WO2018225283A1 - Web bonding apparatus - Google Patents

Web bonding apparatus Download PDF

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Publication number
WO2018225283A1
WO2018225283A1 PCT/JP2017/041719 JP2017041719W WO2018225283A1 WO 2018225283 A1 WO2018225283 A1 WO 2018225283A1 JP 2017041719 W JP2017041719 W JP 2017041719W WO 2018225283 A1 WO2018225283 A1 WO 2018225283A1
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WO
WIPO (PCT)
Prior art keywords
web
laser processing
conveyance
masking material
bonding position
Prior art date
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PCT/JP2017/041719
Other languages
French (fr)
Japanese (ja)
Inventor
隆司 ▲高▼木
佐藤　貴之
Original Assignee
富士商工マシナリー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 富士商工マシナリー株式会社 filed Critical 富士商工マシナリー株式会社
Priority to CN201780091644.8A priority Critical patent/CN110914180B/en
Priority to JP2017562086A priority patent/JP6339302B1/en
Publication of WO2018225283A1 publication Critical patent/WO2018225283A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H39/00—Associating, collating, or gathering articles or webs
    • B65H39/16—Associating two or more webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H41/00—Machines for separating superposed webs

Definitions

  • the present invention relates to a web laminating apparatus for laminating a plurality of webs.
  • Patent Documents 1 to 5 disclose such techniques.
  • Patent Document 1 describes an apparatus for bonding two sheets printed with a pattern or the like while matching the positions of the patterns.
  • the positions of the images on both sheets are detected by two CCD cameras provided for the sheets, and the images are bonded so that the images coincide with each other while adjusting the feed rate of the roll.
  • Patent Document 2 in a device for attaching a conductive foil tape to an insulating tape while cutting the conductive foil tape, the insulating tape is transported and the conductive foil tape is attached to a predetermined length by a cutting device provided in the vicinity of a bonding roll for bonding the two tapes together. Describes the technique of cutting and pasting.
  • Patent Document 3 in a device that forms a first pattern printed on one film and performs half-cutting as a second pattern in accordance with the pattern, both patterns match so that half-cutting is possible. A technique for adjusting the tension is described.
  • Patent Document 4 describes an apparatus for attaching a masking film to a product film so that there is no slack while adjusting the tension of the masking film.
  • Patent Document 5 describes an apparatus that adjusts tension so that the leading end of a medium to be bonded does not curl, and uses a laser to cut the bonded medium.
  • JP 05-105320 A Japanese Patent Application Laid-Open No. 07-172681 JP 2007-131390 A JP 2010-111470 A JP2015-209288A
  • This invention aims at providing the web bonding apparatus which can implement
  • the present invention is a web laminating apparatus (for example, a laminating apparatus 1 described later) for laminating a plurality of webs, and a plurality of predetermined patterns (for example, a pattern 11 described later) are formed at intervals in the transport direction.
  • 1st conveyance apparatus (for example, below-mentioned base material 10) conveys a 1st web (for example, below-mentioned bonding position 100) to a bonding position (for example, below-mentioned bonding position 100) through a 1st conveyance path
  • route for example, below-mentioned 1st conveyance path
  • a first transport device 15 described later and a second web (for example, masking material 20 described later) bonded to the first web are moved to the bonding position in a second transport path (for example, second transport described later).
  • a second conveyance device (for example, a second conveyance device 25 described later) that conveys through the path 120), and an image detection unit that acquires image information of the first web on the upstream side of the bonding position in the first conveyance path.
  • a later-described CCD camera 35 For example, a later-described CCD camera 35), a laser processing apparatus (for example, a later-described laser processing apparatus 30) that performs laser processing on the second web on the upstream side of the bonding position in the second transport path, A web laminating apparatus that obtains a conveyance error of the first web based on the image information obtained by the image detection unit, and that adjusts the laser processing on the second web based on the conveyance error.
  • the adjustment of the laser processing based on the conveyance error is performed by correcting the timing of performing laser irradiation.
  • the web laminating device includes a first tension management unit (for example, a first tension management device 17 described later) that manages the tension of the first web conveyed by the first conveyance device, and the second conveyance device. It is preferable to further include a second tension management unit (for example, a second tension management device 27 described later) that manages the tension of the second web to be conveyed.
  • a first tension management unit for example, a first tension management device 17 described later
  • second conveyance device for example, a second tension management device 27 described later
  • a sheet peeling device (for example, a sheet peeling device 50 described later) that peels the release sheet upstream of the bonding position from the second web conveyed on the second conveyance path in a state where the release sheet is adhered. Further, the laser processing apparatus irradiates a surface of the second web opposite to the side to which the release sheet is bonded, upstream of the release position where the release sheet is peeled off by the sheet peeling apparatus. Preferably it is possible.
  • the web laminating apparatus of the present invention it is possible to realize the efficiency and high accuracy of the work of laminating the second web subjected to laser processing to the first web on which the predetermined pattern is formed.
  • FIG. 1 is a view showing a laminating apparatus (web bonding apparatus) 1 according to an embodiment of the present invention.
  • a laminating apparatus 1 shown in FIG. 1 is for manufacturing electronic components such as a flexible substrate and a film sensor.
  • the laminating apparatus 1 of the present embodiment includes a first conveying device 15, a first tension management device 17, a second conveying device 25, a laser processing device 30, a second tension management device 27, and a sheet peeling device 50.
  • the CCD camera 35 and the control unit 90 are configured to be included.
  • the 1st conveyance apparatus 15 conveys the base material 10 in which the pattern 11 was formed to the bonding position 100 through the 1st conveyance path
  • route 110 is a movement path
  • FIG. A conveyance roller 16 is disposed in the first conveyance path 110, and the base material 10 is conveyed along the first conveyance path 110 at a predetermined speed by the rotation of the conveyance roller 16.
  • the base material 10 is a roll material formed in a strip shape, and is supplied to the bonding position 100 without interruption.
  • a predetermined pattern 11 is formed on the surface of the base material 10 at intervals in the transport direction.
  • the pattern 11 may be formed in a single row in the transport direction or may be formed in a double row.
  • the pattern 11 is formed on the base material 10 by an etching process or the like, for example, in an upstream process before reaching the laminating apparatus 1.
  • the first tension management device 17 manages the tension of the base material 10 transported through the first transport path 110.
  • the tension applied to the base material 10 is set depending on the material and thickness of the base material 10.
  • the base material 10 is sent to the downstream side in a state where the tension is appropriately managed by the first tension management device 17.
  • the tension of the base material 10 is detected by a tension detection unit such as a load cell (not shown), and the control unit 90 described later performs tension management.
  • the second transport device 25 transports the masking material 20 to the bonding position 100 through the second transport path 120.
  • the second conveyance path 120 is a path different from the first conveyance path 110 and is a movement path of the masking material 20 that joins the bonding position 100 of the first conveyance path 110.
  • a laminating roller 26 is disposed on the bonding position 100 side of the second conveying path 120, and the masking material 20 is conveyed along the second conveying path 120 at a predetermined speed by the rotational driving of the laminating roller 26.
  • the masking material 20 extends in a band shape and is continuously supplied to the bonding position 100.
  • a release sheet 21 is bonded to the masking material 20, and the masking material 20 and the release sheet 21 are integrally conveyed on the second conveyance path 120 until reaching a later-described release position 102, and the release sheet 21 is released at the release position 102. After being peeled off, it is sent to the bonding position 100.
  • the laser processing apparatus 30 performs a cutting process with a laser on the masking material 20 with the release sheet 21 adhered thereto.
  • the laser processing apparatus 30 is a galvano type.
  • the laser which processes the masking material 20 is not necessarily limited to a galvano type
  • the laser irradiation position 101 is set on the upstream side of the bonding position 100 in the second transport path 120.
  • the laser processing apparatus 30 performs laser processing by irradiating the masking material 20 with laser from the opposite side of the masking material 20 to which the release sheet 21 is bonded.
  • the masking material 20 is irradiated with laser so as to cut out a predetermined shape.
  • the processing portion for processing the laser of the masking material 20 is set so that the processing portion is located at a predetermined portion corresponding to the pattern 11 when the masking material 20 is bonded to the base material 10.
  • laser processing is performed at a depth corresponding to the thickness of the masking material 20, and the release sheet 21 is not cut.
  • the sheet peeling device 50 peels the release sheet 21 from the masking material 20 before the masking material 20 reaches the bonding position 100.
  • the peeling position 102 from which the peeling sheet 21 is peeled is set on the downstream side of the irradiation position 101 in the second transport path 120 and on the upstream side of the bonding position 100, and is masked before being bonded to the base material 10.
  • the release sheet 21 is peeled from the material 20.
  • the release sheet 21 peeled at the peeling position 102 is sent to the sheet peeling apparatus 50 side.
  • the laser depth is set so that only the portion of the masking material 20 is cut, and the peeling sheet 21 is not cut. Therefore, an unnecessary portion of the masking material 20 cut out by laser processing is separated from the masking material 20 while being adhered to the release sheet 21 to be peeled off at the peeling position 102. That is, the unnecessary part cut
  • the second tension management device 27 manages the tension of the masking material 20 transported along the second transport path 120.
  • the tension applied to the masking material 20 is set according to the material and thickness of the masking material 20 and the release sheet 21.
  • the masking material 20 is sent to the downstream side in a state where the tension is appropriately managed by the second tension management device 27.
  • the tension of the masking material 20 is detected by a tension detection unit such as a load cell (not shown), and the control unit 90 described later performs tension management.
  • the CCD camera 35 is an image detection unit that acquires image information of the base material 10 flowing through the first transport path 110.
  • the imaging position 103 where the CCD camera 35 acquires image information is set on the upstream side of the bonding position 100 in the first transport path 110.
  • the control unit 90 is a computer that performs various controls of the laminating apparatus 1. Adjustment of the conveyance speed of the substrate 10 by the control unit 90, management of tension applied to the substrate 10 being conveyed, adjustment of the conveyance speed of the masking material 20, management of tension of the masking material 20, and laser processing control of the laser processing device 30 Etc. are executed.
  • the masking material 20 transported through the second transport path 120 is irradiated with a laser to perform cutting processing for cutting out a predetermined shape.
  • the position where the masking material 20 is to be cut needs to match the pattern 11 when bonded to the substrate 10. Therefore, the timing for irradiating the laser is set according to the position of the base material 10 transported along the first transport path 110.
  • the base material 10 is transported at a preset transport speed, and the current position of the base material 10 can be estimated from the transport speed and the elapsed time. However, a conveyance error may occur in the conveyance of the base material 10.
  • control unit 90 detects a transport error based on the image information acquired by the CCD camera 35, and the laser irradiation timing is corrected based on the transport error.
  • the masking material 20 may mask a part of the pattern 11 or may mask the whole.
  • the masking method of the masking material 20 can employ a suitable one depending on the circumstances.
  • a reference shape for specifying the actual position of the base material 10 is stored.
  • the reference shape may be the pattern 11 itself, a part of the pattern 11, or a shape having characteristics formed outside the pattern 11.
  • the reference shape is a shape, a pattern, a color, or a combination thereof having a characteristic point for visually comparing with another shape at a position that falls within the imaging range of the CCD camera 35.
  • the control unit 90 extracts a reference shape from the image information acquired by the CCD camera 35, and calculates a transport error based on the position of the reference shape.
  • the conveyance error is calculated from the difference between the position of the reference shape included in the image information captured by the CCD camera 35 and the assumed position of the reference shape assumed from the conveyance speed, and the calculated conveyance error is the timing of laser irradiation.
  • the control unit 90 extracts a reference shape from the image information acquired by the CCD camera 35, and calculates a transport error based on the position of the reference shape.
  • the conveyance error is calculated from the difference between the position of the reference shape included in the image information captured by the CCD camera 35 and the assumed position of the reference shape assumed from the conveyance speed, and the calculated conveyance error is the timing of laser irradiation.
  • the control unit 90 extracts a reference shape from the image information acquired by the CCD camera 35, and calculates a transport error based on the position of the reference shape.
  • the conveyance error is calculated from
  • Delay the timing of Conversely, when the position of the reference shape is located on the downstream side of the assumed position in the first transport path 110, the transport of the base material 10 is accelerated, and laser irradiation is performed according to the accelerated amount. Advance timing.
  • the detection of the conveyance error based on the image information by the control unit 90 is not limited to this method, and various methods can be employed.
  • the masking material 20 that has been subjected to laser processing is peeled off from the release sheet 21 at the release position 102 by the sheet peeling apparatus 50, is reversed by the laminating roller 26 with the adhesive surface exposed, and is conveyed to the bonding position 100.
  • the release sheet 21 of the masking material 20 is formed on the surface on which the pattern 11 of the base material 10 transported by the first transport device 15 is formed.
  • the peeled surfaces are bonded together to be integrated, and in this state, they are conveyed to a downstream process.
  • the base material 10 to which the masking material 20 is bonded is cut into single sheets, and an electronic component on which lamination has been performed is manufactured.
  • a laminating apparatus (web bonding apparatus) 1 conveys a substrate (first web) 10 in which a plurality of predetermined patterns 11 are formed at intervals in the conveying direction to a bonding position 100 through a first conveying path 110.
  • 1 conveyance device 15, 2nd conveyance device 25 which conveys masking material (2nd web) 20 pasted on substrate 10 to pasting position 100 through 2nd conveyance course 120, and pasting in the 1st conveyance course 110
  • a laser that performs laser processing on the masking material 20 on the upstream side of the bonding position 100 in the second transport path 120 and a CCD camera 35 (image detection unit) that acquires image information of the base material 10 on the upstream side of the position 100.
  • a processing device 30 Based on the image information acquired by the CCD camera 35, a conveyance error of the substrate 10 is acquired, and laser processing on the masking material 20 is adjusted based on the conveyance error.
  • the laser processing can be performed with high accuracy, and the operation of attaching the masking material 20 to the base material 10 is performed with high accuracy. be able to.
  • the base material on which the masking material 20 is bonded can be cut into single sheets. Accordingly, the masking material 20 can be bonded to the base material 10 at a time compared to the case where the masking material is bonded to each base material cut into single sheets, so that the work time can be shortened and work efficiency can be improved. Can be improved.
  • the apparatus configuration can be compactly combined and the distance from the irradiation position 101 to the bonding position 100 can be shortened. And the bonding accuracy can be improved. That is, in the configuration in which the object whose image is to be detected by the CCD camera 35 is the base material 10, but the object to be laser-processed is a completely different material called the masking material 20 different from the base material 10, it is applied with high accuracy. The technology to match is realized.
  • the adjustment of the laser processing based on the conveyance error is performed by correcting the timing of performing the laser irradiation.
  • the conveyance error of the substrate 10 conveyed by the first conveyance device 15 can be reflected in the laser processing by a simple process of adjusting the timing of laser irradiation without using complicated logic.
  • the laminating apparatus 1 includes a first tension management device 17 that manages the tension of the base material 10 that is transported by the first transport device 15 and a masking material 20 that is transported by the second transport device 25. And a second tension management device 27 for managing tension.
  • the base material 10 and the masking material 20 are stably conveyed with an appropriate tension, a conveyance error is less likely to occur, and the bonding accuracy can be further improved.
  • the distance from the irradiation position 101 to the bonding position 100 can be shortened by the laser processing apparatus 30 that does not need to ensure a large arrangement space compared to the press apparatus, there is a further effect of facilitating tension management. be able to.
  • the laminating apparatus 1 is the sheet peeling which peels the peeling sheet 21 in the upstream of the bonding position 100 from the masking material 20 conveyed in the 2nd conveyance path 120 in the state to which the peeling sheet 21 was adhere
  • the apparatus 50 is further provided.
  • the laser processing device 30 is configured to be able to irradiate a laser on the surface opposite to the side to which the release sheet 21 of the masking material 20 is bonded, upstream of the release position 102 where the release sheet 21 is peeled off by the sheet peeling device 50. Is done.
  • the laser processing apparatus 30 is configured to perform the process of cutting only the masking material 20 with a laser on the masking material 20 with the release sheet 21 adhered thereto, but is not limited to this configuration. For example, it is good also as a structure which cuts so that the peeling sheet 21 may be punched out with the masking material 20.
  • FIG. In some cases, the masking material 20 may be laser processed after the release sheet 21 is peeled off.
  • the first transport device 15 and the second transport device 25 are configured to transport continuously without stopping, but can be changed to a configuration in which transport and stop are repeated and transported.
  • the laser processing is adjusted based on the conveyance error by correcting the laser irradiation timing, but the present invention is not limited to this configuration.
  • An appropriate method can be adopted for adjustment of laser processing.
  • the base material 10 on which a predetermined pattern is formed is described as the first web, and the masking material 20 is described as the second web.
  • the present invention is not limited to this configuration.
  • a resin multilayer substrate such as MetroSark (registered trademark) can be used for the first web.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Collation Of Sheets And Webs (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

A laminating apparatus (web bonding apparatus) (1) comprises: a first conveyance device (15) for conveying, to a bonding position (100), a base (first web) (10) on which a predetermined pattern (11) is formed; a second conveyance device (25) for conveying, to the bonding position (100), a masking material (second web) (20) to be bonded to the base (10); a CCD camera (35) (image detection unit) for acquiring image information on the base (10) on the upstream side of the bonding position (100) in a first conveyance path (110); and a laser processing device (30) for performing laser processing on the masking material (20) on the upstream side of the bonding position (100) in a second conveyance path (120). A conveyance error of the base (10) is acquired on the basis of the image information acquired by the CCD camera (35), and laser processing on the masking material (20) is adjusted on the basis of the conveyance error.

Description

ウェブ貼合装置Web laminating device
　本発明は、複数のウェブを貼り合せるウェブ貼合装置に関する。 The present invention relates to a web laminating apparatus for laminating a plurality of webs.
　従来、異なる種類のウェブを貼り合わせる技術が知られている。この種の技術を開示するものとして例えば特許文献１～５がある。 Conventionally, a technique for bonding different types of webs is known. For example, Patent Documents 1 to 5 disclose such techniques.
　特許文献１には、絵柄等が印刷された二つのシートについて、絵柄の位置を一致させながら貼り合わせる装置が記載されている。この装置では、両シートの絵柄の位置をそれぞれに対して設けられた二つのＣＣＤカメラで位置を検出し、ロールの送り速度を調整しつつ絵柄が一致するように貼り合わせている。 Patent Document 1 describes an apparatus for bonding two sheets printed with a pattern or the like while matching the positions of the patterns. In this apparatus, the positions of the images on both sheets are detected by two CCD cameras provided for the sheets, and the images are bonded so that the images coincide with each other while adjusting the feed rate of the roll.
　特許文献２には、絶縁テープに導電箔テープを切断しつつ貼り付ける装置において、絶縁テープを搬送するとともに、両テープを貼りあわせる貼合わせロールの近傍に設けた切断装置で導電箔テープを所定長に切断して貼り付ける技術について記載されている。 In Patent Document 2, in a device for attaching a conductive foil tape to an insulating tape while cutting the conductive foil tape, the insulating tape is transported and the conductive foil tape is attached to a predetermined length by a cutting device provided in the vicinity of a bonding roll for bonding the two tapes together. Describes the technique of cutting and pasting.
　特許文献３には、一つのフィルム上に印刷した第一パターンを形成し、当該パターンに合わせて第二パターンとしてハーフカットをする装置において、両パターンが一致してハーフカット可能なようにフィルムの張力調整を行う技術について記載されている。 In Patent Document 3, in a device that forms a first pattern printed on one film and performs half-cutting as a second pattern in accordance with the pattern, both patterns match so that half-cutting is possible. A technique for adjusting the tension is described.
　特許文献４には、製品フィルムに対してマスキングフィルムを張力調整しつつ弛みが無いように貼り付ける装置について記載されている。 Patent Document 4 describes an apparatus for attaching a masking film to a product film so that there is no slack while adjusting the tension of the masking film.
　特許文献５には、貼り合わせようの媒体の先端部がカールしないように張力調整をする装置において、貼り合わせ媒体をカットする際にレーザを用いて裁断するものが記載されている。 Patent Document 5 describes an apparatus that adjusts tension so that the leading end of a medium to be bonded does not curl, and uses a laser to cut the bonded medium.
特開平０５－１０５３２０号公報JP 05-105320 A 特開平０７－１７２６８１号公報Japanese Patent Application Laid-Open No. 07-172681 特開２００７－１３１３９０号公報JP 2007-131390 A 特開２０１０－１１１４７０号公報JP 2010-111470 A 特開２０１５－２０９２８８号公報JP2015-209288A
　ところで、所定のパターンが搬送方向に間隔をあけて複数形成された第１ウェブ（例えば、基材）に対してレーザ加工を施した第２ウェブ（例えば、マスキング材）をそのまま貼り合わせる場合、第１ウェブの搬送誤差が生じると、レーザ加工を施した部分の位置ずれの原因となる。そのため、第１ウェブを所定の長さに切断して枚葉にした後、枚葉ごとに第２ウェブを貼り合わせる方法を採っていた。枚葉ごとに貼り合わせる作業が必要となり、自動化の障害となっていた。この点、従来技術には、ＣＣＤカメラ等を用いてウェブの搬送を調整するもの等があるものの、検出対象と加工対象が同じものであり、第１ウェブの搬送誤差に基づく第２ウェブの加工部分の位置ずれを十分に解消できるものがなかった。所定のパターンが形成される第１ウェブに加工が施された第２ウェブを貼り合わせる構成において、高精度化及び効率化の観点から改善の余地があった。 By the way, when a second web (for example, a masking material) subjected to laser processing is bonded to a first web (for example, a base material) in which a plurality of predetermined patterns are formed at intervals in the transport direction, If a conveyance error of one web occurs, it causes a position shift of a portion subjected to laser processing. For this reason, after the first web is cut into a predetermined length to make a single sheet, the second web is bonded to each sheet. The work of pasting each sheet was necessary, which was an obstacle to automation. In this regard, although some conventional techniques adjust the web conveyance using a CCD camera or the like, the detection target and the processing target are the same, and the second web is processed based on the first web conveyance error. There was nothing that could sufficiently eliminate the position shift. In the configuration in which the processed second web is bonded to the first web on which the predetermined pattern is formed, there is room for improvement from the viewpoint of high accuracy and efficiency.
　本発明は、所定のパターンが形成される第１ウェブにレーザ加工を施した第２ウェブを貼り合わせる作業の効率化及び高精度化を実現できるウェブ貼合装置を提供することを目的とする。 This invention aims at providing the web bonding apparatus which can implement | achieve the efficiency improvement and the precision improvement of the operation | work which bonds the 2nd web which performed the laser processing on the 1st web in which a predetermined pattern is formed.
　本発明は、複数のウェブを貼り合わせるウェブ貼合装置（例えば、後述のラミネート装置１）であって、所定のパターン（例えば、後述のパターン１１）が搬送方向に間隔をあけて複数形成された第１ウェブ（例えば、後述の基材１０）を貼合位置（例えば、後述の貼合位置１００）に第１搬送経路（例えば、後述の第１搬送経路１１０）を通じて搬送する第１搬送装置（例えば、後述の第１搬送装置１５）と、前記第１ウェブに貼り合わされる第２ウェブ（例えば、後述のマスキング材２０）を前記貼合位置に第２搬送経路（例えば、後述の第２搬送経路１２０）を通じて搬送する第２搬送装置（例えば、後述の第２搬送装置２５）と、前記第１搬送経路における前記貼合位置の上流側で前記第１ウェブの画像情報を取得する画像検出部（例えば、後述のＣＣＤカメラ３５）と、前記第２搬送経路における前記貼合位置の上流側で前記第２ウェブに対してレーザ加工を行うレーザ加工装置（例えば、後述のレーザ加工装置３０）と、を備え、前記画像検出部が取得した前記画像情報に基づいて前記第１ウェブの搬送誤差を取得し、当該搬送誤差に基づいて前記第２ウェブに対する前記レーザ加工が調整されるウェブ貼合装置に関する。 The present invention is a web laminating apparatus (for example, a laminating apparatus 1 described later) for laminating a plurality of webs, and a plurality of predetermined patterns (for example, a pattern 11 described later) are formed at intervals in the transport direction. 1st conveyance apparatus (for example, below-mentioned base material 10) conveys a 1st web (for example, below-mentioned bonding position 100) to a bonding position (for example, below-mentioned bonding position 100) through a 1st conveyance path | route (for example, below-mentioned 1st conveyance path | route 110). For example, a first transport device 15 described later) and a second web (for example, masking material 20 described later) bonded to the first web are moved to the bonding position in a second transport path (for example, second transport described later). A second conveyance device (for example, a second conveyance device 25 described later) that conveys through the path 120), and an image detection unit that acquires image information of the first web on the upstream side of the bonding position in the first conveyance path. For example, a later-described CCD camera 35), a laser processing apparatus (for example, a later-described laser processing apparatus 30) that performs laser processing on the second web on the upstream side of the bonding position in the second transport path, A web laminating apparatus that obtains a conveyance error of the first web based on the image information obtained by the image detection unit, and that adjusts the laser processing on the second web based on the conveyance error. .
　前記搬送誤差に基づく前記レーザ加工の調整は、レーザ照射を行うタイミングを補正することで行われることが好ましい。 It is preferable that the adjustment of the laser processing based on the conveyance error is performed by correcting the timing of performing laser irradiation.
　前記ウェブ貼合装置は、前記第１搬送装置によって搬送される前記第１ウェブの張力を管理する第１張力管理部（例えば、後述の第１張力管理装置１７）と、前記第２搬送装置によって搬送される前記第２ウェブの張力を管理する第２張力管理部（例えば、後述の第２張力管理装置２７）と、を更に備えることが好ましい。 The web laminating device includes a first tension management unit (for example, a first tension management device 17 described later) that manages the tension of the first web conveyed by the first conveyance device, and the second conveyance device. It is preferable to further include a second tension management unit (for example, a second tension management device 27 described later) that manages the tension of the second web to be conveyed.
　剥離シートが接着された状態で前記第２搬送経路を搬送される前記第２ウェブから前記貼合位置の上流側で前記剥離シートを剥離するシート剥離装置（例えば、後述のシート剥離装置５０）を更に備え、前記レーザ加工装置は、前記シート剥離装置により前記剥離シートが剥離される剥離位置の上流側で、前記第２ウェブの前記剥離シートが接着される側と反対側の面にレーザを照射可能であることが好ましい。 A sheet peeling device (for example, a sheet peeling device 50 described later) that peels the release sheet upstream of the bonding position from the second web conveyed on the second conveyance path in a state where the release sheet is adhered. Further, the laser processing apparatus irradiates a surface of the second web opposite to the side to which the release sheet is bonded, upstream of the release position where the release sheet is peeled off by the sheet peeling apparatus. Preferably it is possible.
　本発明のウェブ貼合装置によれば、所定のパターンが形成される第１ウェブにレーザ加工を施した第２ウェブを貼り合わせる作業の効率化及び高精度化を実現できる。 According to the web laminating apparatus of the present invention, it is possible to realize the efficiency and high accuracy of the work of laminating the second web subjected to laser processing to the first web on which the predetermined pattern is formed.
本発明の一実施形態に係るラミネート装置（ウェブ貼合装置）を示す図である。It is a figure which shows the laminating apparatus (web bonding apparatus) which concerns on one Embodiment of this invention.
　以下、本発明の好ましい実施形態について、図面を参照しながら説明する。図１は、本発明の一実施形態に係るラミネート装置（ウェブ貼合装置）１を示す図である。図１に示すラミネート装置１は、フレキシブル基板やフィルムセンサ等の電子部品を製造するためのものである。 Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a view showing a laminating apparatus (web bonding apparatus) 1 according to an embodiment of the present invention. A laminating apparatus 1 shown in FIG. 1 is for manufacturing electronic components such as a flexible substrate and a film sensor.
　本実施形態のラミネート装置１は、第１搬送装置１５と、第１張力管理装置１７と、第２搬送装置２５と、レーザ加工装置３０と、第２張力管理装置２７と、シート剥離装置５０と、ＣＣＤカメラ３５と、制御部９０と、を含むように構成される。 The laminating apparatus 1 of the present embodiment includes a first conveying device 15, a first tension management device 17, a second conveying device 25, a laser processing device 30, a second tension management device 27, and a sheet peeling device 50. The CCD camera 35 and the control unit 90 are configured to be included.
　第１搬送装置１５は、パターン１１が形成された基材１０を貼合位置１００まで第１搬送経路１１０を通じて搬送する。第１搬送経路１１０は貼合位置１００まで基材１０を搬送する基材１０の移動経路である。第１搬送経路１１０には、搬送ローラ１６が配置されており、この搬送ローラ１６の回転駆動により、基材１０が第１搬送経路１１０を所定の速度で搬送される。 The 1st conveyance apparatus 15 conveys the base material 10 in which the pattern 11 was formed to the bonding position 100 through the 1st conveyance path | route 110. FIG. The 1st conveyance path | route 110 is a movement path | route of the base material 10 which conveys the base material 10 to the bonding position 100. FIG. A conveyance roller 16 is disposed in the first conveyance path 110, and the base material 10 is conveyed along the first conveyance path 110 at a predetermined speed by the rotation of the conveyance roller 16.
　本実施形態では、基材１０は帯状に形成されるロール材料であり、貼合位置１００に途切れることなく供給される。基材１０の表面には、所定のパターン１１が搬送方向に間隔をあけて形成される。なお、パターン１１は、搬送方向に１列形成される構成であってもよいし、複列形成される構成であってもよい。パターン１１は、例えば、ラミネート装置１に至る前の上流工程で、エッチング処理等によって基材１０に形成される。 In this embodiment, the base material 10 is a roll material formed in a strip shape, and is supplied to the bonding position 100 without interruption. A predetermined pattern 11 is formed on the surface of the base material 10 at intervals in the transport direction. The pattern 11 may be formed in a single row in the transport direction or may be formed in a double row. The pattern 11 is formed on the base material 10 by an etching process or the like, for example, in an upstream process before reaching the laminating apparatus 1.
　第１張力管理装置１７は、第１搬送経路１１０を搬送される基材１０の張力を管理する。基材１０に付与される張力は、基材１０を構成する材料や厚みによって設定される。第１張力管理装置１７により、張力が適切に管理された状態で基材１０が下流側に送られる。基材１０の張力は、ロードセル（図示省略）等の張力検出部によって検出し、後述の制御部９０が張力管理を行う。 The first tension management device 17 manages the tension of the base material 10 transported through the first transport path 110. The tension applied to the base material 10 is set depending on the material and thickness of the base material 10. The base material 10 is sent to the downstream side in a state where the tension is appropriately managed by the first tension management device 17. The tension of the base material 10 is detected by a tension detection unit such as a load cell (not shown), and the control unit 90 described later performs tension management.
　第２搬送装置２５は、第２搬送経路１２０を通じてマスキング材２０を貼合位置１００まで搬送する。第２搬送経路１２０は、第１搬送経路１１０とは異なる経路であり、第１搬送経路１１０の貼合位置１００に合流するマスキング材２０の移動経路である。第２搬送経路１２０の貼合位置１００側にはラミネートローラ２６が配置されており、このラミネートローラ２６の回転駆動により、マスキング材２０が第２搬送経路１２０を所定の速度で搬送される。 The second transport device 25 transports the masking material 20 to the bonding position 100 through the second transport path 120. The second conveyance path 120 is a path different from the first conveyance path 110 and is a movement path of the masking material 20 that joins the bonding position 100 of the first conveyance path 110. A laminating roller 26 is disposed on the bonding position 100 side of the second conveying path 120, and the masking material 20 is conveyed along the second conveying path 120 at a predetermined speed by the rotational driving of the laminating roller 26.
　マスキング材２０は、帯状に延びており、貼合位置１００まで連続的に供給される。マスキング材２０には剥離シート２１が接着されており、後述する剥離位置１０２に到達するまでマスキング材２０と剥離シート２１は一体的に第２搬送経路１２０を搬送され、剥離位置１０２で剥離シート２１が剥離された後、貼合位置１００に送られる。 The masking material 20 extends in a band shape and is continuously supplied to the bonding position 100. A release sheet 21 is bonded to the masking material 20, and the masking material 20 and the release sheet 21 are integrally conveyed on the second conveyance path 120 until reaching a later-described release position 102, and the release sheet 21 is released at the release position 102. After being peeled off, it is sent to the bonding position 100.
　レーザ加工装置３０は、剥離シート２１が接着した状態のマスキング材２０に対してレーザによる切断加工を行う。レーザ加工装置３０は、ガルバノタイプのものが用いられる。なお、マスキング材２０に加工を行うレーザは、ガルバノタイプに限定される訳ではなく、事情に応じて適宜変更できる。 The laser processing apparatus 30 performs a cutting process with a laser on the masking material 20 with the release sheet 21 adhered thereto. The laser processing apparatus 30 is a galvano type. In addition, the laser which processes the masking material 20 is not necessarily limited to a galvano type | mold, It can change suitably according to a situation.
　レーザの照射位置１０１は、第２搬送経路１２０における貼合位置１００の上流側に設定される。レーザ加工装置３０は、マスキング材２０の剥離シート２１が接着されている側の反対側からマスキング材２０にレーザを照射してレーザ加工を行う。 The laser irradiation position 101 is set on the upstream side of the bonding position 100 in the second transport path 120. The laser processing apparatus 30 performs laser processing by irradiating the masking material 20 with laser from the opposite side of the masking material 20 to which the release sheet 21 is bonded.
　レーザ加工では、所定の形状を切り抜くようにマスキング材２０にレーザを照射する。マスキング材２０のレーザを加工する加工部分は、基材１０にマスキング材２０を貼り合わせたときに加工部分がパターン１１に応じた所定の部分に位置するように設定される。 In laser processing, the masking material 20 is irradiated with laser so as to cut out a predetermined shape. The processing portion for processing the laser of the masking material 20 is set so that the processing portion is located at a predetermined portion corresponding to the pattern 11 when the masking material 20 is bonded to the base material 10.
　本実施形態のレーザ加工では、マスキング材２０の厚みに応じた深度でレーザ加工を行っており、剥離シート２１までは切断しないようになっている。 In the laser processing according to the present embodiment, laser processing is performed at a depth corresponding to the thickness of the masking material 20, and the release sheet 21 is not cut.
　シート剥離装置５０は、マスキング材２０が貼合位置１００に到達する前でマスキング材２０から剥離シート２１を剥離する。剥離シート２１が剥離される剥離位置１０２は、第２搬送経路１２０における照射位置１０１の下流側であって貼合位置１００の上流側に設定されており、基材１０に貼り合わされる手前でマスキング材２０から剥離シート２１が剥離される。 The sheet peeling device 50 peels the release sheet 21 from the masking material 20 before the masking material 20 reaches the bonding position 100. The peeling position 102 from which the peeling sheet 21 is peeled is set on the downstream side of the irradiation position 101 in the second transport path 120 and on the upstream side of the bonding position 100, and is masked before being bonded to the base material 10. The release sheet 21 is peeled from the material 20.
　剥離位置１０２で剥離された剥離シート２１はシート剥離装置５０側に送られる。なお、剥離位置１０２の上流側で行われたレーザ加工では、マスキング材２０の部分だけが切断されるようにレーザの深度が設定されており、剥離シート２１の切断は行われない。そのため、マスキング材２０のうちレーザ加工によって切り出された不要な部分は、剥離位置１０２で剥離される剥離シート２１に接着したままマスキング材２０から離間する。即ち、レーザ加工によって切断された不要な部分は、剥離位置１０２で剥離シート２１とともに除去され、貼合位置１００に到達しない構成となっている。 The release sheet 21 peeled at the peeling position 102 is sent to the sheet peeling apparatus 50 side. In the laser processing performed on the upstream side of the peeling position 102, the laser depth is set so that only the portion of the masking material 20 is cut, and the peeling sheet 21 is not cut. Therefore, an unnecessary portion of the masking material 20 cut out by laser processing is separated from the masking material 20 while being adhered to the release sheet 21 to be peeled off at the peeling position 102. That is, the unnecessary part cut | disconnected by laser processing is removed with the peeling sheet 21 in the peeling position 102, and has the structure which does not reach the bonding position 100. FIG.
　第２張力管理装置２７は、第２搬送経路１２０を搬送されるマスキング材２０の張力を管理する。マスキング材２０に付与される張力は、マスキング材２０や剥離シート２１を構成する材料や厚みによって設定される。第２張力管理装置２７により、張力が適切に管理された状態でマスキング材２０が下流側に送られる。マスキング材２０の張力は、ロードセル（図示省略）等の張力検出部によって検出し、後述の制御部９０が張力管理を行う。 The second tension management device 27 manages the tension of the masking material 20 transported along the second transport path 120. The tension applied to the masking material 20 is set according to the material and thickness of the masking material 20 and the release sheet 21. The masking material 20 is sent to the downstream side in a state where the tension is appropriately managed by the second tension management device 27. The tension of the masking material 20 is detected by a tension detection unit such as a load cell (not shown), and the control unit 90 described later performs tension management.
　ＣＣＤカメラ３５は、第１搬送経路１１０を流れる基材１０の画像情報を取得する画像検出部である。ＣＣＤカメラ３５が画像情報を取得する撮像位置１０３は、第１搬送経路１１０における貼合位置１００の上流側に設定される。 The CCD camera 35 is an image detection unit that acquires image information of the base material 10 flowing through the first transport path 110. The imaging position 103 where the CCD camera 35 acquires image information is set on the upstream side of the bonding position 100 in the first transport path 110.
　制御部９０は、ラミネート装置１の各種の制御を行うコンピュータである。制御部９０によって基材１０の搬送速度の調整、搬送中の基材１０に付与される張力管理、マスキング材２０の搬送速度の調整、マスキング材２０の張力管理、レーザ加工装置３０のレーザ加工制御等が実行される。 The control unit 90 is a computer that performs various controls of the laminating apparatus 1. Adjustment of the conveyance speed of the substrate 10 by the control unit 90, management of tension applied to the substrate 10 being conveyed, adjustment of the conveyance speed of the masking material 20, management of tension of the masking material 20, and laser processing control of the laser processing device 30 Etc. are executed.
　レーザ加工制御では、第２搬送経路１２０を搬送されるマスキング材２０に対してレーザを照射して所定の形状を切り出す切断加工を行う。マスキング材２０における切断加工を行う位置は、基材１０に貼り合わせたときにパターン１１に合致する必要がある。そのため、第１搬送経路１１０を搬送される基材１０の位置に応じてレーザを照射するタイミングが設定される。基材１０は、予め設定される搬送速度で搬送されており、搬送速度と経過時間等によって基材１０の現在位置を推定することができる。しかし、基材１０の搬送には搬送誤差が生じる場合がある。本実施形態では、ＣＣＤカメラ３５が取得する画像情報によって制御部９０が搬送誤差を検出し、この搬送誤差に基づいてレーザ照射のタイミングが補正される。なお、マスキング材２０はパターン１１の一部をマスキングするものであってもよいし、全部をマスキングするものであってもよい。このように、マスキング材２０のマスキングの仕方は、事情に応じて適したものを採用できる。 In the laser processing control, the masking material 20 transported through the second transport path 120 is irradiated with a laser to perform cutting processing for cutting out a predetermined shape. The position where the masking material 20 is to be cut needs to match the pattern 11 when bonded to the substrate 10. Therefore, the timing for irradiating the laser is set according to the position of the base material 10 transported along the first transport path 110. The base material 10 is transported at a preset transport speed, and the current position of the base material 10 can be estimated from the transport speed and the elapsed time. However, a conveyance error may occur in the conveyance of the base material 10. In the present embodiment, the control unit 90 detects a transport error based on the image information acquired by the CCD camera 35, and the laser irradiation timing is corrected based on the transport error. The masking material 20 may mask a part of the pattern 11 or may mask the whole. Thus, the masking method of the masking material 20 can employ a suitable one depending on the circumstances.
　本実施形態の制御部９０には、実際の基材１０の位置を特定するための基準形状が記憶されている。基準形状は、パターン１１そのものでもよいし、パターン１１の一部でもよいし、パターン１１の外側に形成される特徴を持った形状でもよい。基準形状は、ＣＣＤカメラ３５の撮像範囲に入る位置にあり、視覚的に他の形状と比較するための特徴点を有する形状、模様、色彩又はこれらの結合である。 In the control unit 90 of this embodiment, a reference shape for specifying the actual position of the base material 10 is stored. The reference shape may be the pattern 11 itself, a part of the pattern 11, or a shape having characteristics formed outside the pattern 11. The reference shape is a shape, a pattern, a color, or a combination thereof having a characteristic point for visually comparing with another shape at a position that falls within the imaging range of the CCD camera 35.
　搬送誤差の検出例について説明する。制御部９０は、ＣＣＤカメラ３５が取得した画像情報の中から基準形状を抽出し、当該基準形状の位置に基づいて搬送誤差を算出する。搬送誤差は、ＣＣＤカメラ３５が撮像した画像情報に含まれる基準形状の位置と、搬送速度等から想定される基準形状の想定位置と、のずれから算出し、算出した搬送誤差をレーザ照射のタイミングに反映させる。例えば、第１搬送経路１１０において画像情報の基準形状の位置が想定位置よりも上流側に位置する場合は、基材１０の搬送が遅れていることになるので、その遅れ量にあわせてレーザ照射を行うタイミングを遅らせる。逆に、第１搬送経路１１０において基準形状の位置が想定位置よりも下流側に位置する場合は、基材１０の搬送が早まっていることになるので、早まった量に合わせてレーザ照射を行うタイミングを早める。なお、制御部９０による画像情報に基づく搬送誤差の検出は、この方法に限らず、種々の方法を採用することができる。 An example of transport error detection will be described. The control unit 90 extracts a reference shape from the image information acquired by the CCD camera 35, and calculates a transport error based on the position of the reference shape. The conveyance error is calculated from the difference between the position of the reference shape included in the image information captured by the CCD camera 35 and the assumed position of the reference shape assumed from the conveyance speed, and the calculated conveyance error is the timing of laser irradiation. To reflect. For example, when the position of the reference shape of the image information is positioned upstream of the assumed position in the first transport path 110, the transport of the base material 10 is delayed, so laser irradiation is performed in accordance with the delay amount. Delay the timing of Conversely, when the position of the reference shape is located on the downstream side of the assumed position in the first transport path 110, the transport of the base material 10 is accelerated, and laser irradiation is performed according to the accelerated amount. Advance timing. In addition, the detection of the conveyance error based on the image information by the control unit 90 is not limited to this method, and various methods can be employed.
　レーザ加工が行われたマスキング材２０は、シート剥離装置５０によって剥離位置１０２で剥離シート２１が剥離され、接着面が露出した状態でラミネートローラ２６により反転されて貼合位置１００に搬送される。第１搬送経路１１０と第２搬送経路１２０が合流する貼合位置１００では、第１搬送装置１５によって搬送される基材１０のパターン１１が形成される面に、マスキング材２０の剥離シート２１が剥離された面が貼り合わされて一体となり、この状態で下流工程へと搬送される。 The masking material 20 that has been subjected to laser processing is peeled off from the release sheet 21 at the release position 102 by the sheet peeling apparatus 50, is reversed by the laminating roller 26 with the adhesive surface exposed, and is conveyed to the bonding position 100. At the bonding position 100 where the first transport path 110 and the second transport path 120 join, the release sheet 21 of the masking material 20 is formed on the surface on which the pattern 11 of the base material 10 transported by the first transport device 15 is formed. The peeled surfaces are bonded together to be integrated, and in this state, they are conveyed to a downstream process.
　ラミネート装置１の下流工程では、マスキング材２０が貼り合わされた基材１０が枚葉で切断され、ラミネートが施された電子部品が製造される。 In the downstream process of the laminating apparatus 1, the base material 10 to which the masking material 20 is bonded is cut into single sheets, and an electronic component on which lamination has been performed is manufactured.
　上記実施形態によれば、以下のような効果を奏する。
　ラミネート装置（ウェブ貼合装置）１は、所定のパターン１１が搬送方向に間隔をあけて複数形成された基材（第１ウェブ）１０を貼合位置１００に第１搬送経路１１０を通じて搬送する第１搬送装置１５と、基材１０に貼り合わされるマスキング材（第２ウェブ）２０を貼合位置１００に第２搬送経路１２０を通じて搬送する第２搬送装置２５と、第１搬送経路１１０における貼合位置１００の上流側で基材１０の画像情報を取得するＣＣＤカメラ３５（画像検出部）と、第２搬送経路１２０における貼合位置１００の上流側でマスキング材２０に対してレーザ加工を行うレーザ加工装置３０と、を備える。ＣＣＤカメラ３５が取得した画像情報に基づいて基材１０の搬送誤差を取得し、当該搬送誤差に基づいてマスキング材２０に対するレーザ加工が調整される。 According to the above embodiment, the following effects are obtained.
A laminating apparatus (web bonding apparatus) 1 conveys a substrate (first web) 10 in which a plurality of predetermined patterns 11 are formed at intervals in the conveying direction to a bonding position 100 through a first conveying path 110. 1 conveyance device 15, 2nd conveyance device 25 which conveys masking material (2nd web) 20 pasted on substrate 10 to pasting position 100 through 2nd conveyance course 120, and pasting in the 1st conveyance course 110 A laser that performs laser processing on the masking material 20 on the upstream side of the bonding position 100 in the second transport path 120 and a CCD camera 35 (image detection unit) that acquires image information of the base material 10 on the upstream side of the position 100. And a processing device 30. Based on the image information acquired by the CCD camera 35, a conveyance error of the substrate 10 is acquired, and laser processing on the masking material 20 is adjusted based on the conveyance error.
　これにより、実際の基材１０の位置がマスキング材２０に対するレーザ加工に反映されるので、レーザ加工を高精度に行うことができ、基材１０にマスキング材２０を貼り合わせる作業を高精度に行うことができる。また、加工が施されたマスキング材２０を枚葉にカットされる前の基材１０に高精度に貼り合わせた後に、マスキング材２０が張り合わされた基材を枚葉にカットすることができる。従って、枚葉にカットした基材ごとにマスキング材を貼り合わせる場合に比べてマスキング材２０を基材１０に貼り合わせる作業を一度で行うことができるので、作業時間を短縮でき、作業効率を効果的に向上させることができる。また、プレス装置に比べて装置構成が小さいレーザ加工装置３０を用いて切断加工を行うので、装置構成をコンパクトにまとめることができるとともに、照射位置１０１から貼合位置１００までの距離を短くすることができ、貼合精度を向上させることができる。即ち、ＣＣＤカメラ３５で画像を検出する対象が基材１０であるのに対し、レーザ加工を行う対象が基材１０とは異なるマスキング材２０という全く別の材料である構成において、高精度に貼り合わせる技術が実現されるのである。 Thereby, since the actual position of the base material 10 is reflected in the laser processing on the masking material 20, the laser processing can be performed with high accuracy, and the operation of attaching the masking material 20 to the base material 10 is performed with high accuracy. be able to. In addition, after the processed masking material 20 is bonded to the base material 10 before being cut into single sheets with high accuracy, the base material on which the masking material 20 is bonded can be cut into single sheets. Accordingly, the masking material 20 can be bonded to the base material 10 at a time compared to the case where the masking material is bonded to each base material cut into single sheets, so that the work time can be shortened and work efficiency can be improved. Can be improved. Moreover, since cutting is performed using the laser processing apparatus 30 having a smaller apparatus configuration than the press apparatus, the apparatus configuration can be compactly combined and the distance from the irradiation position 101 to the bonding position 100 can be shortened. And the bonding accuracy can be improved. That is, in the configuration in which the object whose image is to be detected by the CCD camera 35 is the base material 10, but the object to be laser-processed is a completely different material called the masking material 20 different from the base material 10, it is applied with high accuracy. The technology to match is realized.
　また、本実施形態では、搬送誤差に基づくレーザ加工の調整は、レーザ照射を行うタイミングを補正することで行われる。 In the present embodiment, the adjustment of the laser processing based on the conveyance error is performed by correcting the timing of performing the laser irradiation.
　これにより、複雑なロジックを用いることなくレーザ照射のタイミングを調整するというシンプルな処理で第１搬送装置１５によって搬送される基材１０の搬送誤差をレーザ加工に反映することができる。 Thereby, the conveyance error of the substrate 10 conveyed by the first conveyance device 15 can be reflected in the laser processing by a simple process of adjusting the timing of laser irradiation without using complicated logic.
　また、本実施形態では、ラミネート装置１は、第１搬送装置１５によって搬送される基材１０の張力を管理する第１張力管理装置１７と、第２搬送装置２５によって搬送されるマスキング材２０の張力を管理する第２張力管理装置２７と、を更に備える。 In the present embodiment, the laminating apparatus 1 includes a first tension management device 17 that manages the tension of the base material 10 that is transported by the first transport device 15 and a masking material 20 that is transported by the second transport device 25. And a second tension management device 27 for managing tension.
　これにより、適切な張力で基材１０及びマスキング材２０が安定して搬送されるので、搬送誤差が生じ難くなり、貼り合わせ精度も一層向上させることができる。特に、プレス装置に比べて配置スペースを大きく確保する必要がないレーザ加工装置３０により、照射位置１０１から貼合位置１００までの距離を短くできる構成において、張力管理を容易にする一層の効果を奏することができる。 Thereby, since the base material 10 and the masking material 20 are stably conveyed with an appropriate tension, a conveyance error is less likely to occur, and the bonding accuracy can be further improved. In particular, in the configuration in which the distance from the irradiation position 101 to the bonding position 100 can be shortened by the laser processing apparatus 30 that does not need to ensure a large arrangement space compared to the press apparatus, there is a further effect of facilitating tension management. be able to.
　また、本実施形態では、ラミネート装置１は、剥離シート２１が接着された状態で第２搬送経路１２０を搬送されるマスキング材２０から貼合位置１００の上流側で剥離シート２１を剥離するシート剥離装置５０を更に備える。レーザ加工装置３０は、シート剥離装置５０により剥離シート２１が剥離される剥離位置１０２の上流側で、マスキング材２０の剥離シート２１が接着される側と反対側の面にレーザを照射可能に構成される。 Moreover, in this embodiment, the laminating apparatus 1 is the sheet peeling which peels the peeling sheet 21 in the upstream of the bonding position 100 from the masking material 20 conveyed in the 2nd conveyance path 120 in the state to which the peeling sheet 21 was adhere | attached. The apparatus 50 is further provided. The laser processing device 30 is configured to be able to irradiate a laser on the surface opposite to the side to which the release sheet 21 of the masking material 20 is bonded, upstream of the release position 102 where the release sheet 21 is peeled off by the sheet peeling device 50. Is done.
　これにより、マスキング材２０にレーザを照射するタイミングに基材１０の搬送誤差を反映させつつ、レーザ加工で切り出した不要な部分を剥離シート２１とともに剥離する構成も可能となる。 Thereby, it is possible to adopt a configuration in which unnecessary portions cut out by laser processing are peeled off together with the release sheet 21 while reflecting the transport error of the base material 10 at the timing of irradiating the masking material 20 with laser.
　以上、本発明の好ましい実施形態について説明したが、本発明は、上述の実施形態に制限されるものではなく、適宜変更が可能である。 The preferred embodiments of the present invention have been described above, but the present invention is not limited to the above-described embodiments, and can be modified as appropriate.
　上記実施形態では、レーザ加工装置３０は、剥離シート２１が接着された状態のマスキング材２０に対してレーザによってマスキング材２０のみを切断する加工を行う構成であるが、この構成に限定されない。例えば、マスキング材２０とともに剥離シート２１を打ち抜くように切断加工を行う構成としてもよい。また、場合によっては剥離シート２１を剥離した後にマスキング材２０にレーザ加工を行う構成としてもよい。 In the above embodiment, the laser processing apparatus 30 is configured to perform the process of cutting only the masking material 20 with a laser on the masking material 20 with the release sheet 21 adhered thereto, but is not limited to this configuration. For example, it is good also as a structure which cuts so that the peeling sheet 21 may be punched out with the masking material 20. FIG. In some cases, the masking material 20 may be laser processed after the release sheet 21 is peeled off.
　上記実施形態では、第１搬送装置１５及び第２搬送装置２５が停止することなく連続的に搬送する構成であるが、搬送、停止を繰り返して搬送する構成に変更することもできる。 In the above embodiment, the first transport device 15 and the second transport device 25 are configured to transport continuously without stopping, but can be changed to a configuration in which transport and stop are repeated and transported.
　上記実施形態では、レーザの照射タイミングを補正することで搬送誤差に基づくレーザ加工の調整を行う構成であるが、この構成に限定されない。例えば、基材１０の搬送速度、マスキング材２０の搬送速度、第１張力管理装置１７によって付与する張力、第２張力管理装置２７によって付与する張力又はこれらの組み合せを搬送誤差に基づいて調整する構成としてもよい。レーザ加工の調整は、適宜の方法を採用することができる。 In the above embodiment, the laser processing is adjusted based on the conveyance error by correcting the laser irradiation timing, but the present invention is not limited to this configuration. For example, the structure which adjusts the conveyance speed of the base material 10, the conveyance speed of the masking material 20, the tension applied by the first tension management device 17, the tension applied by the second tension management device 27, or a combination thereof based on the conveyance error. It is good. An appropriate method can be adopted for adjustment of laser processing.
　上記実施形態では、所定のパターンが形成された基材１０を第１ウェブとし、マスキング材２０を第２ウェブとして説明したが、この構成に限定されない。例えば、第１ウェブにメトロサーク（登録商標）等のような樹脂多層基板を用いることもできる。 In the above embodiment, the base material 10 on which a predetermined pattern is formed is described as the first web, and the masking material 20 is described as the second web. However, the present invention is not limited to this configuration. For example, a resin multilayer substrate such as MetroSark (registered trademark) can be used for the first web.
　１　ラミネート装置（ウェブ貼合装置）
　１０　基材（第１ウェブ）
　１１　パターン
　１５　第１搬送装置
　２０　マスキング材（第２ウェブ）
　２５　第２搬送装置
　３０　レーザ加工装置
　３５　ＣＣＤカメラ（画像検出部）
　１００　貼合位置
　１１０　第１搬送経路
　１２０　第２搬送経路 1 Laminating device (web laminating device)
10 Substrate (first web)
11 Pattern 15 First conveying device 20 Masking material (second web)
25 Second conveying device 30 Laser processing device 35 CCD camera (image detection unit)
100 bonding position 110 1st conveyance path 120 2nd conveyance path

Claims (4)

  1. 　複数のウェブを貼り合わせるウェブ貼合装置であって、
    　所定のパターンが搬送方向に間隔をあけて複数形成された第１ウェブを貼合位置に第１搬送経路を通じて搬送する第１搬送装置と、
    　前記第１ウェブに貼り合わされる第２ウェブを前記貼合位置に第２搬送経路を通じて搬送する第２搬送装置と、
    　前記第１搬送経路における前記貼合位置の上流側で前記第１ウェブの画像情報を取得する画像検出部と、
    　前記第２搬送経路における前記貼合位置の上流側で前記第２ウェブに対してレーザ加工を行うレーザ加工装置と、
    を備え、
    　前記画像検出部が取得した前記画像情報に基づいて前記第１ウェブの搬送誤差を取得し、当該搬送誤差に基づいて前記第２ウェブに対する前記レーザ加工が調整されるウェブ貼合装置。     A web laminating device for laminating a plurality of webs,
    A first transport device that transports a plurality of first webs formed with a predetermined pattern at intervals in the transport direction to a bonding position through a first transport path;
    A second conveying device for conveying the second web to be bonded to the first web to the bonding position through a second conveying path;
    An image detection unit for acquiring image information of the first web on the upstream side of the bonding position in the first transport path;
    A laser processing apparatus for performing laser processing on the second web on the upstream side of the bonding position in the second transport path;
    With
    A web laminating apparatus that acquires a conveyance error of the first web based on the image information acquired by the image detection unit, and that adjusts the laser processing on the second web based on the conveyance error.
  2. 　前記搬送誤差に基づく前記レーザ加工の調整は、レーザ照射を行うタイミングを補正することで行われる請求項１に記載のウェブ貼合装置。 The web bonding apparatus according to claim 1, wherein the adjustment of the laser processing based on the conveyance error is performed by correcting a timing of performing laser irradiation.
  3. 　前記第１搬送装置によって搬送される前記第１ウェブの張力を管理する第１張力管理部と、
    　前記第２搬送装置によって搬送される前記第２ウェブの張力を管理する第２張力管理部と、を更に備える請求項１又は２に記載のウェブ貼合装置。     A first tension management unit that manages tension of the first web conveyed by the first conveying device;
    The web bonding apparatus according to claim 1, further comprising: a second tension management unit that manages tension of the second web conveyed by the second conveying apparatus.
  4. 　剥離シートが接着された状態で前記第２搬送経路を搬送される前記第２ウェブから前記貼合位置の上流側で前記剥離シートを剥離するシート剥離装置を更に備え、
    　前記レーザ加工装置は、
    　前記シート剥離装置により前記剥離シートが剥離される剥離位置の上流側で、前記第２ウェブの前記剥離シートが接着される側と反対側の面にレーザを照射可能な請求項１から３までの何れかに記載のウェブ貼合装置。     A sheet peeling device for peeling the release sheet on the upstream side of the bonding position from the second web conveyed along the second conveyance path in a state where the release sheet is adhered;
    The laser processing apparatus is
    The laser beam can be irradiated to the surface opposite to the side to which the release sheet is bonded of the second web on the upstream side of the release position where the release sheet is peeled off by the sheet peeling device. The web bonding apparatus in any one.
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