WO2019000216A1 - 基板清洗装置 - Google Patents

基板清洗装置 Download PDF

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Publication number
WO2019000216A1
WO2019000216A1 PCT/CN2017/090298 CN2017090298W WO2019000216A1 WO 2019000216 A1 WO2019000216 A1 WO 2019000216A1 CN 2017090298 W CN2017090298 W CN 2017090298W WO 2019000216 A1 WO2019000216 A1 WO 2019000216A1
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WIPO (PCT)
Prior art keywords
water
cleaning
substrate
carrying container
light
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PCT/CN2017/090298
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English (en)
French (fr)
Inventor
徐顺龙
谢忠伟
Original Assignee
深圳市柔宇科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 深圳市柔宇科技有限公司 filed Critical 深圳市柔宇科技有限公司
Priority to CN201780047281.8A priority Critical patent/CN109564886B/zh
Priority to PCT/CN2017/090298 priority patent/WO2019000216A1/zh
Publication of WO2019000216A1 publication Critical patent/WO2019000216A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere

Definitions

  • the present application relates to the field of semiconductor manufacturing technology, and in particular, to a substrate cleaning device.
  • the substrate In the manufacturing process of the panel, when the lithography pattern is used on the substrate by photolithography, the substrate needs to be cleaned first to ensure the film formation quality.
  • the cleaning process includes a water cleaning process in which the water is recycled. Since the water in the container is prone to bacteria, bacteria will be carried to the substrate during circulation, causing contamination of the substrate.
  • the application provides a substrate cleaning device.
  • a substrate cleaning device comprising a light cleaning chamber, a circulating water cleaning device and a water carrying container; the light cleaning chamber is for performing light cleaning on the substrate, and accommodating ozone generated during the light cleaning process, the light
  • the cleaning chamber is in communication with the water carrying container, so that the ozone can be introduced into the water carrying container to sterilize and disinfect the water in the water carrying container; the water in the water carrying container can flow into the circulating water
  • the cleaning device is configured to perform water cleaning on the substrate by the circulating water cleaning device.
  • the excess water generated in the light cleaning chamber is introduced into the water carrying container to sterilize the water carrying container, thereby ensuring that the water used in the circulating water cleaning device is clean and clean, thereby ensuring clean and sterilizing of the substrate; Excess ozone is also effectively utilized to avoid the pollution caused by the direct discharge of excess ozone.
  • FIG. 1 is a schematic structural view of a substrate cleaning apparatus according to an embodiment of the present application.
  • FIG. 2 is a schematic view showing the mounting structure of the ozone concentration detecting device of the embodiment of the present application.
  • the embodiment of the present application provides a substrate cleaning device for cleaning a substrate.
  • the cleaning may include light washing and water washing.
  • the light cleaning refers to a process in which the substrate 100 is irradiated with light to oxidize the organic contaminants adhering to the substrate to be separated from the substrate.
  • the water cleaning refers to the process of using water to rinse the substrate to carry away contaminants.
  • the substrate cleaning apparatus 10 of the first embodiment includes a light cleaning chamber 11, a circulating water cleaning device 17, and a water carrying container 15.
  • the light cleaning chamber 11 is for performing light cleaning of the substrate 100 and accommodating ozone generated during the light cleaning process.
  • the light cleaning chamber 11 communicates with the water carrying container 15 so that ozone can be introduced into the water carrying container 15 to sterilize and disinfect the water in the water carrying container 15.
  • the water in the water carrying tank 15 can flow into the circulating water washing device 17 for the circulating water washing device 17 to perform water washing on the substrate 100.
  • the light cleaning chamber 11 is a place where the substrate 100 is light-cleaned.
  • a loading platform can be disposed in the light cleaning chamber 11, and a roller 113 is mounted on the loading platform, and the roller 113 carries and transports the substrate 100 for light cleaning.
  • the substrate 100 can also be transported by other transport mechanisms, such as by a translatable carrier, the substrate 100 being stationary relative to the carrier.
  • An excimer ultraviolet light source 111 may be disposed in the light cleaning chamber 11, and the excimer ultraviolet light source 111 emits excimer ultraviolet light. Under the action of excimer ultraviolet light, the air in the light cleaning chamber 11 generates ozone, which oxidizes organic pollutants (hydrocarbons) on the substrate 100, so that the organic pollutant macromolecules are decomposed into easy separation from the substrate 100. Small molecules (including carbon dioxide and water vapor).
  • the optical cleaning using the excimer ultraviolet light source 111 eliminates the need to contact the substrate 100, avoids secondary contamination of the substrate 100, and does not require drying after light cleaning.
  • the use of the excimer ultraviolet light source 111 for light cleaning can thoroughly remove organic contaminants, so that the surface of the substrate 100 reaches "atomic cleanliness", and the uniformity of the cleaning process is uniform. The high reliability and high yield of the substrate 100 are ensured. In other embodiments, other light sources can be employed.
  • the light cleaning chamber 11 may be filled with an inert gas to protect the light cleaning process from occurrence of an explosion such as an explosion of an active gas (such as oxygen) generated in the light cleaning chamber 11.
  • the inert gas may be nitrogen.
  • the cleaning device 10 may include an inert gas supply device for supplying an inert gas to the light cleaning chamber 11.
  • the circulating water washing device 17 is for performing water washing on the substrate 100, and the water washing process is performed after light washing.
  • the circulating water cleaning device 17 can adopt the method of water-gas two-fluid cleaning, that is, the circulating water cleaning device 17 can include a pipeline 171, and the pipeline 171 can be provided with a plurality of nozzles. Water and air are respectively introduced into both ends of the pipe 171, and water and air are mixed to generate small water droplets, and small water droplets are sprayed from the nozzle onto the substrate 100 to perform water cleaning on the substrate 100.
  • the circulating water cleaning device 17 can be in other configurations. The water used in the circulating water washing device 17 comes from the water carrying container 15 and is recycled.
  • the water carrying container 15 contains water for supplying the circulating water washing device 17, and the water enters the circulating water washing device 17 for water washing, and then flows back to the water carrying container 15 to form a circulation.
  • the water in the water carrying container 15 will breed bacteria, and during the circulation of the water, the bacteria will be carried onto the substrate 100, causing contamination of the substrate 100.
  • the water carrying container 15 communicates with the light cleaning chamber 11, and the ozone generated in the light cleaning chamber 11 is excessive after participating in the light cleaning, and is introduced into the water carrying container 15. Since ozone can destroy the structure of the microbial membrane by oxidation, the ozone flowing into the water carrying tank 15 can sterilize the water in the water carrying tank 15 to clean the water. Therefore, bacteria are not introduced into the substrate 100 during the water washing process, and the cleanliness of the substrate 100 is ensured.
  • the excess water generated in the light cleaning chamber 11 is introduced into the water carrying container 15 to sterilize the water carrying container 15 to ensure that the water used in the circulating water cleaning device 17 is clean and clean.
  • the clean and sterility of the substrate 100 is ensured; and the excess ozone is also effectively utilized to avoid the pollution caused by the direct discharge of excess ozone.
  • an ozone concentration detecting device is provided in the light cleaning chamber 11.
  • a current limiting device 12 is provided between the light cleaning chamber 11 and the water carrying container 15.
  • the substrate cleaning apparatus 10 further includes control means for controlling the current limiting means 12 to be turned on or off in accordance with the concentration value of the ozone detected by the ozone concentration detecting means to connect or block the light cleaning chamber 11 and the water carrying container 15.
  • the ozone concentration detecting device detects the ozone concentration in the light cleaning chamber 11 and feeds back the detection result to the control device.
  • the ozone concentration detecting device includes, but is not limited to, an ozone detector.
  • the flow restricting device 12 is for controlling the flow rate of the fluid (including water vapor, carbon dioxide, ozone, etc.) that enters the water carrying container 15 by the light cleaning chamber 11.
  • the flow restricting device 12 includes, but is not limited to, a restrictor valve, and the restrictor valve is safe and reliable, and is mature in use.
  • the control unit is used for signal processing and to control the operation of other components.
  • a concentration threshold may be preset within the control device, the concentration threshold being used to measure the concentration of ozone in the cleaning chamber, the concentration threshold being an ozone concentration value required to ensure a better light cleaning effect.
  • the concentration threshold can be set according to actual needs.
  • the control device controls the current limiting device 12 to be turned off, so that the ozone is oxidized and washed, and cannot flow into the water carrying container 15.
  • the control device controls the current limiting device 12 to be turned on so that ozone can flow into the water carrying container 15.
  • the ozone concentration detecting device 114 is mounted on the axle of the roller 113 in the light cleaning chamber 11.
  • the purpose of such a design is that the ozone concentration in the light cleaning chamber 11 is different, and the ozone concentration in the vicinity of the substrate 100 is required to reach a certain value to ensure a good oxidation cleaning effect. Therefore, it is necessary to detect the ozone concentration in the vicinity of the substrate 100.
  • the ozone concentration detecting device 114 by mounting the ozone concentration detecting device 114 on the wheel shaft 112 of the roller 113 (the substrate 100 is carried on the roller 113), the ozone concentration in the vicinity of the substrate 100 can be detected.
  • the light cleaning chamber 11 also houses carbon dioxide generated during the light cleaning process.
  • the substrate cleaning device 10 may further include a filtering device 13 that communicates with the light cleaning chamber 11 and the water carrying container 15 for filtering carbon dioxide.
  • the carbon dioxide produced by the light cleaning can also enter the water carrying container 15 along with the ozone. If it is not filtered, carbon dioxide is brought into contact with the substrate 100 through the water carrying container 15-cycle water washing device 17, and the film on the substrate 100 is oxidized and destroyed. Therefore, by increasing the filtration device 13, carbon dioxide can be effectively removed, and the film formation quality of the substrate 100 can be ensured.
  • the filtering device 13 is provided between the current limiting device 12 and the water carrying container 15. In other embodiments, the filtering device 13 can be disposed prior to the current limiting device 12.
  • the filtering device 13 may be an lye container containing an alkaline solution. Profit The carbon dioxide is absorbed by the alkaline solution, and the filtering effect is good and the cost is low. In other embodiments, other materials and/or structures having carbon dioxide adsorption capabilities may be employed.
  • the substrate cleaning apparatus 10 may further include an air suction device 14 disposed between the filtration device 13 and the water carrying container 15 .
  • the air extracting device 14 is for drawing ozone flowing through the filtering device 13 into the water carrying container 15. By increasing the air suction device 14, ozone can be quickly and sufficiently introduced into the water carrying container 15, which shortens the process time.
  • the control device can perform operation control on the air suction device 14. Under the control of the control device, when the current limiting device 12 is turned on, the air extracting device 14 is also turned on; when the current limiting device 12 is turned off, the air extracting device 14 is also turned off.
  • the air extraction device 14 includes, but is not limited to, a vacuum pump.
  • the cleaning device 10 may further include a cleaning water jet 16.
  • Deionized water flows through the washing water jet 16 for water washing in the circulating water washing device 17, and then the substrate 100 is again washed with water.
  • the substrate 100 can be further cleaned by the cleaning of the water jet 16 again.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Physical Water Treatments (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

提供了一种基板清洗装置（10），包括光清洗室（11）、循环水清洗装置（17）及载水容器（15）；光清洗室（11）用于对基板（100）进行光清洗，并容纳在光清洗的过程中生成的臭氧，光清洗室（11）与载水容器（15）连通，使得臭氧能够导入载水容器（15），以对载水容器（15）内的水进行杀菌消毒；载水容器（15）内的水能够流入循环水清洗装置（17），以供循环水清洗装置（17）对基板（100）进行水清洗。通过将光清洗室内生成的多余臭氧导入载水容器，对载水容器进行杀菌消毒，保证了循环水清洗装置所用的水干净清洁，从而能够确保基板的洁净无菌；并且，也对多余的臭氧进行了有效利用，避免了多余臭氧直接排出造成的污染。

Description

基板清洗装置 技术领域
本申请涉及半导体制造技术领域，尤其涉及一种基板清洗装置。
背景技术
在面板的制造过程中，使用光刻技术在基板上光刻图案时，需要先对基板进行清洗，才能保证成膜质量。清洗工艺包括水清洗环节，此环节中的水为循环使用。由于容器中的水容易滋生细菌，在循环流动的过程中，细菌将被带到基板，造成基板污染。
发明内容
本申请提供了一种基板清洗装置。
一种基板清洗装置，包括光清洗室、循环水清洗装置及载水容器；所述光清洗室用于对基板进行光清洗，并容纳在所述光清洗的过程中生成的臭氧，所述光清洗室与所述载水容器连通，使得所述臭氧能够导入所述载水容器，以对所述载水容器内的水进行杀菌消毒；所述载水容器内的水能够流入所述循环水清洗装置，以供所述循环水清洗装置对所述基板进行水清洗。
本申请的方案，通过将光清洗室内生成的多余臭氧导入载水容器，对载水容器进行杀菌消毒，保证了循环水清洗装置所用的水干净清洁，从而能够确保基板的洁净无菌；并且，也对多余的臭氧进行了有效利用，避免了多余臭氧直接排出造成的污染。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例的基板清洗装置的结构示意图；
图2是本申请实施例的臭氧浓度检测装置的安装结构示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例是本申请的一部分实施例，而不是全部实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动的前提下所获得的所有其他实施例，都应属于本申请保护的范围。
本申请实施例提供了一种基板清洗装置，用于对基板进行清洗。所述清洗可以包括光清洗和水清洗。所述光清洗指使用光线照射基板100，使黏附在基板上的有机污染物发生氧化而与基板分离的过程。所述水清洗指使用水来冲洗基板，以带走污染物的过程。
如图1所示，本第一实施例的基板清洗装置10包括光清洗室11、循环水清洗装置17及载水容器15。光清洗室11用于对基板100进行光清洗，并容纳在光清洗的过程中生成的臭氧。光清洗室11与载水容器15连通，使得臭氧能够导入载水容器15，以对载水容器15内的水进行杀菌消毒。载水容器15内的水能够流入循环水清洗装置17，以供循环水清洗装置17对基板100进行水清洗。
具体的，光清洗室11是对基板100进行光清洗的场所。光清洗室11内可设置承载台，承载台上安装有滚轮113，滚轮113承载并传送基板100，以进行光清洗。也可以通过其他传送机构来传送基板100，例如通过可平移的承载台传送基板100，基板100相对承载台静止。
光清洗室11内可设置准分子紫外光源111，准分子紫外光源111发射准分子紫外光线。在准分子紫外光线的作用下，光清洗室11内的空气会产生臭氧，臭氧将基板100上的有机污染物(碳氢化合物)氧化，使得有机污染物大分子分解成容易从基板100上分离的小分子(包括二氧化碳和水蒸气)。采用准分子紫外光源111进行光清洗可以不用接触基板100，避免了二次污染基板100，且在光清洗后不必进行干燥。采用准分子紫外光源111进行光清洗可彻底有机污染物，使基板100表面达到“原子清洁度”，并且清洗处理的均匀度一致， 保证了基板100的高可靠性和高成品率。在其他实施例中，可以采用其他光源。
光清洗室11内可填充惰性气体，以保护光清洗过程，防止出现光清洗室11内生成的活泼气体(如氧气)爆炸等异常。所述惰性气体可以是氮气。本实施例中，清洗装置10可以包括惰性气体供应装置，用于向光清洗室11提供惰性气体。
循环水清洗装置17用于对基板100进行水清洗，水清洗处理在光清洗之后进行。本实施例中，循环水清洗装置17可以采用水气二流体清洗的方式，即循环水清洗装置17可以包括管路171，管路171上可设有多个喷嘴。管路171的两端分别通入水和空气，水与空气混合之后生成小水珠，小水珠从喷嘴中喷到基板100上，对基板100进行水清洗。在其他实施例中，循环水清洗装置17可以是其他结构形式。循环水清洗装置17所使用的水来自载水容器15，并且是循环利用的。
载水容器15内盛装有供应循环水清洗装置17的水，水进入循环水清洗装置17中进行水清洗之后，又流回到载水容器15，形成循环。在实际工艺中，载水容器15内的水会滋生细菌，在水的循环流动过程中，细菌将被带到基板100上，造成基板100污染。载水容器15与光清洗室11连通，光清洗室11内生成的臭氧在参与光清洗之后仍有多余，就会导入载水容器15。由于臭氧能够通过氧化作用破坏微生物膜的结构，因此流入载水容器15的臭氧能对载水容器15内的水进行杀菌，使水变得清洁。因而，在进行水清洗处理时不会将细菌引入到基板100，保证了基板100的洁净度。
由此，本实施例的方案，通过将光清洗室11内生成的多余臭氧导入载水容器15，对载水容器15进行杀菌消毒，保证了循环水清洗装置17所用的水干净清洁，从而能够保证基板100的洁净无菌；并且，也对多余的臭氧进行了有效利用，避免了多余臭氧直接排出造成的污染。
进一步的，光清洗室11内设有臭氧浓度检测装置。其中，如图1所示，光清洗室11与载水容器15之间设有限流装置12。基板清洗装置10还包括控制装置，控制装置用于根据臭氧浓度检测装置所检测到的臭氧的浓度值，控制限流装置12开启或关闭，以连通或阻隔光清洗室11与载水容器15。
具体的，臭氧浓度检测装置用于检测光清洗室11内的臭氧浓度，并向控制装置反馈检测结果。臭氧浓度检测装置包括但不限于为臭氧检测仪。限流装置12用于控制由光清洗室11进入载水容器15的流体(包括水蒸气、二氧化碳、臭氧等)的流速。限流装置12包括但不限于为限流阀，限流阀安全可靠、使用成熟。控制装置则用于进行信号处理，对其他部件进行工作控制。例如，控制装置内可预设浓度阈值，所述浓度阈值用于衡量清洗室内的臭氧浓度高低，所述浓度阈值为保证较好的光清洗效果所需要的臭氧浓度值。所述浓度阈值可以根据实际需要予以设定。当臭氧浓度检测装置检测到清洗室内的臭氧浓度小于或等于所述浓度阈值时，这表明清洗室内的臭氧较少，需要优先保证光清洗所需。此时，控制装置控制限流装置12关闭，使得臭氧进行氧化清洗，而无法流入载水容器15。反之，当臭氧浓度检测装置检测到清洗室内的臭氧浓度大于所述浓度阈值时，这表明清洗室内的臭氧较多，可以释放多余的臭氧进行杀菌消毒。此时，控制装置控制限流装置12开启，使得臭氧可以流入载水容器15。
进一步的，如图2所示，臭氧浓度检测装置114装在光清洗室11内的滚轮113的轮轴上。如此设计的目的在于：光清洗室11内各处的臭氧浓度有差异，而基板100附近的臭氧浓度要达到一定值，才能保证较好的氧化清洗效果，因此需要检测基板100附近的臭氧浓度。本实施例中，通过将臭氧浓度检测装置114装在滚轮113的轮轴112上(基板100承载在滚轮113之上)，就能够检测到基板100附近的臭氧浓度。
进一步的，如图1所示，光清洗室11还容纳有所述光清洗过程中生成的二氧化碳。其中，基板清洗装置10还可以包括连通光清洗室11与载水容器15的过滤装置13，用于过滤二氧化碳。在实际工艺中，光清洗所产生的二氧化碳也可以随臭氧一起进入载水容器15。若不对其进行过滤，二氧化碳就会通过载水容器15-循环水清洗装置17接触到基板100，氧化破坏基板100上的膜层。因此，通过增加过滤装置13能够有效去除二氧化碳，保证基板100的成膜品质。本实施例中，优选的，过滤装置13设在限流装置12与载水容器15之间。在其他实施例中，过滤装置13可以设在限流装置12之前。
进一步的，过滤装置13可以是碱液容器，碱液容器盛装有碱性溶液。利 用碱性溶液吸收二氧化碳，过滤效果好，成本低廉。在其他实施例中，可以采用其他具有吸附二氧化碳功能的材料和/或结构。
进一步的，如图1所示，基板清洗装置10还可以包括设于过滤装置13与载水容器15之间的抽气装置14。抽气装置14用于将流经过滤装置13的臭氧抽入载水容器15。通过增加抽气装置14，能够快速、充分地将臭氧导入载水容器15，缩短了制程时间。本实施例中，控制装置能够对抽气装置14进行工作控制。在控制装置的控制下，当限流装置12开启时，抽气装置14也开启；当限流装置12关闭时，抽气装置14也关闭。本实施例中，抽气装置14包括但不限于为真空泵。
进一步的，如图1所示，清洗装置10还可以包括清洗水刀16。清洗水刀16内流通有去离子水(Deionized Water)，用于在循环水清洗装置17进行水清洗之后，对基板100再次进行水清洗。通过清洗水刀16的再次清洗，能够进一步洁净基板100。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易的想到各种等效的修改或替换，这些修改或替换都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (10)

  1. 一种基板清洗装置，其特征在于，
    包括光清洗室、循环水清洗装置及载水容器；所述光清洗室用于对基板进行光清洗，并容纳在所述光清洗的过程中生成的臭氧，所述光清洗室与所述载水容器连通，使得所述臭氧能够导入所述载水容器，以对所述载水容器内的水进行杀菌消毒；所述载水容器内的水能够流入所述循环水清洗装置，以供所述循环水清洗装置对所述基板进行水清洗。
  2. 根据权利要求1所述的基板清洗装置，其特征在于，
    所述光清洗室内设有臭氧浓度检测装置，所述光清洗室与所述载水容器之间设有限流装置；所述基板清洗装置还包括控制装置，所述控制装置用于根据所述臭氧浓度检测装置所检测到的所述臭氧的浓度值，控制所述限流装置开启或关闭，以连通或阻隔所述光清洗室与所述载水容器。
  3. 根据权利要求2所述的基板清洗装置，其特征在于，
    所述光清洗室内设有用于传送所述基板的滚轮，所述臭氧浓度检测装置装在所述滚轮的轮轴上。
  4. 根据权利要求2或3所述的基板清洗装置，其特征在于，
    所述限流装置包括限流阀，所述限流阀设于所述光清洗室与所述载水容器之间。
  5. 根据权利要求1所述的基板清洗装置，其特征在于，
    所述光清洗室还容纳有所述光清洗过程中生成的二氧化碳，所述基板清洗装置还包括连通所述光清洗室与所述载水容器的过滤装置，所述过滤装置用于过滤所述二氧化碳。
  6. 根据权利要求5所述的基板清洗装置，其特征在于，
    所述过滤装置为碱液容器，所述碱液容器盛装有碱性溶液。
  7. 根据权利要求5或6所述的基板清洗装置，其特征在于，
    还包括设于所述过滤装置与所述载水容器之间的抽气装置，所述抽气装置用于将流经所述过滤装置的所述臭氧抽入所述载水容器。
  8. 根据权利要求7所述的基板清洗装置，其特征在于，
    所述抽气装置包括真空泵，所述真空泵用于将流经所述过滤装置的所述臭氧抽入所述载水容器。
  9. 根据权利要求1、2、3、5和6中任一项所述的基板清洗装置，其特征在于，
    所述光清洗室内设有准分子紫外光源，所述基板清洗装置包括用于向所述光清洗室提供惰性气体的惰性气体供应装置。
  10. 根据权利要求1、2、3、5和6中任一项所述的基板清洗装置，其特征在于，
    还包括清洗水刀，用于在所述循环水清洗装置进行水清洗之后，对所述基板再次进行水清洗。
PCT/CN2017/090298 2017-06-27 2017-06-27 基板清洗装置 WO2019000216A1 (zh)

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CN1214535A (zh) * 1997-10-09 1999-04-21 三菱电机株式会社 半导体基片的处理系统及处理方法
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CN1214535A (zh) * 1997-10-09 1999-04-21 三菱电机株式会社 半导体基片的处理系统及处理方法
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