Classifications

• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
  • C08G59/62—Alcohols or phenols
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/34—Silicon-containing compounds
  • C08K3/36—Silica
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K5/00—Use of organic ingredients
  • C08K5/54—Silicon-containing compounds
  • C08K5/544—Silicon-containing compounds containing nitrogen
  • C08K5/5465—Silicon-containing compounds containing nitrogen containing at least one C=N bond
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
  • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
  • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
  • C09K3/00—Materials not provided for elsewhere
  • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
  • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
  • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Definitions

• the present invention relates to a resin composition for a sealing sheet, a sealing sheet and a semiconductor device.
• an electronic component used for an electronic device there is a semiconductor package obtained by resin-sealing a semiconductor element.
• this semiconductor package is generally manufactured by transfer molding using a solid epoxy resin sealing material.
• semiconductor packages such as a lead on chip (LOC), a quad flat package (QFP), a chip size package (CSP), and a ball grid array (BGA) have been developed.
• LOC lead on chip
• QFP quad flat package
• CSP chip size package
• BGA ball grid array
• so-called face-down type package flip chip, wafer level CSP and the like have been developed in which the circuit surface of the semiconductor element is mounted on the wiring substrate side.
• the proportion of the inorganic filler blended in the encapsulant may be increased in consideration of the characteristics after curing and the like.
• the proportion of the inorganic filler is increased, the melt viscosity of the sealing material at the time of transfer molding is increased, and the filling property of the sealing material is reduced.
• filling defects, residual voids in the molded product, wire flow (deformation and breakage of the bonding wire), increase in stage shift and the like occur, and the quality of the molded product is degraded.
• Patent Document 1 a sealing resin sheet obtained by laminating a plurality of resin sheets made of an epoxy resin composition containing an epoxy resin, a curing agent, a curing catalyst or a curing accelerator, and an inorganic filler It is disclosed. Further, Patent Document 2 discloses a sheet-like sealing material having a thickness of 3.0 mm or less, which is made of a thermosetting resin composition which softens or melts at 70 to 150 ° C.
• the resin sheet for sealing of patent document 1 has a problem that curvature will generate
• the problem can be ameliorated by, for example, blending a large amount of an inorganic filler such as silica, but in this case, the melt viscosity increases, and the above-mentioned problems such as filling defects occur.
• the sheet-like sealing material of Patent Document 2 can sufficiently cope with a large size package and the like, it is easily broken when the sheet thickness is reduced to about 0.5 mm in order to further reduce the thickness. There are problems in handling, such as difficulty in loading into the mold.
• the present invention has been made to solve the above-mentioned problems of the prior art, and has excellent handleability and moldability even when the thickness is reduced, and flexibility is maintained over a long period, and excellent adhesion
• a sealing sheet capable of sealing the semiconductor element efficiently and favorably by a compression molding method, a resin composition for a sealing sheet to be a forming material of the sealing sheet, and a seal using the sealing sheet
• An object of the present invention is to provide a high quality, high reliability resin-sealed semiconductor device.
• the inventors of the present invention conducted intensive studies to achieve the above object, and as a result, by using a ketimine compound in combination with a crystalline epoxy resin and / or a liquid epoxy resin, the handling property and the molding are obtained even if the thickness is reduced. It has been found that a sealing sheet having excellent properties and having flexibility maintained for a long time and having excellent adhesion can be obtained, and the present invention has been completed.
• the present invention provides the following [1] to [4].
• [1] (A) crystalline epoxy resin and / or liquid epoxy resin, (B) phenol resin curing agent, (C) curing accelerator, (D) inorganic filler, and (E) ketimine group-containing silane compound Resin composition for sealing sheet to be [2]
• the resin composition for a sealing sheet according to the above [1], wherein the (D) inorganic filler is a silica powder, and 70 to 95% by mass is contained in the entire resin composition for a sealing sheet.
• a sealing sheet comprising the resin composition for a sealing sheet according to the above [1] or [2].
• [4] A semiconductor device comprising an element sealed by the sealing sheet according to the above [3].
• the present invention even when the thickness is reduced, the handling property and the moldability are good, and the flexibility is maintained for a long period, and the adhesive strength is excellent, and the semiconductor element can be efficiently formed by the compression molding method.
• a sealing sheet capable of sealing well, a resin composition for sealing sheet to be a forming material of the sealing sheet, and a semiconductor with high quality and high reliability sealed using the sealing sheet An apparatus can be provided.
• the resin composition for sealing sheet of this embodiment includes (A) crystalline epoxy resin and / or liquid epoxy resin, (B) phenol resin curing agent, (C) curing accelerator, (D) inorganic filler, and (E) A ketimine group-containing silane compound is contained.
• a resin composition for sealing sheet of this embodiment includes (A) crystalline epoxy resin and / or liquid epoxy resin, (B) phenol resin curing agent, (C) curing accelerator, (D) inorganic filler, and (E) A ketimine group-containing silane compound is contained.
• each component of the resin composition for sealing sheets of this embodiment (Hereinafter, it is also only called a resin composition.) Is demonstrated.
• the epoxy resin of the component (A) used in the present embodiment is a crystalline epoxy resin and / or a liquid epoxy resin.
• the crystalline epoxy resin is an epoxy resin which is solid at normal temperature (25 ° C.) and shows a crystalline state, and has a property that the viscosity is largely reduced at the time of melting.
• the melting point of the crystalline epoxy resin is preferably 80 to 150 ° C., more preferably 90 to 130 ° C.
• a liquid epoxy resin means the epoxy resin of a liquid or semisolid state at normal temperature (25 degreeC), for example, the epoxy resin which has fluidity
• the liquid epoxy resin is preferably 10,000 mPa ⁇ s or less, more preferably 1,000 to 6,000 mPa ⁇ s.
• the melting point of the crystalline epoxy resin can be measured by the endothermic peak of DSC.
• the viscosity at 25 ° C. of the liquid epoxy resin can be measured by a rotational viscometer.
• the crystalline epoxy resin of the component (A) and the liquid epoxy resin can be used without being restricted by the molecular structure, molecular weight, etc.
• Biphenyl type epoxy resin, bisphenol A type epoxy resin and bisphenol F type epoxy resin are preferable. These may use 1 type and may mix and use 2 or more types.
• the biphenyl type epoxy resin is an epoxy resin having a biphenyl skeleton, but the biphenyl skeleton in the present embodiment also includes one obtained by hydrogenating at least one aromatic ring of the biphenyl ring.
• biphenyl type epoxy resin examples include, for example, 4,4′-bis (2,3-epoxypropoxy) biphenyl, 4,4′-bis (2,3-epoxypropoxy) -3,3 ′, 5, Epoxy obtained by reacting 5'-tetramethylbiphenyl, epichlorohydrin and 4,4'-biphenol or a biphenol compound such as 4,4 '-(3,3', 5,5'-tetramethyl) biphenol Resin etc. are mentioned.
• YX-4000 (epoxy equivalent 185, melting point 105 ° C.), YX-4000 K (epoxy equivalent 185, melting point 105 ° C.), manufactured by Mitsubishi Chemical Corporation
• YX-4000H (epoxy equivalent 193, melting point 105 ° C.)
• YL-6121H epoxy equivalent 175, melting point 125 ° C.
• specific examples of the bisphenol A epoxy resin include EXA-850 CRP (epoxy equivalent 173, viscosity at 25 ° C. 4500 mPa ⁇ s) manufactured by DIC Corporation.
• bisphenol F-type epoxy resin examples include YDF-8170C (epoxy equivalent 160, viscosity 1250 mPa ⁇ s at 25 ° C.) manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., and the like.
• an epoxy resin used as a sealing material can be used in combination as long as the effects of the present invention are not impaired.
• the phenol resin curing agent of the component (B) used in this embodiment is particularly limited as long as it has two or more phenolic hydroxyl groups capable of reacting with the epoxy group in the epoxy resin of the component (A). It can be used without being Specifically, novolac type phenol resins such as phenol novolac resin and cresol novolac resin obtained by reacting phenols such as phenol and alkylphenol with formaldehyde or paraformaldehyde, these novolac type phenol resins are epoxidized or butylated Modified novolac type phenol resin, dicyclopentadiene modified phenol resin, paraxylene modified phenol resin, phenol aralkyl resin, naphthol aralkyl resin, triphenol alkane type phenol resin, polyfunctional phenol resin and the like. Among them, novolac type phenol resin and triphenol alkane type phenol resin are preferably used. These may use 1 type and may mix and use 2 or more types.
• the compounding amount of the phenol resin curing agent of the component (B) is the number of phenolic hydroxyl groups (b) possessed by the phenol resin curing agent of the component (B) with respect to the number of epoxy groups (a) possessed by the epoxy resin of the component (A).
• the range in which the ratio [(b) / (a)] is 0.3 or more and 1.5 or less is preferable, and the range in which 0.5 or more and 1.2 or less is more preferable. If the ratio [(b) / (a)] is 0.3 or more, the moisture resistance reliability of the cured product can be improved, and if it is 1.5 or less, the strength of the cured product can be increased.
• the curing accelerator of the component (C) used in the present embodiment is a component that promotes the curing reaction between the epoxy resin of the component (A) and the phenol resin curing agent of the component (B).
• the curing accelerator for the component (C) any known curing accelerator can be used without particular limitation as long as it exerts the above-mentioned action.
• Specific examples of the curing accelerator for component (C) include 2-methylimidazole, 2-ethylimidazole, 2-isopropylimidazole, 2-undecylimidazole, 1,2-dimethylimidazole and 2,4-dimethylimidazole.
• Imidazole 2-phenylimidazole, 2-phenyl-4-methylimidazole, 4-methylimidazole, 4-ethylimidazole, 2-phenyl-4-hydroxymethylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2 -Methylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-undecylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2 -Phenylimidazo Imidazoles such as 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, etc .; 8-Diazabicyclo [5.4.0] undecene-7
• the content of the curing accelerator as the component (C) is preferably in the range of 0.1 to 5% by mass, and more preferably in the range of 0.2 to 1% by mass, based on the entire resin composition. If the compounding amount of the component (C) is 0.1% by mass or more, the curing promoting effect can be sufficiently obtained, and if 5% by mass or less, the moisture resistance reliability of the molded article can be improved.
• the inorganic filler of the component (D) used in the present embodiment is filled in the resin composition to adjust the viscosity of the resin composition and to improve the handleability and the formability of the sealing sheet to be described later. It is.
• any known inorganic filler generally used in this type of resin composition can be used without particular limitation.
• the inorganic filler of the component (D) is, for example, oxide powder such as fused silica, crystalline silica, crushed silica, synthetic silica, alumina, titanium oxide, magnesium oxide, etc .; aluminum hydroxide, magnesium hydroxide And hydroxide powders, and nitride powders such as boron nitride, aluminum nitride, and silicon nitride.
• oxide powder such as fused silica, crystalline silica, crushed silica, synthetic silica, alumina, titanium oxide, magnesium oxide, etc .
• aluminum hydroxide, magnesium hydroxide And hydroxide powders such as boron nitride, aluminum nitride, and silicon nitride.
• silica powder is preferable among the above-exemplified examples, fused silica is more preferable, and spherical fused silica is particularly preferable. Moreover, fused silica and silica other than fused silica can be used together, and in that case, it is preferable to make the ratio of silica other than fused silica less than 30 mass% of the whole silica powder.
• the inorganic filler of the component (D) preferably has an average particle diameter of 0.5 to 40 ⁇ m, more preferably 1 to 30 ⁇ m, and still more preferably 5 to 30 ⁇ m. Further, the maximum particle size of the inorganic filler of the component (D) is more preferably 105 ⁇ m or less. If the average particle diameter is 0.5 ⁇ m or more, it is possible to suppress the decrease in the fluidity of the resin composition and to improve the moldability. In addition, when the average particle diameter is 40 ⁇ m or less, warpage of a molded product obtained by curing the resin composition can be suppressed, and deterioration in dimensional accuracy can be prevented. If the maximum particle size is 105 ⁇ m or less, the moldability of the resin composition can be improved.
• the average particle size of the inorganic filler of the component (D) can be determined, for example, by a laser diffraction type particle size distribution measuring apparatus, and the average particle size is the particle size distribution measured by the same apparatus.
• the particle size (d50) is 50% of the cumulative volume.
• the content of the inorganic filler as the component (D) is preferably 70 to 95% by mass, more preferably 75 to 90% by mass, with respect to the entire resin composition. If the blending amount of the inorganic filler is 70% by mass or more, the increase in the linear expansion coefficient of the resin composition can be suppressed, and the dimensional accuracy, the moisture resistance, the mechanical strength and the like of the molded article can be enhanced. When the blending amount of the inorganic filler is 95% by mass or less, the increase in the melt viscosity of the resin composition can be suppressed, and the decrease in the fluidity can be suppressed, and the moldability can be enhanced. Moreover, the sealing sheet obtained by shape
• the ketimine group-containing silane compound of the component (E) used in this embodiment is a compound having a ketimine group and an alkoxy group in one molecule, and is cured by containing the component (E) in the resin composition.
• the adhesion of objects can be enhanced.
• the ketimine group-containing silane compound of the component (E) is not particularly limited as long as it has a ketimine group and an alkoxy group in one molecule, but from the viewpoint of enhancing the adhesion of a cured product, it is represented by the following general formula (1) It is preferred that the compound be
• R 1 to R 4 each independently represent an alkyl group having 1 to 5 carbon atoms, and specifically, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group Groups, isobutyl group, sec-butyl group, tert-butyl group, various pentyl groups and the like can be mentioned. Among them, methyl group, ethyl group, propyl group and butyl group are preferable from the viewpoint of market availability.
• R 5 represents an alkylene group having 1 to 10 carbon atoms, preferably 1 to 5 carbon atoms.
• the alkylene group may be linear or branched, and examples thereof include a methylene group, an ethylene group, a propylene group, a trimethylene group, a butylene group and a pentylene group. Among them, ethylene and trimethylene are preferable.
• A represents an integer of 0 to 2, preferably 0.
• the ketimine group-containing silane compound of the component (E) is easily hydrolyzed under high temperature conditions at the time of molding to form a primary amine.
• water necessary for hydrolysis is sufficient for water adsorbed on the silica surface, it may be mixed with pure water in advance. Also, they may be used alone or in combination with other silane coupling agents.
• ketimine group-containing silane compound represented by the general formula (1) include N- (1-methylethylidene) -3- (triethoxysilyl) -1-propanamine and N- (1,3-dimethyl) Butylidene) -3- (triethoxysilyl) -1-propanamine, N- (1-methylpropylidene) -3- (triethoxysilyl) -1-propanamine, N- (1-methylethylidene) -3 -(Methyldiethoxysilyl) -1-propanamine, N- (1,3-dimethylbutylidene) -3- (methyldiethoxysilyl) -1-propanamine, N- (1-methylpropylidene) -3 -(Methyldiethoxysilyl) -1-propanamine, N- (1-methylethylidene) -3-(Methyldiethoxysilyl) -1-propanamine, N- (1-
• N- (1,3-dimethylbutylidene) -3- (triethoxysilyl) -1-propanamine is preferable from the viewpoint of market availability.
• These ketimine group-containing silane compounds may be used alone or in combination of two or more.
• the ketimine group-containing silane compound of the component (E) is easily hydrolyzed under high temperature conditions during molding to form a primary amine and to form a silanol group.
• the primary amine reacts with the epoxy resin of the component (A), and the silanol group causes a condensation reaction with the hydroxy group present on the surface of the inorganic filler of the component (D), whereby the cured resin and the inorganic filler The bond with is strong.
• the resin composition of the present embodiment is used as a sealing material for a semiconductor device, the cured product has strong adhesion to a silicon chip or the like.
• the content of the ketimine group-containing silane compound of the component (E) with respect to the total amount of the resin composition is from the viewpoint of improving the adhesion of the cured product to the silicon chip etc., suppressing molding defects such as voids, and balance of economy.
• it is selected in the range of 0.5 to 2.0% by mass, more preferably 0.8 to 1.5% by mass.
• a commercially available product used as the ketimine group-containing silane compound of the above component (E) can be exemplified, for example, as N- (1,3-dimethylidene) -3- (triethoxysilyl) -1-propanamine
• Examples thereof include KBE-9103 manufactured by Silicone Co., Ltd., Sira Ace S340 manufactured by JNC Co., Ltd., Z-6860 manufactured by Toray Dow Corning Co., Ltd., and the like.
• components generally compounded in this kind of resin composition, to the extent that the effects of the present embodiment are not inhibited such as coupling agents; Mold release agents such as natural waxes, higher fatty acids, metal salts of higher fatty acids; coloring agents such as carbon black and cobalt blue; low stress imparting agents such as silicone oil and silicone rubber; hydrotalcites; can do.
• the coupling agent examples include coupling agents such as epoxysilane type, aminosilane type, ureidosilane type, vinylsilane type, alkylsilane type, organic titanate type and aluminum alcoholate type. One of these may be used, or two or more may be mixed and used.
• an aminosilane type coupling agent is preferable from the viewpoint of moldability, flame retardancy, curability, etc., and in particular, ⁇ -aminopropyltrimethoxysilane, ⁇ -aminopropyltriethoxysilane, ⁇ -amino Propylmethyldimethoxysilane, ⁇ -aminopropylmethyldiethoxysilane, (N-phenyl- ⁇ -aminopropyl) trimethoxysilane and the like are preferable.
• the range which becomes the 0.01 mass% or more and 3.0 mass% or less of the whole resin composition is preferable, and the range which becomes 0.1 mass% or more and 1 mass% or less is more preferable preferable.
• the compounding amount of the coupling agent is 0.01% by mass or more, the formability can be improved, and if it is 3.0% by mass or less, the occurrence of foaming is suppressed at the time of molding, and voids or surface swelling in the molded product It can suppress that etc. occur.
• the resin composition of the present embodiment includes (A) crystalline epoxy resin and / or liquid epoxy resin, (B) phenolic resin curing agent, (C) curing accelerator, (D) inorganic filler, (E) ketimine group After thoroughly mixing (dry blending) the contained silane compound and the various components to be blended according to the above-mentioned necessity with a mixer etc., it is melt-kneaded by a kneading apparatus such as a heat roll or kneader, and after cooling, it has an appropriate size. Crush to.
• the grinding method is not particularly limited, and a common grinder such as a speed mill, a cutting mill, a ball mill, a cyclone mill, a hammer mill, a vibration mill, a cutter mill, a grinder mill, etc. can be used. Among them, a speed mill is preferably used.
• the pulverized material can then be adjusted to a particle assembly having a predetermined particle size distribution by sieve classification, air classification or the like.
• the sealing sheet of this embodiment is a sheet-like molded object obtained by using the above-mentioned resin composition for sealing sheets as a material, and shape
• the sealing sheet is obtained, for example, by heating, melting and compressing the resin composition of the present embodiment between pressure members, and forming it into a sheet. More specifically, the above resin composition is supplied on a heat resistant release film such as a polyester film so as to have a substantially uniform thickness to form a resin layer, and then the resin layer is heated and softened to form a roll. And rolling by heat press. At that time, a heat resistant film such as a polyester film is disposed also on the resin layer.
• the heating temperature for softening the resin layer is usually about 80 to 150 ° C. When the heating temperature is less than 80 ° C., the melt mixing becomes insufficient, and when the heating temperature exceeds 150 ° C., the curing reaction proceeds too much, and the moldability may be deteriorated at the time of heat curing.
• the sealing sheet of the present embodiment has a melt viscosity of 2 to 50 Pa ⁇ s measured by a heightening type flow tester under conditions of a temperature of 175 ° C. and a load of 10 kg (shear stress 1.23 ⁇ 10 5 Pa). Is preferable, and 3 to 20 Pa ⁇ s is more preferable.
• the melt viscosity is 2 Pa ⁇ s or more, the generation of burrs can be suppressed, and when the melt viscosity is 50 Pa ⁇ s or less, the filling property is improved, and the generation of voids and unfilled portions can be suppressed.
• the sealing sheet of the present embodiment is suitable for sealing components such as semiconductor elements, and is provided by appropriately adjusting the size according to the size and the like of the component to be sealed.
• the size of the sealing sheet can be arbitrarily made, but for example, 200 ⁇ 200 mm to 600 ⁇ 600 mm is preferable.
• the sealing sheet preferably has a thickness of 0.1 to 2.0 mm. If the thickness is 0.1 mm or more, there is no fear of cracking, the handling property is excellent, and the loading into the compression molding die can be easily performed without any problem. Moreover, if thickness is 2.0 mm or less, melting of the sealing sheet in a metal mold
• the semiconductor device of this embodiment is provided with the element sealed by the above-mentioned sealing sheet.
• the semiconductor device can be manufactured by sealing the semiconductor element fixed on the substrate by compression molding using the above sealing sheet.
• the sealing sheet is covered on the semiconductor element so as to be sandwiched between the two sealing sheets on the substrate on which the semiconductor element is mounted, and placed at a predetermined position in the cavity of the compression molding die. And compression molding at a predetermined pressure.
• the molding conditions are preferably a temperature of 100 to 190 ° C. and a pressure of 4 to 12 MPa.
• post curing is performed at a temperature of 130 to 190 ° C. for about 2 to 8 hours. By this heat curing, the sealing sheet adheres to the semiconductor element and is cured, and a resin-sealed semiconductor device sealed so that the semiconductor element is not in contact with the external atmosphere can be manufactured.
• the semiconductor device obtained in this manner is sealed by compression molding using a sealing sheet that is easy to handle even if it is thin and has excellent formability, so it has high quality and high reliability even if it is thin. can do.
• the semiconductor element sealed in the semiconductor device of the present embodiment is not particularly limited because it may be a known semiconductor element, and, for example, IC (Integrated Circuit), LSI (Large Scale Integration), A diode, a thyristor, a transistor or the like can be exemplified.
• IC Integrated Circuit
• LSI Large Scale Integration
• a diode, a thyristor, a transistor or the like can be exemplified.
• a semiconductor device using the above sealing sheet The method of manufacture is particularly useful.
• Examples 1 to 6, Comparative Examples 1 to 3 Each raw material was mixed at normal temperature (25.degree. C.) so as to obtain the composition shown in Table 2, and then heat-kneaded at 80 to 130.degree. C. using a heat roll. After cooling, it was pulverized using a speed mill to prepare a resin composition for encapsulating sheet.
• the obtained resin composition for sealing sheet is sandwiched between mold release films made of polyester, placed between hot plates at 80 ° C., heated and pressurized at a pressure of 10 MPa for 1 minute, and sealed with a thickness of 0.5 mm A sheet was made. Furthermore, the semiconductor chip was sealed using the obtained sealing sheet. That is, first, a 150 mm ⁇ 30 mm sheet was cut out from the obtained sealing sheet.
• the cut-out sealing sheet is placed in a compression molding mold, a substrate on which a semiconductor chip is mounted is stacked thereon, and the sealing sheet is further stacked thereon, and 30 at a temperature of 175 ° C. under a pressure of 8.0 MPa. Compression molding was performed for 1 minute. Thereafter, post curing was performed at 175 ° C. for 4 hours to manufacture a semiconductor device.
• ⁇ Sealing sheet> Flexibility A sealing sheet of 10 mm in width, 50 mm in length and 0.5 mm in thickness is cut out, and a portion of 15 mm is clamped from one end, and set at a height of 18 mm on a gantry. The time to contact the upper surface of the gantry was measured (initial). Separately from this, a sealing sheet with a width of 10 mm, a length of 50 mm and a thickness of 0.5 mm is cut out and left at 25 ° C. for 168 hours, and similarly, a portion of 15 mm from one end is clamped. The height was set to 18 mm, and the time it took for one end of the sheet to come in contact with the upper surface of the mount by its own weight was measured.
• Tg Glass transition point
• TMA thermal analyzer
• Adhesive Strength to Silicon Chip A sealing sheet was transfer molded on a silicon chip into a square shape of 2 mm on a side at a molding temperature of 150 ° C. and a molding pressure of 100 kg / cm 2 for 10 minutes. A shear force was applied to the obtained molded article, and the shear force at break was taken as the adhesive force.
• High temperature storage reliability Highly accelerated life test: HAST
• the sealing sheet of the present embodiment has flexibility even when left at normal temperature for a long time, has good handling properties, and has good adhesion to silicon chips. Met.
• semiconductor devices manufactured using the sealing sheet show good results in any of the MSL test, pressure cooker test, and advanced accelerated life test, and are high as a resin-sealed semiconductor device. It could be confirmed that it was reliable.
• the sealing sheet of the present invention is excellent in handleability and moldability even when the thickness is reduced. Therefore, it is useful as a sealing material for compression molding of a thinned semiconductor element, and a high-quality, highly reliable resin-sealed semiconductor device can be manufactured. Moreover, it can use as a sealing sheet which seals components etc. so that it may not expose to external environment besides a semiconductor element.

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• Chemical & Material Sciences (AREA)
• Organic Chemistry (AREA)
• Health & Medical Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Medicinal Chemistry (AREA)
• Polymers & Plastics (AREA)
• Engineering & Computer Science (AREA)
• General Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• Physics & Mathematics (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Materials Engineering (AREA)
• Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
• Compositions Of Macromolecular Compounds (AREA)
• Sealing Material Composition (AREA)
• Epoxy Resins (AREA)

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• 2017
  • 2017-07-19 JP JP2017140177A patent/JP2020152740A/ja active Pending
• 2018
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