WO2019085486A1 - 柔性基板及柔性基板制作方法 - Google Patents

柔性基板及柔性基板制作方法 Download PDF

Info

Publication number
WO2019085486A1
WO2019085486A1 PCT/CN2018/091060 CN2018091060W WO2019085486A1 WO 2019085486 A1 WO2019085486 A1 WO 2019085486A1 CN 2018091060 W CN2018091060 W CN 2018091060W WO 2019085486 A1 WO2019085486 A1 WO 2019085486A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
glass
flexible substrate
flexible
organic functional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/091060
Other languages
English (en)
French (fr)
Inventor
芦宁
张伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yungu Guan Technology Co Ltd
Original Assignee
Yungu Guan Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yungu Guan Technology Co Ltd filed Critical Yungu Guan Technology Co Ltd
Publication of WO2019085486A1 publication Critical patent/WO2019085486A1/zh
Priority to US16/524,233 priority Critical patent/US10892428B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/20—Layered products comprising a layer of natural or synthetic rubber comprising silicone rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/20—Inorganic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/28—Multiple coating on one surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/42—Polarizing, birefringent, filtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/724—Permeability to gases, adsorption
    • B32B2307/7242—Non-permeable
    • B32B2307/7244—Oxygen barrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/724—Permeability to gases, adsorption
    • B32B2307/7242—Non-permeable
    • B32B2307/7246—Water vapor barrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/206—Organic displays, e.g. OLED
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/208—Touch screens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a flexible substrate and a method for fabricating the flexible substrate.
  • FIG. 1 is a schematic structural view of a flexible substrate in the prior art.
  • the flexible substrate of the prior art includes a cover 11 , an OCA (adhesive) layer 12 , a TP (touch) layer 13 , an OCA (adhesive) layer 12 , and a POL (which are sequentially stacked).
  • a polarizer layer 14 a TFE (thin film package) layer 15, an OLED (Organic Light-Emitting Diode) layer 16, and a back sheet layer 17, wherein the cover 11 having a protective screen function in the existing flexible substrate is PI ( Polyimide) or PET (Polyethylene Terephthalate) material, so ITO (conductive material) can only be attached in the form of TP layer 13, and can not be set by a thinner coating process.
  • PI Polyimide
  • PET Polyethylene Terephthalate
  • each film layer is as follows: the thickness of the cover 11 is 150 ⁇ m, the thickness of the OCA (adhesive) layer 12 is 25 ⁇ m, the thickness of the TP (touch) layer 13 is 50 ⁇ m, and the layer of POL (polarizer) 14 has a thickness of 75 ⁇ m, a TFE (film package) layer 15 has a thickness of 15 ⁇ m, an OLED (Organic Light-Emitting Diode) layer 16 has a thickness of 20 ⁇ m, and a back sheet layer 17 has a thickness of 100 ⁇ m. That is, the overall thickness of the existing flexible substrate is approximately 460 ⁇ m.
  • the existing flexible substrate is generally formed by a process in which the respective film layers are attached to each other, the screen body is thick and the film layer is easily broken during the bending process.
  • the embodiments of the present invention provide a flexible substrate and a flexible substrate manufacturing method, so as to solve the problem that the existing flexible substrate screen is thick, the number of layers is large, and the film layer is easily broken during the bending process. .
  • an embodiment of the present invention provides a flexible substrate including a hard layer, an organic functional layer, and a back layer layer, and an organic functional layer is attached to the back layer, the hard layer and the organic function.
  • the layer includes a polarizer layer and a touch layer, and the touch layer includes a glass substrate and a conductive layer coated on one side of the glass substrate.
  • the glass substrate in the touch layer is in direct contact with the organic functional layer.
  • an adhesive layer is disposed between the glass substrate and the organic functional layer.
  • the hard layer comprises a hard coating disposed in a coating manner
  • the glass substrate of the touch layer comprises an ultra-thin glass layer
  • the adhesive layer comprises a pressure-sensitive adhesive layer.
  • the polarizer layer is disposed on a side of the glass substrate of the touch layer that is not coated with the conductive layer.
  • the polarizer layer comprises a PVA layer and a 1/4 ⁇ slide layer, and the 1/4 ⁇ slide layer is applied to one side of the uncoated conductive layer of the glass substrate of the touch layer, and the PVA layer is disposed. Between the glass substrate and the hard layer or between the glass substrate and the organic functional layer.
  • the flexible substrate further includes an adhesive layer disposed between the conductive layer of the touch layer and the PVA layer of the polarizer layer.
  • the flexible substrate further includes an adhesive layer disposed between the conductive layer of the touch layer and the organic functional layer.
  • the flexible substrate further includes an encapsulation layer disposed on a periphery of the film layer included between the glass substrate and the organic functional layer of the touch layer.
  • the hard layer is disposed in a manner of attachment or coating.
  • the glass substrate of the touch layer has a thickness of 25 ⁇ m to 70 ⁇ m.
  • the flexible substrate further includes a first flexible glass layer and a second flexible glass layer, and a sealing layer is disposed between the first flexible glass layer and the second flexible glass layer, and the middle portion of the sealing layer includes an empty groove region And a hard layer, an organic functional layer, and a backing layer disposed in the empty groove region.
  • the flexible substrate further comprises a first layer of silicone oil disposed adjacent to the first flexible glass layer; and/or a second layer of silicone oil disposed adjacent to the second layer of flexible glass.
  • an embodiment of the present invention further provides a method for fabricating a flexible substrate, comprising: coating a conductive material on one side of the glass substrate to form a conductive layer; and providing a polarizing layer on a side of the glass substrate not coated with the conductive material. Coating hardening is performed on the side of the polarizer layer that is not in contact with the glass substrate to form a hard layer; and the conductive layer, the polarizer layer, the hard layer, and the laminated organic functional layer and the backing layer are laminated.
  • a flexible substrate manufacturing method includes: coating a conductive material on one side of a glass layer to form a conductive layer; and coating 1/4 ⁇ on the other side of the glass layer not coated with a conductive material.
  • a slide layer, a PVA layer and a conductive layer are laminated; a coating hardening is performed on a side of the PVA layer not in contact with the glass layer to form a hard layer; the conductive layer, the PVA layer, the hard layer The layer is superposed with the organic functional layer and the back sheet layer which are stacked.
  • the flexible substrate manufacturing method further includes: performing a packaging operation on the film layer between the glass substrate and the organic functional layer.
  • the flexible substrate provided by the embodiment of the present invention is provided with a glass substrate, and the conductive material is applied to the glass substrate by a coating process to form a conductive layer, and the glass substrate coated with the conductive layer is laminated with other film layers to form a flexible substrate.
  • FIG. 1 is a schematic structural view of a flexible substrate in the prior art.
  • FIG. 2 is a schematic structural view of a flexible substrate according to a first embodiment of the present invention.
  • FIG. 3 is a schematic structural view of a flexible substrate according to a second embodiment of the present invention.
  • FIG. 4 is a schematic structural view of a flexible substrate according to a third embodiment of the present invention.
  • FIG. 5 is a schematic structural view of a flexible substrate according to a fourth embodiment of the present invention.
  • FIG. 6 is a schematic top plan view of a flexible substrate according to a fifth embodiment of the present invention.
  • FIG. 7 is a front elevational view showing a flexible substrate according to a fifth embodiment of the present invention.
  • FIG. 8 is a schematic structural view of a flexible substrate according to a sixth embodiment of the present invention.
  • FIG. 9 is a schematic structural view of a flexible substrate according to a seventh embodiment of the present invention.
  • FIG. 10 is a schematic structural view of a flexible substrate according to an eighth embodiment of the present invention.
  • FIG. 11 is a schematic flow chart of a method for fabricating a flexible substrate according to a ninth embodiment of the present invention.
  • FIG. 12 is a schematic flow chart of a method for fabricating a flexible substrate according to a tenth embodiment of the present invention.
  • FIG. 2 is a schematic structural view of a flexible substrate according to a first embodiment of the present invention.
  • the flexible substrate provided by the first embodiment of the present invention includes a hard layer 21, a polarizer layer 22, a touch layer 23, an organic functional layer 24, and a backing layer 25 which are sequentially stacked from top to bottom.
  • the touch layer 23 includes a glass substrate and a conductive layer (not shown) applied to one side of the glass substrate.
  • the specific implementation includes the following two situations:
  • the conductive layer in the touch layer 23 is applied to the upper end surface of the glass substrate (wherein the upper end surface is the upper end surface in the stacking direction as shown in FIG. 2), at this time, in the touch layer 23
  • the glass substrate is in direct contact with the organic functional layer 24.
  • the glass substrate directly contacting and the organic functional layer 24 need to be bonded and fixed by means of an adhesive layer.
  • the periphery of the layer is not in contact with the other film layers of the flexible substrate.
  • the conductive layer in the touch layer 23 is applied to the lower end surface of the glass substrate (wherein the lower end surface is the lower end surface in the stacking direction as shown in FIG. 2), and at this time, in the touch layer 23 Between the glass substrate and the organic functional layer 24, a conductive layer applied to the glass substrate is included.
  • an adhesive layer (not shown) should be further included between the touch layer 23 and the organic functional layer 24, that is, the adhesive layer is disposed between the conductive layer and the organic functional layer 24, and the conductive layer and the adhesive layer are bonded.
  • the layer is subjected to a packaging operation to form an encapsulation layer disposed along a periphery of the conductive layer and the adhesive layer that is not in contact with other film layers of the flexible substrate to substantially block damage of the organic functional layer 24 by substances such as water and oxygen from the outside.
  • the purpose of including the adhesive layer between the conductive layer of the touch layer 23 and the organic functional layer 24 is to firmly bond to improve the embodiment of the present invention.
  • the stability of the flexible substrate is to firmly bond to improve the embodiment of the present invention.
  • organic functional layer 24 may be either an OLED layer or a film layer having other functions.
  • the backing layer 25 can be either a backing film layer in a conventional screen body or a backing layer layer integrated with other functions.
  • the flexible substrate provided by the first embodiment of the present invention is provided by disposing a glass substrate, and applying a conductive material to the glass substrate by a coating process to form a conductive layer, and stacking the glass substrate coated with the conductive layer with other film layers to generate The way of the flexible substrate finally achieves a reduction in the thickness of the flexible substrate and the number of layers while reducing the probability of film breakage during the bending process.
  • the hard layer is disposed in a manner of attaching, that is, the hard layer is attached to the adjacent film layer in the form of a cover to improve the adaptability of the flexible substrate provided by the embodiment of the present invention.
  • the hard layer is disposed in a coating manner, that is, the hard layer is applied to the adjacent film layer in a coating manner, and the coating method can reduce the hard layer compared to the attaching method.
  • the thickness of the film further reduces the chance of film breakage during the bending process.
  • the polarizer layer of the flexible substrate is disposed on a side of the uncoated conductive layer of the glass substrate of the touch layer, that is, the polarizer layer and the conductive layer are respectively disposed on the glass substrate by means of the glass substrate.
  • the opposite sides of the glass substrate together with the hard layer and the organic functional layer which are also respectively disposed on opposite sides of the glass substrate form effective protection for the polarizer layer and/or the conductive layer.
  • FIG. 3 is a schematic structural view of a flexible substrate according to a second embodiment of the present invention.
  • the second embodiment of the present invention is extended on the basis of the first embodiment of the present invention.
  • the second embodiment of the present invention is substantially the same as the first embodiment of the present invention. The differences will be described below, and the details are not described again.
  • the flexible substrate provided by the second embodiment of the present invention includes a hard coat layer 31, a POL (polarizer) layer 14, an ultra-thin glass layer 33, and an ITO (conductive material) which are sequentially stacked from top to bottom.
  • the layer 34, the pressure sensitive adhesive layer 35, the OLED (Organic Light-Emitting Diode) layer 16 and the back sheet layer 17, and the periphery of the ITO layer 34 and the pressure sensitive adhesive layer 35 are not in contact with other film layers of the flexible substrate.
  • Water oxygen barrier rubber layer 36 Water oxygen barrier rubber layer 36.
  • the flexible substrate provided by the second embodiment of the present invention achieves the purpose of blocking the destruction of the OLED layer 16 by substances such as water and oxygen from the outside by providing the water-oxygen barrier rubber layer 36 (ie, the encapsulation layer).
  • the ultra-thin glass in the ultra-thin glass layer 33 is an ultra-thin glass having a thickness of 70 ⁇ m and a bending radius of 3 mm to 5 mm to reduce the thickness of the flexible substrate provided by the embodiment of the present invention.
  • the ultra-thin glass in the ultra-thin glass layer 33 is an ultra-thin glass having a thickness of 50 ⁇ m and a bending radius of 3 mm to 5 mm to further reduce the thickness of the flexible substrate provided by the embodiment of the present invention.
  • the ultra-thin glass in the ultra-thin glass layer 33 is an ultra-thin glass having a thickness of 25 ⁇ m and a bending radius of 3 mm to 5 mm to further reduce the thickness of the flexible substrate provided by the embodiment of the present invention.
  • each film layer of the flexible substrate provided by the second embodiment of the present invention is as follows: the thickness of the hard coat layer 31 is 10 ⁇ m, the thickness of the POL layer 14 is 75 ⁇ m, the thickness of the ultra-thin glass layer 33 is 70 ⁇ m or 50 ⁇ m, and the thickness of the ITO layer 34. 5 ⁇ m, the pressure-sensitive adhesive layer 35 has a thickness of 7 ⁇ m, the OLED layer 16 has a thickness of 20 ⁇ m, and the back sheet layer 17 has a thickness of 100 ⁇ m.
  • the entire thickness of the flexible substrate provided by the second embodiment of the present invention is approximately 287 ⁇ m (when the thickness of the ultra-thin glass layer 33 is 70 ⁇ m) or 267 ⁇ m (when the thickness of the ultra-thin glass layer 33 is 50 ⁇ m).
  • the flexible substrate provided by the second embodiment of the present invention defines the hard layer 21 of the flexible substrate provided by the first embodiment as a hard coating layer 31 disposed in a coating manner, and defines the glass substrate of the touch layer 23 as super
  • the thin glass layer 33, and defining the adhesive layer as the pressure-sensitive adhesive layer 35 reduces the overall thickness of the flexible substrate and the number of layers while ensuring the surface hardness of the screen body, and effectively avoids the relationship between the film layers.
  • the problem of film fracture has improved the reliability of bending.
  • FIG. 4 is a schematic structural view of a flexible substrate according to a third embodiment of the present invention.
  • the third embodiment of the present invention is extended on the basis of the second embodiment of the present invention.
  • the third embodiment of the present invention is substantially the same as the second embodiment of the present invention. The differences will be described below, and the details are not described again.
  • the flexible substrate provided by the third embodiment of the present invention replaces the POL layer 14 in the flexible substrate provided in the second embodiment with a PVA (polyvinyl alcohol) layer 41 and a 1/4 ⁇ slide layer 42.
  • the flexible substrate provided by the third embodiment of the present invention includes a hard coat layer 31, a PVA layer 41, a pressure sensitive adhesive layer 35, an ITO layer 34, an ultra-thin glass layer 33, and 1/1, which are sequentially stacked from top to bottom.
  • each film layer of the flexible substrate provided by the third embodiment of the present invention is as follows: the thickness of the hard coat layer 31 is 10 ⁇ m, the thickness of the PVA layer 41 is 12 ⁇ m, the thickness of the pressure-sensitive adhesive layer 35 is 7 ⁇ m, and the thickness of the ITO layer 34 is 5 ⁇ m.
  • the ultra-thin glass layer 33 has a thickness of 70 ⁇ m or 50 ⁇ m, the 1/4 ⁇ slide layer 42 has a thickness of 5 ⁇ m, the OLED layer 16 has a thickness of 20 ⁇ m, and the back sheet layer 17 has a thickness of 100 ⁇ m.
  • the overall thickness of the flexible substrate provided by the third embodiment of the present invention is approximately 234 ⁇ m (when the thickness of the ultra-thin glass layer 33 is 70 ⁇ m) or 214 ⁇ m (when the thickness of the ultra-thin glass layer 33 is 50 ⁇ m).
  • the flexible substrate provided by the third embodiment of the present invention replaces the POL layer 14 of the flexible substrate provided by the second embodiment with the PVA layer 41 and the 1/4 ⁇ slide layer 42 while retaining the functions of the respective layers of the flexible substrate.
  • the overall thickness of the flexible substrate is further reduced, and since the 1/4 ⁇ slide layer 42 is also applied to the ultra-thin glass layer 33 in a coating manner, the flexible substrate provided in the third embodiment of the present invention is in the process of bending
  • the phenomenon of membrane separation has a more obvious improvement effect.
  • an adhesive layer ie, a pressure-sensitive adhesive layer 35
  • the conductive layer of the touch layer ie, the ITO layer 34
  • the PVA layer 41 of the polarizer layer ie, the conductive layer of the touch layer
  • the flexible substrate can be realized.
  • the effective fixation between the film layers further improves the stability of the flexible substrate provided by the embodiments of the present invention.
  • the PVA layer 41 and the 1/4 ⁇ slide layer 42 may also be disposed on the same side of the ultra-thin glass layer 33 to substantially improve the flexibility of the flexible substrate provided by the embodiment of the present invention.
  • the ITO layer 34 is applied to the side of the ultra-thin glass layer 33 near the hard coat layer 31, and the PVA layer 41 and the 1/4 ⁇ slide layer 42 are both disposed to the ultra-thin glass layer 33 and the OLED layer 16.
  • the bonding is performed by means of the pressure-sensitive adhesive layer 35 and the packaging operation by means of the water-oxygen barrier rubber layer 36.
  • the PVA layer 41 and the 1/4 ⁇ slide layer 42 are both disposed between the hard coat layer 31 and the ultra-thin glass layer 33, and the ITO layer 34 is applied to the ultra-thin glass layer 33 near the OLED layer 16.
  • the hard coating layer 31 can be replaced with the cover plate 11 in the existing flexible substrate to improve the adaptation of the flexible substrate provided by the above embodiments of the present invention. Sex. Compared with the flexible substrate of the prior art, the replaced flexible substrate can also achieve the technical effect of reducing the thickness of the flexible substrate and reducing the breakage of the film layer during the bending process.
  • the pressure sensitive adhesive layer 35 can be replaced with the OCA layer 12 in the existing flexible substrate to improve the flexible substrate provided by the above embodiments of the present invention.
  • Adaptability Compared with the flexible substrate of the prior art, the replaced flexible substrate can also achieve the technical effect of reducing the thickness of the flexible substrate and reducing the breakage of the film layer during the bending process.
  • FIG. 5 is a schematic structural view of a flexible substrate according to a fourth embodiment of the present invention.
  • the flexible substrate includes a superposed first flexible glass layer 101 and a second flexible glass layer 102, a sealing layer 103 disposed between the first flexible glass layer 101 and the second flexible glass layer 102, and The display panel 104.
  • the central portion of the sealing layer 103 includes an empty groove region 1031.
  • the display panel 104 is disposed in the empty groove region 1031 of the sealing layer 103.
  • the bottom surface area of the empty groove region 1031 is larger than the size of the display panel 104.
  • the display panel 104 includes a polarizing layer. , touch layer and organic functional layer.
  • Flexible glass has bendable properties. After testing, the flexible glass can withstand 100,000 bending fatigue tests with a bending radius of 5 mm. When the glass is thin to a certain extent, the softness of the glass is exhibited and it can be bent without breaking. Ultra-thin flexible glass has the properties of glass hardness, transparency, heat resistance, electrical insulation, gas impermeability, and relatively stable mechanical and chemical properties in an oxidizing and illuminating environment, and is bendable and lightweight.
  • the specific thickness of the first flexible glass layer 101 and the second flexible glass layer 102 is not limited in the embodiment of the present invention.
  • the embodiment of the present invention replaces the hard layer and the back layer in the flexible substrate with a flexible glass layer. Since the flexible glass itself has excellent stiffness and bending resistance, it can effectively solve the problem that the existing flexible substrate has a contradiction between the stiffness and the prevention of film breakage. Meanwhile, since the display panel 104 is disposed in the vacant area 1031 between the first flexible glass layer 101 and the second flexible glass layer 102, and the bottom area size of the vacant area 1031 is larger than the size of the display panel 104, When the display panel 104 is bent, the display panel 104 can slide relative to the first flexible glass layer 101 and the second flexible glass layer 102 in the empty groove region 1031, thereby alleviating the bending stress, and effectively avoiding the inside of the display panel 104. The layering of the film layer further improves the bending resistance of the flexible substrate and improves the reliability of the product.
  • the specific shape of the hollow groove region 1031 of the sealing layer 103 may be adjusted according to the shape of the display panel 104. Generally, it is only slightly larger than the display panel 104 and has the same shape as the display panel 104. For example, when the display panel 104 has a rectangular shape, the empty groove region 1031 in the sealing layer 103 may also have a rectangular shape, except that the bottom surface area of the empty groove region 1031 is larger than the display panel 104, so that the display panel 104 is bent. The middle slides in the empty groove area 1031.
  • the present invention does not limit the specific shape of the hollow groove region 1031 of the sealing layer 103.
  • a first silicone oil layer may be disposed between the display panel 104 and the first flexible glass layer 101. And/or providing a second layer of silicone oil between the display panel 104 and the second flexible glass layer 102.
  • the display panel 104 can slide in the empty groove region 1031, and the present invention does not make the flexible substrate including the first silicone oil layer and the second silicone oil layer. limited.
  • the sealing layer 103 is bonded and fixed to the first flexible glass layer 101 and/or the second flexible glass layer 102 by an adhesive layer.
  • the material of the adhesive layer may be a transparent optical adhesive (OCA).
  • OCA transparent optical adhesive
  • the specific material of the adhesive layer is not limited in the present invention.
  • the sealing layer 103 may be made of silicone rubber.
  • the silicone rubber material can be elastically deformed as the bending stress changes, and has good bending resistance and sealing performance.
  • the sealing layer 103 can also be made of other sealing materials, and the specific material of the sealing layer 103 is not limited in the present invention.
  • FIGS. 6 and 7 are respectively a top view and a front view of a flexible substrate according to a fifth embodiment of the present invention.
  • FIG. 8 is a schematic structural view of a flexible substrate according to a sixth embodiment of the present invention.
  • the flexible substrate includes a flexible glass layer 10 and a display panel 104 disposed inside the flexible glass layer 10.
  • the flexible glass layer 10 is composed of a first flexible glass layer 101 and a second flexible glass layer 102 with a groove in between.
  • the first flexible glass layer 101 having a groove in the middle may be grooved by etching or the like in the middle of a piece of flexible glass.
  • first flexible glass 101 with the groove in the middle may be prepared by itself or directly purchased by a glass sales company, wherein the groove may be obtained by a process such as etching, and the intermediate tape of the present invention
  • the source or preparation manner of the grooved first flexible glass 101 is not limited.
  • the display panel 104 is disposed within the recess of the first flexible glass layer 101.
  • the display panel 104 may be disposed in the recess of the first flexible glass layer 101 by a bonding manner using an optical adhesive. Due to the presence of the groove of the first flexible glass layer 101, the sliding range of the second flexible glass layer 102 is effectively limited, and the excessive positional displacement of the second flexible glass layer 102 during the bending process is prevented to cause flexibility. The entire substrate fails.
  • the second flexible glass layer 102 is disposed on the display panel 104, and the second flexible glass layer 102 is attached to the display panel 104 by optical glue, and after the setting is completed, the upper surface of the second flexible glass layer 102 should be the first flexible
  • the upper surface of the glass layer 101 remains at the same level.
  • the cross-sectional area of the groove of the first flexible glass 101 with the groove in the middle is larger than the cross-sectional area of the display panel 104, so that the display panel 104 can be in the process of bending the flexible substrate.
  • the groove is slid, so that the bending stress can be further dispersed to avoid the fracture failure of the display panel 104.
  • the second flexible glass layer 102 should be located in the groove of the first flexible glass layer 101. Due to the presence of the first flexible glass layer 101, the slip of the second flexible glass layer 102 is effectively suppressed, and the bending resistance of the flexible substrate is improved. Folding characteristics.
  • the display panel 104 may be disposed in the groove of the first flexible glass 101 by optical glue bonding or by silicone oil bonding or the like. When the silicone oil is bonded, the display panel 104 can be better in the groove. The ground is slid to relieve the bending stress, but the present invention does not limit the specific arrangement and the bonding material used.
  • the periphery of the second flexible glass layer 102 and the side of the groove of the first flexible glass layer 101 are encapsulated by a laser sintered glass powder process.
  • the packaged glass frit layer 104 is shown in FIG.
  • the laser sintered glass powder layer 104 fills a gap between the periphery of the second flexible glass layer 102 and the side of the groove of the first flexible glass layer 101, thereby preventing external water oxygen from entering the display panel 104 after the inner package is completed.
  • the upper surface of the display panel 104 is covered with a second flexible glass layer 102.
  • the lower surface and the side edges are covered with the protection of the first flexible glass layer 101, and the glass powder layer 104 is surrounded for protection, effectively blocking the entry of moisture and oxygen.
  • the water and oxygen barrier properties of the flexible substrate are improved.
  • FIG. 9 is a schematic structural view of a flexible substrate according to a seventh embodiment of the present invention.
  • the flexible substrate provided by the embodiment of the present invention includes: a first module material layer 1 and a second module material layer 3 superimposed; and at least one layer 1 and a second module disposed on the first module material
  • the strain barrier layer 2 between the layers of material layers 3; wherein the strain barrier layer 2 comprises a chamber 221 and an elastic material layer 211 surrounding the periphery of the chamber.
  • the module material layer is a functional unit constituting the flexible substrate, and each module material layer may be composed of a plurality of functional layers.
  • the module material layer may be a flexible display body, a touch layer, and a polarizer layer.
  • the first and second qualifiers are introduced in the embodiment of the present invention, such as A module material layer 1 and a second module material layer 3 and the like.
  • a strain barrier layer 2 is disposed between the first module material layer 1 and the second module material layer 3. Since the strain barrier layer 2 can effectively block the strain of the first module material layer 1 and the second module material layer 3, the first module material layer 1 and the second module material can be effectively prevented from occurring when the bending deformation occurs. The transmission of the strain between the layers 3 reduces the strain of the first module material layer 1 and the second module material layer 3, thereby significantly improving the bending resistance of the flexible substrate and improving the reliability of the product.
  • the flexible substrate is not limited to including only the first module material layer 1 and the second module material layer 3 shown in FIG. 9 , and may also include more layers of module materials.
  • a strain barrier layer 2 may be disposed between adjacent two layers of module material layers. The embodiment of the present invention does not specifically limit the number of layers of the module material layer and the adjacent barrier material layers 2 between the module material layers.
  • the chamber 221 may be filled with a gas or a vacuum, and may function to block strain. However, when the chamber 221 is filled with gas, the air pressure inside and outside the chamber 221 can be balanced.
  • the gas may be a mixture of one or more of air or an inert gas.
  • the air resources are abundant and convenient to collect, and filling the air in the chamber 221 can reduce the overall manufacturing cost of the flexible substrate.
  • the gas may also be an inert gas. Since the chemical properties of the inert gas are stable and it is difficult to chemically react with the substance in contact with it, the use of an inert gas in the chamber 221 can increase the service life of the flexible substrate.
  • the embodiment of the present invention does not specifically limit the kind of gas in the chamber 221.
  • the display panel 104 may also need to be electrically connected to an external circuit structure through conductive leads. This can be done by punching holes in the surface (side, top or bottom) of the flexible glass layer 10, and then filling the holes with conductive material to form conductive leads electrically connected to the display panel 104, the conductive material and the holes in the holes. The gap between them can be sealed with a sealing material.
  • a conductive film extending to the outer surface of the first flexible glass layer 101 may be first coated on the groove side of the first flexible glass layer 101, and the film is etched into a pattern of conductive leads, and then The second flexible glass layer 102 may be packaged with the first flexible glass layer 101.
  • the display panel 104 encapsulated in the flexible glass layer 10 may also form an electrical connection with the external circuit structure by other means, but the specific structure and formation manner of the conductive lead of the present invention are not limited.
  • FIG. 10 is a schematic structural view of a flexible substrate according to an eighth embodiment of the present invention.
  • the flexible substrate in addition to the first flexible glass layer 101, the second flexible glass layer 102, and the display panel 104 disposed on the first surface of the first flexible glass layer 101, the flexible substrate is further The wiring area 30 is disposed on the second surface of the first flexible glass layer 101, wherein the second surface is a surface opposite to the first surface, and the routing area 30 is electrically connected to the display panel 104 of the first surface.
  • the first surface of the first flexible glass layer 101 is a front surface, and a TFT array layer, an anode layer, an organic light-emitting layer, a cathode layer and the like may be sequentially disposed thereon, and these functional layers collectively constitute the display panel 104.
  • the second surface of the first flexible glass layer 101 is the back surface, and the routing area 30 is disposed as a non-display portion at a corresponding position on the back surface of the first flexible glass layer 101, such as an edge region of the periphery, which greatly reduces the non-display area of the front surface of the device.
  • the area allows the device to achieve a narrow bezel or even a full screen display.
  • the routing area of the non-display portion is disposed on the back surface of the substrate, so that the OLED module is electrically connected to the front surface of the OLED module to complete the routing function, and the front surface of the display device is greatly reduced.
  • the area of the display area enables the device to achieve a narrow border or even a full screen display, thereby enhancing the display effect of the screen and improving the user's visual experience.
  • the first flexible glass layer 101 includes vias, and circuit traces of the trace regions 30 may be connected to the display panel 104 on the front side via vias on the first flexible glass layer 101.
  • the via structure may be set in one-to-one correspondence with the circuit traces, or one via may be corresponding to a plurality of circuit traces, or one via may correspond to all circuit traces.
  • the holes may be punched by a laser or chemically, and the walls of the holes may be vapor-deposited with various conductive media such as copper.
  • the circuit traces of the rear trace region 30 of the first flexible glass layer 101 can be electrically connected to the front display panel 104 through the vias.
  • a frame having the shape of the preset curved surface may be prepared first, and then the flexible substrate provided by the embodiment of the present invention is installed into the frame.
  • the perimeter of the bezel may be less than the perimeter of the flexible substrate.
  • the flexible substrate itself has a bendable property, and when the whole is mounted in a frame having a circumference smaller than the whole, the whole is curved into a curved surface by a plane.
  • mounting the flexible substrate into the frame may include: bonding the frame to the entire circumference of the flexible substrate in a frame-fitting manner.
  • an annular groove may be provided on the inner surface of the bezel.
  • the depth of the annular groove is preferably 3-5 mm, which ensures that the mounting is secure and does not make the frame too thick.
  • the width of the annular groove can be equal to the thickness of the flexible substrate.
  • the cross-sectional shape of the annular groove may be any one of a U shape, an arc shape, and a trapezoidal shape.
  • FIG. 11 is a schematic flow chart of a method for fabricating a flexible substrate according to a ninth embodiment of the present invention. As shown in FIG. 11, a method for fabricating a flexible substrate according to a ninth embodiment of the present invention includes:
  • Step S10 ITO is applied to one side of the ultra-thin glass layer to form an ITO layer.
  • Step S20 attaching a polarizer to the other side of the ultra-thin glass layer not coated with ITO to form a polarizer layer.
  • Step S30 coating hardening is performed on the side of the polarizer layer not in contact with the ultra-thin glass layer to form a hard layer.
  • Step S40 The OLED device is subjected to a lamination operation with the film layer formed by the above steps using a pressure sensitive adhesive.
  • step S40 includes, but is not limited to, an attaching operation or a coating operation to improve the adaptability of the embodiment of the present invention.
  • Step S50 performing a packaging operation using a water oxygen barrier rubber.
  • ITO is first applied to one side of the ultra-thin glass layer to form an ITO layer, and a polarizer is attached to the other side of the ultra-thin glass layer not coated with ITO to form a polarizer layer, and then in the polarizer The side of the layer not in contact with the ultra-thin glass layer is subjected to coating hardening to form a hard layer, and finally the pressure sensitive adhesive is used to laminate the OLED device (the OLED layer and the backing layer) with the film layer formed by the above steps. And the water and oxygen barrier rubber is used for packaging operation.
  • FIG. 12 is a schematic flow chart of a method for fabricating a flexible substrate according to a tenth embodiment of the present invention.
  • the tenth embodiment of the present invention is extended on the basis of the ninth embodiment of the present invention.
  • the tenth embodiment of the present invention is substantially the same as the ninth embodiment of the present invention. The differences will be described below, and the details are not described again.
  • the method for fabricating a flexible substrate according to the tenth embodiment of the present invention replaces step S20 of the method for fabricating a flexible substrate provided in the ninth embodiment with step S21 and step S22, and step S30 with step S31, as follows: :
  • Step S21 A 1/4 ⁇ slide layer is coated on the other side of the ultra-thin glass layer not coated with ITO.
  • Step S22 laminating the PVA layer and the ITO layer with a pressure sensitive adhesive.
  • Step S31 coating hardening is performed on the side where the PVA layer is not in contact with the ultra-thin glass layer to form a hard layer.
  • ITO is first applied to one side of the ultra-thin glass layer to form an ITO layer, and then a 1/4 ⁇ slide layer is coated on the other side of the ultra-thin glass layer not coated with ITO, using a pressure-sensitive adhesive.
  • the PVA layer is bonded to the ITO layer, and the coating layer is hardened on the side of the PVA layer that is not in contact with the ultra-thin glass layer to form a hard layer.
  • the OLED device (the OLED layer and the back sheet glue) is used by the pressure sensitive adhesive.
  • the layer) is subjected to a lamination operation with the film layer formed in the above step, and the encapsulation operation is performed using a water-oxygen barrier rubber.
  • a user terminal is further provided, the user terminal comprising the flexible substrate described in any of the above embodiments.
  • the user terminal includes, but is not limited to, a user terminal such as a mobile phone or a tablet computer.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

本发明实施例提供一种柔性基板及柔性基板制作方法，该柔性基板包括层叠设置的硬质层、有机功能层和背板层，有机功能层贴附到背板层，硬质层与有机功能层之间包括偏光片层和触控层，触控层包括玻璃基板和涂覆到玻璃基板一侧的导电层。本发明实施例提供的柔性基板通过设置玻璃基板，并将导电材料采用涂覆工艺涂覆到玻璃基板以形成导电层，将涂覆有导电层的玻璃基板与其他膜层层叠设置从而生成柔性基板的方式，最终实现了在降低柔性基板厚度和膜层数量的同时降低弯折过程中发生膜层断裂情况的几率。

Description

柔性基板及柔性基板制作方法
本申请要求2017年10月31日提交的申请号为No.201711051574.1的中国申请的优先权，通过引用将其全部内容并入本文。
技术领域
本发明涉及显示技术领域，具体涉及一种柔性基板及柔性基板制作方法。
发明背景
为了满足用户日益丰富的应用需求，现有一些智能终端配备了超大面积的显示屏。但是，配备超大面积显示屏的智能终端亦存在不便携带的问题，为此，一些厂商开始采用柔性显示屏替换智能终端上的普通显示屏。
图1所示为现有技术中柔性基板的结构示意图。如图1所示，现有技术中的柔性基板包括依次层叠设置的盖板11、OCA(胶黏剂)层12、TP(触控)层13、OCA(胶黏剂)层12、POL(偏光片)层14、TFE(薄膜封装)层15、OLED(Organic Light-Emitting Diode)层16和背板膜层17，其中，现有柔性基板中具备保护屏体作用的盖板11为PI(Polyimide)或PET(Polyethylene Terephthalate)材质，因此ITO(导电材料)只能做成TP层13形式进行贴附，而不能采用厚度更轻薄的涂覆工艺设置。
现有柔性基板中，各膜层的大致厚度如下：盖板11厚度为150μm，OCA(胶黏剂)层12厚度为25μm，TP(触控)层13厚度为50μm，POL(偏光片)层14厚度为75μm，TFE(薄膜封装)层15厚度为15μm，OLED(Organic Light-Emitting Diode)层16厚度为20μm，背板膜层17厚度为100μm。也就是说，现有柔性基板的整体厚度大致为460μm。
由于现有柔性基板一般采用各膜层相互贴附的工艺生成，因此导致屏体较厚且在弯折过程中极易出现膜层断裂等问题。
发明内容
有鉴于此，本发明实施例提供了一种柔性基板及柔性基板制作方法，以解决现有柔性基板屏体较厚、膜层数量多且在弯折过程中极易出现膜层断裂情况的问题。
第一方面，本发明一实施例提供一种柔性基板，该柔性基板包括层叠设置的硬质层、有机功能层和背板层，有机功能层贴附到背板层，硬质层与有机功能层之间包括偏光片层和触控层，触控层包括玻璃基板和涂覆到玻璃基板一侧的导电 层。
在本发明一实施例中，所述触控层中的玻璃基板与有机功能层直接接触。
在本发明一实施例中，所述玻璃基板与所述有机功能层之间具有粘合层。
在本发明一实施例中，所述硬质层包括以涂覆方式设置的硬质涂层，所述触控层的玻璃基板包括超薄玻璃层，所述粘合层包括压敏胶层。
在本发明一实施例中，偏光片层设置到触控层的玻璃基板的未涂覆导电层的一侧。
在本发明一实施例中，偏光片层包括PVA层和1/4λ玻片层，1/4λ玻片层涂覆到触控层的玻璃基板的未涂覆导电层的一侧，PVA层设置到玻璃基板与硬质层之间或玻璃基板与有机功能层之间。
在本发明一实施例中，该柔性基板进一步包括粘合层，该粘合层设置于触控层的导电层与偏光片层的PVA层之间。
在本发明一实施例中，该柔性基板进一步包括粘合层，该粘合层设置于触控层的导电层与有机功能层之间。
在本发明一实施例中，该柔性基板进一步包括封装层，该封装层设置于触控层的玻璃基板与有机功能层之间包括的膜层的外围。
在本发明一实施例中，硬质层的设置方式为贴附方式或涂覆方式。
在本发明一实施例中，触控层的玻璃基板的厚度为25μm至70μm。
在本发明一实施例中，该柔性基板进一步包括第一柔性玻璃层和第二柔性玻璃层，第一柔性玻璃层和第二柔性玻璃层之间设置有密封层，密封层中部包括空槽区域，以及设置在空槽区域内的硬质层、有机功能层和背板层。
在本发明一实施例中，该柔性基板进一步包括紧邻第一柔性玻璃层设置的第一硅油层；和/或，紧邻第二柔性玻璃层设置的第二硅油层。
第二方面，本发明一实施例还提供一种柔性基板制作方法，包括：在玻璃基板的一侧涂覆导电材料以形成导电层；在玻璃基板未涂覆导电材料的一侧设置偏光片层；在偏光片层未与玻璃基板接触的一侧进行涂层硬化以形成硬质层；将导电层、偏光片层、硬质层与层叠设置的有机功能层和背板层进行叠附操作。
在本发明一实施例中，一种柔性基板制作方法，包括：在玻璃层的一侧涂覆导电材料以形成导电层；在在玻璃层未涂覆导电材料的另一侧涂覆1/4λ玻片层，将PVA层与导电层进行贴合操作；在PVA层未与玻璃层接触的一侧进行涂层硬化以形成硬质层；将所述导电层、所述PVA层、所述硬质层与层叠设置的有机功能层和背板层进行叠附操作。
在本发明一实施例中，该柔性基板制作方法进一步包括：对玻璃基板与有机功能层之间的膜层进行封装操作。
本发明实施例提供的柔性基板通过设置玻璃基板，并将导电材料采用涂覆工 艺涂覆到玻璃基板以形成导电层，将涂覆有导电层的玻璃基板与其他膜层层叠设置从而生成柔性基板的方式，最终实现了在降低柔性基板厚度和膜层数量的同时降低弯折过程中发生膜层断裂情况的几率。
附图简要说明
图1所示为现有技术中柔性基板的结构示意图。
图2所示为本发明第一实施例提供的柔性基板的结构示意图。
图3所示为本发明第二实施例提供的柔性基板的结构示意图。
图4所示为本发明第三实施例提供的柔性基板的结构示意图。
图5所示为本发明第四实施例提供的柔性基板的结构示意图。
图6所示为本发明第五实施例提供的柔性基板的俯视示意图。
图7所示为本发明第五实施例提供的柔性基板的主视示意图。
图8所示为本发明第六实施例提供的柔性基板的结构示意图。
图9所示为本发明第七实施例提供的柔性基板的结构示意图。
图10所示为本发明第八实施例提供的柔性基板的结构示意图。
图11所示为本发明第九实施例提供的柔性基板制作方法的流程示意图。
图12所示为本发明第十实施例提供的柔性基板制作方法的流程示意图。
实施本发明的方式
为使本发明的目的、技术手段和优点更加清楚明白，以下结合附图对本发明作进一步详细说明。
图2所示为本发明第一实施例提供的柔性基板的结构示意图。如图2所示，本发明第一实施例提供的柔性基板包括依次自上而下层叠设置的硬质层21、偏光片层22、触控层23、有机功能层24和背板层25，其中，触控层23包括玻璃基板和涂覆到玻璃基板一侧的导电层(图中未示出)。
具体实现包括下述两种情况：
第一种情况：触控层23中的导电层涂覆到玻璃基板的上端面(其中，上端面为如图2所示的层叠设置方向的上端面)，此时，触控层23中的玻璃基板与有机功能层24直接接触。
直接接触的玻璃基板与有机功能层24之间需要借助粘合层进行粘合固定。此外，为了充分阻隔外界的水氧等物质对有机功能层24的破坏，需要对玻璃基板与有机功能层24之间的粘合层的外围进行封装操作以形成封装层，该封装层沿粘合层的未与柔性基板的其它膜层接触的外围设置。
第二种情况：触控层23中的导电层涂覆到玻璃基板的下端面(其中，下端面 为如图2所示的层叠设置方向的下端面)，此时，触控层23中的玻璃基板与有机功能层24之间包括涂覆到玻璃基板的导电层。此外，触控层23与有机功能层24之间还应当包括粘合层(图中未示出)，即粘合层设置于导电层和有机功能层24之间，并且对导电层和粘合层进行封装操作形成封装层，该封装层沿导电层和粘合层的未与柔性基板的其它膜层接触的外围设置，以充分阻隔外界的水氧等物质对有机功能层24的破坏。
在本发明实施例的具体实现情况的第二种情况中，触控层23的导电层和有机功能层24之间包括粘合层的目的是为了牢固粘合，以提高本发明实施例提供的柔性基板的稳定性。
应当理解，有机功能层24既可以为OLED层，又可以为具备其他功能的膜层。
此外，背板层25既可以是传统的屏体中的背板膜层，又可以是集成了其他功能的背板层。
本发明第一实施例提供的柔性基板通过设置玻璃基板，并将导电材料采用涂覆工艺涂覆到玻璃基板以形成导电层，将涂覆有导电层的玻璃基板与其他膜层层叠设置从而生成柔性基板的方式，最终实现了在降低柔性基板厚度和膜层数量的同时降低弯折过程中发生膜层断裂情况的几率。
在本发明一实施例中，硬质层的设置方式为贴附方式，即硬质层以盖板形式贴附到相邻膜层，以提高本发明实施例提供的柔性基板的适应性。
在本发明一实施例中，硬质层的设置方式为涂覆方式，即硬质层以涂覆方式涂覆到相邻膜层，与贴附方式相比，涂覆方式能够降低硬质层的厚度，从而进一步降低弯折过程中发生膜层断裂情况的几率。
在本发明一实施例中，将柔性基板的偏光片层设置到触控层的玻璃基板的未涂覆导电层的一侧，即借助于玻璃基板将偏光片层与导电层分别设置到玻璃基板的相对两侧，以便玻璃基板与同样分别设置到玻璃基板相对两侧的硬质层和有机功能层共同形成对偏光片层和/或导电层的有效保护。
图3所示为本发明第二实施例提供的柔性基板的结构示意图。在本发明第一实施例的基础上延伸出本发明第二实施例，本发明第二实施例与本发明第一实施例基本相同，下面着重叙述不同之处，相同之处不再赘述。
如图3所示，本发明第二实施例提供的柔性基板包括依次自上而下层叠设置的硬质涂层31、POL(偏光片)层14、超薄玻璃层33、ITO(导电材料)层34、压敏胶层35、OLED(Organic Light-Emitting Diode)层16和背板膜层17，以及沿ITO层34和压敏胶层35未与柔性基板的其它膜层接触的外围设置的水氧阻隔胶材层36。
本发明第二实施例提供的柔性基板通过设置水氧阻隔胶材层36(即封装层)的方式，实现了阻隔外界的水氧等物质对OLED层16的破坏的目的。
在本发明一实施例中，超薄玻璃层33中超薄玻璃为厚度70μm、弯折半径为3mm至5mm区间内的超薄玻璃，以降低本发明实施例提供的柔性基板的厚度。
在本发明另一实施例中，超薄玻璃层33中超薄玻璃为厚度50μm、弯折半径为3mm至5mm区间内的超薄玻璃，以进一步降低本发明实施例提供的柔性基板的厚度。
在本发明另一实施例中，超薄玻璃层33中超薄玻璃为厚度25μm、弯折半径为3mm至5mm区间内的超薄玻璃，以进一步降低本发明实施例提供的柔性基板的厚度。
本发明第二实施例提供的柔性基板的各膜层的大致厚度如下：硬质涂层31厚度为10μm，POL层14厚度为75μm，超薄玻璃层33厚度为70μm或50μm，ITO层34厚度为5μm，压敏胶层35厚度为7μm，OLED层16厚度为20μm，背板膜层17厚度为100μm。也就是说，本发明第二实施例提供的柔性基板的整体厚度大致为287μm(当超薄玻璃层33厚度为70μm时)或267μm(当超薄玻璃层33厚度为50μm时)。
本发明第二实施例提供的柔性基板通过将第一实施例提供的柔性基板的硬质层21限定为以涂覆方式设置的硬质涂层31，将触控层23的玻璃基板限定为超薄玻璃层33，并且将粘合层限定为压敏胶层35的方式，在保证屏体表面硬度的同时降低了柔性基板的整体厚度和膜层数量，并且有效避免了各膜层之间的膜层断裂问题，提高了弯折可靠性。
图4所示为本发明第三实施例提供的柔性基板的结构示意图。在本发明第二实施例的基础上延伸出本发明第三实施例，本发明第三实施例与本发明第二实施例基本相同，下面着重叙述不同之处，相同之处不再赘述。
如图4所示，本发明第三实施例提供的柔性基板将第二实施例提供的柔性基板中的POL层14替换为PVA(聚乙烯醇)层41和1/4λ玻片层42。具体地，本发明第三实施例提供的柔性基板包括依次自上而下层叠设置的硬质涂层31、PVA层41、压敏胶层35、ITO层34、超薄玻璃层33、1/4λ玻片层42、压敏胶层35、OLED层16和背板膜层17，以及沿超薄玻璃层33和OLED层16之间的1/4λ玻片层42和压敏胶层35未与柔性基板的其它膜层接触的外围设置的水氧阻隔胶材层36，设置水氧阻隔胶材层36以充分阻隔外界的水氧等物质对OLED层16的破坏。
本发明第三实施例提供的柔性基板的各膜层的大致厚度如下：硬质涂层31厚度为10μm，PVA层41厚度为12μm，压敏胶层35厚度为7μm，ITO层34厚度为5μm，超薄玻璃层33厚度为70μm或50μm，1/4λ玻片层42厚度为5μm，OLED层16厚度为20μm，背板膜层17厚度为100μm。也就是说， 本发明第三实施例提供的柔性基板的整体厚度大致为234μm(当超薄玻璃层33厚度为70μm时)或214μm(当超薄玻璃层33厚度为50μm时)。
本发明第三实施例提供的柔性基板通过将第二实施例提供的柔性基板的POL层14替换为PVA层41和1/4λ玻片层42的方式，在保留柔性基板各膜层功能的同时进一步降低了柔性基板的整体厚度，并且，由于1/4λ玻片层42同样是以涂覆的方式设置到超薄玻璃层33，因此本发明第三实施例提供的柔性基板对弯折过程中的膜层分离现象具备了更加明显的改善效果。
在本发明第三实施例中，在触控层的导电层(即ITO层34)和偏光片层的PVA层41之间设置粘合层(即压敏胶层35)，能够实现柔性基板的膜层之间的有效固定，进一步提高了本发明实施例提供的柔性基板的稳定性。
应当理解，在本发明一实施例中，PVA层41和1/4λ玻片层42亦可以设置在超薄玻璃层33的同一侧，以充分提高本发明实施例提供的柔性基材的适应性。比如，将ITO层34涂覆到超薄玻璃层33的靠近硬质涂层31的一侧，将PVA层41和1/4λ玻片层42均设置到超薄玻璃层33和OLED层16之间，并借助压敏胶层35进行粘合以及借助水氧阻隔胶材层36进行封装操作。又比如，将PVA层41和1/4λ玻片层42均设置到硬质涂层31和超薄玻璃层33之间，而ITO层34涂覆到超薄玻璃层33的靠近OLED层16的一侧。
应当理解，在本发明上述实施例中所提供的柔性基板中，均可将硬质涂层31替换为现有柔性基板中的盖板11，以提高本发明上述实施例提供的柔性基板的适应性。替换后的柔性基板与现有技术中的柔性基板相比，同样能够实现降低柔性基板厚度、减少弯折过程中的膜层断裂情况的技术效果。
此外，应当理解，在本发明上述实施例中所提供的柔性基板中，均可将压敏胶层35替换为现有柔性基板中的OCA层12，以提高本发明上述实施例提供的柔性基板的适应性。替换后的柔性基板与现有技术中的柔性基板相比，同样能够实现降低柔性基板厚度、减少弯折过程中的膜层断裂情况的技术效果。
图5所示为本发明第四实施例提供的柔性基板的结构示意图。如图5所示，该柔性基板包括：叠加的第一柔性玻璃层101和第二柔性玻璃层102、设置在第一柔性玻璃层101和第二柔性玻璃层102之间的密封层103、以及显示面板104。密封层103中部包括空槽区域1031，显示面板104设置在密封层103的空槽区域1031中，其中空槽区域1031的底面积尺寸大于显示面板104的尺寸，其中，显示面板104包括偏光片层、触控层和有机功能层。
柔性玻璃具有可弯折特性。经试验，柔性玻璃可以承受住10万次弯折半径为5mm的弯折疲劳性测试。当玻璃薄到一定程度时，就体现出了玻璃的柔软性，可以弯曲而不破裂。超薄的柔性玻璃具有玻璃的硬度、透明性、耐热性、电气绝缘性、不透气性以及氧化和光照环境具有相对稳定的机械和化学性能，又可弯曲、 重量轻。本发明实施例对第一柔性玻璃层101和第二柔性玻璃层102的具体厚度不作限定。
由此可见，本发明实施例采用柔性玻璃层替代柔性基板中的硬质层和背板层。由于柔性玻璃本身具有优良的挺度和耐弯折性能，可有效解决现有柔性基板在挺度和预防膜层断裂之间存在需求矛盾的问题。同时，由于显示面板104是设置在第一柔性玻璃层101和第二柔性玻璃层102之间的空槽区域1031中，且空槽区域1031的底面积尺寸大于显示面板104的尺寸，这样当柔性显示面板104发生弯折时，显示面板104可在空槽区域1031中相对于第一柔性玻璃层101和第二柔性玻璃层102滑动，从而缓解了弯折应力，可有效避免显示面板104内部的膜层分层，进一步提高了柔性基板的耐弯折性能，提高了产品的可靠性。
应当理解，密封层103中空槽区域1031的具体形状可根据显示面板104的形状而调整。一般来说，只要比显示面板104稍大一些且与显示面板104呈相同的形状即可。例如当显示面板104呈矩形时，密封层103中的空槽区域1031也可呈矩形，只不过该空槽区域1031的底面积尺寸比显示面板104大，以便于显示面板104在弯折的过程中在空槽区域1031中滑动。本发明对密封层103中空槽区域1031的具体形状不做限定。
在本发明一实施例中，为了使得显示面板104在弯折过程中在空槽区域1031中的滑动更加灵活顺畅，可在显示面板104和第一柔性玻璃层101之间设置第一硅油层，和/或在显示面板104和第二柔性玻璃层102之间设置第二硅油层。然而应当理解，即使没有第一硅油层和第二硅油层，显示面板104也是可以在空槽区域1031中滑动的，本发明对该柔性基板是否包括该第一硅油层和第二硅油层不做限定。
在本发明一实施例中，密封层103与第一柔性玻璃层101和/或第二柔性玻璃层102之间通过粘合层贴合固定。粘合层的材质可采用透明的光学粘结剂(OCA(Optically Clear Adhesive))，然而本发明对粘合层的具体材质不做限定。
在本发明一实施例中，密封层103可采用硅橡胶制成。硅橡胶材料可随着弯折应力的变化而发生弹性变形，具有良好的耐弯折性能和密封性能。然而应当理解，密封层103也可采用其他密封材料制成，本发明对密封层103的具体材质也不作限定。
图6和图7分别所示为本发明五实施例提供的柔性基板的俯视示意图和主视示意图。图8所示为本发明第六实施例提供的柔性基板的结构示意图。如图6至图8所示，该柔性基板包括：柔性玻璃层10和设置于柔性玻璃层10的内部的显示面板104。
柔性玻璃层10由中间带有凹槽第一柔性玻璃层101和第二柔性玻璃层102共同组成。该中间带有凹槽的第一柔性玻璃层101可以通过在一块柔性玻璃的中间 通过刻蚀等方法进行挖槽制备。
应当理解，该中间带有凹槽的第一柔性玻璃101可以自己制备，也可直接通过玻璃销售公司购买得来，其中的凹槽可通过刻蚀等工艺方法制得，本发明对该中间带有凹槽的第一柔性玻璃101的来源或制备方式不作限定。
显示面板104设置在第一柔性玻璃层101的凹槽内。可以采用使用光学胶的贴合方式，将显示面板104设置在第一柔性玻璃层101的凹槽中。由于有第一柔性玻璃层101的凹槽的存在，有效的限制了第二柔性玻璃层102的滑动范围，防止第二柔性玻璃层102在弯折的过程中发生过度的位置偏移而导致柔性基板整体失效。
第二柔性玻璃层102设置在显示面板104上，将第二柔性玻璃层102通过光学胶贴合在显示面板104上，并且设置完成后，第二柔性玻璃层102的上表面应当与第一柔性玻璃层101的上表面保持同一水平。在本发明一实施例中，中间带有凹槽的第一柔性玻璃101的凹槽的横截面积要大于显示面板104的横截面积，这样柔性基板在弯折过程中，显示面板104可以在凹槽中滑动，从而可进一步分散弯折应力，避免显示面板104的断裂失效。并且第二柔性玻璃层102应当位于第一柔性玻璃层101的凹槽中，由于第一柔性玻璃层101的存在，有效抑制了第二柔性玻璃层102的滑移，提高了柔性基板的耐弯折特性。
应当理解，显示面板104设置在第一柔性玻璃101的凹槽内的方式可以是通过光学胶粘合或通过硅油贴合等，当通过硅油贴合时，显示面板104可在凹槽内更好地滑动以缓解弯折应力，但本发明对具体的设置方式和所采用的结合材料不作限定。
本发明一实施例中，第二柔性玻璃层102的周边与第一柔性玻璃层101的凹槽的侧边采用激光烧结玻璃粉工艺完成封装。封装后的玻璃粉层104如图8所示。激光烧结后的玻璃粉层104填充了第二柔性玻璃层102的周边和第一柔性玻璃层101的凹槽的侧边之间的缝隙，从而避免了外部水氧进入显示面板104内部封装完成后的显示面板104上表面覆盖有第二柔性玻璃层102，下表面和侧边覆盖有第一柔性玻璃层101的保护，四周有玻璃粉层104进行保护，有效地阻隔了水分和氧气的进入，提升了该柔性基板的水氧阻隔性能。
图9所示为本发明七实施例提供的柔性基板的结构示意图。如图9所示，本发明实施例提供的柔性基板包括：叠加的第一模组材料层1和第二模组材料层3；以及至少一个设置在第一模组材料层1和第二模组材料层3之间的应变隔断层2；其中，应变隔断层2包括腔室221以及包围在腔室外围的弹性材料层211。
应当理解，模组材料层为构成柔性基板的功能单元，每个模组材料层又有可能由多个功能层构成。例如，模组材料层可以是柔性显示屏体、触控层以及偏光片层等，为了将不同的模组材料层区分开，本发明实施例引入了第一和第二等限 定词，如第一模组材料层1和第二模组材料层3等。
本发明实施例提供的柔性基板，在第一模组材料层1和第二模组材料层3之间设置应变隔断层2。由于应变隔断层2可以有效地将第一模组材料层1和第二模组材料层3的应变隔断，因此可以有效地阻止发生弯曲变形时第一模组材料层1和第二模组材料层3之间的应变的传递，降低第一模组材料层1和第二模组材料层3的应变从而显著提高了柔性基板的耐弯折性能，提高了产品的可靠性。
然而应当理解，本发明实施例提供柔性基板不限于仅包括图9所示的第一模组材料层1和第二模组材料层3，也可包括更多层模组材料层。并且相邻的两层模组材料层之间均可设置应变隔断层2。本发明实施例对模组材料层的层数以及相邻的哪些模组材料层之间设置应变隔断层2不作具体限定。
在一个实施例中，腔室221内可填充有气体也可为真空状态，都可起到隔断应变的作用，然而腔室221内填充有气体时，可以平衡腔室221内外部的气压。
在一个实施例中，气体可为空气或惰性气体中的一种或几种的混合。空气资源丰富并且采集方便，腔室221内填充空气可以降低柔性基板的整体制作成本。气体也可为惰性气体，由于惰性气体的化学性能稳定，不易和与其接触物质发生化学反应，因此腔室221中采用惰性气体可以提高柔性基板的使用寿命。然而应当理解，本发明实施例对腔室221中的气体的种类不做具体限定。
此外，在实际的应用场景下，显示面板104可能还需通过导电引线与外部电路结构进行电连接。这可以通过在柔性玻璃层10的表面(侧面、上面或底面均可)进行打孔，然后在孔中填充导电材料来形成与显示面板104电连接的导电引线，孔中的导电材料与孔之间的间隙可采用密封材料密封。或者，还可以在第一柔性玻璃层101的凹槽侧面先镀一层延伸至第一柔性玻璃层101外表面的具有导电性能的薄膜，将该薄膜刻蚀成导电引线的图案，然后再将第二柔性玻璃层102与第一柔性玻璃层101封装即可。然而应当理解，该封装在柔性玻璃层10中的显示面板104还可通过其他的方式形成与外部电路结构的电连接，但本发明对该导电引线的具体结构和形成方式并不作限定。
图10所示为本发明八实施例提供的柔性基板的结构示意图。如图10所示，除了之前的实施例中提到的第一柔性玻璃层101、第二柔性玻璃层102以及设置于第一柔性玻璃层101第一表面的显示面板104外，该柔性基板还包括设置于第一柔性玻璃层101第二表面的走线区域30，其中第二表面为与第一表面相对的表面，该走线区域30与第一表面的显示面板104电性连接。
在本实施例中，第一柔性玻璃层101的第一表面即为正面，其上可依次设置TFT阵列层、阳极层、有机发光层和阴极层等，这些功能层共同构成显示面板104，成为显示器件的显示区域。第一柔性玻璃层101的第二表面即为背面，走线区域30作为非显示部分设置于第一柔性玻璃层101背面的相应位置，如四周的边缘区 域，大大减小了器件正面非显示区域的面积，使得器件可实现窄边框甚至是全面屏的显示效果。
在本实施例提供的显示器件中，将非显示部分的走线区域设置于基板的背面，使其与正面的OLED模块电性连接完成走线功能的同时，大大减小了显示器件正面的非显示区域面积，使得器件实现了窄边框甚至是全面屏的显示，从而增强了屏幕的显示效果，提升了用户的视觉体验。
在本发明一实施例中，第一柔性玻璃层101包括过孔，则走线区域30的电路走线可通过第一柔性玻璃层101上的过孔连接至位于正面的显示面板104。具体地，该过孔结构可以与电路走线一一对应设置，也可以设置一个过孔对应多条电路走线，或者一个过孔对应所有电路走线。对于过孔的形成，可通过激光进行打孔，也可通过化学方法实现，孔壁可蒸镀如铜等各种导电介质。这样，第一柔性玻璃层101背面走线区域30的电路走线就可通过过孔与正面的显示面板104形成电性连接。
在本发明一实施例中，当所要制备的最终显示屏产品需要有预设的曲面形状时(例如中间为平面且四周为曲面的2.5D曲面，或中间和四周均为曲面的3D曲面)，可先制备一个具有该预设曲面形状的边框，然后再将本发明实施例所提供的柔性基板安装到该边框内。该边框的周长可小于柔性基板的周长。柔性基板本身具有可弯曲特性，当将该整体安装到周长比该整体小的边框中时，该整体便由平面弯曲成了曲面。
在一个实施例中，将柔性基板安装到边框内可包括：将边框以框贴的方式贴合到柔性基板的整体的四周。为了确保柔性AMOLED面板和柔性玻璃安装的更牢靠，可以在边框的内表面设置环形凹槽。
环形凹槽的深度优选3-5毫米，这样既可以保证安装牢靠，又不至于使边框过于厚重。环形凹槽的宽度可等于柔性基板的厚度。
环形凹槽的断面形状可以是U形、弧形、梯形中的任一种。
图11所示为本发明第九实施例提供的柔性基板制作方法的流程示意图。如图11所示，本发明第九实施例提供的柔性基板制作方法包括：
步骤S10：将ITO涂覆到超薄玻璃层的一侧以形成ITO层。
步骤S20：在超薄玻璃层未涂覆ITO的另一侧贴附偏光片以形成偏光片层。
步骤S30：在偏光片层未与超薄玻璃层接触的一侧进行涂层硬化以形成硬质层。
步骤S40：利用压敏胶将OLED器件与上述步骤形成的膜层进行叠附操作。
应当理解，步骤S40中的叠附操作包括但不限于为贴附操作或涂覆操作，以提高本发明实施例的适应性。
步骤S50：利用水氧阻隔胶材进行封装操作。
实际应用过程中，首先将ITO涂覆到超薄玻璃层的一侧以形成ITO层，在超薄玻璃层未涂覆ITO的另一侧贴附偏光片以形成偏光片层，然后在偏光片层未与超薄玻璃层接触的一侧进行涂层硬化以形成硬质层，最后利用压敏胶将OLED器件(OLED层和背板胶层)与上述步骤形成的膜层进行叠附操作，并且利用水氧阻隔胶材进行封装操作。
图12所示为本发明第十实施例提供的柔性基板制作方法的流程示意图。在本发明第九实施例的基础上延伸出本发明第十实施例，本发明第十实施例与本发明第九实施例基本相同，下面着重叙述不同之处，相同之处不再赘述。
如图12所示，本发明第十实施例提供的柔性基板制作方法将第九实施例提供的柔性基板制作方法的步骤S20替换为步骤S21和步骤S22、将步骤S30替换为步骤S31，具体如下：
步骤S21：在超薄玻璃层未涂覆ITO的另一侧涂覆1/4λ玻片层。
步骤S22：利用压敏胶将PVA层与ITO层进行贴合操作。
步骤S31：在PVA层未与超薄玻璃层接触的一侧进行涂层硬化以形成硬质层。
实际应用过程中，首先将ITO涂覆到超薄玻璃层的一侧以形成ITO层，然后在超薄玻璃层未涂覆ITO的另一侧涂覆1/4λ玻片层，利用压敏胶将PVA层与ITO层进行贴合操作，并在PVA层未与超薄玻璃层接触的一侧进行涂层硬化以形成硬质层，最后利用压敏胶将OLED器件(OLED层和背板胶层)与上述步骤形成的膜层进行叠附操作，并且利用水氧阻隔胶材进行封装操作。
在本发明一实施例中，还提供一种用户终端，该用户终端包括上述任一实施例所描述的柔性基板。该用户终端包括但不限于手机、平板电脑等用户终端。
以上仅为本发明的较佳实施例而已，并非用于限定本发明的保护范围。凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (15)

  1. 一种柔性基板，包括层叠设置的硬质层、有机功能层和背板层，所述有机功能层贴附到所述背板层，其中，所述硬质层与所述有机功能层之间包括偏光片层和触控层，所述触控层包括玻璃基板和涂覆到所述玻璃基板一侧的导电层。
  2. 如权利要求1所述的柔性基板，其中，所述触控层中的玻璃基板与所述有机功能层直接接触。
  3. 如权利要求1所述的柔性基板，其中，所述玻璃基板与所述有机功能层之间具有粘合层。
  4. 如权利要求3所述的柔性基板，其中，所述硬质层包括以涂覆方式设置的硬质涂层，所述触控层的玻璃基板包括超薄玻璃层，所述粘合层包括压敏胶层。
  5. 如权利要求1所述的柔性基板，其中，所述偏光片层设置到所述触控层的所述玻璃基板的未涂覆所述导电层的一侧。
  6. 如权利要求1所述的柔性基板，其中，所述偏光片层包括PVA层和1/4λ玻片层，所述1/4λ玻片层涂覆到所述触控层的所述玻璃基板的未涂覆所述导电层的一侧，所述PVA层设置到所述玻璃基板与所述硬质层之间或所述玻璃基板与所述有机功能层之间。
  7. 如权利要求6所述的柔性基板，其中，进一步包括粘合层，所述粘合层设置于所述触控层的所述导电层与所述偏光片层的所述PVA层之间。
  8. 如权利要求1所述的柔性基板，其中，进一步包括粘合层，所述粘合层设置于所述触控层的所述导电层与所述有机功能层之间。
  9. 如权利要求1所述的柔性基板，其中，进一步包括封装层，所述封装层设置于所述触控层的所述玻璃基板与所述有机功能层之间包括的膜层的外围。
  10. 如权利要求1所述的柔性基板，其中，所述硬质层的设置方式为贴附方式或涂覆方式。
  11. 如权利要求1所述的柔性基板，其中，所述触控层的所述玻璃基板的厚度为25μm至70μm。
  12. 如权利要求1所述的柔性基板，其中，进一步包括叠加的第一柔性玻璃层和第二柔性玻璃层，设置在所述第一柔性玻璃层和所述第二柔性玻璃层之间的密封层，所述密封层中部包括空槽区域，以及设置在所述空槽区域内的所述硬质层、所述有机功能层和所述背板层。
  13. 如权利要求12所述的柔性显示模组，其中，进一步包括紧邻所述第一柔性玻璃层设置的第一硅油层；和/或，紧邻所述第二柔性玻璃层设置的第二硅油层。
  14. 一种柔性基板制作方法，包括：
    在玻璃基板的一侧涂覆导电材料以形成导电层；
    在所述玻璃基板未涂覆所述导电材料的一侧设置偏光片层；
    在所述偏光片层未与所述玻璃基板接触的一侧进行涂层硬化以形成硬质层；
    将所述导电层、所述偏光片层、所述硬质层与层叠设置的有机功能层和背板层进行叠附操作，
    或者包括：
    在玻璃层的一侧涂覆导电材料以形成导电层；
    在所述玻璃层未涂覆所述导电材料的另一侧涂覆1/4λ玻片层，将PVA层与所述导电层进行贴合操作；
    在所述PVA层未与所述玻璃层接触的一侧进行涂层硬化以形成硬质层；
    将所述导电层、所述PVA层、所述硬质层与层叠设置的有机功能层和背板层进行叠附操作。
  15. 如权利要求14所述的柔性基板制作方法，其中，进一步包括对所述玻璃基板与所述有机功能层之间的膜层进行封装操作。
PCT/CN2018/091060 2017-10-31 2018-06-13 柔性基板及柔性基板制作方法 Ceased WO2019085486A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/524,233 US10892428B2 (en) 2017-10-31 2019-07-29 Flexible substrate and manufacturing method thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201711051574.1 2017-10-31
CN201711051574.1A CN107765921B (zh) 2017-10-31 2017-10-31 柔性基板及柔性基板制作方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US16/524,233 Continuation US10892428B2 (en) 2017-10-31 2019-07-29 Flexible substrate and manufacturing method thereof

Publications (1)

Publication Number Publication Date
WO2019085486A1 true WO2019085486A1 (zh) 2019-05-09

Family

ID=61270316

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/091060 Ceased WO2019085486A1 (zh) 2017-10-31 2018-06-13 柔性基板及柔性基板制作方法

Country Status (4)

Country Link
US (1) US10892428B2 (zh)
CN (1) CN107765921B (zh)
TW (1) TWI718399B (zh)
WO (1) WO2019085486A1 (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10985344B2 (en) 2017-10-27 2021-04-20 Applied Materials, Inc. Flexible cover lens films
US11579339B2 (en) 2018-05-10 2023-02-14 Applied Materials, Inc. Replaceable cover lens for flexible display
US11789300B2 (en) 2019-06-26 2023-10-17 Applied Materials, Inc. Flexible multi-layered cover lens stacks for foldable displays
US11988810B2 (en) 2018-08-14 2024-05-21 Applied Materials, Inc. Multi-layer wet-dry hardcoats for flexible cover lens

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107153483B (zh) * 2017-05-09 2019-12-03 京东方科技集团股份有限公司 一种触控显示模组、显示装置及其驱动方法
CN107765921B (zh) 2017-10-31 2021-06-11 云谷（固安）科技有限公司 柔性基板及柔性基板制作方法
CN108600426A (zh) * 2018-03-28 2018-09-28 努比亚技术有限公司 终端屏幕、终端屏幕的装配方法及计算机可读存储介质
CN112002241B (zh) * 2018-04-20 2022-06-07 云谷（固安）科技有限公司 异形曲面盖板与柔性屏的贴合装置及贴合方法
CN108550586A (zh) * 2018-06-04 2018-09-18 云谷（固安）科技有限公司 显示模组及其制作方法、显示装置
CN108831305A (zh) 2018-06-22 2018-11-16 京东方科技集团股份有限公司 一种盖板及其制备方法、显示面板、显示装置
CN108962028B (zh) 2018-07-10 2020-03-31 云谷（固安）科技有限公司 柔性显示屏盖板、柔性显示模组和柔性显示装置
CN109671756A (zh) * 2018-12-17 2019-04-23 武汉华星光电半导体显示技术有限公司 显示屏及显示装置
CN112640119A (zh) * 2018-12-19 2021-04-09 深圳市柔宇科技股份有限公司 一种柔性屏幕
CN109979327B (zh) * 2019-04-22 2021-04-02 武汉华星光电半导体显示技术有限公司 一种柔性显示器
CN110246815B (zh) * 2019-06-25 2024-12-17 浙江荷清柔性电子技术有限公司 一种柔性芯片封装结构与方法
CN110423020B (zh) * 2019-07-29 2021-09-17 恩利克（浙江）智能装备有限公司 具有圆偏光功能的可折叠超薄玻璃保护盖板及制作方法
WO2021022525A1 (zh) * 2019-08-07 2021-02-11 深圳市柔宇科技有限公司 柔性显示模组及其制造方法、电子设备
WO2021035692A1 (en) * 2019-08-30 2021-03-04 Huawei Technologies Co., Ltd. Display screen and terminal device
US11432410B2 (en) 2019-12-05 2022-08-30 Samsung Electronics Co., Ltd. Portable communication device including display
CN111081742A (zh) * 2019-12-11 2020-04-28 武汉华星光电半导体显示技术有限公司 显示面板及显示装置
CN111276518A (zh) * 2020-02-10 2020-06-12 武汉华星光电半导体显示技术有限公司 一种柔性显示面板、显示装置及显示装置制备方法
CN111176490A (zh) * 2020-02-18 2020-05-19 恩利克（浙江）智能装备有限公司 一种可折叠amoled显示屏的结构与制作方法
CN111403464A (zh) * 2020-03-30 2020-07-10 昆山国显光电有限公司 显示面板、显示面板的制备方法及显示装置
JP2021176144A (ja) * 2020-04-28 2021-11-04 住友化学株式会社 フレキシブル積層体及び表示装置
JP2021176145A (ja) * 2020-04-28 2021-11-04 住友化学株式会社 フレキシブル積層体及び表示装置
CN111968504B (zh) * 2020-07-31 2022-04-19 合肥维信诺科技有限公司 可固态弯折的显示面板以及显示装置
KR102395757B1 (ko) * 2021-01-28 2022-05-10 (주)유티아이 플렉시블 커버 윈도우
CN113031818B (zh) * 2021-03-24 2022-09-20 业成科技（成都）有限公司 触控显示模组及电子设备
CN115598757A (zh) * 2021-06-28 2023-01-13 北京小米移动软件有限公司（Cn） 偏振光片及柔性显示模组
JP2023154554A (ja) * 2022-04-07 2023-10-20 住友化学株式会社 積層体および画像表示装置
CN115798332B (zh) * 2022-12-02 2026-01-06 Oppo广东移动通信有限公司 盖板结构、盖板结构的制作方法、柔性显示屏及电子设备

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203232403U (zh) * 2013-04-01 2013-10-09 江西合力泰科技股份有限公司 一种柔性可弯曲的电容触摸屏
KR20130115819A (ko) * 2012-04-13 2013-10-22 엘지디스플레이 주식회사 유기발광다이오드 표시장치 제조방법
CN104423693A (zh) * 2013-09-09 2015-03-18 三星显示有限公司 有机发光二极管显示器的制造方法及触摸面板的制造方法
CN105122190A (zh) * 2013-04-10 2015-12-02 日本瑞翁株式会社 带静电容量式触摸面板的显示装置
CN206209650U (zh) * 2016-08-31 2017-05-31 深圳市深越光电技术有限公司 一种曲面触摸显示屏
CN107037906A (zh) * 2016-10-25 2017-08-11 上海天马微电子有限公司 触控显示面板及触控显示装置
CN107765921A (zh) * 2017-10-31 2018-03-06 云谷（固安）科技有限公司 柔性基板及柔性基板制作方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200904950A (en) 2007-04-23 2009-02-01 Lg Chemical Ltd A retardation film, a method for preparing retardation film and polarizer comprising the retardation film
CN101853104B (zh) * 2010-06-02 2012-05-30 信利半导体有限公司 一种具有触摸屏功能的显示器及其制造方法
WO2012018234A2 (ko) 2010-08-05 2012-02-09 미래나노텍 주식회사 패턴화된 광위상 변조판 및 이의 제조방법
KR20120138991A (ko) 2011-06-16 2012-12-27 주식회사 동진쎄미켐 패턴된 위상지연필름의 제조방법
JP5798270B1 (ja) 2015-03-30 2015-10-21 グンゼ株式会社 タッチパネル
KR102378893B1 (ko) * 2015-05-29 2022-03-24 엘지디스플레이 주식회사 유기발광 표시장치
TWI736538B (zh) * 2015-06-26 2021-08-21 南韓商三星顯示器有限公司 可撓性顯示裝置
KR102337694B1 (ko) * 2015-11-20 2021-12-09 동우 화인켐 주식회사 플렉서블 터치스크린 패널 모듈 및 이를 포함하는 플렉서블 디스플레이 장치
KR102454824B1 (ko) * 2016-03-25 2022-10-18 삼성디스플레이 주식회사 플렉서블 표시장치
JP7042020B2 (ja) * 2016-08-15 2022-03-25 日東電工株式会社 フレキシブル画像表示装置用積層体、及び、フレキシブル画像表示装置
CN206541281U (zh) * 2016-10-12 2017-10-03 肖特玻璃科技(苏州)有限公司 一种电子器件结构及其使用的超薄玻璃板

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130115819A (ko) * 2012-04-13 2013-10-22 엘지디스플레이 주식회사 유기발광다이오드 표시장치 제조방법
CN203232403U (zh) * 2013-04-01 2013-10-09 江西合力泰科技股份有限公司 一种柔性可弯曲的电容触摸屏
CN105122190A (zh) * 2013-04-10 2015-12-02 日本瑞翁株式会社 带静电容量式触摸面板的显示装置
CN104423693A (zh) * 2013-09-09 2015-03-18 三星显示有限公司 有机发光二极管显示器的制造方法及触摸面板的制造方法
CN206209650U (zh) * 2016-08-31 2017-05-31 深圳市深越光电技术有限公司 一种曲面触摸显示屏
CN107037906A (zh) * 2016-10-25 2017-08-11 上海天马微电子有限公司 触控显示面板及触控显示装置
CN107765921A (zh) * 2017-10-31 2018-03-06 云谷（固安）科技有限公司 柔性基板及柔性基板制作方法

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10985344B2 (en) 2017-10-27 2021-04-20 Applied Materials, Inc. Flexible cover lens films
US11758757B2 (en) 2017-10-27 2023-09-12 Applied Materials, Inc. Flexible cover lens films
US12108622B2 (en) 2017-10-27 2024-10-01 Applied Materials, Inc. Flexible cover lens films
US11579339B2 (en) 2018-05-10 2023-02-14 Applied Materials, Inc. Replaceable cover lens for flexible display
US11988810B2 (en) 2018-08-14 2024-05-21 Applied Materials, Inc. Multi-layer wet-dry hardcoats for flexible cover lens
US11789300B2 (en) 2019-06-26 2023-10-17 Applied Materials, Inc. Flexible multi-layered cover lens stacks for foldable displays
US11934056B2 (en) 2019-06-26 2024-03-19 Applied Materials, Inc. Flexible multi-layered cover lens stacks for foldable displays
US11940682B2 (en) 2019-06-26 2024-03-26 Applied Materials, Inc. Flexible multi-layered cover lens stacks for foldable displays
US11940683B2 (en) 2019-06-26 2024-03-26 Applied Materials, Inc. Flexible multi-layered cover lens stacks for foldable displays
US12292635B2 (en) 2019-06-26 2025-05-06 Applied Materials, Inc. Flexible multi-layered cover lens stacks for foldable displays
US12292634B2 (en) 2019-06-26 2025-05-06 Applied Materials, Inc. Flexible multi-layered cover lens stacks for foldable displays

Also Published As

Publication number Publication date
US20190355919A1 (en) 2019-11-21
TWI718399B (zh) 2021-02-11
CN107765921B (zh) 2021-06-11
US10892428B2 (en) 2021-01-12
TW201918759A (zh) 2019-05-16
CN107765921A (zh) 2018-03-06

Similar Documents

Publication Publication Date Title
TWI718399B (zh) 柔性基板及柔性基板製作方法
TWI676309B (zh) 一種柔性顯示模組及其製備方法
US11600799B2 (en) Display device
TWI670849B (zh) 柔性顯示模組及柔性顯示模組製備方法
US11251393B2 (en) Flexible display module, flexible display device and method for preparing the flexible display module
WO2020001381A1 (zh) 显示面板及其制作方法、移动终端
EP3859720A1 (en) Display panel and manufacturing method therefor, and display apparatus
CN110262701A (zh) 一种显示面板及显示装置
WO2016095332A1 (zh) Oled触控显示装置及其制造方法
TW201918757A (zh) 一種曲面顯示幕的組立方法及曲面顯示幕
CN115421327A (zh) 盖板、显示模组及其制作方法、显示装置
KR20160066369A (ko) 유기 발광 표시 장치 및 유기 발광 표시 장치 제조 방법
KR20150072013A (ko) 표시 모듈 및 이를 포함하는 표시 장치
CN116782698A (zh) 一种复合结构、其制作方法及曲面显示模组
KR102543443B1 (ko) 표시 장치 및 연성 인쇄 회로 기판의 제조 방법
CN108153440A (zh) 软性可挠触摸显示屏及其制造方法
CN104009058B (zh) 电子装置及电子装置的显示模块的制造方法
WO2022048740A1 (en) Combined thin film encapsulation in flexible display devices and method of fabrication thereof
JP2011008666A (ja) 座標入力装置とそれを備えた表示装置及び電子機器
TWM478872U (zh) 觸控裝置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18874140

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18874140

Country of ref document: EP

Kind code of ref document: A1