TWM595374U - Thin circuitry laser processing device - Google Patents

Abstract

This creative thin line laser processing device includes: support platform, feed mechanism, laser mechanism and recovery mechanism. The feed mechanism has three storage rollers, two of which are located at one end of the support platform Wind the processed object and the adhesive film, and the remaining storage roller is located above the support platform, and wind another adhesive film with a higher viscosity. In addition, the laser mechanism can perform laser processing on the processed object to make the processing The object is cut into two shaped objects, and the recovery mechanism is provided with two recovery rollers at the other end of the support platform, and each recovery roller can individually wind the processed object and the adhesive film at the same time, thereby creating a thin line laser The processing device can automatically separate the two shaped objects from each other through two different adhesive films to improve production efficiency.

Description

Thin line laser processing device

This work is about a laser processing device, especially a laser processing device for thin circuits.

Laser processing is to use the optical system to focus to form a high-power laser beam, and project the laser beam onto the processed object, so that the laser beam performs laser marking, cutting, scoring, grooving, cutting, etc. on the processed object. Shot processing operations.

Among them, when performing laser processing on thin processed objects, the adhesive film is first attached to one side of the thin processed object, and then the thin processed object and the adhesive film are simultaneously moved in the first direction to make the thin processed The object is located below the laser mechanism. Next, the cutting head of the laser mechanism projects a laser beam on the thin processed object, so that the laser beam performs laser cutting on the thin processed object, and then the processed object is cut to form a waste object With finished objects.

However, after forming the waste object and the finished object, the adhesive film will move in a second direction different from the first direction, so that the thin-processed object and the adhesive film move in the first direction and the second direction, respectively. It can separate the scrap objects and the finished objects from each other, but because both the scrap objects and the finished objects are formed by thin processed objects, and the thin processed objects have lower rigidity because of the thinner thickness, and then when the adhesive film is along When moving in the second direction, both the waste object and the finished object will follow the adhesive film and move along the second direction, so that the waste object and the finished object cannot be separated from each other, thereby, the operator must spend time To separate scrap objects and finished products from each other, which will lengthen the operation time of laser processing operations, relatively reducing the production efficiency of laser processing operations.

The main purpose of this creation is to improve the mechanism of laser processing of thin circuits. When the processed object is cut into two shaped objects by the laser through the laser mechanism, the two shaped objects can be separated from each other to improve production efficiency.

In order to achieve the foregoing purpose, the present invention relates to a thin-line laser processing device, which can perform laser processing on a processed object according to a removal pattern described above, and is mainly composed of a supporting platform and a feed It is composed of a mechanism, a laser mechanism and a recovery mechanism. The support platform is used to support the processed object, and has a feed end and a discharge end far away from the feed end, and the feed mechanism has an object storage Material roller, a first film storage roller and a second film storage roller, both the object storage roller and the first film storage roller are close to the input end, and the object storage roller and the first Both the film-storage rollers wind the above-mentioned processed object and a first adhesive film respectively, and the second film-storage roller is located above the support platform and winds a second adhesive with a viscosity greater than that of the first adhesive film Adhesive film.

Wherein, the laser mechanism is located above the supporting platform, and can perform laser processing on the processed object according to the removal pattern, so that the processed object is laser-cut to form a shape having a shape nearly corresponding to the removal pattern A shaped object and a second shaped object having a shape different from the first shaped object, and the recycling mechanism has a first recycling roller and a second recycling roller, both the first recycling roller and the second recycling roller are close to The discharge end, and the first recovery roller is used to wind the first adhesive film and the first formed object at the same time, and the second recovery roller is used to wind the second adhesive film and the second formed object at the same time .

In this embodiment, the thin-line laser processing device further includes an adsorption mechanism and a removal mechanism, the adsorption mechanism is located below the support platform, and can generate an adsorption air flow flowing from top to bottom, so that the processed objects Close contact with the supporting platform through the adsorption airflow, the cleaning mechanism is located on the side of the laser mechanism, and can be used to remove a debris, wherein the debris is the laser mechanism for the laser processing of the processed object Formed during processing.

In a preferred embodiment, the cleaning mechanism has a blower and an adsorption unit. The blower and the adsorption unit are located on the front and back sides of the support platform. The blower can generate a flowing air flow, and the flowing air flow The debris is entrained and flows to the suction unit, and the suction unit sucks the flowing air flow to collect the debris.

The laser mechanism has a laser processing machine with a fixed position. When the laser processing machine projects a laser beam to perform laser processing on the processed object, both the object storage roller and the second recovery roller can share Continue to drive the processed object to move, the laser mechanism has an auxiliary laser processing machine arranged at intervals with the laser processing machine, and both the laser processing machine and the auxiliary laser processing machine are located in the second film The same side of the storage drum.

In this embodiment, the laser processing machine performs laser processing on the processed object according to the outline of the removal pattern, so that the processed object removes the entire thickness through the laser processing machine at a position corresponding to the outline of the removal pattern, and The auxiliary laser processing machine performs laser processing on the processed object according to the shape of the removal pattern, so that the processed object removes a partial thickness through the auxiliary laser processing machine at a position corresponding to the shape of the removal pattern, and then the first The thickness of the shaped object is smaller than the above-mentioned second shaped object.

In yet another preferred embodiment, the cleaning mechanism has a first cleaning roller and a second cleaning roller arranged at intervals between the first cleaning roller, and the first cleaning roller and the second cleaning roller both wind together The cleaning film is less than the first adhesive film.

The laser mechanism has an auxiliary laser processing machine with a fixed position, the auxiliary laser processing machine is arranged at intervals between the laser processing machine, and the second film storage roller is located between the laser processing machine and the auxiliary laser processing Between machines, wherein one of the laser processing machine and the auxiliary laser processing machine performs laser cutting on the processed object according to the outline of the removed pattern to form the first shaped object and the second shaped object, and the other One is to irradiate the second adhesive film according to the shape of the removal pattern, so that the local adhesion of the second adhesive film in the local area corresponding to the first shaped object is less than that of the first adhesive film.

The characteristic of this creation is that the thin line laser processing device will use two adhesive films with different viscosities to cooperate with the laser mechanism, so that the processed objects are laser processed through the laser mechanism to form the first shaped object and the second shape When the object is formed, the two adhesive films will be respectively adhered to the first and second shaped objects to automatically separate the first shaped object from the second shaped object, thereby, the operator does not need to spend extra time to separate the first shaped object from The second shaped object, in turn, shortens the operation time for performing the laser processing operation, and can relatively improve the productivity of the laser processing operation.

In order to facilitate a deeper and clearer understanding of the structure, use and characteristics of this creation, I will cite the preferred embodiment, which is explained in detail in conjunction with the drawings as follows:

Please refer to FIG. 1, in the first preferred embodiment, the thin-line laser processing device 1 of the present invention is mainly composed of a supporting platform 10, a feeding mechanism 11, a recycling mechanism 12, a laser mechanism 13, a The computing mechanism 14, an adsorption mechanism 15 and a cleaning mechanism 16 are formed. The opposite ends of the support platform 10 are respectively provided with a feed end 101 and a discharge end 102 far away from the feed end 101, and the feed mechanism 11 has An object storage roller 111, a first film storage roller 112, and a second film storage roller 113 arranged at intervals from each other, wherein both the object storage roller 111 and the first film storage roller 112 are close to the support The input end 101 of the platform 10, and the second film storage roller 113 is located above the support platform 10. As shown in the figure, the recovery mechanism 12 is provided with a first recovery roller 121 and a The second recovery rollers 122 are arranged at intervals on the first recovery roller 121.

As shown in the figure, the laser mechanism 13 has a laser processing machine 131 above the support platform 10, and the laser processing machine 131 is located on the left side of the second film storage drum 113 of the feeding mechanism 11, in this embodiment The position of the laser processing machine 131 is fixed, so that the relative position between the laser processing machine 131 and the support platform 10 will not change, and the computing mechanism 14 is electrically connected to the laser processing machine 131, wherein the adsorption mechanism 15 Located under the support platform 10, and the cleaning mechanism 16 is located between the support platform 10 and the laser mechanism 13, in this embodiment, the cleaning mechanism 16 has an adsorption unit 161 and a blower 162, and the adsorption unit 161 and the blower 162 The two are located on the front and back sides of the support platform 10 respectively.

In this embodiment, the thin-line laser processing device 1 cooperates with the steps shown in FIG. 2 to perform laser processing operations. Please refer to FIGS. 1 and 3 to simultaneously roll a processed object 20 with a length greater than that of the support platform 10 The object storage drum 111 of the feed mechanism 11 and the second recovery drum 122 of the recovery mechanism 12 make the processed object 20 above the support platform 10, and then the support platform 10 supports the processed object 20, and then, The first adhesive film 30 longer than the support platform 10 is wound around the first film storage roller 112 of the feeding mechanism 11, and then a second adhesive film 40 having a viscosity greater than the first adhesive film 30 is wound around the feeding mechanism The second film-storing roller 113 of 11 thus completes a preparation step S1. In this embodiment, the thickness of the processed object 20 is less than 1 mm. In the preferred embodiment, the thickness of the processed object 20 is less than 0.5 mm.

Please refer to FIG. 1 and FIG. 4, after the material preparation step S1 is completed, the object storage roller 111 of the feeding mechanism 11 and the second recovery roller 122 of the recovery mechanism 12 start to rotate, so that the object storage roller 111 and the second recovery Both of the rollers 122 together drive the processed object 20 to move at a moving speed, and then the processed object 20 moves in a moving direction D from the feeding end 101 toward the discharging end 102, so that the feeding mechanism 11 will form a corresponding The moving message of the moving speed is transmitted to the computing mechanism 14 to complete a feeding setting step S2, in which, when performing the feeding setting step S2, the first film storage of the feeding mechanism 11 The material roller 112 rotates synchronously to drive the first adhesive film 30 to move, so that the first adhesive film 30 is attached to the bottom surface of the processed object 20 to complete a first bonding step S3.

Please refer to FIGS. 1 and 5. When both the object storage drum 111 of the feeding mechanism 11 and the second recycling drum 122 of the recycling mechanism 12 jointly drive the processed object 20 and the first adhesive film 30 to move, the adsorption mechanism 15 An adsorption air flow F1 flowing from top to bottom is generated, and the processed object 20 and the first adhesive film 30 move closely along the movement direction D through the adsorption air flow F1 to closely contact the support platform 10 to allow the processing object 20 Maintain a flat condition to complete an adsorption step S4.

Please refer to FIG. 1 and FIG. 6A, a removal pattern with multiple appearances (such as a circle, a square, a polygon, or a combination thereof) is input to the computing mechanism 14, and the computing mechanism 14 cooperates according to the shape of the removal pattern The movement information is calculated to form a cutout information, and the operation mechanism 14 performs calculation according to the outline of the removal pattern to cooperate with the movement information to form a cutoff information, and the calculation mechanism 14 then calculates the cutout information and the cutoff information. It is transmitted to the laser mechanism 13, and when the laser mechanism 13 receives the above-mentioned cutout information and cut-off information, it completes a planning step S5, and can begin preparations for a shaping step S6 to make the laser of the laser mechanism 13 The processing machine 131 can prepare to project a laser beam 131a on the processed object 20.

Please refer to FIGS. 1 and 6B. During the forming step S6, both the object storage drum 111 of the feeding mechanism 11 and the second recovery drum 122 of the recycling mechanism 12 continue to rotate, so that the processed object 20 continues to move along The moving direction D moves, in which the laser processing machine 131 of the laser mechanism 13 performs the first projection toward the processed object 20 while the processed object 20 is moving, and the laser processing machine 131 projects the laser toward the processed object 20 The laser beam 131a, and the laser processing machine 131 firstly changes the projection direction of the laser beam 131a through the above-mentioned cutout information, so that the laser beam 131a first lasers the local block of the processed object 20 according to the shape of the removal pattern The material is removed to remove the local thickness of the processed object 20, so that the thickness of the local block of the processed object 20 is reduced so that the processed object 20 is recessed downward to form a groove 201 having the same shape as the above-mentioned target pattern, and then shown in FIG. 6C , The laser processing machine 131 performs a second projection toward the processed object 20 that has been laser-processed, and the laser processing machine 131 will change the projection direction of the laser beam 131a through the above-mentioned cutting information so that the laser beam 131a Laser cutting the periphery of the groove 201 of the processed object 20 according to the outline of the removed pattern to remove the entire thickness of the processed object 20, and then a part of the processed object 20 forms a first shaped object with a shape approximately corresponding to the removed pattern 21, and the remaining part of the processed object 20 forms a second shaped object 22 with a thickness greater than that of the first shaped object 21, wherein when the laser beam 131a performs laser cutting and laser cutting on the processed object 20, the first shape Both the object 21 and the second shaped object 22 are still attached to the first adhesive film 30, and the processed object 20 will simultaneously form a plurality of debris 23 (as shown in FIG. 7A). In this embodiment, the first shaped object 21 is set as waste to be discarded, and the second shaped object 22 is set as a finished product that can be used, however, the first shaped object 21 is set as a scrap and the second shaped object 22 is set as a finished material is only for convenience of explanation, and That is, the first shaped object 21 can be set as the finished material, and the second shaped object 22 can be set as the waste.

However, when performing the forming step S6, the laser processing machine 131 of the laser mechanism 13 first performs laser cutting on the processed object 20, and then performs laser cutting on the processed object 20 for convenience of illustration only, as also shown in FIG. 6D As shown, in another preferred implementation, the laser processing machine 131 performs the first projection toward the processed object 20, so that the laser beam 131a of the laser processing machine 131 is projected onto the processed object 20, and the laser processing machine 131 first Through the above cutting information, the projection direction of the laser beam 131a is changed, so that the laser beam 131a first performs laser cutting on a partial block of the processed object 20 according to the outline of the removed pattern, so that the processed object 20 is divided into two The first shaped object 21 and the second shaped object 22 are formed, and then as shown in FIG. 6E, the laser processing machine 131 performs a second projection toward the first shaped object 21, so that the laser beam 131a of the laser mechanism 13 is projected to the first A shaped object 21, and then, the laser mechanism 13 changes the projection direction of the laser beam 131a through the above-mentioned cutout information, so that the laser beam 131a is applied to the upper half of the first shaped object 21 according to the shape of the removal pattern Laser cutting is performed so that the thickness of the first shaped object 21 is smaller than the thickness of the second shaped object 22.

Please refer to FIGS. 1 and 7. When the forming step S6 is completed, a cleaning step S7 is started. During the cleaning step S7, the blower 162 of the cleaning mechanism 16 generates a flowing air flow F2, and the flowing air flow F2 faces the first The shaped object 21 and the second shaped object 22 flow, so that the flowing airflow F2 entrains the debris 23 and flows to the adsorption unit 161 of the cleaning mechanism 16, and the adsorption unit 161 sucks the flowing airflow F2 to collect a plurality of debris 23, and No debris 23 remains on the surface of the second shaped object 22.

Please refer to FIG. 1 and FIG. 8. After the cleaning step S7 is completed, a second bonding step S8 is started. After a plurality of debris 23 is cleaned by the cleaning mechanism 16, the object storage drum 111 and recovery of the feeding mechanism 11 Both of the second recovery roller 122 of the mechanism 12 continue to rotate, so that both the first shaped object 21 and the second shaped object 22 continue to move along the moving direction D, while both the first shaped object 21 and the second shaped object 22 In the state of moving along the moving direction D at the same time, the second film storage drum 113 of the feeding mechanism 11 starts to rotate to drive the second adhesive film 40 to move, so that the second adhesive film 40 is adhered to the second forming The top surface of the object 22, and then both the first shaped object 21 and the second shaped object 22 are located between the first adhesive film 30 and the second adhesive film 40, so that the first adhesive film 30 and the second adhesive film 40 The two are attached to the bottom surface of the second shaped object 22 and the top surface of the second shaped object 22, at this time, because the thickness of the second shaped object 22 is greater than the thickness of the first shaped object 21, the first shaped object 21 and the second A reserved space R is formed between the two adhesive films 40. When the second adhesive film 40 is attached to the top surface of the second shaped object 22, the second adhesive film 40 will not be attached to the first shaped object 21.

Please refer to FIGS. 1 and 9. After the second bonding step S8 is completed, a separation step S9 is performed. The first adhesive film 30 moves toward the first recycling roller 121 of the recycling mechanism 12, and the second adhesive film 40 faces recycling The second recovery roller 122 of the mechanism 12 moves to move both the first adhesive film 30 and the second adhesive film 40 in different directions. However, since the viscosity of the second adhesive film 40 is greater than that of the first adhesive film 30 and The second adhesive film 40 is only attached to the second shaped object 22, so that the second adhesive film 40 can separate the second shaped object 22 from the first adhesive film 30. At this time, the first adhesive film 30 is only attached to The first shaped object 21, and the second adhesive film 40 is only attached to the second shaped object 22, so that the first shaped object 21 and the second shaped object 22 are separated from each other. Next, the first recovery roller 121 is simultaneously wound on The first shaped object 21 and the first adhesive film 30 which are set as waste materials, and the second recovery roller 122 are simultaneously wound around the second shaped object 22 and the second adhesive film 40 which are set as finished materials.

Please refer to FIG. 10, in the second preferred embodiment, the difference from the first preferred embodiment lies in the structure of the cleaning mechanism 16 and the installation position of the cleaning mechanism 16, and the supporting platform 10, the feeding mechanism 11, The structure of the recycling mechanism 12, the laser mechanism 13, the computing mechanism 14 and the adsorption mechanism 15 are the same as in the first preferred embodiment, and will not be described repeatedly in this embodiment, as shown in the figure, clear The mechanism 16 is provided on the side of the laser mechanism 13 so that the cleaning mechanism 16 is located between the laser mechanism 13 and the second film storage drum 113 of the feeder trench, wherein the cleaning mechanism 16 has a first cleaning drum 163 and The second cleaning roller 164 is arranged at intervals with the first cleaning roller 163.

Please refer to FIG. 11. In the specific application of the second preferred embodiment, the difference from the first preferred embodiment is the clearing step S7, and the other steps are the same as the first preferred embodiment, in this embodiment When performing the cleaning step S7, both the first cleaning roller 163 of the cleaning mechanism 16 and the second cleaning roller 164 of the cleaning mechanism 16 will jointly wind a cleaning film 165 with a viscosity less than that of the first adhesive film 30. Both the cleaning roller 163 and the second cleaning roller 164 rotate so that the cleaning film 165 adheres to the second shaped object 22. Next, the cleaning film 165 will move toward the second cleaning roller 164, and the first adhesive film 30 will Continue to move along the moving direction D to move the cleaning film 165 and the first adhesive film 30 in different directions. At this time, since the viscosity of the cleaning film 165 is less than that of the first adhesive film 30, the cleaning film 165 only Will adhere to the debris 23 (as shown in FIG. 7A) and cannot adhere to the second shaped object 22, and the second shaped object 22 is still stuck to the first adhesive film 30, so that the cleaning film 165 will separate from the second shaped object 22, and when the cleaning film 165 is separated from the second shaped object 22, the cleaning film 165 adheres to the debris 23 so that no debris 23 remains on the surface of the second shaped object 22.

Please refer to FIG. 12. In the third preferred embodiment, the difference from the first preferred embodiment lies in the laser mechanism 13. As shown in the figure, the laser mechanism 13 further has an auxiliary laser processing machine with a fixed position 132, the laser mechanism 13 is mainly composed of a laser processing machine 131 and an auxiliary laser processing machine 132, wherein the auxiliary laser processing machine 132 is electrically connected to the computing mechanism 14 and arranged at intervals in the laser processing machine 131, As shown in the figure, both the laser processing machine 131 and the auxiliary laser processing machine 132 are located on the same side of the second film storage drum 113 (as shown on the left side in FIG. 12 ).

Please refer to FIGS. 13A and 13B. In the specific application of the third preferred embodiment, the difference from the first preferred embodiment is the forming step S6, and the other steps are the same as the first preferred embodiment. In the third preferred embodiment, when the forming step S6 is performed, the laser processing machine 131 of the laser mechanism 13 projects the laser beam 131a toward the moving processing object 20, and the laser processing machine 131 changes through the above-mentioned cutout information The projection direction of the laser beam 131a causes the laser beam 131a to perform laser cutting on the local blocks of the processed object 20 according to the shape of the removal pattern to remove the local thickness of the processed object 20, so that the local area of the processed object 20 The thickness of the block is reduced so that the processed object 20 is recessed downward to form a groove 201 with the same shape as the above-mentioned target pattern. Then, as shown in FIG. 13B, the processed object 20 continues to move and moves below the auxiliary laser processing machine 132 Next, the auxiliary laser processing machine 132 projects an auxiliary laser beam 132a toward the laser-processed object 20, and the auxiliary laser processing machine 132 changes the projection of the auxiliary laser beam 132a through the above-mentioned cutting information Direction, the auxiliary laser beam 132a laser-cuts the periphery of the groove 201 of the processed object 20 according to the outline of the removal pattern to remove the entire thickness of the processed object 20 to form the first shaped object 21 and the second shaped object 22 .

However, the laser processing machine 131 of the laser mechanism 13 performs laser processing on the processed object 20 according to the above-mentioned cutout information and the auxiliary laser processing machine 132 of the laser mechanism 13 performs laser processing on the processed object 20 according to the above-mentioned cutting information The laser processing is for convenience only, that is, the laser processing machine 131 can perform laser processing on the processed object 20 according to the above-mentioned cutting information. In contrast, the auxiliary laser processing machine 132 processes the processed object according to the above-mentioned cut-out information. 20 Perform laser processing.

Please refer to FIG. 14. In the fourth preferred embodiment, the difference from the first preferred embodiment lies in the laser mechanism 13. In this embodiment, the laser mechanism 13 has a position like the third preferred embodiment. The auxiliary laser processing machine 132 is fixed so that the laser mechanism 13 is mainly composed of a laser processing machine 131 and an auxiliary laser processing machine 132, wherein the auxiliary laser processing machine 132 is electrically connected to the computing mechanism 14 and arranged at intervals In the laser processing machine 131, as shown in the figure, the laser processing machine 131 and the auxiliary laser processing machine 132 are located on opposite sides of the second film storage roller 113, so that the second film storage roller 113 Between the laser processing machine 131 and the auxiliary laser processing machine 132.

In this embodiment, the thin-line laser processing apparatus 1 cooperates with the step flow shown in FIG. 15 to perform laser processing operations. When the thin-line laser processing apparatus 1 is specifically applied, the thin-line laser processing apparatus 1 prepares materials in order Step S1, feed setting step S2, first bonding step S3 and adsorption step S4, and, in this embodiment, preparation step S1, feed setting step S2, first bonding step S3 and adsorption step S4 Similar to the first preferred embodiment, the object storage drum 111 of the feeding mechanism 11 and the second recycling barrel of the recycling mechanism 12 jointly tighten the processed object 20, so that the processed object 20 can be kept in a flat state continuously Move along the moving direction D.

15 and 16, after the adsorption step S4 is completed, the planning step S5 is started, and the removal pattern is input to the calculation mechanism 14, and the calculation mechanism 14 performs calculation according to the outline of the removal pattern and the movement information to form the cut Information, and the computing mechanism 14 performs the calculation to remove the pattern shape to form an irradiation information, and the computing mechanism 14 transmits the cutting information and the irradiation information to the laser mechanism 13, and when the laser mechanism 13 receives the above When cutting information and irradiation information, the cutting information and irradiation information are transmitted to the laser processing machine 131 and the auxiliary laser processing machine 132, respectively, thereby completing a planning step S5 and preparing for a forming step S6.

15 and FIG. 17, when the forming step S6 is performed, the laser processing machine 131 of the laser mechanism 13 projects the laser beam 131a toward the processed object 20 while the processed object 20 is moving, and the laser The processing machine 131 changes the projection direction of the laser beam 131a through the above cutting information, so that the laser beam 131a performs laser cutting on the processed object 20 according to the outline of the removed pattern to form the first shaped object 21 and the second The shaped object 22, however, after the forming step S6 is completed, the cleaning step S7 as in the first preferred embodiment can be performed so that no debris 23 remains on the top surfaces of both the first and second shaped objects 21,22.

Referring to FIGS. 15 and 18, after the cleaning step S7 is completed, the second bonding step S8 is started. Both the object storage drum 111 of the feeding mechanism 11 and the second recovery drum 122 of the recycling mechanism 12 continue to rotate, so that Both the first shaped object 21 and the second shaped object 22 continue to move along the moving direction D, and in a state where both the first shaped object 21 and the second shaped object 22 move along the moving direction D at the same time, The second film storage roller 113 of the feed mechanism 11 starts to rotate to drive the second adhesive film 40 to move, so that the second adhesive film 40 is simultaneously attached to the top surface of the first shaped object 21 and the top of the second shaped object 22 Surface, so that both the first shaped object 21 and the second shaped object 22 are located between the first adhesive film 30 and the second adhesive film 40, and then the first adhesive film 30 and the second adhesive film 40 are attached separately The bottom surfaces of the first and second shaped objects 21 and 22 are combined with the top surfaces of the first and second shaped objects 21 and 22.

Please refer to FIGS. 15 and 19. Next, a modification step S10 is performed. In the state where both the first and second adhesive films are attached to the first and second shaped objects 21 and 22, the first and second shaped objects Both 21 and 22 continue to move along the moving direction D, bringing the first and second shaped objects 21 and 22 closer to the auxiliary laser processing machine 132 of the laser mechanism 13, and then, the auxiliary laser processing machine 132 is based on the above irradiation Information, the auxiliary laser beam 132a is projected on the second adhesive film 40, and the second adhesive film 40 is irradiated by the auxiliary laser beam 132a in a local area corresponding to the shape of the first shaped object 21 to reduce or lose the viscosity, so that The viscosity of the second adhesive film 40 corresponding to the local area of the shape of the first shaped object 21 is smaller than that of the first adhesive film 30.

15 and 20, after the modification step S10, the separation step S9 is performed. The first adhesive film 30 moves toward the first recovery roller 121 of the recovery mechanism 12, and the second adhesive film 40 faces the first of the recovery mechanism 12. The two recovery rollers 122 move to move the first adhesive film 30 and the second adhesive film 40 in different directions. However, since the second adhesive film 40 adheres to a local area where the viscosity is less than that of the first adhesive film 30 The first molded object 21 and the second adhesive film 40 are adhered to the second molded object 22 at a local area where the viscosity is greater than that of the first adhesive film 30, so that the second adhesive film 40 can separate the second molded object 22 from the first adhesive Film 30, at this time, the first adhesive film 30 is only attached to the first shaped object 21, and the second adhesive film 40 is only attached to the second shaped object 22, so that the first shaped object 21 and the second shaped object 22 are separated from each other. Next, the first recovery roller 121 is simultaneously wound on the first shaped object 21 and the first adhesive film 30 which are set as waste, and the second recovery roller 122 is simultaneously wound on the second forming which is set as the finished material The object 22 and the second adhesive film 40.

The above-mentioned embodiments are only for the convenience of explaining that this creation is not a limitation. Without departing from the scope of this creation, those skilled in the industry who are familiar with this industry should apply for various simple deformations and modifications based on the scope of patent applications and new descriptions of this creation. Included in the following patent applications.

1: Thin line laser processing device 10: Support platform 101: feeding end 102: Discharge end 11: Feeding mechanism 111: Object storage drum 112: The first film storage roller 113: Second film storage roller 12: Recycling agency 121: The first recycling roller 122: second recycling roller 13: Laser mechanism 131: laser processing machine 131a: Laser beam 132: Auxiliary laser processing machine 132a: auxiliary laser beam 14: computing mechanism 15: Adsorption mechanism 16: Clear the organization 161: Adsorption unit 162: Blower 163: First clear roller 164: Second clear roller 165: Cleaning film 20: Processed objects 201: groove 21: The first shaped object 22: Second shaped object 23: Debris 30: First adhesive film 40: Second adhesive film D: direction of movement F1: Adsorption air flow F2: flowing air R: reserved space S1: Material preparation steps S2: Feed setting steps S3: The first step of fitting S4: Adsorption step S5: Planning steps S6: forming step S7: Clearing steps S8: Second step of fitting S9: Separation step S10: deterioration step

FIG. 1 is a schematic view of a first preferred embodiment of a thin-line laser processing device; FIG. 2 is a flowchart of steps of the specific application of FIG. 1; Figure 3 is a schematic diagram of the material preparation step in Figure 2; 4 is a schematic diagram of the feeding setting step and the first laminating step in FIG. 2; 5 is a schematic diagram of the adsorption step in FIG. 2; 6A is a schematic diagram of the planning steps in FIG. 2; 6B and 6C are schematic diagrams of cutting and cutting after the forming step in FIG. 2; 6D and 6E are schematic diagrams of cutting and then cutting when performing the forming step in FIG. 2; 7 is a schematic diagram of the removal step in FIG. 2; 8 is a schematic diagram of the second bonding step in FIG. 2; 9 is a schematic diagram of the separation step in FIG. 2; 10 is a schematic view of a second preferred embodiment of a thin-line laser processing device; FIG. 11 is a schematic diagram of the cleaning step of the second preferred embodiment; 12 is a schematic diagram of a third preferred embodiment of a thin-line laser processing device; 13A and 13B are schematic diagrams of forming steps in the third preferred embodiment; 14 is a schematic view of a fourth preferred embodiment of a thin line laser processing device; 15 is a flowchart of steps of the specific application of FIG. 14; 16 is a schematic diagram of the planning steps in FIG. 15; 17 is a schematic diagram of the forming step in FIG. 15; 18 is a schematic diagram of performing the second bonding step in FIG. 15; 19 is a schematic diagram of the modification step in FIG. 15; and FIG. 20 is a schematic diagram of the separation step in FIG. 15.

1: Thin line laser processing device

10: Support platform

101: feeding end

102: Discharge end

11: Feeding mechanism

111: Object storage drum

112: The first film storage roller

113: Second film storage roller

12: Recycling agency

121: The first recycling roller

122: second recycling roller

13: Laser mechanism

131: laser processing machine

14: computing mechanism

15: Adsorption mechanism

16: Clear the organization

161: Adsorption unit

162: Blower

20: Processed objects

30: First adhesive film

40: Second adhesive film

Claims (10)

A thin line laser processing device can perform laser processing on a processed object according to the above-mentioned removal pattern, and includes: A supporting platform for supporting the processed object, and has a feeding end and a discharging end far away from the feeding end; A feeding mechanism has an object storage roller, a first film storage roller and a second film storage roller. Both the object storage roller and the first film storage roller are close to the input end. The object storage roller and the first film storage roller are wound around the processed object and a first adhesive film, respectively, and the second film storage roller is located above the support platform and is wound with an adhesive A second adhesive film larger than the first adhesive film; A laser mechanism is located above the supporting platform, and can perform laser processing on the processed object according to the removal pattern, so that the processed object is laser-cut to form a first shape nearly corresponding to the removal pattern A shaped object and a second shaped object having a shape different from the first shaped object; and A recycling mechanism has a first recycling roller and a second recycling roller, both the first recycling roller and the second recycling roller are close to the discharge end, and the first recycling roller is used to wind the first The adhesive film and the first shaped object, and the second recovery roller is used to wind the second adhesive film and the second shaped object at the same time. The thin-line laser processing apparatus according to claim 1, wherein the thin-line laser processing apparatus further has an adsorption mechanism, the adsorption mechanism is located below the support platform, and can generate a flow from top to bottom The airflow is adsorbed, so that the processed object passes through the airflow and closely contacts the support platform. The thin-line laser processing apparatus according to claim 1, wherein the thin-line laser processing apparatus further has a cleaning mechanism on the side of the laser mechanism, the cleaning mechanism is used to remove a debris, and The debris is formed when the laser mechanism performs laser processing on the processed object. The thin line laser processing device according to claim 3, wherein the cleaning mechanism has a blower and an adsorption unit, and the blower and the suction unit are located on the front and back sides of the support platform, respectively, and the blower can generate A flowing air flow, and the flowing air flow will entrain the debris and flow to the adsorption unit, and the adsorption unit will suck the flowing air flow to collect the debris. The thin line laser processing apparatus according to claim 3, wherein the cleaning mechanism has a first cleaning roller and a second cleaning roller arranged at intervals between the first cleaning roller, the first cleaning roller and the second The two cleaning rollers are wound together with a cleaning film with a viscosity lower than that of the first adhesive film. The thin line laser processing apparatus according to claim 1, wherein the laser mechanism has a fixed position laser processing machine, and when the laser processing machine projects a laser beam to perform laser processing on the processed object During processing, both the material storage roller and the second recovery roller can continue to drive the processed object to move together. The thin line laser processing apparatus according to claim 6, wherein the laser mechanism has an auxiliary laser processing machine arranged at intervals with the laser processing machine, and the laser processing machine and the auxiliary laser processing machine Both are located on the same side of the above second film storage drum. The thin-line laser processing apparatus according to claim 7, wherein the laser processing machine performs laser processing on the processed object according to the outline of the removal pattern to transmit the processed object at a position corresponding to the outline of the removal pattern The laser processing machine removes the entire thickness, and the auxiliary laser processing machine performs laser processing on the processed object according to the shape of the removal pattern so that the processed object transmits the auxiliary laser at a position corresponding to the shape of the removal pattern The processing machine removes the partial thickness, so that the thickness of the first shaped object is smaller than the thickness of the second shaped object. The thin line laser processing apparatus according to claim 6, wherein the laser mechanism has a fixed auxiliary laser processing machine, the auxiliary laser processing machine is arranged at intervals between the laser processing machines, and the first The second film storage roller is located between the laser processing machine and the auxiliary laser processing machine. The thin-line laser processing apparatus according to claim 9, wherein one of the laser processing machine and the auxiliary laser processing machine performs laser cutting on the processed object according to the outline of the removed pattern to form the first A shaped object and a second shaped object, and the other irradiates the second adhesive film according to the shape of the removal pattern so that the viscosity of the second adhesive film in the local area corresponding to the first shaped object is less than the first A sticky film.

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