WO2019129038A1 - 一种光刻胶软烘装置 - Google Patents

一种光刻胶软烘装置 Download PDF

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Publication number
WO2019129038A1
WO2019129038A1 PCT/CN2018/123836 CN2018123836W WO2019129038A1 WO 2019129038 A1 WO2019129038 A1 WO 2019129038A1 CN 2018123836 W CN2018123836 W CN 2018123836W WO 2019129038 A1 WO2019129038 A1 WO 2019129038A1
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Prior art keywords
exhaust
photoresist
chamber
soft drying
disposed
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PCT/CN2018/123836
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English (en)
French (fr)
Inventor
李威
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武汉华星光电技术有限公司
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Publication of WO2019129038A1 publication Critical patent/WO2019129038A1/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking

Definitions

  • the present invention relates to the field of display panel manufacturing technology, and in particular, to a photoresist soft drying device.
  • the production process of the TFT side exposure portion includes: cleaning the glass substrate, coating the photoresist (Coater), baking (Pre-bake), and then entering the exposure machine (Exposure), using MASK
  • the photoresist is defined on the glass substrate; then the graphics are displayed by a Developer process.
  • the substrate After the glass substrate coating process is completed, the substrate enters a Soft Bake unit for a soft baking process.
  • the soft baking process has a significant effect on the photoresist residue.
  • the photoresist on the glass substrate evaporates due to high temperature baking, and the photoresist particles are formed to fill the entire process chamber.
  • the design of the soft drying device of the CSOT T3 Photo machine has insufficient exhaust capability, so that the photoresist particles generated by the process cannot be completely extracted from the process chamber, and the photoresist particles fall on the substrate, resulting in photoresist residue.
  • the design defect of the soft drying exhaust valve causes the drawn photoresist particles to condense on the exhaust valve, causing friction between the valve and the horizontal rubber pad, causing the soft drying and exhausting alarm to crash.
  • the invention provides a photoresist soft drying device, which can increase the exhausting ability of the soft baking process, quickly absorb the high temperature photoresist particles in the hot exhaust gas, and avoid the exhaust valve smashing.
  • the invention provides a photoresist soft drying device, comprising:
  • a hot plate disposed in the chamber for heating the substrate
  • a hot air knife disposed at one end of the chamber for causing the chamber to generate a flow in a predetermined direction
  • the exhaust port is correspondingly provided with an exhaust pipe, and a variable pressure vacuum adsorption device is disposed in the exhaust pipe for adjusting the exhaust pressure to adsorb the photoresist particles, and the variable pressure vacuum adsorption device
  • a gas pressure regulating valve and an adsorption module are disposed; an exhaust valve is disposed at one end away from the exhaust port for controlling the soft drying device to perform exhausting.
  • the pressure swing vacuum adsorption apparatus includes a circulation condensing unit for condensing the photoresist particles in the exhaust duct.
  • the circulating condensing device is provided with a condensing plate/condensing pipe, wherein the condensing plate/condensing pipe has a U shape, a "back" shape or a spiral shape.
  • the exhaust valve is an alternating current magnetic sensor.
  • the soft drying device further includes a control end, and the AC magnetic induction valve is electrically connected to the control end.
  • the hot plate is disposed at the bottom of the chamber for carrying the substrate; the hot air knife is for forming an airflow flowing through the surface of the substrate and flowing to the exhaust port .
  • the chamber is provided with at least two exhaust ports, at least two of the exhaust ports are spaced apart from the surface of the substrate, and one of the exhaust ports is correspondingly provided with the An exhaust pipe, one of the exhaust pipes is correspondingly provided with a variable pressure vacuum adsorption device and an exhaust valve.
  • the exhaust valves in different exhaust ducts are independently controlled, and the exhaust valves are partially opened to form the airflow in different flow directions.
  • At least two of the exhaust ducts are connected to an air extracting device for enhancing the exhaust rate.
  • the present invention also provides a photoresist soft drying device, comprising:
  • a hot plate disposed in the chamber for heating the substrate
  • a hot air knife disposed at one end of the chamber for causing the chamber to generate a flow in a predetermined direction
  • the exhaust port is correspondingly provided with an exhaust duct, and a variable pressure vacuum adsorption device is disposed in the exhaust duct for adjusting exhaust pressure to adsorb the photoresist particles; away from the exhaust port
  • An exhaust valve is disposed at one end for controlling the soft drying device to perform exhaust.
  • the pressure swing vacuum adsorption apparatus includes a circulation condensing unit for condensing the photoresist particles in the exhaust duct.
  • the circulating condensing device is provided with a condensing plate/condensing pipe, wherein the condensing plate/condensing pipe has a U shape, a "back" shape or a spiral shape.
  • the exhaust valve is an alternating current magnetic sensor.
  • the soft drying device further includes a control end, and the AC magnetic induction valve is electrically connected to the control end.
  • the hot plate is disposed at the bottom of the chamber for carrying the substrate; the hot air knife is for forming an airflow flowing through the surface of the substrate and flowing to the exhaust port .
  • the chamber is provided with at least two exhaust ports, at least two of the exhaust ports are spaced apart from the surface of the substrate, and one of the exhaust ports is correspondingly provided with the An exhaust pipe, one of the exhaust pipes is correspondingly provided with a variable pressure vacuum adsorption device and an exhaust valve.
  • the exhaust valves in different exhaust ducts are independently controlled, and the exhaust valves are partially opened to form the airflow in different flow directions.
  • At least two of the exhaust ducts are connected to an air extracting device for enhancing the exhaust rate.
  • the invention has the beneficial effects that the photoresist soft drying device of the invention improves the exhaust pipe by changing the position of the exhaust port and increases the exhaust of the soft baking device compared with the prior art photoresist soft drying device.
  • the pressure is favorable for the rapid removal of the photoresist particles, effectively solving the problem of residual photoresist on the substrate.
  • the exhaust valve is changed to an AC magnetic induction valve structure to avoid friction with the exhaust pipe to avoid exhaust gas smashing.
  • the exhaust valve is changed to the AC magnetic sensor valve to open/close the control exhaust is more sensitive and rapid, and does not need to be disassembled for regular maintenance, improve the machine OEE (equipment efficiency), improve product yield, save photoresist consumption, cut costs.
  • FIG. 1 is a schematic structural view of a photoresist soft drying device in the prior art
  • Figure 2 is a schematic view showing the internal structure of the existing exhaust duct
  • FIG. 3 is a schematic structural view of a photoresist soft drying device according to an embodiment of the present invention.
  • FIG. 4 is a schematic structural view of an internal structure of an exhaust duct according to an embodiment of the present invention.
  • FIG. 5 is a schematic structural diagram of a variable pressure vacuum adjusting device according to an embodiment of the present invention.
  • FIG. 1 it is a schematic structural view of a photoresist soft drying device in the prior art, the device includes a chamber 10 , and a left end of the chamber 10 is provided with a hot air knife 11 , and a rear end of the chamber 10 An exhaust port 13 is disposed, and a substrate 12 having a surface coated with a photoresist is placed in the chamber 10.
  • FIG. 2 which is a schematic diagram of the internal structure of the existing exhaust duct, two exhaust valves 131 are arranged side by side in the exhaust duct corresponding to the exhaust port 13 , and the exhaust valve is driven by the left and right telescopic movement of the CDA drive 132 .
  • the airflow formed by the hot air knife 11 blows the photoresist particles formed by evaporation of the photoresist to the right, and the position of the exhaust port 13 is unreasonably designed, so that the exhaust capability is insufficient.
  • the photoresist particles cannot be completely withdrawn from the chamber 10; and the extracted photoresist particles are condensed on the exhaust valve 131, causing the exhaust valve 131 to rub against the horizontal rubber pad, causing a soft drying and exhausting alarm. Downtime.
  • the invention is directed to the existing photoresist soft drying device, which has insufficient exhausting ability, causes the photoresist particles to be completely unable to be extracted out of the process chamber, thereby affecting the product quality, and the technical problem of the soft drying and exhausting alarm device.
  • the example can solve this defect.
  • FIG. 3 is a schematic structural diagram of a photoresist soft drying apparatus according to an embodiment of the present invention.
  • the apparatus includes a chamber 30 for accommodating a substrate 37 coated with a photoresist; a hot plate (not labeled) And disposed in the chamber 30 for carrying and heating the substrate 37; a hot air knife 31 disposed at one end of the chamber 30 for causing the chamber 30 to generate a flow in a predetermined direction; a port 36 corresponding to the hot air knife 31 is disposed at the other end of the chamber 30 for discharging photoresist particles formed by evaporation of the photoresist after high temperature baking, and the exhaust port 36 is correspondingly arranged with a row Gas pipeline.
  • the hot plate is disposed at the bottom of the chamber 30, and the hot air knife 31 is disposed above the plane of the hot plate for forming a surface flowing through the surface of the substrate 37 and flowing to the exhaust port 36. airflow.
  • the exhaust port 36 is disposed on the right side of the chamber 30 with respect to the hot air knife 31, and the exhaust port 36 includes a first exhaust port arranged in a line at a distance from the surface of the substrate 37. 32.
  • the second exhaust port 33, the third exhaust port 34, and the fourth exhaust port 35 may be plural, and may be set according to actual conditions and process requirements.
  • the arrangement of the exhaust ports 36 may also be misaligned or arranged side by side, which is not limited herein.
  • the internal structure of the exhaust duct provided by the embodiment of the present invention is provided with a first exhaust port 32, a second exhaust port 33, and a third exhaust port 34 in the soft drying device provided in this embodiment.
  • a fourth exhaust port 35 each exhaust port corresponding to an exhaust duct for adsorbing the photoresist particles distributed in the chamber.
  • the exhaust duct 321 corresponding to the first exhaust port 32 is taken as an example to describe the structure of the exhaust duct of the present embodiment.
  • a variable pressure vacuum adsorption device 322 is disposed in the exhaust duct 321 .
  • the pressure swing vacuum adsorption device 322 is disposed at an end of the exhaust port 32 for adjusting the exhaust pressure to adsorb the light.
  • Blocking particles; an end of the exhaust port 32 is provided with an exhaust valve 323 for controlling the soft drying device to perform exhausting, and the exhaust valve 323 is a butterfly valve structure.
  • the pressure swing vacuum adsorption device 322 includes a circulating condensation device for condensing the photoresist particles entering the exhaust gas conduit 321.
  • the circulating condensing device is provided with a detachable condensing plate/condensing pipe, and the photoresist particles are condensed on the condensing plate/condensing pipe, and the condensing plate/condensing pipe is periodically detachably cleaned.
  • the condensation plate/condensation tube has a U shape, a "back" shape or a spiral shape, etc., for condensing the photoresist particles on the condensation tube.
  • the front portion of the exhaust duct 321 performs a pressure swing vacuum adsorption process, and the rear portion is provided with the exhaust valve 323, and the exhaust valve 323 may be an alternating current magnetic sense valve.
  • the soft drying device further includes a control end, the AC magnetic induction valve is electrically connected to the control end, and the opening/closing of the exhaust gas is controlled by electromagnetic induction, thereby avoiding friction with the exhaust duct 321 And notify the exhaust to open and close more quickly, to avoid the exhaust gas down.
  • exhaust duct It is also possible to connect the above-mentioned exhaust duct to an air extracting device 38 to assist the exhaust to enhance the exhaust rate.
  • the exhaust valves in different exhaust ducts are independently controlled, and the exhaust valves are partially opened to form the air flow in different flow directions, and the opening and closing states of the exhaust valves are changed to make the The airflow in the soft drying chamber is more uniform to avoid photoresist residue.
  • the exhaust valve is fully opened, the exhaust capability is greatly enhanced, the photoresist particles can be quickly extracted, the process time is reduced, and the cost is reduced.
  • a schematic structural view of a variable pressure vacuum regulating device includes: a vacuum chamber 501; an air inlet 502 is disposed at one end of the vacuum chamber 501, and is disposed opposite to the other end.
  • the vacuum chamber 501 is provided with an adsorption module 504, and the adsorption module 504 is coated with an adsorption coating for Adsorbing the photoresist particles;
  • the left side wall of the vacuum chamber 501 is provided with a first branch pipe 505 and the right side wall is provided with a second branch pipe 506, and the first branch pipe 505 and the second branch pipe 506 are respectively provided with air pressure adjustment
  • a valve 507 is provided for regulating air pressure from both ends of the vacuum chamber 501 to form an air flow such as a gas flow direction 508.
  • the adsorption module 504 is distributed in a strip shape in the vacuum chamber 501, and extends in an axial direction of the air inlet 502 / the air outlet 503; and the air pressure adjusting valve 507 is controlled to change the
  • the chamber 501 flows to the air outlet 503, and the photoresist particles are also adsorbed to the surface of each of the adsorption modules 504 as the airflow flows.
  • the adsorption module 504 may be an adsorption plate, and two adjacent adsorption plates are dislocated; or the adsorption plates are arranged in rows/columns at a certain inclination angle in the vacuum chamber 501, adjacent to two rows/ The two columns are misaligned or vertically staggered; the above-mentioned adsorption plate can also be cut into a plurality of spaced adsorption blocks.
  • the above design minimizes the effect on the flow rate of the gas stream and increases the adsorption area as much as possible.
  • the variable pressure vacuum adsorption device can also be other pressure transformation devices, which are not limited herein.
  • the soft baking process is provided by the soft drying device provided by the invention
  • the soft baking process is entered, and before the substrate enters the chamber, the chamber valve is opened, and the soft drying device turns on the hot air knife at the same time.
  • the exhaust valve is opened to generate airflow to the exhaust port in the chamber, and the flow direction of the airflow can be adjusted by controlling the opening and closing of different exhaust valves to remove the photoresist residue generated by the soft baking process of the previous substrate to ensure the process in the chamber.
  • the environment is clean.
  • the substrate passes through the automatic exchange piece and enters the hot plate.
  • the chamber valve is closed, the hot air knife is closed, the exhaust valve is in the bypass state, and the soft baking process starts, the process time is 153s, and the temperature is 110°.
  • the photoresist soft drying device of the invention changes the exhaust port position, reforms the exhaust pipe, increases the exhaust pressure of the soft baking device, and is advantageous for the photoresist particles to be fast. Evacuation, effectively solve the problem of substrate photoresist residue.
  • the exhaust valve is changed into an AC magnetic sensor structure to avoid friction with the exhaust pipe to avoid exhaust gas smashing.
  • the exhaust valve is changed to the AC magnetic sensor valve to open/close the control exhaust is more sensitive and rapid, and does not need to be disassembled for regular maintenance, improve the machine OEE (equipment efficiency), improve product yield, save photoresist consumption, cut costs.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Drying Of Solid Materials (AREA)
  • Coating Apparatus (AREA)

Abstract

一种光刻胶软烘装置，包括：腔室（30），用于容置涂有光刻胶的基板（37）；热板，用于加热基板（37）；热风刀（31），用于使腔室产生预设方向气流；排气口（36），对应热风刀（31）设置并用于排出光刻胶烘烤后形成的光阻颗粒；排气管道内设有变压真空吸附装置（322），用以调节排气压力来吸附光阻颗粒；远离排气口（36）一端设有排气阀门（323），用以控制软烘装置排气。

Description

一种光刻胶软烘装置 技术领域
本发明涉及显示面板制造技术领域，尤其涉及一种光刻胶软烘装置。
 背景技术
显示面板的制造过程中，TFT侧曝光部的生产工艺包括：玻璃基板完成清洗，涂布上光阻后（Coater），经过烘烤（Pre-bake），再进入曝光机（Exposure），利用MASK在玻璃基板上对光阻定义图形；然后再经过显影制程（Developer）显示图形。
玻璃基板涂布制程完成后，基板进入软烘（Soft Bake）单元进行软烘制程。目前基板软烘制程所用设备CSOT T3 Photo机台在Photo Line连续run货过程中，对应黄光制程来说，光阻残留对产品良率有着非常重要的影响，小颗残留会影响到产品电信号以及屏幕品质，大颗产品直接会影响基板质量降等甚至报废，这其中软烘制程对光阻残留影响尤其明显。软烘制程过程中，玻璃基板上面的光阻由于高温烘烤而蒸发，形成光阻颗粒充满整个制程腔室（Chamber）中。
目前CSOT T3 Photo机台软烘装置设计存在着排气能力不足，导致制程产生的光阻颗粒无法完全被抽出制程腔室，光阻颗粒掉在基板上，就会产生光阻残留。与此同时，软烘排气阀门设计缺陷导致抽出的光阻颗粒凝结在排气阀门上面，导致阀门与水平橡胶垫产生摩擦，造成软烘排气报警宕机。
 技术问题
本发明提供一种光刻胶软烘装置，能够增大软烘制程排气能力，迅速吸附热排气中高温光阻颗粒，避免排气阀门宕机。
 技术解决方案
为解决上述问题，本发明提供的技术方案如下：
本发明提供一种光刻胶软烘装置，包括：
腔室，用于容置表面涂布有光刻胶的基板；
热板，设置于所述腔室内，用于加热所述基板；
热风刀，设置于所述腔室一端，用于使所述腔室产生预设方向的气流；以及
排气口，对应所述热风刀设置于所述腔室的另一端，用于排出所述光刻胶经高温烘烤后蒸发形成的光阻颗粒；
其中，所述排气口对应设置有排气管道，在所述排气管道内设置有变压真空吸附装置，用以调节排气压力来吸附所述光阻颗粒，所述变压真空吸附装置设置有气压调节阀以及吸附模块；远离所述排气口的一端设置有排气阀门，用以控制所述软烘装置进行排气。
在本申请的软烘装置中，所述变压真空吸附装置包括循环冷凝装置，用于冷凝所述排气管道中的所述光阻颗粒。
在本申请的软烘装置中，所述循环冷凝装置中设置有冷凝板/冷凝管，其中，所述冷凝板/冷凝管呈U形、“回”字形或者螺旋形。
在本申请的软烘装置中，所述排气阀门为交流磁感阀。
在本申请的软烘装置中，所述软烘装置还包括控制端，所述交流磁感阀与所述控制端电性连接。
在本申请的软烘装置中，所述热板设置于所述腔室底部，用于承载所述基板；所述热风刀用于形成流经所述基板表面并流向所述排气口的气流。
在本申请的软烘装置中，所述腔室至少设置有两所述排气口，至少两所述排气口平行于所述基板表面间隔设置，一所述排气口对应设置有一所述排气管道，一所述排气管道对应设置一变压真空吸附装置以及一所述排气阀门。
在本申请的软烘装置中，不同所述排气管道内的所述排气阀门独立控制，通过局部开启所述排气阀门用以形成不同流向的所述气流。
在本申请的软烘装置中，至少两所述排气管道连接于一抽气装置上，用以增强排气速率。
为解决上述问题，本发明还提供一种光刻胶软烘装置，包括：
腔室，用于容置表面涂布有光刻胶的基板；
热板，设置于所述腔室内，用于加热所述基板；
热风刀，设置于所述腔室一端，用于使所述腔室产生预设方向的气流；以及
排气口，对应所述热风刀设置于所述腔室的另一端，用于排出所述光刻胶经高温烘烤后蒸发形成的光阻颗粒；
其中，所述排气口对应设置有排气管道，在所述排气管道内设置有变压真空吸附装置，用以调节排气压力来吸附所述光阻颗粒；远离所述排气口的一端设置有排气阀门，用以控制所述软烘装置进行排气。
在本申请的软烘装置中，所述变压真空吸附装置包括循环冷凝装置，用于冷凝所述排气管道中的所述光阻颗粒。
在本申请的软烘装置中，所述循环冷凝装置中设置有冷凝板/冷凝管，其中，所述冷凝板/冷凝管呈U形、“回”字形或者螺旋形。
在本申请的软烘装置中，所述排气阀门为交流磁感阀。
在本申请的软烘装置中，所述软烘装置还包括控制端，所述交流磁感阀与所述控制端电性连接。
在本申请的软烘装置中，所述热板设置于所述腔室底部，用于承载所述基板；所述热风刀用于形成流经所述基板表面并流向所述排气口的气流。
在本申请的软烘装置中，所述腔室至少设置有两所述排气口，至少两所述排气口平行于所述基板表面间隔设置，一所述排气口对应设置有一所述排气管道，一所述排气管道对应设置一变压真空吸附装置以及一所述排气阀门。
在本申请的软烘装置中，不同所述排气管道内的所述排气阀门独立控制，通过局部开启所述排气阀门用以形成不同流向的所述气流。
在本申请的软烘装置中，至少两所述排气管道连接于一抽气装置上，用以增强排气速率。
 有益效果
本发明的有益效果为：相较于现有技术的光刻胶软烘装置，本发明的光刻胶软烘装置通过变更排气口位置，改造排气管道，增大了软烤装置排气压力，有利光阻颗粒快速抽离，有效解决基板光阻残留的问题。还通过在排气管道内增设变压真空吸附装置，快速吸附排气中的高温光阻颗粒，同时将排气阀门改为交流磁感阀结构，避免与排气管道摩擦从而避免排气宕机；而且排气阀门改为交流磁感阀后开启/关闭控制排气更加灵敏迅速，且无需拆卸进行定期维护保养，提高机台OEE（设备综合效率），提高产品良率，节约光阻用量，降低成本。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为现有技术中光刻胶软烘装置结构示意图；
图2 为现有的排气管道内部结构示意图；
图3为本发明实施例提供的光刻胶软烘装置结构示意图；
图4为本发明实施例提供的排气管道内部结构示意图；
图5为本发明实施例提供的变压真空调节装置结构示意图。
 本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本申请可用以实施的特定实施例。本申请所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本申请，而非用以限制本申请。在图中，结构相似的单元是用以相同标号表示。
如图1所示，为现有技术中光刻胶软烘装置结构示意图，所述装置包括腔室10，所述腔室10内的左端设置有热风刀11，所述腔室10的后端设置一排气口13，以及所述腔室10内放置有表面涂布有光刻胶的基板12。如图2所示，为现有的排气管道内部结构示意图，排气口13对应的排气管道内并排设置有两个排气阀门131，通过CDA驱动132的左右伸缩带动所述排气阀门131进行左右运动来控制排气的开启/关闭。参照图1及图2，由于所述热风刀11形成的气流将所述光刻胶蒸发形成的光阻颗粒向右吹，而所述排气口13的位置设计不合理，从而排气能力不足，无法将光阻颗粒完全抽出所述腔室10；而且抽出的光阻颗粒凝结在所述排气阀门131上面，导致所述排气阀门131与水平橡胶垫产生摩擦，造成软烘排气报警宕机。
本发明针对现有的光刻胶软烘装置，存在排气能力不足，导致光阻颗粒无法完全被抽出制程腔室从而影响产品质量，以及存在软烘排气报警宕机的技术问题，本实施例能够解决该缺陷。
下面结合附图详细介绍本发明具体实施例提供的光刻胶软烘装置。
如图3所示，本发明实施例提供的光刻胶软烘装置结构示意图，所述装置包括腔室30，用于容置表面涂布有光刻胶的基板37；热板（未标示），设置于所述腔室30内，用于承载并加热所述基板37；热风刀31，设置于所述腔室30一端，用于使所述腔室30产生预设方向的气流；排气口36，对应所述热风刀31设置于所述腔室30的另一端，用于排出所述光刻胶经高温烘烤后蒸发形成的光阻颗粒，所述排气口36对应设置有排气管道。其中，所述热板设置于所述腔室30底部，所述热风刀31设置于所述热板所在平面的上方，用于形成流经所述基板37表面并流向所述排气口36的气流。所述排气口36相对所述热风刀31设置于所述腔室30内的右侧，所述排气口36包括平行于所述基板37表面呈一字型间隔设置的第一排气口32、第二排气口33、第三排气口34以及第四排气口35。所述排气口36的数量还可以为多个，根据实际情况及制程需求进行设定；所述排气口36的排布方式还可以为错位分布，或者并排设置，此处不做限定。
如图4所示，本发明实施例提供的排气管道内部结构示意图，本实施例提供的软烘装置中设置有第一排气口32、第二排气口33、第三排气口34以及第四排气口35，每一个排气口对应有一个排气管道，用以吸附所述腔室中分布的光阻颗粒。其中，以所述第一排气口32所对应的排气管道321为例，对本实施例的所述排气管道结构作以说明。所述排气管道321内设置有变压真空吸附装置322，优选的，所述变压真空吸附装置322设置于靠近所述排气口32的一端，用以调节排气压力来吸附所述光阻颗粒；远离所述排气口32的一端设置有排气阀门323，用以控制所述软烘装置进行排气，所述排气阀门323为蝴蝶阀结构。其中，所述变压真空吸附装置322包括循环冷凝装置，用于冷凝进入所述排气管道321中的所述光阻颗粒。所述循环冷凝装置中设置有可拆卸的冷凝板/冷凝管，所述光阻颗粒凝于所述冷凝板/冷凝管上，定期可拆卸清洁所述冷凝板/冷凝管。所述冷凝板/冷凝管呈U形、“回”字形或者螺旋形等，用以将所述光阻颗粒凝于所述冷凝管上。所述排气管道321的前部分进行变压真空吸附制程，后部分设置有所述排气阀门323，所述排气阀门323可以为交流磁感阀。所述软烘装置还包括控制端，所述交流磁感阀与所述控制端电性连接，通过电磁感应进行控制排气的开启/关闭，避免了与所述排气管道321之间发生摩擦，且通知排气开启关闭更加迅速，避免排气发生宕机。
所述第二排气口33、所述第三排气口34以及所述第四排气口35各自所对应的排气管道与所述第一排气口32对应的排气管道321的结构相同，此处不再一一赘述。
还可以将上述排气管道连接于一抽气装置38上，辅助排气，以增强排气速率。不同所述排气管道内的所述排气阀门独立控制，通过局部开启所述排气阀门用以形成不同流向的所述气流，通过改变不同所述排气阀门的开闭状态，使所述软烘腔室内的气流更加均匀，避免光阻残留现象。全部开启所述排气阀门，大大增强了排气能力，使所述光阻颗粒能够快速被抽出，缩减制程时间，降低成本。
如图5所示，为本发明实施例提供的变压真空调节装置结构示意图，所述装置包括：真空腔室501；所述真空腔室501一端设置有入气口502，相对另一端设置有出气口503，所述入气口502与所述出气口503分别与所述排气管道密封连接；所述真空腔室501内设置有吸附模块504，所述吸附模块504上涂覆有吸附涂料用于吸附光阻颗粒；所述真空腔室501的左侧壁设置有第一支管505以及右侧壁设置有第二支管506，所述第一支管505以及所述第二支管506均设有气压调节阀507，用以从所述真空腔室501两端调节气压，形成如气流方向508的气流。所述吸附模块504呈条状间隔分布于所述真空腔室501内，延伸方向沿所述入气口502/所述出气口503的轴向方向；通过控制所述气压调节阀507，改变所述第一支管505以及所述第二支管506内的气压，优选的，所述第一支管505以及所述第二支管506内形成负压，以形成从所述入气口502经由整个所述真空腔室501流向所述出气口503的气流，而所述光阻颗粒也随气流流动被吸附于各所述吸附模块504表面。通过气压调节，加快了气流流动速度，增大了排气量，能够迅速吸附热排气中所述光阻颗粒，形成充满整个所述真空腔室501的气流，从而加快了所述装置的排气以及吸附能力，避免排气阀门宕机现象。
所述吸附模块504可以为吸附板，相邻两所述吸附板呈错位分布；或者所述吸附板以一定倾斜角度成行/成列的设置于所述真空腔室501内，相邻两行/两列呈错位分布，也可呈垂直交错分布；上述一所述吸附板还可以切割为多个间隔的吸附块。上述设计能尽可能的减小对气流流速的影响，以及尽可能的增大吸附面积。所述变压真空吸附装置还可以为其他变压装置，此处不做限制。
采用本发明提供的软烘装置进行软烘制程时，在玻璃基板涂布制程完成后，进入软烘制程，基板进入腔室之前，腔室阀门打开，此时软烘装置会开启热风刀，同时开启排气阀门，使腔室内产生流向排气口的气流，也可以通过控制不同排气阀门的开闭调节气流流向，将前一片基板软烘制程产生的光阻残留抽走，保证腔室内制程环境的洁净。基板通过自动交换片，进入热板中，此时腔室阀门关闭，热风刀关闭，排气阀门处于旁路状态，开始软烘制程，制程时间153s，温度110°。
相较于现有技术的光刻胶软烘装置，本发明的光刻胶软烘装置通过变更排气口位置，改造排气管道，增大了软烤装置排气压力，有利光阻颗粒快速抽离，有效解决基板光阻残留的问题。还通过在排气管道内增设变压真空吸附装置，快速吸附排气中的高温光阻颗粒，同时将排气阀门改为交流磁感阀结构，避免与排气管道摩擦从而避免排气宕机；而且排气阀门改为交流磁感阀后开启/关闭控制排气更加灵敏迅速，且无需拆卸进行定期维护保养，提高机台OEE（设备综合效率），提高产品良率，节约光阻用量，降低成本。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (18)

  1. 一种光刻胶软烘装置，其包括：
    腔室，用于容置表面涂布有光刻胶的基板；
    热板，设置于所述腔室内，用于加热所述基板；
    热风刀，设置于所述腔室一端，用于使所述腔室产生预设方向的气流；以及
    排气口，对应所述热风刀设置于所述腔室的另一端，用于排出所述光刻胶经高温烘烤后蒸发形成的光阻颗粒；
    其中，所述排气口对应设置有排气管道，在所述排气管道内设置有变压真空吸附装置，用以调节排气压力来吸附所述光阻颗粒，所述变压真空吸附装置设置有气压调节阀以及吸附模块；远离所述排气口的一端设置有排气阀门，用以控制所述软烘装置进行排气。
  2. 根据权利要求1所述的软烘装置，其中，所述变压真空吸附装置包括循环冷凝装置，用于冷凝所述排气管道中的所述光阻颗粒。
  3. 根据权利要求2所述的软烘装置，其中，所述循环冷凝装置中设置有冷凝板/冷凝管，其中，所述冷凝板/冷凝管呈U形、“回”字形或者螺旋形。
  4. 根据权利要求1所述的软烘装置，其中，所述排气阀门为交流磁感阀。
  5. 根据权利要求4所述的软烘装置，其中，所述软烘装置还包括控制端，所述交流磁感阀与所述控制端电性连接。
  6. 根据权利要求1所述的软烘装置，其中，所述热板设置于所述腔室底部，用于承载所述基板；所述热风刀用于形成流经所述基板表面并流向所述排气口的气流。
  7. 根据权利要求6所述的软烘装置，其中，所述腔室至少设置有两所述排气口，至少两所述排气口平行于所述基板表面间隔设置，一所述排气口对应设置有一所述排气管道，一所述排气管道对应设置一变压真空吸附装置以及一所述排气阀门。
  8. 根据权利要求7所述的软烘装置，其中，不同所述排气管道内的所述排气阀门独立控制，通过局部开启所述排气阀门用以形成不同流向的所述气流。
  9. 根据权利要求7所述的软烘装置，其中，至少两所述排气管道连接于一抽气装置上，用以增强排气速率。
  10. 一种光刻胶软烘装置，其包括：
    腔室，用于容置表面涂布有光刻胶的基板；
    热板，设置于所述腔室内，用于加热所述基板；
    热风刀，设置于所述腔室一端，用于使所述腔室产生预设方向的气流；以及
    排气口，对应所述热风刀设置于所述腔室的另一端，用于排出所述光刻胶经高温烘烤后蒸发形成的光阻颗粒；
    其中，所述排气口对应设置有排气管道，在所述排气管道内设置有变压真空吸附装置，用以调节排气压力来吸附所述光阻颗粒；远离所述排气口的一端设置有排气阀门，用以控制所述软烘装置进行排气。
  11. 根据权利要求10所述的软烘装置，其中，所述变压真空吸附装置包括循环冷凝装置，用于冷凝所述排气管道中的所述光阻颗粒。
  12. 根据权利要求11所述的软烘装置，其中，所述循环冷凝装置中设置有冷凝板/冷凝管，其中，所述冷凝板/冷凝管呈U形、“回”字形或者螺旋形。
  13. 根据权利要求10所述的软烘装置，其中，所述排气阀门为交流磁感阀。
  14. 根据权利要求13所述的软烘装置，其中，所述软烘装置还包括控制端，所述交流磁感阀与所述控制端电性连接。
  15. 根据权利要求10所述的软烘装置，其中，所述热板设置于所述腔室底部，用于承载所述基板；所述热风刀用于形成流经所述基板表面并流向所述排气口的气流。
  16. 根据权利要求15所述的软烘装置，其中，所述腔室至少设置有两所述排气口，至少两所述排气口平行于所述基板表面间隔设置，一所述排气口对应设置有一所述排气管道，一所述排气管道对应设置一变压真空吸附装置以及一所述排气阀门。
  17. 根据权利要求16所述的软烘装置，其中，不同所述排气管道内的所述排气阀门独立控制，通过局部开启所述排气阀门用以形成不同流向的所述气流。
  18. 根据权利要求16所述的软烘装置，其中，至少两所述排气管道连接于一抽气装置上，用以增强排气速率。
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CN206757298U (zh) * 2017-04-28 2017-12-15 北京京东方显示技术有限公司 一种烘干装置、光刻设备

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