WO2019035197A1 - Alliage de brasage pour prévention de l'érosion de fe, brasure à fil fourré de résine, fil de brasage, fil de brasage fourré de résine, brasure à enrobage de flux, et joint à brasure tendre - Google Patents

Alliage de brasage pour prévention de l'érosion de fe, brasure à fil fourré de résine, fil de brasage, fil de brasage fourré de résine, brasure à enrobage de flux, et joint à brasure tendre Download PDF

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Publication number
WO2019035197A1
WO2019035197A1 PCT/JP2017/029531 JP2017029531W WO2019035197A1 WO 2019035197 A1 WO2019035197 A1 WO 2019035197A1 JP 2017029531 W JP2017029531 W JP 2017029531W WO 2019035197 A1 WO2019035197 A1 WO 2019035197A1
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WO
WIPO (PCT)
Prior art keywords
solder
flux
alloy
wire
corrosion
Prior art date
Application number
PCT/JP2017/029531
Other languages
English (en)
Japanese (ja)
Inventor
基泰 鬼塚
陽子 倉澤
俊策 吉川
岳 齋藤
Original Assignee
千住金属工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 千住金属工業株式会社 filed Critical 千住金属工業株式会社
Priority to CN201780037357.9A priority Critical patent/CN109673149A/zh
Priority to CN202310068678.2A priority patent/CN116174992A/zh
Priority to JP2018511177A priority patent/JP6344541B1/ja
Priority to PCT/JP2017/029531 priority patent/WO2019035197A1/fr
Priority to PH12018501147A priority patent/PH12018501147A1/en
Publication of WO2019035197A1 publication Critical patent/WO2019035197A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

Definitions

  • the present invention relates to a solder alloy for preventing iron corrosion which can suppress corrosion of a tip and carbonization of a flux, core solder, wire solder, core wire solder, flux coated solder, and a solder joint.
  • Sn-Ag-Cu based lead-free solder alloys are mainly used for connection of terminals such as printed circuit boards.
  • Sn-Ag-Cu based lead-free solder alloys are used in various processes such as flow soldering, reflow soldering, and soldering using a solder pot.
  • Soldering using a soldering iron includes manual soldering such as manual soldering.
  • the automation of soldering using a soldering iron has been advanced, and soldering has been performed automatically by a trowel robot.
  • the solder crucible is composed of a heating element and a tip, and the heat of the heating element is conducted to the tip to heat the tip.
  • Cu having a good thermal conductivity is used as the core material of the point.
  • the solder comes in direct contact with Cu, Cu is eaten by Sn in the solder alloy, and the shape of the tip is deformed, making it difficult to use as a solder iron. Therefore, in order to suppress erosion by Sn, the erosion is coated with Fe and Fe alloy plating.
  • the coating with Fe and Fe alloy plating is applied to the coating from the viewpoint of extending the life of the coating
  • the coating of the coating surface is coated as the number of solderings increases by the automation of the soldering. Eating has come to occur.
  • the cause of the occurrence of corrosion of Fe and Fe alloy is that Sn and Fe in the solder alloy are alloyed by mutual diffusion and it becomes easy to dissolve in Sn in the molten solder. For this reason, there is a limit in the handling of the solder pot side, and a solder alloy in which the occurrence of Fe corrosion is suppressed has been studied.
  • Patent Document 1 proposes an alloy in which 0.1 mass% or more of Co is added to a Sn—Ag—Cu-based solder alloy.
  • a Sn-Fe alloy is formed even if the content is very small. Therefore, in the invention described in Patent Document 1, 0.1% of Co belonging to the same Group 8 as Fe is used. By adding at least mass%, diffusion of Fe into the solder alloy is suppressed, and Fe corrosion can be prevented.
  • Patent No. 4577888 gazette
  • solder alloy described in Patent Document 1 contains 0.1% by mass or more of Co, Co disperses in the solder alloy and suppresses the diffusion of Fe into the solder alloy. It is possible to extend the previous life.
  • Co also has the property of being easy to react with carbon, although it suppresses Fe eating. For this reason, when soldering is performed several thousand times, the problem of the carbide adhering to the point has surfaced.
  • a flux based on rosin is generally used to break the oxide film on the terminal surface to make the solder easy to wet, and when soldering, together with the solder Rosin is also heated.
  • Co in the solder alloy reacts with the carbon and oxygen of the rosin to form a large amount of carbides and causes the carbides to adhere to the forehead.
  • the carbide adheres to the crucible due to a chemical reaction with Co, so it is difficult to remove the carbide from the crucible even by air cleaning. Therefore, as the frequency of use increases, the adhesion area of carbides increases, and eventually, soldering becomes difficult.
  • the subject of the present invention is a solder alloy for preventing iron corrosion, in which adhesion of a carbide to a tip is suppressed in order to suppress tip erosion for prolonging the life of the tip, core solder, wire solder
  • An object of the present invention is to provide a core wire solder, a flux coating solder, and a solder joint.
  • the inventors of the present invention in the alloy composition described in Patent Document 1, reduced the amount of adhesion of carbides to the tip due to the reduction of the Co content, but Fe corrosion was gradually generated as the Co content was reduced. I started. Therefore, in order to simultaneously achieve the prevention of Fe corrosion of the tip and the suppression of adhesion of carbides to the tip, the present inventors are to inhibit Fe corrosion in an alloy composition with a reduced Co content. Study was carried out.
  • Ni which is a transition metal of the same family.
  • Ni causes the melting point of the solder alloy to rise to form a compound with Sn
  • the addition of a small amount of Ni to such an extent as to compensate for the reduction of the Co content hardly causes the above-mentioned problems due to the large addition of Ni.
  • the addition of only a small amount of Ni can not exert a sufficient Fe eating suppression effect.
  • the present invention obtained by these findings is as follows. (1) Ag: 0.2 to 4.0% by mass, Cu: 0.1 to 1.0%, Co: 0.01 to 0.04%, Ni: 0.025 to 0.1%, A solder alloy for preventing corrosion of iron according to claim 1, characterized in that it has an alloy composition comprising Fe: 0.007 to 0.015% and the balance being Sn.
  • a wire solder comprising the solder alloy for preventing Fe corrosion according to the above (1) or (2).
  • % relating to the solder alloy composition is “% by mass” unless otherwise specified.
  • Alloy composition (1) Ag 0.2 to 4.0% or less Ag is an element capable of improving the wettability of a solder alloy. When the content of Ag is 0.2% or more, the wettability is remarkably improved. Further, if the Ag content is 0.2% or more, in addition to the above effects, the melting temperature of the solder alloy is lowered, so that the set temperature of the solder can be lowered, and additionally, the occurrence of Fe corrosion is generated. Can also be suppressed.
  • the lower limit of the Ag content is preferably 1.0% or more, and particularly preferably 2.3% or more. On the other hand, when the Ag content exceeds 4.0%, coarse compounds of SnAg crystallize out and cause defects such as bridges when soldering is performed.
  • the upper limit of the Ag content is 4.0% or less, preferably 3.5% or less.
  • Cu 0.1 to 1.0%
  • Cu is an element capable of suppressing corrosion of the electrode when the material of the electrode is Cu.
  • the lower limit of the Cu content is 0.1% or more, preferably 0.3% or more, and more preferably 0.5% or more.
  • the soldering iron temperature can not be set in the temperature range of the soldering operation temperature (240 ° C. to 450 ° C.), and the thermal of the electronic parts to be soldered It will cause damage.
  • the upper limit of the Cu content is 1.0% or less, preferably 0.7% or less.
  • Co 0.01 to 0.04% or less
  • Co is an element that suppresses Fe corrosion.
  • the lower limit of the Co content is 0.01% or more, preferably 0.020% or more, and more preferably 0.025% or more.
  • the Co content exceeds 0.04%, carbonization is promoted because it reacts with carbon and oxygen of rosin to form a large amount of carbides.
  • the upper limit of the Co content is 0.04% or less, preferably 0.035% or less.
  • Ni is an element capable of suppressing the corrosion to Fe. Moreover, Ni can improve the fatigue resistance of the solder alloy in addition to the above effects. In order to sufficiently exert these effects, the lower limit of the Ni content is 0.025% or more, preferably 0.035%. In addition, when the Ni content exceeds 0.1%, a compound with Sn is formed, the melting point of the solder alloy rises, and the solder temperature is kept within the temperature range of the soldering operation temperature (240 ° C to 450 ° C). It can not be set, causing thermal damage to the electronic component to be soldered.
  • the upper limit of the Ni content is 0.1% or less, preferably 0.7% or less, and more preferably 0.5% or less.
  • Fe 0.007 to 0.015%
  • Fe is an effective element to suppress the elution of Fe into the solder alloy and to prevent the corrosion of the Fe alloy that covers the tip of the solder crucible. These effects can not fully be exhibited as Fe content is less than 0.007%.
  • the lower limit of the Fe content is 0.007% or more, preferably 0.009% or more, and more preferably 0.010% or more.
  • the upper limit of the Fe content is 0.015% or less, preferably 0.013% or less, and more preferably 0.011% or less.
  • Sn The remainder of the solder alloy according to the invention is Sn.
  • unavoidable impurities may be contained. Even when including inevitable impurities, the above-mentioned effects are not affected. In addition, as described later, even if an element not contained in the present invention is contained as an unavoidable impurity, the above-mentioned effect is not affected.
  • the solder alloy according to the present invention preferably has a melting temperature of 350 ° C. or less. This is because the tip temperature is usually heated to 350 to 450 ° C. during soldering with a soldering iron.
  • solder alloy according to the present invention is suitably used for core solder which has flux in advance. Moreover, it can also be used in the form of wire solder from the viewpoint of supplying solder to the crucible. Furthermore, it is also possible to apply to flux core solder in which flux is sealed in flux solder. Furthermore, flux may be coated on the surface of each solder. In addition to this, the flux may be coated on the surface of the solder having no flux in the solder.
  • the flux content in the solder is, for example, 1 to 10% by mass, and the rosin content in the flux is 70 to 95%.
  • rosin is an organic compound and contains carbon and oxygen, the present invention is not limited to terminal functional groups and the like.
  • solder joint in the present invention means a connection portion of an electrode, and the connection portion is formed of the solder alloy according to the present invention. Moreover, Cu, Ni, and Al are mentioned as a material of an electrode, The electrode by which Ni / Au plating was given to Cu electrode may be sufficient.
  • Solder alloys shown in Table 1 were produced. It was confirmed that all of these solder alloys have a melting temperature of 350 ° C. or less. The solder alloy was used to form a core solder and to evaluate Fe corrosion and carbonization. The evaluated results are shown in Table 1. ⁇ Fe eaten> Using an automatic soldering machine (JAPAN UNIX (registered trademark), UNIX (registered trademark) -413S), the tip temperature is 380 ° C., the solder feed speed is 10 mm / sec, and the solder feed amount is 1 shot. Soldering was performed in the air at 15 mm in the air, and while the air cleaning was performed on the tip once every 10 shots, Fe erosion of the tip was evaluated.
  • JAPAN UNIX registered trademark
  • UNIX registered trademark
  • the crucible used has a model number of P2D-R manufactured by JAPAN UNIX (registered trademark), and the surface of Cu, which is the core of the crucible, is plated with Fe with a thickness of 500 ⁇ m. Moreover, as for the core solder, the flux content in the solder was 3% by mass, and the rosin content in the flux was 90%.
  • Comparative Example 5 had x wettability because it did not contain Ag. In Comparative Example 6, carbonization was x because the Fe content was high.
  • the solder alloy according to the present invention is particularly suitable when soldering is performed several thousand times or more with a soldering iron.
  • soldering since the number of times of soldering reaches several thousand times immediately, it is possible to suppress the carbonization of rosin caused by the extension of the life of the soldering iron.
  • Comparative Example 9 was Fe-poor x because it did not contain Fe.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Nonmetallic Welding Materials (AREA)

Abstract

L'invention fournit un alliage de brasage pour prévention de l'érosion de Fe inhibant l'érosion d'une pointe de fer afin d'en allonger la durée de vie, et inhibant l'adhésion d'un carbure sur cette pointe de fer, une brasure à fil fourré de résine, un fil de brasage, un fil de brasage fourré de résine, une brasure à enrobage de flux, et un joint à brasure tendre. Plus précisément, l'alliage de brasage pour prévention de l'érosion de Fe de l'invention possède une composition d'alliage constituée, en % en masse, de Ａｇ：０,２～４,０％, Ｃｕ：０,１～１,０％, Ｃｏ：０,０１～０,０４％, Ｎｉ：０,０２５～０,１％ et Ｆｅ：０,００７～０,０１５％, le reste étant constitué de Sn, et est mis en œuvre en tant que moyen de prévention de l'érosion de Fe afin d'inhiber l'adhésion d'un carbure sur une pointe de fer.
PCT/JP2017/029531 2017-08-17 2017-08-17 Alliage de brasage pour prévention de l'érosion de fe, brasure à fil fourré de résine, fil de brasage, fil de brasage fourré de résine, brasure à enrobage de flux, et joint à brasure tendre WO2019035197A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN201780037357.9A CN109673149A (zh) 2017-08-17 2017-08-17 防Fe腐蚀用软钎料合金、包芯软钎料、焊丝、包芯焊丝、覆助焊剂软钎料和钎焊接头
CN202310068678.2A CN116174992A (zh) 2017-08-17 2017-08-17 防Fe腐蚀用软钎料合金、包芯软钎料、焊丝、包芯焊丝、覆助焊剂软钎料和钎焊接头
JP2018511177A JP6344541B1 (ja) 2017-08-17 2017-08-17 Ｆｅ食われ防止用はんだ合金、やに入りはんだ、線はんだ、やに入り線はんだ、フラックス被覆はんだ、およびはんだ継手
PCT/JP2017/029531 WO2019035197A1 (fr) 2017-08-17 2017-08-17 Alliage de brasage pour prévention de l'érosion de fe, brasure à fil fourré de résine, fil de brasage, fil de brasage fourré de résine, brasure à enrobage de flux, et joint à brasure tendre
PH12018501147A PH12018501147A1 (en) 2017-08-17 2018-05-31 Solder alloy for preventing fe leaching, flux-cored solder, wire solder, flux-cored wire solder, flux-coated solder and solder joint

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2017/029531 WO2019035197A1 (fr) 2017-08-17 2017-08-17 Alliage de brasage pour prévention de l'érosion de fe, brasure à fil fourré de résine, fil de brasage, fil de brasage fourré de résine, brasure à enrobage de flux, et joint à brasure tendre

Publications (1)

Publication Number Publication Date
WO2019035197A1 true WO2019035197A1 (fr) 2019-02-21

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PCT/JP2017/029531 WO2019035197A1 (fr) 2017-08-17 2017-08-17 Alliage de brasage pour prévention de l'érosion de fe, brasure à fil fourré de résine, fil de brasage, fil de brasage fourré de résine, brasure à enrobage de flux, et joint à brasure tendre

Country Status (4)

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JP (1) JP6344541B1 (fr)
CN (2) CN116174992A (fr)
PH (1) PH12018501147A1 (fr)
WO (1) WO2019035197A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6709303B1 (ja) * 2019-02-15 2020-06-10 株式会社小島半田製造所 接合材料

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005153007A (ja) * 2003-01-22 2005-06-16 Hakko Kk マニュアルソルダリング用またはフローソルダリング用鉛フリーはんだ及びそれを用いた電子部品
JP2008188672A (ja) * 2007-01-11 2008-08-21 Topy Ind Ltd マニュアルソルダリング用無鉛はんだ合金
JP6082952B1 (ja) * 2016-07-04 2017-02-22 株式会社弘輝 はんだ合金、ヤニ入りはんだ

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Publication number Priority date Publication date Assignee Title
JP2000223607A (ja) * 1999-02-01 2000-08-11 Senju Metal Ind Co Ltd リッド用はんだ合金
JP3768849B2 (ja) * 2001-08-27 2006-04-19 白光株式会社 半田ごて用の半田
TW200529963A (en) * 2004-02-04 2005-09-16 Senju Metal Industry Co Solder alloy for preventing Fe erosion and method for preventing Fe erosion
JP2007111715A (ja) * 2005-10-19 2007-05-10 Nihon Almit Co Ltd はんだ合金
CN101049657A (zh) * 2006-04-06 2007-10-10 亚通电子有限公司 无铅软钎焊料
CN100445018C (zh) * 2006-08-16 2008-12-24 东莞市普赛特电子科技有限公司 无铅软钎料
EP2583792B1 (fr) * 2010-06-15 2014-10-08 Nippon Steel & Sumitomo Metal Corporation Fil de scie
JP6047254B1 (ja) * 2016-03-22 2016-12-21 株式会社タムラ製作所 鉛フリーはんだ合金、電子回路基板および電子制御装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005153007A (ja) * 2003-01-22 2005-06-16 Hakko Kk マニュアルソルダリング用またはフローソルダリング用鉛フリーはんだ及びそれを用いた電子部品
JP2008188672A (ja) * 2007-01-11 2008-08-21 Topy Ind Ltd マニュアルソルダリング用無鉛はんだ合金
JP6082952B1 (ja) * 2016-07-04 2017-02-22 株式会社弘輝 はんだ合金、ヤニ入りはんだ

Also Published As

Publication number Publication date
JP6344541B1 (ja) 2018-06-20
JPWO2019035197A1 (ja) 2019-11-07
CN116174992A (zh) 2023-05-30
PH12018501147A1 (en) 2019-01-21
CN109673149A (zh) 2019-04-23

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