WO2019015006A1 - 减压干燥设备及减压干燥方法 - Google Patents

减压干燥设备及减压干燥方法 Download PDF

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Publication number
WO2019015006A1
WO2019015006A1 PCT/CN2017/098166 CN2017098166W WO2019015006A1 WO 2019015006 A1 WO2019015006 A1 WO 2019015006A1 CN 2017098166 W CN2017098166 W CN 2017098166W WO 2019015006 A1 WO2019015006 A1 WO 2019015006A1
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air
hole
intake
air inlet
suction
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French (fr)
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龚成波
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking

Definitions

  • the present invention relates to the field of display technology, and in particular, to a vacuum drying apparatus and a vacuum drying method.
  • LCDs liquid crystal displays
  • OLEDs organic light emitting displays
  • Both the liquid crystal display and the organic light emitting diode display often use a photolithography process in the manufacturing process, the purpose of which is to sequentially pass the metal or non-metal film layer on the glass substrate through photoresist coating, mask exposure, development and After the etching process, it is not damaged at its corresponding position, thereby achieving the purpose of forming a pattern on the glass substrate.
  • Photoresist coating is an important process in the lithography process. To ensure the fluidity and coating performance of the photoresist, about 80% of the photoresist is a volatile solvent, and solvent removal must be performed after coating. In the current step, the solvent removal is mainly carried out by a combination of first drying under reduced pressure and then heating and baking. Among them, the vacuum drying can remove the volatile solvent in the photoresist by pressure reduction, so that the fluidity of the photoresist is weakened and can be uniformly distributed on the substrate.
  • the vacuum drying equipment in the process of drying under reduced pressure, in order to avoid the adsorption of impurities in the VCD chamber during pumping, and at the same time ensuring the pumping effect, the vacuum drying equipment is pumped.
  • the gas vacuum hole 200 can neither be placed higher than the substrate 300 nor placed under the substrate 300, and can only be placed at a position slightly lower than the substrate 300 at the edge of the substrate 300.
  • the vacuum hole 200 is placed at the edge of the substrate 300 for pumping, the edge of the substrate 300 is close to the vacuum hole 200, the pumping speed is fast, the middle of the substrate 300 is away from the vacuum hole 200, the pumping speed is slow, and the edge of the substrate 300 is pumped.
  • the inconsistency between the gas velocity and the pumping speed in the middle of the substrate 300 may cause the solvent content in the middle of the edge of the substrate 300 and the substrate 300 to be inconsistent.
  • the macroscopic inspection it is found that the color of the edge of the substrate 300 and the middle of the substrate 300 are different.
  • the edge line width (Critical Dimesion, CD) of the substrate 300 is small.
  • the intermediate line width of the substrate 300 is large, and the line uniformity (CD Uniformity) is deteriorated.
  • Another object of the present invention is to provide a method for drying under reduced pressure, which can improve the uniformity of evaporation of the solvent of the photoresist and ensure the uniformity of the line width of the development process.
  • the present invention provides a vacuum drying apparatus comprising: a working chamber, a work table, a suction hole, an air inlet hole, and an air inlet valve;
  • the working table is disposed in the working chamber, and each of the four corners of the working table is provided with a suction hole, and each of the air suction holes is provided with at least one air inlet hole adjacent to the air suction hole, and each air inlet hole An air inlet valve is provided on the upper;
  • the worktable is configured to place a substrate to be dried, the plane of the air suction hole is higher than an upper surface of the worktable and lower than an upper surface of the substrate;
  • the air vent is used for pumping and depressurizing the working chamber
  • the air inlet hole is for introducing a shielding gas into the working chamber
  • the air inlet valve is used for controlling the air intake of each air inlet hole. flow.
  • At least two air inlet holes adjacent to the air suction holes are provided, and the distance between the at least two air inlet holes and the corresponding air suction holes is different.
  • the intake port valve controls an intake flow rate of the intake port that is closer to the suction hole than an intake air flow of the intake port that is farther from the extraction hole.
  • the intake port valve controls the intake air flow rate of the intake port to decrease as the length of the suction hole is increased.
  • the air inlet valve is an electromagnetic control valve.
  • the invention also provides a method for drying under reduced pressure, comprising the following steps:
  • Step S1 providing a vacuum drying device and a substrate to be dried, the vacuum drying device comprising: a working chamber, a working table, a suction hole, an air inlet hole, and an air inlet valve;
  • the working table is disposed in the working chamber, and each of the four corners of the working table is provided with a suction hole, and each of the air suction holes is provided with at least one air inlet hole adjacent to the air suction hole, and each air inlet hole An air inlet valve is provided on the upper;
  • the substrate is placed on the workbench, the plane of the air venting hole is higher than the upper surface of the working table and lower than the upper surface of the substrate;
  • Step S2 the suction hole suction reduces the pressure in the working chamber to volatilize the photoresist solvent on the substrate, and draws the evaporated photoresist solvent away from the working cavity; While pumping, the air inlet hole passes the shielding gas into the working chamber according to a preset intake air flow rate under the control of the air inlet port valve, and reduces the pumping hole to be evaporated from the edge of the substrate. Rear The speed of the photoresist solvent.
  • each of the air suction holes is provided with at least two air inlet holes adjacent to the air suction holes, and the distance between the at least two air inlet holes and the corresponding air suction holes is different.
  • the intake port valve controls the intake flow rate of the intake hole near the suction hole to be larger than the intake hole far from the suction hole. Intake flow.
  • the intake port valve controls the intake air flow rate of the intake hole to decrease as the length of the suction hole is increased.
  • the air inlet valve is an electromagnetic control valve.
  • the invention also provides a vacuum drying device comprising: a working chamber, a working table, a suction hole, an air inlet hole, and an air inlet valve;
  • the working table is disposed in the working chamber, and each of the four corners of the working table is provided with a suction hole, and each of the air suction holes is provided with at least one air inlet hole adjacent to the air suction hole, and each air inlet hole An air inlet valve is provided on the upper;
  • the worktable is configured to place a substrate to be dried, the plane of the air suction hole is higher than an upper surface of the worktable and lower than an upper surface of the substrate;
  • the air vent is used for pumping and depressurizing the working chamber
  • the air inlet hole is for introducing a shielding gas into the working chamber
  • the air inlet valve is used for controlling the air intake of each air inlet hole. flow
  • each of the air venting holes is provided with at least two air inlet holes adjacent to the air venting holes, and the distance between the at least two air inlet holes and the corresponding air venting holes is different;
  • the intake port valve controls an intake flow rate of the intake hole near the suction hole to be larger than an intake flow rate of the intake hole far from the extraction hole.
  • the intake port valve controls the intake air flow rate of the air intake hole to decrease as the length of the air suction hole is increased
  • the air inlet valve is an electromagnetic control valve.
  • the present invention provides a vacuum drying apparatus comprising: a working chamber, a work table, a suction hole, an air inlet hole, and an air inlet valve, the work table being disposed in the working chamber, Each of the four corners of the worktable is provided with an air venting hole, and each of the air venting holes is provided with at least one air inlet hole adjacent to the air venting hole, and each of the air inlet holes is provided with an air inlet valve, While the air vent is pumping, the shielding gas is introduced into the periphery of the air venting hole to reduce the speed of the venting hole from the edge of the substrate to evaporate the photoresist solvent, thereby improving the photoresist.
  • the uniformity of solvent evaporation avoids the influence of the unevenness of the evaporation of the photoresist solvent on the line width of the developing process and ensures the uniformity of the line width of the developing process.
  • the invention also provides a method for drying under reduced pressure, It can improve the uniformity of the evaporation of the photoresist solvent and ensure the uniformity of the line width of the development process.
  • Figure 1 is a plan view of a conventional vacuum drying apparatus
  • Figure 2 is a side view of a conventional vacuum drying apparatus
  • Figure 3 is a plan view of the vacuum drying apparatus of the present invention.
  • Figure 4 is a side view of the vacuum drying apparatus of the present invention.
  • Figure 5 is a flow chart of the reduced pressure drying method of the present invention.
  • the present invention provides a vacuum drying apparatus comprising: a working chamber 10, a table 21, a suction hole 30, an air inlet 40, and an air inlet valve 50;
  • the working table 21 is disposed in the working chamber 10.
  • the four corners of the working table 21 are respectively provided with an air venting hole 30, and each of the air venting holes 30 is provided with at least one air inlet hole adjacent to the air venting hole 30.
  • each of the air inlet holes 40 is provided with an air inlet valve 50.
  • the working table 21 is used for placing the substrate 20 to be dried.
  • the plane in which the suction holes 30 are disposed is slightly lower than the above.
  • the upper surface of the substrate 20, preferably, the plane in which the air vent 30 is located is higher than the upper surface of the table 21 and lower than the upper surface of the substrate 20.
  • the plane ratio of the air vent 30 is The upper surface of the substrate 20 is 1 to 2 mm lower.
  • the substrate 20 is coated with a photoresist, and the photoresist includes a photoresist solvent.
  • the air vent 30 is used for pumping the working chamber 10 to reduce the air pressure in the working chamber 10, so that the photoresist solvent on the substrate 20 is volatilized, and the evaporated light is evaporated.
  • the working chamber 10 is extracted by a glue solvent.
  • the air inlet hole 40 is configured to pass a shielding gas into the working chamber 10 to reduce the velocity of the photoresist solvent after the evacuation hole 30 is evacuated from the edge of the substrate 20.
  • the air inlet hole 40 is provided with a shielding gas around the air venting hole 30, and the shielding gas is again drawn by the air venting hole 30 after being opened.
  • the photoresist solvent contained in the gas extracted by the air vent 30 is reduced, that is, the air volume of the air vent 30 in the present invention includes the air in the working chamber, the evaporated photoresist solvent, and the protective gas that is introduced.
  • the shielding gas is added compared with the prior art, and when the pumping flow rate is constant, the partially evaporated solvent solvent which should be extracted is replaced by the shielding gas, thereby reducing the air venting hole 30.
  • the velocity of the photoresist solvent evaporated from the edge of the substrate 20 finally causes the edge of the substrate 20 to coincide with the velocity of the photoresist solvent in the center of the substrate 20, avoiding VCD
  • the generation of mura ensures the uniformity of the line width of the subsequent development process.
  • the shielding gas is nitrogen gas or an inert gas.
  • the air inlet valve 50 is used to control the intake air flow rate of each air inlet hole 40, and the precise control of the intake air flow rate of the air inlet hole 40 prevents the excessive air intake from affecting the lithography after the evaporation.
  • the peptizing agent is discharged while ensuring that the amount of intake air is sufficient to balance the difference in the extraction speed of the photoresist solvent at the center of the substrate 20 and the edge of the substrate 20.
  • the inlet port valve 50 is an electromagnetically controlled valve.
  • the intake air flow rate of the air inlet hole 40 and the evaporation amount of the photoresist solvent are very small compared to the pumping flow rate of the air suction hole 30, and do not cause an influence on the air flow direction, and
  • the air inlet hole 40 is disposed at a position adjacent to the air suction hole 30 to ensure that the air suction hole 30 can timely extract the shielding gas that is introduced into the air inlet hole 40 to replace a part of the photoresist solvent by the shielding gas.
  • the extraction is performed to reduce the velocity at which the evacuation hole 30 is evacuated from the edge of the substrate 20 to the volatilized photoresist solvent.
  • each of the air venting holes 30 is provided with at least two air inlet holes 40 adjacent to the air venting holes 30, and the at least two air intake holes 40 correspond thereto.
  • the distance between the suction holes 30 is different.
  • the intake port valve 50 controls the intake flow rate of the intake port 40 close to the exhaust hole 30 to be greater than the distance from the exhaust hole 30. The intake air flow rate of the intake port 40.
  • the intake port valve 50 also controls the corresponding change in the intake air flow rate of the intake port 40 according to the difference in the length of time that the air suction hole 30 is exhausted. Specifically, the intake air flow rate of the air intake hole 40 follows The increase in the length of the suction of the suction port 30 is reduced, and preferably, the flow rate of the intake air of the intake port 40 is gradually decreased by a predetermined ratio.
  • the air inlet valve 50 also controls the air intake hole 40 to stop the intake air when the intake air time reaches a preset total intake air time.
  • the pumping process of the air venting holes 30 is sequentially: a slow pumping phase, a pumping flow rate greater than a fast pumping phase of the slow pumping phase, an equilibrium phase in which the air pressure in the working chamber 10 is constant, and a pre-exhaustion air pumping phase.
  • the preset total air intake time is equal to the duration of the slow pumping phase.
  • the plane of the air inlet hole 40 is slightly higher than the plane of the air suction hole 30, so that the shielding gas that the air inlet hole 40 is able to pass can be described.
  • the suction holes 30 are evacuated in time.
  • the present invention also provides a vacuum drying method, comprising the following steps:
  • Step S1 providing a vacuum drying apparatus and a substrate 20 to be dried, the vacuum drying apparatus comprising: a working chamber 10, a table 21, a suction hole 30, an air inlet 40, and an air inlet valve 50;
  • the working table 21 is disposed in the working chamber 10.
  • the four corners of the working table 21 are respectively provided with an air venting hole 30, and each of the air venting holes 30 is provided with at least one air inlet hole adjacent to the air venting hole 30.
  • each of the air inlet holes 40 is provided with an air inlet valve 50;
  • the substrate 20 is placed on the table 21, and the plane of the air vent 30 is higher than the upper surface of the table 21 and lower than the upper surface of the substrate 20.
  • the substrate 20 is coated with a photoresist, and the photoresist includes a photoresist solvent.
  • Step S2 the pumping holes 30 pump down to reduce the pressure in the working chamber 10, so that the photoresist solvent on the substrate 20 is volatilized, and the volatilized photoresist solvent is pumped away from the working chamber 10; While the air suction hole 30 is pumping, the air inlet hole 40 is introduced into the working chamber 10 according to a preset intake air flow rate under the control of the air inlet port valve 50, and the air suction hole 30 is reduced. The velocity of the volatilized photoresist solvent is extracted from the edge of the substrate 20.
  • the air intake hole 40 is around the air venting hole 30 in a case where the pumping flow rate of the air venting hole 30 is constant.
  • the shielding gas is introduced, and the shielding gas is again drawn by the air venting holes 30 after being introduced, thereby causing the photoresist solvent contained in the gas extracted by the air venting holes 30 to be reduced, that is, the venting holes 30 of the present invention.
  • the pumping capacity includes three parts of the air in the working chamber, the evaporated photoresist solvent, and the protective gas that is introduced. Compared with the prior art, the shielding gas is added, and when the pumping flow rate is constant, the pumping gas should be taken out.
  • the partially evaporated photoresist solvent is replaced by a shielding gas, thereby reducing the velocity of the extraction solvent 30 from the edge of the substrate 20 after evaporation of the photoresist solvent, ultimately resulting in the substrate 20
  • the edge is in the same speed as the photoresist solvent in the center of the substrate 20, avoiding the generation of VCD mura, and ensuring the uniformity of the line width of the subsequent development process.
  • the shielding gas is nitrogen gas or an inert gas.
  • the intake air flow rate of each air intake hole 40 is controlled by the air inlet valve 50, and the precise control of the intake air flow rate of the air inlet hole 40 prevents the excessive intake air from affecting the volatile state.
  • the photoresist solvent is discharged while ensuring that the amount of intake air is sufficient to balance the difference in the extraction speed of the photoresist solvent at the center of the substrate 20 and the edge of the substrate 20.
  • the inlet valve 50 For electromagnetic control of the valve.
  • each of the air venting holes 30 is provided with at least two air inlet holes 40 adjacent to the air venting holes 30, and the at least two air intake holes 40 correspond thereto.
  • the distance between the suction holes 30 is different.
  • the intake port valve 50 controls the intake flow rate of the intake port 40 close to the exhaust hole 30 to be greater than the distance from the exhaust hole 30. The intake air flow rate of the intake port 40.
  • the intake port valve 50 also controls the corresponding change in the intake air flow rate of the intake port 40 according to the difference in the length of time that the air suction hole 30 is exhausted. Specifically, the intake air flow rate of the air intake hole 40 follows The increase in the length of the suction of the suction port 30 is reduced, and preferably, the flow rate of the intake air of the intake port 40 is gradually decreased by a predetermined ratio.
  • the air inlet valve 50 also controls the air intake hole 40 to stop the intake air when the intake air time reaches a preset total intake air time.
  • the pumping process of the air venting holes 30 is sequentially: a slow pumping phase, a pumping flow rate greater than a fast pumping phase of the slow pumping phase, an equilibrium phase in which the air pressure in the working chamber 10 is constant, and a pre-exhaustion air pumping phase.
  • the preset total air intake time is equal to the duration of the slow pumping phase.
  • the plane of the air inlet hole 40 is slightly higher than the plane of the air suction hole 30, so that the shielding gas that the air inlet hole 40 is able to pass can be described.
  • the suction holes 30 are evacuated in time.
  • the present invention provides a vacuum drying apparatus including: a working chamber, a work table, a suction hole, an air inlet hole, and an air inlet valve, wherein the work table is disposed in the working cavity,
  • a vacuum drying apparatus including: a working chamber, a work table, a suction hole, an air inlet hole, and an air inlet valve, wherein the work table is disposed in the working cavity,
  • Each of the four corners of the workbench is provided with an air venting hole, and each of the air venting holes is provided with at least one air inlet hole adjacent to the air venting hole, and each of the air inlet holes is provided with an air inlet valve, which is At the same time as the air venting, the shielding gas is introduced into the periphery of the air venting hole to reduce the speed of the venting hole from the edge of the substrate to evaporate the photoresist solvent, thereby improving the photoresist solvent.
  • the uniformity of volatilization avoids the influence of the unevenness of the evaporation of the photoresist solvent on the line width of the developing process and the uniformity of the line width of the developing process.
  • the invention also provides a vacuum drying method, which can improve the uniformity of the solvent evaporation of the photoresist and ensure the uniformity of the line width of the developing process.

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  • General Physics & Mathematics (AREA)
  • Drying Of Solid Materials (AREA)

Abstract

一种减压干燥设备及减压干燥方法。减压干燥设备包括：工作腔（10）、工作台（21）、抽气孔（30）、进气孔（40）、以及进气孔阀门（50），工作台（21）设于工作腔（10）内，工作台（21）的四角分别设有一抽气孔（30），对应每一个抽气孔（30）均设有至少一个与抽气孔（30）相邻的进气孔（40），每一个进气孔（40）上均设有一进气孔阀门（50），通过在抽气孔（30）抽气的同时由进气孔（40）在抽气孔（30）的周边通入保护气，减少抽气孔（30）从基板的边缘抽离挥发后的光刻胶溶剂的速度，从而提升光刻胶溶剂挥发的均一性，避免因光刻胶溶剂挥发不均匀影响显影制程的线宽，保证显影制程的线宽的均匀性。

Description

减压干燥设备及减压干燥方法 技术领域
本发明涉及显示技术领域，尤其涉及一种减压干燥设备及减压干燥方法。
背景技术
随着显示技术的发展，液晶显示器(Liquid Crystal Display，LCD)和有机发光二极管显示器(Organic Light Emitting Display，OLED)等平面显示装置因具有高画质、省电、机身薄及应用范围广等优点，而被广泛的应用于手机、电视、个人数字助理、数字相机、笔记本电脑、台式计算机等各种消费性电子产品，成为显示装置中的主流。
无论是液晶显示器还是有机发光二极管显示器在制作过程中都经常用到光刻工序，其目的是使玻璃基板上的金属或非金属膜层在依次经过光刻胶涂布、掩膜曝光、显影和刻蚀工序之后在其相应的位置不受到损害，从而达到在玻璃基板上形成图案的目的。光刻胶涂布是光刻制程中的一个重要工序，为保证光刻胶的流动性和涂布性能，光刻胶中80％左右为挥发性的溶剂，在涂布之后还必须进行溶剂去除的步骤，目前溶剂去除主要采用先减压干燥再加热烘烤相结合的方式进行的。其中，减压干燥可通过减压去除光刻胶中的挥发溶剂，使得光刻胶的流动性减弱，能够均匀的分布在基板上。
请参阅图1和图2，在减压干燥过程中，为避免在抽气时吸附到减压干燥腔100(VCD chamber)内的杂质(Particle)，同时保证抽气效果，减压干燥设备抽气的真空孔200既不能放在比基板300高的位置，又不放在基板300底下，只能放在基板300边缘比基板300略低的位置。但将真空孔200放在基板300的边缘进行抽气时，基板300的边缘靠近真空孔200，抽气速度快，基板300的中间远离真空孔200，抽气速度慢，基板300的边缘的抽气速度和基板300的中间的抽气速度的不一致又会导致基板300的边缘和基板300的中间的溶剂含量不一致，进行宏观检查时就会发现基板300的边缘和基板300的中间的颜色有差别，产生减压干燥不良(VCD Mura)，同时在进行后续显影制程时，由于基板300的边缘和基板300的中间的溶剂含量不一致，又会导致基板300的边缘线宽(Critical Dimesion，CD)小，基板300的中间线宽大，线宽均匀性(CD Uniformity)变差。
发明内容
本发明的目的在于提供一种减压干燥设备，能够提升光刻胶溶剂挥发的均一性，保证显影制程的线宽的均匀性。
本发明的目的还在于提供一种减压干燥方法，能够提升光刻胶溶剂挥发的均一性，保证显影制程的线宽的均匀性。
为实现上述目的，本发明提供了一种减压干燥设备，包括：工作腔、工作台、抽气孔、进气孔、以及进气孔阀门；
所述工作台设于所述工作腔内，所述工作台的四角分别设有一抽气孔，对应每一个抽气孔均设有至少一个与该抽气孔相邻的进气孔，每一个进气孔上均设有一进气孔阀门；
所述工作台用于放置待干燥的基板，所述抽气孔所在的平面高于所述工作台的上表面且低于所述基板的上表面；
所述抽气孔用于对所述工作腔进行抽气降压，所述进气孔用于向所述工作腔通入保护气，所述进气孔阀门用于控制各个进气孔的进气流量。
对应每一个抽气孔均设有与该抽气孔相邻的至少两个进气孔，所述至少两个进气孔与其所对应的抽气孔之间的距离不同。
对于与同一个抽气孔相邻的各个进气孔，所述进气孔阀门控制距离该抽气孔近的进气孔的进气流量大于距离该抽气孔远的进气孔的进气流量。
所述进气孔阀门控制所述进气孔的进气流量随着抽气孔抽气的时长的增加而减小。
所述进气孔阀门为电磁控制阀门。
本发明还提供一种减压干燥方法，包括如下步骤：
步骤S1、提供一减压干燥设备和一待干燥的基板，所述减压干燥设备包括：工作腔、工作台、抽气孔、进气孔、以及进气孔阀门；
所述工作台设于所述工作腔内，所述工作台的四角分别设有一抽气孔，对应每一个抽气孔均设有至少一个与该抽气孔相邻的进气孔，每一个进气孔上均设有一进气孔阀门；
所述基板放置于所述工作台上，所述抽气孔所在的平面高于所述工作台的上表面且低于所述基板的上表面；
步骤S2、所述抽气孔抽气降低所述工作腔内的压力使得所述基板上的光刻胶溶剂挥发，并将挥发后的光刻胶溶剂抽离所述工作腔；在所述抽气孔抽气的同时，所述进气孔在进气孔阀门的控制下按照预设的进气流量向所述工作腔内通入保护气，减少所述抽气孔从所述基板的边缘抽离挥发后 的光刻胶溶剂的速度。
所述步骤S1中，对应每一个抽气孔均设有与该抽气孔相邻的至少两个进气孔，所述至少两个进气孔与其所对应的抽气孔之间的距离不同。
所述步骤S2中，对于与同一个抽气孔相邻的各个进气孔，所述进气孔阀门控制距离该抽气孔近的进气孔的进气流量大于距离该抽气孔远的进气孔的进气流量。
所述步骤S2中，进气孔阀门控制所述进气孔的进气流量随着抽气孔抽气的时长的增加而减小。
所述步骤S1中，所述进气孔阀门为电磁控制阀门。
本发明还提供一种减压干燥设备，包括：工作腔、工作台、抽气孔、进气孔、以及进气孔阀门；
所述工作台设于所述工作腔内，所述工作台的四角分别设有一抽气孔，对应每一个抽气孔均设有至少一个与该抽气孔相邻的进气孔，每一个进气孔上均设有一进气孔阀门；
所述工作台用于放置待干燥的基板，所述抽气孔所在的平面高于所述工作台的上表面且低于所述基板的上表面；
所述抽气孔用于对所述工作腔进行抽气降压，所述进气孔用于向所述工作腔通入保护气，所述进气孔阀门用于控制各个进气孔的进气流量；
其中，对应每一个抽气孔均设有与该抽气孔相邻的至少两个进气孔，所述至少两个进气孔与其所对应的抽气孔之间的距离不同；
其中，对于与同一个抽气孔相邻的各个进气孔，所述进气孔阀门控制距离该抽气孔近的进气孔的进气流量大于距离该抽气孔远的进气孔的进气流量；
其中，所述进气孔阀门控制所述进气孔的进气流量随着抽气孔抽气的时长的增加而减小；
其中，所述进气孔阀门为电磁控制阀门。
本发明的有益效果：本发明提供一种减压干燥设备，包括：工作腔、工作台、抽气孔、进气孔、以及进气孔阀门，所述工作台设于所述工作腔内，所述工作台的四角分别设有一抽气孔，对应每一个抽气孔均设有至少一个与该抽气孔相邻的进气孔，每一个进气孔上均设有一进气孔阀门，通过在所述抽气孔抽气的同时由所述进气孔在所述抽气孔的周边通入保护气，减少所述抽气孔从基板的边缘抽离挥发后的光刻胶溶剂的速度，从而提升光刻胶溶剂挥发的均一性，避免因光刻胶溶剂挥发不均匀影响显影制程的线宽，保证显影制程的线宽的均匀性。本发明还提供一种减压干燥方法， 能够提升光刻胶溶剂挥发的均一性，保证显影制程的线宽的均匀性。
附图说明
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图中，
图1为现有的减压干燥设备的俯视图；
图2为现有的减压干燥设备的侧视图；
图3为本发明的减压干燥设备的俯视图；
图4为本发明的减压干燥设备的侧视图；
图5为本发明的减压干燥方法的流程图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图3和图4，本发明提供一种减压干燥设备，包括：工作腔10、工作台21、抽气孔30、进气孔40、以及进气孔阀门50；
所述工作台21设于所述工作腔10内，所述工作台21的四角分别设有一抽气孔30，对应每一个抽气孔30均设有至少一个与该抽气孔30相邻的进气孔40，每一个进气孔40上均设有一进气孔阀门50。
具体地，所述工作台21用于放置待干燥的基板20，为避免在抽气时吸附到工作腔10内的杂质，同时保证抽气效果，设置抽气孔30所在的平面略低于所述基板20的上表面，优选地，所述抽气孔30所在的平面高于所述工作台21的上表面且低于所述基板20的上表面，详细地，所述抽气孔30所在的平面比所述基板20的上表面低1～2mm。
具体地，所述基板20上涂布有光刻胶，所述光刻胶包括光刻胶溶剂。
需要说明的是，所述抽气孔30用于对所述工作腔10进行抽气，以降低所述工作腔10内的气压，使得基板20上的光刻胶溶剂挥发，并将挥发后的光刻胶溶剂抽出所述工作腔10。
重点的是，所述进气孔40用于向所述工作腔10通入保护气，以减少所述抽气孔30从所述基板20边缘的抽离挥发后的光刻胶溶剂的速度，在所述抽气孔30的抽气流量不变的情况下，所述进气孔40在所述抽气孔30周围通入了保护气，该些保护气在通入之后又会被抽气孔30抽出，进而导 致抽气孔30抽出的气体中含有的光刻胶溶剂减少，也即本发明中所述抽气孔30的抽气量包括工作腔内的空气、挥发后的光刻胶溶剂、以及通入的保护气三个部分，相比于现有技术增加了保护气，在抽气流量不变时，原本应该被抽出的部分挥发后的光刻胶溶剂的被保护气代替，从而减少了所述抽气孔30从所述基板20的边缘的抽离挥发后的光刻胶溶剂的速度，最终使得所述基板20的边缘与所述基板20的中央的光刻胶溶剂的被抽离的速度一致，避免VCD mura的产生，保证后续显影制程的线宽的均匀性。
优选地，所述保护气为氮气、或惰性气体。
进一步地，所述进气孔阀门50用于控制各个进气孔40的进气流量，通过对所述进气孔40的进气流量的精确控制，避免进气过多影响挥发后的光刻胶溶剂排出，同时又保证进气量足够平衡基板20的中央和基板20的边缘光刻胶溶剂的抽离速度的差异，优选地，所述进气孔阀门50为电磁控制阀门。
进一步地，所述进气孔40的进气流量和光刻胶溶剂的挥发量与抽气孔30相比的抽气流量相比均非常小，不会造成气流方向上的影响，并且通过将所述进气孔40设置在与所述抽气孔30相邻的位置，可保证所述抽气孔30能够及时将进气孔40通入的保护气抽出，以通过保护气代替部分光刻胶溶剂被抽出，从而减少所述抽气孔30从基板20的边缘抽离挥发后的光刻胶溶剂的速度。
具体地，在本发明的优选实施例中，对应每一个抽气孔30均设有与该抽气孔30相邻的至少两个进气孔40，所述至少两个进气孔40与其所对应的抽气孔30之间的距离不同。此时，对于与同一个抽气孔30相邻的各个进气孔40，所述进气孔阀门50控制距离该抽气孔30近的进气孔40的进气流量大于距离该抽气孔30远的进气孔40的进气流量。
与此同时，所述进气孔阀门50还根据抽气孔30抽气的时长的不同控制所述进气孔40的进气流量相应变化，具体为，所述进气孔40的进气流量随着抽气孔30抽气的时长的增加而减小，优选地，所述进气孔40的进气流量的按照预设的比例逐渐减少。
进一步地，所述进气口阀门50还会在进气时长达到预设的进气总时长时控制所述进气孔40停止进气。一般情况下，所述抽气孔30的抽气过程先后依次为：慢抽阶段、抽气流量大于慢抽阶段的快抽阶段、工作腔10内气压不变的平衡阶段、以及抽气结束前的最终抽气阶段，其中慢抽阶段所述光刻胶溶剂挥发量最大阶段，通常所述预设的进气总时长等于所述慢抽阶段的时长。
具体地，为了保证较好的进气效果，优选所述进气孔40所在的平面略高于所述抽气孔30所在的平面，使得所述进气孔40通入的保护气能够被所述抽气孔30及时抽离。
请参阅图5，基于上述的减压干燥设备，本发明还提供一种减压干燥方法，包括如下步骤：
步骤S1、提供一减压干燥设备和一待干燥的基板20，所述减压干燥设备包括：工作腔10、工作台21、抽气孔30、进气孔40、以及进气孔阀门50；
所述工作台21设于所述工作腔10内，所述工作台21的四角分别设有一抽气孔30，对应每一个抽气孔30均设有至少一个与该抽气孔30相邻的进气孔40，每一个进气孔40上均设有一进气孔阀门50；
所述基板20放置于所述工作台21上，所述抽气孔30所在的平面高于所述工作台21的上表面且低于所述基板20的上表面。
具体地，所述基板20上涂布有光刻胶，所述光刻胶包括光刻胶溶剂。
步骤S2、所述抽气孔30抽气降低所述工作腔10内的压力使得所述基板20上的光刻胶溶剂挥发，并将挥发后的光刻胶溶剂抽离所述工作腔10；在所述抽气孔30抽气的同时，所述进气孔40在进气孔阀门50的控制下按照预设的进气流量向所述工作腔10内通入保护气，减少所述抽气孔30从所述基板20的边缘抽离挥发后的光刻胶溶剂的速度。
需要说明的是，在所述抽气孔30的抽气流量不变的情况下，在所述抽气孔30的抽气流量不变的情况下，所述进气孔40在所述抽气孔30周围通入了保护气，该些保护气在通入之后又会被抽气孔30抽出，进而导致抽气孔30抽出的气体中含有的光刻胶溶剂减少，也即本发明中所述抽气孔30的抽气量包括工作腔内的空气、挥发后的光刻胶溶剂、以及通入的保护气三个部分，相比于现有技术增加了保护气，在抽气流量不变时，原本应该被抽出的部分挥发后的光刻胶溶剂的被保护气代替，从而减少了所述抽气孔30从所述基板20的边缘的抽离挥发后的光刻胶溶剂的速度，最终使得所述基板20的边缘与所述基板20的中央的光刻胶溶剂的被抽离的速度一致，避免VCD mura的产生，保证后续显影制程的线宽的均匀性。
优选地，所述保护气为氮气、或惰性气体。
进一步地，所述步骤S2中通过进气孔阀门50控制各个进气孔40的进气流量，通过对所述进气孔40的进气流量的精确控制，避免进气过多影响挥发后的光刻胶溶剂排出，同时又保证进气量足够平衡基板20的中央和基板20的边缘光刻胶溶剂的抽离速度的差异，优选地，所述进气孔阀门50 为电磁控制阀门。
具体地，在本发明的优选实施例中，对应每一个抽气孔30均设有与该抽气孔30相邻的至少两个进气孔40，所述至少两个进气孔40与其所对应的抽气孔30之间的距离不同。此时，对于与同一个抽气孔30相邻的各个进气孔40，所述进气孔阀门50控制距离该抽气孔30近的进气孔40的进气流量大于距离该抽气孔30远的进气孔40的进气流量。
与此同时，所述进气孔阀门50还根据抽气孔30抽气的时长的不同控制所述进气孔40的进气流量相应变化，具体为，所述进气孔40的进气流量随着抽气孔30抽气的时长的增加而减小，优选地，所述进气孔40的进气流量的按照预设的比例逐渐减少。
进一步地，所述进气口阀门50还会在进气时长达到预设的进气总时长时控制所述进气孔40停止进气。一般情况下，所述抽气孔30的抽气过程先后依次为：慢抽阶段、抽气流量大于慢抽阶段的快抽阶段、工作腔10内气压不变的平衡阶段、以及抽气结束前的最终抽气阶段，其中慢抽阶段所述光刻胶溶剂挥发量最大阶段，通常所述预设的进气总时长等于所述慢抽阶段的时长。
具体地，为了保证较好的进气效果，优选所述进气孔40所在的平面略高于所述抽气孔30所在的平面，使得所述进气孔40通入的保护气能够被所述抽气孔30及时抽离。
综上所述，本发明提供一种减压干燥设备，包括：工作腔、工作台、抽气孔、进气孔、以及进气孔阀门，所述工作台设于所述工作腔内，所述工作台的四角分别设有一抽气孔，对应每一个抽气孔均设有至少一个与该抽气孔相邻的进气孔，每一个进气孔上均设有一进气孔阀门，通过在所述抽气孔抽气的同时由所述进气孔在所述抽气孔的周边通入保护气，减少所述抽气孔从基板的边缘抽离挥发后的光刻胶溶剂的速度，从而提升光刻胶溶剂挥发的均一性，避免因光刻胶溶剂挥发不均匀影响显影制程的线宽，保证显影制程的线宽的均匀性。本发明还提供一种减压干燥方法，能够提升光刻胶溶剂挥发的均一性，保证显影制程的线宽的均匀性。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (11)

  1. 一种减压干燥设备，包括：工作腔、工作台、抽气孔、进气孔、以及进气孔阀门；
    所述工作台设于所述工作腔内，所述工作台的四角分别设有一抽气孔，对应每一个抽气孔均设有至少一个与该抽气孔相邻的进气孔，每一个进气孔上均设有一进气孔阀门；
    所述工作台用于放置待干燥的基板，所述抽气孔所在的平面高于所述工作台的上表面且低于所述基板的上表面；
    所述抽气孔用于对所述工作腔进行抽气降压，所述进气孔用于向所述工作腔通入保护气，所述进气孔阀门用于控制各个进气孔的进气流量。
  2. 如权利要求1所述的减压干燥设备，其中，对应每一个抽气孔均设有与该抽气孔相邻的至少两个进气孔，所述至少两个进气孔与其所对应的抽气孔之间的距离不同。
  3. 如权利要求2所述的减压干燥设备，其中，对于与同一个抽气孔相邻的各个进气孔，所述进气孔阀门控制距离该抽气孔近的进气孔的进气流量大于距离该抽气孔远的进气孔的进气流量。
  4. 如权利要求1所述的减压干燥设备，其中，所述进气孔阀门控制所述进气孔的进气流量随着抽气孔抽气的时长的增加而减小。
  5. 如权利要求1所述的减压干燥设备，其中，所述进气孔阀门为电磁控制阀门。
  6. 一种减压干燥方法，包括如下步骤：
    步骤S1、提供一减压干燥设备和一待干燥的基板，所述减压干燥设备包括：工作腔、工作台、抽气孔、进气孔、以及进气孔阀门；
    所述工作台设于所述工作腔内，所述工作台的四角分别设有一抽气孔，对应每一个抽气孔均设有至少一个与该抽气孔相邻的进气孔，每一个进气孔上均设有一进气孔阀门；
    所述基板放置于所述工作台上，所述抽气孔所在的平面高于所述工作台的上表面且低于所述基板的上表面；
    步骤S2、所述抽气孔抽气降低所述工作腔内的压力使得所述基板上的光刻胶溶剂挥发，并将挥发后的光刻胶溶剂抽离所述工作腔；在所述抽气孔抽气的同时，所述进气孔在进气孔阀门的控制下按照预设的进气流量向所述工作腔内通入保护气，降低所述抽气孔从所述基板的边缘抽离挥发后 的光刻胶溶剂的速度。
  7. 如权利要求6所述的减压干燥方法，其中，所述步骤S1中，对应每一个抽气孔均设有与该抽气孔相邻的至少两个进气孔，所述至少两个进气孔与其所对应的抽气孔之间的距离不同。
  8. 如权利要求7所述的减压干燥方法，其中，所述步骤S2中，对于与同一个抽气孔相邻的各个进气孔，进气孔阀门控制距离该抽气孔近的进气孔的进气流量大于距离该抽气孔远的进气孔的进气流量。
  9. 如权利要求6所述的减压干燥方法，其中，所述步骤S2中，进气孔阀门控制所述进气孔的进气流量随着抽气孔抽气的时长的增加而减小。
  10. 如权利要求6所述的减压干燥方法，其中，所述步骤S1中，所述进气孔阀门为电磁控制阀门。
  11. 一种减压干燥设备，包括：工作腔、工作台、抽气孔、进气孔、以及进气孔阀门；
    所述工作台设于所述工作腔内，所述工作台的四角分别设有一抽气孔，对应每一个抽气孔均设有至少一个与该抽气孔相邻的进气孔，每一个进气孔上均设有一进气孔阀门；
    所述工作台用于放置待干燥的基板，所述抽气孔所在的平面高于所述工作台的上表面且低于所述基板的上表面；
    所述抽气孔用于对所述工作腔进行抽气降压，所述进气孔用于向所述工作腔通入保护气，所述进气孔阀门用于控制各个进气孔的进气流量；
    其中，对应每一个抽气孔均设有与该抽气孔相邻的至少两个进气孔，所述至少两个进气孔与其所对应的抽气孔之间的距离不同；
    其中，对于与同一个抽气孔相邻的各个进气孔，所述进气孔阀门控制距离该抽气孔近的进气孔的进气流量大于距离该抽气孔远的进气孔的进气流量；
    其中，所述进气孔阀门控制所述进气孔的进气流量随着抽气孔抽气的时长的增加而减小；
    其中，所述进气孔阀门为电磁控制阀门。
PCT/CN2017/098166 2017-07-18 2017-08-18 减压干燥设备及减压干燥方法 Ceased WO2019015006A1 (zh)

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