WO2019047381A1 - 一种显示面板的制备方法及其显示面板 - Google Patents

一种显示面板的制备方法及其显示面板 Download PDF

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Publication number
WO2019047381A1
WO2019047381A1 PCT/CN2017/112464 CN2017112464W WO2019047381A1 WO 2019047381 A1 WO2019047381 A1 WO 2019047381A1 CN 2017112464 W CN2017112464 W CN 2017112464W WO 2019047381 A1 WO2019047381 A1 WO 2019047381A1
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layer
organic light
emitting layer
spacer
display panel
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PCT/CN2017/112464
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English (en)
French (fr)
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李双
林建宏
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武汉华星光电半导体显示技术有限公司
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Publication of WO2019047381A1 publication Critical patent/WO2019047381A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a method for preparing a display panel and a display panel thereof.
  • the touch panel of the conventional display panel is prepared on a separate substrate, and the touch structure of the flexible display panel is mostly prepared directly on the film encapsulation layer TFE, thereby reducing the touch substrate and achieving flexibility.
  • AMOLED Active-matrix organic light emitting diode Diode
  • the existing OLED display panel includes an array substrate, a cathode layer 103 sequentially formed on the array substrate, an encapsulation layer 102 and a touch layer 101.
  • the cathode layer is mostly deposited in a large area, this may cause overlapping of the coverage area between the cathode layer and the touch trace of the display panel, which may cause a large capacitive load, and the generation of these capacitive loads may seriously affect.
  • the touch sensitivity and screen brightness of the display panel since the cathode layer is mostly deposited in a large area, this may cause overlapping of the coverage area between the cathode layer and the touch trace of the display panel, which may cause a large capacitive load, and the generation of these capacitive loads may seriously affect.
  • the touch sensitivity and screen brightness of the display panel since the cathode layer is mostly deposited in a large area, this may cause overlapping of the coverage area between the cathode layer and the touch trace of the display panel, which may cause a large capacitive load
  • the technical problem to be solved by the present invention is to provide a method for preparing a display panel and a display panel, which can reduce the touch capacitance of the display panel.
  • a technical solution adopted by the present invention is to provide a method for preparing a display panel, including:
  • an organic light-emitting layer having a spacer on a surface of the anode layer of the array substrate, the spacer being located in a non-pixel region of the organic light-emitting layer, the anode layer being located in a pixel region of the organic light-emitting layer;
  • a touch layer is formed on the surface of the encapsulation layer, and a touch line of the touch layer is located in a non-pixel region of the surface of the organic light-emitting layer.
  • another technical solution adopted by the present invention is to provide a method for preparing a display panel, including:
  • an organic light emitting layer having a spacer on a surface of the array substrate, the spacer being located in a non-pixel region of the organic light emitting layer;
  • a touch layer is formed on the surface of the encapsulation layer, and a touch line of the touch layer is located in a non-pixel region of the surface of the organic light-emitting layer.
  • a display panel including:
  • the organic light emitting layer has a spacer, and the spacer is located in a non-pixel region of the organic light emitting layer;
  • a cathode layer on top of the spacer and a cathode layer on a surface of the organic light-emitting layer are separated by the encapsulation layer;
  • the touch line of the touch layer is located in a non-pixel area of the surface of the organic light emitting layer.
  • An advantageous effect of the present invention is that, in a method for preparing a display panel of the present invention, an organic light-emitting layer having a spacer portion is formed on a surface of the array substrate, and the spacer portion is located at a non-position of the organic light-emitting layer.
  • a pixel region a cathode layer is formed on a surface of the organic light-emitting layer, and a cathode layer on a top portion of the spacer portion and a cathode layer on a surface of the organic light-emitting layer are formed with a gap, and an encapsulation layer is formed on a surface of the cathode layer.
  • the surface of the encapsulation layer forms a touch layer, and the touch line of the touch layer is located in a non-pixel area of the surface of the organic light-emitting layer.
  • the cathode layer on the top of the spacer and the cathode layer on the surface of the organic light-emitting layer are separated by the encapsulation layer, the cathode layer on the surface of the organic light-emitting layer has a signal, and the cathode layer on the top of the spacer has no electrical signal, which is reduced.
  • the facing area of the touch line and the cathode layer with the electric signal can effectively reduce the touch capacitance of the display panel, improve the touch sensitivity and screen brightness of the display panel, thereby improving the user experience and feeling.
  • FIG. 1 is a schematic cross-sectional structural view of a prior art display panel
  • FIG. 2 is a schematic flow chart of an embodiment of a method for preparing a display panel according to the present invention
  • FIG 3 is a schematic cross-sectional view showing an embodiment of a display panel prepared by the preparation method of the present invention.
  • FIG. 2 is a schematic flow chart of an embodiment of a method for preparing a display panel of the present invention.
  • the method for preparing the display panel of the present embodiment includes:
  • the metal film layer is deposited on the substrate, the metal film layer is etched into a gate electrode, and then a gate insulating layer is deposited on the surface of the gate electrode, wherein the gate insulating layer includes silicon nitride SiNx. At least one of amorphous silicon oxide SiOx. Further, a source and a drain separated by a channel are formed on the gate insulating layer, and finally, after the gate, the source and the drain are formed, an insulating passivation layer is deposited on the surface of the thin film transistor. A contact via is disposed on the insulating passivation layer, and a contact electrode is disposed in the contact via to form an array substrate.
  • the preparation method of the array substrate may also be in other well-known manners, which is not limited herein.
  • an anode layer is formed on the surface of the array substrate.
  • an organic light-emitting layer having a spacer is formed on the surface of the anode layer of the array substrate, and the spacer is located in a non-pixel region of the organic light-emitting layer, and the anode layer corresponds to a pixel region of the organic light-emitting layer.
  • a spacer is formed on the surface of the array substrate, and then an organic light-emitting layer is formed, and the height of the spacer is higher than the height of the organic light-emitting layer.
  • the spacer portion can be formed by a mask.
  • the organic light-emitting layer is formed by a vacuum deposition method.
  • the surface in which the spacer portion is in contact with the array substrate is the bottom surface of the spacer portion, and the surface facing the bottom surface is the top surface, and the cross section of the spacer portion is a trapezoid having a narrow top side and a narrow bottom side.
  • 202 forming a cathode layer on a surface of the organic light-emitting layer, and forming a gap between the cathode layer on the top of the spacer and the cathode layer on the surface of the organic light-emitting layer.
  • a cathode layer is formed on the surface of the organic light-emitting layer by vacuum deposition, and a gap is formed between the cathode layer on the top of the spacer and the cathode layer on the surface of the organic light-emitting layer.
  • the cathode layer is prepared using a material having high conductivity and high transparency.
  • the cathode layer material when the cathode layer is vacuum-deposited, the cathode layer material is provided with the metal material property, and the cathode layer material directly falls on the surface of the organic light-emitting layer and the top of the spacer without entering the inside of the spacer, and the spacer portion
  • the top of the cathode layer above the surface of the organic light-emitting layer that is, the cathode layer at the top of the spacer and the cathode layer on the surface of the organic light-emitting layer are broken, so that the cathode layer on the top of the spacer and the cathode layer on the surface of the organic light-emitting layer A gap is formed between them.
  • the encapsulation layer formed on the surface of the cathode layer is encapsulated by a thin film encapsulation technique. After the package is completed, the encapsulation layer enters the gap between the cathode layer at the top of the spacer and the cathode layer on the surface of the organic light-emitting layer, forming a space therebetween, thereby reliably breaking the electrical connection therebetween.
  • 204 forming a touch layer on the surface of the package layer, and placing the touch line of the touch layer on a non-pixel area of the surface of the organic light-emitting layer.
  • the touch line is a grid-like, highly transparent, and electrically conductive metal wire.
  • an organic light-emitting layer having a spacer portion is formed on a surface of the array substrate, the spacer portion is located in a non-pixel region of the organic light-emitting layer, a cathode layer is formed on a surface of the organic light-emitting layer, and a spacer portion is formed Forming a gap between the cathode layer and the cathode layer on the surface of the organic light-emitting layer, forming an encapsulation layer on the surface of the cathode layer, forming a touch layer on the surface of the encapsulation layer, and disposing the touch line of the touch layer on the surface of the organic light-emitting layer region.
  • the cathode layer on the top of the spacer and the cathode layer on the surface of the organic light-emitting layer are separated by the encapsulation layer, the cathode layer on the surface of the organic light-emitting layer has a signal, and the cathode layer on the top of the spacer has no electrical signal, which is reduced.
  • the facing area of the touch line and the cathode layer with the electric signal can effectively reduce the touch capacitance of the display panel, improve the touch sensitivity and screen brightness of the display panel, thereby improving the user experience and feeling.
  • FIG. 3 is a schematic cross-sectional structural view of an embodiment of a display panel prepared by the preparation method of the present invention.
  • the display panel includes an array substrate 301 and an organic light emitting layer 302, a cathode layer 304, an encapsulation layer 305, and a touch layer sequentially formed on the array substrate 301.
  • the organic light emitting layer 302 has a spacer 303 located in a non-pixel region of the organic light emitting layer 302. The top height of the spacer 303 is higher than the top of the cathode layer on the surface of the organic light-emitting layer 302. The cathode layer on the top of the spacer 303 and the cathode layer on the surface of the organic light-emitting layer 302 are separated by an encapsulation layer 305.
  • the touch line 306 of the touch layer is located in a non-pixel area on the surface of the organic light emitting layer 302.
  • the display panel further includes an anode layer (not shown), an anode layer disposed between the array substrate 301 and the organic light emitting layer 302, and an anode layer corresponding to the pixel region of the organic light emitting layer 302.
  • the surface of the partition portion 303 that is in contact with the array substrate 301 is the bottom surface of the partition portion 303, and the surface facing the bottom surface is the top surface, and the cross section of the partition portion 303 is a trapezoid having a narrow top side and a narrow bottom side.
  • the spacer 303 disposed on the surface of the array substrate 301 is located in the non-pixel region of the organic light-emitting layer 302, and the spacer portion 303 is located below the package layer 305 facing the touch line of the touch layer 306, and the cathode layer 304
  • the cathode layer including the surface of the organic light-emitting layer 302 and the cathode layer at the top of the spacer 303, and the cathode layer on the top of the spacer 303 and the cathode layer on the surface of the organic light-emitting layer 302 are separated by the encapsulation layer 305.
  • the cathode layer on the surface of the organic light-emitting layer 302 has an electrical signal in the pixel region of the organic light-emitting layer 302, and the cathode layer on the top of the spacer portion 303 is located in the non-pixel region of the organic light-emitting layer 302 without a signal, the touch line 306 and the cathode having the electrical signal.
  • the facing area of the layer is reduced, and the cathode layer at the top of the spacer 303 has no electrical signal and does not form a parasitic capacitance with the touch trace 306. Therefore, the capacitive load of the touch panel of the display panel can be effectively reduced.
  • the display panel of the present embodiment includes an array substrate and an organic light-emitting layer, a cathode layer, an encapsulation layer and a touch layer formed on the array substrate in sequence; the organic light-emitting layer has a spacer portion, and the spacer portion is located on the organic light-emitting layer.
  • the non-pixel region; the cathode layer at the top of the spacer and the cathode layer at the surface of the organic light-emitting layer are separated by an encapsulation layer; and the touch line of the touch layer is located at a non-pixel region of the surface of the organic light-emitting layer.
  • the cathode layer on the top of the spacer and the cathode layer on the surface of the organic light-emitting layer are separated by the encapsulation layer, the cathode layer on the surface of the organic light-emitting layer has an electrical signal, and the cathode layer on the top of the spacer has no electrical signal, which reduces the touch line.
  • the positive facing area of the cathode layer with the electrical signal can effectively reduce the touch capacitance of the display panel, improve the touch sensitivity of the display panel and the brightness of the screen, thereby improving the user experience and feeling.

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Abstract

本发明公开了一种显示面板的制备方法及显示面板，显示面板的制备方法包括：在阵列基板的表面形成具有间隔部的有机发光层，间隔部位于有机发光层的非像素区域；在有机发光层的表面形成阴极层，并使间隔部顶部的阴极层与有机发光层表面的阴极层形成间隙；在阴极层表面形成封装层；在封装层表面形成触控层，并使触控层的触控线位于有机发光层表面的非像素区域。通过上述方式，本发明能够有效降低显示面板触控电容负载，提高显示面板触控灵敏度和屏幕亮度。

Description

一种显示面板的制备方法及其显示面板
【技术领域】
本发明涉及显示技术领域，特别是涉及一种显示面板的制备方法及其显示面板。
【背景技术】
随着显示面板技术的突飞猛进以及市场的需求，柔性显示面板越来越受到广泛关注和发展。传统的显示面板的触控面板是在独立的基板上制备，而柔性显示面板的触控结构多是直接在薄膜封装层TFE上制备完成的，这样减少了触控基板，又可实现柔性化。
有源矩阵有机发光二极体（Active-matrix organic light emitting diode，简称AMOLED）显示面板，与多数手机使用的传统液晶显示面板相比，具有更宽的视角、更高的刷新率和更薄的尺寸，因此正在得到智能手机采用。
如图1所示，现有的OLED显示面板包括：阵列基板及依次形成在阵列基板上的阴极层103，封装层102和触控层101。但是，由于阴极层多是大面积沉积的，这样就会导致显示面板的阴极层与触控走线之间覆盖区域会有重叠会产生较大的电容负载，而这些电容负载的产生会严重影响显示面板的触控灵敏度和屏幕亮度。
【发明内容】
本发明主要解决的技术问题是提供一种显示面板的制备方法及显示面板，能够降低显示面板触控电容负载。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种显示面板的制备方法，包括：
在阵列基板表面形成阳极层；
在阵列基板的阳极层的表面形成具有间隔部的有机发光层，所述间隔部位于所述有机发光层的非像素区域，所述阳极层位于所述有机发光层的像素区域；
在所述有机发光层的表面形成阴极层，并使所述间隔部顶部的阴极层与所述有机发光层表面的阴极层形成间隙，所述间隔部的截面为顶边宽底边窄的梯形；
在所述阴极层表面形成封装层；
在所述封装层表面形成触控层，并使所述触控层的触控线位于所述有机发光层表面的非像素区域。
为解决上述技术问题，本发明采用的另一个技术方案是：提供一种显示面板的制备方法，包括：
在阵列基板的表面形成具有间隔部的有机发光层，所述间隔部位于所述有机发光层的非像素区域；
在所述有机发光层的表面形成阴极层，并使所述间隔部顶部的阴极层与所述有机发光层表面的阴极层形成间隙；
在所述阴极层表面形成封装层；
在所述封装层表面形成触控层，并使所述触控层的触控线位于所述有机发光层表面的非像素区域。
为解决上述技术问题，本发明采用的再一个技术方案是：提供一种显示面板，包括：
包括阵列基板及依次形成在所述阵列基板上的有机发光层、阴极层、封装层及触控层；
所述有机发光层具有间隔部，所述间隔部位于所述有机发光层的非像素区域；
所述间隔部顶部的阴极层与所述有机发光层表面的阴极层由所述封装层间隔；
所述触控层的触控线位于所述有机发光层表面的非像素区域。
本发明的有益效果是：区别于现有技术的情况，本发明的显示面板的制备方法，在阵列基板的表面形成具有间隔部的有机发光层，所述间隔部位于所述有机发光层的非像素区域，在所述有机发光层的表面形成阴极层，并使所述间隔部顶部的阴极层与所述有机发光层表面的阴极层形成间隙，在所述阴极层表面形成封装层，在所述封装层表面形成触控层，并使所述触控层的触控线位于所述有机发光层表面的非像素区域。上述方法制备的显示面板，间隔部顶部的阴极层与有机发光层表面的阴极层被封装层间隔，有机发光层表面的阴极层有电讯号，间隔部顶部的阴极层没有电讯号，减小了触控线和有电讯号的阴极层的正对面积，能够有效降低显示面板触控电容负载，提高显示面板触控灵敏度和屏幕亮度，从而提升用户的使用体验和感受。
【附图说明】
图1是现有技术显示面板的剖面结构示意图；
图2是本发明显示面板制备方法一实施方式的流程示意图；
图3是本发明制备方法制备的显示面板一实施方式的剖面结构示意图。
【具体实施方式】
为了便于理解本发明，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明的较佳的实施方式，并不限于本文所描述的实施方式。相反地，提供这些实施方式的目的是为了让公众对本发明的公开内容理解的更加清楚透彻。
参阅图2，图2是本发明显示面板的制备方法一实施方式的流程示意图。本实施方式的显示面板的制备方法包括：
201：在阵列基板的表面形成具有间隔部的有机发光层，间隔部位于有机发光层的非像素区域。
在本实施方式中，先在基板上沉积金属膜层后，将金属膜层刻蚀成栅极，然后在栅极的表面沉积栅极绝缘层，其中，栅极绝缘层包括氮化硅SiNx，非晶氧化硅SiOx中的至少一种。再在栅极绝缘层上形成以一沟道分隔开的源极和漏极，最后在栅极、源极和漏极形成以后，在薄膜晶体管的表面沉积绝缘钝化层。绝缘钝化层上设置有接触通孔，接触通孔中设置有接触电极，最终形成阵列基板。阵列基板的制备方法还可以有其他公知的方式，此处不做限定。
阵列基板制备完成后，在阵列基板表面先形成阳极层。形成阳极层的方法有多种，此处不做限定。之后，在阵列基板的阳极层的表面形成具有间隔部的有机发光层，并且，使间隔部位于有机发光层的非像素区域，阳极层对应于有机发光层的像素区域。在本实施方式中，在阵列基板的表面形成间隔部，之后形成有机发光层，且间隔部的高度高于有机发光层的高度。
在本实施方式中，间隔部可通过掩膜板的方式形成。
在本实施方式中，有机发光层通过真空蒸镀法的方式形成。
在本实施方式中，间隔部与阵列基板接触的面为间隔部的底面，与底面相对的面为顶面，间隔部的截面为顶边宽底边窄的梯形。
202：在有机发光层的表面形成阴极层，并使间隔部顶部的阴极层与有机发光层表面的阴极层形成间隙。
在本实施方式中，在有机发光层的表面使用真空蒸镀法形成阴极层，并使间隔部顶部的阴极层与有机发光层表面的阴极层之间形成间隙。其中，阴极层使用高导电性和高透明度的材料制备的。
在本实施方式中，真空蒸镀阴极层时，阴极层材料具备金属材料特性，阴极层材料会直接落在有机发光层的表面和间隔部顶部上，而不会进入间隔部内侧，间隔部的顶部高于有机发光层表面的阴极层的顶部，即间隔部顶部的阴极层与有机发光层表面的阴极层之间断裂开来，从而使间隔部顶部的阴极层与有机发光层表面的阴极层之间形成间隙。
203：在阴极层表面形成封装层。
在本实施方式中，在阴极层表面形成封装层采用薄膜封装技术封装。封装完成后，封装层会进入间隔部顶部的阴极层与有机发光层表面的阴极层之间的间隙中，对二者形成间隔，从而可靠地断开两者的电连接。
204：在封装层表面形成触控层，并使触控层的触控线位于有机发光层在表面的非像素区域。
在本实施方式中，触控线是网格状的、透明度高的且导电性好的金属线。
区别于现有技术，本实施方式通过在阵列基板的表面形成具有间隔部的有机发光层，间隔部位于有机发光层的非像素区域，在有机发光层的表面形成阴极层，并使间隔部顶部的阴极层与所述有机发光层表面的阴极层形成间隙，在阴极层表面形成封装层，在封装层表面形成触控层，并使触控层的触控线位于有机发光层表面的非像素区域。上述方法制备的显示面板，间隔部顶部的阴极层与有机发光层表面的阴极层被封装层间隔，有机发光层表面的阴极层有电讯号，间隔部顶部的阴极层没有电讯号，减小了触控线和有电讯号的阴极层的正对面积，能够有效降低显示面板触控电容负载，提高显示面板触控灵敏度和屏幕亮度，从而提升用户的使用体验和感受。
参阅图3，图3是本发明制备方法制备的显示面板一实施方式的剖面结构示意图。
在本实施方式中，显示面板包括阵列基板301及依次形成在阵列基板301上的有机发光层302、阴极层304、封装层305和触控层。进一步的，有机发光层302具有间隔部303，间隔部303位于有机发光层302的非像素区域。间隔部303的顶部高度高于有机发光层302表面的阴极层的顶部。间隔部303顶部的阴极层与有机发光层302表面的阴极层由封装层305间隔。触控层的触控线306位于有机发光层302表面的非像素区域。显示面板还包括阳极层（图示未标示），阳极层设置在阵列基板301与有机发光层302之间，阳极层对应于有机发光层302的像素区域。
在本实施方式中，间隔部303与阵列基板301接触的面为间隔部303的底面，与底面相对的面为顶面，间隔部303的截面为顶边宽底边窄的梯形。
在本实施方式中，在阵列基板301表面设置的间隔部303位于有机发光层302的非像素区域，同时间隔部303位于触控层306的触控线正对的封装层305下方，阴极层304包括有机发光层302的表面的阴极层和间隔部303顶部的阴极层，并且间隔部303顶部的阴极层与有机发光层302表面的阴极层由封装层305所间隔。有机发光层302表面的阴极层位于有机发光层302的像素区域有电讯号，间隔部303顶部的阴极层位于有机发光层302的非像素区域没有电讯号，触控线306和有电讯号的阴极层的正对面积减小了，同时间隔部303顶部的阴极层没有电讯号也不会与触控走线306形成寄生电容。因此，能够有效降低显示面板触控结构电容负载。
区别于现有技术，本实施方式显示面板包括阵列基板及依次形成在阵列基板上的有机发光层、阴极层、封装层及触控层；有机发光层具有间隔部，间隔部位于有机发光层的非像素区域；间隔部顶部的阴极层与有机发光层表面的阴极层由封装层间隔；触控层的触控线位于有机发光层表面的非像素区域。上述显示面板，间隔部顶部的阴极层与有机发光层表面的阴极层被封装层间隔，有机发光层表面的阴极层有电讯号，间隔部顶部的阴极层没有电讯号，减小了触控线和有电讯号的阴极层的正对面积，能够有效降低显示面板触控电容负载，提高显示面板触控灵敏度和屏幕亮度，从而提升用户的使用体验和感受。
以上所述仅为本发明的实施方式，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (20)

  1. 一种显示面板的制备方法，其中，包括：
    在阵列基板表面形成阳极层；
    在阵列基板的阳极层的表面形成具有间隔部的有机发光层，所述间隔部位于所述有机发光层的非像素区域，所述阳极层位于所述有机发光层的像素区域；
    在所述有机发光层的表面形成阴极层，并使所述间隔部顶部的阴极层与所述有机发光层表面的阴极层形成间隙，所述间隔部的截面为顶边宽底边窄的梯形；
    在所述阴极层表面形成封装层；
    在所述封装层表面形成触控层，并使所述触控层的触控线位于所述有机发光层表面的非像素区域。
  2. 根据权利要求1所述一种显示面板的制备方法，其中，所述在所述有机发光层的表面形成阴极层，并使所述间隔部顶部的阴极层与所述有机发光层表面的阴极层形成间隙的步骤具体包括：在所述有机发光层的表面使用真空蒸镀法形成阴极层，并使所述间隔部顶部的阴极层与所述有机发光层表面的阴极层形成间隙。
  3. 根据权利要求2所述一种显示面板的制备方法，其中，所述间隔部的顶部高于所述有机发光层表面的阴极层的顶部。
  4. 根据权利要求1所述一种显示面板的制备方法，其中，所述触控线是网格状的透明的金属线。
  5. 根据权利要求1所述一种显示面板的制备方法，其中，所述间隔部通过掩膜板的方式形成。
  6. 根据权利要求1所述一种显示面板的制备方法，其中，所述阴极层材料是透明导电材料。
  7. 一种显示面板的制备方法，其中，包括：
    在阵列基板的表面形成具有间隔部的有机发光层，所述间隔部位于所述有机发光层的非像素区域；
    在所述有机发光层的表面形成阴极层，并使所述间隔部顶部的阴极层与所述有机发光层表面的阴极层形成间隙；
    在所述阴极层表面形成封装层；
    在所述封装层表面形成触控层，并使所述触控层的触控线位于所述有机发光层表面的非像素区域。
  8. 根据权利要求7所述的一种显示面板的制备方法，其中，在所述在阵列基板的表面形成具有间隔部的有机发光层，所述间隔部位于所述有机发光层的非像素区域的步骤之前还包括如下步骤：在阵列基板表面形成阳极层；
    所述在阵列基板的表面形成具有间隔部的有机发光层，所述间隔部位于所述有机发光层的非像素区域的步骤具体包括：
    在阵列基板的阳极层的表面形成具有间隔部的有机发光层，所述间隔部位于所述有机发光层的非像素区域，所述阳极层位于所述有机发光层的像素区域。
  9. 根据权利要求7所述一种显示面板的制备方法，其中，所述间隔部的截面为顶边宽底边窄的梯形。
  10. 根据权利要求9所述一种显示面板的制备方法，其中，所述在所述有机发光层的表面形成阴极层，并使所述间隔部顶部的阴极层与所述有机发光层表面的阴极层形成间隙的步骤具体包括：在所述有机发光层的表面使用真空蒸镀法形成阴极层，并使所述间隔部顶部的阴极层与所述有机发光层表面的阴极层形成间隙。
  11. 根据权利要求10所述一种显示面板的制备方法，其中，所述间隔部的顶部高于所述有机发光层表面的阴极层的顶部。
  12. 根据权利要求7所述一种显示面板的制备方法，其中，所述触控线是网格状的透明的金属线。
  13. 根据权利要求7所述一种显示面板的制备方法，其中，所述间隔部通过掩膜板的方式形成。
  14. 根据权利要求7所述一种显示面板的制备方法，其中，所述阴极层材料是透明导电材料。
  15. 一种显示面板，其中，包括：
    包括阵列基板及依次形成在所述阵列基板上的有机发光层、阴极层、封装层及触控层；
    所述有机发光层具有间隔部，所述间隔部位于所述有机发光层的非像素区域；
    所述间隔部顶部的阴极层与所述有机发光层表面的阴极层由所述封装层间隔；
    所述触控层的触控线位于所述有机发光层表面的非像素区域。
  16. 根据权利要求15所述的一种显示面板，其中，还包括阳极层，所述阳极层设置在所述阵列基板与所述有机发光层之间，所述阳极层位于所述有机发光层的像素区域。
  17. 根据权利要求15所述的一种显示面板，其中，所述间隔部的顶部高于所述有机发光层表面的阴极层的顶部。
  18. 根据权利要求15所述的一种显示面板，其中，所述间隔部的截面为顶边宽底边窄的梯形。
  19. 根据权利要求15所述的一种显示面板，其中，所述触控线是网格状的透明的金属线。
  20. 根据权利要求15所述的一种显示面板，其中，所述封装层设置在所述阴极层与所述触控层之间，所述封装层间隔所述间隔部顶部的阴极层与所述有机发光层表面的阴极层。
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