WO2019029018A1 - 一种用于机车电子硬件设备的铜基合金材料及其制备方法 - Google Patents

一种用于机车电子硬件设备的铜基合金材料及其制备方法 Download PDF

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WO2019029018A1
WO2019029018A1 PCT/CN2017/108038 CN2017108038W WO2019029018A1 WO 2019029018 A1 WO2019029018 A1 WO 2019029018A1 CN 2017108038 W CN2017108038 W CN 2017108038W WO 2019029018 A1 WO2019029018 A1 WO 2019029018A1
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copper
alloy material
based alloy
electronic hardware
locomotive
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PCT/CN2017/108038
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French (fr)
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孙飞
赵勇
埃塞尔赛
佐罗叶斯夫丹尼斯
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苏州列治埃盟新材料技术转移有限公司
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Publication of WO2019029018A1 publication Critical patent/WO2019029018A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent

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  • the invention relates to the field of copper-based alloy material processing, in particular to a copper-based alloy material for locomotive electronic hardware equipment and a preparation method thereof.
  • TAg0.1 silver-copper alloy is an alloy material that can increase the softening temperature (recrystallization temperature) and creep of a material by adding a small amount of silver to the copper without reducing the conductivity, heat conduction and shaping of the material. strength.
  • the material has good wear resistance, electrical conductivity and corrosion resistance, as well as good electrical conductivity, thermal conductivity, corrosion resistance and processing properties.
  • the effect of age hardening of the material is not significant, and it is easy to cause "hydrogen disease", and it is not suitable for processing (annealing, welding, etc.) and use in a reducing atmosphere at a high temperature (for example, >370 ° C).
  • a high temperature for example, >370 ° C
  • the present invention provides a copper-based alloy material which has a high effect of high temperature age hardening treatment and has great practical significance in the industry.
  • the present invention adopts the following technical solutions:
  • a copper-based alloy material for locomotive electronic hardware comprising zinc, tin, manganese, and copper.
  • the mass percentage of each component in the copper-based alloy material is: zinc 0.3-0.7%, tin 0.3-0.7%, manganese 0.02-0.15%, and the balance copper.
  • impurities may be mixed, which requires that the mass percentage of the impurity Fe is less than 0.01%, and the mass percentage of Pb is less than 0.01%.
  • the copper is electrolytic copper.
  • the copper-based alloy material has a tensile strength greater than 360 MPa, an elongation greater than 8%, a hardness greater than 130 HB, a strength after 200-300 ° C age hardening greater than 150 Hb, an ambient temperature of up to 450 ° C, and an elastic modulus of 126 GPa, conductivity is 100% IACS.
  • the mass percentage of iron is not more than 0.01%, and the mass percentage of lead is not more than 0.01%.
  • the invention selects tin, zinc and manganese elements with lower material prices to replace silver, thereby reducing the manufacturing cost of the material, and improving the strength and hardness of the material while ensuring the electrical conductivity of the alloy material. Improve the age hardening treatment effect of the material and satisfy the material used in the environment of 400 °C. The service life of the lifting material in the electronic conductive parts of the locomotive.
  • the invention also provides a preparation method of the copper-based alloy material for the locomotive electronic hardware device, the method comprising the following steps:
  • step 2 the smelting time of step 2) is 1.5-2 hours.
  • step 3 stirring speed was 280 r/min, and the stirring time was 10 minutes.
  • the vibration frequency of the step 5 was set to 15-20 times/second, the stirring speed was 200 r/min, and the drawing speed was 25 mm/min.
  • the preparation method of the copper-based alloy material of the invention is simple in process and easy to implement, and the prepared alloy has a uniform distribution of components, and can effectively prevent element segregation.
  • the weighed electrolytic copper was added to a 500 kg intermediate frequency electric furnace, smelted, and gradually heated to 1300 °C.
  • the weighed manganese was added to the copper melt for smelting, and the smelting time was 1.5 hours.
  • the weighed tin and zinc were added to the smelted alloy liquid, cooled to 1100 ° C, and the stirring device was turned on for mechanical stirring at a stirring speed of 280 r/min and a stirring time of 10 minutes. After the completion of the stirring, the temperature was lowered to 1050 °C.
  • the smelted copper alloy water was subjected to composition testing using a Spike direct reading spectrometer to determine its chemical composition within the requirements of the national standard.
  • the vibration device and the stirring device were turned on, and the vibration frequency was set to 15 times/second, and the stirring speed was 200 r/min.
  • the casting drawing apparatus was opened, the drawing speed was 25 mm/min, and the blank profile was cast according to the predetermined product shape, and the casting temperature was set at 1150 °C.
  • the finished blank profile is surface-treated, further processed according to the size of the corresponding product, and packaged into the warehouse after completion.
  • the weighed electrolytic copper was added to a 500 kg intermediate frequency electric furnace, smelted, and gradually heated to 1300 °C.
  • the weighed manganese was added to the copper melt for melting, and the melting time was 1.8 hours.
  • the weighed tin and zinc were added to the smelted alloy liquid, the temperature was lowered to 1110 ° C, and the stirring device was turned on for mechanical stirring, the stirring speed was 280 r / min, and the stirring time was 10 minutes. After the completion of the stirring, the temperature was lowered to 1050 °C.
  • the smelted copper alloy water was subjected to composition testing using a Spike direct reading spectrometer to determine its chemical composition within the requirements of the national standard.
  • the vibration device and the stirring device were turned on, and the vibration frequency was set to 18 times/second, and the stirring speed was 200 r/min.
  • the casting drawing apparatus was opened, the drawing speed was 25 mm/min, and the blank profile was cast according to the predetermined product shape, and the casting temperature was set at 1150 °C.
  • the finished blank profile is surface-treated, further processed according to the size of the corresponding product, and packaged into the warehouse after completion.
  • the weighed electrolytic copper was added to a 500 kg intermediate frequency electric furnace, smelted, and gradually heated to 1300 °C.
  • the weighed manganese was added to the copper melt for smelting, and the smelting time was 2 hours.
  • the weighed tin and zinc were added to the smelted alloy liquid, cooled to 1120 ° C, and the stirring device was turned on for mechanical stirring at a stirring speed of 280 r/min and a stirring time of 10 minutes. After the completion of the stirring, the temperature was lowered to 1050 °C.
  • the smelted copper alloy water was subjected to composition testing using a Spike direct reading spectrometer to determine its chemical composition within the requirements of the national standard.
  • the vibration device and the stirring device were turned on, and the vibration frequency was set to 20 times/second, and the stirring speed was 200 r/min.
  • the casting drawing apparatus was opened, the drawing speed was 25 mm/min, and the blank profile was cast according to the predetermined product shape, and the casting temperature was set at 1150 °C.
  • the finished blank profile is surface-treated, further processed according to the size of the corresponding product, and packaged into the warehouse after completion.
  • the copper-based alloy material obtained by the distribution ratio and the method disclosed in the present invention has lower cost, higher tensile strength, higher elongation, higher hardness, and an effect of age hardening treatment at 200-300 ° C.
  • the use environment is wider, more wear-resistant, and the conductivity is not reduced.

Abstract

一种用于机车电子硬件设备的铜基合金材料及其制备方法，各组分的质量百分比为：锌0.3-0.7％、锡0.3-0.7％、锰0.02-0.15％以及余量的铜。制备方法为熔炼后铸造拉拔。保证合金材料导电性能的同时，提高材料的强度、硬度，提高材料的时效硬化处理效果。满足材料在400℃环境下使用。提升材料在机车电子导电部件中的使用年限。

Description

一种用于机车电子硬件设备的铜基合金材料及其制备方法 技术领域
本发明涉及铜基合金材料加工领域，具体涉及一种用于机车电子硬件设备的铜基合金材料及其制备方法。
背景技术
TAg0.1银铜合金是一种合金材料，它通过在铜中加入少量的银，在不降低材料的导电、导热和塑形的同时，能够提高材料的软化温度(再结晶温度)和蠕变强度。该材料具有很好的耐磨性、导电性和耐腐蚀性，以及良好的导电、导热、耐蚀和加工性能等特点。但是该材料时效硬化的效果不显著，且易引起“氢病”，不宜在高温(如＞370℃)还原性气氛中加工(退火、焊接等)和使用。而且，银的价格高，在工业中应用会明显提高材料的成本。
发明内容
针对上述问题，本发明提供一种铜基合金材料，该材料高温时效硬化处理效果好，在行业内具有非常重大的现实意义。
为了实现本发明的目的，本发明采用以下技术方案：
一种用于机车电子硬件设备的铜基合金材料，该铜基合金材料包含锌、锡、锰以及铜。
进一步地，该铜基合金材料中各组分的质量百分比为：锌0.3-0.7％、锡0.3-0.7％、锰0.02-0.15％以及余量的铜。在实际生产中可能混有杂质，其要求杂质Fe的质量百分比小于0.01％，Pb的质量百分比小于0.01％。
进一步地，其中铜为电解铜。
进一步地，该铜基合金材料的抗拉强度大于360MPa，伸长率大于8％，硬度大于130HB，200-300℃时效硬化后强度仍大于150Hb，使用环境温度可达450℃，弹性模量为126GPa，导电率为100％IACS。
进一步地，铜基合金材料中，铁的质量百分含量不大于0.01％，铅的质量百分含量不大于0.01％。
本发明选取材料价格较低的锡、锌和锰元素用于取代银，从而降低材料的制作成本，在保证合金材料导电性能的同时，提高材料的强度、硬度。提高材料的时效硬化处理效果，满足材料在400℃环境下使用。提升材料在机车电子导电部件中的使用年限。
本发明同时还提供了这种用于机车电子硬件设备的铜基合金材料的制备方法，该方法包括以下步骤：
1)将铜添加到电炉中，逐渐升温至1300℃并进行熔炼；
2)将锰按照比例添加到铜熔液中进行熔炼；
3)将锡和锌按照比例添加到熔炼完成的合金熔液当中，降温至1100℃-1120℃之间，同时开启搅拌装置进行机械搅拌，搅拌完成后降温至1050℃；
4)对熔炼完成的铜合金水进行成分检测；
5)开启振动装置及搅拌装置，同时进行铸造拉拔，按照预定的产品形状铸造毛坯型材；以及
6)将铸造完成的毛坯型材进行表面处理，根据相应产品规格尺寸进一步加工处理，完成后包装入库。
进一步地，步骤2)的熔炼时间为1.5-2小时。
进一步地，步骤3)搅拌速度为280r/min，搅拌时间为10分钟。
进一步地，步骤5)的振动频率设定为15-20次/秒，搅拌速度为200r/min，拉拔速度为25mm/min。
本发明的铜基合金材料的制备方法工艺简单、易于实施，所制备的合金成分分布均匀，可有效防止元素偏析。
具体实施方式
应当理解，在示例性实施例中所示的本发明的实施例仅是说明性的。虽然在本发明中仅对少数实施例进行了详细描述，但本领域技术人员很容易领会在未实质脱离本发明主题的教导情况下，多种修改是可行的。相应地，所有这样的修改都应当被包括在本发明的范围内。在不脱离本发明的主旨的情况下，可以对以下示例性实施例的设计、操作条件和参数等做出其他的替换、修改、变化和删减。
实施例一
按照质量百分比为锌0.3％、锡0.3％、锰0.02％以及余量的电解铜称取这些原料。这些原料中不可避免地含有一些杂质，本发明要求杂质Fe相对于总原料的质量百分比小于0.01％，杂质Pb相对于总原料的质量百分比也小于0.01％。
将称取的电解铜添加到500kg的中频电炉当中，进行熔炼，逐渐升温至1300℃。将称取的锰添加到铜熔液中进行熔炼，熔炼时间为1.5小时。将所称取的锡和锌添加至熔炼完成的合金液当中，降温至1100℃，并开启搅拌装置进行机械搅拌，搅拌速度为280r/min，搅拌时间为10分钟。搅拌完成后降温至1050℃。采用斯派克直读光谱仪对熔炼完成的铜合金水进行成分检测，以确定其化学成分在国标要求范围之内。开启振动装置及搅拌装置，振动频率设定为15次/秒，搅拌速度为200r/min。开启铸造拉拔设备，拉拔速度为25mm/min，按照预定的产品形状铸造毛坯型材，铸造温度设定在1150℃。将铸造完成的毛坯型材进行表面处理，根据相应产品规格尺寸进一步加工处理，完成后包装入库。
按照本发明的方法所制备得到的铜基复合材料(标记为LZCu-Sn0.3-Zn0.3-Mn0.02)与现有技术的TAg0.1材料的性能对比如下表：
表1
Figure PCTCN2017108038-appb-000001
Figure PCTCN2017108038-appb-000002
实施例二
按照质量百分比为锌0.5％、锡0.5％、锰0.1％以及余量的电解铜称取这些原料。
将称取的电解铜添加到500kg的中频电炉当中，进行熔炼，逐渐升温至1300℃。将称取的锰添加到铜熔液中进行熔炼，熔炼时间为1.8小时。 将所称取的锡和锌添加至熔炼完成的合金液当中，降温至1110℃，并开启搅拌装置进行机械搅拌，搅拌速度为280r/min，搅拌时间为10分钟。搅拌完成后降温至1050℃。采用斯派克直读光谱仪对熔炼完成的铜合金水进行成分检测，以确定其化学成分在国标要求范围之内。开启振动装置及搅拌装置，振动频率设定为18次/秒，搅拌速度为200r/min。开启铸造拉拔设备，拉拔速度为25mm/min，按照预定的产品形状铸造毛坯型材，铸造温度设定在1150℃。将铸造完成的毛坯型材进行表面处理，根据相应产品规格尺寸进一步加工处理，完成后包装入库。
按照本发明的方法所制备得到的铜基复合材料(标记为LZCu-Sn0.5-Zn0.5-Mn0.1)与现有技术的TAg0.1材料的性能对比如下表：
表2
Figure PCTCN2017108038-appb-000003
Figure PCTCN2017108038-appb-000004
实施例三
按照质量百分比为锌0.7％、锡0.7％、锰0.15％以及余量的电解铜称取这些原料。
将称取的电解铜添加到500kg的中频电炉当中，进行熔炼，逐渐升温至1300℃。将称取的锰添加到铜熔液中进行熔炼，熔炼时间为2小时。将所称取的锡和锌添加至熔炼完成的合金液当中，降温至1120℃，并开启搅拌装置进行机械搅拌，搅拌速度为280r/min，搅拌时间为10分钟。搅拌完成后降温至1050℃。采用斯派克直读光谱仪对熔炼完成的铜合金水进行成分检测，以确定其化学成分在国标要求范围之内。开启振动装置及搅拌装置，振动频率设定为20次/秒，搅拌速度为200r/min。开启铸造拉拔设备，拉拔速度为25mm/min，按照预定的产品形状铸造毛坯型材，铸造温度设定在1150℃。将铸造完成的毛坯型材进行表面处理，根据相应产品规格尺寸进一步加工处理，完成后包装入库。
按照本发明的方法所制备得到的铜基复合材料(标记为LZCu-Sn0.7-Zn0.7-Mn0.15)与现有技术的TAg0.1材料的性能对比如下表：
表3
Figure PCTCN2017108038-appb-000005
Figure PCTCN2017108038-appb-000006
由上表可知，按照本发明公开的成分配比及方法所制得的铜基合金材料其成本降低，抗拉强度提高，伸长率提高，硬度提高，200-300℃的时效硬化处理效果提高，使用环境更广，更耐磨，并且导电性也未降低。
以上所述实施例仅表达了本发明的实施方式，其描述较为具体和详 细，但并不能因此而理解为对本发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。

Claims (6)

  1. 一种用于机车电子硬件设备的铜基合金材料，其特征在于，所述铜基合金材料包含锌、锡、锰以及铜。
  2. 根据权利要求1所述的用于机车电子硬件设备的铜基合金材料，其特征在于，所述铜基合金材料中各组分的质量百分比为：锌0.3-0.7％、锡0.3-0.7％、锰0.02-0.15％以及余量的铜。
  3. 根据权利要求2所述的用于机车电子硬件设备的铜基合金材料，其特征在于，所述铜为电解铜。
  4. 根据权利要求1-3任一项所述的用于机车电子硬件设备的铜基合金材料，其特征在于，所述铜基合金材料的抗拉强度大于360MPa，伸长率大于8％，硬度大于130HB，使用环境温度高达450℃，弹性模量为126GPa，导电率为100％IACS。
  5. 根据权利要求1-3任一项所述的用于机车电子硬件设备的铜基合金材料，其特征在于，所述铜基合金材料中，铁的质量百分含量不大于0.01％，铅的质量百分含量不大于0.01％。
  6. 一种如权利要求1-5任一项所述的用于机车电子硬件设备的铜基合金材料的制备方法，其特征在于，包括以下步骤：
    1)将铜添加到电炉中，逐渐升温至1300℃并进行熔炼；
    2)将锰按照比例添加到铜熔液中进行熔炼；
    3)将锡和锌按照比例添加到熔炼完成的合金熔液当中，降温至1100℃-1120℃之间，同时开启搅拌装置进行机械搅拌，搅拌完成后降温至1050℃；
    4)对熔炼完成的铜合金水进行成分检测；
    5)开启振动装置及搅拌装置，同时进行铸造拉拔，按照预定的产品形状铸造毛坯型材；以及
    6)将铸造完成的毛坯型材进行表面处理，根据相应产品规格尺寸进
PCT/CN2017/108038 2017-08-07 2017-10-27 一种用于机车电子硬件设备的铜基合金材料及其制备方法 WO2019029018A1 (zh)

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CN108588473A (zh) * 2018-05-30 2018-09-28 苏州列治埃盟新材料技术转移有限公司 一种电机设备用的铜合金材料及其制备方法
CN111876630A (zh) * 2020-07-31 2020-11-03 苏州列治埃盟新材料技术转移有限公司 一种电机设备用的铜合金材料及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62240731A (ja) * 1986-04-14 1987-10-21 Hitachi Cable Ltd 半導体機器用リ−ド材
CN1724700A (zh) * 2004-07-20 2006-01-25 日立电线株式会社 铜合金材料、铜合金导体及其制造方法、电缆和电车用供电线
CN103555991A (zh) * 2013-11-20 2014-02-05 苏州天兼金属新材料有限公司 一种无铅环保铜基合金管及其制造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1930314A (zh) * 2004-03-12 2007-03-14 住友金属工业株式会社 铜合金及其制造方法
JP5306591B2 (ja) * 2005-12-07 2013-10-02 古河電気工業株式会社 配線用電線導体、配線用電線、及びそれらの製造方法
WO2013038816A1 (ja) * 2011-09-16 2013-03-21 株式会社村田製作所 導電性材料、それを用いた接続方法、および接続構造
JP6140032B2 (ja) * 2013-08-30 2017-05-31 Ｄｏｗａメタルテック株式会社 銅合金板材およびその製造方法並びに通電部品
CN103509966B (zh) * 2013-10-18 2015-09-09 苏州天兼新材料科技有限公司 一种适用于航空航天领域的合金材料及其制造方法
JP5822895B2 (ja) * 2013-11-08 2015-11-25 Jx日鉱日石金属株式会社 銅合金板および、それを備える放熱用電子部品
JP5851000B1 (ja) * 2014-08-22 2016-02-03 株式会社神戸製鋼所 Ｌｅｄのリードフレーム用銅合金板条

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62240731A (ja) * 1986-04-14 1987-10-21 Hitachi Cable Ltd 半導体機器用リ−ド材
CN1724700A (zh) * 2004-07-20 2006-01-25 日立电线株式会社 铜合金材料、铜合金导体及其制造方法、电缆和电车用供电线
CN103555991A (zh) * 2013-11-20 2014-02-05 苏州天兼金属新材料有限公司 一种无铅环保铜基合金管及其制造方法

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