WO2019017428A1 - 金属樹脂複合成形品およびその製造方法 - Google Patents

金属樹脂複合成形品およびその製造方法 Download PDF

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Publication number
WO2019017428A1
WO2019017428A1 PCT/JP2018/027081 JP2018027081W WO2019017428A1 WO 2019017428 A1 WO2019017428 A1 WO 2019017428A1 JP 2018027081 W JP2018027081 W JP 2018027081W WO 2019017428 A1 WO2019017428 A1 WO 2019017428A1
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WIPO (PCT)
Prior art keywords
metal plate
metal
resin
molded article
groove
Prior art date
Application number
PCT/JP2018/027081
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English (en)
French (fr)
Inventor
秀水 近藤
Original Assignee
ポリプラスチックス株式会社
ヤマセ電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ポリプラスチックス株式会社, ヤマセ電気株式会社 filed Critical ポリプラスチックス株式会社
Priority to US16/632,257 priority Critical patent/US11697232B2/en
Priority to CN201880060255.3A priority patent/CN111093932B/zh
Priority to EP18835735.4A priority patent/EP3656528A4/en
Publication of WO2019017428A1 publication Critical patent/WO2019017428A1/ja

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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/02—2 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/44—Number of layers variable across the laminate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2274/00—Thermoplastic elastomer material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/202—LCD, i.e. liquid crystal displays

Definitions

  • the present invention relates to a method for producing a metal plate to be bonded to a resin, and a metal-resin composite molded article comprising the metal plate produced by the method and a resin.
  • a metal-resin composite molded article in which a metal plate composed of a metal, an alloy or the like and a resin molded article composed of a thermoplastic resin composition are combined has been conventionally used for console boxes and the like around instrument panels It is used for parts that come in contact with the outside world, such as automobile interior parts and engine peripheral parts, interior parts, housings of electronic devices such as digital cameras and mobile phones, interface connections, and power supply terminals.
  • a method of compounding a metal plate and a resin molded product As a method of compounding a metal plate and a resin molded product, a method of forming minute irregularities on the bonding surface on the metal plate side and bonding by an anchor effect, a method of bonding using an adhesive or double-sided tape, metal
  • the plate and / or the resin molded product may be provided with fixing members such as folded pieces and claws, and the fixing members may be used to fix the both, or may be joined using screws or the like.
  • the method of forming minute irregularities on a metal plate and the method of using an adhesive are effective in terms of the degree of freedom in designing a metal resin composite molded article.
  • the method of processing the surface of the metal plate to form minute irregularities is advantageous in that it does not use an expensive adhesive and the steps of applying and curing the adhesive are unnecessary.
  • the method of patent documents 1 is mentioned, for example.
  • Patent Document 1 Since the method described in Patent Document 1 forms a groove on the surface of a metal plate with a laser, the groove can be formed in a desired range on the surface, and the operation is simple and one of effective methods. .
  • metal when metal is used in a roll shape as in the case of a hoop-formed insert terminal, if the metal plate is too thick, it can not be wound in a roll shape, and even if it can be wound temporarily, it is thick metal If the plate is rolled up forcibly, the load applied to the metal plate at that time remains as internal strain, and the strength and deformation of the metal plate occur, resulting in the problem of lowering the bonding strength and airtightness as an insert molded article. In such applications, a metal thin plate with a thickness of about 500 ⁇ m or less is required for such applications, and the problem is to suppress the deformation of such thin metal plate during laser processing. It had become.
  • An object of the present invention is a technology for forming grooves on the surface of a metal plate with a laser to improve the adhesion between a metal plate and a resin, which can suppress deformation due to laser processing even if the metal plate becomes thinner It is in providing an article.
  • the metal-resin composite molded article of the present invention is one in which deformation due to laser processing is suppressed to a small degree while the metal plate is a thin film.
  • the metal-resin composite molded article of the present invention is a metal-resin composite molded article in which a resin composition is insert-molded on a metal plate, and the metal plate has a thickness H of 500 ⁇ m or less.
  • the groove is formed in the surface where the object is inserted, and the groove has a width Y of 30 to 300 ⁇ m, a depth X of 24% or less of the thickness H of the metal plate, the depth X with respect to the width Y
  • the ratio of X / Y is 0.1 to 2.5.
  • Metal plate As a metal plate used for this invention, aluminum, magnesium, stainless steel, copper, titanium etc. can be illustrated. Also, the metal plate may be made of a metal alloy. In addition, surface treatment such as anodizing treatment or coating may be performed on the surface of the metal material. Aluminum, magnesium, copper and titanium are preferred from the viewpoint of light weight and strength, and aluminum and copper are more preferred in applications where conductivity is required, such as terminals, and copper is particularly preferred. Further, in applications where thin-walled rigidity is required such as a portable terminal case, magnesium and titanium are preferable, and titanium is particularly preferable. The present invention is useful when the thickness H of the metal plate is 500 ⁇ m or less. The lower limit of the thickness H of the metal film is preferably 100 ⁇ m or more in terms of strength.
  • the groove formed on the surface of the metal plate has a width Y of 30 to 300 ⁇ m, a depth X of 24% or less of the thickness H of the metal plate, and a ratio X of the depth X to the width Y It is formed such that / Y is 0.1 to 2.5.
  • the thickness H of the metal plate exceeds 500 ⁇ m, the depth of the groove and the bonding strength are substantially correlated, and the desired bonding strength can be obtained by increasing the depth of the groove, but the thickness of the metal plate
  • H is 500 ⁇ m or less, the metal plate is easily deformed at the time of forming the groove because it is thin first, and the metal plate becomes thinner at the groove when the groove is deep, the metal plate
  • a sufficient groove depth can not be secured while maintaining the strength of the above, and technical means for obtaining the joint strength other than the depth are required. In the present invention it has been found that this can be achieved by the preparation of the shape of the groove.
  • the depth X and the width Y of the groove of the present invention adopt values measured using a laser microscope.
  • the depth is measured by the above method except for the portion where the laser light intersects.
  • the width Y is preferably 30 to 300 ⁇ m and 50 to 200 ⁇ m in view of the balance between deformation and bonding strength.
  • the depth X is 24% or less of the thickness H of the metal plate.
  • the content is preferably 5 to 23%. It is preferable that X be 20 to 100 ⁇ m.
  • the ratio X / Y of the depth X to the width Y needs to be 0.1 to 2.5 in order to balance the deformation and the joint strength. 0.2 to 2 is preferable, and 0.25 to 1 is more preferable.
  • the groove according to the invention is formed by a laser. Specifically, a groove is formed under the condition that the metal surface is subjected to a digging process, melting and resolidification by laser irradiation. Specifically, the case of applying a pulse wave laser beam will be described as an example.
  • FIG. 1 describes an example of the irradiation pattern of laser light on the metal surface. A groove is formed on the portion of the metal surface where the laser has been irradiated.
  • the white arrow in FIG. 1 represents the scanning direction of a laser.
  • FIG. 1A shows a laser irradiation method for forming the grooves in a line.
  • two grooves are arranged substantially in parallel.
  • the distance between the centers of pulses in the direction in which the grooves are arranged is the distance between adjacent grooves (in this specification, the distance between adjacent grooves may be referred to as “hatching width” W).
  • the hatching width is constant, and in the present invention, the hatching width is preferably adjusted to be in the range of 0.1 to 5.0 times the width Y of the groove. .
  • the hatching width is smaller than the above range, the width of the metal portion between the grooves will be narrowed, and the strength of this portion may be reduced, which may be disadvantageous in bonding strength and airtightness. If the width is larger than the above range, the distance between the groove and the groove becomes wide, and the number of grooves that can be provided in the same processing area decreases, so the bonding strength and the airtightness may be reduced.
  • the laser may not be irradiated substantially in parallel.
  • the hatching width is not constant, but at least a part of the hatching width is preferably in the range of 0.1 to 5.0 times the width Y of the groove.
  • the laser beam may not be irradiated linearly.
  • the number of grooves is not particularly limited. When the number of grooves is three or more, at least a part of the hatching width of any adjacent groove is preferably in the range of 0.1 to 5.0 times the width Y of the grooves. Further, as shown in FIG. 1 (d), a plurality of grooves may intersect with each other as long as the grooves are formed to line up as described above.
  • a more preferable irradiation method for improving the strength of the bonding portion in the present invention is formed so as to line up in a predetermined direction as shown in FIG. It is a method of irradiating a laser beam so that the groove to be made and the groove arranged in the direction different from the above-mentioned predetermined direction cross.
  • the most preferable irradiation method is an irradiation method in which the crossing angle is approximately 90 °.
  • a more preferable irradiation method is a method of irradiating a laser beam so that the groove blocks the direction Z where airtightness is desired to be secured as shown in FIG.
  • the most preferable irradiation method is a method of irradiating a laser beam so that the grooves are formed substantially perpendicularly to the direction in which air tightness is to be secured and they are not connected to each other.
  • the spot diameter of the laser light is preferably 300 ⁇ m or less, and more preferably 30 to 100 ⁇ m.
  • the laser irradiation method of the present invention double or triple laser light irradiation is performed at the position where the laser light is irradiated once (double adjustment of the number of scans), adjustment of the spot diameter of the laser light, laser light
  • a metal material which constitutes a metal plate, Therefore According to the kind etc. of a metal material, suitably suitable conditions are adopted.
  • a metal plate formed into a desired shape is used according to the application and the like. For example, by pouring molten metal or the like into a mold of a desired shape, a metal plate of a desired shape can be obtained. Further, in order to form the metal plate into a desired shape, cutting with a machine tool or the like may be used.
  • a thin metal plate such as that of the present invention may be supplied to hoop forming in a rolled state, but in such a case, it is being supplied to a forming machine from a roll wound with a metal plate.
  • the groove may be formed by irradiating the laser beam at the stage of (ii), or the metal plate on which the groove is formed in advance by irradiating the laser light may be wound in a roll.
  • a groove is formed on the surface of the metal plate obtained as described above using a laser. The position where the groove is formed and the size of the range of the groove are determined in consideration of the position where the resin is formed and the like.
  • the resin composition used in the present invention is not particularly limited, and a thermoplastic composition containing a conventionally known thermoplastic resin can be used.
  • thermoplastic resin examples include polyethylene (PE), polypropylene (PP), polystyrene (PS), acrylonitrile / styrene resin (AS), acrylonitrile / butadiene / styrene resin (ABS), methacrylic resin (PMMA), vinyl chloride (vinyl chloride) PVC), as a thermoplastic resin (general-purpose engineering resin), for example, polyamide (PA), polyacetal (POM), ultra high molecular weight polyethylene (UHPE), polybutylene terephthalate (PBT), GF reinforced polyethylene terephthalate (GF-PET) ), Polymethylpentene (TPX), polycarbonate (PC), modified polyphenylene ether (PPE), and as a thermoplastic resin (super engineering resin), for example, polyphenylene sulfide (PP) ), Polyetheretherketone (PEEK), liquid crystalline resin (LCP), polytetrafluoroethylene (PTFE), polyetherimide (PEI
  • thermosetting resins include phenol resins, urea resins, melamine resins, unsaturated polyesters, alkyd resins, epoxy resins and diallyl phthalates.
  • elastomers include thermoplastic elastomers and the like. Examples thereof include rubbers such as styrene butadiene type, polyolefin type, urethane type, polyester type, polyamide type, 1,2-polybutadiene, polyvinyl chloride type and ionomers.
  • rubbers such as styrene butadiene type, polyolefin type, urethane type, polyester type, polyamide type, 1,2-polybutadiene, polyvinyl chloride type and ionomers.
  • glass fiber to the thermoplastic resin, a polymer alloy, etc. can be mentioned.
  • an inorganic filler represented by glass fiber, an organic filler, a flame retardant, an ultraviolet absorber, a heat stabilizer, a light stabilizer, and the like for imparting desired physical properties within a range that does not significantly impair the effects of the present invention.
  • Additives such as colorants, mold release agents and plasticizers can be added.
  • thermoplastic resin compositions in order to obtain better adhesion, the melt viscosity at a shear rate of 1000 / sec measured at a temperature of melting point of thermoplastic resin + 20 ° C or more and melting point of thermoplastic resin + 30 ° C or less, 500 Pa It is preferable to use a thermoplastic resin composition of s or less.
  • polyacetal (POM), polybutylene terephthalate (PBT), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyetheretherketone (PEEK), liquid crystalline resin (LCP), etc. are preferable thermoplastic resins
  • polybutylene terephthalate (PBT), polyethylene terephthalate (PET), polyphenylene sulfide (PPS) and liquid crystalline resin (LCP) are preferably used.
  • the metal-resin composite molded article of the present invention comprises the metal plate and a resin composition formed on at least a part of the surface of the metal plate.
  • the specific steps of the method for producing the metal-resin composite molded article are not particularly limited, as long as the molten thermoplastic resin composition is caused to enter into the concavities and convexities of the groove, so long as the resin and the metal plate are composited. .
  • a metal plate having a groove formed therein is disposed in an injection mold, and the molten thermoplastic resin composition is injected into the injection mold to form a metal resin composite of resin and metal sheet.
  • the method of manufacturing a molded article is mentioned.
  • the conditions for injection molding are not particularly limited, and preferred conditions can be appropriately set according to the physical properties and the like of the thermoplastic resin composition. Further, methods using transfer molding, compression molding, etc. are also effective methods for forming a metal-resin composite molded article in which a resin and a metal plate are combined.
  • a resin is manufactured in advance by a general molding method such as injection molding, and a metal plate with a groove formed is brought into contact with the resin at a desired bonding position, and heat is applied to the contact surface.
  • a general molding method such as injection molding
  • a metal plate with a groove formed is brought into contact with the resin at a desired bonding position, and heat is applied to the contact surface.
  • the metal resin of the present invention is excellent in the adhesion between the resin and the thin metal plate and also in the long-term durability that adhesion is stably maintained over a long period of time under high temperature environment or low temperature environment.
  • the composite molded article can be suitably used in applications requiring stable and stable adhesion over a long period of time in a high temperature environment.
  • the metal-resin composite molded article of the present invention includes a conductive heat generating portion, an insulating portion, and a conductive heat dissipating portion, and transfers heat from the conductive heat generating portion to the conductive heat dissipating portion via the insulating portion to dissipate heat Can be used in a heat dissipating structure that
  • the resin and the metal plate in the metal-resin composite molded article of the present invention correspond to the insulating portion and the conductive heat dissipating portion in the heat dissipating structure, and examples of the conductive heat generating portion include electronic components.
  • the metal-resin composite molded article of the present invention uses a thin metal plate, it can be efficiently manufactured by hoop forming to supply it as a roll, and therefore, it is an electronic part or the like which requires airtightness.
  • the terminal holding structure can be suitably used.
  • the metal / resin composite molded article according to the present invention is a heat dissipation structure in an electric / electronic device having a conductive heat generating portion housed in a housing provided with a resin boss, a holding member, etc.
  • portable video electronic devices such as mobile phones, cameras, video composite cameras, digital cameras, notebook computers, pocket computers, pocket computers, calculators, electronic organizers, PDC, PHS, mobile phones, etc. Examples include portable information or communication terminals, MD, cassette headphone stereos, portable acoustic electronic devices such as radios, liquid crystal TVs and monitors, home electric appliances such as telephones, facsimiles, hand scanners, and the like.
  • a connector, a sensor, a capacitor, a capacitor, a battery, an LED package, etc. can be mentioned.
  • FIG. (A) is a top view
  • (b) is a perspective view
  • (c) is a cross-sectional view.
  • the upper part of (b) is a metal plate and the lower part is an insert resin.
  • This insert molded body was manufactured by the following method. In addition, the unit of the dimension in a figure is mm.
  • a polyphenylene sulfide-based resin composition (containing 35% by mass of glass fiber as a filler, measured at 310 ° C., melt viscosity at a shear rate of 1000 / sec is 260 Pa ⁇ s, as a thermoplastic resin composition constituting the resin part A resin composition, Polyplastics Co., Ltd. product "Durafide (registered trademark) 1135ML1" was used.
  • melt viscosity The melt viscosity at a predetermined barrel temperature and a shear rate of 1000 / sec was measured using Capillograph manufactured by Toyo Seiki Co., Ltd., using 1 mm ⁇ ⁇ 20 mm L / flat die as a capillary. The above barrel temperature was set to 310 ° C.
  • a metal plate As a metal plate, a disc-like material having an outer diameter of 30 mm was used, which was made of copper (C1100P, thickness H described in the table) and in which grooves were formed as follows. These metal plates have bonding planned surfaces around the groove in FIG. 3A, specifically, in the region outside 20 mm ⁇ from the center of the disk, ie, in the region of 5 mm width on the outer peripheral side of the disk of 30 mm ⁇ .
  • the spot diameter is adjusted to 50 ⁇ m, and the number of times of scanning is 300 times.
  • the number of grooves is such that the projected areas of the concave and the convex portions forming the grooves are equal to each other in the area of the area (surface to be joined) where resin and metal contact
  • the width of the concave portion and the width of the convex portion were set at equal intervals (the hatching width was twice the width Y of the groove).
  • the number of grooves formed in a 5 mm width between the outer periphery (diameter 30 mm) of the area where resin and metal contact are 15 mm and the inner periphery (diameter 20 mm) is 10 mm is approximately 5 mm ⁇ It becomes width Y x 2).
  • the depth X and the width Y of the unevenness forming the grooves were measured using a laser microscope ("VK-9510" manufactured by Keyence Corporation).
  • the measurement results of the depth X, the width Y, and the ratio X / Y are shown in Tables 1 and 2.
  • Molding machine Sodic TR-40 VR (vertical injection molding machine) Cylinder temperature: 320 ° C Mold temperature: 150 ° C Injection speed: 100 mm / s Holding pressure: 49MPa x 5 seconds
  • FIG. 4 is a longitudinal sectional view showing a method of air tightness evaluation using the air tightness tester E.
  • the airtightness tester E includes an airtightness tester body 7 and an airtight tester lid 6.
  • the metal resin composite molded body test piece 2 was attached to the airtightness test machine main body 7 through the O-ring 5, and the lower portion of the metal resin composite molded body test piece 2 was sealed. Thereafter, the airtight tester lid 6 was placed on the resin member 4 of the metal resin composite molded body test piece 2 and clamped.
  • Distilled water 10 was poured onto the metal resin composite molded body test piece 2, and the metal resin composite molded body test piece 2 was completely immersed in the distilled water 10. Air was fed through the line 9, and a pressure of 0.1 MPa was applied to the inside of the airtightness tester body 7 for 6 minutes, and visually observed whether air bubbles leaked from the interface between the metal plate 3 and the resin member 4 .
  • the above test was carried out three times, and the evaluation results of air tightness according to the following criteria are shown in Tables 1 and 2.
  • the metal plate of each thickness used in the example and the comparative example is cut into a plate of 20 mm ⁇ 50 mm in a state before the laser irradiation, and the longitudinal direction is in the circumferential direction After being wound around a cylinder with a radius of curvature of 40 mm and held for 10 seconds, it was placed on a surface plate with the outer side facing down at the time of holding, and occurrence of warpage due to strain was visually confirmed.
  • FIG. 5 shows a hatched frame satisfying the respective numerical specifications of claim 1 and shows an example and a comparative example corresponding to a plate thickness of 400 ⁇ m.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Laser Beam Processing (AREA)

Abstract

本発明の目的は、レーザーで金属板の表面に溝を形成して、金属板と樹脂との密着性を向上させる技術において、金属板が薄くなってもレーザー加工による変形を抑制できる金属樹脂複合成形品を提供することにある。　本発明の目的は、金属板に樹脂組成物をインサート成形した金属樹脂複合成形品であって、該金属板は、厚さＨが５００μｍ以下であり、該金属板の該樹脂組成物がインサートされる表面には溝が形成されており、該溝は、幅Ｙが３０～３００μｍ、深さＸが該金属板の厚さＨの２４％以下、該幅Ｙに対する該深さＸの割合Ｘ／Ｙが０．１～２．５である金属樹脂複合成形品によって達成された。

Description

金属樹脂複合成形品およびその製造方法
　本発明は、樹脂と接合される金属板の製造方法、及び当該製造方法で製造された金属板と樹脂とを備える金属樹脂複合成形品に関する。
　金属や合金等から構成される金属板と、熱可塑性樹脂組成物から構成される樹脂成形品とが複合化されてなる金属樹脂複合成形品は、従来から、インストルメントパネル周りのコンソールボックス等の自動車の内装部材やエンジン周り部品、インテリア部品、デジタルカメラや携帯電話等の電子機器の筐体部、インターフェース接続部、電源端子部等の外界と接触する部品に用いられている。
　金属板と樹脂成形品とを複合化する方法としては、金属板側の接合面に微小な凹凸を形成しておきアンカー効果で接合する方法、接着剤や両面テープを用いて接着する方法、金属板及び／又は樹脂成形品に折り返し片や爪等の固定部材を設け、この固定部材を用いて両者を固着させる方法、ねじ等を用いて接合する方法等がある。これらの中でも、金属板に微小な凹凸を形成する方法や接着剤を用いる方法は、金属樹脂複合成形品を設計する形状自由度の点で有効である。
　特に、金属板の表面を加工し微小な凹凸を形成する方法は、高価な接着剤を使用しない点、接着剤の塗布及び硬化の工程が不要である点において有利である。金属板の表面を加工し微小な凹凸を形成する方法としては、例えば、特許文献１に記載の方法が挙げられる。
特開２０１４－１１７７２４号公報
　上記特許文献１に記載の方法は、レーザーで金属板の表面に溝を形成するため、上記表面における所望の範囲に溝を形成可能であり、作業も簡便で、有効な方法の一つである。
　ところで、金属板をレーザー加工する際には、金属板の加工点において局所的な発熱があり、金属板の熱膨張に起因する変形を生じることがある。熱膨張の小さい金属あるいは、熱拡散が容易に起こるような形態の金属板であればこのような変形はある程度抑えられるが、金属板であって板厚が５００μｍを下回るような薄肉のものでは、金属板自体の剛性による構造強度を確保することが難しいため、この変形が無視できない程度に大きなものとなっている。
　最近のスマートフォンの筐体のような薄型が求められる金属板では、この変形を抑制することが課題となっていた。
　また、フープ成形のインサート端子のように、金属をロール状に巻いて用いる場合には、金属板が厚すぎてはロール状に巻き取ることができず、仮に巻くことができても、厚い金属板を無理に巻き取ると、その際に金属板にかかった負荷が内部歪として残留し、金属板の強度低下や変形が生じ、インサート成形品としての接合強度や気密性を低下させるといった問題が発生するため、このような用途においては、巻取り性の面からやはり厚さ５００μｍ以下程度の金属薄板が必要となり、そのような薄肉の金属板のレーザー加工時の変形を抑制することが課題となっていた。
　本発明の目的は、レーザーで金属板の表面に溝を形成して、金属板と樹脂との密着性を向上させる技術において、金属板が薄くなってもレーザー加工による変形を抑制できる金属樹脂複合成形品を提供することにある。
　本発明は、下記によって達成された。
（１）　金属板に樹脂組成物をインサート成形した金属樹脂複合成形品であって、該金属板は、厚さＨが５００μｍ以下であり、該金属板の該樹脂組成物がインサートされる表面には溝が形成されており、該溝は、幅Ｙが３０～３００μｍ、深さＸが該金属板の厚さＨの２４％以下、該幅Ｙに対する該深さＸの割合Ｘ／Ｙが０．１～２．５である金属樹脂複合成形品。
（２）　厚さＨが５００μｍ以下である金属板に、樹脂組成物をインサート成形して金属樹脂複合成形品を製造する方法であって、該金属板の表面に該樹脂組成物をインサートする溝を形成する工程を有し、該溝を、幅Ｙが３０～３００μｍ、深さＸが該金属板の厚さＨの２４％以下、該幅Ｙに対する該深さＸの割合Ｘ／Ｙが０．１～２．５とする金属樹脂複合成形品の製造方法。
　本発明の金属樹脂複合成形品は、金属板が薄膜でありながらレーザー加工による変形が小さく抑制されているものである。
金属表面へのレーザーの照射パターンの例を示す図である。 気密性試験のための成形品における気密性確保の方向Ｚを示す図である。 実施例及び比較例で使用した金属樹脂複合成形品試験片（金属板の厚みｔのインサート成形体）を模式的に示す図であり、（ａ）は上面図であり、金属板の加工は裏面に施されている。（ｂ）は分解した斜視図であり、金属板の加工は下方に施されている。（ｃ）はＡ－Ａ’の断面図である。 実施例で使用した樹脂部と金属板との間の気密試験機Ｅを示す図である。 実施例と比較例のプロット図である。
　以下、本発明の実施形態について説明する。なお、本発明は以下の実施形態に限定されない。
＜金属樹脂複合成形品＞
　本発明の金属樹脂複合成形品は、金属板に樹脂組成物をインサート成形した金属樹脂複合成形品であって、該金属板は、厚さＨが５００μｍ以下であり、該金属板の該樹脂組成物がインサートされる表面には溝が形成されており、該溝は、幅Ｙが３０～３００μｍ、深さＸが該金属板の厚さＨの２４％以下、該幅Ｙに対する該深さＸの割合Ｘ／Ｙが０．１～２．５であることを特徴とする。
　≪金属板≫
　本発明に使用される金属板としては、アルミニウム、マグネシウム、ステンレス鋼、銅、チタン等を例示することができる。また、金属板は、金属合金から構成されてもよい。また、金属材料の表面には、陽極酸化処理等の表面処理や塗装がされていてもよい。軽量、強度の点からアルミニウム、マグネシウム、銅、チタンが好ましく、端子等の導電性が必要とされる用途においてはアルミニウム、銅がより好ましく、銅が特に好ましい。また、携帯端末筐体等の薄肉での剛性が要求される用途においてはマグネシウム、チタンが好ましく、チタンが特に好ましい。
　本発明では、金属板の厚みＨが５００μｍ以下である場合に有用である。金属膜の厚みＨの下限は、強度的に１００μｍ以上であることが好ましい。
　≪溝の形状≫
　本発明においては、金属板の表面に形成される溝は、幅Ｙが３０～３００μｍ、深さＸが該金属板の厚さＨの２４％以下、該幅Ｙに対する該深さＸの割合Ｘ／Ｙが０．１～２．５となるように形成される。
　金属板の厚みＨが５００μｍを超えるようなものであれば、溝の深さと接合強度はほぼ相関し、溝の深さを増すことで所望の接合強度を得ることができるが、金属板の厚みＨが５００μｍ以下である場合、まず薄いため、溝を形成する際に金属板が容易に変形してしまうこと、また溝の深さが深い場合、溝部において金属板がさらに薄くなるため、金属板の強度を保ったままで十分な溝の深さを確保できないことがあり、深さ以外に接合強度を得る技術的手段が必要であった。本発明ではそれを、溝の形状の調製によって達成できることを見出したものである。
　本発明の溝の深さＸ及び幅Ｙとは、レーザー顕微鏡を用いて測定された値を採用する。また、レーザー光が交差するように照射され交差する部分がある場合には、交差する部分以外について、上記の方法で深さを測定する。
　本発明においては、幅Ｙは３０～３００μｍであり、５０～２００μｍであることが、変形と接合強度のバランスの点で好ましい。
　深さＸは、金属板の厚みＨの２４％以下にしなければ変形を抑制することが難しい。より変形を抑制しながら接合強度を得るためには、５～２３％であることが好ましい。Ｘとしては、２０～１００μｍであることが好ましい。
　幅Ｙに対する深さＸの割合Ｘ／Ｙは、０．１～２．５にすることが、変形と接合強度のバランスの点で必要である。０．２～２であることが好ましく、０．２５～１であることがより好ましい。
　≪溝の形成方法≫
　本発明に係る溝は、レーザーによって形成される。具体的には、レーザーを照射して、金属表面を堀加工及び溶融させ再凝固させる条件にて溝を形成する。具体的にパルス波のレーザー光を照射する場合を例に説明する。図１には金属表面へのレーザー光の照射パターンの例を記載する。金属表面上でレーザーが照射された部分に溝が形成される。なお、図１中の白抜き矢印は、レーザーの走査方向を表す。
　また、図１（ａ）には、溝が並ぶように形成するためのレーザーの照射方法を示す。図１（ａ）に記載の照射方法の場合、二つの溝が略平行に並ぶ。溝が並ぶ方向におけるパルスの中心間距離が、隣り合う溝の間隔である（本明細書においては、隣り合う溝の間隔を「ハッチング幅」Ｗという場合がある）。図１（ａ）に示す場合においては、ハッチング幅が一定であり、本発明では、ハッチング幅が溝の幅Ｙの０．１～５．０倍の範囲になるように調整されることが好ましい。
　ハッチング幅が上記範囲より小さいと、溝と溝との間にある金属部の幅が狭くなり、この部分の強度が低下することで接合強度や気密性が不利になる場合があり、ハッチング幅が上記範囲より広いと、溝と溝の間隔が広くなり、同一処理面積内に設けることのできる溝の本数が少なくなるため、接合強度や気密性が低下する場合がある。
　なお、図１（ｂ）に示すように、略平行にレーザーを照射しなくてもよい。図１（ｂ）に示すような場合には、ハッチング幅が一定にならないが、ハッチング幅の少なくとも一部が溝の幅Ｙの０．１～５．０倍の範囲であることが好ましい。また、図１（ｃ）に示すように、レーザー光が直線状に照射されなくてもよい。
　また、溝の数も特に限定されない。溝の数が３以上の場合、いずれかの隣り合う溝のハッチング幅の少なくとも一部が、溝の幅Ｙの０．１～５．０倍の範囲であることが好ましい。また、上記のように溝が並ぶように形成されていれば、図１（ｄ）に示すように、複数の溝同士が交差してもよい。
　以上の通り、金属板表面にレーザー光を照射するが、本発明において接合部の強度を向上するためにより好ましい照射方法は、図１（ｅ）に示すように、所定の方向に並ぶように形成される溝と、上記所定の方向とは異なる方向に並ぶ溝とが交差するように、レーザー光を照射する方法である。最も好ましい照射方法は、上記交差の角度が略９０°になる照射方法である。
　本発明において接合部の気密性を向上するためにより好ましい照射方法は、図２に示すように、気密性を確保したい方向Ｚを溝が遮断するように、レーザー光を照射する方法である。最も好ましい照射方法は、上記溝が、気密性を確保したい方向に対してほぼ垂直に複数形成され、かつそれらが互いに連接されないように、レーザー光を照射する方法である。また、レーザー光のスポット径（図１に示すような、レーザー光の照射範囲が円の場合の、照射範囲を表す円の直径）は、３００μｍ以下が好ましく、３０～１００μｍがより好ましい。
　本発明におけるレーザーの照射方法は、一度レーザー光を照射した位置に、二重、三重と重ねてレーザー光を照射したり（走査回数の調整）、レーザー光のスポット径を調整したり、レーザー光の出力を調整したり、レーザー光の周波数を調整したり、レーザー光の走査速度を調整したりする方法が挙げられる。具体的な条件については、金属板を構成する金属材料の種類等によって異なるため、金属材料の種類等に応じて適宜好ましい条件を採用する。
　用途等に応じて所望の形状に成形した金属板を使用する。例えば、所望の形状の型に溶融した金属等を流し込むことで、所望の形状の金属板を得ることができる。また、金属板を所望の形状に成形するために、工作機械等による切削加工等を用いてもよい。
　特に、本発明のような薄肉の金属板は、ロール状に巻いた状態でフープ成形に供給する場合があるが、そのような場合は、金属板を巻いたロールから、成形機に供給する途中の段階でレーザー光を照射して溝を形成してもよいし、あらかじめレーザー光を照射して溝を形成しておいた金属板をロール状に巻き取ってもよい。
　上記のようにして得られた金属板の表面に、レーザーを用いて、溝を形成する。溝を形成する位置や、溝の範囲の大きさは、樹脂が形成される位置等を考慮して決定される。
　≪樹脂組成物≫
　本発明で使用される樹脂組成物は、特に限定されず、従来公知の熱可塑性樹脂を含む熱可塑性組成物を使用することができる。
　熱可塑性樹脂としては、例えば、ポリエチレン（ＰＥ）、ポリプロピレン（ＰＰ）、ポリスチレン（ＰＳ）、アクリロニトリル／スチレン樹脂（ＡＳ）、アクリロニトリル／ブタジエン／スチレン樹脂（ＡＢＳ）、メタクリル樹脂（ＰＭＭＡ）、塩化ビニル（ＰＶＣ）を、熱可塑性樹脂（汎用エンジニアリング樹脂）としては、例えば、ポリアミド（ＰＡ）、ポリアセタール（ＰＯＭ）、超高分子量ポリエチレン（ＵＨＰＥ）、ポリブチレンテレフタレート（ＰＢＴ）、ＧＦ強化ポリエチレンテレフタレート（ＧＦ－ＰＥＴ）、ポリメチルペンテン（ＴＰＸ）、ポリカーボネート（ＰＣ）、変性ポリフェニレンエーテル（ＰＰＥ）を、熱可塑性樹脂（スーパーエンジニアリング樹脂）としては、例えば、ポリフェニレンサルファイド（ＰＰＳ）、ポリエーテルエーテルケトン（ＰＥＥＫ）、液晶性樹脂（ＬＣＰ）、ポリテトラフロロエチレン（ＰＴＦＥ）、ポリエーテルイミド（ＰＥＩ）、ポリアリレート（ＰＡＲ）、ポリサルフォン（ＰＳＦ）、ポリエーテルサルフォン（ＰＥＳ）、ポリアミドイミド（ＰＡＩ）を、熱硬化性樹脂としては、例えば、フェノール樹脂、尿素樹脂、メラミン樹脂、不飽和ポリエステル、アルキッド樹脂、エポキシ樹脂、ジアリルフタレートを、エラストマーとしては、例えば、熱可塑性エラストマーやゴム、例えば、スチレン・ブタジエン系、ポリオレフィン系、ウレタン系、ポリエステル系、ポリアミド系、１，２－ポリブタジエン、ポリ塩化ビニル系、アイオノマーを挙げることができる。更には、熱可塑性樹脂にガラスファイバーを添加したものや、ポリマーアロイ等も挙げることができる。
　また、本発明の効果を大きく損なわない範囲において、所望の物性付与のために、ガラスファイバーに代表される無機充填剤、有機充填剤、難燃剤、紫外線吸収剤、熱安定剤、光安定剤、着色剤、離型剤、可塑剤等の添加剤を添加することができる。
　熱可塑性樹脂組成物の中でも、より良い密着性を得るために、熱可塑性樹脂の融点＋２０℃以上熱可塑性樹脂の融点＋３０℃以下の温度で測定した、せん断速度１０００／秒での溶融粘度が５００Ｐａ・ｓ以下の熱可塑性樹脂組成物を用いることが好ましい。
　上記の点で、ポリアセタール（ＰＯＭ）、ポリブチレンテレフタレート（ＰＢＴ）、ポリエチレンテレフタレート（ＰＥＴ）、ポリフェニレンサルファイド（ＰＰＳ）、ポリエーテルエーテルケトン（ＰＥＥＫ）、液晶性樹脂（ＬＣＰ）等は、好ましい熱可塑性樹脂であり、特に、ポリブチレンテレフタレート（ＰＢＴ）、ポリエチレンテレフタレート（ＰＥＴ）、ポリフェニレンサルファイド（ＰＰＳ）、液晶性樹脂（ＬＣＰ）が好ましく用いられる。
＜金属樹脂複合成形品の製造方法＞
　本発明の金属樹脂複合成形品は、上記金属板と、金属板の表面の少なくとも一部に形成される樹脂組成物とを備える。
　金属樹脂複合成形品の製造方法の具体的な工程は特に限定されず、溶融した熱可塑性樹脂組成物を溝の凹凸に入り込ませることで、樹脂と金属板とを複合化させるものであればよい。
　例えば、溝が形成された金属板を、射出成形用金型内に配置し、溶融状態の熱可塑性樹脂組成物を射出成形用金型内に射出して、樹脂と金属板との金属樹脂複合成形品を製造する方法が挙げられる。射出成形の条件は特に限定されず、熱可塑性樹脂組成物の物性等に応じて、適宜、好ましい条件を設定することができる。また、トランスファ成形、圧縮成形等を用いる方法も樹脂と金属板とが複合化した金属樹脂複合成形品を形成する有効な方法である。
　他の例としては、予め射出成形法等の一般的な成形方法で樹脂を製造し、溝が形成された金属板と上記樹脂とを、所望の接合位置で当接させ、当接面に熱を与えることで、樹脂の当接面付近を溶融させて、樹脂と金属板との金属樹脂複合成形品を製造する方法が挙げられる。
＜金属樹脂複合成形品の特性＞
　上記の通り、樹脂と薄肉金属板との密着性に優れるとともに、高温環境下や低温環境下でも密着性が長期間にわたり安定して持続するという長期耐久性にも優れるため、本願発明の金属樹脂複合成形品は、高温環境下で長期間にわたり安定して優れた密着性が要求される用途に好適に使用することができる。
　例えば、本発明の金属樹脂複合成形品は、導電性発熱部と絶縁部と導電性放熱部とを備え、導電性発熱部から絶縁部を介して導電性放熱部へと熱を伝達して放熱を行う放熱構造体において用いることができる。
　ここで、本発明の金属樹脂複合成形品における樹脂及び金属板は、それぞれ、放熱構造体における絶縁部及び導電性放熱部に対応し、導電性発熱部としては、例えば、電子部品等が挙げられる。特に本発明の金属樹脂複合成形品は、薄肉の金属板を用いているため、これをロール状として供給するフープ成形によって効率よく製造することができる点で、気密性が要求される電子部品やその端子保持構造体に好適に使用することができる。
　より具体的には、本発明の金属樹脂複合成形品は、内部に樹脂製のボスや保持部材等を備えた筐体に収められた導電性発熱部を有する電気・電子機器において、放熱構造体の一部として有用である。ここで、電気・電子機器としては、携帯電話、カメラ、ビデオ複合型カメラ、デジタルカメラ等の携帯用映像電子機器、ノート型パソコン、ポケットコンピュータ、電卓、電子手帳、ＰＤＣ、ＰＨＳ、携帯電話等の携帯用情報又は通信端末、ＭＤ、カセットヘッドホンステレオ、ラジオ等の携帯用音響電子機器、液晶ＴＶ・モニター、電話、ファクシミリ、ハンドスキャナー等の家庭用電化機器等を挙げることができる。また、気密性が要求される電子部品としては、コネクタ、センサ、コンデンサ、キャパシタ、電池、ＬＥＤパッケージ等を挙げることができる。
　以下、実施例及び比較例を示し、本発明を具体的に説明するが、本発明はこれらの実施例に限定されるものではない。
＜インサート成形体の製造方法＞
　実施例及び比較例で使用した金属樹脂複合成形品（インサート成形体）の模式図を図３に示した。（ａ）は上面図であり、（ｂ）は斜視図であり、（ｃ）は断面図である。（ｂ）の上部は金属板であり、下部がインサート樹脂である。
　このインサート成形体を以下の方法で製造した。なお、図中の寸法の単位はｍｍである。
　樹脂部を構成する熱可塑性樹脂組成物として、ポリフェニレンサルファイド系樹脂組成物（充填材としてガラスファイバーを３５質量％含み、３１０℃で測定した、せん断速度１０００／秒での溶融粘度が２６０Ｐａ・ｓの樹脂組成物、ポリプラスチックス（株）社製、「ジュラファイド（登録商標）１１３５ＭＬ１」）を用いた。
［溶融粘度］
　東洋精機（株）製キャピログラフを用い、キャピラリーとして１ｍｍφ×２０ｍｍＬ／フラットダイを使用し、所定のバレル温度、せん断速度１０００／秒での溶融粘度を測定した。上記のバレル温度は、３１０℃に設定した。
　金属板として、銅（Ｃ１１００Ｐ、厚さＨは表に記載）から構成され、下記の通りにして溝を形成した外径３０ｍｍφの円板状物を用いた。これら金属板は、図３（ａ）の溝部周辺、具体的には円板の中心部から２０ｍｍφより外側の領域、すなわち３０ｍｍφの円板の外周側５ｍｍ幅の領域に接合予定面を有する。
＜溝の形成＞
　レーザーマーカＭＤ－Ｖ９９００（キーエンス社製、レーザータイプ：ＹＶ０４レーザー、発信波長：１０６４ｎｍ、最大定格出力：１３Ｗ（平均））を用い、出力９０％、周波数４０ｋＨｚ、走査速度１０００ｍｍ／ｓにて、接合予定面の金属表面に、表１及び表２に示す深さと幅で、図３（ｂ）に示すような同心円状になるように溝を形成した。なお、レーザー光のスポット径と走査回数は、溝の深さと幅に応じ適宜調整した。例えば幅５０μｍ、深さ７０μｍの場合は、スポット径を５０μｍに調整し、走査回数を３００回とした。
　ここで溝の本数は、図３に示す試験片において樹脂と金属が接触する領域（接合予定面）の面積のうち、溝を形成する凹凸の凹部と凸部の投影面積がそれぞれ同等になるよう、凹部の幅と凸部の幅が等間隔（ハッチング幅が溝の幅Ｙの２倍）となるように設定した。すなわち、樹脂と金属が接触する領域の外周（直径３０ｍｍ）の半径１５ｍｍと、内周（直径２０ｍｍ）の半径１０ｍｍとの間の５ｍｍ幅の中に形成される溝の本数は、概ね５ｍｍ÷（幅Ｙ×２）となる。
　また、溝を形成する凹凸の深さＸ及び幅Ｙを、レーザー顕微鏡（株式会社キーエンス社製、「ＶＫ－９５１０」）を用いて測定した。深さＸ、幅Ｙ、及び比Ｘ／Ｙの測定結果を表１及び表２に示す。
　これらの金属板をそれぞれ金型に配置し、複合化工程を行った。成形条件は以下の通りである。金属樹脂複合成形品の形状は図３に示す通りである。
［成形条件］
成形機：ソディックＴＲ－４０ＶＲ（縦型射出成形機）
シリンダー温度：３２０℃
金型温度：１５０℃
射出速度：１００ｍｍ／ｓ
保圧力：４９ＭＰａ×５秒　
＜評価＞
　上記の方法で作成した金属樹脂複合成形品について、接合部分の接合強度及び剥離後の破壊形態を評価した。具体的な評価方法は以下の通りである。
　[変形]
　レーザー照射後の金属板を目視で観察し、反り等の著しい変形が見られるものは×、そうでないものは○として評価した。結果を表１及び表２に示す。
　［接合性（気密性）］
　接合性の評価は、上記の方法で作製した金属樹脂複合成形体５について、以下の方法により気密性を測定した。図４は、気密試験機Ｅを用いた気密性評価の方法を示す縦断面図である。気密試験機Ｅは、気密試験機本体７と気密試験機蓋６とを備える。Ｏリング５を介して金属樹脂複合成形体試験片２を気密試験機本体７に取り付け、金属樹脂複合成形体試験片２の下部を封止した。その後、気密試験機蓋６を金属樹脂複合成形体試験片２の樹脂部材４上に載せてクランプした。
　金属樹脂複合成形体試験片２の上に蒸留水１０を注ぎ、金属樹脂複合成形体試験片２を蒸留水１０中に完全に浸した。ライン９を介して空気を送り込み、気密試験機本体内部７に０．１ＭＰａの圧力を６分間加え、金属板３と樹脂部材４との界面から気泡の漏れがあるか否かを目視で観察した。上記の試験を３回実施し、以下の基準による気密性の評価結果を表１及び表２に示す。
　○：１回も気泡の漏れが確認されなかった場合、気密性が良好であると評価した。
　△：１～２回で気泡の漏れが確認された場合、気密性が中程度であると評価した。
　×：３回とも漏れが確認された場合、気密性が不良であると評価した。
［巻き取り性］
　フープ成形に用いる場合を想定し、実施例と比較例で用いた各厚さの金属板を、レーザー照射を行う前の状態で２０ｍｍ×５０ｍｍの板状に裁断し、長手方向が円周方向になるように、曲率半径４０ｍｍの円柱に巻き付けて１０秒間保持した後、保持時に外側になっていた面を下にして定盤上に載置し、歪による反りの発生を目視で確認した。
　反りが見られものについては、金属板をロール状に巻き取る際に過大な力が必要となるため巻き取りが困難となるか、あるいは歪により強度低下や変形が発生すると考えられることから、著しい反りが見られたものは×、そうでないものは○として評価した。結果を表１及び表２に示す。
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000002
　表１及び表２に示す通り、本発明の範囲では、変形の少ない状態で樹脂部と金属板との接合強度を顕著に向上させることができる。
　図５には、厚さ４００μｍの金属板を用いた場合について、請求項１の各数値規定を満足する範囲をハッチングした枠で示し、板厚４００μｍに該当する実施例と比較例を示した。
　Ｚ　気密性試験のための成形品における気密性確保の方向
　Ｗ　ハッチング幅
　１　金属板にレーザーで形成された溝
　２　金属板が樹脂組成物でインサート成形された試験片
　３　レーザー加工された金属板
　４　樹脂組成物からなる成形体＝樹脂部材
　５　Ｏリング
　６　気密試験機蓋
　７　気密試験機本体
　８　圧力
　９　ライン
　１０　蒸留水
　Ｅ　気密試験機
　ａ、ｃ、ｄ　接合（気密性）不良発生領域
　ｂ　変形発生領域

 

Claims (2)

  1. 　金属板に樹脂組成物をインサート成形した金属樹脂複合成形品であって、該金属板は、厚さＨが５００μｍ以下であり、該金属板の該樹脂組成物がインサートされる表面には溝が形成されており、該溝は、幅Ｙが３０～３００μｍ、深さＸが該金属板の厚さＨの２４％以下、該幅Ｙに対する該深さＸの割合Ｘ／Ｙが０．１～２．５である金属樹脂複合成形品。
  2. 　厚さＨが５００μｍ以下である金属板に、樹脂組成物をインサート成形して金属樹脂複合成形品を製造する方法であって、該金属板の表面に該樹脂組成物をインサートする溝を形成する工程を有し、該溝を、幅Ｙが３０～３００μｍ、深さＸが該金属板の厚さＨの２４％以下、該幅Ｙに対する該深さＸの割合Ｘ／Ｙが０．１～２．５とする金属樹脂複合成形品の製造方法。

     
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