WO2019120197A1 - 感光组件、摄像模组、感光组件拼板及相应制作方法 - Google Patents

感光组件、摄像模组、感光组件拼板及相应制作方法 Download PDF

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Publication number
WO2019120197A1
WO2019120197A1 PCT/CN2018/121812 CN2018121812W WO2019120197A1 WO 2019120197 A1 WO2019120197 A1 WO 2019120197A1 CN 2018121812 W CN2018121812 W CN 2018121812W WO 2019120197 A1 WO2019120197 A1 WO 2019120197A1
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WIPO (PCT)
Prior art keywords
photosensitive
circuit board
photosensitive member
panel
electronic component
Prior art date
Application number
PCT/CN2018/121812
Other languages
English (en)
French (fr)
Inventor
田中武彦
赵波杰
吴业
梅哲文
王明珠
Original Assignee
宁波舜宇光电信息有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201721782486.4U external-priority patent/CN207765447U/zh
Priority claimed from CN201711378319.8A external-priority patent/CN107910345B/zh
Application filed by 宁波舜宇光电信息有限公司 filed Critical 宁波舜宇光电信息有限公司
Priority to JP2020533278A priority Critical patent/JP7085625B2/ja
Priority to EP18891042.6A priority patent/EP3731272B1/en
Priority to US16/954,724 priority patent/US11646332B2/en
Priority to KR1020207019593A priority patent/KR102428682B1/ko
Publication of WO2019120197A1 publication Critical patent/WO2019120197A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14634—Assemblies, i.e. Hybrid structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
    • H01L27/14605—Structural or functional details relating to the position of the pixel elements, e.g. smaller pixel elements in the center of the imager compared to pixel elements at the periphery
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
    • H01L27/1461—Pixel-elements with integrated switching, control, storage or amplification elements characterised by the photosensitive area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14636—Interconnect structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14687—Wafer level processing
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Definitions

  • the invention relates to the technical field of camera modules.
  • the camera module industry is increasingly becoming smaller and smaller, so as to meet the requirements of integration and miniaturization of smart terminals.
  • the biggest obstacle to the miniaturization of camera modules is printed circuit boards (also called circuit boards). ), in order to ensure the strength of the printed circuit board to prevent its deformation, the thickness of the printed circuit board has a limit that is difficult to break through, which results in the axial dimension of the camera module or the photosensitive member (refers to the dimension along the optical axis direction) ) It is difficult to further reduce.
  • Full-screen mobile phones generally refer to mobile phones with a frontal screen ratio of more than 80%.
  • the ultra-narrow bezel screen is adopted, which is superior to ordinary mobile phones. Obviously, it can bring more shocking visual experience to mobile phone users. It is foreseeable that many mobile phone manufacturers are willing to adopt a comprehensive screen solution.
  • the front camera module of the mobile phone necessarily needs to be placed on the border of the mobile phone very close to the border (such as the top side or the bottom side). This places higher demands on the radial dimension of the camera module (referring to the dimension in the direction perpendicular to the optical axis).
  • the applicant proposed a MOC solution.
  • the non-photosensitive area of the photosensitive chip and other areas of the printed circuit board are molded and integrated into one body, so that the printed circuit board can be made thinner and lighter, and the arrangement of the electronic components in the camera module can be more dense, thereby satisfying The current demand for miniaturization in the industry.
  • a molding portion is formed on a wiring board by a molding process, the molding portion covering an edge portion of the photosensitive chip (ie, covering at least a portion of the non-photosensitive region of the photosensitive chip) and a gold electrically connecting the photosensitive chip to the wiring board line.
  • the solution can effectively reduce the radial dimension of the photosensitive component (referring to the dimension in the direction perpendicular to the optical axis) and the axial dimension (referring to the dimension along the optical axis), thereby helping to reduce the size of the camera module. , is widely welcomed by the market.
  • MOC camera modules still have some improvements in the manufacturing process.
  • the non-photosensitive area of the photosensitive chip and the peripheral area of the chip need to be integrally packaged, that is, the gold wire of the camera module (the gold wire connecting the photosensitive chip and the circuit board) also needs to be molded.
  • the plastic part is wrapped, and the usual molding scheme is to inject the liquefied EMC material into the mold, which results in the phenomenon that the mold flow breaks the gold wire when the EMC material is injected, thereby causing defective products. Due to the characteristics of the molding process itself, such defective products cannot be repaired, which makes such defective products completely scrapped, which increases the difficulty in manufacturing the finished camera module.
  • the present invention is directed to providing a solution that overcomes at least one of the above-discussed deficiencies of the prior art.
  • a photosensitive assembly comprising:
  • a photosensitive element mounted on the circuit board, and the photosensitive element has a first side;
  • a molding portion formed on the wiring board and surrounding the photosensitive member, and the molding portion extends toward the photosensitive member, covers the first electronic component and the first metal wire, and contacts the The surface of the photosensitive element.
  • the photosensitive element has a plurality of first terminals disposed along the first side
  • the circuit board has a plurality of second terminals
  • the second terminal is disposed on the line along the first side
  • the second terminal is in one-to-one correspondence with the first terminal; the metal wire connects the first terminal and the second terminal corresponding thereto.
  • the photosensitive element further has a second side opposite to the first side;
  • the photosensitive component further includes:
  • a second electronic component mounted on the circuit board and having a mounting area of the second electronic component on an extension line of the second side;
  • the molding portion further covers the second electronic component and the second metal wire.
  • the photosensitive element further has a third side crossing the first side; and the photosensitive assembly further includes a third metal wire electrically connecting the photosensitive element and the wiring board, and the A triple metal wire spans the third side.
  • the size of the first electronic component in a direction perpendicular to the first side direction and a size of a projection of the first metal line on a surface of the circuit board in a direction perpendicular to the first side direction are sized.
  • the line connecting the first terminal and the second terminal corresponding thereto is not perpendicular to the first side.
  • a photosensitive component panel comprising:
  • circuit board panel comprising a plurality of circuit board units
  • each photosensitive element being located on a circuit board unit, and each of the photosensitive elements having a parallel to the first direction
  • a molding portion formed on the wiring board panel and surrounding each of the photosensitive members, and the molding portion extending to each of the photosensitive members, covering the corresponding first electronic component and the first a metal wire and contacting the surface of the photosensitive member; and the wiring board region between adjacent photosensitive members is covered by the molding portion to form the molding portion as a whole.
  • each of the photosensitive elements has a plurality of first terminals disposed along the first side
  • the circuit board unit corresponding to the photosensitive elements has a plurality of second terminals, the second terminals along The first side is disposed on the circuit board unit and corresponds to the first terminal one by one; the metal wire connects the first terminal and the second terminal corresponding thereto.
  • each of the photosensitive elements further has a second side opposite to the first side;
  • the photosensitive component panel further includes:
  • the molding portion further covers the second electronic component and the second metal wire.
  • each of the photosensitive elements further has a third side crossing the first side; and the photosensitive assembly panel further includes a plurality of third metal lines, each of the photosensitive elements and corresponding thereto The circuit board unit is electrically connected, and the third metal line spans the third side.
  • the circuit board board is a soft and hard board.
  • circuit board assembly comprises at least one hard board area, and the plurality of photosensitive elements are mounted on the hard board area.
  • each of the hard board regions comprises two rows of circuit board units, and each of the circuit board units is mounted with one of the photosensitive elements.
  • the hard board area further comprises a non-wiring area between the two rows of circuit board units.
  • any two adjacent circuit board units have a common boundary.
  • the photosensitive member is obtained by cutting the aforementioned photosensitive member assembly.
  • the photosensitive member is obtained by cutting a photosensitive member assembly having a non-wiring area as described above, and the non-wiring area is cut.
  • a camera module comprising the aforementioned photosensitive member.
  • a method for fabricating a photosensitive member panel including:
  • Step 1 Prepare a panel to be molded, and the panel to be molded includes:
  • circuit board panel comprising a plurality of circuit board units
  • each photosensitive element being located on a circuit board unit, and each of the photosensitive elements having a first side, the first side being identical Arranging directions of the photosensitive elements of the row are parallel;
  • first metal wires electrically connecting each of the photosensitive elements and a wiring board unit corresponding to the photosensitive elements, and the first metal lines span the first side of the photosensitive elements
  • Step 2 pressing the mold to be molded by a mold to form a forming cavity between the mold and the panel to be molded;
  • Step 3 injecting a liquid molding material into the forming cavity, filling the molding cavity with the molding material, thereby forming a molding portion on the circuit board panel;
  • the mounting area of the first electronic component is located on an extension line of the first side of the corresponding photosensitive element to block or slow down the flow of the mold to the first metal line during the molding process. Shock.
  • the forming cavity comprises a plurality of forming cavity units, each of the forming cavity units corresponding to one of the circuit board units, and the plurality of forming cavity units are in communication with each other.
  • the molding portion surrounds each of the photosensitive elements, and the molding portion extends toward each of the photosensitive members, covers the corresponding first electronic components, and the first a metal wire and contacting a surface of the photosensitive member; and a wiring board region between adjacent photosensitive members is covered by the molding portion to form the molding portion as a whole.
  • the circuit board assembly is a soft and hard bonding board, and the soft and hard bonding board includes at least one hard board area, and the plurality of photosensitive elements are installed in the hard board area.
  • each of the hard board areas comprises two rows of circuit board units, one of the photosensitive elements is mounted on each of the circuit board units, and the hard board area further comprises two rows of circuit board units.
  • Non-wired area
  • the liquid molding material is injected from a position of the non-wiring area.
  • each of the hard board regions comprises a first row of circuit board units and a second row of circuit board units, and each of the circuit board units is mounted with one of the photosensitive elements;
  • the injection position of the liquid molding material includes a region between the first row of circuit board units and the second row of circuit board units, and a region between the first row of photosensitive elements and the first edge of the hard plate region. And a region between the second row of photosensitive elements and the second edge of the hard plate region, wherein the first edge of the hard plate region is an edge of the hard plate region adjacent to the first row of photosensitive elements and parallel to the first side, the hard plate region The second edge is an edge of the hard plate region adjacent to the second row of photosensitive elements and parallel to the first side.
  • each of the hard board regions is composed of a single row of circuit board units, and each of the circuit board units is mounted with one of the photosensitive elements;
  • the injection position of the liquid molding material includes a region between the photosensitive member and the first edge of the hard plate region, and a region between the photosensitive member and the second edge of the hard plate region, wherein the hard plate region An edge and a second edge of the hard plate region are two hard plate region edges that are parallel to the first edge. And the photosensitive element is located between the edges of the two hard plate regions.
  • each of the photosensitive elements has a plurality of first terminals disposed along the first side, and the circuit board unit corresponding to the photosensitive elements has a plurality of second terminals,
  • the second terminal is disposed on the circuit board unit along the first side and is in one-to-one correspondence with the first terminal; the metal wire connects the first terminal and the second terminal corresponding thereto.
  • each of the photosensitive elements further has a second side opposite to the first side;
  • the jigsaw to be molded further includes:
  • a mounting area of the second electronic component is located on the second side of the corresponding photosensitive element
  • the molding portion further covers the second electronic component and the second metal wire.
  • the dimension of the first electronic component in a direction perpendicular to the first side and the projection of the first metal line on the surface of the circuit board are perpendicular to the first side Size adaptation in the direction.
  • connection between the first terminal and the second terminal corresponding thereto is not perpendicular to the first side.
  • a photosensitive member panel produced by the above-described photosensitive member assembly method.
  • a photosensitive member obtained by cutting the aforementioned photosensitive member assembly.
  • a photosensitive member obtained by cutting a photosensitive member assembly, wherein the photosensitive member assembly is obtained according to the aforementioned photosensitive member assembly method, the photosensitive assembly
  • the hard board area of the panel includes a non-wiring area between the two rows of board units; and when the photosensitive assembly panel is cut, the non-wiring area is cut.
  • a camera module comprising the aforementioned photosensitive component.
  • the present invention has at least one of the following technical effects:
  • the present invention can reduce the risk of damage to the gold wire in the molding process to a certain extent without adding unnecessary parts and changing the mold.
  • the invention increases the production yield and reduces the production cost.
  • FIG. 1 is a cross-sectional view showing a camera module according to an embodiment of the present invention
  • Figure 2 is a top plan view showing the photosensitive member of the embodiment of Figure 1;
  • Figure 3 is a top plan view showing a photosensitive member in another embodiment of the present invention.
  • FIG. 4 is a top plan view showing a photosensitive member in still another embodiment of the present invention.
  • Figure 5 is a top plan view showing a photosensitive member panel in one embodiment of the present invention.
  • Figure 6 is a perspective view showing an example of a panel to be molded
  • Figure 7 is a cross-sectional view showing the mold after being pressed in an embodiment of the present invention.
  • Figure 8 is a schematic cross-sectional view showing the filling of the liquid molding material on the basis of Figure 7;
  • Figure 9 is a perspective view showing the imposition of the photosensitive member after molding in one embodiment
  • Figure 10 is a view showing the positional relationship between electronic components and metal wires in the photosensitive member of the present invention.
  • first, second, etc. are used to distinguish one feature from another, and do not represent any limitation of the feature.
  • first subject discussed below may also be referred to as a second subject, without departing from the teachings of the present application.
  • FIG. 1 is a cross-sectional view showing a camera module according to an embodiment of the present invention, which is fabricated based on a process of molding on a chip (MOC process).
  • the camera module 100 includes a circuit board 101, a photosensitive member 102, a molding portion 103, a metal wire 104, and a lens assembly 105.
  • the wiring board 101 has a first surface and an opposite second surface, and the photosensitive member 102 is mounted on the first surface of the wiring board 101.
  • the second surface serves as the bottom surface of the wiring board 101 (herein, the bottom surface of the wiring board refers to the second surface).
  • a molding portion 103 is formed on the wiring board 101 and surrounds the photosensitive member 102, and the molding portion 103 extends toward the photosensitive member 102 and contacts the photosensitive member 102 such that the molding portion 103 and the photosensitive member There is no gap between the sides of 102.
  • the metal wire 104 is used to electrically connect the photosensitive element 102 to the wiring board 101.
  • the lens assembly 105 is mounted on the molding portion 103 to constitute a complete camera module.
  • the lens assembly 105 includes a lens.
  • the lens assembly 105 can also include a motor mounted on a carrier of the motor that is mounted to the molding portion 103.
  • the camera module 100 is generally divided into two parts, a photosensitive member and a lens assembly 105, wherein the photosensitive member includes a wiring board 101, a photosensitive member 102, a molding portion 103, and a metal wire 104.
  • the photosensitive member includes a wiring board 101, a photosensitive member 102, a molding portion 103, and a metal wire 104.
  • Fig. 2 is a top plan view showing the photosensitive member of the embodiment of Fig. 1, in which the molded portion is not shown to more clearly show the positional relationship of the photosensitive member, the metal wires, and the electronic components.
  • the photosensitive member further includes electronic components mounted on the wiring board 101.
  • the photosensitive element 102 has a rectangular shape, and has a first side 1021, a second side 1022 opposite to the first side 1021, and a third side 1023 crossing the first side 1021.
  • the metal line includes a first metal line 1041 that spans the first side 1021.
  • the first metal line 1041 may have a plurality of strips arranged along the first side 1021.
  • the electronic component includes a first electronic component 1061.
  • a first electronic component 1061 is mounted on the wiring board 101 and a mounting area of the first electronic component 1061 corresponds to an extension line 1021a of the first side 1021.
  • the extension line 1021a corresponding to the first side 1021 may be located on the extension line 1021a of the first side 1021 or may be located adjacent to the extension line 1021a of the first side 1021.
  • the molding portion 103 covers the first electronic component 1061 and the first metal wire 1041 and contacts the surface of the photosensitive member 102.
  • the first electronic component 1061 is intentionally arranged on the side of the gold wire perpendicular (or substantially perpendicular) to the direction of the mold flow, so that the electronic component can generate the mold flow during the molding process. A certain blocking effect, so that the mold flow does not directly impact the gold wire, in order to protect the gold wire to a certain extent.
  • the circuit board 101 may be a printed wiring board. In this embodiment, by placing the mounting area of the first electronic component 1061 at a position corresponding to the extension line 1021a of the first side 1021, the liquid mold flow to the first metal line during the molding process is blocked or at least partially blocked. Direct impact of 1041.
  • the mounting area of the first electronic component 1061 when the mounting area of the first electronic component 1061 is not located on the extension line 1021a of the first side 1021, as long as the first electronic component 1061 can partially block the flow of the liquid mold during the molding process.
  • the direct impact of the wire 1041 is considered to be the position at which the first electronic component 1061 is mounted adjacent to the extension line 1021a of the first side 1021.
  • the metal line can be a gold wire.
  • the two ends of the metal wire may be soldered to the solder joints of the photosensitive element 102 and the circuit board 101 by a "wire bonding" process, thereby electrically connecting the photosensitive element 102 and the circuit board 101 to be photosensitive.
  • the image data received by element 102 is output.
  • the solder joint of the photosensitive element 102 is the terminal of the photosensitive element 102.
  • the solder joint of the wiring board 101 is the terminal of the wiring board 101.
  • the photosensitive element 102 has a plurality of first terminals disposed along the first side 1021, the circuit board 101 has a plurality of second terminals, and the second terminals are along the One side 1021 is disposed on the circuit board 101 and the second terminal is in one-to-one correspondence with the first terminal; the metal line connects the first terminal and the second terminal corresponding thereto.
  • a dimension of the first electronic component 1061 in a direction perpendicular to the first side 1021 and a projection of the first metal line 1041 on a surface of the circuit board 101 are perpendicular to the first Dimensional adaptation in the direction of one side 1021.
  • FIG. 2 being a top view
  • the first metal line 1041 shown in the drawing is substantially identical to the projection of the first metal line 1041 on the surface of the circuit board 101.
  • the length direction is perpendicular to the first side 1021 (as shown in FIG. 2) to prevent the mold flow from directly impacting the first metal line 1041 across the first side 1021.
  • the mold flow means a mold flow formed by the liquid molding material during the molding of the molded portion 103.
  • the width direction of the first electronic component 1061 may be perpendicular to the first side 1021 (as shown in FIG. 3, FIG. 3 is a schematic top view of the photosensitive component in another embodiment of the present invention.
  • the molded portion is not shown in the figure to more clearly show the positional relationship of the photosensitive member, the metal wire, and the electronic component.
  • the first electronic component 1061 has a relatively small blockage of the mold flow, which facilitates the filling of the molding material throughout the forming cavity.
  • the above embodiment can reduce the risk of damage of the gold wire in the molding process to a certain extent without adding unnecessary parts and changing the mold; and can increase the production yield and reduce the manufacturing cost.
  • a plurality of first terminals and a plurality of second terminals disposed along the first side 1021 define a strip-shaped wire arrangement region 1040.
  • the strip-shaped wire arrangement area 1040 covers the first side 1041.
  • the mounting area of the first electronic component 1061 is located at the extension 1040a of the strip-shaped metal wire arrangement area 1040.
  • the first electronic component 1061 may completely cover the extension portion 1040a of the metal wire arrangement region 1040 (as shown in FIG. 2) in a direction perpendicular to the first side, or may be perpendicular to the first side.
  • the upper portion covers the extension 1040a of the wire routing region 1040 (shown in Figure 3).
  • the mounting region of the first electronic component 1061 corresponds to the An extension line 1021a of the first side 1021.
  • Fig. 4 shows a schematic plan view of a photosensitive member in still another embodiment of the present invention, in which a molded portion is not shown to more clearly show the positional relationship of the photosensitive member, the metal wire, and the electronic component.
  • the line connecting the first terminal and the second terminal corresponding thereto is not perpendicular to the first side 1021.
  • the projection of the first metal line 1041 on the surface of the circuit board 101 is not perpendicular to the first side 1021. This oblique "wire" design helps to reduce the stencil impact experienced by the first wire 1041.
  • the length of the first metal line 1041 is difficult to be infinitely reduced, if a tilt "wire” method is used (ie, the projection of the first metal line 1041 on the surface of the circuit board 101 and the The first side 1021 is not perpendicular), then it helps to reduce the stress surface of the first metal wire 1041 which is subjected to the mold flow impact (because the tilt "wire” can reduce the first metal wire 1041 on the circuit board
  • the projection of the surface of 101 is in a dimension perpendicular to the direction of the first side 1021. In this way, the size of the first electronic component 1061 in the direction perpendicular to the first side 1021 can also be reduced.
  • the first electron can be made.
  • the width direction of the element 1061 is perpendicular to the first side 1021.
  • the first electronic component 1061 has a relatively small blockage of the mold flow, which is advantageous for the molding material to fill the entire forming cavity.
  • the inclined surface is “wired”, the force receiving surface of the first metal wire 1041 subjected to the dies flow is reduced, so that the width of the first electronic component 1061 and the reduced first metal are
  • the projection of the line 1041 on the surface of the wiring board 101 in the direction perpendicular to the first side 1021 is adapted to effectively block the direct impact of the mold flow on the first metal line 1041.
  • the photosensitive assembly further includes a second metal line 1042 and a second electronic component 1062.
  • the second metal line 1042 electrically connects the photosensitive element 102 and the wiring board 101, and the second metal line 1042 spans the second side 1022.
  • a second electronic component 1062 is mounted on the circuit board 101 and a mounting area of the second electronic component 1062 is located on an extension of the second side 1022.
  • the molding portion also covers the second electronic component 1062 and the second metal line 1042. Similar to the first metal line 1041, the second metal line 1042 spanning the second side 1022 is also susceptible to the impact of the mold flow.
  • the second electronic component 1062 is thus mounted at a location corresponding to the extension of the second side 1022 to block direct impact of the mold flow on the second metal line 1042.
  • the "wire" process of the second metal line 1042 can be consistent with the "wire" mode of the first metal line 1041 of the previous embodiment.
  • the second metal line 1042 can also be tilted "wired" (ie, the projection of the second metal line 1042 on the surface of the circuit board 101 is not perpendicular to the second side 1022).
  • the photosensitive element 102 has a third side that intersects the first side 1021.
  • the photosensitive member further includes a third metal wire.
  • a third metal line electrically connects the photosensitive element 102 and the wiring board 101, and the third metal line spans the third side.
  • the projection of the third metal line on the surface of the circuit board 101 is parallel or substantially parallel to the first side 1021, so that the third metal wire is subjected to a small impact of the mold flow.
  • the third metal wire may also adopt a tilt "wire" manner.
  • Fig. 5 shows a schematic plan view of the photosensitive member panel in one embodiment of the present invention, in which the molded portion is not shown to more clearly show the positional relationship of the photosensitive member, the metal wire, and the electronic component.
  • the photosensitive member assembly includes a wiring board assembly, a plurality of photosensitive members 102, a plurality of first metal wires 1041, a plurality of first electronic components 1061, and a molding portion (the molding portion is not shown in FIG. 5).
  • the circuit board assembly includes a plurality of circuit board units 101a. A plurality of photosensitive members 102 are mounted in a row in the first direction (the direction indicated by the arrow in FIG.
  • each photosensitive member 102 is located on one of the wiring board units 101a, and each of the substrates
  • the photosensitive elements 102 each have a first side 1021 that is parallel to the first direction.
  • a plurality of first metal lines 1041 electrically connecting each of the photosensitive elements 102 and a wiring board unit 101a corresponding to the photosensitive elements 102, and the first metal lines 1041 span the first side of the photosensitive elements 102 1021.
  • a plurality of first electronic components 1061 are respectively mounted on each of the wiring board units 101a and a mounting area of the first electronic components 1061 is located on an extension line of the first side 1021 of the corresponding photosensitive element 102.
  • a molding portion is formed on the wiring board panel and surrounds each of the photosensitive members 102, and the molding portion extends toward each of the photosensitive members 102 to cover the corresponding first electronic components 1061 and
  • the first metal wire 1041 is in contact with the surface of the photosensitive member 102; and the wiring board region between adjacent photosensitive members 102 is covered by the molding portion to form the molding portion as a whole.
  • each of the photosensitive elements 102 has a plurality of first terminals disposed along the first side 1021, and the circuit board unit 101a corresponding to the photosensitive elements 102 has a plurality of second terminals.
  • the second terminal is disposed on the circuit board unit 101a along the first side 1021 and is in one-to-one correspondence with the first terminal; the metal wire connects the first terminal and the corresponding portion thereof Two terminals.
  • each of the photosensitive elements 102 further has a second side 1022 opposite the first side 1021.
  • the photosensitive assembly panel further includes a plurality of second metal lines 1042 and a plurality of second electronic components 1062.
  • a plurality of second metal lines 1042 electrically connect each of the photosensitive elements 102 and the corresponding wiring board unit 101a thereof, and the second metal lines 1042 span the second side 1022.
  • a plurality of second electronic components 1062 are mounted on each of the wiring board units 101a and a mounting area of the second electronic components 1062 is located on an extension line of the second side 1022 of the corresponding photosensitive element 102.
  • the molding portion covers the first electronic component 1061, the first metal wire 1041, the second electronic component 1062, and the second metal wire 1042.
  • each of the photosensitive elements 102 further has a third side that intersects the first side 1021; and the photosensitive assembly panel further includes a plurality of third metal lines, which will each The photosensitive member 102 is electrically connected to the corresponding wiring board unit 101a, and the third metal line spans the third side.
  • the photosensitive assembly may have two first sides 1021 that are parallel to each other, and two third sides that are parallel to each other (the third side intersects the first side 1021).
  • the photosensitive assembly may have a plurality of first metal lines 1041 and a plurality of first electronic components 1061 respectively corresponding to the two first sides 1021.
  • the photosensitive member may also have only the first metal line 1041 spanning one of the first sides 1021 and the corresponding first electronic component 1061.
  • the electronic components may be disposed at a boundary between the third side of the photosensitive member 102 and the corresponding circuit board unit 101a (the boundary and the third side of the circuit board unit 101a) The area of the board unit 101a between substantially parallel).
  • the circuit board panel is a soft and hard bonding board.
  • the circuit board panel includes at least one hard board area 1010 (refer to FIG. 5) to which the plurality of photosensitive elements 102 are mounted.
  • Each of the hard board regions includes two rows of circuit board units 101a, and one of the photosensitive elements 102 is mounted on each of the circuit board units 101a. It should be noted that in other embodiments, only one row of circuit board units 101a may be provided for each of the hard board regions.
  • the hard board region 1010 further includes a non-wiring area 1012 (refer to FIG. 5) between the two rows of board unit 101a.
  • the photosensitive member is obtained by cutting a photosensitive member assembly having a non-wiring area as described above, and the non-wiring area 1012 is cut off, so that the photosensitive member has a small radial size (the radial size means vertical) The size of the camera module in the optical axis direction).
  • the provision of the non-wiring area 1012 between the two rows of circuit board units 101a helps to widen the main flow path of the mold flow, thereby making it easier for the mold flow to fill the entire forming cavity.
  • any two adjacent circuit board units 101a have a common boundary in order to reduce the number of times the photosensitive member panel is cut into photosensitive members. At the same time, it saves molding materials and circuit board materials.
  • a method for fabricating a photosensitive component panel including:
  • Step 1 Prepare the panel to be molded.
  • Fig. 6 shows a perspective view of an example of a panel to be molded.
  • the panel to be molded includes: a wiring board, a plurality of photosensitive elements 102, a plurality of first metal lines 1041, and a plurality of first electronic components 1061.
  • the circuit board panel includes at least one hard board area 1010, and the hard board area 1010 includes a plurality of circuit board units 101a.
  • a plurality of photosensitive elements 102 are mounted in a row on the circuit board assembly 1010, each photosensitive element 102 is located on a circuit board unit 101a, and each of the photosensitive elements 102 has a first side 1021, the first One side 1021 is parallel to the arrangement direction of the photosensitive elements 102 in a single row.
  • a plurality of first metal lines 1041 electrically connect each of the photosensitive elements 102 and a wiring board unit 101a corresponding to the photosensitive elements 102, and the first metal lines 1041 span the first side 1021 of the photosensitive elements 102 .
  • a plurality of first electronic components 1061 are respectively mounted on each of the wiring board units 101a to block or slow the impact of the mold flow on the first metal wires 1041 during molding.
  • the mounting area of the first electronic component 1061 is located on an extension line of the first side 1021 of the corresponding photosensitive element 102 to block or slow the mold flow to the first metal line during molding. The impact of 1061.
  • the board panel may be a soft and hard bond board, the soft board area forming a strap 108 and a connector 109.
  • the connecting strip 108 is electrically connected to the hard board area through the side of the hard board area 1010 to reduce the size of the finished photosensitive member.
  • Step 2 pressing the mold to be molded by a mold to form a forming cavity between the mold and the panel to be molded.
  • Figure 7 is a cross-sectional view showing a cross-section of the mold in a preferred embodiment of the present invention, which is perpendicular to the first side 1021. Only a single row of circuit board units are shown in Figure 6, but it will be understood that each hard board area 1010 can be provided with two rows of circuit board units (as shown in Figure 5).
  • the hard plate region 1010 shown in FIG. 7 is provided with two rows of circuit board units, and the mold 201 is pressed against the hard plate region 1010 to form a forming cavity 202.
  • the first side 1021 and the opposite second side 1022 are all in the forming cavity 202, spanning the metal of the first side 1021 and the second side 1022
  • the wires are also all in the forming cavity 202.
  • Two photosensitive elements 102 are mounted on the left and right sides of Fig. 7, respectively.
  • the photosensitive elements 102 on the left and right sides in Fig. 7 correspond to the photosensitive elements 102 in the upper and lower rows in Fig. 5, respectively.
  • the forming cavity 201 includes a plurality of forming cavity units, each of which forms one of the wiring board units 101a, and the plurality of forming cavity units are in communication with each other.
  • Step 3 injecting a liquid molding material into the forming cavity, filling the molding cavity with the molding cavity, thereby forming a molding portion on the wiring board panel, wherein the injection molding material is injected
  • the injection direction (the arrow in FIG. 5 shows the injection direction) is parallel to the first side 1021.
  • the liquid molding material is vertically injected in a direction from the paper to the back of the paper.
  • Fig. 8 is a schematic cross-sectional view showing the filling of the liquid molding material on the basis of Fig. 7.
  • 301 denotes a liquid molding material. Since the plurality of forming cavity units are in communication with each other, the molded portion formed by molding surrounds each of the photosensitive members 102, and the molding portion extends toward each of the photosensitive members 102 to cover the corresponding first portion The electronic component 1061 and the first metal line are in contact with the surface of the photosensitive element 102; and the wiring board area between adjacent photosensitive elements 102 is covered by the molding portion to make the molding portion Form a whole.
  • the circuit board panel is a soft and hard bonding board
  • the soft and hard bonding board includes at least one hard board area
  • the plurality of photosensitive elements 102 are mounted on the hard board. Area.
  • each of the hard board regions of the board panel may be provided with only one row of the board unit 101a, so that the molding material is liable to fill the entire forming chamber.
  • the injection position of the liquid molding material includes a region between the photosensitive member and the upper edge of the hard plate region, and a region between the photosensitive member and the lower edge of the hard plate region.
  • the injection direction of the liquid molding material is a direction substantially parallel to the first side 1021.
  • the single hard plate region has two molding material flow paths, so that the mold flow is more likely to fill the entire forming cavity, thereby avoiding the appearance defect of the jig molding portion, thereby improving the yield.
  • the arrows in Fig. 2 show the injection direction and the injection position of the liquid molding material.
  • Fig. 9 is a perspective view showing the imposition of the photosensitive member after molding in one embodiment. It can be seen that the photosensitive component imposition comprises four hard plate regions, and each hard plate region is provided with a single row of circuit board units (ie, a single row of photosensitive components is disposed). The arrows in Fig. 9 show the injection direction of the liquid molding material. It can be seen that the injection direction is substantially parallel to the first side 1021. It should be noted that the complete panel is not shown in FIG. 2. In this embodiment, the portion shown in FIG. 2 can be understood as one of the circuit board units corresponding to FIG.
  • each of the hard board regions includes two rows of circuit board units 101a, and each of the circuit board units 101a is mounted with one of the photosensitive elements, and the hard board area further includes A non-wiring area between the two rows of circuit board units 101a.
  • the liquid molding material is injected from the position of the non-wiring area (the arrow in Fig. 5 shows the injection position).
  • the area between the two rows of photosensitive elements in the forming chamber serves as a corresponding flow path in which the liquid molding material flows from left to right and fills the entire forming chamber.
  • the injection position of the liquid molding material includes a region between two rows of photosensitive elements, an area between the first row of photosensitive elements and an upper edge of the hard plate region, And an area between the second row of photosensitive elements and the lower edge of the hard plate region.
  • the first row of photosensitive elements is a row of photosensitive elements
  • the second row of photosensitive elements is a row of photosensitive elements.
  • the direction in which the liquid molding material is injected is substantially parallel to the first side 1021, such as the direction from left to right in FIG.
  • the molding material has three flow paths.
  • the forming cavity 202 includes three sections that correspond to the three flow channels, respectively. With respect to a single flow path, the three flow paths make it easier for the mold flow to fill the entire forming cavity, avoiding the appearance of defects in the molded part of the panel, thereby improving the yield.
  • Fig. 10 shows the positional relationship between the electronic component and the metal wire in the photosensitive member of the present invention.
  • the viewing angle of Fig. 10 is identical to that of Figs. 7 and 8, and the portion blocked by the electronic component is indicated by a broken line. It can be seen that both the first side 1021 and the first metal line 1041 are blocked by the first electronic component 1061, and the second side 1022 and the second metal line 1042 are both blocked by the second electronic component 1062.
  • the first electronic component 1061 can block or slow the impact of the mold flow in the flow channel on the first metal wire 1041
  • the second electronic component 1062 can block or slow the mold flow in the flow channel to the second metal wire.
  • the impact of 1042 is the positional relationship between the electronic component and the metal wire in the photosensitive member of the present invention.
  • the viewing angle of Fig. 10 is identical to that of Figs. 7 and 8, and the portion blocked by the electronic component is indicated by a broken line.

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Abstract

一种感光组件，包括：线路板(101)；感光元件(102)，安装在所述线路板(101)上，并且所述感光元件(102)具有第一边(1021)；第一金属线(1041)，将所述感光元件(102)和所述线路板(101)电连接，并且所述第一金属线(1041)跨越所述第一边(1021)；第一电子元件(1061)，安装在所述线路板(101)上并且所述第一电子元件(1061)的安装区域对应于所述第一边(1021)的延伸线(1021a)；以及模塑部(103)，形成在所述线路板(101)上并围绕所述感光元件(102)，并且所述模塑部(103)向所述感光元件(102)延伸、覆盖所述第一电子元件(1061)和所述第一金属线(1041)、并接触所述感光元件(102)的表面。还提供了相应的摄像模组(100)、感光组件拼板及其制作方法，可以在不增加多余部件以及改变模具的情况下，在一定程度上，减小在模塑工艺中金线被损坏的风险。

Description

感光组件、摄像模组、感光组件拼板及相应制作方法
相关申请的交叉引用
本申请要求于2017年12月19日向中国国家知识产权局提交的第201711378319.8号和201721782486.4号中国专利申请的优先权和权益，该申请的全部内容通过引用并入本文。
技术领域
本发明涉及摄像模组技术领域。
背景技术
目前摄像模组行业越来越向小型化发展，从而以满足现在智能终端的集成化和小型化的要求，而目前对摄像模组小型化最大的阻碍就是印刷电路板(也可称为线路板)，因为为了保证印刷电路板的强度以防止其变形，则印刷电路板的厚度存在难以突破的极限，这就导致摄像模组或感光组件的轴向尺寸(指沿着光轴方向上的尺寸)难以进一步地减小。
另一方面，近年来全面屏手机成为了一个预见的手机发展大趋势，全面屏手机一般是指正面屏占比达到80％以上的手机，采用极限超窄边框屏幕，相比普通手机，外观优势明显，能够给手机使用者带来更加震撼的视觉体验，可以预见有众多手机厂商愿意采用全面屏方案。随着全面屏潮流的兴起，手机的前置摄像模组必然需要布置在手机的极为靠近边框(比如顶侧或底侧的边框)。这就对摄像模组的径向尺寸(指垂直于光轴的方向上的尺寸)提出了更高的要求。
为此，申请人提出了一种MOC解决方案。该方案中，通过将感光芯片的非感光区域以及印刷电路板其他区域模塑封装成一体，使得印刷电路板能够更加轻薄，且摄像模组中的电子元件的排布也能更加密集，从而满足目前行业内的小型化的需求。MOC方案中，通过模塑 工艺在线路板上形成模塑部，该模塑部覆盖感光芯片的边缘部分(即覆盖感光芯片非感光区的至少一部分)以及将感光芯片与线路板电连接的金线。该方案能够有效地减小感光组件的径向尺寸(指垂直于光轴的方向上的尺寸)以及轴向尺寸(指沿着光轴方向上的尺寸)，进而帮助减小摄像模组的尺寸，受到市场的普遍欢迎。
然而，MOC摄像模组在制作工艺上还存在一些需要改进之处。例如，MOC方案中，模塑需要将感光芯片的非感光区域与芯片周边区域全部都封装成一体，也就是说摄像模组的金线(连接感光芯片与线路板的金线)也需要被模塑部包裹，而通常的模塑方案为在模具中注入液化的EMC材料进行，这也就导致了在注入EMC材料时存在模流将金线冲断的现象发生，从而产生不良品。而由于模塑工艺本身的特点，此类不良品无法进行返修，这也就使得此类不良品只能完全报废，也就增加了摄像模组成品的制造难度。
发明内容
本发明旨在提供一种能够克服现有技术的上述至少一个缺陷的解决方案。
根据本发明的一个方面，提供了一种感光组件，包括：
线路板；
感光元件，安装在所述线路板上，并且所述感光元件具有第一边；
第一金属线，将所述感光元件和所述线路板电连接，并且所述第一金属线跨越所述第一边；
第一电子元件，安装在所述线路板上并且所述第一电子元件的安装区域对应于所述第一边的延伸线；以及
模塑部，形成在所述线路板上并围绕所述感光元件，并且所述模塑部向所述感光元件延伸、覆盖所述第一电子元件和所述第一金属线、并接触所述感光元件的表面。
其中，所述感光元件具有沿着所述第一边设置的多个第一端子，所述线路板具有多个第二端子，所述第二端子沿着所述第一边设置在所述线路板上并且所述第二端子与所述第一端子一一对应；所述金属 线将所述第一端子和与其对应的所述第二端子连接。
其中，所述感光元件还具有与所述第一边相对的第二边；
所述感光组件还包括：
第二金属线，将所述感光元件和所述线路板电连接，并且所述第二金属线跨越所述第二边；以及
第二电子元件，安装在所述线路板上并且所述第二电子元件的安装区域位于所述第二边的延伸线上；
其中，所述模塑部还覆盖所述第二电子元件和所述第二金属线。
其中，所述感光元件还具有与所述第一边交叉的第三边；并且所述感光组件还包括第三金属线，其将所述感光元件和所述线路板电连接，并且所述第三金属线跨越所述第三边。
其中，所述第一电子元件在垂直于所述第一边方向上的尺寸与所述第一金属线在所述线路板表面的投影的在垂直于所述第一边方向上的尺寸适配。
其中，所述第一端子和与其对应的所述第二端子的连线与所述第一边不垂直。
根据本发明的另一方面，还提供了一种感光组件拼板，包括:
线路板拼板，其包括多个线路板单元；
多个感光元件，沿着第一方向成排地安装在所述线路板拼板上，每个感光元件位于一个线路板单元上，并且每个所述感光元件均具有与所述第一方向平行的第一边；
多条第一金属线，将每个所述感光元件和与该感光元件对应的线路板单元电连接，并且所述第一金属线跨越该感光元件的所述第一边；
多个第一电子元件，分别安装在每个所述线路板单元上并且所述第一电子元件的安装区域位于对应的感光元件的所述第一边的延伸线上；以及
模塑部，形成在所述线路板拼板上并围绕每个所述感光元件，并且所述模塑部向每个所述感光元件延伸、覆盖对应的所述第一电子元件和所述第一金属线、并接触所述感光元件的表面；并且相邻感光元件之间的线路板拼板区域均被所述模塑部覆盖以使所述模塑部形成一 个整体。
其中，每个所述感光元件具有沿着所述第一边设置的多个第一端子，与该感光元件对应的所述线路板单元具有多个第二端子，所述第二端子沿着所述第一边设置在所述线路板单元上并与所述第一端子一一对应；所述金属线连接所述第一端子和与其对应的所述第二端子。
其中，每个所述感光元件还具有与所述第一边相对的第二边；
所述感光组件拼板还包括：
多条第二金属线，将每个所述感光元件和与其对应的所述线路板单元电连接，并且所述第二金属线跨越所述第二边；以及
多个第二电子元件，安装在每个所述线路板单元上并且所述第二电子元件的安装区域位于对应的感光元件的所述第二边的延伸线上；
其中，所述模塑部还覆盖所述第二电子元件和所述第二金属线。
其中，每个所述感光元件还具有与所述第一边交叉的第三边；并且所述感光组件拼板还包括多条第三金属线，其将每个所述感光元件和与其对应的所述线路板单元电连接，并且所述第三金属线跨越所述第三边。
其中，所述线路板拼板为软硬结合板。
其中，所述线路板拼板包括至少一个硬板区，所述多个感光元件安装于所述硬板区。
其中，每个所述硬板区包括两排线路板单元，每个线路板单元上安装一个所述的感光元件。
其中，所述硬板区还包括位于两排线路板单元之间的非布线区。
其中，对于每排线路板单元，其中任意两个相邻的线路板单元具有共同的边界。
其中，所述感光组件通过切割前述的感光组件拼板得到。
其中，所述感光组件通过切割前述的线路板拼板具有非布线区的感光组件拼板得到，并且所述非布线区被切除。
根据本发明的另一方面，还提供了一种摄像模组，包括前述的感光组件。
根据本发明的另一方面，还提供了一种感光组件拼板制作方法，包括：
步骤1，准备待模塑拼板，所述待模塑拼板包括：
线路板拼板，其包括多个线路板单元；
多个感光元件，成排地安装在所述线路板拼板上，每个感光元件位于一个线路板单元上，并且每个所述感光元件均具有第一边，所述第一边与位于同一排的所述感光元件的排列方向平行；
多条第一金属线，将每个所述感光元件和与该感光元件对应的线路板单元电连接，并且所述第一金属线跨越该感光元件的所述第一边；以及
多个第一电子元件，分别安装在每个所述线路板单元上以阻挡或减缓模塑过程中模流对所述第一金属线的冲击；
步骤2，通过模具压合所述待模塑拼板，在模具和所述待模塑拼板之间形成成形腔；以及
步骤3，向所述成形腔中注入液态模塑材料，使所述模塑材料填充满所述成形腔，进而在所述线路板拼板上形成模塑部；
其中，所述注入液态模塑材料的注入方向与所述第一边平行。
其中，所述步骤1中，所述第一电子元件的安装区域位于对应的感光元件的所述第一边的延伸线上以阻挡或减缓模塑过程中模流对所述第一金属线的冲击。
其中，所述步骤2中，所述成形腔包括多个成形腔单元，每个所述成形腔单元对应于一个所述线路板单元，并且所述多个成形腔单元互相连通。
其中，所述步骤3中，所述模塑部围绕每个所述感光元件，并且所述模塑部向每个所述感光元件延伸、覆盖对应的所述第一电子元件和所述第一金属线、并接触所述感光元件的表面；并且相邻感光元件之间的线路板拼板区域均被所述模塑部覆盖以使所述模塑部形成一个整体。
其中，所述步骤1中，所述线路板拼板为软硬结合板，所述软硬结合板包括至少一个硬板区，所述多个感光元件安装于所述硬板区。
其中，所述步骤1中，每个所述硬板区包括两排线路板单元，每个线路板单元上安装一个所述的感光元件，所述硬板区还包括位于两排线路板单元之间的非布线区；以及
所述步骤3中，所述液态模塑材料从所述非布线区的位置注入。
其中，所述步骤1中，每个所述硬板区包括第一排线路板单元和第二排线路板单元，每个线路板单元上安装一个所述的感光元件；以及
所述步骤3中，所述液态模塑材料的注入位置包括第一排线路板单元和第二排线路板单元之间的区域、第一排感光元件与硬板区第一边缘之间的区域、以及第二排感光元件与硬板区第二边缘之间的区域，其中硬板区第一边缘为靠近第一排感光元件且与所述第一边平行的硬板区边缘，硬板区第二边缘为靠近第二排感光元件且与所述第一边平行的硬板区边缘。
其中，所述步骤1中，每个所述硬板区由单排线路板单元构成，每个线路板单元上安装一个所述的感光元件；以及
所述步骤3中，所述液态模塑材料的注入位置包括感光元件与硬板区第一边缘之间的区域、以及感光元件与硬板区第二边缘之间的区域，其中硬板区第一边缘和硬板区第二边缘是与所述第一边平行的两条硬板区边缘。并且所述感光元件位于这两条硬板区边缘之间。
其中，所述步骤1中，每个所述感光元件具有沿着所述第一边设置的多个第一端子，与该感光元件对应的所述线路板单元具有多个第二端子，所述第二端子沿着所述第一边设置在所述线路板单元上并与所述第一端子一一对应；所述金属线连接所述第一端子和与其对应的所述第二端子。
其中，所述步骤1中，每个所述感光元件还具有与所述第一边相对的第二边；
所述待模塑拼板还包括：
多条第二金属线，将每个所述感光元件和与其对应的所述线路板单元电连接，并且所述第二金属线跨越所述第二边；以及
多个第二电子元件，安装在每个所述线路板单元上并且所述
第二电子元件的安装区域位于对应的感光元件的所述第二边的延
伸线上；
其中，所述模塑部还覆盖所述第二电子元件和所述第二金属线。
其中，所述步骤1中，所述第一电子元件在垂直于所述第一边方向上的尺寸与所述第一金属线在所述线路板表面的投影的在垂直于所述第一边方向上的尺寸适配。
其中，所述步骤1中，所述第一端子和与其对应的所述第二端子的连线与所述第一边不垂直。
根据本发明的另一实施例，还提供了一种感光组件拼板，其前述感光组件拼板制作方法制成。
根据本发明的另一实施例，还提供了一种感光组件，通过切割前述的感光组件拼板得到。
根据本发明的另一实施例，还提供了一种感光组件，所述感光组件通过切割感光组件拼板得到，其中所述感光组件拼板根据前述的感光组件拼板制作方法得到，该感光组件拼板的硬板区包括位于两排线路板单元之间的非布线区；并且切割所述感光组件拼板时，所述非布线区被切除。
根据本发明的另一实施例，还提供了一种摄像模组，其包括前述的感光组件。
与现有技术相比，本发明具有下列至少一个技术效果：
1、本发明可以在不增加多余部件以及改变模具的情况下，在一定程度上，减小在模塑工艺中金线被损坏的风险。
2、本发明增加了制作良率，减少了制作成本。
附图说明
在参考附图中示出示例性实施例。本文中公开的实施例和附图应被视作说明性的，而非限制性的。
图1示出了本发明一个实施例提供的摄像模组的剖面示意图；
图2示出了图1实施例中感光组件的俯视示意图；
图3示出了本发明另一个实施例中感光组件的俯视示意图；
图4示出了本发明又一个实施例中的感光组件的俯视示意图；
图5示出了本发明一个实施例中的感光组件拼板的俯视示意图；
图6示出了待模塑拼板的一个示例的立体示意图；
图7示出了本发明一个实施例中模具压合后的剖面示意图；
图8示出了图7基础上填充了液态模塑材料后的剖面示意图；
图9示出了一个实施例中的模塑完成后的感光组件拼版的立体示意图；
图10示出了本发明感光组件中电子元件和金属线之间的位置关系。
具体实施方式
为了更好地理解本申请，将参考附图对本申请的各个方面做出更详细的说明。应理解，这些详细说明只是对本申请的示例性实施方式的描述，而非以任何方式限制本申请的范围。在说明书全文中，相同的附图标号指代相同的元件。表述“和/或”包括相关联的所列项目中的一个或多个的任何和全部组合。
应注意，在本说明书中，第一、第二等的表述仅用于将一个特征与另一个特征区分开来，而不表示对特征的任何限制。因此，在不背离本申请的教导的情况下，下文中讨论的第一主体也可被称作第二主体。
在附图中，为了便于说明，已稍微夸大了物体的厚度、尺寸和形状。附图仅为示例而并非严格按比例绘制。
还应理解的是，用语“包括”、“包括有”、“具有”、“包含”和/或“包含有”，当在本说明书中使用时表示存在所陈述的特征、整体、步骤、操作、元件和/或部件，但不排除存在或附加有一个或多个其它特征、整体、步骤、操作、元件、部件和/或它们的组合。此外，当诸如“...中的至少一个”的表述出现在所列特征的列表之后时，修饰整个所列特征，而不是修饰列表中的单独元件。此外，当描述本申请的实施方式时，使用“可以”表示“本申请的一个或多个实施方式”。并且，用语“示例性的”旨在指代示例或举例说明。
如在本文中使用的，用语“基本上”、“大约”以及类似的用语用作表近似的用语，而不用作表程度的用语，并且旨在说明将由本领域普通技术人员认识到的、测量值或计算值中的固有偏差。
除非另外限定，否则本文中使用的所有用语(包括技术用语和科学用语)均具有与本申请所属领域普通技术人员的通常理解相同的含义。还应理解的是，用语(例如在常用词典中定义的用语)应被解释为具有与它们在相关技术的上下文中的含义一致的含义，并且将不被以理想化或过度正式意义解释，除非本文中明确如此限定。
需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互组合。下面将参考附图并结合实施例来详细说明本申请。
图1示出了本发明一个实施例提供的摄像模组的剖面示意图，该摄像模组基于在芯片上模塑的工艺(MOC工艺)制作。参考图1，摄像模组100包括线路板101、感光元件102、模塑部103、金属线104以及镜头组件105。其中，线路板101具有第一表面和相反的第二表面，感光元件102安装在线路板101的第一表面上。第二表面则作为线路板101的底面(本文中，线路板的底面均是指所述第二表面)。模塑部103形成在所述线路板101上并围绕所述感光元件102，并且所述模塑部103向所述感光元件102延伸并接触所述感光元件102，使得模塑部103与感光元件102的侧面之间无间隙。金属线104用于将感光元件102与线路板101电连接。该镜头组件105安装在模塑部103上，从而构成完整的摄像模组。镜头组件105包含镜头。在一些实施例中，镜头组件105还可以包含马达，所述镜头安装在马达的载体上，马达基座安装于所述模塑部103上。
摄像模组100通常分为感光组件与镜头组件105两个部分，其中感光组件包括线路板101、感光元件102、模塑部103和金属线104。在制作摄像模组100时，先制作出感光组件，然后再在所述感光组件上安装镜头组件105。
图2示出了图1实施例中感光组件的俯视示意图，该图中未示出 模塑部以便更清楚地示出感光元件、金属线以及电子元件的位置关系。感光组件还包括安装在线路板101上的电子元件。如图2所示，所述感光元件102呈矩形，其具有第一边1021、与第一边1021相对的第二边1022、与第一边1021交叉的第三边1023。所述金属线包括第一金属线1041，第一金属线1041跨越所述第一边1021。第一金属线1041可以具有多条，它们沿着所述第一边1021排列。
电子元件包括第一电子元件1061。第一电子元件1061安装在所述线路板101上并且所述第一电子元件1061的安装区域对应于所述第一边1021的延伸线1021a。对应于所述第一边1021的延伸线1021a，可以是位于所述第一边1021的延伸线1021a上，也可以是位于靠近所述所述第一边1021的延伸线1021a的位置。本实施例中，所述模塑部103覆盖所述第一电子元件1061和所述第一金属线1041并接触所述感光元件102的表面。本实施例中，有意识地将第一电子元件1061排布在与模流方向相垂直(或大致垂直)的金线的侧面，从而使得在进行模塑工艺时，电子元器件能够对模流产生一定的阻挡作用，从而使得模流不会对金线产生直接的冲击作用，以在一定程度上起到保护金线的作用。线路板101可以是印刷线路板。本实施例中，通过将第一电子元件1061的安装区域设置在对应于所述第一边1021的延伸线1021a的位置，来阻挡或至少部分阻挡模塑过程中液态模流对第一金属线1041的直接冲击。在一个实施例中，当第一电子元件1061的安装区域不位于所述第一边1021的延伸线1021a上时，只要该第一电子元件1061能够部分阻挡模塑过程中液态模流对第一金属线1041的直接冲击，即可视为该第一电子元件1061安装于靠近所述第一边1021的延伸线1021a的位置。
在一个实施例中，金属线可以是金线。在实际制作时，可以通过“打线”工艺将金属线的两端焊接在感光元件102和线路板101的焊点上，从而使所述感光元件102和所述线路板101电连接，以便感光元件102所接收的图像数据输出。感光元件102的焊点即感光元件102的端子。线路板101的焊点即线路板101的端子。在一个实施例中，所述感光元件102具有沿着所述第一边1021设置的多个第一端子，所 述线路板101具有多个第二端子，所述第二端子沿着所述第一边1021设置在所述线路板101上并且所述第二端子与所述第一端子一一对应；所述金属线将所述第一端子和与其对应的所述第二端子连接。
在一个实施例中，所述第一电子元件1061在垂直于所述第一边1021方向上的尺寸与所述第一金属线1041在所述线路板101表面的投影的在垂直于所述第一边1021方向上的尺寸适配(由于图2为俯视图，因此图中所示的第一金属线1041实际上与所述第一金属线1041在所述线路板101表面的投影是一致的)。当第一电子元件1061在所述线路板101表面的投影(由于图2为俯视图，该投影实际上与图2中第一电子元件1061的形状一致)为矩形时，可使第一电子元件1061的长度方向与所述第一边1021垂直(如图2所示)，以避免模流直接冲击跨越所述第一边1021的第一金属线1041。这里模流是指模塑所述模塑部103的过程中液体模塑材料所形成的模流。当然，在别的例子中，可使第一电子元件1061的宽度方向与所述第一边1021垂直(如图3所示，图3示出了本发明另一个实施例中感光组件的俯视示意图，该图中未示出模塑部以便更清楚地示出感光元件、金属线以及电子元件的位置关系)。这样，第一电子元件1061对模流的阻滞相对较小，有利于模塑材料填充满整个成形腔。上述实施例能够在不增加多余部件以及改变模具的情况下，在一定程度上，减小在模塑工艺中金线被损坏的风险；并且能增加制作良率，减少了制作成本。
参考图2，在一个实施例中，沿着第一边1021布置的多个第一端子与多个第二端子界定了一个条带状的金属线布置区1040。该条带状的金属线布置区1040涵盖所述第一边1041。第一电子元件1061的安装区域位于条带状的金属线布置区1040的延伸部1040a。本发明中，第一电子元件1061可以在垂直于第一边的方向上完全覆盖所述金属线布置区1040的延伸部1040a(如图2所示)，也可以在垂直于第一边的方向上部分覆盖所述金属线布置区1040的延伸部1040a(如图3所示)。换句话说，只要第一电子元件1061在垂直于第一边的方向上至少部分覆盖所述金属线布置区1040的延伸部1040a，即可视为第一电子元件1061的安装区域对应于所述第一边1021的延伸线1021a。
进一步地，图4示出了本发明又一个实施例中的感光组件的俯视示意图，该图中未示出模塑部以便更清楚地示出感光元件、金属线以及电子元件的位置关系。在图4的实施例中，所述第一端子和与其对应的所述第二端子的连线与所述第一边1021不垂直。这样所述第一金属线1041在所述线路板101表面的投影与所述第一边1021不垂直。这种倾斜“打线”设计有助于减小第一金属线1041所受到的模流冲击。因为“打线”工艺的限制，第一金属线1041的长度难以无限缩小，如果采用倾斜“打线”的方式(即所述第一金属线1041在所述线路板101表面的投影与所述第一边1021不垂直)，那么就有助于减小第一金属线1041受到模流冲击的受力面(因为倾斜“打线”能够减小所述第一金属线1041在所述线路板101表面的投影的在垂直于所述第一边1021方向上的尺寸)。这样，第一电子元件1061在垂直于所述第一边1021方向上的尺寸也可以减小，例如当第一电子元件1061在所述线路板101表面的投影为矩形时，可使第一电子元件1061的宽度方向与所述第一边1021垂直。这样，一方面，第一电子元件1061对模流的阻滞相对较小，有利于模塑材料填充满整个成形腔。另一方面，由于采用倾斜“打线”的方式，第一金属线1041受到模流冲击的受力面被减小，因此只要第一电子元件1061的宽度与减小后的所述第一金属线1041在所述线路板101表面的投影的在垂直于所述第一边1021方向上的尺寸相适配，即可有效地阻挡模流对第一金属线1041的直接冲击。
仍然参考图2，在一个实施例中，所述感光组件还包括：第二金属线1042和第二电子元件1062。第二金属线1042将所述感光元件102和所述线路板101电连接，并且所述第二金属线1042跨越所述第二边1022。第二电子元件1062安装在所述线路板101上并且所述第二电子元件1062的安装区域位于所述第二边1022的延伸线上。所述模塑部还覆盖所述第二电子元件1062和所述第二金属线1042。与第一金属线1041类似，跨越第二边1022的第二金属线1042同样易于收到模流的冲击。因此在对应于所述第二边1022的延伸线的位置上安装第二电子元件1062，以便阻挡模流对第二金属线1042的直接冲击。第二金属线1042的“打线”工艺可以与前述实施例中第一金属线1041的“打 线”方式一致。例如，第二金属线1042同样可以采用倾斜“打线”的方式(即所述第二金属线1042在所述线路板101表面的投影与所述第二边1022不垂直)。
仍然参考图2，在一个实施例中，所述感光元件102具有与所述第一边1021交叉的第三边。并且所述感光组件还包括第三金属线。第三金属线将所述感光元件102和所述线路板101电连接，并且所述第三金属线跨越所述第三边。本实施例中，第三金属线在所述线路板101表面的投影与所述第一边1021平行或大致平行，这样可使第三金属线受到的模流冲击较小。当然，在其它实施例中，第三金属线也可以采用倾斜“打线”的方式。
进一步地，图5示出了本发明一个实施例中的感光组件拼板的俯视示意图，该图中未示出模塑部以便更清楚地示出感光元件、金属线以及电子元件的位置关系。参考图5，感光组件拼板包括线路板拼板、多个感光元件102、多条第一金属线1041、多个第一电子元件1061、以及模塑部(图5中未示出模塑部)。其中线路板拼板包括多个线路板单元101a。多个感光元件102沿着第一方向(图5中箭头所指示的方向)成排地安装在所述线路板拼板上，每个感光元件102位于一个线路板单元101a上，并且每个所述感光元件102均具有与所述第一方向平行的第一边1021。多条第一金属线1041，将每个所述感光元件102和与该感光元件102对应的线路板单元101a电连接，并且所述第一金属线1041跨越该感光元件102的所述第一边1021。多个第一电子元件1061，分别安装在每个所述线路板单元101a上并且所述第一电子元件1061的安装区域位于对应的感光元件102的所述第一边1021的延伸线上。模塑部形成在所述线路板拼板上并围绕每个所述感光元件102，并且所述模塑部向每个所述感光元件102延伸、覆盖对应的所述第一电子元件1061和所述第一金属线1041、并接触所述感光元件102的表面；并且相邻感光元件102之间的线路板拼板区域均被所述模塑部覆盖以使所述模塑部形成一个整体。
在一个实施例中，每个所述感光元件102具有沿着所述第一边1021设置的多个第一端子，与该感光元件102对应的所述线路板单元 101a具有多个第二端子，所述第二端子沿着所述第一边1021设置在所述线路板单元101a上并与所述第一端子一一对应；所述金属线连接所述第一端子和与其对应的所述第二端子。
在一个实施例中，每个所述感光元件102还具有与所述第一边1021相对的第二边1022。所述感光组件拼板还包括：多条第二金属线1042和多个第二电子元件1062。多条第二金属线1042将每个所述感光元件102和与其对应的所述线路板单元101a电连接，并且所述第二金属线1042跨越所述第二边1022。多个第二电子元件1062，安装在每个所述线路板单元101a上并且所述第二电子元件1062的安装区域位于对应的感光元件102的所述第二边1022的延伸线上。所述模塑部覆盖所述第一电子元件1061、所述第一金属线1041、所述第二电子元件1062和所述第二金属线1042。
进一步地，在一个实施例中，每个所述感光元件102还具有与所述第一边1021交叉的第三边；并且所述感光组件拼板还包括多条第三金属线，其将每个所述感光元件102和与其对应的所述线路板单元101a电连接，并且所述第三金属线跨越所述第三边。在一个实施例中，对于矩形感光元件102，其可以具有两条互相平行的第一边1021，以及两条互相平行的第三边(第三边与第一边1021交叉)。所述感光组件可以具有分别对应于两条第一边1021的多条第一金属线1041以及多个第一电子元件1061。所述感光组件也可以仅具有跨越其中一条第一边1021的第一金属线1041以及对应的第一电子元件1061。当感光组件的电路设计需要在线路板上布设较多的电子元件时，这些电子元件可以布置在该感光元件102第三边与对应线路板单元101a边界(该线路板单元101a边界与第三边大致平行)之间的线路板单元101a区域。
在一个实施例中，所述线路板拼板为软硬结合板。所述线路板拼板包括至少一个硬板区1010(参考图5)，所述多个感光元件102安装于所述硬板区1010。每个所述硬板区包括两排线路板单元101a，每个线路板单元101a上安装一个所述的感光元件102。需要注意，在其它实施例中，每个所述硬板区也可以仅设置一排线路板单元101a。
在一个实施例中，所述硬板区1010还包括位于两排线路板单元101a之间的非布线区1012(参考图5)。感光组件通过切割前述的线路板拼板具有非布线区的感光组件拼板得到，并且所述非布线区1012被切除，这样可以保证感光组件具有较小的径向尺寸(径向尺寸是指垂直于摄像模组光轴方向的尺寸)。另一方面，在两排线路板单元101a之间设置非布线区1012，有助于拓宽模流的主要流道，从而使模流更易于填充满整个成形腔。
进一步地，参考图5，在一个实施例中，对于每排线路板单元101a，其中任意两个相邻的线路板单元101a具有共同的边界，以便减少感光组件拼板切割成感光组件的切割次数，同时节省模塑材料以及线路板拼板材料。
根据本发明的另一实施例，还提供了一种感光组件拼板制作方法，包括：
步骤1，准备待模塑拼板。图6示出了待模塑拼板的一个示例的立体示意图。参考图6，所述待模塑拼板包括：线路板拼板、多个感光元件102、多条第一金属线1041以及多个第一电子元件1061。
其中，线路板拼板包括至少一个硬板区1010，硬板区1010包括多个线路板单元101a。多个感光元件102成排地安装在所述线路板拼板1010上，每个感光元件102位于一个线路板单元101a上，并且每个所述感光元件102均具有第一边1021，所述第一边1021与单排所述感光元件102的排列方向平行。多条第一金属线1041将每个所述感光元件102和与该感光元件102对应的线路板单元101a电连接，并且所述第一金属线1041跨越该感光元件102的所述第一边1021。多个第一电子元件1061分别安装在每个所述线路板单元101a上以阻挡或减缓模塑过程中模流对所述第一金属线1041的冲击。
在一个实施例中，所述第一电子元件1061的安装区域位于对应的感光元件102的所述第一边1021的延伸线上以阻挡或减缓模塑过程中模流对所述第一金属线1061的冲击。
在一个实施例中，线路板拼板可以是软硬结合板，软板区域形成连接带108和连接器109。其中连接带108通过硬板区1010的侧面与 所述硬板区电连接，以便减小感光组件成品的尺寸。
步骤2，通过模具压合所述待模塑拼板，在模具和所述待模塑拼板之间形成成形腔。图7示出了本发明一个实施例中模具压合后的剖面示意图，该剖面是垂直于所述第一边1021的剖面。图6中只画出了单排线路板单元，但可以理解，每个硬板区1010可以设置两排线路板单元(如图5所示)。图7所示的硬板区1010就设置了两排线路板单元，模具201压合在硬板区1010上形成成形腔202。第一边1021和与之相对的第二边1022(例如第二边1022可以是与第一边1021平行的相对边)均处于成形腔202中，跨越第一边1021和第二边1022的金属线也均处于成形腔202中。两个感光元件102分别安装在图7的左右两边。图7中左右两边的感光元件102分别对应于图5中的位于上下两排的感光元件102。
进一步地，所述成形腔201包括多个成形腔单元，每个所述成形腔单元对应于一个所述线路板单元101a，并且所述多个成形腔单元互相连通。
步骤3，向所述成形腔中注入液态模塑材料，使所述模塑材料填充满所述成形腔，进而在所述线路板拼板上形成模塑部，其中所述注入液态模塑材料的注入方向(图5中的箭头示出了该注入方向)与所述第一边1021平行。在图7中，液态模塑材料以从纸面向纸背的方向垂直地注入。
图8示出了图7基础上填充了液态模塑材料后的剖面示意图。图8中，301表示液态模塑材料。由于多个成形腔单元互相连通，模塑形成的所述模塑部围绕每个所述感光元件102，并且所述模塑部向每个所述感光元件102延伸、覆盖对应的所述第一电子元件1061和所述第一金属线、并接触所述感光元件102的表面；并且相邻感光元件102之间的线路板拼板区域均被所述模塑部覆盖以使所述模塑部形成一个整体。
在一个实施例中，所述步骤1中，所述线路板拼板为软硬结合板，所述软硬结合板包括至少一个硬板区，所述多个感光元件102安装于所述硬板区。在一个实施例中，线路板拼板的每个硬板区可以仅设置 一排线路板单元101a，这样模塑材料易于充满整个成形腔。本实施例中，液态模塑材料的注入位置包括：感光元件与硬板区上边缘之间的区域、以及感光元件与硬板区下边缘之间的区域。液态模塑材料的注入方向为与所述第一边1021大致平行的方向。该实施例中，单个硬板区具有两个模塑材料流道，使得模流更易于填充满整个成形腔，避免拼板模塑部存在外形缺陷，从而提高良率。图2中的箭头示出了液态模塑材料的注入方向和注入位置。图9示出了一个实施例中的模塑完成后的感光组件拼版的立体示意图。可以看出，该感光组件拼版包括四个硬板区，每个硬板区设置单排线路板单元(即设置单排感光组件)。图9中的箭头示出了液态模塑材料的注入方向。可以看出，该注入方向与第一边1021大致平行。需要注意，图2中并未示出完整的拼板，本实施例中，可以将图2所示的部分理解为图9对应的线路板拼板中的一个线路板单元。
在另一个实施例中，所述步骤1中，每个所述硬板区包括两排线路板单元101a，每个线路板单元101a上安装一个所述的感光元件，所述硬板区还包括位于两排线路板单元101a之间的非布线区。并且，所述步骤3中，所述液态模塑材料从所述非布线区的位置注入(图5中的箭头示出了该注入位置)。这样，成形腔中两排感光元件之间的区域可作为对应的流道，液态模塑材料在该流道中自左向右流动并填充满整个成形腔。本实施例中，在两排线路板单元101a之间设置非布线区，有助于拓宽模流的主要流道，从而使模流更易于填充满整个成形腔。进一步地，仍然参考图5，在一个优选实施例中，所述液态模塑材料的注入位置包括两排感光元件之间的区域、第一排感光元件与硬板区上边缘之间的区域、以及第二排感光元件与硬板区下边缘之间的区域。其中第一排感光元件为靠上的一排感光元件，第二排感光元件为靠下的一排感光元件。液态模塑材料的注入方向与所述第一边1021大致平行的方向，例如图5中自左向右的方向。该实施例中，模塑材料具有三个流道。参考图7和图8，成形腔202包括三个部分，这三个部分分别对应于所述的三个流道。相对于单个流道，三个流道可使得模流更易于填充满整个成形腔，避免拼板模塑部存在外形缺陷，从 而提高良率。
进一步地，图10示出了本发明感光组件中电子元件和金属线之间的位置关系。图10的视角与图7和图8一致，被电子元件遮挡的部分用虚线表示。可以看出第一边1021和第一金属线1041均被第一电子元件1061遮挡，第二边1022和第二金属线1042均被第二电子元件1062遮挡。这样，在模塑过程中，第一电子元件1061可阻挡或减缓流道中的模流对第一金属线1041的冲击，第二电子元件1062可阻挡或减缓流道中的模流对第二金属线1042的冲击。
以上描述仅为本申请的较佳实施方式以及对所运用技术原理的说明。本领域技术人员应当理解，本申请中所涉及的发明范围，并不限于上述技术特征的特定组合而成的技术方案，同时也应涵盖在不脱离所述发明构思的情况下，由上述技术特征或其等同特征进行任意组合而形成的其它技术方案。例如上述特征与本申请中公开的(但不限于)具有类似功能的技术特征进行互相替换而形成的技术方案。

Claims (33)

  1. 一种感光组件，其特征在于，包括：
    线路板；
    感光元件，安装在所述线路板上，并且所述感光元件具有第一边；
    第一金属线，将所述感光元件和所述线路板电连接，并且所述第一金属线跨越所述第一边；
    第一电子元件，安装在所述线路板上并且所述第一电子元件的安装区域对应于所述第一边的延伸线；以及
    模塑部，形成在所述线路板上并围绕所述感光元件，并且所述模塑部向所述感光元件延伸、覆盖所述第一电子元件和所述第一金属线、并接触所述感光元件的表面。
  2. 根据权利要求1所述的感光组件，其特征在于，所述感光元件具有沿着所述第一边设置的多个第一端子，所述线路板具有多个第二端子，所述第二端子沿着所述第一边设置在所述线路板上并且所述第二端子与所述第一端子一一对应；所述金属线将所述第一端子和与其对应的所述第二端子连接。
  3. 根据权利要求1所述的感光组件，其特征在于，所述感光元件还具有与所述第一边相对的第二边；
    所述感光组件还包括：
    第二金属线，将所述感光元件和所述线路板电连接，并且所述第二金属线跨越所述第二边；以及
    第二电子元件，安装在所述线路板上并且所述第二电子元件的安装区域对应于所述第二边的延伸线；
    其中，所述模塑部还覆盖所述第二电子元件和所述第二金属线。
  4. 根据权利要求1～3中任意一项所述的感光组件，其特征在于，所述感光元件还具有与所述第一边交叉的第三边；并且所述感光组件 还包括第三金属线，其将所述感光元件和所述线路板电连接，并且所述第三金属线跨越所述第三边。
  5. 根据权利要求1所述的感光组件，其特征在于，所述第一电子元件在垂直于所述第一边方向上的尺寸与所述第一金属线在所述线路板表面的投影的在垂直于所述第一边方向上的尺寸适配。
  6. 根据权利要求2所述的感光组件，其特征在于，所述第一端子和与其对应的所述第二端子的连线与所述第一边不垂直。
  7. 一种感光组件拼板，其特征在于，包括:
    线路板拼板，其包括多个线路板单元；
    多个感光元件，沿着第一方向成排地安装在所述线路板拼板上，每个感光元件位于一个线路板单元上，并且每个所述感光元件均具有与所述第一方向平行的第一边；
    多条第一金属线，将每个所述感光元件和与该感光元件对应的线路板单元电连接，并且所述第一金属线跨越该感光元件的所述第一边；
    多个第一电子元件，分别安装在每个所述线路板单元上并且所述第一电子元件的安装区域对应于相应的感光元件的所述第一边的延伸线；以及
    模塑部，形成在所述线路板拼板上并围绕每个所述感光元件，并且所述模塑部向每个所述感光元件延伸、覆盖对应的所述第一电子元件和所述第一金属线、并接触所述感光元件的表面；并且相邻感光元件之间的线路板拼板区域均被所述模塑部覆盖以使所述模塑部形成一个整体。
  8. 根据权利要求7所述的感光组件拼板，其特征在于，每个所述感光元件具有沿着所述第一边设置的多个第一端子，与该感光元件对应的所述线路板单元具有多个第二端子，所述第二端子沿着所述第一边设置在所述线路板单元上并与所述第一端子一一对应；所述金属 线连接所述第一端子和与其对应的所述第二端子。
  9. 根据权利要求8所述的感光组件拼板，其特征在于，每个所述感光元件还具有与所述第一边相对的第二边；
    所述感光组件拼板还包括：
    多条第二金属线，将每个所述感光元件和与其对应的所述线路板单元电连接，并且所述第二金属线跨越所述第二边；以及
    多个第二电子元件，安装在每个所述线路板单元上并且所述第二电子元件的安装区域对应于相应的感光元件的所述第二边的延伸线；
    其中，所述模塑部还覆盖所述第二电子元件和所述第二金属线。
  10. 根据权利要求7～9中任意一项所述的感光组件拼板，其特征在于，每个所述感光元件还具有与所述第一边交叉的第三边；并且所述感光组件拼板还包括多条第三金属线，其将每个所述感光元件和与其对应的所述线路板单元电连接，并且所述第三金属线跨越所述第三边。
  11. 根据权利要求7～9中任意一项所述的感光组件拼板，其特征在于，所述线路板拼板为软硬结合板。
  12. 根据权利要求11所述的感光组件拼板，其特征在于，所述线路板拼板包括至少一个硬板区，所述多个感光元件安装于所述硬板区。
  13. 根据权利要求12所述的感光组件拼板，其特征在于，每个所述硬板区包括两排线路板单元，每个线路板单元上安装一个所述的感光元件。
  14. 根据权利要求13所述的感光组件拼板，其特征在于，所述 硬板区还包括位于两排线路板单元之间的非布线区。
  15. 根据权利要求13所述的感光组件拼板，其特征在于，对于每排线路板单元，其中任意两个相邻的线路板单元具有共同的边界。
  16. 一种感光组件，其特征在于，所述感光组件通过切割权利要求7～15中任意一项所述的感光组件拼板得到。
  17. 一种感光组件，其特征在于，所述感光组件通过切割权利要求14所述的感光组件拼板得到，其中所述非布线区被切除。
  18. 一种摄像模组，其特征在于，包括权利要求1～6、16和17中任意一项所述的感光组件。
  19. 一种感光组件拼板制作方法，其特征在于，包括：
    步骤1，准备待模塑拼板，所述待模塑拼板包括：
    线路板拼板，其包括多个线路板单元；
    多个感光元件，成排地安装在所述线路板拼板上，每个感光元件位于一个线路板单元上，并且每个所述感光元件均具有第一边，所述第一边与位于同一排的所述感光元件的排列方向平行；
    多条第一金属线，将每个所述感光元件和与该感光元件对应的线路板单元电连接，并且所述第一金属线跨越该感光元件的所述第一边；以及
    多个第一电子元件，分别安装在每个所述线路板单元上以阻挡或减缓模塑过程中模流对所述第一金属线的冲击；
    步骤2，通过模具压合所述待模塑拼板，在模具和所述待模塑拼板之间形成成形腔；以及
    步骤3，向所述成形腔中注入液态模塑材料，使所述模塑材料填充满所述成形腔，进而在所述线路板拼板上形成模塑部；
    其中，所述注入液态模塑材料的注入方向与所述第一边平行。
  20. 根据权利要求19所述的感光组件拼板制作方法，其特征在于，所述步骤1中，所述第一电子元件的安装区域位于对应的感光元件的所述第一边的延伸线上以阻挡或减缓模塑过程中模流对所述第一金属线的冲击。
  21. 根据权利要求19所述的感光组件拼板制作方法，其特征在于，所述步骤2中，所述成形腔包括多个成形腔单元，每个所述成形腔单元对应于一个所述线路板单元，并且所述多个成形腔单元互相连通。
  22. 根据权利要求19所述的感光组件拼板制作方法，其特征在于，所述步骤3中，所述模塑部围绕每个所述感光元件，并且所述模塑部向每个所述感光元件延伸、覆盖对应的所述第一电子元件和所述第一金属线、并接触所述感光元件的表面；并且相邻感光元件之间的线路板拼板区域均被所述模塑部覆盖以使所述模塑部形成一个整体。
  23. 根据权利要求19所述的感光组件拼板制作方法，其特征在于，所述步骤1中，所述线路板拼板为软硬结合板，所述软硬结合板包括至少一个硬板区，所述多个感光元件安装于所述硬板区。
  24. 根据权利要求23所述的感光组件拼板制作方法，其特征在于，所述步骤1中，每个所述硬板区包括两排线路板单元，每个线路板单元上安装一个所述的感光元件，所述硬板区还包括位于两排线路板单元之间的非布线区；以及
    所述步骤3中，所述液态模塑材料从所述非布线区的位置注入。
  25. 根据权利要求23所述的感光组件拼板制作方法，其特征在于，所述步骤1中，每个所述硬板区包括第一排线路板单元和第二排线路板单元，每个线路板单元上安装一个所述的感光元件；以及
    所述步骤3中，所述液态模塑材料的注入位置包括第一排线路板单元和第二排线路板单元之间的区域、第一排感光元件与硬板区第一边缘之间的区域、以及第二排感光元件与硬板区第二边缘之间的区域，其中硬板区第一边缘为靠近第一排感光元件且与所述第一边平行的硬板区边缘，硬板区第二边缘为靠近第二排感光元件且与所述第一边平行的硬板区边缘。
  26. 根据权利要求23所述的感光组件拼板制作方法，其特征在于，所述步骤1中，每个所述硬板区由单排线路板单元构成，每个线路板单元上安装一个所述的感光元件；以及
    所述步骤3中，所述液态模塑材料的注入位置包括感光元件与硬板区第一边缘之间的区域、以及感光元件与硬板区第二边缘之间的区域，其中硬板区第一边缘和硬板区第二边缘是与所述第一边平行的两条硬板区边缘，并且所述感光元件位于这两条硬板区边缘之间。
  27. 根据权利要求19～26中任意一项所述的感光组件拼板制作方法，其特征在于，所述步骤1中，每个所述感光元件还具有与所述第一边相对的第二边；
    所述待模塑拼板还包括：
    多条第二金属线，将每个所述感光元件和与其对应的所述线路板单元电连接，并且所述第二金属线跨越所述第二边；以及
    多个第二电子元件，安装在每个所述线路板单元上并且所述第二电子元件的安装区域位于对应的感光元件的所述第二边的延伸线上；
    其中，所述模塑部还覆盖所述第二电子元件和所述第二金属线。
  28. 根据权利要求19～25中任意一项所述的感光组件拼板制作方法，其特征在于，所述步骤1中，所述第一电子元件在垂直于所述第一边方向上的尺寸与所述第一金属线在所述线路板表面的投影的在垂直于所述第一边方向上的尺寸适配。
  29. 根据权利要求19～25中任意一项所述的感光组件拼板制作方法，其特征在于，所述步骤1中，所述第一端子和与其对应的所述第二端子的连线与所述第一边不垂直。
  30. 一种感光组件拼板，其特征在于，根据权利要求19～29中任意一项所述的感光组件拼板制作方法制成。
  31. 一种感光组件，其特征在于，所述感光组件通过切割权利要求30所述的感光组件拼板得到。
  32. 一种感光组件，其特征在于，所述感光组件通过切割感光组件拼板得到，其中所述感光组件拼板根据权利要求24所述的感光组件拼板制作方法得到，并且切割所述感光组件拼板时，所述非布线区被切除。
  33. 一种摄像模组，其特征在于，包括权利要求31～33中任意一项所述的感光组件。
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