WO2019090793A1 - 蒸镀用的复合掩模板 - Google Patents

蒸镀用的复合掩模板 Download PDF

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Publication number
WO2019090793A1
WO2019090793A1 PCT/CN2017/110901 CN2017110901W WO2019090793A1 WO 2019090793 A1 WO2019090793 A1 WO 2019090793A1 CN 2017110901 W CN2017110901 W CN 2017110901W WO 2019090793 A1 WO2019090793 A1 WO 2019090793A1
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Prior art keywords
rib
mask
base
vapor deposition
mounting groove
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PCT/CN2017/110901
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English (en)
French (fr)
Inventor
范硕
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武汉华星光电半导体显示技术有限公司
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Publication of WO2019090793A1 publication Critical patent/WO2019090793A1/zh

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation

Definitions

  • the present invention relates to the field of organic light emitting display technology, and in particular to a composite mask for vapor deposition.
  • OLED organic light-emitting diode
  • the thickness of the high-precision metal mask (FMM, ie, the metal metal mask) needs to be thinner, and the metal mask cannot avoid sagging when the thickness of the FMM is thin.
  • FMM the high-precision metal mask
  • transversely and vertically staggered carrier strips are usually formed in the frame.
  • the upper layer of the carrier strip is vertically overlapped on the lower layer of the carrier strip, and the ends are further Soldering to the frame, although this structure can play the role of the upper FMM to a certain extent, alleviating the evaporation of R, G, B organic luminescent materials on the glass substrate in the large-sized panel, the glass substrate with the lower part
  • the phenomenon of sagging of FMM however, the two-layer bearing strips perpendicular to each other will inevitably exhibit an arched state at the intersection, which affects the flatness of the metal mask, affects the vapor deposition uniformity of the organic light-emitting material, and arches A small gap is formed in the portion, and the vapor deposition material is easily accumulated, which brings inconvenience to the cleaning of the metal mask in the later stage.
  • the present invention provides a composite mask for vapor deposition, which can ensure that the mask does not sag, has good flatness, and can facilitate cleaning of the mask.
  • a composite mask for vapor deposition comprising a base, a grid structure and a mask plate, wherein the grid structure is a mesh structure formed by a plurality of mutually perpendicular first ribs and second ribs, the base Opened for the middle
  • An annular plate having a vapor deposition hole, wherein a top surface of the base is further provided with a mounting groove communicating with the vapor deposition hole, wherein the grid structure is suspended in the vapor deposition hole and is overlapped and fixed on the periphery a mounting groove, and an upper surface of the grid structure is flush with the top surface;
  • the mask plate includes a plurality of spaced hollow pattern regions and a blank region adjacent to the hollow pattern region, the mask A diaphragm is overlapped on the base, and a projection of the first rib and the second rib on the mask is located in the blank area.
  • the mounting slot includes a first mounting slot on opposite sides of the top surface of the base and a second mounting slot on the other two opposite sides of the top surface of the base; a rib is lapped over the second rib, the first rib is embedded in the first mounting groove, and the second rib is embedded in the second mounting groove, and
  • the depth of the second mounting groove is the sum of the thicknesses of the first rib and the second rib, and the depth of the first mounting groove is the same as the thickness of the first rib.
  • the mask is placed parallel to the first rib, and a gap between two adjacent first ribs is smaller than a width of the mask, the mask Lap the two adjacent first rib surfaces.
  • the second rib is provided with a first groove facing the surface of the first rib, and the first rib is embedded and held in the first groove.
  • the first rib is provided with a second groove facing the surface of the second rib, and the second rib is embedded and held in the second groove.
  • the bottom surface of the base is further provided with a sub-mounting groove communicating with the vapor deposition hole, and the sub-mounting groove includes a first sub-mounting groove located at two opposite sides of the bottom surface of the base and located a second sub-mounting groove of the other two opposite sides of the bottom surface of the base, wherein the depth of the second sub-mounting groove is the sum of the thicknesses of the first rib and the second rib, the first pair The depth of the mounting groove is the same as the thickness of the first rib.
  • the composite mask for vapor deposition further includes a shutter
  • the shutter includes a frame-shaped frame portion and a first portion disposed on the first pair of opposite sides of the frame portion a bump and a second bump disposed on a second pair of opposite sides of the frame portion, wherein the first bump and the second bump have the same convex direction, and when the frame portion is selective When the ground surface is attached to the top surface or the bottom surface of the base, the first protrusion and the second protrusion are respectively engaged in the mounting groove or the auxiliary mounting groove.
  • the protruding heights of the first bump and the second bump are respectively the same as the depth of the first mounting groove and the depth of the second mounting groove.
  • the composite mask for vapor deposition further includes a positioning frame at two ends of the base, the positioning frame connects the plurality of the mask plates together, and the positioning frame is provided with an alignment mark, and the base is correspondingly provided with the alignment mark as a alignment The reference mark for the benchmark.
  • the mesh grid structure is suspended in the vapor deposition hole and is overlapped and fixed in the installation groove, and the upper surface of the grid structure is flush with the top surface, and the mask plate is overlapped On the base, the projection of the first rib and the second rib on the mask is located in a blank area of the mask plate which does not have a hollow evaporation channel, which can ensure the smooth progress of the evaporation and ensure the mask It has good flatness, does not sag during the evaporation process, and facilitates the cleaning of the mask.
  • FIG. 1 is a schematic structural view of a composite mask according to Embodiment 1 of the present invention.
  • FIG. 2 is a schematic view showing the internal structure of a composite mask according to Embodiment 1 of the present invention.
  • FIG. 3 is a cross-sectional structural view of a base according to Embodiment 1 of the present invention.
  • FIG. 4 is a schematic view showing a manner of fitting a rib in a grid structure according to Embodiment 1 of the present invention.
  • FIG. 5 is a schematic view showing another manner of fitting the ribs in the grid structure according to Embodiment 1 of the present invention.
  • FIG. 6 is a schematic view showing still another manner of fitting the ribs in the grid structure according to Embodiment 1 of the present invention.
  • FIG. 7 is a cross-sectional structural view of a base according to Embodiment 2 of the present invention.
  • FIG. 8 is a schematic view showing the internal structure of a composite mask according to Embodiment 2 of the present invention.
  • FIG. 9 is a schematic view showing the internal structure of a composite mask according to Embodiment 3 of the present invention.
  • FIG. 10 is a schematic structural view of a shutter according to Embodiment 3 of the present invention.
  • Fig. 11 is a cross-sectional view taken along line A-A of Fig. 10;
  • the composite mask of the embodiment of the present invention is mainly used for vapor-depositing an organic light-emitting material layer in an OLED panel.
  • the composite mask mainly includes a base 10, a grid structure 20, and a plurality of masks 30.
  • the grid structure 20 is a mesh structure formed by a plurality of mutually perpendicular first ribs 21 and second ribs 22, and the base 10 is an annular plate having a vapor deposition hole 100 in the middle thereof, and the top surface of the base 10 is also opened.
  • the grid structure 20 is suspended in the vapor deposition hole 100 and overlaps and fixed in the mounting groove 110, and the upper surface of the grid structure 20 is flush with the top surface; the mask plate is connected to the mounting hole 110 of the vapor deposition hole 100.
  • 30 includes a plurality of spaced apart hollow pattern regions 31 and a blank region 32 adjacent to the hollowed pattern region 31, the masking plate 30 is overlapped on the base 10, and the first rib 21 and the second rib 22 are in the mask
  • the projection on 30 is located in the blank area 32, and the hollow pattern area 31 of the mask 30 has a pattern conforming to a predetermined pixel arrangement on the OLED display panel.
  • the first rib 21 is overlapped over the second rib 22, and the mask 30 is placed parallel to the first rib 21, and the gap between the two adjacent first ribs 21 is
  • the masking plate 30 is overlapped on the surface of the two adjacent first ribs 21, and the two ends of the first rib 21 and the second rib 22 may be fixed in the base 10 by welding or the like. .
  • the two ends of the mask 30 are overlapped on the base 10.
  • the intermediate portion of the mask 30 is overlapped on the surface of the first rib 21 located at the upper portion, each of the two phases.
  • the adjacent first rib 21 carries a mask plate 30 thereon, which can ensure that the mask plate 30 is always horizontal without being drooping during the evaporation process, and the glass substrate can be placed on the plurality of mask plates 30.
  • the particulate organic material evaporated in the vapor deposition device sequentially passes through the vapor deposition hole 100, the mesh of the grid structure 20, and the hollow pattern region of the mask 30. After 31, it is deposited on the lower surface of the uppermost glass substrate, and a pixel arrangement pattern conforming to the pattern of the hollow pattern region 31 is formed on the glass substrate.
  • the hollow pattern area 31 is located directly above the mesh of the grid structure 20, the blank area 32 is located directly above the first rib 21, and the second rib 22 is carried under the first rib 21, which can prevent the first The effect of the rib 21 sagging.
  • the first rib 21 also blocks the slit between the two adjacent mask plates 30 above, thereby preventing the organic material from entering the slit during the evaporation process and affecting the pixels of the uppermost glass substrate. The formation of the pattern.
  • the composite mask further has a positioning frame 50 respectively disposed at two ends of the base 10.
  • the positioning frame 50 connects the plurality of masks 30 together, and the alignment mark 51 is disposed on the positioning frame 50.
  • Corresponding marks 51 are provided on the base 10 as reference marks 11 for the alignment reference.
  • the mounting groove 110 of the present embodiment includes two opposite sides on the top surface of the base 10.
  • the first mounting groove 111 and the second mounting groove 112 on the other two opposite sides of the top surface of the base 10; the first rib 21 is embedded in the first mounting groove 111, and the second rib 22 is embedded in the second mounting
  • the depth of the second mounting groove 112 is the sum of the thicknesses of the first rib 21 and the second rib 22, and the depth of the first mounting groove 111 is the same as the thickness of the first rib 21.
  • the first rib 21 is overlapped over the second rib 22, the lower second rib 22 is completely embedded in the deeper second mounting groove 112, and the upper first rib 21 is completely embedded in the shallower first In the mounting groove 111, in the process of assembling the composite mask, the first rib 21 and the second rib 22 are respectively mounted into the first mounting groove 111 and the second mounting groove 112, and then can be fixed by welding or the like.
  • the first groove 220 is opened only on the surface of the second rib 22 facing the first rib 21.
  • the first rib 21 Inserted and held in the first recess 220; in FIG. 5, the second recess 210 is formed only on the surface of the first rib 21 facing the second rib 22, and the second rib 22 is embedded and latched.
  • the second recess 210 in FIG.
  • a first recess 220 is formed on the surface of the second rib 22 facing the first rib 21, and the first rib 21 is opened toward the surface of the second rib 22.
  • the second groove 210 can further reduce the thickness of the composite mask relative to the first two cases.
  • the matching manner shown in FIG. 6 is that the first rib 21 has the second recess 210 facing downward, and the second recess 210 is inevitably deposited with particles, which causes certain difficulties in cleaning the composite mask, and the method shown in FIG. There is no such defect in the matching method.
  • the bottom surface of the base 10 of the present embodiment is further provided with a sub-mounting groove 110' that communicates with the vapor deposition hole 100.
  • the mounting groove 110 and the sub-mounting groove 110' are vertically symmetrical, specifically,
  • the sub-mounting groove 110' includes a first sub-mounting groove 111' on opposite sides of the bottom surface of the base 10 and a second sub-mounting groove 112' on the other opposite sides of the bottom surface of the base 10, the first sub-mounting groove 111'
  • the second sub-mounting groove 112' corresponds to the position of the second mounting groove 112
  • the depth of the second sub-mounting groove 112' is the thickness of the first rib 21 and the second rib 22.
  • the depth of the first sub-mounting groove 111' is the same as the thickness of the first rib 21.
  • the base structure of this embodiment allows the composite mask of the embodiment to have a longer service life.
  • the grid structure 20 can be installed in the mounting groove 110 at the top of the base 10, or can be mounted on the bottom mounting groove 110' at the bottom of the base 10. Even if the top structure of the base is damaged or worn, just remove the top After the rib 21 and the second rib 22 are respectively fixed to the first sub-mounting groove 111' and the second sub-mounting groove 112' at the bottom of the base, the composite mask is turned upside down (as shown in FIG. 8). ), the composite mask can still be used.
  • the composite mask of the present embodiment further has a shutter 40.
  • the shutter 40 includes a frame-shaped frame portion 41 and a first pair of opposite sides provided on the frame portion 41.
  • the first bumps 42 and the second bumps 43 disposed on the opposite sides of the second pair of the frame portions 41 have the same convex direction of the first bumps 42 and the second bumps 43.
  • the shutter 40 can be used to block the unused mounting groove 110 or the sub-mounting groove 110' to prevent the particulate organic material from entering the corresponding mounting groove 110 or the sub-mounting groove 110' during the evaporation process to affect the cleaning of the composite mask.
  • the frame portion 41 is selectively attached to the top surface or the bottom surface of the base 10, the first protrusion 42 and the second protrusion 43 are respectively engaged in the mounting groove 110 or the sub-mounting groove 110'.
  • the first rib 21 and the second rib 22 are respectively mounted in the first mounting groove 111 and the second mounting groove 112, and the first bump 42 and the second convex are respectively
  • the blocks 43 are respectively engaged in the first sub-mounting groove 111' and the second sub-mounting groove 112' at the bottom of the base 10 to prevent particulate matter from entering the first sub-mounting groove 111' and the second sub-mounting groove 112';
  • the first rib 21 and the second rib 22 are respectively mounted in the first sub-mounting groove 111' and the second sub-mounting groove 112', and the first bump 42 and the second bump 43 respectively
  • the first mounting groove 111 and the second mounting groove 112 are engaged to prevent particulate matter from entering the first mounting groove 111 and the second mounting groove 112.
  • the protruding heights of the first bump 42 and the second bump 43 are respectively the same as the depth of the first mounting groove 111 and the depth of the second mounting groove 112 to further prevent the particulate matter from entering the first bump 42 and the first mounting. a gap between the groove 111 / the first sub-mounting groove 111 ′ and a gap between the second bump 43 and the second mounting groove 112 / the second sub-mounting groove 112 ′.
  • the mesh structure is suspended in the vapor deposition hole and is overlapped and fixed in the installation groove, and the upper surface of the grid structure is flush with the top surface.
  • the film plate is overlapped on the base, and the projection of the first rib and the second rib on the mask plate is located in a blank area of the mask plate which does not have a hollow evaporation channel, thereby ensuring smooth evaporation. It can also ensure that the mask has good flatness, does not sag during the evaporation process, and facilitates the cleaning of the mask.
  • the invention further improves the composite mask, improves the service life thereof, reduces the maintenance cost, and can well avoid the organic particles entering the unnecessary gap during the evaporation process, and is convenient to clean.

Abstract

一种蒸镀用的复合掩模板,其中,包括底座(10)、栅格结构(20)和掩膜板(30),栅格结构(20)为多条相互垂直的第一筋条(21)和第二筋条(22)形成的网状结构,底座(10)为中部开设有蒸镀孔(100)的环状板,底座(10)的顶面还开设有连通蒸镀孔(100)的安装槽(110),栅格结构(20)悬于蒸镀孔(100)内且四周搭接并固定于安装槽(110)内,且栅格结构(20)的上表面与顶面平齐;掩膜板(30)包括多个间隔的镂空图案区域(31)和与镂空图案区域(31)相邻的空白区域(32),掩膜板(30)搭接在底座(10)上,且第一筋条(21)第二筋条(22)在掩膜板(30)上的投影位于空白区域(32)内。

Description

蒸镀用的复合掩模板 技术领域
本发明涉及有机发光显示技术领域,尤其涉及一种蒸镀用的复合掩模板。
背景技术
目前,有机发光二极管(OLED)显示屏广泛用于智能手机、平板电脑、电脑和电视等终端产品。但是,这些电子终端产品对显示屏提出了越来越高的分辨率要求,需要屏幕解析度(即像素密度)超过400ppi。
随着OLED面板高分辨率化,高精度金属掩模板(FMM,即Fine metal Mask)厚度需要变得更薄,FMM厚度变薄时金属掩模板无法避免下垂的现象。在采用现有的制作工艺制作OLED像素时,由于金属掩模板变薄的加工难度及下垂等问题,很难做出高分辨率的OLED面板。
现有的金属掩模板制作过程中,通常在框架内制作出横纵交错的承载条,下层的承载条焊接到框架后,上层的承载条垂直地搭接在下层的承载条上,两端再焊接到框架,虽然此种结构在一定程度上可以起到对上部的FMM的承载作用,缓解了大尺寸面板中在玻璃基板上蒸镀R、G、B有机发光材料时,玻璃基板随其下部的FMM下垂的现象,然而,相互垂直的两层承载条难免会在相交处呈现拱起状态,使得金属掩模板的平整度受到影响,影响有机发光材料的蒸镀均匀性,并且,拱起的部位形成细小的缝隙,易积累蒸镀材料,对金属掩模板后期的清洗带来了不便。
发明内容
鉴于现有技术存在的不足,本发明提供了一种蒸镀用的复合掩模板,可以保证掩模板不会下垂,具有良好的平整度,也可以方便掩膜板的清洗。
为了实现上述的目的,本发明采用了如下的技术方案:
一种蒸镀用的复合掩模板,包括底座、栅格结构和掩膜板,所述栅格结构为多条相互垂直的第一筋条和第二筋条形成的网状结构,所述底座为中部开设 有蒸镀孔的环状板,所述底座的顶面还开设有连通所述蒸镀孔的安装槽,所述栅格结构悬于所述蒸镀孔内且四周搭接并固定于所述安装槽内,且所述栅格结构的上表面与所述顶面平齐;所述掩膜板包括多个间隔的镂空图案区域和与所述镂空图案区域相邻的空白区域,所述掩膜板搭接在所述底座上,且所述第一筋条和所述第二筋条在所述掩膜板上的投影位于所述空白区域内。
作为其中一种实施方式,所述安装槽包括位于所述底座的顶面上两相对边的第一安装槽和位于所述底座的顶面上另两相对边的第二安装槽;所述第一筋条搭接于所述第二筋条上方,所述第一筋条嵌设于所述第一安装槽内,所述第二筋条嵌设于所述第二安装槽内,且所述第二安装槽的深度为所述第一筋条与所述第二筋条的厚度之和,所述第一安装槽的深度与所述第一筋条的厚度相同。
作为其中一种实施方式,所述掩膜板平行于所述第一筋条放置,相邻两根所述第一筋条之间的间隙小于所述掩膜板的宽度,所述掩膜板搭接在相邻两根所述第一筋条表面。
作为其中一种实施方式,所述第二筋条朝向所述第一筋条的表面开设有第一凹槽,所述第一筋条嵌设并卡持于所述第一凹槽内。
作为其中一种实施方式,所述第一筋条朝向所述第二筋条的表面开设有第二凹槽,所述第二筋条嵌设并卡持于所述第二凹槽内。
作为其中一种实施方式,所述底座的底面还开设有连通所述蒸镀孔的副安装槽,所述副安装槽包括位于所述底座的底面上两相对边的第一副安装槽和位于所述底座的底面上另两相对边的第二副安装槽,所述第二副安装槽的深度为所述第一筋条与所述第二筋条的厚度之和,所述第一副安装槽的深度与所述第一筋条的厚度相同。
作为其中一种实施方式,所述的蒸镀用的复合掩模板还包括遮板,所述遮板包括框形的边框部和设于所述边框部的第一对相对的边上的第一凸块和设于所述边框部的第二对相对的边上的第二凸块,所述第一凸块、所述第二凸块的凸出方向相同,且当所述边框部选择性地贴合在所述底座的顶面或底面时,所述第一凸块与所述第二凸块分别对应地卡合在所述安装槽或所述副安装槽内。
作为其中一种实施方式,所述第一凸块、所述第二凸块的凸出高度分别与所述第一安装槽的深度、所述第二安装槽的深度相同。
作为其中一种实施方式,所述的蒸镀用的复合掩模板还包括分别设于所述 底座两端的定位架,所述定位架将多块所述掩膜板衔接在一起,且所述定位架上设置有对位标记,所述底座上对应设有供所述对位标记作为对位基准的参考标记。
本发明的复合掩模板中,网状的栅格结构悬于蒸镀孔内且四周搭接并固定于安装槽内,且栅格结构的上表面与顶面平齐,掩膜板搭接在底座上,且第一筋条和第二筋条在掩膜板上的投影位于掩膜板上不具有镂空蒸镀通道的空白区域内,既可以保证蒸镀的顺利进行,又能保证掩模板具有良好的平整度,不会在蒸镀过程中发生下垂,也方便掩膜板的清洗。
附图说明
图1为本发明实施例1的复合掩模板的结构示意图;
图2为本发明实施例1的复合掩模板的内部结构示意图;
图3为本发明实施例1的底座的剖视结构示意图;
图4为本发明实施例1的栅格结构内的筋条的一种配合方式示意图;
图5为本发明实施例1的栅格结构内的筋条的另一种配合方式示意图;
图6为本发明实施例1的栅格结构内的筋条的又一种配合方式示意图;
图7为本发明实施例2的底座的剖视结构示意图;
图8为本发明实施例2的复合掩模板的内部结构示意图;
图9为本发明实施例3的复合掩模板的内部结构示意图;
图10为本发明实施例3的遮板的结构示意图;
图11为图10的A-A向剖视图。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白,以下结合附图及实施例,对本发明进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本发明,并不用于限定本发明。
实施例1
参阅图1~3,本发明实施例的复合掩模板主要用于在0LED面板中蒸镀有机发光材料层,该复合掩模板主要包括底座10、栅格结构20和多块掩膜板30, 栅格结构20为多条相互垂直的第一筋条21和第二筋条22形成的网状结构,底座10为中部开设有蒸镀孔100的环状板,底座10的顶面还开设有连通蒸镀孔100的安装槽110,栅格结构20悬于蒸镀孔100内且四周搭接并固定于安装槽110内,且栅格结构20的上表面与顶面平齐;掩膜板30包括多个间隔的镂空图案区域31和与镂空图案区域31相邻的空白区域32,掩膜板30搭接在底座10上,且第一筋条21和第二筋条22在掩膜板30上的投影位于空白区域32内,掩膜板30的镂空图案区域31具有与0LED显示面板上预定的像素排布方式一致的图案。
结合图1和图2所示,第一筋条21搭接于第二筋条22上方,掩膜板30平行于第一筋条21放置,相邻两根第一筋条21之间的间隙小于掩膜板30的宽度,掩膜板30搭接在相邻两根第一筋条21表面,第一筋条21、第二筋条22的两端可通过焊接等方式固定在底座10内。当掩膜板30放置到底座10上后,掩膜板30的两端搭接在底座10上,掩膜板30的中间部分搭接在位于上部的第一筋条21表面,每两条相邻的第一筋条21将一块掩膜版30承载于其上,可以保证掩膜版30在蒸镀过程中始终保持水平而不会下垂,玻璃基板可以放置在多块掩膜版30形成的表面上,通过将蒸镀装置放置在复合掩模板下方,蒸镀装置内蒸发出的颗粒状有机材料会依次穿过蒸镀孔100、栅格结构20的网眼、掩膜板30的镂空图案区域31后沉积到最上方的玻璃基板下表面,在玻璃基板上形成与镂空图案区域31的图案一致的像素排布方式。
这里,镂空图案区域31位于栅格结构20的网眼正上方,空白区域32位于第一筋条21的正上方,第二筋条22承载在第一筋条21的下方,可以起到防止第一筋条21下垂的作用。而第一筋条21还对其上方的相邻的两块掩膜板30之间的狭缝进行阻挡,可以避免蒸镀过程中有机材料进入该狭缝内而影响最上方的玻璃基板的像素图案的形成。
作为其中一种实施方式,复合掩模板还具有分别设于底座10两端的定位架50,定位架50将多块掩膜板30衔接在一起,并在定位架50上设置有对位标记51,在底座10上对应设有供对位标记51,以此作为对位基准的参考标记11。在定位各掩膜板30时,只需通过在水平方向移动定位架50而使其上的对位标记51与参考标记11对准,即可使所有的掩膜板30都被移动到预定的位置,可以实现快速对位,立即进行后续的蒸镀制程。
如图3所示,本实施例的安装槽110包括位于底座10的顶面上两相对边的 第一安装槽111和位于底座10的顶面上另两相对边的第二安装槽112;第一筋条21嵌设于第一安装槽111内,第二筋条22嵌设于第二安装槽112内,且第二安装槽112的深度为第一筋条21与第二筋条22的厚度之和,第一安装槽111的深度与第一筋条21的厚度相同。第一筋条21搭接于第二筋条22上方,下方的第二筋条22完全嵌入到较深的第二安装槽112内,上方的第一筋条21完全嵌入到较浅的第一安装槽111内,在组装复合掩模板的过程中,第一筋条21、第二筋条22分别安装到第一安装槽111、第二安装槽112内,然后可以通过焊接等方式进行固定。
为了减薄复合掩模板的厚度,在对第一筋条21与第二筋条22进行配合时,可以有多种配合方式。如图4~6,图4中,仅在第二筋条22朝向第一筋条21的表面开设有第一凹槽220,第一筋条21安装到底座10上后,第一筋条21嵌设并卡持于第一凹槽220内;图5中,仅在第一筋条21朝向第二筋条22的表面开设有第二凹槽210,第二筋条22嵌设并卡持于第二凹槽210内;图6中,在第二筋条22朝向第一筋条21的表面开设有第一凹槽220,在第一筋条21朝向第二筋条22的表面开设有第二凹槽210,可以相对于前两种情形更进一步地减薄复合掩模板的厚度。然而,在本实施例中,最好是采用图4所示的搭配方式,因为在蒸镀过程中颗粒状的有机材料自下而上沉积到掩膜板30上方的玻璃基板上,图5和图6所示的搭配方式由于第一筋条21具有朝下的第二凹槽210,第二凹槽210内难免会沉积颗粒物,导致复合掩模板清洗存在一定的困难,而图4所示的搭配方式不会存在此种缺陷。
实施例2
如图7,在实施例1的基础上,本实施例的底座10的底面还开设有连通蒸镀孔100的副安装槽110′,安装槽110与副安装槽110′上下对称,具体地,副安装槽110′包括位于底座10的底面上两相对边的第一副安装槽111′和位于底座10的底面上另两相对边的第二副安装槽112′,第一副安装槽111′与第一安装槽111的位置对应,第二副安装槽112′与第二安装槽112的位置对应,第二副安装槽112′的深度为第一筋条21与第二筋条22的厚度之和,第一副安装槽111′的深度与第一筋条21的厚度相同。
此种方式的底座结构使得本实施例的复合掩模板具有更长的使用寿命,栅格结构20可以安装在底座10顶部的安装槽110内,也可以安装在底座10底部的副安装槽110′上,即使底座的顶部结构出现损坏或磨损,只需拆掉上方的第 一筋条21和第二筋条22后将其分别固定到底座底部的第一副安装槽111′和第二副安装槽112′内后将复合掩模板翻转至底朝上(如图8所示),复合掩模板仍能继续使用。
实施例3
如图9~11,在实施例2的基础上,本实施例的复合掩模板还具有遮板40,遮板40包括框形的边框部41和设于边框部41的第一对相对的边上的第一凸块42和设于边框部41的第二对相对的边上的第二凸块43,第一凸块42、第二凸块43的凸出方向相同。
遮板40可用于遮挡未使用的安装槽110或副安装槽110′,避免在蒸镀过程中颗粒状的有机材料进入相应的安装槽110或副安装槽110′内影响复合掩模板的清洗。当边框部41选择性地贴合在底座10的顶面或底面时,第一凸块42与第二凸块43分别对应地卡合在安装槽110或副安装槽110′内。具体是,当在使用底座10的顶部时,第一筋条21和第二筋条22分别安装在第一安装槽111和第二安装槽112内,而将第一凸块42与第二凸块43分别对应地卡合在底座10底部的第一副安装槽111′与第二副安装槽112′内,防止颗粒物进入第一副安装槽111′与第二副安装槽112′;当在使用底座10的底面时,第一筋条21和第二筋条22分别安装在第一副安装槽111′与第二副安装槽112′内,第一凸块42与第二凸块43分别对应地卡合在第一安装槽111与第二安装槽112内,防止颗粒物进入第一安装槽111与第二安装槽112内。
这里,第一凸块42、第二凸块43的凸出高度分别与第一安装槽111的深度、第二安装槽112的深度相同,以进一步避免颗粒物进入第一凸块42与第一安装槽111/第一副安装槽111′之间的缝隙以及第二凸块43与第二安装槽112/第二副安装槽112′之间的间隙。
综上所述,本发明的复合掩模板中,网状的栅格结构悬于蒸镀孔内且四周搭接并固定于安装槽内,且栅格结构的上表面与顶面平齐,掩膜板搭接在底座上,且第一筋条和第二筋条在掩膜板上的投影位于掩膜板上不具有镂空蒸镀通道的空白区域内,既可以保证蒸镀的顺利进行,又能保证掩模板具有良好的平整度,不会在蒸镀过程中发生下垂,也方便掩膜板的清洗。并且,本发明还进一步对复合掩模板进行改进,提高了其使用寿命,降低了维护成本,并能很好地避免蒸镀过程中有机物颗粒进入不必要的缝隙中,清洗方便。
以上所述仅是本申请的具体实施方式,应当指出,对于本技术领域的普通 技术人员来说,在不脱离本申请原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也应视为本申请的保护范围。

Claims (17)

  1. 一种蒸镀用的复合掩模板,其中,包括底座、栅格结构和掩膜板,所述栅格结构为多条相互垂直的第一筋条和第二筋条形成的网状结构,所述底座为中部开设有蒸镀孔的环状板,所述底座的顶面还开设有连通所述蒸镀孔的安装槽,所述栅格结构悬于所述蒸镀孔内且四周搭接并固定于所述安装槽内,且所述栅格结构的上表面与所述顶面平齐;所述掩膜板包括多个间隔的镂空图案区域和与所述镂空图案区域相邻的空白区域,所述掩膜板搭接在所述底座上,且所述第一筋条和所述第二筋条在所述掩膜板上的投影位于所述空白区域内。
  2. 根据权利要求1所述的蒸镀用的复合掩模板,其中,还包括分别设于所述底座两端的定位架,所述定位架将多块所述掩膜板衔接在一起,且所述定位架上设置有对位标记,所述底座上对应设有供所述对位标记作为对位基准的参考标记。
  3. 根据权利要求1所述的蒸镀用的复合掩模板,其中,所述安装槽包括位于所述底座的顶面上两相对边的第一安装槽和位于所述底座的顶面上另两相对边的第二安装槽;所述第一筋条搭接于所述第二筋条上方,所述第一筋条嵌设于所述第一安装槽内,所述第二筋条嵌设于所述第二安装槽内,且所述第二安装槽的深度为所述第一筋条与所述第二筋条的厚度之和,所述第一安装槽的深度与所述第一筋条的厚度相同。
  4. 根据权利要求3所述的蒸镀用的复合掩模板,其中,还包括分别设于所述底座两端的定位架,所述定位架将多块所述掩膜板衔接在一起,且所述定位架上设置有对位标记,所述底座上对应设有供所述对位标记作为对位基准的参考标记。
  5. 根据权利要求3所述的蒸镀用的复合掩模板,其中,所述掩膜板平行于所述第一筋条放置,相邻两根所述第一筋条之间的间隙小于所述掩膜板的宽度,所述掩膜板搭接在相邻两根所述第一筋条表面。
  6. 根据权利要求5所述的蒸镀用的复合掩模板,其中,还包括分别设于所述底座两端的定位架,所述定位架将多块所述掩膜板衔接在一起,且所述定位架上设置有对位标记,所述底座上对应设有供所述对位标记作为对位基准的参考标记。
  7. 根据权利要求3所述的蒸镀用的复合掩模板,其中,所述第二筋条朝向 所述第一筋条的表面开设有第一凹槽,所述第一筋条嵌设并卡持于所述第一凹槽内。
  8. 根据权利要求7所述的蒸镀用的复合掩模板,其中,还包括分别设于所述底座两端的定位架,所述定位架将多块所述掩膜板衔接在一起,且所述定位架上设置有对位标记,所述底座上对应设有供所述对位标记作为对位基准的参考标记。
  9. 根据权利要求3所述的蒸镀用的复合掩模板,其中,所述第一筋条朝向所述第二筋条的表面开设有第二凹槽,所述第二筋条嵌设并卡持于所述第二凹槽内。
  10. 根据权利要求9所述的蒸镀用的复合掩模板,其中,还包括分别设于所述底座两端的定位架,所述定位架将多块所述掩膜板衔接在一起,且所述定位架上设置有对位标记,所述底座上对应设有供所述对位标记作为对位基准的参考标记。
  11. 根据权利要求3所述的蒸镀用的复合掩模板,其中,所述底座的底面还开设有连通所述蒸镀孔的副安装槽,所述副安装槽包括位于所述底座的底面上两相对边的第一副安装槽和位于所述底座的底面上另两相对边的第二副安装槽,所述第二副安装槽的深度为所述第一筋条与所述第二筋条的厚度之和,所述第一副安装槽的深度与所述第一筋条的厚度相同。
  12. 根据权利要求11所述的蒸镀用的复合掩模板,其中,还包括分别设于所述底座两端的定位架,所述定位架将多块所述掩膜板衔接在一起,且所述定位架上设置有对位标记,所述底座上对应设有供所述对位标记作为对位基准的参考标记。
  13. 根据权利要求11所述的蒸镀用的复合掩模板,其中,还包括遮板,所述遮板包括框形的边框部和设于所述边框部的第一对相对的边上的第一凸块和设于所述边框部的第二对相对的边上的第二凸块,所述第一凸块、所述第二凸块的凸出方向相同,且当所述边框部选择性地贴合在所述底座的顶面或底面时,所述第一凸块与所述第二凸块分别对应地卡合在所述安装槽或所述副安装槽内。
  14. 根据权利要求13所述的蒸镀用的复合掩模板,其中,还包括分别设于所述底座两端的定位架,所述定位架将多块所述掩膜板衔接在一起,且所述定 位架上设置有对位标记,所述底座上对应设有供所述对位标记作为对位基准的参考标记。
  15. 根据权利要求13所述的蒸镀用的复合掩模板,其中,所述第一凸块、所述第二凸块的凸出高度分别与所述第一安装槽的深度、所述第二安装槽的深度相同。
  16. 根据权利要求15所述的蒸镀用的复合掩模板,其中,还包括分别设于所述底座两端的定位架,所述定位架将多块所述掩膜板衔接在一起,且所述定位架上设置有对位标记,所述底座上对应设有供所述对位标记作为对位基准的参考标记。
  17. 一种蒸镀用的复合掩模板,其中,包括底座、栅格结构和掩膜板,所述栅格结构为多条相互垂直的第一筋条和第二筋条形成的网状结构,所述底座为中部开设有蒸镀孔的环状板,所述底座的顶面还开设有连通所述蒸镀孔的安装槽,所述栅格结构悬于所述蒸镀孔内且四周搭接并固定于所述安装槽内,且所述栅格结构的上表面与所述顶面平齐;所述掩膜板包括多个间隔的镂空图案区域和与所述镂空图案区域相邻的空白区域,所述掩膜板搭接在所述底座上,且所述第一筋条和所述第二筋条在所述掩膜板上的投影位于所述空白区域内;所述安装槽包括位于所述底座的顶面上两相对边的第一安装槽和位于所述底座的顶面上另两相对边的第二安装槽;所述第一筋条搭接于所述第二筋条上方,所述第一筋条嵌设于所述第一安装槽内,所述第二筋条嵌设于所述第二安装槽内,且所述第二安装槽的深度为所述第一筋条与所述第二筋条的厚度之和,所述第一安装槽的深度与所述第一筋条的厚度相同;所述掩膜板平行于所述第一筋条放置,相邻两根所述第一筋条之间的间隙小于所述掩膜板的宽度,所述掩膜板搭接在相邻两根所述第一筋条表面;所述第二筋条朝向所述第一筋条的表面开设有第一凹槽,所述第一筋条嵌设并卡持于所述第一凹槽内。
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