TWI723688B - Method for manufacturing thin wire - Google Patents

Abstract

The present invention relates to the method for manufacturing a thin wire, comprises: a supplying step, a wire forming step, an adhesive step, a transformation step and a separation step. A first processed subject including an electric conduct layer and a first adhesive layer is provided in the supplying step; a wire portion and a remainder portion, separated from each other, are formed in the electric conduct layer through removing a part of the electric conduct layer in the wire forming step; a second adhesive layer is connected to the electric conduct layer in the adhesive step. The adhesive of the second adhesive layer is changed through processing a part of the second adhesive layer in the transformation step. Lastly, the first processed subject and the second adhesive layer are separated in the separation step. The remainder portion is separated from the first adhesive layer because the different adhesive strength between the electric conduct layer, the first adhesive layer and the second adhesive layer, the wire portion also being separated from the second adhesive layer and remained in the first adhesive layer to form the thin wire.

Description

Processing method of thin circuit

The invention relates to a processing method of a circuit, in particular to a processing method of a thin circuit for manufacturing a circuit on a sheet element.

Laser processing is the use of an optical system to focus and form a high-power laser beam, and project the laser beam to the processed object, so that the laser beam can mark, cut, scribe, groove, and cut the processed object. Shot processing operations.

Among them, when laser processing is used to manufacture thin processed objects, an adhesive film is first attached to one side of a thin processed object, and then a laser beam is projected on the thin processed object by a laser cutting mechanism to remove the thin processed object When all the parts to be removed of the thin processed object are removed by the laser beam, the appearance and contour of the thin processed object will change, leaving only the reserved part of the thin processed object. At this time, stick the film Part of the area will not be covered by thin processed objects.

However, when all the removed parts of the thin processed object are removed by the laser beam, the laser beam will be projected to a part of the adhesive film. Once the laser beam is projected on the adhesive film for a long time, the adhesive film will be carbonized and become black. Dust, and once the black dust adheres to the reserved part of the thin processed object, it will affect the mechanical properties (such as conductivity) of the reserved part of the thin processed object, and will relatively reduce the service life of the reserved part of the processed object.

The main purpose of the present invention is to provide a thin circuit processing method, in the process by adding the use of the difference in the bonding strength between the materials to make the circuit on the sheet component, reducing the possibility of using laser to manufacture the sheet component. The problem.

In order to achieve the above objective, the present invention includes: a processing method of a thin circuit, including: a feeding step, a circuit forming step, a bonding step, a deterioration step, and a separation step.

In the feeding step, a first processed part is provided, the first processed part includes a conductive layer and a first adhesive film layer, the first adhesive film layer is connected to one side of the conductive layer with a first bonding strength In the circuit forming step, a part of the conductive layer of the first processed part is removed along a processing path, so that the conductive layer forms a circuit portion and a remaining material portion that are separated from each other.

In the bonding step, a second adhesive film layer is connected to the circuit portion and the remaining material portion of the conductive layer, so that the second adhesive film layer is connected to the other opposite side of the conductive layer with a second bonding strength .

In the modification step, a light source is used to process one of the first adhesive film layer or the second adhesive film layer to form a processed adhesive film layer so that the processed adhesive film layer is connected to one of the circuit portion or the remaining material portion The bonding strength of the other is changed to form a third bonding strength, and the remaining part of the processed adhesive film layer maintains the original bonding strength to be connected to the other of the circuit portion or the remaining material portion.

In the separating step, the first adhesive film layer and the second adhesive film layer are respectively moved toward a separation direction away from each other, so that one of the first adhesive film layer or the second adhesive film layer leads the circuit portion Separate from the other film layer and the remaining material part.

Regarding the type of mechanism for changing the processed adhesive film layer, in a preferred embodiment, the processing method of the thin circuit is to process the conductive layer through a laser mechanism and change the viscosity of the processed adhesive film layer.

Regarding the mating hardware part: In a preferred embodiment, the circuit forming step is to provide a fixed position laser mechanism and a feeder that can drive the first workpiece to move The laser mechanism has at least one deflectable laser head to process the conductive layer in the circuit forming step, and when the laser mechanism processes the first processed part, the feeding mechanism can continue to drive The first workpiece is moved.

In conjunction with the aforementioned hardware, in this embodiment, the circuit forming step further includes: a feeding setting step and a path planning step; in the feeding setting step, the feeding mechanism drives the first processed part to The moving speed moves, and the feeding mechanism generates a moving message corresponding to the moving speed, and transmits the moving message to an arithmetic mechanism; in the path planning step, the processing path is provided to the arithmetic mechanism, and the calculation The mechanism calculates the processing path with the movement information to form processing information used by the laser mechanism in the circuit forming step and a deterioration message used by the laser mechanism in the deterioration step, and sent to the Laser mechanism.

The present invention also provides a method for processing a thin circuit, including: a feeding step, a circuit forming step, an adhesive film providing step, an adhesive film bonding step, and a separating step; wherein, due to the feeding step and the circuit forming step The steps and the separation step are the same as the aforementioned method, so they will not be repeated here.

In the step of providing the adhesive film, a second adhesive film layer for connecting the conductive layer is provided, a part of the second adhesive film layer forms a first bonding area with a second bonding strength, and the remaining part penetrates A light source is processed to form a second bonding area with a third bonding strength.

In the adhesive film bonding step, the second adhesive film layer is connected to the other opposite side of the conductive layer, and the first bonding area is connected to one of the circuit portion or the remaining material portion, the first The two bonding areas are connected to the other of the line part or the remaining material part.

For other methods and mechanisms for changing the properties of the first and second adhesive film layers (generating the second adhesive zone), refer to the foregoing description, and will not be repeated here.

It can be seen from the above description that the feature of the present invention is that the difference in the connection strength between the second adhesive film layer and the conductive layer on the first adhesive film layer (circuit part, residual material part) makes the conductive layer The connection strength between the part to be retained and the first adhesive film layer is greater than the connection strength between the part to be retained on the conductive layer and the second adhesive film layer, and the part to be removed on the conductive layer and the first adhesive film layer The connection strength between the conductive layer is less than the connection strength between the part to be removed on the conductive layer and the second adhesive film layer, so that when the second adhesive film layer is separated from the conductive layer, the part to be removed on the conductive layer will be with the second adhesive film layer. The film layer is separated from the first adhesive film layer together, and the remaining part forms a circuit on the first adhesive film layer.

11: The first feed roller

12: The second feed roller

13: Support table

14: Finished product receiving roller

2: Feeding mechanism

21: Raw material drum

22: recycling drum

3: Line forming mechanism

31: The first laser mechanism

310: Laser head

4: Deteriorating institutions

41: The second laser mechanism

5: Clean up institutions

51: Blowing and exhausting machine

6: Computing mechanism

61: Computer

S1: Feeding step

S21: Feed setting steps

S22: Path planning steps

S3: circuit forming steps

S4A: bonding step

S4B: Film supply steps

S5A: Deteriorating step

S5B: Adhesive film bonding step

S6: separation step

7: Conductive layer

71: Processing path

7a: Line Department

7b: Remaining material department

8: The first film layer

9: The second film layer

9a: The first junction zone

9b: The second junction zone

9c: The first bonding area

9d: The second bonding area

91: diaphragm

92: colloid

D: direction

P1: The first processed part

P2: The second processing part

P3: The third machining part

Fig. 1 is a schematic flow diagram of a preferred embodiment of a method for processing a thin circuit of the present invention; Fig. 2 is a schematic diagram of an apparatus using the embodiment of Fig. 1; Fig. 3A is a schematic diagram of the feeding step in Fig. 1; Fig. 3B is a diagram Fig. 3C is a schematic diagram of the bonding step in Fig. 1; Fig. 3D is a schematic diagram of the deterioration step in Fig. 1; Fig. 3E is a schematic diagram of the separation step in Fig. 1; Fig. 4 is the processing of the thin circuit of the present invention A schematic diagram of the second adhesive film layer in another embodiment of the method.

5 is a schematic flow diagram of another embodiment of the processing method of the thin circuit of the present invention; FIG. 6A is a schematic diagram of the adhesive film deterioration step in FIG. 5; FIG. 6B is a schematic diagram of the adhesive film bonding step in FIG. 5.

In order to facilitate a deeper understanding and understanding of the structure, use and characteristics of the present invention, a preferred embodiment is given, and the detailed description with the drawings is as follows: Please refer to Figures 1 and 2 as shown in In a preferred embodiment, the processing method of the thin circuit of the present invention includes: a feeding step S1, a feeding setting step S21, a path planning step S22, a circuit forming step S3, a bonding step S4A, and a modification step S5A And a separation step S6; and the machine using these steps in this embodiment includes: a feeding mechanism, a feeding mechanism 2, a first laser mechanism 31 as a circuit forming mechanism 3, and a first laser mechanism 31 as a circuit forming mechanism 3. The second laser mechanism 41 of the alteration mechanism 4, a blowing and air extraction machine 51 as the cleaning mechanism 5, and a computer 61 as the calculation mechanism 6.

The feeding mechanism is electrically connected to the computer 61 (not shown in the figure). In terms of composition, as shown in FIG. 2, the feeding mechanism includes: a first feeding roller 11, a second feeding roller 12, and a supporting table. 13 and a finished product receiving roller 14; the first supply roller 11 and the second supply roller 12 are installed on one side of the supporting table 13, and the finished product receiving roller 14 is installed on the other side of the supporting table 13 The first supply roller 11 is used to provide a conductive layer 7, the second supply roller 12 is used to provide a flexible first film layer 8, wherein the first film layer 8 and the conductive The layers 7 are connected to each other on the supporting table 13 (the detailed manner is not limited) to form a first processed part P1 (see FIG. 3A) that moves in a direction D along the supporting table 13, and the finished product receiving roller 14 is provided by A tension drives the first processed part P1 and subsequent processed products to move along the direction D at a moving speed, and receive the processed product after processing is completed; wherein, the present invention does not limit how to join the first glue The film layer 8 and the conductive layer 7 can pass through the possible adhesiveness of the first adhesive film layer 8 itself, or apply glue between the first adhesive film layer 8 and the conductive layer 7, etc. Make changes according to production requirements.

The supply drums (11, 12), the first laser mechanism 31, the blower exhaust machine 51, and the second laser mechanism 41 are electrically connected to the computer 61 (not shown), as shown in FIG. 2 Show that the above components are in sequence On the supporting table 13, the two laser mechanisms (31, 41) and the cleaning mechanism 5 are located between the feeding rollers (11, 12) and the finished product receiving roller 14.

The first laser mechanism 31 is used to process the conductive layer 7 and has at least one deflection laser head 310; the blowing and air extraction machine 51 is used to provide a gas released toward the conductive layer 7 and take it away The first laser mechanism 31 is used to process the conductive layer 7 of the residue; the feeding mechanism 2 is used to provide a second adhesive film layer 9 connected to the conductive layer 7, including a method for providing the second adhesive The raw material roller 21 of the film layer 9 and a recovery roller 22 for receiving the processed second adhesive film layer 9, the second laser mechanism 41 is located between the raw material roller 21 and the recovery roller 22; the second The laser mechanism 41 is used to process the second adhesive film layer 9 to deteriorate the properties of the second adhesive film layer 9 at the processed location and change the bonding between the second adhesive film layer 9 and the conductive layer 7 Strength (detailed later).

For a detailed description of each step, please refer to FIG. 2 and FIG. 3A to FIG. 3E; please refer to FIG. 3A, in the feeding step S1, the conductive layer provided by the first feeding roller 11 7 and the first adhesive film layer 8 provided by the second feed roller 12 are connected to each other on the support table 13 to form the first processed part P1, and wherein the first adhesive film layer 8 is a first The bonding strength is connected to the side of the conductive layer 7 close to the supporting table 13.

2 and 3B, when the first workpiece P1 is driven to move to the first laser mechanism 31, the circuit forming step S3 is performed; in the circuit forming step S3, the first laser The mechanism 31 cuts a portion of the conductive layer 7 on the first processed part P1 through the laser projected by the laser head 310, so that the conductive layer 7 forms a circuit portion 7a separated from each other. A surplus part 7b, wherein, in this embodiment, when the line forming step S3 is performed, the feeding mechanism can still continue to drive the first processed part P1 to move (the reason will be described later).

As shown in FIG. 2, in this embodiment, in order to determine the path of the laser light of the first laser mechanism 31 in the line forming step S3 and process it in accordance with the moving speed provided by the feeding mechanism, the line forming step S3 is performed. Before, the feeding setting step S21 and the path planning step S22 will be performed; in the feeding setting step S21, when the feeding mechanism drives the first workpiece P1 to move at the moving speed, the feeding mechanism will generate And transmit a movement message corresponding to the movement speed to the calculation mechanism 6.

In the path planning step S22, the processing path 71 is provided to the calculation mechanism 6, and the calculation mechanism 6 calculates the processing path 71 in accordance with the movement information to form a path for the first laser mechanism 31 to The processing information to be used in the circuit forming step S3 and a deterioration message for the subsequent second laser mechanism 41 to use in the deterioration step S5A are sent to the laser mechanisms (31, 41).

Wherein, the present invention does not limit how to provide the processing path 71 to the computing mechanism 6 and the detailed time point of performing the feeding setting step S21 and the path planning step S22, as long as the path is formed before the line forming step S3. The processing information is provided to the first laser mechanism 31, and the deterioration information is provided to the second laser mechanism 41 before the deterioration step S5A; the source of the processing information may be an existing electronic component such as a computer 61 There are no restrictions in this case.

As shown in FIGS. 2 and 3C, in the bonding step S4A, on the support table 13, the second adhesive film layer 9 provided by the raw material roller 21 is connected to the conductive layer with a second bonding strength A second processed part P2 is produced on the other side of 7, and the second adhesive film layer 9 is connected to the circuit portion 7a and the remaining material portion 7b at the same time; wherein, when the second adhesive film layer 9 is connected to When the conductive layer 7 is used, the second adhesive film layer 9 is still driven by the recovery roller 22 at the same time.

Furthermore, as shown in FIGS. 2 and 3D, when the second processed part P2 is driven by the finished product receiving roller 14 to move to the second laser mechanism 41, the second laser mechanism 41 is activated to perform the deterioration step S5A to produce a third workpiece P3.

In the deterioration step S5A, the second laser mechanism 41 cooperates with the deterioration information to process the area of the second adhesive film layer 9 so that the properties of the local positions of the second adhesive film layer 9 are changed and distinguished as unaffected. The changed first bonding area 9a and the changed second bonding area 9b (the black part in FIG. 3D), and the change is connected between the circuit portion 7a and the second bonding area 9b of the second bonding area 9b The bonding strength is such that a third bonding strength between the first strength and the second strength is used to connect the circuit portion 7a, while the other part still maintains the original bonding strength (the second bonding strength ) To connect to the remaining part 7b.

As shown in Figures 2 and 3E, when the third workpiece P3 is continuously driven by the finished product receiving roller 14 to move to the end of the support table 13, the separation step S6 is performed. In the separation step S6, the product P3 The receiving roller 14 and the recycling roller 22 are respectively located on opposite sides of the supporting table 13, so that the first adhesive film layer 8 and the second adhesive film layer 9 of the third processed part P3 are separated from each other.

Wherein, during separation, the first bonding strength between the first adhesive film layer 8 and the circuit portion 7a is greater than the third bonding strength between the circuit portion 7a and the second bonding area 9b, but the first The adhesive film layer 8 and the remaining material portion 7b are smaller than the second bonding strength between the remaining material portion 7b and the first joining area 9a, so that the first adhesive film layer 8 and the second adhesive film layer are away from each other When moving in the separation direction, the first adhesive film layer 8 leads the circuit portion 7a to separate from the second bonding area 9b and moves toward the finished product receiving roller 14, and the second adhesive film layer 9 leads the remaining material portion 7b from the The first adhesive film layer 8 is separated and moves toward the recovery roller 22, so that the first adhesive film layer 8 and the circuit portion 7a received by the finished product receiving roller 14 form a thin circuit.

As can be seen from the above description, the feature of the thin circuit processing method is that it penetrates through different parts of the conductive layer 7 on the second adhesive film layer 9 and the first adhesive film layer 8 in the structure shown in FIG. 3D (the circuit portions 7a, The difference in the connection strength between the remaining material part 7b), when the connection strength between the part to be retained on the conductive layer 7 and the first adhesive film layer 8 is greater than the part to be retained on the conductive layer 7 and the second adhesive film The connection strength between the layers 9 and the connection strength between the portion to be removed on the conductive layer 7 and the first adhesive film layer 8 is less than the connection strength between the portion to be removed on the conductive layer 7 and the second adhesive film layer 9 When the second adhesive film layer 9 is separated from the conductive layer 7, the part to be removed on the conductive layer 7 will be separated from the first adhesive film layer 8 together with the second adhesive film layer 9, and the remaining part is in the first adhesive film layer. The adhesive film layer 8 and the first adhesive film layer 8 together form a thin circuit.

In addition, the present invention does not limit the type of hardware equipment of the device applying the above-mentioned thin line processing method. In other embodiments, the first laser mechanism 31 can be changed to a processing machine with a movable laser processing head. In addition, in other embodiments, the cleaning mechanism 5 can also be replaced by a roller with glue, through the viscosity of the glue to remove the residue generated during processing (the glue and the conductive layer 7 The bonding strength is less than the bonding strength between the conductive layer 7 and the first adhesive film layer 8).

The target of the modification step S5A, in other embodiments of the present invention, after the second semi-finished product P2 is manufactured as described above in FIGS. 3A to 3C, the modification is performed on the first adhesive film layer 8 in FIG. 3C. Change in quality step S5A.

Regarding the detailed aspects of the adhesive film layers (8, 9), it can be a single solid flexible adhesive film as shown in Figures 3C to 3E, or it can be coated with a solid flexible film 91 as shown in Figure 4 The liquid colloid 92 is formed on the surface of the film.

In the above-mentioned processing method, the types of the adhesive film layers (8, 9) are not limited. They can be adhesive films that pass through the second laser mechanism 41 and deteriorate through heating, or they can pass through specific wavelengths (such as ultraviolet rays). ) To change the properties of the film (in this embodiment, the modification mechanism 4 is variable More other types of light sources, such as ultraviolet radiation machine (with additional mask, etc.) or ultraviolet laser, etc. (not shown)); the adhesive film layers 8, 9 can be modified to reduce the bonding strength (or viscosity) ), or a material that can increase the bonding strength (or viscosity) after deterioration. In this way, in different embodiments, through the difference in the properties of the rubber, the second and third bonding strengths can be exchanged The relative size relationship determines whether the circuit portion 7a or the remaining material portion 7b is attached to the different adhesive film layers (8, 9) after the separation step S6.

As can be seen from the above description, due to the nature of the rubber material and the object of deterioration, the processing method provided by the present invention can be adjusted according to the processing requirements (such as machine performance limitations or precision requirements) to adjust the sequence between the steps For example, in order to align the deterioration range of the adhesive film layer (8 or 9) processed in the deterioration step S5A with the position of the circuit portion 7a or the remaining material portion 7b, the processing sequence can be adjusted to allow the aforementioned deterioration Step S5A is performed after the bonding step S4A; in order to avoid affecting another film layer when performing the deterioration step S5A, in one type of embodiment, the processing sequence and processing objects can be adjusted so that the deterioration step S5A is adjusted before the bonding step S4A get on.

Please refer to FIG. 5, because the present invention does not limit how to form the third processed part P3 of FIG. 3d between the first adhesive film layer 8, the conductive layer 7 and the second adhesive film layer 9, Therefore, in another embodiment of the present invention, the timing of processing the second adhesive film layer 9 can be modified, and after the circuit forming step S3, an adhesive film providing step S4B and an adhesive film bonding step S5B are performed, and then A thin circuit is generated by performing the separation step S6. The detailed description of the adhesive film providing step S4B and the adhesive film bonding step S5B is as follows: Please refer to FIG. 6A, in the adhesive film providing step S4B, the second The adhesive film layer 9, the modification mechanism 4 (such as the aforementioned second laser mechanism 41 or the mechanism applying ultraviolet rays) cooperates with the movement information and the processing path 71 to process a part of the area on the second adhesive film layer 9 so that The second adhesive film layer 9 provided A first bonding area 9c with the third bonding strength is generated (the black part in the figure), and the remaining part is generated with a second bonding area 9d with the second bonding strength.

Then, as shown in FIG. 6B, in the adhesive film bonding step S5B, the second adhesive film layer 9 is connected to the conductive layer 7, and the first bonding area 9c is connected to the circuit portion 7a. The area 9d is connected to the remaining material part 7b, and then a state as shown in FIG. 3D is generated, so as to generate a thin circuit in the subsequent separation step S6.

Wherein, how to make the position of the first bonding area 9c and the circuit portion 7a, and the second bonding area 9d and the remaining material portion 7b correspond to and be combined can be achieved by matching the moving speed of the feeding mechanism and the feeding mechanism The feeding speed of 2 is such that the speed at which the first processed part P1 is driven by the finished product receiving roller 14 and the speed at which the second adhesive film layer 9 is driven by the recovery roller 22 correspond to each other. The alignment method between the adhesive film layers 8 can refer to the prior art.

Similarly, because there is no limitation on the timing of changing the properties of the first adhesive film layer 8, in other embodiments, a second adhesive zone structure having two adhesive zone structures similar to the adhesive zones 9c and 9d as shown in FIG. 6A can be generated first. After an adhesive film layer 8, the circuit forming step S3 is performed, and then the second adhesive film layer 9 is directly attached to the conductive layer 7 to make it similar to that in FIG. 3D. The conductive layer 7 has undergone a modification and has A structure in which the adhesive film layers in different connection areas and another adhesive film layer that has not undergone any processing are sandwiched, and then the second adhesive film layer 9 and the first adhesive film layer 8 are directly separated to make a product.

Based on the above description, it can be seen that because there is no particular limitation on how to manufacture the structure as shown in Figure 3D, as long as the circuit part 7a, the remaining material part 7b, and the modification mechanism 4 are formed on the conductive layer 7 through the circuit forming mechanism 3 Change the properties of a part of the adhesive film layers 8, 9 and bond the two adhesive film layers 8, 9 to different sides of the wire layer 7, and the deteriorated parts of the adhesive film layers 8, 9 correspond to the circuit part 7a or the remaining part 7b is sufficient. Therefore, in different embodiments, the modification mechanism 4 can be changed according to requirements. The processing object is to change the processing timing of the alteration mechanism 4 or the timing of the alteration step S5A and the line forming step S3 to reduce the impact of the laser on the product.

The above-mentioned embodiments are only used to facilitate the description of the present invention and are not intended to limit them. Without departing from the spirit of the present invention, those skilled in the industry who are familiar with the scope of the invention’s patent application and the description of the invention should make various simple modifications and modifications according to the scope of the patent application and the description of the invention. Included in the scope of the following patent applications.

7: Conductive layer

7a: Line Department

7b: Remaining material department

8: The first film layer

9: The second film layer

9a: The first junction zone

9b: The second junction zone

P3: The third machining part

Claims (6)

A method for processing a thin circuit includes: a feeding step: providing a first processed part continuously driven, the first processed part including a conductive layer and a first adhesive film layer, the first adhesive film layer is The first bonding strength is connected to one side of the conductive layer; a circuit forming step: a laser mechanism is used to remove a part of the conductive layer continuously driven by the first processed part according to a processing path, so that the conductive layers form each other Separate a circuit part and a residual material part; a bonding step: connect a second adhesive film layer to the circuit part and the residual material part of the conductive layer, so that the second adhesive film layer is different from the first A second bonding strength of bonding strength is connected to the other opposite side of the conductive layer, so that the first adhesive film layer, the conductive layer, and the second adhesive film layer form a second processed part that is continuously driven; a deterioration Step: Use the laser mechanism to process the second processed part according to the processing path, so that one of the first adhesive film layer or the second adhesive film layer forms a processed adhesive film layer, and the processed adhesive film layer The bonding strength of one of the area connecting the line portion or the area connecting the remaining material portion is changed to form a third bonding strength, and the third bonding strength is different from the first bonding strength and the second bonding strength, and The remaining part of the processed adhesive film layer maintains the original bonding strength to be connected to the other of the circuit part or the remaining material part, so that a third processed part subjected to continuous movement is covered by the first adhesive film layer and the first adhesive film layer. The two adhesive film layers and the conductive layer are formed together; a separation step: the first adhesive film layer and the second adhesive film layer of the third processed part are respectively moved toward a separation direction away from each other, and the third The workpiece will pass through the first joint strength, the second joint The different viscosities of the strength and the third bonding strength enable one of the first adhesive film layer or the second adhesive film layer to lead the circuit part to separate the other adhesive film layer and the remaining material part. The method for processing a thin circuit according to claim 1, wherein the step of forming the circuit is to use a fixed position laser mechanism and a feeding mechanism capable of driving the first workpiece to move, and the laser mechanism has At least one tiltable laser head is used to process the conductive layer, and when the laser mechanism processes the first processed part, the feeding mechanism can continue to drive the first processed part to move. The method for processing a thin circuit according to claim 2, wherein, before the circuit forming step, it further includes: a feeding setting step: the feeding mechanism drives the first workpiece to move at a moving speed, and the feeding The mechanism generates a movement message corresponding to the movement speed and transmits the movement message to an arithmetic mechanism; and a path planning step: provides the processing path to the arithmetic mechanism, and the arithmetic mechanism matches the processing path with the movement information The calculation is performed to form a processing information used by the laser mechanism in the circuit forming step and a deterioration message used by the laser mechanism in the deterioration step, and then transmitted to the laser mechanism. A method for processing a thin circuit includes: a feeding step: providing a first processed part continuously driven, the first processed part including a conductive layer and a first adhesive film layer, the first adhesive film layer is The first bonding strength is connected to one side of the conductive layer; A circuit forming step: using a laser mechanism to remove a part of the conductive layer continuously driven by the first processed part along a processing path, so that the conductive layer forms a circuit portion and a residual material portion that are separated from each other; An adhesive film providing step: providing a second adhesive film layer for connecting the conductive layer, and a part of the second adhesive film layer forms a first bonding strength that is different from the first bonding strength. The remaining part of the bonding area is processed by a laser mechanism according to the processing path to form a second bonding area having a third bonding strength different from the first bonding strength and the second bonding strength, and the first bonding area The position corresponds to the position of one of the circuit part or the remaining material part, and the position of the second bonding area corresponds to the position of the other of the circuit part and the remaining material part; an adhesive film bonding step: The second adhesive film layer is connected to the other opposite side of the conductive layer, and the first bonding area is connected to one of the circuit portion or the remaining material portion, and the second bonding area is connected to the circuit portion or the remaining material portion. The other part of the remaining material part forms a third processed part subject to continuous movement; a separation step: the first adhesive film layer and the second adhesive film layer are respectively moved toward a separation direction away from each other, the second The three processed parts will separate the circuit portion by one of the first adhesive film layer or the second adhesive film layer through the different bonding strengths of the first bonding strength, the second bonding strength, and the third bonding strength Another film layer and the remaining material part. According to claim 4, the thin circuit processing method, wherein the circuit forming step is performed by using a fixed position laser mechanism and a feeding mechanism capable of driving the first workpiece to move, the laser mechanism having At least one tiltable laser head is used to process the conductive layer, and when the laser mechanism processes the first processed part, the feeding mechanism can continue to drive the first processed part to move. According to claim 4, the method for processing a thin circuit, wherein, before the circuit forming step, it further includes: a feeding setting step: the feeding mechanism drives the first workpiece to move at a moving speed, and the feeding The mechanism generates a movement message corresponding to the movement speed and transmits the movement message to an arithmetic mechanism; and a path planning step: provides the processing path to the arithmetic mechanism, and the arithmetic mechanism matches the processing path with the movement information The calculation is performed to form a processing information used by the laser mechanism in the circuit forming step and a deterioration message used by the laser mechanism in the deterioration step, and then transmitted to the laser mechanism.

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