WO2018225283A1 - Appareil de liaison de bandes - Google Patents

Appareil de liaison de bandes Download PDF

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Publication number
WO2018225283A1
WO2018225283A1 PCT/JP2017/041719 JP2017041719W WO2018225283A1 WO 2018225283 A1 WO2018225283 A1 WO 2018225283A1 JP 2017041719 W JP2017041719 W JP 2017041719W WO 2018225283 A1 WO2018225283 A1 WO 2018225283A1
Authority
WO
WIPO (PCT)
Prior art keywords
web
laser processing
conveyance
masking material
bonding position
Prior art date
Application number
PCT/JP2017/041719
Other languages
English (en)
Japanese (ja)
Inventor
隆司 ▲高▼木
佐藤　貴之
Original Assignee
富士商工マシナリー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士商工マシナリー株式会社 filed Critical 富士商工マシナリー株式会社
Priority to CN201780091644.8A priority Critical patent/CN110914180B/zh
Priority to JP2017562086A priority patent/JP6339302B1/ja
Publication of WO2018225283A1 publication Critical patent/WO2018225283A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H39/00—Associating, collating, or gathering articles or webs
    • B65H39/16—Associating two or more webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H41/00—Machines for separating superposed webs

Definitions

  • the present invention relates to a web laminating apparatus for laminating a plurality of webs.
  • Patent Documents 1 to 5 disclose such techniques.
  • Patent Document 1 describes an apparatus for bonding two sheets printed with a pattern or the like while matching the positions of the patterns.
  • the positions of the images on both sheets are detected by two CCD cameras provided for the sheets, and the images are bonded so that the images coincide with each other while adjusting the feed rate of the roll.
  • Patent Document 2 in a device for attaching a conductive foil tape to an insulating tape while cutting the conductive foil tape, the insulating tape is transported and the conductive foil tape is attached to a predetermined length by a cutting device provided in the vicinity of a bonding roll for bonding the two tapes together. Describes the technique of cutting and pasting.
  • Patent Document 3 in a device that forms a first pattern printed on one film and performs half-cutting as a second pattern in accordance with the pattern, both patterns match so that half-cutting is possible. A technique for adjusting the tension is described.
  • Patent Document 4 describes an apparatus for attaching a masking film to a product film so that there is no slack while adjusting the tension of the masking film.
  • Patent Document 5 describes an apparatus that adjusts tension so that the leading end of a medium to be bonded does not curl, and uses a laser to cut the bonded medium.
  • JP 05-105320 A Japanese Patent Application Laid-Open No. 07-172681 JP 2007-131390 A JP 2010-111470 A JP2015-209288A
  • This invention aims at providing the web bonding apparatus which can implement
  • the present invention is a web laminating apparatus (for example, a laminating apparatus 1 described later) for laminating a plurality of webs, and a plurality of predetermined patterns (for example, a pattern 11 described later) are formed at intervals in the transport direction.
  • 1st conveyance apparatus (for example, below-mentioned base material 10) conveys a 1st web (for example, below-mentioned bonding position 100) to a bonding position (for example, below-mentioned bonding position 100) through a 1st conveyance path
  • route for example, below-mentioned 1st conveyance path
  • a first transport device 15 described later and a second web (for example, masking material 20 described later) bonded to the first web are moved to the bonding position in a second transport path (for example, second transport described later).
  • a second conveyance device (for example, a second conveyance device 25 described later) that conveys through the path 120), and an image detection unit that acquires image information of the first web on the upstream side of the bonding position in the first conveyance path.
  • a later-described CCD camera 35 For example, a later-described CCD camera 35), a laser processing apparatus (for example, a later-described laser processing apparatus 30) that performs laser processing on the second web on the upstream side of the bonding position in the second transport path, A web laminating apparatus that obtains a conveyance error of the first web based on the image information obtained by the image detection unit, and that adjusts the laser processing on the second web based on the conveyance error.
  • the adjustment of the laser processing based on the conveyance error is performed by correcting the timing of performing laser irradiation.
  • the web laminating device includes a first tension management unit (for example, a first tension management device 17 described later) that manages the tension of the first web conveyed by the first conveyance device, and the second conveyance device. It is preferable to further include a second tension management unit (for example, a second tension management device 27 described later) that manages the tension of the second web to be conveyed.
  • a first tension management unit for example, a first tension management device 17 described later
  • second conveyance device for example, a second tension management device 27 described later
  • a sheet peeling device (for example, a sheet peeling device 50 described later) that peels the release sheet upstream of the bonding position from the second web conveyed on the second conveyance path in a state where the release sheet is adhered. Further, the laser processing apparatus irradiates a surface of the second web opposite to the side to which the release sheet is bonded, upstream of the release position where the release sheet is peeled off by the sheet peeling apparatus. Preferably it is possible.
  • the web laminating apparatus of the present invention it is possible to realize the efficiency and high accuracy of the work of laminating the second web subjected to laser processing to the first web on which the predetermined pattern is formed.
  • FIG. 1 is a view showing a laminating apparatus (web bonding apparatus) 1 according to an embodiment of the present invention.
  • a laminating apparatus 1 shown in FIG. 1 is for manufacturing electronic components such as a flexible substrate and a film sensor.
  • the laminating apparatus 1 of the present embodiment includes a first conveying device 15, a first tension management device 17, a second conveying device 25, a laser processing device 30, a second tension management device 27, and a sheet peeling device 50.
  • the CCD camera 35 and the control unit 90 are configured to be included.
  • the 1st conveyance apparatus 15 conveys the base material 10 in which the pattern 11 was formed to the bonding position 100 through the 1st conveyance path
  • route 110 is a movement path
  • FIG. A conveyance roller 16 is disposed in the first conveyance path 110, and the base material 10 is conveyed along the first conveyance path 110 at a predetermined speed by the rotation of the conveyance roller 16.
  • the base material 10 is a roll material formed in a strip shape, and is supplied to the bonding position 100 without interruption.
  • a predetermined pattern 11 is formed on the surface of the base material 10 at intervals in the transport direction.
  • the pattern 11 may be formed in a single row in the transport direction or may be formed in a double row.
  • the pattern 11 is formed on the base material 10 by an etching process or the like, for example, in an upstream process before reaching the laminating apparatus 1.
  • the first tension management device 17 manages the tension of the base material 10 transported through the first transport path 110.
  • the tension applied to the base material 10 is set depending on the material and thickness of the base material 10.
  • the base material 10 is sent to the downstream side in a state where the tension is appropriately managed by the first tension management device 17.
  • the tension of the base material 10 is detected by a tension detection unit such as a load cell (not shown), and the control unit 90 described later performs tension management.
  • the second transport device 25 transports the masking material 20 to the bonding position 100 through the second transport path 120.
  • the second conveyance path 120 is a path different from the first conveyance path 110 and is a movement path of the masking material 20 that joins the bonding position 100 of the first conveyance path 110.
  • a laminating roller 26 is disposed on the bonding position 100 side of the second conveying path 120, and the masking material 20 is conveyed along the second conveying path 120 at a predetermined speed by the rotational driving of the laminating roller 26.
  • the masking material 20 extends in a band shape and is continuously supplied to the bonding position 100.
  • a release sheet 21 is bonded to the masking material 20, and the masking material 20 and the release sheet 21 are integrally conveyed on the second conveyance path 120 until reaching a later-described release position 102, and the release sheet 21 is released at the release position 102. After being peeled off, it is sent to the bonding position 100.
  • the laser processing apparatus 30 performs a cutting process with a laser on the masking material 20 with the release sheet 21 adhered thereto.
  • the laser processing apparatus 30 is a galvano type.
  • the laser which processes the masking material 20 is not necessarily limited to a galvano type
  • the laser irradiation position 101 is set on the upstream side of the bonding position 100 in the second transport path 120.
  • the laser processing apparatus 30 performs laser processing by irradiating the masking material 20 with laser from the opposite side of the masking material 20 to which the release sheet 21 is bonded.
  • the masking material 20 is irradiated with laser so as to cut out a predetermined shape.
  • the processing portion for processing the laser of the masking material 20 is set so that the processing portion is located at a predetermined portion corresponding to the pattern 11 when the masking material 20 is bonded to the base material 10.
  • laser processing is performed at a depth corresponding to the thickness of the masking material 20, and the release sheet 21 is not cut.
  • the sheet peeling device 50 peels the release sheet 21 from the masking material 20 before the masking material 20 reaches the bonding position 100.
  • the peeling position 102 from which the peeling sheet 21 is peeled is set on the downstream side of the irradiation position 101 in the second transport path 120 and on the upstream side of the bonding position 100, and is masked before being bonded to the base material 10.
  • the release sheet 21 is peeled from the material 20.
  • the release sheet 21 peeled at the peeling position 102 is sent to the sheet peeling apparatus 50 side.
  • the laser depth is set so that only the portion of the masking material 20 is cut, and the peeling sheet 21 is not cut. Therefore, an unnecessary portion of the masking material 20 cut out by laser processing is separated from the masking material 20 while being adhered to the release sheet 21 to be peeled off at the peeling position 102. That is, the unnecessary part cut
  • the second tension management device 27 manages the tension of the masking material 20 transported along the second transport path 120.
  • the tension applied to the masking material 20 is set according to the material and thickness of the masking material 20 and the release sheet 21.
  • the masking material 20 is sent to the downstream side in a state where the tension is appropriately managed by the second tension management device 27.
  • the tension of the masking material 20 is detected by a tension detection unit such as a load cell (not shown), and the control unit 90 described later performs tension management.
  • the CCD camera 35 is an image detection unit that acquires image information of the base material 10 flowing through the first transport path 110.
  • the imaging position 103 where the CCD camera 35 acquires image information is set on the upstream side of the bonding position 100 in the first transport path 110.
  • the control unit 90 is a computer that performs various controls of the laminating apparatus 1. Adjustment of the conveyance speed of the substrate 10 by the control unit 90, management of tension applied to the substrate 10 being conveyed, adjustment of the conveyance speed of the masking material 20, management of tension of the masking material 20, and laser processing control of the laser processing device 30 Etc. are executed.
  • the masking material 20 transported through the second transport path 120 is irradiated with a laser to perform cutting processing for cutting out a predetermined shape.
  • the position where the masking material 20 is to be cut needs to match the pattern 11 when bonded to the substrate 10. Therefore, the timing for irradiating the laser is set according to the position of the base material 10 transported along the first transport path 110.
  • the base material 10 is transported at a preset transport speed, and the current position of the base material 10 can be estimated from the transport speed and the elapsed time. However, a conveyance error may occur in the conveyance of the base material 10.
  • control unit 90 detects a transport error based on the image information acquired by the CCD camera 35, and the laser irradiation timing is corrected based on the transport error.
  • the masking material 20 may mask a part of the pattern 11 or may mask the whole.
  • the masking method of the masking material 20 can employ a suitable one depending on the circumstances.
  • a reference shape for specifying the actual position of the base material 10 is stored.
  • the reference shape may be the pattern 11 itself, a part of the pattern 11, or a shape having characteristics formed outside the pattern 11.
  • the reference shape is a shape, a pattern, a color, or a combination thereof having a characteristic point for visually comparing with another shape at a position that falls within the imaging range of the CCD camera 35.
  • the control unit 90 extracts a reference shape from the image information acquired by the CCD camera 35, and calculates a transport error based on the position of the reference shape.
  • the conveyance error is calculated from the difference between the position of the reference shape included in the image information captured by the CCD camera 35 and the assumed position of the reference shape assumed from the conveyance speed, and the calculated conveyance error is the timing of laser irradiation.
  • the control unit 90 extracts a reference shape from the image information acquired by the CCD camera 35, and calculates a transport error based on the position of the reference shape.
  • the conveyance error is calculated from the difference between the position of the reference shape included in the image information captured by the CCD camera 35 and the assumed position of the reference shape assumed from the conveyance speed, and the calculated conveyance error is the timing of laser irradiation.
  • the control unit 90 extracts a reference shape from the image information acquired by the CCD camera 35, and calculates a transport error based on the position of the reference shape.
  • the conveyance error is calculated from
  • Delay the timing of Conversely, when the position of the reference shape is located on the downstream side of the assumed position in the first transport path 110, the transport of the base material 10 is accelerated, and laser irradiation is performed according to the accelerated amount. Advance timing.
  • the detection of the conveyance error based on the image information by the control unit 90 is not limited to this method, and various methods can be employed.
  • the masking material 20 that has been subjected to laser processing is peeled off from the release sheet 21 at the release position 102 by the sheet peeling apparatus 50, is reversed by the laminating roller 26 with the adhesive surface exposed, and is conveyed to the bonding position 100.
  • the release sheet 21 of the masking material 20 is formed on the surface on which the pattern 11 of the base material 10 transported by the first transport device 15 is formed.
  • the peeled surfaces are bonded together to be integrated, and in this state, they are conveyed to a downstream process.
  • the base material 10 to which the masking material 20 is bonded is cut into single sheets, and an electronic component on which lamination has been performed is manufactured.
  • a laminating apparatus (web bonding apparatus) 1 conveys a substrate (first web) 10 in which a plurality of predetermined patterns 11 are formed at intervals in the conveying direction to a bonding position 100 through a first conveying path 110.
  • 1 conveyance device 15, 2nd conveyance device 25 which conveys masking material (2nd web) 20 pasted on substrate 10 to pasting position 100 through 2nd conveyance course 120, and pasting in the 1st conveyance course 110
  • a laser that performs laser processing on the masking material 20 on the upstream side of the bonding position 100 in the second transport path 120 and a CCD camera 35 (image detection unit) that acquires image information of the base material 10 on the upstream side of the position 100.
  • a processing device 30 Based on the image information acquired by the CCD camera 35, a conveyance error of the substrate 10 is acquired, and laser processing on the masking material 20 is adjusted based on the conveyance error.
  • the laser processing can be performed with high accuracy, and the operation of attaching the masking material 20 to the base material 10 is performed with high accuracy. be able to.
  • the base material on which the masking material 20 is bonded can be cut into single sheets. Accordingly, the masking material 20 can be bonded to the base material 10 at a time compared to the case where the masking material is bonded to each base material cut into single sheets, so that the work time can be shortened and work efficiency can be improved. Can be improved.
  • the apparatus configuration can be compactly combined and the distance from the irradiation position 101 to the bonding position 100 can be shortened. And the bonding accuracy can be improved. That is, in the configuration in which the object whose image is to be detected by the CCD camera 35 is the base material 10, but the object to be laser-processed is a completely different material called the masking material 20 different from the base material 10, it is applied with high accuracy. The technology to match is realized.
  • the adjustment of the laser processing based on the conveyance error is performed by correcting the timing of performing the laser irradiation.
  • the conveyance error of the substrate 10 conveyed by the first conveyance device 15 can be reflected in the laser processing by a simple process of adjusting the timing of laser irradiation without using complicated logic.
  • the laminating apparatus 1 includes a first tension management device 17 that manages the tension of the base material 10 that is transported by the first transport device 15 and a masking material 20 that is transported by the second transport device 25. And a second tension management device 27 for managing tension.
  • the base material 10 and the masking material 20 are stably conveyed with an appropriate tension, a conveyance error is less likely to occur, and the bonding accuracy can be further improved.
  • the distance from the irradiation position 101 to the bonding position 100 can be shortened by the laser processing apparatus 30 that does not need to ensure a large arrangement space compared to the press apparatus, there is a further effect of facilitating tension management. be able to.
  • the laminating apparatus 1 is the sheet peeling which peels the peeling sheet 21 in the upstream of the bonding position 100 from the masking material 20 conveyed in the 2nd conveyance path 120 in the state to which the peeling sheet 21 was adhere
  • the apparatus 50 is further provided.
  • the laser processing device 30 is configured to be able to irradiate a laser on the surface opposite to the side to which the release sheet 21 of the masking material 20 is bonded, upstream of the release position 102 where the release sheet 21 is peeled off by the sheet peeling device 50. Is done.
  • the laser processing apparatus 30 is configured to perform the process of cutting only the masking material 20 with a laser on the masking material 20 with the release sheet 21 adhered thereto, but is not limited to this configuration. For example, it is good also as a structure which cuts so that the peeling sheet 21 may be punched out with the masking material 20.
  • FIG. In some cases, the masking material 20 may be laser processed after the release sheet 21 is peeled off.
  • the first transport device 15 and the second transport device 25 are configured to transport continuously without stopping, but can be changed to a configuration in which transport and stop are repeated and transported.
  • the laser processing is adjusted based on the conveyance error by correcting the laser irradiation timing, but the present invention is not limited to this configuration.
  • An appropriate method can be adopted for adjustment of laser processing.
  • the base material 10 on which a predetermined pattern is formed is described as the first web, and the masking material 20 is described as the second web.
  • the present invention is not limited to this configuration.
  • a resin multilayer substrate such as MetroSark (registered trademark) can be used for the first web.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Collation Of Sheets And Webs (AREA)

Abstract

La présente invention porte sur un appareil de stratification (appareil de liaison de bandes) (1) comprenant: un premier dispositif de transport (15) pour transporter, vers une position de liaison (100), une base (première bande) (10) sur laquelle est formé un motif prédéterminé (11); un second dispositif de transport (25) pour transporter, vers la position de liaison (100), un matériau de masquage (seconde bande) (20) devant être lié à la base (10); une caméra CCD (35) (unité de détection d'images) pour acquérir des informations d'image sur la base (10) sur le côté amont de la position de liaison (100) dans un premier trajet de transport (110); et un dispositif de traitement laser (30) pour effectuer un traitement laser sur le matériau de masquage (20) sur le côté amont de la position de liaison (100) dans un second trajet de transport (120). Une erreur de transport de la base (10) est acquise sur la base des informations d'image acquises par la caméra CCD (35), et un traitement laser sur le matériau de masquage (20) est ajusté sur la base de l'erreur de transport.
PCT/JP2017/041719 2017-06-05 2017-11-20 Appareil de liaison de bandes WO2018225283A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201780091644.8A CN110914180B (zh) 2017-06-05 2017-11-20 幅材贴合装置
JP2017562086A JP6339302B1 (ja) 2017-06-05 2017-11-20 ウェブ貼合装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017110824 2017-06-05
JP2017-110824 2017-06-05

Publications (1)

Publication Number Publication Date
WO2018225283A1 true WO2018225283A1 (fr) 2018-12-13

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PCT/JP2017/041719 WO2018225283A1 (fr) 2017-06-05 2017-11-20 Appareil de liaison de bandes

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CN (1) CN110914180B (fr)
TW (1) TWI743357B (fr)
WO (1) WO2018225283A1 (fr)

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Publication number Priority date Publication date Assignee Title
TWI723688B (zh) * 2019-12-19 2021-04-01 長豐光學科技股份有限公司 薄型線路的加工方法

Citations (3)

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JPH0558543A (ja) * 1991-08-29 1993-03-09 Kanzaki Paper Mfg Co Ltd ウエブの補修方法及び補修装置
JP2006520700A (ja) * 2003-03-22 2006-09-14 ツェー　エス　アー　テー　ゲゼルシャフト　フュア　コンピューター−ジステーメ　ウント　アウトマツィオーンス−テヒニク　ミット　ベシュレンクテル　ハフツング 見当のないフィルムへの正確な印刷のための装置
WO2014192098A1 (fr) * 2013-05-29 2014-12-04 住友化学株式会社 Dispositif et procédé de fabrication de corps collé d'élément optique

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DE4416231B4 (de) * 1994-05-07 2004-02-26 Xaver Lipp Verfahren zur Herstellung eines zweilagigen Metallbandes und Vorrichtung zur Durchführung des Verfahrens
DE69511458T3 (de) * 1994-05-27 2007-04-12 Instance, David John, Sellindge Etiketten und Verfahren zu deren Herstellung
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DE10243084B3 (de) * 2002-09-16 2004-01-29 CSAT Gesellschaft für Computer-Systeme und Automations-Technik mbH Vorrichtung zum positionsgenauen Zusammenfügen von zwei Materialsträngen
JP4920746B2 (ja) * 2006-04-27 2012-04-18 エスセーアー・ハイジーン・プロダクツ・アーベー 少なくとも一つの本質的に連続する材料ウェブの同期化された位置決めのための方法および装置
EP2349891A1 (fr) * 2008-10-27 2011-08-03 Wilfried Bachmann Procédé d'application d'un élément en forme de ruban, en particulier d'un fil de sécurité, sur un support en forme de bande et dispositif en vue de l'exécution et de l'utilisation du procédé
JP5360937B2 (ja) * 2011-06-02 2013-12-04 住友化学株式会社 光学フィルムの搬送方法および搬送装置
CN203919955U (zh) * 2014-06-10 2014-11-05 日东电工株式会社 基材膜剥离装置及偏光膜制造装置
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Publication number Priority date Publication date Assignee Title
JPH0558543A (ja) * 1991-08-29 1993-03-09 Kanzaki Paper Mfg Co Ltd ウエブの補修方法及び補修装置
JP2006520700A (ja) * 2003-03-22 2006-09-14 ツェー　エス　アー　テー　ゲゼルシャフト　フュア　コンピューター−ジステーメ　ウント　アウトマツィオーンス−テヒニク　ミット　ベシュレンクテル　ハフツング 見当のないフィルムへの正確な印刷のための装置
WO2014192098A1 (fr) * 2013-05-29 2014-12-04 住友化学株式会社 Dispositif et procédé de fabrication de corps collé d'élément optique

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TWI743357B (zh) 2021-10-21
CN110914180A (zh) 2020-03-24
TW201904850A (zh) 2019-02-01

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