WO2019054284A1 - 圧着ヘッドおよび実装装置 - Google Patents

圧着ヘッドおよび実装装置 Download PDF

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Publication number
WO2019054284A1
WO2019054284A1 PCT/JP2018/033135 JP2018033135W WO2019054284A1 WO 2019054284 A1 WO2019054284 A1 WO 2019054284A1 JP 2018033135 W JP2018033135 W JP 2018033135W WO 2019054284 A1 WO2019054284 A1 WO 2019054284A1
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WIPO (PCT)
Prior art keywords
pressing
elastic member
head
elastic
displacement
Prior art date
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PCT/JP2018/033135
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English (en)
French (fr)
Japanese (ja)
Inventor
敏行 陣田
宏一 今井
寺田　勝美
雅史 千田
Original Assignee
東レエンジニアリング株式会社
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Application filed by 東レエンジニアリング株式会社 filed Critical 東レエンジニアリング株式会社
Priority to KR1020207006392A priority Critical patent/KR20200051608A/ko
Publication of WO2019054284A1 publication Critical patent/WO2019054284A1/ja

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    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/94—Batch processes at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Definitions

  • semiconductor devices such as ICs and LSIs and other electronic components are adhered to circuit substrates such as flexible substrates, glass epoxy substrates, glass substrates, ceramic substrates, silicon interposers, silicon substrates, etc.
  • circuit substrates such as flexible substrates, glass epoxy substrates, glass substrates, ceramic substrates, silicon interposers, silicon substrates, etc.
  • the present invention relates to a crimping head and a mounting device for mounting as it is.
  • a mounting apparatus in which a plurality of semiconductor chips are simultaneously crimped to a substrate.
  • a plurality of pressing blocks for simultaneously and separately pressing a plurality of semiconductor chips are formed on a relatively large-area heating and pressing head (head body) corresponding to the area of the substrate. ing.
  • head body heating and pressing head
  • the position of the pressing block provided below the elastic body may also shift in the direction perpendicular to the pressing direction.
  • the pressing block whose position is shifted in the direction perpendicular to the pressing direction is difficult to uniformly press the semiconductor chip.
  • mounting failure displacement of mounting position or the like
  • the present invention has been made in view of the above circumstances, and an appropriate pressing force is applied to the electronic component to absorb height variations of the electronic component to prevent breakage and to reduce mounting frequency by reducing the frequency of replacement.
  • the main object is to provide a crimping head and mounting device that can be improved.
  • the present invention has the following configuration in order to achieve such an object.
  • a pressure bonding head for mounting an electronic component on a substrate, Head body, A pressing member attached to a lower portion of the head body to press an electronic component;
  • An elastic member interposed between the head body and the pressing member;
  • a blocking member for blocking displacement of the elastic member in a direction perpendicular to a pressing direction in which the electronic component is pressed;
  • the elastic member is interposed between the pressing member for pressing the electronic component and the head main body, and the blocking member is provided.
  • the blocking member prevents the elastic member from being displaced in a direction perpendicular to the direction in which the electronic component is pressed. Therefore, the pressing member is displaced together with the elastic member, and the mounting failure of the electronic component can be avoided when the displaced pressing member presses the electronic component unevenly.
  • the blocking member is interposed between the head main body and the elastic member, and the adhesion between the blocking member and the elastic member is the head main body and the elastic member. It is preferable to be configured to be higher than the adhesion between them.
  • the blocking member is interposed between the head main body and the elastic member, and the adhesion between the blocking member and the elastic member is determined between the head main body and the elastic member. It is configured to be higher than the adhesion. Since the improvement of the adhesion increases the coefficient of friction at the contact surface, the frictional force generated between the blocking member and the elastic member is larger than the frictional force generated between the head main body and the elastic member. Therefore, as compared with the case where the elastic member and the head main body are in direct contact, the frictional force is increased when the blocking member intervenes, so that the blocking member can prevent the displacement of the elastic member.
  • the relative positional relationship between the electronic component and the pressing member can be suitably maintained due to the displacement of the elastic member. That is, it is possible to prevent a situation in which the pressure bonding head is replaced due to relative displacement between the electronic component and the pressing member. Therefore, the frequency of replacement of the pressure bonding head can be reduced, and the mounting efficiency of the electronic component can be improved.
  • the blocking member is interposed between the pressing member and the elastic member, and the blocking member has an adhesive force between the pressing member and the elastic member. It is preferable to be configured to be higher than the adhesion between them.
  • the blocking member is interposed between the pressing member and the elastic member, and the adhesion between the blocking member and the elastic member is determined between the pressing member and the elastic member. It is configured to be higher than the adhesion.
  • the improvement of the adhesion increases the coefficient of friction at the contact surface, so the frictional force generated between the blocking member and the elastic member is larger than the frictional force generated between the pressing member and the elastic member. Therefore, as compared with the case where the elastic member and the pressing member are in direct contact, the frictional force is increased when the blocking member intervenes, so that the blocking member can prevent the displacement of the elastic member.
  • the blocking member is preferably made of a plate-like metal material.
  • the blocking member can be easily made flat. Therefore, the pressing member disposed below the blocking member can maintain high accuracy parallelism with the electronic member. Moreover, since the metal blocking member has rigidity suitable for pressing, the thickness in the pressing direction can be reduced.
  • the elastic member be made of fluororubber, and the blocking member be made of plate-like stainless steel.
  • the elastic member and the blocking member have high adhesiveness, the elastic member and the blocking member are preferably brought into close contact with each other to increase the coefficient of friction while making the surfaces of the elastic member and the blocking member flat. it can. That is, the frictional force between the elastic member and the blocking member can be improved to preferably prevent the displacement of the elastic member, and the thickness of the elastic member can be made uniform with high accuracy.
  • the parallelism of the pressing member with respect to the electronic component can be maintained with high accuracy. Therefore, while being able to press electronic components uniformly, the variation in height of electronic components can be suitably absorbed by the elastic member which has uniform thickness.
  • the blocking member applies an external force to the elastic member and compresses the same in the pressing direction to generate a repulsive force in the pressing direction on the elastic member, and the crimping head does not press the electronic component.
  • the blocking member is a vertical drag maintaining means, applies an external force to the elastic member to compress it in the pressing direction, generates a repulsive force in the pressing direction on the elastic member, and the crimping head
  • the elastic member is interposed between the head main body and the pressing member in a state where the repulsive force is maintained even when the component is not pressed.
  • a vertical reaction force having a size corresponding to the repulsive force is generated in the elastic member. Therefore, when pressing by the pressure bonding head is performed, the frictional force generated on the surface of the elastic member increases in accordance with the magnitude of the vertical reaction. Therefore, the displacement of the elastic member in the direction perpendicular to the pressing direction is blocked by the blocking member.
  • the blocking member maintains a state in which the elastic member is compressed to a thickness of 80% to 99%.
  • the elastic member can be appropriately compressed in advance to generate a repulsive force. Therefore, when the pressing by the pressure bonding head is performed, the frictional force generated on the surface of the elastic member can be increased to an appropriate size, so displacement of the elastic member in the direction perpendicular to the pressing direction can be more reliably prevented.
  • this invention takes the following structures in order to achieve such an object.
  • a pressure bonding head for mounting an electronic component on a substrate, Head body, A pressing member attached to a lower portion of the head body to press an electronic component; An elastic member interposed between the head body and the pressing member; A blocking member for blocking displacement of the elastic member in a direction perpendicular to a pressing direction in which the electronic component is pressed; Equipped with An uneven portion having the same uneven pattern is formed on the contact surface between the head main body and the elastic member and the contact surface between the pressing member and the elastic member.
  • the uneven surface having the same pattern is formed on the contact surface between the head main body and the elastic member and the contact surface between the pressing member and the elastic member.
  • the uneven pattern of the uneven surface increases the frictional force at the contact surface between the head main body and the elastic member and at the contact surface between the pressing member and the elastic member. Therefore, displacement of the elastic member in the direction perpendicular to the pressing direction can be more reliably prevented.
  • grooved part is the same, the thickness of an elastic member becomes uniform over the whole surface. Therefore, the force for absorbing the variation in height of the electronic component is uniform over the entire surface of the elastic member, so that the occurrence of a mounting error due to the nonuniformization of the variation absorption of the elastic member can be avoided.
  • this invention takes the following structures in order to achieve such an object.
  • It is a mounting device for mounting an electronic component on a substrate, and Any one of the crimping heads described above, An elevation mechanism for raising and lowering the pressure bonding head; A holding stage for mounting and holding the substrate; It is characterized by having.
  • the electronic component may be a semiconductor device having a bump and mounted on a substrate through a thermosetting resin.
  • the bumps of the semiconductor device can be connected to the electrodes of the substrate, and the thermosetting resin interposed between the semiconductor device and the substrate can be thermally cured in a short time.
  • an appropriate pressure is applied to the electronic component to absorb height variations of the electronic component to prevent breakage and reduce the frequency of replacement of the pressure bonding head. Implementation efficiency can be improved.
  • FIG. 1 is a perspective view showing a schematic overall configuration of a mounting apparatus according to a first embodiment.
  • FIG. 6 is a plan view of the transport mechanism according to the first embodiment.
  • FIG. 6 is a front view of the transport mechanism according to the first embodiment.
  • 1 is a longitudinal sectional view of a pressure bonding head according to a first embodiment.
  • 5 is a flowchart showing one round of operation of the mounting apparatus according to the first embodiment. It is a front view showing conveyance operation of a plate and a substrate. It is a figure which shows the operation
  • (A) is a view showing a state before pressing the semiconductor device
  • (b) is a view showing a state in which spreading occurs between the elastic body and the head body when pressing the semiconductor device
  • c) is a diagram showing a state in which displacement of the elastic body occurs at the time of releasing the pressure
  • (d) is a diagram showing a state in which mounting failure occurs due to the displacement of the elastic body.
  • (A) is a perspective view of the crimping head showing a state in which the elastic body and the pressing block are rotationally displaced
  • (b) is a position of the semiconductor device and the pressing block in a state before the rotational displacement of the elastic body occurs.
  • (c) is a top view which shows a relationship
  • (c) is a top view which shows the physical relationship of a semiconductor device and the block for a press in the state after rotational displacement of an elastic body generate
  • A is a figure which shows the state before pressing a semiconductor device
  • (b) is a figure which shows the state which expansion generate
  • (C) is a view showing a state in which the pressing block is displaced relative to the elastic body at the time of releasing the pressure
  • (d) is a state in which mounting failure occurs due to positional deviation between the pressing block and the elastic body FIG.
  • (A) is a figure which shows the state which expansion generate
  • (b) is each to a block for a press and a head main body at the time of press release.
  • FIG. 6 is a diagram for explaining the effect of the device according to the first embodiment.
  • FIG. 6 is a view showing a configuration of a pressure bonding head according to a second embodiment.
  • (A) is a longitudinal cross-sectional view in the initial state of the crimping head concerning Example 2
  • (b) is a perspective view which shows a structure of a bolt
  • (c) demonstrates the structure of a protrusion part and a notch part. It is a perspective view of a press member. It is a figure explaining each state of an elastic member.
  • (A) is a figure which shows a non-compression state
  • (b) is a figure which shows a semi-compression state
  • (c) is a figure which shows a compression limit state.
  • FIG. 13 is a view showing a process of arranging an elastic member in the pressure bonding head in Example 2;
  • (A) is a longitudinal sectional view showing a configuration in which the elastic member is in a non-compressed state before tightening the bolt, and
  • (b) is shown in FIG. 14 (c) by tightening the bolt and fixing the elastic member in a semi-compressed state.
  • It is a longitudinal cross-sectional view which shows the structure made into the initial state shown to a).
  • FIG. 8 is a diagram showing the effect of the configuration according to the second embodiment.
  • FIG. 7 is a view showing a configuration of a pressure bonding head according to a third embodiment.
  • FIG. 16 is a view showing a process of arranging an elastic member in a pressure bonding head in a modified example.
  • (A) is a longitudinal cross-sectional view showing a configuration in which the elastic member is in a non-compressed state before tightening the support holder, and (b) shows a structure in which the elastic holder is fixed in a semi-compression state by tightening the support holder
  • (A) is a perspective view which shows the state which a displacement prevention member is comprised with a plate-shaped member of several sheets
  • (b) is an elastic member and a pressing member by the displacement prevention member comprised with a plurality of plate-like members Etc.
  • thermosetting resin is preferably NCF (nonconductive adhesive film).
  • the "semiconductor device" in the present invention is one having bumps such as an IC chip, a semiconductor chip, an optical element, a surface mounting component, a chip, a wafer, a TCP (Tape Carrier Package), and an FPC (Flexible Printed Circuit). is there.
  • these semiconductor devices show all forms of the side to be bonded to the substrate regardless of the type and size, and for example, bonding of COG (Chip On Glass), TCP, and FPC which is chip bonding to a flat display panel.
  • OLB Outer Lead Bonding
  • substrate for example, a flexible substrate, a glass epoxy substrate, a glass substrate, a ceramic substrate, a silicon interposer, a silicon substrate or the like is used.
  • FIG. 1 is a perspective view showing a schematic configuration of a pressure bonding apparatus constituting a mounting apparatus according to a first embodiment
  • FIG. 2 is a plan view showing an essential configuration of a conveyance mechanism.
  • the mounting apparatus in the first embodiment is configured of a transport mechanism 1 and a main crimping device 2. Each component will be described in detail below.
  • the transport mechanism 1 includes a movable stand 3 and a transport arm 4.
  • the movable stand 3 is configured to move in the horizontal axis direction along the guide rails 5.
  • the transfer arm 4 is connected at its base end side to the elevation drive mechanism of the movable table 3 and is configured to be movable in the vertical direction (z direction) and in the z axis direction ( ⁇ direction). Further, the transfer arm 4 is provided with a holding frame 6 at its tip. As shown in FIGS. 2 and 3, the holding frame 6 has a horseshoe shape, and is provided with a plurality of locking claws 7 for locking the plate for delaying heat conduction and the substrate W at the corners.
  • the crimping device 2 includes a movable table 8 and a pressing mechanism 9.
  • the movable table 8 includes a holding stage 10 that holds the substrate W by suction.
  • the holding stage 10 is configured to be movable in two horizontal axis directions (x direction and y direction), z direction, and ⁇ direction.
  • the outer shape of the holding stage 10 is set to a size that fits inside the holding frame 6.
  • the heater 11 is embedded in the holding stage 10.
  • the pressing mechanism 9 includes a cylinder 13 and a pressure bonding head 14.
  • a cylinder 13 is connected to the upper side of the pressure bonding head 14, and the pressure bonding head 14 is configured to move in the z direction, which is the vertical direction. That is, in the first embodiment, the pressing direction of the pressure bonding head 14 is configured to be the z direction.
  • the cylinder 13 is an example of a mechanism for moving up and down, and another drive mechanism may be used as appropriate as long as the pressure bonding head 14 is moved in the pressing direction.
  • the pressure bonding head 14 includes a head main body 16 in which the heater 15 is embedded, and a support holder 18 in which a plurality of pressing members 17 are stored at the lower part of the head main body 16.
  • the heater 15 corresponds to the heater of the present invention.
  • the material of the head main body 16 is preferably a material having high thermal conductivity, and examples of preferable materials include aluminum and copper. By enhancing the thermal conductivity of the head main body 16, the heat from the heater 15 can be efficiently conducted to the pressing member 17, so more preferable heating and pressing can be realized.
  • the pressing member 17 has a downward convex shape.
  • the tip has a contact surface of substantially the same size as the semiconductor device C, and is aligned so as to individually press the plurality of semiconductor devices C disposed on the substrate W.
  • the pressing member 17 is configured such that the base end side is supported by the support holder 18 by passing the tip through a through hole that is slightly larger than the convex portion formed in the support holder 18. By screwing the support holder 18, the proximal end 17 ⁇ / b> S of the pressing member 17 is gripped by the support holder 18 and the head main body 16.
  • the material of the pressing member 17 is preferably a material having high thermal conductivity, and examples of preferable materials include aluminum and copper. By enhancing the thermal conductivity of the pressing member 17, the heat of the heater 15 is efficiently conducted to the thermosetting resin G to be described later through the tip 17 T of the pressing member 17. It can be mounted on the substrate W. In the present embodiment, solder is used for the bumps B of the semiconductor device C.
  • the crimping head 14 is provided with an elastic member 19 between the head main body 16 and the pressing member 17 as shown in FIG.
  • the thickness of the elastic member 19 in the pressing direction is constant, and is configured to have high parallelism.
  • a material of the elastic member 19 general rubber can be used, but it is preferable to use heat-resistant fluororubber from the viewpoint of heating by the heater 11 and the heater 15.
  • the semiconductor device C can be suitably mounted even when the solder is heated to a melting temperature by using a heat resistant fluororubber.
  • the thickness of the elastic member 19 in the pressing direction is, for example, 500 ⁇ m to 1000 ⁇ m.
  • the pressure bonding head 14 is provided with a displacement blocking member 20.
  • the displacement blocking member 20 is provided between the pressing surface 16 a of the head main body 16 and the elastic member 19.
  • the displacement blocking member 20 is made of a material having high adhesion to the elastic body constituting the elastic member 19. That is, the coefficient of friction between the material of elastic member 19 and the material of displacement preventing member 20 is set to be larger than the coefficient of friction between the material of elastic member 19 and the material of head main body 16. . Therefore, the frictional force V2 generated between the elastic member 19 and the displacement preventing member 20 is larger than the frictional force V1 generated between the elastic member 19 and the head main body 16.
  • the material which comprises the displacement prevention member 20 As a specific example of the material which comprises the displacement prevention member 20, plate-shaped metal materials, such as plate-shaped stainless steel (SUS), are mentioned.
  • the thickness of the displacement prevention member 20 in the pressing direction is, for example, 10 ⁇ m to 100 ⁇ m. Since the thickness of the displacement preventing member 20 is very thin as compared with the elastic member 19 and the head main body 16, the heat of the heater 15 is suitably conducted to the pressing member 17 without being blocked by the displacement preventing member 20.
  • the adhesion between the displacement blocking member 20 and the elastic member 19 is higher than the adhesion between the material of the head main body 16 and the elastic member 19. Therefore, even if the surfaces of elastic member 19 and displacement prevention member 20 are each flat, elastic member 19 is compared with the friction force generated between head main body 16 and elastic member 19 due to the increase of the coefficient of friction. The frictional force generated between the and the displacement prevention member 20 can be increased.
  • the displacement blocking member 20 corresponds to the blocking means in the present invention.
  • the pressure bonding head 14 is provided with a displacement preventing member 21 between the elastic member 19 and the base end 17S of the pressing member 17.
  • the displacement blocking member 21 is made of a material having high adhesion to the elastic body constituting the elastic member 19. That is, even if the surfaces of the elastic member 19 and the displacement preventing member 21 are flat, the coefficient of friction between the elastic member 19 and the displacement preventing member 21 from the coefficient of friction between the elastic member 19 and the pressing member 17 Is configured to be large.
  • the thickness of the displacement prevention member 21 in the pressing direction is, for example, 10 ⁇ m to 100 ⁇ m.
  • the head main body 16, the pressing member 17, the elastic member 19, the displacement blocking member 20, and the displacement blocking member 21 are arranged such that a pressing force acts uniformly over the entire semiconductor device C when pressing is performed by the crimping head 14.
  • Each has a structure parallel to the surface (xy plane) of the semiconductor device C.
  • the control unit 23 controls the temperature of the heater 15 of the pressure bonding head 14 and the heater 11 of the holding stage 10 to be equal to or higher than the temperature at which the thermosetting resin G is cured.
  • a round of operations for fully pressing the semiconductor device C to the substrate W using the mounting apparatus according to the first embodiment will be described with reference to the flowchart shown in FIG. 5 and FIGS. 6 to 8.
  • the thermosetting resin is completely cured with respect to those transported in a state in which a plurality of semiconductor devices C are pre-temporarily crimped to the substrate W by NCF in the pre-crimping step in the previous step.
  • the case of pressure bonding will be described as an example.
  • Step S1 setting of conditions
  • the temperature of both heaters 11 and 15 provided on the holding stage 10 and the pressure bonding head 14 is set by operating the operation unit 24.
  • the temperature of both the heaters 11 and 15 is set such that the temperature of the interface between the plate P for heat conduction delay and the substrate W and the interface between the pressure bonding head 14 and the semiconductor device C is higher than the curing temperature of the thermosetting resin G.
  • Ru That is, when the substrate W held by suction on the holding stage 10 reaches the lower mounting position of the pressure bonding head 14, the heat transmitted to the thermosetting resin G through the semiconductor device C and the plate P is It is set to be the curing temperature.
  • stainless steel is used for the plate P.
  • the plate P is not limited to stainless steel, and may be made of any material that does not deform when pressed by the pressure bonding head 14, and may be metal, ceramic, carbon, porous material, or the like.
  • Step S2 operation start of the device
  • the operation of the apparatus is started by appropriately operating an input unit (such as a button) (not shown) provided in the mounting apparatus.
  • an input unit such as a button
  • the control unit 23 turns on the heater 11 and the heater 15 to start temperature control so as to keep the temperature set in the initial setting constant.
  • Step S3 substrate transfer
  • the plate P is mounted on the holding frame 6 of the transfer mechanism 1 by a transfer robot (not shown) disposed on the side of the temporary pressure bonding step, and then the substrate W is mounted on the plate P .
  • Step S4 holding a substrate
  • the plate P and the substrate W are conveyed to the main pressure bonding apparatus 2 in a state where they are superimposed.
  • the substrate W is transferred onto the holding stage 10 as shown by the two-dot chain line in FIG.
  • the plate P is formed with a plurality of through holes, and is held by suction on the holding stage 10 through the through holes. Further, the holding stage 10 is moved to a predetermined mounting position below the pressure bonding head 14 by a drive mechanism (not shown).
  • Step S5 Heating is started by the heater 11 when the plate P and the substrate W are held by suction on the holding stage 10.
  • Step S6 Heating pressure of semiconductor device
  • the holding stage 10 reaches the mounting position, as shown in FIG. 7, the pressure bonding head 14 is lowered by the operation of the cylinder 13, and the plurality of semiconductor devices C are simultaneously held. At this time, the semiconductor device C is pressed while being heated by the pressure bonding head 14 being heated.
  • thermosetting resin G when the pressure bonding head 14 is lowered to a predetermined height, the thermosetting resin G is in an uncured state, and therefore, as shown in FIG. It is pushed into the curable resin G. That is, after the bumps B of the semiconductor device C reach the electrodes of the substrate W, the thermosetting resin is cured.
  • the temperature of the heater is controlled to melt the solder before the adhesive is completely cured.
  • temperature control of the heater for causing the melting temperature of the solder can be omitted.
  • the elastic member 19 is compressed.
  • the displacement blocking member 20 and the displacement blocking member 21 prevent the elastic member 19 from being displaced in the direction perpendicular to the pressing direction (z direction).
  • the pressing of the pressure bonding head 14 suitably brings the elastic member 19 into close contact with the displacement blocking member 20 to increase the friction coefficient at the contact surface. . Therefore, since the frictional force on the contact surface is increased, it is possible to avoid the situation where the elastic member 19 slips in the direction (x, y, ⁇ directions) perpendicular to the pressing direction with respect to the displacement preventing member 20. As a result, relative displacement of the elastic member 19 and the displacement preventing member 20 in the direction perpendicular to the pressing direction is prevented. Therefore, it is possible to avoid a disadvantage such as a positional deviation of the pressing member 17 with respect to the semiconductor device C.
  • the elastic member 19 is preferably in close contact with the displacement prevention member 21 by the pressure of the pressure bonding head 14. Therefore, the coefficient of friction at the contact surface between the elastic member 19 and the displacement blocking member 21 is increased, so that the elastic member 19 can be prevented from sliding in the direction perpendicular to the pressing direction with respect to the displacement blocking member 21. As a result, relative displacement of the elastic member 19 and the displacement preventing member 21 in the direction perpendicular to the pressing direction is prevented. Therefore, it is possible to avoid a disadvantage such as uneven compression of the elastic member 19 due to the relative position of the elastic member 19 with respect to the pressing member 17 being shifted in the direction perpendicular to the pressing direction.
  • the main pressure bonding is performed by the heating and pressing according to step S6, and each of the plurality of semiconductor devices C is simultaneously mounted on the substrate W.
  • Step S7 After heating and pressing the semiconductor device C until a predetermined time (setting time) for curing the thermosetting resin G elapses, the pressure bonding head 14 is returned to the upper standby position to release the pressure, and the transport mechanism 1 to carry out the plate and the substrate W on which the semiconductor device C is mounted.
  • the plate P and the substrate W transported to the predetermined position are stored in the stocker via another transport robot or the like.
  • the pressure bonding head 14 includes the displacement blocking member 20 and the displacement blocking member 21.
  • the displacement preventing member 20 prevents the elastic member 19 from being displaced relative to the head main body 16 in the direction perpendicular to the pressing direction of the pressure bonding head 14.
  • the displacement blocking member 21 prevents the elastic member 19 from being displaced relative to the pressing member 17 in the direction perpendicular to the pressing direction of the pressure bonding head 14.
  • each of the displacement blocking member 20 and the displacement blocking member 21 blocks the displacement of the elastic member 19, it is possible to avoid the occurrence of a disadvantage such as the displacement of the position of the pressing member 19 with respect to the semiconductor device C.
  • a disadvantage such as the displacement of the position of the pressing member 19 with respect to the semiconductor device C.
  • a mounting apparatus having an elastic body between a heating and pressing head (head main body) and a pressing block has been known as a conventional configuration.
  • the position of the elastic body is initially arranged by repeating the pressing operation of the semiconductor chip by the heat pressure bonding head. The problem of gradually shifting from the direction perpendicular to the pressing direction occurs.
  • the positional displacement of the elastic body generated in such a conventional device is a displacement of the constituent materials of the heating pressure bonding head and the pressing block, and the positional relationship between the heating pressure bonding head and the elastic body and the pressing block. It turned out to be due to.
  • the elastic body D is attached to each of the heating and pressing head H and the pressing block R. , Are in direct contact with each other.
  • thermocompression bonding head and the pressing block In a mounting apparatus that heats and presses the semiconductor device, it is necessary to efficiently transmit the heat of the heater contained in the heating and pressing head and the pressing force of the heating and pressing head to the semiconductor device to be pressed. Therefore, it is required to use a material having a high thermal conductivity and a certain rigidity or more as the material of the heating and pressing head and the pressing block. Therefore, a metal having high thermal conductivity, such as aluminum or copper, is generally used as a constituent material of the thermocompression bonding head and the pressing block.
  • the material constituting the elastic body has low adhesion to a metal having high thermal conductivity such as copper or aluminum, and the elastic body is caused by the low adhesion. It has been found that misalignment of That is, in the conventional configuration, the elastic body D is in direct contact with the heat pressing head H having low adhesion. And the friction coefficient in the contact surface of the elastic body D and the heating pressure bonding head H becomes low due to the low adhesiveness. Therefore, the frictional force V1 generated on the surface where the elastic body D and the heating and pressing head H are in contact with each other is low.
  • the pressing block R can not uniformly press the semiconductor device C. Therefore, a mounting failure of the semiconductor device C on the substrate occurs, such as a pressing error of the pressing block R on the semiconductor device C, or a tilt of the semiconductor device C mounted due to uneven pressing (FIG. 9 (d)).
  • the allowable range of positional deviation of the pressing block R with respect to the semiconductor device C is, for example, 10% or less of the diameter of the bump B, and high accuracy is required for the position of the pressing block R at the time of pressing mounting. Be done.
  • the position of the elastic body D is shifted not only in the x direction but also in the y direction due to the occurrence of slippage on the contact surface of the heating and pressing head H and the elastic body D. Furthermore, as shown in FIG. 10A, the elastic body D may be displaced so as to rotate in the ⁇ direction about the z axis.
  • each of the pressing blocks R shown by dotted lines is arranged to face each of the semiconductor devices C shown by solid lines (FIG. 10 (b)).
  • the elastic body D is in direct contact with the pressing block R, and the adhesion between the constituent material of the general elastic body D and the constituent material of the general pressing block R is low. Therefore, the frictional force V3 generated between the elastic body D and the pressing block R is reduced. Therefore, since each of the forces J1 and J2 which the elastic body D tries to spread along the contact surface with the pressing block R at the time of pressing exceeds the frictional force V3, as shown by a symbol SL in FIG.
  • the elastic body D spreads so as to slide along the contact surface with the pressing block R. That is, the elastic body D compressed in the z direction spreads so as to project in the direction perpendicular to the pressing direction not only at the central portion in the thickness direction but also at the contact surface with the pressing block R.
  • the elastic body D may not contact the entire surface of the pressing block R uniformly, or A situation occurs in which the positions of the block R and the semiconductor device C are shifted.
  • the pressing block R may be tilted with respect to the xy plane, or a mounting failure of the semiconductor device C may occur (FIG. 11 (d)).
  • the elastic body D may come into contact with the adjacent elastic body Ds as shown in FIG. 12C due to the elastic body D being shifted in the direction perpendicular to the pressing direction. Such contact further causes variations in pressing force. That is, when the elastic body D is not in contact with the adjacent elastic body Ds, when the head main body H is lowered to press the semiconductor chip, the elastic body D is compressed in the z direction and becomes thin and orthogonal to the z direction Expand and displace radially in the horizontal direction. In other words, as shown in FIG. 12D, the elastic body D expands in the horizontal direction at least at the central portion in the thickness direction, and an enlarged portion DL expanded in the horizontal direction compared to that before pressing is formed.
  • the elastic body D is difficult to be compressed in the z direction, so that variations in repulsive force occur to the pressing block R. As a result, it is difficult to uniformly press the pressing block R.
  • the displacement preventing member 20 is provided between the elastic member 19 and the head main body 16.
  • the displacement blocking member 20 is made of stainless steel (SUS) or the like.
  • the elastic member 19 is displaced to slide in the direction perpendicular to the pressing direction along the contact surface with the displacement blocking member 20 at the time of pressing, from the frictional force V1. It is blocked by the increasing frictional force V2 (FIG. 13 (b), symbol ST).
  • V2 FIG. 13 (b), symbol ST.
  • the displacement preventing member 21 is provided between the elastic member 19 and the pressing member 17.
  • the displacement blocking member 21 is made of stainless steel (SUS) or the like. That is, when pressing is performed using the pressure bonding head 14 according to the first embodiment, as shown in FIG. 13C, a strong frictional force V4 is generated on the contact surface between the displacement blocking member 21 and the elastic member 19. Compared with the frictional force (frictional force V3, see FIG. 11 (b)) generated between the pressing member 17 and the elastic member 19 made of a material such as copper or aluminum, between the displacement blocking member 21 and the elastic member 19 The frictional force V4 generated by
  • the elastic member 19 is displaced to slide in the direction perpendicular to the pressing direction along the contact surface with the displacement blocking member 21 at the time of pressing, from the frictional force V3. It is blocked by the increasing frictional force V4 (FIG. 13 (c), symbol ST).
  • V4 FIG. 13 (c), symbol ST
  • each of the displacement preventing members 20 and 21 is a plate-like member made of a metal such as stainless steel having high adhesion to an elastic body. Unlike an adhesive such as a resin, it is easy to make a plate-like metal member into a highly accurate planar shape. Therefore, the parallelism between the pressing member 17 and the surface of the semiconductor device C can be maintained with high accuracy while enhancing the adhesion between each of the displacement preventing members and the elastic member 19 to increase the friction coefficient. As a result, the semiconductor device C can be uniformly pressed by the pressing member 17 having high accuracy parallelism.
  • the thickness of the elastic body in the entire elastic member 19 can be made uniform with high precision. Therefore, the variation in height in each of the semiconductor devices C can be more suitably absorbed by the elastic members 19 having a uniform thickness.
  • the crimping head 14 includes the displacement blocking member 20 and the displacement blocking member 21 which are made of a material having high adhesion to the elastic member 19. That is, by increasing the coefficient of friction due to the improvement in adhesion, the frictional force at the contact surface between the elastic member 19 and the other components is increased. The rise of the frictional force prevents the elastic member 19 from being displaced so as to slide in the direction perpendicular to the pressing direction.
  • the second embodiment by increasing the vertical resistance of the elastic member 19, the frictional force at the contact surface between the elastic member 19 and the other components is increased, and as a result, the elastic member 19 is displaced in the direction perpendicular to the pressing direction. It is configured to prevent you from The configuration of the second embodiment will be described below with reference to the drawings.
  • the same components as those in the first embodiment are denoted by the same reference numerals and the detailed description will be omitted.
  • the pressure bonding head 14A includes a plate-like plate portion 16P and a block portion 16Q attached to the lower surface of the plate portion 16P.
  • a through hole 25 penetrating in the pressing direction is formed in the plate portion 16P, and a through hole 27 penetrating in the pressing direction is formed in the block portion 16Q.
  • Each of through hole 25 and through hole 27 is formed in accordance with the position where pressing member 17 is disposed.
  • the through holes 25 and the through holes 27 are respectively formed in communication with each other.
  • the pressing member 17 has a protruding portion 17 a having a shape protruding upward, and the protruding portion 17 a is fitted and arranged inside the through hole 27.
  • a depression 31 is provided on the upper side of the through hole 27 for fitting a restriction 30 described later.
  • the crimping head 14A includes a bolt 29 instead of the displacement blocking member 20 and the displacement blocking member 21.
  • the bolts 29 are disposed in accordance with the number and position at which each of the pressing members 17 is disposed.
  • Each of the bolts 29 has a head 29a, a shaft 29b and a ring 29c.
  • the head portions 29a of the bolts 29 are individually disposed inside the through holes 25 formed in the plate portion 16P.
  • the head 29a of the bolt 29 is received on the upper surface of the ring 29c, and the ring 29c is received on the upper surface of the block portion 16Q outside the through hole 27.
  • the shaft portion 29 b of the bolt 29 is disposed inside the through hole 27 and is screwed into a screw hole 33 formed on the upper surface of the projecting portion 17 a of the pressing member 17.
  • the pressure bonding head 14A further includes a restriction portion 30.
  • the restricting portion 30 is provided on the lower surface of the ring 29c so as to be in contact with one end side thereof.
  • the projecting portion 17a of the pressing member 17 forms a notch portion 17b by cutting out a part of the upper end side surface according to the shape of the regulating portion 30.
  • the restricting portion 30 is disposed to be fitted to the recess 31 and the notch 17b, and restricts the rotation of each of the ring 29c and the pressing member 17 in the ⁇ direction.
  • the pressing member 17 shown in FIG. 14 (a) is a cross-sectional view taken along the line AA in FIG. 14 (c).
  • the elastic member 19A in a state of being compressed in the pressing direction in advance is disposed between the head main body 16 and the pressing member 17 by screwing the bolt 29 into the screw hole 33. It has a configuration. Specifically, when an external force T is applied to the non-compressed elastic member 19 (FIG. 15A) to which no external force is applied, the elastic member 19 can be further compressed from the non-compression state. After passing through the semi-compressed state which is the state (FIG. 15 (b)), it reaches the compression limit state where the further compression is impossible (FIG. 15 (c)).
  • the repulsive force F according to the magnitude of the external force T is inside the semi-compressed elastic member 19A or the elastic member 19B in the compression limit state. Occur.
  • the elastic member 19A which is in a semi-compressed state in advance, is disposed between the head main body 16 and the pressing member 17 in a state where pressing on the semiconductor device C is not performed. It is set up. That is, the elastic member 19 having the thickness h1 is compressed in the z direction by further strongly tightening the bolt 29 from the state where the bolt 29 is screwing the elastic member 19 in the non-compressed state (FIG. 16A).
  • the elastic member 19A in the semi-compressed state having the thickness h2 is disposed on the pressure bonding head 14A in the initial state (FIGS. 16 (b) and 14 (a)). Inside the elastic member 19A fixed to the crimping head 14 in a semi-compressed state, a repulsive force F is always generated according to the magnitude of the tightening force of the bolt 29.
  • the elastic member 19A is preferably disposed on the pressure bonding head 14A in a semi-compressed state compressed at a damping rate of 1% or more and 20% or less. That is, the thickness h2 of the elastic member 19A in the semi-compressed state as shown in FIG. 16 (b) is 80% to 99% less than the thickness h1 in the non-compressed state as shown in FIG. 16 (a). It is preferable that In the second embodiment, the bolt 29 corresponds to the blocking member and the vertical drag maintaining means in the present invention.
  • the one-round operation of fully pressing the semiconductor device C to the substrate W using the mounting apparatus according to the second embodiment is the same as the operation in the first embodiment.
  • the mounting apparatus according to the second embodiment Is different in that the elastic member 19A is in the semi-compressed state.
  • the elastic member 19A in the second embodiment is in a semi-compressed state in which an external force is applied in the pressing direction in advance, even in the initial state before pressing on the semiconductor device C, the repulsive force of the predetermined value N1. F acts on the contact surface of the pressing member 17 and the contact surface of the head main body 16.
  • step S6 the pressure bonding head 14A is lowered by the operation of the cylinder 13, and the plurality of semiconductor devices C are simultaneously heated and pressed by the heated pressure bonding head 14A.
  • the heat of the heater 15 embedded in the pressure bonding head 14A is conducted to the pressing member 17 via the elastic member 19A, and the pressing member 17 via the projecting portion 17a fitted in the through hole 27.
  • the projecting portion 17a is a part of the pressing member 17, and is particularly made of a material having high heat conductivity. Therefore, the heat of the heater 15 is more efficiently transmitted to the pressing member 17 through the projecting portion 17a, so that the semiconductor device C and the thermosetting resin G can be heated more efficiently.
  • the elastic member 19A having the thickness h2 and in the semi-compressed state is further compressed in the z direction. Its thickness is h3.
  • the elastic member 19A since the elastic member 19A is in a semi-compressed state in advance, there is room for the elastic member 19A to be thinner in the pressing direction when the pressure is applied by the pressure bonding head 14A. Therefore, even if the heights of the plurality of semiconductor devices C in the pressing direction vary, the variations are absorbed by the elastic member 19A.
  • the frictional force acting on the contact surface is proportional to each of the normal force and the coefficient of friction at the contact surface. Therefore, when the elastic member 19A in the semi-compressed state is further compressed as compared with the case where the elastic member 19 in the non-compressed state is compressed, the frictional force V2 acting on the contact surface of the pressing member 17 and the contact surface of the head main body 16 And V4 become large (FIG. 17).
  • the elastic member 19A is prevented from slidingly spreading along the contact surface with the head main body 16 by the frictional force V2 which is increased as compared with the frictional force V1 in the conventional device. Further, the elastic member 19A is prevented from spreading so as to slide along the contact surface with the pressing member 17 by the frictional force V4 which is increased as compared with the frictional force V3 in the conventional device.
  • the bolt 29 corresponds to the blocking member in the second embodiment.
  • the elastic member disposed between the head body and the pressing member is in the non-compressed state in the initial state in which the semiconductor device is waiting above the semiconductor device. Is configured.
  • the elastic member 19A disposed between the head main body 16 and the pressing member 17 is configured to be in the semi-compressed state.
  • the frictional force generated at the contact surface between the elastic member 19A and the other member is increased. Therefore, even if the head body 16 and the pressing member 17 are made of a material (such as aluminum or copper) having a relatively small coefficient of friction with the material of the elastic member 19A while having high thermal conductivity, the elastic member 19A presses It is possible to avoid sliding displacement in the direction perpendicular to the direction.
  • the displacement of the elastic member 19A can be avoided without providing the displacement preventing member 20 or the displacement preventing member 21 on the upper surface or the lower surface of the elastic member 19A.
  • each of the semiconductor devices C can be suitably mounted on the substrate W. Even if the height of the lower surface of the pressing member 17 varies individually, if the variation is about several ⁇ m, it is possible to make the same within the same plane by adjusting the tightening condition of the bolt 29.
  • the bolt 29 (and the ring 29c) interposed between the head main body and the pressing member 16 is metal having high thermal conductivity, the heat of the heater 15 is more efficiently conducted to the pressing member 17.
  • the elastic member 19A is in direct contact with each of the head main body 16 and the pressing member 17 made of a material having high thermal conductivity, and since the elastic member 19A is in a semi-compressed state, Is getting thinner. Therefore, the heat transfer efficiency of the heater 15 in the elastic member 19A can be further improved.
  • the elastic member 19A when the pressing external force is applied to the elastic member 19A, the elastic member 19A is expanded in the lateral direction. For this reason, when designing, it is necessary to consider the dimensions so that the elastic member 19A does not contact the projecting portion 17a of the pressing member 17 even in the case of the maximum pressing external force in the specification. If the elastic member 19A comes into contact with the projecting portion 17a of the pressing member 17, an uneven force is applied to the projecting portion 17a in the horizontal direction, which causes a disadvantage.
  • FIG. 18A shows a schematic configuration of a pressure bonding head 14B according to a third embodiment.
  • the elastic member 19 is provided between the head main body 16 and the pressing member 17, and the elastic member 19 is in direct contact with each of the head main body 16 and the pressing member 17 as in the second embodiment.
  • another embodiment is that the uneven portion 41 is formed on the contact surface between the elastic member 19 and the head main body 16 and the uneven portion 43 is formed on the contact surface between the elastic member 19 and the pressing member 17. It is different from.
  • An uneven surface 16 j is formed on the lower surface of the head main body 16, that is, the surface of the head main body 16 in contact with the elastic member 19.
  • An uneven surface 19 h is formed on the upper surface of the elastic member 19, that is, the surface of the elastic member 19 in contact with the head main body 16.
  • the concavo-convex pattern is formed so that the concavo-convex surface 16 j and the concavo-convex surface 19 h fit each other, and the concavo-convex portion 41 is formed by fitting the concavo-convex surface 16 j with the concavo-convex surface 19 h.
  • An uneven surface 19 j is formed on the lower surface of the elastic member 19, that is, the surface of the elastic member 19 in contact with the pressing member 17.
  • An uneven surface 17 h is formed on the upper surface of the pressing member 17, that is, the surface of the pressing member 17 in contact with the elastic member 19.
  • the concavo-convex pattern is formed so that the concavo-convex surface 19 j and the concavo-convex surface 17 h fit each other, and the concavo-convex portion 43 is formed by fitting the concavo-convex surface 19 j with the concavo-convex surface 17 h.
  • the concavo-convex portion 41 and the concavo-convex portion 43 are not limited to the concavo-convex shape, and the shape may be changed as long as the coefficient of friction on the surface of the elastic member 19 is improved.
  • the coefficient of friction on the contact surface between the elastic member 19 and the head main body 16 is increased by the concavo-convex pattern constituting the concavo-convex part 41. Further, the coefficient of friction on the contact surface between the elastic member 19 and the pressing member 17 is increased by the concavo-convex pattern constituting the concavo-convex portion 43. Therefore, by forming the concavo-convex portion 41 and the concavo-convex portion 43, the frictional force on each contact surface of the elastic member 19 is improved, so that the elastic member 19 is displaced to slide in the horizontal direction orthogonal to the pressing direction. It can be avoided with certainty.
  • the concavo-convex pattern of the concavo-convex part 41 and the concavo-convex pattern of the concavo-convex part 43 are configured to coincide in the pressing direction (see dotted line in FIG. 18C). Therefore, as shown in FIG. 18C, the elastic member 19 has a constant value ha in the z direction over the entire surface in the horizontal direction. Since the thickness is uniform over the entire surface of the elastic member 19, the force of the elastic member 19 to absorb the variation in height of the semiconductor device C is the same over the entire surface in the horizontal direction of the elastic member 19.
  • the displacement of the elastic member 19 in the horizontal direction can be suppressed by the concavo-convex portions 41 and 43, and the pressing member 17 is inclined to the horizontal surface when the head main body 16 is lowered to press the semiconductor device C. Can be avoided with certainty.
  • an uneven surface is formed on each of the head main body 16, the elastic member 19, and the pressing member 17.
  • the coefficient of friction of the contact surface between the elastic member 19 and the head main body 16 is flat due to the uneven portion 41 formed by fitting the uneven surface 16 j of the head main body 16 with the uneven surface 19 h of the elastic member 19.
  • the present invention is greatly improved as compared with the conventional configuration in which the elastic body D and the elastic body D are brought into contact with each other. Further, the coefficient of friction at the contact surface between the elastic member 19 and the pressing member 17 is greatly improved by the uneven portion 43.
  • the frictional force is increased by the improvement of the coefficient of friction, displacement of the elastic member 19 in the direction perpendicular to the pressing direction can be avoided.
  • the coefficient of friction as in the first embodiment is obtained by forming the concavo-convex portions 41 and 43.
  • the frictional force of the elastic member 19 can be increased due to the improvement of
  • the present invention is not limited to the embodiment described above, but may be modified as follows.
  • the configurations of Embodiment 1 and Embodiment 2 may be combined. That is, as shown in FIG. 19, as in the second embodiment, the pressure bonding head 14C according to the modification includes the elastic member 19A in a semi-compressed state between the head main body 16 and the pressing member 17. Furthermore, in the modification, as in the first embodiment, the displacement blocking member 20 is provided between the elastic member 19A and the head main body 16, and the displacement blocking member 21 is provided between the elastic member 19A and the pressing member 17. There is.
  • the elastic member 19A is made semi-compressed in advance to generate the repulsive force F, and the displacement preventing member is made of a material (such as stainless steel) having a high coefficient of friction with the constituent material of the elastic member 19A. It has 20 and 21. That is, in this modification, both the normal reaction and the friction coefficient at the contact surface with the elastic member 19A are increased.
  • the frictional force generated at the contact surface between the elastic member 19A and the displacement prevention member 20 and at the contact surface between the elastic member 19A and the displacement prevention member 21 is dramatically enhanced by the improvement of the vertical resistance and the coefficient of friction.
  • displacement of the elastic member 19A in the direction perpendicular to the pressing direction can be more reliably prevented. Accordingly, since the positions and postures of the elastic member 19A and the pressing member 17 in the xy plane are fixed, the heating and pressing mounting of the semiconductor device C by the pressing member 17 can be completed without occurrence of positional deviation and inclination of the semiconductor device C. .
  • the semiconductor device C to be pressed has a single-layer structure having one bump B as shown in FIG.
  • the object to be pressed and mounted is not limited to a single layer structure, and the mounting device according to the present invention may be mounted on a substrate W when mounting a semiconductor device C having a multilayer structure in which multilayer bumps B are stacked as shown in FIG. Can be used.
  • a bolt 29 which penetrates the head body 16 is newly provided, and the elastic member 19A is fixed in a semi-compressed state by the tightening force of the bolt 29.
  • the configuration for fixing the elastic member 19A in the semi-compressed state is not limited to the bolt 29.
  • the support holder 18 which concerns on Example 1 is diverted, and the structure which clamps and fixes the said elastic member 19 with force stronger than the clamping force of Example 1 is mentioned.
  • the elastic member 19 is compressed in the z direction from the non-compressed state (FIG. 21 (a)) to the semi-compressed state (FIG. 21 (b)) by strongly tightening with the support holder 18, and fixed in the semi-compressed state Be done.
  • a repulsive force F corresponding to the strength of the tightening force N2 is generated on the elastic member 19A in the semi-compressed state, and the normal force of the elastic member 19 is increased due to the repulsive force.
  • the support holder 18 corresponds to the blocking member and the vertical drag maintaining means in the present invention.
  • each of the displacement preventing members 20 and 21 may have a configuration in which a plurality of plate-shaped materials S are overlapped.
  • the constituent material of the material S is, for example, stainless steel (SUS).
  • the height in the z direction is independently and selectively selected between the adjacent pressing member 17P and the pressing member 17Q by appropriately changing the number of the materials S. It can be changed as appropriate. Therefore, as shown in FIG. 22 (b), even if the thickness of the elastic members 19P and the elastic members 19Q adjacent to each other varies, the number of the material S constituting the displacement preventing member should be adjusted. Thus, the height of the lower surface of the pressing member 17P and the height of the lower surface of the pressing member 17Q can be made uniform. As a result, it is possible to reliably avoid the occurrence of a mounting error caused by the variation in the thickness of the elastic member 19.
  • the number of the material S disposed on the upper and lower surfaces of the elastic member 19P and the upper and lower surfaces of the elastic member 19Q are also provided.
  • the heights of the tip portions of the plurality of pressing members 17 can be made uniform. Therefore, it is possible to reliably avoid the occurrence of the mounting error caused by the variation in the thickness of the plurality of pressing members 17.
  • the single crimping head 14 including the plurality of pressing members 17 is provided, and the plurality of semiconductor devices C are fully crimped by the crimping head 14.
  • the mounting apparatus may have a configuration in which a plurality of pressure bonding heads 14 provided with the pressing members 17 are provided.
  • the heater 15 of the pressure bonding head 14 is embedded in the head main body 16, but is configured to be heated from the outside of the head main body 16 Also good.
  • the heater is heated to a high temperature.
  • a pulse heater which changes the temperature during the process can be used, and the mounting can be performed without using a plate for delaying heat conduction.
  • one of the displacement blocking member 20 and the displacement blocking member 21 may be omitted.
  • the displacement blocking member 20 it is possible to avoid a situation in which the elastic member 19 and the head main body 16 are displaced relative to each other.
  • the displacement blocking member 21 separately from the positional displacement, it is possible to prevent the relative displacement between the elastic member 19 and the pressing member 17.
  • the effect of preventing the positional displacement of the pressing member 17 with respect to the semiconductor device C can be exhibited.
  • both the displacement blocking member 20 and the displacement blocking member 21 are provided, it is possible to more reliably avoid the occurrence of the positional displacement of the pressing member 17 with respect to the semiconductor device C by the synergetic effect.
  • thermosetting resin a thermosetting resin
  • the present invention can be effectively applied to any implementation that requires pressing to absorb height variations.
  • it may be used in flip chip mounting in which a thermosetting resin is not interposed, or in die bonding in which the non-electrode surface of a semiconductor chip is mounted on a substrate via a thermosetting resin.
  • the present invention may be used when mounting electronic components (resistors, capacitors, piezoelectric elements, etc.) other than semiconductor devices on a substrate.
  • the substrate W is transported and mounted on the holding stage 10 in a state where the substrate W is locked and held by the transport arm 4 provided with the holding frame 6.
  • the configuration in which the holding stage 10 sucks and holds is described as an example. However, as long as the substrate W can be appropriately transported, placed, and held, the configurations of the transport arm 4 and the holding stage 10 may be changed as appropriate.
  • the configuration for transporting and placing the substrate W a configuration in which the substrate is sucked and held by the transport arm 4 and transported, and a configuration in which the substrate W is manually transported and loaded on the holding stage 10 Can be mentioned.
  • the holding stage 10 may omit the configuration for adsorbing the substrate W.
  • the heater 15 is illustrated as being built in the head body 16.
  • the configuration is not limited thereto as long as the semiconductor device C can be heated and pressed. That is, the heater 15 may be provided outside the head main body 16 so as to heat the head main body 16 and the like from the outside of the head main body 16.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
PCT/JP2018/033135 2017-09-12 2018-09-07 圧着ヘッドおよび実装装置 WO2019054284A1 (ja)

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EP4080554A3 (de) * 2021-04-21 2023-04-19 PINK GmbH Thermosysteme Sintervorrichtung und verfahren zum steuern einer sintervorrichtung
WO2023195175A1 (ja) * 2022-04-08 2023-10-12 株式会社Fuji 電気回路形成方法、および電気回路形成装置

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JP7453035B2 (ja) 2020-03-30 2024-03-19 東レエンジニアリング株式会社 圧着ヘッド、これを用いた実装装置および実装方法

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JP2007294607A (ja) * 2006-04-24 2007-11-08 Sony Chemical & Information Device Corp 押圧ヘッド及び押圧装置
JP2010034423A (ja) * 2008-07-30 2010-02-12 Fujitsu Ltd 加圧加熱装置及び方法
JP2011009357A (ja) * 2009-06-24 2011-01-13 Fujitsu Ltd 実装装置
JP2015170646A (ja) * 2014-03-05 2015-09-28 東レ株式会社 圧着ヘッド、それを用いた実装装置および実装方法
WO2016031806A1 (ja) * 2014-08-25 2016-03-03 東レエンジニアリング株式会社 実装用ヘッドおよびそれを用いた実装装置

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JP2007294607A (ja) * 2006-04-24 2007-11-08 Sony Chemical & Information Device Corp 押圧ヘッド及び押圧装置
JP2010034423A (ja) * 2008-07-30 2010-02-12 Fujitsu Ltd 加圧加熱装置及び方法
JP2011009357A (ja) * 2009-06-24 2011-01-13 Fujitsu Ltd 実装装置
JP2015170646A (ja) * 2014-03-05 2015-09-28 東レ株式会社 圧着ヘッド、それを用いた実装装置および実装方法
WO2016031806A1 (ja) * 2014-08-25 2016-03-03 東レエンジニアリング株式会社 実装用ヘッドおよびそれを用いた実装装置

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Publication number Priority date Publication date Assignee Title
EP4080554A3 (de) * 2021-04-21 2023-04-19 PINK GmbH Thermosysteme Sintervorrichtung und verfahren zum steuern einer sintervorrichtung
WO2023195175A1 (ja) * 2022-04-08 2023-10-12 株式会社Fuji 電気回路形成方法、および電気回路形成装置

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