WO2019127039A1 - 曲面触控板、制作方法及电子设备 - Google Patents

曲面触控板、制作方法及电子设备 Download PDF

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Publication number
WO2019127039A1
WO2019127039A1 PCT/CN2017/118730 CN2017118730W WO2019127039A1 WO 2019127039 A1 WO2019127039 A1 WO 2019127039A1 CN 2017118730 W CN2017118730 W CN 2017118730W WO 2019127039 A1 WO2019127039 A1 WO 2019127039A1
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Prior art keywords
curved
groove
width
touch panel
panel according
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PCT/CN2017/118730
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English (en)
French (fr)
Inventor
曾露
Original Assignee
深圳市柔宇科技有限公司
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Publication date
Application filed by 深圳市柔宇科技有限公司 filed Critical 深圳市柔宇科技有限公司
Priority to CN201780097435.4A priority Critical patent/CN111433720A/zh
Priority to PCT/CN2017/118730 priority patent/WO2019127039A1/zh
Priority to TW107145126A priority patent/TW201928637A/zh
Publication of WO2019127039A1 publication Critical patent/WO2019127039A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means

Definitions

  • the present invention relates to the field of touch technologies, and in particular, to a curved touch panel, a manufacturing method, and an electronic device.
  • Curved touch panels have been widely used in the fields of life, industry and so on.
  • the traditional curved touch panel is manufactured by making a curved substrate, making a flat touch conductive line, and bonding a flat touch conductive line to the curved substrate to obtain a curved touch of the curved conductive line with a curved surface.
  • Control board the curvature of the touch conductive line of the curved surface obtained by the method is difficult to be completely consistent with the curvature of the curved substrate, so that the points of the obtained curved touch panel have the defects of inconsistent touch sensitivity.
  • the embodiment of the invention discloses a curved touch panel, a manufacturing method and an electronic device, wherein the curvature of the touch conductive line of the curved touch panel is completely consistent with the curvature of the substrate, and the points of the curved touch panel are The touch sensitivity is good.
  • a method for preparing a curved touch panel comprising the steps of: preparing a curved substrate, wherein the curved substrate comprises at least one curved surface, the at least one curved surface is formed with a plurality of grooves; and on the at least one curved surface
  • the coating forms a conductive layer, and the conductive layer is spaced apart by the plurality of grooves to form a plurality of touch conductive lines to obtain a curved touch plate.
  • a curved touch panel comprising: a curved substrate comprising at least one curved surface, wherein the at least one curved surface is formed with a plurality of grooves; and a conductive layer directly formed on the at least one curved surface by a coating process, The conductive layer is spaced apart by the plurality of grooves to form a plurality of touch conductive lines.
  • An electronic device comprising the above-described curved touch panel.
  • the curved touch panel, the preparation method and the electronic device of the invention have the conductive layer formed by the coating completely conforming to the curved substrate, and the curvature is completely uniform, so that the curvature of the conductive layer and the curved substrate does not appear to be inconsistent.
  • the defects of the touch sensitivity of each point are inconsistent, so that the quality of the curved touch panel and the electronic device of the present invention can be improved; and a plurality of grooves are formed on the curved substrate, so that when the conductive layer is coated, the conductive layer is covered by the plurality of The grooves are blocked to present a discontinuous state, so that a plurality of touch conductive lines can be obtained, thereby satisfying the requirements of the touch panel and the electronic device for the touch conductive lines.
  • FIG. 1 is a schematic view showing a method of preparing a curved touch panel according to a technical solution of the present invention.
  • FIG. 2 is a cross-sectional view of a curved substrate according to an embodiment of the present invention.
  • FIG 3 is a cross-sectional view of a curved panel of an embodiment of the present invention.
  • 3a-3g are schematic cross-sectional views showing various shapes of a groove of a curved substrate according to an embodiment of the present invention.
  • FIG. 4 is a cross-sectional view of a curved touch panel obtained by coating a curved substrate on the curved substrate of FIG. 2 to form a conductive layer.
  • 4a is a cross-sectional view showing the conductive material entering the groove when the conductive layer is formed on the curved substrate of FIG. 2.
  • FIG. 5 is a schematic structural diagram of an electronic device according to an embodiment of the present technical solution.
  • FIG. 1 is a schematic diagram of a method for preparing a curved touch panel according to a technical solution of the present invention.
  • a method 100 for preparing a curved touch panel comprising the steps of:
  • the curved substrate includes at least one curved surface, and the at least one curved surface is formed with a plurality of grooves.
  • the method for preparing the curved touch panel of the embodiment includes the following steps:
  • a curved substrate 10 is prepared.
  • the curved substrate includes at least one curved surface, and a plurality of grooves 11 are formed on the at least one curved surface.
  • the curved surface may be a convex arc surface, a concave arc surface, a wave surface, or an irregular curved surface.
  • the curved substrate 10 includes an opposite first surface 101 and a second surface 102, wherein the first surface 101 and the second surface 102 are curved surfaces, and the first surface 101 is a concave circle.
  • the arc surface, the second surface 102 is a convex arc surface.
  • the plurality of grooves 11 are formed on the first surface 101.
  • the curved substrate 10 is made of an electrically insulating material, so that the bottom wall and the sidewall of the groove 11 are made of an electrically insulating material.
  • the groove 11 is equivalent to the line gap of the touch panel. Therefore, the extending direction and the extension length of the touch panel need to be set according to the circuit design.
  • cross section The shape of the cross section of the groove 11 perpendicular to the extending direction (hereinafter referred to as "cross section") is not particularly limited, and the relationship between the opening width of the groove 11 and the inner width may be upper and lower (see FIG. 3). -a), the upper and lower large (refer to Figure 3-b), the same size (see Figure 3-c), timely large and small (refer to Figure 3-d), that is, the opening width is greater than the internal width, The opening width is smaller than the inner width, the opening width is equal to the inner width, and the inner width is larger than the inner width when the inner width is smaller than the inner width; the central axis of the cross section of the groove 11 may extend perpendicularly from the opening of the groove 11 (refer to FIG. 3-a). , 3-b, 3-c, 3-d), oblique extension (see Figure 3-e), polyline extension (see Figure 3-f), and curve extension (see Figure 3-g).
  • the opening width of the groove 11 is the same as the inner width, and the central axis of the cross section of the groove 11 extends from the fold line at the opening of the groove 11, wherein The fold line of the groove 11 is extended so that the conductive material does not easily flow to the bottom of the groove 11 during coating, thereby preventing the line connection.
  • the opening width of the groove 11 is smaller than the inner width, and the central axis of the cross section of the groove 11 extends perpendicularly from the opening of the groove 11, also That is, the upper and lower large shapes, wherein, even when the conductive material flows to the bottom of the groove 11 during coating, since the bottom of the groove 11 is large, the conductive material is more difficult to fill the bottom of the groove 11, and thus Can prevent line connections.
  • the size of the groove 11, including the opening width, the inner width, the depth, and the like, are also not particularly limited, and only need to be set according to the circuit design requirements and the process capability.
  • the width of the touch conductive line to be formed is L1
  • the width of the opening 11 adjacent to the touch conductive line is L2
  • the width of the innermost portion of the groove 11 is L3, then L3 ⁇ L1+L2, more preferably, L3 ⁇ 1/2(L1+L2); defining a groove 11 having a depth H1, corresponding to the thickness of the curved substrate 10 at the groove 11 being H2, then H1 ⁇ H2, preferably, H1 is much smaller than H2.
  • the opening width L2 of the groove 11 can be set relatively large, for example, 0.3. Mm>L2>0.2 mm; also preferably, the bottom of the groove 11 is the widest and L3>L2, wherein 0.5 mm>L3>0.8 mm, and the structure of the upper and the lower is not easy to cause clogging of the coating material. Further, more preferably, L2>L3-L2 is provided to facilitate the entry and exit of a cutting tool such as a turning tool.
  • the process precision is high, and the line connection is not easy to occur, and the opening width L2 of the groove 11 can be set relatively small.
  • the plurality of grooves may also be formed on the second surface 102; the plurality of grooves may also be formed on other surfaces of the curved substrate 10.
  • the method for preparing the curved substrate 10 may include: referring to FIG. 3, a curved panel 20 is provided; and then, referring to FIG. 2, the curved panel is processed by mechanical processing or laser ablation. The plurality of grooves 11 are formed on at least one curved surface of 20 to obtain the curved substrate 10.
  • the method for preparing the curved substrate 10 may be: forming the curved substrate 10 directly by means of 3D printing, and forming the plurality of grooves 11 directly during the 3D printing process, without requiring a second Processing; wherein, in the curved substrate 10 formed by 3D printing, the shape of the plurality of grooves 11 is selected to be larger, and the shape that cannot be formed by the machining and laser ablation methods in the foregoing is also Can be achieved by 3D printing.
  • a conductive layer 12 is formed on the at least one curved surface, wherein the conductive layer 12 is spaced apart by the plurality of grooves 11 to be presented as a plurality of touch conductive lines 121. Thereby, a curved touch panel 1 is obtained.
  • the conductive layer 12 is formed on the first surface 101 by a process such as coating, spraying, sputtering, evaporation, or plasma plating.
  • the process conditions are controlled so that the conductive material does not enter or not
  • the grooves 11 are connected to each other, so that the conductive layer 12 is spaced apart by the plurality of grooves 11 and appears discontinuous in any of the grooves 11, thereby presenting a plurality of touch conductive lines. 121.
  • a conductive layer 12 is formed on the at least one curved surface, and the conductive material enters the groove 11 at the same time, but inside the groove 11, the shape and size of the groove 11 in this case
  • the conductive material entering the recess 11 is not connected inside the recess 11 but forms a gap 122, so that the touch conductive lines 121 on both sides of the recess 11 remain
  • the phases are separated, that is to say not electrically connected in the recess 11.
  • the material of the conductive layer 12 will vary depending on the process, and will not be described here.
  • the embodiment of the present invention further provides a curved touch panel 1 including a curved substrate 10 and a conductive layer 12 directly formed on the curved substrate 10 by a coating process.
  • the curved substrate 10 includes at least one curved surface on which a plurality of grooves 11 are formed.
  • the curved surface may be a convex arc surface, a concave arc surface, a wave surface, or an irregular curved surface.
  • the curved substrate 10 includes an opposite first surface 101 and a second surface 102, wherein the first surface 101 and the second surface 102 are curved surfaces, and the first surface 101 is a concave circle.
  • the arc surface, the second surface 102 is a convex arc surface, and the plurality of grooves 11 are formed on the first surface 101.
  • the curved substrate 10 is made of an electrically insulating material, and the bottom wall and the sidewall of the recess 11 are also made of an electrically insulating material.
  • the conductive layer 12 is spaced apart by the plurality of grooves 11 and presents a discontinuous state in any of the plurality of grooves 11 to form a plurality of touch conductive lines 121.
  • the conductive layer 12 is formed by a process such as coating, spraying, sputtering, evaporation, or plasma plating.
  • the groove 11 is equivalent to the line gap of the touch panel. Therefore, the extending direction and the extension length of the touch panel need to be set according to the circuit design.
  • cross section The shape of the cross section of the groove 11 perpendicular to the extending direction (hereinafter referred to as "cross section") is not particularly limited, and the relationship between the opening width of the groove 11 and the inner width may be upper and lower (see FIG. 3). -a), the upper and lower large (refer to Figure 3-b), the same size (see Figure 3-c), timely large and small (refer to Figure 3-d), that is, the opening width is greater than the internal width, The opening width is smaller than the inner width, the opening width is equal to the inner width, and the inner width is larger than the inner width when the inner width is smaller than the inner width; the central axis of the cross section of the groove 11 may extend vertically inward from the opening of the groove 11 (refer to FIG. 3 -a, 3-b, 3-c, 3-d), oblique extension (see Figure 3-e), extending along the fold line (see Figure 3-f), and extending along the curve (see Figure 3-g).
  • the opening width of the groove 11 is the same as the inner width, and the central axis of the cross-section of the groove 11 is inwardly along the opening of the groove 11.
  • the extension, wherein the fold line of the groove 11 is extended, can make the conductive material not easily flow to the bottom of the groove 11 during coating, thereby preventing the line connection.
  • the opening width of the groove 11 is smaller than the inner width, and the central axis of the cross section of the groove 11 extends vertically inward from the opening of the groove 11. That is, the upper and lower large shapes, wherein, since the bottom of the groove 11 is large, even when the conductive material flows to the bottom of the groove 11 during coating, the conductive material is more difficult to fill the bottom of the groove 11, thereby It also prevents line connections.
  • the size of the groove 11, including the opening width, the inner width, the depth, and the like are also not particularly limited, and only need to be set according to the circuit design requirements and the process capability.
  • the width of the touch conductive line to be formed is L1
  • the width of the opening 11 adjacent to the touch conductive line is L2
  • the width of the innermost portion of the groove 11 is L3, then L3 ⁇ L1+L2, more preferably, L3 ⁇ 1/2(L1+L2), to prevent the width of the curved substrate 10 supporting each conductive line from being too small and weak; defining a depth of the groove 11
  • the thickness of the curved substrate 10 corresponding to the groove 11 is H2, then H1 ⁇ H2, preferably, H1 is much smaller than H2.
  • the opening width L2 of the groove 11 can be set relatively large, for example, 0.3. Mm>L2>0.2 mm; also preferably, the bottom of the groove 11 is the widest and L3>L2, wherein 0.5 mm>L3>0.8 mm, and the structure of the upper and the lower is not easy to cause clogging of the coating material. .
  • the process precision is high, and the line connection is not easy to occur, and the opening width L2 of the groove 11 can be set relatively small.
  • the groove 11 adopts a structure with a small upper and a lower, preferably, L2>L3-L2, in order to facilitate the entry and exit of a cutting tool such as a turning tool.
  • an embodiment of the present technical solution further provides an electronic device 2 , which includes the aforementioned curved touch panel 1 .
  • the electronic device 2 can be a mobile phone, a tablet computer, an e-book, or the like.
  • the conductive layer formed by the coating is completely adhered to the curved substrate, and the curvature is completely uniform, so that the curvature of the conductive layer and the curved substrate are not uniform.
  • the defect of inaccurate touch sensitivity can improve the quality of the curved touch panel and the electronic device of the present invention; and a plurality of grooves are formed on the curved substrate, so that when the conductive layer is coated, the conductive layer is covered by the plurality of The groove is blocked to be in a discontinuous state, so that a plurality of touch conductive lines can be obtained, thereby satisfying the requirements of the touch panel and the electronic device for the touch conductive line; and the curved touch panel and the electronic device of the technical solution are
  • the conductive layer is directly formed on the substrate by coating, and does not need to be bonded by the adhesive layer, thereby eliminating the adhesive layer, thereby making the curved touch panel thinner, and facilitating miniaturization, thinning and thinning of the electronic device;

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Abstract

本申请公开一种曲面触控板，包括曲面基板，包括至少一个曲面，所述至少一个曲面上形成有多个凹槽；及导电层，通过涂镀工艺直接形成于所述至少一个曲面上，所述导电层被所述多个凹槽相间隔从而形成多条触控导电线路。本申请还公开一种曲面触控板制备方法及一种包含所述曲面触控板的电子设备。本申请的曲面触控板、制备方法及电子设备，触控导电线路的曲率与基板的曲率完全一致，触控灵敏度均较好。

Description

曲面触控板、制作方法及电子设备 技术领域
本发明涉及触控技术领域，尤其涉及一种曲面触控板、制作方法及电子设备。
背景技术
曲面触摸板目前已广泛应用于生活，工业等领域中。传统的曲面触控板的制作方法为：制作曲面基板，制作纯平触控导电线路，及将纯平的触控导电线路贴合在曲面基板上，得到具有曲面的触控导电线路的曲面触控板。然而，此方法得到的曲面的触控导电线路的曲率很难与曲面基板的曲率完全一致，从而会使得到的曲面触控板的各点有触控灵敏度不一致的缺陷。
发明内容
本发明实施例公开一种曲面触控板、制作方法及电子设备，其中，所述曲面触控板的触控导电线路的曲率与基板的曲率完全一致，所述曲面触控板的各点的触控灵敏度均较好。
一种曲面触控板的制备方法，包括步骤：制备一曲面基板，其中，所述曲面基板包括至少一个曲面，所述至少一个曲面上形成有多个凹槽；及在所述至少一个曲面上涂镀形成一导电层，所述导电层被所述多个凹槽相间隔从而形成多条触控导电线路，得到曲面触控版。
一种曲面触控板，包括：曲面基板，包括至少一个曲面，所述至少一个曲面上形成有多个凹槽；及导电层，通过涂镀工艺直接形成于所述至少一个曲面上，所述导电层被所述多个凹槽相间隔从而形成多条触控导电线路。
一种电子设备，所述电子设备包括上述的曲面触控板。
本发明的曲面触控板、制备方法及电子设备，因涂镀形成的导电层与曲面基板完全相贴合，曲率完全一致，故，并不会出现因导电层与曲面基板曲率不一致而导致的各点触控灵敏度不一致的缺陷，从而能够提升本案的曲面触控板 及电子设备的品质；而在曲面基板上形成有多个凹槽，从而涂镀导电层时，导电层会被所述多个凹槽阻隔从而呈现不连续状态，从而可以得到多条触控导电线路，进而可以满足触控板及电子设备对触控导电线路的要求。
附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本发明技术方案的曲面触控板的制备方法的示意图。
图2是本发明技术方案实施例的曲面基板的剖视示意图。
图3是本发明技术方案实施例的曲面板的剖视示意图。
图3a-3g是本发明技术方案实施例的曲面基板的凹槽的各种形状的剖视示意图。
图4是在图2的曲面基板上涂镀形成导电层后得到的曲面触控板的剖视示意图。
图4a是在图2的曲面基板上涂镀形成导电层时，导电材料进入凹槽后的剖视示意图。
图5是本技术方案实施例提供的电子设备的结构示意图。
具体实施方式
下面将结合本发明技术方案实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请参考图1，图1是本发明技术方案的曲面触控板的制备方法的示意图。
一种曲面触控板的制备方法100，包括步骤：
S101，制备一曲面基板，所述曲面基板包括至少一个曲面，所述至少一个曲面上形成有多个凹槽。
S102，在所述至少一个曲面上涂镀形成一导电层，所述导电层被所述多个凹槽相间隔从而形成多条触控导电线路。
具体地，本实施例的曲面触控板的制备方法包括如下步骤：
首先，请参阅图2，制备一曲面基板10，所述曲面基板包括至少一个曲面，所述至少一个曲面上形成有多个凹槽11。
所述曲面可以为凸出的圆弧表面，也可以为凹陷的圆弧表面，也可以为波浪曲面，还可以为不规则的曲面等。
本实施例中，所述曲面基板10包括相对的第一表面101及第二表面102，其中，所述第一表面101及第二表面102均为曲面，所述第一表面101为凹陷的圆弧表面，所述第二表面102为凸出的圆弧表面。所述第一表面101上形成所述多个凹槽11。
本实施例中，所述曲面基板10为电绝缘材料制成，从而，所述凹槽11的底壁及侧壁均为电绝缘材料制成。
所述凹槽11即相当于触控板的线路间隙，故，其延伸方向及延伸长度依线路设计需要设置。
所述凹槽11的与延伸方向相垂直的截面(后简称“截面”)的形状并无特殊限制，所述凹槽11的开口宽度与内部宽度的关系可以为上大下小(参图3-a)，上小下大(参图3-b)，等大(参图3-c)，及时大时小(参图3-d)等，也即，分别为开口宽度大于内部宽度、开口宽度小于内部宽度、开口宽度等于内部宽度、内部宽度时大于开口宽度时小于内部宽度；所述凹槽11的截面中轴线可以自所述凹槽11的开口处垂直延伸(参图3-a、3-b、3-c、3-d)，倾斜延伸(参图3-e)，折线延伸(参图3-f)，及曲线延伸(参图3-g)等。
请参阅图3-f，在一优选的实施例中，所述凹槽11的开口宽度与内部宽度相同，所述凹槽11的截面中轴线自所述凹槽11的开口处折线延伸，其中， 所述凹槽11的折线延伸的设置可以使在涂镀时，导电材料不易流至凹槽11的底部，从而防止线路连接。
请参阅图3-b，在另一优选的实施例中，所述凹槽11的开口宽度小于内部宽度，所述凹槽11的截面中轴线自所述凹槽11的开口处垂直延伸，也即为上小下大形状，其中，在涂镀时，导电材料即使流至凹槽11的底部，因凹槽11的底部较大，导电材料也较难填满凹槽11的底部，从而也能防止线路连接。
所述凹槽11的尺寸，包括开口宽度，内部宽度，深度等，也并无特殊限制，仅需根据线路设计需求以及制程工艺能力设置即可。
例如，定义待形成的触控导电线路的宽度为L1，邻接所述触控导电线路的凹槽11的开口宽度为L2，所述凹槽11的内部最宽处的宽度为L3，则L3<L1+L2，更优选地，L3<1/2(L1+L2)；定义一凹槽11的深度为H1，对应所述凹槽11处的所述曲面基板10的厚度为H2，则H1<H2，优选地，H1远小于H2。
又例如，采用涂布或喷涂等工艺形成导电层时，因涂布材料粘度较大，易发生粘连进而容易发生线路连接，则凹槽11的开口宽度L2则可设置的相对大一些，例如0.3毫米>L2>0.2毫米；还优选地，所述凹槽11的底部最宽且L3>L2，其中，0.5毫米>L3>0.8毫米，采用上小下大的结构不容易造成涂布材料的堵塞；进一步，更优选地，L2>L3-L2，以利于车刀等切割工具的进出。
再例如，采用镀覆，如溅镀、蒸镀或等离子镀等，工艺形成导电层时，工艺精度较高，不易发生线路连接，则，凹槽11的开口宽度L2则可设置的相对小一些，例如L2>0.05毫米，优选地，0.3毫米>L2>0.05毫米，以具有较好的触控性能；更优选地，所述凹槽11采用上大下小的结构，例如类似图3-e的形状。
在其他实施例中，也可以在所述第二表面102上形成所述多个凹槽；还可以在所述曲面基板10的其他表面形成所述多个凹槽。
在一优选实施例中，所述曲面基板10的制备方法可以包括：请参阅图3，提供一曲面板20；之后，请参阅图2，通过机械加工或激光烧蚀的方式在所述 曲面板20的至少一曲面上形成所述多个凹槽11，得到所述曲面基板10。
在另一优选实施例中，所述曲面基板10的制备方法可以为：通过3D打印的方式直接形成所述曲面基板10，3D打印过程中直接形成所述多个凹槽11，不需要二次加工；其中，3D打印形成的所述曲面基板10中，所述多个凹槽11的形状的选择范围更大，如前述所述里中的机械加工及激光烧蚀方法无法形成的形状，也可以通过3D打印实现。
之后，请参阅图4，在所述至少一个曲面上涂镀形成一导电层12，其中，所述导电层12被所述多个凹槽11相间隔从而呈现为多条触控导电线路121，从而得到一曲面触控板1。
本实施例中，通过涂布、喷涂、溅镀、蒸镀或等离子镀等工艺，在所述第一表面101上形成所述导电层12。
因所述第一表面101上形成有多个凹槽11，在进行涂布、喷涂、溅镀、蒸镀或等离子镀等工艺时，控制工艺条件，可使导电材料并不进入或不在任一所述凹槽11内相连接，从而，所述导电层12即被所述多个凹槽11相间隔而在任一凹槽11内均呈现为不连续状态，从而呈现为多条触控导电线路121。
例如，请参阅图4a，在所述至少一个曲面上涂镀形成一导电层12，导电材料同时进入所述凹槽11内，但在所述凹槽11内部，因本案凹槽11形状及尺寸的设置，进入所述凹槽11的所述导电材料在所述凹槽11内部并不连接，而是形成一间隙122，从而，所述凹槽11两侧所述触控导电线路121仍保持相分离，也即不在所述凹槽11内相电连接。
因工艺的不同，所述导电层12的材质也会有所不同，此处不再赘述。
请再次参阅图4，本技术方案实施例还提供一曲面触控板1，所述曲面触控板1包括一曲面基板10及通过涂镀工艺直接形成于曲面基板10上的导电层12。
所述曲面基板10包括至少一个曲面，所述至少一个曲面上形成有多个凹槽11。所述曲面可以为凸出的圆弧表面，也可以为凹陷的圆弧表面，也可以为波浪曲面，还可以为不规则的曲面等。
本实施例中，所述曲面基板10包括相对的第一表面101及第二表面102，其中，所述第一表面101及第二表面102均为曲面，所述第一表面101为凹陷的圆弧表面，所述第二表面102为凸出的圆弧表面，所述第一表面101上形成有所述多个凹槽11。
本实施例中，所述曲面基板10为电绝缘材料制成，所述凹槽11的底壁及侧壁也即均为电绝缘材料制成。
所述导电层12被所述多个凹槽11相间隔而在任一所述多个凹槽11内均呈现不连续状态，从而形成多条触控导电线路121。本实施例中，所述导电层12通过涂布、喷涂、溅镀、蒸镀或等离子镀等工艺形成。
所述凹槽11即相当于触控板的线路间隙，故，其延伸方向及延伸长度依线路设计需要设置。
所述凹槽11的与延伸方向相垂直的截面(后简称“截面”)的形状并无特殊限制，所述凹槽11的开口宽度与内部宽度的关系可以为上大下小(参图3-a)，上小下大(参图3-b)，等大(参图3-c)，及时大时小(参图3-d)等，也即，分别为开口宽度大于内部宽度、开口宽度小于内部宽度、开口宽度等于内部宽度、内部宽度时大于开口宽度时小于内部宽度；所述凹槽11的截面中轴线可以自所述凹槽11的开口处向内垂直延伸(参图3-a、3-b、3-c、3-d)，倾斜延伸(参图3-e)，沿折线延伸(参图3-f)，及沿曲线延伸(参图3-g)等。
请参阅图3-f，在一优选的实施例中，所述凹槽11的开口宽度与内部宽度相同，所述凹槽11的截面中轴线自所述凹槽11的开口处向内沿折线延伸，其中，所述凹槽11的折线延伸的设置可以使在涂镀时，导电材料不易流至凹槽11的底部，从而防止线路连接。
请参阅图3-b，在另一优选的实施例中，所述凹槽11的开口宽度小于内部宽度，所述凹槽11的截面中轴线自所述凹槽11的开口处向内垂直延伸，也即为上小下大形状，其中，因凹槽11的底部较大，在涂镀时，导电材料即使流至凹槽11的底部，导电材料较难填满凹槽11的底部，从而也能防止线路连 接。
所述凹槽11的尺寸，包括开口宽度，内部宽度，深度等也并无特殊限制，仅需根据线路设计需求以及制程工艺能力设置即可。
例如，定义待形成的触控导电线路的宽度为L1，邻接所述触控导电线路的凹槽11的开口宽度为L2，所述凹槽11的内部最宽处的宽度为L3，则L3<L1+L2，更优选地，L3<1/2(L1+L2)，以防止支撑每条导电线路的所述曲面基板10的宽度太小，强度较弱；定义一所述凹槽11的深度为H1，对应所述凹槽11处的所述曲面基板10的厚度为H2，则H1<H2，优选地，H1远小于H2。
又例如，采用涂布或喷涂等工艺形成导电层时，因涂布材料粘度较大，易发生粘连进而容易发生线路连接，则凹槽11的开口宽度L2则可设置的相对大一些，例如0.3毫米>L2>0.2毫米；还优选地，所述凹槽11的底部最宽且L3>L2，其中，0.5毫米>L3>0.8毫米，采用上小下大的结构不容易造成涂布材料的堵塞。
再例如，采用镀覆，如溅镀、蒸镀或等离子镀等，工艺形成导电层时，工艺精度较高，不易发生线路连接，则，凹槽11的开口宽度L2则可设置的相对小一些，例如L2>0.05毫米，优选地，0.3毫米>L2>0.05毫米，以具有较好的触控性能；更优选地，所述凹槽11采用上大下小的结构，例如类似图3-e的形状。
其中，当所述凹槽11采用上小下大的结构时，优选地，L2>L3-L2，以利于车刀等切割工具的进出。
请参阅图5，本技术方案实施例还提供一种电子设备2，所述电子设备2包括前述的曲面触控板1。
其中，所述电子设备2可以为手机、平板电脑、电子书等。
本技术方案的曲面触控板及电子设备中，因涂镀形成的导电层与曲面基板完全相贴合，曲率完全一致，故，并不会出现因导电层与曲面基板曲率不一致而导致的各点触控灵敏度不一致的缺陷，从而能够提升本案的曲面触控板及电子设备的品质；而在曲面基板上形成有多个凹槽，从而涂镀导电层时，导电层 会被所述多个凹槽阻隔从而呈现不连续状态，从而可以得到多条触控导电线路，进而可以满足触控板及电子设备对触控导电线路的要求；并且，本技术方案的曲面触控板及电子设备中，导电层通过涂镀方式直接形成于基板上，并不需要胶层进行粘结，省去了胶层，从而可以使曲面触控板更薄，利于电子设备的小型化、轻薄化；本技术方案的曲面触控板的制备方法较为简单，且不需要进行对位贴合等工艺，良率也较高。
以上所述是本发明的优选实施例，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也视为本发明的保护范围。

Claims (20)

  1. 一种曲面触控板的制备方法，包括步骤：
    制备一曲面基板，其中，所述曲面基板包括至少一个曲面，所述至少一个曲面上形成有多个凹槽；及
    在所述至少一个曲面上涂镀形成一导电层，所述导电层被所述多个凹槽相间隔从而形成多条触控导电线路，得到曲面触控板。
  2. 如权利要求1所述的曲面触控板的制备方法，其特征在于，所述曲面基板的制备方法包括：提供一曲面板；之后，通过机械加工或激光烧蚀的方式在所述曲面板的至少一曲面上形成所述多个凹槽，得到所述曲面基板。
  3. 如权利要求1所述的曲面触控板的制备方法，其特征在于，所述曲面基板的制备方法为：通过3D打印的方式直接形成所述曲面基板，其中，在3D打印过程中直接形成所述多个凹槽。
  4. 如权利要求1所述的曲面触控板的制备方法，其特征在于，所述涂覆的工艺为涂布、喷涂、溅镀、蒸镀或等离子镀工艺。
  5. 如权利要求4所述的曲面触控板的制备方法，其特征在于，采用涂布或喷涂工艺形成所述导电层时，定义所述凹槽的开口宽度为L2，则0.3毫米>L2>0.2毫米。
  6. 如权利要求4所述的曲面触控板的制备方法，其特征在于，采用溅镀、蒸镀或等离子镀工艺形成所述导电层时，定义所述凹槽的开口宽度为L2，则L2>0.05毫米。
  7. 如权利要求1所述的曲面触控板的制备方法，其特征在于，在所述至少一个曲面上涂镀形成一导电层时，导电材料同时进入所述凹槽，但所述凹槽两侧的所述触控导电线路仍相分离。
  8. 如权利要求7所述的曲面触控板的制备方法，其特征在于，进入凹槽的导电材料未完全填满凹槽而在凹槽内形成间隙，从而使所述凹槽两侧的所述触控导电线路仍相分离。
  9. 一种曲面触控板，包括：
    曲面基板，包括至少一个曲面，所述至少一个曲面上形成有多个凹槽；及
    导电层，通过涂镀工艺直接形成于所述至少一个曲面上，所述导电层被所述多个凹槽相间隔从而形成多条触控导电线路。
  10. 如权利要求9所述的曲面触控板，其特征在于，所述曲面基板为电绝缘材料制成。
  11. 如权利要求9所述的曲面触控板，其特征在于，所述凹槽的开口宽度与凹槽内部宽度的关系为开口宽度大于内部宽度、开口宽度小于内部宽度、开口宽度等于内部宽度、内部宽度时大于开口宽度时小于内部宽度。
  12. 如权利要求9所述的曲面触控板，其特征在于，所述凹槽的截面中轴线自所述凹槽的开口处向内垂直延伸、倾斜延伸、沿折线延伸或沿曲线延伸。
  13. 如权利要求9所述的曲面触控板，其特征在于，所述凹槽的开口宽度与内部宽度相同，所述凹槽的截面中轴线自所述凹槽的开口处向内沿折线延伸。
  14. 如权利要求9所述的曲面触控板，其特征在于，所述凹槽的开口宽度小于内部宽度，所述凹槽的截面中轴线自所述凹槽的开口处向内垂直延伸；定义邻接所述触控导电线路的凹槽的开口宽度为L2，所述凹槽的内部最宽处的宽度为L3，则L2>L3-L2。
  15. 如权利要求9所述的曲面触控板，其特征在于，定义触控导电线路的宽度为L1，邻接所述触控导电线路的凹槽的开口宽度为L2，所述凹槽的内部最宽处的宽度为L3，则L3<L1+L2。
  16. 如权利要求15所述的曲面触控板，其特征在于，定义所述触控导电线路的宽度为L1，邻接所述触控导电线路的所述凹槽的开口宽度为L2，所述凹槽的内部最宽处的宽度为L3，则L3<1/2(L1+L2)。
  17. 如权利要求9所述的曲面触控板，其特征在于，所述导电层采用涂布或喷涂工艺形成，定义所述凹槽的开口宽度为L2，则0.3毫米>L2>0.2毫米。
  18. 如权利要求17所述的曲面触控板，其特征在于，定义所述凹槽的内部最宽处的宽度为L3，其中L3>L2，且0.5毫米>L3>0.8毫米。
  19. 如权利要求9所述的曲面触控板的制备方法，其特征在于，所述导电 层采用溅镀、蒸镀或等离子镀工艺形成，定义所述凹槽的开口宽度为L2，则L2>0.05毫米。
  20. 一种电子设备，所述电子设备包括如权利要求9至19任一项所述的曲面触控板。
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106206615A (zh) * 2016-08-26 2016-12-07 深圳市华星光电技术有限公司 一种阵列基板及其制作方法、液晶显示面板
CN106433398A (zh) * 2016-09-27 2017-02-22 京东方科技集团股份有限公司 透明导电涂胶组合物、触控面板及其制备方法、显示装置
CN107315507A (zh) * 2017-07-05 2017-11-03 京东方科技集团股份有限公司 一种柔性触控基板及其制备方法、触控显示装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106206615A (zh) * 2016-08-26 2016-12-07 深圳市华星光电技术有限公司 一种阵列基板及其制作方法、液晶显示面板
CN106433398A (zh) * 2016-09-27 2017-02-22 京东方科技集团股份有限公司 透明导电涂胶组合物、触控面板及其制备方法、显示装置
CN107315507A (zh) * 2017-07-05 2017-11-03 京东方科技集团股份有限公司 一种柔性触控基板及其制备方法、触控显示装置

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