WO2019085460A1 - 掩模组件 - Google Patents

掩模组件 Download PDF

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Publication number
WO2019085460A1
WO2019085460A1 PCT/CN2018/089386 CN2018089386W WO2019085460A1 WO 2019085460 A1 WO2019085460 A1 WO 2019085460A1 CN 2018089386 W CN2018089386 W CN 2018089386W WO 2019085460 A1 WO2019085460 A1 WO 2019085460A1
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WO
WIPO (PCT)
Prior art keywords
mask
open
mask assembly
attachment
open field
Prior art date
Application number
PCT/CN2018/089386
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English (en)
French (fr)
Inventor
张金方
张露
韩珍珍
胡思明
Original Assignee
昆山国显光电有限公司
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Publication date
Application filed by 昆山国显光电有限公司 filed Critical 昆山国显光电有限公司
Publication of WO2019085460A1 publication Critical patent/WO2019085460A1/zh
Priority to US16/562,446 priority Critical patent/US20190390318A1/en

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
    • B05C1/02—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to separate articles
    • B05C1/027—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to separate articles only at particular parts of the articles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C21/00—Accessories or implements for use in connection with applying liquids or other fluent materials to surfaces, not provided for in groups B05C1/00 - B05C19/00
    • B05C21/005—Masking devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Definitions

  • This application relates to the field of shaped displays, and more particularly to mask assemblies.
  • an OLED display has an effective display area defined by outlines. Corresponding pixels or sub-pixels are arranged along the contour to fit the shape of the contour. When there is a non-linear portion in the outline, the pixels or sub-pixels arranged along the outline are generally stepped or jagged for the portion of the non-linear outline. For example, when the display screen is chamfered as desired, the pixels or sub-pixels arranged along the chamfer are generally stepped or jagged.
  • the pixels or sub-pixels arranged along the contour line are arranged in a stepwise manner for the portion of the non-linear contour line, and the number of sub-pixels in different columns is different, which requires corresponding precision.
  • the number of sub-pixel opening fields of different columns on the metal mask is also different, so that the opening of the precision metal mask is irregular, which affects the net and precision adjustment.
  • a mask assembly for an evaporation process for display screen preparation, including:
  • a mask plate having a plurality of open areas for depositing an evaporation material through the open area
  • the open area shielding member is shielded from the evaporation direction of the open field to form a display chamfer.
  • At least a portion of the open field obscuring member is disposed at a corner of the open field.
  • the open field shutter member is welded to a corner of the open field.
  • the thickness of the open field blocking member is consistent with the thickness of the mask.
  • the mask assembly further includes a mask attachment, the open field obscuring member being fixedly coupled to the mask attachment.
  • the number of open-domain occlusion members is several, and the open-domain occlusion members are fixedly coupled to the mask attachment in an array-distributed manner.
  • the mask attachment is capable of translation and positioning relative to the mask.
  • the mask assembly and the mask are fixed to a frame, and the frame is provided with a slide rail, and the mask attachment is movable relative to the mask through the slide rail .
  • the mask attachment is rotatable and positionable relative to the mask.
  • the mask assembly and the mask are fixed to a frame, and the frame is provided with a slide rail through which the mask attachment can be rotated relative to the mask.
  • the mask attachment and the reticle have a common axis of rotation.
  • the frame is provided with a limiting member.
  • the outline of the portion of the open-area blocking member for forming the chamfer is a smooth circular arc.
  • the outline of the portion of the open-area blocking member for forming the chamfer is a stepped fold line.
  • the present application can make the mask plate favorable for the sheet by providing an open field blocking member in the mask assembly for shielding a position other than the corresponding preset deposition position in the opening field to form a display chamfer.
  • the mesh and the shape of the precision adjustment improve the problem of the screen and precision adjustment of the mask in the preparation of the shaped display.
  • FIG. 1 is a schematic structural view of an evaporation apparatus in the prior art.
  • FIG. 2 is a schematic structural view of a mask assembly provided by the present application.
  • FIG. 3 is a schematic structural view of a mask attachment provided by the present application.
  • OLED Organic Light-Emitting Diode
  • a typical structure of an OLED display panel is: depositing a layer of tens of nanometers thick luminescent material on a TFT substrate provided with an anode, and then vapor depositing a cathode on the luminescent material. After a voltage is applied across the cathode and the anode, the luminescent layer emits light.
  • the luminescent material is the main evaporation material.
  • the luminescent material is evaporated on the TFT substrate and forms a luminescent layer.
  • FIG. 1 it is a schematic structural view of an evaporation apparatus.
  • the vapor deposition apparatus includes a vacuum chamber 11 and an evaporation source 12, a TFT substrate 13, a mask plate 14, a magnetic plate 15, and a registration system 16 placed in the vacuum chamber 11.
  • the TFT substrate 13 is placed on a rotating sample holder.
  • the vapor deposition material such as a luminescent material or a metal electrode material is heated to evaporate the vapor deposition material into gaseous atoms or molecules.
  • the gaseous atoms or molecules undergo Brownian motion in the vacuum chamber, collide with the TFT substrate 13, and condense on the surface to form a thin film.
  • the heating method of the vapor deposition material includes one or more of current heating, electron beam bombardment heating, or laser heating.
  • the precision metal mask 14 is provided with an open field 141 to evaporate a complete display.
  • the open field 141 includes a number of sub-openings 1410.
  • Each sub-opening 1410 corresponds to one sub-pixel.
  • the sub-pixels can generally include a first sub-pixel, a second sub-pixel, and a third sub-pixel.
  • the first sub-pixel, the second sub-pixel, and the third sub-pixel may generally be a red sub-pixel, a green sub-pixel, and a blue sub-pixel, respectively.
  • the red sub-pixel, the green sub-pixel, and the blue sub-pixel are usually vapor-deposited separately.
  • a mask strip can generally be used to mask the sub- openings 1410 that are not needed to vaporize the desired sub-pixels, respectively.
  • the shape of the occlusion strip can be altered to vaporize the display with chamfers.
  • the shielding strip is provided with a corresponding chamfered structure, the shielding strip is liable to wrinkle due to stress concentration.
  • a mask assembly for an evaporation process for display screen preparation includes:
  • the mask 14 is provided with a plurality of opening domains 141 for depositing the evaporation material through the open field 141;
  • the open-area blocking member 20 is masked in the evaporation direction of the opening field 141 to form a display chamfer of the display screen.
  • the mask 14 is used to control the deposition of an organic material on a predetermined position on the substrate.
  • the mask 14 is provided with an open field 141.
  • the open field 141 can generally correspond to a display of a complete product.
  • the open field 141 includes a number of sub-openings 1410. Each sub-opening 1410 corresponds to one sub-pixel.
  • the mask 14 may use a precision metal mask 14.
  • the material of the precision metal mask 14 can be SUS 420 or SUS 430.
  • the open-area blocking member 20 is masked in the evaporation direction of the open field 141 to form a display chamfer of the display screen.
  • the open field blocking component 20 can correspond to the display chamfer of the display screen.
  • the open-area shielding member 20 can also use SUS 420 or SUS 430.
  • the open area shielding component 20 is disposed at a corner of the open field 141.
  • the open field shutter member 20 in order to form a display chamfer of the display screen, at least a portion of the open field shutter member 20 must be disposed at a corner of the open field 141.
  • the vapor deposition material is deposited on the open-area shielding member 20 without further passing through the opening-domain shielding member 20 at a position other than the predetermined position.
  • the open area shielding member 20 is welded to a corner of the open field 141.
  • the open-area shielding member 20 is welded to the corner of the opening field 141, so that when the thickness of the opening-domain shielding member 20 coincides with the thickness of the mask 14 , the portion of the opening region 141 that is not covered by the opening-domain shielding member 20 can be deposited and evaporated. material. It can be understood that when the open-area shielding member 20 is located upstream of the mask 14 in the evaporation direction, some evaporation material may be diffused and deposited downstream of the evaporation direction of the opening-domain shielding member 20, thereby reducing evaporation. the quality of. In the embodiment of the present application, when the open-area shielding member 20 is welded to the opening region 141, the quality of the vapor deposition can be improved.
  • the mask assembly further includes a mask attachment 201 , and the open area shielding component 20 is fixedly coupled to the mask attachment 201 .
  • the open-area shielding member 20 when the open-area shielding member 20 is soldered to the mask 14 , the existing mask 14 needs to be modified, and the quality of the soldering or the fixed connection may eventually affect the quality of the vapor deposition.
  • the open-area blocking member 20 when the open-area blocking member 20 is fixedly coupled to the mask attachment 201, it is not necessary to modify the original mask 14 to prevent the precision in the two-time manufacturing, and the quality of the vapor deposition can be improved.
  • the mask assembly further includes a mask attachment 201, the number of the open-domain shielding members 20 is several, and the open-domain shielding members 20 are arranged in an array. A distributed manner is fixedly coupled to the mask attachment 201.
  • the open area shielding member 20 is fixedly connected to the mask attachment 201 in an array distribution manner, so that a plurality of chamfered display screens can be prepared at one time, which can effectively improve production efficiency.
  • the mask attachment 201 can be translated and positioned relative to the mask 14.
  • the mask 14 can be fixed by a frame.
  • the mask attachment 201 can also be fixed by a frame.
  • the slide rail of the mask attachment 201 can be placed on the frame.
  • the mask attachment 201 can be translated relative to the mask 14 by the slide rails.
  • the frame can be provided with a limit member, such as a limit screw.
  • the mask attachment 201 is translated relative to the mask 14 to adjust the position of the opening-domain shielding member 20 relative to the opening field 141.
  • the limiting member is used for the mask attachment. 201 is limited. Thereby, a display screen having a chamfer can be conveniently prepared.
  • the mask attachment 201 can be rotated and positioned relative to the mask 14.
  • the mask attachment 201 and the mask 14 have a common rotating shaft.
  • the mask 14 can be fixed by a frame.
  • the mask attachment 201 can also be fixed by a frame.
  • the shaft can be set on the frame.
  • the mask attachment 201 can be rotated relative to the mask 14 by the rotation axis.
  • the frame can be provided with a limit member, such as a limit screw.
  • the rotation of the mask attachment 201 relative to the mask 14 can adjust the position of the opening blocking member 20 relative to the opening field 141.
  • the mask attachment 201 is performed using the limiting member. Limit. Thereby, a display screen having a chamfer can be conveniently prepared.
  • the rotating shaft can also be disposed on the mask 14, and the mask attachment 201 and the mask 14 have a common rotating shaft.
  • the contour of the portion of the open-field shielding member 20 for forming the chamfer is a smooth circular arc.
  • the contour of the portion of the microstructure of the open-domain shielding member 20 for forming the chamfer is a smooth circular arc, correspondingly, at least a portion of the sub-pixel obtained by the deposition has a shape corresponding to the smooth circular arc.
  • the zigzag feeling at the chamfer can be reduced.
  • the outline of the portion for forming the chamfer in the open field blocking member 20 is a stepped polygonal line.
  • the formed sub-pixel is a complete sub-pixel, and the driver of the sub-pixel does not have to be adaptively modified, thereby
  • the range of use of the open field blocking member 20 can be expanded.
  • the mask 14 is fixed to the frame while the open-area blocking member 20 is shielded from the open field 141 of the mask 14 to form a chamfer.
  • the open field blocking member 20 can be fixed to the open field 141 of the mask 14.
  • the fixed method can be a common connection method such as welding, bonding, and adsorption.
  • the open area blocking member 20 can be fixed to the mask attachment 201, and the opening area shielding member 20 can be adjusted relative to the opening field 141 by the relative movement between the mask attachment 201 and the mask 14. The position so that both adjust to the appropriate position.
  • the mask attachment 201 can be translated relative to the mask 14 or can be rotated relative to the mask 14.
  • the mask attachment 201 can also have a common rotating shaft with the mask 14.
  • the vapor deposition atmosphere is turned on to perform vapor deposition.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
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Abstract

一种掩模组件，包括：掩模板(14)，设有若干开口域(141)，以使蒸镀材料通过开口域(141)进行沉积；开口域遮挡部件(20)，遮罩于开口域(141)的蒸镀方向，以便形成显示倒角。

Description

掩模组件
援引加入
本申请要求于2017年10月31日提交中国专利局、申请号为201711051595.3、发明名称为“掩模组件”的中国专利申请的优先权，其全部内容通过引用结合在本申请中
技术领域
本申请涉及异形显示领域，特别是涉及掩模组件。
背景技术
随着电子技术的发展，电子显示屏也越来越多样化，并随之出现了圆角显示屏、曲面屏等异形显示屏。
传统技术中，OLED显示屏具有由轮廓线界定的有效显示区。对应的像素或子像素沿着轮廓线排布，以拟合轮廓线的形状。当轮廓线中存在非直线型部分时，针对该非直线型轮廓线的部分，沿轮廓线排布的像素或子像素通常呈现阶梯状或锯齿状。例如，当显示屏根据需要设计有倒角时，沿着倒角排布的像素或子像素通常呈阶梯状或锯齿状。
申请人在实现现有技术的过程中发现：
当轮廓线中存在非直线型部分时，针对该非直线型轮廓线的部分，沿轮廓线排布的像素或子像素呈阶梯排布，不同列的子像素数量不同，这就要求对应的精密金属掩模板上的不同列的子像素开口域数量也不同，从而使精密金属掩模板的开口呈不规则状，影响其张网及精度调节。
发明内容
根据本申请公开的各种实施例，提供一种掩模组件，用于显示屏制备的蒸镀工艺，包括：
掩模板，设有若干开口域，以使蒸镀材料通过所述开口域进行沉积；
开口域遮挡部件，遮罩于所述开口域的蒸镀方向，以便形成显示倒角。
在其中一个实施例中，所述开口域遮挡部件的至少一部分设置于所述开口域的角落。
在其中一个实施例中，所述开口域遮挡部件焊接于所述开口域的角落。
在其中一个实施例中，所述开口域遮挡部件的厚度与所述掩模板的厚度一致。
在其中一个实施例中，所述掩模组件还包括掩模附件，所述开口域遮挡部件固定连接于所述掩模附件。
在其中一个实施例中，所述开口域遮挡部件的数量为若干个，并且所述开口域遮挡部件以阵列分布的方式固定连接于所述掩模附件。
在其中一个实施例中，所述掩模附件能够相对所述掩模板平动及定位。
在其中一个实施例中，所述掩模组件和所述掩模板固定于框架，所述框架上设有滑轨，所述掩模附件能够通过所述滑轨相对所述掩膜板平动。
在其中一个实施例中，所述掩模附件能够相对所述掩模板转动及定位。
在其中一个实施例中，所述掩模组件和所述掩模板固定于框架，所述框架上设有滑轨，所述掩模附件能够通过所述滑轨相对所述掩膜板转动。
在其中一个实施例中，所述掩模附件和所述掩模板具有共用的转轴。
在其中一个实施例中，所述框架上设有限位件。
在其中一个实施例中，所述开口域遮挡部件中的用于形成倒角的部分的轮廓线为光滑圆弧。
在其中一个实施例中，所述开口域遮挡部件中的用于形成倒角的部分的轮廓线为阶梯状折线。
本申请通过在掩模组件中设置开口域遮挡部件，用于遮挡所述开口域中的除了对应预设沉积位置以外的位置，以便形成显示倒角，可将掩模板制作为有利于其张网及精度调节的形状，从而改善在异形显示屏的制备中掩模板的张网及精度调节的问题。
附图说明
图1为现有技术中蒸镀设备的结构示意图。
图2为本申请的提供的掩模组件的结构示意图。
图3为本申请的提供的掩模附件的结构示意图。
其中，
真空室          11
蒸发源          12
TFT基板         13
掩模板          14
开口域          141
子开口          1410
磁力板          15
对位系统        16
开口域遮挡部件  20
掩模附件        201
具体实施方式
在有机发光二极管(Organic Light-Emitting Diode,OLED)显示技术中，通常采用蒸镀技术来获得OLED显示屏。OLED显示屏的典型结构为：在布设有阳极的TFT基板上蒸镀一层几十纳米厚的发光材料，然后再在发光材料上蒸镀一层阴极。阴极和阳极两端施加电压后，发光层发光。
发光材料为主要蒸镀材料。发光材料被蒸镀在TFT基板上并形成发光层。如图1所示，为一种蒸镀设备的结构示意图。蒸镀设备包括真空室11以及置于真空室11内的蒸发源12、TFT基板13、掩模板14、磁力板15和对位系统16。
在真空室11内，将TFT基板13放置在旋转样品托架上。对发光材料或金属电极材料等蒸镀材料进行加热，以使蒸镀材料蒸发成气态的原子或分子。气态的原子或分子在真空室内做布朗运动，碰撞到TFT基板13后，在表面凝结形成薄膜。对蒸镀材料进行加热方法包括电流加热、电子束轰击加热或激光加热等的一种或多种。
请参照图2，在蒸镀的过程中，为能精准控制发光材料的位置，通常需要利用精密金属掩模板(fine metal mask，FMM)14。精密金属掩模板14设有开口域141以蒸镀一个完整的显示屏。开口域141包括若干子开口1410。每一子开口1410对应一个子像素。可以理解的是，子像素通常可以包括第一子像素、第二子像素和第三子像素。第一子像素、第二子像素和第三子像素通常可以分别为红色子像素、绿色子像素和蓝色子像素。在蒸镀过程中，红色子像素、绿色子像素和蓝色子像素通常是分别进行蒸镀的。为了防止子像素之间的错位，通常可以使用遮挡条来遮罩住不需要使用的子开口1410以分别蒸镀需要的子像素。
随着显示屏技术的发展，出现了对显示屏设置倒角，以改善显示效果的需求。为了满足该需求，可以改变遮挡条的形状，以便蒸镀具有倒角的显示屏。然而，当该遮挡条设置有对应的倒角结构时，遮挡条容易由于应力集中而产生褶皱。
请参照图2，本申请提供的一种实施例中，一种掩模组件，用于显示屏制备的蒸镀工艺，包括：
掩模板14，设有若干开口域141，以使蒸镀材料通过所述开口域141进行沉积；
开口域遮挡部件20，遮罩于所述开口域141的蒸镀方向，以便形成显示屏的显示倒角。
掩模板14用于控制有机材料沉积在基板上的预设位置。如前所述，掩模板14设有开口域141。开口域141通常可以对应一个完整产品的显示屏。开口域141包括若干子开口1410。每一子开口1410对应一个子像素。为了精确控制有机材料沉积的位置，掩模板14可以使用精密金属掩模板14。精密金属掩模板14的材料可以使用SUS 420或SUS 430。
开口域遮挡部件20遮罩于所述开口域141的蒸镀方向，以便形成显示屏的显示倒角。或者说，所述开口域遮挡部件20可以对应显示屏的显示倒角。为了保证精度，开口域遮挡部件20同样可以使用SUS 420或SUS 430。
进一步的，在本申请提供的一种实施例中，所述开口域遮挡部件20设置于所述开口域141的角落。
可以理解的是，为了形成显示屏的显示倒角，开口域遮挡部件20的至少一部分必须设置于开口域141的角落。这样在蒸镀时，蒸镀材料沉积于开口域遮挡部件20，而不会进一步透过开口域遮挡部件20沉积于预设位置以外的其他位置。
进一步的，在本申请提供的一种实施例中，所述开口域遮挡部件20焊接于所述开口域141的角落。
开口域遮挡部件20焊接于开口域141的角落，这样，当开口域遮挡部件20的厚度与掩模板14的厚度一致时，开口域141未被开口域遮挡部件20遮罩的部分可以沉积蒸镀材料。可以理解的是，当开口域遮挡部件20在蒸镀方向上位于掩模板14上游时，在开口域遮挡部件20的蒸镀方向的下游，可能会扩散沉积一些蒸镀材料，从而，降低蒸镀的质量。而本申请实施例中，开口域遮挡部件20焊接于开口域141时，则可以提高蒸镀的质量。
请参照图3，进一步的，在本申请提供的一种实施例中，所述掩模组件还包括掩模附件201，所述开口域遮挡部件20固定连接于所述掩模附件201。
从前述内容可知，当开口域遮挡部件20焊接于掩模板14时，需要对现有的掩模板14进行改造，而且，焊接或固定连接的质量的高低，会最终影响蒸镀的质量。而在该实施例中，当开口域遮挡部件20固定连接于掩模附件201时，不必对原有的掩模板14进行改造，防止两次加工制造时精度差，从而可以提高蒸镀的质量。
进一步的，在本申请提供的一种实施例中，所述掩模组件还包括掩模附件201，所述开口域遮挡部件20的数量为若干个，并且所述开口域遮挡部件20以阵列分布的方式固定连接于所述掩模附件201。
在该申请实施例中，所述开口域遮挡部件20以阵列分布的方式固定连接于所述掩模附件201，从而可以一次制备多个具有倒角的显示屏，可以有效提高生产效率。
进一步的，在本申请提供的一种实施例中，所述掩模附件201可相对所述掩模板14平动及定位。
通常，掩模板14可以通过框架来固定。这里，掩模附件201同样可以通过 框架来固定。可以在框架上设置掩模附件201的滑轨。这样，掩模附件201可以通过滑轨相对掩模板14平动。当然，框架上可以设置限位件，例如限位螺钉等。掩模附件201相对掩模板14平动能够调整开口域遮挡部件20相对开口域141的位置，当将掩模附件201相对掩模板14的位置调整到适当位置时，使用限位件对掩模附件201进行限位。从而，可以便利地制备具有倒角的显示屏。
进一步的，在本申请提供的又一种实施例中，所述掩模附件201可相对所述掩模板14转动及定位。
进一步的，在本申请提供的又一种实施例中，所述掩模附件201和所述掩模板14具有共用的转轴。
通常，掩模板14可以通过框架来固定。这里，掩模附件201同样可以通过框架来固定。可以在框架上设置转轴。这样，掩模附件201可以通过转轴相对掩模板14转动。当然，框架上可以设置限位件，例如限位螺钉等。掩模附件201相对掩模板14转动能够调整开口域遮挡部件20相对开口域141的位置，当掩模附件201相对掩模板14的位置调整到适当位置时，使用限位件对掩模附件201进行限位。从而，可以便利地制备具有倒角的显示屏。
当然，还可将转轴设置于掩模板14，掩模附件201和掩模板14具有共用的转轴。
进一步的，在本申请提供的又一种实施例中，所述开口域遮挡部件20中的用于形成倒角的部分的轮廓线为光滑圆弧。
可以理解的是，当开口域遮挡部件20的微结构中的用于形成倒角的部分的轮廓线为光滑圆弧，对应的，沉积获得的子像素的至少一部分具有与光滑圆弧对应的形状，从而，可以降低倒角处的锯齿感。
进一步的，在本申请提供的又一种实施例中，所述开口域遮挡部件20中的用于形成倒角的部分的轮廓线为阶梯状折线。
当开口域遮挡部件20的微结构中的用于形成倒角的部分的轮廓线为阶梯状折线时，形成的子像素为完整的子像素，子像素的驱动程序不必进行适应性修改，从而，可以扩大开口域遮挡部件20的使用范围。
下面介绍本申请实施的具体应用场景：
在制备具有倒角的显示屏时，将掩模板14固定于框架上，同时，将开口域遮挡部件20遮挡于掩模板14的开口域141以便形成倒角。
在本申请提供的一种实现方式中，可以将开口域遮挡部件20固定于掩模板14的开口域141。固定的方式可以是焊接、粘接、吸附等常用的连接方式。
在本申请提供的另一种实现方式，可以将开口域遮挡部件20固定于掩模附件201，通过掩模附件201与掩模板14之间的相对运动能够调整开口域遮挡部件20相对开口域141的位置，以便两者调整到适宜的位置。掩模附件201可以相对掩模板14平动，也可以相对掩模板14转动。而且，掩模附件201还可以和掩模板14具有共用的转轴。
当开口域遮挡部件20相对掩模板14的位置调整到适宜位置时，开启蒸镀气氛进行蒸镀。
以上所述实施例仅表达了本申请的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本申请构思的前提下，还可以做出若干变形和改进，这些都属于本申请的保护范围。因此，本申请专利的保护范围应以所附权利要求为准。

Claims (15)

  1. 一种掩模组件，用于显示屏制备的蒸镀工艺，其中，包括：
    掩模板，设有若干开口域，以使蒸镀材料通过所述开口域进行沉积；
    开口域遮挡部件，遮罩于所述开口域的蒸镀方向，以便形成显示倒角。
  2. 根据权利要求1所述的掩模组件，其中，所述开口域遮挡部件的至少一部分设置于所述开口域的角落。
  3. 根据权利要求2所述的掩模组件，其中，所述开口域遮挡部件焊接于所述开口域的角落。
  4. 根据权利要求3所述的掩模组件，其中，所述开口域遮挡部件的厚度与所述掩模板的厚度一致。
  5. 根据权利要求2所述的掩模组件，其中，所述掩模组件还包括掩模附件，所述开口域遮挡部件固定连接于所述掩模附件。
  6. 根据权利要求2所述的掩模组件，其中，所述掩模组件还包括掩模附件，所述开口域遮挡部件的数量为若干个，并且所述开口域遮挡部件以阵列分布的方式固定连接于所述掩模附件。
  7. 根据权利要求6所述的掩模组件，其中，所述掩模附件能够相对所述掩模板平动及定位。
  8. 根据权利要求7所述的掩模组件，其中，所述掩模组件和所述掩模板固定于框架，所述框架上设有滑轨，所述掩模附件能够通过所述滑轨相对所述掩膜板平动。
  9. 根据权利要求8所述的掩模组件，其中，所述框架上还设有限位件。
  10. 根据权利要求6所述的掩模组件，其中，所述掩模附件能够相对所述掩模板转动及定位。
  11. 根据权利要求10所述的掩模组件，其中，所述掩模组件和所述掩模板固定于框架，所述框架上设有转轴，所述掩模附件能够通过所述转轴相对所述掩膜板转动。
  12. 根据权利要求11所述的掩模组件，其中，所述框架上设有限位件。
  13. 根据权利要求10-12中任意一项所述的掩模组件，其中，所述掩模附件和所述掩模板具有共用的转轴。
  14. 根据权利要求1-13中任意一项所述的掩模组件，其中，所述开口域遮挡部件中的用于形成倒角的部分的轮廓线为光滑圆弧。
  15. 根据权利要求1-13中任意一项所述的掩模组件，其中，所述开口域遮挡部件中的用于形成倒角的部分的轮廓线为阶梯状折线。
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102110787A (zh) * 2010-11-05 2011-06-29 四川虹视显示技术有限公司 Oled掩膜板对位方法
US20130216709A1 (en) * 2012-02-17 2013-08-22 Semiconductor Energy Laboratory Co., Ltd. Film Formation Apparatus, Method for Forming Film and Method for Cleaning Shadow Mask
CN106119773A (zh) * 2016-08-03 2016-11-16 京东方科技集团股份有限公司 掩膜板及其制造方法、蒸镀掩膜板组件及其制造方法
CN206266701U (zh) * 2016-11-25 2017-06-20 信利（惠州）智能显示有限公司 掩膜板组件
CN107699854A (zh) * 2017-11-10 2018-02-16 京东方科技集团股份有限公司 掩膜组件及其制造方法
CN107740040A (zh) * 2017-09-08 2018-02-27 上海天马有机发光显示技术有限公司 掩膜版组件及蒸镀装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104425547B (zh) * 2013-09-11 2019-01-04 昆山国显光电有限公司 一种有机发光显示器及其制作方法
CN104157550B (zh) * 2014-07-28 2016-08-31 京东方科技集团股份有限公司 薄膜图形化方法及掩膜板
KR102432350B1 (ko) * 2015-11-06 2022-08-16 삼성디스플레이 주식회사 마스크 프레임 조립체, 이를 포함하는 증착 장치 및 표시 장치의 제조 방법
KR102375261B1 (ko) * 2016-04-01 2022-03-17 엘지이노텍 주식회사 증착용마스크 및 이를 이용한 oled 패널
CN205688000U (zh) * 2016-06-29 2016-11-16 鄂尔多斯市源盛光电有限责任公司 一种掩膜板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102110787A (zh) * 2010-11-05 2011-06-29 四川虹视显示技术有限公司 Oled掩膜板对位方法
US20130216709A1 (en) * 2012-02-17 2013-08-22 Semiconductor Energy Laboratory Co., Ltd. Film Formation Apparatus, Method for Forming Film and Method for Cleaning Shadow Mask
CN106119773A (zh) * 2016-08-03 2016-11-16 京东方科技集团股份有限公司 掩膜板及其制造方法、蒸镀掩膜板组件及其制造方法
CN206266701U (zh) * 2016-11-25 2017-06-20 信利（惠州）智能显示有限公司 掩膜板组件
CN107740040A (zh) * 2017-09-08 2018-02-27 上海天马有机发光显示技术有限公司 掩膜版组件及蒸镀装置
CN107699854A (zh) * 2017-11-10 2018-02-16 京东方科技集团股份有限公司 掩膜组件及其制造方法

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