WO2019033897A1 - 成像组件及其制作方法以及模塑模具、摄像模组和智能终端 - Google Patents

成像组件及其制作方法以及模塑模具、摄像模组和智能终端 Download PDF

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Publication number
WO2019033897A1
WO2019033897A1 PCT/CN2018/096305 CN2018096305W WO2019033897A1 WO 2019033897 A1 WO2019033897 A1 WO 2019033897A1 CN 2018096305 W CN2018096305 W CN 2018096305W WO 2019033897 A1 WO2019033897 A1 WO 2019033897A1
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WIPO (PCT)
Prior art keywords
photosensitive
flexible film
indenter
inwardly inclined
molded package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/096305
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English (en)
French (fr)
Chinese (zh)
Inventor
田中武彦
姚立锋
赵波杰
梅哲文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Sunny Opotech Co Ltd
Original Assignee
Ningbo Sunny Opotech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201710693245.0A external-priority patent/CN109387915B/zh
Priority claimed from CN201721013133.8U external-priority patent/CN207216104U/zh
Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Priority to JP2020508336A priority Critical patent/JP7104776B2/ja
Priority to EP18846429.1A priority patent/EP3671302A4/en
Priority to KR1020207004559A priority patent/KR102393994B1/ko
Priority to CN201880044865.4A priority patent/CN111344616B/zh
Publication of WO2019033897A1 publication Critical patent/WO2019033897A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B11/00—Filters or other obturators specially adapted for photographic purposes
    • G03B11/04—Hoods or caps for eliminating unwanted light from lenses, viewfinders or focusing aids
    • G03B11/045—Lens hoods or shields

Definitions

  • the present application relates to the field of imaging components and smart terminal technologies.
  • the traditional COB (Chip on Board) process camera module is assembled by a circuit board, a photosensitive chip, a lens holder, a motor drive, and a lens, and various other electronic components are placed on the surface of the circuit board.
  • the proportion of the photosensitive area of the existing photosensitive chip is increased, and the edge of the photosensitive area is getting closer to the side wall of the light window. Since the sidewall of the light window is close to the photosensitive region, the external light is reflected by the sidewall of the light window to reach the intensity of the photosensitive region, so that the stray light becomes stronger and stronger, thereby affecting the imaging quality of the camera module.
  • the application provides an imaging assembly and a manufacturing method thereof, as well as a molding die, a camera module and a smart terminal.
  • an image forming assembly comprising: a photosensitive member having a photosensitive region; and a molded package portion formed around the photosensitive region and in contact with the photosensitive member, and the molding
  • the encapsulation portion has a sloped inner side surface and a top surface higher than the photosensitive region, wherein a height difference between a top surface of the molded package portion and a photosensitive region of the photosensitive member is less than or equal to 0.7 mm, within the slope
  • the sides have a different surface roughness than the top surface.
  • a method of fabricating an imaging assembly comprising: mounting a photosensitive element on a wiring board of an imaging assembly to be fabricated; attaching a flexible film to a lower portion of the molding mold, wherein the flexible film has a back side a matte surface of the molding die, the lower portion of the molding die comprising a ram and a module portion located around the ram, the rim of the ram having an inwardly inclined surface; the flexible film to be attached a molding die placed on the photosensitive member and having a height difference between a bottom surface of the module portion facing the photosensitive member and a top surface of the photosensitive member being less than or equal to 0.7 mm; Between the photosensitive member and between the bottom surface of the photosensitive member facing the photosensitive member and the inwardly inclined surface of the embossed edge, a molded package portion is molded around the photosensitive member The inclined inner side formed by the molded package portion adjacent to the inwardly inclined surface has a matte surface corresponding to a matte surface
  • a molding die for manufacturing an image forming assembly comprising: an indenter having an inwardly inclined surface at an edge thereof; and a module portion surrounding the indenter, wherein the module portion A working height difference between a bottom surface adjacent to the indenter and a bottom surface of the indenter is less than or equal to 0.7 mm.
  • a camera module including the above-described imaging assembly.
  • an intelligent terminal including the above camera module.
  • an image forming assembly comprising: a photosensitive member having a photosensitive region; a molded package portion formed around the photosensitive region and in contact with the photosensitive member, and the molded package a portion having a sloped inner side and a top surface higher than the photosensitive region; and a buffer structure between the photosensitive member and the inclined inner side, wherein a top surface of the molded package portion and the buffer structure The height difference between the tops is less than or equal to 0.7 mm, and the inclined inner side and top surface of the molded package have different surface roughness.
  • a method of fabricating an image forming assembly comprising: mounting a photosensitive member to a wiring board of an image forming assembly to be fabricated; attaching a buffer structure to the photosensitive member; attaching the flexible film to the molding die a lower portion, wherein the flexible film has a matte surface facing away from the molding die, a lower portion of the molding die including a ram and a module portion located around the ram, the edge of the ram having an orientation An inner inclined surface; a molding die to which the flexible film is attached is placed over the buffer structure, and the module portion faces a height difference between a bottom surface of the photosensitive member and a top portion of the buffer structure Less than or equal to 0.7 mm; and an inwardly inclined surface molding around the edge of the indenter between the photosensitive member and between the bottom surface of the photosensitive member facing the photosensitive member and the top surface of the photosensitive member Forming the package portion such that the inclined inner side formed by the molded package portion adjacent to the inwardly
  • Figure 1 illustrates a method of making an imaging assembly in accordance with one embodiment of the present application
  • FIG. 2a shows a schematic diagram of step S110 of Figure 1;
  • FIG. 2b shows a schematic diagram of step S120 of Figure 1;
  • Figure 2c shows a schematic diagram of step S130 of Figure 1;
  • Figure 2d shows a schematic diagram of step S140 of Figure 1;
  • Figure 3a shows the physical meaning of equation (1)
  • Figure 3b shows a variant of Figure 3a
  • FIG. 4 shows a cross-sectional view of an imaging assembly in accordance with an embodiment of the present application
  • Figure 5a shows the meaning of each parameter in equation (2)
  • Figure 5b shows a variant of Figure 5a
  • Figure 6 shows a cross-sectional view of a molding die for making an imaging assembly in accordance with one embodiment of the present application
  • Figure 7a shows the meaning represented by each parameter in equation (3)
  • Figure 7b shows a variant of Figure 7a
  • Figure 8 illustrates a method of making an imaging assembly in accordance with another embodiment of the present application.
  • Figure 9 illustrates a cross-sectional view of an imaging assembly in accordance with another embodiment of the present application.
  • Figure 10 shows the case where the buffer structure of Figure 9 is a filter element
  • Figure 11 shows the case where the buffer structure of Figure 9 is a step rubber and a filter element.
  • first, second, etc. are used to distinguish one feature from another, and do not represent any limitation of the feature.
  • first subject discussed below may also be referred to as a second subject, without departing from the teachings of the present application.
  • FIG. 1 illustrates a method of making an imaging assembly in accordance with an embodiment of the present application. As shown in FIG. 1, the method 100 includes steps S110 through S140.
  • step S110 the photosensitive member is mounted to the wiring board of the image forming assembly to be fabricated.
  • Figure 2a shows a schematic diagram of this step S110.
  • the photosensitive member 220 is mounted on the wiring board 210.
  • circuit board 210 is part of the imaging assembly to be fabricated that contains the circuitry required in the imaging assembly.
  • Photosensitive element 220 is a sensor in the imaging assembly to be fabricated that is capable of sensing optical image information and converting it into an available output signal.
  • step S120 the flexible film is attached to the lower portion of the molding die.
  • Figure 2b shows a schematic diagram of this step S120.
  • the flexible film 300 is attached to the lower portion of the molding die 400 for fabricating the image forming assembly.
  • the flexible film 300 facing away from the surface 310 of the molding die 400 i.e., the generally downward facing surface
  • the lower portion of the molding die 400 includes a ram 410 and a module portion 420, the module portion 420 is located around the ram 410, and the ram 410 has an inwardly inclined surface 411 at its edge.
  • the film 300 has flexibility, when it is attached to the lower portion of the molding die 400, a portion of the flexible film 300 attached to the ram 410 (shown in a broken line portion in Fig. 2b) will be stretched to cause deformation. Since the surface 310 of the flexible film 300 facing away from the molding die 400 is a non-smooth surface, the portion of the flexible film 300 attached to the indenter 410 will be reduced in its Ra (the arithmetic mean deviation of the surface roughness profile) due to being stretched. That is, the surface roughness is reduced.
  • Ra the arithmetic mean deviation of the surface roughness profile
  • step S130 a molding die to which a flexible film is attached is placed on the photosensitive member, and a height difference between the bottom surface of the module portion facing the photosensitive member and the top surface of the photosensitive member is less than or equal to 0.7mm.
  • Figure 2c shows a schematic diagram of this step S130. As shown in FIG. 2c, in step S130, the molding die 400 to which the flexible film 300 is attached is placed over the photosensitive member 220, and the difference in height between the bottom surface 421 of the module portion 420 and the top surface 221 of the photosensitive member 220 is shown. ⁇ H is less than or equal to 0.7 mm.
  • the magnitude of ⁇ H can be adjusted by adjusting the height difference between the bottom surface 412 of the ram 410 and the bottom surface 421 of the module portion 420 (at the design stage of the molding die 400 or the operational phase of fabricating the imaging assembly). Since the height difference between the bottom surface 412 and the bottom surface 421 is adjusted at the time of design or operation so that ⁇ H is less than or equal to 0.7 mm, the degree of stretching of the flexible film 300 can be made small, so that the flexible film 300 can be made. The surface roughness of surface 310 is only slightly reduced.
  • step S140 between the photosensitive member and between the bottom surface of the module facing the photosensitive member and the top surface of the photosensitive member, an in-line inclined surface is molded around the edge of the indenter to mold the molded portion to The inclined inner side surface formed by the molded package portion adjacent to the inwardly inclined surface has a matte surface corresponding to the matte surface of the flexible film attached to the inwardly inclined surface.
  • Figure 2d shows a schematic diagram of this step S140. As shown in FIG.
  • the molding is performed around the photosensitive member 220, between the bottom surface 421 of the photosensitive member 220 facing the module portion 420 and the top surface 221 of the photosensitive member 220 (for example, The molding can be formed by using a material such as a thermosetting resin to form the molded package portion 230 around the inwardly inclined surface 411.
  • the inclined inner side surface 231 has a matte surface corresponding to the matte surface 310 of the flexible film 300 attached to the inwardly inclined surface 411.
  • step S140 a conventional process such as demolding may be performed to obtain an image forming assembly.
  • the flexible film can be made in the manufacturing process
  • the degree of stretching is small, that is, the surface roughness of the lower surface of the flexible film is only slightly lowered, so that the inclined inner side of the molded package portion in the formed image forming assembly also has a considerable surface roughness to suppress Light is reflected by the inclined inner side surface to the photosensitive region of the photosensitive element, effectively controlling the influence of stray light on the photosensitive element.
  • the sloped inner side 231 of the molded package portion 230 has a reflectance to visible light of less than or equal to 5%.
  • the inclined inner side of the molded package portion will have a considerable surface roughness, and therefore, the reflectance thereof will be lowered to a lower level, thereby reducing its reflection of light.
  • the value of Ra (surface roughness profile arithmetic mean deviation) of the inclined inner side surface 231 of the molded package portion 230 is greater than or equal to 1 ⁇ m.
  • the Ra value of the flexible film 300 attached to the matte surface of the module portion 420 is greater than the Ra value of the matte surface attached to the inwardly inclined surface 411.
  • the portion of the flexible film 300 attached to the ram 410 will be deformed, and the portion attached to the module portion 420 will not or hardly be deformed. Therefore, the Ra value of the flexible film 300 attached to the matte surface of the module portion 420 will be greater than the Ra value of the matte surface attached to the inwardly inclined surface 411.
  • the above step S130 includes: directly pressing the indenter to which the flexible film is attached to the photosensitive region of the photosensitive member. Since the molded package portion of the image forming assembly is formed around the photosensitive region of the photosensitive member, and during the molding process, the molding material is not desired to flow onto the photosensitive region, the indenter to which the flexible film is attached can be directly opposed Relying on the photosensitive area of the photosensitive element. Since the flexible film has a certain flexibility due to its flexibility, the pressure head is placed against the photosensitive region to provide a good barrier to prevent the molding material from entering the photosensitive region.
  • the inclination angle of the inwardly inclined surface 411 with respect to the photosensitive region of the photosensitive member is 20 to 70 degrees.
  • the degree of stretching of the flexible film in the process of making the image forming assembly is expressed by a stretch factor K.
  • K is expressed by the following formula:
  • d represents the height difference between the bottom surface of the module facing the photosensitive element and the top surface of the photosensitive element
  • ⁇ represents the inclination angle of the inwardly inclined surface with respect to the top surface of the photosensitive element
  • b 1 represents the inward inclination of the indenter
  • the distance between the surfaces, b 2 represents the length of the inwardly inclined surface that is orthographically projected on the top surface of the photosensitive element.
  • Fig. 3a shows the physical meaning of the above formula (1).
  • A1 represents the length of the portion of the flexible film attached to the indenter before stretching
  • the stretch coefficient K of the flexible film is less than or equal to 1.4.
  • K represents the degree of stretching of the flexible film in the process of fabricating the image forming assembly
  • controlling the K value within a certain range will prevent the flexible film from being excessively stretched and causing the surface roughness of the non-smooth surface. Too much drop, thereby ensuring that the inclined inner side of the molded package portion in the formed image forming assembly can also have a considerable surface roughness to suppress light from being reflected by the inclined inner side surface to the photosensitive region of the photosensitive member, effectively controlling The effect of stray light on the photosensitive element.
  • FIG. 3b shows a variant of Figure 3a above.
  • K can be expressed by the following formula:
  • d 1 and d 2 represent the difference in height between the bottom surface of the module portion facing the photosensitive member and the top surface of the photosensitive member, and ⁇ 1 and ⁇ 2 indicate the inwardly inclined surface with respect to the top surface of the photosensitive member.
  • the angle of inclination, b 1 represents the distance between the inwardly inclined surfaces of the indenter, and b 2 and b 3 represent the length of the inwardly inclined surface being orthographically projected on the top surface of the photosensitive element.
  • the flexible film has an anti-adhesive surface facing the molding die.
  • the flexible film is made of one or more selected from the group consisting of ETFE, PTFE, PFA, FEP, and PS. These materials can form an anti-adhesive surface and have the characteristics of good stain resistance, high toughness, easy separation, high temperature resistance, etc., which is beneficial to the operation of the flexible film.
  • the imaging assembly 200 as shown in FIG. 4 can be prepared.
  • the imaging assembly 200 can include a circuit board 210, a photosensitive element 220, and a molded package portion 230.
  • the photosensitive member 220 may have a photosensitive region 222 formed around the photosensitive region 222 and in contact with the photosensitive member 220, and the molded package portion 230 has a sloped inner side surface 231 and a top surface 232 higher than the photosensitive region 222.
  • the height difference ⁇ H between the top surface 232 of the molded package portion 230 and the photosensitive region 222 of the photosensitive member 220 is less than or equal to 0.7 mm, and the inclined inner side surface 231 has a different surface roughness from the top surface 232.
  • the top surface of the molded package portion and the photosensitive member are caused The difference in height between the photosensitive regions is less than or equal to 0.7 mm (the effect of the thickness of the flexible film on the size of other components can be ignored in the present application). Since the degree to which the flexible film is stretched during the molding process is small, that is, the surface roughness of the lower surface of the flexible film is only slightly lowered, the molded package portion of the formed image forming assembly is inclined The sides also have considerable surface roughness.
  • the inclined inner side and the top surface of the molded package have different surface roughness (and thus different reflectance), since the inclined inner side still maintains a considerable surface roughness, light reflection through the inclined inner side can be suppressed. To the photosensitive area of the photosensitive element to effectively control the influence of stray light on the photosensitive element.
  • the sloped inner side 231 of the molded package portion 230 has a reflectance to visible light of less than or equal to 5%.
  • the value of Ra of the inclined inner side surface 231 of the molded package portion 230 is greater than or equal to 1 ⁇ m.
  • the Ra value of the top surface 232 of the molded package portion 230 is greater than the Ra value of the inclined inner side surface 231.
  • the angle of inclination of the inclined inner side surface 231 with respect to the photosensitive region 222 is 20-70 degrees.
  • the size of the molded package portion 230 satisfies the following inequality:
  • Fig. 5a shows the meaning of each parameter in the above formula (2).
  • the equivalent or similar parameters in the formulas (2) and (1) are denoted by the same reference numerals.
  • d represents the difference in height between the top surface of the molded package portion and the photosensitive region of the photosensitive member
  • ⁇ represents the inclination angle of the inclined inner side surface with respect to the photosensitive area
  • b 1 represents the relative inclination within the photosensitive area.
  • the distance between the sides, b 2 represents the length of the oblique inner side that is orthographically projected on the plane of the photosensitive region.
  • Figure 5b shows a variant of Figure 5a above. According to the embodiment shown in Fig. 5b, the size of the molded package portion 230 satisfies the following inequality:
  • d 1 and d 2 represent the difference in height between the top surface of the molded package portion and the photosensitive region of the photosensitive member, and ⁇ 1 and ⁇ 2 represent the inclination angles of the inclined inner side surface with respect to the photosensitive region, and b 1 represents The distance between the opposite inclined inner sides on the photosensitive region, b 2 and b 3 represent the length of the oblique inner side surface being projected on the plane of the photosensitive region.
  • Figure 6 shows a cross-sectional view of a molding die for making an imaging assembly in accordance with one embodiment of the present application.
  • the molding die can be used in the method 100 as shown in FIG.
  • the molding die 400 may include a ram 410 and a module portion 420.
  • the ram 410 has an inwardly inclined surface 411 at its edge, and the module portion 420 surrounds the ram 410.
  • the module portion 420 is adjacent to the bottom surface 421 of the ram 410 and the working height difference between the bottom surface 412 of the ram 410 is less than or equal to 0.7 mm.
  • the image forming assembly is fabricated using the molding die as described above, since the difference in the working height between the bottom surface 421 of the module portion 420 adjacent to the bottom surface 421 of the ram 410 and the bottom surface 412 of the ram 410 is less than or equal to 0.7 mm,
  • the flexible film is attached to the molding die, it is stretched to a lesser extent, that is, the surface roughness of the lower surface of the flexible film is only slightly lowered, and thus the tilt of the molded package portion in the formed image forming assembly
  • the inner side also has a considerable surface roughness to suppress light from being reflected by the inclined inner side to the photosensitive region of the photosensitive member, effectively controlling the influence of stray light on the photosensitive member.
  • the angle of inclination of the inwardly inclined surface 411 relative to the bottom surface 412 of the indenter 410 is 20-70 degrees.
  • the size of the molding die 400 satisfies the following inequality:
  • Fig. 7a shows the meaning represented by each parameter in the above formula (3).
  • the equivalent or similar parameters in the formulas (3) and (1) are denoted by the same reference numerals.
  • d represents the work between the bottom 7a and the bottom surface of the head portion of the module adjacent to the head height difference
  • ⁇ represents the inwardly inclined surface with respect to the inclination angle of the bottom surface of the ram
  • b 1 represents indenter
  • b 2 represents the length of the inwardly inclined surface that is orthographically projected on the plane of the bottom surface of the indenter.
  • Figure 7b shows a variant of Figure 7a above. According to the embodiment shown in Fig. 7b, the size of the molding die 400 satisfies the following inequality:
  • d 1 and d 2 indicate the working height difference between the bottom of the module portion adjacent to the bottom surface of the indenter and the bottom surface of the indenter
  • ⁇ 1 and ⁇ 2 indicate the inclination of the inwardly inclined surface with respect to the bottom surface of the indenter.
  • Angle, b 1 represents the distance between the inwardly inclined surfaces of the indenter
  • b 2 and b 3 represent the length of the inwardly inclined surface being orthographically projected on the plane of the bottom surface of the indenter.
  • a camera module is provided that can include an imaging assembly as described above.
  • an intelligent terminal which may include the above-described camera module.
  • FIG. 8 illustrates a method of making an imaging assembly in accordance with another embodiment of the present application. As shown in FIG. 8, the method 800 includes steps S810 through S850.
  • step S810 the photosensitive member is mounted on the wiring board of the image forming assembly to be fabricated. This step is the same as or similar to the above step S110, and will not be described again here.
  • the buffer structure is attached to the photosensitive element.
  • the buffer structure can be used to protect components such as photosensitive elements and/or connecting wires from impact.
  • step S830 the flexible film is attached to the lower portion of the molding die.
  • the flexible film has a matte surface facing away from the molding die
  • the lower portion of the molding die includes a ram and a module portion located around the ram
  • the edge of the ram has an inwardly inclined surface.
  • step S840 the molding die to which the flexible film is attached is placed over the buffer structure, and the height difference between the bottom surface of the module portion facing the photosensitive member and the top of the buffer structure is less than or equal to 0.7 mm.
  • This step is similar to the above-described step S130, except that since the buffer structure is introduced in step S820, in this step S840, the molding die to which the flexible film is attached is placed on the buffer structure instead of being placed. Above the photosensitive element, and the height difference between the bottom surface of the module portion facing the photosensitive element and the top of the buffer structure is less than or equal to 0.7 mm.
  • step S850 between the photosensitive member and between the bottom surface of the module facing the photosensitive member and the top surface of the photosensitive member, an in-line inclined surface is molded around the edge of the indenter to mold the package portion so that the molded package portion is molded.
  • the inclined inner side surface formed adjacent to the inwardly inclined surface has a matte surface corresponding to the matte surface of the flexible film attached to the inwardly inclined surface.
  • a conventional process such as demolding may be performed to obtain an image forming assembly.
  • the buffer structure is a step glue and/or a filter element.
  • the sloped inner side of the molded package has a reflectance to visible light of less than or equal to 5%.
  • Ra of the inclined inner side surface of the molded package portion is greater than or equal to 1 ⁇ m.
  • the Ra of the matte surface of the flexible film attached to the module portion is larger than the Ra of the matte surface of the flexible film attached to the inwardly inclined surface.
  • placing the molding die to which the flexible film is attached on the buffer structure includes directly pressing the indenter to which the flexible film is attached to the buffer structure.
  • the angle of inclination of the inwardly inclined surface with respect to the photosensitive region is 20-70 degrees.
  • the stretched coefficient K of the produced flexible film is less than or equal to 1.4, wherein
  • d represents the height difference between the bottom surface of the module facing the photosensitive element and the top of the buffer structure
  • ⁇ represents the inclination angle of the inwardly inclined surface with respect to the photosensitive area
  • b 1 represents the inwardly inclined surface of the indenter
  • the distance, b 2 represents the length of the inwardly inclined surface that is orthographically projected on the plane of the photosensitive region.
  • the above formula (4) differs from the formula (1) only in that, in the formula (4), d represents the height difference between the bottom surface of the module portion facing the photosensitive member and the top of the buffer structure, and in the formula (1) , d represents the difference in height between the bottom surface of the module facing the photosensitive element and the top surface of the photosensitive element.
  • the stretched coefficient K of the produced flexible film is less than or equal to 1.4, wherein
  • d 1 and d 2 represent the height difference between the bottom surface of the module portion facing the photosensitive member and the top of the buffer structure
  • ⁇ 1 and ⁇ 2 represent the inclination angle of the inwardly inclined surface with respect to the photosensitive region
  • b 1 represents the indenter
  • the distance between the inwardly inclined surfaces, b 2 and b 3 represents the length of the inwardly inclined surface that is orthographically projected on the plane of the photosensitive region.
  • the flexible film has an anti-adhesive surface facing the molding die.
  • the flexible film is made of one or more selected from the group consisting of ETFE, PTFE, PFA, FEP, and PS.
  • Figure 9 illustrates a cross-sectional view of an imaging assembly in accordance with another embodiment of the present application.
  • an imaging assembly 200' as shown in Fig. 9 can be prepared.
  • the imaging assembly 200' can include a wiring board 210, a photosensitive element 220, a molded package portion 230, and a buffer structure 240.
  • the photosensitive member 220 may have a photosensitive region 222 formed around the photosensitive region 222 and in contact with the photosensitive member 220, and the molded package portion 230 has a sloped inner side surface 231 and a top surface 232 higher than the photosensitive region 222.
  • the buffer structure 240 is located between the photosensitive element 220 and the inclined inner side surface 231.
  • the height difference ⁇ H' between the top surface 232 of the molded package portion 230 and the top portion 241 of the buffer structure 240 is less than or equal to 0.7 mm, and the inclined inner side surface 231 and the top surface 232 of the molded package portion 230 have different surface roughnesses.
  • the buffer structure is a step glue and/or a filter element.
  • the buffer structure shown in FIG. 9 above is a step rubber.
  • Fig. 10 shows the case where the buffer structure of Fig. 9 is a filter element.
  • Figure 11 shows the case where the buffer structure of Figure 9 is a step rubber and a filter element.
  • the sloped inner side of the molded package has a reflectance to visible light of less than or equal to 5%.
  • the Ra value of the inclined inner side surface of the molded package portion is greater than or equal to 1 ⁇ m.
  • the Ra value of the top surface of the molded package portion is larger than the Ra value of the inclined inner side surface.
  • the angle of inclination of the inclined inner side with respect to the photosensitive area is 20-70 degrees.
  • the size of the molded package portion satisfies the following inequality:
  • d represents the height difference between the top surface of the molded package portion and the top of the buffer structure
  • ⁇ represents the inclination angle of the inclined inner side surface with respect to the photosensitive area
  • b 1 represents the distance between the opposite inclined inner side surfaces of the buffer structure.
  • b 2 denotes the length of the oblique inner side surface being projected on the plane of the photosensitive area.
  • the above formula (5) differs from the formula (2) only in that, in the formula (5), d represents a height difference between the top surface of the molded package portion and the top of the buffer structure, and b 1 represents a relative relationship on the buffer structure.
  • the size of the molded package portion satisfies the following inequality:
  • d 1 and d 2 represent the difference in height between the top surface of the molded package portion and the top of the buffer structure
  • ⁇ 1 and ⁇ 2 represent the inclination angle of the inclined inner side surface with respect to the photosensitive area
  • b 1 represents the relative relationship on the buffer structure.
  • the distance between the inclined inner sides, b 2 and b 3 represents the length of the oblique inner side that is orthographically projected on the plane of the photosensitive area.

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
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PCT/CN2018/096305 2017-08-14 2018-07-19 成像组件及其制作方法以及模塑模具、摄像模组和智能终端 Ceased WO2019033897A1 (zh)

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