WO2019127371A1 - 电子模组预备层及其制造方法 - Google Patents

电子模组预备层及其制造方法 Download PDF

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Publication number
WO2019127371A1
WO2019127371A1 PCT/CN2017/119867 CN2017119867W WO2019127371A1 WO 2019127371 A1 WO2019127371 A1 WO 2019127371A1 CN 2017119867 W CN2017119867 W CN 2017119867W WO 2019127371 A1 WO2019127371 A1 WO 2019127371A1
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WO
WIPO (PCT)
Prior art keywords
substrate
release layer
electronic module
layer
release
Prior art date
Application number
PCT/CN2017/119867
Other languages
English (en)
French (fr)
Inventor
林武旭
Original Assignee
林武旭
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 林武旭 filed Critical 林武旭
Priority to KR1020197013801A priority Critical patent/KR20190095259A/ko
Priority to US16/344,378 priority patent/US11270183B2/en
Priority to JP2019526605A priority patent/JP2020506451A/ja
Priority to PCT/CN2017/119867 priority patent/WO2019127371A1/zh
Priority to CN201780054931.1A priority patent/CN110214329A/zh
Priority to EP17929427.7A priority patent/EP3734511B1/en
Publication of WO2019127371A1 publication Critical patent/WO2019127371A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07737—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts
    • G06K19/07739—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/20—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof characterised by a particular use or purpose
    • B42D25/23—Identity cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/313—Fingerprints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/40—Manufacture
    • B42D25/45—Associating two or more layers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0716—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor
    • G06K19/0718—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor the sensor being of the biometric kind, e.g. fingerprint sensors
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
    • G06K19/07345—Means for preventing undesired reading or writing from or onto record carriers by activating or deactivating at least a part of the circuit on the record carrier, e.g. ON/OFF switches
    • G06K19/07354—Means for preventing undesired reading or writing from or onto record carriers by activating or deactivating at least a part of the circuit on the record carrier, e.g. ON/OFF switches by biometrically sensitive means, e.g. fingerprint sensitive
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07701—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07716—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising means for customization, e.g. being arranged for personalization in batch

Definitions

  • the invention relates to an electronic module preparation layer, in particular to an electronic module preparation layer which facilitates subsequent processing and avoids breakage of the electronic module and a manufacturing method thereof.
  • the identification card has gradually become an indispensable item in life.
  • RFID Radio Frequency IDentification
  • the user can easily transmit specific information by means of induction.
  • the step of inputting the program code directly by an electronic module is completed, and then the electronic module is processed, and then combined with a printed layer to form an identification card.
  • the present invention utilizes an electronic module preparation layer to cover a plurality of electronic modules through two release layers.
  • a protection effect is provided, and when the user inputs the program code, the electronic module preparation layer operation can be directly utilized, and the disadvantages of the prior art are effectively improved, and further described below.
  • the invention provides an electronic module preparation layer comprising a substrate, a plurality of electronic modules and two release layers, wherein:
  • the substrate is provided with a plurality of receiving holes at intervals;
  • the plurality of electronic modules are respectively combined with the substrate and located in one of the receiving holes, and each of the electronic modules includes at least one input element;
  • the two release layers are respectively combined with the substrate and the plurality of electronic modules through a glue layer, and are located on the two sides of the substrate and the plurality of electronic modules, and the two release layers and each An operation hole is disposed at a position corresponding to at least one input component of the electronic module.
  • each electronic module is provided with a plurality of input elements, the plurality of input elements are located on the same side of the electronic module, and the plurality of input elements comprise a chip and a button And a fingerprint identification component.
  • each of the electronic modules is combined with the substrate in the same direction, so that one of the release layers has a plurality of operation holes, and the plurality of operation holes are respectively located with the electronic modules. The position of each input element.
  • the substrate is provided with a plurality of positioning portions at intervals, and the two release layers are respectively provided with a plurality of corresponding positions corresponding to the plurality of positioning portions. Release layer positioning section.
  • the invention also provides a method for manufacturing an electronic module preparation layer, comprising the following steps:
  • Providing a substrate preparing a substrate and a first release layer, wherein the substrate is provided with a plurality of receiving holes at intervals and penetrating, and coating a surface on a surface of the first release layer Bonding to the first release layer;
  • an electronic module preparing a plurality of electronic modules, wherein one of the electronic modules is provided with at least one input component, and the plurality of electronic modules are respectively disposed in one of the receiving holes;
  • Combining the second release layer preparing a second release layer, wherein the second release layer is provided with a plurality of operation holes, and the substrate and the plurality of electronic modules are coated on the side away from the first release layer After bonding, the second release layer is bonded to the substrate, and when the second release layer is bonded to the substrate, the plurality of operation holes are connected to at least one input component of each electronic module. .
  • the substrate in the step of disposing the substrate, the substrate is spaced apart from the plurality of positioning portions, and the first release layer is at a position corresponding to the plurality of positioning portions A plurality of first release layer positioning portions are disposed, and when the substrate is combined with the first release layer, the plurality of positioning portions are associated with the plurality of first release layer positioning portions.
  • the substrate in the step of bonding the second release layer, is spaced apart from the plurality of positioning portions, and the second release layer is in phase with the plurality of positioning portions
  • a plurality of second release layer positioning portions are disposed at corresponding positions, and when the second release layer is combined with the substrate, the plurality of second release layer positioning portions are associated with the plurality of positioning portions.
  • each electronic module includes a plurality of input elements, the plurality of input elements including a chip, a button and a fingerprint identification component, and the second release layer is a plurality of operation holes are provided at intervals and through, in the step of bonding the second release layer, when the second release layer is combined with the substrate, the plurality of operation holes are respectively combined with the chips of the electronic modules
  • the fingerprint identification elements are in communication.
  • the present invention also provides a method of manufacturing an identification card, comprising the manufacturing method of the electronic module preparation layer, wherein after the step of rolling and standing is completed, a step of inputting a program code and a combination of printing layers are performed.
  • the cutting step after cutting, separates the plurality of electronic modules and forms an identification card.
  • the user when the user needs to input the program code to each electronic module, the user can directly pass each chip and each fingerprint identification component to the outside due to the operation hole of the second release layer.
  • the electronic module preparation layer performs the operation of inputting the program code, and provides protection effects through the two release layers, thereby effectively improving the prior art, when directly inputting to each electronic module, it is easy to bend and damage each electronic module. Disadvantages, in order to provide an electronic module preparation layer.
  • Figure 1 is a partially exploded perspective view of a preferred embodiment of the present invention.
  • FIG. 2 is a perspective view of an electronic module in accordance with a preferred embodiment of the present invention.
  • Figure 3 is an exploded perspective view of a preferred embodiment of the present invention.
  • Figure 4 is a side elevational view, partially in section, of a preferred embodiment of the present invention.
  • Figure 5 is a schematic illustration of the operation of a preferred embodiment of the present invention.
  • Figure 6 is a schematic view showing the state of use of the preferred embodiment of the present invention.
  • Figure 7 is a flow diagram of the fabrication of a preferred embodiment of the present invention.
  • Figure 8 is a flow diagram of a fabrication of an identification card using a preferred embodiment of the present invention.
  • the present invention is an electronic module preparation layer.
  • the preferred embodiment of the electronic module is as shown in FIG. 1 to FIG. 3 .
  • the electronic module preparation layer A includes a substrate 10 , a plurality of electronic modules 20 , and two release patterns . Layers 30, 40, wherein:
  • the substrate 10 is provided with a plurality of accommodating holes 11 and a plurality of positioning portions 12, wherein the plurality of accommodating holes 11 are spaced apart from both sides of the substrate 10 and linear along the length direction and the width direction of the substrate 10. Arranging, and each of the accommodating holes 11 is shaped to match the plurality of electronic modules 20; the plurality of positioning portions 12 are a plurality of perforations spaced apart from positions on the opposite sides of the substrate 10 .
  • the plurality of electronic modules 20 are combined with the substrate 10 and disposed in one of the receiving holes 11 , and each of the electronic modules 20 is respectively provided with a plurality of input elements.
  • the plurality of input components include a chip 21, a button 22, and a fingerprint identification component 23.
  • the chip 21, the button 22, and the fingerprint recognition component 23 are respectively disposed at intervals, and the chip 21, the button 22, and the fingerprint identification are respectively
  • the components 23 are electrically connected to each other, and the chip 21, the button 22 and the fingerprint recognition component 23 are located on the same side of the electronic module 20, and when the plurality of electronic modules 20 are combined with the substrate 10, each electronic mode Group 20 faces in the same direction.
  • the two transparent release layers 30 , 40 are a first release layer 30 and a second release layer 40 , respectively. 40 is bonded to the substrate 10 and the plurality of electronic modules 20 through a glue layer 103, 104, respectively, wherein the first release layer 30 is at a position corresponding to the plurality of positioning portions 12.
  • a plurality of first release layer positioning portions 31 are disposed on the first release layer 30 to be aligned with the plurality of positioning portions 12 when the first release layer 30 is combined with the substrate 10 to form a positioning effect.
  • the layer positioning portion 31 is a mark or a hole having the same inner diameter as the plurality of positioning portions 12, so that the first release layer 30 can be combined with the substrate 10 through the mark point or the hole and the phase Corresponding to the center of the positioning portion 12;
  • the second release layer 40 is provided with a plurality of second release layer positioning portions 41 and a plurality of operation holes 42.
  • the plurality of second release layer positioning portions 41 are disposed at the same a position corresponding to the plurality of positioning portions 12 of the second release layer 40, whereby the plurality of positioning portions 12 are aligned with each other when the second release layer 40 is combined with the substrate 10
  • each of the second release layer positioning portions 41 is a mark point or a hole having the same inner diameter and the plurality of positioning portions 12, so that the second release layer 40 can be combined with the substrate 10
  • the marking point or the perforation corresponds to the center of the corresponding positioning portion 12, and the plurality of operation holes 42 are spaced apart and are respectively located on the second release layer 40 and the chip 21 and the fingerprint of the plurality of electronic modules 20.
  • the position of the identification component 23 is such that each of the chips 21 and each of the fingerprint recognition elements 23 communicate with the outside through one of the operation holes 42.
  • each chip 21 and each fingerprint recognition component 23 are connected to the outside due to the plurality of operation holes 42 of the second release layer 40.
  • the user can directly input the program code through the electronic module preparation layer A, and can provide packaging and protection effects through the two adhesive layers 103 and 104 and the two release layers 30 and 40.
  • the electronic module preparation layer A has a flat surface, which effectively improves the shortcomings of the prior art that directly bends and damages each electronic module 20 when inputting directly to each electronic module 20, thereby providing an electronic module preparation. Layer A.
  • the user can further remove the two release layers 30 and 40 of the pre-layer A of the electronic module, and respectively attach one on both sides.
  • the first printing layer 50 and the second printing layer 60 are formed by coating the two printing layers 50 and 60 on the two sealing layers 103 and 104 respectively, and then performing the steps of hot pressing to make the two sealing layers.
  • the layers 103, 104 soften and bond the two printed layers 50, 60.
  • the two sealants 103, 104 are re-solidified, the combination of the electronic module preparation layer A and the two printed layers 50, 60 is completed.
  • the second printing layer 60 is provided with a plurality of using holes 61 and a plurality of marking portions 62.
  • the plurality of using holes 61 are spaced apart and are respectively located on the second printing layer 60 and the chip 21 of the plurality of electronic modules 20.
  • the positions corresponding to the fingerprint recognition elements 23 are such that the respective chips 21 and the fingerprint recognition elements 23 are respectively connected to the outside through one of the use holes 61; the plurality of mark portions 62 are spaced apart from the second print layer 60.
  • a plurality of side faces of the substrate 10 are located away from the buttons 22 of the electronic modules 20, and after the above steps are completed, a plurality of identification cards B as shown in FIG. 4 are obtained.
  • the present invention provides a method for manufacturing an electronic module preparation layer.
  • the preferred embodiment of the present invention is as shown in FIG. 1 and FIG.
  • the substrate is provided with a substrate 10 and a first release layer 30.
  • the substrate 10 is provided with a plurality of receiving holes 11 and a plurality of positioning portions 12, and the first release layer 30 is provided.
  • a plurality of first release layer positioning portions 31 are coated with a glue on a surface of the first release layer 30 to cause a first separation of the plurality of positioning portions 12 of the substrate 10 and the first release layer 30. After the layer positioning portion 31 corresponds, the substrate 10 is bonded to the first release layer 30.
  • the electronic module is disposed: a plurality of electronic modules 20 are prepared. As shown in FIG. 2, one side of each electronic module 20 is provided with a chip 21, a button 22 and a fingerprint identification component 23, so that the plurality of electronic modules are The plurality of electronic modules 20 are combined with the substrate 10 and the first release layer 30, and the plurality of electronic modules 20 are combined with the plurality of electronic modules 20 in the same direction. When the substrates 10 are combined, the electronic modules 20 face in the same direction.
  • the second release layer 40 is provided with a plurality of second release layer positioning portions 41 and a plurality of operation holes 42 on the substrate 10 and the plurality of After applying a glue to one side of the electronic module 20 away from the first release layer 30, the plurality of second release layer positioning portions 41 are associated with the plurality of positioning portions 12 of the substrate 10, and then the first The two release layers 40 are bonded to the substrate 10, and when the second release layer 40 is bonded to the substrate 10, the plurality of operation holes 42 are in communication with the respective chips 21 and the fingerprint recognition elements 23.
  • Rolling and standing rolling a surface of the two release layers 30, 40 with a roller module to provide a cold pressing effect, whereby the two release layers 30, 40 and the substrate 10 are The air between the plurality of electronic modules 20 is pushed out and the two release layers 30, 40 are closely adhered to the substrate 10. Further, after standing, the substrate 10 and the plurality of electronic modes The adhesive between the group 20 and the two release layers 30, 40 will solidify and form a glue layer 103, 104, respectively, which will tightly coat the electronic modules 20 and provide The effect of packaging and protection is flattened, and an electronic module preparation layer A is formed.
  • the electronic module preparation layer A has a flat surface.
  • a method for manufacturing the identification card B can be further provided. Referring to FIG. 8, the rolling and standing of the manufacturing method of the electronic module preparation layer A can be performed. After the steps, follow these steps:
  • the two release layers 30 and 40 of the electronic module preparation layer A can be removed and respectively correspondingly attached.
  • a first printing layer 50 and a second printing layer 60 wherein the second printing layer 60 is provided with a plurality of using holes 61 at positions corresponding to the chips 21 and the fingerprint identifying elements 23 of the electronic modules 20,
  • a plurality of marking portions 62 are disposed at positions corresponding to the buttons 22 of the electronic modules 20, and the two printed layers 50 and 60 are pasted and combined with the electronic module preparation layer A, and then subjected to hot-press molding.
  • the plurality of electronic modules 20 can be separated and formed into an identification card B, respectively.
  • the substrate 10 is disposed on the first release layer 30, so that the plurality of electronic modules 20 can be received in the receiving holes 11 of the substrate 10 and allowed to be used by the user.
  • the subsequent steps of the identification card can be facilitated, thereby effectively improving the operation efficiency, and avoiding the damage caused by the bending of the electronic module during the manufacturing process of the existing identification card.
  • the disadvantage is to provide a manufacturing method for the electronic module preparation layer.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Security & Cryptography (AREA)
  • General Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Credit Cards Or The Like (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)

Abstract

一种电子模组预备层（A）及其制造方法，该电子模组预备层（A）包括一基板（10）、多个电子模组（20）以及两个离型层（30、40），通过该两个离型层（30、40）将该多个电子模组（20）包覆在该基板（10）中，提供保护效果，当使用者需要对各电子模组（20）输入程序代码时，由于其中一离型层（40）设有操作孔（42），使各电子模组（20）所设有的芯片（21）与指纹辨识元件（23）能与外部相连通，使用者可直接通过该电子模组预备层（A）进行输入程序代码的作业，有效改进现有技术直接针对各电子模组（20）输入时，容易弯折并损坏各电子模组（20）的缺点，藉以提供一种电子模组预备层（A）。

Description

电子模组预备层及其制造方法 技术领域
本发明涉及一种电子模组预备层，尤指一种方便后续处理，且可避免电子模组折损的电子模组预备层及其制造方法。
背景技术
识别卡逐渐成为生活中不可或缺的物品，利用射频识别无线通信技术(Radio Frequency IDentification；RFID)，使用者可以简易地用感应的方式完成特定信息的传输，现有识别卡的制造过程中，是通过将一电子模组直接进行输入程序代码的步骤，完成后再对该电子模组进行加工，并再结合一印刷层后形成一识别卡。
然而，由于该电子模组布满电子元件且容易弯折，在上述的加工过程中，容易因为该电子模组被弯折而导致损坏，造成现有识别卡的制造过程具有成本高的缺点，因此确有其需加以改进之处。
发明内容
为解决现有识别卡制造过程中，容易因该电子模组弯折而导致损坏的缺点，本发明利用一种电子模组预备层，通过两个离型层将多个电子模组包覆在一基板中，提供保护效果，且使用者进行输入程序代码的步骤时，可以直接利用该电子模组预备层作业，有效改善现有技术的缺点，进一步说明如下。
本发明提供一种电子模组预备层，其包括有一基板、多个电子模组以及两个离型层，其中：
该基板是间隔贯穿设有多个容置孔；
该多个电子模组是分别与该基板相结合，且位于其中一容置孔内，各电子模组是包括至少一输入元件；以及
该两个离型层是分别通过一封胶层与该基板以及该多个电子模组相结合，并位于该基板与该多个电子模组的两侧，且该两个离型层与各电子模组的至少一输入元件相对应的位置设有一操作孔。
进一步，上述电子模组预备层，其中各电子模组是设有多个输入元件，该多个输入元件是位于该电子模组的同一侧，且该多个输入元件是包括一芯片、一按钮以及一指纹辨识元件。
再进一步，上述电子模组预备层，其中各电子模组是以相同方向与该基板相结合，使其中一离型层具有多个操作孔，该多个操作孔分别位于与各电子模组的各输入元件相对应的位置。
较佳的是，上述电子模组预备层，其中该基板是间隔设有多个定位部，且该两个离型层再与该多个定位部相对应的位置上分别设有多个对应的离型层定位部。
本发明还提供一种电子模组预备层的制造方法，其包括有以下步骤：
设置基板：准备一基板以及一第一离型层，其中该基板设有间隔且贯穿地设有多个容置孔，在该第一离型层的一表面涂布一粘胶，将该基板与该第一离型层相粘合；
设置电子模组：准备多个电子模组，各电子模组的其中一侧是设有至少一输入元件，使该多个电子模组分别设置于其中一容置孔中；以及
结合第二离型层：准备一第二离型层，该第二离型层设有多个操作孔，在该基板与该多个电子模组远离该第一离型层的一面涂上粘胶后，将该第二离型层与该基板相粘合，且该第二离型层与该基板相粘合时，该多个操作孔是与各电子模组的至少一输入元件相连通。
进一步，上述电子模组预备层的制造方法，其中在设置基板的步骤中，该基板是间隔设有多个定位部，且该第一离型层在与该多个定位部相对应的位置上设有多个第一离型层定位部，该基板与该第一离型层相结合时，是使该多个定位部与该多个第一离型层定位部相对应。
进一步，上述电子模组预备层的制造方法，其中在结合第二离型层的步骤中，该基板是间隔设有多个定位部，且该第二离型层在与该多个定位部相对应的位置上设有多个第二离型层定位部，该第二离型层与该基板相结合时，是使该多个第二离型层定位部与该多个定位部相对应。
进一步，上述电子模组预备层的制造方法，其中各电子模组是包括多个输入元件，该多个输入元件是包括一芯片、一按钮以及一指纹辨识元件，且该第二离型层是间隔且贯穿地设有多个操作孔，使结合第二离型层的步骤中，该第二离型层与该基板相结合时，该多个操作孔是分别与各电子模组的芯片与指纹辨识元件相连通。
再进一步，上述电子模组预备层的制造方法，其中在结合第二离型层的步骤完成后，进行一滚压与静置的步骤，藉以将该两个离型层与该基板以及该多个电子模组之间的空气推挤出，并使该两个离型层与该基板紧密结合，且将各电子模组包覆。
本发明还提供一种识别卡的制造方法，其是包括上述电子模组预备层的制造方法，其中在滚压与静置的步骤完成后，进行一输入程序代码的步骤以及一结合印刷层并裁切的步骤，裁切后使该多个电子模组分离，并形成一识别卡。
藉由上述的技术特征，当使用者需要对各电子模组输入程序代码时，由于该第二离型层的操作孔，使各芯片与各指纹辨识元件与外部相连通，使用者可直接通过该电子模组预备层进行输入程序代码的作业，并可通过该两个离型层提供保护效果，有效改进现有技术直接针对各电子模组输入时，容易弯折并损坏各电子模组的缺点，藉以提供一种电子模组预备层。
附图说明
图1是本发明较佳实施例局部的立体分解图。
图2是本发明较佳实施例电子模组的立体外观图。
图3是本发明较佳实施例的立体分解图。
图4是本发明较佳实施例局部剖面的侧视图。
图5是本发明较佳实施例的操作示意图。
图6是本发明较佳实施例的使用状态示意图。
图7是本发明较佳实施例的制造流程图。
图8是利用本发明较佳实施例制作识别卡的制造流程图。
符号说明：
10基板
11容置孔
12定位部
20电子模组
30第一离型层
40第二离型层
41第二离型层定位部
42操作孔
A电子模组预备层
具体实施方式
为能详细了解本发明的技术特征及实用功效并且能依照说明书的内容来实现，兹进一步以图式所示的较佳实施例详细说明如后：
本发明是一种电子模组预备层，其较佳实施例是如图1至图3所示，该电子模组预备层A是包括一基板10、多个电子模组20以及两个离型层30、40，其中：
该基板10是设有多个容置孔11以及多个定位部12，其中该多个容置孔11是间隔贯穿该基板10的两侧面，并沿该基板10的长度方向及宽度方向呈线性排列，且各容置孔11的形状是与该多个电子模组20相搭配；该多个定位部12是为间隔穿设于靠近该基板10的两相对侧边上的位置的多个穿孔。
请参阅如图2所示，该多个电子模组20是与该基板10相结合，而分别设置于其中一容置孔11中，各电子模组20是分别设有多个输入元件，该多个输入元件包括一芯片21、一按钮22以及一指纹辨识元件23，该芯片21、该按钮22以及该指纹辨识元件23是分别呈间隔设置，且该芯片21、该按钮22与该指纹辨识元件23相互电连接，且该芯片21、该按钮22与该指纹辨识元件23是位于该电子模组20的同一侧面，且该多个电子模组20与该基板10相结合时，各电子模组20朝向同一方向。
请参阅如图1、图3及图4所示，该两透明的离型层30、40分别为一第一离型层30以及一第二离型层40，该两个离型层30、40是分别通过一封胶层103、104，而与该基板10及该多个电子模组20相粘合，其中该第一离型层30是在与该多个定位部12相对应的位置上设有多个第一离型层定位部31，藉以在该第一离形层30与该基板10相结合时与该多个定位部12相互对位而形成一定位效果，各第一离型层定位部31是为一标记点或一内径与该多个定位部12相同的穿孔，使该第一离形层30与该基板10相结合时，可通过该标记点或该穿孔与相对应定位部12的中心相对应；该第二离型层40设有多个第二离型层定位部41以及多个操作孔42，该多个第二离型层定位部41是设置于该第二离型层40与该多个定位部12相对应的位置，藉以在该第二离形层40与该基板10相结合时与该多个定位部12相互对位而形成一定位效果，各第二离型层定位部41是为一标记点或一内径与该多个定位部12相同的穿孔，使该第二离形层40与该基板10相结合时，可通过该标记点或该穿孔与相对应定位部12的中心相对应，该多个操作孔42是间 隔穿设且分别位于该第二离型层40与该多个电子模组20的芯片21与指纹辨识元件23相对应的位置，使各芯片21与各指纹辨识元件23是分别通过其中一操作孔42而与外部相连通。
藉由上述的技术特征，当使用者需要对各电子模组20输入程序代码时，由于该第二离型层40的多个操作孔42，使各芯片21与各指纹辨识元件23与外部相连通，让使用者可直接通过该电子模组预备层A，进行输入程序代码的作业，并可通过该两封胶层103、104与该两个离型层30、40提供封装、保护的效果，使该电子模组预备层A具有平整的表面，有效改进现有技术直接针对各电子模组20输入时，容易弯折并损坏各电子模组20的缺点，藉以提供一种电子模组预备层A。
请参阅如图5及图6所示，完成程序代码的输入作业后，使用者可进一步取下该电子模组预备层A的两个离型层30、40，并在两侧分别贴合一第一印刷层50以及一第二印刷层60，其详细作法是将该两印刷层50、60分别覆盖在该两封胶层103、104后，经热压成型的步骤，使该两封胶层103、104软化并粘合该两印刷层50、60，待该两封胶层103、104重新固化后即完成该电子模组预备层A与该两印刷层50、60的结合。
该第二印刷层60是设有多个使用孔61以及多个标记部62，该多个使用孔61是间隔贯穿且分别位于该第二印刷层60与该多个电子模组20的芯片21与指纹辨识元件23相对应的位置，使各芯片21与各指纹辨识元件23是分别通过其中一使用孔61而与外部相连通；该多个标记部62是间隔设置于该第二印刷层60远离该基板10的一侧面，且分别位于与各电子模组20的按钮22相对应的位置，完成上述步骤后，再经过裁切即可得到多数张如图4所示的识别卡B。
本发明提供一种电子模组预备层的制造方法，其较佳实施例是如图1及图7所示，包括下列操作步骤：
设置基板：准备一基板10以及一第一离型层30，其中该基板10设有间隔且贯穿地设有多个容置孔11以及多个定位部12，该第一离型层30设有多个第一离型层定位部31，在该第一离型层30的一表面涂布一粘胶，使该基板10的多个定位部12与该第一离型层30的第一离型层定位部31相对应后，将该基板10与该第一离型层30相黏合。
设置电子模组：准备多个电子模组20，如图2所示，各电子模组20的其中一侧是设有一芯片21、一按钮22以及一指纹辨识元件23，使该多个电子模组20以相同的方向分别设置于其中一容置孔11中，藉以使该多个电子模组20与该基板10以及该第一离型 层30相结合，且该多个电子模组20与该基板10相结合时，各电子模组20朝向同一方向。
结合第二离型层：准备一第二离型层40，该第二离型层40设有多个第二离型层定位部41以及多个操作孔42，在该基板10与该多个电子模组20远离该第一离型层30的一面涂布一粘胶后，使该多个第二离型层定位部41与该基板10的多个定位部12相对应后，将该第二离型层40与该基板10相粘合，且该第二离型层40与该基板10相粘合时，该多个操作孔42是与各芯片21以及各指纹辨识元件23相连通。
滚压与静置：利用一滚轮模组在该两个离型层30、40的表面进行滚压，提供一冷压的效果，藉以将该两个离型层30、40与该基板10以及该多个电子模组20之间的空气推挤出，并使该两个离型层30、40与该基板10紧密粘合，进一步，经过静置之后，该基板10及该多个电子模组20与该两个离型层30、40之间的粘胶会固化并分别形成一封胶层103、104，该两封胶层103、104会将各电子模组20紧密包覆，提供平整封装、保护的效果，并形成一电子模组预备层A，较佳的是，该电子模组预备层A具有平整的表面。
藉由上述该电子模组预备层A的制造方法，可进一步提供一识别卡B的制造方法，请参阅如图8所示，在该电子模组预备层A的制造方法的滚压与静置的步骤之后进行以下步骤：
输入程序代码：利用该电子模组预备层A所具有的该第二离型层40，对各电子模组20输入程序代码，使用者可直接通过该第二离型层40按压各按钮22，并可通过各操作孔42，对各芯片21及各指纹辨识元件23进行作业。
结合印刷层并裁切：完成程序代码的输入后，请参阅如图3及图4所示，可将该电子模组预备层A的两个离型层30、40去除，并分别相对应贴上一第一印刷层50及一第二印刷层60，其中该第二印刷层60在相对应于各电子模组20的芯片21及指纹辨识元件23的位置上设有多个使用孔61，并在相对应于各电子模组20的按钮22的位置上设有多个标记部62，该两印刷层50、60与该电子模组预备层A贴合并经过热压成型后，经过剪裁即可分离该多个电子模组20并使其分别形成一识别卡B。
藉由上述的制造步骤，本发明通过在该第一离型层30设置该基板10，使该多个电子模组20可容置于该基板10的各容置孔11内，并让使用者可以再结合第二离型层40的步骤之后，方便后续制做识别卡的后续步骤，有效提升作业效率，并可避免现有识别 卡制造过程中，容易因该电子模组弯折而导致损坏的缺点，藉以提供一种电子模组预备层的制造方法。
以上所述，仅是本发明的较佳实施例，并非对本发明任何形式上的限制，任何所属技术领域中具有通常知识者，若在不脱离本发明所提技术方案范围内，利用本发明所揭示技术内容所作出局部更动或修饰的等效实施例，并且未脱离本发明的技术方案内容，均仍属本发明的技术方案的范围内。

Claims (10)

  1. 一种电子模组预备层，其特征在于，包括有：
    一基板，其是间隔贯穿设有多个容置孔；
    多个电子模组，其是分别与所述基板相结合，且位于其中一容置孔内，各电子模组是包括至少一输入元件；以及
    两个离型层，其是分别通过一封胶层与所述基板以及所述多个电子模组相结合，并位于所述基板与所述多个电子模组的两侧，且所述两个离型层与各电子模组的至少一输入元件相对应的位置设有一操作孔。
  2. 如权利要求1所述的电子模组预备层，其特征在于，各电子模组是设有多个输入元件，所述多个输入元件是位于所述电子模组的同一侧，且所述多个输入元件是包括一芯片、一按钮以及一指纹辨识元件。
  3. 如权利要求1或2所述的电子模组预备层，其特征在于，各电子模组是以相同方向与所述基板相结合，使其中一离型层具有多个操作孔，所述多个操作孔分别位于与各电子模组的各输入元件相对应的位置。
  4. 如权利要求3所述的电子模组预备层，其特征在于，所述基板是间隔设有多个定位部，且所述两个离型层再与所述多个定位部相对应的位置上分别设有多个对应的离型层定位部。
  5. 一种电子模组预备层的制造方法，其特征在于，包括有以下步骤：
    设置基板：准备一基板以及一第一离型层，其中所述基板设有间隔且贯穿地设有多个容置孔，在所述第一离型层的一表面涂上粘胶，将所述基板与所述第一离型层相粘合；
    设置电子模组：准备多个电子模组，各电子模组的其中一侧是设有至少一输入元件，使所述多个电子模组分别设置于其中一容置孔中；以及
    结合第二离型层：准备一第二离型层，所述第二离型层设有多个操作孔，在所述基板与所述多个电子模组远离所述第一离型层的一面涂布一粘胶后，将所述第二离型层与所述基板相粘合，且所述第二离型层与所述基板相粘合时，所述多个操作孔是与各电子模组的至少一输入元件相连通。
  6. 如权利要求5所述的电子模组预备层的制造方法，其特征在于，在设置基板的步骤中，所述基板是间隔设有多个定位部，且所述第一离型层在与所述多个定位部相对应 的位置上设有多个第一离型层定位部，所述基板与所述第一离型层相结合时，是使所述多个定位部与所述多个第一离型层定位部相对应。
  7. 如权利要求5所述的电子模组预备层的制造方法，其特征在于，在结合第二离型层的步骤中，所述基板是间隔设有多个定位部，且所述第二离型层在与所述多个定位部相对应的位置上设有多个第二离型层定位部，所述第二离型层与所述基板相结合时，是使所述多个第二离型层定位部与所述多个定位部相对应。
  8. 如权利要求5所述的电子模组预备层的制造方法，其特征在于，各电子模组是包括多个输入元件，所述多个输入元件是包括一芯片、一按钮以及一指纹辨识元件，且所述第二离型层是间隔且贯穿地设有多个操作孔，使结合第二离型层的步骤中，所述第二离型层与所述基板相结合时，所述多个操作孔是分别与各电子模组的芯片与指纹辨识元件相连通。
  9. 如权利要求5至8中任一项所述的电子模组预备层的制造方法，其特征在于，在结合第二离型层的步骤完成后，进行一滚压与静置的步骤，藉以将所述两个离型层与所述基板以及所述多个电子模组之间的空气推挤出，并使所述两个离型层与所述基板紧密结合，且将各电子模组包覆。
  10. 一种识别卡的制造方法，其特征在于，是包括如权利要求9所述的电子模组预备层的制造方法，在滚压与静置的步骤完成后，进行一输入程序代码的步骤以及一结合印刷层并裁切的步骤，裁切后使所述多个电子模组分离，并形成一识别卡。
PCT/CN2017/119867 2017-12-29 2017-12-29 电子模组预备层及其制造方法 WO2019127371A1 (zh)

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