玻璃胶进行烧结，烧结方式可以采用非接触式的激光烧结，可以实现更精确的局部烧结处理；
S06、在凹槽20a内切割盖板20，该切割过程可以以步骤S02中的切割线为切割边界，切除切割线外的多余的玻璃基板；
S07、采用3D打印机，在基板10上的玻璃胶外围制作玻璃熔融材料，并使玻璃熔融材料填充凹槽20a。采用3D打印机制作玻璃熔融材料时，在基板10表面自下而上逐层打印，直至玻璃熔融材料填满凹槽20a并与基板10平齐为止。进一步地，凹槽20a约占盖板20厚度的一半，打印到凹槽20a内的和打印到基板10上的玻璃熔融材料的宽度相等，可以更好地适应3D打印操作，提高打印的玻璃与基板10、盖板20的粘附力，提高封装效果。
实施例2
如图5和图6，在实施例1的基础上，本实施例的盖板20上表面边缘的凹陷部200底面还进一步开设有一圈第一凹槽201，基板10朝向盖板20的表面也开设有一圈第二凹槽100，玻璃层40还同时填充于第一凹槽201、第二凹槽100内。第一凹槽201内也形成有熔融玻璃材料，可以进一步提高玻璃层40与基板10的结合强度，第二凹槽100与玻璃胶烧结形成的内部封装层50之间具有高度差，使得外部的玻璃层40可以更好地封装在内部封装层50的外围，同时，还能进一步提高3D打印后的熔融玻璃层与基板10的结合效果。
综上所述，本发明考虑到内层封装结构的玻璃胶中的有机物在烤炉中无法 完全挥发，从而在激光烧结后会在玻璃胶内部存在许多气孔和裂纹，这些气孔和裂纹会作为水汽的侵入通道，使封装效果变差。因此，本发明在玻璃胶外围进一步通过3D打印技术制作出一圈将玻璃胶进一步封装于其中的玻璃层40，其在打印速度和精度上有着无可比拟的优势，可以实现接近完美的玻璃3D打印效果。
以上所述仅是本申请的具体实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本申请原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本申请的保护范围。

Claims (20)

  1. 一种OLED面板，其中，包括基板、盖板、设于所述基板与所述盖板之间的有机发光层以及同时封装于所述基板与所述盖板端部的玻璃层，所述基板的宽度大于所述盖板的宽度，所述玻璃层形成于所述基板朝向所述盖板的表面，并包裹所述盖板的端部，将所述有机发光层封装于所述基板、所述盖板、所述玻璃层围成的空间内。
  2. 根据权利要求1所述的OLED面板，其中，所述玻璃层至少部分覆盖于所述盖板上背离所述基板的表面。
  3. 根据权利要求2所述的OLED面板，其中，所述玻璃层通过3D打印的方式逐层形成于所述基板表面。
  4. 根据权利要求3所述的OLED面板，其中，所述盖板背离所述基板的表面的边缘厚度比中间厚度薄而形成台阶状的凹陷部，所述玻璃层填充于所述凹陷部内。
  5. 根据权利要求4所述的OLED面板，其中，所述玻璃层表面与所述基板平齐。
  6. 根据权利要求4所述的OLED面板，其中，所述凹陷部底面开设有第一凹槽，所述玻璃层还填充于所述第一凹槽内。
  7. 根据权利要求1所述的OLED面板，其中，还包括封装于所述基板与所述盖板之间的烧结的玻璃胶构成的内部封装层，所述内部封装层将所述有机发光层封装于其中。
  8. 根据权利要求7所述的OLED面板，其中，所述内部封装层内壁与所述玻璃层贴合。
  9. 根据权利要求2所述的OLED面板，其中，还包括封装于所述基板与所述盖板之间的烧结的玻璃胶构成的内部封装层，所述内部封装层将所述有机发光层封装于其中。
  10. 根据权利要求9所述的OLED面板，其中，所述内部封装层内壁与所述玻璃层贴合。
  11. 根据权利要求3所述的OLED面板，其中，还包括封装于所述基板与所 述盖板之间的烧结的玻璃胶构成的内部封装层，所述内部封装层将所述有机发光层封装于其中。
  12. 根据权利要求11所述的OLED面板，其中，所述内部封装层内壁与所述玻璃层贴合。
  13. 根据权利要求4所述的OLED面板，其中，还包括封装于所述基板与所述盖板之间的烧结的玻璃胶构成的内部封装层，所述内部封装层将所述有机发光层封装于其中。
  14. 根据权利要求13所述的OLED面板，其中，所述内部封装层内壁与所述玻璃层贴合。
  15. 根据权利要求5所述的OLED面板，其中，还包括封装于所述基板与所述盖板之间的烧结的玻璃胶构成的内部封装层，所述内部封装层将所述有机发光层封装于其中。
  16. 根据权利要求15所述的OLED面板，其中，所述内部封装层内壁与所述玻璃层贴合。
  17. 根据权利要求6所述的OLED面板，其中，还包括封装于所述基板与所述盖板之间的烧结的玻璃胶构成的内部封装层，所述内部封装层将所述有机发光层封装于其中。
  18. 根据权利要求17所述的OLED面板，其中，所述内部封装层内壁与所述玻璃层贴合。
  19. 一种OLED面板的制作方法，其中，包括：
    提供基板和盖板；
    在所述盖板的下表面制作出一圈凹槽；
    在所述盖板的上表面涂布一圈玻璃胶，并烧掉玻璃胶内的有机物；
    在所述基板上表面制作出有机发光层；
    将所述盖板与所述基板真空贴合，使所述玻璃胶将所述有机发光层包围于其中，并对所述玻璃胶进行激光烧结；
    在所述凹槽内切割所述盖板；
    在所述基板表面制作玻璃熔融材料，并使所述玻璃熔融材料填充所述凹槽。
  20. 根据权利要求19所述的OLED面板的制作方法，其中，所述玻璃熔融材料采用3D打印机在所述基板表面自下而上逐层打印，直至所述玻璃熔融材料填满所述凹槽。
PCT/CN2018/073465 2018-01-03 2018-01-19 Oled面板及其制作方法 WO2019134192A1 (zh)

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