CN110914180A - Web material attaching device - Google Patents
Web material attaching device Download PDFInfo
- Publication number
- CN110914180A CN110914180A CN201780091644.8A CN201780091644A CN110914180A CN 110914180 A CN110914180 A CN 110914180A CN 201780091644 A CN201780091644 A CN 201780091644A CN 110914180 A CN110914180 A CN 110914180A
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- Prior art keywords
- web
- laser processing
- bonding
- conveyance
- tension
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000000463 material Substances 0.000 title claims abstract description 101
- 238000011144 upstream manufacturing Methods 0.000 claims abstract description 20
- 238000010030 laminating Methods 0.000 claims abstract description 19
- 238000001514 detection method Methods 0.000 claims abstract description 11
- 230000032258 transport Effects 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 12
- 230000000873 masking effect Effects 0.000 abstract description 56
- 239000000758 substrate Substances 0.000 description 23
- 238000005520 cutting process Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 230000003111 delayed effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000011143 downstream manufacturing Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H39/00—Associating, collating, or gathering articles or webs
- B65H39/16—Associating two or more webs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H41/00—Machines for separating superposed webs
Abstract
A laminating apparatus (web bonding apparatus) (1) comprises: a 1 st conveying device (15) which conveys a base material (1 st web) (10) on which a predetermined pattern (11) is formed to a bonding position (100); a 2 nd conveying device (25) which conveys a masking material (2 nd web) (20) to be bonded to the base material (10) to a bonding position (100); a CCD camera (35) (image detection unit) that obtains image information of the base material (10) on the upstream side of the bonding position (100) in the 1 st transport path (110); and a laser processing device (30) which performs laser processing on the shielding material (20) at the upstream side of the bonding position (100) in the 2 nd conveying path (120). The laminating device acquires a conveying error of the base material (10) according to image information acquired by the CCD camera (35), and adjusts laser processing on the shielding material (20) according to the conveying error.
Description
Technical Field
The present invention relates to a web application apparatus that applies a plurality of webs (web).
Background
Conventionally, a technique of bonding different kinds of webs is known. As a document disclosing such a technique, for example, patent documents 1 to 5 are available.
Patent document 2 describes the following technique: in an apparatus for cutting and adhering a conductive foil tape to an insulating tape, the insulating tape is conveyed and the conductive foil tape is cut to a predetermined length by a cutting device provided near a adhering roll for adhering the two tapes.
Patent document 3 describes the following technique: in an apparatus for forming a first pattern printed on one film and half-cutting a second pattern in accordance with the first pattern, tension adjustment of the film is performed so that the two patterns can be half-cut in accordance with each other.
Patent document 4 describes the following apparatus: the masking film is attached to the product film without slack while adjusting the tension.
Patent document 5 describes the following: in an apparatus for adjusting tension in order to avoid curling of a terminal portion of a medium to be bonded, cutting is performed using a laser when the bonded medium is cut.
Documents of the prior art
Patent document
Patent document 1: japanese laid-open patent publication No. H05-105320
Patent document 2: japanese laid-open patent publication No. H07-172681
Patent document 3: japanese laid-open patent publication No. 2007-131390
Patent document 4: japanese patent laid-open publication No. 2010-111470
Patent document 5: japanese patent laid-open publication No. 2015-209288
Disclosure of Invention
Problems to be solved by the invention
However, when the 2 nd web (for example, a masking material) subjected to laser processing is directly bonded to the 1 st web (for example, a base material) on which a plurality of predetermined patterns are formed at intervals in the conveyance direction, if a conveyance error of the 1 st web occurs, the position of the portion subjected to laser processing may be shifted. Therefore, the following method is adopted: after the 1 st web is cut into pieces having a predetermined length, the 2 nd web is bonded to each piece. This requires the execution of the operation of bonding for each individual sheet, and becomes an obstacle to automation. In this regard, although the conventional techniques have been proposed to adjust the conveyance of the web using a CCD camera or the like, the detection target is the same as the processing target, and the positional deviation of the processing portion of the 2 nd web due to the conveyance error of the 1 st web cannot be sufficiently eliminated. From the viewpoint of high precision and high efficiency, there is room for improvement in a structure in which a processed 2 nd web and a 1 st web on which a predetermined pattern is formed are bonded to each other.
The purpose of the present invention is to provide a web bonding apparatus that can achieve high efficiency and high accuracy in the operation of bonding a 2 nd web on which laser processing has been performed to a 1 st web on which a predetermined pattern has been formed.
Means for solving the problems
The present invention relates to a web bonding apparatus (for example, a laminating apparatus 1 described later) that bonds a plurality of webs together, the web bonding apparatus including: a 1 st transport device (e.g., a 1 st transport device 15 described later) that transports a 1 st web (e.g., a substrate 10 described later) on a 1 st transport path (e.g., a 1 st transport path 110 described later) in which a plurality of predetermined patterns (e.g., patterns 11 described later) are formed at intervals in a transport direction to a bonding position (e.g., a bonding position 100 described later); a 2 nd transport device (for example, a 2 nd transport device 25 described later) that transports a 2 nd web (for example, a masking material 20 described later) to be bonded to the 1 st web to the bonding position in a 2 nd transport path (for example, a 2 nd transport path 120 described later); an image detection unit (for example, a CCD camera 35 described later) that acquires image information of the 1 st web on the upstream side of the bonding position in the 1 st transport path; and a laser processing device (for example, a laser processing device 30 described later) that performs laser processing on the 2 nd web material on an upstream side of the bonding position in the 2 nd conveyance path, wherein the web bonding device acquires a conveyance error of the 1 st web material based on the image information acquired by the image detection unit, and adjusts the laser processing for the 2 nd web material based on the conveyance error.
Preferably, the adjustment of the laser processing based on the transport error is performed by correcting the timing of performing the laser irradiation.
Preferably, the web attaching device further includes: a 1 st tension management unit (for example, a 1 st tension management device 17 described later) that manages tension of the 1 st web conveyed by the 1 st conveyor; and a 2 nd tension management unit (for example, a 2 nd tension management device 27 described later) that manages tension of the 2 nd web conveyed by the 2 nd conveyor.
Preferably, the web bonding apparatus further includes a sheet peeling apparatus (for example, a sheet peeling apparatus 50 described later) that peels a peeling sheet from the 2 nd web on an upstream side of the bonding position, wherein the 2 nd web is conveyed in the 2 nd conveyance path in a state where the peeling sheet is bonded, and the laser processing apparatus is capable of irradiating a surface of the 2 nd web opposite to a side where the peeling sheet is bonded with a laser on the upstream side of the peeling position where the peeling sheet is peeled by the sheet peeling apparatus.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the web bonding apparatus of the present invention, it is possible to achieve high efficiency and high accuracy of a work of bonding the 2 nd web subjected to the laser processing and the 1 st web formed with the predetermined pattern.
Drawings
Fig. 1 is a diagram illustrating a laminating apparatus (web bonding apparatus) according to an embodiment of the present invention.
Detailed Description
Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. Fig. 1 is a diagram showing a laminating apparatus (web bonding apparatus) 1 according to an embodiment of the present invention. The laminating apparatus 1 shown in fig. 1 is used for manufacturing electronic parts such as a flexible substrate and a film sensor.
The laminating apparatus 1 of the present embodiment includes a 1 st conveying device 15, a 1 st tension management device 17, a 2 nd conveying device 25, a laser processing device 30, a 2 nd tension management device 27, a sheet peeling device 50, a CCD camera 35, and a control section 90.
The 1 st transport device 15 transports the substrate 10 on which the pattern 11 is formed to the bonding position 100 through the 1 st transport path 110. The 1 st transport path 110 is a moving path of the substrate 10 that transports the substrate 10 to the bonding position 100. A conveying roller 16 is disposed in the 1 st conveying path 110, and the substrate 10 is conveyed at a predetermined speed in the 1 st conveying path 110 by driving the conveying roller 16 to rotate.
In the present embodiment, the base material 10 is a web formed in a band shape, and the base material 10 is supplied to the bonding position 100 without interruption. A predetermined pattern 11 is formed on the surface of the substrate 10 at intervals in the conveyance direction. The pattern 11 may be formed in 1 row in the transport direction, or may be formed in a plurality of rows. For example, in an upstream process before reaching the laminating apparatus 1, the pattern 11 is formed on the base material 10 by etching or the like.
The 1 st tension management device 17 manages the tension of the base material 10 conveyed on the 1 st conveyance path 110. The tension applied to the base material 10 is set according to the material and thickness of the base material 10. The base material 10 is conveyed to the downstream side in a state where the tension is appropriately managed by the 1 st tension management device 17. The tension of the base material 10 is detected by a tension detection unit such as a load cell (not shown), and the tension is controlled by a control unit 90 described later.
The 2 nd conveying device 25 conveys the masking material 20 to the bonding position 100 via the 2 nd conveying path 120. The 2 nd conveying path 120 is a path different from the 1 st conveying path 110, and is a moving path of the masking material 20 merged at the pasting position 100 of the 1 st conveying path 110. The laminating roller 26 is disposed on the side of the bonding position 100 of the 2 nd transport path 120, and the masking material 20 is transported at a predetermined speed in the 2 nd transport path 120 by driving the laminating roller 26 to rotate.
The masking material 20 extends in a belt shape and is continuously supplied to the bonding position 100. The release sheet 21 is bonded to the masking material 20, the masking material 20 and the release sheet 21 are integrally conveyed in the 2 nd conveyance path 120 before reaching the release position 102 described later, and the masking material 20 is conveyed to the bonding position 100 after the release sheet 21 is released at the release position 102.
The laser processing apparatus 30 performs cutting processing by laser on the masking material 20 with the release sheet 21 adhered thereto. The laser processing device 30 is a current type laser processing device. The laser beam for processing the masking material 20 is not limited to the current type, and can be appropriately changed according to the circumstances.
The laser irradiation position 101 is set upstream of the bonding position 100 in the 2 nd conveyance path 120. The laser processing apparatus 30 performs laser processing by irradiating the masking material 20 with laser light from the side of the masking material 20 opposite to the side to which the release sheet 21 is adhered.
In the laser processing, the shielding material 20 is irradiated with laser light so as to cut out a predetermined shape. The laser processing portion of the masking material 20 is set as follows: when the masking material 20 is bonded to the base material 10, the processed portion is located at a predetermined portion corresponding to the pattern 11.
In the laser processing of the present embodiment, the laser processing is performed at a depth corresponding to the thickness of the masking material 20, and cutting to the peeling sheet 21 is avoided.
The sheet peeling device 50 peels the peeling sheet 21 from the masking material 20 before the masking material 20 reaches the bonding position 100. The peeling position 102 at which the peeling sheet 21 is peeled is set downstream of the irradiation position 101 and upstream of the bonding position 100 in the 2 nd conveyance path 120, and the peeling sheet 21 is peeled from the masking material 20 just before being bonded to the substrate 10.
The release sheet 21 released at the release position 102 is conveyed toward the sheet releasing device 50. In the laser processing performed on the upstream side of the peeling position 102, the depth of the laser beam is set so as to cut only the masking material 20 portion, and the peeling sheet 21 is not cut. Therefore, the unnecessary portion of the masking material 20 cut out by the laser processing is directly separated from the masking material 20 in a state of being adhered to the release sheet 21 released at the release position 102. Namely, the following structure is provided: the unnecessary portion cut by the laser processing is removed together with the release sheet 21 at the release position 102 and does not reach the bonding position 100.
The 2 nd tension management device 27 manages the tension of the masking member 20 conveyed through the 2 nd conveyance path 120. The tension applied to the masking material 20 is set according to the material and thickness of the masking material 20 or the release sheet 21. The masking material 20 is conveyed to the downstream side in a state where the tension is appropriately controlled by the 2 nd tension control device 27. The tension of the masking member 20 is detected by a tension detecting unit such as a load cell (not shown), and the tension is controlled by a control unit 90, which will be described later.
The CCD camera 35 is an image detecting unit that acquires image information of the substrate 10 moving on the 1 st conveying path 110. The imaging position 103 at which the CCD camera 35 acquires image information is set upstream of the bonding position 100 in the 1 st conveying path 110.
The control unit 90 is a computer that performs various controls of the laminating apparatus 1. The control unit 90 adjusts the conveyance speed of the substrate 10, manages the tension applied to the substrate 10 being conveyed, adjusts the conveyance speed of the masking member 20, manages the tension of the masking member 20, and controls the laser processing of the laser processing device 30.
In the laser processing control, cutting processing is performed in which the masking material 20 conveyed through the 2 nd conveyance path 120 is irradiated with laser light to cut a predetermined shape. The position of the masking material 20 where the cutting process is performed needs to be matched with the pattern 11 when the masking material is bonded to the base material 10. Therefore, the timing of laser light irradiation is set according to the position of the substrate 10 conveyed on the 1 st conveyance path 110. The substrate 10 is transported at a predetermined transport speed, and the current position of the substrate 10 can be estimated from the transport speed, the elapsed time, and the like. However, when the substrate 10 is conveyed, a conveyance error may occur. In the present embodiment, the control unit 90 detects a conveyance error from image information acquired by the CCD camera 35, and corrects the timing of laser irradiation based on the conveyance error. The shielding material 20 may be a shielding material that shields a part of the pattern 11, or may be a shielding material that shields the entire pattern 11. In this way, the shielding material 20 can be appropriately used in a shielding method according to circumstances.
The control unit 90 of the present embodiment stores a reference shape for specifying the actual position of the base material 10. The reference shape may be the pattern 11 itself, may be a part of the pattern 11, or may be a shape having a feature formed outside the pattern 11. The reference shape is a shape, a pattern, a color, or a combination thereof, which is located at a position within the imaging range of the CCD camera 35 and has a feature point for visually comparing with other shapes.
An example of detection of the conveyance error will be described. The control unit 90 extracts a reference shape from the image information acquired by the CCD camera 35, and calculates a conveyance error from the position of the reference shape. The conveying error is calculated from the deviation between the position of the reference shape included in the image information captured by the CCD camera 35 and the assumed position of the reference shape assumed from the conveying speed and the like, and the calculated conveying error is reflected in the timing of laser irradiation. For example, when the position of the reference shape of the image information is on the upstream side of the assumed position in the 1 st conveyance path 110, the conveyance of the base material 10 is delayed, and therefore, the timing of laser irradiation is delayed according to the delay amount. On the other hand, when the position of the reference shape is on the downstream side of the assumed position in the 1 st conveyance path 110, the conveyance of the substrate 10 is advanced, and therefore the timing of laser irradiation is advanced by the advanced amount. The detection of the transport error by the control unit 90 based on the image information is not limited to this method, and various methods can be employed.
The laser-processed masking material 20 is peeled off the peeling sheet 21 at the peeling position 102 by the sheet peeling device 50, reversed by the laminating roller 26 with the adhesive surface exposed, and conveyed to the bonding position 100. At the bonding position 100 where the 1 st conveyance path 110 and the 2 nd conveyance path 120 are joined, the surface of the masking material 20 from which the release sheet 21 is peeled off and the surface of the base material 10 conveyed by the 1 st conveyance device 15 on which the pattern 11 is formed are bonded and integrated, and are conveyed in this state to the downstream process.
In a downstream process of the laminating apparatus 1, the substrate 10 to which the masking material 20 is bonded is cut into individual pieces, thereby manufacturing an electronic component in which lamination is performed.
According to the above embodiment, the following effects are obtained.
The laminating apparatus (web bonding apparatus) 1 includes: a 1 st transport device 15 for transporting a substrate (1 st web) 10 to a bonding position 100 via a 1 st transport path 110, the substrate 10 having a plurality of predetermined patterns 11 formed thereon at intervals in a transport direction; a 2 nd conveyor 25, the 2 nd conveyor 25 conveying the masking material (2 nd web) 20 to be bonded to the base material 10 to the bonding position 100 via a 2 nd conveyance path 120; a CCD camera 35 (image detection unit) for obtaining image information of the substrate 10 by the CCD camera 35 on the upstream side of the bonding position 100 in the 1 st transport path 110; and a laser processing device 30, wherein the laser processing device 30 performs laser processing on the shielding material 20 at the upstream side of the bonding position 100 in the 2 nd conveying path 120. The laminating apparatus 1 obtains a conveyance error of the base material 10 based on the image information obtained by the CCD camera 35, and adjusts the laser processing to be performed on the masking material 20 based on the conveyance error.
Thus, since the actual position of the base material 10 is reflected in the laser processing performed on the masking material 20, the laser processing can be performed with high accuracy, and the work of bonding the masking material 20 to the base material 10 can be performed with high accuracy. Further, after the processed masking material 20 is accurately attached to the base material 10 before being cut into individual pieces, the base material to which the masking material 20 is attached can be cut into individual pieces. Therefore, as compared with the case where the masking material is bonded to each of the base materials cut into individual pieces, the work of bonding the masking material 20 to the base material 10 can be performed at one time, and therefore, the work time can be shortened, and the work efficiency can be effectively improved. Further, since the cutting process is performed using the laser processing device 30 having a smaller device configuration than the press device, the device configuration can be compactly arranged, and the distance from the irradiation position 101 to the bonding position 100 can be shortened, thereby improving the bonding accuracy. That is, in a configuration in which the object of the image detected by the CCD camera 35 is the base material 10 and the object of the laser processing is a completely different material such as the masking material 20 different from the base material 10, a technique of bonding with high accuracy has been realized.
In the present embodiment, the timing of laser irradiation is corrected, whereby adjustment based on the conveyance error in laser processing is performed.
Thus, the conveying error of the substrate 10 conveyed by the 1 st conveying device 15 can be reflected in the laser processing by a simple process of adjusting the timing of laser irradiation without using a complicated logic.
In the present embodiment, the laminating apparatus 1 further includes: a 1 st tension management device 17, the 1 st tension management device 17 managing the tension of the base material 10 conveyed by the 1 st conveying device 15; and a 2 nd tension management device 27, wherein the 2 nd tension management device 27 manages the tension of the shielding material 20 conveyed by the 2 nd conveying device 25.
Accordingly, since the base material 10 and the masking material 20 are stably conveyed by an appropriate tension, a conveyance error is less likely to occur, and the bonding accuracy can be further improved. In particular, in a configuration in which the distance from the irradiation position 101 to the bonding position 100 can be shortened by the laser processing device 30, the arrangement space does not need to be secured larger than that of the press device, and a further effect of facilitating tension management can be achieved.
In the present embodiment, the laminating apparatus 1 further includes a sheet peeling apparatus 50, and the sheet peeling apparatus 50 peels the release sheet 21 from the masking member 20 on the upstream side of the bonding position 100, wherein the masking member 20 is conveyed in the 2 nd conveying path 120 in a state where the release sheet 21 is adhered. The laser processing apparatus 30 is configured to be able to irradiate a surface of the masking member 20 opposite to the side to which the release sheet 21 is adhered with laser light on the upstream side of the release position 102 where the release sheet 21 is released by the sheet releasing device 50.
Thereby, the following structure can be realized: the conveying error of the base material 10 is reflected in the timing of irradiating the masking material 20 with the laser beam, and the unnecessary portion cut out by the laser processing is peeled off together with the peeling sheet 21.
Although the preferred embodiments of the present invention have been described above, the present invention is not limited to the above embodiments and can be modified as appropriate.
In the above embodiment, the laser processing apparatus 30 is configured to perform the following processing: the masking material 20 with the release sheet 21 adhered thereto is only cut by the laser beam, but the present invention is not limited to this configuration. For example, the peeling sheet 21 may be punched together with the masking material 20 and cut. In addition, the masking material 20 may be laser-processed after the peeling sheet 21 is peeled off.
In the above embodiment, the 1 st conveyance device 15 and the 2 nd conveyance device 25 are configured to continuously convey without stopping, but a configuration in which conveyance is performed by repeating conveyance and stopping may be modified.
In the above embodiment, the laser processing adjustment based on the transport error is performed by correcting the irradiation timing of the laser beam, but the present invention is not limited to this configuration. For example, the conveyance speed of the base material 10, the conveyance speed of the masking material 20, the tension applied by the 1 st tension management device 17, the tension applied by the 2 nd tension management device 27, or a combination thereof may be adjusted according to the conveyance error. The adjustment of the laser processing can be performed by an appropriate method.
In the above embodiment, the base material 10 on which the predetermined pattern is formed is described as the 1 st web and the masking material 20 is described as the 2 nd web, but the present invention is not limited to this configuration. For example, a resin multilayer substrate such as MetroCirc (registered trademark) can be used as the 1 st web.
Description of the symbols
1: laminating apparatus (Web applying apparatus)
10: substrate (No. 1 Web)
11: pattern(s)
15: 1 st conveying device
20: shielding material (No. 2 web material)
25: 2 nd conveying device
30: laser processing apparatus
35: CCD Camera (image detection part)
100: bonding position
110: 1 st conveying path
120: 2 nd conveying path
Claims (4)
1. A web attaching apparatus that attaches a plurality of webs together, wherein,
the web applying apparatus includes:
a 1 st transport device that transports a 1 st web to a bonding position on a 1 st transport path, the 1 st web having a plurality of predetermined patterns formed at intervals in a transport direction;
a 2 nd conveyance device that conveys a 2 nd web to be attached to the 1 st web to the attachment position in a 2 nd conveyance path;
an image detection unit that acquires image information of the 1 st web on an upstream side of the bonding position in the 1 st conveyance path; and
a laser processing device that laser-processes the 2 nd web material on an upstream side of the bonding position in the 2 nd conveyance path,
the web bonding apparatus acquires a conveyance error of the 1 st web based on the image information acquired by the image detection unit, and adjusts the laser processing for the 2 nd web based on the conveyance error.
2. The web doubler according to claim 1,
the adjustment of the laser processing based on the transport error is performed by correcting the timing of performing the laser irradiation.
3. The web application apparatus according to claim 1 or 2,
the web attaching device further includes:
a 1 st tension management unit that manages tension of the 1 st web conveyed by the 1 st conveyor; and
a 2 nd tension management unit configured to manage tension of the 2 nd web conveyed by the 2 nd conveyor.
4. The web laminating apparatus according to any one of claims 1 to 3,
the web bonding apparatus further has a sheet peeling apparatus that peels a release sheet from the 2 nd web on an upstream side of the bonding position, wherein the 2 nd web is conveyed in the 2 nd conveyance path in a state where the release sheet is adhered,
the laser processing apparatus can irradiate a laser beam on a surface of the 2 nd web opposite to the side to which the release sheet is bonded, on an upstream side of a release position at which the release sheet is released by the sheet releasing device.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-110824 | 2017-06-05 | ||
| JP2017110824 | 2017-06-05 | ||
| PCT/JP2017/041719 WO2018225283A1 (en) | 2017-06-05 | 2017-11-20 | Web bonding apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110914180A true CN110914180A (en) | 2020-03-24 |
| CN110914180B CN110914180B (en) | 2021-07-13 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780091644.8A Expired - Fee Related CN110914180B (en) | 2017-06-05 | 2017-11-20 | Web material attaching device |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN110914180B (en) |
| TW (1) | TWI743357B (en) |
| WO (1) | WO2018225283A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI723688B (en) * | 2019-12-19 | 2021-04-01 | 長豐光學科技股份有限公司 | Method for manufacturing thin wire |
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| KR101932303B1 (en) * | 2011-06-02 | 2018-12-24 | 수미토모 케미칼 컴퍼니 리미티드 | Optical film conveyance method and conveyance apparatus |
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- 2017-11-20 CN CN201780091644.8A patent/CN110914180B/en not_active Expired - Fee Related
- 2017-11-20 WO PCT/JP2017/041719 patent/WO2018225283A1/en active Application Filing
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- 2018-05-09 TW TW107115674A patent/TWI743357B/en active
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| ES2284091T3 (en) * | 1998-02-19 | 2007-11-01 | Lts Lohmann Therapie-Systeme Ag | PROCEDURE TO ENTER A PLURALITY OF INDIVIDUALIZED LAMINARY ADMINISTRATION FORMS IN A DISTRIBUTOR, FORMING A MULTI-PAPER BATTERY. |
| CN1681728A (en) * | 2002-09-16 | 2005-10-12 | Csat计算机系统及自动控制技术有限公司 | Device for the precise positional joining of two material webs |
| CN101405209A (en) * | 2006-04-27 | 2009-04-08 | Sca卫生产品股份公司 | Method and apparatus for synchronously positioning at least a basic continuous material fabric |
| WO2010052513A1 (en) * | 2008-10-27 | 2010-05-14 | Luiten, Marco | Method for applying a strip-shaped element, in particular a security thread, to a ribbon-like substrate and device for carrying out the method, and use thereof |
| TW201512711A (en) * | 2013-05-29 | 2015-04-01 | Sumitomo Chemical Co | Apparatus and method of manufacturing optical-member-attached body |
| CN203919955U (en) * | 2014-06-10 | 2014-11-05 | 日东电工株式会社 | Base material film stripping off device and polarizing film producing device |
| CN204400299U (en) * | 2015-01-12 | 2015-06-17 | 苏州贝克诺斯电子科技有限公司 | A kind of structure-improved of make-up machine |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018225283A1 (en) | 2018-12-13 |
| TWI743357B (en) | 2021-10-21 |
| TW201904850A (en) | 2019-02-01 |
| CN110914180B (en) | 2021-07-13 |
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