KR102393994B1 - 이미징 어셈블리 및 그 제작방법과 몰딩 몰드, 카메라 모듈과 인텔리전트 단말 - Google Patents

이미징 어셈블리 및 그 제작방법과 몰딩 몰드, 카메라 모듈과 인텔리전트 단말 Download PDF

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KR102393994B1
KR102393994B1 KR1020207004559A KR20207004559A KR102393994B1 KR 102393994 B1 KR102393994 B1 KR 102393994B1 KR 1020207004559 A KR1020207004559 A KR 1020207004559A KR 20207004559 A KR20207004559 A KR 20207004559A KR 102393994 B1 KR102393994 B1 KR 102393994B1
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KR
South Korea
Prior art keywords
photosensitive element
photosensitive
delete delete
flexible film
molding
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KR1020207004559A
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Korean (ko)
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KR20200041320A (ko
Inventor
타케히코 타나카
리펑 야오
보어지에 자오
즈어원 메이
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닝보 써니 오포테크 코., 엘티디.
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Priority claimed from CN201721013133.8U external-priority patent/CN207216104U/zh
Priority claimed from CN201710693245.0A external-priority patent/CN109387915B/zh
Application filed by 닝보 써니 오포테크 코., 엘티디. filed Critical 닝보 써니 오포테크 코., 엘티디.
Publication of KR20200041320A publication Critical patent/KR20200041320A/ko
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    • H01L23/31—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H04N5/2251—
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B11/00—Filters or other obturators specially adapted for photographic purposes
    • G03B11/04—Hoods or caps for eliminating unwanted light from lenses, viewfinders or focusing aids
    • G03B11/045—Lens hoods or shields

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Light Receiving Elements (AREA)
  • Studio Devices (AREA)
KR1020207004559A 2017-08-14 2018-07-19 이미징 어셈블리 및 그 제작방법과 몰딩 몰드, 카메라 모듈과 인텔리전트 단말 Active KR102393994B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
CN201710693245.0 2017-08-14
CN201721013133.8U CN207216104U (zh) 2017-08-14 2017-08-14 成像组件以及模塑模具、摄像模组和智能终端
CN201721013133.8 2017-08-14
CN201710693245.0A CN109387915B (zh) 2017-08-14 2017-08-14 成像组件及其制作方法以及模塑模具、摄像模组和智能终端
PCT/CN2018/096305 WO2019033897A1 (zh) 2017-08-14 2018-07-19 成像组件及其制作方法以及模塑模具、摄像模组和智能终端

Publications (2)

Publication Number Publication Date
KR20200041320A KR20200041320A (ko) 2020-04-21
KR102393994B1 true KR102393994B1 (ko) 2022-05-03

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EP (1) EP3671302A4 (https=)
JP (1) JP7104776B2 (https=)
KR (1) KR102393994B1 (https=)
TW (1) TWI716712B (https=)
WO (1) WO2019033897A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006041277A (ja) 2004-07-28 2006-02-09 Fuji Photo Film Co Ltd 固体撮像装置及び固体撮像装置の製造方法
CN205961279U (zh) * 2016-08-01 2017-02-15 宁波舜宇光电信息有限公司 摄像模组及其模塑感光组件和成型模具
CN206977545U (zh) * 2017-06-30 2018-02-06 南昌欧菲光电技术有限公司 摄像模组及其感光组件

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002110722A (ja) * 2000-10-03 2002-04-12 Nitto Denko Corp 半導体チップの樹脂封止方法及び半導体チップ樹脂封止用離型フィルム
JP2004296584A (ja) * 2003-03-26 2004-10-21 Sony Corp 固体撮像装置及びその製造方法
EP1471730A1 (en) * 2003-03-31 2004-10-27 Dialog Semiconductor GmbH Miniature camera module
JP4365743B2 (ja) * 2004-07-27 2009-11-18 富士通マイクロエレクトロニクス株式会社 撮像装置
CN102291525B (zh) * 2010-06-18 2013-06-12 华晶科技股份有限公司 支架及具有该支架的摄像装置
WO2015133631A1 (ja) * 2014-03-07 2015-09-11 旭硝子株式会社 半導体素子実装用パッケージの製造方法、および離型フィルム
TWI829181B (zh) * 2014-04-25 2024-01-11 日商力森諾科股份有限公司 感光性元件、積層體、永久抗蝕罩幕及其製造方法以及半導體封裝的製造方法
CN105280664B (zh) * 2015-10-29 2024-09-06 格科微电子（上海）有限公司 摄像头模组
CN105681640B (zh) * 2016-03-28 2019-12-27 宁波舜宇光电信息有限公司 摄像模组及其制造方法
CN207216104U (zh) * 2017-08-14 2018-04-10 宁波舜宇光电信息有限公司 成像组件以及模塑模具、摄像模组和智能终端

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006041277A (ja) 2004-07-28 2006-02-09 Fuji Photo Film Co Ltd 固体撮像装置及び固体撮像装置の製造方法
CN205961279U (zh) * 2016-08-01 2017-02-15 宁波舜宇光电信息有限公司 摄像模组及其模塑感光组件和成型模具
CN206977545U (zh) * 2017-06-30 2018-02-06 南昌欧菲光电技术有限公司 摄像模组及其感光组件

Also Published As

Publication number Publication date
EP3671302A1 (en) 2020-06-24
WO2019033897A1 (zh) 2019-02-21
JP7104776B2 (ja) 2022-07-21
KR20200041320A (ko) 2020-04-21
TWI716712B (zh) 2021-01-21
JP2020530664A (ja) 2020-10-22
EP3671302A4 (en) 2020-09-02
TW201910900A (zh) 2019-03-16

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