CN104582271B - 功放槽制作方法、含功放槽的印刷电路板及其制作方法 - Google Patents
功放槽制作方法、含功放槽的印刷电路板及其制作方法 Download PDFInfo
- Publication number
- CN104582271B CN104582271B CN201310468367.1A CN201310468367A CN104582271B CN 104582271 B CN104582271 B CN 104582271B CN 201310468367 A CN201310468367 A CN 201310468367A CN 104582271 B CN104582271 B CN 104582271B
- Authority
- CN
- China
- Prior art keywords
- power amplifier
- blind hole
- circuit board
- printed circuit
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310468367.1A CN104582271B (zh) | 2013-10-09 | 2013-10-09 | 功放槽制作方法、含功放槽的印刷电路板及其制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310468367.1A CN104582271B (zh) | 2013-10-09 | 2013-10-09 | 功放槽制作方法、含功放槽的印刷电路板及其制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104582271A CN104582271A (zh) | 2015-04-29 |
CN104582271B true CN104582271B (zh) | 2017-12-12 |
Family
ID=53097164
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310468367.1A Active CN104582271B (zh) | 2013-10-09 | 2013-10-09 | 功放槽制作方法、含功放槽的印刷电路板及其制作方法 |
Country Status (1)
Country | Link |
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CN (1) | CN104582271B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105578767B (zh) * | 2015-12-14 | 2018-09-25 | 生益电子股份有限公司 | 一种pcb阶梯槽的制作方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101652034A (zh) * | 2008-08-12 | 2010-02-17 | 华为技术有限公司 | 印制电路板及制造方法、解决射频功率放大器回流的装置 |
CN101820728A (zh) * | 2010-04-08 | 2010-09-01 | 深南电路有限公司 | 一种具有台阶槽的pcb板加工工艺方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101460018B (zh) * | 2007-12-14 | 2011-02-16 | 华为技术有限公司 | 一种印制电路板及其制造方法、射频装置 |
CN101699938B (zh) * | 2009-10-21 | 2011-10-05 | 深南电路有限公司 | 线路板的加工方法及线路板 |
CN101998768B (zh) * | 2010-11-09 | 2012-11-21 | 深圳崇达多层线路板有限公司 | 一种pcb背钻孔制作方法 |
CN103124469B (zh) * | 2011-11-18 | 2015-08-26 | 北大方正集团有限公司 | 一种阶梯印刷电路板及其制作方法 |
-
2013
- 2013-10-09 CN CN201310468367.1A patent/CN104582271B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101652034A (zh) * | 2008-08-12 | 2010-02-17 | 华为技术有限公司 | 印制电路板及制造方法、解决射频功率放大器回流的装置 |
CN101820728A (zh) * | 2010-04-08 | 2010-09-01 | 深南电路有限公司 | 一种具有台阶槽的pcb板加工工艺方法 |
Also Published As
Publication number | Publication date |
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CN104582271A (zh) | 2015-04-29 |
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SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 9 floor Patentee after: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee after: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Patentee after: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 9 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee before: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Patentee before: FOUNDER INFORMATION INDUSTRY HOLDINGS Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220919 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee after: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 9 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee before: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Patentee before: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. |