WO2019011126A1 - 一种电路板及其检测装置 - Google Patents

一种电路板及其检测装置 Download PDF

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Publication number
WO2019011126A1
WO2019011126A1 PCT/CN2018/093154 CN2018093154W WO2019011126A1 WO 2019011126 A1 WO2019011126 A1 WO 2019011126A1 CN 2018093154 W CN2018093154 W CN 2018093154W WO 2019011126 A1 WO2019011126 A1 WO 2019011126A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
test points
substrate
clearance area
probe
Prior art date
Application number
PCT/CN2018/093154
Other languages
English (en)
French (fr)
Inventor
陈宏辉
Original Assignee
惠科股份有限公司
重庆惠科金渝光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 惠科股份有限公司, 重庆惠科金渝光电科技有限公司 filed Critical 惠科股份有限公司
Priority to US16/330,096 priority Critical patent/US20190239342A1/en
Publication of WO2019011126A1 publication Critical patent/WO2019011126A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
    • H01R13/41—Securing in non-demountable manner, e.g. moulding, riveting by frictional grip in grommet, panel or base
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09418—Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09445—Pads for connections not located at the edge of the PCB, e.g. for flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display

Definitions

  • the present application relates to the field of display technologies, and in particular, to a circuit board and a detecting device thereof.
  • the display panel In order to ensure that the produced display has high image quality, low power, no radiation, stable display, etc., and the quality and performance are reliable, in the production process of the display screen, the display panel needs to be tested to determine whether the display panel is defective. . Therefore, after the preparation of the display panel is completed, the PCBI inspection of the liquid crystal display panel that has not been subjected to the packaging process is performed before the packaging process of the liquid crystal display panel is performed. When the PCBI detection is performed, the signal wire connecting the detector body is manually required. Plug into the connector on the printed circuit board (PCB), and after the PCBI test is completed, manually pull the signal wire out of the connector on the board. At present, PCBI testing is performed by this manual manual insertion and removal method.
  • PCB printed circuit board
  • manual manual insertion and removal method has the following drawbacks: manual manual insertion and removal is time-consuming and labor-intensive, and human resources are wasted, and the method of manually plugging and unplugging the signal wire easily damages the connector on the circuit board, thereby affecting the display product. Quality.
  • the inventor of the present application introduces a PCBI automatic detecting device in the PCBI detection of the display panel, and the design on the circuit board increases the detection.
  • the test signal is located on the connection circuit board by the detecting device to transmit the detection signal for automatic PCBI detection.
  • the size and production cost of the circuit board will increase. Under the customer's clear requirements on the size of the circuit board, the width of the circuit board cannot be directly increased to increase the test point. Automatic PCBI detection is not possible.
  • Embodiments of the present application provide a circuit board and a detecting device thereof, which can increase a plurality of test points for testing by designing on a circuit board, and design an improved position of the connector and the test point, and according to the designed circuit board.
  • the position of the connector and the test point is used to improve the detection device such that a plurality of test points are in contact with the detection device during the detection process to transmit a detection signal for automatic PCBI detection.
  • an embodiment of the present application provides a circuit board, the circuit board includes: a substrate; the connector includes a first side and a second side opposite to the first side, The connector is disposed on the substrate with a first side thereof adjacent to an edge of the substrate; a plurality of test points disposed on the substrate and arranged along a line along the second side, the plurality of The test points are used to contact the detecting device during the detection process for signal transmission.
  • the embodiment of the present application further provides another circuit board, the circuit board includes: a substrate; the connector includes a first side and a second side opposite to the first side, the connection The device is disposed on the substrate with a first side thereof adjacent to an edge of the substrate; a plurality of test points, the plurality of test points are identical in shape and size, disposed on the substrate and along the first The two side edges are arranged in a straight line, and the first component clearance area and the second component clearance area are respectively disposed on two sides of the plurality of test points, and the first component clearance area is located at the plurality of test points and the first Between the two sides, the plurality of test points are used to contact the detecting device during the detecting process for signal transmission.
  • the embodiment of the present application provides a detecting device for detecting the circuit board according to the first aspect and the second aspect, the detecting device includes: a fixed platform; and a detecting probe fixed to the fixed platform Above, for contacting the test points on the circuit board during the detection process for signal transmission.
  • the present application by designing the position of the connector on the circuit board, one side of the connector is installed along the edge of the circuit board; and a plurality of test points are designed on the circuit board, and a plurality of test points are along The other side of the connector is installed in a straight line arrangement.
  • the present application also improves the detection device in accordance with the design of the test points on the circuit board and the position of the connector to match the test device to the test points on the improved circuit board.
  • a plurality of test points are added in the design without increasing the size and manufacturing cost of the circuit board, and the improved placement position of the connector and the plurality of test points is designed to be in contact with the detecting device. Signal transmission realizes that the detecting device can contact and connect with the test point and transmit the detection signal for the purpose of automatic detection of PCBI, avoiding the problems caused by the connection detection by manual plugging, improving the quality of the display and reducing Production costs.
  • FIG. 1 is a schematic diagram of a circuit board according to an embodiment of the present application.
  • FIG. 2 is a schematic diagram of a detecting device provided by an embodiment of the present application.
  • FIG. 3 is a schematic diagram of a circuit board and a detecting device thereof according to an embodiment of the present application.
  • the display screen can be implemented in various forms.
  • the display screens described in the embodiments of the present application include, but are not limited to, display screens such as a thin film transistor liquid crystal display, an organic light emitting diode display, a liquid crystal display, a plasma display, a cathode ray tube display, and the like.
  • FIG. 1 is a schematic diagram of a circuit board according to an embodiment of the present application.
  • the circuit board 1 is provided with a substrate 30, a connector 40, a plurality of test points 50, and first element clearance areas 60 and 60'.
  • the connector 40 includes a first side 401 and a second side 402 disposed opposite the first side 401.
  • the connector 40 is disposed on the substrate 30 with a first side 401 adjacent the edge of the substrate 30.
  • a plurality of test points 50 are disposed on the substrate 30 and are arranged in a line along the second side 402 of the connector 40 for contacting the detecting device during the board detection process for signal Transmission detection.
  • the plurality of test points 50 can be, for example, square in shape and 0.3 mm in length.
  • the plurality of test points 50 can be, for example, circular, rectangular, or the like.
  • the plurality of test points are identical in shape and size.
  • the first component clearance area 60 and the second component clearance area 60' are respectively disposed on two sides of the plurality of test points 50, and the first component clearance area 60 is located at the plurality of test points 50 and the second side of the connector 40. Between sides 402.
  • the first element clearance area 60 and the second element clearance area 60' length match the total length of the plurality of test points.
  • the first element clearance area 60 and the second element clearance area 60' are each at least 1.15 mm wide, i.e., no components are placed in the range of 1.15 mm on both sides of the test point.
  • the position of the connector on the circuit board is improved by design without increasing the size and manufacturing cost of the circuit board, and multiple test points are added on the circuit board design, and a plurality of test points are along
  • the other side of the connector is installed in a straight line arrangement.
  • a component clearance area is provided on both sides of the test point to prevent the detection device from colliding with the components around the test point when the test device is connected to the test point and transmits the detection signal.
  • FIG. 2 is a schematic diagram of a detecting device provided by an embodiment of the present application.
  • the detecting device 2 is used to detect the circuit board 1 as described in the embodiment of Fig. 1.
  • the detecting device 2 is provided with a fixed platform 10 and a detecting probe 20; the detecting probe 20 is fixed on the fixed platform 10 for contacting with the test point 50 on the circuit board 1 during the detecting process for signal Transmission detection.
  • the fixed platform 10 is located above the detection probe 20 for fixing the detection probe 20, and the detection probe 20 can be fixedly mounted on the bottom of the fixed platform 10 in various ways.
  • the detection probe 20 can be secured to the bottom of the fixed platform 10 using a variety of fixed connections.
  • a fixed connection such as a screw fixed connection, an electromagnetic adsorption fixed connection, a welding fixed, a pivot connection, or the like.
  • the detection probe 20 includes a housing 201 and a probe 202. One end of the detecting probe 20 is fixedly coupled to one end of the fixed platform 10.
  • the housing 201 includes a body 2011, a cavity 2012 disposed in the body, and a through hole 2013 disposed on the body in communication with the cavity.
  • the probe 202 includes a probe body 2021 and a probe head 2022.
  • the probe body 2021 is disposed in the cavity 2012 and connected to the fixed platform 10.
  • the probe body 2021 has a cross-sectional dimension larger than the through hole 2013.
  • the size of the probe body 2021 is located in the cavity 2012; the probe head 2022 is exposed through the through hole 2013 from the housing 201, and the cross-sectional dimension of the probe head 2022 is The dimensions of the above-mentioned through holes 2013 are matched.
  • the probe head 2022 can be exposed from the body 2011 through the through hole 2013, and the length of the probe head 2022 passing through the through hole 2013 and exposed from the body 2011 can be translated by up and down the probe 202. Adjusting, the probe head 2022 is used for contacting the test point 50 on the circuit board 1 for signal transmission, and the through hole 2013 is disposed at a center position of the end of the body 2011 away from the fixed platform 10, the probe The needle 202 is disposed at a center position of the body 2011.
  • the end of the body head 2011 where the probe head 2022 is located is 1.6 mm long.
  • An end surface of the main body 2011 on which the probe head 2022 is located is defined as a bottom surface of the main body 2011, and the bottom surface faces a plurality of test points 50 on the circuit board 1 and the bottom surface is perpendicular to the connector 40
  • the length of the side is 1.6 mm; the two sides of the bottom surface parallel to the connector 40 are respectively formed as two vertical faces of the bottom surface along the body 2011, and the heights of the two vertical faces are both 4.5 mm, and the two vertical faces are
  • Components on one side reduce interference and enhance detection accuracy.
  • FIG. 3 is a schematic diagram of a circuit board and a detecting device thereof according to an embodiment of the present application.
  • the circuit board and its detecting device 3 comprise a circuit board 1 and a detecting device 2 for detecting the circuit board 1.
  • the circuit board 1 is provided with a connector 40 and a plurality of test points 50.
  • the connector 40 includes a first side 401 and a second side 402 disposed opposite the first side 401.
  • the connector 40 is disposed on the substrate 30 and the first side 401 thereof is adjacent to the edge of the substrate 30.
  • the plurality of test points 50 are used for contacting the detecting device during the board detecting process for signal transmission detection.
  • the plurality of test points 50 are square and have a length of 0.3 mm; the plurality of test points The shape and size are the same.
  • the first component clearance area 60 and the second component clearance area 60' are respectively disposed on two sides of the plurality of test points 50, and optionally, the first element clearance area 60 and the second element clearance area 60' have a length The total length of the test points matches.
  • the first element clearance area 60 and the second element clearance area 60' are each at least 1.15 mm wide, i.e., no components are placed in the range of 1.15 mm on both sides of the test point.
  • the detecting device 2 is configured to detect the circuit board as described in FIG.
  • the detecting device 2 is provided with a fixed platform 10 and a detecting probe 20 which is positioned above the detecting probe 20 for fixing the detecting probe 20.
  • the detection probe 20 includes a housing 201 and a probe 202.
  • the housing 201 includes a body 2011, a cavity 2012 disposed in the body, and a through hole 2013 disposed on the body in communication with the cavity.
  • the probe 202 further includes a probe body 2021 and a probe head 2022 having a cross-sectional dimension larger than the size of the through hole 2013 for limiting the probe body 2021 in the cavity 2012;
  • the cross-sectional dimension of the probe head 2022 matches the size of the through-hole 2013 described above for the probe head 2022 to be exposed through the through-hole 2013 from the housing 201.
  • the length of the probe head 2022 passing through the through hole 2013 and exposed from the body 2011 can be adjusted by translating the probe 202 up and down.
  • the probe head 2022 is used for the test point 50 on the circuit board 1. Contact for signal transmission.
  • the probe 202 is disposed at a center position of the body 2011.
  • the end of the body head 2011 where the probe head 2022 is located is 1.6 mm long.
  • An end surface of the main body 2011 on which the probe head 2022 is located is defined as a bottom surface of the main body 2011, and the bottom surface faces a plurality of test points 50 on the circuit board 1 and the bottom surface is perpendicular to the connector 40
  • the side length is 1.6 mm; since the probe 202 has a deviation in the accuracy of the detection probe 20 when it is in contact with the plurality of test points 50 on the circuit board 1, the bottom surface of the body 2011 and the connector 40 are required.
  • 0.5 mm is reserved for each side of the vertical side.
  • the length of the bottom side of the detecting probe 20 is 1.6 mm, 0.5 mm is required to be reserved before and after, respectively, the total required space for setting a plurality of test points 50 on the circuit board 1 is 2.6 mm, and optionally, the length of the test point It is 0.3 mm, so the first element clearance area 60 and the second element clearance area 60' width provided on both sides of the test point are at least 1.15 mm.
  • the two sides of the bottom surface parallel to the connector 40 are respectively formed as two vertical faces of the bottom surface along the body 2011, and the heights of the two vertical faces are both 4.5 mm, and the two vertical faces are used for avoiding the detecting device 2
  • it collides with the connector 40 and avoids collision with components located on the other side of the second component clearance area 60' away from the plurality of test points 50, thereby reducing interference. , to enhance the accuracy of the detection.
  • the position of the connector on the circuit board is improved by design without increasing the size and manufacturing cost of the circuit board, and multiple test points are added on the circuit board design, and multiple test points are connected along the connection.
  • One side of the unit is installed in a straight line arrangement.
  • the present application also improves the detection device in accordance with the design of the test points on the circuit board and the position of the connector to match the test device to the test points on the improved circuit board.
  • the embodiment of the present application is designed to increase a plurality of test points for testing on a circuit board, and to design an improved connector and a plurality of test point placement positions for contacting the detecting device for signal transmission, and implementing the detecting device and The test point can contact the connection and transmit the detection signal for the purpose of automatic PCBI detection, avoiding the problems caused by the connection detection by manual insertion and removal, improving the quality of the display and reducing the production cost.
  • the disclosed apparatus may be implemented in other manners.
  • the device embodiments described above are merely illustrative.
  • the division of the device is only a structural function division.
  • there may be another division manner for example, multiple devices or components may be combined or It can be integrated into another device, or some features can be ignored or not executed.
  • the mutual coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection through some interface, device or module, or an electrical, mechanical or other form of connection.

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Abstract

本申请公开了一种电路板及其检测装置，其中所述电路板包括：基板；连接器，所述连接器包括第一侧边和与该第一侧边相对设置的第二侧边，所述连接器设置在所述基板上且其第一侧边靠近所述基板的边沿；多个测试点，所述多个测试点设置在所述基板上且沿着所述第二侧边呈直线排布。所述检测装置，用于检测上述电路板，其包括：固定平台；检测探针，固定于所述固定平台上，用于在检测过程中与所述电路板上的测试点相接触以进行信号传输。

Description

一种电路板及其检测装置 技术领域
本申请涉及显示技术领域，尤其涉及一种电路板及其检测装置。
背景技术
随着科技和经济的持续发展，具备显示屏的智能手机、平板电脑、液晶电视等电子产品得到了空前普及，同时对这些电子产品的显示屏的质量、性能等方面也提出了越来越高的要求。因此，制备具有高画质、低功率、无辐射、显示稳定等优越特性的品质及性能可靠的显示屏成为占领液晶显示市场必不可少的竞争力之一。
为了确保生产出的显示屏具备高画质、低功率、无辐射、显示稳定等特点且品质、性能可靠，在显示屏的生产过程中，需要对显示面板进行检测，以确定显示面板是否存在缺陷。因此，在显示面板制备完成后，在进行液晶显示面板的封装制程之前，会对该尚未进行封装制程的液晶显示面板进行PCBI检测，在进行PCBI检测时，需要将连接检测机本体的信号线材手动插到印刷电路板(PCB，Printed Circuit Board)上的连接器(Connecter)上，并在PCBI检测完成后，又要手动将信号线材从电路板上的连接器中拔出。目前，PCBI检测皆是采用这种人工手动插拔的方式进行检测。但是，手动插拔方式存在以下缺陷：采用人工手动插拔方式进行检测费时耗力，浪费人力资源，而且手动插拔信号线材的方式容易对电路板上的连接器造成损伤，进而影响显示屏产品的品质。
为了解决现有技术中采用手动插拔方式来连接以进行检测而造成的问题，本申请发明人在对显示面板的PCBI检测中引入了PCBI自动检测设备，在电路板上设计增加了检测用的测试点，通过检测装置定位连接电路板上的测试点来传输检测讯号以进行PCBI自动检测。但由于在电路板上增加了测试点，会增加电路板的尺寸及生产成本，在客户对电路板的尺寸有明确的要求下，无法直接增加电路板的宽度来增加测试点，没有测试点则无法进行PCBI自动检测。
因此，在不增加电路板的尺寸的前提下，如何设计增加电路板上的测试点和设计连接器和测试点的位置，以及如何根据设计后的电路板上的连接器和测试点的位置来改进检测装置，以使检测装置与电路板上的测试点能匹配连接， 并传输检测讯号以进行PCBI自动检测，是本领域技术人员亟待解决的技术问题。
发明内容
本申请实施例提供一种电路板及其检测装置，可以通过在电路板上设计增加测试用的多个测试点，并设计改进连接器和测试点的位置，以及根据设计后的电路板上的连接器和测试点的位置来改进检测装置，以使多个测试点在检测过程中与所述检测装置相接触传输检测讯号以进行PCBI自动检测。
为了实现上述目的，一方面，本申请实施例提供了一种电路板，该电路板包括：基板；连接器，包括第一侧边和与该第一侧边相对设置的第二侧边，所述连接器设置在所述基板上且其第一侧边靠近所述基板的边沿；多个测试点，设置在所述基板上且沿着所述第二侧边呈直线排布，所述多个测试点用于在检测过程中与检测装置相接触以进行信号传输。
另一方面，本申请实施例还提供了另一种电路板，该电路板包括：基板；连接器，包括第一侧边和与该第一侧边相对设置的第二侧边，所述连接器设置在所述基板上且其第一侧边靠近所述基板的边沿；多个测试点，所述多个测试点的形状和大小均相同，设置在所述基板上且沿着所述第二侧边呈直线排布，所述多个测试点的两侧分别设有第一元件净空区和第二元件净空区，所述第一元件净空区位于所述多个测试点和所述第二侧边之间，所述多个测试点用于在检测过程中与检测装置相接触以进行信号传输。
又一方面，本申请实施例提供了一种检测装置，用于检测如第一方面及第二方面所述的电路板，该检测装置包括：固定平台；检测探针，固定于所述固定平台上，用于在检测过程中与所述电路板上的测试点相接触以进行信号传输。
本申请实施例通过设计改进电路板上的连接器的位置，将连接器的一侧边沿着电路板的边沿设置安装；并在电路板上设计增加多个测试点，将多个测试点沿着连接器的另一侧边呈直线排布设置安装。本申请还根据设计后的电路板上的测试点和连接器的位置情况相应改进了检测装置，以使所述检测装置与所改进后的电路板上的测试点匹配连接。本申请实施例在不增加电路板的尺寸及制作成本的前提下，设计增加了多个测试点，并设计改进连接器和多个测试点的放置位置用于与所述检测装置相接触以进行信号传输，实现了检测装置与测试点能接触连接并传输检测讯号，以进行PCBI自动检测的目的，避免以手动插 拔的方式来进行连接检测而造成的问题，提高了显示屏的品质以及降低了生产成本。
附图说明
为了更清楚地说明本申请实施例技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例提供的一种电路板的示意图；
图2是本申请实施例提供的一种检测装置的示意图；
图3是本申请实施例提供的一种电路板及其检测装置的示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
应当理解，当在本说明书和所附权利要求书中使用时，术语“包括”和“包含”指示所描述特征、整体、步骤、操作、元素和/或组件的存在，但并不排除一个或多个其它特征、整体、步骤、操作、元素、组件和/或其集合的存在或添加。
还应当理解，在此本申请说明书中所使用的术语仅仅是出于描述特定实施例的目的而并不意在限制本申请。如在本申请说明书和所附权利要求书中所使用的那样，除非上下文清楚地指明其它情况，否则单数形式的“一”、“一个”及“该”意在包括复数形式。
具体实现中，显示屏可以以各种形式来实施。例如，本申请实施例中描述的显示屏包括但不限于诸如薄膜晶体管液晶显示屏、有机发光二极管显示屏，液晶显示屏、等离子显示屏、阴极射线管显示屏等显示屏。
请参看图1，其是本申请实施例提供一种电路板的示意图。在本实施例中，该电路板1上设置有基板30、连接器40、多个测试点50以及第一元件净空区 60和60’。
连接器40包括第一侧边401和与该第一侧边401相对设置的第二侧边402，该连接器40设置在该基板30上且其第一侧边401靠近该基板30的边沿。
多个测试点50设置在该基板30上且沿着该连接器40的第二侧边402呈直线排布，该多个测试点用于在电路板检测过程中与检测装置相接触以进行信号传输检测。在一些实施例中，该多个测试点50可例如为正方形状，长为0.3毫米。在另一些实施例中，该多个测试点50可例如为圆形状，矩形状等。该多个测试点的形状和大小均相同。该多个测试点50的两侧分别设有第一元件净空区60和第二元件净空区60’，该第一元件净空区60位于该多个测试点50和该连接器40的第二侧边402之间。可选地，该第一元件净空区60和第二元件净空区60’长度与该多个测试点的总长度相匹配。可选地，该第一元件净空区60和第二元件净空区60’宽度均至少为1.15毫米，即在测试点两侧1.15毫米的范围内都不焊接放置任何元器件。
上述实施例中，在不增加电路板的尺寸及制作成本的前提下，通过设计改进电路板上的连接器的位置，并在电路板上设计增加多个测试点，将多个测试点沿着连接器的另一侧边呈直线排布设置安装。并在测试点两侧均设有元件净空区，以防止检测装置在与测试点连接并传输检测信号时，与测试点周围的元器件接触碰撞产生干扰。
请参看图2，其是本申请实施例提供的一种检测装置的示意图。在本实施例中，该检测装置2用于检测如图1实施例中所述的电路板1。该检测装置2设置有固定平台10、检测探针20；该检测探针20固定于该固定平台10上，用于在检测过程中与所述电路板1上的测试点50相接触以进行信号传输检测。
固定平台10位于该检测探针20的上方用于固定该检测探针20，并且该检测探针20可以采用多种方式被固定安装在固定平台10的底部。因此，在多个实施例中，可以采用多种固定连接方式将检测探针20固定在固定平台10底部。例如螺纹固定连接、电磁吸附固定连接、焊接固定、枢接固定等固定连接方式。
检测探针20包括壳体201和探针202。检测探针20的一端与固定平台10的一端固定连接。壳体201包括本体2011、设置于本体内的空腔2012、以及设置于本体上与所述空腔连通的通孔2013。该探针202包括探针本体2021和探针头部2022，该探针本体2021置于该空腔2012内且与该固定平台10相连，该探 针本体2021的横截面尺寸大于该通孔2013的尺寸，用于限制该探针本体2021位于该空腔2012内；该探针头部2022穿过该通孔2013而从该壳体201裸露出来，该探针头部2022的横截面尺寸与上述通孔2013的尺寸相匹配。该探针头部2022可穿过该通孔2013而从该本体2011露出来，该探针头部2022穿过该通孔2013而从该本体2011裸露出来的长度可通过上下平移该探针202进行调整，该探针头部2022用于与该电路板1上测试点50相接触以进行信号传输，该通孔2013设置在该本体2011远离该固定平台10的一端的中心位置上，该探针202设置于该本体2011的中心位置上。在一些可行的实施例中，该本体2011上该探针头部2022所在的一端长为1.6毫米。将该本体2011上的该探针头部2022所在的一端面定义为该本体2011的底面，则该底面面向着电路板1上的多个测试点50且该底面与该连接器40垂直的侧边长度为1.6毫米；将该底面与该连接器40平行的两侧边分别沿着该本体2011向上做底面的两个垂直面，该两个垂直面的高度均为4.5毫米，该两垂直面用于避免所述检测装置2与所述电路板1上的多个测试点50相接触检测时碰撞到连接器40以及避免碰撞到位于第二元件净空区60’远离多个测试点50的另一侧上的元器件，进而减少干扰，增强检测的精确度。
请参看图3，其是本申请实施例提供的一种电路板及其检测装置的示意图。具体地，所述电路板及其检测装置3包括电路板1以及用于检测电路板1的检测装置2。
如图1所示，所述电路板1设置有连接器40、多个测试点50。该连接器40包括第一侧边401和与该第一侧边401相对设置的第二侧边402，该连接器40设置在该基板30上且其第一侧边401靠近该基板30的边沿；该多个测试点50用于在电路板检测过程中与检测装置相接触以进行信号传输检测，可选地，该多个测试点50呈正方形状，长为0.3毫米；该多个测试点的形状和大小均相同。该多个测试点50的两侧分别设有第一元件净空区60和第二元件净空区60’，可选地，该第一元件净空区60和第二元件净空区60’长度与该多个测试点的总长度相匹配。可选地，该第一元件净空区60和第二元件净空区60’宽度均至少为1.15毫米，即在测试点两侧1.15毫米的范围内都不焊接放置任何元器件。
所述检测装置2，用于检测如图1所述的电路板。该检测装置2设置有固定平台10、检测探针20，该固定平台10位于该检测探针20的上方用于固定该检 测探针20。该检测探针20包括壳体201和探针202。该壳体201包括本体2011、设置于本体内的空腔2012、以及设置于本体上与所述空腔连通的通孔2013。该探针202还包括探针本体2021和探针头部2022，该探针本体2021的横截面尺寸大于上述通孔2013的尺寸，用于限制该探针主体2021位于该空腔2012内；该探针头部2022的横截面尺寸与上述通孔2013的尺寸相匹配，用于该探针头部2022可穿过该通孔2013而从该壳体201裸露出来。该探针头部2022穿过该通孔2013而从该本体2011裸露出来的长度可通过上下平移该探针202进行调整，该探针头部2022用于与该电路板1上测试点50相接触以进行信号传输。该探针202设置于该本体2011的中心位置上。
在一些可行的实施例中，该本体2011上该探针头部2022所在的一端长为1.6毫米。将该本体2011上的该探针头部2022所在的一端面定义为该本体2011的底面，则该底面面向着电路板1上的多个测试点50且该底面与该连接器40垂直的侧边长度为1.6毫米；由于探针202在与电路板1上的多个测试点50相接触时存在检测探针20仪器精度上的偏差，因此，需要在该本体2011底面与该连接器40的垂直的侧边前后分别预留0.5毫米。由于检测探针20底面侧边长度为1.6毫米，前后分别需要预留0.5毫米，因此，在电路板1上设置多个测试点50的总需求空间为2.6毫米，可选地，该测试点长度为0.3毫米，因此，在测试点的两侧设置的第一元件净空区60和第二元件净空区60’宽度均至少为1.15毫米。将该底面与该连接器40平行的两侧边分别沿着该本体2011向上做底面的两个垂直面，该两个垂直面的高度均为4.5毫米，该两垂直面用于避免检测装置2与电路板1上的多个测试点50相接触检测时碰撞到连接器40以及避免碰撞到位于第二元件净空区60’远离多个测试点50的另一侧上的元器件，进而减少干扰，增强检测的精确度。
上述实施例中，在不增加电路板的尺寸及制作成本的前提下，通过设计改进电路板上的连接器位置，并在电路板上设计增加多个测试点，将多个测试点沿着连接器的一侧呈直线排布设置安装。本申请还根据设计后的电路板上的测试点和连接器的位置情况相应改进了检测装置，以使所述检测装置与所改进后的电路板上的测试点匹配连接。本申请实施例在电路板上设计增加测试用的多个测试点，并设计改进连接器和多个测试点的放置位置用于与所述检测装置相接触以进行信号传输，实现了检测装置与测试点能接触连接并传输检测讯号以 进行PCBI自动检测的目的，避免以手动插拔的方式来进行连接检测而造成的问题，提高了显示屏的品质以及降低了生产成本。
在本申请所提供的几个实施例中，应该理解到，所揭露的装置，可以通过其它的方式实现。例如，以上所描述的装置实施例仅仅是示意性的，例如，所述装置的划分，仅仅为一种结构功能划分，实际实现时可以有另外的划分方式，例如多个装置或组件可以结合或者可以集成到另一个装置，或一些特征可以忽略，或不执行。另外，所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口、装置或模块的间接耦合或通信连接，也可以是电的，机械的或其它的形式连接。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到各种等效的修改或替换，这些修改或替换都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (20)

  1. 一种电路板，包括：
    基板；
    连接器，包括第一侧边和与该第一侧边相对设置的第二侧边，所述连接器设置在所述基板上且其第一侧边靠近所述基板的边沿；以及
    多个测试点，设置在所述基板上且沿着所述第二侧边呈直线排布，所述多个测试点用于在检测过程中与检测装置相接触以进行信号传输。
  2. 根据权利要求1所述的电路板，其中，所述多个测试点的两侧分别设有第一元件净空区和第二元件净空区，所述第一元件净空区位于所述多个测试点和所述第二侧边之间。
  3. 根据权利要求2所述的电路板，其中，所述第一元件净空区宽度至少为1.15毫米。
  4. 根据权利要求2所述的电路板，其中，所述第一元件净空区长度与所述多个测试点的总长度相匹配。
  5. 根据权利要求2所述的电路板，其中，所述第二元件净空区宽度至少为1.15毫米。
  6. 根据权利要求2所述的电路板，其中，所述第二元件净空区长度与所述多个测试点的总长度相匹配。
  7. 根据权利要求1所述的电路板，其中，所述多个测试点的形状和大小均相同。
  8. 根据权利要求1所述的电路板，其中，所述测试点呈正方形状。
  9. 根据权利要求1所述的电路板，其中，所述测试点的边长至少为0.3毫米。
  10. 根据权利要求1所述的电路板，其中，所述连接器设置在所述基板上且其第一侧边靠近所述基板的长边沿。
  11. 一种电路板，包括：
    基板；
    连接器，包括第一侧边和与该第一侧边相对设置的第二侧边，所述连接器设置在所述基板上且其第一侧边靠近所述基板的边沿；以及
    多个测试点，所述多个测试点的形状和大小均相同，设置在所述基板上且沿着所述第二侧边呈直线排布，所述多个测试点的两侧分别设有第一元件净空 区和第二元件净空区，所述第一元件净空区位于所述多个测试点和所述第二侧边之间，所述多个测试点用于在检测过程中与检测装置相接触以进行信号传输。
  12. 根据权利要求11所述的电路板，其中，所述第一元件净空区长度与所述多个测试点的总长度相匹配。
  13. 根据权利要求11所述的电路板，其中，所述第一元件净空区宽度至少为1.15毫米。
  14. 一种检测装置，用于检测如权利要求1-13任一项所述的电路板，包括：
    固定平台；以及
    检测探针，固定于所述固定平台上，用于在检测过程中与所述电路板上的测试点相接触以进行信号传输。
  15. 根据权利要求14所述的检测装置，其中，所述检测探针包括：
    壳体，包括与所述固定平台相连的本体、设置于本体内的空腔、以及设置于本体上与所述空腔连通的通孔；以及
    探针，包括探针本体和探针头部，所述探针本体置于所述空腔内且与所述固定平台相连，所述探针头部穿过所述通孔而从所述壳体裸露出来。
  16. 根据权利要求15所述的检测装置，其中，所述通孔位于所述本体远离所述固定平台的一端的中心位置上。
  17. 根据权利要求15所述的检测装置，其中，所述本体上所述探针头部所在的一端长为1.6毫米。
  18. 根据权利要求15所述的检测装置，其中，所述本体的左右两侧高各长为4.5毫米。
  19. 根据权利要求15所述的检测装置，其中，所述探针本体的横截面尺寸大于所述通孔的尺寸以将所述探针本体限制在所述空腔内。
  20. 根据权利要求15所述的检测装置，其中，所述探针头部的横截面尺寸与所述通孔的尺寸相匹配。
PCT/CN2018/093154 2017-07-12 2018-06-27 一种电路板及其检测装置 WO2019011126A1 (zh)

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